Antenna and foldable electronic device including the same

Abstract

In one embodiment, an electronic device may include a housing including a hinge module, a first housing, and a second housing. The first housing and the second housing are rotatably coupled to each other via the hinge module so as to be in a folded state or an unfolded state. The electronic device may also include: a flexible display; at least one conductive pattern disposed in the first housing; at least one conductor disposed in the second housing at a position corresponding to the at least one conductive pattern, such that when the electronic device is in the folded state, the at least one conductor is capacitively coupled to the conductive pattern; and wireless communication circuitry electrically connected to the at least one conductive pattern in the first housing. Other embodiments are also possible.

Description

Technical Field

[0001] The present disclosure generally relates to an antenna and a foldable electronic device including the antenna. Background Art

[0002] One of the current trends in mobile electronic devices is that users generally demand thinner device bodies. Specifically, the thickness of electronic devices is being reduced as much as possible. Furthermore, these electronic devices are being developed to increase their rigidity and improve them in other ways, which will differentiate them in the market. These electronic devices are also being developed with various shapes that depart from the traditional uniform rectangular form. One example of this development is foldable electronic devices with large-screen displays that can be folded when not in use. Summary of the Invention

[0003] Technical issues

[0004] A foldable electronic device may include a first shell (or first shell structure) and a second shell (or second shell structure) connected to each other by a hinge module (or hinge structure) interposed therebetween. In the foldable electronic device, the hinge module allows each of the first shell and the second shell to rotate from 0 degrees to 360 degrees relative to each other. The device can be folded inward, wherein the display is disposed inside the device when folded, or folded outward, wherein the display is disposed outside the device when folded. The foldable electronic device may include a flexible display that is configured to substantially cover both the first shell and the second shell in an open (i.e., unfolded) state, wherein the first shell and the second shell are 180 degrees relative to each other.

[0005] The foldable electronic device includes at least one antenna for communication. Regardless of how the device is folded, the antenna needs to meet the required radiation performance. However, in the unfolded state of the foldable electronic device (wherein the rear surfaces of the first shell and the second shell face each other so that the display is exposed to the outside), the radiation performance may be reduced due to various conductive members that shield the antenna. These conductive members may include a conductive layer of the display (e.g., a copper plate), a conductive mechanical structure (e.g., a conductive support member or a conductive bracket) provided in the electronic device near the antenna, or a conductive electrical structure (e.g., an interface connector port, a speaker assembly, or a microphone module) provided in the electronic device near the antenna.

[0006] Solutions to the problem

[0007] Certain embodiments of the present disclosure provide an antenna and a foldable electronic device including the antenna.

[0008] According to one embodiment of the present disclosure, an electronic device may include a housing comprising a hinge module, a first housing, and a second housing. The first housing is connected to the hinge module and includes a first surface, a second surface facing a direction opposite to the first surface, and a first lateral member surrounding a first space between the first and second surfaces. The second housing is connected to the hinge module and includes a third surface, a fourth surface facing a direction opposite to the third surface, and a second lateral member surrounding a second space between the third and fourth surfaces. The first and second housings are rotatably coupled to each other via the hinge module to be in a folded state or an unfolded state. The first and third surfaces face the same direction in the unfolded state, and the second and fourth surfaces face each other in the folded state. The electronic device may further include: a flexible display disposed on the first and third surfaces; at least one conductive pattern disposed in the first space; at least one conductor disposed in the second space at a position corresponding to the at least one conductive pattern, such that the at least one conductor is capacitively coupled to the at least one conductive pattern when the electronic device is in the folded state; and a wireless communication circuit electrically connected to the second space corresponding to the at least one conductive pattern, such that the at least one conductor is the conductive pattern in the first space.

[0009] According to one embodiment of the present disclosure, an electronic device may include a housing comprising a hinge module, a first housing, and a second housing. The first housing is connected to the hinge module and includes a first surface, a second surface facing a direction opposite to the first surface, and a first lateral member surrounding a first space between the first and second surfaces. The second housing is connected to the hinge module and includes a third surface, a fourth surface facing a direction opposite to the third surface, and a second lateral member surrounding a second space between the third and fourth surfaces. The first and second housings are rotatably coupled to each other via the hinge module to be in a folded or unfolded state. The first and third surfaces face the same direction in the unfolded state, and the second and fourth surfaces face each other in the folded state. The electronic device may further include a flexible display disposed on the first and third surfaces, at least one conductive pattern disposed in the first space, and a first conductive pad disposed in the first space so as to be exposed through the second surface or disposed at a first position closer to the second surface than the first surface. The first conductive pad may be electrically connected to the at least one conductive pattern. The electronic device may further include at least one conductor disposed in the second space, and a second conductive pad disposed in the second space so as to be exposed through the fourth surface or disposed at a second position closer to the fourth surface than the third surface. The second conductive pad may be electrically connected to the at least one conductor and may be capacitively coupled to the first conductive pad when the electronic device is in a folded state. The electronic device may further include a wireless communication circuit electrically connected to the at least one conductive pattern in the first space, a coupler disposed on an electrical path connecting the wireless communication circuit and the at least one conductive pattern, an adjustable circuit disposed on an electrical path connecting the second conductive pad and the at least one conductor, and at least one processor configured to receive return loss information of the at least one conductive pattern from the coupler and control the adjustable circuit based on the received return loss information.

[0010] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0011] Advantageous Effects of the Invention

[0012] According to one embodiment of the present disclosure, even in a folded state, the antenna of a foldable electronic device can use a conductor additionally provided in a relative shell as an antenna element, so that the radiation performance of the antenna of the foldable electronic device when folded can be as good as or better than the radiation performance of the antenna when the foldable electronic device is unfolded. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0014] Figure 1 is a block diagram illustrating electronic devices in a network environment according to various embodiments of the present disclosure.

[0015] Figure 2 FIG. 1 is a diagram illustrating an unfolded state of a foldable electronic device according to an embodiment of the present disclosure.

[0016] Figure 3 It shows Figure 2 FIG. 1 is a diagram showing a foldable electronic device in a folded state.

[0017] Figure 4a FIG. 1 is a diagram illustrating an unfolded state of a foldable electronic device including an antenna according to an embodiment of the present disclosure.

[0018] Figure 4b It shows Figure 4a A diagram showing the internal configuration of an electronic device.

[0019] Figure 4c It shows Figure 4a A block diagram of an electronic device including an antenna is shown.

[0020] Figure 5a It shows Figure 4a FIG. 1 is a diagram showing a foldable electronic device in a folded state.

[0021] Figure 5b It shows Figure 5a A diagram showing the internal configuration of an electronic device.

[0022] Figure 5c It shows Figure 5a A block diagram of an electronic device including an antenna is shown.

[0023] Figure 6a is a graph comparing operating frequency bands with or without conductors according to various embodiments of the present disclosure.

[0024] Figure 6b is a graph comparing return loss characteristics with and without a conductor according to an embodiment of the present disclosure.

[0025] Figure 7a FIG. 1 is a diagram illustrating an unfolded state of a foldable electronic device including an antenna according to an embodiment of the present disclosure.

[0026] Figure 7b It shows Figure 7a A diagram showing the internal configuration of an electronic device.

[0027] Figure 7c It shows Figure 7a A block diagram of an electronic device including an antenna is shown.

[0028] Figure 8a It shows Figure 7a FIG. 1 is a diagram showing a foldable electronic device in a folded state.

[0029] Figure 8b It shows Figure 8a A diagram showing the internal configuration of an electronic device.

[0030] Figure 8c It shows Figure 8a A block diagram of an electronic device including an antenna is shown.

[0031] Figure 9a is a block diagram illustrating an electronic device including a conductor having an adjustable circuit according to an embodiment of the present disclosure.

[0032] Figure 9b is a diagram illustrating an adjustable circuit according to an embodiment of the present disclosure.

[0033] Figure 9c is a block diagram illustrating an electronic device including an adjustable circuit according to an embodiment of the present disclosure.

[0034] Figure 10 is a flow chart illustrating a switching operation of an adjustable circuit for improving antenna performance according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0035] According to one or more embodiments of the present disclosure, the radiation performance of the antenna of the foldable electronic device when folded may be as good as or better than the radiation performance of the antenna when the foldable electronic device is unfolded.

[0036] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to assist understanding, but these are to be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and structures may be omitted for clarity and conciseness.

[0037] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Therefore, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustration purposes only and not for the purpose of limiting the present disclosure as defined by the appended claims and their equivalents.

[0038] It will be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of such surfaces.

[0039] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0040] Reference Figure 1 , the electronic device 101 in the network environment 100 can communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented as embedded in the display device 160 (eg, a display).

[0041] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., a hardware component or a software component), and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. Depending on the embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or combined with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a designated function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121 .

[0042] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) together with the main processor 121. Depending on the embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

[0043] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0044] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0045] The input device 150 may receive commands or data to be used by other components of the electronic device 101 (eg, the processor 120) from outside the electronic device 101 (eg, a user). The input device 150 may include, for example, a microphone, a mouse, or a keyboard.

[0046] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0047] The display device 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit adapted to measure the strength of the force caused by the touch (e.g., a pressure sensor).

[0048] The audio module 170 can convert sound into an electrical signal, and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0049] The sensor module 176 can detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0050] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0051] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. Depending on the embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0052] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0053] The camera module 180 may capture still images or moving images. Depending on the embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0054] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0055] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0056] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. Depending on the embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0057] The antenna module 197 can transmit or receive signals or power to or from the outside of the electronic device 101 (e.g., an external electronic device). Depending on the embodiment, the antenna module 197 may include one or more antennas, and thus, for example, the communication module 190 (e.g., the wireless communication module 192) may select at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199). Signals or power can then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna.

[0058] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general-purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0059] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial response to the request, either by further processing the result or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0060] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0061] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of the items listed together with the corresponding phrases in the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish corresponding components from another component, and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., a second element)”, “combined to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, when the term “operably” or “communicatively” is used or when the term “operably” or “communicatively” is not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0062] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, depending on an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0063] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to be operable to perform at least one function according to the called at least one instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0064] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published (e.g., downloaded or uploaded) online via an application store (e.g., ), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0065] According to various embodiments, each component (for example, module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (for example, module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0066] Figure 2 FIG. 2 is a diagram illustrating an unfolded state of a foldable electronic device 200 according to an embodiment of the present disclosure. Figure 3 It shows Figure 2 FIG. 2 shows a diagram of the foldable electronic device 200 in a folded state.

[0067] Figure 2 and Figure 3 The electronic device 200 shown may be at least partially similar to Figure 1 The electronic device 101 shown may be other embodiments of an electronic device.

[0068] Reference Figure 2 , the electronic device 200 may include a pair of housings 210 and 220 and a display 230. The housings 210 and 220 (e.g., a foldable housing structure) may be rotatably coupled to each other on the X-axis and foldable relative to each other via a hinge module 260 (e.g., a hinge structure). The display 230 (e.g., a flexible display or a foldable display) may be disposed in a space formed by the pair of housings 210 and 220. According to one embodiment, at least a portion of the first housing 210 (e.g., a first housing structure) and / or the second housing 220 (e.g., a second housing structure) may be made of a metal or non-metal material having sufficient rigidity to support the display 230. According to one embodiment, when they are metal, portions of the first housing 210 and / or the second housing 220 may be electrically isolated conductive members that are electrically connected to the wireless communication circuit of the electronic device. This structure may serve as an antenna (e.g., a conventional antenna) operating in a predetermined frequency band.

[0069] According to one embodiment, the hinge module 260 can allow the pair of housings 210 and 220 to be folded relative to each other so that the display 230 is visible from the outside even in the folded state (i.e., the outward folded state). According to one embodiment, the hinge module 260 may include a track-type hinge module configured to be bendable and at least partially slidable to support the outward folded state.

[0070] According to one embodiment, the first housing 210 is connected to the hinge module 260 and includes a first surface 211, a second surface 212, and a first lateral member 213. When the electronic device 200 is in the unfolded state, the first surface 211 is set as the front surface of the electronic device 200, and the second surface 212 faces in a direction opposite to the direction of the first surface 211. The first lateral member 213 at least partially surrounds the space between the first surface 211 and the second surface 212. According to one embodiment, the first lateral member 213 may include a first lateral surface 213a, a second lateral surface 213b, and a third lateral surface 213c. The first lateral surface 213a is arranged parallel to the folding axis (i.e., the X-axis). The second lateral surface 213b extends from one end of the first lateral surface 213a in a direction perpendicular to the folding axis. The third lateral surface 213c extends from the other end of the first lateral surface 213a in a direction perpendicular to the folding axis.

[0071] According to one embodiment, the second housing 220 is connected to the hinge module 260 and includes a third surface 221, a fourth surface 222, and a second lateral member 223. When the electronic device 200 is in the unfolded state, the third surface 221 is set as the front surface of the electronic device 200, and the fourth surface 222 faces a direction opposite to the direction of the third surface 221. The second lateral member 223 at least partially surrounds the space between the third surface 221 and the fourth surface 222. According to one embodiment, the second lateral member 223 may include a fourth lateral surface 223a, a fifth lateral surface 223b, and a sixth lateral surface 223c. The fourth lateral surface 223a is arranged parallel to the folding axis (i.e., the X-axis). The fifth lateral surface 223b extends from one end of the fourth lateral surface 223a in a direction perpendicular to the folding axis. The sixth lateral surface 223c extends from the other end of the fourth lateral surface 223a in a direction perpendicular to the folding axis.

[0072] According to one embodiment, the first surface 211 and the third surface 221 may include at least one support plate formed as part of the first housing 210 and the second housing 220 or structurally combined with the first housing 210 and the second housing 220 to support the display 230. According to one embodiment, the second surface 212 and the fourth surface 222 may include a back cover formed as part of the first housing 210 and the second housing 220 or structurally combined with the first housing 210 and the second housing 220. According to one embodiment, the back cover may be made of various materials, such as coated or colored glass, ceramics, polymers, metals (e.g., aluminum, stainless steel (STS), or magnesium), or combinations thereof.

[0073] According to one embodiment, in the unfolded state, the electronic device 200 may include a recess 201 provided through both the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220. According to one embodiment, the flexible display 230 may be located in the recess 201 in the unfolded state. According to one embodiment, the electronic device 200 may include at least one electronic component disposed below at least a portion of the flexible display 230 or exposed through an opening provided in at least a portion of the flexible display 230. According to one embodiment, these electronic components may include at least one camera module 214 exposed through the opening in the flexible display 230 and / or at least one sensor 215 disposed on the rear surface of the flexible display 230. According to one embodiment, the sensor 215 may be various sensors, such as a proximity sensor, an illumination sensor, an iris recognition sensor, an ultrasonic sensor, a fingerprint recognition sensor, etc. In another embodiment, the electronic component may be disposed in the second housing 220. According to one embodiment, the electronic device 200 may include a receiver 216 or an interface connector port 217 disposed through at least a portion of the first housing 210. According to one embodiment, although not shown, the electronic device 200 may further include an earphone jack, an external speaker module, a SIM card tray and / or at least one button, each button being arranged on the first shell 210 and / or the second shell 220 or passing through the first shell 210 and / or the second shell 220.

[0074] Figure 4a FIG. 2 is a diagram illustrating an unfolded state of a foldable electronic device 200 including an antenna according to an embodiment of the present disclosure. Figure 4b It shows Figure 4a FIG. 2 is a diagram showing the internal configuration of the electronic device 200 . Figure 4c It shows Figure 4a A block diagram of an electronic device 200 including an antenna is shown.

[0075] Reference Figures 4a to 4c , the electronic device 200 may include a hinge module (eg, Figure 2The hinge module 260 in the first housing 210 allows the first housing 210 and the second housing 220 to rotate relative to each other. According to one embodiment, when the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 face the same direction (i.e., in the unfolded state), the flexible display 230 can be unfolded.

[0076] According to one embodiment, the electronic device 200 may include a conductive pattern 410 disposed in the first space 2001 of the first housing 210. According to one embodiment, the conductive pattern 410 may be electrically connected to the wireless communication circuit 291 disposed in the first space 2001 of the first housing 210. According to one embodiment, the wireless communication circuit 291 may be mounted on a printed circuit board (PCB) 290 disposed in the first space 2001. According to one embodiment, the wireless communication circuit 291 may be configured to transmit and / or receive radio signals in the range of approximately 500 MHz to 6000 MHz via the conductive pattern 410. According to one embodiment, the conductive pattern 410 may function as a conventional antenna for the wireless communication circuit 291. According to one embodiment, a portion of the conductive pattern 410 may be disposed in the first space 2001 so as to face the first lateral member 213. According to one embodiment, a portion of the conductive pattern 410 may be disposed so as to face at least one of the first lateral surface 213a, the second lateral surface 213b, or the third lateral surface 213c. According to one embodiment, the conductive pattern 410 may be made of an injection molded material (e.g., an antenna carrier) disposed in the first space 2001 using a laser direct structuring (LDS) method. In another embodiment, the conductive pattern 410 may include a flexible printed circuit board (FPCB) having a conductive plate or conductive pattern disposed in a suitable position in the first space 2001. In another embodiment, the conductive pattern 410 may be formed in the fill and cut areas (i.e., non-conductive areas) of the PCB 290 using a direct patterning method.

[0077] According to one embodiment, the electronic device 200 may include a first conductive pad 411 disposed in the first space 2001 of the first housing 210. According to one embodiment, the first conductive pad 411 may be electrically connected to the conductive pattern 410. According to one embodiment, the first conductive pad 411 may be electrically connected to the conductive pattern 410 through an electrical connector such as an FPCB or a coaxial cable. According to one embodiment, the first conductive pad 411 may be exposed through the second surface 212 of the first housing 210, or be disposed in the first space 2001 at a position closer to the second surface 212 than the first surface 211. According to one embodiment, the first conductive pad 411 may include an FPCB having a conductive plate or a conductive pattern having a specific area. In another embodiment, when the first conductive pad 411 is exposed through the second surface 212 of the first housing 210, the first conductive pad 411 may include a decorative member formed of a conductive material.

[0078] According to one embodiment, the electronic device 200 may include a conductor 420 disposed in the second space 2002 of the second housing 220. According to one embodiment, the conductor 420 may be another conductive pattern disposed in the second space 2002. According to one embodiment, a portion of the conductor 420 may be disposed in the second space 2002 to face the second lateral member 223. According to one embodiment, a portion of the conductor 420 may be disposed to face at least one of the fourth lateral surface 223a, the fifth lateral surface 223b, or the sixth lateral surface 223c. According to one embodiment, the conductor 420 may be made of an injection molded material (e.g., an antenna carrier) that is disposed in the second space 2002 using an LDS method. In another embodiment, the conductor 420 may include an FPCB having a conductive plate or conductive pattern disposed in a suitable position in the second space 2002.

[0079] According to one embodiment, the electronic device 200 may include a second conductive pad 421 disposed in the second space 2002 of the second housing 220. According to one embodiment, in the folded state of the electronic device 200 (where the second surface 212 of the first housing 210 and the fourth surface 222 of the second housing 220 face each other (e.g., contact each other)), the second conductive pad 421 may be disposed in a position such that it is electrically coupled to the first conductive pad 411, thereby being capacitively coupled to the first conductive pad 411. According to one embodiment, the second conductive pad 421 may be electrically connected to the conductor 420. According to one embodiment, the second conductive pad 421 may be electrically connected to the conductor 420 via an electrical connector such as an FPCB or a thin-wire cable. According to one embodiment, the second conductive pad 421 may be exposed through the fourth surface 222 of the second housing 220 or disposed in the second space 2002 closer to the fourth surface 222 than the third surface 221. According to one embodiment, the second conductive pad 421 may include an FPCB having a conductive plate or conductive pattern with a specific area. In another embodiment, when the second conductive pad 421 is exposed through the fourth surface 222 of the second housing 220 , the second conductive pad 421 may include a decorative member formed of a conductive material.

[0080] According to one embodiment, when the electronic device 200 is in the unfolded state, the wireless communication circuit 291 can be configured to transmit and / or receive radio signals in a predetermined frequency band via the conductive pattern 410 disposed in the first space 2001 of the first housing 210. In this case, since the conductor 420 is spaced apart from the conductive pattern 410, the radiation performance of the conductive pattern 410 is not affected.

[0081] Figure 5a It shows Figure 4a FIG. 2 shows a diagram of the foldable electronic device 200 in a folded state. Figure 5b It shows Figure 5a FIG. 2 is a diagram showing the internal configuration of the electronic device 200 . Figure 5c It shows Figure 5a A block diagram of an electronic device 200 including an antenna is shown.

[0082] Reference Figures 5a to 5c When the electronic device 200 is in the folded state, the second surface 212 of the first housing 210 and the fourth surface 222 of the second housing 220 may face each other (i.e., be in contact with or in close proximity to each other). In this case, the radiation performance of an antenna using only the conductive pattern 410 may be reduced due to an increase in return loss or a shift to an undesirable frequency band caused by the conductive layer (e.g., a copper plate) of the display 230. In addition, the radiation performance of an antenna using only the conductive pattern 410 may be reduced due to conductive members, such as a conductive mechanical structure (e.g., a conductive support member or a conductive bracket) or a conductive electrical structure (e.g., an interface connector port, a speaker assembly, or a microphone module) provided near the antenna.

[0083] According to one embodiment of the present disclosure, when the electronic device 200 is in the folded state, the first conductive pad 411 provided in the first housing 210 and the second conductive pad 421 provided in the second housing 220 are adjacent to each other and positioned so as to be electrically coupled to each other, thereby capacitively coupling with each other. In this case, in addition to the conductive pattern 410, the wireless communication circuit 291 can also use the conductor 420 electrically connected to the conductive pattern 410 via the first conductive pad 411 and the second conductive pad 421 as an additional radiator. This can prevent the degradation of radiation performance caused by the folded state of the electronic device 200, or exhibit better radiation characteristics.

[0084] Figure 6a is a comparison according to an embodiment of the present disclosure with or without a conductor (e.g., Figure 4a 4. A graph showing the operating frequency band of the conductor 420 in FIG.

[0085] Reference Figure 6a , when electronic devices (e.g. Figure 5a When the electronic device 200 in FIG. 1 is in a folded state, and when only one conductive pattern (eg, Figure 5a When the conductive pattern 410 in FIG. 4 is used as an antenna, the antenna can operate at frequencies outside the operating frequency band (or use frequency band), as shown in graph 601. On the contrary, as shown in graph 602, according to an embodiment of the present disclosure, when the conductive pattern (e.g., Figure 5a The conductive pattern 410 in the embodiment of the present invention is capacitively coupled to a conductor (e.g., Figure 5a When the conductor 420 is provided in the working frequency band, the antenna can operate normally in the working frequency band.

[0086] Figure 6b is a comparison according to an embodiment of the present disclosure with or without a conductor (e.g., Figure 4a Graph showing the return loss characteristics of the conductor 420 in FIG.

[0087] Reference Figure 6b , when electronic devices (e.g. Figure 5a When the electronic device 200 in FIG. 1 is in a folded state, and when only one conductive pattern (eg, Figure 5a When the conductive pattern 410 in FIG. 4 is used as an antenna, the antenna may have a high return loss in the working frequency band (or the used frequency band), as shown in the graph 603. In contrast, as shown in the graph 604, according to an embodiment of the present disclosure, when the conductive pattern (e.g., Figure 5a The conductive pattern 410 in FIG. 4 is capacitively coupled to a conductor (eg, Figure 5a When the conductor 420 is provided in the antenna, the antenna can have a relatively good return loss (ie, a lower return loss) in the working frequency band.

[0088] Figure 7a FIG. 2 is a diagram illustrating an unfolded state of a foldable electronic device 200 including an antenna according to an embodiment of the present disclosure. Figure 7b It shows Figure 7a FIG. 2 is a diagram showing the internal configuration of the electronic device 200 . Figure 7c It shows Figure 7a A block diagram of an electronic device 200 including an antenna is shown.

[0089] In the description Figures 7a to 7c When the electronic device 200 is shown, detailed descriptions of components similar to those of the above-described electronic device 200 may be omitted.

[0090] Reference Figures 7a to 7c In addition to the conductive pattern 410 provided in the first housing 210, the electronic device 200 may have Figures 5a to 5c The above configuration is basically the same configuration.

[0091] According to one embodiment, the electronic device 200 may include a conductive pattern 410 disposed in the first space 2001 of the first housing 210. According to one embodiment, the conductive pattern 410 may be electrically connected to the wireless communication circuit 291 disposed in the first space 2001 of the first housing 210. According to one embodiment, the wireless communication circuit 291 may be mounted on the PCB 290 disposed in the first space 2001. According to one embodiment, the wireless communication circuit 291 may be configured to transmit and / or receive radio signals in the range of approximately 500 MHz to 6000 MHz via the conductive pattern 410. According to one embodiment, the conductive pattern 410 may be disposed in the first space 2001 so as to face the second surface 212. In other words, the conductive pattern 410 may be disposed in the first space 2001 closer to the second surface 212 than the first surface 211. In another embodiment, when the second surface 212 includes a support plate made of an injection-molded material, the conductive pattern 410 may be formed on or attached to the inner surface of the support plate. According to one embodiment, the conductive pattern 410 may be made of an injection molded material (e.g., an antenna carrier) disposed in the first space 2001 using an LDS method. In another embodiment, the conductive pattern 410 may include an FPCB having a conductive plate or conductive pattern disposed in a suitable position in the first space 2001. In another embodiment, the conductive pattern 410 may be formed in the fill and cut regions (i.e., non-conductive regions) of the PCB 290 using a direct patterning method.

[0092] Figure 8a It shows Figure 7a FIG. 2 shows a diagram of the foldable electronic device 200 in a folded state. Figure 8b It shows Figure 8a A diagram showing the internal configuration of an electronic device. Figure 8c It shows Figure 8a A block diagram of an electronic device including an antenna is shown.

[0093] Reference Figures 8a to 8c When the electronic device 200 is in the folded state, the conductive pattern 410 provided in the first housing 210 and the second conductive pad 421 provided in the second housing 220 are adjacent to each other and are positioned so as to electrically couple with each other. Therefore, they can be capacitively coupled to each other. In this case, in addition to the conductive pattern 410, the wireless communication circuit 291 can also use the conductor 420 electrically connected to the conductive pattern 410 via the second conductive pad 421 as an additional radiator. This can prevent the degradation of radiation performance caused by the folded state of the electronic device 200, or exhibit better radiation characteristics.

[0094] Figure 9ais a block diagram illustrating an electronic device 200 including a conductor 420 having a tunable circuit (T) 450 according to an embodiment of the present disclosure. Figure 9b is a diagram illustrating an adjustable circuit 450 according to an embodiment of the present disclosure.

[0095] have Figure 9a The electronic device 200 of the adjustable circuit 450 is shown Figures 4a to 4c A modified version of the electronic device 200 is shown. However, in combination with Figure 9a-9c The disclosed principles can also be applied to Figures 7a to 7c The electronic device 200 is shown.

[0096] Reference Figure 9a and Figure 9b The electronic device 200 may include a coupler 430 disposed on an electrical path electrically connecting the wireless communication circuit 291 and the conductive pattern 410, an adjustable circuit 450 (e.g., an adjustable IC) disposed on an electrical path electrically connecting the second conductive pad 421 and the conductor 420, and / or a processor 280. According to one embodiment, the processor 280 may receive antenna return loss information (e.g., voltage standing wave ratio (VSWR) information) from the coupler 430 via the wireless communication circuit 291, thereby controlling the adjustable circuit 450. In another embodiment, the processor 280 may receive the antenna return loss information directly from the coupler 430. According to one embodiment, based on the received return loss information, the processor 280 may control the adjustable circuit 450 to improve the antenna return loss. The processor 280 may include a microprocessor or any suitable type of processing circuit, such as one or more general-purpose processors (e.g., ARM-based processors), digital signal processors (DSPs), programmable logic devices (PLDs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), graphics processing units (GPUs), video card controllers, and the like. Furthermore, it will be appreciated that when a general purpose computer accesses code for implementing the processing shown herein, the execution of the code transforms the general purpose computer into a special purpose computer for performing the processing shown herein. Certain functions and steps provided in the accompanying drawings may be implemented in hardware, software, or a combination of both, and may be executed in whole or in part within the programming instructions of a computer. Furthermore, the skilled artisan understands and appreciates that a "processor" or "microprocessor" may be hardware within the claimed disclosure.

[0097] According to one embodiment, the adjustable circuit 450 may include a switching device S and a plurality of inductors L (L1, L2, L3, L4, ..., Ln) having different inductance values ​​L. The switching device S may switch between the plurality of inductors L. In another embodiment, the adjustable circuit 450 may include at least one inductor or at least one capacitor. According to one embodiment, under the control of the processor 280, the adjustable circuit 450 may electrically connect the second conductive pad 421 and the conductor 420 via one of the plurality of inductors L.

[0098] Figure 9c is a block diagram illustrating an electronic device 200 including a tunable circuit (T) 450 according to an embodiment of the present disclosure.

[0099] Reference Figure 9c , the adjustable circuit 450 can be provided on the electrical path connecting the conductive pattern 410 and the first conductive pad 411. Figure 9a-9c As shown, the adjustable circuit 450 may be disposed at various locations on the electrical path connecting the conductive pattern 410 and the conductor 420 .

[0100] Figure 10 is a flow chart illustrating a switching operation of a tunable circuit (T) for improving antenna performance according to an embodiment of the present disclosure.

[0101] Reference Figure 10 In operation 1011, the electronic device (eg, Figure 9a A processor (eg, Figure 9a The processor 280 in the embodiment can detect whether the electronic device 200 is in the folded state. According to one embodiment, when the electronic device 200 is in the folded state, the first housing (eg, Figure 4a The second surface of the first housing 210) (eg, Figure 4a a second surface 212 in the housing) and a second housing (eg, Figure 4a The fourth surface of the second housing 220 (eg, Figure 4a In this case, the conductive pattern (eg, the fourth surface 222 in the first housing 210) electrically connected to the first housing 210 may face each other (ie, contact or be in close proximity to each other). Figure 4a The first conductive pad (eg, the conductive pattern 410 in FIG. 4 ) Figure 4a ) and a conductor electrically connected to the second housing 220 (eg, a first conductive pad 411 in FIG. 4 ). Figure 4a The second conductive pad (eg, the conductor 420) of Figure 4aThe second conductive pad 421 in the first housing 210 and the second conductive pad 421 in the second housing 220) can be capacitively coupled to each other through electrical coupling. Therefore, the conductive pattern 410 can be used as a radiator of the antenna together with the conductor 420. According to one embodiment, the processor can use a Hall sensor provided in one of the first housing 210 and the second housing 220 to detect the folding state of the electronic device 200 (for example, Figure 5a In another embodiment, the processor 280 may use a proximity sensor and / or an ultrasonic sensor provided in one of the first housing 210 and the second housing 220 to detect the folded state of the electronic device 200.

[0102] According to one embodiment, at operation 1013, when the electronic device 200 is in the folded state, the processor 280 may execute an adjustable circuit (eg, Figure 9a According to one embodiment, the processor 280 may control the switching device (eg, Figure 9b The switching device S in the adjustable circuit 450 is used to set a plurality of inductors (eg, Figure 9b One of the inductors L) in is electrically connected to the conductive pad 421.

[0103] According to an embodiment, at operation 1015, the processor 280 may detect a voltage standing wave ratio (VSWR) of each port of the switching device S for each of the plurality of inductors L according to the switching operation of the switching device S. The processor 280 may then detect the voltage standing wave ratio (VSWR) of each port of the switching device S through a coupler (e.g., Figure 9a The coupler 430 in receives the corresponding return loss information.

[0104] According to one embodiment, the processor 280 may compare the return loss information received at each port at operation 1017. For example, based on the return loss information received at each port, the processor 280 may determine a specific inductor corresponding to the best return loss information (e.g., the lowest return loss information).

[0105] According to one embodiment, at operation 1019, the processor 280 may control the switching device S of the adjustable circuit 450 to electrically connect the second conductive pad 421 and the conductor 420 via the determined inductor corresponding to the optimal return loss information. According to one embodiment, the processor 280 may detect the folded state of the electronic device 200, periodically control the switching device S, and detect the antenna return loss of each inductor L through the coupler 430. Therefore, the processor 280 may select the optimal inductor L based on the folded position of the electronic device so that the antenna can have optimal radiation performance. In other words, when the capacitance value between the conductive pads changes due to the folded position of the electronic device, the processor 280 may change the selection of the inductor L.

[0106] According to an embodiment of the present disclosure, an electronic device (eg, Figure 2 The electronic device 200 in FIG. 2 may include a housing including a hinge module (eg, Figure 2 The hinge module 260 in the first housing (eg, Figure 2 The first shell 210 in the embodiment and the second shell (eg, Figure 2 The first housing is connected to the hinge module and includes a first surface (eg, Figure 2 a first surface 211 in the middle), a second surface facing in a direction opposite to the first surface (eg, Figure 2 , and a first space (eg, Figure 4b The first lateral member (eg, Figure 2 The second housing is connected to the hinge module and includes a third surface (eg, Figure 2 , a third surface 221 in the middle), a fourth surface facing in a direction opposite to the third surface (eg, Figure 2 ), and a second space (eg, Figure 4b The second lateral member (eg, Figure 2 The first housing and the second housing are rotatably coupled to each other via the hinge module to be in a folded state or an unfolded state. The first surface and the third surface face the same direction in the unfolded state, and the second surface and the fourth surface face each other in the folded state. The electronic device may further include: a flexible display (e.g., Figure 2 flexible display 230 in the first space); at least one conductive pattern (eg, Figure 4a 410); at least one conductor (eg, Figure 4a 420 in the second space), disposed at a first position corresponding to the at least one conductive pattern in the second space, such that when the electronic device is in the folded state, the at least one conductor is capacitively coupled to the at least one conductive pattern; and a wireless communication circuit (e.g., Figure 4b The wireless communication circuit 291 in the first space is electrically connected to the at least one conductive pattern.

[0107] According to an embodiment, the electronic device may further include a first conductive pad (eg, Figure 4a The first conductive pad 411 is provided in the first space to be exposed through the second surface, or provided at a second position closer to the second surface than the first surface. The first conductive pad may be electrically connected to the at least one conductive pattern.

[0108] According to one embodiment, the electronic device may further include a second conductive pad (eg, Figure 4a The second conductive pad 421 is disposed in the second space so as to be exposed through the fourth surface, or is disposed at a third position closer to the fourth surface than the third surface. The second conductive pad can be electrically connected to the at least one conductor, and when the electronic device is in the folded state, the second conductive pad can be capacitively coupled to the first conductive pad.

[0109] According to one embodiment, the first lateral member (eg Figure 2 The first lateral member 213 in the hinge module may include a first lateral surface (eg, Figure 2 The first lateral surface 213a in the hinge module, extending from one end of the first lateral surface to the second lateral surface of the hinge module (eg, Figure 2 and a second lateral surface 213b in the hinge module) and a third lateral surface extending from the other end of the first lateral surface to the hinge module (eg, Figure 2 A portion of the at least one conductive pattern may be disposed in the first space to face at least one of the first, second, or third lateral surfaces.

[0110] According to one embodiment, the second lateral member (eg Figure 2 The second lateral member 223 in the hinge module may include a fourth lateral surface (eg, Figure 2 A fourth lateral surface 223a in the hinge module), extending from one end of the fourth lateral surface to a fifth lateral surface of the hinge module (eg, Figure 2 and a sixth lateral surface (eg, a fifth lateral surface 223b in the hinge module) extending from the other end of the fourth lateral surface to the hinge module. Figure 2 A portion of the at least one conductor may be disposed in the second space to face at least one of the fourth, fifth, or sixth lateral surfaces.

[0111] According to an embodiment, when the first conductive pad is provided to be exposed through the second surface of the first housing, the first conductive pad may include a conductive decoration member.

[0112] According to an embodiment, the at least one conductive pattern may include at least one of a laser direct structuring (LDS) pattern formed in a dielectric injection molding material or a flexible printed circuit board (FPCB) having a conductive plate or a conductive pattern disposed in the first space.

[0113] According to an embodiment, the electronic device may further include a printed circuit board (PCB) (eg, Figure 4b PCB 290 in the PCB), and the at least one conductive pattern can be formed in the filling and cutting areas of the PCB.

[0114] According to an embodiment, the wireless communication circuit may be configured to transmit and / or receive radio signals in a range of approximately 500 MHz to 6000 MHz through the at least one conductive pattern and the at least one conductor when the electronic device is in the folded state.

[0115] According to an embodiment, the at least one conductive pattern may be disposed in the first space at a second position closer to the second surface than to the first surface.

[0116] According to one embodiment, the electronic device may further include a conductive pad disposed in the second space so as to be exposed through the fourth surface, or disposed at a second position closer to the fourth surface than the third surface. The conductive pad may be electrically connected to the at least one conductor, and when the electronic device is in the folded state, the conductive pad may be capacitively coupled to the at least one conductive pattern.

[0117] According to an embodiment, the electronic device may further include: a coupler (eg, Figure 9a coupler 430 in); an adjustable circuit (eg, Figure 9a 450 in the adjustable circuit); and at least one processor (e.g., Figure 9a The processor 280 in the embodiment is configured to receive return loss information of the at least one conductive pattern from the coupler and control the adjustable circuit based on the received return loss information.

[0118] According to an embodiment, the adjustable circuit may include a plurality of inductors having different inductance values ​​(eg, Figure 9b Inductors L (L1, L2, L3, L4 . . . Ln) in the embodiment of the present invention and a switching device (eg, Figure 9b The switching device S in the ).

[0119] According to one embodiment, the at least one processor may also be configured to control the switching device to electrically connect the conductive pad to the at least one conductor through each of the plurality of inductors in sequence, and based on the received return loss information, control the switching device to electrically connect the conductive pad and the at least one conductor through the inductor having the best return loss.

[0120] According to an embodiment, the at least one processor may be further configured to detect whether the electronic device is in a folded state, and control the switching device when the electronic device is in the folded state.

[0121] According to an embodiment of the present disclosure, an electronic device (eg, Figure 2 The electronic device 200 in FIG. 2 may include a housing including a hinge module (eg, Figure 2 The hinge module 260 in the first housing (eg, Figure 2 The first shell 210 in the embodiment and the second shell (eg, Figure 2 The first housing is connected to the hinge module and includes a first surface (eg, Figure 2 a first surface 211 in the middle), a second surface facing in a direction opposite to the first surface (eg, Figure 2 , and a first space (eg, Figure 4b The first lateral member (eg, Figure 2 The second housing is connected to the hinge module and includes a third surface (eg, Figure 2 , a third surface 221 in the middle), a fourth surface facing in a direction opposite to the third surface (eg, Figure 2 ), and a second space (eg, Figure 4b The second lateral member (eg, Figure 2 The first housing and the second housing are rotatably coupled to each other via the hinge module to be in a folded state or an unfolded state. The first surface and the third surface face the same direction in the unfolded state, and the second surface and the fourth surface face each other in the folded state. The electronic device may further include a flexible display (e.g., Figure 2 flexible display 230 in the first space), at least one conductive pattern (eg, Figure 4a ), and a first conductive pad (eg, a conductive pattern 410 in the first space) provided in the first space to be exposed through the second surface or provided in a first position closer to the second surface than the first surface. Figure 4a The first conductive pad 411 in the second space). The first conductive pad may be electrically connected to the at least one conductive pattern. The electronic device may further include at least one conductor (eg, Figure 4a 4 and a second conductive pad (eg, a conductor 420 in the second space) provided in the second space to be exposed through the fourth surface or provided in a second position closer to the fourth surface than the third surface. Figure 4aThe second conductive pad 421 in the first space). The second conductive pad can be electrically connected to the at least one conductor and can be capacitively coupled to the first conductive pad when the electronic device is in the folded state. The electronic device may further include: a wireless communication circuit (e.g., Figure 4b a wireless communication circuit 291 in the wireless communication circuit); a coupler (eg, Figure 9a coupler 430 in); adjustable circuit (e.g., Figure 9a 450 in the adjustable circuit), provided on the electrical path connecting the second conductive pad and the at least one conductor; and at least one processor (e.g., Figure 9a The processor 280 in the embodiment is configured to receive return loss information of the at least one conductive pattern from the coupler and control the adjustable circuit based on the received return loss information.

[0122] According to an embodiment, the adjustable circuit may include a plurality of inductors having different inductance values ​​(eg, Figure 9b The inductors L (L1, L2, L3, L4...Ln) and switching devices (e.g., Figure 9b A switching device S in the embodiment of the present invention is configured to electrically connect the second conductive pad and the at least one conductor through one of the plurality of inductors.

[0123] According to one embodiment, the at least one processor may also be configured to control the switching device to electrically connect the second conductive pad to the at least one conductor through each of the plurality of inductors in sequence, and based on the received return loss information, control the switching device to electrically connect the second conductive pad and the at least one conductor through the inductor having the best return loss.

[0124] According to an embodiment, the at least one processor may be further configured to detect whether the electronic device is in a folded state, and control the switching device when the electronic device is in the folded state.

[0125] According to an embodiment, the wireless communication circuit may be configured to transmit and / or receive radio signals in a range of approximately 500 MHz to 6000 MHz through the at least one conductive pattern and the at least one conductor when the electronic device is in the folded state.

[0126] Some of the above-described embodiments of the present disclosure may be implemented in hardware, firmware, or by execution of software or computer code, which may be stored in a recording medium (such as a CD ROM, digital versatile disk (DVD), magnetic tape, RAM, floppy disk, hard disk, or magneto-optical disk), or downloaded over a network, or computer code that was initially stored on a remote recording medium or a non-transitory machine-readable medium and is to be stored on a local recording medium, so that the methods described herein can be implemented by such software stored on a recording medium, using a general-purpose computer or a dedicated processor, or programmable or dedicated hardware (such as an ASIC or FPGA). As will be understood in the art, a computer, processor, microprocessor controller, or programmable hardware includes memory components, such as RAM, ROM, flash memory, etc., which can store or receive software or computer code that, when accessed and executed by the computer, processor, or hardware, implements the processing methods described herein.

[0127] While the present disclosure has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the subject matter defined in the appended claims.

Claims

1. An electronic device comprising: The housing comprises: Hinge module; a first housing connected to the hinge module and including a first surface, a second surface facing in a direction opposite to the first surface, and a first lateral member surrounding a first space between the first surface and the second surface; and a second housing connected to the hinge module and including a third surface, a fourth surface facing in a direction opposite to the third surface, and a second lateral member surrounding a second space between the third surface and the fourth surface, wherein the first housing and the second housing are rotatably coupled to each other via the hinge module to be in a folded state or an unfolded state, wherein the first surface and the third surface face the same direction in the unfolded state, and wherein the second surface and the fourth surface face each other in the folded state; a flexible display disposed on the first surface and the third surface; at least one conductive pattern disposed in the first space; at least one conductor disposed in a first position corresponding to the at least one conductive pattern in the second space, such that when the electronic device is in the folded state, the at least one conductor is capacitively coupled to the at least one conductive pattern; a wireless communication circuit electrically connected to the at least one conductive pattern in the first space; a conductive pad disposed in the second space to be exposed through the fourth surface or disposed at a second position closer to the fourth surface than the third surface, wherein the conductive pad is electrically connected to the at least one conductor; a coupler disposed on an electrical path connecting the wireless communication circuit and the at least one conductive pattern; an adjustable circuit disposed on an electrical path connecting the conductive pad and the at least one conductor; and At least one processor configured to: receiving return loss information of the at least one conductive pattern from the coupler, controlling the adjustable circuit based on the received return loss information, detecting whether the electronic device is in the folded state, and When the electronic device is in the folded state, controlling the adjustable circuit, wherein when the electronic device is in the folded state, the conductive pad is capacitively coupled to the at least one conductive pattern, and When the electronic device is in the unfolded state, the conductive pad is spaced apart from the at least one conductive pattern, thereby disconnecting the conductive coupling therebetween.

2. The electronic device according to claim 1, further comprising: A first conductive pad is provided in the first space to be exposed through the second surface or is provided at a third position closer to the second surface than the first surface, wherein the first conductive pad is electrically connected to the at least one conductive pattern.

3. The electronic device according to claim 2, further comprising: When the electronic device is in the folded state, the conductive pad is capacitively coupled to the first conductive pad.

4. The electronic device according to claim 3, wherein the first lateral member further comprises: a first lateral surface disposed substantially parallel to the hinge module; a second lateral surface extending from one end of the first lateral surface to the hinge module; as well as extending from the other end of the first lateral surface to a third lateral surface of the hinge module, A portion of the at least one conductive pattern is disposed in the first space to face the first lateral surface, the second lateral surface, and / or the third lateral surface.

5. The electronic device according to claim 3, wherein the second lateral member further comprises: a fourth lateral surface disposed substantially parallel to the hinge module; a fifth lateral surface extending from one end of the fourth lateral surface to the hinge module; as well as extending from the other end of the fourth lateral surface to a sixth lateral surface of the hinge module, A portion of the at least one conductor is disposed in the second space to face the fourth lateral surface, the fifth lateral surface, and / or the sixth lateral surface. 6 . The electronic device according to claim 3 , wherein when the first conductive pad is disposed to be exposed through the second surface of the first housing, the first conductive pad further comprises a conductive decoration member. 7 . The electronic device according to claim 1 , wherein the at least one conductive pattern further comprises a laser direct structuring (LDS) pattern formed in a dielectric injection molding material and / or a flexible printed circuit board (FPCB).

8. The electronic device according to claim 1, further comprising: a printed circuit board PCB disposed in the first space, The at least one conductive pattern is formed in the filling and cutting regions of the PCB.

9. The electronic device according to claim 1, wherein the wireless communication circuit is configured to send and / or receive radio signals in the range of 500 MHz to 6000 MHz through the at least one conductive pattern and the at least one conductor when the electronic device is in the folded state. 10 . The electronic device according to claim 1 , wherein the at least one conductive pattern is provided at a fourth position in the first space that is closer to the second surface than the first surface.

11. The electronic device according to claim 1 , wherein the adjustable circuit further comprises: Multiple inductors with different inductance values; and A switching device electrically connects the conductive pad and the at least one conductor through one of the plurality of inductors.

12. The electronic device of claim 11, wherein the at least one processor is further configured to: controlling the switching device to electrically connect the conductive pad to the at least one conductor through each of the plurality of inductors in sequence, and Based on the received return loss information, the switching device is controlled to electrically connect the conductive pad and the at least one conductor through the inductor having the best return loss.

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