Wafer processing method and processing apparatus

Abstract

The present invention provides a wafer processing method and a processing apparatus that prevent selection errors of processing conditions. A wafer processing method of processing a wafer having a mark formed on an outer periphery with a processing apparatus having a processing unit and a display unit has the following steps: a preparation step of preparing a frame unit having the wafer, a tape attached to the wafer, and an annular frame having the tape attached to an outer periphery portion of an inner periphery portion; a processing condition selection step of selecting a processing condition when processing the wafer with the processing unit; and a representative image display step of causing the display unit to display a representative image registered in the processing apparatus in association with the processing condition, the annular frame having a notch formed on an outer periphery, and in the frame unit, a positional relationship of the mark and the notch being determined according to the processing condition, the representative image representing a representative example of the frame unit in which the notch of the annular frame and the mark of the wafer are in the positional relationship.

Description

TECHNICAL FIELD

[0001] The present application relates to a wafer processing method and a processing apparatus for processing a wafer supported at an opening portion of a ring-shaped frame by an adhesive tape. BACKGROUND

[0002] In manufacturing a device chip mounted on an electronic device, first, a plurality of division predetermined lines crossing each other are set on a front surface of a semiconductor wafer, and a device such as an IC (Integrated Circuit) or an LSI (Large Scale Integration) is formed in each region divided by the division predetermined lines. Then, the wafer is thinned by grinding from the back surface side using a grinding apparatus, and the wafer is divided along the division predetermined lines using a cutting apparatus, a laser processing apparatus, or the like. Thus, each device chip can be obtained.

[0003] In various processing apparatuses such as a grinding apparatus, a cutting apparatus, and a laser processing apparatus, a wafer is processed in accordance with appropriate processing conditions corresponding to the specifications of the wafer or the device chip (for example, refer to Patent Literature 1, Patent Literature 2, and the like). A plurality of processing conditions for processing various wafers are registered in advance in a control unit of the processing apparatus, and an operator selects appropriate processing conditions from the registered plurality of processing conditions, and causes the processing apparatus to perform processing.

[0004] Patent Literature 1: Japanese Patent Application Laid-Open No. 2015-126054

[0005] Patent Literature 2: Japanese Patent Application Laid-Open No. H10-305420

[0006] However, a plurality of processing conditions are registered in the processing apparatus, and there are also similar processing conditions to each other. Therefore, when appropriate processing conditions are selected in accordance with the specifications of the wafer or the like, an operator sometimes selects an erroneous processing condition. In a case where an erroneous processing condition is selected, not only a desired processing result cannot be obtained, but also there are cases where a crack, a defect, or the like is generated on the wafer or the processing apparatus malfunctions. SUMMARY

[0007] The present application has been achieved in view of the above-described problems, and an object thereof is to provide a wafer processing method and a processing apparatus capable of preventing selection errors of processing conditions and processing a wafer in appropriate processing conditions.

[0008] According to one embodiment of the present application, there is provided a wafer processing method for processing a wafer having a mark formed on an outer periphery thereof using a processing apparatus having a processing unit and a display unit, the wafer processing method comprising: a frame unit preparation step of preparing a frame unit having the wafer, a tape, and a ring-shaped frame, the tape being attached to a front surface or a back surface of the wafer and having a diameter larger than a diameter of the wafer, the ring-shaped frame having an opening portion with a diameter larger than the diameter of the wafer and having an outer periphery portion of the tape attached to an inner periphery portion thereof; a processing condition selection step of selecting a processing condition for processing the wafer using the processing unit from among a plurality of processing conditions registered in the processing apparatus; and a representative image display step of causing the display unit to display a representative image registered in the processing apparatus in association with the processing condition selected by the processing condition selection step, the ring-shaped frame having a notch formed on an outer periphery thereof, a positional relationship between the mark formed on the outer periphery portion of the wafer and the notch of the ring-shaped frame being determined in the frame unit in accordance with the processing condition for processing the wafer using the processing unit, the frame unit prepared by the frame unit preparation step being formed by integrating the ring-shaped frame, the wafer, and the tape in such a manner that the notch of the ring-shaped frame and the mark of the wafer become in the positional relationship, and a representative example of the frame unit in which the notch of the ring-shaped frame and the mark of the wafer are in the positional relationship being reflected in the representative image displayed on the display unit by the representative image display step.

[0009] Preferably, the wafer processing method further comprises a determination step of determining whether the processing condition is appropriate by comparing the representative example reflected in the representative image with the frame unit prepared by the frame unit preparation step after the representative image display step, and a processing step of processing the wafer using the processing unit in accordance with the processing condition is performed when it is determined by the determination step that the processing condition is appropriate, and a frame unit removal step of removing the frame unit from the processing apparatus is performed when it is determined by the determination step that the processing condition is not appropriate.

[0010] Further, preferably, the processing performed by the processing step is dicing processing for dicing the wafer, and the processing condition includes a size of the wafer, an interval of a dicing intended line provided in the wafer, a processing feed rate of the processing unit and the wafer, and a key pattern to be formed on the front surface or the back surface of the wafer.

[0011] Further, according to another aspect of the present application, there is provided a processing apparatus which processes a wafer which is integrated with a ring-shaped frame and a tape to be a part of a frame unit, characterized by comprising: a chuck table which is capable of holding the wafer to be processed; a processing unit which processes the wafer held by the chuck table; a display unit; and a control unit which controls each structural element, the control unit having: a storage section which stores a plurality of processing conditions for processing the wafer by the processing unit and a plurality of representative images which represent the frame unit including the wafer to be processed for each of the processing conditions; and a display control section which causes the display unit to display the representative image which represents the frame unit including the wafer to be processed for the selected processing condition, in which the positional relationship between the mark formed on the outer peripheral portion of the wafer and the cutout of the ring-shaped frame is determined in accordance with the processing condition when the wafer is processed by the processing unit, when one of the processing conditions stored in the storage section is selected.

[0012] In the wafer processing method and the processing apparatus of one embodiment of the present application, a processing condition for processing a wafer to be processed is selected from a plurality of processing conditions registered in advance in a processing apparatus. A representative image of a frame unit including a wafer to be processed based on each processing condition is registered in the processing apparatus. Further, when one processing condition is selected, the representative image registered in association with the processing condition is displayed on a display unit of the processing apparatus.

[0013] Here, in the frame unit, the positional relationship between the cutout of the ring-shaped frame and the mark of the outer periphery of the wafer is determined in advance for each processing condition in which the wafer is processed. Further, when the frame unit is formed, the orientations of the wafer and the ring-shaped frame are adjusted so as to satisfy the positional relationship. Further, when a processing condition in which the wafer is processed is selected, the operator can confirm whether or not the positional relationship between the mark of the outer periphery of the wafer to be processed and the cutout of the ring-shaped frame is consistent with the representative image displayed on the display unit.

[0014] As a result, if the positional relationship is consistent in both, the operator can understand that the selected processing condition is appropriate. On the other hand, in the case where the positional relationship is not consistent in both, it is confirmed that the selected processing condition does not correspond to the wafer. In this case, the operator can prevent a defective condition of the wafer or the processing apparatus by stopping the processing of the processing apparatus, and can correct the selection error of the processing condition so that appropriate processing can be performed.

[0015] Accordingly, according to one embodiment of the present application, there is provided a wafer processing method and a processing apparatus capable of preventing selection errors of processing conditions and processing a wafer with appropriate processing conditions. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 (A) of FIG. 1 is a perspective view of a frame unit including a wafer, Figure 1 (B) of FIG. 1 is a plan view of the frame unit.

[0017] Figure 2 is a perspective view schematically showing a cutting apparatus.

[0018] Figure 3 (A) of FIG. 2 is a plan view schematically showing an example of a frame unit, Figure 3 (B) of FIG. 2 is a plan view schematically showing another example of a frame unit, Figure 3 (C) of FIG. 2 is a plan view schematically showing still another example of a frame unit.

[0019] Figure 4 is a plan view schematically showing a display unit showing a representative image.

[0020] Figure 5 is a flowchart showing a flow of each step of a wafer processing method.

[0021] REFERENCE NUMERALS

[0022] 1: wafer; 1a: front surface; 1b: back surface; 1c: mark; 1d: center; 3: division predetermined line; 5: device; 7: chip; 9: ring-shaped frame; 9a: opening portion; 9b, 9c: cutout; 11: frame unit; 13: cassette; 2: cutting apparatus (processing apparatus); 4: base; 6: cassette table; 8: guide rail; 10: temporary placement table; 12: carrying-out unit; 14, 40: carrying-in / out unit; 16: X-axis moving table; 18: table base; 20: chuck table; 22: holding surface; 24: jig; 26: dust and drip preventing cover; 28: support structure; 30: photographing unit; 32: cutting unit (processing unit); 34: cutting tool; 36: spindle; 38: cleaning unit; 42: display unit; 44: control unit; 46: storage; 48: display control unit; 50: reference image display screen; 52: information related to processing conditions; 54: representative image. DETAILED DESCRIPTION

[0023] An embodiment of one embodiment of the present application will be described with reference to the accompanying drawings. First, a wafer 1 and the like which is a processing target will be described. The wafer 1 is a substantially disc-shaped substrate formed of a material such as a semiconductor such as silicon, SiC (silicon carbide), GaN (gallium nitride), and the like. In addition, the wafer 1 can be formed of a material such as sapphire, glass, quartz, and the like.

[0024] Figure 1 (A) is a perspective view of a wafer 1 and the like, Figure 1 (B) is a plan view of the wafer 1 and the like. A plurality of division intended lines 3, which are called streets, are provided on the front surface la of the wafer 1 so as to intersect with each other.

[0025] A device 5 such as an IC, LSI, or the like is formed in each region divided by the plurality of division intended lines 3. A notch-like mark lc, which is called a notch, indicating the crystal orientation of the wafer 1 is formed in the outer peripheral portion of the wafer 1. However, the mark lc is not limited to the notch. For example, in a case where a straight-line-like cutout portion, which is called an orientation flat, indicating the crystal orientation of the wafer 1 is formed in the outer peripheral portion of the wafer 1, the orientation flat can be used as the mark lc.

[0026] The wafer 1 is processed along the division intended lines 3, and thus is divided into a plurality of device chips. When the wafer 1 is processed, a tape 7 having a larger diameter than the wafer 1 is attached to the back surface (one surface) lb side of the wafer 1, for example.

[0027] The tape 7 includes a film-like base material having flexibility. The base material layer is formed of PO (polyolefin), PET (polyethylene terephthalate), PVC (polyvinyl chloride), PS (polystyrene), or the like. An adhesive layer (paste layer) is provided on one surface of the base material layer.

[0028] The adhesive layers are respectively formed of ultraviolet-curable silicone rubber, an acrylic material, an epoxy material, or the like. The adhesive layers are attached to the back surface lb side of the wafer 1. By attaching the tape 7 to the wafer 1, it is possible to moderate the impact on the wafer 1 at the time of cutting, carrying, or the like, and thus it is possible to reduce the damage to the wafer 1.

[0029] An inner peripheral portion of a ring-shaped frame 9 formed of a metal such as aluminum, stainless steel, or the like is attached to the outer peripheral portion of the tape 7. The ring-shaped frame 9 has an opening portion 9a having a larger diameter than the diameter of the wafer 1. A first notch 9b and a second notch 9c are formed in the outer periphery of the ring-shaped frame 9. The first notch 9b is formed in an acute angle shape in plan view. The second notch 9c is a notch having a shape different from that of the first notch 9b. The second notch 9c is formed in a substantially right angle shape in plan view.

[0030] However, the shape and arrangement of the notches provided in the outer peripheral portion of the ring-shaped frame 9 are not limited to the above-described examples. It is also possible to provide only either one of the first notch 9b and the second notch 9c in the outer peripheral portion of the ring-shaped frame 9. In addition, it is also possible to provide three or more notches in the outer peripheral portion of the ring-shaped frame 9.

[0031] With the wafer 1 positioned approximately at the center of the opening 9a of the annular frame 9, a frame unit 11 is formed by attaching a strip 7 to the back side 1b of the wafer 1 and one surface of the annular frame 9.

[0032] When attaching the tape 7 to the wafer 1 and the annular frame 9, for example, a tape attaching device (not shown) is used. The tape attaching device attaches the tape 7 to the wafer 1 and the annular frame 9 in a state in which the annular frame 9 is configured in a predetermined positional relationship with respect to the mark 1c.

[0033] Thus, wafer 1 is supported by annular frame 9 via belt 7. At this time, the relative position of wafer 1 and annular frame 9 is fixed in the plane direction parallel to the back surface 1b (or front surface 1a). That is, the relative positional relationship between mark 1c and the first cut 9b and the second cut 9c is fixed in the plane direction of wafer 1.

[0034] By integrating the strip 7 with the annular frame 9, the wafer 1 becomes part of the frame unit 11, which is processed by the processing apparatus. Figure 2 This is a perspective view schematically showing a cutting device 2 as an example of a processing apparatus for implementing the wafer processing method of this embodiment. However, this processing apparatus is not limited to the cutting device 2. Furthermore, in Figure 2 In this paper, some structural elements are simplified and represented by boxes, etc.

[0035] like Figure 2 As shown, a platform 6 for holding the box 13 is provided at the corner of the base 4 of the cutting device 2. The platform 6 can be raised and lowered in the vertical direction (Z-axis direction) via a lifting mechanism (not shown). Figure 2 In the diagram, the outline of box 13 placed on box platform 6 is represented by a double-dotted line.

[0036] A temporary worktable 10 is provided on the upper surface of the base 4, adjacent to the box platform 6. This temporary worktable 10 includes a pair of guide rails 8 that approach and separate while maintaining parallelism to the Y-axis direction (left-right direction, indexing feed direction). Additionally, a transfer unit 12 is provided on the upper surface of the base 4, adjacent to the temporary worktable 10. This transfer unit 12 removes the frame unit 11, housed in the box 13 placed on the box platform 6, from the box 13. The transfer unit 12 has a gripping portion on its front surface capable of holding the annular frame 9.

[0037] When the frame unit 11 housed in the cassette 13 is carried out, the carrying-out unit 12 is moved toward the cassette 13, the annular frame 9 is gripped by the gripping portion, and then the carrying-out unit 12 is moved in a direction away from the cassette 13. Thus, the frame unit 11 is pulled out from the cassette 13 onto the temporary placement table 10. At this time, if the pair of guide rails 8 are moved in the X-axis direction in a direction approaching each other in conjunction and the annular frame 9 is gripped by the pair of guide rails 8, the frame unit 11 is positioned at a prescribed position.

[0038] An opening 4a longer in the X-axis direction (front-rear direction, machining feed direction) is formed at a position on the upper surface of the base 4 adjacent to the cassette table 6. Inside the opening 4a, an X-axis moving mechanism (machining feed unit) of a ball screw type not shown and a corrugated dust and drip-proof cover 26 covering the upper portion of the X-axis moving mechanism are provided.

[0039] The X-axis moving mechanism is connected to the lower portion of an X-axis moving table 16 and has a function of moving the X-axis moving table 16 in the X-axis direction. For example, the X-axis moving table 16 moves between a carrying-out and carrying-in region adjacent to the cassette table 6 and a machining region below the cutting unit 32 described later.

[0040] A table base 18 and a chuck table 20 placed on the table base 18 are provided on the X-axis moving table 16. A porous plate (not shown) formed of a porous member is provided on the upper portion of the chuck table 20. The porous plate is connected to one end of a suction passage (not shown) formed in the chuck table 20.

[0041] A suction source (not shown) such as an ejector is connected to the other end of the suction passage. When the suction source is activated, a negative pressure is generated on the front surface of the porous plate. Thus, the front surface of the porous plate functions as a holding surface that suctions and holds the base material layer side of the tape 7.

[0042] A rotation driving mechanism (not shown) that rotates the chuck table 20 around a prescribed rotation axis is provided below the chuck table 20. In addition, a clamp 24 that grips the annular frame 9 is provided on the radially outer side of the chuck table 20. The chuck table 20 is moved in the X-axis direction by the X-axis moving mechanism described above.

[0043] The carrying of the frame unit 11 from the temporary placement table 10 to the chuck table 20 is performed by a first carrying unit 14 provided at a position on the upper surface of the base 4 adjacent to the temporary placement table 10 and the opening 4a. The first carrying unit 14 has a shaft portion protruding upward from the upper surface of the base 4, capable of ascending and descending and capable of rotating, an arm portion extending in the horizontal direction from the upper end of the shaft portion, and a holding portion provided below the front end of the arm portion.

[0044] When the frame unit 11 is carried from the temporary placement table 10 to the chuck table 20 by the first carrying unit 14, the X-axis moving table 16 is moved to position the chuck table 20 in the carrying-in / out area. Then, the annular frame 9 of the frame unit 11 temporarily placed on the temporary placement table 10 is held by the holding portion, the frame unit 11 is lifted, and the shaft portion is rotated to move the frame unit 11 above the chuck table 20.

[0045] After that, the frame unit 11 is lowered to place the frame unit 11 on the holding surface 22 of the chuck table 20. Then, the annular frame 9 is fixed by the jig 24, and the wafer 1 is suction-held by the chuck table 20 through the tape 7 of the frame unit 11.

[0046] The cutting device 2 has a support structure 28 disposed so as to cross the opening 4a above the moving path from the carrying-in / out area of the X-axis moving table 16 to the processing area. Further, a photographing unit 30 directed downward is provided on the support structure 28. The photographing unit 30 photographs the front surface la of the wafer 1 suction-held on the chuck table 20 moving toward the processing area below the cutting unit 32, and detects the position and orientation of the division intended line 3 provided on the front surface la.

[0047] The cutting unit (processing unit) 32 that cuts (processes) the wafer 1 of the frame unit 11 held by the chuck table 20 is provided in the processing area. The cutting unit 32 has a cutting tool 34 having a circular ring-shaped tool portion on the outer periphery, and a main shaft 36 along the Y-axis direction that has the cutting tool 34 installed at the tip end portion to become the rotation axis of the cutting tool 34.

[0048] A rotation drive source (not shown) such as a motor is connected to the base end side of the main shaft 36. When the rotating cutting tool 34 is cut into the wafer 1 included in the frame unit 11 held by the chuck table 20, the wafer 1 can be cut (processed). When the wafer 1 is cut along all the division intended lines 3, the wafer 1 is divided to form each device chip. After that, the chuck table 20 is moved to the carrying-in / out area by the X-axis moving mechanism.

[0049] An opening 4b is formed on the upper surface of the base 4 at a position adjacent to the temporary placement table 10 and the opening 4a, and a cleaning unit 38 that cleans the processed frame unit 11 is housed in the opening 4b. The cleaning unit 38 has a rotating table that holds the frame unit 11. A rotation drive source (not shown) that rotates the rotating table at a predetermined speed is connected to the lower portion of the rotating table.

[0050] The cutting apparatus 2 has a second conveyance unit 40 that conveys the frame unit 11 from the chuck table 20 positioned in the carry-in / carry-out area to the cleaning unit 38. The second conveyance unit 40 has an arm portion that is movable in the Y-axis direction and a holding portion provided below the front end of the arm portion.

[0051] When the frame unit 11 is conveyed from the chuck table 20 to the cleaning unit 38 by the second conveyance unit 40, first, the frame unit 11 is held by the holding portion. Then, the arm portion is moved in the Y-axis direction, and the frame unit 11 is placed on the rotary table of the cleaning unit 38. Thereafter, the frame unit 11 is held by the rotary table, and the wafer 1 is cleaned.

[0052] When the wafer 1 is cleaned by the cleaning unit 38, a fluid for cleaning (typically, a mixed fluid obtained by mixing water and air) is sprayed toward the front surface la of the wafer 1 while the rotary table is rotated. Then, the frame unit 11 cleaned by the cleaning unit 38 is housed in the cassette 13 placed on the cassette table 6.

[0053] When the frame unit 11 is housed in the cassette 13, the frame unit 11 is conveyed from the cleaning unit 38 to the temporary placement table 10 by the first conveyance unit 14. Then, the carry-out unit 12 is moved toward the cassette 13, and the frame unit 11 is pushed into the cassette 13.

[0054] Thus, in the cutting apparatus 2, the frame unit 11 is carried out of the cassette 13, the frame unit 11 is held by suction by the chuck table 20, and the wafer 1 included in the frame unit 11 is processed by the cutting unit 32. Then, the frame unit 11 is cleaned by the cleaning unit 38 and is housed in the cassette 13 again. In the cutting apparatus 2, the frame units 11 are sequentially carried out of the cassette 13, and the wafers 1 are sequentially cut by the cutting unit 32 on the chuck table 20.

[0055] The cutting apparatus 2 has a display unit 42 that can display various information on the upper portion of the housing. The display unit 42 is constituted, for example, by a liquid crystal display or an organic EL panel. Further, the cutting apparatus 2 has an input interface used in the input of various instructions and the like. The input interface is, for example, a touch panel overlaid on the front surface of the display unit 42. That is, the display unit 42 can also be a display with a touch panel.

[0056] Further, the cutting apparatus 2 has a control unit 44 that controls each structural element. The control unit 44 is configured of a computer including a processing device such as a CPU (Central Processing Unit) and a storage device such as a flash memory. The control unit 44 functions as a specific unit that causes software to cooperate with the processing device (hardware resource) by causing the processing device to act in accordance with the program or the like stored in the storage device.

[0057] The control unit 44 has a storage section 46 that stores various information and the like, and a display control section 48 that controls the display of the display unit 42. In the storage section 46, a plurality of processing conditions corresponding to the specifications of various wafers 1 processed by the cutting apparatus 2 and various device chips formed from the wafers 1 are registered in advance, for example.

[0058] The processing conditions include information such as the material and size of the wafer 1 that is the processing target, the interval of the division intended lines 3 provided to the wafer 1, the processing feed speed of the cutting unit (processing unit) 22 and the wafer 1, the rotation speed of the cutting tool 34, and the type of the cutting tool 34, for example. Further, in the storage section 46, the image of a key pattern that should be formed on the front surface la or the back surface lb of the wafer 1 is registered in advance, which is used when detecting the positions of the plurality of division intended lines 3 provided to the front surface la of the wafer 1 by the imaging unit 30.

[0059] An operator who operates the cutting apparatus 2 selects a processing condition appropriate for processing the wafer 1 carried into the cutting apparatus 2 from among the plurality of processing conditions stored in the storage section 46. The control unit 44 controls the cutting unit 32 and the chuck table 20 and the like in accordance with the selected processing condition, and performs cutting (processing) of the wafer 1 held by the chuck table 20.

[0060] However, a plurality of processing conditions are registered in the storage section 46 of the cutting apparatus 2, and there are also processing conditions similar to each other. Therefore, when selecting an appropriate processing condition corresponding to the specification of the wafer 1 and the like, the operator sometimes selects an erroneous processing condition. In the case where an erroneous processing condition is selected, not only a desired processing result cannot be obtained, but also there is a case where a damage such as a crack or a defect is generated on the wafer 1 or a case where the cutting apparatus 2 malfunctions.

[0061] Therefore, in the wafer processing method and the processing apparatus of the present embodiment, the operator is provided with a judgment material for judging whether the selected processing condition is a processing condition appropriate for processing the wafer 1 that is the processing target. Then, the operator judges whether the wafer 1 carried into the cutting apparatus 2 and the selected processing condition correspond to each other.

[0062] Here, in order to enable determination by the operator, the positional relationship of the mark 1c of the wafer 1 in the frame unit 11 and the cutouts 9b, 9c of the annular frame 9 is determined for each processing condition. Also, when the frame unit 11 is formed, the orientations of the wafer 1 and the annular frame 9 are adjusted so as to arrange the mark 1c of the wafer 1 and the cutouts 9b, 9c of the annular frame 9 in a positional relationship corresponding to the processing condition used to process the wafer 1.

[0063] For example, the general angle a of the relative position of the first cutout 9b and the position of the mark 1c when the frame unit 11 is viewed in plan (refer to (B) of FIG. 6) is determined for each processing condition. In the case where the line segment defined by the first cutout 9b and the center 1d of the front face 1a is the initial edge (0°) and the line segment defined by the mark 1c and the center 1d is the vector, the general angle a is the angle indicating how much the vector has rotated from the initial edge. Figure 1

[0064] Alternatively, instead of the general angle a, the general angle β of the relative position of the second cutout 9c and the position of the mark 1c when the frame unit 11 is viewed in plan (refer to (B) of FIG. 7) can be determined for each processing condition. In the case where the line segment defined by the second cutout 9c and the center 1d is the initial edge and the line segment defined by the mark 1c and the center 1d is the vector, the general angle β is the angle indicating how much the vector has rotated from the initial edge. Figure 1

[0065] Also, in the storage section 46 of the control unit 44 of the cutting apparatus 2, a representative image indicating the positional relationship of the mark 1c of the wafer 1 in the frame unit 11 and the cutouts 9b, 9c of the annular frame 9 is registered in association with each processing condition. Figure 3 (A) of FIG. 6, Figure 3 (B) of FIG. 7, and Figure 3 (C) of FIG. 8 are plan views schematically showing examples of the representative images registered in the storage section 46 together with each processing condition. Also, Figure 1 the plan view schematically showing the frame unit 11 shown in (B) of FIG. 7 can be stored in the storage section 46 as a representative image.

[0066] By comparing these respective plan views, it is understood that the general angles a (general angles β) are different from one another in the respective plan views. In other words, the positional relationship of the mark 1c of the wafer 1 and the cutouts 9b, 9c of the annular frame 9 is different from one another. However, the respective representative images registered in the storage section 46 in association with each processing condition do not need to be completely different from one another in this positional relationship, and this positional relationship can be repeated in some of the representative images.

[0067] ​​In addition, each representative image can be formed by photographing each frame unit 11 with the photographing unit 30, or can be formed by photographing each frame unit 11 with a camera or the like outside the cutting apparatus 2. In addition, it can be a legend or the like that imitates the frame unit 11. As long as it is a manner in which the positional relationship of the mark 1c of the wafer 1 and the cutouts 9b, 9c of the ring-shaped frame 9 can be understood, the form is not limited. When a new processing condition is registered in the storage section 46, a representative image can be formed and registered.

[0068] The display control section 48 of the control unit 44 has a function of causing the display unit 42 to display a representative image registered in the storage section 46 in association with a processing condition when one of the plurality of processing conditions stored in the storage section 46 is selected. Figure 4 is a plan view schematically showing the display unit 42 that displays the reference image display screen 50 including the representative image 54. In addition, the display control section 48 can also cause the display unit 42 to display the representative image 54 and cause the display unit 42 to display information 52 related to the processing condition.

[0069] As shown in Figure 4 , the positional relationship of the mark 1c of the wafer 1 and the cutouts 9b, 9c of the ring-shaped frame 9 can be grasped from the representative image 54 displayed by the display unit 42. For example, it can be understood that Figure 4 the positional relationship of the mark 1c of the wafer 1 and the cutouts 9b, 9c of the ring-shaped frame 9 in the representative image 54 included in Figure 3 (A) is identical to the positional relationship in the frame unit 11 shown in

[0070] When the operator who operates the cutting apparatus 2 selects a processing condition for processing the wafer 1 from the plurality of processing conditions stored in the storage section 46 of the control unit 44, a representative image 54 including the wafer 1 or the like that should be processed under the processing condition is displayed on the display unit 42. Therefore, the operator can compare the positional relationship of the mark 1c of the wafer 1 and the cutouts 9b, 9c of the ring-shaped frame 9 with respect to the frame unit 11 carried into the cutting apparatus 2 and the frame unit 11 in the representative image 54.

[0071] As a result, in the case where the positional relationship of both is identical, the operator can confirm that the selected processing condition is appropriate, and is in a state in which the wafer 1 can be appropriately processed under the processing condition. Then, the cutting apparatus 2 is operated, and processing of the wafer 1 by the cutting unit 32 is performed under the processing condition. Thus, the wafer 1 is appropriately processed by the cutting unit 32, and a desired processing result is obtained.

[0072] On the other hand, in a case where the positional relationship of both is not consistent, it can be understood that at least one of the selected processing condition and the wafer 1 carried into the cutting device 2 is wrong. If the wafer 1 is processed by the cutting device 2 in this state, not only a desired processing result cannot be obtained, but also damage can sometimes occur on the wafer 1 and the cutting device 2. In this case, the operator inputs an instruction so as not to cause the cutting device 2 to perform processing. Then, the carried-in frame unit 11 is carried out to the outside of the cutting device 2, the processing condition and the wafer 1 are confirmed, and a corrective measure is taken.

[0073] Thus, according to the wafer processing method and the processing device of the present embodiment, when a specific processing condition is selected from among the registered plurality of processing conditions, the representative image 54 corresponding to the processing condition is displayed on the display unit 42. Therefore, the operator can determine whether the wafer 1 and the processing condition correspond to each other, and can suspend processing in a case where they do not correspond to each other. Therefore, processing of the wafer 1 is not performed in a wrong condition, and damage does not occur on the wafer 1 and the cutting device 2.

[0074] Here, the wafer processing method of the present embodiment will be described. Figure 5 is a flowchart showing a flow of each step of the wafer processing method. In the wafer processing method, first, a preparation step S10 of preparing a frame unit 11 having a wafer 1, a tape 7, and a ring-shaped frame 9 is performed.

[0075] The preparation step S10 can also be performed by a tape attaching device (not shown) that integrates the wafer 1, the tape 7, and the ring-shaped frame 9, for example. In the tape attaching device, integration is performed so as to arrange the mark 1c of the wafer 1 and the notches 9b, 9c of the ring-shaped frame 9 in a positional relationship corresponding to a processing condition of processing to be performed on the wafer 1.

[0076] In addition, in the preparation step S10, a frame unit 11 obtained by integrating the wafer 1, the tape 7, and the ring-shaped frame 9 in advance in a prescribed orientation can also be prepared. Then, in the preparation step S10, the formed frame unit 11 is carried into the cutting device 2 in a state of being housed in the cassette 13.

[0077] In addition, in the wafer processing method of the present embodiment, a processing condition selection step S20 of selecting a processing condition at which the wafer 1 is processed by the cutting unit (processing unit) 32 from among a plurality of processing conditions registered in the cutting device (processing device) 2 is performed. The processing condition selection step S20 can be performed before the preparation step S10, or can be performed after the preparation step S10. In the processing condition selection step S20, the operator selects a processing condition by using an operation screen displayed by the display unit 42, for example.

[0078] Next, a representative image display step S30 is implemented in which the display unit 42 is caused to display the representative image 54 registered in the cutting device (machining device) 2 in association with the machining condition selected by the machining condition selection step S20 (see Fig. 6). The representative image display step S30 is implemented by the display control unit 48 controlling the display unit 42 to display the representative image 54 associated with the machining condition upon receiving an instruction to select the machining condition of the machining condition selection step S20. Figure 4 ). The representative image display step S30 is implemented by the display control unit 48 controlling the display unit 42 to display the representative image 54 associated with the machining condition upon receiving an instruction to select the machining condition of the machining condition selection step S20.

[0079] When the representative image display step S30 is implemented, the representative image 54 is displayed on the display unit 42. As shown in Fig. 6, in the representative image 54 displayed on the display unit 42 by the representative image display step S30, a representative example of the frame unit 11 in which the cutouts 9b, 9c of the ring-shaped frame 9 are in a prescribed positional relationship with the mark 1c of the wafer 1 is visualized. Figure 4

[0080] Then, the operator who operates the cutting device 2 compares the frame unit 11 carried into the cutting device 2 with the representative image 54 to determine whether the positional relationship of the mark 1c of the wafer 1 and the cutouts 9b, 9c of the ring-shaped frame 9 is consistent. That is, after the representative image display step S30, a determination step S40 is implemented in which the representative example of the frame unit 11 visualized in the representative image 54 is compared with the frame unit 11 prepared by the preparation step S10 to determine whether the machining condition is appropriate.

[0081] In the determination step S40, for example, the operator visually confirms the frame unit 11 pulled out from the cassette 13 onto the temporary placement table 10 and compares it with the representative image 54 displayed on the display unit 42. Alternatively, the operator can memorize the positional relationship in the frame unit 11 housed in the cassette 13 in advance and determine whether the positional relationship shown in the representative image 54 displayed on the display unit 42 is consistent with his own memory.

[0082] Further, the determination step S40 can be implemented by the function of the control unit 44. For example, the control unit 44 can instruct the imaging unit 30 to image the frame unit 11 during the conveyance of the frame unit 11 housed in the cassette 13 to the chuck table 20. Also, the positional relationship in the frame unit 11 can be detected from the obtained image. In this case, the control unit 44 determines whether the positional relationship shown in the representative image 54 is consistent with the positional relationship in the frame unit 11.

[0083] ​Then, in a case where it is determined in the determination step S40 that the processing condition is appropriate (S41), a processing step S50 of performing cutting (processing) of the wafer 1 in the processing condition using the cutting unit (processing unit) 32 is implemented. In the processing step S50, the frame unit 11 is carried to and held by the chuck table 20, and the wafer 1 held by the chuck table 20 is cut using the cutting unit 32. Then, an unloading step S60 of unloading the processed wafer 1 from the cutting apparatus 2 is implemented.

[0084] On the other hand, in a case where it is determined in the determination step S40 that the processing condition is inappropriate (S41), the processing step S50 is not implemented, and the unloading step S60 of unloading the frame unit 11 from the cutting apparatus (processing apparatus) 2 is implemented. Alternatively, a reselection step of reselecting the processing condition can be implemented. Thus, the wafer 1 is not processed in an inappropriate processing condition.

[0085] Further, the configuration, method, and the like of the above-described embodiments can be implemented with appropriate modifications within a range not departing from the object of the present application. In the above-described embodiments, a case where the processing apparatus that processes the wafer 1 is the cutting apparatus 2 that performs cutting processing of the wafer 1 by cutting the wafer 1 is described as an example, but the processing apparatus is not limited thereto. That is, the processing apparatus can be a grinding apparatus that grinds the wafer 1 from the back surface 1b side or a laser processing apparatus that performs laser processing of the wafer 1 along the division predetermined line 3.

[0086] Further, in the above-described embodiments, a case where the mark 1c formed on the outer periphery of the wafer 1 is a notch or an orientation flat that indicates the crystal orientation of the wafer 1 is described as an example, but the mark 1c is not limited thereto. For example, the mark 1c can be a pattern of a specific shape provided on the front surface of the wafer 1.

[0087] Further, the configuration, method, and the like of the above-described embodiments can be implemented with appropriate modifications within a range not departing from the object of the present application.

Claims

1. A wafer processing method of processing a wafer having a mark formed on an outer periphery thereof using a processing apparatus having a processing unit and a display unit, characterized by comprising: a preparation step of preparing a frame unit having the wafer, a tape, and a ring-shaped frame, the tape being attached to a front surface or a back surface of the wafer and having a diameter larger than a diameter of the wafer, the ring-shaped frame having an opening portion with a diameter larger than the diameter of the wafer and having an outer periphery portion of the tape attached to an inner periphery portion thereof; a processing condition selection step of selecting a processing condition at the time of processing the wafer using the processing unit from among a plurality of processing conditions registered in the processing apparatus; and a representative image display step of causing the display unit to display a representative image registered in the processing apparatus in association with the processing condition selected by the processing condition selection step, wherein the ring-shaped frame has a notch formed on an outer periphery thereof, wherein, in the frame unit, a positional relationship between the mark formed on the outer periphery portion of the wafer and the notch of the ring-shaped frame is determined in accordance with the processing condition at the time of processing the wafer using the processing unit, wherein the frame unit prepared by the preparation step is formed by integrating the ring-shaped frame, the wafer, and the tape in such a manner that the notch of the ring-shaped frame and the mark of the wafer are in the positional relationship, wherein, in the representative image displayed on the display unit by the representative image display step, a representative example of the frame unit in which the notch of the ring-shaped frame and the mark of the wafer are in the positional relationship is visualized, wherein the wafer processing method further comprises a determination step of, after the representative image display step, determining whether or not the processing condition is appropriate by comparing the representative example visualized in the representative image with the frame unit prepared by the preparation step, wherein, in a case where it is determined by the determination step that the processing condition is appropriate, a processing step of processing the wafer using the processing unit in accordance with the processing condition is performed, and wherein, in a case where it is determined by the determination step that the processing condition is not appropriate, a removal step of removing the frame unit from the processing apparatus is performed.

2. The wafer processing method according to claim 1, wherein the processing performed by the processing step is dicing processing of dicing the wafer, and wherein the processing condition includes a size of the wafer, an interval of a dicing intended line provided to the wafer, a processing feed rate of the processing unit and the wafer, and a key pattern to be formed on the front surface or the back surface of the wafer.

3. A processing apparatus that processes a wafer integrated with a ring-shaped frame and a tape to be part of a frame unit, the processing apparatus comprising: a chuck table capable of holding the wafer to be processed; a processing unit that processes the wafer held by the chuck table; a display unit; and a control unit that controls each structural element, wherein the control unit comprises: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ a storage section that stores a plurality of processing conditions for processing the wafer by the processing unit and a plurality of representative images that represent frame units including the wafer that is a processing target of each of the processing conditions, a display control section that causes the display unit to display the representative image that represents the frame unit including the wafer that is a processing target of the selected processing condition when one of the processing conditions stored in the storage section is selected, in the frame unit, a positional relationship between a mark formed on an outer peripheral portion of the wafer and a notch of the annular frame is determined in accordance with the processing condition when the wafer is processed by the processing unit, the frame unit is formed by integrating the annular frame, the wafer, and the tape in such a manner that the notch of the annular frame and the mark of the wafer become the positional relationship, in the representative image displayed on the display unit, a representative example of the frame unit in which the notch of the annular frame and the mark of the wafer are in the positional relationship is represented, after the representative image is displayed on the display unit, the representative example represented in the representative image and the frame unit prepared are compared, and it is determined whether the processing condition is appropriate, in a case where it is determined that the processing condition is appropriate, the wafer is processed by the processing unit in accordance with the processing condition, in a case where it is determined that the processing condition is inappropriate, the frame unit is carried out of the processing apparatus.

Images