Electronic devices

Abstract

The present disclosure relates to electronic devices. An electronic device may include a housing including an optically transparent component. A first light emitter and a second light emitter may be positioned in an internal volume defined by the housing. A light detector may be positioned in the internal volume and may be optically isolated from the first light emitter and the second light emitter within the internal volume. An opaque material may be disposed on the optically transparent component and may be positioned to inhibit light emitted from the second light emitter from reaching the light detector and allow light emitted from the first light emitter to reach the light detector.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 037961, entitled “ELECTRONIC DEVICE,” filed on June 11, 2020, and the entire disclosure of that U.S. Provisional Patent Application is hereby incorporated herein by reference. Technical Field

[0003] The embodiments generally relate to electronic devices. More specifically, the embodiments relate to wearable electronic devices. Background Art

[0004] When designing electronic devices, the portability of the devices is increasingly considered, for example, to allow users to use the devices in a variety of situations and environments. In the context of wearable devices, these devices can be designed to include many different functions and operate in many different locations and environments. The components of the electronic device, such as the processor, memory, antenna, display, and other components can partially determine the performance level of the electronic device. In addition, the arrangement of these components relative to each other in the device can also determine the performance level of the electronic device.

[0005] Continued advancements in electronic devices and their components have resulted in considerable improvements in performance. However, existing components and structures of electronic devices may limit the performance levels of such devices. For example, while some components may achieve high performance levels in some cases, including multiple components in a device that is sized to enhance portability may limit the performance of the components, and thus the performance of the device. Therefore, it may be desirable to further adjust the arrangement of components of electronic devices to provide additional or enhanced functionality without introducing or increasing undesirable device properties. Summary of the invention

[0006] According to some examples of the present disclosure, an electronic device may include a housing that at least partially defines an internal volume, the housing including an electromagnetically transparent portion that at least partially defines an outer surface of the electronic device. The electronic device may also include an antenna and a sensing circuit, the antenna being disposed in the internal volume and positioned to transmit a signal at a certain power level through the electromagnetically transparent portion, and the sensing circuit being disposed in the internal volume and positioned to receive the signal. The sensing circuit may be configured to measure the transmission power of the signal. A processor may also be disposed in the internal volume, the processor being configured to compare the transmission power with the power level.

[0007] According to some examples of the present disclosure, an electronic device may include: a housing that at least partially defines an internal volume, the housing including an optically transparent component that at least partially defines an outer surface of the electronic device; a first light emitter that is positioned in the internal volume; a second light emitter that is positioned in the internal volume; a light detector that is positioned in the internal volume, the light detector being optically isolated from the first light emitter and the second light emitter within the internal volume; and an opaque material that is disposed on the optically transparent component, the opaque material being positioned to: inhibit light emitted from the second light emitter from reaching the light detector along a path from the second emitter through a medium adjacent to a portion of the outer surface defined by the optically transparent component, and from reaching the light detector through the optically transparent component; and allow light emitted from the first light emitter to reach the light detector along a path from the first emitter through the medium, and from reaching the light detector through the optically transparent component.

[0008] In some examples, the optically transparent component includes glass. The opaque material may be opaque to visible light in general and / or green light in particular. The opaque material may be transparent to infrared light. The opaque material may have a major dimension of 10 mm or less. The opaque material may have a thickness of 10 microns or less. The electronic device may also include a lens positioned above the opaque material. The optically transparent component may include sapphire. The optically transparent component may include a silicon dioxide layer, and the opaque material may be disposed on the silicon dioxide layer.

[0009] According to some examples, an electronic device may include: a housing defining an internal volume, the housing including an optically transparent portion; a light emitter disposed in the internal volume; a first light detector disposed in the internal volume; a second light detector disposed in the internal volume; and a light-blocking component disposed on an inner surface of the optically transparent portion, the size and position of the light-blocking component being set to: prevent light emitted by the light emitter from leaving the electronic device through the optically transparent component when oriented in a direction more toward the second light detector than the first light detector; and allow light emitted by the light emitter to leave the electronic device through the optically transparent component when oriented in a direction more toward the first light detector than the second light detector.

[0010] In some examples, the light blocking member has a substantially circular shape. The light blocking member may have a diameter of 10 mm or less. The light blocking member may include an ink layer. The layer may have a thickness of about 10 microns or less. The light emitter may include an LED. The light blocking member includes a first light blocking member, and the electronic device also includes a second light blocking member positioned in the internal volume between the light emitter and the first light detector.

[0011] According to some examples, a housing for an electronic device may include: a cover defining a hole; an optically transparent component positioned in the hole and fixed to the cover, the optically transparent component at least partially defining an inner surface of the housing and an outer surface of the housing; a lens covering a portion of the optically transparent component defining the inner surface; and an opaque material disposed on the portion of the optically transparent component defining the inner surface, the opaque material being positioned between the optically transparent component and the lens. The opaque material may be opaque to visible light and at least partially transparent to infrared light. The lens may include a Fresnel lens. The optically transparent component may include glass. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0013] Figure 1A A perspective view of an electronic device is shown.

[0014] Figure 1B Shows Figure 1A Exploded view of the bottom of the electronic device.

[0015] Figure 2 An exploded view of the electronic device is shown.

[0016] Figure 3 An exploded view of a portion of an electronic device is shown.

[0017] Figure 4A A cross-sectional side view of components of an electronic device is shown.

[0018] Figure 4B Shows Figure 4A Exploded sectional view of the components.

[0019] Figure 4C Shows Figure 4A A close-up cross-sectional view of a portion of a component.

[0020] Figure 4D Shows Figure 4A An exploded sectional view of a portion of a component.

[0021] Figure 5A An exploded view of a portion of an electronic device is shown.

[0022] Figure 5B Shows Figure 5A A cross-sectional view of an electronic device.

[0023] Figure 5C A cross-sectional view of components of an electronic device is shown.

[0024] Figure 5D A cross-sectional view of components of an electronic device is shown.

[0025] Figure 5E A cross-sectional view of components of an electronic device is shown.

[0026] Fig. 6A A bottom perspective view of the electronic device is shown.

[0027] Figure 6B An exploded view of a portion of an electronic device is shown.

[0028] Figure 6C An exploded view of components of an electronic device is shown.

[0029] Fig.6D An exploded view of components of an electronic device is shown.

[0030] Fig. 6E An exploded view of components of an electronic device is shown.

[0031] Fig. 7A A process flow diagram of a method for detecting the presence of a material near an electronic device is shown.

[0032] Figure 7B A process flow diagram of a method for detecting the presence of a material near an electronic device is shown.

[0033] Fig. 8A A cross-sectional view of components of an electronic device is shown.

[0034] Figure 8B A cross-sectional view of components of an electronic device proximate to a user is shown.

[0035] Figure 8C A cross-sectional view of components of an electronic device proximate to a user is shown.

[0036] Fig.8D A cross-sectional view of components of an electronic device proximate to a user is shown. DETAILED DESCRIPTION

[0037] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalent forms that may be included in the spirit and scope of the embodiments defined by the appended claims.

[0038] The architecture and components of the electronic devices described herein can allow for configurations and designs that can maximize the number of functions and performances of portable or wearable electronic devices, while also allowing for the use of relatively low-cost or abundant materials, and reducing the complexity and cost of manufacturing and assembly. Although the use of high-performance materials or highly complex components can achieve high levels of device performance and functionality, these materials and components can also increase the cost of the device, thereby reducing the number of users who may be able to reasonably afford the device. Therefore, it is desirable to provide component designs that can include relatively low-cost materials and have relatively low manufacturing complexity, but can still achieve performance and functionality levels that are comparable or sufficiently close to those achieved by devices that include high-performance materials and components.

[0039] References below Figures 1A to 7B These and other embodiments are discussed. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these drawings is for illustrative purposes only and should not be construed as limiting.

[0040] Figure 1A An example of an electronic device 100 is shown. Figure 1A The electronic device shown in FIG. 1 is a watch, such as a smart watch. Figure 1A The smartwatch is merely a representative example of a device that can be used in conjunction with the systems and methods disclosed herein. The electronic device 100 may correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, or other electronic device. The electronic device 100 may be referred to as an electronic device or a consumer device. In some examples, the electronic device 100 may include a body 101, which may, for example, carry operating components in an internal volume at least partially defined by a housing of the body. The electronic device 100 may also include a strap 103 or other retaining component that can secure the device 100 to the user's body as desired. Reference is made below to Figure 1B Further details of the electronic equipment are provided.

[0041] Reference now Figure 1B, the electronic device 100 may include a body 101 having a housing 102 and a cover 110 attached to the housing 102. The housing 102 may substantially define at least a portion of the outer surface of the device 100. The cover 110 may include a ceramic material such as sapphire, glass, plastic, or any other substantially transparent material, component, or assembly. The cover 110 may cover or otherwise cover a display, a camera, a touch-sensitive surface such as a touch screen, or any component of the device 100. The cover 110 may define the front outer surface of the device 100. The housing 102 and the cover 110 together may substantially define the outer surface of the device 100.

[0042] In some examples, housing 102 may include a component 130 that defines at least an outer surface of device 100. Component 130 may be referred to as a back shell or back cover, and in some examples, may be attached to one or more other components, such as housing 102. Component 130 may be attached to housing 102 by any method known in the art or developed in the future, such as adhesive bonding, brazing, welding, overmolding, interference fit, or other securing methods.

[0043] Back cover 130 may define one or more holes or through-holes. Transparent material 132 may be disposed in the one or more holes. In some examples, transparent material 132 may be visually transparent and may include any transparent material, including ceramic materials such as sapphire. Transparent material 132 may provide visual and electromagnetic access to the external environment for one or more components of device 100, as described herein.

[0044] The housing 102 may include one or more features for receiving or coupling to other components of the device 100. For example, the housing 102 may include features such as a recess 104 for receiving the strap 103 and an aperture 108 for receiving the button 148. The housing may also define one or more apertures for receiving additional input components, such as a dial or crown 146.

[0045] Device 100 is only one example of an electronic device 100. Additional electronic devices and designs thereof are expressly contemplated. Figure 2 Further details of example electronic devices and components are provided.

[0046] Figure 2 An exploded view of a smartwatch 200 is shown, which can be substantially similar to the devices described herein, such as the electronic device 100, and can include some or all of the features of the devices described herein. The device 200 can include a housing 202, a display assembly 210, and a back cover 230. The housing 202, the display assembly 210, and the back cover 230 together can define an outer surface and an inner volume of the device 200.

[0047] Housing 202 can be a substantially continuous or unitary component and can define one or more openings 204, 206, and 208 to receive components of electronic device 200 and / or provide access to internal portions of electronic device 200. In some examples, device 200 can include input components such as one or more buttons 248 and / or crown 244 that can be disposed in openings 206, 208. A microphone can be disposed in the interior volume so that it communicates with the exterior or surrounding environment through opening 204.

[0048] The display assembly 210 can be received by the housing 202 and can be attached to the housing. The display assembly can include a cover 214, which includes a transparent material such as plastic, glass and / or ceramic. The display assembly 210 can also include a display stack 212, which can include multiple layers and components, each of which can perform one or more desired functions. For example, the display stack 212 can include a display layer 212, which can include a touch detection layer or component, a force-sensitive layer or component, and one or more display layers or components that can include one or more pixels and / or light-emitting portions for displaying visual content and / or information to a user. In some examples, the display layer or component 212 can include a liquid crystal display (LCD), a light-emitting diode (LED) display, an organic light-emitting diode (OLED) display, and / or any other form of display. The display layer 212 can also include one or more electrical connectors to provide signals and / or power to the display layer 212 from other components of the device 200.

[0049] In some examples, the device 200 may include a gasket or seal 216 that may be disposed between the display assembly 210 and the housing 202 to define a barrier to prevent liquid or moisture from entering the internal volume from the external environment generally at the location of the seal 216. As described herein, the seal 216 may include a polymer, metal, and / or ceramic material. The device 200 may also include a seal 234 that may be disposed between the housing 202 and the back cover 230 to define a barrier to prevent liquid or moisture from entering the internal volume from the external environment generally at the location of the seal 234. As described herein, the seal 234 may include a polymer, metal, and / or ceramic material. The seal 234 may be substantially similar to the seal 216 and may include some or all of the features of the seal.

[0050] The device 200 may also include internal components such as a haptic engine 224, a battery 222, and a logic board 240 (also referred to as a main logic board 240), which may include a system-in-package (SiP) 242 disposed thereon, the system-in-package including one or more integrated circuits such as a processor, a sensor, and a memory. The SiP may also include a package.

[0051] In some examples, the internal components may be disposed below the main logic board 240 and may be at least partially disposed in a portion of the internal volume defined by the back cover 230. For example, the device 200 may include an electromagnetic shielding component, or an electronic shield 252, which may shield other components in the device 200 from electromagnetic radiation from the surrounding environment and / or electromagnetic radiation emitted by other components in the device 200. The device 200 may also include a second logic board 250, which may communicate with one or more sensors or transmitters of the device 200, for example, to receive information or signals from the external environment. In some examples, the second logic board 250 may also include a SiP. In some examples, the device 200 may include one or more wireless antennas, such as an antenna 254 that may be electrically connected to one or more other components of the device 200. In some examples, the antenna 254 may receive and / or transmit wireless signals at one or more frequencies, and may be, for example, a cellular antenna such as an LTE antenna, a Wi-Fi antenna, a Bluetooth antenna, a GPS antenna, a multi-frequency antenna, etc. One or more. The antenna 254 may be coupled to one or more additional components of the electronic device 200 in a manner that enables communication.

[0052] The internal components may be disposed within an internal volume at least partially defined by the housing 202 and may be attached to the housing 202 via an adhesive, an internal surface, an attachment feature, a threaded connector, a stud, a column, or other feature formed into, defined by, or otherwise becoming a part of the housing 202 and / or the cover 214 and / or the back cover 330.

[0053] Any number or type of components in any configuration described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of device components and the concepts regarding the use and operation of the components may be applied not only to the specific examples discussed herein, but also to any number of embodiments in any combination. Figures 3 to 4D Various examples of electronic devices and electronic device components are described, including components having various features in various arrangements.

[0054] Figure 3 An exploded view of several components of an electronic device is shown, which may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. Figure 2As described above with reference to electronic device 200, the electronic device may include a housing 302 that may at least partially define an interior volume and an input component such as a crown or dial 346 that may be positioned at and at least partially extend through an aperture 306 defined by the housing 302. The crown module 346 may be connected to one or more other components of the device (not shown).

[0055] Figure 4A A cross-sectional view of an input component 400 of an electronic device is shown. The input component 400 can be a crown or a dial of a crown module and can be substantially similar to the dials 246, 346 described herein. In some examples, the crown 400 can be a component of a crown module that can be substantially similar to and can include some or all of the features of the crown modules described in U.S. Pat. Nos. 9,627,163 and 9,753,436, which are incorporated herein by reference in their entirety.

[0056] The input component 400 may include an outer portion or turntable 402 connected to the shaft 410, for example, using a locking ring 406. The turntable 402 may define an outer surface of both the crown module and the electronic device including the crown module. In addition, the turntable 402 may be sized and shaped to be manipulated by a user, such as being rotated by a user around an axis defined by the shaft 410. In some examples, the turntable 402 may include a cap or ring 404, which may include a different material than the turntable 402 and may provide a desired aesthetic appearance to the exterior of the turntable 402. For example, the cap 404 may be brightly colored so that it can be easily identified by a user.

[0057] In some examples, the shaft 410 may be attached to the locking ring 406 by any desired technique, such as one or more of an adhesive, brazing, or welding. In some examples, the shaft 410 may also include a threaded portion that may be received by other components of the crown module (not shown) and may transmit the rotational force applied to the turntable 402 to the module. All or a portion of the shaft 410 may extend through a collar 420 that may define a hole or orifice through which the shaft 410 may pass. The collar 420 may accommodate the shaft 410 and may hold the shaft 410 in a desired position. In some examples, the shaft 410 may include, for example, a protruding portion that protrudes substantially vertically from the central axis of the shaft 410. In some examples, the protruding portion and the central portion of the shaft may define a channel. One or more washers or O-rings 432 may be disposed between the shaft 410 and the collar 420 to provide or define a seal between them, for example to prevent liquid or contaminants from entering the internal volume of the device and / or the crown module. An additional gasket or O-ring 434 may be disposed on another surface of the collar 420 to provide or define a seal between the collar 420 and one or more other components of the crown module. In some examples, a bushing 422 may be mounted on an outer surface of the collar 420 between the collar 420 and the shaft 410, such as a protrusion defining a channel.

[0058] Figure 4B An exploded cross-sectional view of the turntable 402 and the shaft 410 is shown. As described above, the lock ring 406 can engage or attach the turntable 402 to the shaft 410. In some examples, the lock ring 406 may include a metal or a metallic material, such as a sheet metal, including a stamped sheet metal. The shaft may also include a metallic material, and in some examples, the lock ring 406 may be welded or brazed to the shaft 410, such as welded or brazed to its flat surface. In some examples, the lock ring 406 may have a substantially circular or annular shape, and may also include one or more protrusions extending from the ring (such as extending in a direction substantially perpendicular to the plane of the ring). The size and shape of these protrusions may be set to correspond to the locking feature defined by the turntable 402, so that the protrusions can be received and / or retained by the locking feature of the turntable 402. In some examples, the lock ring 406 and / or the protrusions may be attached to the turntable 402 by any technology (such as an adhesive) as needed. However, in some examples, locking ring 406 and / or protrusions may only be mechanically received and retained by dial 402 , for example to prevent movement of dial 402 relative to shaft 410 .

[0059] In some examples, the turntable 402 may define a recess, cavity, groove or channel that can receive and / or hold the cap 404 (e.g., its engagement portion 405). In some examples, the cap 404 may have an annular or ring shape, but in some other examples, the cap may have a substantially circular shape, as shown. In some examples, the engagement portion 405 may extend substantially vertically from the plane of the circle or ring, as shown. The cap 404 may include any desired material, such as a polymer, metal or ceramic material. In some examples, the cap 404 may include a polymer material and may have any desired color, such as a bright or visually unique color. Therefore, in some examples, the cap 404 may provide a desired decorative or aesthetic appearance to the turntable 402 without the need for a turntable 402 architecture of multiple parts or sections, which may result in an undesirable increase in the size of the turntable or an undesirable increase in the distance that the turntable protrudes from the housing and / or the crown module. The cap 404 can be held in a desired position on the turntable 402 by any desired technique. In some examples, a layer of adhesive or glue 403 can be disposed in a groove defined by the turntable 402 to hold the cap 404. In some other examples, a mechanical interlock between an engagement portion of the cap and a corresponding engagement feature defined by the turntable 402 can additionally or alternatively hold the cap 404 in a desired position on the turntable 402.

[0060] Figure 4C A close-up view of the engagement portion 405 of the cap 404 is shown mating with the engagement feature 407 defined by the turntable 402. As described above, the engagement feature 407 can take the form of a groove or channel. In some examples, and as Figure 4C As shown, the channel may have an undercut geometry or may include an undercut area that can receive and hold a corresponding feature of the engagement portion 405. Thus, in some examples, the engagement portion 405 can interlock with the undercut feature in the channel defined by the turntable 402. In some examples, such as where the cap 404 includes a polymer or plastic material, the cap 404 can flex and / or bend during insertion of the engagement portion 405 into the channel to allow a portion or all of the engagement portion 405 to snap into and / or interlock with the undercut area of ​​the channel 407. In some examples, the undercut area can have a width of about 10 microns to about 100 microns, or about 25 microns to about 75 microns, such as about 50 microns.

[0061] In some examples, an adhesive or glue material 403 may be disposed in the channel 407 and may additionally or alternatively be used to attach the cap 404 to the turntable 402. In some examples, in addition to attaching the cap 404 to the turntable 402, the adhesive 403 may also fill any empty volume in the channel 407 and ensure that the cap 404 is disposed at a desired depth in the channel 407 and, thereby, relative to the outer surface of the turntable 402. In some examples, the outer surface of the cap 404 is substantially flush, level, parallel, and / or coplanar with the outer surface of the turntable 402.

[0062] Figure 4D For example, relative to Figure 4A Exploded cross-sectional view of the collar 420 and bushing 422 as described. In use, the bushing 422 may substantially surround a portion of the collar 420, such as a portion protruding from the collar 420 above the edge 421. In some examples, the bushing 422 may be press-fitted over the collar 420 at a desired location. The collar 420 may define one or more ridges or retention features, as shown, which may retain the bushing 422 in a desired location on the collar. In some examples, the bushing 422 may be retained on the collar 420 at least in part due to an interference fit between the components. In some examples, the inner dimension of the bushing 422 may have an interference fit with the outer dimension of the collar between about 10 microns and about 100 microns, between about 25 microns and about 75 microns, or between about 30 microns and about 60 microns. In some examples, the architecture may allow the height of the bushing 422 and collar 420 components to be significantly reduced, thereby reducing the protrusion distance of the turntable 402.

[0063] In some examples, collar 420 may include a metal or metal alloy, such as steel or aluminum. In some examples, bushing 422 may include a polymer and / or ceramic material, such as a plastic or resin. In some examples, bushing 422 may include an acetal resin, such as a DELRIN brand resin. In some examples, the inner surface of bushing 422 may have a chamfer to allow a press fit process. In some examples, the height of the bushing may be about 1 mm or less, about 0.75 mm or less, or even about 0.6 mm or less. In some examples, the outer surface of bushing 422 may define a groove or channel 423. Groove 423 may be positioned at or near the lower edge of bushing 422, as shown. In some examples, components of the crown module adjacent to bushing 422 (such as shaft 410) may cause wear to the bushing material over time. If groove 423 is not present, this wear may result in the formation of a channel that may then have a lip. Since the shaft will move back and forth over the lip, the lip can create an undesirable feel when pressing the dial 402 into the device. By removing material from the bushing 422 in advance at the location of the groove 423, material that might define the lip is no longer present, thereby eliminating this problem if bushing wear does occur. In some examples, the height of the groove 423 can be between about 0.01 mm and 0.1 mm, such as about 0.05 mm.

[0064] Any number or type of components in any configuration described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components and the concepts related to their use may be applied not only to the specific examples discussed herein, but also to any number of embodiments in any combination. FIG. 5A to FIG. 5C Various examples of electronic devices and electronic device components are described, including components having various features in various arrangements.

[0065] Figure 5A An exploded view of several components of an electronic device 500 is shown, which may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. Figure 2As described in the electronic device 200, the electronic device may include a housing 502 that may at least partially define an internal volume and a display assembly 510 that may be held by the housing. The display assembly 510 may be received by the housing 502 and may be attached to the housing, for example, at a feature defined by the housing 502, such as a protrusion, lip, or flange 503. The display assembly may include a cover 514 that includes a transparent material, such as plastic, glass, and / or ceramic. The display assembly 510 may also include a display stack 512 that may include multiple layers and components, each of which may perform one or more desired functions. In some examples, a gasket or seal 516 may be disposed between the display assembly 510 and the housing 502, for example at the flange 503, to substantially define a barrier that prevents liquid or moisture from entering the internal volume from the external environment at the location of the seal 516.

[0066] Figure 5B A cross-sectional view of housing 502 is shown, wherein transparent cover 514 and seal 516 are attached to the housing in an assembled configuration. It can be seen that seal 516 can contact transparent cover 514 and housing 502, and these two components can be fixed or fastened together. In some examples, seal 516 may include multiple layers of material. As described herein, seal 516 may include polymer, metal and / or ceramic material. In some examples, seal 516 may substantially surround the periphery of the hole defined by housing 502, and may have a shape corresponding to the periphery shape of one or more parts of display assembly 510.

[0067] Figure 5C For example, Figure 5A and Figure 5B 5. The seal 516 of FIG. 5 is a cross-sectional view of the seal 516 shown. In some examples, the seal 516 may include a multilayer material bonded or joined together in a stacked configuration. In some examples, the seal 516 may include a silicone layer 520, such as a silicone rubber layer. The silicone layer 520 may be an intermediate layer or core of the seal 516, and may have a thickness between about 50 microns and about 300 microns, or between about 100 microns and about 200 microns, such as about 150 microns. In some examples, the silicone layer 520 may be substantially transparent. The silicone layer 520 may have a hardness greater than about 5, greater than about 10, or greater than about 15 or greater on the Shore A hardness scale.

[0068] In some examples, polymer layers 523 and 525 may be disposed on the top and bottom surfaces of silicone layer 520. These polymer layers 523, 525 may be the same or different materials, and in some examples, may include polyimide. In some examples, polymer layers 523, 525 may be transparent or translucent. In some examples, polymer layers 523, 525 may be colored translucent materials, such as translucent amber materials. In some examples, polymer layers 523, 525 may have the same or different thicknesses. Polymer layers 523, 525 may have a thickness between about 25 microns and about 150 microns, or between about 50 microns and about 100 microns, for example, about 75 microns.

[0069] To secure the cover 514 to the housing 502, as shown Figure 5B As shown, in some examples, the top outer surface and the bottom outer surface of the seal can be limited by adhesive layers 522, 524. These adhesive layers can be the same or different materials, and can have the same or different thickness. In some examples, adhesive layers 522, 524 may include pressure sensitive adhesive materials. Adhesive layers 522, 524 can have a thickness between about 10 microns and about 100 microns, or between about 25 microns and about 75 microns, for example, about 50 microns. Adhesive layers 522, 524 can have a hardness greater than about 5, greater than about 10, greater than about 12, or greater than about 15 or greater on the Shore A hardness scale.

[0070] Thus, in some examples, the entire seal 516 may have a thickness between about 200 microns and about 600 microns, or between about 300 microns and about 600 microns, such as about 400 microns. In addition, the seal may have a width between about 500 microns and about 1500 microns, or between about 750 microns and about 550 microns, such as about 900 microns.

[0071] See again Figure 5B , the width of the seal 516 and / or the width of the adhesive bond of the adhesive layers 522, 524 may be important for increasing the chemical resistance of the seal 516 and preventing corrosion of the seal 516 and / or liquids or contaminants from passing through it into the internal volume. As shown, the housing 502 and the cover 514 may define a gap 505 located therebetween. In some examples, the gap may provide a certain amount of sway or movement of the cover 514 relative to the housing 502, such as during a high-force event or a drop event. This sway and / or squeezing of the seal 516 may reduce the risk of force being directly transmitted to the cover 514 through the housing 502, thereby reducing the risk of damaging the cover 514.

[0072] However, in some examples, liquids, particles, contaminants, and / or corrosive materials may inadvertently enter gap 505 and may come into contact with seal 516. Therefore, it may be desirable for seal 516 to be corrosion resistant and for the bond length between seal 516 and housing 502 and cover 514 to be relatively large.

[0073] Figure 5D and Figure 5E A cross-sectional view of an alternative seal design 616 and 716 is shown. In some examples, the seal 616 may include a relatively rigid core material 622 surrounded by a relatively soft or pliable material 620. In some examples, the core 622 may include one or more metals and / or polymers, such as stainless steel. The core 622 may then be overmolded with a polymer material 620, such as a silicone material in any desired shape. In some examples, one or more adhesive layers 625 may be disposed on one or more surfaces of the silicone layer 620 to adhere the seal 616 to a component such as a housing or a cover.

[0074] The seal 616 may also include a core 622, which may include one or more metals and / or polymers such as stainless steel, and may be overmolded with a polymer material 620 (e.g., silicone). As shown, the seal 616 may have a generally X-shaped cross-section, for example, defining one or more depressions or dimples that may extend partially or completely along one or more surfaces of the seal 616. In some examples, the shape of the seal 616 may allow for a desired level of compression or deformation of the seal 616 to effectively dissipate energy and provide a desired level of sealing between components.

[0075] Any number or type of components in any configuration described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components, and the concepts regarding their function and use, may apply not only to the specific examples discussed herein, but also to any number of embodiments in any combination. FIG. 6A to FIG. 7B Various examples of electronic devices and electronic device sensor components are described, including components having various features in various arrangements.

[0076] Fig. 6AA bottom perspective view of an electronic device 800 is shown, which may be substantially similar to the electronic devices described herein, and may include some or all of the features of the electronic devices described herein. The device 800 may include a back cover 830, which may be attached to the housing 802, for example, relative to the display assembly 810. The back cover 830 may include ceramic, plastic, metal, or a combination thereof. In some examples, the back cover 830 may include a component 832 that is at least partially electromagnetically transparent. The electromagnetically transparent component 832 may be transparent to any desired wavelength of electromagnetic radiation (such as visible light, infrared light, radio waves, or a combination thereof). In some examples, the electromagnetically transparent component 832 may allow a sensor and / or transmitter disposed in the housing 802 to communicate with the external environment. In some examples, the electromagnetically transparent component 832 and / or the back cover 830 may allow one or more antennas disposed in the internal volume, such as antenna 840, to transmit and / or receive electromagnetic radiation, as further described herein. The housing 802, the display assembly 810, and the back cover 830 together may substantially define the internal volume and external surface of the device 800.

[0077] Figure 6B An exploded view of the components of electronic device 800 is shown. Electronic device 800 may include additional components as described herein, which have been removed from the illustrations for simplicity. Figure 6B . In some examples, the back cover 830 may carry a plurality of components thereon, such as a first antenna element 836, a logic board 850, a sensing package and / or a sensor module 852, and a light guide component 854, a second antenna element 840, and a connecting component 853 for electrically connecting the second antenna element 840 to one or more components of the device 800, such as the logic board 850. In some examples, one or more of these components, such as the sensor module 852 and the second antenna 840, may be disposed above the electromagnetically transparent portion 832 of the back cover 830. In some examples, a seal 834 may be disposed between the back cover 830 and the housing 802 to provide or define a barrier between the internal volume and the surrounding environment, as described herein. With respect to Figure 6C Further details of the second antenna 840 (also referred to as the sensing antenna 840) are described.

[0078] Figure 6C shows that relative to Fig. 6A and Figure 6BAn exploded view of several components of the electronic device 800 of the electronic device described. In some examples, the device may include a back cover (omitted for simplicity) that includes an electromagnetically transparent portion 932, as described herein. The device may also include a logic board 950 that may include a substrate such as a printed circuit board substrate and may have one or more electronic components and / or operating components thereon, such as one or more processors, memories, sensors, and / or integrated circuits. As described with respect to the device 800, the electronic device may also include a sensor module 952, a sensing antenna 940, and a light guide component 954 disposed in an internal volume, for example, covering the electromagnetically transparent portion 932. In some examples, the sensor module 952 may include one or more light-emitting components and / or sensing components, as further described herein. The light guide component 954 may guide light emitted by the sensor module 952 and / or to be received by the sensor module.

[0079] In some examples, the sensing antenna 940 can be used to determine whether there is a material at or near an outer surface of an electronic device including the sensing antenna (e.g., at or near an outer surface at least partially defined by the electromagnetically transparent portion 932). In use, the sensing antenna 940 can be electrically connected to one or more other components of the device and can be driven to emit and / or reflect electromagnetic radiation at one or more desired frequencies. In some examples, the sensing antenna 940 can radiate energy at a frequency of about 2.4 GHz, but substantially any frequency can also be used. The device can also include, for example, an integrated circuit disposed on the logic board 950, on another logic board of the device (such as a main logic board), or at any desired location.

[0080] In use, the sensing antenna 940 is driven at a desired frequency, and an associated sensing integrated circuit in the device can measure the performance, efficiency, and / or resonance of the sensing antenna 940. In some examples, the sensing integrated circuit can measure the difference between the power used to drive the antenna and the transmitted power at the location of the sensing integrated circuit. In some examples, the sensing integrated circuit can measure the reflected power level or reflectivity level from the driven antenna based on the signal and / or power used to drive the antenna. In some examples, the sensing integrated circuit may be located near the back cover of the device, for example, on the logic board 950. Thus, the sensing integrated circuit can measure the antenna efficiency and / or performance in a direction extending from the back cover and / or the electromagnetically transparent component 932. In some examples, the device may include any number of desired sensing integrated circuits, which are positioned at any number of locations within the internal volume of the device.

[0081] When a material or object is brought into proximity with the device (e.g., near the electromagnetically transparent component 932), the dielectric properties or dielectric constant of the material or object may affect the performance, efficiency, and / or resonance of the sensing antenna 940 because at least a portion of the material or object may be in the transmission path between the sensing antenna 940 and the sensing integrated circuit, and / or because the change in the dielectric properties of the area now including the material or object may cause the resonance or resonant frequency of the antenna to shift. The presence of a material or object having a dielectric constant different from air in the transmission path may result in tuning and / or detuning of the performance of the sensing antenna 940, which is then measured by the sensing integrated circuit, for example, by measuring changes in the efficiency and / or level or reflectivity of the transmission from the antenna. The degree to which the performance, efficiency, tuning, and / or resonance of the sensing antenna 940 is altered may be measured and may be used to at least partially determine the presence and / or proximity of an object or material near the device. In some examples, the degree to which the performance, efficiency, tuning, and / or resonance of the sensing antenna 940 is altered may be used to at least partially determine the composition of the material and / or object.

[0082] In some examples, this proximity detection functionality can be used to help the device determine whether it is being actively worn by a user or whether the device has been removed from the user's wrist. That is, the sensing antenna 940 and the sensing integrated circuit can detect the presence and / or proximity of a body part at or near the device. In some examples, the sensing antenna 940 and the sensing integrated circuit can distinguish the presence of a body part at or near the device from the presence of other objects or materials (such as a table). In this way, a user can initially authenticate themselves when a device (such as a smart watch) is worn, and the device may not require further authentication until the device determines that it has been removed from the user's wrist.

[0083] In some examples, the sensing antenna 940 may include a conductive material substantially surrounded and / or encapsulated by an insulating material. In some examples, the conductive material may include a metal or a metal alloy, such as copper. In some examples, the insulating material may include a polymer material. In some examples, the insulating material may include an adhesive material, such as a pressure-sensitive adhesive material. The pressure-sensitive adhesive material may help fix the sensing antenna 940 in a desired position and may also help fix other components in the device. In some examples, the sensing antenna 940 may have a substantially annular or annular shape, as shown. In some examples, the sensing antenna 940 may be a monopole antenna, a dipole antenna, or any desired antenna topology. In addition, in some examples, a spring finger or a connecting component may be electrically connected to the conductive material of the sensing antenna 940 and one or more other components of the device, such as a component that can provide power to the sensing antenna 940 and can drive the sensing antenna. In some examples, the sensing antenna 940 may include a first pressure-sensitive adhesive layer, a copper layer, and a second pressure-sensitive adhesive layer covering the copper and the first pressure-sensitive adhesive layer.

[0084] In some examples, the sensing antenna 940 may include any conductive material of any shape or configuration as required. In some examples, the sensing antenna 940 may be a preformed component including a conductive material disposed in the internal volume of the electronic device. However, in some examples, the sensing antenna 940 may be deposited, plated, or otherwise formed on another component of the electronic device. For example, the conductive material may be deposited on the electromagnetically transparent portion 932 in a desired shape or configuration to form the sensing antenna 940. In some examples, the sensing antenna 940 may be formed by vapor deposition and / or plating processes (such as physical vapor deposition and / or electroplating processes). In addition, in some examples, an existing antenna of an electronic device may be used or may be used as the sensing antenna 940. That is, the electronic device may include one or more antennas, such as a cellular antenna, an NFC antenna, an LTE antenna, a Wi-Fi antenna, a Bluetooth antenna, and / or a GPS antenna, and one or more of these antennas may be additionally or alternatively driven or used as a sensing antenna. In some examples, any antenna positioned adjacent to or near the back cover and / or the electromagnetically transparent portion 930 of the device may be used as a sensing antenna.

[0085] Fig.6D shows that relative to Fig. 6A and Figure 6B An exploded view of several components of the electronic device 800. Figure 6C As in the example shown, the electronic device may include, for example, a logic board 1050, a sensor module 1052, and a sensing antenna 1040 overlying the electromagnetically transparent portion 1032. The sensing antenna 1040 may be substantially similar to the sensing antenna described herein, and may include some or all of the features of the sensing antenna described herein, and may function similarly to the sensing antenna described herein. In some examples, the sensing antenna 1040 may include a polymer or plastic material, such as a thermoplastic material. In some examples, the sensing antenna 1040 may also include, for example, a conductive material integrated into the polymer material in a desired design or configuration. In some examples, the sensing antenna 1040 may be formed by a laser direct structuring (LDS) process. That is, a polymer material containing a non-conductive metal inorganic compound may be exposed to a laser in a desired pattern to write antenna traces onto or into a polymer material that has previously been molded into a desired shape. Therefore, in some examples, the sensing antenna 1040 may be shaped to fit near and / or around one or more other components of the device (such as the sensor module 1052 and / or the logic board 1050). The entire package including the logic board 1050 , the sensor module 1052 , and the sensing antenna 1040 may then be adhered in place, for example to the electromagnetically transparent portion 1032 .

[0086] Fig. 6Eshows that relative to Fig. 6A and Figure 6B An exploded view of several components of the electronic device 800. Figure 6C and Fig.6D As in the example shown, the electronic device may include, for example, a logic board 1150 overlying the electromagnetically transparent portion 1132, a sensor module 1152, and a sensing antenna 1140. In this example, the sensing antenna 1140 has been integrated into an existing component of the electronic device that can provide one or more additional functions. For example, the sensing antenna 1140 may include a flexible electrical connector that can be electrically connected to one or more components of the device. In some examples, the sensing antenna 1140 may include an electromagnetic shielding component or an electronic shield. In some examples, additional traces may be added to the component to form an antenna. For example, additional traces may be added at or near a portion of the component that defines a central aperture or hole. With respect to Fig. 7A and Figure 7B to describe additional details regarding processes for detecting the presence and / or type of material at or near an electronic device.

[0087] Fig. 7A A process flow diagram of a method 1200 for detecting the presence of a material near an electronic device is shown. In some examples, the method 1200 may be performed by an electronic device including a sensing antenna and one or more sensing integrated circuits, such as with respect to FIG. 6A to FIG. 6D described.

[0088] At block 1210, an antenna of an electronic device, such as a sensing antenna 940, 1040, 1140, may be driven at one or more desired frequencies and using a desired power. The antenna may be driven by one or more operating components of the device in communication with the antenna component.

[0089] At block 1220, the efficiency, performance level, tuning or detuning level of the antenna, and / or resonance or resonant frequency of the antenna may be measured at one or more locations on or in the electronic device, such as relative to FIG. 6A to FIG. 6D As described. In some examples, the efficiency of the antenna can be measured at a location such that the transmission path of the signal transmitted by the antenna can pass through or approach a desired portion of the outer surface of the electronic device. In some examples, the portion of the outer surface may be defined by a portion of the back cover and / or transparent cover of the device. In some examples, the efficiency of the antenna can be measured by detecting the transmitted power from the antenna and comparing the transmitted power with the power used to drive the antenna. In some examples, the resonance or resonant frequency of the antenna can be measured by detecting the reflected power from the antenna and comparing the reflected power with the power used to drive the antenna. As used herein, the term "transmitted power" can be broadly applied to refer to the power of a signal transmitted or radiated from an antenna, as well as to refer to reflected power or signal.

[0090] At block 1230, a determination may be made as to whether a material is present at or near an exterior surface of the electronic device based at least in part on the measured efficiency and / or resonance. FIG. 6A to FIG. 6D As described above, the presence of a material with a dielectric constant other than air may affect the transmitted power, efficiency, and / or resonance of the antenna. Therefore, the measured efficiency or resonance can be used to determine the dielectric constant of the space adjacent to or close to the outer surface of the device, and thereby determine the presence of the material or object. In some examples, box 1230 may also include determining the type of material or object present at or near the electronic device. For example, box 1230 may also include determining whether the object is conductive or insulating, and the level of conductivity. In some examples, box 1230 may include determining whether the object is a user, a metal, a ceramic, a plastic material, an organic substance, a liquid, or another type of material.

[0091] Figure 7B A process flow diagram of a method 1300 for detecting the presence of a material near an electronic device is shown. In some examples, the method 1300 may be performed by an electronic device including a sensing antenna and two or more sensing integrated circuits, such as with respect to FIG. 6A to FIG. 6D described.

[0092] At block 1310, an antenna of an electronic device, such as a sensing antenna 940, 1040, 1140, may be driven at one or more desired frequencies and using a desired power. The antenna may be driven by one or more operating components of the device in communication with the antenna component.

[0093] At block 1320, the efficiency, performance level, tuning or detuning level of the antenna, and / or resonance or resonant frequency of the antenna may be measured at a first location on or in the electronic device, such as relative to FIG. 6A to FIG. 6D As described. In some examples, the efficiency of the antenna can be measured at a location such that the transmission path of the signal transmitted by the antenna can pass through or approach a desired portion of the outer surface of the electronic device. In some examples, the portion of the outer surface may be defined by a portion of the back cover and / or transparent cover of the device. In some examples, the efficiency of the antenna can be measured by detecting the transmitted power from the antenna and comparing the transmitted power with the power used to drive the antenna. In some examples, the resonance or resonant frequency of the antenna can be measured by detecting the reflected power from the antenna and comparing the reflected power with the power used to drive the antenna. As used herein, the term "transmitted power" can be broadly applied to refer to the power of a signal transmitted or radiated from an antenna, as well as to refer to reflected power or signal.

[0094] At block 1330, the efficiency, performance level, tuning or detuning level of the antenna, and / or resonance or resonant frequency of the antenna may be measured at a second different location on or in the electronic device, such as relative to FIG. 6A to FIG. 6DIn some examples, the efficiency of the antenna can be measured at a position such that the transmission path of the signal transmitted by the antenna can pass through or be close to a desired portion of the outer surface of the electronic device. In some examples, the portion of the outer surface may be defined by other portions of the back cover and / or transparent cover of the device compared to the first position. In some examples, the efficiency of the antenna can be measured by detecting the transmission power from the antenna and comparing the transmission power to the power used to drive the antenna. In some examples, the first position may require a transmission path from the antenna through the back cover, while the second position may require a transmission path through the front cover.

[0095] At block 1340, the presence of a material at or near an exterior surface of the electronic device may be determined based at least in part on the efficiency measured at the first location and / or the efficiency measured at the second location. FIG. 6A to FIG. 6D As described above, the presence of materials with a dielectric constant other than air may affect the transmit power and / or efficiency of the antenna. Therefore, the efficiency measured at one or both of the first and second positions can be used to determine the dielectric constant of the space adjacent to or close to the outer surface of the device, and thereby determine the presence of a material or object. In some examples, box 1340 may also include determining the type of material or object present at or near the electronic device. For example, box 1340 may also include determining whether the object is conductive or insulating, and the level of conductivity. In some examples, box 1340 may include determining whether the object is a user, a metal, a ceramic, a plastic material, an organic substance, a liquid, or another type of material.

[0096] In some examples, one or more algorithms stored in the memory of the device may determine whether an object exists based on the measured efficiency at the first location, at the second location, and / or by using a weighted combination of the first location and the second location. In some examples of using a weighted combination of the efficiencies measured at the first location and the second location, the algorithm may determine a weight to assign to the efficiencies measured at the first location and / or the second location. In some examples, the weight may be between 0% and 100%. In some examples, determining whether to use the efficiency measured at the first location, the second location, or a combination of the efficiencies measured at the first location and the second location may be based on factors other than the measured efficiency. These factors are not limited and may include date or time, geographic location, input or signal from one or more other sensors, user input, etc. Additional sensing components and processes may be similarly included.

[0097] Fig. 8AA cross-sectional view of a portion of an electronic device described herein is shown. The portion includes an electromagnetically transparent component 1432, which may be part of a back cover (omitted for simplicity) of a device as described herein. The device may also include a logic board 1450 mounted on the electromagnetically transparent component 1432. The device may include one or more sensors and / or transmitters as part of a sensor module as described herein, as part of the logic board 1450, and / or as a separate component. In some examples, the device may include a lens or light-guiding component 1434 that may be mounted adjacent to the electromagnetically transparent component 1432. In some examples, the lens 1434 may be a Fresnel lens 1434. In some examples, a light-blocking component 1470 may be positioned between the lens 1434 and the component 1432, as further described herein.

[0098] The device may include light emitting components 1466, 1468. In some examples, the light emitting components 1466, 1468 may include light emitting diodes (LEDs) that may emit light of one or more desired wavelengths. The device may also include light detecting components 1462, 1464 that may be designed and arranged to receive light that has been emitted by the LEDs 1466, 1468, has left the device through the lens 1434 and the electromagnetic transparent component 1432, and has returned to the device through the lens 1434 and the electromagnetic transparent component 1432. In some examples, light blocking components such as component 1436 may substantially optically isolate the LEDs 1466, 1468 from the detectors 1462, 1464 except along the desired light path. In some examples, the device may include a light directing component or light control component 1463 disposed opposite one or both of the light detectors 1462, 1464. In some examples, light control component 1463 may be used to allow only light incident on light control component 1463 at a particular angle or range of angles to pass through, thereby acting as a filter.

[0099] Figure 8B Shown includes relative to Fig. 8A The device of the component positioned adjacent to the medium 1500 (such as a limb of the user 1500). As used herein, the term medium may refer to any material, substance, and / or object in any state or combination of states of matter. For example, air, water, and / or the human body may all be considered as a medium as used herein.

[0100] The optical paths from LEDs 1466, 1468 to detectors 1462, 1464 are shown. In some examples, light emitted from LEDs 1466, 1468 and transmitted into the user's body and then reflected back to detectors 1462, 1464 can be used to determine one or more physiological characteristics and / or biological characteristics of the user. However, in some examples, the determination of physiological characteristics and / or biological characteristics can be based on receiving light that has passed through a desired tissue depth. For example, light emitted from LED 1468 and received by detector 1464 can penetrate a certain depth, while light emitted from LED 1466 and received by detector 1464 can reach a different depth. However, difficulties may arise when these two optical paths overlap within the user's tissue, potentially introducing noise and making it more difficult to distinguish whether the light is emitted from detector 1466 or from detector 1468. Therefore, it may be desirable to reduce the amount of overlap of the optical paths within the user's tissue.

[0101] exist Figure 8B In the example shown, electromagnetically transparent component 1432 may include a ceramic material with a relatively high refractive index, such as sapphire. As shown, light emitted by LED 1468 may travel along optical path 1481, enter the user's body along optical path 1482, and return to detector 1464 along optical path 1483. As shown, light emitted from LED 1466 may travel along optical path 1484, enter the user's body along optical path 1485, and leave to reach detector 1464. The relatively high refractive index of ceramic or sapphire component 1432 may mean that the overlapping area 1486 of the optical path within the user's tissue is relatively small, for example, less than about 5%, 4%, 3.5% or even less than about 3% of the volume of the irradiated tissue. This amount of overlap may be taken into account by an algorithm or other noise reduction technique, and a result with a desired level of accuracy may be produced.

[0102] Figure 8C Shown with Figure 8C 14 is a cross-sectional view of the same components shown, however, component 1432 now includes a material having a relatively lower refractive index, such as glass. As can be seen, the lower refractive index can result in a significant increase in the overlap area or overlap volume 1486. ​​For example, the overlap volume can be greater than 15% of the volume of the irradiated tissue, greater than 20% of the volume of the irradiated tissue, or even greater than 25% of the volume of the irradiated tissue. Therefore, while component 1432 including glass can provide benefits to the device, such as reduced material costs, reduced manufacturing costs, increased durability, ease of component replacement, and other benefits, the use of glass can have an undesirable effect on determining one or more biological and / or physiological characteristics of the user.

[0103] Therefore, if Fig.8DAs shown, light blocking component 1470 can be positioned on the inner surface of component 1432 to block a portion or substantially all of the light emitted from LED 1466 that would otherwise reach detector 1464 and / or overlap with the light emitted from LED 1468. Thus, even with component 1432 comprising glass or some other relatively low refractive index material, the overlap volume can be less than about 5%, 4%, 3.5%, or even less than about 3% of the volume of the irradiated tissue. In some examples, light blocking component 1470 can be positioned directly on component 1432, such as between component 1432 and Fresnel lens 1434. In some examples, light blocking component 1470 can be positioned substantially in the center of component 1432.

[0104] In some examples, light blocking member 1470 can take the form of a dot or circular portion of ink or other material that is opaque to light of one or more desired wavelengths or wavelength ranges. In some examples, light blocking member 1470 may be opaque for visible light (i.e., light with a wavelength between about 380nm and about 740nm). In some examples, light blocking member 1470 may be opaque to light of wavelengths emitted by LED 1466, 1468. In some examples, LED 1466, 1468 may emit green light, so light blocking member 1470 may be opaque to light of wavelength ranges including green light. That is, in some examples, light blocking member 1470 may be opaque to light including light with a wavelength between about 520nm and about 560nm. In some examples, light blocking member 1470 may be transparent to one or more other wavelengths of light in some examples so as not to affect the function of other sensors, emitters, and / or detectors of the device, such as those sensors, emitters, and / or detectors that can utilize infrared wavelengths or wavelengths between about 740nm and about 1mm. In some examples, the ink or material of light blocking member 1470 may have a thickness of about 15 microns or less, about 10 microns or less, about 7 microns or less, about 5 microns or less, or even about 2 microns or less. In some examples, light blocking member 1470 may have a diameter or major dimension of about 10mm or less, about 5mm or less, about 4mm or less, or even about 2mm or less.

[0105] In some examples, light blocking feature 1470 can be deposited on feature 1432 by any combination of printing and / or deposition processes, such as pad printing and / or one or more physical vapor deposition processes. In some examples, the surface of feature 1432 can be treated prior to forming light blocking feature 1470. For example, a silicon dioxide layer can be deposited on the surface prior to forming light blocking feature 1470.

[0106] Any features or aspects of the devices and components discussed herein may be combined or included in any combination of variations. For example, the design and shape of the components or devices are not limited in any way and may be formed by any number of processes, including those discussed herein. As used herein, the terms exterior, outside, interior, and inside are used for reference purposes only. An exterior portion or exterior portion of a component may form a portion of the exterior surface of the component, but may not necessarily form the entire exterior of the exterior surface of the component. Similarly, an interior portion or interior portion of a component may form or define an interior portion or interior portion of a component, but may also form or define a portion of the exterior surface or exterior surface of a component.

[0107] Various inventions are described herein with reference to certain specific embodiments and examples. However, those skilled in the art will recognize that many variations may be made without departing from the scope and spirit of the invention disclosed herein, as those inventions set forth in the following claims are intended to cover all variations and modifications disclosed herein without departing from the spirit of the invention. The terms "including" and "having" as used in the specification and claims shall have the same meaning as the term "comprising".

[0108] To the extent applicable to the present technology, the collection and use of data obtained from various sources can be used to improve the delivery of inspirational content or any other content that may be of interest to users. The present disclosure contemplates that in some instances, such collected data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, ID, home address, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0109] The present disclosure recognizes that the use of such personal information data in the present invention technology can be used to benefit users. For example, the personal information data can be used to deliver targeted content that users are more interested in. Therefore, the use of such personal information data enables users to have planned control over the content delivered. In addition, the present disclosure also anticipates other uses of personal information data that benefit users. For example, health and fitness data can be used to provide insights into the user's overall health status, or can be used as positive feedback for individuals who use technology to pursue health goals.

[0110] This disclosure envisions that entities responsible for collecting, analyzing, disclosing, transmitting, storing or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as the collection and / or use of data changes. Personal information from users should be collected for legitimate and reasonable purposes of the entity and not shared or sold outside of these legitimate uses. In addition, such collection / sharing should be performed after receiving informed consent from the user. In addition, such entities should consider taking any necessary steps to defend and secure access to such personal information data and ensure that others who have access to personal information data comply with their privacy policies and processes. In addition, such entities may subject themselves to third-party assessments to demonstrate their compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to specific types of personal information data collected and / or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA), while health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained in each country for different types of personal data.

[0111] Regardless of the foregoing, the present disclosure also contemplates implementation schemes in which users selectively block the use or access of personal information data. That is, the present disclosure contemplates that hardware elements and / or software elements may be provided to prevent or block access to such personal information data. For example, with respect to an advertising delivery service, the technology of the present invention may be configured to allow a user to choose to "opt in" or "opt out" at any time during or after registration for the service to participate in the collection of personal information data. In another example, a user may choose not to provide emotion-related data for a target content delivery service. In another example, a user may choose to limit the length of time that emotion-related data is retained, or completely prohibit the development of basic emotional conditions. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to access or use of personal information. For example, a user may be notified that their personal information data will be accessed when downloading an application, and then the user may be reminded again just before the personal information data is accessed by the application.

[0112] In addition, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risks can be minimized by limiting data collection and deleting data once it is no longer needed. In addition, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. De-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than at the address level), controlling how data is stored (e.g., aggregating data on users), and / or other methods when appropriate.

[0113] Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the present disclosure also contemplates that various embodiments may also be implemented without access to such personal information data. That is, various embodiments of the present technology will not fail to function properly due to the lack of all or a portion of such personal information data. For example, content may be selected and delivered to a user by inferring preferences based on non-personal information data or an absolute minimum amount of personal information, such as content requested by a device associated with the user, other non-personal information available to a content delivery service, or publicly available information.

[0114] For the purpose of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that the embodiments can be practiced without specific details. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. They are not intended to be exhaustive or to limit the embodiments to the precise form disclosed. It will be apparent to those of ordinary skill in the art that, in view of the above teachings, many modifications and variations are feasible.

Claims

1. An electronic device, comprising: a housing at least partially defining an interior volume, the housing including an optically transparent member at least partially defining an exterior surface of the electronic device; a first light emitter positioned within the interior volume; a second light emitter positioned within the interior volume; a light detector positioned in the interior volume, the light detector being optically isolated from the first light emitter and the second light emitter within the interior volume; and an opaque material disposed on the optically transparent component, the opaque material being positioned between the first light emitter and the second light emitter, the opaque material being closer to the outer surface than the first light emitter and the second light emitter, the opaque material being positioned: inhibiting light emitted from the second light emitter from: following a path from the second light emitter through a medium adjacent to a portion of an outer surface defined by the optically transparent member to the light detector, and through the optically transparent member to the light detector; as well as Light emitted from the first light emitter is allowed to: follow a path from the first light emitter, pass through the medium to the light detector, and pass through the optically transparent component to the light detector. 2 . The electronic device of claim 1 , wherein the optically transparent component comprises glass. The electronic device of claim 1 , wherein the opaque material is opaque to green light. The electronic device of claim 1 , wherein the opaque material is transparent to infrared light. The electronic device according to claim 1 , wherein the opaque material has a size of 10 mm or less. 6 . The electronic device of claim 1 , wherein the opaque material has a thickness of 10 microns or less.

7. The electronic device of claim 1 further comprising a lens positioned over the opaque material.

8. The electronic device of claim 1, wherein the optically transparent component comprises sapphire.

9. The electronic device according to claim 8, wherein: The optically transparent member comprises a silicon dioxide layer; and The opaque material is disposed on the silicon dioxide layer.

10. An electronic device, comprising: a housing defining an interior volume, the housing including an optically transparent portion; a light emitter disposed in the interior volume; a first light detector disposed in the interior volume; a second light detector disposed in the interior volume; and a light blocking member disposed between the first light detector and the second light detector and on an inner surface of the optically transparent portion, wherein the size and position of the light blocking member are set to: preventing light emitted by the light emitter from exiting the electronic device through the optically transparent portion in a direction oriented more toward the second light detector than the first light detector; as well as Light emitted by the light emitter is allowed to exit the electronic device through the optically transparent portion in a direction oriented toward the first light detector more than the second light detector. The electronic device according to claim 10 , wherein the light blocking member has a substantially circular shape. 12 . The electronic device according to claim 11 , wherein the light blocking member has a diameter of 10 mm or less.

13. The electronic device according to claim 10, wherein the light blocking member comprises an ink layer.

14. The electronic device of claim 13, wherein the layer has a thickness of 10 microns or less.

15. The electronic device of claim 10, wherein the light emitter comprises an LED.

16. The electronic device according to claim 10, wherein: The light blocking member includes a first light blocking member; and The electronic device also includes a second light blocking component positioned in the interior volume between the light emitter and the first light detector.

17. A housing for an electronic device, comprising: a cover defining an aperture; an optically transparent member positioned in the aperture and secured to the cover, the optically transparent member at least partially defining an inner surface of the housing and an outer surface of the housing; a lens overlying a portion of the optically transparent member defining the inner surface; and An opaque material is disposed on the portion of the optically transparent component that defines the inner surface, the opaque material being positioned between the optically transparent component and the lens.

18. The housing of claim 17, wherein the opaque material is opaque to visible light and at least partially transparent to infrared light.

19. The housing of claim 17, wherein the lens comprises a Fresnel lens.

20. The housing of claim 17, wherein the optically transparent member comprises glass.

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