Substrate conveying device and substrate conveying method

Abstract

The present invention provides a substrate conveying device and a substrate conveying method, a positioning base, a positioning rod and a gripping device, wherein the base is located at the lower part of the device, one end of the positioning rod is connected to the positioning base, and the other end of the positioning rod is connected to the gripping device. The present invention provides a film taking device with a film taking function. After the thin film deposition is completed, the tool can be used to directly take and deliver the wafer tray, which is not affected by the temperature in the equipment cavity, and the mechanism is safe and labor-saving to use. During the operation, the tool operation can improve personal safety, overcome the hardship of the heavy and large tray, speed up the film taking speed, improve production capacity, and reduce the labor intensity of the operator. The device has a flexible operation mode, stable processing effect, improved work efficiency, reduced the labor intensity of workers, and has extremely high production economic value.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device wafer picking, and in particular to a substrate conveying device and a substrate conveying method. Background Art

[0002] For small-size wafer deposition, large semiconductor vacuum chamber process equipment is used, and a deposition method of depositing multiple wafers at a time is adopted, which has high production efficiency and significant economic results.

[0003] However, the use of large semiconductor vacuum chambers makes the operation of taking out the film complicated and labor-intensive. Therefore, how to develop a new type of semiconductor thin film deposition equipment to solve the above problems has become an issue that people are eager to solve. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a substrate conveying device and a substrate conveying method.

[0005] On the one hand, the technical solution provided by the present invention is: a substrate conveying device, comprising: a positioning base, a positioning rod and a grasping device;

[0006] The base is located at the lower part of the device, one end of the positioning rod is connected to the positioning base, and the other end of the positioning rod is connected to the grabbing device;

[0007] A turntable is provided at the lower part of the grabbing device, and a plurality of long grabbing arms are provided on the turntable. A downward grabbing hook is provided at the front end of the grabbing arm. A rotating shaft is provided at the center of the turntable, and a rotating limit block and a rotating limit seat are provided on the rotating shaft. A rotating limit pin is provided between the rotating limit seat and the rotating limit block. The rotating limit seat is located on the cross beam between the two positioning bases, and a lifting limit block is provided on the cross beam below the rotating limit seat.

[0008] During the rotation action, when taking the disk, the rotation limit block contacts the left side of the rotation limit seat to complete the limit, and when placing the disk, the rotation limit block contacts the right side of the rotation limit seat to complete the limit;

[0009] During the lifting action, when in the upper position, the rotating limit seat and the lifting positioning block contact to complete the limit, and when in the lower position, the rotating limit block and the rotating limit seat contact to complete the limit.

[0010] Preferably, a fixing hole is provided on the rotation limit seat, and during rotation, the rotation limit pin and the fixing hole on the rotation limit seat are used to fix and adjust the rotation angle.

[0011] Further preferably, the turntable is provided with three grabbing arms, and a downward grabbing hook is provided at the front end of each grabbing arm.

[0012] Further preferably, a protruding buckle is provided at the lower end of the grab hook, and when taking the tray, the buckle can facilitate grabbing the wafer tray.

[0013] Further preferably, a pulley is provided under the base.

[0014] Further preferably, a positioning pin is provided at the lower end of the positioning base, and when the wafer tray is taken or placed, the positioning pin is aligned with the positioning hole of the cavity to achieve a positioning effect.

[0015] On the other hand, the present invention further provides a substrate conveying method, which is performed using any one of the above substrate conveying devices, and comprises the following steps:

[0016] 1) Move the device to the top of the cavity, align the positioning pin of the positioning base with the positioning hole of the cavity, and slowly lower the device. When the bottom surface of the positioning base is completely in contact with the top of the cavity and the force is applied, stop lowering;

[0017] 2) Adjust the rotation direction of the grabbing device, and rotate the grabbing device to the disk-taking position;

[0018] 3) Continue to descend slowly until the rotation positioning block contacts the rotation positioning seat limit position and is positioned in the lower position;

[0019] 4) Adjust the rotation direction of the grabbing device and rotate the grabbing device to the disk placement position;

[0020] 5) The device is slowly raised, and the grabbing device hook lifts the wafer tray until the lifting limit block contacts the turntable and is positioned in the upper position. At this time, the wafer tray is separated from the upper surface of the heating plate;

[0021] 6) The lowering device continues to rise, and the grasping device drives the positioning base to rise and leave the upper surface of the cavity. After the positioning pin is completely out of the positioning hole, the wafer tray can be transported out of the cavity range to complete the tray removal action.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The present invention provides a wafer taking device with a wafer taking function. After the thin film deposition is completed, the tool can be used to directly take and deliver the wafer tray, which is not affected by the temperature in the equipment cavity. The mechanism is safe and labor-saving to use, and the wafer tray can be safely transferred under the high temperature state of the equipment. During the operation, the tool operation can improve personal safety, overcome the hardship of heavy and large trays, speed up the wafer taking speed and improve production capacity, and at the same time, the wafer can be conveniently taken out in a large cavity, thereby improving work efficiency and reducing the labor intensity of the operator. The device has a flexible operation mode, a stable processing effect, reduces the labor intensity of the workers, and has extremely high production economic value. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the present invention;

[0025] Figure 2It is a schematic diagram of the structure of the grabbing device in the present invention;

[0026] Figure 3 It is a schematic diagram of the structure of A in the grabbing device of the present invention;

[0027] Figure 4 It is a schematic diagram of the structure between the rotation limit seat and the positioning base in the present invention. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] like Figures 1 to 4 As shown, this embodiment provides a substrate conveying device, comprising: a positioning base 1, a positioning rod 2 and a grasping device 3;

[0030] The base 1 is located at the lower part of the device, one end of the positioning rod 2 is connected to the positioning base 1, and the other end of the positioning rod 2 is connected to the grabbing device 3;

[0031] A turntable 301 is provided at the lower part of the grabbing device 3, and a plurality of long strip grabbing arms 302 are provided on the turntable 301. The front ends of the grabbing arms 302 are provided with downward grabbing hooks 303. A rotating shaft 304 is provided at the center of the turntable 301. A rotating limit block 305 and a rotating limit seat 401 are provided on the rotating shaft 304. A rotating limit pin 306 is provided between the rotating limit seat 401 and the rotating limit block 305. The rotating limit seat 401 is located on a beam 403 between two positioning bases 402. A lifting limit block 404 is provided on the beam 403 below the rotating limit seat 401.

[0032] During the rotation action, there are two positions: a disk taking position and a disk placing position. When taking a disk, the rotation limit block 305 and the left side of the rotation limit seat 401 are in contact to complete the limit. When placing a disk, the rotation limit block 305 and the right side of the rotation limit seat 401 are in contact to complete the limit.

[0033] During the lifting action, there are two positions, upper and lower. When in the upper position, the rotation limit seat 401 and the lifting positioning block 404 contact to complete the limit. When in the lower position, the rotation limit block 305 and the rotation limit seat 401 contact to complete the limit.

[0034] In order to facilitate quick and convenient positioning of the cavity at the beginning of film removal, as an improvement of the technical solution, a fixing hole is provided on the rotation limit seat 401. When rotating, the rotation limit pin 306 and the fixing hole on the rotation limit seat 401 are used to fix and adjust the rotation angle.

[0035] As an improvement of the technical solution, three grab arms 302 are provided on the turntable 301 , and a downward grab hook 303 is provided at the front end of each grab arm 302 .

[0036] In order to facilitate more stable gripping of the cavity when taking out the wafer, as an improvement of the technical solution, a protruding buckle is provided at the lower end of the grab hook 303, and when taking out the tray, the buckle can facilitate gripping of the wafer tray.

[0037] In order to facilitate the preliminary positioning of the cavity when taking the film, as an improvement of the technical solution, a pulley is provided under the base 1 to perform preliminary positioning through a moving device.

[0038] As an improvement of the technical solution, a positioning pin 405 is provided at the lower end of the positioning base 402. When taking or placing the wafer tray, the positioning pin 405 is aligned with the positioning hole of the cavity to achieve the positioning effect.

[0039] This embodiment provides a substrate conveying method, which is performed using any one of the substrate conveying devices in the above embodiments, and comprises the following steps:

[0040] 1) Move the device to the top of the cavity, align the positioning pin 405 of the positioning base 402 with the positioning hole of the cavity, and slowly lower the device. When the bottom surface of the positioning base 402 is completely in contact with the top of the cavity and the force is applied, the device stops lowering;

[0041] 2) Adjust the rotation direction of the grabbing device, and rotate the grabbing device 3 to the disk-taking position;

[0042] 3) Continue to slowly descend until the rotation positioning block 305 contacts the rotation positioning seat 401 and is positioned in the lower position;

[0043] 4) Adjust the rotation direction of the grabbing device 3, and rotate the grabbing device 3 to the disk placement position;

[0044] 5) The device is slowly raised, and the grab hook 303 of the grabbing device 3 lifts the wafer tray until the lifting limit block 404 contacts the turntable 301 and is positioned in the upper position. At this time, the wafer tray is separated from the upper surface of the heating plate;

[0045] 6) The lowering device continues to rise, and the grabbing device 3 drives the positioning base 402 to rise and leave the upper surface of the cavity. After the positioning pin 405 is completely out of the positioning hole, the wafer tray can be transported out of the cavity range, and the tray removal action is completed.

[0046] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed by the present invention. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0047] It should be understood that the present invention is not limited to what has been described above and that various modifications and changes may be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A substrate conveying device, characterized in that: include: A base (1), a positioning rod (2) and a grabbing device (3); wherein the base (1) is located at the lower part of the device, one end of the positioning rod (2) is connected to the base (1), and the other end of the positioning rod (2) is connected to the grabbing device (3); A rotating disk (301) is provided at the lower part of the grabbing device (3), a plurality of long strip grabbing arms (302) are provided on the rotating disk (301), and a downward grabbing hook (303) is provided at the front end of each grabbing arm (302). A rotating shaft (304) is provided at the center of the rotating disk (301), a rotating limit block (305) and a rotating limit seat (401) are provided on the rotating shaft (304), a rotating limit pin (306) is provided between the rotating limit seat (401) and the rotating limit block (305), the rotating limit seat (401) is located on a crossbeam (403) between two positioning bases (402), and a lifting limit block (404) is provided on the crossbeam (403) below the rotating limit seat (401); During the rotation action, when taking out the disk, the rotation limit block (305) and the left side of the rotation limit seat (401) are in contact to complete the limit, and when putting the disk, the rotation limit block (305) and the right side of the rotation limit seat (401) are in contact to complete the limit; The rotation limit block (305) is provided with a first limit portion, and the rotation limit seat (401) is provided with a second limit portion, and the first limit portion and the second limit portion are arranged opposite to each other in a circumferential direction with the axis of the rotation shaft (304) as the rotation center. When taking out a disk, the first limit portion of the rotation limit block (305) and the left side of the second limit portion of the rotation limit seat (401) contact to complete the limit, and when placing a disk, the first limit portion of the rotation limit block (305) and the right side of the second limit portion of the rotation limit seat (401) contact to complete the limit; During the lifting action, when in the upper position, the rotation limit seat (401) and the lifting positioning block (404) contact to complete the limit, and when in the lower position, the rotation limit block (305) and the rotation limit seat (401) contact to complete the limit.

2. A substrate conveying device according to claim 1, characterized in that: The rotation limit seat (401) is provided with a fixing hole. During rotation, the rotation limit pin (306) and the fixing hole on the rotation limit seat (401) are fixed to adjust the rotation angle.

3. A substrate conveying device according to claim 1, characterized in that: The rotating disk (301) is provided with three grabbing arms (302), and a downward grabbing hook (303) is provided at the front end of each grabbing arm (302).

4. A substrate conveying device according to claim 1, characterized in that: The lower end of the grab hook (303) is provided with a protruding buckle, and when taking the tray, the buckle can easily grab the wafer tray.

5. The substrate conveying device according to claim 1, characterized in that: A pulley is provided below the base (1).

6. The substrate conveying device according to claim 1, characterized in that: A positioning pin (405) is provided at the lower end of the positioning base (402). When the wafer tray is taken in and placed in, the positioning pin (405) is aligned with the positioning hole of the cavity to achieve a positioning effect.

7. A substrate conveying method, said method being performed by using any one of the substrate conveying devices of claims 1 to 6, characterized in that: The method comprises the following steps: 1) transporting the device to the top of the cavity, aligning the positioning pin (405) of the positioning base (402) with the positioning hole of the cavity, and slowly lowering the device. After the bottom surface of the positioning base (402) is completely in contact with the top of the cavity and subjected to force, the device stops descending; 2) adjusting the rotation direction of the grasping device, and the grasping device (3) rotates to a disk-taking position; 3) continuing to slowly descend until the rotation positioning block (305) contacts the rotation positioning seat (401) in a limiting position and is positioned in the lower position; 4) adjusting the rotation direction of the grasping device (3), and the grasping device (3) rotates to a disk-placing position; 5) The device is slowly raised, and the grabbing device (3) hook (303) lifts the wafer tray until the lifting limit block (404) contacts the turntable (301) and is positioned in the upper position. At this time, the wafer tray is separated from the upper surface of the heating plate; 6) The device is continued to be raised, and the grabbing device (3) drives the positioning base (402) to rise and leave the upper surface of the cavity. After the positioning pin (405) is completely out of the positioning hole, the wafer tray can be transported out of the cavity range, completing the tray removal action.

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