Card sleeves and electronic devices

Abstract

This disclosure provides a sleeve adapted to a circuit board, the circuit board having a first air vent and a second air vent; the sleeve includes: a base plate having a first side and a second side disposed opposite to each other, and a third side and a fourth side connected between the first side and the second side and disposed opposite to each other; a first side plate and a second side plate respectively disposed on the first side and the second side plate of the base plate; and both the first side plate and the second side plate having a hollow pattern; when the circuit board is fixed to the sleeve, the first side plate is opposite to the first air vent, and the second side plate is opposite to the second air vent of the circuit board; a connecting back plate disposed on the fourth side of the base plate; and at least one insert plate disposed on the base plate, the extension direction of the insert plate intersecting the extension direction of the third side of the base plate. This disclosure also provides an electronic device including the above-described sleeve.

Description

Technical Field

[0001] This invention relates to the field of communication technology, and more particularly to a card holder and an electronic device. Background Technology

[0002] The orthogonal architecture, which emerged under the market trend of being highly sensitive to medium and large-sized routing and switching equipment, dictates a front-to-back airflow configuration. However, previously developed boards, designed to adapt to the existing system airflow, mostly used a left-to-right airflow configuration. For large market customers—operators—backward compatibility is almost a mandatory requirement. Clearly, boards with a left-to-right airflow configuration cannot be used in orthogonal architecture airflow without changing the heat dissipation measures. Furthermore, with the continuous increase in system traffic, the increase in the number of switching network board slots will also bring about thermal cascading issues between front and back boards. Given this thermal cascading, how to ensure adequate heat dissipation for downstream switching network boards within the orthogonal architecture airflow configuration also presents certain challenges. Summary of the Invention

[0003] The main objective of this invention is to provide a card sleeve and an electronic device, which is intended to apply the card of the left and right air ducts to an orthogonal architecture electronic device.

[0004] In a first aspect, embodiments of this disclosure provide a sleeve adapted to a circuit board, the circuit board having a first air vent and a second air vent; the sleeve includes:

[0005] A substrate having a first side and a second side disposed opposite to each other, and a third side and a fourth side disposed opposite to each other and connected between the first side and the second side;

[0006] A first side plate and a second side plate are respectively disposed on the first side and the second side of the substrate; and both the first side plate and the second side plate have hollow patterns; when the board is fixed on the sleeve, the first side plate is opposite to the first air vent, and the second side plate is opposite to the second air vent of the board;

[0007] A connecting backplate is disposed on the fourth side of the substrate;

[0008] At least one insert plate is disposed on the substrate, and the extending direction of the insert plate intersects the extending direction of the third side of the substrate.

[0009] Optionally, the connection point between the first side and the third side is a first connection point; the connection point between the first side and the fourth side is a second connection point; the connection point between the second side and the third side is a third connection point; and the connection point between the second side and the fourth side is a fourth connection point.

[0010] The first end of the connecting back plate is connected to the second connection point, and there is a certain distance between the second end of the connecting back plate and the fourth connection point;

[0011] At least one first connection end of the insert plate is connected to the third side and is at a certain distance from the third connection point, while the second connection end is connected to the first side.

[0012] Optionally, there are multiple insert plates, one of which is a first insert plate, and the remaining insert plates are second insert plates;

[0013] The first connecting end of the first insert plate is connected to the third connecting point, and the second connecting end is connected to the second end of the connecting back plate; and the connecting back plate has an opening.

[0014] The first connecting end of the second insert plate is connected to the third side and is at a certain distance from the third connecting point, while the second connecting end is connected to the first side.

[0015] Optionally, there are multiple second inserts, which are spaced apart, and the second connection end of one of the multiple second inserts is connected to a second connection point.

[0016] Optionally, the connection point between the first side and the third side is a first connection point; the connection point between the first side and the fourth side is a second connection point; the connection point between the second side and the third side is a third connection point; and the connection point between the second side and the fourth side is a fourth connection point.

[0017] The first end of the connecting back plate is connected to the fourth connection point, and the second end of the connecting back plate is at a certain distance from the second connection point;

[0018] At least one first connection end of the insert plate is connected to the third side and is at a certain distance from both the first connection point and the third connection point, and the second connection end is connected to the second side.

[0019] Optionally, there are multiple insert plates, one of which is a first insert plate, and the remaining insert plates are second insert plates;

[0020] The first connecting end of the first insert plate is connected to the first connecting point, and the second connecting end is connected to the second end of the connecting back plate; and the connecting back plate has an opening.

[0021] The first connecting end of the second insert plate is connected to the third side and is at a certain distance from both the first connecting point and the third connecting point. The second connecting end is connected to the second side.

[0022] Optionally, there are multiple second inserts, which are spaced apart, and the second connection end of one of the multiple second inserts is connected to the fourth connection point.

[0023] Optionally, the connection point between the first side and the third side is a first connection point; the connection point between the first side and the fourth side is a second connection point; the connection point between the second side and the third side is a third connection point; the connection point between the second side and the fourth side is a fourth connection point; the connecting back plate includes a first sub-connecting back plate and a second sub-connecting back plate, and the first sub-connecting back plate and the second sub-connecting back plate are spaced apart and both are connected to the fourth side of the substrate; wherein,

[0024] The first end of the first sub-connecting backplate is connected to the second connection point; the second end of the second sub-connecting backplate is connected to the fourth connection point.

[0025] Optionally, there are multiple insert plates, with some of them being first insert plates and others being second insert plates; wherein,

[0026] The first end of the first insert plate and the first end of the second insert plate are both connected to the third side; the second end of the first insert plate and the second end of the second insert plate are both connected to the third side; and the distance from the first end of the first insert plate to the first connection point is greater than or equal to the distance from the first end of the second insert plate to the first connection point; and the distance from the second end of the first insert plate to the second connection point is greater than the distance from the second end of the second insert plate to the second connection point.

[0027] The interval between the second ends of the first insert plate and the second insert plate that are adjacent to each other is opposite to the interval between the first sub-connecting back plate and the second sub-connecting back plate.

[0028] Secondly, embodiments of this disclosure provide an electronic device, which includes the aforementioned card sleeve and circuit board; the circuit board is fixed on the card sleeve.

[0029] Optionally, it also includes a stencil, wherein the stencil and the board adopt an orthogonal architecture.

[0030] Optionally, both the mesh panel and the circuit board are housed in a chassis, and a fan is provided on the side of the chassis near the mesh panel.

[0031] The embodiments disclosed herein have the following beneficial effects:

[0032] Because the sleeve in this embodiment is compatible with the boards of the left and right air ducts, and an insertion plate is provided on the sleeve, with the insertion angled relative to the substrate (taking the extension direction of the insertion plate intersecting the extensions of the first and third sides of the substrate as an example), when the board is inserted into the chassis through the sleeve, after the rear fan of the chassis is turned on, the air enters from the front of the chassis under the action of the fan and blows to the insertion plate. Under the action of the insertion plate, the airflow changes direction after passing through the hollow pattern on the first side plate to the side wall opposite to the first side plate of the chassis. At this time, the airflow blows from the first air vent of the board to the second air vent to dissipate heat from the board. In other words, after fixing the boards of the left and right air ducts to the sleeve and then applying them to orthogonal architecture electronic devices, good heat dissipation can also be achieved. Attached Figure Description

[0033] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the following detailed description to explain the invention, but do not constitute a limitation thereof. In the drawings:

[0034] Figure 1 A top view of an exemplary electronic device;

[0035] Figure 2 This is a schematic diagram of an exemplary board;

[0036] Figure 3 This is a schematic diagram of the card sleeve structure according to an embodiment of the present disclosure;

[0037] Figure 4 This is a top view of the substrate of the card sleeve according to an embodiment of the present disclosure;

[0038] Figure 5 This is a top view of an exemplary card holder according to an embodiment of the present disclosure;

[0039] Figure 6 For application Figure 5 A top view of the electronic device with the card holder;

[0040] Figure 7 This is a top view of an exemplary card holder according to an embodiment of the present disclosure;

[0041] Figure 8 For application Figure 7 A top view of the electronic device with the card holder;

[0042] Figure 9 This is a top view of an exemplary card holder according to an embodiment of the present disclosure;

[0043] Figure 10 For application Figure 9 A top view of the electronic device with the card holder;

[0044] Figure 11This is a schematic diagram of an exemplary electronic device according to an embodiment of the present disclosure;

[0045] Figure 12 This is a schematic diagram of an exemplary electronic device according to an embodiment of the present disclosure;

[0046] Figure 13 This is a schematic diagram of an exemplary electronic device according to an embodiment of the present disclosure;

[0047] Figure 14 This is a schematic diagram of an exemplary electronic device according to an embodiment of the present disclosure;

[0048] Figure 15 This is a schematic diagram of an exemplary electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0049] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0050] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0051] An exemplary electronic device, including but not limited to a switch, is described below. The electronic device described below is exemplified by a switch. Figure 1As shown, the switch includes a chassis 00, a connector 20 disposed within the chassis 00, and boards 10 (which can be service line boards) and network boards 30 located on the front and rear sides of a connection backplane 54, respectively. The boards 10 and network boards 30 are arranged in an orthogonal architecture and are connected via the connector 20. A fan 40 is also provided inside the chassis 00 for heat dissipation, located on the side of the network board 30 opposite to the boards 10. Correspondingly, air ducts adapted to the fan 40 are formed on the boards 10 and network boards 30. The inventors have discovered that in orthogonal architecture electronic devices, both boards 10 and network boards 30 use front-to-back air ducts so that the fan 40 can direct airflow and dissipate heat from the electronic device. However, in existing products, some boards 10 use left-to-right air ducts, such as... Figure 2 As shown, when this type of board 10 is applied to a switch, the airflow direction of board 10 is different from that of fan 40, resulting in board 10 being unable to dissipate heat effectively.

[0052] In order to enable the left and right air duct boards 10 to effectively dissipate heat when applied to orthogonal architecture electronic devices, the following technical solutions are provided in the embodiments of this disclosure.

[0053] Firstly, such as Figure 3 As shown, this embodiment of the present disclosure provides a card sleeve 50, which is adapted to a board 10. The board 10 has a first air vent and a second air vent disposed opposite to each other; wherein, one of the first air vent and the second air vent is an air inlet and the other is an air outlet, and the air inlet and the air outlet form an air duct. The card sleeve 50 in this embodiment of the present disclosure includes: a base plate 51, a first side plate 52, a second side plate 53, a connecting back plate 54, and at least one insert plate.

[0054] like Figure 4 As shown, the substrate 51 is a rectangular substrate 51, which includes a first side 511 and a second side 512 disposed opposite to each other, and a third side 513 and a fourth side 514 disposed opposite to each other and connected between the first side 511 and the second side 512. The connection point between the first side 511 and the third side 513 is the first connection point a, the connection point between the first side 511 and the fourth side 514 is the second connection point b, the connection point between the second side 512 and the third side 513 is the third connection point c, and the connection point between the second side 512 and the fourth side 514 is the fourth connection point d.

[0055] Both the first side plate 52 and the second side plate 53 have hollowed-out patterns, which are respectively disposed on the first side 511 and the second side 512 of the substrate 51. The hollowed-out patterns on the first side plate 52 and the second side plate 53 can be square openings, and when the board 10 is installed on the card sleeve 50, the hollowed-out patterns on the first side plate 52 and the second side plate 53 can correspond to the first air vent and the second air vent on the board 10, respectively.

[0056] A connecting backplate 54 is connected to the fourth side 514 of the substrate 51 and is used to connect the board 10 and the stencil 30.

[0057] An insert plate is disposed on the substrate 51, and the extending direction of the insert plate intersects the extending direction of the third side 513 of the substrate 51. The insert plate is also inclined relative to the substrate 51.

[0058] It should be noted that snap-fit ​​portions are also provided on the first side 511 and the second side 512 of the substrate 51. After the card 10 is installed in the sleeve 50, the sleeve 50 is inserted into the chassis 00. The snap-fit ​​portions on the substrate 51 are adapted to the fixing portions on the side wall of the chassis 00, so that the card 10 is fixed inside the chassis 00. As an example, the fixing portion on the side wall of the chassis 00 can be a groove, and the snap-fit ​​portion is fixed in the groove to fix the card 10 inside the chassis 00. After the sleeve 50 is fixed in the chassis 00, there is a certain distance between the first side plate 52 and the second side plate 53 of the sleeve 50 and the corresponding side wall of the chassis 00.

[0059] Since the sleeve 50 in this embodiment is compatible with the circuit boards 10 of the left and right air ducts, and an insertion plate is provided on the sleeve 50, and the insertion and removal are inclined relative to the substrate 51 (taking the extension direction of the insertion plate intersecting the extension of the first side 511 and the third side 513 of the substrate 51 as an example), when the circuit board 10 is inserted into the chassis 00 through the sleeve 50, after the rear fan 40 of the chassis 00 is turned on, the air enters from the front of the chassis 00 under the action of the fan 40 and blows to the insertion plate. Under the action of the insertion plate, the air is blown from the hollow pattern on the first side plate 52 to the side wall of the chassis 00 opposite to the first side plate 52, and the air direction changes. At this time, the air blows from the first air vent of the circuit board 10 to the second air vent to dissipate heat from the circuit board 10. In other words, after fixing the circuit board 10 of the left and right air ducts to the sleeve 50 and then applying it to an orthogonal architecture electronic device, good heat dissipation can also be achieved.

[0060] In one example, the first vent on board 10 serves as the air inlet, and the second vent serves as the air outlet. For example... Figure 5 As shown, the card sleeve 50 contains multiple insert plates, one of which is the first insert plate 551, and the remaining insert plates are second insert plates 552; the number of second insert plates 552 can be one or more. Figure 5The following description uses three second insert plates 552 as an example. A backplate 54 on the sleeve 50 is connected to the fourth side 514 of the base plate 51. The first end of the backplate 54 is connected to the second connection point b, and the second end is a certain distance from the fourth connection point d. An opening is provided on the backplate 54. The connector on the card 10 is connected to the backplate 54. The first connection end of the first insert plate 551 is connected to the third connection point c. The second connection end of the second insert plate 552 is connected to the fourth side 514 of the base plate 51 and is correspondingly connected to the second end of the backplate 54. The second insert plates 552 are spaced apart. The first end of each second insert plate 552 is connected to the third side 513 of the base plate 51, and there is a certain distance between it and both the first connection point a and the third connection point c. The second end of each second insert plate 552 is connected to the first side 511 of the base plate 51. Preferably, the second end of the second insert plate 552 closest to the first insert plate 551 is connected to the second connection point b.

[0061] In the above scenario, when the board 10 is fixed to the sleeve 50 of this structure and inserted into the chassis 00 through the sleeve 50, air enters from the front of the sleeve 50. Part of the air is blown from between the first insert plate 551 and the second insert plate 552 closest to the first insert plate 551 to the connecting back plate 54, and then discharged through the opening 541 on the connecting back plate 54. Another part of the air is blown between two adjacent second insert plates 552, and between the second insert plate 552 and the first side plate 52, through the perforated pattern on the first side plate 52, towards the side wall of the chassis 00 opposite to the first side plate 52. The airflow then changes direction, blowing from the first air inlet (air inlet) of the board 10 to the second air outlet (air outlet), thus dissipating heat from the board 10. Part of the air discharged from the second air outlet of the board 10 is discharged between the first insert plate 551 and the second side plate 53, and between the second side plate 53 and the opposite side plate of the chassis 00. It should be noted that... Figure 5-10 The dashed arrows shown all indicate the wind direction passing through card sleeve 50; while the solid arrows indicate the wind direction in board 10 and network card.

[0062] like Figure 6 As shown, the board 10 is inserted into the chassis 00 through the card sleeve 50. At this time, the connector 21 on the board 10 and the connector 22 on the network board 30 are connected through the connecting back plate 54 to form an orthogonal electronic device. The fan 40 set on the side of the network board 30 away from the board 10 exhausts the air that is discharged from the board 10 into the front and rear air ducts of the network board 30 to complete the heat dissipation of the board 10 and the network board 30.

[0063] In one example, similar to the previous example, the difference is that the first air vent of the card 10 adapted to by the card sleeve 50 is an air outlet, and the second air vent is an air inlet. For example... Figure 7As shown, the card sleeve 50 contains multiple insert plates, one of which is the second insert plate 552, and the remaining insert plates are the first insert plates 551; the number of first insert plates 551 can be one or more. Figure 7 The following description uses three first insert plates 551 as an example. A backplate 54 on the sleeve 50 is connected to the fourth side 514 of the base plate 51, and the second end of the backplate 54 is connected to the fourth connection point d. There is a certain distance between the first end and the second connection point b, and an opening 541 is provided on the backplate 54. A connector on the board 10 is connected to the backplate 54. The first connection end of the second insert plate 552 is connected to the first connection point a, and the second connection end of the first insert plate 551 is connected to the fourth side 514 of the base plate 51, corresponding to the first end of the backplate 54. The first insert plates 551 are spaced apart, and the first end of each first insert plate 551 is connected to the third side 513 of the base plate 51, with a certain distance between it and both the first connection point a and the third connection point c. The second end of each first insert plate 551 is connected to the second side 512 of the base plate 51; preferably, the second end of the first insert plate 551 closest to the second insert plate 552 is connected to the fourth connection point d.

[0064] In the above scenario, when the board 10 is fixed to the sleeve 50 of this structure and inserted into the chassis 00 through the sleeve 50, air enters from the front of the sleeve 50. Part of the air is blown from between the second insert plate 552 and the first insert plate 551 closest to the second insert plate 552 to the connecting back plate 54, and then discharged through the opening on the connecting back plate 54. Another part of the air is blown through the space between two adjacent first insert plates 551, and between the first insert plate 551 and the second side plate 53, through the perforated pattern on the second side plate 53, towards the side wall of the chassis 00 opposite to the second side plate 53. The airflow then changes direction, blowing from the first air inlet (air inlet) of the board 10 to the second air outlet (air outlet), thus dissipating heat from the board 10. Part of the air discharged from the second air outlet of the board 10 is discharged between the second insert plate 552 and the first side plate 52, and between the first side plate 52 and the opposite side plate of the chassis 00.

[0065] like Figure 8 As shown, the board 10 is inserted into the chassis 00 through the card sleeve 50. At this time, the connector 21 on the board 10 and the connector 22 on the network board 30 are connected through the connecting back plate 54 to form an orthogonal electronic device. The fan 40 set on the side of the network board 30 away from the board 10 exhausts the air that is discharged from the board 10 into the front and rear air ducts of the network board 30 to complete the heat dissipation of the board 10 and the network board 30.

[0066] In one example, both the first and second air vents on the panel are air inlets. For example... Figure 9As shown, the connecting back plate 54 on the sleeve 50 includes a first sub-connecting back plate 541 and a second sub-connecting back plate 542 spaced apart. Both the first sub-connecting back plate 541 and the second sub-connecting back plate 542 are connected to the fourth side 514 of the substrate 51. The first end of the first sub-connecting back plate 541 is connected to the second connection point b, and the second end of the second sub-connecting back plate 542 is connected to the fourth connection point d. The sleeve 50 has multiple insert plates, some of which are first insert plates 551, and the remaining parts are second insert plates 552. Figure 9 In this embodiment, there are two first insert plates 551 and two second insert plates 552. However, in actual applications, the number of first insert plates 551 and two second insert plates 552 may vary, and there may be one first insert plate 551 and two second insert plates 552, or even three or more. In this embodiment, the number of first insert plates 551 and two second insert plates 552 is limited, and only two first insert plates 551 and two second insert plates 552 are used as an example for explanation. The two first insert plates 551 are spaced apart, and the two second insert plates 552 are spaced apart. The first ends of both the first insert plates 551 and the second insert plates 552 are connected to the third side 513 of the substrate 51, and the second ends are connected to the fourth side 514. The distance from the first end of the first insert plate 551 to the first connection point a is greater than or equal to the distance from the first end of the second insert plate 552 to the first connection point a; the distance from the second end of the first insert plate 551 to the second connection point b is greater than or equal to the distance from the second end of the second insert plate 552 to the second connection point b. In one example, the first ends of the adjacent first insert plate 551 and second insert plate 552 are connected to the same point on the third side 513 of the substrate 51, the second end of the first insert plate 551 is connected to the first end of the second sub-connecting back plate 542 on the fourth side 514 of the substrate 51, and the second end of the second insert plate 552 is connected to the second end of the first sub-connecting back plate 541 on the fourth side 514 of the substrate 51.

[0067] In the above situation, when the board 10 is fixed on the sleeve 50 of this structure and the board 10 is inserted into the chassis 00 through the sleeve 50, air enters from the front side of the sleeve 50. Part of the air blown to the first insert plate 551 changes direction and is discharged from the hollow pattern on the second side plate 53, blown to the side wall of the chassis 00 opposite to the second side plate 53, and then enters the second air vent of the board 10 after the change of air direction. Another part of the air blown to the second insert plate 552 changes direction and is discharged from the hollow pattern on the first side plate 52, blown to the side wall of the chassis 00 opposite to the first side plate 52, and then enters the first air vent of the board 10 after the change of air direction. The air entering from the first air vent and the second air vent dissipates heat from the board 10 and is then discharged through the gap between the first sub-connecting backplate 541 and the second sub-connecting backplate 542.

[0068] like Figure 10As shown, the board 10 is inserted into the chassis 00 through the card sleeve 50. At this time, the connector 21 on the board 10 and the connector 22 on the network board 30 are connected through the connecting back plate 54 to form an orthogonal electronic device. The fan 40 set on the side of the network board 30 away from the board 10 exhausts the air that is discharged from the board 10 into the front and rear air ducts of the network board 30 to complete the heat dissipation of the board 10 and the network board 30.

[0069] Secondly, combining Figure 11-15 As shown, this disclosure provides an electronic device including the aforementioned card sleeve 50, a board 10 disposed on the card sleeve 50, and a network board 30 connected to the board 10; wherein the board 10 and the network board 30 adopt an orthogonal architecture. Specifically, the board 10 and the connection backplate 54 of the card sleeve 50 are connected via a connector 21; the network board 30 is connected to the connection backplate 54 of the card sleeve 50 via a connector 22. In this disclosure embodiment, the electronic device can be a router.

[0070] Since the electronic device in this embodiment includes the aforementioned sleeve 50, which is adapted to the left and right air duct boards 10, and has an insertion plate on the sleeve 50, and the insertion and removal are inclined relative to the substrate 51 (taking the extension direction of the insertion plate intersecting the extension of the first side 511 and the third side 513 of the substrate 51 as an example), when the board 10 is inserted into the chassis 00 through the sleeve 50, after the rear fan 40 of the chassis 00 is turned on, the air enters from the front of the chassis 00 under the action of the fan 40 and blows to the insertion plate. Under the action of the insertion plate, the air is blown from the hollow pattern on the first side plate 52 to the side wall of the chassis 00 opposite to the first side plate 52, and the air direction changes. At this time, the air blows from the first air vent of the board 10 to the second air vent to dissipate heat from the board 10. In other words, after fixing the left and right air duct boards 10 to the sleeve 50 and then applying them to the orthogonal architecture electronic device, good heat dissipation can also be achieved.

[0071] In some embodiments, the electronic device further includes a fan 40 disposed in the chassis 00 for dissipating heat from the board 10 and the mesh board 30.

[0072] In one example, such as Figure 11 As shown, there are multiple fans 40, arranged side-by-side on the side of the mesh plate 30 away from the single board. In this case, the large number of fans 40 is beneficial for heat dissipation of the board 10 and the mesh plate 30, resulting in better heat dissipation. Of course, considering the power consumption of the fans 40, the number of fans 40 and their placement areas should be reasonably set; specifically, the fans 40 can be placed in three areas, such as... Figure 12 As shown, two fans 40 are respectively located on the side of the mesh plate 30 away from the single board and at the corner of the chassis 00, and one fan 40 is located in the middle area of ​​the chassis 00.

[0073] In one example, such as Figure 13 As shown, the fans 40 are configured in two zones, with each zone's fans 40 positioned on the side of the mesh plate 30 facing away from the single board, and located at the corners of the chassis 00. In this configuration, the number of fans 40 is reduced, effectively cooling both the board 10 and the mesh plate 30 while minimizing power consumption. Of course, as... Figure 14 and 15 As shown, the fan 40 can also be set in one area. The fan 40 is set on the side of the mesh plate 30 away from the single board and is located at the corner of the chassis 00.

[0074] The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but this does not limit the scope of the invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and spirit of the present invention should be within the scope of the present invention.

Claims

1. A card sleeve adapted to a circuit board, said circuit board having a first air vent and a second air vent; characterized in that, The card sleeve includes: A substrate having a first side and a second side disposed opposite to each other, and a third side and a fourth side disposed opposite to each other and connected between the first side and the second side; A first side plate and a second side plate are respectively disposed on the first side and the second side of the substrate; and both the first side plate and the second side plate have hollow patterns; when the board is fixed on the sleeve, the first side plate is opposite to the first air vent, and the second side plate is opposite to the second air vent of the board; A connecting backplate is disposed on the fourth side of the substrate; At least one insert plate is disposed on the substrate, and the extending direction of the insert plate intersects the extending directions of a first side and a third side of the substrate; the connection point between the first side and the third side is a first connection point; the connection point between the first side and the fourth side is a second connection point; the connection point between the second side and the third side is a third connection point; the connection point between the second side and the fourth side is a fourth connection point; at least one of the insert plates is disposed at an angle relative to the substrate. At least one first connection end of the insert plate is connected to the third side and is at a certain distance from the third connection point, and the second connection end is connected to the first side or the second side.

2. The card sleeve according to claim 1, characterized in that, The first end of the connecting back plate is connected to the second connection point, and there is a certain distance between the second end of the connecting back plate and the fourth connection point.

3. The card sleeve according to claim 2, characterized in that, The number of the inserts is multiple, one of which is the first insert, and the remaining inserts are the second inserts; The first connecting end of the first insert plate is connected to the third connecting point, and the second connecting end is connected to the second end of the connecting back plate; and the connecting back plate has an opening. The first connecting end of the second insert plate is connected to the third side and is at a certain distance from the third connecting point, while the second connecting end is connected to the first side.

4. The card sleeve according to claim 3, characterized in that, The number of the second inserts is multiple, and the multiple second inserts are spaced apart, and the second connection end of one of the multiple second inserts is connected to the second connection point.

5. The card sleeve according to claim 1, characterized in that, The second end of the connecting back plate is connected to the fourth connection point, and there is a certain distance between the second end of the connecting back plate and the second connection point; At least one first connection end of the insert plate is connected to the third side and is at a certain distance from both the first connection point and the third connection point, and the second connection end is connected to the second side.

6. The card sleeve according to claim 5, characterized in that, The number of the inserts is multiple, one of which is the first insert, and the remaining inserts are the second inserts; The first connecting end of the first insert plate is connected to the first connecting point, and the second connecting end is connected to the second end of the connecting back plate; and the connecting back plate has an opening. The first connecting end of the second insert plate is connected to the third side and is at a certain distance from both the first connecting point and the third connecting point. The second connecting end is connected to the second side.

7. The card sleeve according to claim 6, characterized in that, There are multiple second inserts, which are spaced apart, and the second connection end of one of the multiple second inserts is connected to the fourth connection point.

8. The card sleeve according to claim 1, characterized in that, The connecting backplate includes a first sub-connecting backplate and a second sub-connecting backplate, wherein the first sub-connecting backplate and the second sub-connecting backplate are spaced apart and both are connected to the fourth side of the substrate; wherein, The first end of the first sub-connecting backplate is connected to the second connection point; the second end of the second sub-connecting backplate is connected to the fourth connection point.

9. The card sleeve according to claim 8, characterized in that, The insert plates are multiple, with some being first insert plates and others being second insert plates; wherein... Both the first connecting end of the first plug plate and the first connecting end of the second plug plate are connected to the third side; both the second connecting end of the first plug plate and the second connecting end of the second plug plate are connected to the fourth side; and the distance from the first connecting end of the first plug plate to the first connecting point is greater than or equal to the distance from the first connecting end of the second plug plate to the first connecting point; and the distance from the second connecting end of the first plug plate to the second connecting point is greater than the distance from the second connecting end of the second plug plate to the second connecting point. The interval between the second connecting end of the first insert plate and the second connecting end of the second insert plate arranged adjacent to each other is opposite to the interval between the first sub-connecting back plate and the second sub-connecting back plate.

10. An electronic device, characterized in that, It includes the card sleeve and the plate card as described in any one of claims 1-9; the plate card is fixed on the card sleeve.

11. The electronic device according to claim 10, characterized in that, It also includes a stencil, which adopts an orthogonal architecture with the board.

12. The electronic device according to claim 11, characterized in that, Both the mesh panel and the circuit board are housed in a chassis, and a fan is located on the side of the chassis near the mesh panel.

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