Display panel and display device

Abstract

The application discloses a display panel and a display device, at least one of the insulating layers of the touch control structure is provided with an organic material, so that the bending performance of the flexible and foldable display screen is improved; and the insulating layer with the organic material is provided as a non-overlapping orthographic projection on the display substrate and the orthographic projection of the binding area on the display substrate, so that the step difference of the binding terminal of the binding area is reduced, and the problem of poor crimping of the binding terminal and the driving chip and the flexible circuit board is avoided.

Description

Technical Field

[0001] The present invention relates to the field of touch display technology, and in particular to a display panel and a display device. Background Art

[0002] With the development of active-matrix organic light emitting diode (AMOLED) technology, the development of display devices has entered the era of full-screen and narrow-framed displays. To provide users with a better user experience, full-screen, narrow-framed, high-resolution, rollable wearable, and foldable displays will inevitably become important development directions for AMOLED in the future. In order to achieve lighter and thinner panels to adapt to future foldable and rollable products, Flexible Multi-Layer On Cell (FMLOC) touch technology has been born. Summary of the Invention

[0003] Embodiments of the present invention provide a display panel and a display device, which are used to avoid the problem of poor crimping of binding terminals in a binding area.

[0004] An embodiment of the present invention provides a display panel, including:

[0005] A display substrate having a display area and a non-display area, wherein the non-display area includes a binding area;

[0006] A touch structure is located on the display substrate, and the touch structure includes at least one insulating layer; at least one of the insulating layers is made of an organic material; wherein,

[0007] The orthographic projection of the insulating layer made of an organic material on the display substrate does not overlap with the orthographic projection of the binding area on the display substrate.

[0008] Optionally, in the above-mentioned display panel provided by an embodiment of the present invention, the touch structure includes: a first insulating layer located on the display substrate, a first electrode layer located on a side of the first insulating layer away from the display substrate, a second insulating layer located on a side of the first electrode layer away from the display substrate, and a second electrode layer located on a side of the second insulating layer away from the display substrate;

[0009] The display substrate comprises: a base substrate, a first source-drain metal layer located between the base substrate and the first insulating layer, and a second source-drain metal layer located between the first source-drain metal layer and the first insulating layer;

[0010] The display substrate also includes a plurality of binding terminals arranged on the base substrate and in the binding area, and the binding terminals include: a first conductive layer, a second conductive layer located on a side of the first conductive layer away from the base substrate, and a third conductive layer located on a side of the second conductive layer away from the base substrate; the first conductive layer is arranged on the same layer as the first source and drain metal layer, the second conductive layer is arranged on the same layer as the second source and drain metal layer, and the third conductive layer is arranged on the same layer as the second electrode layer.

[0011] Optionally, in the above-mentioned display panel provided in an embodiment of the present invention, the first insulating layer has a first through hole at a position corresponding to the binding terminal, and the orthographic projection of the first through hole on the base substrate is located within the orthographic projection range of the binding terminal on the base substrate; the orthographic projection of the second insulating layer on the base substrate does not overlap with the orthographic projection of the binding area on the base substrate.

[0012] Optionally, in the above display panel provided by an embodiment of the present invention, the material of the first insulating layer is an inorganic material, and the material of the second insulating layer is an organic material.

[0013] Optionally, in the above-mentioned display panel provided in an embodiment of the present invention, the orthographic projection of the first insulating layer on the base substrate does not overlap with the orthographic projection of the binding area on the base substrate, and the second insulating layer has a second through hole at a position corresponding to the binding terminal, and the orthographic projection of the second through hole on the base substrate is located within the range of the orthographic projection of the binding terminal on the base substrate.

[0014] Optionally, in the above display panel provided by an embodiment of the present invention, the material of the first insulating layer is an organic material, and the material of the second insulating layer is an inorganic material.

[0015] Optionally, in the above display panel provided by an embodiment of the present invention, the orthographic projections of the first insulating layer and the second insulating layer on the base substrate do not overlap with the orthographic projection of the binding area on the base substrate.

[0016] Optionally, in the display panel provided by an embodiment of the present invention, materials of the first insulating layer and the second insulating layer are both organic materials.

[0017] Optionally, in the above display panel provided by an embodiment of the present invention, the binding terminal further includes a fourth conductive layer located between the second conductive layer and the third conductive layer, and the fourth conductive layer is provided in the same layer as the first electrode layer.

[0018] Optionally, in the above-mentioned display panel provided by an embodiment of the present invention, the display panel further includes: a first planarization layer located between the first source / drain metal layer and the second source / drain metal layer, a passivation layer located between the first source / drain metal layer and the first planarization layer, a second planarization layer located between the second source / drain metal layer and the first insulating layer, a pixel defining layer located between the second planarization layer and the first insulating layer, and a spacer layer located between the pixel defining layer and the first insulating layer; wherein,

[0019] The orthographic projections of the first flat layer, the pixel defining layer and the spacer layer on the base substrate do not overlap with the orthographic projection of the binding area on the base substrate; the passivation layer has a third through hole at a position corresponding to the binding terminal, and the orthographic projection of the third through hole on the base substrate is within the range of the orthographic projection of the binding terminal on the base substrate; the second flat layer has a fourth through hole at a position corresponding to the binding terminal, and the orthographic projection of the fourth through hole on the base substrate is within the range of the orthographic projection of the binding terminal on the base substrate.

[0020] Correspondingly, an embodiment of the present invention further provides a display device, comprising any one of the above-mentioned display panels provided by the embodiment of the present invention.

[0021] The beneficial effects of the embodiments of the present invention are as follows:

[0022] The present invention discloses a display panel and a display device. By setting at least one of the insulating layers included in the touch structure to be an organic material, the bending performance of the flexible folding display screen can be improved. In addition, the insulating layer made of organic material is set so that the orthographic projection on the display substrate and the orthographic projection of the binding area on the display substrate do not overlap. In this way, the step difference of the binding terminal in the binding area can be reduced, avoiding the problem of poor crimping when the binding terminal is crimped with the driver chip and the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic top view of a display panel provided by an embodiment of the present invention;

[0024] Figure 2 A schematic cross-sectional view of a display panel corresponding to a display area provided by an embodiment of the present invention;

[0025] Figure 3 for Figure 2 The structure shown corresponds to a schematic diagram of a binding terminal of the binding region;

[0026] Figure 4 for Figure 3 The enlarged schematic diagram of the inner membrane layer in the middle dashed box;

[0027] Figure 5 Another cross-sectional view of a display panel according to an embodiment of the present application is shown in FIG. 6B.

[0028] Figure 6 The structure shown in FIG. 6B corresponds to a schematic view of one binding terminal of the binding area. Figure 5

[0029] Figure 7 An enlarged schematic view of the film layer in the dashed box in FIG. 7B is shown in FIG. 7C. Figure 6

[0030] Figure 8 Another cross-sectional view of a display panel according to an embodiment of the present application is shown in FIG. 8B.

[0031] Figure 9 The structure shown in FIG. 8B corresponds to a schematic view of one binding terminal of the binding area. Figure 8

[0032] Figure 10 An enlarged schematic view of the film layer in the dashed box in FIG. 9B is shown in FIG. 9C. Figure 9

[0033] A top view of a plurality of binding terminals in the binding area is shown in FIG. 10B. Figure 11

[0034] A top view of a display device according to an embodiment of the present application is shown in FIG. 11B. Figure 12 DETAILED DESCRIPTION

[0035] An FMLOC touch structure generally includes a first insulating layer, a first electrode layer, a second insulating layer, and a second electrode layer arranged in layers, wherein the first insulating layer and the second insulating layer are both inorganic material layers, i.e., the FMLOC touch structure in the related art adopts a full inorganic scheme, which is optimal for integrated COE (Color Filter on Encap) technology and can achieve optimal optical properties. However, with increasing demand for flexibility and folding and increasing requirements for touch performance, the first insulating layer and the second insulating layer in the FMLOC touch structure are currently both set to organic materials, and this full organic material scheme has better flexibility; or one of the first insulating layer and the second insulating layer is set to an organic material and the other is set to an inorganic material, and this organic material + inorganic material scheme has moderate flexibility and moderate optical properties.

[0036] ​​​​At present, full-screen display products are the mainstream of development, among which the COP (Chip on PI, directly binding the driver chip on the display panel) binding method has become the future development direction. The display panel is generally provided with a binding area, and the binding area is formed with binding terminals, which are used to bind with the driver chip, flexible circuit board, etc. However, for the aforementioned FMLOC touch structure using all-organic materials and organic materials + inorganic materials, the related technology generally etches long holes in the organic material film layer to expose the binding terminals, and the edge areas around the binding terminals are covered with the organic material film layer. Since the thickness of the organic material film layer is generally thick, the step difference between the area around the binding terminal and the middle area is large, which is prone to poor crimping when crimping with the driver chip, flexible circuit board, etc. in the later stage.

[0037] The purpose of the present invention is to solve the problem of poor crimping when the above-mentioned binding terminals are crimped. In order to make the purpose, technical solution and advantages of the present invention clearer, the display panel provided by the embodiment of the present invention will be further described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0038] An embodiment of the present invention provides a display panel and a display device, wherein the display panel includes a stacked display substrate and a touch structure. Figure 1 is a top view of the display panel. Figure 2 、 Figure 5 and Figure 8 They are schematic cross-sectional views of the display panel corresponding to the display area, Figure 3 for Figure 2 The structure shown corresponds to a schematic diagram of a binding terminal in the binding area. Figure 4 for Figure 3 The enlarged schematic diagram of the membrane layer in the dotted box. Figure 6 for Figure 5 The structure shown corresponds to a schematic diagram of a binding terminal in the binding area. Figure 7 for Figure 6 The enlarged schematic diagram of the membrane layer in the dotted box. Figure 9 for Figure 8 The structure shown corresponds to a schematic diagram of a binding terminal in the binding area. Figure 10 for Figure 9 The enlarged schematic diagram of the membrane layer in the dotted box. Figure 11 This is a top view of multiple binding terminals in the binding area. Figure 12 Schematic top view of the display device.

[0039] The shapes and sizes of the components in the drawings do not reflect the true proportions, and are only intended to illustrate the contents of the present invention.

[0040] An embodiment of the present invention provides a display panel, such as Figures 1-10 As shown, the display panel includes:

[0041] A display substrate 1, the display substrate 1 having a display area AA and a non-display area NA, the non-display area NA including a binding area BA;

[0042] The touch structure 2 is located on the display substrate 1 and includes at least one insulating layer (for example, two insulating layers 21 and 22 ); at least one of the insulating layers ( 21 and 22 ) is made of an organic material;

[0043] The orthographic projection of the insulating layer ( 21 and / or 22 ) made of an organic material on the display substrate 1 does not overlap with the orthographic projection of the binding area BA on the display substrate 1 .

[0044] The above-mentioned display panel provided by an embodiment of the present invention can improve the bending performance of the flexible folding display screen by setting at least one of the insulating layers included in the touch structure to an organic material; and the insulating layer made of organic material is set so that the orthographic projection on the display substrate and the orthographic projection of the binding area on the display substrate do not overlap, thereby reducing the step difference of the binding terminal in the binding area and avoiding the problem of poor crimping when the binding terminal is crimped with the driver chip and the flexible circuit board.

[0045] In specific implementation, in the above display panel provided by the embodiment of the present invention, as Figure 2 、 Figure 5 and Figure 8 As shown, the touch structure 2 includes: a first insulating layer 21 located on the display substrate 1, a first electrode layer 22 located on a side of the first insulating layer 21 away from the display substrate 1, a second insulating layer 23 located on a side of the first electrode layer 22 away from the display substrate 1, and a second electrode layer 24 located on a side of the second insulating layer 23 away from the display substrate 1;

[0046] The display substrate 1 includes: a base substrate 11, a first source-drain metal layer 12 located between the base substrate 11 and a first insulating layer 21, and a second source-drain metal layer 13 located between the first source-drain metal layer 12 and the first insulating layer 21;

[0047] like Figure 1 As shown, the display panel further includes a plurality of binding terminals 3 disposed on the base substrate 11 and disposed in the binding area BA, as shown in FIG. Figure 3 、 Figure 4 、 Figure 6 、 Figure 7 、 Figure 9 andFigure 10 As shown, the binding terminal 3 includes: a first conductive layer 31, a second conductive layer 32 located on the side of the first conductive layer 31 away from the base substrate 11, and a third conductive layer 33 located on the side of the second conductive layer 32 away from the base substrate 11; the first conductive layer 31 is arranged on the same layer as the first source and drain metal layer 12, the second conductive layer 32 is arranged on the same layer as the second source and drain metal layer 13, and the third conductive layer 33 is arranged on the same layer as the second electrode layer 24. In this way, it is only necessary to change the original composition pattern when forming the first source-drain metal layer 12, so that the pattern of the first conductive layer 31 and the first source-drain metal layer 12 can be formed through a single composition process, without adding a process for separately preparing the first conductive layer 31; it is only necessary to change the original composition pattern when forming the second source-drain metal layer 13, so that the pattern of the second conductive layer 32 and the second source-drain metal layer 13 can be formed through a single composition process, without adding a process for separately preparing the second conductive layer 32; it is only necessary to change the original composition pattern when forming the second electrode layer 24, so that the pattern of the third conductive layer 33 and the second electrode layer 24 can be formed through a single composition process, without adding a process for separately preparing the third conductive layer 33, which can simplify the preparation process flow, save production costs, and improve production efficiency.

[0048] In a specific implementation, the first electrode layer 22 includes a plurality of bridging electrodes (22), and the second electrode layer 24 includes a plurality of first touch electrodes and a plurality of second touch electrodes (not shown) extending in different directions and being insulated and cross-arranged; the first touch electrodes include a plurality of first touch electrode blocks (24), and the bridging electrodes (22) electrically connect the first touch electrode blocks (24) through vias penetrating the second insulating layer 23.

[0049] In a specific implementation, the first touch electrode is a touch driving electrode, and the second touch electrode is a touch sensing electrode; or, the first touch electrode is a touch sensing electrode, and the second touch electrode is a touch driving electrode.

[0050] In specific implementation, in the above display panel provided by the embodiment of the present invention, as Figures 2-4 As shown, the material of the first insulating layer 21 is an inorganic material, and the material of the second insulating layer 23 is an organic material. By setting the material of the second insulating layer 23 to an organic material, the bending performance of the flexible foldable display product can be improved.

[0051] In specific implementation, in the above display panel provided by the embodiment of the present invention, as Figure 3 and Figure 4As shown, the first insulating layer 21 made of inorganic material has a first through hole 211 at the position corresponding to the binding terminal 3, and the orthographic projection of the first through hole 211 on the base substrate 11 is located within the orthographic projection range of the binding terminal 3 on the base substrate 11, that is, the first insulating layer 21 only covers the four edge portions of the binding terminal 3 to expose the binding terminal 3; the orthographic projection of the second insulating layer 23 made of organic material on the base substrate 11 does not overlap with the orthographic projection of the binding area BA on the base substrate 11, that is, the second insulating layer 23 made of organic material is completely removed in the binding area BA to reduce the film layer step difference of the binding terminal 3. Specifically, a layer of inorganic material film is deposited on the display substrate 1, a first metal layer is deposited on the inorganic material film layer, and the first metal layer is etched so that the first metal layer forms a first electrode layer 22 pattern in the display area AA, and the first metal layer is completely removed in the binding area BA; then, the inorganic material film layer is etched so that the inorganic material film layer has a first through hole 211 at a position corresponding to the binding terminal 3 in the binding area BA, that is, a first insulating layer 21 is formed; then, a layer of organic material film layer is formed and patterned so that the organic material film layer is The material film layer has vias in the display area AA for overlapping the first electrode layer 22 and the second electrode layer 24. The organic material film layer is completely removed in the binding area BA to reduce the step difference between the edge area and the middle area of ​​the binding terminal 3, that is, to form a second insulating layer 23; then, a second metal layer is deposited on the second insulating layer 23 and etched to form the second electrode layer 24 in the display area AA and the third conductive layer 33 in the binding area BA; the third conductive layer 33 protects the second conductive layer 32 as part of the binding terminal 3. The inventors of this case have found that the second conductive layer 33 is a part of the binding terminal 3. Figure 3 The film layer step difference of the binding terminal 3 structure shown is about 2.8 μm. Compared with the all-inorganic solution (the first insulating layer 21 and the second insulating layer 23 are both inorganic materials, the first metal layer is completely removed in the binding area, the first insulating layer 21 and the second insulating layer 23 are etched using a mask process, and the first insulating layer 21 and the second insulating layer 23 are both provided with vias at the binding terminal 3 position, that is, the first insulating layer 21 and the second insulating layer 23 both cover the surrounding edge portions of the binding terminal 3), the film layer step difference is 3.78 μm. Figure 3 The structure shown completely removes the second insulating layer 23 made of organic material in the binding area BA, and the edge area of ​​the binding terminal 3 is not covered with the thicker second insulating layer 23 made of organic material, thereby reducing the step difference between the edge area and the middle area of ​​the binding terminal 3. Therefore, the solution of the embodiment of the present invention has both flexible function and optical performance.

[0052] It should be noted that Figure 3During the production process of the binding terminal shown, the inorganic material film layer is etched after the first metal layer is etched. This is because if the inorganic material film layer is etched first, then when the first metal layer is deposited, the first metal layer is in contact with the second conductive layer. When the first metal layer is etched, the second conductive layer is easily etched. Therefore, the first metal layer is etched first, and then the inorganic material film layer is etched. The inorganic material film layer protects the second conductive layer from being etched.

[0053] In specific implementation, in the above display panel provided by the embodiment of the present invention, as Figures 5-7 As shown, the material of the first insulating layer 21 is an organic material, and the material of the second insulating layer 23 is an inorganic material. By setting the material of the first insulating layer 21 to be an organic material, the bending performance of the flexible foldable display product can be improved.

[0054] In specific implementation, in the above display panel provided by the embodiment of the present invention, as Figure 6 and Figure 7 As shown, the orthographic projection of the first insulating layer 21 made of organic material on the base substrate 11 does not overlap with the orthographic projection of the binding area BA on the base substrate 11, that is, the first insulating layer 21 made of organic material is completely removed in the binding area BA to reduce the film layer step difference of the binding terminal 3; the second insulating layer 23 made of inorganic material has a second through hole 231 at the position corresponding to the binding terminal 3, and the orthographic projection of the second through hole 231 on the base substrate 11 is located within the orthographic projection range of the binding terminal 3 on the base substrate 11, that is, the second insulating layer 23 only covers the four edge parts of the binding terminal 3 to expose the binding terminal 3.

[0055] In specific implementation, in the above display panel provided by the embodiment of the present invention, as Figure 6 and Figure 7 As shown, the binding terminal 3 further includes a fourth conductive layer 34 located between the second conductive layer 32 and the third conductive layer 33. The fourth conductive layer 34 is provided on the same layer as the first electrode layer 22. Thus, the fourth conductive layer 34 and the first electrode layer 22 can be formed in a single patterning process simply by changing the original pattern when forming the first electrode layer 22. This eliminates the need for a separate process for preparing the fourth conductive layer 34, simplifying the manufacturing process, saving production costs, and improving production efficiency.

[0056] Specifically, if Figure 6 and Figure 7As shown, a layer of organic material film is deposited on the display substrate 1, and the organic material film is etched so that the organic material film is completely removed in the binding area BA to reduce the step difference between the edge area and the middle area of ​​the binding terminal 3, that is, a first insulating layer 21 is formed; then, a first metal layer is deposited on the first insulating layer 21, and the first metal layer is etched so that the first metal layer forms a first electrode layer 22 pattern in the display area AA, and the first metal layer is retained in the binding area BA to form a fourth conductive layer 34. The fourth conductive layer 34 serves as a part of the binding terminal 3 to protect the second conductive layer 32 from being etched; then, on the first electrode layer 22 A layer of inorganic material film is deposited and patterned. The inorganic material film forms a via hole for overlapping the first electrode layer 22 and the second electrode layer 24 in the display area AA. The inorganic material film opens a second through hole 231 at the position corresponding to the binding terminal 3 in the binding area BA, forming a second insulating layer 23. Then, a second metal layer is deposited on the second insulating layer 23 and etched to form the second electrode layer 24 in the display area AA and the third conductive layer 33 in the binding area BA. The third conductive layer 33 protects the fourth conductive layer 34 as part of the binding terminal 3. The inventors of this case have found that the second conductive layer 33 is formed by the second conductive layer 33. Figure 6 The film step difference of the binding terminal 3 structure shown is about 2.88 μm. Compared with the film step difference of the all-inorganic solution of 3.78 μm, the embodiment of the present invention provides Figure 6 The structure shown completely removes the first insulating layer 21 made of organic material in the binding area BA, and the edge area of ​​the binding terminal 3 is not covered with the thicker first insulating layer 21 made of organic material, thereby reducing the step difference between the edge area and the middle area of ​​the binding terminal 3, and by setting the fourth conductive layer 34, the fourth conductive layer 34 is equivalent to raising the middle area of ​​the binding terminal 3, which can further reduce the film layer step difference of the binding terminal 3. Therefore, the solution of the embodiment of the present invention has both flexible function and optical performance.

[0057] In specific implementation, in the above display panel provided by the embodiment of the present invention, as Figures 8-10 As shown, the materials of the first insulating layer 21 and the second insulating layer 23 are both organic materials. By setting the materials of the first insulating layer 21 and the second insulating layer 23 to be organic materials, the bending performance of the flexible foldable display product can be further improved.

[0058] In specific implementation, in the above display panel provided by the embodiment of the present invention, as Figure 9 and Figure 10As shown in FIG. 1, the first insulating layer 21 and the second insulating layer 22 are completely removed in the bonding area BA, so as to reduce the film layer step difference of the bonding terminal 3.

[0059] In a specific implementation, in the display panel provided by the embodiment of the present application, as shown in FIG. 1, Figure 9 and Figure 10 As shown in FIG. 1, the bonding terminal 3 further comprises a fourth conductive layer 34 located between the second conductive layer 32 and the third conductive layer 33, and the fourth conductive layer 34 is arranged in the same layer as the first electrode layer 22. In this way, the fourth conductive layer 34 and the first electrode layer 22 can be formed by one patterning process by changing the original patterning pattern when the first electrode layer 22 is formed, without increasing the process of separately preparing the fourth conductive layer 34, so as to simplify the manufacturing process flow, save production cost, and improve production efficiency.

[0060] Specifically, as shown in FIG. 1, Figure 9 and Figure 10 After the first organic material film layer is deposited on the display substrate 1, the first organic material film layer is etched so as to be completely removed in the bonding area BA, so as to reduce the film layer step difference of the edge region and the middle region of the bonding terminal 3, that is, to form the first insulating layer 21; then, a first metal layer is deposited on the first insulating layer 21, and the first metal layer is etched so as to form the first electrode layer 22 pattern in the display area AA, and the first metal layer remains to form the fourth conductive layer 34 in the bonding area BA, and the fourth conductive layer 34 protects the second conductive layer 32 from being etched as a part of the bonding terminal 3; then, a second organic material film layer is deposited on the first electrode layer 22, and the second organic material film layer is patterned, the second organic material film layer forms a via hole for overlapping the first electrode layer 22 and the second electrode layer 24 in the display area AA, and the second organic material film layer is completely removed in the bonding area BA, so as to reduce the film layer step difference of the edge region and the middle region of the bonding terminal 3, that is, to form the second insulating layer 23; then, a second metal layer is deposited on the second insulating layer 23, and the second metal layer is etched so as to form the second electrode layer 24 in the display area AA, and the second metal layer forms the third conductive layer 33 in the bonding area BA. It is found by the inventor of the present application that the film layer step difference of the bonding terminal 3 structure shown in FIG. 1 is about 2.75 μm, and the film layer step difference of the all-inorganic scheme is 3.78 μm. Therefore, the display panel provided by the embodiment of the present application can reduce the film layer step difference. Figure 9 Figure 9 ​The structure shown is achieved by completely removing the first insulating layer 21 and the second insulating layer 23 made of organic material in the binding area BA, so that the edge area of ​​the binding terminal 3 is not covered with the thicker first insulating layer 21 and the second insulating layer 23 made of organic material, thereby further reducing the step difference between the edge area and the middle area of ​​the binding terminal 3, and by setting the fourth conductive layer 34, the fourth conductive layer 34 is equivalent to raising the middle area of ​​the binding terminal 3, which can further reduce the film layer step difference of the binding terminal 3. Therefore, the solution of the embodiment of the present invention has both flexible function and optical performance.

[0061] It should be noted that Figure 9 The structure shown adopts two mask processes to etch the first organic material film layer and the second organic material film layer. Of course, the first organic material film layer and the second organic material film layer can also be etched with one mask process. In this case, the first metal layer needs to be completely removed in the binding area BA. However, since the organic material film layer is generally thicker, it is difficult to etch it completely with one mask process. Therefore, two mask processes can be used. However, one mask process or two mask processes can be selected according to actual needs.

[0062] In specific implementation, in the above display panel provided by the embodiment of the present invention, as Figure 2 、 Figure 5 and Figure 8 As shown, the display substrate 1 also includes: a first planarizing layer 14 located between the first source-drain metal layer 12 and the second source-drain metal layer 13, a passivation layer 15 located between the first source-drain metal layer 12 and the first planarizing layer 14, a second planarizing layer 16 located between the second source-drain metal layer 13 and the first insulating layer 21, a pixel defining layer 17 located between the second planarizing layer 16 and the first insulating layer 21, and a spacer layer 18 located between the pixel defining layer 17 and the first insulating layer 21.

[0063] like Figure 3 、 Figure 6 and Figure 9As shown in the drawings, the first planar layer 14, the pixel defining layer 17 and the spacer layer 18 have no overlapping projection on the substrate 11 with the binding area BA, the passivation layer 15 has a third through hole 151 corresponding to the binding terminal 3, the third through hole 151 has a projection on the substrate 11 within the projection range of the binding terminal 3 on the substrate 11, the second planar layer 16 has a fourth through hole 161 corresponding to the binding terminal 3, the fourth through hole 161 has a projection on the substrate 11 within the projection range of the binding terminal 3 on the substrate 11, that is, the second planar layer 16 only covers the peripheral edge portion of the binding terminal 3 to expose the binding terminal 3. Specifically, the second planar layer 16 is arranged to cover the peripheral edge portion of the binding terminal 3, which can release the stress generated when the binding terminal 3 is pressure-bonded with the driving chip or the flexible circuit board.

[0064] In specific implementation, as shown in the drawings, Figure 3 , Figure 6 and Figure 9 , the first through hole 211, the second through hole 231, the third through hole 151 and the fourth through hole 161 substantially overlap.

[0065] As shown in the drawings, Figure 11 , the binding terminal 3 only shows the third conductive layer 33 and the fourth conductive layer 34, and since the binding terminal 3 is generally in a strip shape, the first through hole 211, the second through hole 231, the third through hole 151 and the fourth through hole 161 are long strip holes.

[0066] In specific implementation, in the above display panel provided by the embodiment of the present application, as shown in the drawings, Figure 2 , Figure 5 and Figure 8 , the display substrate 1 further comprises: an anode 19 between the second planar layer 16 and the pixel defining layer 17, a light emitting layer 20 between the spacer layer 18 and the first insulating layer 21, a cathode 25 between the light emitting layer 20 and the first insulating layer 21, and an encapsulation layer between the cathode 25 and the first insulating layer 21; the encapsulation layer comprises a first inorganic layer 201, an organic layer 202 and a second inorganic layer 203 arranged in layers, the anode 19, the light emitting layer and the cathode constitute a light emitting device, and the encapsulation layer 20 only covers the display area AA, that is, the display area AA is encapsulated to prevent external moisture from entering the display substrate 1, so that the light emitting device of the display area AA is disabled.

[0067] In specific implementation, in the above display panel provided by the embodiment of the present application, as shown in the drawings, Figure 2 , Figure 5 and Figure 8As shown, the display substrate 1 further includes: a buffer layer 26 located between the base substrate 11 and the first source-drain metal layer 12, an active layer 27 located between the buffer layer 26 and the first source-drain metal layer 12, a first gate insulating layer 28 located between the active layer 27 and the first source-drain metal layer 12, a first gate layer 29 located between the first gate insulating layer 28 and the first source-drain metal layer 12, a second gate insulating layer 30 located between the first gate layer 29 and the first source-drain metal layer 12, and a first gate insulating layer 30 located between the second gate insulating layer 30 and the first source-drain metal layer 12. 2, and an interlayer insulating layer 36 located between the second gate layer 35 and the first source-drain metal layer 12; wherein the first source-drain metal layer 12 is electrically connected to the active layer 27 through a via hole that sequentially penetrates the interlayer insulating layer 36, the second gate insulating layer 30 and the first gate insulating layer 28, the anode 19 is electrically connected to the second source-drain metal layer 13 through a via hole that penetrates the second planar layer 16, and the second source-drain metal layer 13 is electrically connected to the first source-drain metal layer 12 through a via hole that sequentially penetrates the first planar layer 14 and the passivation layer 15.

[0068] In specific implementation, in the above display panel provided by the embodiment of the present invention, as Figure 2 、 Figure 5 and Figure 8 As shown, it also includes: a third flat layer 37 located on the side of the second electrode layer 24 away from the base substrate 11, a black matrix layer 38 and a color filter layer 39 (R, G, B color filter) located on the side of the third flat layer 37 away from the base substrate 11, and a fourth flat layer 40 located on the side of the black matrix layer 38 and the color filter layer 39 away from the base substrate 11.

[0069] In specific implementation, the inorganic material in the embodiment of the present invention may be silicon nitride, silicon oxide, etc., and the organic material may be resin, etc.

[0070] In specific implementation, the display panel provided by the embodiment of the present invention may further include other functional film layers well known to those skilled in the art, which will not be described in detail here.

[0071] Based on the same inventive concept, an embodiment of the present invention further provides a display device, including the display panel provided in the embodiment of the present invention. The implementation of the display device can refer to the embodiment of the display panel, and the repeated parts will not be repeated.

[0072] In specific implementation, in the above display device provided by the embodiment of the present invention, if Figure 12 As shown, it also includes: a signal line (not shown), a driver chip 100 (driver chip) and a flexible circuit board 110 (flexible circuit board), the driver chip 100 and Figure 1 The binding terminal 3 is crimped, and the flexible circuit board 110 is connected to Figure 1The binding terminal 3 in the display is crimped, and the flexible circuit board 110 is connected to the driving chip 100, one end of the signal line is electrically connected to the display area AA, and the other end of the signal line is electrically connected to the driving chip 100 to achieve signal transmission.

[0073] It should be noted that the embodiment of the present invention is described by taking the COP binding method as an example, but is certainly not limited thereto, and may also be a COF (Chip On Film, where the chip is directly fixed on a flexible circuit board) binding method, etc.

[0074] In specific implementation, the display device provided by the embodiment of the present invention may further include other functional film layers well known to those skilled in the art, which will not be described in detail here.

[0075] The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or the like.

[0076] The present invention discloses a display panel and a display device. By setting at least one of the insulating layers included in the touch structure to be an organic material, the bending performance of the flexible folding display screen can be improved. In addition, the insulating layer made of organic material is set so that the orthographic projection on the display substrate and the orthographic projection of the binding area on the display substrate do not overlap. In this way, the step difference of the binding terminal in the binding area can be reduced, avoiding the problem of poor crimping when the binding terminal is crimped with the driver chip and the flexible circuit board.

[0077] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A display panel, characterized in that: include: A display substrate, the display substrate having a display area and a non-display area, the non-display area including a binding area; the display substrate comprising: a base substrate, a first source-drain metal layer located on one side of the base substrate, and a second source-drain metal layer located on a side of the first source-drain metal layer away from the base substrate; the display substrate further comprising a plurality of binding terminals arranged on the base substrate and arranged in the binding area, the binding terminals comprising: a first conductive layer, a second conductive layer located on a side of the first conductive layer away from the base substrate, a third conductive layer located on a side of the second conductive layer away from the base substrate, and a fourth conductive layer located between the second conductive layer and the third conductive layer; the first conductive layer and the first source-drain metal layer are arranged in the same layer, the second conductive layer and the second source-drain metal layer are arranged in the same layer; the fourth conductive layer covers a middle area of ​​the binding terminal; A touch structure includes: a first insulating layer located on the display substrate, a first electrode layer located on a side of the first insulating layer away from the display substrate, a second insulating layer located on a side of the first electrode layer away from the display substrate, and a second electrode layer located on a side of the second insulating layer away from the display substrate; wherein the fourth conductive layer is arranged on the same layer as the first electrode layer, and the third conductive layer is arranged on the same layer as the second electrode layer; at least one of the first insulating layer and the second insulating layer is made of an organic material, and the orthographic projection of the insulating layer made of the organic material on the display substrate does not overlap with the orthographic projection of the binding area on the display substrate.

2. The display panel according to claim 1, wherein The first insulating layer has a first through hole at a position corresponding to the binding terminal, and the orthographic projection of the first through hole on the base substrate is located within the range of the orthographic projection of the binding terminal on the base substrate; the orthographic projection of the second insulating layer on the base substrate does not overlap with the orthographic projection of the binding area on the base substrate.

3. The display panel according to claim 2, wherein: The material of the first insulating layer is an inorganic material, and the material of the second insulating layer is an organic material.

4. The display panel according to claim 1, wherein: The orthographic projection of the first insulating layer on the base substrate does not overlap with the orthographic projection of the binding area on the base substrate. The second insulating layer has a second through hole at a position corresponding to the binding terminal. The orthographic projection of the second through hole on the base substrate is within the range of the orthographic projection of the binding terminal on the base substrate.

5. The display panel according to claim 4, wherein: The material of the first insulating layer is an organic material, and the material of the second insulating layer is an inorganic material.

6. The display panel according to claim 1, wherein: The orthographic projections of the first insulating layer and the second insulating layer on the base substrate do not overlap with the orthographic projection of the binding area on the base substrate.

7. The display panel according to claim 6, wherein: The first insulating layer and the second insulating layer are both made of organic materials.

8. The display panel according to any one of claims 1 to 7, wherein: The display panel further includes: a first planarization layer located between the first source / drain metal layer and the second source / drain metal layer, a passivation layer located between the first source / drain metal layer and the first planarization layer, a second planarization layer located between the second source / drain metal layer and the first insulating layer, a pixel definition layer located between the second planarization layer and the first insulating layer, and a spacer layer located between the pixel definition layer and the first insulating layer; wherein, The orthographic projections of the first flat layer, the pixel defining layer and the spacer layer on the base substrate do not overlap with the orthographic projection of the binding area on the base substrate; the passivation layer has a third through hole at a position corresponding to the binding terminal, and the orthographic projection of the third through hole on the base substrate is within the range of the orthographic projection of the binding terminal on the base substrate; the second flat layer has a fourth through hole at a position corresponding to the binding terminal, and the orthographic projection of the fourth through hole on the base substrate is within the range of the orthographic projection of the binding terminal on the base substrate.

9. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 8.

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