Installation device and installation method

Abstract

The present invention provides an installation device and an installation method. The present invention includes: a substrate carrier for mounting a substrate; a carrier moving mechanism for moving the substrate carrier; a first detection unit for detecting the position of the electronic component before installation and the position of the predetermined installation area of ​​the substrate at the installation position where the electronic component is installed on the substrate; a bonding head for aligning the position of the electronic component with the position of the predetermined installation area of ​​the substrate at the installation position and installing it on the substrate; a second detection unit for detecting the electronic component after installation at a check position isolated from the installation position; and a control device, the control device including an offset detection unit for detecting the position offset between the position of the predetermined installation area of ​​the substrate on which the electronic component is installed and the position of the electronic component detected by the second detection unit based on the position of the predetermined installation area of ​​the substrate detected by the first detection unit.

Description

Technical Field

[0001] The invention relates to an installation device and an installation method for electronic components. Background Art

[0002] The mounting of electronic components on a substrate is performed by, for example, flip chip mounting. Flip chip mounting is a method of mounting a semiconductor chip or other electronic component with its surface having electrodes formed thereon facing a substrate having a conductive pattern formed thereon. In flip chip mounting, it is necessary to directly bond the fine electrodes of the electronic component to the fine terminals of the conductive pattern formed on the substrate, so the electronic component and the substrate must be positioned with high precision.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 10-125728 Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] In recent years, due to the miniaturization and high density of the circuits of electronic parts such as semiconductor chips, the mounting accuracy has been continuously improved. Therefore, after the electronic parts are mounted, the alignment marks set on the electronic parts and the substrate are photographed by the camera unit, and the positional deviation between the mounted electronic parts and the substrate is checked. For example, an infrared camera is used to photograph the alignment marks set on the lower surface of the substrate side of the electronic parts and the alignment marks set on the upper surface of the substrate through the electronic parts, thereby detecting the position of the electronic parts and the position of the substrate.

[0008] However, since the alignment mark of the substrate located below the electronic component overlaps with the alignment mark of the electronic component or the wiring pattern and cannot be photographed, or the photographed image becomes unclear, the position of the substrate cannot be detected. In this case, the positional offset between the electronic component and the substrate after installation cannot be determined, and it is impossible to check whether the product is within the allowable range. In addition, the positional offset for correcting the position during installation cannot be obtained.

[0009] The present invention is made to solve the above-mentioned problems, and its purpose is to provide a mounting device and a mounting method, which can detect the positional deviation between electronic components and substrates even when the position of the substrate after mounting cannot be detected, and can detect the positional deviation amount used to correct the position during mounting.

[0010] [Technical means to solve the problem]

[0011] The present invention is an installation device for installing electronic components on a substrate, comprising: a substrate carrier for carrying the substrate; a carrier moving mechanism for moving the substrate carrier; a first detection unit for detecting the position of the electronic component before installation and the position of the predetermined installation area of ​​the substrate at the installation position of the substrate carried by the substrate carrier; a bonding head for aligning the position of the electronic component with the position of the predetermined installation area of ​​the substrate at the installation position and installing it on the substrate; a second detection unit for detecting the position of the electronic component after the installation at an inspection position isolated from the installation position; and a control device, wherein the control device comprises an offset detection unit for detecting the position offset between the position of the predetermined installation area of ​​the substrate on which the electronic component is installed and the position of the electronic component detected by the second detection unit based on the position of the predetermined installation area of ​​the substrate detected by the first detection unit.

[0012] In addition, the present invention is an installation method for installing an electronic component on a substrate, which includes: a first detection process, in which a first detection unit detects the position of the electronic component before installation and the position of the predetermined installation area of ​​the substrate when the electronic component is installed on the installation position of the substrate; an installation process, in which a bonding head aligns the position of the electronic component with the position of the predetermined installation area of ​​the substrate based on a result of the first detection process at the installation position and installs it on the substrate; a second detection process, in which a second detection unit detects the position of the electronic component after the installation at an inspection position isolated from the installation position; and an offset detection process, in which an offset detection unit detects the position offset between the position of the predetermined installation area of ​​the substrate on which the electronic component is installed and the position of the electronic component detected by the second detection process based on the position of the predetermined installation area of ​​the substrate detected by the first detection process.

[0013] [Effects of the Invention]

[0014] According to the present invention, a mounting device and a mounting method can be obtained, which can detect the positional deviation between an electronic component and a substrate even when the position of the substrate after mounting cannot be detected, and can detect the positional deviation amount for correcting the position during mounting. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a plan view showing an electronic component mounting system to which the mounting device according to the embodiment is applied.

[0016] Figure 2 This is a front view showing an electronic component mounting system to which the mounting device according to the embodiment is applied.

[0017] Figure 3 yes Figure 2 AA cross-sectional view of FIG. 1 , which is a diagram showing a situation in which the imaging unit enters between the bonding head and the substrate stage in order to capture images of the electronic component and the scheduled mounting area on the substrate.

[0018] Figure 4 yes Figure 2 AA cross-sectional view of , which is a diagram showing a state where an electronic component held by a bonding head is mounted on a substrate.

[0019] Figure 5 It is a functional block diagram of the control device.

[0020] Figure 6 It is a diagram showing the amount of movement from the mounting position to the inspection position.

[0021] Figure 7 It is a diagram showing the movement error from the mounting position to the inspection position.

[0022] Figure 8 This is a diagram showing a state where electronic components are mounted face down on a substrate.

[0023] Fig. 9 (A) is a diagram showing an alignment mark of an electronic component. Fig. 9 (B) is a diagram showing an alignment mark in a planned mounting area of ​​a substrate.

[0024] Fig.10 (A) is a diagram showing a state in which an alignment mark of an electronic component is aligned with an alignment mark of a planned mounting area of ​​a substrate, Fig.10 (B) is a diagram showing a state in which the alignment mark in the planned mounting area of ​​the substrate cannot be recognized.

[0025] Fig.11 This is an example of an operation flow chart of an electronic component mounting system.

[0026] Fig.12 (A)~ Fig.12 (C) is a diagram showing another embodiment of an alignment mark.

[0027] [Explanation of Symbols]

[0028] 1: Electronic parts installation system

[0029] 2: Electronic parts

[0030] 2a, 3a, am: Alignment marks

[0031] 2b: Bump

[0032] 3: Substrate

[0033] 10: Supply device

[0034] 11: Supply stage

[0035] 12: Sheet

[0036] 13: Camera

[0037] 20: Pickup device

[0038] 21: Pickup head

[0039] 21a: Adsorption nozzle

[0040] 22, 32: Head moving mechanism

[0041] 23, 323: Support frame

[0042] 30: Installation

[0043] 31: Joint head

[0044] 31a: Adsorption nozzle

[0045] 33: Substrate carrier

[0046] 34: Stage moving mechanism

[0047] 35: First Detection Department

[0048] 35a, 42a: Camera unit

[0049] 40: Inspection unit

[0050] 42: Second detection unit

[0051] 43: Camera lifting mechanism

[0052] 50: Control device

[0053] 51: Supply device control unit

[0054] 52: Pickup head control unit

[0055] 53: Joint head control unit

[0056] 54: Substrate stage control unit

[0057] 55: Substrate position calculation unit

[0058] 56: Correction value calculation unit

[0059] 57: Lifting mechanism control unit

[0060] 58: Camera control department

[0061] 59a: Offset detection unit

[0062] 59b: Judgment Department

[0063] 321: Sliding mechanism

[0064] 321a: Track

[0065] 321b: Sliding parts

[0066] 322: Lifting mechanism

[0067] A, B: distance

[0068] M: Storage

[0069] P1: Supply position

[0070] P2: Handover position

[0071] P3: Installation location

[0072] P4: Check position

[0073] S01~S15: Steps

[0074] X, Y, Z, θ: directions. DETAILED DESCRIPTION

[0075] Embodiments of the mounting device of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 It is a plan view showing an electronic component mounting system to which the mounting device according to the embodiment is applied. Figure 2 This is a front view showing an electronic component mounting system to which the mounting device according to the embodiment is applied.

[0076] The electronic component mounting system 1 is a system for mounting an electronic component 2 on a substrate 3. The electronic component 2 is, for example, a semiconductor chip made of silicon. In the present embodiment, the electronic component 2 is a semiconductor chip on which a bump as a protruding electrode formed of a solder material is formed. An alignment mark is provided on the electronic component 2. When the electronic component 2 is set to a rectangular shape, the alignment mark is provided at the four corners or diagonal corners of the surface on which the bump is formed.

[0077] The substrate 3 is a plate-like body used as an object for mounting the electronic component 2. A conductive pattern connected to a bump is formed on the substrate 3. A predetermined installation area for mounting the electronic component 2 is provided on the surface of the substrate 3 on which the conductive pattern is formed. There are a plurality of predetermined installation areas provided here, and they are arranged in an array. Alignment marks are provided in the predetermined installation areas, respectively. The alignment marks are provided at the four corners or diagonal corners of the rectangular predetermined installation area when the electronic component 2 is set to a rectangular shape, for example. After the alignment marks of the electronic component 2 and the substrate 3 are aligned, the electronic component 2 is installed in the predetermined installation area of ​​the substrate 3. In this embodiment, by detecting the position of the alignment mark, various positions such as the position of the electronic component 2 before or after installation and the position of the predetermined installation area of ​​the substrate 3 are detected. Aligning the position of the alignment mark means setting the offset of the position of the alignment mark to be compared within a specified range, thereby aligning the position of the electronic component 2 to be installed with the substrate 3.

[0078] (structure)

[0079] The electronic component mounting system 1 includes: a supply device 10, a picking device 20, a mounting device 30, and a control device 50. The picking device 20 picks up the electronic component 2 from the supply device 10, transfers the electronic component 2 to the mounting device 30, and mounts the electronic component 2 on the substrate 3 using the mounting device 30.

[0080] The supply device 10 is a device for supplying electronic components 2. Specifically, the supply device 10 includes a supply stage 11 on which a sheet 12 carrying the electronic components 2 is placed. The supply device 10 moves the supply stage 11 in such a manner that the electronic component 2 as a pickup object comes to the supply position P1. The so-called supply position P1 is a predetermined position where the electronic component 2 as a pickup object picked up by the pickup device 20 is picked up by the pickup device 20. For example, a camera 13 is provided above the supply position P1 in such a manner that the optical axis coincides with the supply position P1, and the supply device 10 moves the supply stage 11 in such a manner that the electronic component 2 as a pickup object comes to the shooting center of the camera 13.

[0081] The sheet 12 loaded with the electronic components 2 placed on the supply stage 11 is a wafer sheet in this case. The sheet 12 is an adhesive sheet, and the electronic components 2 are arranged in a matrix on the sheet 12. The electronic components 2 can be arranged with the surface exposed at the top facing up, or with the surface contacting the bumps with the sheet 12 facing down. In this embodiment, the electronic components are arranged with the surface facing up.

[0082] When supplying the electronic component 2 to the pickup device 20 , the supply device 10 may also push the electronic component 2 on the supply position P1 upward through the sheet 12 by using a block or needle-shaped pin provided below the supply position P1 , thereby easily peeling the electronic component 2 from the sheet 12 .

[0083] The pickup device 20 is a relay device that picks up the electronic component 2 from the supply device 10 and delivers the picked-up electronic component 2 to the mounting device 30. The pickup device 20 includes a pickup head 21 and a head moving mechanism 22. The pickup head 21 holds the electronic component 2, and releases the electronic component 2 by releasing the holding state. Specifically, the pickup head 21 has a cylindrical adsorption nozzle 21a. The interior of the adsorption nozzle 21a is connected to a negative pressure generating circuit such as a vacuum pump, and the electronic component 2 is adsorbed by the opening at the front end of the adsorption nozzle 21a by generating negative pressure in the circuit, thereby holding the electronic component 2. In addition, the electronic component 2 is detached from the adsorption nozzle 21a by releasing the negative pressure.

[0084] The head moving mechanism 22 moves the pickup head 21 back and forth between the supply position P1 and the delivery position P2 of the electronic component 2 to the mounting device 30. The head moving mechanism 22 can use, for example, a ball screw mechanism driven by a servo motor. The head moving mechanism 22 is arranged on the support frame 23 in a manner extending along the X-axis direction described later. A suction nozzle 21a is provided in the head moving mechanism 22 via a reversing mechanism. The reversing mechanism reverses the direction of the suction nozzle 21a. When the head moving mechanism 22 uses the suction nozzle 21a with the opening end facing downward to adsorb and hold the electronic component 2 at the supply position P1, the head moving mechanism 22 positions the suction nozzle 21a at the delivery position P2. In addition, the head moving mechanism 22 uses the reversing mechanism to rotate the suction nozzle 21a 180° in a manner that the opening end of the electronic component 2 is facing upward, thereby reversing the electronic component 2. Then, the reversed electronic component 2 is delivered to the mounting device 30.

[0085] In the present embodiment, the supply device 10 and the mounting device 30 are arranged in a horizontal arrangement. The arrangement direction of the supply device 10 and the mounting device 30, that is, the straight line direction connecting the supply position P1 and the mounting position P3 is set as the X-axis direction. In addition, on the horizontal plane where the supply carrier 11 extends, the direction perpendicular to the X-axis direction is set as the Y-axis direction, and the direction perpendicular to the X-axis and the Y-axis is set as the Z-axis direction. In this specification, the position in the Z-axis direction is sometimes referred to as "height". For example, a specific reference position can be determined, such as the position in the Z-axis direction of a specific position on the substrate carrier 33 described later, and the distance in the Z-axis direction relative to the reference position is set as the height. Furthermore, the rotation direction on the XY plane centered on the Z-axis is set as the θ direction.

[0086] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate 3. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate 3, and is set at a fixed location.

[0087] The mounting device 30 includes a bonding head 31 , a head moving mechanism 32 , a substrate stage 33 , a stage moving mechanism 34 , a first detection unit 35 , and an inspection unit 40 .

[0088] At the mounting position P3, the bonding head 31 aligns the position of the electronic component 2 with the position of the mounting planned area of ​​the substrate 3 based on the detection result of the first detection unit 35 described later, and mounts the electronic component 2 on the substrate 3. Specifically, the bonding head 31 receives the electronic component 2 from the pickup device 20 at the delivery position P2, and mounts the electronic component 2 on the substrate 3 at the mounting position P3. The bonding head 31 holds the electronic component 2, and releases the electronic component 2 by releasing the holding state after mounting. Specifically, the bonding head 31 has a cylindrical adsorption nozzle 31a. The interior of the adsorption nozzle 31a is connected to a negative pressure generating circuit such as a vacuum pump, and by generating negative pressure in the circuit, the electronic component 2 is adsorbed by the opening at the front end of the adsorption nozzle 31a, thereby holding the electronic component 2. In addition, the electronic component 2 is detached from the adsorption nozzle 31a by releasing the negative pressure.

[0089] The bonding head 31 reciprocates between the delivery position P2 and the mounting position P3 and is moved up and down at the delivery position P2 and the mounting position P3 by the head moving mechanism 32 . In other words, the head moving mechanism 32 includes a slide mechanism 321 and a lifting mechanism 322 .

[0090] The sliding mechanism 321 moves the bonding head 31 linearly between the handover position P2 and the mounting position P3. Here, the sliding mechanism 321 includes: two rails 321a extending parallel to the X-axis direction and fixed to the support frame 323; and a slider 321b moving on the rails 321a. Furthermore, although not shown, the sliding mechanism 321 includes a sliding mechanism that slides the bonding head 31 in the Y-axis direction. The sliding mechanism may also include a rail in the Y-axis direction and a slider running on the rail. When the sliding mechanism 321 moves the adsorption nozzle 31a of the bonding head 31 to the handover position P2, the adsorption nozzle 31a faces the adsorption nozzle 21a of the pickup head 21 located at the handover position P2 across the electronic component 2. When the sliding mechanism 321 moves the adsorption nozzle 31a holding the electronic component 2 to the mounting position P3, the adsorption nozzle 31a faces the predetermined mounting area on the substrate 3 positioned at the mounting position P3 across the electronic component 2.

[0091] The lifting mechanism 322 lifts the bonding head 31. Here, the lifting direction is a direction parallel to the Z-axis direction. Specifically, the lifting mechanism 322 can use a ball screw mechanism driven by a servo motor. That is, the bonding head 31 is lifted and lowered along the Z-axis direction by the drive of the servo motor.

[0092] The substrate stage 33 is a stage on which the substrate 3 is placed. The substrate stage 33 slides on the XY plane. In addition, the substrate stage 33 rotates in the θ direction on the XY plane.

[0093] The stage moving mechanism 34 slides the substrate stage 33 on the XY plane. Specifically, the stage moving mechanism 34 includes an X-axis moving mechanism that moves the substrate stage 33 in the X-axis direction, a Y-axis moving mechanism that moves the substrate stage 33 in the Y-axis direction, and a rotation mechanism that rotates the substrate stage 33 in the θ direction.

[0094] The X-axis moving mechanism and the Y-axis moving mechanism include, for example, a servo motor and a ball screw mechanism, and the ball screw mechanism is composed of a screw shaft, a nut, a guide rail, and a sliding member. The X-axis moving mechanism is arranged in such a way that its screw shaft and the guide rail extend in the X-axis direction, and the nut is screwed with the screw shaft. The substrate carrier 33 is fixed to the nut via a sliding member, and the screw shaft is rotated by the servo motor, and the sliding member moves along the guide rail extending in the X-axis direction, and the substrate carrier 33 moves linearly in the X-axis direction. The Y-axis moving mechanism is arranged in such a way that its screw shaft and the guide rail extend in the Y-axis direction, and the nut is screwed with the screw shaft. The X-axis moving mechanism is fixed to the nut via a sliding member, and the screw shaft is rotated by the servo motor, and the sliding member moves along the guide rail extending in the Y-axis direction, and the substrate carrier 33 moves linearly in the Y-axis direction together with the X-axis moving mechanism.

[0095] The rotation mechanism includes, for example, a servo motor, a rotation shaft, and a transmission mechanism. The power of the servo motor is transmitted to the rotation shaft by the transmission mechanism using gears or belts, thereby rotating the substrate stage 33 .

[0096] The first detection unit 35 detects the position of the electronic component 2 before mounting and the position of the mounting area of ​​the substrate 3 at the mounting position P3. The first detection unit 35 of the present embodiment includes a camera unit 35a that captures the alignment mark of the electronic component 2 and the alignment mark of the mounting area of ​​the substrate 3 at the mounting position P3, and extracts the specified position of the alignment mark from the image captured by the camera unit 35a, for example, extracts the outer shape from the recognized contour of the alignment mark, and detects its center of gravity, corners, and other points. The detection of the specified position can be performed by the circuit included in the camera unit 35a, or by the control device 50 described later. When the control device 50 performs the detection, the control device 50 assumes part of the function of the first detection unit 35.

[0097] The camera unit 35a is a camera with two fields of view, upper and lower. Figure 3 As shown, the camera unit 35a enters between the bonding head 31 and the substrate stage 33, and photographs the alignment mark of the electronic component 2 held by the upper adsorption nozzle 31a and the alignment mark of the mounting area located at the mounting position P3 on the lower substrate 3. Figure 3 As shown, the camera unit 35a enters between the bonding head 31 and the substrate stage 33 before the electronic component 2 is mounted on the substrate 3. When mounting is performed using the bonding head 31, as shown in FIG. Figure 4 As shown, it retreats to a position where it does not interfere with the bonding head 31.

[0098] The inspection unit 40 inspects the positional deviation between the mounted electronic component 2 and the substrate 3. The inspection unit 40 includes a second inspection unit 42 and a camera lifting mechanism 43 (see Figure 1 , Figure 2 The second detection unit 42 detects the position of the mounted electronic component 2 at the inspection position P4 described later, which is separated from the mounting position P3. The second detection unit 42 of this embodiment also has the function of detecting the position of the mounting planned area of ​​the substrate 3 on which the electronic component 2 is mounted.

[0099] The second detection unit 42 includes a camera unit 42a for capturing images of the mounted electronic component 2 and the substrate 3, and extracts the predetermined position of the alignment mark from the image captured by the camera unit 42a, for example, extracts the outer shape from the contour of the alignment mark to detect its center of gravity, corner, etc. The detection of the predetermined position can be performed by a circuit included in the camera unit 42a, or by a control device 50 described later. In the case where the control device 50 performs the detection, the control device 50 assumes part of the function of the second detection unit 42.

[0100] The imaging unit 42a photographs the alignment marks of the mounted electronic component 2 and the alignment marks of the mounting area of ​​the substrate 3. The imaging unit 42a photographs at least two alignment marks for each electronic component 2. In addition, the imaging unit 42a photographs at least two alignment marks for each mounting area of ​​the substrate 3. The imaging unit 42a may use an infrared (IR) camera. The imaging unit 42a allows infrared rays to pass through the electronic component 2 and photographs the alignment marks of the electronic component 2 and the alignment marks of the mounting area of ​​the substrate 3.

[0101] The second detection unit 42 is set at the inspection position P4. That is, the camera unit 42a is set above the substrate stage 33 in such a way that the optical axis of the camera is consistent with the inspection position P4. The inspection position P4 is a position for inspecting the positional deviation between the electronic component 2 and the substrate 3, that is, the positional deviation between the alignment mark of the mounted electronic component 2 and the alignment mark of the mounting area of ​​the substrate 3 by photographing the mounted electronic component 2 and the mounting area of ​​the substrate 3 using the camera unit 42a. The positional deviation is the positional deviation when each alignment mark of the mounting area of ​​the electronic component 2 and the substrate 3 is projected onto the XY plane. In the present embodiment, the inspection position P4 is a fixed position.

[0102] The camera unit lifting mechanism 43 lifts the camera unit 42a. Here, the lifting direction is a direction parallel to the Z-axis direction, that is, a direction of advance and retreat relative to the mounted electronic component 2 located at the inspection position P4. The camera unit lifting mechanism 43 can use a ball screw mechanism driven by a servo motor. That is, the camera unit 42a is lifted and lowered along the Z-axis direction by the drive of the servo motor.

[0103] The camera lifting mechanism 43 focuses to such an extent that the alignment mark of the mounted electronic component 2 or the alignment mark of the mounting area of ​​the substrate 3 can be recognized by the camera 42a. In other words, the camera lifting mechanism 43 adjusts the height of the camera 42a so that the alignment mark of the mounted electronic component 2 or the alignment mark of the mounting area of ​​the substrate 3 as the imaging object is limited to the depth of field of the lens of the camera 42a. The height adjustment is performed by controlling the camera lifting mechanism 43 by the lifting mechanism control unit 57 described later. Depending on the magnification or numerical aperture for obtaining the accuracy of the required position information, the facing distance between the alignment mark of the electronic component 2 mounted on the substrate 3 and the alignment mark of the mounting area of ​​the substrate 3, that is, the separation distance in the height direction, sometimes exceeds the depth of field (for example, 10 μm) of the lens of the camera 42a. Therefore, the camera lifting mechanism 43 switches the height of the camera 42a when photographing the alignment mark of the electronic component 2 and when photographing the alignment mark of the mounting area of ​​the substrate 3.

[0104] The control device 50 controls the start, stop, speed, action timing, etc. of the supply device 10, the pickup device 20, the installation device 30, and the inspection unit 40. The control device 50 can be implemented, for example, by a dedicated electronic circuit or a computer running a specified program. The control device 50 is connected to an input device for inputting instructions or information required by the operator for control, and an output device for confirming the state of the device and outputting it. For example, a jog dial, a mouse, a touch screen, etc. that operates the stage moving mechanism 34 to move the substrate stage 33 to the desired position is an example of an input device. A display device that displays the installation position P3, the inspection position P4, the images captured by the camera unit 35a, the camera unit 42a, the points extracted from the alignment mark, the position offset, etc. on the display screen, and a notification device such as a speaker and a buzzer is an example of an output device.

[0105] Figure 5 is a functional block diagram of the control device 50. Figure 5 As shown, the control device 50 includes: a supply device control unit 51, a picking head control unit 52, a bonding head control unit 53, a substrate stage control unit 54, a substrate position calculation unit 55, a correction value calculation unit 56, a lifting mechanism control unit 57, a camera unit control unit 58, an offset detection unit 59a, a determination unit 59b and a storage unit M.

[0106] The supply device control unit 51 controls the movement of the supply stage 11 so that the electronic component 2 as a supply target placed on the sheet 12 on the supply stage 11 is located at the supply position P1.

[0107] The pickup head control unit 52 controls the operation of the pickup device 20. Specifically, the pickup head control unit 52 controls the negative pressure generating circuit connected to the adsorption nozzle 21a, and controls the holding and release of the electronic component 2. In addition, the pickup head control unit 52 controls the movement of the pickup head 21, that is, the operation of the head moving mechanism 22.

[0108] The bonding head control unit 53 controls the movement of the bonding head 31 , that is, the operation of the head moving mechanism 32 . The substrate stage control unit 54 controls the operation of the stage moving mechanism 34 .

[0109] The substrate position calculation unit 55 calculates the position of the scheduled mounting area of ​​the substrate 3 when it moves from the mounting position P3 to the inspection position P4. The movement amount in this case is as follows: Figure 6As shown, theoretically, it becomes the distance A in the X direction and the distance B in the Y direction from the fixed mounting position P3 to the fixed inspection position P4. Therefore, in the coordinate system for controlling the movement of the stage moving mechanism 34, the coordinates (X, Y) obtained by adding the distance A and the distance B to the coordinates (X+A, Y+B) when the alignment mark am of each scheduled mounting area of ​​the substrate 3 is aligned with the fixed mounting position P3 become the coordinates (X', Y') when the alignment mark am of each scheduled mounting area is moved to the inspection position P4.

[0110] However, in the movement of the substrate stage 33 using the stage moving mechanism 34, there is a movement error caused by the mechanism part. That is, the stage moving mechanism 34 includes, for example, a guide rail along the X-axis direction and a guide rail along the Y-axis direction. Such a guide rail sometimes has fluctuations and strains caused by processing accuracy or assembly accuracy. Therefore, even if the movement distance of the coordinate system used to move the stage moving mechanism 34 is set to the theoretical distance A and distance B to move the substrate stage 33, the actual moved position is as follows. Figure 7 As shown in FIG. 1 , the alignment mark am of each predetermined installation area is offset from the inspection position P4 due to the movement error. The movement error includes not only the error of the movement distance in the X direction and the error of the movement distance in the Y direction, but also the error of the rotation direction on the XY plane, that is, the angle in the θ direction. That is, even if the alignment mark am of each predetermined installation area is moved by a distance A in the X direction and a distance B in the Y direction from the coordinates (X, Y) when the alignment mark am of each predetermined installation area is aligned with the installation position P3, the alignment mark am of each predetermined installation area is offset from the coordinates (X', Y') of the inspection position P4 due to the movement errors in the X direction, the Y direction and the θ direction.

[0111] In order to cope with this situation, the present embodiment includes a correction value calculation unit 56. The correction value calculation unit 56 calculates a correction value for the substrate position calculation unit 55 to calculate the position of the scheduled mounting area when it moves from the mounting position P3 to the inspection position P4. The correction value is the movement amount corrected for the movement errors in the X direction, the Y direction, and the θ direction. The substrate position calculation unit 55 calculates the position of each scheduled mounting area when it moves from the mounting position P3 to the inspection position P4 based on the correction value calculated by the correction value calculation unit 56.

[0112] For example, the correction value calculation unit 56 detects the coordinates when the substrate stage 33 is moved in advance to align each scheduled mounting area of ​​the substrate 3 with the mounting position P3. Furthermore, the correction value calculation unit 56 detects the coordinates when the substrate stage 33 is moved to align each scheduled mounting area with the inspection position P4, and calculates each movement distance in the X direction and the Y direction between the two coordinates. At this time, each movement distance includes not only the movement error in the X direction and the Y direction, but also in the θ direction.

[0113] More specifically, the following method is used, using a display device that displays images captured by the camera unit 35a and the camera unit 42a, an input device that operates the stage moving mechanism 34, and a calibration glass that is given marks corresponding to each scheduled installation area of ​​the substrate 3. That is, each coordinate when the calibration glass is placed on the substrate stage 33 and each mark displayed on the display device by the camera unit 35a is aligned with the installation position P3 by operating the input device is detected. Furthermore, each coordinate when the calibration glass is moved by the operation input device and each mark displayed on the display device by the camera unit 42a is aligned with the inspection position P4 is detected. Each movement amount in the X direction and the Y direction between the coordinates detected for each mark is calculated, and these movement amounts are used as correction values ​​when each scheduled installation area is moved from the installation position P3 to the inspection position P4.

[0114] Furthermore, the correction value calculation unit 56 preferably prepares in advance the correction values ​​when moving from the installation position P3 to the inspection position P4 for all the scheduled installation areas. However, it is not necessary to calculate the movement amount (X direction, Y direction) for all the scheduled installation areas in the above sequence. For example, one of the scheduled installation areas in the specified area of ​​the substrate 3 is used as the reference position (the representative point, the representative position of the above area), and the movement amount (X direction, Y direction) with respect to the reference position is calculated. Moreover, with respect to other scheduled installation areas in the above area, the movement amount (X direction, Y direction) is calculated based on the relative position with respect to the reference position. Thus, the correction value of the position of each scheduled installation area can be calculated. Therefore, the mark of the calibration glass does not necessarily need to correspond to each scheduled installation area, and can also be set at a position representing a specified area.

[0115] In addition, the correction value calculation unit 56 preferably calculates the correction value at a predetermined timing. That is, it is preferred that the correction value calculated temporarily is not used continuously and fixedly as the mounting device 30 is operated, but that the correction value is calculated and updated at a predetermined timing. For example, it is conceivable to update the correction value by calculating each time a predetermined time has passed since the start of the operation, calculating each time an unacceptable positional deviation occurs, or calculating each time the frequency of unacceptable positional deviation within a predetermined time reaches a threshold.

[0116] The lifting mechanism control unit 57 is a control unit that controls the camera lifting mechanism 43. For example, the lifting mechanism control unit 57 adjusts the height of the camera 42a by controlling the camera lifting mechanism 43. The camera control unit 58 controls the operation of the camera 42a. For example, it controls the start, stop, shooting, and shooting timing of the camera 42a.

[0117] The displacement detection unit 59a detects the position displacement between the position of the mounting area of ​​the substrate 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection unit 42, based on the position of the mounting area of ​​the substrate 3 detected by the first detection unit 35. When the second detection unit 42 can detect the position of the mounting area of ​​the substrate 3 on which the electronic component 2 is mounted, the displacement detection unit 59a of the present embodiment detects the position displacement based on the position detected by the second detection unit 42. When the second detection unit 42 cannot detect the position of the mounting area of ​​the substrate 3 on which the electronic component 2 is mounted, the position displacement is detected based on the position of the mounting area of ​​the substrate 3 detected by the first detection unit 35 and the position of the electronic component 2 detected by the second detection unit 42.

[0118] The determination unit 59b determines the positional deviation between the mounting planned area of ​​the substrate 3 on which the electronic component 2 is mounted and the electronic component 2 detected by the second detection unit 42, based on the positional deviation amount detected by the deviation amount detection unit 59a. The determination unit 59b determines whether the detected positional deviation amount is within the allowable range, and determines that there is no positional deviation if the positional deviation amount is within the allowable range, and determines that there is positional deviation if the positional deviation amount is outside the allowable range.

[0119] More specifically, when the image of the alignment mark of the electronic component 2 and the image of the alignment mark of the mounting area of ​​the substrate 3 can be identified from the image captured by the imaging unit 42a, the displacement detection unit 59a detects the position displacement of the predetermined positions of the two alignment marks based on the recognition result. When the image of the alignment mark of the mounting area of ​​the substrate 3 cannot be recognized in a correct shape because it overlaps with the alignment mark of the electronic component 2, the wiring pattern, etc., the displacement detection unit 59a detects the position displacement based on the predetermined position of the image of the alignment mark of the mounting area of ​​the substrate 3 captured by the imaging unit 35a and the predetermined position of the image of the alignment mark of the electronic component 2 obtained by the imaging unit 42a.

[0120] As described above, the determination of the positional deviation by the determination unit 59b is performed based on whether the deviation amount of the predetermined position of the alignment mark detected by the deviation amount detection unit 59a is within the predetermined range (permissible range). When the image of the alignment mark of the scheduled mounting area of ​​the substrate 3 obtained based on the imaging result of the imaging unit 35a is used, the predetermined position of the alignment mark of the scheduled mounting area of ​​the substrate 3 is converted to the position when moving from the mounting position P3 to the inspection position P4, that is, the position calculated by the substrate position calculation unit 55 based on the correction value calculated by the correction value calculation unit 56.

[0121] In this embodiment, if Figure 8As shown in the figure, an example of an electronic component 2 being mounted face down on a substrate 3 is used for explanation. The alignment mark 2a of the electronic component 2 is provided on the surface provided with the bump 2b, and is facing the substrate 3 by face-down mounting. The alignment mark 3a of the predetermined mounting area of ​​the substrate 3 is provided on the surface opposite to the substrate stage 33, that is, the surface on which the electronic component 2 is mounted. By face-down mounting, the electronic component 2 and the predetermined mounting area of ​​the substrate 3 provided with the alignment mark 2a and the alignment mark 3a come to a position where they overlap in the Z-axis direction. Furthermore, in the figure, the double-dotted chain line is an imaginary line when the substrate 3 is cut and divided according to each electronic component 2.

[0122] Fig. 9 (A) is an example of an alignment mark 2a of an electronic component 2. Fig. 9 (B) is an example of an alignment mark 3a of a predetermined mounting area of ​​a substrate 3. Alignment mark 2a is an example including a triangle and 20 quadrilaterals arranged around it. Alignment mark 3a is an example including a triangle. Furthermore, in the figure, the double-dotted line is an imaginary line when the substrate 3 is cut and divided according to each electronic component 2, and corresponds to a predetermined mounting area of ​​the substrate 3. Fig.10 (A) is a diagram showing a state in which the alignment mark 2a of the electronic component 2 and the alignment mark 3a of the planned mounting region of the substrate 3 are aligned, that is, positioned almost accurately. Fig.10 (B) is a diagram showing a situation where the alignment mark 2a of the electronic component 2 is offset from the alignment mark 3a of the mounting area of ​​the substrate 3, and the alignment mark 3a of the mounting area of ​​the substrate 3 is hidden by the alignment mark 2a of the electronic component 2 and cannot be identified. Fig.10 (A) Fig.10 In (B), the hatching indicates a state in which the image of the alignment mark 2a is unclear because the imaging unit 42a does not sufficiently focus on the alignment mark 2a of the electronic component 2.

[0123] As a method for determining positional deviation, for example, the deviation amount detection unit 59a calculates the distance between a predetermined position extracted from the recognition result of the image of the alignment mark 2a of the electronic component 2 and a predetermined position extracted from the recognition result of the image of the alignment mark 3a of the predetermined mounting area of ​​the substrate 3. If the calculated distance is within a predetermined threshold value (allowable range), the determination unit 59b determines that the mounting is well aligned, and if the calculated distance exceeds the predetermined threshold value (allowable range), the determination unit 59b determines that the mounting is poorly aligned. In the case of poor alignment, the operator is notified by a notification device such as a display device or a speaker connected to the control device 50. Furthermore, in the case of poor alignment, it is conceivable to stop the mounting device 30. However, in the case of poor alignment, it is also possible to record the determination result without stopping. For example, it is also possible to stop when the number of poor alignments reaches a predetermined number or when it is continuous for a predetermined number of times. In addition, in the case of poor detection caused by dust on the electronic component 2 or the substrate 3, it is also possible to continue to operate.

[0124] The storage unit M is, for example, a magnetic or electronic recording medium such as a hard disk drive (HDD) or a solid state drive (SSD). In the storage unit M, data and programs required for the operation of the system are pre-stored, and data required for the operation of the system are stored. For example, the storage unit M stores the position of the electronic component 2 and the predetermined installation area of ​​the substrate 3 before installation detected by the first detection unit 35, the position of the electronic component 2 after installation, and the position of the predetermined installation area of ​​the substrate 3 on which the electronic component 2 is installed detected by the second detection unit 42. In addition, the storage unit M also stores the position of the predetermined installation area of ​​the substrate 3 calculated by the substrate position calculation unit 55 and the correction value calculated by the correction value calculation unit 56. Furthermore, the storage unit M also stores the allowable range of the position offset, the position offset, and the judgment result of the position offset.

[0125] (effect)

[0126] The functions of the electronic component mounting system 1 and the mounting device 30 of the embodiment will be described. Furthermore, a mounting method for mounting electronic components according to the processing sequence shown below is also an embodiment of the present invention. Fig.11 This is an example of an operation flow chart of the electronic component mounting system 1. A sheet 12 on which electronic components 2 are arranged in an array is placed in advance on the supply stage 11, and a substrate 3 to be mounted with the electronic components 2 is placed in advance on the substrate stage 33. In addition, it is assumed that the electronic components 2 on the sheet 12 are placed face-up with the bumps 2b facing upward.

[0127] First, the supply device 10 moves the electronic component 2 as the supply object among the multiple electronic components 2 on the sheet 12 and supplied to the mounting device 30 to the supply position P1 (step S01). The head moving mechanism 22 moves the pickup head 21 to the supply position P1, picks up the electronic component 2 at the supply position P1 (step S02), and delivers the electronic component 2 to the bonding head 31 at the handover position P2 (step S03). That is, the pickup head 21 moves to the handover position P2, and the picked-up electronic component 2 is reversed 180° by the reversing device. As a result, the bonding head 31 faces the electronic component 2 and delivers it. As a result, the electronic component 2 is held on the bonding head 31 with the alignment mark 2a facing downward.

[0128] The bonding head 31 is moved to the mounting position P3 by the slide mechanism 321 (step S04). Meanwhile, the substrate stage 33 is moved by the stage moving mechanism 34 to move the currently mounted scheduled area of ​​the substrate 3 to the mounting position P3 (step S05).

[0129] In this way, after the electronic component 2 and the installation area of ​​the substrate 3 are moved to the installation position P3, the camera unit 35a, which is a camera with two upper and lower fields of view, is moved in and out between the bonding head 31 and the substrate 3 to capture the alignment mark 2a of the electronic component 2 located above and the alignment mark 3a of the installation area of ​​the substrate 3 located below, and the positions of the electronic component 2 and the installation area of ​​the substrate 3 are detected (step S06). The bonding head 31 performs alignment of the electronic component 2 and the installation area of ​​the substrate 3 (step S07).

[0130] After alignment, the bonding head 31 is lowered by the lifting mechanism 322 to make the electronic component 2 contact the predetermined mounting area of ​​the substrate 3 for mounting (step S08). After mounting, the bonding head 31 releases the holding of the electronic component 2 and rises to return to the transfer position P2 to receive the next electronic component 2.

[0131] After the electronic component 2 is mounted on the substrate 3, the electronic component 2 at the mounting position P3 is moved to the inspection position P4 by the stage moving mechanism 34 (step S09). The camera lifting mechanism 43 is controlled by the lifting mechanism control unit 57, and the height of the camera 42a is adjusted to photograph the alignment mark 2a and the alignment mark 3a, thereby detecting the position of the electronic component 2 and the position of the mounting area of ​​the substrate 3 on which the electronic component 2 is mounted (step S10). Furthermore, when the distance between the alignment mark 2a and the alignment mark 3a becomes a distance exceeding the depth of field of the lens, the height adjustment of the camera 42a and the photographing of the alignment mark 2a and the alignment mark 3a are performed separately.

[0132] The photographing of the alignment marks 2a and 3a is preferably performed at two locations for one electronic component 2 and one predetermined installation area of ​​the substrate 3. By identifying the positions of two locations that are separated by a fixed distance, the rotational offset of the object can be identified with higher accuracy. In the case where the electronic component 2 is rectangular, for example, the alignment marks 2a and 3a at the diagonal positions are photographed. For example, from the viewpoint of the camera unit 42a, in order to photograph the alignment mark 2a at the lower left corner, the substrate stage 33 is moved by the stage moving mechanism 34 in such a way that the lower left corner of the electronic component 2 after installation as the object comes to the inspection position P4, the height of the camera unit 42a is adjusted, and the alignment mark 2a is photographed. Moreover, based on the height of the alignment mark 3a that is paired with the alignment mark 2a, the height of the camera unit lifting mechanism 43 is adjusted to photograph the alignment mark 3a.

[0133] Furthermore, in order to photograph the alignment mark 3a located at the upper right corner of the diagonal part, the substrate stage 33 is moved by the stage moving mechanism 34 in such a manner that the upper right corner of the mounted electronic component 2 as the object comes to the inspection position P4. As a result, the alignment mark 3a at the upper right corner is limited to the field of view, and therefore, photographed by the camera unit 42a. Thereafter, in order to photograph the alignment mark 2a at the lower right corner, the height of the camera unit 42a is adjusted by the camera unit lifting mechanism 43 based on the height of the alignment mark 2a, and the alignment mark 2a at the upper right corner is photographed by the camera unit 42a. Furthermore, the alignment mark 2a and the alignment mark 3a at the diagonal part are photographed because the distance between the two points is long and the angle is easy to recognize, thereby reducing the position calculation error. However, the alignment mark 2a and the alignment mark 3a to be photographed are not necessarily the diagonal ones, and the probability of recognition can be increased by setting the alignment mark 2a and the alignment mark 3a at a position where the configuration position is easy to recognize. For example, by placing the alignment mark 3a in the planned mounting area of ​​the substrate 3 at a position that is difficult to hide, it is possible to reduce the number of situations where the alignment mark 3a cannot be recognized.

[0134] Next, when the position of the mounting area of ​​the electronic component 2 and the substrate 3 after mounting can be detected based on the obtained image (YES in step S11), the position shift amount of the mounting area of ​​the electronic component 2 and the substrate 3 after mounting is detected by the shift amount detection unit 59a based on the detected position (step S13), and the position shift is determined by the determination unit 59b (step S14). When the position of the mounting area of ​​the substrate 3 after mounting the electronic component 2 cannot be detected based on the obtained image (NO in step S11), the substrate position calculation unit 55 calculates the position of the mounting area of ​​the substrate 3 when it moves from the mounting position P3 to the inspection position P4 (step S12). Then, based on the detected position of the electronic component 2 and the calculated position of the mounting area of ​​the substrate 3, the position shift amount of the mounting area of ​​the electronic component 2 and the substrate 3 after mounting is detected by the shift amount detection unit 59a (step S13), and the position shift is determined by the determination unit 59b (step S14).

[0135] When it is determined that the positional deviation is within the permissible range, that is, the alignment is good (Yes in step S15), the process returns to step S01 and moves to the installation of the next electronic component 2. Repeat steps S01 to S15, and when there is no electronic component 2 on the supply carrier 11, or when the electronic component 2 is installed in all the predetermined installation areas of the substrate 3, the system is stopped. On the other hand, when the determination unit 59b determines that the positional deviation is within the unpermissible range, that is, the alignment is poor (No in step S15), the operator is notified by the notification component, and the system is stopped and terminated. Furthermore, the supply of electronic components 2 can also be performed in parallel with the detection of the positional deviation amount or the determination of the positional deviation. Therefore, for example, it is not necessarily necessary to return to the process of S01, and it is also possible to return to the process of S05. That is, the processing order is an example, and the present invention is not limited to this. In addition, the camera unit 42a can also be moved to the position of the alignment mark 2a and the alignment mark 3a to take pictures.

[0136] (Effect)

[0137] (1) The present embodiment is a mounting device 30 for mounting an electronic component 2 on a substrate 3, and includes: a substrate stage 33 for mounting the substrate 3; a stage moving mechanism 34 for moving the substrate stage 33; a first detection unit 35 for detecting the position of the electronic component 2 before mounting and the position of the predetermined mounting area of ​​the substrate 3 at a mounting position P3 where the electronic component 2 is mounted on the substrate stage 3; a bonding head 31 for aligning the position of the electronic component 2 with the position of the predetermined mounting area of ​​the substrate 3 at the mounting position P3 and mounting the electronic component 2 on the substrate 3; a second detection unit 42 for detecting the position of the electronic component 2 after mounting at a check position P4 isolated from the mounting position P3; and a control device 50.

[0138] Moreover, the control device 50 includes an offset detection unit 59a, which detects the position offset between the position of the predetermined installation area of ​​the substrate 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection unit 42 based on the position of the predetermined installation area of ​​the substrate 3 detected by the first detection unit 35.

[0139] In addition, the present embodiment is a method for mounting an electronic component 2 on a substrate 3, which includes: a first detection process, in which the first detection unit 35 detects the position of the electronic component 2 before mounting and the position of the predetermined mounting area of ​​the substrate 3 at the mounting position P3 of the substrate 3 placed on the substrate stage 33 moved by the stage moving mechanism 34 when the electronic component 2 is mounted on the substrate stage 33; an installation process, in which the bonding head 31 aligns the position of the electronic component 2 with the position of the predetermined mounting area of ​​the substrate 3 based on the result of the first detection process at the mounting position P3, and mounts the electronic component on the substrate 3; a second detection process, in which the second detection unit 42 detects the position of the electronic component after mounting at the inspection position P4 isolated from the mounting position P3; and an offset detection process, in which the offset detection unit 59a detects the position offset between the position of the predetermined mounting area of ​​the substrate 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection process, based on the position of the predetermined mounting area of ​​the substrate 3 detected by the first detection process.

[0140] Thus, even when the position of the mounting area of ​​the substrate 3 after mounting cannot be detected, the positional deviation between the electronic component 2 and the mounting area of ​​the substrate 3 can be detected. Therefore, the stop time caused by the inability to detect the position of the mounting area of ​​the substrate 3 can be suppressed, and the mounting device 30 with high productivity can be made. In addition, in the state where the electronic component 2 is mounted, even if the position of the mounting area of ​​the substrate 3 cannot be detected, the positional deviation can be detected, so that the mounting device 30 can be made into a wide range of substrates 3 or electronic components 2 that can be mounted.

[0141] (2) The control device 50 includes a substrate position calculation unit 55 that calculates the position of the scheduled mounting area of ​​the substrate 3 when it moves from the mounting position P3 to the inspection position P4, and the displacement detection unit 59a detects the position displacement between the position of the scheduled mounting area of ​​the substrate 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection unit 42 based on the position calculated by the substrate position calculation unit 55. Therefore, the scheduled mounting area of ​​the substrate 3 can be converted to the position when it moves from the mounting position P3 to the inspection position P4, and the position displacement can be detected.

[0142] (3) The control device 50 includes a correction value calculation unit 56 that calculates a correction value used by the substrate position calculation unit 55 to calculate the position of the scheduled mounting area when it moves from the mounting position P3 to the inspection position P4. Therefore, the position of the scheduled mounting area when it moves from the mounting position P3 to the inspection position P4 is calculated using the correction value, so that even if there is a movement error in the stage moving mechanism 34, the positional deviation can be accurately determined.

[0143] (4) The second detection unit 42 has a function of detecting the position of the scheduled installation area of ​​the substrate 3 on which the electronic component 2 is mounted. When the second detection unit 42 can detect the position of the scheduled installation area of ​​the substrate 3 on which the electronic component 2 is mounted, the displacement detection unit 59a detects the position displacement based on the position detected by the second detection unit 42. Therefore, when the position of the scheduled installation area of ​​the substrate 3 can be detected by the second detection unit 42, the position displacement can be detected with relatively good accuracy by determining the position displacement using the position, even without considering the change caused by the movement. When the position of the scheduled installation area of ​​the substrate 3 cannot be detected by the second detection unit 42, the position displacement can be detected by using the position of the scheduled installation area of ​​the substrate 3 at the mounting position P3.

[0144] In addition, since two detection methods can be performed, it is possible to suppress the situation where the position deviation cannot be determined due to the inability to detect the position of the installation predetermined area of ​​the substrate 3, thereby improving the installation accuracy and suppressing the occurrence of defects. In this way, even electronic components 2 or substrates 3 for which it is difficult to detect the position of the installation predetermined area of ​​the substrate 3 can be applied, thereby expanding the application range of electronic components 2 or substrates 3 that can be installed.

[0145] (5) The second detection unit 42 includes an imaging unit 42a, which captures the alignment mark 2a of the electronic component 2 and the alignment mark 3a of the predetermined mounting area of ​​the substrate 3 through the electronic component 2 after installation. Therefore, regardless of the arrangement or form of the alignment mark 2a and the alignment mark 3a of the predetermined mounting area of ​​the electronic component 2 or the substrate 3, the positional deviation can be determined. The degree of freedom in the arrangement of the alignment mark 2a and the alignment mark 3a of the predetermined mounting area of ​​the electronic component 2 or the substrate 3 is improved, thereby expanding the application range of the electronic component 2 or the substrate 3 that can be installed. The area of ​​the non-functional part that should be ensured for the alignment mark 2a and the alignment mark 3a can be reduced, and the area of ​​the functional part of the electronic component 2 or the substrate 3 such as the wiring pattern can be expanded, so that the mounting density of the same area can be increased. Furthermore, the density of the functional part can be increased to make the overall size small.

[0146] (6) The control device 50 includes the determination unit 59b that determines whether the positional deviation is within the allowable range based on the positional deviation detected by the deviation detection unit 59a. Therefore, it is possible to determine whether the mounting is good or not based on the degree of the positional deviation.

[0147] (7) Each time the electronic component 2 is mounted on the substrate 3, the determination unit 59b determines the positional offset. Therefore, since the inspection can be performed in real time each time the installation is performed, compared with the case where all the substrates 3 after the installation are inspected at the same time in a separately provided inspection device, the operation can be interrupted or corrected each time a defect occurs, thereby suppressing the waste of the installed electronic components 2. Furthermore, the number of installation defects can be suppressed to improve the yield rate. Furthermore, the present invention does not necessarily need to determine the positional offset each time the electronic component 2 is mounted on the substrate 3, and the positional offset can also be determined every specified number of installations or at specified time intervals. As a result, the time for determination processing can be saved and productivity can be improved.

[0148] (8) The correction value calculation unit 56 calculates the correction value at a predetermined timing. As the mounting device 30 operates, the movement error may change due to changes in the surrounding temperature, degradation of the mechanism, etc. However, by calculating and updating the movement amount at a predetermined timing, the change in the movement error can be corrected, thereby improving the inspection accuracy.

[0149] (Other embodiments)

[0150] The present invention is not limited to the above-described embodiments, but also includes other embodiments shown below. In addition, the present invention also includes a method of combining all or any one of the above-described embodiments and other embodiments described below. Furthermore, various omissions, substitutions, and changes may be made to these embodiments without departing from the scope of the invention, and such variations are also included in the present invention.

[0151] (1) The correction value calculation unit 56 may also be omitted. When the movement error of the stage moving mechanism 34 is small, the movement amount when moving from the installation position P3 to the inspection position P4 may be set to be fixed. As an example, the substrate position calculation unit 55 may calculate the position of the predetermined installation area of ​​the substrate 3 using the distance (A, B) from the installation position P3 to the inspection position P4 as the movement amount. Thus, there is no need to calculate the correction value in advance. Since there is no time required to calculate the correction value, productivity is improved. The inventor conducted a study and found that the movement range within 100 mm is approximately within 100 mm. Therefore, for example, by setting the installation position P3 and the inspection position P4 within 100 mm, the movement range of the substrate stage 33 can be set within 100 mm, so even if the correction value of the movement of the stage moving mechanism 34 is not calculated, the movement error of the substrate stage 33 can be suppressed. Furthermore, such a setting can be appropriately determined based on the required inspection accuracy and pre-measurement.

[0152] (2) The second detection unit 42 does not necessarily need to detect the position of the predetermined installation area of ​​the substrate 3 on which the electronic component 2 is mounted. That is, the determination unit 59b may always use the position of the predetermined installation area of ​​the substrate 3 detected by the first detection unit 35 at the inspection position P4 to determine the positional deviation. Thus, there is no need to use the second detection unit 42 to detect the position of the predetermined installation area of ​​the substrate 3 on which the electronic component 2 is mounted, thereby improving productivity. Furthermore, it is also possible to select a mode in which either the mode of using the position of the predetermined installation area of ​​the substrate 3 detected by the second detection unit 42 or the mode of using the position of the predetermined installation area of ​​the substrate 3 detected by the first detection unit 35 can be selected. Thus, an arbitrary mode can be selected according to whether to improve the inspection accuracy or to attach importance to productivity, thereby improving the degree of freedom in the operation of the mounting device 30.

[0153] (3) The height variation of the substrate stage 33 when the mounted electronic component 2 located at the mounting position P3 is moved to the inspection position P4 may be detected, and based on the variation, the height at which the imaging unit 42a photographs the alignment mark 2a of the electronic component 2 and the height at which the imaging unit 42a photographs the alignment mark 3a of the scheduled mounting area of ​​the substrate 3 may be changed. Thus, the height of the imaging unit 42a may be limited to within the depth of field of the lens (e.g., 10 μm) to obtain a focused image, thereby improving the detection accuracy of the positional deviation.

[0154] (4) In the above embodiment, the electronic component 2 is mounted face-down on the substrate 3, but the mounting device 30 may also mount the electronic component 2 face-up with the surface on which the electrodes including the bumps 2b are formed facing the side opposite to the substrate 3. In this case, the alignment mark 3a of the mounting area of ​​the substrate 3 cannot be recognized, so the present invention becomes effective.

[0155] (5) The form of the alignment mark 2a and the alignment mark 3a is not limited to the above example. Fig.12 (A) shows a state where the position of the cross-shaped alignment mark 2a is aligned with the square alignment mark 3a arranged at four points. In this case, for example, Fig.12 (B) Fig.12 As shown in (C), the alignment mark 2a overlaps the alignment mark 3a, which may cause the alignment mark 3a to be unrecognizable. Fig.12 In (B), the state where the alignment mark 2a and the alignment mark 3a overlap is also indicated by solid lines.

[0156] (6) The alignment marks 2a and 3a do not need to be provided only for alignment. For example, the electronic component 2, a portion of the substrate 3, a portion of the wiring pattern, etc. may be used as alignment marks. In this case, the alignment mark 3a of the mounting area of ​​the substrate 3 may not be recognized, so the present invention becomes effective.

[0157] (7) In the example described above, the movement amount (X direction, Y direction) is calculated using calibration glass. Thus, the movement amount (X direction, Y direction) can be calculated relatively accurately. However, the movement amount (X direction, Y direction) can be calculated using the substrate 3 before installation instead of the calibration glass. By using the substrate 3 before installation, the movement amount (X direction, Y direction) can be calculated more easily without preparing calibration glass. When the correction value is updated at a specified time, the substrate 3 used during installation is directly used, so there is no need to switch to the operation of calibration glass, etc., thereby suppressing the reduction in productivity.

[0158] (8) In the above example, an example of a process of recording a judgment result when a bad alignment is determined is described. However, the information to be recorded also includes the judgment result when the alignment is determined to be good and the detected position deviation. The control device 50 can, for example, determine the timing of updating the correction value based on the results of monitoring and analyzing the recorded position deviation. Thus, it is possible to update at an appropriate time point, thereby improving the installation accuracy and suppressing the reduction in productivity. In addition, for example, by stopping the work and promoting confirmation based on the results of monitoring and analyzing the position deviation, the occurrence of defects can be prevented. Furthermore, by performing such monitoring and analysis simultaneously with the installation, real-time feedback can be provided to the installation, thereby further improving the yield rate.

Claims

1. A mounting device for mounting an electronic component on a substrate, the mounting device comprising: A substrate carrier, for mounting the substrate; A stage moving mechanism moves the substrate stage; A first detection unit detects the position of the electronic component before mounting and the position of the scheduled mounting area of ​​the substrate before mounting, when mounting the electronic component on the substrate placed on the substrate stage; a bonding head for aligning the position of the electronic component with the position of the predetermined mounting area of ​​the substrate at the mounting position and mounting the electronic component on the substrate; a second detection unit for detecting the position of the electronic component after the mounting at a detection position separated from the mounting position; control device, and The control device includes a displacement detection unit that detects a position displacement between a position of a predetermined mounting area of ​​the substrate on which the electronic component is mounted and a position of the electronic component detected by the second detection unit, based on the position of the predetermined mounting area of ​​the substrate detected by the first detection unit; as well as a substrate position calculation unit that calculates a position of the scheduled mounting area of ​​the substrate when the substrate moves from the mounting position to the inspection position, The displacement amount detection unit detects a position displacement amount between a position of the planned mounting area of ​​the substrate moved to the inspection position after the electronic component is mounted calculated by the substrate position calculation unit and a position of the electronic component detected by the second detection unit at the inspection position.

2. The mounting device according to claim 1, characterized in that: The control device includes a correction value calculation unit, The correction value calculation section calculates a correction value used by the substrate position calculation section to calculate a position of the scheduled mounting area moved from the mounting position to the inspection position.

3. The mounting device according to claim 1 or 2, characterized in that: The second detection unit has a function of detecting the position of the scheduled mounting area of ​​the substrate on which the electronic component is mounted. When the second detection unit is capable of detecting the position of the scheduled mounting region of the substrate on which the electronic component is mounted, the displacement amount detection unit detects the position displacement amount based on the position detected by the second detection unit.

4. The mounting device according to claim 1 or 2, characterized in that: The second detection unit includes an imaging unit that images an alignment mark of the electronic component or an alignment mark of a planned mounting area of ​​the substrate through the electronic component after the mounting.

5. The mounting device according to claim 1 or 2, characterized in that: The control device includes a determination unit that determines whether the positional deviation amount of a positional deviation is within an allowable range based on the positional deviation amount detected by the deviation amount detection unit.

6. The mounting device according to claim 5, characterized in that: The determination unit determines positional deviation every time the electronic component is mounted on the substrate.

7. The mounting device according to claim 2, characterized in that: The correction value calculation unit calculates the correction value at a predetermined timing.

8. A mounting method for mounting an electronic component on a substrate, the mounting method comprising: a first detection process, in which a first detection unit detects the position of the electronic component before mounting and the position of the scheduled mounting area of ​​the substrate before mounting when the electronic component is mounted on the substrate; A mounting process, in which the bonding head aligns the position of the electronic component with the position of the predetermined mounting area of ​​the substrate at the mounting position based on the result of the first detection process, and mounts the electronic component on the substrate; a second detection process, in which a second detection unit detects the position of the electronic component after the mounting at a check position separated from the mounting position; An offset detection process, wherein an offset detection unit detects an amount of positional offset between a position of the predetermined mounting area of ​​the substrate on which the electronic component is mounted and a position of the electronic component detected by the second detection process, based on the position of the predetermined mounting area of ​​the substrate detected by the first detection process; as well as a substrate position calculation process, wherein a substrate position calculation unit calculates a position of the scheduled mounting area of ​​the substrate when the substrate moves from the mounting position to the inspection position; The displacement amount detection process detects a position displacement between a position of the planned mounting area of ​​the substrate moved to the inspection position after the electronic component is mounted calculated by the substrate position calculation process and a position of the electronic component detected by the second detection process at the inspection position.

Images