A spatial position sensor

Abstract

The present invention provides a spatial position sensor for obtaining spatial position information of an object to be detected, comprising a fixed part, a moving part and a control circuit, wherein the fixed part comprises a substrate, the surface of the substrate is perpendicular to a third direction; and a first detection array, the first detection array comprises a plurality of first detection chips, and generates an induced electrical signal based on the position of the moving part relative to the fixed part, wherein; the moving part comprises a first metal guide wire, which is fixedly arranged on the surface of the object to be detected facing the fixed part and is insulated from the object to be detected; the control circuit is electrically connected to the first detection array and the first metal guide wire, and is used to apply a pulse voltage to the first metal guide wire and obtain the induced electrical signal. The spatial position sensor provided by the present invention is a single position sensor that can obtain multi-dimensional position information of an object to be detected, and has the characteristics of simple installation and accurate detection results.

Description

Technical Field

[0001] The present application relates to the field of spatial position detection, and in particular, to a spatial position sensor. Background Art

[0002] At present, in various industrial enterprises, the automated operation of production lines often requires the handling or positioning of workpieces. The use of manipulators can achieve safe operation, improve product quality, increase production efficiency, reduce labor intensity, and avoid manual feeding and inaccurate feeding and picking due to fatigue. Position detection sensors are one of the components of the mobile positioning system of industrial manipulators. Its main function is to detect the specific position of the manipulator actuator in real time and feed back the position information of the manipulator to the control system in real time. The control system compares the feedback position of the manipulator with the given manipulator position, and corrects the position of the manipulator in time to achieve precise positioning. Therefore, position measurement and positioning technology play a key role in the development of manipulators.

[0003] Traditional manipulators use potentiometer displacement sensors, ultrasonic displacement sensors, photoelectric displacement sensors, etc. to measure real-time position of a manipulator. Each of the above sensors has its own advantages in application, but the common disadvantage is that a single sensor can only measure position changes in one dimension and cannot measure position changes in more than two dimensions at the same time. To achieve real-time measurement of position changes in multiple dimensions, a combination of multiple single position sensors is required. The installation structure is complex and the volume is large. In addition, when the sensors are installed in series, multi-axis cumulative errors are easily introduced. Therefore, there is an urgent need for a single position sensor that can obtain multi-dimensional position information of the manipulator, and has the characteristics of simple installation and accurate detection results. Summary of the invention

[0004] The purpose of the present application is to provide a spatial position sensor to solve the problems of complex structure, large volume, and easy accumulation of errors in the multi-dimensional position detection device in the prior art.

[0005] The embodiments of the present application can be implemented through the following technical solutions:

[0006] A spatial position sensor for acquiring spatial position information of an object to be detected, comprising a fixed part, a movable part and a control circuit, wherein the fixed part comprises: a substrate, a surface of the substrate being perpendicular to a third direction; and a first detection array, the first detection array comprising a plurality of first detection chips, the plurality of first detection chips being arranged at equal intervals along a first direction on the surface of the substrate facing the object to be detected, and generating an induced electrical signal based on the position of the movable part relative to the fixed part, wherein the first direction is perpendicular to the third direction; the movable part comprises: a first metal guide wire, fixedly arranged on the surface of the object to be detected facing the fixed part and insulated from the object to be detected; the control circuit is electrically connected to the first detection array and the first metal guide wire, and is used to apply a pulse voltage to the first metal guide wire and acquire the induced electrical signal.

[0007] Furthermore, each of the first detection chips includes a chip substrate and a plurality of first detection plates, and the plurality of first detection plates are arranged on the surface of the chip substrate at equal intervals along the first direction; each of the first detection plates is electrically connected to the control circuit, and the induced electrical signal includes the electrical signal sensed by each of the first detection plates.

[0008] Furthermore, the diameter of the first metal guide wire is smaller than the distance between every two of the first detection plates.

[0009] Furthermore, the first metal guide wire extends along a second direction, wherein the second direction is perpendicular to the first direction and the third direction.

[0010] Furthermore, each of the first detection plates has the same first capacitance with the chip substrate, and the value of the first capacitance is a fixed value; a variable second capacitance is provided between the first detection plate corresponding to the intersection of the projection line of the first metal wire on the substrate and the first detection array and the first metal wire, and the value of the second capacitance is determined by the vertical distance between the first metal wire and the first detection array.

[0011] Furthermore, the control circuit includes: a timing control circuit for controlling each of the first detection plates to output the sensed electrical signals in series; and an interface circuit for receiving the serially output electrical signals.

[0012] Preferably, the fixing part further includes: a frame, in which the substrate is fixedly disposed; and a protective cover, which is disposed on one side of the substrate accommodating the first detection array and is not in contact with the first detection array, for protecting the first detection array.

[0013] Preferably, the movable part further comprises: a receiving member, which is an insulator and is fixedly arranged on a surface of the object to be detected facing the fixed part, and is used for receiving the first metal guide wire.

[0014] Furthermore, the fixed part also includes: a second detection array, which is arranged on the surface of the substrate on the same side as the first detection array, and includes a plurality of second detection chips, and the plurality of second detection chips are arranged at equal intervals along the second direction; each of the second detection chips includes a chip substrate and a plurality of second detection plates, and the plurality of second detection plates are arranged on the surface of the chip substrate at equal intervals along the second direction; each of the second detection plates is electrically connected to the control circuit, and the induced electrical signal includes the electrical signal sensed by each second detection plate; the movable part also includes: a second metal wire, which intersects with the first metal wire and extends along the first direction, and the diameter of the second metal wire is smaller than the distance between each two second detection plates.

[0015] Furthermore, each of the second detection electrodes has the same third capacitance with the chip substrate; and a variable fourth capacitance is provided between the second detection electrode corresponding to the intersection of the projection line of the second metal wire on the substrate and the second detection array and the second metal wire.

[0016] The spatial position sensor provided by the embodiment of the present application has at least the following beneficial effects:

[0017] (1) The induced electrical signal obtained by the first detection array arranged along the first direction simultaneously obtains the position information of the moving part relative to the fixed part in the first direction and the third direction, so that multi-dimensional position information can be obtained by using a single position sensor, with a simple structure and easy installation.

[0018] (2) The position information of the movable part relative to the fixed part in the first direction is obtained through the intersection of the projection of the first metal guide wire on the substrate and the first detection array, and the position information of the movable part relative to the fixed part in the third direction is obtained through the relationship between the variable second capacitor and the fixed first capacitor, thereby avoiding the accumulated error introduced by using a combination of multiple position sensors, making the detection result more accurate.

[0019] (3) By setting a second detection array along the second direction and setting a second metal guide wire along the second direction, the position information of the moving part relative to the fixed part in the second direction can be further obtained, thereby increasing the dimension of position detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A three-dimensional diagram of a spatial position sensor provided according to an embodiment of the present application;

[0021] Figure 2 for Figure 1 A schematic cross-sectional view of the fixing portion after being cut along the second direction;

[0022] Figure 3 A schematic diagram of a first detection array acquiring an induced electrical signal according to an embodiment of the present application;

[0023] Figure 4 is a schematic diagram of an induced electrical signal acquired by a first detection array according to an embodiment of the present application;

[0024] Figure 5 A three-dimensional diagram of a spatial position sensor provided according to another embodiment of the present application;

[0025] Figure 6 This is a schematic diagram of induced electrical signals acquired by a first detection array and a second detection array according to yet another embodiment of the present application.

[0026] Numbers in the figure

[0027] 1: moving part, 11: first metal guide wire, 12: second metal guide wire, 13: receiving part, 2: fixing part, 20: substrate, 21: first detection chip, 211: first detection electrode plate, 221: second detection electrode plate, 23: chip base, 3: control circuit, 41: frame, 42: protective cover. DETAILED DESCRIPTION

[0028] Hereinafter, the present application will be further described based on preferred embodiments with reference to the accompanying drawings.

[0029] In addition, various components on the drawings are enlarged (thickened) or reduced (thinned) for ease of understanding, but this practice is not intended to limit the scope of protection of the present application.

[0030] Words importing the singular also include the plural and vice versa.

[0031] In the description of the embodiments of the present application, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the products of the embodiments of the present application are usually placed when in use, it is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, in the description of the present application, in order to distinguish different units, the words first, second, etc. are used in this specification, but these are not limited by the order of manufacture, nor can they be understood as indicating or implying relative importance, and their names may be different in the detailed description and claims of the present application.

[0032] The vocabulary in this specification is used to illustrate the embodiments of the present application, but is not intended to limit the present application. It should also be noted that, unless otherwise clearly specified and limited, the terms "disposed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, an indirect connection through an intermediate medium, or a connection between the two elements. For those skilled in the art, the specific meanings of the above terms in this application can be specifically understood.

[0033] Example 1

[0034] Figures 1 to 4 An embodiment of a spatial position sensor provided by the present application is shown. Figure 1 is a three-dimensional diagram of the spatial position sensor of this embodiment, Figure 2 for Figure 1 A cross-sectional view of the fixing portion 2 in FIG. 1 after being cut along the second direction.

[0035] like Figure 1 , Figure 2 As shown, the present application provides a spatial position sensor for obtaining spatial position information of an object to be detected, comprising a fixed part 2, a moving part 1 and a control circuit 3, wherein:

[0036] The fixed part 2 comprises: a substrate 20, the surface of the substrate 20 is perpendicular to the third direction; a first detection array, the first detection array comprises a plurality of first detection chips 21, the plurality of first detection chips 21 are arranged at equal intervals along the first direction on the surface of the substrate 20 facing the object to be detected, and an induced electrical signal is generated based on the position of the moving part 1 relative to the fixed part 2, wherein the first direction is perpendicular to the third direction;

[0037] The moving part 1 comprises: a first metal guide wire 11, which is fixedly arranged on the surface of the object to be detected facing the fixed part 2 and is insulated from the object to be detected;

[0038] The control circuit 3 is electrically connected to the first detection array and the first metal guide wire 11 , and is used to apply a pulse voltage to the first metal guide wire 11 and obtain the induced electrical signals generated by the plurality of first detection chips 21 .

[0039] Specifically, in an embodiment of the present application, the object to be detected may be a manipulator, a robotic arm or other object that needs to obtain spatial position information. The moving part 1 follows the movement of the object to be detected, the fixed part 2 is arranged relative to and fixed to the object to be detected, and the space formed between the fixed part 2 and the object to be detected is the space for the movement of the object to be detected.

[0040] The fixed part 2 includes a substrate 20, a surface of one side of the substrate 20 faces the object to be detected, and a direction perpendicular to the surface is set as a third direction; the fixed part 2 also includes a first detection array, the first detection array includes a plurality of first detection chips 21, and can generate an induced electrical signal based on the position of the moving part 1 relative to the fixed part 2. The plurality of first detection arrays are arranged at equal intervals on the surface of the substrate 20 facing the object to be detected, and the arrangement direction is the first direction, and the first direction is perpendicular to the third direction;

[0041] Furthermore, if Figure 1 , Figure 2 As shown, the first detection chip 21 includes a chip base 23 and a plurality of first detection plates 211. The chip base 23 is arranged on the surface of the substrate 20. The plurality of first detection plates 211 are arranged on the surface of the chip base 23 at equal intervals along a first direction. Each first detection plate 211 is electrically connected to the control circuit 3. The collection of electrical signals sensed by all the first detection plates 211 constitutes the above-mentioned induced electrical signal.

[0042] The moving part 1 includes a first metal guide wire 11, which can be fixedly arranged on the surface of the object to be detected facing the fixed part 2 by means of pasting, embedding, etc., and is insulated from the object to be detected. Figure 1 As shown, the first metal guide wire 11 extends along the second direction, and the second direction is perpendicular to the first direction and the third direction respectively.

[0043] In this embodiment, the control circuit 3 can be integrated on the substrate 20. Specifically, the control circuit 3 can be arranged on the surface of the substrate 20 facing away from the object to be detected. The control circuit 3 is electrically connected to each first detection electrode 211 through a circuit printed on the substrate 20, and is electrically connected to the first metal guide wire 11 through a wire whose surface is covered with an insulating skin.

[0044] Furthermore, the control circuit 3 includes a timing control circuit for controlling each first detection electrode 211 to output the sensed electrical signal in series; the control circuit 3 also includes an interface circuit for receiving the serially output electrical signal. Those skilled in the art should know that after the interface circuit receives the serially output electrical signal, it can be further connected to modules such as an AD conversion module to further process the information obtained by the spatial position sensor as needed.

[0045] Preferably, if Figure 2 As shown, the fixed part 2 also includes a frame 41 and a protective cover 42, wherein the substrate 20 is fixedly disposed in the frame 41, the protective cover 42 overlaps the frame 41, is disposed on one side of the substrate 20 accommodating the first detection array and is not in contact with the first detection array, and is used to protect the first detection array.

[0046] In some preferred implementations of the present embodiment, in order to improve the integration of the product and facilitate mass production, the chip substrate 23 and the first detection electrode plate 211 included in the above-mentioned first detection chip 21, and the above-mentioned control circuit 3 can be manufactured by adopting structural film layers with different electrical properties, which are stacked in sequence according to pre-designed specifications on a substrate 20 made of PCB (printed circuit board) material. An insulating structural film layer is also arranged between the first detection electrode plate 211 and the chip substrate 23 to form a capacitor structure between the first detection electrode plate 211 and the chip substrate 23. The above-mentioned process of manufacturing using structural film layers of multiple materials is known to technicians in this field and will not be repeated here.

[0047] Obviously, the number and spacing of the multiple first detection plates 211 arranged along the first direction determine the maximum range that the spatial position sensor of this embodiment can detect in the first direction. For example, in a specific implementation of this embodiment, the first detection array includes 6 first detection chips 21, each first detection chip 21 includes 36 first detection plates 211, the size of the detection plates is 0.45mm*0.45mm, and they are arranged at equal intervals along the first direction according to the specification of 50DPI to form an array including 216 first detection plates 211. For the convenience of description, the electrical signals sensed by the above 216 first detection plates 211 can be defined as SIG1~SIG216. Specifically, the electrical signals sensed by the first detection plates 211 are voltage signals. In other specific implementations of this embodiment, technicians in this field can also increase the number of first detection chips 21 according to actual detection needs to expand the maximum detectable range.

[0048] Preferably, in order to improve the detection accuracy, the diameter of the first metal guide wire 11 is smaller than the distance between each two first detection plates 211. Specifically, in the above specific implementation, the diameter of the first metal guide wire 11 is 0.5 mm, and the length along the second direction is 10 mm; Figure 1 It is easy to know that the first metal guide wire 11 extends a certain length in the second direction so that its projection on the substrate 20 intersects with the first detection array, and the intersection can be used to indicate the position of the object to be detected relative to the fixed part 2 in the first direction.

[0049] In other specific implementations of this embodiment, those skilled in the art may also increase the length of the first metal guide wire 11 according to detection requirements, thereby ensuring that when the object to be detected moves to a certain extent in the second direction, the projection of the first metal guide wire 11 on the substrate 20 can still generate an intersection with the first detection array.

[0050] The following, combined Figure 3 , Figure 4 , the principle of the first detection array acquiring the position information of the object to be detected relative to the fixed part 2 in the above specific implementation is elaborated in detail.

[0051] Specifically, each first detection electrode plate 211 has the same first capacitance with the chip substrate 23, and the first capacitance is a fixed value, which is predetermined by the size specifications and electrical properties of the first detection electrode plate 211 and the chip substrate 23, and can be recorded as CI; the first detection electrode plate 211 (for the convenience of description, the serial number of the first detection electrode plate 211 is set to m) corresponding to the intersection of the projection line of the first metal conductive wire 11 on the substrate 20 and the first detection array and the first metal conductive wire 11 has a variable second capacitance, which can be recorded as CS, and the second capacitance CS increases as the first metal conductive wire 11 changes in the first detection array. The first metal guide wire 11 changes with the change of the vertical distance D from the first detection array in the three directions (in the above specific implementation, the various parts of the first detection array are made of a structural film layer, and its thickness in the third direction is much smaller than the distance between the object to be detected and the first detection array. Therefore, it can be considered that the first metal guide wire 11 and different parts of the first detection array have an equal vertical distance D in the third direction); obviously, the first metal guide wire 11 and the first detection plate 211 numbered m and the chip substrate 23 form a capacitive voltage-dividing structure, but do not form a capacitive voltage-dividing structure with other first detection plates 211.

[0052] When a voltage Vp is applied to the first metal wire 11 and the chip substrate 23 is grounded, it can be seen from the above analysis that the first detection plate 211 No. m has a voltage: Vo = Vp*CS / (CS+CI), and the above formula can be transformed into: Vo = Vp*1 / (K*D+1), where K is a simplification coefficient, which is predetermined by the size specifications and electrical properties of the first metal wire 11, the first detection plate 211 and the chip substrate 23. The first detection plate 211 located at other positions does not constitute a capacitive voltage divider structure, so its voltage is 0. When the position of the object to be detected relative to the fixed part 2 is measured, as shown in FIG. Figure 4 As shown, the timing control circuit receives an external clock signal CLK, applies a pulse voltage Vp to the metal guide wire, and controls the interface circuit to sequentially receive and output the voltage signals SIG1 to SIG216 sensed by the 216 first detection plates 211 in synchronization with the clock signal CLK.

[0053] Figure 4 The signal SIG in FIG. 1 shows the voltage signals sensed by the 216 first detection plates 211, wherein the voltage sensed by the first detection plate 211 numbered m is Vo, and the voltage signals sensed by the other first detection plates 211 are 0. Through the voltage Vo, when Vp and K are known, the vertical distance D between the first metal guide wire 11 and the first detection array can be obtained.

[0054] Therefore, through the voltage signals sensed by the above-mentioned multiple first detection plates 211, the position of the movable part 1 relative to the fixed part 2 in the first direction and the third direction can be obtained. Specifically, the position information of the movable part 1 relative to the fixed part 2 in the first direction can be obtained through the presence or absence of the voltage signal, and the distance information of the movable part 1 relative to the fixed part 2 in the third direction can be obtained through the amplitude of the voltage signal.

[0055] Figure 1 It also shows the situations where the first metal guide wire 11 is located at three positions a, b, and c: when the first metal guide wire 11 is located at position a and position c, the distance relative to the first detection array in the third direction is the same, and the projection on the substrate 20 intersects with the first detection array at the m-th first detection electrode plate 211 and the n-th first detection electrode plate 211, respectively; when the first metal guide wire 11 is located at position b, the projection on the substrate 20 intersects with the first detection array at the n-th first detection electrode plate 211, but is closer to the first detection array than at position c.

[0056] Figure 4The figure shows the voltage signals serially output by 216 first detection plates 211 through the control interface circuit when the first metal guide wire 11 is located at the three positions a, b, and c. It can be seen from the figure that SIG_a, SIGb, and SIG_c can accurately reflect the position information of the first metal guide wire 11 relative to the first detection array in the first direction and the third direction.

[0057] In this embodiment, the induced electrical signal obtained by the first detection array arranged along the first direction simultaneously obtains the position information of the movable part 1 relative to the fixed part 2 in the first direction and the third direction, so that the multi-dimensional position information can be obtained by using a single position sensor, and the structure is simple and easy to install; the position information of the movable part 1 relative to the fixed part 2 in the first direction is obtained through the intersection of the projection of the first metal guide wire 11 on the substrate 20 and the first detection array, and the position information of the movable part 1 relative to the fixed part 2 in the third direction is obtained through the relationship between the variable second capacitor and the fixed first capacitor, thereby avoiding the accumulated error introduced by the combination of multiple position sensors, so that the detection result is more accurate; in the preferred implementation mode of this embodiment, the diameter of the first metal guide wire 11 is set to be smaller than the spacing of the first detection plates 211, ensuring that the number of first detection plates 211 that can sense the voltage divider signal at the same time does not exceed 1, thereby improving the accuracy of position detection.

[0058] Example 2

[0059] Figure 5 , Figure 6 Another embodiment of a spatial position sensor provided by the present application is shown. Figure 5 is a three-dimensional diagram of the spatial position sensor of this embodiment, Figure 6 FIG. 1 is a schematic diagram of induced electrical signals acquired by the first detection array and the second detection array according to the present embodiment. The same parts as those in Embodiment 1 are denoted by the same reference numerals.

[0060] like Figure 5 As shown, the difference between this embodiment and embodiment 1 is that the fixed part 2 also includes: a second detection array, which is arranged on the surface of the substrate 20 on the same side as the first detection array, including a plurality of second detection chips, and the plurality of second detection chips are arranged at equal intervals along the second direction; each second detection chip includes a chip substrate 23 and a plurality of second detection electrodes 221, and the plurality of second detection electrodes 221 are arranged on the surface of the chip substrate 23 at equal intervals along the second direction; each second detection electrode 221 is electrically connected to the control circuit 3, and the induced electrical signal includes the electrical signal sensed by each second detection electrode 221; the movable part 1 also includes: a second metal wire, the second metal wire intersects with the first metal wire and extends along the first direction, and the diameter of the second metal wire is smaller than the distance between each two second detection electrodes 221.

[0061] Furthermore, each second detection electrode plate 221 has the same third capacitance with the chip substrate 23 ; and a variable fourth capacitance is provided between the second detection electrode plate 221 and the second metal conductive wire 12 corresponding to the intersection of the projection line of the second metal conductive wire 12 on the substrate 20 and the second detection array.

[0062] In some preferred implementations of this embodiment, the first detection chip 21 and the second detection chip are of the same model, with the same specifications and performance parameters, so that the third capacitor is equal to the first capacitor, and the fourth capacitor is equal to the second capacitor.

[0063] Figure 5 A stereogram of a spatial position sensor provided by a preferred embodiment of the present embodiment is shown, wherein the first metal wire 11, the second metal wire 12, a plurality of first detection plates 211 and a plurality of second detection plates 221 are all represented in a simplified form. In the present embodiment, the first metal wire 11 and the second metal wire 12 have a diameter of 0.5 mm and a length of 54 mm, are perpendicular to each other and intersect, and the plane formed by the intersection of the two is parallel to the substrate 20; the first detection array is set in the same manner as in Example 1, and the induced electrical signal obtained is SIG1, and the second detection array includes 6 second detection chips arranged at equal intervals along the second direction, and the specifications, models and spacing of the second detection chips are the same as those of the first detection array, and the induced electrical signal obtained is SIG2. In other specific embodiments of the present embodiment, those skilled in the art can also adjust the specifications of the first metal wire 11, the second metal wire 12, the first detection array and the second detection array to meet the needs of actual measurement.

[0064] In this embodiment, the second metal guide wire 12 is perpendicular to the first metal guide wire 11, and the second detection array is perpendicular to the first detection array. The position information of the movable part 1 relative to the fixed part 2 in the second direction can be obtained by the serial number of the second detection plate 221 corresponding to the intersection of the projection of the second metal guide wire 12 on the substrate 20 and the second detection array (for example, the serial number of the second detection plate 221 at the intersection is n). The information acquisition method is the same as the method of obtaining the position information of the movable part 1 relative to the fixed part 2 in the first direction in Example 1, and will not be repeated here.

[0065] Figure 6A schematic diagram of the induced electrical signals acquired by the first detection array and the second detection array of the above preferred embodiment is shown, wherein m is the serial number of the first detection electrode 211 corresponding to the intersection of the projection of the first metal wire 11 on the substrate 20 and the first detection array, and n is the serial number of the second detection electrode 221 corresponding to the intersection of the projection of the second metal wire 12 on the substrate 20 and the second detection array. Obviously, since the plane formed by the intersection of the first metal wire 11 and the second metal wire 12 is parallel to the substrate 20, the amplitudes of the voltage signals sensed by the first detection electrode 211 numbered m and the second detection electrode 221 numbered n are the same.

[0066] Preferably, in this embodiment, the movable part 1 further includes a receiving member 13 , which is an insulator and is fixedly disposed on a surface of the object to be detected facing the fixed part 2 , and is used to receive the first metal guide wire 11 and the second metal guide wire 12 .

[0067] In this embodiment, by setting a second detection array along the second direction and setting a second metal guide wire 12 along the second direction, the position information of the moving part 1 relative to the fixed part 2 in the second direction can be further obtained, thereby increasing the dimension of position detection. By using the spatial position sensor provided in this embodiment, position information of three dimensions can be obtained through a single spatial position sensor, and the structure is extremely simple and easy to install.

[0068] The above is a detailed introduction to the specific implementation methods of the present application. For those skilled in the art, several improvements and modifications may be made to the present application without departing from the principles of the present application. These improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A spatial position sensor for obtaining spatial position information of an object to be detected, comprising a fixed part, a moving part and a control circuit, Features: The fixing portion comprises: a substrate, a surface of the substrate being perpendicular to a third direction; and a first detection array, the first detection array comprising a plurality of first detection chips, the plurality of first detection chips being arranged at equal intervals along a first direction on a surface of the substrate facing the object to be detected, and generating an induced electrical signal based on a position of the moving part relative to the fixed part, wherein the first direction is perpendicular to the third direction; The mobile unit comprises: A first metal guide wire is fixedly disposed on a surface of the object to be detected facing the fixing portion and is insulated from the object to be detected, wherein the first metal guide wire extends along a second direction, and the second direction is perpendicular to the first direction and the third direction; The control circuit is electrically connected to the first detection array and the first metal guide wire, and is used to apply a pulse voltage to the first metal guide wire and obtain the induced electrical signal, including: a timing control circuit, used to control each of the first detection plates to serially output the sensed electrical signals; and an interface circuit, used to receive the serially output electrical signals.

2. The spatial position sensor according to claim 1, Features: Each of the first detection chips comprises a chip substrate and a plurality of first detection plates, wherein the plurality of first detection plates are arranged on the surface of the chip substrate at equal intervals along the first direction; Each of the first detection plates is electrically connected to the control circuit, and the induced electrical signal includes an electrical signal sensed by each of the first detection plates.

3. The spatial position sensor according to claim 2, Features: The diameter of the first metal guide wire is smaller than the distance between every two of the first detection plates.

4. The spatial position sensor according to claim 3, Features: Each of the first detection plates has the same first capacitance with the chip substrate, and the value of the first capacitance is a fixed value; A variable second capacitor is provided between the first detection electrode corresponding to the intersection of the projection line of the first metal wire on the substrate and the first detection array and the first metal wire, and the value of the second capacitor is determined by the vertical distance between the first metal wire and the first detection array.

5. The spatial position sensor according to any one of claims 1 to 4, It is characterized in that The fixing portion further comprises: A frame, wherein the substrate is fixedly disposed in the frame; A protection cover plate is disposed on a side of the substrate accommodating the first detection array and is not in contact with the first detection array, and is used to protect the first detection array.

6. The spatial position sensor according to claim 5, It is characterized in that The mobile unit also includes: The receiving member is an insulator, fixedly arranged on the surface of the object to be detected facing the fixed part, and is used to receive the first metal guide wire.

7. The spatial position sensor according to claim 4, Features: The fixing portion further comprises: A second detection array, the second detection array is arranged on the surface of the substrate on the same side as the first detection array, and includes a plurality of second detection chips, and the plurality of second detection chips are arranged at equal intervals along the second direction; Each of the second detection chips comprises a chip substrate and a plurality of second detection electrodes, wherein the plurality of second detection electrodes are arranged on the surface of the chip substrate at equal intervals along the second direction; Each of the second detection plates is electrically connected to the control circuit, and the induced electrical signal includes an electrical signal sensed by each of the second detection plates; The mobile unit also includes: A second metal guide wire intersects with the first metal guide wire and extends along the first direction, and a diameter of the second metal guide wire is smaller than a distance between every two second detection plates.

8. The spatial position sensor according to claim 7, Features: There is a same third capacitor between each of the second detection plates and the chip substrate, and the value of the third capacitor is a fixed value; A variable fourth capacitor is provided between the second metal wire and the second detection electrode plate corresponding to the intersection of the projection line of the second metal wire on the substrate and the second detection array.

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