Decoupled conduction / convection dual heat sink for microcontrollers with onboard memory

Abstract

A heat sink may include a base having a first surface on a first plane, the first surface being configured to contact a system-on-chip (SoC) located on a circuit board. The heat sink may include a plurality of heat transfer members connected to and extending from the base. The plurality of heat transfer members are configured to extend along a longitudinal length in a second plane having a first spacing from the first plane. The plurality of heat transfer members respectively include relative inner walls defining a second spacing between the plurality of heat transfer members. The heat sink may include a housing surrounding the plurality of heat transfer members. The housing may include a substrate contacting the base of the heat sink to form a cold plate. The housing partially surrounds the length of the heat transfer member, thereby allowing airflow to pass through the housing in a lateral direction.

Description

Technical Field

[0001] The present disclosure relates to cooling systems, and more particularly, to cooling systems for electronic devices. Background Art

[0002] Cooling systems for electronic devices such as computers typically include fans that move air over various components to remove heat generated by the components. As part of having the fans move warm air, air heated by one component will likely pass over another component; the air passing over the other components will be "preheated." Increasing the "preheat" or component inlet air temperature reduces the cooling capacity of downstream components when compared to upstream components, as shown by the heat transfer internal flow equation. Therefore, to address some of these issues, improved mechanisms for controlling the heat generated by computing devices are needed. Summary of the invention

[0003] A simplified summary of one or more implementations is presented below to provide a basic understanding of such implementations. This summary is not an extensive overview of all contemplated implementations, and is neither intended to identify key or important elements of all implementations nor to delineate the scope of any or all implementations. Its purpose is to present some concepts of one or more implementations in a simplified form as a prelude to a more detailed description presented later.

[0004] In one aspect, the present disclosure provides a heat sink. The heat sink may include a base having a first surface in a first plane, the first surface being configured to contact a system on a chip (SoC) located on a circuit board. The heat sink may include a plurality of heat transfer members connected to and extending from the base, wherein the plurality of heat transfer members are configured to extend along a longitudinal length in a second plane, the second plane having a first spacing from the first plane, and wherein the plurality of heat transfer members respectively include opposing inner walls defining a second spacing between the plurality of heat transfer members.

[0005] In one aspect, the heat sink can further include a plurality of arms, each arm extending from opposite sides of the base, each arm having a shape defining a clip configured to attach to a circuit board.

[0006] In one aspect, the plurality of heat transfer members include a connector portion proximate the base, wherein the connector portion is sized to define a first spacing between a second plane of the plurality of heat transfer members and a first plane of the first surface of the base; the connector portion can be bent at an inflection point.

[0007] In one aspect, the first surface of the base has a first surface area that is greater than a second surface area of ​​a corresponding surface of the SoC.

[0008] In one aspect, the heat sink further includes a thermal adhesive configured to attach the base to the SoC.

[0009] In one aspect, the heat sink further includes a housing that at least partially surrounds the plurality of heat transfer members. The housing may include a substrate that contacts the base at a second surface opposite to the first surface of the base. The substrate and the base may form a cold plate of the heat sink. The housing may include: a proximal panel positioned at a first side of the plurality of heat transfer members and configured to face the circuit board; a distal panel positioned at a second side of the plurality of heat transfer members, wherein the second side is opposite to the first side; and wherein both the proximal panel and the distal panel extend longitudinally from a respective proximal end adjacent to the base to a respective distal end away from the base, wherein the respective distal ends define an opening at an end of the heat transfer member. The housing may include one or more inner side walls that define one or more side vents between the proximal panel and the distal panel. The heat transfer member may have a greater thermal conductivity than the housing.

[0010] In one aspect, the present disclosure provides a computer system. The computer system may include a printed circuit board, the printed circuit board including a SoC and at least one additional component. The computer system may include a heat sink, the heat sink including a base attached to a surface of the SoC in a first plane, the heat sink further including a plurality of heat transfer members connected to the base and extending from the base, wherein the plurality of heat transfer members are configured to extend along a longitudinal length in a second plane, the second plane having a first spacing from the first plane, and wherein the plurality of heat transfer members respectively include opposing inner walls defining a second spacing between the plurality of heat transfer members.

[0011] In one aspect, the computer system may further include an air source configured to move air from ends of the plurality of heat transfer members toward the SoC.

[0012] In one aspect, the printed circuit board is a memory microcontroller card.

[0013] Additional advantages and novel features associated with the disclosed implementations will be set forth in part in the description that follows and in part will become apparent to those skilled in the art upon study of the following or learning of them through practice. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The specific features, implementations and advantages of the present disclosure will become better understood with reference to the following description, appended claims and drawings, in which:

[0015] Figure 1 is an upper right perspective view of an example heat sink mounted on a circuit board and in contact with a heat generating component such as a system on a chip (SoC).

[0016] Figure 2 yes Figure 1 Lower right perspective view of the implementation of the heat sink.

[0017] Figure 3 yes Figure 1 A top plan view of an implementation of a heat sink.

[0018] Figure 4 yes Figure 1 A bottom plan view of an implementation of a radiator.

[0019] Figure 5 yes Figure 1 A front view of an implementation of a heat sink.

[0020] Figure 6 yes Figure 1 Left side view of an implementation of a heat sink.

[0021] Figure 7 yes Figure 1 Right side view of an implementation of a heat sink.

[0022] Figure 8 yes Figure 2 A partially cut-away front view of the left side of an implementation of a heat sink.

[0023] Fig. 9 yes Figure 1 An upper right perspective view of another implementation of a heat sink further comprising a housing and including arrows representing airflow around the heat sink.

[0024] Fig.10 yes Figure 2 A close-up, partial front view of the right side portion of the heat sink of FIG. 5 , including a heat transfer member extending from the end of the housing visible through the vent within the housing.

[0025] Fig.11 yes Fig. 9 Upper right perspective view of the implementation of the heat sink.

[0026] Fig.12 yes Fig. 9 Upper left perspective view of the implementation of the heat sink.

[0027] Fig.13 yes Fig. 9 Lower right perspective view of the implementation of the heat sink.

[0028] Fig.14 yes Fig. 9 A top plan view of an implementation of a heat sink.

[0029] Fig.15 yes Fig. 9 A bottom plan view of an implementation of a radiator.

[0030] Fig.16 yes Fig. 9 A front view of an implementation of a heat sink.

[0031] Fig.17 yes Fig. 9 Left side view of an implementation of a heat sink.

[0032] Fig.18 yes Fig. 9 Right side view of an implementation of a heat sink.

[0033] Fig.19 yes Fig. 9 A partially cut-away front view of the left side of an implementation of a heat sink.

[0034] Fig. 20 yes Figure 2 A cross-sectional top plan view of an implementation of a heat sink, including a representation of heat conduction via a heat transfer member.

[0035] Fig.21 yes Figure 2 A top plan view of an implementation of a heat sink including a representation of heat conduction in the housing. DETAILED DESCRIPTION

[0036] The detailed description set forth below in conjunction with the accompanying drawings is intended to be a description of different embodiments and is not intended to represent the only configuration in which the concepts described herein can be practiced. For the purpose of providing a thorough understanding of various concepts, the detailed description includes specific details. However, it is apparent to those skilled in the art that these concepts can be practiced without these specific details. In some cases, well-known components are shown in block diagram form to avoid blurring these concepts. In some embodiments, one or more components and one or more methods that can perform the actions or operations described herein may be referenced to describe examples, wherein the components and / or actions / operations in the dotted lines may be optional.

[0037] Microcontrollers generate more heat and become more difficult to cool, and in addition, microcontrollers may need to meet the requirements of the Peripheral Component Interconnect Express (PCI-e) specification. These controllers are responsible for NAND operations and double data rate (DDR) operations with increasing workload requirements. Traditional base and heat sink heat sinks are too large to be used as a solution for these types of architectures. Folded heat sinks do not have the heat sink to base height efficiency of traditional heat sinks, and can cause preheated turbulent air to increase the local ambient temperature and reduce the amount of energy that can be transferred from the package.

[0038] The present disclosure provides a heat sink comprising a plurality of heat transfer members, such as two positioned side by side, extending from a base or a cold plate, which may be in contact with or configured to contact a system on chip (SoC). The plurality of heat transfer members extend over all or a portion of a package, which may include a printed circuit board and components thereon. There may be spacing between the plurality of heat transfer members and the package so that the plurality of heat transfer members do not contact the printed circuit board or components thereon. In an embodiment, the heat sink may additionally include a housing surrounding the plurality of heat transfer members. The housing may form a base or a cold plate, or a portion thereof. The housing may surround all or a portion of the length of the heat transfer member, and may include an open end to allow airflow through the housing.

[0039] refer to Figure 1-8 , an exemplary heat sink 100, includes a plurality of heat transfer members 110, which can be mounted to a package 132 to remove thermal energy or heat from the package 132. For example, in one implementation, the heat sink 100 can include a mating arm 120 and / or a thermal adhesive 122 to enable mounting of the heat sink 100 to the package 132, which can include a printed circuit board (PCB) 134 and components 136 thereon. The system on chip (SoC) 130 can be a specific component 136 of the package 132 that generates heat and requires cooling. For example, the package 132 can be a memory card including a memory card controller SoC. The SoC 130 can include a surface 138 that the heat sink 100 contacts.

[0040] The heat sink 100 may include a base 112 configured to contact a heat generating component (e.g., SoC 130) of a component 136 of a package 132. The base 112 may have a base surface 118 having a surface area greater than a surface area of ​​a corresponding contact surface 138 of the SOC 130. The size of the base surface 118 is designed to contact the SoC 130 so that heat can be conducted into the heat sink 100 via the base 112. The base 112 may be formed of the same material as the plurality of heat transfer members or a different material. Suitable materials for forming the base 112 include, but are not limited to, copper alloys and aluminum alloys.

[0041] In some embodiments, thermal adhesive 122 may be located between SoC 130 and base 112 to improve or maintain thermal contact between SoC 130 and base 112 to allow conduction. Thermal adhesive 122 may include, but is not limited to, thermally conductive materials such as metals, metal oxides, silica, or ceramic microspheres carried by epoxy, paste, or double-sided tape.

[0042] In one aspect, the engagement arms 120 may extend from opposite sides of the base 112 and may have a shape capable of clamping or connecting the heat sink 100 to the printed circuit board 134. For example, in one implementation, each engagement arm may extend to an edge of the printed circuit board 134 and bend around the printed circuit board 134 to hold the heat sink 100 on the package 132. For example, each engagement arm 120 may include two approximately right angles, and the height between the opposing inner surfaces (e.g., an inner top surface and an opposing inner bottom surface) of each engagement arm 120 may be at least the height of the printed circuit board 134 and the SoC 130. It should be understood that the shape of the engagement arms 120 may be adapted to the size of a particular package.

[0043] The heat transfer member 110 may include a planar body with a planar body base extending longitudinally from the base 112 along all or a portion of the length of the package 132. For example, the heat transfer member 110 may extend to the end of the last component 136 (e.g., the end closest to the printed circuit board 134 opposite the base 112) or may extend to the end of the printed circuit board 134 opposite the base 112.

[0044] The heat transfer member 110 includes a connector portion 124 proximate the base 112, wherein the connector portion 124 connects the heat transfer member 110 to the base 112. In one implementation, the connector portion 124 is sized to define a spacing 140 between a plane 142 and a plane 144 of a surface of the base 112, in which the heat transfer member 110 extends. The spacing 140 enables the heat transfer member 110 to extend without interfering with the component 136 while maintaining a relatively low profile and providing a gap that can allow cooling airflow. For example, the heat transfer member 110 can have a thickness of approximately 1 mm (e.g., Figure 1 vertical thickness in the embodiment of the present invention), or more preferably, a thickness of approximately 0.5 mm resulting in a low profile. Figure 1 The connector portion 124 is shown in FIG. 1 as forming a curved member having an inflection point, but other shapes (eg, a member orthogonal to the base 112 and the heat transfer member 110 , an angled member, etc.) may be used depending on the application.

[0045] The heat transfer member 110 may include opposing inner walls 126 that increase the heat transfer capacity of the heat transfer member 110. For example, the inner walls 126 include a heat transfer surface area, and the spacing 114 may allow airflow between the heat transfer members 110. For example, in one embodiment, the spacing 114 may be between 0.2 mm and 2 mm, preferably about 0.5 mm. Conduction (heat transfer through a solid) may be given by the following equation:

[0046]

[0047] Where: Q (watts (W)) refers to power or heat dissipation; k (W / mK) refers to the conductivity of the material (e.g., copper, heat pipe, etc.); A (m 2 ) refers to the area (thickness x width); dT (°C) refers to the temperature change between the coldest and hottest areas of the conductive material; and dX (m) refers to the length that the heat travels. Thus, increasing the width of the conductive material (metal, heat pipe, etc.) allows for increased conduction through the material. However, increasing the surface area will increase the air trapped between the package 132 and the heat sink 100.

[0048] Meanwhile, convection (heat transfer through air, water, or other media) can be defined by the following equation:

[0049] Q=hA(dT)

[0050] Where Q (watt (W)) refers to power or heat dissipation; h (W / m 2 -K) refers to the convection coefficient of the air (assume 50-200); and dT refers to the temperature change of the air from the surface being analyzed (which may be the top of the heat transfer member 110) to the top of the package measured as a rectangle. Additionally, the Nusselt number may define the balance of heat transferred via conduction or convection as hL / k. Thus, the width of the gap 114 may be adjusted to optimize cooling by conduction and convection for a particular design.

[0051] The heat transfer member 110 may be formed of the same material as the base 112 or a different material. Suitable materials for forming the heat transfer member 110 include, but are not limited to, copper alloys, aluminum alloys, stainless steel, copper, vapor chambers, heat pipe devices, or other thermally conductive materials or structures. The thermal conductivity of the conductive material may be determined by the density of the molecular structure of the metal and / or the internal fluid phase contained in the metal shell. The "density of the molecular structure" may refer to a solid in which energy is transferred through the solid metal rod itself (e.g., when the heat transfer member 110 is a solid). The "internal fluid phase" refers to a two-phase vapor process that occurs in both the heat pipe and the vapor chamber. For example, in the case of a heat pipe device, the heat transfer member 110 may be a sealed tube including a liquid. Heat from the base 112 may cause the liquid to evaporate and travel to the end 116, where the liquid condenses and travels back to the base 112. Further for example, in the form of a planar metal, the heat transfer member 110 may conduct heat from the base 112 toward the end 116. Thus, in various forms, the heat transfer member 110 may be effective in increasing the conduction of heat from the base 112 to the end 116 .

[0052] The heat sink can have an integral construction including a base 112, a heat transfer member 110, and / or an engagement arm 120. For example, a blank of thermally conductive material can be stamped to form the base 112, the heat transfer member 110, and the edges of the engagement arm 120. In aspects where a particular heat pipe apparatus or vapor chamber is used for the heat transfer member 110, the heat transfer member 110 can be welded to the base 112. In one embodiment, as described above, the engagement arm 120 can be bent to bend around the package 132. For example, in this case, the engagement arm 120 can be bent at a first inflection point in a direction orthogonal to the package 132 and then bent at a second inflection point in a direction toward and parallel to the package 132.

[0053] The heat transfer member 110 works in conjunction with the base 112 to increase energy dissipation into the local ambient air and improve cooling capabilities. Because the low profile of the heat sink 100 matches the shape of the package 132, and the increase in height can be within the PCI-e standard, the heat sink 100 allows the memory card to be positioned in different orientations. In one aspect, according to simulations, the heat sink 100 can provide up to 50% improvement in cooling solutions with minimal impact on airflow impedance. The heat sink 100 can reduce latent heat transfer to upstream components that occurs in traditional heat sinks and supporting solutions. For example, by limiting the airflow above other components 136 and toward the SoC 130, the heat transfer member 110 can prevent the components 136 from preheating the air that contacts the base 112.

[0054] In an implementation, the heat sink 100 used on the microcontroller can increase the cooling capacity for the memory card. The heat sink 100 can cooperate with the printed circuit board (PCB) 134 without adding matching features to the board, and can be configured in various heat pipes and vapor chamber structures. The heat sink 100 can be able to cool the memory components oriented in a vertical or horizontal placement in the space-limited area of ​​the system. Space limitations cause high-power memory components to be unable to provide the same airflow boundary layer development as other components (e.g., CPU). Therefore, the memory components are subjected to reduced convection cooling. The design takes into account the reduced air cooling capacity by providing increased conduction cooling on the package 132 without generating high airflow impedance that will affect the system airflow. In addition, the design implementation is generally applicable to the pairing technology required by the memory card structure and PCI-e.

[0055] Some advantages of the heat sink 100 over conventional heat sinks are that the heat sink 100 is not bulky and can be fitted into small spaces within many computer platforms. The heat sink 100 allows multiple component orientations regardless of airflow direction. Other advantages include compactness, driving energy into cooler ambient air, and a universal fit.

[0056] Finally, other heat sink designs couple heat from surrounding components 136 by installing a "block" type heat sink, which increases the latent heat of the surrounding components and reduces cooling capabilities. In contrast, the relatively thin and relatively long structure of heat transfer member 110, along with spacing 114 and spacing 150 that allow cooling airflow, decouple higher heat flux components from lower heat flux components in heat sink 100, thereby allowing increased conduction for higher temperature on-board packages and optimal airflow for lower power on-board packages.

[0057] refer to Figure 9-Figure 19 , which can be similar to Figure 1 Another example heat sink 200 of the heat sink 100 further includes a housing 220 surrounding a plurality of heat transfer members 210 that are similar to the heat transfer members 110 of the example heat sink 100. For example, the heat transfer members 210 can be manufactured in the same manner as the heat transfer members 110, or formed of the same material or construction as the heat transfer members 110. Fig. 9 2. As shown in the example of right-to-left airflow 226 around heat sink 200, housing 220 can reduce the temperature rise of the air before it reaches SoC 130 by isolating heat transfer member 110. Figure 1 In the heat sink 100 of FIG. 1 , the spacing 270 between the PCB 134 and the heat transfer member 210 allows for cross-sectional airflow and allows the heat sink 200 to be used in a variety of orientations. The heat transfer member 210 can contact the housing 220 at the SoC mating point (e.g., the cold plate 222, where the base 212 to which the heat transfer member is connected is located within the housing 220), but the heat transfer member 210 can be decoupled from the housing 220 by the airflow area 224. In other words, and with additional reference to FIG. Fig.10 , the heat transfer member 210 is spaced apart from the housing 220 by a spacing 242 along the length defined by the airflow region 224. The spacing 242 is defined between the inner surface 234 of the distal panel 232 of the housing 220 and the top surface 218 of the heat transfer member 210, and between the inner surface 231 of the proximal panel 230 of the housing 220 and the bottom surface 219 of the heat transfer member 210. The spacing 242 above the heat transfer member 210 and below the heat transfer member 210 may be the same or may be different.

[0058] refer to Fig.11 , showing a proximal direction 250 and a distal direction 252 relative to the package 132. Since the example heat sink 200 can be positioned in a variety of orientations, directions can be defined relative to the package to which the example heat sink 200 is to be attached. As used herein, an absolute direction (e.g., top, bottom) refers to Figure 1 and Fig. 9 1. The orientation of the top of the package 132 is shown with the heat sink 100, 200 oriented horizontally.

[0059] refer to Fig.10 , providing a more detailed view of the airflow area 224, the housing 220 may include a proximal panel 230 proximal to the enclosure 132 and a distal panel 232 opposite the enclosure 132. The housing 220 may further include vents 238 between the proximal panel 230 and the distal panel 232, at the front and rear sides, as shown in FIG. Figure 2 The vents 238 allow for a cross flow (eg, front to back) of air through the heat transfer member 210, as compared to the right to left airflow 226 shown in FIG. 2. Additionally, the vents 238 may provide increased surface area of ​​the housing 220 to improve convection.

[0060] refer to Fig.11 as well as Fig.12 An opening 236 through the housing 220 is defined by opposing inner surfaces in the cold plate 222 (eg, on the left side) and by opposing inner surfaces of the proximal and distal panels 230, 232. The opening 236 may allow air to flow through the housing 220 and over the cold plate 222.

[0061] refer to Fig.13 , the contact surface 223 of the base 212 is visible, and as shown, the cold plate 222 of the housing 220 can form a box around the base 212, which includes an inner wall 225 defining a rectangular opening 227, and the base 212 contacts the SoC 130 at the rectangular opening 227. Therefore, both the cold plate 222 and the base 212 can contact the SoC 130.

[0062] refer to Fig.19 , the cold plate 222 includes a base 212 and a connection to a heat transfer member 210 extending from the base 212. In an implementation, for example, the heat transfer member 210 can include a connector portion 240, such as a flange portion or a bend, located near an end of the base 212 to space a first longitudinal axis 262 of the heat transfer member 210 from a second longitudinal axis 264 of the base 212, and therefore from the plane of the surface of the SoC 130, which can improve thermal heat transfer. Specifically, in one embodiment, the connector portion 240 can have an arcuate or S-shaped (as shown) configuration, an angled configuration, an orthogonal configuration, or any other configuration or shape that enables the heat transfer member 210 to be spaced from the base 212 (and therefore from the SoC 130) in a direction orthogonal to the circuit board heat transfer member while extending from the base 212 parallel to and along the length of the circuit board.

[0063] Since the housing 220 acts as a heat transfer baffle and a heat sink for the SoC 130 on the package 132, decoupling the heat transfer member 210 from the housing 220 uses the relative thermal impedance of the housing 220 to improve the cooling efficiency of the heat transfer member 210 and reduce heat absorption. For example, the housing 220 can be composed of copper having a lower thermal conductivity than the heat transfer member 210. The housing 220 can be formed as two or more parts (e.g., a top and a bottom) placed around the heat transfer member 210 and joined together (e.g., welded). The heat transfer member 210 can contact the housing 220 only at the base 212. The heat transfer member 210 can be structurally supported by the support 260 ( Fig.11 ) is supported in the housing 220, and the support 260 is made of a non-thermally conductive material or a relatively low thermally conductive material (such as compared to the thermal conductivity of the heat transfer component 210), which thermally insulates the heat transfer component 210 from the housing 220.

[0064] According to the conduction formula The effective conductivity (k eff ) and effective area (A eff ) increases. In this way, housing 220 can conduct some of the heat from SoC 130. Therefore, decoupling housing 220 from heat transfer member 210 solves the problem of preheating from conduction by allowing heat transfer member 210 to be in cooler air and allowing airflow through housing 220.

[0065] This decoupling allows conduction through the heat transfer member 210 and around the heat pipes into airflow, and through the cold plate 222 of the second heat sink 200. The heat transfer member 210 has a relatively high heat transfer rate to move heat from the SoC 130 to the surrounding ambient air, while the housing 220 (despite having a relatively low heat transfer rate) allows the turbulent boundary layer of hot air caused by the heat transfer member 210 to mix into the airflow region 224.

[0066] One difference between this solution and conventional heat sinks is that in conventional fin / base heat sinks, the preheated air that cools the components is not preheated by the components themselves. That is, in conventional fin / base heat sinks, preheated air from other components passes through the fins, thereby reducing its ability to cool the components. In contrast, using example heat sinks 100 and 200, any preheated air is caused by the components themselves via the heat transfer members 110, 210 and helps cool the components.

[0067] One advantage of the example heat sinks 100 and 200 is that due to the low profile of the heat sink and the low impedance to airflow, such heat sinks can be used in multiple heat source panels in confined spaces. In one aspect, features such as fins can be added to create a turbulent boundary layer or heat transfer members can be formed to create a turbulent boundary layer, which increases the convective heat transfer rate into the fluid airflow around the heat sink while already having a high conductive heat transfer rate via the heat transfer member.

[0068] refer to Fig. 20 as well as Fig.21 , exemplary heat transfer profiles 300 and 400 provide examples of how heat may be transferred in each of the heat transfer members 210 and in the housing 220, respectively. In particular, referring to Fig. 20 , heat transfer profile 300 represents heat transfer via heat transfer member 210. Similar conduction can occur using heat transfer member 110. Generally, heat is conducted from base 212 along heat transfer member 110 to end 216. As described above, heat is dissipated from heat transfer member 210 via convection. Similarly, reference Figure 5 , the heat transfer profile 400 represents the heat transfer in the housing 220. Generally, the heat transfer member 210 can have a greater thermal conductivity than the housing 220. Therefore, the distal face plate 232 can remain relatively cool while the cold plate 222 ( Fig.21 ) is hotter. Therefore, the cooling air Fig. 9 Directional flow as shown, for example, right to left airflow 226 , may cool the cold plate 222 due to reduced preheating of the housing 220 .

[0069] The above detailed description set forth above in conjunction with the accompanying drawings describes examples and does not represent the only examples that can be implemented or within the scope of the claims. When used in this specification, the term "example" means "used as an example, instance, or illustration," rather than "preferred" or "superior to other examples." The detailed description includes specific details for providing an understanding of the described techniques. However, these techniques may be practiced without these specific details. In some cases, well-known structures and devices are shown in block diagram form to avoid obscuring the concepts of the described examples.

[0070] Other examples and implementations are within the scope and spirit of the present disclosure and the appended claims. For example, due to the nature of software, the above functions can be implemented using software executed by a dedicated programmed processor, hardware, firmware, hard wiring, or any combination thereof. Features that implement the functions can also be physically located in various locations, including being distributed so that parts of the functions are implemented in different physical locations. In addition, as used herein, including in the claims, "or" used in a list of items beginning with "at least one of" indicates a disjunctive list, so that, for example, a list of "at least one of A, B, or C" means A or B or C or AB or AC or BC or ABC (i.e., A and B and C).

[0071] Although the exemplary implementations have been described in language specific to structural features and / or methodological acts, it should be understood that the implementations defined in the appended claims are not necessarily limited to the specific features or acts described. Instead, these specific features and acts are disclosed as example forms of implementing the claimed features.

Claims

1. A radiator, comprising: a base having a first surface in a first plane, the first surface being configured to contact a system-on-chip SoC located on a circuit board; a plurality of heat transfer members connected to and extending from the base, wherein the plurality of heat transfer members are configured to extend along a longitudinal length in a second plane having a first spacing from the first plane, and wherein the plurality of heat transfer members respectively include opposing inner walls defining a second spacing between the plurality of heat transfer members; as well as a housing at least partially surrounding the plurality of heat transfer members, the housing comprising: a proximal panel positioned on a first side of the plurality of heat transfer members and configured to face the circuit board; as well as a distal panel on a second side of the plurality of heat transfer members, wherein the second side is opposite the first side, Wherein both the proximal panel and the distal panel extend longitudinally from respective proximal ends adjacent the base to respective distal ends distal from the base, wherein the respective distal ends define an opening at an end of the heat transfer member. 2 . The heat sink of claim 1 , further comprising a plurality of arms, each arm extending from opposite sides of the base, each arm having a shape defining a clip configured to attach to the circuit board.

3. The heat sink of claim 1 , wherein the plurality of heat transfer members include a connector portion proximate the base, wherein the connector portion is sized to define the first spacing between the second plane of the plurality of heat transfer members and the first plane of the first surface of the base. The heat sink according to claim 3 , wherein the connector portion is bent at an inflection point. 5 . The heat sink of claim 1 , wherein the first surface of the base has a first surface area that is greater than a second surface area of ​​a corresponding surface of the SoC. 6 . The heat sink of claim 1 , further comprising a thermal adhesive configured to attach the base to the SoC. 7 . The heat sink of claim 1 , wherein the housing includes a base plate that contacts the base at a second surface opposite the first surface of the base.

8. The heat sink of claim 1, wherein the housing includes one or more interior side walls defining one or more side vents between the proximal panel and the distal panel.

9. The heat sink of claim 1, wherein the plurality of heat transfer members have a greater thermal conductivity than the housing.

10. A computer system comprising: A printed circuit board including a system on a chip SoC and at least one additional component; a heat sink comprising a base having a first surface in a first plane, the first surface configured to attach a surface of the SoC, the heat sink further comprising a plurality of heat transfer members connected to and extending from the base, wherein the plurality of heat transfer members are configured to extend along a longitudinal length in a second plane having a first spacing from the first plane, and wherein the plurality of heat transfer members respectively include opposing inner walls defining a second spacing between the plurality of heat transfer members; as well as a housing at least partially surrounding the plurality of heat transfer members, the housing comprising: a proximal panel positioned on a first side of the plurality of heat transfer members and configured to face the circuit board; as well as a distal panel on a second side of the plurality of heat transfer members, wherein the second side is opposite the first side, Wherein both the proximal panel and the distal panel extend longitudinally from respective proximal ends adjacent the base to respective distal ends distal from the base, wherein the respective distal ends define an opening at an end of the heat transfer member. 11 . The computer system of claim 10 , further comprising an air source configured to move air from ends of the plurality of heat transfer members toward the SoC.

12. The computer system of claim 10, wherein the printed circuit board is a memory microcontroller card.

13. The computer system of claim 10, wherein the plurality of heat transfer members include a connector portion proximate the base, wherein the connector portion is sized to define the first spacing between the second plane of the plurality of heat transfer members and the first plane of the first surface of the base.

14. The computer system of claim 10, wherein the first surface of the base has a first surface area that is greater than a second surface area of ​​a corresponding surface of the SoC. 15 . The computer system of claim 10 , wherein the housing includes a base plate that contacts the base at a second surface opposite the first surface of the base.

16. The computer system of claim 10, wherein the housing includes one or more interior side walls defining one or more side vents between the proximal panel and the distal panel.

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