Slide rails as airflow channels

Abstract

An airflow device includes a cooling air passage structure formed outside and along one side of a server chassis, the cooling air passage structure extending from the front side of the server chassis in the depth direction of the server chassis. The airflow device also includes an airflow channel formed in the cooling air passage structure, the airflow channel extending in the depth direction, and a vent that connects the airflow channel to the inside of the server chassis at a vent position, the vent position being rearward relative to the front side in the depth direction.

Description

Background Art

[0001] Cooling server components for optimal performance is important to general server functionality. Temperature control in server racks can generate a lot of heat, which presents an even greater challenge. Air may be drawn into the interior of the server that is cooler than the air already circulating within the server. The continued drawing in of cooler air results in a continuous transfer of heat from the server's heat-generating components to the drawn-in air. The circulating air is then exhausted from the interior of the server to the exterior of the server, cooling the internal components. Certain portions of the server, especially those where hard drives, batteries, and other heat-generating components are located, may receive special consideration in the temperature control design for cooling the server. Summary of the invention

[0002] An airflow device is provided. The airflow device may include a cooling air passage structure formed outside a server chassis and along a side thereof, the cooling air passage structure extending from a front side of the server chassis in a depth direction of the server chassis. The airflow device may also include an airflow channel formed in the cooling air passage structure, the airflow channel extending in the depth direction, and a vent fluidly connecting the airflow channel and the interior of the server chassis at a vent position, the vent position being rearward relative to the front side in the depth direction.

[0003] This summary is provided to introduce a selection of concepts that are further described in the detailed description below in a simplified form. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Furthermore, the claimed subject matter is not limited to implementations that solve any or all disadvantages noted in any part of this disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 A schematic diagram of an example hardware environment is shown in which an airflow device may be implemented.

[0005] Figure 2 According to an example embodiment, Figure 1 An enlarged view of a portion of an airflow device implemented in an electronic device.

[0006] Figure 3 yes Figure 1 A detailed view of the internal parts of an electronic device, Figure 1 An electronic device includes an airflow device according to an example embodiment.

[0007] Figure 4 yes Figure 1 A top view of an electronic device. Figure 1 An electronic device includes an airflow device according to an example embodiment.

[0008] Figure 5 is a flow chart of a method according to one embodiment of the present disclosure. DETAILED DESCRIPTION

[0009] An airflow device is disclosed herein to enhance air flow to the interior of an electronic device, such as a server. Moving ambient air to the interior of an electronic device in order to cool heat-generating components within the device may be important to maintaining peak performance of the device. In some prior configurations, baffles are placed within the chassis of a computing device in an attempt to direct air through the chassis of the computing device to specific interior areas that include heat-generating components. However, as the density of components within servers increases, it has been found that in some cases the interiors of these densely packed computing devices can impede effective air flow through the devices. For this reason, it has become increasingly difficult to draw in enough air to flow through the interior of such a device to the various areas that require cooling.

[0010] Specifically, in some computing device configurations, such as blade servers mounted in racks in a data center environment, it is a challenge to provide adequate ambient air to the rear of the device. Cooling air can be drawn into the front of the server by fans mounted at the rear of the server; however, intermediate components may obstruct the path of the cooling airflow, preventing it from adequately reaching the rear area of ​​the device. In addition, the air drawn into the device may become too hot when circulated, thereby preventing the reliable operation of the device. Since power supply units and hard drives are typically placed near the rear area of ​​the device, it may be important to maintain cooler airflow to provide adequate cooling for these components at the rear of the device. To address these issues, an example configuration of an airflow device is disclosed herein that utilizes one or more additional airflow channels that are disposed outside the chassis of the computing device. These channels can direct the airflow through the slide rails of the chassis to an area inside the chassis, thereby increasing the cooling airflow to the rearward area within the chassis.

[0011] Figure 1 A schematic diagram of an example hardware environment is shown that includes an electronic device 10 on which an airflow device 12 can be implemented. In this example configuration, the electronic device 10 is a blade server that includes the airflow device 12. The blade server may include a power supply unit (PSU) 60, a battery 62, a hard drive 64, and a processor 66, among other components. These and other components may generate heat when operating, so a design that allows cooler air to enter the interior of the blade server may be advantageous. The PSU fan 70 and the system fan 54 can be placed toward the rear of the electronic device 10 to help draw air from the front side 68 of the electronic device 10 to the rear side 58 (e.g., Figure 4The slide rail (first slide rail 14 of the server chassis 16) may be outside the server chassis 16 and along one side (first side 34) of the server chassis 16. The slide rail of the server chassis 16 may allow the blade server to be placed in a server rack (not shown). The airflow device 12 may include a cooling air duct structure formed outside and along one side of the server chassis 16. The cooling air duct structure may extend from the front side 68 of the server chassis 16 in the depth direction D of the server chassis 16. Figure 1 , an example airflow is indicated by an arrow from the front side 68 of the electronic device 10 to the first vent 20; wherein the dashed arrows represent airflow within the cooling air passage structure of the airflow device 12. In the example discussed below, the cooling air passage structure may be the first rail 14 of the server chassis 16.

[0012] Figure 2 FIG. 1 is an enlarged view of a portion of an airflow device that may be implemented in the electronic device 10. An airflow channel may be formed within the cooling air passage structure, and the airflow channel may be referred to as a first airflow channel 18. The first airflow channel 18 may be located in the first rail 14 and extend in the depth direction D of the server chassis 16. Figure 2 As shown, it should be understood that the first airflow channel 18 can be integral with the first rail 14 and located outside the interior 22 of the server chassis 16. Figure 2 As shown, two arrows indicate the flow of air that may enter the opening of the first airflow channel 18, a set of three parallel arrows indicate the direction of airflow through the first airflow channel 18, and the set of three parallel arrows are indicated by dashed lines where airflow is indicated inside the first airflow channel 18. One potential advantage of positioning the first airflow channel 18 outside the server chassis 16 is that the air may not be preheated before being directed to the vicinity of the heat generating components, unlike air that is only drawn from the front side 68 of the electronic device 10 and directed to the back side 58 through the server chassis 16.

[0013] Figure 3 FIG. 1 is an enlarged view of a portion of the airflow device 12, showing a depth direction D along the first side 34 of the server chassis 16, which is larger than FIG. Figure 2 The view shown is closer to the rear of the server chassis 16. Figure 3As shown, the vent (which can be understood as the first vent 20) can fluidly connect the first airflow channel 18 to the interior 22 of the server chassis 16 at a vent position, which is rearward relative to the front side 68 along the depth direction D. The dashed line with the arrow tip represents an example airflow direction along the inside of the airflow device 12 to the first vent 20. The first vent 20 may include a channel opening (which may be referred to as a first channel opening 24), which may be located at a first depth 28 of the server chassis 16, and the channel opening is in the first airflow channel 18. The first vent 20 may also include a chassis opening (which may be referred to as a first chassis opening 26) in the server chassis 16. The first chassis opening 26 may coincide with the first channel opening 24, so that air flows from the first airflow channel 18 through the first channel opening 24 and enters the interior 22 of the server chassis 16 through the first chassis opening 26. Figure 3 The two parallel arrows in FIG. 1 represent an example airflow from the vent 20 at the overlapping opening toward the rear of the electronic device 10 along the depth direction D. Figure 3 As shown, airflow may not be introduced into the interior 22 of the server chassis 16 until the air reaches a location close to the components to be cooled, which in this case include the battery 62. In this example, a potential advantage of this configuration is that airflow inside the electronic device 10 does not need to travel very far within the interior 22 before reaching the battery 62 to be cooled.

[0014] Figure 4 is a top view of the electronic device 10. Figure 4 As shown, the airflow device 12 may also include a second channel opening 30 located at a second depth 32 of the server chassis 16, the second channel opening 30 being in the first airflow channel 18. However, while the second channel opening 30 may be present in the first airflow channel 18, an accompanying chassis opening may not be placed in the server chassis 16. As discussed further below, this design may promote preferred airflow from the first airflow channel 18 to the interior 22 of the server chassis 16 while allowing for ease of manufacturing of the first and second rails 14, 38, as the same component shape may be used for each of the first and second rails 14, 38, thereby reducing the number of unique components.

[0015] Considering the symmetry of server blades, e.g. Figure 4 As shown, it should be understood that the airflow device 12 can also include a second rail 38 of the server chassis 16, which is located outside and along the second side 36 of the server chassis 16. The second airflow channel 40 (which can be in the second rail 38) can extend in the depth direction D of the server chassis 16. The airflow device 12 can also include a third channel opening 44 at a third depth 46 and a fourth channel opening 48 at a fourth depth 50 in the second airflow channel 40. Although Figure 4 While the illustrated first depth 28 is depicted as being equal to the third depth 46 and the second depth 32 is depicted as being equal to the fourth depth 50, it should be understood that in some embodiments, each depth of the corresponding channel openings may be different and that any particular depth arrangement of a given channel opening may not be equal to any other depth arrangement of another given channel opening.

[0016] like Figure 4 As shown, the second vent 42 can fluidly connect the second airflow channel 40 with the interior 22 of the server chassis 16. The second vent 42 can include a fourth channel opening 48 and a second chassis opening 52 in the server chassis 16. The second chassis opening 52 can coincide with the fourth channel opening 48, so that air flows from the second airflow channel 40 through the fourth channel opening 48 and into the interior 22 of the server chassis 16 through the second chassis opening 52.

[0017] The depth of the first depth 28, at which the first chassis opening 26 may coincide with the first channel opening 24 in the first airflow channel 18, may be different from the fourth depth 50, at which the second chassis opening 52 may coincide with the fourth channel opening 48 in the second airflow channel 40. Figure 4 An example of such a structure is shown, where the first channel opening 24 is aligned with the first chassis opening 26 to form the first vent 20, while the second channel opening 30 is not aligned with the chassis opening and therefore does not allow airflow to enter the interior of the electronic device 10. Therefore, the air drawn into the first airflow channel 18 can be directed entirely toward the rear of the blade server to cool the PSU 60, specifically the PSU battery 62. However, on the second side 36, the third channel opening 44 is not aligned with the chassis opening, and the fourth channel opening 48 coincides with the second chassis opening 52 to form the second vent 42. The airflow at the second vent 42 can be directed primarily to the hard drive 64. Therefore, as shown, the depth of the first depth 28 is different from the fourth depth 50 to selectively direct air to a preferred location in the interior 22 of the server chassis 16. Therefore, airflow can be intentionally directed through the interior 22 of the server chassis 16. However, the first and second rails 14, 38 can have channel openings at the same depth along each rail, so the rails can be more easily manufactured due to this symmetry.

[0018] In an alternative configuration, a first plurality of channel openings may be formed in the first airflow channel 18 and a second plurality of channel openings may be formed in the second airflow channel 40. Each of the first plurality of channel openings may be located at a different depth along the depth direction D, and each of the second plurality of channel openings may be located at a depth along the depth direction D that is the same as the depth of each of the first plurality of channel openings. In this configuration, each channel opening may be spaced apart from any other channel openings, either regularly or irregularly, by a preferred amount. However, by forming each of the second plurality of channel openings at the same depth as the first plurality of channel openings, the first and second slide rails 14, 38 may be matched so that they are similarly manufactured and therefore may be more efficiently manufactured as described above.

[0019] Continuing in this example, one or more chassis openings in the server chassis 16 can be along the first side 34 and / or the second side 36 of the server chassis 16. At least one vent can be formed to include one of the first and second plurality of channel openings that coincide with one of the one or more chassis openings. In this configuration, any one or more chassis openings can be formed to align with any of the channel openings to selectively form and place one or more vents along the first and second sides 34, 36 of the server chassis 16. Each vent can fluidly connect at least one of the first airflow channel 18 and the second airflow channel 40 to the interior 22 of the server chassis 16 at a venting location that is rearward relative to the front side 68 in the depth direction D. A potential advantage of this configuration is that by designing the first and second rails 14, 38 to have channel openings at set predetermined locations, the chassis openings can be selectively matched, so that the vents can be effectively strategically placed along the server chassis 16.

[0020] It should be understood that this selective alignment of the channel openings with the chassis openings can allow for intentional placement of vents to potentially bring relatively fresh air to components within the electronic device 10, particularly to the rear of the device 10. It should also be understood that while the arrangement of each channel opening in the rails can be identical to facilitate manufacture of the rails, the arrangement of the chassis openings used to create the selectively arranged vents can ultimately determine the location of the airflow from the corresponding airflow channel to the interior 22 of the server chassis 16. Alternatively, it should also be understood that the placement of the channel openings in the rails can be located at different depths for each rail, such that the channel openings are asymmetric along each rail. In some applications of vent and airflow design, an asymmetric design may be advantageous.

[0021] The rear side 56 of the first airflow channel 18 can be blocked by a restrictor 72, which is included at the rear end of the first airflow channel 18, so that hot air from the rear side 58 of the server chassis 16 can be prevented from entering the first airflow channel 18. This configuration may be advantageous when heat-generating components (such as PSU 60) are located near the rear of the blade server and make the air around this area warmer than the ambient air. Blocking the rear side 56 of the first airflow channel 18 (or the second airflow channel 40) can prevent this warmer air from entering the corresponding airflow channel.

[0022] Figure 5 1 shows a flow chart of a method 500 for manufacturing an airflow device 12. The following description of the method 500 is based on the description above and in Figure 1 The method 500 is provided by the airflow device 12 shown in the electronic device 10. It should be understood that the method 500 may also be performed in other contexts using other suitable components.

[0023] refer to Figure 5 At 502, a method 500 for manufacturing an airflow device 12 may include forming a cooling air duct structure including an airflow channel, which may be a first airflow channel 18 formed therein. At 504, the method 500 may include connecting the cooling air duct structure from the outside to and along a side, which may be a first side 34 of the server chassis 16, the cooling air duct structure and the first airflow channel 18 extending from the front side 68 of the server chassis 15 along the depth direction D of the server chassis 16. At 506, the method 500 may include aligning the vent, which may be the first vent 20, to fluidly connect the first airflow channel 18 with the interior 22 of the server chassis 16 at a vent location that is rearward relative to the front side 68 in the depth direction D. A potential advantage of this configuration is that by providing a cooling air duct on the outside of the server chassis 16, air drawn from the outside of the server may not absorb a significant amount of heat before entering the interior 22 of the server along the first side 34 of the server chassis 16 at the first vent 20. Thus, when air eventually moves through the first vent 20, it can have a greater cooling effect on the heat generating components near the first vent 20 than air entering the front side 68 of the server (which may have to travel within the server where that air may be warmer than the ambient air around the heat generating components near the first vent).

[0024] As described above, the cooling air passage structure may be a rail, which may be a first rail 14 of the server chassis 16. The method 500 may also include forming a channel opening, which may be a first channel opening 24 in the first airflow channel 18, and forming a chassis opening, which may be a first chassis opening 26 of the server chassis 16. Aligning the first vent 20 may include aligning the first channel opening 24 in the airflow channel 18 with the first chassis opening 26. The first chassis opening 26 may coincide with the first channel opening 24, so that air flows from the first airflow channel 18 through the first channel opening 24 and into the interior 22 of the server chassis 16 through the first chassis opening 26. As described above, the channel opening may be the first channel opening 24. The first channel opening 24 may be at a first depth 28 of the server chassis 16. The method 500 may also include forming a second channel opening 30 at a first depth 32 of the server chassis 16. It should be understood that the placement of the first and second channel openings 24, 30 along the first airflow channel 18 may be based on a preferred design that may reflect the components and / or planned airflow arrangement within the server.

[0025] As described above, the rail may be the first rail 14, the side of the server chassis 16 may be the first side 34, the airflow channel may be the first airflow channel 18, and the vent may be the first vent 20. The method 500 may include connecting the second rail 38 of the server chassis 16 to the exterior of the server chassis 16 and along the second side 36 of the server chassis 16. The method 500 may also include forming a second airflow channel 40, which may be formed in the second rail 38 and extend along the depth direction D of the server chassis 16. The method 500 may also include aligning the second vent 42 to fluidly connect the second airflow channel 40 with the interior 22 of the server chassis 16. It should be understood that although the first and second rails 14, 38 may be manufactured with symmetry in mind, the first and second airflow channels 18, 40 are similarly formed in their respective rails. The channel openings may also be symmetrical about the first and second sides 34, 36; however, the first and second vents 20, 42 may be asymmetrically aligned. This design may have potential advantages as further explained below.

[0026] The method 500 may include forming a third channel opening 44 at a third depth 46 in the second airflow channel 40 and forming a fourth channel opening 48 at a fourth depth 50 in the second airflow channel 40. As described above, the chassis opening may be the first chassis opening 26. The method 500 may include forming a second chassis opening 52 in the server chassis 16. Aligning the second vent 42 may include aligning the fourth channel opening 48 and the second chassis opening 52 in the server chassis 16, the second chassis opening 52 coinciding with the fourth channel opening 48, such that air flows from the second airflow channel 40 through the fourth channel opening 48 and into the interior 22 of the server chassis 16 through the second chassis opening 52.

[0027] It should be understood that the first and second vents 20, 42 can be located at different depths along the first and second sides 34, 36 of the server. That is, the first depth 28, where at the first depth the first chassis opening 26 coincides with the first channel opening 24 in the first airflow channel 18, can be located at a depth different from the fourth depth 50, where at the first depth the first chassis opening 26 coincides with the first channel opening 24 in the first airflow channel 18, and at the fourth depth the second chassis opening 52 coincides with the fourth channel opening 48 in the second airflow channel. In this way, while the channel openings can be placed at the same depth corresponding to the first and second sides 34, 36 of the first and second rails 14, 38 to potentially simplify rail manufacturing, the chassis openings can be at different depths to selectively align with the channel openings. Therefore, airflow can be specifically directed to each of the first and second sides 34, 36 of the server.

[0028] As described above, the restrictor 72 may be included at the rear end of the first airflow channel 18 so that air from the back side 58 of the server chassis 16 may be prevented from entering the first airflow channel 18. Because heat generating components may be located near the rear of the server, the air temperature around the rear of the server may be elevated compared to the ambient air away from the rear of the server. Therefore, placing the restrictor 72 near the rear of the first and second airflow channels 18, 40 may be beneficial in maintaining airflow from the front side 68 of the server toward the rear, rather than airflow entering from the back side 58.

[0029] As described herein, the airflow device 12 can be implemented in the electronic device 10 to potentially draw ambient air from the exterior of the electronic device 10 into the interior area. Outside the electronic device 10, the airflow device 12 can take up no space inside the electronic device 10, thereby leaving room for other components and / or allowing for increased airflow space within the electronic device 10. In addition, the air flowing through the airflow channel can avoid being unnecessarily heated by heat-generating components during its travel to the exterior of the chassis. The placement of the channel openings and chassis openings to form vents at selected locations can be tailored to the ease of manufacturing and specificity of directing the airflow (particularly in the area at the rear of the chassis).

[0030] The present disclosure is presented by way of example and with reference to the relevant drawings. Parts, process steps and other elements that may be substantially the same in one or more drawings are identified in a coordinated manner and described with minimal repetition. However, it should be understood that the elements identified in a coordinated manner may also be different to some extent. It should also be noted that some figures may be schematic and not drawn to scale. The various drawing scales, aspect ratios and number of parts shown in the figures may be deliberately distorted to make certain features or relationships easier to see.

[0031] The following paragraphs provide additional support for the claims of the present application. One aspect provides an airflow device, which includes a cooling air passage structure, which is formed outside and along a side of a server chassis, and the cooling air passage structure extends from a front side of the server chassis in a depth direction along the server chassis. The airflow device includes an airflow channel formed in the cooling air passage structure, and the airflow channel extends in the depth direction. The airflow device includes an air vent that connects the airflow channel to an internal fluid of the server chassis at a vent location, and the vent is located rearward in the depth direction relative to the front side.

[0032] In this regard, additionally or alternatively, the cooling air pathway structure may be a slide rail of the server chassis. In this regard, additionally or alternatively, the vent may include a channel opening in the airflow channel and a chassis opening in the server chassis. In this regard, additionally or alternatively, the chassis opening may coincide with the channel opening so that air may flow from the airflow channel through the channel opening and into the interior of the server chassis through the chassis opening. In this regard, additionally or alternatively, the channel opening may be a first channel opening at a first depth of the server chassis, and the airflow device may further include a second channel opening at a second depth of the server chassis, the second channel opening being in the airflow channel.

[0033] In this regard, additionally or alternatively, the rail may be a first rail, the side of the server chassis may be a first side, the airflow channel may be a first airflow channel, and the vent may be a first vent. The airflow device may also include: a second rail of the server chassis, the second rail being located outside and along the second side of the server chassis; a second airflow channel, which may be located in the second rail and extends in a depth direction of the server chassis; and a second vent for connecting the second airflow channel to an internal fluid of the server chassis.

[0034] In this regard, additionally or alternatively, the airflow device may also include a third channel opening at a third depth in the second airflow channel and a fourth channel opening at a fourth depth. In this regard, additionally or alternatively, the chassis opening may be a first chassis opening and the second vent may include a fourth channel opening and a second chassis opening in the server chassis. The second chassis opening may overlap with the fourth channel opening so that air may flow from the second airflow channel through the fourth channel opening and into the interior of the server chassis through the second chassis opening. In this regard, additionally or alternatively, the depth of the first depth may be different from the fourth depth, and at the first depth, the first chassis opening may overlap with the first channel opening in the first airflow channel, and at the fourth depth, the second chassis opening overlaps with the fourth channel opening in the second airflow channel.

[0035] In another aspect, a method for manufacturing an airflow device is provided. The method includes forming a cooling air passage structure, the cooling air passage structure including an airflow channel formed therein. The method also includes connecting the cooling air passage structure to the outside of a side of the server chassis along a side of the server chassis, the cooling air passage structure and the airflow channel extending from the front side of the server chassis in a depth direction of the server chassis. The method also includes aligning the vent to fluidly connect the airflow channel to the interior of the server chassis at the vent location, the vent location being rearward relative to the front side in a depth direction.

[0036] In this regard, additionally or alternatively, the cooling air passage structure may be a slide rail of the server chassis. In this regard, additionally or alternatively, the method may further include forming a channel opening in the airflow channel and forming a chassis opening in the server chassis; aligning the vents, which may include aligning the channel opening in the airflow channel with the chassis opening in the server chassis. In this regard, additionally or alternatively, the chassis opening may coincide with the channel opening so that air can flow from the airflow channel through the channel opening and into the interior of the server chassis through the chassis opening. In this regard, additionally or alternatively, the channel opening may be a first channel opening at a first depth of the server chassis, and the method may further include forming a second channel opening at a second depth of the server chassis, the second channel opening being in the airflow channel.

[0037] In this regard, additionally or alternatively, the rail may be a first rail, the side of the server chassis may be a first side, the airflow channel may be a first airflow channel, and the vent may be a first vent. The method may also include connecting a second rail of the server chassis to the outside of the second side of the server chassis along the second side of the server chassis; forming a second airflow channel, which may be formed in the second rail and extends in a depth direction of the server chassis; and aligning the second vent to connect the second airflow channel to the interior fluid of the server chassis.

[0038] In this regard, additionally or alternatively, the method may further include forming a third channel opening at a third depth in the second airflow channel and forming a fourth channel opening at a fourth depth in the second airflow channel. In this regard, additionally or alternatively, the chassis opening may be a first chassis opening, and the method may further include forming a second chassis opening in the server chassis. Aligning the second vent may include aligning a fourth channel opening and a second chassis opening in the server chassis, the second chassis opening coinciding with the fourth channel opening, so that air can flow from the second airflow channel through the fourth channel opening and enter the interior of the server chassis through the second chassis opening. In this regard, additionally or alternatively, the depth of the first depth may be different from the fourth depth, at the first depth, the first chassis opening may coincide with the first channel opening in the first airflow channel, and at the fourth depth, the second chassis opening may coincide with the fourth channel opening in the second airflow channel.

[0039] On the other hand, an airflow device is provided, comprising: a first cooling air passage structure, the first cooling air passage structure is a first slide rail of a server chassis, the first slide rail is formed outside the server chassis and along the first side of the server chassis, and the cooling air passage structure extends from the front side of the server chassis along the depth direction of the server chassis. The airflow device comprises a second cooling air passage structure, the second cooling air passage structure is a second slide rail of the server chassis, the second slide rail is formed outside the second side of the server chassis and along the second side of the server chassis, and the second cooling air passage extends from the front side of the server chassis in the depth direction of the server chassis. The airflow device comprises a first airflow channel formed in the first cooling air passage structure and a second airflow channel formed in the second cooling air passage structure, and the first airflow channel and the second airflow channel extend in the depth direction. The airflow device comprises a first plurality of channel openings in the first airflow channel and a second plurality of channel openings in the second airflow channel, each of the first plurality of channel openings is located at a different depth along the depth direction, and each of the second plurality of channel openings is at the same depth as each of the first plurality of channel openings along the depth direction. The airflow device includes one or more chassis openings in the server chassis along a first side and / or a second side of the server chassis, and at least one vent, which includes one of a first and a second plurality of channel openings, one of the first and second plurality of channel openings coincides with one of the one or more channel openings to fluidly connect at least one of the first and second airflow channels with the interior of the server chassis at the vent location, which is rearward relative to the front side in the depth direction.

[0040] It should be understood that the configuration and / or method described herein are exemplary in nature, and these specific embodiments or examples should not be considered restrictive, because many variations are possible. The specific program or method described herein can represent one or more of any number of processing strategies. Therefore, the various actions shown and / or described can be performed in the order shown and / or described, in other orders, in parallel or omitted. Likewise, the order of the above-mentioned process can be changed. If used in this article, a phrase in the form of "at least one of A and B" represents at least one A or at least one B, is not mutually exclusive, and does not require at least one A and at least one B. If used in this article, the phrase "and / or" refers to any or all of a variety of statement possibilities.

[0041] The subject matter of the present disclosure includes all novel and nonobvious combinations and subcombinations of the various processes, systems and configurations, and other features, functions, acts, and / or properties disclosed herein, as well as any and all equivalents thereof.

Claims

1. An air flow device, include: a first cooling air passage structure formed outside the interior of the server chassis and along a first side of the server chassis, the first cooling air passage structure extending from the front side of the server chassis in a depth direction of the server chassis, the first cooling air passage structure comprising a first slide rail of the server chassis; a first airflow channel opening and a second airflow channel opening formed in the first cooling air passage structure, the first airflow channel opening and the second airflow channel opening being arranged at respective first and second depths of the server chassis in the depth direction; as well as a second cooling air passage structure formed outside the interior of the server chassis and along a second side of the server chassis, the second cooling air passage structure comprising a second rail of the server chassis; as well as A third airflow channel opening and a fourth airflow channel opening are formed in the second cooling air passage structure, and the third airflow channel opening and the fourth airflow channel opening are arranged at respective third depths and fourth depths of the server chassis in the depth direction, wherein The first airflow channel opening is aligned with the first chassis opening at the first depth of the server chassis, The fourth airflow channel opening coincides with the second chassis opening at the fourth depth of the server chassis, and The first depth of the server chassis is disposed before the fourth depth of the server chassis.

2. The airflow device of claim 1 , wherein a first restrictor is included at a rear end of the first cooling air passage structure, and a second restrictor is included at a rear end of the second cooling air passage structure, so that air from the back side of the server chassis is prevented from entering the first cooling air passage structure and the second cooling air passage structure.

3. A method for manufacturing an airflow device, the method include: forming a first cooling air passage structure, the first cooling air passage structure comprising a first slide rail of the server chassis and a first airflow passage opening and a second airflow passage opening formed therein; connecting the first cooling air passage structure to the interior exterior of the server chassis along a first side of the server chassis, the first cooling air passage structure extending from the front side of the server chassis in a depth direction of the server chassis, and the first airflow channel opening and the second airflow channel opening being arranged at respective first and second depths of the server chassis in the depth direction of the server chassis; forming a second cooling air passage structure, the second cooling air passage structure comprising a second rail of the server chassis and a third airflow passage opening and a fourth airflow passage opening formed therein; The second cooling air passage structure is connected to the interior of the server chassis along the second side of the server chassis, the second cooling air passage structure extends in the depth direction of the server chassis, and the third airflow channel opening and the fourth airflow channel opening are arranged at the respective third depth and fourth depth of the server chassis in the depth direction of the server chassis, wherein The first airflow channel opening is aligned with the first chassis opening at the first depth of the server chassis, The fourth airflow channel opening coincides with the second chassis opening at the fourth depth of the server chassis, and The first depth of the server chassis is disposed before the fourth depth of the server chassis.

4. The method according to claim 3, further comprising: include: forming a first restrictor at a rear end of the first cooling air passage structure; as well as A second restrictor is formed at a rear end of the second cooling air passage structure.

5. An air flow device, include: a first cooling air passage structure, the first cooling air passage structure comprising a first rail of the server chassis formed outside the interior of the server chassis and along a first side of the server chassis, the cooling air passage structure extending from a front side of the server chassis in a depth direction of the server; a second cooling air passage structure, the second cooling air passage structure comprising a second rail of the server chassis formed outside the interior of the server chassis and along a second side of the server chassis, the second cooling air passage structure extending from a front side of the server chassis in a depth direction of the server chassis; a first airflow passage formed in the first cooling air passage structure and a second airflow passage formed in the second cooling air passage structure, the first airflow passage and the second airflow passage extending in the depth direction; a first plurality of channel openings in the first airflow channel and a second plurality of channel openings in the second airflow channel, each of the first plurality of channel openings being at a different depth in the depth direction, and each of the second plurality of channel openings being at the same depth in the depth direction as each of the first plurality of channel openings; one or more chassis openings in the server chassis along the first side of the server chassis; one or more chassis openings in the server chassis along the second side of the server chassis; a first vent including one of the first plurality of channel openings coincident with one of the one or more chassis openings along the first side of the server chassis to fluidly connect at least one of the first airflow channels with an interior of the server chassis at a first vent location that is rearward in a depth direction relative to the front side; as well as A second vent includes one of the second plurality of channel openings that coincides with one of the one or more chassis openings along the second side of the server chassis to fluidly connect at least one of the second airflow channels with the interior of the server chassis at a second vent location that is rearward in the depth direction relative to the first vent location.

6. The airflow device according to claim 5, further comprising: include: A first restrictor at the rear end of the first cooling air passage structure, and a second restrictor at the rear end of the second cooling air passage structure, prevent air from the rear side of the server chassis from entering the corresponding first cooling air passage structure and the second cooling air passage structure.

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