Display device, electronic device, and method for manufacturing a bending region of a display device

Abstract

The embodiment of the present application provides a display device, an electronic device and a method for manufacturing a bending zone of the display device, wherein the display device comprises: a display zone for displaying an image; a binding zone arranged on the back of the display zone of the display zone, wherein the binding zone is used to arrange a driver chip; and a bending zone connected between the display zone and the binding zone, wherein the bending zone comprises a substrate portion and a conductive portion, wherein elastic particles are arranged in the substrate portion. The elastic particles are arranged in the substrate portion of the bending zone, so as to reduce the elastic modulus of the bending zone, improve the elasticity and stretchability of the bending zone, protect the conductive portion in the bending zone, and make the bending zone less susceptible to damage.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a display device, an electronic device, and a method for manufacturing a bending region of a display device. Background Art

[0002] With the development of communication technology, electronic devices such as smart phones are becoming more and more popular. During the use of electronic devices, the electronic devices can use their display screens to display images.

[0003] In the related art, by increasing the screen-to-body ratio of the display screen, better display effects and user experience can be obtained. In order to achieve a higher screen-to-body ratio, the driver chip of the display screen can be set on the back of the display screen, and the driver chip is electrically connected to the display area of ​​the display screen through a padbending, but the padbending is easily damaged due to the stress caused by the bending. Summary of the invention

[0004] The embodiments of the present application provide a display device, an electronic device, and a method for manufacturing a bending zone of a display device, which can reduce the elastic modulus of the bending zone, improve the elasticity of the bending zone, and make the bending zone less susceptible to damage.

[0005] The present application provides a display device, which includes:

[0006] Display area, used for displaying pictures;

[0007] a binding area, where the display back of the display area is arranged, and the binding area is used to arrange a driving chip; and

[0008] The bending area is connected between the display area and the binding area, and the bending area includes a substrate portion and a conductive portion, and elastic particles are arranged in the substrate portion.

[0009] The present application also provides an electronic device, which includes:

[0010] A display device, wherein the display device is the display device described above; and

[0011] The circuit board is electrically connected to the binding area of ​​the display device.

[0012] The embodiment of the present application also provides a method for manufacturing a bending region of a display device, which includes:

[0013] obtaining a stock solution of a first material;

[0014] adding elastic particles into the stock solution to obtain a mixed solution;

[0015] solidifying the mixed liquid to form a substrate;

[0016] disposing a conductive portion on the substrate; and

[0017] The mixed liquid is disposed on the conductive portion, and the mixed liquid on the conductive portion is solidified to obtain a bending region.

[0018] The embodiment of the present application also provides a method for manufacturing a bending region of a display device, which includes:

[0019] obtaining a first substrate;

[0020] Disposing a first mixed liquid including a first material and elastic particles on the first substrate;

[0021] solidifying the first mixed liquid to form a first intermediate layer;

[0022] Disposing a conductive portion on the first intermediate layer;

[0023] Disposing a second mixed liquid including a first material and elastic particles on the conductive portion;

[0024] solidifying the second mixed liquid to form a second intermediate layer; and

[0025] A stock solution of the first material is arranged on the second intermediate layer, and the stock solution is solidified to form a second substrate, thereby obtaining a bending area.

[0026] In the embodiment of the present application, elastic particles are provided in the substrate portion of the bending zone, which can reduce the elastic modulus of the bending zone, improve the elasticity and stretchability of the bending zone, protect the conductive portion in the bending zone, and make the bending zone less susceptible to damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for describing the embodiments are briefly introduced below.

[0028] Figure 1 A first structural schematic diagram of a display device provided in an embodiment of the present application.

[0029] Figure 2 for Figure 1 A schematic diagram of the structure of the display device after the bending area is bent.

[0030] Figure 3 for Figure 2 A schematic structural diagram of the display device from another angle.

[0031] Figure 4 for Figure 1 A first cross-sectional schematic diagram of a bending area in a display device along the AA direction is shown.

[0032] Figure 5 for Figure 1A second cross-sectional schematic diagram of the bending region of the display device along the AA direction is shown.

[0033] Figure 6 A second structural schematic diagram of the display device provided in an embodiment of the present application.

[0034] Figure 7 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0035] Figure 8 A schematic flow chart of a method for manufacturing a bending region of a display device provided in an embodiment of the present application.

[0036] Fig. 9 Another schematic diagram of the process of manufacturing a bending region of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0038] The present application embodiment provides a display device. Figures 1 to 3 , Figure 1 This is a schematic diagram of a first structure of a display device provided in an embodiment of the present application. Figure 2 for Figure 1 The structure diagram of the bending area of ​​the display device shown is after bending, Figure 3 for Figure 2 Another perspective structural diagram of the display device shown. The display device 20 includes a display area 220, a bending area 240 and a binding area 260. The display area 220 is used to display images. The binding area 260 is arranged on the display back side of the display area 220, and the binding area 260 is used to set a driver chip 262. The bending area 240 is connected between the display area 220 and the binding area 260.

[0039] Please combine Figure 4 , Figure 4 for Figure 1 The first cross-sectional schematic diagram of the bending zone along the AA direction in the display device shown. The bending zone 240 includes a substrate portion 242 and a conductive portion 244, and elastic particles 246 are arranged in the substrate portion 242. The elastic particles 246 are arranged in the substrate portion 242 of the bending zone 240, which can reduce the elastic modulus of the bending zone 240, improve the elasticity and stretchability of the bending zone 240, protect the conductive portion 244 in the bending zone 240, and make the bending zone 240 not easily damaged.

[0040] It should be noted that the display device can obtain better display effects and user experience by increasing its screen-to-body ratio. In order to achieve a higher screen-to-body ratio, the chip encapsulation on glass (Chip On Glass, COG) technology or chip encapsulation on film (Chip On Film, COF) technology can be used to encapsulate the driver chip. Both COG technology and COF technology require bending part of the non-display area of ​​the display device, and the part of the area to be bent is the bending area corresponding to the display device. Among them, the bending area is generally arranged at the lower end of the display device, so the width of the lower frame of the display device is significantly larger than other frames. In order to reduce the lower frame of the display device, it is necessary to reduce the bending radius of the bending area, but the smaller the bending radius, the greater the stress on the bending area, which is easy to cause damage to the bending area, causing abnormal display function of the display device. Especially for the OLED display screen of the 3D front cover, the deformation and stress of the bending area during the bonding process are much greater than those of 2D bonding. The bending zone 240 in the embodiment of the present application can reduce the elastic modulus of the bending zone 240, improve the elasticity and stretchability of the bending zone 240, protect the conductive portion 244 in the bending zone 240, and make the conductive portion 244 and the substrate portion 242 in the bending zone 240 less likely to break, that is, the bending zone 240 is not easily damaged and will not affect the display effect of the display device 20.

[0041] See also Figure 5 , Figure 5 for Figure 1 The second cross-sectional schematic diagram of the bending zone along the AA direction in the display device shown in the figure. The substrate portion 242 may include a first sub-substrate portion 2422, a second sub-substrate portion 2424 and a third sub-substrate portion 2426 connected in sequence, and the elastic particles 246 are arranged in the second sub-substrate portion 2424, and the elastic modulus of the second sub-substrate portion 2424 is smaller than the elastic modulus of the first sub-substrate portion 2422 and the third sub-substrate portion 2426. It can also be understood that the first sub-substrate portion 2422 and the third sub-substrate portion 2426 are not provided with elastic particles 246, and only the second sub-substrate portion 2424 is provided with elastic particles 246. The first sub-substrate portion 2422 and the third sub-substrate portion 2426, which are not provided with elastic particles 246 on both sides, can be used to protect the second sub-substrate portion 2424 provided with elastic particles 246, and the elasticity of the bending zone 240 can be improved by the second sub-substrate portion 2424 located in the middle.

[0042] It can be understood that the conductive part 244 is located in the second sub-substrate part 2424. The second sub-substrate part 2424 has good elasticity and stretchability. The second sub-substrate part 2424 wraps the conductive part 244, which can provide the conductive part 244 with good elastic force. For example, when the conductive part 244 is bent, there are elastic particles 246 around the bent area of ​​the conductive part 244. The elastic particles 246 have a certain elasticity. When the conductive part 244 is bent, the elastic particles 246 are squeezed. After being squeezed, a certain space can be vacated. Moreover, there are many elastic particles 246 around the bent area of ​​the conductive part 244, which can provide uniform support force to the bent area of ​​the conductive part 244. The stress generated by the bending of the conductive part 244 will be uniformly transmitted to the entire conductive part 244 or most of the conductive part 244 through the elastic particles 246, and the stress generated by the bending of the conductive part 244 will not be concentrated in a certain position. Compared with the rigid substrate part without elastic particles, when the conductive part 244 is bent, the stress generated by the bending is dispersed to multiple positions instead of being concentrated in the position where the conductive part 244 is most severely bent, thereby better protecting the conductive part 244, making the conductive part 244 in the bending area 240 not easy to break, improving the stability of the electrical conduction in the bending area 240, and improving the stability of the display function of the display device 20.

[0043] Because the conductive portion 244 is disposed in the second sub-substrate portion 2424, the thickness of the second sub-substrate portion 2424 may be greater than the thickness of the first sub-substrate portion 2422 and the third sub-substrate portion 2424, and even the thickness of the second sub-substrate portion 2424 may be greater than the sum of the thicknesses of the first sub-substrate portion 2422 and the third sub-substrate portion 2426. For example, the thickness of the second sub-substrate portion may be no less than 400 micrometers, and the thicknesses of the first sub-substrate portion and the third sub-substrate portion may both be no more than 200 micrometers.

[0044] Please continue reading Figure 4 In some embodiments, the substrate portion 242 may include a first material 248 and elastic particles 246, and the elastic modulus of the elastic particles 246 is less than the elastic modulus of the first material 248. It can also be understood that the elastic particles 246 are provided throughout the substrate portion 242, which improves the overall elastic performance of the bending zone 240. Such a structure facilitates the manufacture of the substrate portion 242, and the process of generating the bending zone 240 is simple and has high production efficiency. At the same time, the substrate portion 242 can well protect the conductive portion 244. When the conductive portion 244 is bent, the elastic particles 246 in the substrate portion 242 can well support the bent area of ​​the conductive portion 244, and disperse the stress generated by the bending of the conductive portion 244 to multiple positions, rather than concentrating on the position where the conductive portion 244 is bent the most severely, thereby better protecting the conductive portion 244, making the conductive portion 244 of the bending zone 240 not easy to break, improving the stability of the electrical conduction of the bending zone 240, and improving the stability of the display function of the display device 20.

[0045] The volume ratio of the elastic particles 246 to the first material 248 may be no greater than 1:4, that is, the doping ratio of the elastic particles 246 does not exceed 20%. The first material 248 may be polyimide, and the elastic particles 246 may be elastic material particles or inactive bubble particles. Exemplarily, the material of the elastic particles may be polyurethane elastomer rubber (TPU), polyolefin (PO), etc., or may be bubble particles of inactive gases such as N2 and Ar.

[0046] Since the thickness of the bending area 240 is very thin, the diameter of the elastic particles 246 is not greater than 2 microns. In order to improve the elasticity of the bending area 240, the elastic modulus of the elastic particles 246 should be less than 100 MPa.

[0047] It can be understood that the second sub-substrate portion may also include the first material and elastic particles. The material, structure and proportion of the first material and the elastic particles may be the same as those in the above embodiments, and will not be repeated here.

[0048] In order to further improve the elastic properties of the bending zone and reduce the risk of bending and breaking of the conductive part, the material of the conductive part can be nanosilver. In the related art, the conductive part of the bending zone is generally a titanium-aluminum alloy (such as Ti / Al / Ti alloy). Because the conductivity of nanosilver is better than that of titanium-aluminum alloy, under the same conditions (such as the same impedance or the same conductivity), the thickness of nanosilver can be less than that of titanium-aluminum alloy. For example, the thickness of titanium-aluminum alloy needs to be 700 nanometers, and the thickness of nanosilver can be less than 500 nanometers. Therefore, the material of the conductive part is nanosilver, and the thickness of the conductive part can be less than 500 nanometers. The smaller the thickness of the conductive part, the better the flexibility of the conductive part, the better the bending performance, and the less likely it is to bend and break. Moreover, the flexibility of the nanosilver material itself is better than that of titanium-aluminum alloy. It is also possible to reduce the bending radius of the bending zone, reduce the size of the lower frame of the display device, and increase the screen-to-body ratio of the display device.

[0049] In order to further improve the elastic performance of the bending zone and reduce the risk of bending and breaking of the conductive part, a hollow area can be set on the conductive part. The conductive part provided with a hollow area can effectively improve its flexibility and enhance the bending performance of the conductive part, thereby improving the bending performance of the entire bending zone and reducing the risk of bending and breaking of the conductive part.

[0050] It can be understood that the material of the conductive part in the display device can be nanosilver, and a hollow area can be set on the conductive part, so as to maximize the flexibility and bending performance of the conductive part, reduce the bending radius of the bending zone, reduce the size of the lower frame of the display device, and increase the screen-to-body ratio of the display device.

[0051] See also Figure 6 , Figure 6The display device 20 may further include a first fan-out area 250 and a second fan-out area 230 , wherein the bending area 240 is connected to the binding area 260 via the first fan-out area 250 , and the display area 220 is connected to the bending area 240 via the second fan-out area 230 .

[0052] The present application also provides an electronic device. Figure 7 , Figure 7 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. The electronic device 10 includes a display device 20 and a circuit board 140. The display device 20 can be the display device in any of the above embodiments, and the structure of the display device 20 is not repeated here. The circuit board 140 is arranged on the back of the display of the display device 20, and the circuit board 140 is electrically connected to the binding area of ​​the display device 20. The processor on the circuit board 140 can control the display of the display device 20, and the circuit board 140 and the display device 20 can cooperate to display images required by the user, such as operation interface images, application interface images, video images, etc. Among them, the display device 20 can be an organic light-emitting diode display device 20 (Organic Light-Emitting Diode, OLED) display device 20.

[0053] In order to have a more comprehensive understanding of the electronic device of the present application embodiment, the structure of the electronic device is further described below. Figure 7 The electronic device 10 further includes a housing 30, the housing 30 includes a frame 330 and a rear housing (not shown in the figure), and the display device 20 is installed in the housing 30. The display device 20 and the rear housing are located on opposite sides of the electronic device 10, and the electronic device 10 further includes a middle plate, and the frame 330 is arranged around the middle plate, wherein the frame 330 and the middle plate can form a middle frame of the electronic device 10. The middle plate and the frame 330 form a receiving cavity on both sides of the middle plate, wherein one receiving cavity receives the display device 20, and the other receiving cavity receives the circuit board 140, the battery 150 and other electronic components or functional modules of the electronic device 10.

[0054] The middle plate may be a thin plate or sheet structure, or a hollow frame structure. The middle frame is used to provide support for the electronic components or functional components in the electronic device 10, so as to install the electronic components and functional components in the electronic device 10 together. Functional components such as the camera assembly, receiver, circuit board 140, and battery 150 of the electronic device 10 can be installed on the middle frame or circuit board 140 for fixing. It can be understood that the material of the middle frame may include metal or plastic.

[0055] The circuit board 140 may be mounted on the middle frame. The circuit board 140 may be a mainboard of the electronic device 10. The circuit board 140 may be integrated with one or more functional components such as a microphone, a speaker, a receiver, an earphone interface, a camera assembly, an acceleration sensor, a gyroscope, and a processor. At the same time, the display device 20 may be electrically connected to the circuit board 140 so that the display of the display device 20 is controlled by the processor on the circuit board 140.

[0056] The battery 150 may be mounted on the middle frame. At the same time, the battery 150 is electrically connected to the circuit board 140 so that the battery 150 can power the electronic device 10. A power management circuit may be provided on the circuit board 140. The power management circuit is used to distribute the voltage provided by the battery 150 to various electronic components in the electronic device 10.

[0057] The display device 20 forms the display surface of the electronic device 10, which is used to display images, texts and other information. The display device 20 can be a full screen, that is, the front of the display device 20 is basically all display area. It should be noted that a camera 160 and / or some other optical sensors, such as proximity sensors, infrared sensors, etc., can be set below the display device 20. The display device can be set with a special display area corresponding to the optical sensor such as the camera, and the transmittance of the special display area is greater than that of other areas, so that the camera can obtain external light signal imaging through the special display area. In addition, the display device can also be all the same display area, and the optical sensor such as the camera can move between the inside and outside of the shell through a retractable driving mechanism, that is, the camera can move outside the shell to obtain external light signal imaging, and realize Selfie and other camera functions. In some other embodiments, the display device 20 can be a special-shaped screen, and the display device 20 may include a display area and a non-display area. Among them, the display area performs the display function of the display device 20, which is used to display images, texts and other information. The non-display area does not display information. A camera and / or other sensors, such as at least one of a proximity sensor, an infrared sensor, and an acoustic sensor, are set below the non-display area.

[0058] It is understandable that a cover plate may also be provided on the display device 20. The cover plate covers the display device 20 to protect the display device 20 and prevent the display device 20 from being scratched or damaged by water. The cover plate may be a transparent glass cover plate, so that the user can observe the information displayed by the display device 20 through the cover plate. For example, the cover plate may be a sapphire glass cover plate.

[0059] The present application also provides a method for manufacturing a bending region of a display device. Figure 8 , Figure 8 A schematic flow chart of a method for manufacturing a bending region of a display device provided in an embodiment of the present application. The method specifically comprises:

[0060] 401, obtain a stock solution of a first material. Exemplarily, the first material may be polyimide, and the stock solution of the first material may be understood as polyimide in a liquid state. It should be noted that the first material may be selected from other materials as needed, and other embodiments of the present application may select other materials as the first material as needed.

[0061] 402, adding elastic particles to the stock solution to obtain a mixed solution. Elastic particles are added to the stock solution of the first material to form a mixed solution. The elastic particles can be elastic material particles or inactive bubble particles. Exemplarily, the material of the elastic particles can be polyurethane elastomer rubber (TPU), polyolefin (PO), etc., and can also be bubble particles of inactive gases such as N2 and Ar. In order to improve the elasticity of the bending zone, the elastic modulus of the elastic particles is less than 100 MPa. Because the thickness of the bending zone is very thin, the diameter of the elastic particles is not more than 2 microns. It should be noted that the mixed solution needs to be processed such as stirring to make the elastic particles evenly distributed in the stock solution.

[0062] 403, solidify the mixed liquid to form a substrate. The mixed liquid can be solidified in a variety of ways. For example, the mixed liquid can be subjected to coating, exposure, development and other processes to finally obtain a solidified substrate.

[0063] 404, a conductive part is provided on the substrate. A conductive part is provided on the cured substrate, for example, a layer of conductive material is first coated, then cured, and then unnecessary parts are etched away to finally obtain the necessary conductive part.

[0064] 405, a mixed liquid is placed on the conductive part, and the mixed liquid on the conductive part is solidified to obtain a bending area. After obtaining the conductive part, a mixed liquid is placed on the conductive part again, and the mixed liquid is solidified to form a bending area, and the conductive part is placed in the middle of the bending area. The method of solidifying the mixed liquid on the conductive part is similar to the method of solidifying the mixed liquid into a substrate, and will not be repeated here.

[0065] It can be understood that the solidified portion of the mixed liquid on the substrate and the conductive portion in this embodiment can serve as the base material portion of the display device in the above embodiment.

[0066] The present application also provides a method for manufacturing a bending region of a display device. Fig. 9 , Fig. 9 Another schematic diagram of a method for manufacturing a bending region of a display device provided in an embodiment of the present application. The method specifically comprises:

[0067] 501, obtain a first substrate. Obtain a first substrate formed of a first material. The first substrate may be prepared in advance or prepared on site. For example, the first material may be polyimide.

[0068] 502, a first mixed liquid including a first material and elastic particles is arranged on a first substrate. The first mixed liquid is formed by adding elastic particles to a stock solution of the first material. The elastic particles may be elastic material particles or inactive bubble particles. Exemplarily, the material of the elastic particles may be polyurethane elastomer rubber (TPU), polyolefin (PO), etc., or bubble particles of inactive gases such as N2 and Ar. In order to improve the elasticity of the bending zone, the elastic modulus of the elastic particles is less than 100 MPa. Because the thickness of the bending zone is very thin, the diameter of the elastic particles is not more than 2 microns. It should be noted that the first mixed liquid needs to be processed, such as stirred, so that the elastic particles are evenly distributed in the stock solution.

[0069] 503, solidify the first mixed liquid to form a first intermediate layer. The first mixed liquid can be solidified in a variety of ways. For example, the first mixed liquid can be subjected to coating, exposure, development and other processes to obtain a solidified first intermediate layer.

[0070] 504, a conductive part is provided on the first intermediate layer. The conductive part is provided on the solidified first intermediate layer, for example, a layer of conductive material is coated on the first intermediate layer, then solidified, and then unnecessary parts are etched away to finally obtain the necessary conductive part.

[0071] 505, a second mixed solution including the first material and elastic particles is disposed on the conductive part. After the conductive part is obtained, a second mixed solution including the first material and elastic particles is disposed on the conductive part. It should be noted that the second mixed solution can be the same as the first mixed solution, and the second mixed solution can also use a different mixed solution according to the bending direction of the conductive part. For example, the doping ratio of the elastic particles is different, the material of the elastic particles is different, etc.

[0072] 506, solidify the second mixed liquid to form a second intermediate layer. The second mixed liquid is solidified to form the second intermediate layer. The method of solidifying the second mixed liquid into the second intermediate layer is similar to the method of solidifying the first mixed liquid into the second intermediate layer, which will not be repeated here. The first intermediate layer and the second intermediate layer can have the same layer structure, or can have layer structures with different elastic moduli. Depending on the bending direction of the conductive part, the first intermediate layer and the second intermediate layer can provide different elastic forces. For example, after the conductive part is bent, the first intermediate layer is located in the bending area of ​​the conductive part, and the elastic force of the first intermediate layer can be greater than the elastic force of the second intermediate layer, thereby providing better support for the conductive part.

[0073] 507, a stock solution of the first material is placed on the second intermediate layer, and the stock solution is solidified to form a second substrate, thereby obtaining a bending region. After obtaining the second intermediate layer, a stock solution of the first material is placed on the second intermediate layer, and the stock solution is solidified to form a second substrate, thereby obtaining a bending region. It can also be understood that the bending region includes the first substrate, the first intermediate layer, the conductive part, the second intermediate layer, and the second substrate in sequence.

[0074] It is understandable that in order to make the bending zone have better bending performance and a smaller bending radius, so that the frame of the display device is smaller, the thickness of the bending zone should be relatively thin. Exemplarily, the thickness of the first substrate and the second substrate is no more than 1 micron, the sum of the thickness of the first intermediate layer and the second intermediate layer is no more than 4 microns, and the thickness of the conductive part is no more than 2 microns.

[0075] It should be noted that the first substrate in this embodiment can be used as the first sub-substrate portion of the display device in the above embodiment, the first intermediate layer and the second intermediate layer can be used as the second sub-substrate portion of the display device in the above embodiment, and the second substrate can be used as the third sub-substrate portion of the display device in the above embodiment.

[0076] It can be understood that the manufacturing method of the bending zone of the display device in the embodiment of the present application forms the bending zone in the above-mentioned display device embodiment, and the structure of the bending zone of the display device in the above-mentioned embodiment can adopt the structure of the bending zone formed by the manufacturing method of the bending zone of the display device, which will not be repeated here.

[0077] The above is a detailed introduction to the display device, electronic device and method for manufacturing the bending zone of the display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. At the same time, for those skilled in the art, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display device, characterized in that: include: Display area, used for displaying pictures; A binding area, arranged on the display back side of the display area, and the binding area is used to arrange a driving chip; as well as A bending area connected between the display area and the binding area, the bending area comprising a substrate portion and a conductive portion, wherein elastic particles are arranged in the substrate portion, the elastic particles are elastic and are used to reduce the elastic modulus of the bending area and improve the elasticity and stretchability of the bending area; The substrate portion includes a first sub-substrate portion, a second sub-substrate portion and a third sub-substrate portion connected in sequence, the elastic particles are arranged in the second sub-substrate portion, the conductive portion is located in the second sub-substrate portion, and the elastic particles are arranged surrounding the conductive portion.

2. The display device according to claim 1, characterized in that The elastic modulus of the second sub-base portion is smaller than the elastic moduli of the first sub-base portion and the third sub-base portion.

3. The display device according to claim 1, characterized in that The base material portion includes a first material and the elastic particles, and an elastic modulus of the elastic particles is smaller than an elastic modulus of the first material.

4. The display device according to claim 3, characterized in that The volume ratio of the elastic particles to the first material is not greater than 1:

4.

5. The display device according to claim 3, characterized in that: The diameter of the elastic particles is no more than 2 microns, and the elastic modulus of the elastic particles is less than 100 MPa.

6. The display device according to claim 1, characterized in that: The elastic particles are elastic material particles or inactive bubble particles.

7. An electronic device, characterized in that: include: A display device, the display device being the display device according to any one of claims 1 to 6; as well as The circuit board is electrically connected to the binding area of ​​the display device.

8. A method for manufacturing a bending region of a display device according to any one of claims 1 to 6, characterized in that: include: obtaining a stock solution of a first material; Adding elastic particles to the stock solution to obtain a mixed solution; wherein the elastic particles are elastic and are used to reduce the elastic modulus of the bending zone and improve the elasticity and stretchability of the bending zone; solidifying the mixed liquid to form a substrate; disposing a conductive portion on the substrate; and The mixed liquid is disposed on the conductive portion, and the mixed liquid on the conductive portion is solidified to obtain a bending region.

9. A method for manufacturing a bending region of a display device according to any one of claims 1 to 6, characterized in that: include: obtaining a first substrate; A first mixed liquid including a first material and elastic particles is arranged on the first substrate; wherein the elastic particles have elasticity and are used to reduce the elastic modulus of the bending zone and improve the elasticity and stretchability of the bending zone; solidifying the first mixed liquid to form a first intermediate layer; Disposing a conductive portion on the first intermediate layer; Disposing a second mixed liquid including the first material and the elastic particles on the conductive portion; solidifying the second mixed liquid to form a second intermediate layer; and The stock solution of the first material is arranged on the second intermediate layer, and the stock solution is solidified to form a second substrate, thereby obtaining a bending area.

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