Radiators and electronic equipment

Abstract

The present application discloses a heat sink and an electronic device. The heat sink is used to dissipate heat from a chip and includes a heat-conducting substrate for bonding and fixing to the chip, a heat dissipation structure disposed on a surface of the heat-conducting substrate away from the chip, and an absorbing material capable of attenuating and absorbing electromagnetic waves disposed on at least one of the heat-conducting substrate and the heat dissipation structure. During use, the heat sink's heat-conducting substrate is bonded and fixed to the chip. During operation, the heat generated by the heat sink is conducted to the heat dissipation structure by the heat-conducting substrate, and the heat dissipation structure is then transferred to the outside world by the heat dissipation structure, thereby achieving cooling and heat dissipation of the chip. At the same time, the absorbing material reduces or blocks the propagation path of interference current on the heat sink surface, thereby reducing the electromagnetic energy received and emitted by the chip from the heat sink. This can effectively improve the chip's anti-interference performance, reduce the electromagnetic radiation emitted by the chip from the heat sink, and thus improve the operating performance of the electronic device.

Description

Technical Field

[0001] The present application relates to the technical field of anti-interference of electronic equipment, and more specifically, to a radiator. The present application also relates to an electronic device. Background Art

[0002] In electronic devices such as servers, heat sinks are attached to the chips to dissipate heat. However, these chips are sensitive to electromagnetic interference and are prone to malfunctioning during testing or when used in harsh electromagnetic environments. Furthermore, the high operating frequency of the chips can cause significant electromagnetic interference radiated from the heat sink, impacting the performance of the electronic device. Summary of the Invention

[0003] In view of this, the purpose of this application is to disclose a heat sink to improve the anti-interference performance and thereby improve the working performance of electronic equipment.

[0004] Another object of the present application is to disclose an electronic device comprising the above-mentioned radiator.

[0005] In order to achieve the above objectives, this application discloses the following technical solutions:

[0006] A heat sink for dissipating heat from a chip comprises a heat-conducting substrate for attaching and fixing to the chip, a heat dissipation structure provided on a surface of the heat-conducting substrate away from the chip, and an absorbing material capable of attenuating and absorbing electromagnetic waves provided on at least one of the heat-conducting substrate and the heat dissipation structure.

[0007] Preferably, in the above heat sink, the heat-conducting substrate is provided with a filling groove, and the filling groove is filled with an absorbing material.

[0008] Preferably, in the above heat sink, the filling groove is an annular groove formed on a circumferential side surface of the heat-conducting substrate perpendicular to the chip.

[0009] Preferably, in the above heat sink, the filling groove has a depth of 5-10 mm and a width of 1-2 mm.

[0010] Preferably, in the above-mentioned heat sink, an outer edge of a surface of the thermally conductive substrate for bonding with the chip is provided with an absorbing material.

[0011] Preferably, in the above heat sink, a wave absorbing material is provided on a circumferential side surface of the heat conductive substrate perpendicular to the chip.

[0012] Preferably, in the above-mentioned radiator, the absorbing material is a ferrite absorber, a magnetic microsphere absorber or a carbon-based absorber.

[0013] Preferably, in the above-mentioned heat sink, the heat dissipation structure comprises a plurality of heat dissipation fins vertically arranged on the heat-conducting substrate and evenly distributed, and a partial surface of the heat dissipation fins is compounded with an absorbing material.

[0014] As can be seen from the above technical solution, in the heat sink for chip heat dissipation disclosed in the present application, at least one of the thermally conductive substrate and the heat dissipation structure is provided with an absorbing material capable of attenuating and absorbing electromagnetic waves. When in use, the thermally conductive substrate of the heat sink is bonded and fixed to the chip. During operation, the heat generated by the heat sink is conducted to the heat dissipation structure by the thermally conductive substrate, and the heat dissipation structure is used to transfer the heat to the outside, thereby achieving cooling and heat dissipation of the chip. At the same time, the absorbing material reduces or blocks the propagation path of the interference current on the surface of the heat sink, thereby reducing the electromagnetic energy received and emitted by the chip from the heat sink, which can effectively improve the anti-interference performance of the chip, reduce the electromagnetic radiation emitted by the chip from the heat sink, and thus improve the operating performance of the electronic device.

[0015] The present application also discloses an electronic device, including a chip and a radiator for dissipating heat from the chip. The radiator is any of the above-mentioned radiators. Since the above-mentioned radiator has the above-mentioned effect, the electronic device having the above-mentioned radiator has the same effect, so it will not be repeated in this article.

[0016] Preferably, in the above electronic device, the chip and the heat sink are fixed together by thermally conductive adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 This is a front view of the radiator disclosed in the embodiment of the present application;

[0019] Figure 2 is a bottom view of the thermally conductive substrate disclosed in an embodiment of the present application;

[0020] Figure 3 This is a schematic diagram of the anti-interference principle when the radiator disclosed in the embodiment of the present application is used;

[0021] Figure 4 This is a schematic diagram of the principle of reducing electromagnetic radiation when the radiator disclosed in the embodiment of the present application is used. DETAILED DESCRIPTION

[0022] The embodiment of the present application discloses a radiator, which improves anti-interference performance and thereby improves the operating performance of electronic equipment.

[0023] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] Please refer to the attached Figure 1-4 The heat sink disclosed in the embodiment of the present application is used to dissipate heat from the chip 4, and includes a thermally conductive substrate 1 for bonding and fixing the chip 4, a heat dissipation structure arranged on the surface of the thermally conductive substrate 1 away from the chip 4, and an absorbing material 3 capable of attenuating and absorbing electromagnetic waves is provided on at least one of the thermally conductive substrate 1 and the heat dissipation structure.

[0025] As can be seen from the above technical solution, in the heat sink for dissipating heat from the chip 4 disclosed in the present application, an absorbing material 3 capable of attenuating and absorbing electromagnetic waves is provided on at least one of the thermally conductive substrate 1 and the heat dissipation structure. During application, the thermally conductive substrate 1 of the heat sink is attached to and fixed to the chip 4. During operation, the heat generated by the heat sink is conducted to the heat dissipation structure by the thermally conductive substrate 1, and the heat dissipation structure is used to transfer the heat to the outside, thereby achieving cooling and heat dissipation of the chip 4. At the same time, the absorbing material 3 reduces or blocks the propagation path of the interference current on the surface of the heat sink, thereby reducing the electromagnetic energy received and emitted by the chip 4 by the heat sink, which can effectively improve the anti-interference performance of the chip 4, reduce the electromagnetic radiation emitted by the chip 4 by the heat sink, and thus improve the operating performance of the electronic device.

[0026] In one specific embodiment, the thermally conductive substrate 1 is provided with a filling groove filled with an absorbing material 3. In this embodiment, the absorbing material 3 is embedded in the filling groove of the thermally conductive substrate 1. This provides strong fixing strength for the absorbing material 3 and facilitates assembly. The absorbing material 3 can be used to attenuate and absorb electromagnetic waves. The groove surface of the filling groove increases the contact area between the absorbing material 3 and the thermally conductive substrate 1, thereby increasing the signal path of the electromagnetic wave and enhancing the absorbing effect.

[0027] In a further technical solution, the filling groove is an annular groove 11 formed on the circumferential side of the heat conducting substrate 1 perpendicular to the chip 4, as shown in FIG. Figure 1-2 shown.

[0028] In terms of anti-interference: For interference to chip 4 during testing and actual use, electromagnetic interference will be coupled to the heat sink through spatial coupling. After the heat sink is coupled to the electromagnetic interference, due to the skin effect of the radio frequency current, the interference current will flow along the surface of the heat sink to the surface of the heat sink close to the chip 4, and then be coupled to the chip 4 by the parasitic capacitance between the heat sink and the chip 4, thereby interfering with the normal operation of the chip 4. This application reduces or blocks the propagation path of the surface interference current by slotting the heat-conducting substrate 1 of the heat sink and adding an absorbing material 3 of a suitable frequency band therein, which can reduce interference by at least 6dB and effectively improve the anti-interference performance of the chip 4 and the electronic device; the propagation path of the current is as follows: Figure 3 As shown by the arrow in .

[0029] In terms of reducing electromagnetic radiation: As the working speed of chip 4 becomes higher and higher, the electromagnetic interference generated by chip 4 during operation becomes more and more serious. The electromagnetic energy generated by chip 4 during operation will be coupled to the radiator through the coupling capacitor between chip 4 and the radiator. Due to the antenna effect of the radiator, the electromagnetic energy will be amplified and radiated, causing interference to exceed the standard. Due to the skin effect of high-frequency current, this application grooves the heat-conducting substrate 1 of the radiator and adds absorbing materials 3 of a suitable frequency band, which can effectively absorb surface interference current and reduce electromagnetic radiation by more than 6dB, meeting the standard requirements; the current propagation path is as follows Figure 4 As shown by the arrow in .

[0030] It can be seen that in this embodiment, the filling groove is opened on the entire circumferential side surface of the thermal conductive substrate 1, so that the entire circumferential side surface of the thermal conductive substrate 1 is provided with the absorbing material 3, thereby ensuring the anti-interference and electromagnetic radiation reduction performance.

[0031] Specifically, the shape of the filling groove matches the annular edge of the thermally conductive substrate 1 . When the thermally conductive substrate 1 is a circular plate, the annular groove 11 is circular; when the thermally conductive substrate 1 is a square plate, the annular groove 11 is square.

[0032] This technical solution is easy to implement, has good versatility, and can be applied to radiators of different structures.

[0033] Alternatively, the filling groove may be provided on other surfaces of the thermally conductive substrate 1 , such as a surface for bonding with the chip 4 ; the filling groove may also be composed of multiple groove sections.

[0034] Preferably, the filling groove has a depth of 5-10 mm and a width of 1-2 mm. A filling groove of this size can ensure the absorbing performance of the absorbing material 3 while minimizing the impact on the thermal conductivity of the heat-conducting substrate 1 and facilitating the fixation of the absorbing material 3. It is understood that the filling groove may also have other sizes depending on the specifications of the heat sink.

[0035] The present application also allows for securing the absorbing material 3 without slotting. In another specific embodiment, the absorbing material 3 is provided along the outer edge of the surface of the thermally conductive substrate 1 that contacts the chip 4. The surface of the thermally conductive substrate 1 protruding from the chip 4 has an outer edge. In this embodiment, the absorbing material 3 is directly bonded to this outer edge, facilitating its installation and fixation. This absorbing material 3 blocks the propagation path of interference currents on the surface of the thermally conductive substrate 1, thereby effectively improving the chip 4's anti-interference performance and reducing electromagnetic radiation emitted by the chip 4 from the heat sink.

[0036] In another specific embodiment, absorbing material 3 is provided on the circumferential side surfaces of the thermally conductive substrate 1 perpendicular to the chip 4. In this embodiment, the absorbing material 3 is directly bonded to the circumferential side surfaces of the thermally conductive substrate 1, facilitating its installation and fixation. This absorbing material 3 blocks the propagation path of interference currents on the surface of the thermally conductive substrate 1, thereby effectively improving the anti-interference performance of the chip 4 and reducing the electromagnetic radiation emitted by the chip 4 from the heat sink.

[0037] It is understandable that the present application can also provide absorbing material 3 on the outer edge of the surface of the thermal conductive substrate 1 for bonding with the chip 4 and on the circumferential side surface perpendicular to the chip 4 to further improve the performance of anti-interference and reducing electromagnetic radiation.

[0038] In the above embodiments, the absorbing material 3 is disposed on the heat-conducting substrate 1 , which can achieve the heat sink's anti-interference and electromagnetic radiation reduction performance while ensuring the heat dissipation effect and antenna effect of the heat dissipation structure.

[0039] The present application selects the absorbing material 3 of a suitable frequency band according to the frequency band that the chip 4 needs to suppress (ie, the working frequency of the chip 4 and the interference frequency band of the working environment of the chip 4) to achieve the effect of effectively suppressing interference.

[0040] Absorbing material 3 is a ferrite absorber, a magnetic microsphere absorber, or a carbon-based absorber, which can achieve good absorbing effects. Alternatively, absorbing material 3 can be foam, etc., which blocks the path of electromagnetic interference and reduces the electromagnetic energy received and transmitted by the heat sink, effectively improving the chip 4's anti-interference performance and external emission.

[0041] In another specific embodiment, the heat dissipation structure includes a plurality of heat dissipation fins 2 vertically disposed and evenly distributed on a thermally conductive substrate 1, with absorbing material 3 being partially laminated on the surfaces of the heat dissipation fins 2. In this embodiment, the absorbing material 3 is laminated on the partial surfaces of the heat dissipation fins 2, so that the absorbing material 3 and the heat dissipation fins 2 are integrally formed. Thus, the absorbing material 3 is disposed on the heat dissipation structure, and the absorbing material 3 is utilized to impart anti-interference and electromagnetic radiation reduction properties to the heat sink.

[0042] It is understandable that the heat dissipation structure may also include a plurality of evenly distributed heat dissipation columns, or other structures that can exchange heat with the outside world to achieve heat dissipation.

[0043] The present application also discloses an electronic device, including a chip 4 and a radiator for dissipating heat from the chip 4. The radiator is the radiator provided in any one of the above embodiments, which improves the anti-interference performance and thus improves the working performance of the electronic device. The advantages are brought by the radiator. For details, please refer to the relevant parts in the above embodiments and will not be repeated here.

[0044] Specifically, the electronic device is a server, a desktop computer, or other devices having a chip 4 and a heat sink.

[0045] Preferably, the chip 4 is fixed to the heat sink by thermally conductive adhesive. The heat conductive substrate 1 of the heat sink and the chip 4 are tightly pressed together by the thermally conductive adhesive, which has higher heat conduction efficiency and further improves the heat dissipation performance.

[0046] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0047] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat sink for dissipating heat from a chip, comprising a heat-conducting substrate for attaching and fixing the chip, and a heat dissipation structure provided on a surface of the heat-conducting substrate away from the chip, characterized in that: At least one of the heat-conducting substrate and the heat dissipation structure is provided with a wave-absorbing material capable of attenuating and absorbing electromagnetic waves; The thermally conductive substrate is provided with a filling groove, and the filling groove is filled with an absorbing material; The filling groove is provided on the entire circumferential side surface of the heat-conducting substrate, so that the absorbing material is provided on the entire circumferential side surface of the heat-conducting substrate; The filling groove is an annular groove formed on a circumferential side surface of the heat-conducting substrate perpendicular to the chip; The surface of the thermally conductive substrate used for bonding with the chip is a first surface, the heat dissipation structure is arranged on a second surface of the thermally conductive substrate, and the circumferential side surface is located between the first surface and the second surface.

2. The radiator according to claim 1, characterized in that The filling groove has a depth of 5-10 mm and a width of 1-2 mm.

3. The radiator according to claim 1, wherein: The outer edge of the surface of the heat-conducting substrate used for bonding with the chip is provided with a wave-absorbing material.

4. The radiator according to claim 1, wherein A wave absorbing material is provided on a circumferential side surface of the heat-conducting substrate that is perpendicular to the chip.

5. The radiator according to claim 1, wherein The wave absorbing material is a ferrite wave absorbing agent, a magnetic microsphere wave absorbing agent or a carbon-based wave absorbing agent.

6. The radiator according to claim 1, characterized in that The heat dissipation structure comprises a plurality of heat dissipation fins which are vertically arranged on the heat-conducting substrate and evenly distributed, and a partial surface of the heat dissipation fins is compounded with a wave-absorbing material.

7. An electronic device comprising a chip and a heat sink for dissipating heat from the chip, characterized in that: The radiator is the radiator according to any one of claims 1 to 6.

8. The electronic device according to claim 7, wherein: The chip and the heat sink are fixed together by thermally conductive adhesive.

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