Display module and display device

Abstract

Embodiments of the present application provide a display module and a display device. The display module comprises a heat-conducting structure, a display panel and a heat-dissipating structure. The heat-dissipating structure comprises: the heat-conducting structure is arranged on one side of the back light surface of the display panel; a circuit board assembly is located on the side of the heat-conducting structure away from the display panel; one end of a support is configured to abut against the heat-conducting structure, and the other end of the support abuts against the circuit board assembly; one end of a first heat-conducting piece is connected with the heat-conducting structure, and the other end of the first heat-conducting piece passes through the circuit board assembly and is used to connect with an external heat-conducting assembly of the display device. The support separates the heat-conducting structure and the circuit board assembly in the embodiments of the present application, avoids mutual interference of the heat-dissipating processes of the heat-conducting structure and the circuit board assembly, reduces the heat accumulation between the heat-conducting structure and the circuit board assembly, and improves the heat-dissipating efficiency. The first heat-conducting piece is used to conduct the heat of the heat-conducting structure to the external heat-conducting assembly, which facilitates heat dissipation of the heat-conducting structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular, the present application relates to a display module and a display device. BACKGROUND

[0002] At present, display devices as display components of electronic equipment have been widely used in various electronic products, and the bendability, wider application and more delicate display performance of display panels are favored in automobile control and entertainment screen products. However, due to the strict reliability standards of various electronic products and the pursuit of ultra-narrow frame, ultra-thin screen and comfortable experience in various industries, there are higher requirements for the display panel of the display module.

[0003] The display panel itself will generate heat during use, and the heat will generally be dissipated through the corresponding heat conduction structure of the display panel. In order to maintain the ultra-thin body and ultra-narrow frame, the circuit board assembly needs to be folded back to the back of the display panel, and the corresponding heat conduction structure of the display panel is tightly attached. However, after the circuit board assembly is folded back, the temperature of the display panel rises too high, the heat dissipation capacity is poor, which easily affects the normal work of the display panel, even damages the display panel, reduces the service life of the display panel, and further leads to poor user experience and other problems. SUMMARY

[0004] The present application aims at the shortcomings of the prior art, and proposes a display module and a display device to solve the technical problems of poor heat dissipation effect of the corresponding heat conduction structure of the display panel in the prior art.

[0005] In a first aspect, the embodiments of the present application provide a display module, comprising: a heat conduction structure, a display panel and a heat dissipation structure; the heat dissipation structure comprises: a circuit board assembly, a support and at least one first heat conduction piece;

[0006] The heat conduction structure is arranged on one side of the back light surface of the display panel;

[0007] The circuit board assembly is located on the side of the heat conduction structure away from the display panel;

[0008] One end of the support abuts against the heat conduction structure, and the other end of the support abuts against the circuit board assembly;

[0009] One end of the first heat conduction piece is connected with the heat conduction structure, and the other end of the first heat conduction piece penetrates through the circuit board assembly and is used to connect with the external heat conduction assembly of the display device.

[0010] Optionally, the support is a tubular object;

[0011] The support is sleeved outside the first heat conduction piece, and the material of the support is heat insulation material.

[0012] Optionally, the display module further comprises: a component; a dimension of the support along a direction perpendicular to the circuit board assembly is determined by a dimension of the display panel in the display device, heat generated by the component of the display device, or heat generated by the display panel.

[0013] Optionally, the circuit board assembly comprises: a first heat conduction layer and a circuit board body arranged in a stack;

[0014] The first heat conduction layer is located on a side of the circuit board assembly close to the heat conduction structure.

[0015] The first heat conduction member passes through the first heat conduction layer and the circuit board body and is in contact with the first heat conduction layer.

[0016] The first heat conduction layer has a thermal conductivity greater than that of the circuit board body.

[0017] Optionally, the circuit board assembly further comprises: a second heat conduction layer; and the heat dissipation structure further comprises: at least one second heat conduction member.

[0018] The second heat conduction layer is connected to a side of the circuit board body away from the first heat conduction layer.

[0019] One end of the second heat conduction member is connected to a side of the second heat conduction layer away from the circuit board body, and the other end of the second heat conduction member is used to be connected to an external heat conduction assembly.

[0020] The second heat conduction layer has a thermal conductivity greater than that of the circuit board body.

[0021] Optionally, the circuit board assembly comprises: a first heat conduction layer, a circuit board body, and a second heat conduction layer arranged in a stack; and the heat dissipation structure further comprises: at least one second heat conduction member.

[0022] The first heat conduction layer is located on a side of the circuit board assembly close to the heat conduction structure.

[0023] The first heat conduction member passes through the circuit board assembly and has a spacing between the first heat conduction member and the circuit board assembly.

[0024] One end of the second heat conduction member passes through the second heat conduction layer and the circuit board body and is connected to the first heat conduction layer, and the other end of the second heat conduction member is used to be connected to an external heat conduction assembly.

[0025] Optionally, the display module further comprises: a component and a heat conduction connecting member.

[0026] The component is located on a side of the circuit board assembly away from the heat conduction structure.

[0027] The heat conduction connecting member is arranged between the component and the circuit board assembly.

[0028] Optionally, the circuit board assembly has at least one through hole.

[0029] The side of the circuit board assembly away from the heat conduction structure is connected with the component;

[0030] The through hole is arranged in the region where the circuit board assembly is connected with the component.

[0031] Optionally, the display module further comprises a heat dissipation member;

[0032] The heat dissipation member is arranged on the side of the component away from the circuit board.

[0033] Optionally, the display module further comprises a cover plate, and the heat conduction structure comprises a heat conduction back plate structure.

[0034] One end of the support member abuts against the side of the heat conduction back plate structure away from the display panel.

[0035] In a second aspect, the embodiments of the present application further provide a display device, comprising an external heat conduction assembly and the display module improved according to the first aspect.

[0036] One end of the first heat conduction member of the heat dissipation structure of the display module is connected with the heat conduction structure of the display module, and the other end of the first heat conduction member passes through the circuit board assembly of the display module and is connected with the external heat conduction assembly.

[0037] Optionally, one end of the second heat conduction member of the heat dissipation structure is connected with the side of the second heat conduction layer of the circuit board assembly away from the circuit board body of the circuit board assembly, and the other end of the second heat conduction member is connected with the external heat conduction assembly.

[0038] Optionally, the display device is a vehicle-mounted display device.

[0039] The display module and the display device provided by the embodiments of the present application have the following beneficial technical effects:

[0040] The support member separates the corresponding heat conduction structure and the circuit board assembly of the display panel, so that the heat conduction structure and the circuit board assembly have a certain interval, and the heat conduction structure has a certain heat dissipation space, thereby avoiding the mutual interference of the heat dissipation processes of the heat conduction structure and the circuit board assembly, reducing the heat accumulation between the heat conduction structure and the circuit board assembly, and facilitating the independent heat dissipation of the heat conduction structure and the circuit board assembly, thereby improving the heat dissipation efficiency.

[0041] The first heat conduction member connects the heat conduction structure of the display device and the external heat conduction assembly of the display device, directly conducts the heat of the heat conduction structure to the external heat conduction assembly, facilitates the heat dissipation of the heat conduction structure, and further rapidly cools the display panel.

[0042] Additional aspects and advantages of the present application will be made apparent from the following description, which provides, by way of non-limiting example, specific embodiments thereof. BRIEF DESCRIPTION OF DRAWINGS

[0043] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings in which:

[0044] Figure 1a A structural schematic diagram of a display device provided for an embodiment of the present application;

[0045] Figure 1b A heat transfer schematic diagram of a display device provided for an embodiment of the present application;

[0046] Figure 2a A structural schematic diagram of another display device provided for an embodiment of the present application;

[0047] Figure 2b A heat transfer schematic diagram of another display device provided for an embodiment of the present application;

[0048] Figure 3 A structural schematic diagram of a heat dissipation member provided for an embodiment of the present application;

[0049] Figure 4 A structural schematic diagram of a display module provided for an embodiment of the present application.

[0050] In the drawings:

[0051] 1 - display device;

[0052] 10 - heat dissipation structure;

[0053] 11 - circuit board assembly; 111 - first heat conduction layer; 112 - circuit board body; 113 - second heat conduction layer; 114 - through hole; 12 - support member; 13 - first heat conduction member; 14 - second heat conduction member; 15 - limiting member;

[0054] 20 - display panel;

[0055] 30 - heat conduction structure;

[0056] 40 - external heat conduction assembly;

[0057] 50 - cover plate;

[0058] 60 - component;

[0059] 70 - heat conduction connecting member;

[0060] 80 - heat dissipation member;

[0061] 90 - chip on film;

[0062] 100 - polarizing plate;

[0063] 110 - touch layer;

[0064] 120 - chip. DETAILED DESCRIPTION

[0065] Hereinafter, the present application will be described in detail. Examples of embodiments of the present application are illustrated in the accompanying drawings, in which like or similar components have the same or similar reference numbers throughout the several views. Also, if it is determined that a detailed description of known technology is unnecessary with regard to the features of the present application shown, it will be omitted. The embodiments described below are exemplary and are merely intended to explain the present application, and should not be construed as limiting the present application.

[0066] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless specifically so defined herein.

[0067] Those skilled in the art can understand that, unless otherwise stated, the singular forms "a", "an" and "the" used herein also include the plural. It should be further understood that the use of the phrase "comprises" in the specification of the present application means that the stated features, integers, steps and / or components are present, but does not exclude the presence or addition of one or more other features, integers, steps and / or groups thereof. The phrase "and / or" used herein includes all or any one of the associated listed items and all combinations thereof.

[0068] The inventors of the present application have found that in most display devices, in order to uniformly dissipate heat from the display panel, a heat conduction structure is usually provided on one side of the display panel, which absorbs heat from the display panel and then dissipates it. However, in order to maintain the ultra-narrow frame of the display device, the circuit board assembly is folded back to the rear of the display panel and is attached to the heat conduction structure, and a large amount of heat is conducted to the heat conduction structure. The circuit board assembly attached to the heat conduction structure blocks the heat dissipation path of the heat conduction structure, affecting the heat dissipation of the heat conduction structure. In addition, the circuit board assembly also generates heat during use, and the heat of the circuit board assembly and the heat of the display panel are all accumulated on the heat conduction structure, which is difficult to dissipate, thereby causing the temperature of the display panel and the circuit board assembly to rise too high, damaging the display panel or the circuit board assembly, and reducing the service life of the display device.

[0069] The display module and display device provided by the present application aim to solve the above technical problems of the prior art.

[0070] The technical solutions of the present application and how the technical solutions of the present application solve the above technical problems will be described in detail below with specific embodiments.

[0071] The embodiment of the present application provides a display module, please refer to Figure 1a , comprising: a heat conduction structure 30, a display panel 20 and a heat dissipation structure 10.

[0072] The heat dissipation structure 10 comprises: a circuit board assembly 11, a support 12 and at least one first heat conduction member 13.

[0073] The heat conduction structure 30 is arranged on one side of the backlight surface of the display panel 20.

[0074] The circuit board assembly 11 is located on the side away from the heat conduction structure 30 of the display panel 20.

[0075] One end of the support 12 abuts against the heat conduction structure 30, and the other end of the support 12 abuts against the circuit board assembly 11.

[0076] One end of the first heat conduction member 13 is connected with the heat conduction structure 30, and the other end of the first heat conduction member 13 passes through the circuit board assembly 11 and is used for being connected with an external heat conduction component 40 of the display device 1.

[0077] In the embodiment, the support 12 can separate the corresponding heat conduction structure 30 of the display panel 20 and the circuit board assembly 11, so that the heat conduction structure 30 has a certain space for heat dissipation, thereby the heat conduction structure 30 has a certain space for heat dissipation, and the heat dissipation process of the heat conduction structure 30 and the circuit board assembly 11 is prevented from interfering with each other, the heat accumulation between the heat conduction structure 30 and the circuit board assembly 11 is reduced, the heat conduction structure 30 and the circuit board assembly 11 are independently heat dissipated, and the heat dissipation efficiency is improved. The first heat conduction member 13 connects the heat conduction structure 30 and the external heat conduction component 40 of the display device 1, directly conducts the heat of the heat conduction structure 30 to the external heat conduction component 40, facilitates heat dissipation of the heat conduction structure 30, and thereby the display panel 20 is rapidly cooled.

[0078] Please refer to Figure 1b , Figure 1b The heat transfer process of the embodiment of the present application is shown in the figure, the arrows in the figure represent the direction of heat transfer, are not real existing structures, and are added for the reader to facilitate understanding.

[0079] Optionally, please refer to Figure 4 , the display device further comprises: a chip on film 90, a polarizer 100 and a touch layer 110. The circuit board assembly 11 is connected with the display panel 20 through the chip on film 90, one end of the chip on film 90 is connected with the side of the display panel 20 away from the heat conduction structure 30, and the other end of the chip on film 90 is connected with the side of the circuit board assembly 11 away from the display panel 20. In the display device 1, the heat conduction structure 30, the display panel 20, the polarizer 100, the touch layer 110 and the cover plate 50 are stacked, and the end of the chip on film 90 abuts against the end of the polarizer 100.

[0080] Optionally, the first heat-conducting member 13 can be a copper column.

[0081] Optionally, the circuit board assembly 11 and the display panel 20 are bonded by a flexible COF (Chip On Film) chip-on-film method. This screen packaging process integrates the chip 120 on the chip-on-film 90 of flexible material, and then bends to the back light side of the display panel 20, which can further reduce the frame and improve the screen ratio.

[0082] Optionally, the chip 120 can be a driving chip of the display module.

[0083] Optionally, the first heat-conducting member 13 passes through the circuit board assembly 11, and is fixed to the circuit board assembly 11 on the side away from the heat-conducting structure 30 by the limiting member 15, so as to avoid displacement between the first heat-conducting member 13 and the circuit board, damage to the heat dissipation structure 10, and influence on the heat dissipation efficiency.

[0084] Optionally, the limiting member 15 includes but is not limited to a nut with a locking position.

[0085] In some possible embodiments, please refer to Figure 1a The support member 12 is a tubular object.

[0086] The support member 12 is sleeved on the first heat-conducting member 13, and the material of the support member 12 is a heat insulation material.

[0087] In the embodiment, the support member 12 is a hollow tubular object, such as a heat-resistant sleeve, which can be sleeved on the first heat-conducting member 13 between the circuit board assembly 11 and the heat-conducting structure 30. The space between the circuit board assembly 11 and the heat-conducting structure 30 is reasonably used, so that the first heat-conducting member 13 and the support member 12 jointly occupy less space, and more space is left for heat dissipation of the heat-conducting structure 30 and the circuit board assembly 11.

[0088] Optionally, the support member 12 can be a columnar object, a bent wall-shaped object, a labyrinth-shaped object, a meandering object, or an irregular object, and the support member 12 can be designed to have a required shape according to the heat generated by the heat-conducting structure 30, the heat generated by the circuit board assembly 11, and the like.

[0089] In some possible embodiments, the size of the support member 12 in the direction perpendicular to the circuit board assembly 11 is determined according to the size of the display panel 20 in the display device 1, the heat generated by the components 60 of the display device 1, or the heat generated by the display panel 20.

[0090] In the embodiment, the heat source of the display device 1 further includes the component 60. The dimension of the support 12 in the direction perpendicular to the circuit board assembly 11, i.e. the height of the support 12, is equal to the distance between the circuit board assembly 11 and the heat conducting structure 30, which is determined by the size of the display panel 20, the size of the circuit board assembly 11, the heat generated by the component 60 or the heat generated by the display panel 20, etc.

[0091] Optionally, the component 60 can be a master chip of the circuit board assembly 11, which converts the received image data signal into synchronous control signal and data output signal to realize the display of the image on the display panel 20.

[0092] It can be understood that the air layer between the circuit board assembly 11 and the heat conducting structure 30 is similar to a heat insulation material after the circuit board assembly 11 is separated from the heat conducting structure 30, which reduces the heat transferred from the circuit board assembly 11 to the heat conducting structure 30. The purpose of increasing the height of the support 12 (i.e. increasing the distance between the circuit board assembly 11 and the heat conducting structure 30) is to further eliminate the influence of thermal radiation and natural convection. According to the size of the actual display panel 20, the size of the circuit board assembly 11 and the heat source (which can include one or more of the display panel 20, the circuit board assembly 11 or the component 60), a distance value that can eliminate the above influences is simulated and analog, and then the height of the support 12 is designed using the distance value.

[0093] Optionally, the height of the support 12 is 3-5 mm. Within this range, the influence of thermal radiation and natural convection between the circuit board assembly 11 and the heat conducting structure 30 can be obviously improved.

[0094] In some possible embodiments, the circuit board assembly 11 includes a first heat conducting layer 111 and a circuit board body 112 arranged in a stack.

[0095] The first heat conducting layer 111 is located on the side of the circuit board assembly 11 close to the heat conducting structure 30.

[0096] The first heat conducting member 13 penetrates through the first heat conducting layer 111 and the circuit board body 112 and is in contact with the first heat conducting layer 111.

[0097] The thermal conductivity coefficient of the first heat conducting layer 111 is greater than that of the circuit board body 112.

[0098] In the embodiment, the circuit board assembly 11 is a stacked structure with at least two layers, and the first heat conduction layer 111 is closer to the heat conduction structure 30 than the circuit board body 112. When the first heat conduction member 13 passes through the circuit board assembly 11, the peripheral surface of the first heat conduction member 13 is in contact with the first heat conduction layer 111 of the circuit board assembly 11, so that heat conduction can occur between the first heat conduction member 13 and the first heat conduction layer 111. Since the heat conduction coefficient of the first heat conduction layer 111 is greater than that of the circuit board body 112, the heat generated by the circuit board body 112 is conducted to the first heat conduction member 13 through the first heat conduction layer 111, and then transmitted to the external heat conduction assembly 40.

[0099] In some possible embodiments, please refer to Figure 2a , the circuit board assembly 11 further comprises a second heat conduction layer 113. The heat dissipation structure 10 further comprises at least one second heat conduction member 14.

[0100] The second heat conduction layer 113 is connected to the side of the circuit board body 112 away from the first heat conduction layer 111.

[0101] One end of the second heat conduction member 14 is connected to the side of the second heat conduction layer 113 away from the circuit board body 112, and the other end of the second heat conduction member 14 is used to connect the external heat conduction assembly 40.

[0102] The heat conduction coefficient of the second heat conduction layer 113 is greater than that of the circuit board body 112.

[0103] In the embodiment, the circuit board assembly 11 is a stacked structure with at least three layers, specifically the second heat conduction layer 113, the circuit board body 112 and the first heat conduction layer 111. The circuit board body 112 is arranged between the second heat conduction layer 113 and the first heat conduction layer 111. The heat generated by the circuit board assembly 11 is absorbed by the first heat conduction layer 111 or the second heat conduction layer 113. The second heat conduction member 14 directly connects the second heat conduction layer 113 and the external heat conduction assembly 40, and transmits the heat absorbed by the second heat conduction layer 113 from the circuit board assembly 11 to the external heat conduction assembly 40. In addition to being in contact with the first heat conduction layer 111, the first heat conduction member 13 can also be in contact with the second heat conduction layer 113, or not in contact with the second heat conduction layer 113, as long as the heat of the first heat conduction layer 111 is transmitted out.

[0104] Please refer to Figure 2b , Figure 2b for the heat transfer process of another embodiment of the present application. The arrows in the figure represent the direction of heat transfer, and are not real structures, but are added to facilitate the understanding of the reader.

[0105] Optionally, the first heat-conducting layer 111 or the second heat-conducting layer 113 in the embodiment of the present application can be a copper layer, and the main material of the circuit board body 112 is a resin material, the thermal conductivity of the resin material is about 0.3 W / m.℃, and the thermal conductivity of the copper layer is about 401 W / m.℃. The thermal conductivity of the resin material is much lower than that of the copper layer. Therefore, the circuit board assembly 11 as a whole has anisotropic characteristics, the normal thermal conductivity is much lower than the tangential thermal conductivity, and the tangential thermal conductivity is higher.

[0106] In some possible implementations, the circuit board assembly 11 comprises: a first heat-conducting layer 111, a circuit board body 112, and a second heat-conducting layer 113 which are stacked. The heat dissipation structure 10 further comprises: at least one second heat-conducting member 14.

[0107] The first heat-conducting layer 111 is located on the side of the circuit board assembly 11 close to the heat-conducting structure 30.

[0108] The first heat-conducting member 13 passes through the circuit board assembly 11 and has a gap between the first heat-conducting member 13 and the circuit board assembly 11.

[0109] One end of the second heat-conducting member 14 passes through the second heat-conducting layer 113 and the circuit board body 112 and is connected to the first heat-conducting layer 111, and the other end of the second heat-conducting member 14 is used to be connected to the external heat-conducting assembly 40.

[0110] In the embodiment, the circuit board assembly 11 is a stacked structure with at least three layers, specifically, the second heat-conductive layer 113, the circuit board body 112, and the first heat-conductive layer 111. Different from the previous embodiment, the first heat-conductive member 13 in the embodiment has a gap with the first heat-conductive layer 111 when passing through the circuit board assembly 11, and is not in contact with the first heat-conductive layer 111. The gap can be filled with a heat insulation material such as air, to avoid heat conduction between the first heat-conductive member 13 and the first heat-conductive layer 111. One end of the second heat-conductive member 14 passes through the second heat-conductive layer 113 and the circuit board assembly 11, and is connected to the first heat-conductive layer 111 at the bottom. Therefore, the heat from the first heat-conductive layer 111, the heat from the circuit board assembly 11, and the heat from the second heat-conductive layer 113 are all transferred to the external heat-conductive assembly 40 through the second heat-conductive member 14, while the first heat-conductive member 13 only transfers the heat from the heat-conductive structure 30 to the external heat-conductive assembly 40, because it is not in contact with the first heat-conductive layer 111 or the second heat-conductive layer 113. That is, in the embodiment, the first heat-conductive member 13 only transfers the heat absorbed by the heat-conductive structure 30 from the display panel 20, and the second heat-conductive member 14 only transfers the heat generated by the circuit board assembly 11. The display panel 20 and the circuit board assembly 11 independently conduct the heat to the external heat-conductive assembly 40, without interfering with each other. Because there is a gap between the circuit board assembly 11 and the heat-conductive structure 30, and between the circuit board assembly 11 and the display panel 20, the heat is difficult to be transferred between them. The first heat-conductive member 13 and the second heat-conductive member 14 have clear division of labor, and have higher heat transfer efficiency.

[0111] In some possible embodiments, the display module further includes: a component 60 and a heat-conductive connecting member 70.

[0112] The component 60 is located on the side of the circuit board assembly 11 away from the heat-conductive structure 30.

[0113] The heat-conductive connecting member 70 is arranged between the component 60 and the circuit board assembly 11.

[0114] In the embodiment, the component 60 is fixedly connected to one side of the circuit board assembly 11 through the heat-conductive connecting member 70. The heat-conductive connecting member 70 has the functions of heat conduction and connection, and has higher heat absorption efficiency for the component 60.

[0115] Optionally, the material of the heat-conductive connecting member 70 can be heat-conductive silicone grease.

[0116] In some possible embodiments, the circuit board assembly 11 has at least one through hole 114.

[0117] The side of the circuit board assembly 11 away from the heat-conductive structure 30 is connected to the component 60.

[0118] The through hole 114 is arranged in the region where the circuit board assembly 11 is connected to the component 60.

[0119] In the embodiment, the circuit board assembly 11 has a through hole 114 vertically penetrating through the whole circuit board assembly 11, the component 60 is connected to the side of the circuit board assembly 11 away from the display panel 20, one end of the through hole 114 is the component 60, and the other end is connected to the space between the circuit board assembly 11 and the heat conduction structure 30, and the component 60 can dissipate heat through the through hole 114.

[0120] Specifically, the component 60 is connected to the second heat conduction layer 113, part of the heat generated by the component 60 is transmitted to the second heat conduction layer 113, and part of the heat is transmitted to the first heat conduction layer 111 through the through hole 114, and the first heat conduction layer 111 and the second heat conduction layer 113 transmit the heat to the external heat conduction assembly 40 to dissipate the heat of the component 60.

[0121] Optionally, the display module further comprises a heat dissipation piece 80, and the heat dissipation piece 80 is arranged on the side of the component 60 away from the circuit board assembly 11.

[0122] In the embodiment, the heat dissipation piece 80 is further arranged on the component 60, and the heat dissipation piece 80 can also dissipate part of the heat of the component 60 to the air.

[0123] Optionally, referring to Figure 3 , the heat dissipation piece 80 can be a heat dissipation fin, and the material is copper or aluminum, and the surface can be subjected to oxidation treatment to improve the energy emission rate of the surface and improve the heat dissipation efficiency. The heat dissipation piece 80 and the component 60 can also be connected by using heat conduction silicone grease.

[0124] In some possible embodiments, the display module further comprises a cover plate 50, and the heat conduction structure 30 comprises a heat conduction back plate structure.

[0125] One end of the support 12 of the heat dissipation structure 10 abuts against the side of the heat conduction back plate structure away from the display panel 20.

[0126] In the embodiment, the heat conduction structure 30 has a plate-shaped heat conduction back plate structure, the cover plate 50, the display panel 20 and the heat conduction back plate structure are arranged in layers, and the heat of the display panel 20 can be partially transmitted to the cover plate 50 and then diffused to the outside, and part of the heat is transmitted to the heat dissipation structure 10 through the heat conduction back plate structure and then transmitted to the external heat conduction assembly 40 for heat dissipation.

[0127] Optionally, the heat conduction structure 30 is an aluminum plate.

[0128] Based on the same inventive concept, the embodiments of the present application also provide a display device 1, referring to Figure 1a , comprising an external heat conduction assembly 40 and a display module provided in any of the preceding embodiments.

[0129] One end of the first heat-conducting member 13 of the heat-dissipating structure 10 is connected with the heat-conducting structure 30 of the display module, and the other end of the first heat-conducting member 13 passes through the circuit board assembly 11 and is connected with the external heat-conducting assembly 40.

[0130] In the embodiment, the heat-dissipating structure 10 is located at one side of the heat-conducting structure 30, and the display panel 20 is located at the other side of the heat-conducting structure 30. The heat-conducting structure 30 absorbs heat from the display panel 20 and transmits the heat to the external heat-conducting assembly 40 through the heat-dissipating structure 10 for heat dissipation. The display device 1 provided in the embodiment has the display module in any of the foregoing embodiments, and the principle and technical effects thereof are described in the foregoing embodiments, which will not be described herein.

[0131] Optionally, the display panel 20, the heat-conducting structure 30, and the heat-dissipating structure 10 are all located in the external heat-conducting assembly 40, and the other end of the first heat-conducting member 13 is connected with the inner wall of the external heat-conducting assembly 40.

[0132] Optionally, the first heat-conducting member 13 is connected with the external heat-conducting assembly 40 through a flexible member, which can avoid damage to the display panel 20 and other structures in the display device 1 caused by vibration impact transmission of the display device 1. The first heat-conducting member 13 can also be fixed by slotting the external heat-conducting assembly 40.

[0133] Similarly, the second heat-conducting member 14 is connected with the external heat-conducting assembly 40 through a flexible member, which can avoid damage to the display panel 20 and other structures in the display device 1 caused by vibration impact transmission of the display device 1. The second heat-conducting member 14 can also be fixed by slotting the external heat-conducting assembly 40.

[0134] Optionally, the flexible member also needs to have good heat-conducting performance. The flexible member can include but is not limited to heat-conducting silicone grease or light springs.

[0135] In some possible embodiments, one end of the second heat-conducting member 14 of the heat-dissipating structure 10 is connected with the second heat-conducting layer 113 of the circuit board assembly 11 away from the circuit board body 112 of the circuit board assembly 11, and the other end of the second heat-conducting member 14 is connected with the external heat-conducting assembly 40.

[0136] In the embodiment, the second heat-conducting member 14 connects the second heat-conducting layer 113 with the external heat-conducting assembly 40, so as to transmit heat of the circuit board assembly 11 to the external heat-conducting assembly 40 for heat dissipation.

[0137] Optionally, the display device 1 is a vehicle-mounted display device 1.

[0138] At present, the bendability of the display panel 20 and the more delicate display performance, plus the future car technology, intelligence, the display panel 20 is favored in the car control and entertainment screen products. But due to the stringent reliability standards of the car, and the pursuit of ultra-narrow frame, ultra-thin screen, comfortable experience in the automotive industry, therefore, higher requirements are put forward for the display panel 20 of the vehicle display device 1. The embodiments of the present application can better meet the high requirements of the vehicle display device 1.

[0139] Optionally, the external heat conduction component 40 can be a shell of the display device. The shell is provided by the supplier of the vehicle machine assembly of the whole vehicle factory, and after our party provides the display panel and the like display module, the display module is placed into the vehicle machine assembly and connected with the mainboard thereof, so as to constitute the final complete vehicle machine system

[0140] By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

[0141] 1. The support 12 can separate the corresponding heat conduction structure 30 of the display panel 20 and the circuit board assembly 11, so that the heat conduction structure 30 and the circuit board assembly 11 have a certain interval, and the heat conduction structure 30 has a certain heat dissipation space, which is convenient for heat dissipation of the heat conduction structure 30, and also avoids accumulation of heat of the circuit board assembly 11 on the heat conduction structure 30.

[0142] 2. The first heat conduction piece 13 connects the heat conduction structure 30 of the display device 1 and the external heat conduction component 40 of the display device 1, directly conducts the heat of the heat conduction structure 30 to the external heat conduction component 40, achieves the purpose of heat dissipation of the heat conduction structure 30, and rapidly cools the display panel 20.

[0143] 3. The support 12 is a hollow tubular object, such as a heat-resistant sleeve, which can be sleeved on the first heat conduction piece 13 between the circuit board assembly 11 and the heat conduction structure 30, reasonably uses the space between the circuit board assembly 11 and the heat conduction structure 30, so that the first heat conduction piece 13 and the support 12 jointly occupy less space, and more space is left for heat dissipation of the heat conduction structure 30 and the circuit board assembly 11.

[0144] 4. The second heat conduction piece 14 directly connects the second heat conduction layer 113 and the external heat conduction component 40, and transmits the heat absorbed by the second heat conduction layer 113 from the circuit board assembly 11 to the external heat conduction component 40.

[0145] 5. The first heat-conducting component 13 only transfers the heat absorbed by the heat-conducting structure 30 from the display panel 20, and the second heat-conducting component 14 only transfers the heat generated by the circuit board assembly 11. The display panel 20 and the circuit board assembly 11 independently conduct heat to the external heat-conducting component 40 without interfering with each other. Since there is a gap between the circuit board assembly 11 and the heat-conducting structure 30, it is also difficult for heat to be transferred between the circuit board assembly 11 and the display panel 20. The first heat-conducting component 13 and the second heat-conducting component 14 have clear division of labor, resulting in higher heat transfer efficiency.

[0146] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0147] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0148] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0149] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0150] The above description is only a partial embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A display module, characterized in that, include: Thermal conduction structure, display panel, and heat dissipation structure; The heat dissipation structure includes: a circuit board assembly, a support component, and at least one first heat-conducting component; The heat-conducting structure is disposed on one side of the backlight surface of the display panel; The circuit board assembly is located on the side of the heat-conducting structure away from the display panel; One end of the support member abuts against the heat-conducting structure, and the other end of the support member abuts against the circuit board assembly; One end of the first heat-conducting element is connected to the heat-conducting structure, and the other end of the first heat-conducting element passes through the circuit board assembly for connection to an external heat-conducting assembly of the display device. The first heat-conducting element passes through the circuit board assembly, and on the side of the circuit board assembly away from the heat-conducting structure, the first heat-conducting element is fixed to the circuit board assembly by a limiting member; The support component is tubular; The support member is sleeved outside the first heat-conducting member, and the material of the support member is heat-insulating material; The display module also includes: components and thermally conductive connectors; The component is located on the side of the circuit board assembly away from the heat-conducting structure; The thermally conductive connector is disposed between the component and the circuit board assembly; The circuit board assembly has at least one through hole; The side of the circuit board assembly away from the heat-conducting structure is connected to the component; The through-hole is located in the area where the circuit board assembly connects to the component; The circuit board assembly includes: a first thermally conductive layer, a circuit board body, and a second thermally conductive layer stacked together; The component is connected to the second thermal conductive layer. Part of the heat generated by the component is transferred to the second thermal conductive layer, and part of the heat is transferred to the first thermal conductive layer through the through hole. The first thermal conductive layer and the second thermal conductive layer then transfer the heat to an external thermal conductive component to dissipate heat from the component.

2. The display module according to claim 1, characterized in that, The display module also includes: components; The dimension of the support member in the direction perpendicular to the circuit board assembly is determined by the size of the display panel in the display device, the heat generated by the components, or the heat generated by the display panel.

3. The display module according to claim 1, characterized in that, The circuit board assembly includes: a first thermally conductive layer and a circuit board body stacked together; The first thermally conductive layer is located on the side of the circuit board assembly closest to the thermally conductive structure; The first thermally conductive element passes through the first thermally conductive layer and the circuit board body and is in contact with the first thermally conductive layer; The thermal conductivity coefficient of the first thermally conductive layer is greater than that of the circuit board body.

4. The display module according to claim 3, characterized in that, The circuit board assembly further includes: a second thermally conductive layer; the heat dissipation structure further includes: at least one second thermally conductive element; The second thermal conductive layer is connected to the side of the circuit board body away from the first thermal conductive layer; One end of the second thermal conductive element is connected to the side of the second thermal conductive layer away from the circuit board body, and the other end of the second thermal conductive element is used to connect to the external thermal conductive component; The thermal conductivity coefficient of the second thermal conductive layer is greater than that of the circuit board body.

5. The display module according to claim 1, characterized in that, The circuit board assembly includes: a first thermally conductive layer, a circuit board body, and a second thermally conductive layer stacked together; the heat dissipation structure further includes: at least one second thermally conductive element. The first thermally conductive layer is located on the side of the circuit board assembly closest to the thermally conductive structure; The first heat-conducting element passes through the circuit board assembly and has a gap between it and the circuit board assembly; One end of the second thermal conductive element passes through the second thermal conductive layer and the circuit board body and is connected to the first thermal conductive layer, while the other end of the second thermal conductive element is used to connect to the external thermal conductive component.

6. The display module according to claim 1, characterized in that, The display module further includes: a heat sink; The heat sink is located on the side of the component away from the circuit board assembly.

7. The display module according to claim 1, characterized in that, The display module further includes: a cover plate; the heat-conducting structure includes: a heat-conducting back plate structure; One end of the support member abuts against the side of the heat-conducting backplate structure away from the display panel.

8. A display device, characterized in that, include: External heat-conducting components and the display module as described in any one of claims 1 to 7; One end of the first heat-conducting component of the heat dissipation structure of the display module is connected to the heat-conducting structure of the display module, and the other end of the first heat-conducting component passes through the circuit board assembly of the display module and is connected to the external heat-conducting component.

9. The display device according to claim 8, characterized in that, One end of the second heat-conducting element of the heat dissipation structure is connected to the side of the second heat-conducting layer of the circuit board assembly away from the circuit board body of the circuit board assembly, and the other end of the second heat-conducting element is connected to the external heat-conducting component.

10. The display device according to claim 8, characterized in that, The display device is a vehicle-mounted display device.

Images