Shape memory alloy actuator and method thereof

Abstract

This document describes an SMA actuator and related methods. One embodiment of the actuator includes: a base; a plurality of buckling arms; and at least a first shape memory alloy wire coupled to a pair of buckling arms among the plurality of buckling arms. Another embodiment of the actuator includes a base and at least one dual piezoelectric wafer actuator comprising a shape memory alloy material. The dual piezoelectric wafer actuator is attached to the base.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 044,305, filed June 25, 2020, and U.S. Patent Application No. 17 / 195,497, filed March 8, 2021, and claims priority to those U.S. applications, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments of the present invention relate to the field of shape memory alloy systems. More specifically, embodiments of the present invention relate to the field of shape memory alloy actuators and related methods. Background Technology

[0004] Shape memory alloy (“SMA”) systems have a moving component or structure that can be used, for example, as an autofocus actuator with a camera lens element. These systems can be enclosed by a structure such as a shield. The moving component is supported by bearings, such as multiple balls, to move on a support assembly. A flexural element formed of a metal such as phosphor bronze or stainless steel has a moving plate and a flexure. The flexure extends between the moving plate and the fixed support assembly and acts as a spring, allowing the moving component to move relative to the fixed support assembly. The balls allow the moving component to move with minimal resistance. The moving component and the support assembly are coupled by four shape memory alloy (SMA) wires extending between the components. One end of each SMA wire is attached to the support assembly, and the other end is attached to the moving component. The suspension is actuated by applying an electrical drive signal to the SMA wires. However, these types of systems suffer from system complexity, resulting in bulky systems requiring large footprints and large height clearances. Furthermore, current systems cannot provide a high Z-stroke range with a compact, low-profile footprint. Summary of the Invention

[0005] This document describes an SMA actuator and related methods. One embodiment of the actuator includes a base; a plurality of buckling arms; and at least a first shape memory alloy wire coupled (coupled) to a pair of buckling arms among the plurality of buckling arms. Another embodiment of the actuator includes a base and at least one dual piezoelectric wafer actuator comprising a shape memory alloy material. The dual piezoelectric wafer actuator is attached to the base.

[0006] Other features and advantages of embodiments of the present invention will become apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0007] In the various figures of the accompanying drawings, embodiments of the invention are shown by way of example rather than limitation, wherein similar reference numerals indicate similar elements, and in the drawings:

[0008] Figure 1a A lens assembly comprising an SMA actuator configured as a buckling actuator according to one embodiment is shown;

[0009] Figure 1b An SMA actuator according to one embodiment is shown;

[0010] Figure 2 An SMA actuator according to one embodiment is shown;

[0011] Figure 3 An exploded view of an autofocusing assembly including an SMA wire actuator according to one embodiment is shown;

[0012] Figure 4 An autofocusing assembly including an SMA actuator according to one embodiment is shown;

[0013] Figure 5 An SMA actuator including a sensor is shown according to one embodiment;

[0014] Figure 6 A top view and a side view of an SMA actuator configured as a buckling actuator, equipped with a lens holder, are shown according to one embodiment;

[0015] Figure 7 A side view of a portion of an SMA actuator according to one embodiment is shown;

[0016] Figure 8 Several views of an embodiment of the buckling actuator are shown;

[0017] Figure 9 A dual piezoelectric wafer actuator with a lens holder is shown according to one embodiment;

[0018] Figure 10 A cross-sectional view is shown, including an autofocusing assembly of an SMA actuator according to one embodiment;

[0019] Figure 11a -c shows a view of a dual piezoelectric wafer actuator according to some embodiments;

[0020] Figure 12 A view of an embodiment of a dual piezoelectric wafer actuator is shown;

[0021] Figure 13 A cross-section of the end pad of a dual piezoelectric wafer actuator according to one embodiment is shown;

[0022] Figure 14 A cross-section of the central power supply pad of a dual piezoelectric wafer actuator according to one embodiment is shown;

[0023] Figure 15 An exploded view of an SMA actuator including two buckling actuators according to one embodiment is shown;

[0024] Figure 16 An SMA actuator comprising two buckling actuators is shown according to one embodiment;

[0025] Figure 17 A side view of an SMA actuator including two buckling actuators according to one embodiment is shown;

[0026] Figure 18 A side view of an SMA actuator including two buckling actuators according to one embodiment is shown;

[0027] Figure 19 An exploded view of components including an SMA actuator according to one embodiment is shown, the SMA actuator including two buckling actuators;

[0028] Figure 20 An SMA actuator comprising two buckling actuators is shown according to one embodiment;

[0029] Figure 21 An SMA actuator comprising two buckling actuators is shown according to one embodiment;

[0030] Figure 22 An SMA actuator comprising two buckling actuators is shown according to one embodiment;

[0031] Figure 23 An SMA actuator comprising two buckling actuators and a coupler is shown according to one embodiment;

[0032] Figure 24 An exploded view of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a buckling actuator with a laminated hammock;

[0033] Figure 25 An SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a buckling actuator 2402 with a laminated hammock;

[0034] Figure 26 A buckling actuator comprising a laminated hammock according to one embodiment is shown;

[0035] Figure 27 A laminated hammock with an SMA actuator according to one embodiment is shown;

[0036] Figure 28 A press-fit connection formed by lamination of an SMA actuator according to one embodiment is shown;

[0037] Figure 29 An SMA actuator including a buckling actuator with a laminated hammock is shown;

[0038] Figure 30 An exploded view of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a buckling actuator;

[0039] Figure 31 An SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a buckling actuator;

[0040] Figure 32 An SMA actuator including a buckling actuator is shown according to one embodiment;

[0041] Figure 33 A biyoke capture joint of a pair of buckling arms of an SMA actuator according to one embodiment is shown;

[0042] Figure 34 A resistance-welded press-fit for an SMA actuator according to one embodiment is shown, the resistance-welded press-fit for attaching SMA wires to a buckling actuator;

[0043] Figure 35 An SMA actuator is shown, which includes a buckling actuator with a biyoke capture joint;

[0044] Figure 36 An SMA dual piezoelectric wafer liquid lens according to one embodiment is shown;

[0045] Figure 37 A perspective view of an SMA dual piezoelectric wafer liquid lens according to one embodiment is shown;

[0046] Figure 38 A cross-sectional view and a bottom view of an SMA dual piezoelectric wafer liquid lens according to one embodiment are shown;

[0047] Figure 39 An SMA system including an SMA actuator with dual piezoelectric wafer actuators according to one embodiment is shown;

[0048] Figure 40 An SMA actuator with dual piezoelectric wafer actuators according to one embodiment is shown;

[0049] Figure 41The length of the dual piezoelectric chip actuator and the location of the wiring pads are shown, which are used to extend the wire length of the SMA wires beyond the dual piezoelectric chip actuator;

[0050] Figure 42 An exploded view of an SMA system including dual piezoelectric wafer actuators according to one embodiment is shown;

[0051] Figure 43 An exploded view of a sub-section of an SMA actuator according to one embodiment is shown;

[0052] Figure 44 A sub-section of an SMA actuator according to one embodiment is shown;

[0053] Figure 45 A five-axis sensor shifting system according to one embodiment is shown;

[0054] Figure 46 An exploded view of a five-axis sensor shifting system according to one embodiment is shown;

[0055] Figure 47 An SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric chip actuator integrated into the circuit for all motions;

[0056] Figure 48 An SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric chip actuator integrated into the circuit for all motions;

[0057] Figure 49 A cross-section of a five-axis sensor shifting system according to one embodiment is shown;

[0058] Figure 50 An SMA actuator including dual piezoelectric wafer actuators is shown according to one embodiment;

[0059] Figure 51 A top view of an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric wafer actuator that moves an image sensor to different x and y positions;

[0060] Figure 52 An SMA actuator including a dual piezoelectric wafer actuator is shown, configured as a cartridge-type dual piezoelectric wafer autofocusing device according to one embodiment;

[0061] Figure 53 An SMA actuator including dual piezoelectric wafer actuators is shown according to one embodiment;

[0062] Figure 54An SMA actuator including dual piezoelectric wafer actuators is shown according to one embodiment;

[0063] Figure 55 An SMA actuator including dual piezoelectric wafer actuators is shown according to one embodiment;

[0064] Figure 56 An SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric chip actuator;

[0065] Figure 57 An exploded view of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric wafer actuator configured as a biaxial lens shift OIS;

[0066] Figure 58 A cross-section of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric wafer actuator configured for biaxial lens shifting OIS;

[0067] Figure 59 A cartridge-type dual piezoelectric chip actuator according to one embodiment is shown;

[0068] Figure 60 An SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric chip actuator;

[0069] Figure 61 An exploded view of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric chip actuator;

[0070] Figure 62 A cross-section of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric wafer actuator;

[0071] Figure 63 A cartridge-type dual piezoelectric chip actuator according to one embodiment is shown;

[0072] Figure 64 An SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric chip actuator;

[0073] Figure 65 An exploded view of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric chip actuator;

[0074] Figure 66An SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric chip actuator;

[0075] Figure 67 An SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric chip actuator;

[0076] Figure 68 illustrates an SMA system including an SMA actuator according to one embodiment, the SMA actuator comprising a dual piezoelectric chip actuator;

[0077] Figure 69 shows an exploded view of an SMA including an SMA actuator according to one embodiment, the SMA actuator including a dual piezoelectric chip actuator;

[0078] Figure 70 A cross-section of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric wafer actuator configured for triaxial sensor displacement OIS;

[0079] Figure 71 A cartridge-type dual piezoelectric wafer actuator component is shown according to one embodiment;

[0080] Figure 72 A flexible sensor circuit used in an SMA system according to one embodiment is shown;

[0081] Figure 73 illustrates an SMA system including an SMA actuator according to one embodiment, the SMA actuator comprising a dual piezoelectric chip actuator;

[0082] Figure 74 shows an exploded view of an SMA system including an SMA actuator according to one embodiment, the SMA actuator including a dual piezoelectric chip actuator;

[0083] Figure 75 A cross-section of an SMA system including an SMA actuator according to one embodiment is shown;

[0084] Figure 76 A cartridge-type dual piezoelectric chip actuator according to one embodiment is shown;

[0085] Figure 77 A flexible sensor circuit used in an SMA system according to one embodiment is shown;

[0086] Figure 78 illustrates an SMA system including an SMA actuator according to one embodiment, the SMA actuator comprising a dual piezoelectric chip actuator;

[0087] Figure 79 shows an exploded view of an SMA system including an SMA actuator according to one embodiment, the SMA actuator including a dual piezoelectric chip actuator;

[0088] Figure 80 A cross-section of an SMA system including an SMA actuator according to one embodiment is shown;

[0089] Figure 81 A cartridge-type dual piezoelectric chip actuator according to one embodiment is shown;

[0090] Figure 82 A flexible sensor circuit used in an SMA system according to one embodiment is shown;

[0091] Figure 83 illustrates an SMA system including an SMA actuator according to one embodiment, the SMA actuator comprising a dual piezoelectric chip actuator;

[0092] Figure 84 shows an exploded view of an SMA system including an SMA actuator according to one embodiment;

[0093] Figure 85 A cross-section of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric wafer actuator;

[0094] Figure 86 A cartridge-type dual piezoelectric chip actuator used in an SMA system according to one embodiment is shown;

[0095] Figure 87 A flexible sensor circuit used in an SMA system according to one embodiment is shown;

[0096] Figure 88 An exemplary dimension of a dual piezoelectric wafer actuator for an SMA actuator according to one embodiment is shown;

[0097] Figure 89 A lens system for a folding camera according to one embodiment is shown;

[0098] Figure 90 Several embodiments of a lens system including a liquid lens are shown according to one embodiment;

[0099] Figure 91 A folded lens as a prism is shown, disposed on an actuator according to one embodiment;

[0100] Figure 92 A dual piezoelectric wafer arm with an offset portion is shown according to one embodiment;

[0101] Figure 93A dual piezoelectric wafer arm having an offset portion and a limiter is shown according to one embodiment;

[0102] Figure 94 A dual piezoelectric wafer arm having an offset portion and a limiter is shown according to one embodiment;

[0103] Figure 95 An embodiment of a base including a dual piezoelectric wafer arm with an offset portion is shown according to one embodiment;

[0104] Figure 96 An embodiment of a base comprising two piezoelectric wafer arms with offset portions is shown according to one embodiment;

[0105] Figure 97 A buckling arm including a load point extension is shown according to one embodiment;

[0106] Figure 98 A buckling arm 9801 including a load point extension 9810 according to one embodiment is shown;

[0107] Figure 99 A dual piezoelectric wafer arm including a point-of-load extension is shown according to one embodiment;

[0108] Figure 100 A dual piezoelectric wafer arm including a point-of-load extension is shown according to one embodiment;

[0109] Figure 101 An SMA optical image stabilizer according to one embodiment is shown;

[0110] Figure 102 An SMA material attachment portion 40 of a movable part according to one embodiment is shown;

[0111] Figure 103 An SMA attachment portion of a static board according to one embodiment is shown, the static board having resistance-welded SMA wires attached thereto;

[0112] Figure 104 An SMA actuator 45 including a buckling actuator is shown according to one embodiment;

[0113] Figure 105a -b illustrates a resistance-welded press-fit assembly comprising an island structure for an SMA actuator according to one embodiment;

[0114] Figure 106 The relationship between the bending plane z-offset, valley width, and peak force of a dual piezoelectric wafer beam according to one embodiment is shown.

[0115] Figure 107An example is shown of how the volume of the approximate box surrounding the entire dual piezoelectric wafer actuator according to one embodiment relates to the work done by each dual piezoelectric wafer component;

[0116] Figure 108 A liquid lens actuated using a buckling actuator is shown according to one embodiment;

[0117] Figure 109 An unfixed load point end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0118] Figure 110 An unfixed load point end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0119] Figure 111 An unfixed load point end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0120] Figure 112 An unfixed load point end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0121] Figure 113 The fixed end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0122] Figure 114 The fixed end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0123] Figure 115 The fixed end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0124] Figure 116 The fixed end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0125] Figure 117 A rear view of the fixed end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0126] Figure 118 An unfixed load point end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0127] Figure 119 An unfixed load point end of a dual piezoelectric wafer arm according to an alternative embodiment is shown;

[0128] Figure 120 An unfixed load point end of a dual piezoelectric wafer arm according to an alternative embodiment is shown;

[0129] Figure 121 An unfixed load point end of a dual piezoelectric wafer arm according to an alternative embodiment is shown;

[0130] Figure 122An unfixed load point end of a dual piezoelectric wafer arm according to an alternative embodiment is shown;

[0131] Figure 123 The fixed end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0132] Figure 124 The fixed end of a dual piezoelectric wafer arm according to one embodiment is shown;

[0133] Figure 125 The fixed end of a dual piezoelectric wafer arm according to one embodiment is shown; and

[0134] Figure 126 The fixed end of a dual piezoelectric wafer arm according to an alternative embodiment is shown. Detailed Implementation

[0135] This document describes embodiments of SMA actuators that have a compact footprint and provide a high actuation height, such as high movement in the positive z-axis direction (z-direction), referred to herein as z-stroke. Embodiments of SMA actuators include SMA buckling actuators and SMA dual piezoelectric wafer actuators. SMA actuators can be used in a wide range of applications, including, but not limited to, for lens assemblies (as autofocus actuators, microfluidic pumps, sensor shifting devices, optical image stabilization devices, optical zoom assemblies) to mechanically impact two surfaces to produce a tactile feedback sensation commonly found in haptic feedback sensors and devices, and for other systems using actuators. For example, embodiments of the actuators described herein can be used as haptic feedback actuators in mobile phones or wearable devices configured to provide users with alarms, notifications, alerts, touch areas, or button press responses. Furthermore, more than one SMA actuator can be used in a system to achieve greater stroke.

[0136] For various embodiments, the SMA actuator has a z-stroke greater than 0.4 mm. Furthermore, when the SMA actuator is in its initial de-actuated position, the height of the SMA actuator in the z-direction in various embodiments is 2.2 mm or less. The footprint of the SMA actuator configured as an autofocusing actuator in a lens assembly can be as small as 3 mm larger than the lens inner diameter (“ID”). According to various embodiments, the footprint of the SMA actuator can be wider in one direction to accommodate components including, but not limited to, sensors, wires, traces, and connectors. According to some embodiments, the footprint of the SMA actuator is 0.5 mm larger in one direction; for example, the length of the SMA actuator is 0.5 mm larger than its width.

[0137] Figure 1a A lens assembly including an SMA actuator configured as a buckling actuator according to one embodiment is shown. Figure 1b An SMA actuator configured as a buckling actuator according to one embodiment is shown. The buckling actuator 102 is coupled to a base 101. Figure 1b As shown, an SMA wire (wire) 100 is attached to a buckling actuator 102 such that when the SMA wire 100 is actuated and contracts, the buckling actuator 102 buckles (bends), resulting in at least the central portion 104 of each buckling actuator 102 moving along the z-stroke direction (e.g., the positive z-direction), as indicated by arrow 108. According to some embodiments, the SMA wire 100 is actuated when current is supplied to one end of the wire via a wire retainer such as a crimp structure 106. The current flowing through the SMA wire 100 heats it due to the inherent resistance of the SMA material in which it is made. The other side of the SMA wire 100 has a wire retainer such as a crimp structure 106, which connects the SMA wire 100 to ground the circuit. Heating the SMA wire 100 to a sufficient temperature causes a unique material property to change from a martensitic to an austenitic crystal structure, resulting in a change in the length of the wire. Changing the current will change the temperature, and thus the length of the conductor. This change in conductor length will be used to actuate and de-actuate the actuator, at least controlling its movement along the z-direction. Those skilled in the art will understand that other techniques can be used to supply current to the SMA conductor.

[0138] Figure 2 An SMA actuator configured as an SMA dual piezoelectric wafer actuator according to one embodiment is shown. Figure 2 As shown, the SMA actuator includes a dual piezoelectric chip actuator 202 coupled to a base 204. The dual piezoelectric chip actuator 202 includes an SMA band 206. The dual piezoelectric chip actuator 202 is configured to move at least its unfixed end along the z-stroke direction 208 when the SMA band 206 contracts.

[0139] Figure 3An exploded view of an autofocus assembly including an SMA actuator according to one embodiment is shown. As shown, according to the embodiment described herein, the SMA actuator 302 is configured as a buckling actuator. The autofocus assembly also includes an optical image stabilizer (“OIS”) 304, a lens holder 306 configured to hold one or more optical lenses using techniques including those known in the art, a return spring 308, a vertical sliding bearing 310, and a guide cap 312. When the SMA wire is actuated using techniques including those described herein, causing it to pull the buckling actuator 302 and thus buckling the buckling actuator 302, the lens holder 306 is configured to slide against the vertical sliding bearing 310 as the SMA actuator 302 moves along the z-stroke direction (e.g., the positive z-direction). The return spring 308 is configured to apply a force to the lens holder 306 in a direction opposite to the z-stroke direction using techniques including those known in the art. According to various embodiments, the return spring 308 is configured to move the lens holder 306 in the opposite direction to the z-stroke direction when the tension in the SMA conductor decreases due to the release of the SMA conductor actuation. When the tension in the SMA conductor decreases to its initial value, the lens holder 306 moves to its lowest height in the z-stroke direction. Figure 4 It shows including according to Figure 3 The embodiment shown is an autofocusing component of the SMA wire actuator.

[0140] Figure 5 An SMA wire actuator including a sensor is illustrated according to one embodiment. For various embodiments, the sensor 502 is configured to measure the movement of the SMA actuator in the z-direction or the movement of a component to which the SMA actuator is moving using techniques including those known in the art. The SMA actuator includes one or more buckling actuators 506 configured to be actuated using one or more SMA wires 508 (similar to SMA wires described herein). For example, in reference... Figure 4 In the autofocus assembly, the sensor is configured to determine the amount of movement of the lens holder 306 from its initial position along the z-direction 504 using techniques including those known in the art. According to some embodiments, the sensor is a tunneling magnetoresistive (“TMR”) sensor.

[0141] Figure 6 A top view and a side view of an SMA actuator 602 are shown, which is configured as a buckling actuator fitted with a lens bracket 604 according to one embodiment. Figure 7 It shows according to Figure 6 A side view of a portion of the SMA actuator 602 of the illustrated embodiment. (Compared to...) Figure 7In the illustrated embodiment, the SMA actuator 602 includes a sliding base 702. According to one embodiment, the sliding base 702 is formed from a metal such as stainless steel using techniques including those known in the art. However, those skilled in the art will understand that other materials can be used to form the sliding base 702. Furthermore, according to some embodiments, the sliding base 702 has a spring arm 612 coupled to the SMA actuator 602. According to various embodiments, the spring arm 612 is configured to have two functions. The first function is to assist in pushing an object (e.g., a lens holder 604) onto a vertical sliding surface of a guide cap. In this example, the spring arm 612 preloads the lens holder 604 onto this surface to ensure that the lens does not tilt during actuation. In some embodiments, the vertical sliding surface 708 is configured to mate with the guide cap. The second function of the spring arm 612 is to assist in pulling back the SMA actuator 602 (e.g., along the negative z-direction) after the SMA guide wire 608 has moved the SMA actuator 602 along the z-stroke direction (positive z-direction). Therefore, when the SMA wire 608 is actuated, the SMA wire 608 retracts to move the SMA actuator 602 along the z-stroke direction, and when the SMA wire 608 is de-actuated, the spring arm 612 is configured to move the SMA actuator 602 in the opposite direction to the z-stroke direction.

[0142] SMA actuator 602 also includes a buckling actuator 710. In various embodiments, the buckling actuator 710 is formed of a metal such as stainless steel. Furthermore, the buckling actuator 710 includes a buckling arm 610 and one or more wire retainers 606. According to... Figure 6 and Figure 7In the illustrated embodiment, the buckling actuator 710 includes four wire retainers 606. Each of the four wire retainers 606 is configured to receive and retain an end of the SMA wire 608, such that the SMA wire 608 is secured to the buckling actuator 710. In various embodiments, the four wire retainers 606 are crimp members configured to press downwards onto a portion of the SMA wire 608 to secure the wire to the crimp member. Those skilled in the art will understand that techniques known in the art (including, but not limited to, adhesives, welds, and mechanical fasteners) can be used to secure the SMA wire 608 to the wire retainers 606. A smart memory alloy (“SMA”) wire 608 extends between a pair of wire retainers 606 such that the buckling arm 610 of the buckling actuator 710 is configured to move when the SMA wire 608 is actuated, thereby causing the pair of wire retainers 606 to be pulled closer together. According to various embodiments, when current is applied to the SMA lead 608, the SMA lead 608 is electrically actuated to move and control the position of the bend arm 610. When the current is removed or falls below a threshold, the SMA lead 608 is de-actuated. This causes the pair of lead retainers 606 to separate and the bend arm 610 to move in the opposite direction to when the SMA lead 608 was actuated. According to various embodiments, when the SMA lead is de-actuated in its initial position, the bend arm 610 is configured to have an initial angle of 5 degrees relative to the sliding base 702. And, according to various embodiments, at full stroke or when the SMA lead is fully actuated, the bend arm 610 is configured to have an angle of 10 to 12 degrees relative to the sliding base 702.

[0143] according to Figure 6 and Figure 7 In the illustrated embodiment, the SMA actuator 602 also includes a sliding bearing 706 disposed between the sliding base 702 and the wire retainer 606. The sliding bearing 706 is configured to minimize any friction between the sliding base 702 and the buckling arm 610 and / or the wire retainer 606. In some embodiments, the sliding bearing is fixed to the sliding bearing 706. According to various embodiments, the sliding bearing is formed of polyoxymethylene (“POM”). Those skilled in the art will understand that other structures can be used to reduce any friction between the buckling actuator and the base.

[0144] According to various embodiments, the sliding base 702 is configured to couple with a component base 704, such as an autofocusing base for an autofocusing assembly. According to some embodiments, the actuator base 704 includes etched pads. When the SMA actuator 602 is part of a component such as an autofocusing assembly, these etched pads can be used to provide clearance for wires and crimping.

[0145] Figure 8Several views of an embodiment of the buckling actuator 802 relative to the x-axis, y-axis, and z-axis are shown. Figure 8 As shown, the buckling arm 804 is configured to move along the z-axis when the SMA conductor is actuated and de-actuated as described herein. Figure 8 In the illustrated embodiment, the buckling arms 804 are coupled to each other via a central portion such as a hammock (sling) portion 806. According to various embodiments, the hammock portion 806 is configured to support (lift) an object as part of a buckling actuator (e.g., a lens holder moved by a buckling actuator using techniques including those described herein). According to some embodiments, the hammock portion 806 is configured to provide lateral (transverse) stiffness to the buckling actuator during actuation. In other embodiments, the buckling actuator does not include the hammock portion 806. According to these embodiments, the buckling arms are configured to act on the object to move it. For example, the buckling arms are configured to act directly on a feature of a lens holder to push it upward.

[0146] Figure 9 An SMA actuator configured as an SMA dual piezoelectric chip actuator according to one embodiment is shown. The SMA dual piezoelectric chip actuator includes a dual piezoelectric chip actuator 902, which includes those dual piezoelectric chip actuators described herein. Figure 9 In the illustrated embodiment, one end 906 of each dual piezoelectric wafer actuator 902 is fixed to the base 908. According to some embodiments, said end 906 is welded to the base 908. However, those skilled in the art will understand that other techniques can be used to fix said end 906 to the base 908. Figure 9 A lens holder 904 is also shown, arranged such that the dual piezoelectric wafer actuator 902 is configured to roll up along the z-direction and lift the holder 904 along the z-direction when actuated. In some embodiments, a return spring is used to push the dual piezoelectric wafer actuator 902 back to its initial position. The return spring can be configured as described herein to help push the dual piezoelectric wafer actuator downward to its initial de-actuated position. Due to the small footprint of the dual piezoelectric wafer actuator, SMA actuators with a reduced footprint compared to existing actuator technologies can be manufactured.

[0147] Figure 10A cross-sectional view of an autofocus assembly including an SMA actuator according to one embodiment is shown. The SMA actuator includes a position sensor, such as a TMR sensor. The autofocus assembly 1002 includes a position sensor 1004 attached to a movement spring 1006 and a magnet 1008 attached to a lens holder 1010 of the autofocus assembly, the autofocus assembly including an SMA actuator such as the SMA actuator described herein. The position sensor 1004 is configured to determine the amount of movement of the lens holder 1010 from an initial position along the z-direction 1005 based on the distance of the magnet 1008 from the position sensor 1004 using techniques including those known in the art. According to some embodiments, the position sensor 1004 is electrically coupled to a controller or processor (e.g., a central processing unit) using multiple electrical traces on the spring arm of the movement spring 1006 of the optical image stabilization assembly.

[0148] Figure 11a -c shows a view of a dual piezoelectric wafer actuator according to some embodiments. According to various embodiments, the dual piezoelectric wafer actuator 1102 includes a beam 1104 and one or more SMA materials 1106, such as an SMA strip 1106b (e.g., a perspective view of a dual piezoelectric wafer actuator including an SMA strip according to an embodiment of FIG. 11b) or an SMA wire 1106a (e.g., according to...). Figure 11a The cross-section of a dual piezoelectric wafer actuator including SMA wires is shown in an embodiment. The SMA material 1106 is secured to the beam 1104 using techniques including those described herein. According to some embodiments, the SMA material 1106 is secured to the beam 1104 using an adhesive film material 1108. For various embodiments, the ends of the SMA material 1106 are electrically and mechanically coupled to contacts 1110, which are configured to supply current to the SMA material 1106 using techniques including those known in the art. According to various embodiments, contacts 1110 (e.g., as shown in the cross-section of a dual piezoelectric wafer actuator including SMA wires) are... Figure 11aFigure 11b shows a gold-plated copper pad (solder pad). According to various embodiments, a dual piezoelectric chip actuator 1102 having a length of approximately 1 mm is configured to produce a large stroke and a thrust of 50 millinewtons (“mN”) and is used as part of a lens assembly, such as shown in Figure 11c. According to some embodiments, the use of a dual piezoelectric chip actuator 1102 having a length greater than 1 mm will produce a larger stroke but a smaller force compared to a dual piezoelectric chip actuator 1102 having a length of 1 mm. In one embodiment, the dual piezoelectric chip actuator 1102 includes a 20-micron-thick SMA material 1106, a 20-micron-thick insulator 1112 (e.g., a polyimide insulator), and a 30-micron-thick stainless steel beam 1104 or base metal. Various embodiments include a second insulator 1114 disposed between the contact layer including the contacts 1110 and the SMA material 1106. According to some embodiments, the second insulator 1114 is configured to insulate the SMA material 1106 from the portion of the contact layer not used as a contact 1110. In some embodiments, the second insulator 1114 is a cover layer, such as a polyimide insulator. Those skilled in the art will understand that other sizes and materials can be used to meet the desired design characteristics.

[0149] Figure 12 A view of an embodiment of a dual piezoelectric wafer actuator is shown. Figure 12 The illustrated embodiment includes a central feeder 1204 for applying power (electricity). As described herein, power is supplied at the center of an SMA material 1202 (wire or strip). The ends of the SMA material 1202 are grounded to a beam 1206 or base metal at end pads 1203 as a return path. End pads 1203 are electrically isolated from the remainder of contact layer 1214. According to various embodiments, the beam 1206 or base metal is flush against the SMA material 1202 (e.g., an SMA wire) along its entire length, allowing the wire to cool more quickly when the current is turned off (i.e., when the dual piezoelectric crystal actuator is de-actuated). This results in faster wire deactivation and a faster actuator response time. The thermal profile (performance) of the SMA wire or strip is improved. For example, the thermal profile is more uniform, allowing higher total current to be reliably delivered to the wire. Without uniform heat dissipation, certain portions of the wire (e.g., the central region) may overheat and become damaged, requiring reduced current and reduced motion for reliable operation. The center feeder 1204 offers the following advantages: the SMA material 1202 provides faster wire activation / actuation (faster heating) and reduced power consumption (lower resistance path length), thus enabling a faster response time. This allows for faster actuator movement and enables operation at higher operating frequencies.

[0150] like Figure 12As shown, beam 1206 includes a central metal 1208, which is isolated from the rest of beam 1206 to form a central power supply 1204. An insulator 1210, such as the insulator described herein, is disposed on beam 1206. The insulator 1210 is configured to have one or more openings or through-holes 1212 to provide an electrical path to beam 1206 (e.g., to couple a ground portion 1214b of the contact layer) and to provide contact with the central metal 1208 to form the central power supply 1204. According to some embodiments, contact layer 1214, such as the contact layer described herein, includes a power portion 1214a and a ground portion 1214b to provide actuation / control signals to a dual piezoelectric wafer actuator via power contacts 1216 and ground contacts 1218. A cover layer 1220, such as the cover layer described herein, is disposed on the contact layer 1214 to electrically isolate the contact layer at portions of the contact layer 1214 other than the portions requiring electrical coupling (e.g., one or more contacts).

[0151] Figure 13 It shows according to Figure 12 The illustrated embodiment shows a cross-section of the end pad of the dual piezoelectric wafer actuator. As described above, the end pad 1203 is electrically isolated from the remainder of the contact layer 1214 by a gap 1222 formed between the end pad 1203 and the contact layer 1214. According to some embodiments, the gap is formed using etching techniques including those known in the art. The end pad 1203 includes a through-hole portion 1224 configured to electrically couple the end pad 1203 to the beam 1206. The through-hole portion 1224 is formed in a through-hole 1212 formed in the insulator 1210. SMA material 1202 is electrically coupled to the end pad 1213. The SMA material 1202 can be electrically coupled to the end pad 1213 using techniques including, but not limited to, welding, resistance welding, laser welding, and direct plating.

[0152] Figure 14 It shows according to Figure 12 The cross-section of the central feeder of the dual piezoelectric wafer actuator of the illustrated embodiment. The central feeder 1204 is electrically coupled to the power supply through the contact layer 1214, and is electrically and thermally coupled to the central metal 1208 through a through-hole portion 1226 formed in the through-hole 1212 formed in the insulator 1210.

[0153] The actuators described herein can be used to form actuator assemblies employing multiple buckling actuators and / or multiple dual piezoelectric wafer actuators. According to one embodiment, the actuators can be stacked on top of each other to increase the achievable stroke distance.

[0154] Figure 15An exploded view of an SMA actuator including two buckling actuators according to one embodiment is shown. According to the embodiments described herein, the two buckling actuators 1302, 1304 are arranged relative to each other such that their movements are anti-mutual. In various embodiments, the two buckling actuators 1302, 1304 are configured to move in opposite directions to position the lens holder 1306. For example, the first buckling actuator 1302 is configured to receive a power signal that is opposite to the power (electrical) signal sent to the second buckling actuator 1304.

[0155] Figure 16 An SMA actuator comprising two buckling actuators is shown according to one embodiment. The buckling actuators 1302, 1304 are configured such that the buckling arms 1310, 1312 of each buckling actuator 1302, 1304 face each other, and the sliding bases 1314, 1316 of each buckling actuator 1302, 1304 are the outer surfaces of the two buckling actuators. According to various embodiments, the hammock portion 1308 of each SMA actuator 1302, 1304 is configured to support a portion of an object acted upon by the one or more buckling actuators 1302, 1304 (e.g., a lens holder 1306 moved by the buckling actuators using techniques including those described herein).

[0156] Figure 17 A side view of an SMA actuator including two buckling actuators according to one embodiment is shown, illustrating the orientation of the SMA wire 1318 that causes an object such as a lens holder to move along the positive z-direction or upward direction.

[0157] Figure 18 A side view of an SMA actuator including two buckling actuators according to one embodiment is shown, illustrating the orientation of the SMA wire 1318 that causes an object such as a lens holder to move along the negative z-direction or downward direction.

[0158] Figure 19An exploded view of an assembly including an SMA actuator according to one embodiment is shown, the SMA actuator comprising two buckling actuators. Buckling actuators 1902, 1904 are configured such that the buckling arms 1910, 1912 of each buckling actuator 1902, 1904 are the outer surfaces of the two buckling actuators, and the sliding bases 1914, 1916 of each buckling actuator 1902, 1904 face each other. According to various embodiments, a hammock portion 1908 of each SMA actuator 1902, 1904 is configured to support a portion of an object acted upon by the one or more buckling actuators 1902, 1904 (e.g., a lens holder 1906 moved by the buckling actuators using techniques including those described herein). In some embodiments, the SMA actuator includes a base portion 1918 configured to receive a second buckling actuator 1904. The SMA actuator may also include a cover portion 1920. Figure 20 An SMA actuator comprising two buckling actuators is shown according to one embodiment. The SMA actuator includes a base portion and a cover portion.

[0159] Figure 21 An SMA actuator comprising two buckling actuators is shown according to one embodiment. In some embodiments, the buckling actuators 1902, 1904 are arranged relative to each other such that the hammock portion 1908 of the first buckling actuator 1902 rotates approximately 90 degrees relative to the hammock portion of the second buckling actuator 1904. This 90-degree configuration allows an object such as a lens holder 1906 to pitch and roll. This enables better control over the movement of the lens holder 1906. In various embodiments, differential power signals are applied to the SMA leads of each buckling actuator pair to cause the lens holder to pitch and roll, thereby achieving tilt OIS motion.

[0160] Embodiments of SMA actuators including two buckling actuators do not require a return spring. When using SMA wire resistance for position feedback, using two buckling actuators can improve / reduce hysteresis. Compared to actuators including a return spring, the reaction force SMA actuator including two buckling actuators contributes to more precise position control due to the lower hysteresis. For some embodiments, such as... Figure 22The illustrated embodiment includes two buckling actuators 2202, 2204 whose SMA actuators provide two-axis tilting by applying differential power to the left and right SMA leads 2218a, 2218b of each buckling actuator 2202, 2204. For example, the left SMA lead 2218a is actuated with a higher power than the right SMA lead 2218b. This causes the left side of the lens holder 2206 to move downwards, while the right side moves upwards (tilts). In some embodiments, the SMA lead of the first buckling actuator 2202 is kept at equal power to serve as a fulcrum for the differential actuation of the SMA leads 2218a, 2218b, thereby causing tilting motion. By swapping the power signals applied to the SMA conductors, for example, applying equal power to the SMA conductors of the second buckling actuator 2202, and applying differential power to the left and right SMA conductors 2218a and 2218b of the second buckling actuator 2204, the lens holder 2206 will tilt in the opposite direction. This allows an object (e.g., the lens holder) to tilt along either axis of motion, or allows any tilt between the lens and the sensor to be adjusted to achieve good dynamic tilt, thereby achieving better image quality across all pixels.

[0161] Figure 23 An SMA actuator comprising two buckling actuators and a coupler is shown according to one embodiment. The SMA actuator includes two buckling actuators, such as those described herein. A first buckling actuator 2302 is configured to couple with a second buckling actuator 2304 using a coupler such as a coupler ring 2305. The buckling actuators 2302 and 2304 are arranged relative to each other such that a hammock portion 2308 of the first buckling actuator 2302 rotates approximately 90 degrees relative to a hammock portion 2309 of the second buckling actuator 2304. A payload (e.g., a lens or lens assembly) for movement is attached to a lens holder 2306, which is configured to be disposed on a sliding base of the first buckling actuator 2302.

[0162] In various embodiments, equal power can be applied to the SMA leads of the first buckling actuator 2302 and the second buckling actuator 2304. This can cause the z-stroke of the SMA actuator in the positive z-direction to be maximized. In some embodiments, the stroke of the SMA actuator can have a z-stroke equal to or greater than twice the stroke of other SMA actuators including two buckling actuators. In some embodiments, when the power signal is removed from the SMA actuator, additional springs can be added to push against the two buckling (actuators) to help push the actuator assembly and the payload downwards. Equal and opposite power signals can be applied to the SMA leads of the first buckling actuator 2302 and the second buckling actuator 2304. This allows the SMA actuator to be moved by the buckling actuator in the positive z-direction and also in the negative z-direction, which allows for precise control of the position of the SMA actuator. In addition, equal and opposite power signals (differential power signals) can be applied to the left and right SMA wires of the first buckling actuator 2302 and the second buckling actuator 2304 to cause an object such as a lens bracket 2306 to tilt along at least one of the two axes.

[0163] An embodiment of an SMA actuator including two buckling actuators and a coupler (e.g.) Figure 23 (As shown) can be coupled with an additional buckling actuator and a pair of buckling actuators to achieve a larger desired stroke than a single SMA actuator.

[0164] Figure 24 An exploded view of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator comprising a buckling actuator with a laminated hammock. As described herein, in some embodiments, the SMA system is configured for use as an autofocus driver with one or more camera lens elements. Figure 24 As shown, the SMA system includes a return spring 2403, which, according to various embodiments, is configured to move the lens holder 2406 in a direction opposite to the z-stroke direction when the tension in the SMA conductor 2408 decreases due to the SMA conductor being de-actuated. In some embodiments, the SMA system includes a housing 2409 configured to receive the return spring 2403 and serve as a sliding bearing guiding the movement of the lens holder in the z-stroke direction. The housing 2409 is also configured to be disposed on a buckling actuator 2402. The buckling actuator 2402 includes a sliding base 2401 similar to the sliding base described herein. The buckling actuator 2402 includes a buckling arm 2404 coupled to a hammock portion (e.g., a laminated hammock 2406 formed of laminate). The buckling actuator 2402 also includes an SMA conductor attachment structure, such as a laminated press-fit connector 2412.

[0165] like Figure 24As shown, a sliding base 2401 is mounted on an optional adapter plate 2414. The adapter plate is configured to engage the SMA system or buckling actuator 2402 with another system (e.g., OIS, an additional SMA system, or other components). Figure 25 An SMA system 2501 is shown, which includes an SMA actuator according to one embodiment, the SMA actuator including a buckling actuator 2402 with a laminated hammock.

[0166] Figure 26 A buckling actuator including a laminated hammock is shown according to one embodiment. The buckling actuator 2402 includes a buckling arm 2404. As described herein, the buckling arm 2404 is configured to move along the z-axis when the SMA conductor 2412 is actuated and de-actuated. The SMA conductor 2408 is attached to the buckling actuator using a laminated crimp connector 2412. Figure 26 In the illustrated embodiment, the buckling arms 2404 are coupled to each other via a central portion such as a laminated hammock 2406. According to various embodiments, the laminated hammock 2406 is configured as part of a buckling actuator that supports an object (e.g., a lens holder moved by a buckling actuator using techniques including those described herein).

[0167] Figure 27 A laminated hammock of an SMA actuator according to one embodiment is shown. In some embodiments, the laminated hammock 2406 is made of a low-stiffness material, and therefore does not resist actuation movements. For example, the laminated hammock 2406 is formed using a copper layer disposed on a first polyimide layer and a second polyimide layer disposed on the copper. In some embodiments, the laminated hammock 2406 is formed on the buckling arm 2404 using deposition and etching techniques, including those known in the art. In other embodiments, the laminated hammock 2406 is formed separately from the buckling arm 2404 and is attached to the buckling arm 2404 using techniques including welding, bonding, and other techniques known in the art. In various embodiments, glue or other adhesives are used on the laminated hammock 2406 to ensure that the buckling arm 2404 remains in place relative to the lens holder.

[0168] Figure 28 A laminated crimp connector 2412 for an SMA actuator according to one embodiment is shown. The laminated crimp connector 2412 is configured to attach an SMA wire 2408 to the buckling actuator and form a circuit connection with the SMA wire 2408. For various embodiments, the laminated crimp connector 2412 comprises a laminate formed of one or more conductive layers and one or more insulating layers formed on the crimp connector.

[0169] For example, a polyimide layer is disposed on at least a portion of the stainless steel portion forming the crimp member 2413. A conductive layer, such as copper, is then disposed on the polyimide layer, said conductive layer being electrically coupled to one or more signal traces 2415 disposed on the buckling actuator. Deforming the crimp member to bring it into contact with the SMA wires therein also brings the SMA wires into electrical contact with the conductive layer. Thus, the conductive layer coupled to said one or more signal traces is used to apply a power signal to the SMA wires using techniques including those described herein. In some embodiments, a second polyimide layer is formed on the conductive layer in areas where the conductive layer will not contact the SMA wires. In some embodiments, a laminated crimp connector 2412 is formed on the crimp member 2413 using deposition and etching techniques including those known in the art. In other embodiments, the laminated crimp connector 2412 and the one or more electrical traces are formed separately from the crimp connector 2413 and the buckling actuator, and are attached to the crimp connector 2412 and the buckling actuator using techniques including welding, bonding and other techniques known in the art.

[0170] Figure 29 An SMA actuator is shown, which includes a buckling actuator with a laminated hammock. (As shown) Figure 29 As shown, when a power signal is applied, the SMA conductor contracts or shortens, causing the buckling arm and laminating hammock to move along the positive z-direction. The laminating hammock in contact with an object (e.g., a lens holder) then moves that object along the positive z-direction. When the power signal decreases or is removed, the SMA conductor lengthens, moving the buckling arm and laminating hammock along the negative z-direction.

[0171] Figure 30 An exploded view of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator comprising a buckling actuator. As described herein, in some embodiments, the SMA system is configured for use as an autofocus driver with one or more camera lens elements. Figure 30As shown, the SMA system includes a return spring 3003, which, according to various embodiments, is configured to cause the lens holder 3005 to move in the direction opposite to the z-stroke direction when the tension in the SMA conductor 3008 decreases due to the SMA conductor being de-actuated. In some embodiments, the SMA system includes a reinforcement 3000 disposed on the return spring 3003. In some embodiments, the SMA system includes a housing 3009 formed of two parts, which is configured to receive the return spring 3003 and serve as a sliding bearing for guiding the movement of the lens holder in the z-stroke direction. The housing 3009 is also configured to be disposed on a buckling actuator 3002. The buckling actuator 3002 includes a sliding base 3001, which, similar to the sliding base described herein, is formed of two parts. The sliding base 3001 is separated to electrically isolate the two sides (e.g., one side is grounded and the other side is powered) because, according to some embodiments, current flows through certain portions of the sliding base 3001 to the conductors.

[0172] The buckling actuator 3002 includes a buckling arm 3004. Each pair of buckling actuators 3002 is formed on a separate portion of the buckling actuator 3002. The buckling actuator 3002 also includes an SMA wire attachment structure, such as a resistance-welded wire crimp 3012. The SMA system optionally includes a flexible circuit 3020 for electrically coupling the SMA wire 3008 to one or more control circuits.

[0173] like Figure 30 As shown, a sliding base 3001 is mounted on an optional adapter plate 3014. This adapter plate is configured to engage the SMA system or buckling actuator 3002 with another system (e.g., OIS, an additional SMA system, or other components). Figure 31 An SMA system 3101 is shown that includes an SMA actuator according to one embodiment, the SMA actuator including a buckling actuator 3002.

[0174] Figure 32 This includes an SMA actuator including a buckling actuator according to one embodiment. The buckling actuator 3002 includes a buckling arm 3004. The buckling arm 3004 is configured to move along the z-axis when the SMA wire 3012 is actuated and de-actuated as described herein. The SMA wire 2408 is attached to the resistance-welded wire crimp member 3012. According to... Figure 32 In the embodiment shown, the flexure arm 3004 is configured to engage with an object (e.g., a lens holder) without using the central portion of the biyoke capture joint.

[0175] Figure 33 A biyoke capture joint of a pair of flexed arms of an SMA actuator according to one embodiment is shown. Figure 33Also shown are plated pads for attaching optional flexible circuitry to a sliding base. In some embodiments, the plated pads are formed using gold. Figure 34 A resistance-welded crimp fitting for attaching SMA wires to a buckling actuator is shown according to one embodiment. In some embodiments, glue or adhesive may also be applied to the top of the weld to help improve mechanical strength and mitigate fatigue strain during operation and impact loading.

[0176] Figure 35 An SMA actuator is shown, which includes a buckling actuator with a biyoke capture joint. Figure 35 As shown, when a power signal is applied, the SMA conductor contracts or shortens to move the buckling arm along the positive z-direction. The two yoke capture joints, in contact with an object (e.g., a lens holder), then move that object along the positive z-direction. When the power signal decreases or is removed, the SMA conductor lengthens and moves the buckling arm along the negative z-direction. This yoke capture feature ensures that the buckling arm remains in the correct position relative to the lens holder.

[0177] Figure 36 An SMA dual piezoelectric wafer liquid lens according to one embodiment is shown. The SMA dual piezoelectric wafer liquid lens 3501 includes a liquid lens subassembly 3502, a housing 3504, and circuitry 3506 with SMA actuators. For various embodiments, the SMA actuators include four dual piezoelectric wafer actuators 3508, such as those described herein. The dual piezoelectric wafer actuators 3508 are configured to actuate a forming ring 3510 located on a flexible membrane 3512. This ring bends the membrane 3512 / liquid 3514, thereby altering the optical path through the membrane 3512 / liquid 3514. A liquid-receiving ring 3516 is used to receive the liquid 3514 between the membrane 3512 and the lens 3518. The equal forces from the dual piezoelectric wafer actuators alter the focal point of the image in the Z direction (perpendicular to the lens), allowing it to be used as an autofocus device. According to some embodiments, differential forces from the dual piezoelectric chip actuator 3508 can move light along the X and Y axes, making it usable as an optical image stabilizer. By properly controlling each actuator, both OIS (Optical Image Stabilization) and AF (Autofocus) functions can be achieved simultaneously. In some embodiments, three actuators are used. The circuitry 3506 with SMA actuators includes one or more contacts 3520 for transmitting control signals to actuate the SMA actuators. According to some embodiments including four SMA actuators, the circuitry 3506 with SMA actuators includes four power circuit control contacts for each SMA actuator and a common return contact.

[0178] Figure 37A perspective view of an SMA dual piezoelectric wafer liquid lens according to one embodiment is shown. Figure 38 A cross-sectional view and a bottom view of an SMA dual piezoelectric wafer liquid lens according to one embodiment are shown.

[0179] Figure 39 An SMA system including an SMA actuator 3902 with dual piezoelectric chip actuators according to one embodiment is shown. The SMA actuator 3902 includes four dual piezoelectric chip actuators using the technology described herein. Figure 40 As shown, two dual piezoelectric crystal actuators are configured as positive z-stroke actuators 3904, and two dual piezoelectric crystal actuators are configured as negative z-stroke actuators 3906, with an SMA actuator 3902 with dual piezoelectric crystal actuators shown according to one embodiment. Opposite actuators 3906, 3904 are configured to control movement in both directions throughout the entire stroke range. This allows for adjustment of the control code to compensate for tilt. In various embodiments, two SMA wires 3908 attached to the top of the component achieve positive z-stroke displacement. Two SMA wires attached to the bottom of the component achieve negative z-stroke displacement. In some embodiments, each dual piezoelectric crystal actuator is attached to an object (e.g., a lens holder 3910) using a flap-joining object. The SMA system includes a top spring 3912 configured to provide stability to the lens holder 3910 on axes perpendicular to the z-stroke axis (e.g., in the x and y directions). Furthermore, a top spacer 3914 is configured to be disposed between a top spring 3912 and an SMA actuator 3902. A bottom spacer 3916 is disposed between an SMA actuator 3902 and a bottom spring 3918. The bottom spring 3918 is configured to provide stability to the lens holder 3910 on an axis perpendicular to the z-axis of travel (e.g., in the x and y directions). The bottom spring 3918 is configured to be disposed on a base 3920 (e.g., the base described herein).

[0180] Figure 41 The length 4102 of the dual piezoelectric chip actuator 4103 and the location of the wiring pad 4104 are shown. The wiring pad 4104 is used to extend the wire length of the SMA wire 4206 beyond the dual piezoelectric chip actuator. The wire being longer than the dual piezoelectric chip actuator is used to increase the stroke and force. Therefore, the extension length 4108 of the SMA wire 4206 beyond the dual piezoelectric chip actuator 4103 is used to set the stroke and force of the dual piezoelectric chip actuator 4103.

[0181] Figure 42An exploded view of an SMA system including an SMA dual piezoelectric chip actuator 4202 according to one embodiment is shown. According to various embodiments, the SMA system is configured to use separate metallic materials and non-conductive adhesives to create one or more circuits to independently power the SMA wires. Some embodiments do not affect the AF size and include four dual piezoelectric chip actuators, such as those described herein. Two dual piezoelectric chip actuators are configured as positive z-stroke actuators, and two dual piezoelectric chip actuators are configured as negative z-stroke actuators. Figure 43 An exploded view of a sub-section of an SMA actuator according to one embodiment is shown. This sub-section includes a negative actuator signal connector 4302 and a base 4304 with a dual piezoelectric chip actuator 4306. The negative actuator signal connector 4302 includes a pad 4308 for connecting the SMA wires of the dual piezoelectric chip actuator 4306 using techniques including those described herein. The negative actuator signal connector 4302 is secured to the base 4304 using an adhesive layer 4310. This sub-section also includes a positive actuator signal connector 4314 with a pad 4316 for connecting the SMA wires 4312 of the dual piezoelectric chip actuator 4306 using techniques including those described herein. The positive actuator signal connector 4314 is secured to the base 4304 using an adhesive layer 4318. Each of the base 4304, the negative actuator signal connector 4302, and the positive actuator signal connector 4314 is formed of metal, such as stainless steel. A connection pad 4322 on each of the base 4304, the negative actuator signal connector 4302, and the positive actuator signal connector 4314 is configured to electrically couple a control signal to ground using techniques including those described herein, to actuate the dual piezoelectric crystal actuator 4306. In some embodiments, the connection pad 4322 is gold-plated. Figure 44 A sub-section of an SMA actuator according to one embodiment is shown. In some embodiments, gold-plated pads are formed on a stainless steel layer for soldering or other known electrical termination methods. Additionally, the formed terminal blocks serve as signal connectors to electrically couple SMA wires for use with power signals.

[0182] Figure 45A five-axis sensor shifting system according to one embodiment is illustrated. This five-axis sensor shifting system is configured to move an object (e.g., an image sensor) along five axes relative to one or more lenses. These include X / Y / Z-axis translation and pitch / roll tilt. Optionally, the system is configured to use only four axes (i.e., X / Y-axis translation and pitch / roll tilt) and has a separate AF on top to perform Z-motion. Other embodiments include five-axis sensor shifting systems configured to move one or more lenses relative to an image sensor. In some embodiments, a static lens stack is mounted on a top cover and inserted into the ID (without contacting the internal orange moving bracket).

[0183] Figure 46 An exploded view of a five-axis sensor shifting system according to one embodiment is shown. The five-axis sensor shifting system includes: two circuit components, namely, a flexible sensor circuit 4602 and a dual piezoelectric crystal actuator circuit 4604; and 8-12 dual piezoelectric crystal actuators 4606 built on the dual piezoelectric crystal circuit components using techniques including those described herein. The five-axis sensor shifting system includes a movable carriage 4608 configured to hold one or more lenses and a housing 4610. According to one embodiment, the dual piezoelectric crystal actuator circuit 4604 includes 8-12 SMA actuators, such as the SMA actuators described herein. The SMA actuators are configured to move the movable carriage 4608 along five axes (e.g., x-direction, y-direction, z-direction, pitch, and roll), similar to other five-axis systems described herein.

[0184] Figure 47 An SMA actuator according to one embodiment is shown, which includes dual piezoelectric chip actuators integrated into the circuit for all motions. Embodiments of the SMA actuator may include 8-12 dual piezoelectric chip actuators 4606. However, other embodiments may include more or fewer dual piezoelectric chip actuators. Figure 48 An SMA actuator 4802 according to one embodiment is shown, which includes a dual piezoelectric chip actuator integrated into the circuit for all motions, and the SMA actuator 4802 is partially configured to be mounted within a corresponding housing 4804. Figure 49 A cross-section of a five-axis sensor shifting system according to one embodiment is shown.

[0185] Figure 50 An SMA actuator 5002 including dual piezoelectric chip actuators is shown according to one embodiment. The SMA actuator 5002 is configured to move an image sensor, lens, or other various payloads along the x and y directions using four side-mounted SMA dual piezoelectric chip actuators 5004. Figure 51A top view of an SMA actuator including dual piezoelectric crystal actuators is shown, which move an image sensor, lens, or other various payloads to different x and y positions.

[0186] Figure 52 An SMA actuator including a dual piezoelectric wafer actuator 5202 is shown according to one embodiment, the SMA actuator being configured as a cartridge-type dual piezoelectric wafer autofocusing device. Four top- and bottom-mounted SMA dual piezoelectric wafer actuators (e.g., the SMA dual piezoelectric wafer actuators described herein) are configured to move together to produce movement in the z-stroke direction for autofocusing motion. Figure 53 An SMA actuator including dual piezoelectric wafer actuators is shown according to one embodiment, wherein two top-mounted dual piezoelectric wafer actuators 5302 are configured to push one or more lenses downward. Figure 54 An SMA actuator including dual piezoelectric wafer actuators is shown according to one embodiment, wherein two bottom-mounted dual piezoelectric wafer actuators 5402 are configured to push one or more lenses upward. Figure 55 An SMA actuator including dual piezoelectric wafer actuators according to one embodiment is shown, illustrating four top- and bottom-mounted SMA dual piezoelectric wafer actuators 5502, as described herein, for moving the one or more lenses to produce tilting motion.

[0187] Figure 56 An SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator comprising a dual piezoelectric wafer actuator configured for biaxial lens shift OIS. In some embodiments, the biaxial lens shift OIS is configured to move a lens along the X / Y axes. In some embodiments, Z-axis movement originates from a single AF, such as those described herein. Four dual piezoelectric wafer actuators push the sides of the autofocus device to perform OIS movement. Figure 57 An exploded view of an SMA system including an SMA actuator 5802 according to one embodiment is shown, the SMA actuator 5802 including a dual piezoelectric wafer actuator 5806 configured for biaxial lens shifting OIS. Figure 58 A cross-section of an SMA system including an SMA actuator 5802 according to one embodiment is shown, the SMA actuator 5802 including a dual piezoelectric wafer actuator 5806 configured for biaxial lens shift OIS. Figure 59A cartridge-type dual piezoelectric wafer actuator 5802 for an SMA system according to one embodiment is shown. The cartridge-type dual piezoelectric wafer actuator 5802 is configured as a biaxial lens-shifting OIS fabricated prior to being shaped to suit the system. Such a system can be configured with an OIS having a high OIS travel (e.g., + / - 200 μm or higher). Furthermore, such embodiments are configured to use four sliding bearings (e.g., POM sliding bearings) to have a wide range of motion and good dynamic OIS tilt. These embodiments are configured for easy integration with AF designs (e.g., VCM or SMA).

[0188] Figure 60 An SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator comprising dual piezoelectric crystal actuators configured as a five-axis lens shift OIS and an autofocus device. In some embodiments, the five-axis lens shift OIS and autofocus device are configured to move the lens along the X / Y / Z axes. In some embodiments, pitch and yaw axis movements are used for dynamic tilt tuning capability. Using the techniques described herein, eight dual piezoelectric crystal actuators are used to move the autofocus device and OIS. Figure 61 An exploded view of an SMA system including an SMA actuator 6202 according to one embodiment is shown. The SMA actuator 6202 includes a dual piezoelectric wafer actuator 6204 according to one embodiment, which is configured as a five-axis lens shift OIS and autofocus device. Figure 62 A cross-section of an SMA system including an SMA actuator 6202 according to one embodiment is shown. The SMA actuator 6202 includes a dual piezoelectric wafer actuator 6204 configured as a five-axis lens shift OIS and an autofocus device. Figure 63 A cartridge-type dual piezoelectric wafer actuator 6202 for an SMA system according to one embodiment is shown. The cartridge-type dual piezoelectric wafer actuator 6202 is configured as a five-axis lens shifting OIS and autofocusing device fabricated prior to being shaped to suit the system. Such a system can be configured with a high OIS travel (e.g., + / - 200 μm or higher) and a high autofocus travel (e.g., 400 μm or higher). Furthermore, such an embodiment makes it possible to eliminate any tilting and eliminates the need for a separate autofocusing component.

[0189] Figure 64An SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator comprising dual piezoelectric crystal actuators configured to push outwards. In some embodiments, the dual piezoelectric crystal actuator assembly is configured to be wound around an object such as a lens holder. The X / Y / Z stiffness of the flexible portion is low because the circuit assembly moves with the lens holder. The tail pad of the circuit is static. The pushing outwards box can be configured with four or eight dual piezoelectric crystal actuators. Thus, the pushing outwards box can be configured with four dual piezoelectric crystal actuators on the OIS side, moving in the X and Y axes. The pushing outwards box can be configured with four dual piezoelectric crystal actuators on the top and bottom of the autofocus unit, moving in the z-axis. The pushing outwards box can be configured with eight dual piezoelectric crystal actuators on the top, bottom, and sides of the OIS and autofocus unit, moving in the x, y, and z axes, and capable of 3-axis tilt (pitch / roll / yaw). Figure 65 An exploded view of an SMA system including an SMA actuator 6602 according to one embodiment is shown. The SMA actuator 6602 includes a dual piezoelectric wafer actuator 6604 configured to push the housing outward. Therefore, the SMA actuator is configured such that the dual piezoelectric wafer actuator acts on a housing 6504 to move a lens holder 6506 using the techniques described herein. Figure 66 An SMA system including an SMA actuator 6602 according to one embodiment is shown, the SMA actuator 6602 including a dual piezoelectric wafer actuator configured to push a box outward, the box being partially shaped to receive a lens holder 6604. Figure 67 An SMA system is shown that includes an SMA actuator 6602 having a dual piezoelectric chip actuator 6604 according to one embodiment, the dual piezoelectric chip actuator 6604 being configured as an outward push box as formed to suit the system prior to its fabrication.

[0190] Figure 68 illustrates an SMA system including an SMA actuator 6802 according to one embodiment, which includes dual piezoelectric wafer actuators configured for triaxial sensor displacement of the OIS. In some embodiments, z-axis movement originates from a separate autofocus system. Four dual piezoelectric wafer actuators are configured to push the sides of a sensor holder 6804 using the techniques described herein to move the OIS. Figure 69 shows an exploded view of an SMA including an SMA actuator 6802 according to one embodiment, which includes dual piezoelectric wafer actuators configured for triaxial sensor displacement of the OIS. Figure 70 A cross-section of an SMA system including an SMA actuator 6802 according to one embodiment is shown, the SMA actuator 6802 including a dual piezoelectric wafer actuator 6806 configured for triaxial sensor shifting OIS. Figure 71Components of a cartridge dual piezoelectric wafer actuator 6802 for an SMA system according to one embodiment are shown, which is configured as a triaxial sensor shift OIS manufactured prior to being shaped to suit the system. Figure 72 A flexible sensor circuit for an SMA system, configured as a triaxial sensor shifting OIS according to one embodiment, is illustrated. Such a system can be configured with a high OIS travel (e.g., + / - 200µm or higher) and a high autofocus travel (e.g., 400µm or higher). Furthermore, such embodiments are configured to utilize four sliding bearings (e.g., POM sliding bearings) to achieve a wide range of biaxial motion and good OIS dynamic tilt. These embodiments are configured for easy integration with AF designs (e.g., VCM or SMA).

[0191] Figure 73 illustrates an SMA system including an SMA actuator 7302 according to one embodiment, the SMA actuator 7302 including a dual piezoelectric crystal actuator 7304 configured as a six-axis sensor shift OIS and autofocus device. In some embodiments, the six-axis sensor shift OIS and autofocus device are configured to move a lens on the X / Y / Z / pitch / yaw / roll axes. In some embodiments, the pitch and yaw axis movements are for dynamic tilt tuning capability. Using the techniques described herein, eight dual piezoelectric crystal actuators are used to move the autofocus and OIS device. Figure 74 shows an exploded view of an SMA system including an SMA actuator 7402 according to one embodiment, the SMA actuator 7402 including a dual piezoelectric crystal actuator 7404 configured as a six-axis sensor shift OIS and autofocus device. Figure 75 A cross-section of an SMA system including an SMA actuator 7402 according to one embodiment is shown. The SMA actuator 7402 includes a dual piezoelectric wafer actuator configured as a six-axis sensor shift OIS and an autofocus device. Figure 76 A cartridge dual piezoelectric wafer actuator 7402 for an SMA system according to one embodiment is shown, the cartridge dual piezoelectric wafer actuator 7402 being configured as such to be suitable for a six-axis sensor shifting OIS and autofocus device manufactured prior to the system. Figure 77 A flexible sensor circuit for an SMA system according to one embodiment is shown, the flexible sensor circuit being configured as a triaxial sensor shift OIS. Such a system can be configured with a high OIS travel (e.g., + / - 200 μm or higher) and a high autofocus travel (e.g., 400 μm or higher). Furthermore, such an embodiment enables the elimination of any tilt and eliminates the need for a separate autofocus component.

[0192] Figure 78 illustrates an SMA system including an SMA actuator according to one embodiment, the SMA actuator comprising a dual piezoelectric crystal actuator configured for two-axis camera tilt OIS. In some embodiments, the two-axis camera tilt OIS is configured to move the camera on the pitch / yaw axis. Using the techniques described herein, four dual piezoelectric crystal actuators are used to push the top and bottom of the autofocus device throughout the camera movement to achieve OIS pitch and yaw motion. Figure 79 shows an exploded view of an SMA system including an SMA actuator 7902 according to one embodiment, the SMA actuator 7902 including a dual piezoelectric crystal actuator 7904 configured for two-axis camera tilt OIS. Figure 80 A cross-section of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric wafer actuator configured for tilting OIS of a two-axis camera. Figure 81 A cartridge-type dual piezoelectric wafer actuator for an SMA system is shown according to one embodiment, the cartridge-type dual piezoelectric wafer actuator being configured as if shaped to suit a two-axis camera tilting OIS fabricated prior to the system. Figure 82 A flexible sensor circuit for an SMA system, configured as a two-axis camera tilt OIS according to one embodiment, is shown. Such a system can be configured with an OIS having a high OIS travel (e.g., ±3 degrees or higher). These embodiments are configured for easy integration with autofocus (“AF”) designs (e.g., VCM or SMA).

[0193] Figure 83 illustrates an SMA system including an SMA actuator according to one embodiment, the SMA actuator comprising a dual piezoelectric crystal actuator configured for three-axis camera tilt OIS. In some embodiments, two-axis camera tilt OIS is configured to move the camera along the pitch / yaw / roll axes. Using the techniques described herein, four dual piezoelectric crystal actuators are used to push the top and bottom of the autofocus unit throughout the camera movement to achieve OIS pitch and yaw motion, and using the techniques described herein, four dual piezoelectric crystal actuators are used to push the sides of the autofocus unit throughout the camera movement to achieve OIS roll motion. Figure 84 shows an exploded view of an SMA system including an SMA actuator 8402 according to one embodiment, the SMA actuator 8402 including a dual piezoelectric crystal actuator 8404 configured for three-axis camera tilt OIS. Figure 85 A cross-section of an SMA system including an SMA actuator according to one embodiment is shown, the SMA actuator including a dual piezoelectric wafer actuator configured for tilting OIS of a three-axis camera. Figure 86 A cartridge-type dual piezoelectric wafer actuator for an SMA system is shown according to one embodiment, the cartridge-type dual piezoelectric wafer actuator being configured as if shaped to suit a triaxial camera tilting OIS fabricated prior to the system. Figure 87 A flexible sensor circuit for an SMA system, according to one embodiment, is illustrated. This flexible sensor circuit is configured as a tilting OIS for a three-axis camera. Such a system can be configured with an OIS with a high OIS travel (e.g., ±3 degrees or higher). These embodiments are configured for easy integration with AF designs (e.g., VCM or SMA).

[0194] Figure 88 Exemplary dimensions of dual piezoelectric wafer actuators for SMA actuators according to various embodiments are shown. These dimensions are preferred embodiments, but those skilled in the art will understand that other dimensions may be used based on the desired characteristics of the SMA actuator.

[0195] Figure 89 A lens system for a folding camera according to one embodiment is shown. The folding camera includes a folding lens 8902 configured to bend light into a lens system 8901 comprising one or more lenses 8903a-d. In some embodiments, the folding lens is any one or more of a prism and a lens. The lens system 8901 is configured to have a principal axis 8904 angled to a transmission axis 8906 parallel to the direction of light travel before reaching the folding lens 8902. For example, a folding camera can be used in a cameraphone system to reduce the height of the lens system 8901 in the direction of the transmission axis 8906.

[0196] Embodiments of the lens system include one or more liquid lenses, such as those described herein. Figure 89 The illustrated embodiment includes two liquid lenses 8903b, d, such as those described herein. The one or more liquid lenses 8903b, d are configured to be actuated using techniques including those described herein. Actuators, including but not limited to buckling actuators, dual piezoelectric crystal actuators, and other SMA actuators, are used to actuate the liquid lenses. Figure 108 A liquid lens actuated using a buckling actuator 60 according to one embodiment is illustrated. The liquid lens includes a forming ring coupler 64, a liquid lens assembly 61, one or more buckling actuators 60 such as those described herein, a sliding base 65, and a base 62. The one or more buckling actuators 60 are configured to move the forming ring / coupler 64 to change the shape of the flexible membrane of the liquid lens assembly 61, thereby moving or shaping light, for example, as described herein. In some embodiments, three or four actuators are used. The liquid lens can be configured individually or in combination with other lenses to serve as an autofocus device or an optical image stabilizer. The liquid lens can also be configured to otherwise guide an image onto an image sensor.

[0197] Figure 90 Several embodiments of a lens system 9001 are illustrated, the lens system 9001 including liquid lenses 9002a-h to focus an image onto an image sensor 9004. As shown, the liquid lenses 9002a-h can have any lens shape and are configured to be dynamically configured to adjust the light path through the lenses using techniques including those described herein.

[0198] The lens system for a folding camera is configured to include an actuated folding lens 9100. An example of an actuated folding lens is a prism tilting device, such as... Figure 91 As shown. In Figure 91 In the example shown, the folding lens is a prism 9102 disposed on actuator 9104. This actuator includes, but is not limited to, an SMA actuator including the actuators described herein. For some embodiments, a prism tilting device is disposed on an SMA actuator including four dual piezoelectric wafer actuators 9106 (e.g., those dual piezoelectric wafer actuators described herein). According to some embodiments, the actuated folding lens 9100 is configured as an optical image stabilizer using techniques including those described herein. For example, the actuated folding lens is configured to include, for example,... Figure 39 An SMA system, such as the one shown, is an example of an SMA system. Another example of an actuated folding lens may include, for example, Figure 21 The SMA actuator shown is an example of an SMA actuator. However, the folding lens may also include other actuators.

[0199] Figure 92 A dual piezoelectric wafer arm with offset is shown according to one embodiment. The dual piezoelectric wafer arm 9201 includes a dual piezoelectric wafer beam 9202 having a shaped offset portion 9203. Compared to a dual piezoelectric wafer arm without an offset portion, the shaped offset portion 9203 provides a mechanical advantage to generate higher forces. According to some embodiments, the depth 9204 of the offset portion (also referred to herein as the bending plane z-offset 9204) and the length 9206 of the offset portion (also referred to herein as the valley width 9206) are configured to define characteristics of the dual piezoelectric wafer arm, such as peak force. For example, Figure 106 The curves in the figure show the relationship between the bending plane z-offset 9204, the valley width 9206, and the peak force of the dual piezoelectric wafer beam 9202 according to one embodiment.

[0200] The dual piezoelectric wafer arm includes one or more SMA materials, such as SMA tape or SMA wire 9210, as described herein. The SMA material is secured to the beam using techniques including those described herein. In some embodiments, the SMA material (e.g., SMA wire 9210) is attached to the fixed end 9212 and the load point end 9214 of the dual piezoelectric wafer arm such that a shaped offset 9203 is positioned between the two ends of the fixed SMA material. In various embodiments, the ends of the SMA material are electrically and mechanically coupled to contacts configured to supply current to the SMA material using techniques including those known in the art. A dual piezoelectric wafer arm with an offset can be included in SMA actuators and systems such as those described herein.

[0201] Figure 93 A dual piezoelectric wafer arm with an offset portion and a limiter is illustrated according to one embodiment. The dual piezoelectric wafer arm 9301 includes a dual piezoelectric wafer beam 9302 having a shaped offset portion 9303 and a limiter 9304 adjacent to the shaped offset portion 9303. Compared to a dual piezoelectric wafer arm 9301 without an offset portion, the offset portion 9303 provides a mechanical advantage to generate higher forces, and the limiter 9304 prevents the arm from moving in a direction away from the unfixed load point end 9306 of the dual piezoelectric wafer actuator. The dual piezoelectric wafer arm 9301 with the shaped offset portion 9303 and the limiter 9304 can be included in SMA actuators and systems such as those described herein. The dual piezoelectric wafer arm 9301 includes one or more SMA materials such as those described herein, such as SMA tape or SMA wire 9308, and these SMA materials are secured to the dual piezoelectric wafer arm 9301 using techniques including those described herein.

[0202] Figure 94A dual piezoelectric wafer arm with an offset portion and a limiter according to one embodiment is shown. The dual piezoelectric wafer arm 9401 includes a dual piezoelectric wafer beam 9402 having a forming offset portion 9403 and a limiter 9404 adjacent to the forming offset portion 9403. The limiter 9404 is formed as part of a base 9406 of the dual piezoelectric wafer arm 9401. The base 9406 is configured to receive the dual piezoelectric wafer arm 9401 and includes a recess 9408 configured to receive an offset portion of the dual piezoelectric wafer beam. The bottom of the recess is configured as the limiter 9404 adjacent to the forming offset portion 9403. The base 9406 may also include one or more portions 9410 configured to support certain portions of the dual piezoelectric wafer arm when it is not actuated. A dual piezoelectric wafer arm 9401 having a forming offset portion 9403 and a limiter 9404 may be included in SMA actuators and systems such as those described herein. The dual piezoelectric wafer arm 9401 comprises one or more SMA materials such as those described herein, such as SMA tapes or SMA wires, which are fixed to the dual piezoelectric wafer arm 9401 using techniques including those described herein.

[0203] Figure 95 An embodiment of a base including a dual piezoelectric wafer arm with an offset portion is shown according to one embodiment. The dual piezoelectric wafer arm 9501 includes a dual piezoelectric wafer beam 9502 having a shaped offset portion 9504. The dual piezoelectric wafer arm may also include a limiter using techniques including those described herein. The dual piezoelectric wafer arm 9501 includes one or more SMA materials such as those described herein, such as SMA tape or SMA wire 9506, which are secured to the dual piezoelectric wafer arm 9501 using techniques including those described herein.

[0204] Figure 96An embodiment of a base 9608 comprising two dual piezoelectric wafer arms with offset portions is shown according to one embodiment. Each dual piezoelectric wafer arm 9601a, b includes dual piezoelectric wafer beams 9602a, b having shaped offset portions 9604a, b. Each dual piezoelectric wafer arm 9601a, b has one or more SMA materials such as those described herein, such as SMA tapes or SMA wires 9606a, b, which are fixed to the dual piezoelectric wafer arm 9501 using techniques including those described herein. Each dual piezoelectric wafer arm 9601a, b may also include a limiter using techniques including those described herein. Some embodiments include a base comprising more than two dual piezoelectric wafer arms formed using techniques including those described herein. According to some embodiments, the dual piezoelectric wafer arms 9601 are integrally formed with the base 9608. In other embodiments, one or more of the dual piezoelectric wafer arms 9602a, b are formed separately from the base 9608 and fixed to the base 9608 using techniques including, but not limited to, welding, resistance welding, laser welding, and adhesive bonding. In some embodiments, two or more dual piezoelectric wafer arms 9601a, b are configured to act on a single object. This allows for an increase in the force applied to the object. The following... Figure 107 The graph in the figure illustrates an example of how the volume of the approximate box surrounding the entire dual piezoelectric crystal actuator relates to the work done by each dual piezoelectric crystal component. The box volume (collectively referred to as the “box volume”) is approximated using the length of dual piezoelectric crystal actuator 9612, the width of dual piezoelectric crystal actuator 9610, and the height of dual piezoelectric crystal actuator 9614.

[0205] Figure 97A buckling arm including load point extensions is illustrated according to one embodiment. The buckling arm 9701 includes a beam portion 9702 and one or more load point extensions 9704a, b extending from the beam portion 9702. Each end 9706a, b of the buckling arm 9701 is configured to be fixed to or integrally formed with a plate or other base using techniques including those described herein. According to some embodiments, the one or more load point extensions 9704a, b are fixed to or integrally formed with the beam portion 9702 at an offset from the load points 9710a, b of the beam portion 9702. The load points 9710a, b are portions of the beam portion 9702 configured to transmit forces from the buckling arm 9701 to another object. In some embodiments, the load points 9710a, b are at the center of the beam portion 9702. In other embodiments, the load points 9710a, b are located outside the center of the beam portion 9702. Load point extensions 9704a, b are configured to extend from their points of connection to beam portion 9702 along the longitudinal axis of beam portion 9702 toward load points 9710a, b of beam portion 9702. In some embodiments, the ends of load point extensions 9704a, b extend at least to load points 9710a, b of beam portion 9702. Bend arm 9701 includes one or more SMA materials such as those described herein, such as SMA strips or SMA conductors 9712. The SMA material (e.g., SMA conductors 9712) is secured to opposite ends of beam portion 9702. The SMA material is secured to opposite ends of beam portion 9702 using techniques including those described herein. In some embodiments, the length of load point extensions 9704a, b can be configured to be any length contained within the longitudinal length of the associated flat (unactuated) beam portion 9702 of bend arm 9701.

[0206] Figure 98 A buckling arm 9801, including a load point extension 9810, is shown in an actuated position according to one embodiment. SMA material attached to the opposite end of a beam portion 9802 is actuated using techniques including those described herein. The load point 9804 allows the buckling arm 9801 to increase its stroke range compared to a buckling arm without the extension. Therefore, a buckling arm including the load point extension can achieve a greater maximum vertical stroke. A buckling arm with a load point extension can be included in SMA actuators and systems such as those described herein.

[0207] Figure 99A dual piezoelectric wafer arm including load point extensions is illustrated according to one embodiment. The dual piezoelectric wafer arm 9901 includes a beam portion 9902 and one or more load point extensions 9904a, b extending from the beam portion. One end of the dual piezoelectric wafer arm 9901 is configured to be fixed to or integrally formed with a plate or other base using techniques including those described herein. The end of the beam portion 9902 opposite to the fixed or integrally formed end is not fixed and is freely movable. According to some embodiments, the one or more load point extensions 9904a, b are fixed to or integrally formed with the beam portion 9902 at an offset from the free end of the beam portion 9902. The load point extensions 9904a, b are configured to extend from their point of connection to the beam portion 9902 in a direction away from a plane including the longitudinal axis of the beam portion 9902. For example, the one or more load point extensions 9904a, b extend in the direction of extension of the free end of the beam portion when actuated. Some embodiments of the dual piezoelectric wafer arm 9901 include one or more load point extensions 9904a, b, the longitudinal axis of which forms an angle of 1 degree to 90 degrees with a plane including the longitudinal axis of the beam portion. In some embodiments, the ends 9910a, b of the load point extensions 9904a, b are configured to engage an object configured to move.

[0208] The dual piezoelectric wafer arm 9901 includes one or more SMA materials such as those described herein, such as SMA tape or SMA wire 9906. The SMA material (e.g., SMA wire 9906) is secured to opposite ends of the beam portion 9902. The SMA material is secured to opposite ends of the beam portion 9902 using techniques including those described herein. For some embodiments, the lengths of the load point extensions 9904a, b can be configured to any length. According to some embodiments, the positions of the junctions of the ends 9910a, b of the load point extensions 9904a, b with the object can be configured at any point along the longitudinal length of the beam portion 9902. When the beam portion is flat (unacted), the height of the ends of the load point extensions above the beam portion can be configured to any height. For some embodiments, when the dual piezoelectric wafer arm is actuated, the load point extensions can be configured to be at least above other portions of the dual piezoelectric wafer arm.

[0209] Figure 100A dual piezoelectric wafer arm including a load point extension is shown in an actuated position according to one embodiment. SMA material fixed to opposite ends of beam portion 2 is actuated using techniques including those described herein. The load point extension 10 allows the dual piezoelectric wafer arm 1 to increase the stroke force compared to a dual piezoelectric wafer arm 1 without the extension. Therefore, the dual piezoelectric wafer arm 1 including the load point extension 10 allows the dual piezoelectric wafer arm 1 to apply a greater force. The dual piezoelectric wafer arm 1 with the load point extension 10 can be included in SMA actuators and systems such as those described herein.

[0210] Figure 101 An SMA optical image stabilizer according to one embodiment is shown. The SMA optical image stabilizer 20 includes a movable plate 22 and a static plate 24. The movable plate 22 includes a spring arm 26 integrally formed therewith. In some embodiments, the movable plate 22 and the static plate 24 are each formed as a single, integral plate. The movable plate 22 includes a first SMA material attachment portion 28a and a second SMA material attachment portion 28b. The static plate 24 includes a first SMA material attachment portion 30a and a second SMA material attachment portion 30b. Each SMA material attachment portion 28, 30 is configured to secure an SMA material, such as an SMA wire, to the plate using a resistance welding joint. The first SMA material attachment portion 28a of the movable plate 22 includes a first SMA wire 32a disposed between itself and the first SMA material attachment portion 30a of the static plate, and a second SMA wire 32b disposed between itself and the second SMA attachment portion 30b of the static plate 24. The second SMA material attachment portion 28b of the movable plate 22 includes a third SMA wire 32c disposed between it and the second SMA material attachment portion 30b of the static plate, and a fourth SMA wire 32d disposed between it and the first SMA attachment portion 30a of the static plate 24. Each SMA wire is actuated using techniques including those described herein, thereby moving the movable plate 22 away from the static plate 24. Figure 102 An SMA material attachment portion 40 of a movable part according to one embodiment is shown. The SMA material attachment portion is configured to resistance solder SMA material (e.g., SMA wire 41) to the SMA material attachment portion 40. Figure 103 An SMA attachment portion 42 of a static board having resistance-welded SMA wires 43 attached thereto, according to one embodiment, is shown.

[0211] Figure 104An SMA actuator 45 including a buckling actuator is shown according to one embodiment. The buckling actuator 46 includes a buckling arm 47, as described herein. The buckling arm 47 is configured to move along the z-axis when actuated and de-actuated using techniques including those described herein. Each SMA wire 48 is attached to a corresponding resistance-welded wire crimp 49 using resistance welding. Each resistance-welded wire crimp 49 includes, on at least one side of the SMA wire 48, an island structure 50 isolated from the metal 51 forming the buckling arm 47. This island structure can be used in other actuators, optical image stabilizers, and autofocus systems to connect at least one side of the SMA wire to an isolation island structure formed in a base metal layer, for example... Figure 101 The OIS application shown.

[0212] Figure 105 illustrates a resistance-welded press-fit of an SMA actuator according to one embodiment, comprising an island structure, for attaching SMA wires 48 to a buckling actuator 46 using techniques including those described herein. Figure 105A shows the bottom of the SMA actuator 45. According to some embodiments, the SMA actuator 45 is formed of a stainless steel substrate layer 51. A dielectric layer 52 (e.g., a polyimide layer) is disposed on the bottom of the stainless steel substrate layer 51. According to some embodiments, a conductor layer 53 is electrically connected to a stainless steel island structure 50 through vias in the dielectric layer 52, thereby enabling electrical connections between wires welded to the stainless steel island structure 50 and conductor circuitry attached to the stainless steel island structure. According to some embodiments, the island structure 50 is etched from the stainless steel substrate layer. The dielectric layer 52 holds the island structure 50 in position within the stainless steel substrate layer 51. The island structure 50 is configured to have SMA wires attached thereto using techniques including those described herein (e.g., resistance welding). Figure 105B shows the top of the SMA actuator 45, including the island structure 50. In some embodiments, glue or adhesive may also be applied to the top of the weld to help improve mechanical strength and alleviate fatigue strain during operation and impact loading.

[0213] Figure 108A lens system according to one embodiment includes an SMA actuator with a buckling actuator. The lens system includes a liquid lens assembly 61 disposed on a base 62. The lens system also includes a forming ring / coupler 64 mechanically coupled to the buckling actuator 60. The SMA actuator, including the buckling actuator 60 as described herein, is disposed on a sliding base 65 disposed on the base 62. The SMA actuator is configured to actuate the buckling actuator 60 using techniques including those described herein, thereby moving the forming ring / coupler 64 along the optical axis of the liquid lens assembly 61. This movement of the forming ring / coupler 64 alters the focal point of the liquid lens in the liquid lens assembly.

[0214] Figure 109 An unfixed load point end of a dual piezoelectric wafer arm according to one embodiment is shown. The unfixed load point end 70 of the dual piezoelectric wafer arm includes a flat surface 71 for securing an SMA material (e.g., an SMA wire 72). The SMA wire 72 is secured to the flat surface 71 by a resistance weld (resistance weld) 73. The resistance weld 73 is formed using techniques including those known in the art.

[0215] Figure 110 An unfixed load point end of a dual piezoelectric wafer arm according to one embodiment is shown. The unfixed load point end 76 of the dual piezoelectric wafer arm includes a flat surface 77 for fixing SMA material (e.g., SMA wire 78). Similar to Figure 109 As shown, the SMA wire 78 is secured to the flat surface 77 via a resistance welding section. Adhesive 79 is applied to the resistance welding section. This makes the bond between the SMA wire 78 and the unsecured load point end 76 more reliable. Adhesive 79 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

[0216] Figure 111 An unfixed load point end 80 of a dual piezoelectric wafer arm according to one embodiment is shown. The unfixed load point end 80 of the dual piezoelectric wafer arm includes a flat surface 81 for securing an SMA material (e.g., an SMA wire 82). A metal interlayer (sandwich) 84 is disposed on the flat surface 81. The metal interlayer 84 includes, but is not limited to, a gold layer, a nickel layer, or an alloy layer. The SMA wire 82 is secured to the metal interlayer 84 disposed on the flat surface 81 by a resistance bonding portion 83. The resistance bonding portion 83 is formed using techniques including those known in the art. The metal interlayer 84 facilitates better adhesion to the unfixed load point end 80.

[0217] Figure 112An unfixed load point end 88 of a dual piezoelectric wafer arm according to one embodiment is shown. The unfixed load point end 88 of the dual piezoelectric wafer arm includes a flat surface 89 for fixing SMA material (e.g., SMA wire 90). A metal interlayer 92 is disposed on the flat surface 89. The metal interlayer 92 includes, but is not limited to, a gold layer, a nickel layer, or an alloy layer. Similar to... Figure 111 As shown, the SMA wire 90 is secured to the flat surface 89 via a resistance welding section. Adhesive 91 is applied to the resistance welding section. This makes the bond between the SMA wire 90 and the unsecured load point 88 more reliable. Adhesive 91 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

[0218] Figure 113 A fixed end of a dual piezoelectric wafer arm according to one embodiment is shown. The fixed end 95 of the dual piezoelectric wafer arm includes a flat surface 96 for fixing an SMA material (e.g., an SMA wire 97). The SMA wire 97 is fixed to the flat surface 96 by a resistance welding portion 98. The resistance welding portion 98 is formed using techniques including those known in the art.

[0219] Figure 114 A fixed end of a dual piezoelectric wafer arm according to one embodiment is shown. The fixed end 120 of the dual piezoelectric wafer arm includes a flat surface 121 for fixing SMA material (e.g., SMA wire 122). Similar to Figure 113 As shown, the SMA wire 122 is fixed to the flat surface 121 by resistance welding. Adhesive 123 is applied to the resistance welding portion. This makes the bond between the SMA wire 122 and the fixed end 120 more reliable. Adhesive 123 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

[0220] Figure 115 A fixed end of a dual piezoelectric wafer arm according to one embodiment is shown. The fixed end 126 of the dual piezoelectric wafer arm includes a flat surface 127 for fixing SMA material (e.g., SMA wire 128). A metal interlayer 130 is disposed on the flat surface 127. The metal interlayer 130 includes, but is not limited to, a gold layer, a nickel layer, or an alloy layer. The SMA wire 128 is fixed to the metal interlayer 130 disposed on the flat surface 127 by a resistance bonding portion 129. The resistance bonding portion 129 is formed using techniques including those known in the art. The metal interlayer 130 facilitates better adhesion to the fixed end 126.

[0221] Figure 116A fixed end of a dual piezoelectric wafer arm according to one embodiment is shown. The fixed end 135 of the dual piezoelectric wafer arm includes a flat surface 136 for fixing SMA material (e.g., SMA wire 137). A metal interlayer 138 is disposed on the flat surface 136. The metal interlayer 136 includes, but is not limited to, a gold layer, a nickel layer, or an alloy layer. Similar to... Figure 115 As shown, the SMA wire 137 is fixed to the flat surface 136 by resistance welding. Adhesive 139 is applied to the resistance welding portion. This makes the bond between the SMA wire 137 and the fixed end 135 more reliable. Adhesive 139 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

[0222] Figure 117 A rear view of the fixed end of a dual piezoelectric wafer arm according to one embodiment is shown. The dual piezoelectric wafer arm 143 is configured according to the embodiment described herein. The fixed end 143 of the dual piezoelectric wafer arm includes an island structure 144 isolated from an outer portion 145 of the fixed end 143. This makes the island structure 144 electrically and / or thermally isolated from the outer portion 145. In some embodiments, SMA material fixed to the opposite side of the fixed end 143 of the dual piezoelectric wafer arm is electrically coupled to an SMA material (e.g., SMA wire) through a through-hole. For example, as described herein, the island structure 144 is disposed on an insulator 146. The island structure 144 can be formed using etching techniques, including those known in the art.

[0223] Figure 118 An unfixed load point end 70 of a dual piezoelectric wafer arm according to one embodiment is shown. The unfixed load point end 70 of the dual piezoelectric wafer arm includes a flat surface 71 configured to include a radiating surface region 74 extending from a resistance-bonded region 73. The radiating surface region 74 includes a distal portion 76 and a proximal portion 75. The flat surface 71 is configured to allow SMA material, such as an SMA wire 72, to be secured to the flat surface 71. According to some embodiments, the SMA wire 72 is secured to the flat surface 71 at the resistance-bonded region 73 by resistance bonding. The resistance bond is formed using techniques including those known in the art. For other embodiments, the SMA wire 72 is secured to the flat surface 71 using other attachment techniques including the attachment techniques described herein.

[0224] The temperature reduction at the unfixed load point 70 is relative to the phase transition temperature of the SMA conductor 72. The radiating surface region 74 significantly increases the surface area of ​​the unfixed load point 70.

[0225] The increased surface area improves the temperature drop at the unfixed load point 70. The increased surface area allows cooling to prevent shape memory alloy phase transformation during actuation.

[0226] Figure 119 An unfixed load point end 170 of a dual piezoelectric wafer arm according to one embodiment is shown. The unfixed load point end 170 of the dual piezoelectric wafer arm includes a flat surface 171 configured to include a radiating surface region 174 extending from a resistance bonding region 173.

[0227] The radiating surface region 174 includes a distal portion 176 and a proximal portion 175. The flat surface 171 is configured to allow SMA materials, such as SMA wires 172, to be secured to the flat surface 171. According to some embodiments, the SMA wires 172 are secured to the flat surface 171 by resistance welding to a resistance welding region 173. In other embodiments, the SMA wires 172 are secured to the flat surface 171 using other attachment techniques, including those described herein.

[0228] The unfixed load point end 170 also includes a proximal aperture 178 and a distal aperture 179 separated by a resistance-welded region 173. The proximal aperture 178 and distal aperture 179 are formed using techniques known in the art. Although apertures 178 and 179 are shown as fully through-hole features, in some examples, apertures 178 and 179 may be partially etched.

[0229] The proximal orifice 178 and the distal orifice 179 physically interrupt the flat surface 171 and define the location of the resistance welding region 173. According to some embodiments, the orifices 178 and 179 are configured to mitigate interference between the conductor 172 and the flat surface 171 near the resistance welding region 173.

[0230] Figure 120 An unfixed load point end 270 of a dual piezoelectric wafer arm according to one embodiment is shown. The unfixed load point end 270 of the dual piezoelectric wafer arm includes a flat surface 271 configured to include a radiating surface region 274 extending from a resistance-bonded region 273. The flat surface 271 is configured to allow SMA material, such as an SMA wire 272, to be secured to the flat surface 271. According to some embodiments, the SMA wire 272 is secured to the flat surface 271 by resistance bonding to the resistance-bonded region 273. For other embodiments, the SMA wire 272 is secured to the flat surface 271 using other attachment techniques, including those described herein.

[0231] The unfixed load point end 270 also includes a proximal aperture 278 and a distal aperture 279 separated by a resistance-welded region 273. The unfixed load point end 270 also includes an elongated aperture 280 corresponding to a segment of the SMA conductor 272. The elongated aperture 280 can be removed to create a conductor gap for the SMA conductor 272. In some embodiments, the elongated aperture 280 extends from the proximal aperture 278. While apertures 278, 279, and 280 are shown as fully through-hole features, in some examples, apertures 278, 279, and 280 may be partially etched.

[0232] Proximal orifice 278 and distal orifice 279 physically interrupt the flat surface 271 and define the location of the resistance welding region 273. Similarly, elongated orifice 280 physically interrupts the flat surface 271 and defines the location of the SMA conductor 272. According to some embodiments, orifices 278, 279, and 280 are configured to mitigate interference between the conductor 272 and the flat surface 271 near the resistance welding region 273.

[0233] Figure 121 An unfixed load point end 370 of a dual piezoelectric wafer arm according to one embodiment is shown. A flat surface 371 is configured to attach an SMA material, such as an SMA wire 372, to the flat surface 371. According to some embodiments, the SMA wire 372 is attached to the flat surface 371 by resistance bonding to a resistance bonding region 373, which is at least partially isolated by a nonlinear aperture 378. In some configurations, the nonlinear aperture 378 is U-shaped to physically isolate up to 90% of the resistance bonding region 373. The resistance bonding region 373 may be mounted on a bonding tongue defined by the nonlinear aperture 378. For other embodiments, the SMA wire 372 is attached to the flat surface 371 using other attachment techniques, including those described herein. While the nonlinear aperture 378 is shown as fully through-hole, in some examples, the aperture of the nonlinear aperture 378 may be partially etched.

[0234] The increased surface area from the radiating surface region 374 allows cooling to prevent shape memory alloy phase transformation during actuation. In some alternative embodiments, the resistance-welded region 373 may be completely etched out from the unfixed load point end 370. Alternatively, the resistance-welded region 373 may also include locally etched slots to increase the compliance of the tongue.

[0235] Figure 122An unfixed load point end 470 of a dual piezoelectric wafer arm according to one embodiment is shown. An adjacent flat surface 471 is provided to fix an SMA material such as an SMA wire 472. The SMA wire 472 is fixed to the flat surface 471 by a resistance bonding region 473, which is at least partially isolated by a nonlinear aperture 478.

[0236] The resistance-welded region 473 can be mounted in a nonlinear aperture 478 using a locally etched slot 479. In some configurations, the nonlinear aperture 478 physically interrupts the flat surface 471 and defines the location of the resistance-welded region 473. According to some embodiments, the aperture 478 is configured to mitigate interference between the conductor 472 and the flat surface 471 near the resistance-welded region 473. Although the aperture 478 is shown as a fully through-hole feature, in some examples, the aperture 478 may be locally etched.

[0237] The increased surface area from the radiating surface region 474 enables cooling to prevent phase transformation of the shape memory alloy during actuation.

[0238] The disclosed embodiments can be applied to the fixed end of a dual piezoelectric wafer arm. The embodiments provided herein... Figures 123 to 125 This is an exemplary embodiment of the fixed end in conjunction with the disclosed embodiments.

[0239] Figure 123 A fixed end of a dual piezoelectric wafer arm according to one embodiment is shown. The fixed end 95 of the dual piezoelectric wafer arm includes a flat surface 96 for securing an SMA material, such as an SMA wire 97. The SMA wire 97 is secured to the flat surface 96 via a resistance bonding region 98. The resistance bonding region 98 is formed using techniques known in the art.

[0240] The fixed end 95 includes a proximal orifice 93 and a distal orifice 94 separated by a resistance welding region 98. The proximal orifice 93 and the distal orifice 94 are formed using techniques including those known in the art.

[0241] The proximal orifice 93 and the distal orifice 94 physically interrupt the flat surface 96 and define the location of the resistance welding region 98. According to some embodiments, orifices 93 and 94 are configured to mitigate interference between the conductor 97 and the flat surface 96 near the resistance welding region 98. While orifices 93 and 94 are shown as fully through-hole features, in some examples, orifices 93 and 94 may be partially etched.

[0242] Figure 124A fixed end of a dual piezoelectric wafer arm according to one embodiment is shown. The fixed end 195 of the dual piezoelectric wafer arm includes a flat surface 196 for securing an SMA material, such as an SMA wire 197. The SMA wire 197 is secured to the flat surface 196 by resistance bonding at a resistance bonding region 198. The resistance bonding region 198 is formed using techniques including those known in the art.

[0243] The fixed end 195 includes a proximal aperture 193 and a distal aperture 194 separated by a resistance welding region 198. The proximal aperture 193 and the distal aperture 194 are formed using techniques including those known in the art.

[0244] The fixed end 195 also includes an elongated aperture 160 corresponding to a segment of the SMA wire 197. The elongated aperture 160 can be removed to provide wire clearance for the SMA wire 197. In some embodiments, the elongated aperture 160 extends from the distal aperture 194.

[0245] Proximal orifice 193 and distal orifice 194 at least partially physically isolate the resistance soldering region 198. An elongated orifice 160 physically interrupts the flat surface 196 and defines the location of the SMA conductor 197. According to some embodiments, orifices 194 and 196 are configured to mitigate interference between the conductor 197 and the flat surface 196 near the resistance soldering region 198. While orifices 194 and 196 are shown as fully through-hole features, in some examples, orifices 194 and 196 may be partially etched.

[0246] Figure 125 A fixed end 295 of a dual piezoelectric wafer arm according to one embodiment is shown. The fixed end 295 of the dual piezoelectric wafer arm includes a flat surface 296 for securing an SMA material, such as an SMA wire 297. The SMA wire 297 is secured to the flat surface 296 by resistance bonding at a resistance bonding region 298.

[0247] The resistance welding area 298 is at least partially isolated by the nonlinear orifice 294. In some configurations, the nonlinear orifice 294 is U-shaped to physically isolate up to 90% of the resistance welding area 298. The resistance welding area 298 can be mounted on a welding tongue defined by the nonlinear orifice 294.

[0248] The nonlinear orifice 294 physically interrupts the flat surface 296 and defines the location of the resistance-welded region 298. According to some embodiments, the linear orifice 294 is configured to mitigate interference between the conductor 297 and the flat surface 296 near the resistance-welded region 298. In some alternative embodiments, the resistance-welded region 298 may be completely etched out from the fixed end 295. Alternatively, the resistance-welded region 298 may also include locally etched slots to reduce the contact area.

[0249] Figure 126 An alternative embodiment is shown. In this embodiment, the nonlinear orifice 294 in the resistance welding region 298 is relative to... Figure 125 The situation shown has been rotated 180 degrees.

[0250] It will be understood that terms such as “top,” “bottom,” “above,” “below,” and the x, y, and z directions used herein are for convenience of indicating the spatial relationship of parts relative to each other, and not any particular spatial or gravitational direction. Therefore, these terms are intended to cover the components of a part, regardless of whether the component is oriented in a particular direction shown in the figures and described in the specification, an inverted orientation from that direction, or any other rotational variation orientation.

[0251] It should be understood that the term "invention" as used herein should not be construed as representing a single invention having only a single basic element or group of elements. Similarly, it will be understood that the term "invention" encompasses many individual innovations, each of which can be considered a separate invention. Although the invention has been described in detail with respect to preferred embodiments and accompanying drawings, it will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the invention without departing from the spirit and scope thereof. Furthermore, the techniques described herein can be used to manufacture devices having two, three, four, five, six, or more typically n dual piezoelectric wafer actuators and buckling actuators. Therefore, it should be understood that the detailed description and accompanying drawings set forth above are not intended to limit the breadth of the invention, which should be inferred only from the appended claims and their legal equivalents as suitably interpreted.

Claims

1. An actuator, characterized in that, The actuator includes: Beam section; Fixed end; At the load point end, the beam portion is disposed between the fixed end and the load point end; and SMA material fixed to the fixed end and the load point end The load point terminal includes: A flat surface, the flat surface including a resistance welding area configured for fixing the SMA material; and The distal and proximal orifices are separated by the resistance welding area.

2. The actuator according to claim 1, characterized in that, The load point also includes an elongated orifice corresponding to a segment of the SMA material.

3. The actuator according to claim 2, characterized in that, The elongated orifice extends from the distal orifice.

4. An actuator, characterized in that, The actuator includes: Beam section; Fixed end; At the load point end, the beam portion is disposed between the fixed end and the load point end; and SMA material fixed to the fixed end and the load point end The load point terminal includes: A flat surface, the flat surface including a resistance welding area configured for fixing the SMA material; and An elongated orifice corresponding to a segment of the SMA material.

5. An actuator, characterized in that, The actuator includes: Beam section; Fixed end; At the load point end, the beam portion is disposed between the fixed end and the load point end; and SMA material fixed to the fixed end and the load point end The load point terminal includes: A flat surface, the flat surface including a resistance welding area configured for fixing the SMA material; and A nonlinear orifice defining the resistance welding area.

6. The actuator according to claim 5, characterized in that, The resistance welding area is completely etched from the load point end.

7. The actuator according to claim 5, characterized in that, The resistance welding area is locally etched through the nonlinear orifice.

8. The actuator according to any one of claims 1 to 7, characterized in that, The load point also includes at least one radiation surface area extending from the resistance welding area.

9. An actuator, characterized in that, The actuator includes: Beam section; Fixed end; At the load point end, the beam portion is disposed between the fixed end and the load point end; and SMA material fixed to the fixed end and the load point end, the fixed end comprising: A flat surface, the flat surface including a resistance-welded portion of the SMA material; and The distal and proximal orifices are separated by the resistance welded portion.

10. The actuator according to claim 9, characterized in that, The fixed end also includes an elongated orifice corresponding to a segment of the SMA material.

11. The actuator according to claim 10, characterized in that, The elongated orifice extends from the distal orifice.

12. An actuator, characterized in that, The actuator includes: Beam section; Fixed end; At the load point end, the beam portion is disposed between the fixed end and the load point end; and SMA material fixed to the fixed end and the load point end, the fixed end comprising: A flat surface, the flat surface including a resistance-welded portion of the SMA material; and An elongated orifice corresponding to a segment of the SMA material.

13. An actuator, characterized in that, The actuator includes: Beam section; Fixed end; At the load point end, the beam portion is disposed between the fixed end and the load point end; and SMA material fixed to the fixed end and the load point end, the fixed end comprising: A flat surface, the flat surface including a resistance-welded portion of the SMA material; and A non-linear orifice, which defines a resistance welding area for the resistance welding part.

14. The actuator according to claim 13, characterized in that, The resistance welding area used for the resistance welding part is completely etched from the load point end.

15. The actuator according to claim 13, characterized in that, The resistance welding area used for the resistance welding part is locally etched through the nonlinear orifice.

16. The actuator according to any one of claims 9 to 15, characterized in that, The load point also includes at least one radiation surface area extending from the resistance welded portion.

17. An actuator, characterized in that, The actuator includes: Base; and One or more dual piezoelectric wafer arms, the one or more dual piezoelectric wafer arms comprising: Beam section, Fixed end, and At the load point end, the beam portion is disposed between the fixed end and the load point end, and at least one of the fixed end and the load point end includes: A flat surface, the flat surface including a resistance welding area; and The distal and proximal orifices are separated by the resistance welding area.

18. An actuator, characterized in that, The actuator includes: Base; and One or more dual piezoelectric wafer arms, the one or more dual piezoelectric wafer arms comprising: Beam section, Fixed end, and At the load point end, the beam portion is disposed between the fixed end and the load point end, and at least one of the fixed end and the load point end includes: A flat surface, the flat surface including a resistance welding area configured for fixing SMA material; and An elongated orifice corresponding to a segment of the SMA material.

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