Immersion cooling system and electronic device having the same

Abstract

The present invention provides an immersion cooling system and an electronic device having the immersion cooling system, which are used to solve the problem that the non-conductive liquid in the existing immersion cooling system is easy to lose. The system comprises: a sealing groove having a chamber inside; a working layer formed by at least one non-conductive liquid filled in the chamber; and a protective layer formed by at least one protective liquid filled in the chamber, wherein the density of the protective liquid is lower than that of the non-conductive liquid, and the boiling point of the protective liquid is higher than that of the non-conductive liquid.

Description

Technical Field

[0001] The present invention relates to a cooling system for an electronic device, in particular to an immersion cooling system for immersing a heat source of the electronic device in a non-conductive liquid to maintain a proper working temperature and an electronic device having the immersion cooling system. Background Art

[0002] Immersion cooling is to immerse electrical units (such as servers, motherboards, CPUs, graphics cards or memory, etc.) in non-conductive liquid so that the high-temperature heat energy generated by the electrical units when they are working can be directly absorbed by the non-conductive liquid, allowing the electrical units to maintain an appropriate operating temperature to achieve the expected working performance and service life.

[0003] Common existing immersion cooling systems generally include a cooling tank and a condenser. The lower layer of the cooling tank is filled with liquid non-conductive liquid, and the condenser is installed in the upper layer of the cooling tank and is located above the liquid non-conductive liquid. The electrical unit to be cooled is immersed in the liquid non-conductive liquid. Since the boiling point of the non-conductive liquid is relatively low, after absorbing the working heat energy of the electrical unit, part of the non-conductive liquid can be converted into gaseous state, so that bubbles are formed in the liquid non-conductive liquid and float upward until they leave the surface of the liquid non-conductive liquid, and then condense back into liquid state when contacting the condenser and drip downward.

[0004] However, since the gaseous non-conductive liquid can easily leak to the outside through the gaps in the cooling tank or elsewhere before condensing back into liquid, the amount of non-conductive liquid in the cooling tank gradually decreases and needs to be replenished at regular intervals. This not only requires manpower costs for maintenance, but the non-conductive liquid is expensive, which also creates an economic burden on users.

[0005] In view of this, the existing immersion cooling system still needs to be improved. Summary of the invention

[0006] To solve the above problems, an object of the present invention is to provide an immersion cooling system and an electronic device having the immersion cooling system, so that the gaseous non-conductive liquid can condense back into liquid in a liquid environment to reduce the loss of the gaseous non-conductive liquid.

[0007] Another object of the present invention is to provide an immersion cooling system and an electronic device having the immersion cooling system, which can improve the efficiency of condensing gaseous non-conductive liquid back into liquid.

[0008] Another object of the present invention is to provide an immersion cooling system and an electronic device having the immersion cooling system to reduce equipment and operation costs.

[0009] The directions or their approximate terms described throughout the present invention, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inside", "outside", "side", etc., mainly refer to the directions of the accompanying drawings, and each direction or its approximate terms are only used to assist in the explanation and understanding of the embodiments of the present invention, and are not used to limit the present invention.

[0010] The elements and components described throughout the present invention use the quantifiers "a" or "an" for convenience only and to provide a general meaning of the scope of the present invention; they should be interpreted in the present invention as including one or at least one, and a single concept also includes plural cases, unless it is obvious that it means otherwise.

[0011] The similar terms such as "combination", "assembly" or "assembly" described throughout the present invention mainly include the connection that can be separated without destroying the components, or the connection that makes the components inseparable. Technicians in this field can choose according to the materials of the components to be connected or the assembly requirements.

[0012] The immersion cooling system of the present invention comprises: a sealing tank having a chamber inside; a working layer formed by at least one non-conductive liquid filled in the chamber; and a protective layer formed by at least one protective liquid filled in the chamber, wherein the density of the protective liquid is lower than that of the non-conductive liquid, and the boiling point of the protective liquid is higher than that of the non-conductive liquid.

[0013] Therefore, in the immersion cooling system of the present invention, the liquid non-conductive liquid in the working layer can be converted into gas after absorbing heat energy, and form bubbles that rise into the protective layer, so that the gaseous non-conductive liquid can condense back into liquid in a liquid environment and then sink back into the working layer, thereby effectively reducing the loss of gaseous non-conductive liquid and making it difficult for the amount of non-conductive liquid in the sealing groove to decrease, which has the effect of greatly reducing the cost and labor cost of replenishing the non-conductive liquid.

[0014] The sealing groove may include a barrel groove and a groove cover, the chamber is located inside the barrel groove, the barrel groove may include a cover opening connected to the chamber, and the groove cover may cover the cover opening. In this way, it is convenient to input liquid into the chamber, take in and put in objects, or pull out wires, which has the effect of improving the convenience of assembly and use.

[0015] The protective layer can be formed by two or more protective liquids of different densities, and the upper protective liquid has a lower density and a higher boiling point, thereby further reducing the loss of the non-conductive liquid.

[0016] The immersion cooling system may further include a disturbance device, which may be located in the protective layer, and the disturbance device stirs the protective liquid by an impeller, so that the temperature of the entire protective layer can be more uniform, which has the effect of improving the efficiency of condensing the gaseous non-conductive liquid back into liquid.

[0017] The immersion cooling system may further include a circulating cooling module, which may include a pipe assembly, a portion of which may pass through the protective layer and form a heat absorbing portion, and the protective liquid may exchange heat with the heat absorbing portion. In this way, the protective liquid may maintain a low temperature, thereby improving cooling efficiency and the like.

[0018] The circulating cooling module may have a driving source connected to the pipe assembly, the driving source may drive the fluid in the pipe assembly to flow, and the pipe assembly may be connected to a heat dissipation unit to reduce the temperature of the fluid in the pipe assembly, thereby improving the cooling efficiency.

[0019] The immersion cooling system may further include at least one electrical unit, which may be positioned in the chamber and immersed in the non-conductive liquid, so that the temperature of the electrical unit can be effectively reduced, thereby achieving the effect of making the electrical unit operate stably.

[0020] The heat source of the electrical unit can be located in the working layer, and a part of the electrical unit can be located in the protective layer. In this way, the amount of non-conductive liquid can be reduced while cooling the heat source, thereby reducing costs.

[0021] The immersion cooling system may further include a stand for positioning at least one electrical unit, the stand may be located at the bottom of the chamber, the stand may have a plurality of fixed frames spaced apart from each other, a slot may be formed between any two adjacent fixed frames, the electrical unit may be inserted and positioned in one of the slots, the non-conductive liquid may pass through the slot to soak the heat source of the electrical unit. In this way, the electrical unit may be stably arranged, and the number of electrical units that can be cooled simultaneously may be increased, thereby improving the cooling effect and reducing the occupied space.

[0022] The present invention further provides an electronic device, comprising: a plurality of electrical units, at least one of which has a heat source; and an immersion cooling system as described above, wherein the heat source is located in the working layer. Thus, the protective layer can also allow the gaseous non-conductive liquid to condense back into a liquid state in a liquid environment, thereby reducing the loss of the non-conductive liquid, so that the electronic device has the effect of greatly reducing the cost and labor cost of replenishing the non-conductive liquid.

[0023] Part of the electrical unit with the heat source can be located in the protective layer. In this way, the electrical unit can be stably arranged, and the number of electrical units that can be cooled at the same time is increased, which has the effects of improving the cooling effect and reducing the occupied space. In this way, the amount of non-conductive liquid can be reduced while being able to cool the heat source, which has the effects of reducing costs.

[0024] The immersion cooling system may further include a frame, which may be located at the bottom of the chamber, and may have a plurality of fixed frames spaced apart from each other, and a slot may be formed between any two adjacent fixed frames, and the electrical unit having the heat source may be inserted and positioned in one of the slots, and the non-conductive liquid may penetrate the heat source through the slot. In this way, the electrical unit may be stably arranged, and the number of electrical units that can be cooled at the same time may be increased, thereby improving the cooling effect and reducing the occupied space. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0026] Figure 1 : An exploded perspective view of a first embodiment of the present invention;

[0027] Figure 2 : A combined cross-sectional view of a first embodiment of the present invention;

[0028] Figure 3 : A combined cross-sectional view of a second embodiment of the present invention;

[0029] Figure 4 : A plan view of a third embodiment of the present invention;

[0030] Figure 5 : A plan view of another aspect of the third embodiment of the present invention;

[0031] Figure 6 : A partial cross-sectional plan view of the electronic device of the present invention.

[0032] Description of Reference Numerals

[0033] 1: Sealing groove

[0034] 11: barrel groove

[0035] 11a: Ring Wall

[0036] 11b: Sealing the bottom plate

[0037] 111: Cover and close

[0038] 112: Opening

[0039] 12: Slot cover

[0040] 121: Holes

[0041] 2: Working layer

[0042] 3: Protective layer

[0043] 4: Seat

[0044] 41:Fixed bracket

[0045] 42: Slot

[0046] 5: Disturber

[0047] 51: Shell

[0048] 511: Inlet

[0049] 512: Exhaust port

[0050] 52:Connecting frame

[0051] 53: Impeller

[0052] 6: Circulation cooling module

[0053] 61: Pipe fittings

[0054] 611:Heat absorption part

[0055] 62: Driving source

[0056] 63: Cooling unit

[0057] 7: Electronic devices

[0058] 71: Chassis

[0059] B: Bottom

[0060] C: Chamber

[0061] E:Electrical unit

[0062] H: Heat source

[0063] L1: Non-conductive liquid

[0064] L2: Protective liquid

[0065] L21: First protective liquid

[0066] L22: The second protective liquid. DETAILED DESCRIPTION

[0067] In order to make the above and other purposes, features and advantages of the present invention more clearly understood, preferred embodiments of the present invention are listed below and described in detail with reference to the accompanying drawings as follows:

[0068] Please refer to Figure 1 , Figure 2 As shown, it is a first embodiment of the immersion cooling system of the present invention, comprising a sealing tank 1, a working layer 2 and a protective layer 3. The sealing tank 1 has a chamber C inside for accommodating the working layer 2, the protective layer 3 and at least one electrical unit E to be cooled.

[0069] The present invention does not limit the shape of the sealing tank 1, and the principle is that the working layer 2, the protective layer 3 and the electrical unit E can be accommodated, so that the working layer 2 can absorb the heat energy generated by the operation of the electrical unit E. The sealing tank 1 can have a barrel tank 11 and a tank cover 12, wherein the chamber C is located inside the barrel tank 11, and the barrel tank 11 has a cover opening 111 connected to the chamber C, so that liquid can be input into the chamber C through the cover opening 111, or objects such as the electrical unit E can be taken in and out, or wires such as wires or signal wires connected to the electrical unit E can be pulled out; the tank cover 12 can cover the cover opening 111, so that the chamber C is sealed.

[0070] In this embodiment, the barrel 11 may have a ring wall 11a and a sealing bottom plate 11b, so that different parts of the barrel 11 may be made of different materials; for example, the ring wall 11a may be made of a transparent material, and the sealing bottom plate 11b may be made of a material with strong, wear-resistant or non-slip properties according to needs. One end of the ring wall 11a may form the aforementioned cover opening 111, and the other end of the ring wall 11a may form an opening 112, and the opening 112 may be opposite to the cover opening 111; in the use state, the cover opening 111 may face upward, and the opening 112 may face downward. In addition, for the barrel 11 having both the cover opening 111 and the opening 112, objects may be taken in and out, wires may be connected, or liquids may be input from the opening 112. In addition, the bottom sealing plate 11 b can be combined with the annular wall 11 a and cover the opening 112 , and the bottom sealing plate 11 b can form a liquid-tight seal with the annular wall 11 a to ensure that the liquid in the chamber C will not leak from the bottom end of the barrel 11 to the outside.

[0071] The slot cover 12 can be combined with the annular wall 11a and cover the cover opening 111, and the periphery of the slot cover 12 can be airtight with the annular wall 11a by, for example, a rubber ring, to ensure that the gas or liquid in the chamber C will not leak to the outside from the periphery of the slot cover 12. In the use state, the slot cover 12 can be located above the barrel slot 11. In this embodiment, a plurality of holes 121 can be opened on the slot cover 12, so that the slot cover 12 can maintain the state of covering the cover opening 111, and liquid can be input into the chamber C through the plurality of holes 121, or wires such as wires or signal wires connected to the electrical unit E can be pulled out. Among them, each hole 121 preferably has a sealing structure to reduce the chance of gas or liquid in the chamber C leaking to the outside.

[0072] The working layer 2 is formed by at least one non-conductive liquid L1 filled in the chamber C, and the protective layer 3 is formed by at least one protective liquid L2 filled in the chamber C. In this embodiment, the working layer 2 is formed by a single non-conductive liquid L1, and the protective layer 3 is formed by a single protective liquid L2, but the present invention is not limited thereto. The density of the protective liquid L2 is lower than that of the non-conductive liquid L1, so that the non-conductive liquid L1 and the protective liquid L2 can be naturally layered in the chamber C, and the protective layer 3 is adjacent to the working layer 2. In addition, the boiling point of the protective liquid L2 is higher than that of the non-conductive liquid L1.

[0073] The electrical unit E is an object that needs to be cooled. The electrical unit E can be positioned at a preset position in the chamber C so that the electrical unit E can be immersed in and contact the non-conductive liquid L1. For example, the entire electrical unit E can be immersed in the working layer 2, or at least the heat source H of the electrical unit E can be immersed in the working layer 2, and the present invention is not limited thereto. Among them, the heat source H of the electrical unit E can be selected to be located in the working layer 2, and a part of the electrical unit E can be located in the protective layer 3, so that the amount of the non-conductive liquid L1 can be reduced to reduce costs while being able to cool the heat source H; in addition, when setting up the electrical unit E, the heat source H of the electrical unit E can be selected to be as close to the bottom B of the chamber C as possible, thereby further saving the amount of the non-conductive liquid L1.

[0074] In more detail, in this embodiment, the electrical unit E can be positioned on a stand 4, and the stand 4 can be stably disposed at the bottom B of the chamber C. For example, but not limited to, the stand 4 can have a plurality of spaced fixing frames 41 to form a slot 42 between any two adjacent fixing frames 41. When the electrical unit E is a sheet structure such as a motherboard, a communication interface board, a display board or a data storage board, the electrical unit E can be inserted and positioned in one of the slots 42, and the non-conductive liquid L1 can still penetrate the heat source H of the electrical unit E through the slot 42. Alternatively, in other embodiments, a hanger can also be disposed on the slot cover 12 to position the electrical unit E so that the electrical unit E can be immersed in the working layer 2, so the present invention does not limit the method of positioning the electrical unit E.

[0075] The immersion cooling system may further include a perturbator 5, which is located in the protective layer 3 and is used to stir the protective liquid L2 so that the temperature of each part of the entire protective layer 3 can be more uniform. In this embodiment, the perturbator 5 may have a shell 51, and the shell 51 may be assembled to the tank cover 12 by a connecting frame 52, and the shell 51 is kept immersed in the protective liquid L2. The shell 51 has an inlet 511 and a discharge port 512, and the shell 51 has an impeller 53 inside to drive the protective liquid L2 to flow from the inlet 511 into the shell 51 and then flow out from the discharge port 512, wherein the diameter of the discharge port 512 may be smaller than the diameter of the inlet 511, so as to increase the flow rate of the liquid flowing out of the discharge port 512, thereby reducing the energy consumption of the perturbator 5.

[0076] Please refer to Figure 2 As shown, the immersion cooling system of this embodiment can absorb the heat energy from the non-conductive liquid L1 around the electrical unit E when the electrical unit E operates and generates heat energy, so that the electrical unit E can be maintained at an appropriate working temperature. The liquid non-conductive liquid L1 in the working layer 2 can be converted into a gaseous state after absorbing the heat energy, and form bubbles and rise into the protective layer 3; at this time, the gaseous non-conductive liquid L1 entering the protective layer 3 can transfer the heat energy to the liquid protective liquid L2, thereby condensing back to a liquid state in the protective layer 3, and then through the density difference between the non-conductive liquid L1 and the protective liquid L2, the non-conductive liquid L1 condensed back to a liquid state can naturally sink back into the working layer 2. In addition, since the boiling point of the protective liquid L2 is relatively high, when the gaseous non-conductive liquid L1 transfers heat energy to the liquid protective liquid L2, the protective liquid L2 can still maintain a liquid state, and as long as the gaseous non-conductive liquid L1 condenses back into a liquid state before reaching the top of the protective layer 3, there is almost no loss, so the loss of the non-conductive liquid L1 can be greatly reduced.

[0077] Please refer to Figure 3 , which is a second embodiment of the immersion cooling system of the present invention. The protective layer 3 of this embodiment can be formed by two or more protective liquids L2 of different densities to further enhance the effect of reducing the loss of the non-conductive liquid L1. For example, the protective layer 3 of this embodiment can be formed by two protective liquids L2 of different densities, and they are respectively referred to as the first protective liquid L21 and the second protective liquid L22 below for the convenience of description.

[0078] The density of the first protection liquid L21 is lower than that of the non-conductive liquid L1, and the density of the second protection liquid L22 is lower than that of the first protection liquid L21, and the boiling point of the first protection liquid L21 is higher than that of the non-conductive liquid L1, and the boiling point of the second protection liquid L22 is higher than that of the first protection liquid L21. In this way, the protection layer 3 of this embodiment can form a two-layer form, and the second protection liquid L22 is adjacent to the top of the first protection liquid L21. In case the gaseous non-conductive liquid L1 does not have time to condense back to liquid before reaching the top of the first protection liquid L21, the bubbles can continue to enter the second protection liquid L22, and condense back to liquid in the liquid second protection liquid L22, and naturally sink, and return to the working layer 2 through the first protection liquid L21; therefore, the second protection liquid L22 can further reduce the loss of the non-conductive liquid L1. In other embodiments, protective liquids of different densities may be added to form the protective layer 3 in multiple layers, as long as the principle that the upper layer of protective liquid has a lower density and a higher boiling point is followed.

[0079] Please refer to Figure 4 As shown, it is the third embodiment of the immersion cooling system of the present invention. This embodiment can also have a circulating cooling module 6. The circulating cooling module 6 can be composed of a pipe group 61 through the protective layer 3, so that the liquid or gaseous fluid circulating in the pipe group 61 can exchange heat with the protective liquid L2 forming the protective layer 3, absorb the thermal energy of the protective liquid L2, so that the protective liquid L2 can be maintained at a low temperature, so as to improve the efficiency of condensing the gaseous non-conductive liquid L1 back to liquid.

[0080] In detail, the circulating cooling module 6 may also have a driving source 62 and a heat dissipation unit 63, the pipe assembly 61 is connected to the driving source 62, so that the driving source 62 drives the fluid in the pipe assembly 61 to flow; the pipe assembly 61 is connected to the heat dissipation unit 63, and the part of the pipe assembly 61 located in the chamber C forms a heat absorption part 611, and the connection between the heat dissipation unit 63 and the pipe assembly 61 is preferably far away from the heat absorption part 611. Accordingly, the fluid in the pipe assembly 61 can absorb the heat energy of the protection liquid L2 when flowing through the heat absorption part 611, and cool down when flowing through the heat dissipation unit 63, and be guided to the heat absorption part 611 again after cooling down, and the protection liquid L2 can be kept at a low temperature by continuous circulation.

[0081] The driving source 62 may be, for example, an impeller or a pump, and the driving source 62 may be Figure 4 As shown in the chamber C, or as Figure 5 As shown, it is arranged outside the sealing groove 1. The heat dissipation unit 63 can be an air-cooled or liquid-cooled radiator, which is not limited in the present invention.

[0082] Please refer to Figure 6As shown, the electronic device 7 of this embodiment may have a housing 71 and a plurality of electrical units E. The plurality of electrical units E and the immersion cooling system of the aforementioned embodiments may be located in the housing 71 .

[0083] In detail, the electronic device 7 may be, for example, an industrial personal computer (IPC), and the plurality of electrical units E may be, for example, a power supply, a hard disk, a fan, a motherboard, a central processing unit, a memory, and a display card, etc. Among them, the electrical units E that generate high temperatures during operation, such as the motherboard, the central processing unit, the memory, and the display card, etc., at least one of the electrical units E may have a heat source H, and the heat source H may be arranged in the chamber C of the sealing tank 1 and immersed in the working layer 2; and the other electrical units E that are unlikely to generate high temperatures during operation may be arranged outside the sealing tank 1. The working layer 2 is formed by at least one non-conductive liquid L1, and the protective layer 3 is formed by at least one protective liquid L2, the density of the protective liquid L2 is lower than the density of the non-conductive liquid L1, and the boiling point of the protective liquid L2 is higher than the boiling point of the non-conductive liquid L1. Accordingly, the liquid non-conductive liquid L1 in the working layer 2 can absorb the heat energy generated by the heat source H and convert it into gas, forming bubbles that rise into the protective layer 3, condense back into liquid in the protective layer 3, and then sink back into the working layer 2, thereby achieving the effect of reducing the loss of the non-conductive liquid L1.

[0084] It is worth mentioning that the protective layer 3 of this embodiment can also be formed by two or more protective liquids L2 of different densities as in the aforementioned second embodiment, so as to further enhance the aforementioned effect of reducing the loss of the non-conductive liquid L1; or, as in the aforementioned first embodiment, a perturbator 5 (indicated at Figure 2 ), or as in the aforementioned third embodiment, a circulating cooling module 6 (indicated at Figure 4 ), so as to improve the efficiency of condensing the gaseous non-conductive liquid L1 back into liquid. In addition, in other embodiments, the sealing groove 1 can be selectively arranged outside the housing 71 of the electronic device 7, and the electrical unit E that needs to be arranged in the chamber C is naturally also located outside the housing 71. This is understandable to those skilled in the art, so the electronic device 7 of the present invention is not limited to Figure 6 The configuration relationships shown are limited.

[0085] In summary, the immersion cooling system of the present invention and the electronic device having the immersion cooling system, the liquid non-conductive liquid in the working layer can be converted into gas after absorbing heat energy, and form bubbles and rise into the protective layer, so that the gaseous non-conductive liquid can condense back to liquid in the liquid environment, and then sink back into the working layer, thereby effectively reducing the loss of gaseous non-conductive liquid, making it difficult for the amount of non-conductive liquid in the sealing groove to decrease, and having the effect of greatly reducing the cost and labor cost of replenishing the non-conductive liquid.

[0086] Although the present invention has been disclosed using the above-mentioned preferred embodiments, they are not intended to limit the present invention. Any person skilled in the art may make various changes and modifications to the above-mentioned embodiments without departing from the spirit and scope of the present invention, and the technical scope protected by the present invention is still within the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of protection of the claims.

Claims

1. An immersion cooling system, characterized in that: include: a sealing groove having a chamber therein; a working layer formed by at least one non-conductive liquid filled in the chamber; A protective layer is formed by at least one protective liquid filled in the chamber, the density of the protective liquid is lower than the density of the non-conductive liquid, and the boiling point of the protective liquid is higher than the boiling point of the non-conductive liquid; and a disturber is located in the protective layer, and the disturber stirs the protective liquid by an impeller.

2. The immersion cooling system according to claim 1, characterized in that: The sealing groove has a barrel groove and a groove cover. The chamber is located inside the barrel groove. The barrel groove has a cover opening connected to the chamber. The groove cover covers the cover opening.

3. The immersion cooling system according to claim 1, characterized in that: The protective layer is formed by two or more protective liquids of different densities, and the upper protective liquid has a lower density and a higher boiling point.

4. The immersion cooling system according to claim 1, characterized in that: In addition, a circulating cooling module is included. The circulating cooling module has a pipe assembly. Part of the pipe assembly passes through the protective layer and forms a heat absorption part. The protective liquid exchanges heat with the heat absorption part.

5. The immersion cooling system according to claim 4, characterized in that: The circulating cooling module has a driving source connected to the pipe group, the driving source drives the fluid in the pipe group to flow, and the pipe group is connected to a heat dissipation unit to reduce the temperature of the fluid in the pipe group.

6. The immersion cooling system according to any one of claims 1 to 5, characterized in that: Also included is at least one electrical unit, which is positioned in the chamber and immersed in the non-conductive liquid.

7. The immersion cooling system according to claim 6, characterized in that: The heat source of the electric unit is located in the working layer, and a part of the electric unit is located in the protective layer.

8. The immersion cooling system according to any one of claims 1 to 5, characterized in that: In addition, it includes a bracket for positioning at least one electrical unit, the bracket is located at the bottom of the chamber, the bracket has a plurality of fixed frames spaced apart from each other, a slot is formed between any two adjacent fixed frames, the electrical unit is inserted and positioned in one of the slots, and the non-conductive liquid penetrates the heat source of the electrical unit through the slot.

9. An electronic device, characterized in that: include: a plurality of electrical units, at least one of which has a heat source; and An immersion cooling system as claimed in any one of claims 1 to 5, wherein the heat source is located in the working layer.

10. The electronic device according to claim 9, wherein: A portion of the electrical unit having the heat source is located in the protective layer.

11. The electronic device according to claim 9, wherein: The immersion cooling system further includes a frame, which is located at the bottom of the chamber. The frame has a plurality of fixed frames spaced apart from each other, and a slot is formed between any two adjacent fixed frames. The electrical unit with the heat source is inserted and positioned in one of the slots, and the non-conductive liquid penetrates the heat source through the slot.

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