Display device

Abstract

A display device is provided. The display device includes a display panel configured to display an image, an input sensor located on the display panel, a proximity sensing electrode arranged around the input sensor, and a sensor controller connected to the input sensor and the proximity sensing electrode. The sensor controller is configured to drive the input sensor in a first driving mode during a first input sensing frame and to drive the input sensor in a second driving mode during a second input sensing frame, and the sensor controller is further configured to provide an uplink signal to the proximity sensing electrode in response to the input sensor operating in the first driving mode or the second driving mode.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2020-0087084, filed on July 14, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0002] Some aspects of embodiments of this disclosure relate to a display device. Background Technology

[0003] Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation devices, and game consoles all have display devices for displaying images. In addition to typical input methods such as buttons, keyboards, and mice, electronic devices may also include input sensors that provide touch-based input methods that allow users to easily input information or commands in an intuitive and convenient manner.

[0004] Input sensors can sense touch or pressure provided by the user's body. Simultaneously, the demand for electronic pens is increasing, with pens used for detailed touch input by users familiar with writing tools or for detailed touch input in specific applications (e.g., applications for sketching or drawing).

[0005] Therefore, input sensors are needed in electronic devices to sense various inputs, such as electronic pen inputs and inputs provided by touch or pressure from the user's body.

[0006] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention

[0007] Some aspects of embodiments of this disclosure relate to a display device, for example, to a display device having improved input sensing performance.

[0008] Some aspects of embodiments of this disclosure include a display device capable of preventing or reducing degradation of input sensing performance when the display device is driven at a relatively high speed.

[0009] According to some embodiments of the inventive concept, the display device includes: a display panel configured to display an image; an input sensor located on the display panel; proximity sensing electrodes disposed around the input sensor; and a sensor controller connected to the input sensor and the proximity sensing electrodes.

[0010] According to some embodiments, the sensor controller can drive the input sensor in a first drive mode during a first input sensing frame and in a second drive mode during a second input sensing frame. The sensor controller can provide an uplink signal to the proximity sensing electrode when the input sensor is operating in either the first or second drive mode.

[0011] According to some embodiments, the display device includes: a display panel configured to display an image; an input sensor located on the display panel; a window located on the input sensor; a proximity sensing electrode located on the rear surface of the window; and a sensor controller connected to the input sensor and the proximity sensing electrode. The sensor controller can drive the input sensor in a first driving mode during a first input sensing frame and in a second driving mode during a second input sensing frame. The sensor controller can provide an uplink signal to the proximity sensing electrode when the input sensor operates in either the first or second driving mode. Attached Figure Description

[0012] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and form part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the implementation methods, serve to describe the principles of the inventive concept. In the drawings:

[0013] Figure 1A These are perspective views of a display device according to some embodiments of the inventive concept;

[0014] Figure 1B This is an exploded perspective view of a display device according to some embodiments of the inventive concept;

[0015] Figure 1C This is a rear view of a display device according to some embodiments of the inventive concept;

[0016] Figure 1D It is along Figure 1C The cross-sectional view of the display device shown is taken by line II-II'.

[0017] Figure 2A It is along Figure 1B The cross-sectional view of the display device shown is taken by line I-I'.

[0018] Figure 2B and Figure 2C These are all cross-sectional views of display devices based on some embodiments of the inventive concept;

[0019] Figure 3A It is a block diagram used to describe the operation of an electronic device according to some embodiments of the inventive concept;

[0020] Figure 3B yes Figure 3A Block diagram of the input device shown;

[0021] Figure 4 This is a cross-sectional view of a display module according to some embodiments of the inventive concept;

[0022] Figure 5 This is a plan view illustrating an input sensor according to some embodiments of the inventive concept;

[0023] Figure 6A This is a view used to illustrate the operation of an input sensor and a proximity sensing electrode in a first driving mode according to some embodiments of the inventive concept;

[0024] Figure 6B This is a view used to illustrate the operation of an input sensor and a proximity sensing electrode in a second driving mode according to some embodiments of the inventive concept;

[0025] Figures 7A to 7C These are all conceptual diagrams illustrating the operation of the input sensor and proximity sensing electrode over time according to some embodiments of the inventive concept;

[0026] Figure 8A It is a block diagram used to describe the operation of an input sensor and a sensor controller according to some embodiments of the inventive concept;

[0027] Figure 8B This is a view used to illustrate the operation of the input sensor and proximity sensing electrode in a second driving mode according to some embodiments of the inventive concept; and

[0028] Figure 8C This is a conceptual diagram illustrating the operation of an input sensor and proximity sensing electrode over time according to some embodiments of the inventive concept. Detailed Implementation

[0029] It will be understood that when an element or layer is referred to as being “on”, “connected to”, or “combined to” another element or layer, the element or layer may be directly on, connected to, or combined with the other element or layer, or there may be an intermediate element or layer.

[0030] Throughout this specification, the same reference numerals denote the same components. In the figures, for the purpose of effectively describing the technical content, the thickness, scale, and dimensions of the components are exaggerated.

[0031] As used herein, the term “and / or” includes any and all combinations of one or more of the relevant listed items.

[0032] It will be understood that although the terms first, second, etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Thus, the first element, first component, first region, first layer, or first portion discussed below may be named a second element, second component, second region, second layer, or second portion without departing from the teachings of the invention. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well.

[0033] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” may be used herein to describe the relationship of one element or feature as shown in the figure to other elements or features. It will be understood that, in addition to the orientation depicted in the figure, the spatial relative terms are intended to also include different orientations of the device in use or operation.

[0034] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense, unless expressly defined herein.

[0035] It will also be understood that when the terms “comprising” or “having” are used in this specification, it indicates the presence of the stated features, integrals, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or groups thereof.

[0036] In the following description, some aspects of embodiments of the invention will be explained in more detail with reference to the accompanying drawings.

[0037] Figure 1A These are perspective views of a display device according to some embodiments of the inventive concept, and Figure 1B This is an exploded perspective view of a display device according to some embodiments of the inventive concept. Figure 1C This is a rear view of a display device according to some embodiments of the inventive concept. Figure 1D It is along Figure 1C The cross-sectional view of the display device is shown by line II-II'. Figure 2A It is along Figure 1B The cross-sectional view of the display device is shown by line I-I'. Figure 2B and Figure 2C These are all cross-sectional views of display devices based on some embodiments of the inventive concept.

[0038] Reference Figures 1A to 1C An electronic device (ED) can be a device activated by an electrical signal. Electronic devices (EDs) can include various embodiments or applications. For example, electronic devices (EDs) can be applied to electronic devices such as smartwatches, tablets, laptops, computers, and smart TVs.

[0039] The electronic device ED may include a display device DD and an input device AP. The display device DD may display an image IM on a display surface IS facing a third direction DR3, the display surface IS being parallel to a plane defined by a first direction DR1 and a second direction DR2. The display surface IS on which the image IM is displayed may correspond to the front surface of the display device DD. The image IM may include a moving image or a still image.

[0040] According to some embodiments, the front (or top) surface and rear (or bottom) surface of each of the components are defined relative to a third direction DR3 along which the displayed image IM is directed. The front and rear surfaces may be opposite each other on the third direction DR3, and the normal direction of each of the front and rear surfaces may be parallel to the third direction DR3.

[0041] The spacing between the front and rear surfaces of the display device DD in the third direction DR3 can correspond to the thickness of the display device DD in the third direction DR3. Meanwhile, the directions indicated by the first direction DR1 to the third direction DR3 are relative and can be converted to different directions.

[0042] The display device DD can sense external input applied from the outside. External input can include various types of input provided from outside the display device DD. According to some embodiments of the inventive concept, the display device DD can sense a first input TC1 applied from the outside by a user US. The first input TC1 of the user US can be any one or a combination of various types of external input (such as a part of the user's body, light, heat, and pressure). Although, according to some embodiments, the first input TC1 of the user US is described by way of example as a touch input applied to the front surface by the user US's hand, this is an example, and the first input TC1 of the user US can be provided in various types as described above. Additionally, the display device DD can sense the first input TC1 of the user US applied to the side or rear surface of the display device DD depending on its structure, and the display device DD is not limited to any one embodiment.

[0043] Additionally, according to some embodiments of the inventive concept, the display device DD can sense a second input TC2 applied from an external source. The second input TC2 may include input via an input device AP (e.g., a stylus, active pen, touch pen, electronic pen, electronic whiteboard pen (e-pen), etc.) rather than the user's hand. In the following description, the second input TC2 is described by way of example as input via an active pen.

[0044] The front surface of the display device DD can be divided into a transmissive region TA and a border region BZA. The transmissive region TA can be the area in which an image IM is displayed. The user US views the image IM through the transmissive region TA. According to some embodiments, the transmissive region TA is shown as a quadrilateral shape with rounded vertices. However, this is shown by way of example, and the transmissive region TA can have various shapes and is not limited to any one embodiment.

[0045] The border region BZA is adjacent to the transmissive region TA. The border region BZA may have a color (e.g., a set or predetermined color). The border region BZA may surround the transmissive region TA. Therefore, the shape of the transmissive region TA may be substantially defined by the border region BZA. However, this is shown by way of example, and the border region BZA may be positioned only adjacent to one side of the transmissive region TA, or it may be omitted. The display device DD according to some embodiments of the inventive concept may include various embodiments, and is not limited to any one embodiment.

[0046] like Figure 1B As shown, the display device DD may include a display module DM and a window WM positioned on the display module DM. The display module DM may include a display panel DP and an input sensor ISP.

[0047] The display panel DP according to some embodiments of the inventive concept can be a light-emitting display panel and is not specifically limited thereto. For example, the display panel DP can be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots, quantum rods, etc. Hereinafter, the display panel DP is described as an organic light-emitting display panel.

[0048] Figure 1A and Figure 1B A display device DD with a flat structure is shown, but embodiments according to the inventive concept are not limited thereto. The display device DD may be bent or folded about a folding axis, or may have a sliding structure.

[0049] Reference Figure 2A and Figure 2BThe input sensor ISP can be directly mounted on the display panel DP. According to some embodiments of the inventive concept, the input sensor ISP can be formed on the display panel DP via a continuous process. That is, when the input sensor ISP is directly mounted on the display panel DP, no adhesive film is positioned between the input sensor ISP and the display panel DP. However, as... Figure 2C As shown, the internal adhesive film I_AF can be positioned between the input sensor ISP and the display panel DP. In this case, the input sensor ISP can be manufactured separately from the display panel DP through a non-continuous process. The input sensor ISP can be manufactured through a process separate from the display panel DP, and then fixed to the top surface of the display panel DP by the internal adhesive film I_AF.

[0050] The display panel DP outputs an image IM, and the input sensor ISP obtains the coordinate information of external inputs (e.g., first input TC1 and second input TC2).

[0051] The window WM can be made of a transparent material that allows the image IM to pass through. For example, the window WM can be made of glass, sapphire, plastic, etc. Although the window WM is shown as a single layer, it is not limited to this and can include multiple layers.

[0052] Reference Figures 1B to 1D The display device DD may further include a proximity sensing electrode ASE positioned on the rear surface of the window WM. According to some embodiments of the inventive concept, the proximity sensing electrode ASE may be disposed on the window WM corresponding to the bezel region BZA of the display device DD. The proximity sensing electrode ASE may not overlap with the transmissive region TA.

[0053] The proximity sensing electrode ASE may include a metallic material. The proximity sensing electrode ASE may be configured such that it is formed directly on the rear surface of the window WM by a coating method without the need for a separate adhesive member, or may be configured such that it is attached to the rear surface of the window WM by a separate adhesive member.

[0054] According to some embodiments of the inventive concept, the proximity sensing electrode ASE can have a closed ring shape. However, the shape of the proximity sensing electrode ASE is not limited to this. For example, the display device DD may include two or more proximity sensing electrodes ASE arranged spaced apart from each other.

[0055] like Figure 2BAs shown, the display device DD may further include a cover layer CVL covering the proximity sensing electrode ASE. The cover layer CVL may include an insulating material. The cover layer CVL can protect the proximity sensing electrode ASE from moisture, oxygen, or foreign matter. The cover layer CVL may have a single-layer structure or a multilayer structure in which multiple layers are stacked.

[0056] According to some embodiments of the inventive concept, the cover layer CVL may include a material having a color (e.g., a set or predetermined color). For example, the cover layer CVL may be a black organic film. Therefore, the cover layer CVL can perform the function of blocking light leakage from the display module DM. Here, the cover layer CVL is described as having a light-blocking function, but the embodiments according to this disclosure are not limited thereto. That is, a light-blocking layer formed by a layer separate from the cover layer CVL may be provided on the rear surface of the window WM. In this case, the light-blocking layer may be positioned between the proximity sensing electrode ASE and the window WM, or it may be positioned on the cover layer CVL.

[0057] The window WM can be bonded to the display module DM via an adhesive film AF. According to some embodiments of the inventive concept, the adhesive film AF may include an optically clear adhesive (OCA) film. However, the adhesive film AF is not limited to this and may include typical adhesives or typical removable adhesives. For example, the adhesive film AF may include an optically clear resin (OCR) or pressure-sensitive adhesive (PSA) film.

[0058] An anti-reflective layer may also be positioned between the window WM and the display module DM. The anti-reflective layer reduces the degree of reflection of external light incident from above the window WM. According to some embodiments of the inventive concept, the anti-reflective layer may include a phase retarder and a polarizer. The phase retarder may be a film-type or a liquid crystal coated type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film-type or a liquid crystal coated type. The film-type may include a stretched synthetic resin film, and the liquid crystal coated type may include liquid crystal (e.g., liquid crystal arranged in a set or predetermined arrangement). The phase retarder and polarizer may be implemented as a single polarizing film.

[0059] The display module DM can display images and send / receive information about external inputs based on electrical signals. The display module DM can be defined as including a valid area AA and a peripheral area NAA. The valid area AA can be defined as the area that transmits the image provided by the display module DM.

[0060] The peripheral region NAA is adjacent to the effective region AA. For example, the peripheral region NAA may surround the effective region AA. However, this is shown as an example, and the peripheral region NAA may be defined in various shapes, and is not limited to having any particular shape according to embodiments of this disclosure. According to some embodiments, the effective region AA of the display module DM may correspond to at least a portion of the transmissive region TA.

[0061] The display device DD may further include a main circuit board MCB, a flexible circuit film FCB, and a driver chip DIC. The main circuit board MCB may be connected to the flexible circuit film FCB for electrical connection to the display panel DP. The main circuit board MCB may include multiple driving elements. These driving elements may include circuit units for driving the display panel DP. The flexible circuit film FCB is connected to the display panel DP to electrically connect the display panel DP to the main circuit board MCB. The driver chip DIC may be mounted on the flexible circuit film FCB.

[0062] The driver chip DIC may include driving elements for driving the pixels of the display panel DP, such as data driving circuitry. Although the flexible circuit film FCB is shown as a single flexible circuit film in some embodiments according to the inventive concept, the flexible circuit film FCB is not limited thereto and may be configured as multiple flexible circuit films connected to the display panel DP. Figure 1B The diagram illustrates a configuration in which the driver chip DIC is mounted on the flexible circuit film FCB, but embodiments according to the inventive concept are not limited thereto. For example, the driver chip DIC can be directly mounted on the display panel DP. In this case, the portion of the display panel DP on which the driver chip DIC is mounted can be bent and positioned on the rear surface of the display module DM.

[0063] The input sensor ISP can be electrically connected to the main circuit board MCB via a flexible circuit film FCB. However, embodiments according to the inventive concept are not limited to this. That is, the display module DM may additionally include a separate flexible circuit film for electrically connecting the input sensor ISP to the main circuit board MCB.

[0064] The display device DD also includes a contact flexible circuit film C_FCB connecting the main circuit board MCB and the proximity sensing electrode ASE. The contact flexible circuit film C_FCB is positioned on the rear surface of the display module DM. The proximity sensing electrode ASE can be electrically connected to the main circuit board MCB via the contact flexible circuit film C_FCB on the rear surface of the display module DM. The main circuit board MCB can provide an uplink signal to the proximity sensing electrode ASE via the contact flexible circuit film C_FCB. The uplink signal can include a beacon signal. The beacon signal can be a high-voltage signal. For example, the beacon signal can be a high-frequency signal oscillating between approximately 0V and approximately 14.5V. The main circuit board MCB can sense the proximity of the input device AP by periodically sending the beacon signal negotiated with the input device AP via the proximity sensing electrode ASE. The uplink signal may also include panel information about the display device DD, synchronization signals, etc.

[0065] The proximity sensing electrode ASE can be superimposed on the peripheral area NAA of the display module DM, but not on the effective area AA of the display module DM. Therefore, it is possible to prevent the image IM output from the effective area AA from being blocked by the proximity sensing electrode ASE. In addition, even when the proximity sensing electrode ASE sends an uplink signal as a high voltage signal to the input device AP, it can prevent or reduce the flickering phenomenon that can be seen on the display module DM due to the uplink signal.

[0066] Reference Figure 1C and Figure 1D A contact portion CNT for exposing the proximity sensing electrode ASE can be disposed within a cover layer CVL. The contact portion CNT can be formed by partially removing the cover layer CVL. Within the contact portion CNT, a contact flexible circuit film C_FCB is arranged to overlap with the proximity sensing electrode ASE. An anisotropic conductive film ACF can be positioned between the contact flexible circuit film C_FCB and the proximity sensing electrode ASE. The contact flexible circuit film C_FCB and the proximity sensing electrode ASE are electrically connected via the anisotropic conductive film ACF. Therefore, an uplink signal provided by the contact flexible circuit film C_FCB can be transmitted to the proximity sensing electrode ASE via the anisotropic conductive film ACF. Furthermore, because the anisotropic conductive film ACF includes an adhesive material, the contact flexible circuit film C_FCB can be bonded to the proximity sensing electrode ASE via the anisotropic conductive film ACF.

[0067] As another example, the main circuit board MCB can be directly connected to the proximity sensing electrode ASE without contacting the flexible circuit film C_FCB. In this case, the main circuit board MCB can be extended to overlap with the proximity sensing electrode ASE and can be electrically connected to the proximity sensing electrode ASE via an anisotropic conductive film ACF.

[0068] In addition, the display device DD may also include connectors for electrically connecting the main circuit board MCB and the contact flexible circuit film C_FCB.

[0069] Figure 1C The diagram shows a structure in which the proximity sensing electrode ASE contacts the contact flexible circuit film C_FCB at one point. However, embodiments according to the inventive concept are not limited to this. The proximity sensing electrode ASE may contact the contact flexible circuit film C_FCB at two points. In this case, the display device DD may include two contact flexible circuit films C_FCB, each contacting the proximity sensing electrode ASE at a different point. As the size of the display device DD increases, the strength of the uplink signal can vary depending on the position of the proximity sensing electrode ASE. That is, as the distance from the point where the proximity sensing electrode ASE contacts the contact flexible circuit film C_FCB increases, the strength of the uplink signal decreases. Therefore, when the display device DD becomes larger, the phenomenon that the strength of the uplink signal applied to the proximity sensing electrode ASE varies depending on the position of the proximity sensing electrode ASE can be prevented by increasing the number of points where the proximity sensing electrode ASE contacts the contact flexible circuit film C_FCB.

[0070] Return to reference Figure 1B The display device DD also includes a housing EDC that houses the display module DM. The housing EDC can be combined with a window WM to define the appearance of the display device DD. The housing EDC absorbs impacts applied from the outside and prevents foreign objects / moisture from penetrating into the display module DM, thereby protecting the components housed in the housing EDC. On the other hand, according to some embodiments of the inventive concept, the housing EDC can be provided in the form of a combination of multiple storage components.

[0071] According to some embodiments, the display device DD may also include an electronic module containing various functional modules for operating the display module DM, a power supply module for supplying power required for the overall operation of the display device DD, and a bracket combined with the display module DM and / or the housing EDC to divide the internal space of the display device DD, etc.

[0072] Figure 3A It is a block diagram used to describe the operation of an electronic device according to some embodiments of the inventive concept, and Figure 3B yes Figure 3A The block diagram of the input device shown is shown.

[0073] Reference Figure 3AAccording to some embodiments of the inventive concept, the display device DD also includes a sensor controller 100 connected to the input sensor ISP and the proximity sensing electrode ASE. The sensor controller 100 can control the driving of the input sensor ISP and the proximity sensing electrode ASE. According to some embodiments of the inventive concept, the sensor controller 100 can be mounted on the main circuit board MCB (in...). Figure 1B (as shown in the diagram). However, embodiments of the inventive concept are not limited thereto. That is, the sensor controller 100 can be embedded in the driver chip DIC (in... Figure 1B (As shown in the image).

[0074] The input sensor ISP may include sensing electrodes. See below for further details. Figures 4 to 7B Describe in detail the structure and operation of the input sensor ISP.

[0075] The sensor controller 100 can be connected to the sensing electrodes of the input sensor ISP. The sensor controller 100 can operate the input sensor ISP in a first drive mode to sense a first input TC1, and in a second drive mode to sense a second input TC2.

[0076] like Figure 3A and Figure 3B As shown, the input device AP may include a housing 11, a conductive tip 12, and a communication module 13. The housing 11 may be pen-shaped and include a receiving space formed therein. The conductive tip 12 may protrude outward from the side of the housing 11 with an opening. The conductive tip 12 may be the portion of the input device AP that directly contacts the input sensor ISP.

[0077] The communication module 13 may include a transmitting circuit 13a and a receiving circuit 13b. The transmitting circuit 13a may transmit a downlink signal DLS to the sensor controller 100. The downlink signal DLS may include pen data, position information of the input device AP, tilt information of the input device AP, status information, etc. When the input device AP contacts the input sensor ISP, the sensor controller 100 can receive the downlink signal DLS through the input sensor ISP.

[0078] The receiving circuit 13b can receive an uplink signal ULS from the sensor controller 100. The uplink signal ULS may include information such as beacon signals, panel information, and protocol version. The sensor controller 100 provides the uplink signal ULS to the proximity sensing electrode ASE to sense the proximity of the input device AP. When the input device AP approaches the display device DD, the input device AP can receive the uplink signal ULS from the proximity sensing electrode ASE.

[0079] The input device AP also includes an input controller 14 that controls the drive of the input device AP. The input controller 14 can be configured to operate according to a predetermined program. The transmitting circuit 13a receives signals provided from the input controller 14 to convert the received signals into signals that can be sensed by the input sensor ISP, and the receiving circuit 13b converts signals received from the proximity sensing electrode ASE into signals that can be processed by the input controller 14.

[0080] The input device AP may also include a power module 15 for supplying power to the input device AP.

[0081] Figure 4 This is a cross-sectional view of a display module according to some embodiments of the inventive concept.

[0082] Reference Figure 4 The display module DM may include a display panel DP and an input sensor ISP directly positioned on the display panel DP. The display panel DP may include a substrate layer BS, a circuit layer DP_CL, a light-emitting element layer DP_ED, and a packaging layer TFE.

[0083] The substrate layer BS can provide a substrate surface on which the circuit layer DP_CL is positioned. The substrate layer BS can be a glass substrate, a metal substrate, a polymer substrate, etc. However, embodiments according to this disclosure are not limited thereto, and the substrate layer BS can be an inorganic layer, an organic layer, or a composite material layer.

[0084] The matrix layer BS can have a multilayer structure. For example, the matrix layer BS can have a three-layer structure consisting of a synthetic resin layer, an adhesive layer, and a synthetic resin layer. Specifically, the synthetic resin layer can include a polyimide resin. Optionally, the synthetic resin layer can include at least one of acrylate resin, methacrylate resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, silicone resin, polyamide resin, and perylene resin.

[0085] The circuit layer DP_CL can be positioned on the substrate layer BS. The circuit layer DP_CL may include insulating layers, semiconductor patterns, conductive patterns, signal lines, etc. The insulating layer, semiconductor layer, and conductive layer can be formed on the substrate layer BS using methods such as coating and deposition. Subsequently, the insulating layer, semiconductor layer, and conductive layer can be selectively patterned using multiple photolithography processes. Then, semiconductor patterns, conductive patterns, and signal lines included in the circuit layer DP_CL can be formed.

[0086] At least one inorganic layer is formed on the top surface of the substrate layer BS. The inorganic layer may include at least one of alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. Multiple inorganic layers may be formed. These multiple inorganic layers may constitute a barrier layer and / or a buffer layer. According to some embodiments, the display panel DP is shown to include a buffer layer BFL.

[0087] The buffer layer (BFL) can improve the adhesion between the substrate layer (BS) and the semiconductor pattern. The buffer layer (BFL) may include a silicon oxide layer and a silicon nitride layer, and the silicon oxide layer and silicon nitride layer may be stacked alternately.

[0088] Semiconductor patterns can be positioned on the buffer layer BFL. The semiconductor pattern can include polycrystalline silicon. However, the semiconductor pattern is not limited to this and can also include amorphous silicon or metal oxide.

[0089] Figure 4 Only a portion of the semiconductor pattern is shown, and another portion of the semiconductor pattern may be located in another region. The semiconductor pattern can be arranged across pixels according to specific rules. Depending on whether the semiconductor pattern is doped, it can have different electrical properties. The semiconductor pattern may include doped and undoped regions. Doped regions may be doped with N-type or P-type dopants. A PMOS transistor may include doped regions doped with P-type dopants, and an NMOS transistor may include doped regions doped with N-type dopants.

[0090] Doped regions can have higher conductivity than undoped regions and can essentially be used as electrodes or signal lines. Undoped regions can essentially correspond to the active region (or channel region) of a transistor. In other words, a portion of the semiconductor pattern can be the active region of a transistor, and another portion of the semiconductor pattern can be the source or drain region of a transistor.

[0091] Each pixel can have an equivalent circuit including seven transistors, a capacitor, and a light-emitting element, and the equivalent circuit diagram of a pixel can be modified in various ways. Figure 4 The example illustrates a transistor TR and a light-emitting element EE included in a pixel.

[0092] The source region SR, active region CHR, and drain region DR of a transistor TR can be formed by a semiconductor pattern. When viewed in cross-section, the source region SR and drain region DR can be arranged from the active region CHR in opposite directions. Figure 4 A portion of a signal line SCL is shown, positioned in the same layer as a semiconductor pattern. According to some embodiments, when viewed in a plane, the signal line SCL may be electrically connected to a transistor TR.

[0093] The first insulating layer IL1 can be positioned on the buffer layer BFL. The first insulating layer IL1 can be stacked with multiple pixels and covers a semiconductor pattern. The first insulating layer IL1 can be an inorganic layer and / or an organic layer, and can have a single-layer or multi-layer structure. The first insulating layer IL1 can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. According to some embodiments, the first insulating layer IL1 can be a single-layer silicon oxide layer. Not only the first insulating layer IL1, but also the insulating layer of the circuit layer DP_CL, which will be described later, can be an inorganic layer and / or an organic layer, and can have a single-layer or multi-layer structure. The inorganic layer can include at least one of the above materials, but is not limited thereto according to embodiments of this disclosure.

[0094] The gate GE of transistor TR is located on the first insulating layer IL1. The gate GE can be part of a metal pattern. The gate GE is stacked with the active region CHR. In the process of doping semiconductor patterning, the gate GE can be used as a mask.

[0095] The second insulating layer IL2 can be positioned on the first insulating layer IL1 and can cover the gate GE. The second insulating layer IL2 can be stacked with multiple pixels. The second insulating layer IL2 can be an inorganic layer and / or an organic layer, and can have a single-layer structure or a multi-layer structure. According to some embodiments, the second insulating layer IL2 can be a single-layer silicon oxide layer.

[0096] The third insulating layer IL3 can be positioned on the second insulating layer IL2, and according to some embodiments, the third insulating layer IL3 can be a single layer of silicon oxide.

[0097] The first connecting electrode CNE1 can be positioned on the third insulating layer IL3. The first connecting electrode CNE1 can be connected to the signal line SCL through a first contact hole CNT1 that penetrates the first insulating layer IL1, the second insulating layer IL2, and the third insulating layer IL3.

[0098] The fourth insulating layer IL4 can be positioned on top of the third insulating layer IL3. The fourth insulating layer IL4 can be a single layer of silicon oxide. The fifth insulating layer IL5 can be positioned on top of the fourth insulating layer IL4. The fifth insulating layer IL5 can be an organic layer.

[0099] The second connecting electrode CNE2 can be positioned on the fifth insulating layer IL5. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the second contact hole CNT2 that penetrates the fourth insulating layer IL4 and the fifth insulating layer IL5.

[0100] The sixth insulating layer IL6 can be positioned on the fifth insulating layer IL5 and can cover the second connection electrode CNE2. The sixth insulating layer IL6 can be an organic layer. The light-emitting element layer DP_ED can be positioned on the circuit layer DP_CL. The light-emitting element layer DP_ED can include a light-emitting element EE. For example, the light-emitting element layer DP_ED can include organic light-emitting materials, quantum dots, quantum rods, micro-LEDs, or nano-LEDs. The light-emitting element EE can include a first electrode AE, a light-emitting layer EL, and a second electrode CE.

[0101] The first electrode AE ​​can be positioned on the sixth insulating layer IL6. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the third contact hole CNT3 that penetrates the sixth insulating layer IL6.

[0102] A pixel defining film IL7 may be positioned on a sixth insulating layer IL6 and may cover a portion of the first electrode AE. An opening OP is defined in the pixel defining film IL7. The opening OP of the pixel defining film IL7 exposes at least a portion of the first electrode AE. According to some embodiments, a light-emitting region PXA is defined to correspond to the portion of the first electrode AE ​​exposed by the opening OP. A non-light-emitting region NPXA may surround the light-emitting region PXA.

[0103] The light-emitting layer (EL) can be positioned on the first electrode (AE). The EL can also be positioned within the opening (OP). That is, the EL can be formed individually in each pixel. Multiple ELs can be configured. When the EL is formed individually in each pixel, each EL can emit light of at least one color selected from blue, red, and green. However, the EL is not limited to this and can be shared across multiple pixels. In this case, the EL can provide either blue or white light.

[0104] The second electrode CE can be positioned on the light-emitting layer EL. The second electrode CE can have a monolithic shape and can be commonly positioned in multiple pixels. A common voltage can be provided to the second electrode CE, and the second electrode CE can be referred to as the common electrode.

[0105] According to some embodiments, a hole control layer can be positioned between the first electrode AE ​​and the light-emitting layer EL. The hole control layer can be commonly positioned within the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. An electron control layer can be positioned between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. The hole control layer and the electron control layer can be commonly formed in multiple pixels using an aperture mask. An encapsulation layer TFE can be positioned on the light-emitting element layer DP_ED. The encapsulation layer TFE may include sequentially stacked inorganic layers, organic layers, and inorganic layers, but the layers constituting the encapsulation layer TFE are not limited to these.

[0106] The inorganic layer protects the DP_ED light-emitting element layer from moisture and oxygen, while the organic layer protects it from foreign matter such as dust particles. The inorganic layer may include silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, aluminum oxide, etc. The organic layer may include, but is not limited to, acrylic organic layers.

[0107] The input sensor ISP can be formed on the display panel DP through a continuous process. The input sensor ISP may include an input substrate layer IIL1, a first conductive layer ICL1, a sensing insulating layer IIL2, a second conductive layer ICL2, and a cover insulating layer IIL3.

[0108] The input substrate layer IIL1 can be an inorganic layer including silicon nitride, silicon oxynitride, and silicon oxide. Optionally, the input substrate layer IIL1 can be an organic layer including epoxy resin, acrylate resin, or imide resin. The input substrate layer IIL1 can have a monolayer structure or a multilayer structure stacked on the third-direction DR3.

[0109] Each of the first conductive layer ICL1 and the second conductive layer ICL2 may have a monolayer structure or a multilayer structure stacked on the third-direction DR3. The monolayer conductive layer may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium zinc tin oxide (IZTO). Alternatively, the transparent conductive layer may include conductive polymers such as PEDOT, metal nanowires, graphene, etc.

[0110] The conductive layer in a multilayer structure may include a metal layer. The metal layer may have a three-layer structure, such as titanium / aluminum / titanium. The conductive layer in a multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0111] At least one of the sensing insulating layer IIL2 and the covering insulating layer IIL3 may include an inorganic film. The inorganic film may include at least one of alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0112] At least one of the sensing insulating layer IIL2 and the covering insulating layer IIL3 may include an organic film. The organic film may include at least one of acrylate resin, methacrylate resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, silicone resin, polyimide resin, polyamide resin, and perylene resin.

[0113] Figure 5 This is a plan view illustrating an input sensor according to some embodiments of the inventive concept, and Figure 6A This is a view used to describe the operation of an input sensor and a proximity sensing electrode in a first driving mode according to some embodiments of the inventive concept. Figure 6B This is a view used to illustrate the operation of an input sensor and proximity sensing electrodes in a second driving mode according to some embodiments of the inventive concept. Figure 6A and Figure 6B It shows Figure 5 A magnified view of part A1.

[0114] Reference Figure 3A and Figure 5 The input sensor ISP can include a sensing area (SA) and a non-sensing area (NSA). The sensing area (SA) can be an area that is activated according to an electrical signal. For example, the sensing area (SA) can be an area that senses an input. The non-sensing area (NSA) can surround the sensing area (SA).

[0115] The input sensor ISP includes first sensing electrodes SE1_1 to SE1_n and second sensing electrodes SE2_1 to SE2_m. The first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m cross each other in an electrically insulated manner. According to some embodiments of the inventive concept, the first sensing electrodes SE1_1 to SE1_n comprise n quantities of first sensing electrodes SE1_1 to SE1_n, and the second sensing electrodes SE2_1 to SE2_m comprise m quantities of second sensing electrodes SE2_1 to SE2_m. Here, each of n and m is a natural number of 1 or greater. For example, n can be a number greater than m, but is not limited thereto. That is, n can be a number equal to or less than m.

[0116] Each of the first sensing electrodes SE1_1 to SE1_n may be strip-shaped and may extend in the first direction DR1. The first sensing electrodes SE1_1 to SE1_n may be arranged spaced apart in the second direction DR2. The first sensing electrodes SE1_1 to SE1_n may have the same electrode width in the second direction DR2. The separation distance between the first sensing electrodes SE1_1 to SE1_n in the second direction DR2 may be constant.

[0117] Each of the second sensing electrodes SE2_1 to SE2_m may be strip-shaped and may extend in the second direction DR2. The second sensing electrodes SE2_1 to SE2_m may be arranged spaced apart in the first direction DR1. The second sensing electrodes SE2_1 to SE2_m may have the same electrode width in the first direction DR1. The separation distance between the second sensing electrodes SE2_1 to SE2_m in the first direction DR1 may be constant.

[0118] The first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m may cross each other. The first sensing electrodes SE1_1 to SE1_n may be electrically insulated from each other, and the second sensing electrodes SE2_1 to SE2_m may be electrically insulated from each other.

[0119] The input sensor ISP can operate in either a first driving mode or a second driving mode. In the first driving mode, the input sensor ISP obtains information about the first input TC1 by measuring the change in mutual capacitance between the first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m. In the second driving mode, the input sensor ISP senses the second input TC2 through the input device AP by measuring the change in capacitance of each of the first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m.

[0120] The input sensor ISP may further include multiple first signal lines SL1_1 to SL1_n and multiple second signal lines SL2_1 to SL2_m. First sensing electrodes SE1_1 to SE1_n and second sensing electrodes SE2_1 to SE2_m may be located in the sensing region SA. The first signal lines SL1_1 to SL1_n and second signal lines SL2_1 to SL2_m may be located in the non-sensing region NSA. The multiple first signal lines SL1_1 to SL1_n are electrically connected to one side of the first sensing electrodes SE1_1 to SE1_n, and the multiple second signal lines SL2_1 to SL2_m are electrically connected to one side of the second sensing electrodes SE2_1 to SE2_m. According to some embodiments of the inventive concept, the input sensor ISP may further include third signal lines SL3_1 to SL3_n, each electrically connected to the other side of the first sensing electrodes SE1_1 to SE1_n. However, embodiments of the inventive concept are not limited to this. That is, the third signal lines SL3_1 to SL3_n may be omitted.

[0121] The first sensing electrodes SE1_1 to SE1_n are electrically connected to the sensor controller 100 through multiple first signal lines SL1_1 to SL1_n, and the second sensing electrodes SE2_1 to SE2_m are electrically connected to the sensor controller 100 through multiple second signal lines SL2_1 to SL2_m.

[0122] Reference Figure 3A , Figure 5 and Figure 6A In the first driving mode MD1, the first sensing electrodes SE1_1 to SE1_n can operate as transmitting electrodes, and the second sensing electrodes SE2_1 to SE2_m can operate as receiving electrodes. In the first driving mode MD1, the sensor controller 100 can sense the external input by sensing the amount of change in the mutual capacitance formed between the first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m.

[0123] In the first driving mode MD1, the sensor controller 100 can provide driving signals TS1 and TS2 to the first sensing electrodes SE1_1 to SE1_n. In the first driving mode MD1, the sensor controller 100 can receive sensing signals RS1 and RS2 from the second sensing electrodes SE2_1 to SE2_m. Therefore, the sensor controller 100 can compare the driving signals TS1 and TS2 with the sensing signals RS1 and RS2 corresponding to the driving signals TS1 and TS2, and can generate coordinate values ​​of the position to which the first input TC1 has been provided based on the amount of change.

[0124] In the first drive mode MD1, the sensor controller 100 can provide an uplink signal ULS to the proximity sensing electrode ASE. The sensor controller 100 can sense the proximity of the input device AP via the proximity sensing electrode ASE in the first drive mode MD1. That is, the sensor controller 100 can operate the input sensor ISP in the first drive mode MD1 and simultaneously sense the proximity of the input device AP using the proximity sensing electrode ASE. Therefore, the sensor controller 100 can simultaneously (or concurrently) sense the proximity of the input device AP and the first input TC1. As a result, it is possible to prevent the time allocated for sensing the first input TC1 from being diverted to sensing the proximity of the input device AP, thereby improving the performance of sensing the first input TC1.

[0125] Reference Figure 3A , Figure 5 and Figure 6B When it is determined that the input device AP is close to the display device DD, the input sensor ISP can enter the second drive mode MD2 for sensing the second input TC2. In the second drive mode MD2, the input device AP can send a downlink signal DLS to the sensor controller 100 through the input sensor ISP.

[0126] In the second drive mode MD2, the first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m can be used as receiving electrodes for providing the downlink signal DLS provided from the input device AP to the sensor controller 100.

[0127] In the second drive mode MD2, the sensor controller 100 can provide an uplink signal ULS to the proximity sensing electrode ASE. When the input sensor ISP operates in the second drive mode MD2, the sensor controller 100 can periodically sense the proximity of the input device AP through the proximity sensing electrode ASE. That is, while receiving the downlink signal DLS through the input sensor ISP, the sensor controller 100 can periodically provide the uplink signal ULS to the input device AP through the proximity sensing electrode ASE. Therefore, the sensor controller 100 can simultaneously (or concurrently) sense the proximity of the input device AP and the second input TC2. As a result, it is possible to prevent the time used for sensing the second input TC2 from being allocated to sensing the proximity of the input device AP, thereby improving the performance of sensing the second input TC2.

[0128] Figures 7A to 7C These are all conceptual diagrams illustrating the operation of input sensors and proximity sensing electrodes over time according to some embodiments of the inventive concept.

[0129] Reference Figures 5 to 7AThe display device DD can be displayed via the display panel DP (in Figure 1B (As shown in the image) IM (in) Figure 1A (As shown in the diagram) it simultaneously senses the first input TC1 and the second input TC2. Depending on the presence of the input device AP, the input sensor ISP can operate in a first drive mode MD1 for sensing the first input TC1 or a second drive mode MD2 for sensing the second input TC2. For example, when the input device AP is not sensed, the input sensor ISP can operate in the first drive mode MD1, and when the input device AP is sensed, the input sensor ISP can operate in the second drive mode MD2.

[0130] According to some embodiments of the inventive concept, in the first driving mode MD1 and the second driving mode MD2, the operating frequency of the input sensor ISP can be higher than or equal to the operating frequency of the display panel DP. For example, when the operating frequency of the display panel DP is about 120Hz, the operating frequency of the input sensor ISP can be about 240Hz. The operating frequency of the input sensor ISP in the first driving mode MD1 can be equal to the operating frequency of the input sensor ISP in the second driving mode MD2. The input sensor ISP senses the first input TC1 in the first driving mode MD1 during the first input sensing frame IF1, and senses the second input TC2 in the second driving mode MD2 during the second input sensing frame IF2. Here, the first input sensing frame IF1 can have the same time period as the second input sensing frame IF2.

[0131] According to some embodiments of the inventive concept, when the input sensor ISP operates in a first driving mode MD1, the input sensor ISP can sense the first input TC1 in a first mode and a second mode. Here, the first mode can be defined as a self-capacitance operating mode in which the first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m of the input sensor ISP are integrated into a single sensing electrode to sense the first input TC1. The second mode can be defined as a mutual capacitance operating mode in which the first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m of the input sensor ISP are capacitively combined to sense the first input TC1. That is, in the first driving mode MD1, the first input sensing frame IF1 can include a first operating period for operation in the first mode and a second operating period for operation in the second mode. The input sensor ISP can sense the first input TC1 in the first mode during the first operating period and in the second mode during the second operating period. According to some embodiments of the inventive concept, in the first input sensing frame IF1, the second operating period can be located after the first operating period. In addition, the duration of the second operating period can be longer than the duration of the first operating period.

[0132] When the input sensor ISP operates in the first drive mode MD1, the sensor controller 100 periodically sends an uplink signal ULS to the input device AP via the proximity sensing electrode ASE. Here, the period during which the proximity sensing electrode ASE sends the uplink signal ULS to the input device AP can be defined as the uplink period ULP. The uplink period ULP can overlap with the first input sensing frame IF1. That is, the display device DD can sense the first input TC1 via the input sensor ISP, and simultaneously sense the proximity of the input device AP via the proximity sensing electrode ASE. Therefore, the input sensor ISP can be used without sensing the proximity of the input device AP, thus preventing a reduction in the time period allocated to sensing the first input TC1.

[0133] The input sensor ISP can operate in a second drive mode MD2 during the second input sensing frame IF2. The second input sensing frame IF2 may include an acknowledgment period (ACP) and a downlink period (DLP). The input device AP can send an acknowledgment signal ACK for the uplink signal ULS to the sensor controller 100 during the acknowledgment period ACP. In this case, the input sensor ISP can operate in the second drive mode MD2 and receive the acknowledgment signal ACK from the input device AP to send the acknowledgment signal ACK to the sensor controller 100.

[0134] When the sensor controller 100 receives the aforementioned acknowledgment signal ACK, it confirms the proximity of the input device AP, and the sensor controller 100 initiates the downlink period (DLP) for communication with the input device AP. During the downlink period (DLP), the input device AP sends a downlink signal (DLS) to the sensor controller 100 via the input sensor ISP. The downlink signal (DLS) may include pen data, the position information of the input device AP, the tilt information of the input device AP, status information, etc.

[0135] The second input sensing frame IF2 may include a pairing period in which the sensor controller 100 and the input device AP perform pairing operations. During the pairing period, the sensor controller 100 and the input device AP can send and receive information to each other via the input sensor ISP.

[0136] Reference Figure 7BThe Delay Period (DEP) can be positioned between the uplink period ULP and the start time of the first input sensing frame IF1. After the uplink period ULP ends and the delay due to the DEP occurs, the next first input sensing frame IF1 can begin. Furthermore, the Delay Period (DEP) can be positioned between the uplink period ULP and the second input sensing frame IF2. The Delay Period (DEP) can separate the Acknowledgment Period (ACP) of the next second input sensing frame IF2 from the uplink period ULP. The Delay Period (DEP) can be a pause period during which the sensor controller 100 and the input device AP do not transmit or receive signals. Additionally, the second input sensing frame IF2 can include a delay period set between the Acknowledgment Period (ACP) and the downlink period (DLP).

[0137] Reference Figure 7C The sensor controller 100 can periodically send an uplink signal ULS to the input device AP via the proximity sensing electrode ASE, and can receive an acknowledgment signal ACK from the input device AP via the proximity sensing electrode ASE. Here, the period during which the proximity sensing electrode ASE sends the uplink signal ULS to the input device AP can be defined as the uplink period ULP, and the period during which the proximity sensing electrode ASE receives the acknowledgment signal ACK from the input device AP can be defined as the acknowledgment period ACP.

[0138] The uplink time period ULP and the acknowledgment time period ACP can overlap with the first input sensing frame IF1. That is, the display device DD can sense the first input TC1 through the input sensor ISP, and at the same time can sense the proximity of the input device AP through the proximity sensing electrode ASE. Therefore, the input sensor ISP can be used to avoid sensing the proximity of the input device AP, thus preventing a reduction in the time period allocated to sensing the first input TC1.

[0139] like Figure 7C As shown, a delay period (DEP) can also be located between the uplink period (ULP) and the acknowledgment period (ACP).

[0140] When sensor controller 100 receives the aforementioned acknowledgment signal ACK, it confirms the proximity of input device AP, and sensor controller 100 initiates a second input sensing frame IF2 for communication with input device AP. The second input sensing frame IF2 includes the downlink periodicity (DLP). Figure 7A Compared to the second input sensing frame IF2 shown, because the confirmation period (ACP) is omitted from the second input sensing frame IF2, therefore... Figure 7C The downlink period DLP in the second input sensing frame IF2 shown can be increased. Furthermore, the second input sensing frame IF2 may also include a delay period preceding the downlink period DLP.

[0141] Figure 8A It is a block diagram used to describe the operation of an input sensor and a sensor controller according to some embodiments of the inventive concept. Figure 8B This is a view used to illustrate the operation of an input sensor and proximity sensing electrodes in a second driving mode according to some embodiments of the inventive concept, and Figure 8C This is a conceptual diagram illustrating the operation of an input sensor and proximity sensing electrode over time according to some embodiments of the inventive concept.

[0142] Reference Figure 5 , Figure 8A and Figure 8B In the second drive mode MD2, the first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m can be used as transmitting electrodes to provide an auxiliary uplink signal ULSa provided from the sensor controller 100 to the input device AP. Here, the auxiliary uplink signal ULSa transmitted to the input device AP via the first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m can be distinguished from the uplink signal ULS transmitted to the input device AP via the proximity sensing electrode ASE. The auxiliary uplink signal ULSa can have a voltage level lower than that of the uplink signal ULS. However, embodiments according to the inventive concept are not limited to this. The auxiliary uplink signal ULSa can be the same signal as the uplink signal ULS.

[0143] The proximity sensing electrode ASE is set on the display device DD (in Figure 1B The border area BZA (shown in) Figure 1B (As shown in the diagram). A dead zone DS exists above the input sensor ISP, in which the uplink signal ULS transmitted via the proximity sensing electrode ASE is not provided or is provided weakly. The surface area of ​​the dead zone DS increases as the display device DD increases. When the input device AP is positioned within the dead zone DS, it becomes difficult for the input device AP to properly receive the uplink signal ULS transmitted via the proximity sensing electrode ASE.

[0144] Therefore, according to some embodiments of the inventive concept, the input sensor ISP can operate in a second drive mode MD2, such that the auxiliary uplink signal ULSa can be transmitted to the input device AP via the input sensor ISP. Specifically, in order to transmit the auxiliary uplink signal ULSa to the input device AP, the first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m of the input sensor ISP can be used as transmitting electrodes. That is, the first sensing electrodes SE1_1 to SE1_n and the second sensing electrodes SE2_1 to SE2_m of the input sensor ISP can receive the auxiliary uplink signal ULSa from the sensor controller 100 during the auxiliary uplink period ULPa. The auxiliary uplink period ULPa can be included in the second input sensing frame IF2.

[0145] The auxiliary uplink signal ULSa provided to the input sensor ISP can be a signal with a voltage level lower than that of the uplink signal ULS provided to the proximity sensing electrode ASE. When the auxiliary uplink signal ULSa is sent to the input device AP via the input sensor ISP, flickering can be seen on the display panel DP, which is arranged in a superimposed manner with the input sensor ISP. According to some embodiments of the inventive concept, the auxiliary uplink signal ULSa can have a sufficiently low voltage level so that flickering does not occur on the display panel DP. Therefore, degradation of the display quality of the display device DD can be prevented during the operation of sensing the proximity of the input device AP in the auxiliary uplink period ULPa.

[0146] The sensor controller 100 can receive an auxiliary acknowledgment signal ACKa from the input device AP via the input sensor ISP. Here, the sensor controller 100 can receive the auxiliary acknowledgment signal ACKa from the input device AP via the input sensor ISP as a response to the auxiliary uplink signal ULSa, and the period during which the auxiliary acknowledgment signal ACKa is received can be defined as the auxiliary acknowledgment period ACPa.

[0147] according to Figure 8C The auxiliary uplink period ULPa and the auxiliary acknowledgment period ACPa may not overlap with the uplink period ULP and the acknowledgment period ACP. However, embodiments according to the inventive concept are not limited to this. For example, the auxiliary uplink period ULPa and the auxiliary acknowledgment period ACPa may overlap with the uplink period ULP and the acknowledgment period ACP, respectively. That is, the auxiliary uplink signal ULSa is sent to the input device AP through the input sensor ISP, while the uplink signal ULS is sent to the input device AP through the proximity sensing electrode ASE. A delay period DEPa may also be positioned between the auxiliary uplink period ULPa and the auxiliary acknowledgment period ACPa.

[0148] As described above, by using the input sensor ISP to sense the proximity of the input device AP in the second drive mode MD2, the performance of sensing the proximity of the input device AP can be improved.

[0149] According to some embodiments of the inventive concept, the display device can transmit an uplink signal for sensing the proximity of the input device via a proximity sensing electrode, which is driven independently of the input sensor. Therefore, when the input sensor senses the first input and the second input respectively in a first driving mode and a second driving mode, the time allocated to sensing the proximity of the input device can be omitted, thereby preventing performance degradation of the sensing of the first and second inputs due to insufficient time.

[0150] Although embodiments of the inventive concept have been described herein, it is understood that various changes and modifications can be made by those skilled in the art within the spirit and scope of the inventive concept as defined by the claims or their equivalents. Therefore, the embodiments described herein are not intended to limit the technical spirit and scope of the invention, and all technical spirit within the scope of the claims or their equivalents will be construed as being included within the scope of the invention.

Claims

1. A display device, the display device comprising: The display panel is configured to display images; An input sensor is located on the display panel; Proximity sensing electrodes are arranged around the input sensor; as well as The sensor controller is connected to the input sensor and the proximity sensing electrode. The sensor controller is configured to drive the input sensor in a first driving mode during a first input sensing frame and in a second driving mode during a second input sensing frame. The sensor controller is also configured to provide an uplink signal to the proximity sensing electrode in response to the input sensor operating in the first drive mode or the second drive mode, and The uplink period overlaps with at least one of the first input sensing frame and the second input sensing frame, and the sensor controller sends the uplink signal to the input device through the proximity sensing electrode during the uplink period.

2. The display device according to claim 1, further comprising a window located on the input sensor and divided into a transmissive area and a border area. in, The proximity sensing electrode is located in the border area of ​​the window.

3. The display device according to claim 2, wherein, The proximity sensing electrode is located on the rear surface of the window, corresponding to the frame area.

4. The display device of claim 3, further comprising a cover layer located on the rear surface of the window to cover the proximity sensing electrode.

5. The display device according to claim 4, wherein, The proximity sensing electrode comprises a metallic material, and the covering layer comprises an insulating material.

6. The display device according to claim 5, wherein, The covering layer also includes a light-blocking material.

7. The display device of claim 4, further comprising a contact flexible circuit film configured to connect the sensor controller and the proximity sensing electrode. in, A contact portion exposing the proximity sensing electrode is disposed in the cover layer, and the contact flexible circuit film is connected to the proximity sensing electrode through the contact portion.

8. The display device according to claim 2, wherein, The proximity sensing electrode has a closed ring shape in the frame region of the window.

9. The display device according to claim 1, wherein, The input sensor includes: Multiple first sensing electrodes; and Multiple second sensing electrodes are electrically insulated from the multiple first sensing electrodes.

10. The display device according to claim 9, wherein, In the first driving mode, the plurality of first sensing electrodes are configured to serve as transmitting electrodes, and the plurality of second sensing electrodes are configured to serve as receiving electrodes. In the second driving mode, both the plurality of first sensing electrodes and the plurality of second sensing electrodes are configured to be used as transmitting electrodes or as receiving electrodes.

11. The display device according to claim 1, wherein, The second input sensing frame includes a downlink period, during which the input sensor operates in the second drive mode, and the sensor controller receives downlink signals from the input device via the input sensor during the downlink period.

12. The display device according to claim 1, wherein, The second input sensing frame includes an auxiliary uplink period during which the sensor controller sends an auxiliary uplink signal to the input device via the input sensor.

13. The display device according to claim 12, wherein, The auxiliary uplink signal has a voltage level different from that of the uplink signal.

14. The display device according to claim 11, wherein, The first driving mode is a mode in which a first input generated by the user's body is sensed, and The second driving mode is a mode in which a second input generated by the input device is sensed.

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