Array substrate and manufacturing method thereof, display panel, and display device

Abstract

The present application discloses an array substrate and a manufacturing method thereof, a display panel, and a display device, which belong to the field of display technology. The array substrate includes a base substrate, and a light-emitting unit, a first photoelectric sensing unit, a second photoelectric sensing unit, and a first circuit located on the base substrate. The first photoelectric sensing unit and the second photoelectric sensing unit are connected in parallel to the first circuit, the light-emitting unit is used to emit light to the side away from the base substrate, the first photoelectric sensing unit and the second photoelectric sensing unit are both used to generate an electrical signal based on the light from the side away from the base substrate, and transmit the electrical signal to the first circuit, the first circuit is used to connect to a fingerprint recognition chip, and transmit the received electrical signal to the fingerprint recognition chip. The present application solves the problem that the fingerprint recognition chip often fails to recognize fingerprints, and the present application is used for an array substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate and a manufacturing method thereof, a display panel, and a display device. Background Art

[0002] An array substrate of electronic products such as mobile phones and tablet computers generally has a display area for displaying images, and the display area has a fingerprint recognition function.

[0003] In related technologies, the display area includes multiple light-emitting units (such as sub-pixel units), multiple organic photodiode (OPD) units, and multiple OPD circuits. The OPD units are located between the light-emitting units, and the OPD units are connected to the OPD circuits one-to-one. The OPD circuits are connected to the fingerprint recognition chip. When a finger touches the display area, the light-emitting unit emits light. After the light is reflected by the finger and received by the OPD unit, the OPD unit generates an electrical signal based on the received light and transmits the electrical signal to the OPD circuit. The OPD circuit then transmits the electrical signal to the fingerprint recognition chip, which then performs fingerprint recognition based on the electrical signals sent by each OPD circuit.

[0004] It should be noted that the amount of electrical signals sent by the OPD circuit to the fingerprint recognition chip must reach a certain threshold before the fingerprint recognition chip can perform fingerprint recognition based on this electrical signal. However, the amount of electrical signals sent by the OPD circuit to the fingerprint recognition chip may not reach this threshold, so the fingerprint recognition chip often fails to perform fingerprint recognition. Summary of the Invention

[0005] This application provides an array substrate and a manufacturing method thereof, a display panel, and a display device, which can solve the problem that fingerprint recognition chips often fail to perform fingerprint recognition. The technical solution is as follows:

[0006] In a first aspect, an array substrate is provided, comprising: a base substrate, and a light-emitting unit, a first photoelectric sensor unit, a second photoelectric sensor unit, and a first circuit located on the base substrate; the first photoelectric sensor unit and the second photoelectric sensor unit are connected in parallel to the first circuit;

[0007] The light emitting unit is used to emit light toward a side away from the substrate;

[0008] The first photoelectric sensing unit and the second photoelectric sensing unit are both used to generate an electrical signal according to light from a side away from the substrate, and transmit the electrical signal to the first circuit;

[0009] The first circuit is used to connect to a fingerprint recognition chip and transmit the received electrical signal to the fingerprint recognition chip.

[0010] Optionally, each of the first photoelectric sensing unit and the second photoelectric sensing unit comprises: a first electrode, a photoelectric sensing layer, and a second electrode sequentially arranged in a direction away from the substrate;

[0011] The first electrode of the first photoelectric sensing unit is connected to the first circuit;

[0012] The first electrode of the second photoelectric sensing unit is connected to the first circuit through the first electrode of the first photoelectric sensing unit.

[0013] Optionally, the array substrate further comprises: a connecting electrode located on the base substrate;

[0014] The first electrode of the second photoelectric sensing unit is connected to the first electrode of the first photoelectric sensing unit through the connecting electrode; the first electrode and the connecting electrode are in the same layer structure.

[0015] Optionally, the light emitting unit comprises: a third electrode, an electroluminescent layer and a fourth electrode arranged in sequence in a direction away from the base substrate;

[0016] The second electrode and the fourth electrode are connected to form a common electrode; an orthographic projection of the connecting electrode on the base substrate and an orthographic projection of the common electrode on the base substrate have an overlapping area.

[0017] Optionally, each of the first photoelectric sensing unit and the second photoelectric sensing unit includes: a first electrode, a photoelectric sensing layer, and a second electrode sequentially arranged in a direction away from the substrate;

[0018] The first electrode of the first photoelectric sensing unit is connected to the first circuit;

[0019] The array substrate further includes: a second circuit located on the base substrate; and the first electrode of the second photoelectric sensing unit is connected to the first circuit via the second circuit.

[0020] Optionally, the second circuit includes: a first connecting portion located on the base substrate, the first photoelectric sensing unit and the second photoelectric sensing unit are connected in parallel to the second connecting portion in the first circuit; the first connecting portion and the second connecting portion are in the same layer structure.

[0021] Optionally, the first circuit includes: a thin film transistor TFT, the TFT includes: a gate, an active layer, a fifth electrode and a sixth electrode, the first photoelectric sensing unit and the second photoelectric sensing unit are connected in parallel to the fifth electrode or the active layer, and the sixth electrode is used to connect to a fingerprint recognition chip.

[0022] Optionally, each of the first photoelectric sensing unit and the second photoelectric sensing unit includes: a first electrode, a first injection layer, a first transmission layer, a photoelectric sensing layer, a second transmission layer, a second injection layer, and a second electrode, which are sequentially arranged in a direction away from the substrate;

[0023] The light emitting unit comprises: a third electrode, a third injection layer, a third transmission layer, an electroluminescent layer, a fourth transmission layer, a fourth injection layer and a fourth electrode arranged in sequence in a direction away from the base substrate;

[0024] The array substrate satisfies at least one of the following conditions: the electroluminescent layer and the photoelectric sensing layer are in the same layer structure; the first injection layer and the third injection layer are in the same layer structure; the first transmission layer and the third transmission layer are in the same layer structure; the second transmission layer and the fourth transmission layer are in the same layer structure; and the second injection layer and the fourth injection layer are in the same layer structure.

[0025] Optionally, the photoelectric sensing unit is an organic photodiode OPD unit.

[0026] In a second aspect, a display panel is provided, comprising: an array substrate as described in any one of the first aspects.

[0027] In a third aspect, a display device is provided, comprising: the display panel described in the second aspect, and a fingerprint recognition chip; the fingerprint recognition chip is connected to a first circuit in the display panel, and is used to perform fingerprint recognition based on an electrical signal transmitted by the first circuit.

[0028] Optionally, the display device further includes at least one of a touch layer and a color filter layer.

[0029] In a fourth aspect, a method for manufacturing an array substrate is provided, wherein the method is used to manufacture the array substrate according to any one of the first aspects, and the method comprises:

[0030] providing a substrate;

[0031] forming a fingerprint recognition device on the substrate, the fingerprint recognition device comprising: a light emitting unit, a first photoelectric sensing unit, a second photoelectric sensing unit and a first circuit;

[0032] Among them, the first photoelectric sensing unit and the second photoelectric sensing unit are connected in parallel to the first circuit; the light-emitting unit is used to emit light toward the side away from the substrate; the first photoelectric sensing unit and the second photoelectric sensing unit are both used to generate electrical signals based on light from the side away from the substrate, and transmit the electrical signals to the first circuit; the first circuit is used to connect to the fingerprint recognition chip, and transmit the received electrical signals to the fingerprint recognition chip.

[0033] Optionally, the fingerprint recognition device further includes a connecting electrode, and the fingerprint recognition device is formed on the substrate, including:

[0034] forming the first circuit on the base substrate;

[0035] forming a connection pattern on the base substrate on which the first circuit is formed, the connection pattern including: a first electrode of the first photoelectric sensing unit, a first electrode of the second photoelectric sensing unit, and a connection electrode, wherein the first electrode of the first photoelectric sensing unit is connected to the first circuit; and the first electrode of the second photoelectric sensing unit is connected to the first electrode of the first photoelectric sensing unit via the connection electrode;

[0036] forming other structures on the base substrate having the connection pattern formed thereon, the other structures including: structures other than the first electrode in the first photoelectric sensing unit, and structures other than the first electrode in the second photoelectric sensing unit; each of the first photoelectric sensing unit and the second photoelectric sensing unit including: a first electrode, a photoelectric sensing layer, and a second electrode sequentially arranged in a direction away from the base substrate;

[0037] The light emitting unit is formed on the base substrate.

[0038] Optionally, the fingerprint recognition device further includes a first connecting portion, and the fingerprint recognition device is formed on the base substrate, including:

[0039] forming the first circuit and the first connecting portion on the base substrate, wherein the first circuit includes a second connecting portion, the first connecting portion and the second connecting portion are in the same layer structure, and the first connecting portion is connected to the second connecting portion;

[0040] The first photoelectric sensing unit and the second photoelectric sensing unit are formed on the base substrate having the first circuit and the first connecting portion formed thereon; each of the first photoelectric sensing unit and the second photoelectric sensing unit comprises: a first electrode, a photoelectric sensing layer, and a second electrode sequentially arranged in a direction away from the base substrate; the first electrode of the first photoelectric sensing unit is connected to the second connecting portion; and the first electrode of the second photoelectric sensing unit is connected to the first connecting portion;

[0041] The light emitting unit is formed on the base substrate.

[0042] In summary, because the first circuit in the array substrate provided by the embodiments of the present application can receive electrical signals generated by multiple photoelectric sensing units, the amount of these electrical signals is relatively large, and the amount of electrical signals sent by the first circuit to the fingerprint recognition chip is also relatively large. Therefore, the fingerprint recognition chip can accurately identify the valleys and ridges of a fingerprint, and the fingerprint recognition chip has a higher success rate in fingerprint recognition. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0044] Figure 1 This is a cross-sectional schematic diagram of a display area of an array substrate provided by related technology;

[0045] Figure 2 It is a cross-sectional schematic diagram of another array substrate provided by the related art;

[0046] Figure 3 This is a structural diagram of an array substrate provided by related technology;

[0047] Figure 4 This is a schematic structural diagram of an array substrate provided in an embodiment of the present application;

[0048] Figure 5 is a structural schematic diagram of another array substrate provided in an embodiment of the present application;

[0049] Figure 6 is a structural schematic diagram of another array substrate provided in an embodiment of the present application;

[0050] Figure 7 is a cross-sectional schematic diagram of an array substrate provided in an embodiment of the present application;

[0051] Figure 8is a cross-sectional schematic diagram of another array substrate provided in an embodiment of the present application;

[0052] Figure 9 is a cross-sectional schematic diagram of another array substrate provided in an embodiment of the present application;

[0053] Figure 10 is a top view of an array substrate provided in an embodiment of the present application;

[0054] Figure 11 is a cross-sectional schematic diagram of another array substrate provided in an embodiment of the present application;

[0055] Figure 12 is a flow chart of a method for manufacturing an array substrate provided in an embodiment of the present application;

[0056] Figure 13 is a flow chart of another method for manufacturing an array substrate provided in an embodiment of the present application;

[0057] Figure 14 This is a schematic diagram of a manufacturing process of an array substrate provided in an embodiment of the present application;

[0058] Figure 15 is a schematic diagram of a manufacturing process of another array substrate provided in an embodiment of the present application;

[0059] Figure 16 is a flow chart of another method for manufacturing an array substrate provided in an embodiment of the present application;

[0060] Figure 17 This is a schematic diagram of the manufacturing process of another array substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0061] In order to make the principles, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0062] The array substrate of the display device has a display area for displaying images, and the display area has a fingerprint recognition function.

[0063] For example, Figure 1 This is a cross-sectional schematic diagram of the display area of an array substrate (also called a backplane) provided by the related art, such as Figure 1 As shown, the display area of the array substrate includes: a base substrate 01, and a plurality of OPD circuits 02 ( Figure 1 Only one OPD circuit is shown), multiple OPD units 03 ( Figure 1 Only one OPD unit is shown), multiple drive circuits 04 ( Figure 1 Only one driving circuit is shown), multiple sub-pixel units 05 ( Figure 1 Only one sub-pixel unit is shown in the figure). In addition, the display area of the array substrate also includes some insulating layers, inter-level dielectric (ILD) layers, planarization (PLN) layers, pixel definition layers (PDL) and other film layers. Figure 1 Not marked in.

[0064] The OPD circuit 02 is connected to the OPD unit 03 in a one-to-one correspondence. The OPD circuit 02 is also used to connect to the fingerprint recognition chip ( Figure 1 (not shown). For example, Figure 2 and Figure 3 As shown, two OPD circuits 02 are connected to two OPD units 03 in a one-to-one correspondence, and each OPD circuit 02 is connected to a fingerprint recognition chip. A driving circuit 04 is connected to a sub-pixel unit 05 in a one-to-one correspondence, and is used to drive the sub-pixel unit 05 to emit light.

[0065] When a finger touches the display area, the sub-pixel unit 05 emits light. The light is reflected by the finger and received by the OPD unit 03. The OPD unit 03 generates an electrical signal based on the received light and transmits the electrical signal to the OPD circuit 02. The OPD circuit 02 then transmits the electrical signal to the fingerprint recognition chip, which then performs fingerprint recognition based on the electrical signals sent by each OPD circuit 02.

[0066] It should be noted that the electrical signal volume sent by the OPD circuit 02 to the fingerprint recognition chip must reach a certain threshold to ensure that the ridge-to-valley voltage difference of the fingerprint is ≥30 millivolts, allowing the fingerprint recognition chip to perform fingerprint recognition based on this electrical signal. However, the electrical signal volume sent by the OPD circuit 02 to the fingerprint recognition chip may not reach this threshold, resulting in the fingerprint recognition chip often being unable to perform fingerprint recognition.

[0067] An embodiment of the present application provides an array substrate, in which the amount of electrical signals sent by the OPD circuit to the fingerprint recognition chip can be increased.

[0068] For example, Figure 4 is a structural diagram of an array substrate provided in an embodiment of the present application, such as Figure 4 As shown, the array substrate includes: a base substrate ( Figure 4 ), and a light emitting unit ( Figure 4 ), a first photoelectric sensing unit 11, a second photoelectric sensing unit 12 and a first circuit 13, and the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12 are connected to the first circuit 13 in parallel.

[0069] Furthermore, the light-emitting unit is configured to emit light toward a side away from the substrate. The first photoelectric sensing unit 11 and the second photoelectric sensing unit 12 are each configured to generate an electrical signal based on light emitted from a side away from the substrate, and transmit the electrical signal to the first circuit 13. The first circuit 13 is configured to connect to the fingerprint recognition chip and transmit the received electrical signal to the fingerprint recognition chip.

[0070] It should be noted that since the first photoelectric sensor unit 11 and the second photoelectric sensor unit 12 are connected in parallel to the first circuit 13, the electrical signals generated by the first photoelectric sensor unit 11 and the second photoelectric sensor unit 12 are both transmitted to the first circuit 13. Therefore, the first circuit 13 receives electrical signals generated by multiple photoelectric sensor units, and the amount of electrical signals sent by the first circuit 13 to the fingerprint recognition chip is relatively large.

[0071] In summary, because the first circuit in the array substrate provided by the embodiments of the present application can receive electrical signals generated by multiple photoelectric sensing units, the amount of these electrical signals is relatively large, and the amount of electrical signals sent by the first circuit to the fingerprint recognition chip is also relatively large. Therefore, the fingerprint recognition chip can accurately identify the valleys and ridges of a fingerprint, and the fingerprint recognition chip has a higher success rate in fingerprint recognition.

[0072] In addition, the embodiment of the present application does not require changing the orthographic projection area of the photoelectric sensing unit on the base substrate. Therefore, the aperture ratio of the sub-pixel unit in the array substrate will not be affected, the pixel density unit (Pixels Per Inch, PPI) of the sub-pixel unit will not be affected, and the display effect (such as brightness) and life of the display device where the array substrate is located will not be affected.

[0073] In the embodiment of the present application, two photoelectric sensor units (a first photoelectric sensor unit 11 and a second photoelectric sensor unit 12) are connected in parallel to the first circuit 13. Alternatively, more than two (such as three or four) photoelectric sensor units may be connected in parallel to the first circuit 13. In addition, to ensure that fingerprint recognition can be achieved, the number of first circuits 13 in the array substrate needs to be relatively large.

[0074] Optionally, the photoelectric sensing unit (such as the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12) here can be an OPD unit, the above-mentioned first circuit 13 can be an OPD circuit, and the light-emitting unit can be a sub-pixel unit, such as an organic light-emitting diode (OLED) sub-pixel unit. The OPD circuit may include at least one thin film transistor (TFT), or at least one TFT and at least one capacitor. It should be noted that the photoelectric sensing unit may not be an OPD unit, the first circuit 13 may not be an OPD circuit, and the light-emitting unit may not be an OLED sub-pixel unit, and the embodiments of the present application do not limit this.

[0075] For example, when the photoelectric sensing unit is an OPD unit and the first circuit 13 includes a TFT, as shown in FIG. Figure 5 As shown, the OPD unit includes a capacitor and a diode, and the TFT includes: a gate 131, an active layer ( Figure 5 The fifth electrode 132 and the sixth electrode 133 are connected to the TFT. The capacitor and the diode are connected in parallel to the fifth electrode 132 of the TFT, and the sixth electrode 133 of the TFT is used to connect to the fingerprint recognition chip.

[0076] Furthermore, if Figure 6 As shown, the array substrate includes: a plurality of gate lines G and a plurality of data lines S located on a base substrate 14, a plurality of sub-pixel units X arranged in an array, and a plurality of photoelectric sensing units O arranged in an array. Each row of sub-pixel units X is connected to a gate line G, and each column of sub-pixel units X is connected to a data line S ( Figure 6 The data line S connected to the sub-pixel unit X is not shown in the figure. Each row of photoelectric sensor units O is connected to a gate line G, and each column of photoelectric sensor units O is connected to a data line. In addition, multiple sub-pixel units X and multiple photoelectric sensor units O form multiple pixel units arranged in an array. Each pixel unit includes: n sub-pixel units X and one photoelectric sensor unit O, n ≥ 1. Figure 6 Take n=3 as an example. Figure 6 In the embodiment, the gate electrode 131 of the TFT in the first circuit 13 is connected to the gate line G, and the sixth electrode 133 of the TFT in the first circuit 13 can be connected to the fingerprint recognition chip through the data line S.

[0077] In related art, OPD units are connected to OPD circuits in a one-to-one correspondence. In the embodiment of the present application, the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12 are connected to a corresponding circuit (first circuit 13). In this case, the array substrate does not need to include two circuits corresponding to the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12 at the same time, but only needs to include one first circuit 13. Therefore, the number of circuits that need to be formed on the base substrate is reduced, the process window (Margin) on the base substrate is increased, and the process yield of the array substrate is improved.

[0078] Optionally, the array substrate may further include another circuit (different from the first circuit 13) corresponding to the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12, but the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12 are not connected to the other circuit, and this embodiment of the application is not limited to this.

[0079] Furthermore, there are various ways to connect the first photoelectric sensor unit 11 and the second photoelectric sensor unit 12 in parallel to the first circuit 13 , and two optional parallel connection ways will be taken as examples for explanation below.

[0080] Method (1), such as Figure 7 As shown, each of the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12 includes: a first electrode 21, a photoelectric sensing layer 22, and a second electrode 23 arranged in sequence in a direction away from the base substrate 14. In addition, the first electrode 21 of the first photoelectric sensing unit 11 is connected to the first circuit 13, and the first electrode 21 of the second photoelectric sensing unit 12 is connected to the first circuit 13 through the first electrode 21 of the first photoelectric sensing unit 11.

[0081] It can be seen that in mode (1), the first electrodes 21 of the first photoelectric sensor unit 11 and the second photoelectric sensor unit 12 are connected, and the first electrode 21 of one of the photoelectric sensor units is connected to the first circuit 13, so that the two photoelectric sensor units are connected in parallel to the first circuit 13.

[0082] Optionally, please continue to refer to Figure 7 The array substrate further includes a connecting electrode 15 located on the base substrate 14. The first electrode 21 of the second photoelectric sensing unit 12 is connected to the first electrode 21 of the first photoelectric sensing unit 11 via the connecting electrode 15. The first electrodes 21 (the first electrode 21 in the first photoelectric sensing unit 11 and the first electrode 21 in the second photoelectric sensing unit 12) and the connecting electrode 15 are co-layered.

[0083] In other words, the first electrode 21 of the second photoelectric sensing unit 12 is connected to the first electrode 21 of the first photoelectric sensing unit 11 via the connecting electrode 15. Alternatively, the first electrode 21 of the second photoelectric sensing unit 12 may also be directly connected to the first electrode 21 of the first photoelectric sensing unit 11, which is not limited in this embodiment of the present application.

[0084] In the above scheme, the first electrode 21 and the connecting electrode 15 are co-layer structures. It should be noted that the two structures mentioned in the embodiments of the present application as co-layer structures mean that the two structures are formed by the same thin film through a patterning process. For example, when the first electrode 21 and the connecting electrode 15 are co-layer structures, the material of the first electrode 21 and the connecting electrode 15 can both be metal. Therefore, the first electrode 21 and the connecting electrode 15 can be formed by the same metal layer through a patterning process.

[0085] When the first electrode 21 and the connecting electrode 15 are in the same layer structure, the connecting electrode 15 can be manufactured at the same time as the first electrode 21 is manufactured, thereby reducing the complexity of the manufacturing process of the array substrate.

[0086] In the embodiment of the present application, the array substrate includes the connecting electrode 15 as an example. Optionally, the array substrate may not include the connecting electrode 15. In this case, the first electrode 21 in the first photoelectric sensing unit 11 may be directly connected to the first electrode 21 in the second photoelectric sensing unit 12.

[0087] Furthermore, the light-emitting unit may include a third electrode, an electroluminescence (EL) layer, and a fourth electrode arranged sequentially in a direction away from the base substrate 14. The second electrode 23 in the photoelectric sensing unit (the second electrode 23 in the first photoelectric sensing unit 11 and the second electrode 23 in the second photoelectric sensing unit 12) and the fourth electrode in the light-emitting unit are connected to form a common electrode. The orthographic projection of the connecting electrode 15 on the base substrate 14 overlaps with the orthographic projection of the common electrode on the base substrate 14.

[0088] A capacitor is formed between the first electrode 21 and the second electrode 23 in the photoelectric sensor unit. The amount of the electrical signal generated by the photoelectric sensor unit in response to the received light is positively correlated with the size of this capacitance. When the orthographic projection of the connecting electrode 15 on the base substrate 14 overlaps with the orthographic projection of the common electrode on the base substrate 14, this capacitance increases. At this time, the amount of the electrical signal generated by the first photoelectric sensor unit 11 and the second photoelectric sensor unit 12 in response to the received light increases, further improving the fingerprint recognition chip's success rate in fingerprint recognition.

[0089] It should be noted that the common electrode may be a whole-surface electrode or may not be a whole-surface electrode. For example, the common electrode may be a network-shaped electrode.

[0090] In the embodiment of the present application, the second electrode 23 and the fourth electrode are connected to form a common electrode, and the orthographic projection of the connecting electrode 15 on the base substrate 14 overlaps with the orthographic projection of the common electrode on the base substrate 14. Alternatively, the second electrode 23 and the fourth electrode may not be connected to form a common electrode, and the orthographic projection of the connecting electrode 15 on the base substrate 14 may not overlap with the orthographic projection of the common electrode on the base substrate 14. This embodiment of the present application is not limited to this.

[0091] Method (2), such as Figure 8 As shown, each of the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12 includes a first electrode 21, a photoelectric sensing layer 22, and a second electrode 23 arranged in sequence in a direction away from the base substrate 14. The first electrode 21 of the first photoelectric sensing unit 11 is connected to the first circuit 13. The array substrate further includes a second circuit 16 located on the base substrate 14. The first electrode 21 of the second photoelectric sensing unit 12 is connected to the first circuit 13 via the second circuit 16.

[0092] It can be seen that in the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12 in method (2), the first electrode 21 of one photoelectric sensing unit is connected to the first circuit 13, and the first electrode 21 of the other photoelectric sensing unit is connected to the first circuit 13 through the second circuit 16, so that the two photoelectric sensing units are connected in parallel to the first circuit 13.

[0093] Please continue to refer to Figure 8 , the second circuit 16 may include: a first connection portion 161 located on the base substrate 14, the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12 are connected in parallel to the second connection portion in the first circuit 13, and the first connection portion 161 and the second connection portion are in the same layer structure. For example, when the first circuit 13 includes a TFT, the TFT includes a gate 131, an active layer 134, a fifth electrode 132 and a sixth electrode 133, and the second connection portion in the first circuit 13 may be the fifth electrode 132 in the TFT. For another example, the first connection portion 151 and the second connection portion may not be as shown. Figure 8 For example, please refer to Figure 9 When the first circuit 13 includes a TFT, the second connection portion in the first circuit 13 can be the active layer 134 in the TFT. In this case, the first connection portion 161 and the active layer 134 are co-layered. It is understood that the second connection portion can be any structure in the first circuit that can connect the first photoelectric sensor unit 11 and the second photoelectric sensor unit 12 in parallel, and this embodiment of the application is not limited to this.

[0094] When the first connection portion 161 and the second connection portion are in the same layer structure, the first connection portion 161 can be manufactured while the second connection portion is manufactured, thereby reducing the complexity of the manufacturing process of the array substrate.

[0095] In the embodiment of the present application, the second circuit 16 includes the first connecting portion 161 as an example. Optionally, the second circuit 16 may not include the first connecting portion 161, but may have other implementation methods. For example, the second circuit 16 includes at least one TFT, or at least one TFT and at least one capacitor. The embodiment of the present application is not limited to this.

[0096] The array substrate provided in the embodiment of the present application may include a plurality of light-emitting units and a plurality of photoelectric sensing units (such as the first photoelectric sensing unit 11 and the second photoelectric sensing unit 12 described above). The plurality of photoelectric sensing units and the plurality of light-emitting units are both located on the base substrate 14, and the photoelectric sensing units are located between the plurality of light-emitting units.

[0097] For example, Figure 10 A top view of an array substrate provided in an embodiment of the present application is shown. Figure 7 、 Figure 8 and Figure 9 All show Figure 10 Schematic diagram of the middle section AA'. Figure 10 As shown, the array substrate includes a plurality of light-emitting units and a plurality of photoelectric sensing units O. The light-emitting units are sub-pixel units, and the plurality of light-emitting units include: a red sub-pixel unit R for emitting red light, a green sub-pixel unit G for emitting green light, and a blue sub-pixel unit B for emitting blue light.

[0098] In addition, the array substrate further includes a PDL, which is used to define a plurality of sub-pixel regions. Each of the above-mentioned light-emitting units (red sub-pixel unit R, green sub-pixel unit G, and blue sub-pixel unit B) and photoelectric sensing units O can be located in a sub-pixel region.

[0099] It should be noted that, in the embodiment of the present application, the arrangement of the light emitting unit and the photoelectric sensing unit is as follows: Figure 10 As shown in the figure, the pixel unit composed of the sub-pixel units in the array substrate includes: two green sub-pixel units G, one red sub-pixel unit R, and one blue sub-pixel unit B. In this case, the pixel unit can be expressed as GGRB. Optionally, the arrangement of the light-emitting unit and the photoelectric sensing unit can also be the same as Figure 10 The arrangement shown is different, and the pixel unit may not be GGRB, such as RGB, etc., which is not limited in the embodiment of the present application.

[0100] Furthermore, in the array substrate provided in the embodiments of the present application, the light-emitting unit may be an OLED sub-pixel unit. In this case, the light-emitting unit may include: a third electrode, an EL layer, and a fourth electrode arranged sequentially in a direction away from the base substrate 14. The EL layer and the photoelectric sensing layer in the photoelectric sensing unit may be co-layered. When the EL layer and the photoelectric sensing layer are co-layered, the photoelectric sensing layer can be manufactured simultaneously with the EL layer, thereby reducing the complexity of the array substrate manufacturing process.

[0101] Furthermore, each photoelectric sensing unit in the array substrate further comprises: a first injection layer, a first transmission layer, a second transmission layer, and a second injection layer; in each photoelectric sensing unit, the first electrode, the first injection layer, the first transmission layer, the photoelectric sensing layer, the second transmission layer, the second injection layer, and the second electrode are sequentially arranged in a direction away from the base substrate. The light-emitting unit further comprises: a third injection layer, a third transmission layer, a fourth transmission layer, and a fourth injection layer; the third electrode, the third injection layer, the third transmission layer, the EL layer, the fourth transmission layer, the fourth injection layer, and the fourth electrode are sequentially arranged in a direction away from the base substrate.

[0102] In this case, the array substrate satisfies at least one of the following conditions: the first injection layer and the third injection layer are co-layered; the first transmission layer and the third transmission layer are co-layered; the second transmission layer and the fourth transmission layer are co-layered; and the second injection layer and the fourth injection layer are co-layered. In the embodiments of the present application, the simultaneous satisfaction of these conditions is taken as an example. Optionally, the EL layer and the photoelectric sensing layer may not be co-layered; the first injection layer and the third injection layer may not be co-layered; the first transmission layer and the third transmission layer may not be co-layered; the second transmission layer and the fourth transmission layer may not be co-layered; and the second injection layer and the fourth injection layer may not be co-layered.

[0103] When the first injection layer and the third injection layer are co-layered, they form a common layer. The first injection layer can be manufactured simultaneously with the third injection layer, thereby reducing the complexity of the array substrate manufacturing process. When the first transfer layer and the third transfer layer are co-layered, they form a common layer. The first transfer layer can be manufactured simultaneously with the third transfer layer, thereby reducing the complexity of the array substrate manufacturing process. When the second injection layer and the fourth injection layer are co-layered, they form a common layer. The second injection layer can be manufactured simultaneously with the fourth injection layer, thereby reducing the complexity of the array substrate manufacturing process. When the second transfer layer and the fourth transfer layer are co-layered, they form a common layer. The second transfer layer can be manufactured simultaneously with the fourth transfer layer, thereby reducing the complexity of the array substrate manufacturing process.

[0104] For example, Figure 11 As shown, each photoelectric sensing unit in the array substrate ( Figure 11 The first photoelectric sensing unit 11 is taken as an example, and includes: a first electrode 21, a first injection layer 24, a first transmission layer 25, a photoelectric sensing layer 22, a second transmission layer 26, a second injection layer 27 and a second electrode 23 arranged in sequence along a direction away from the base substrate 14.

[0105] The light emitting unit 17 includes a third electrode 171 , a third injection layer 172 , a third transport layer 173 , an EL layer 174 , a fourth transport layer 175 , a fourth injection layer 176 and a fourth electrode 177 , which are sequentially arranged in a direction away from the substrate.

[0106] The first injection layer 24 and the third injection layer 172 are in the same layer structure; the first transmission layer 25 and the third transmission layer 173 are in the same layer structure; the second transmission layer 26 and the fourth transmission layer 175 are in the same layer structure; and the second injection layer 27 and the fourth injection layer 176 are in the same layer structure.

[0107] Also, please continue to refer to Figure 11 The array substrate further includes a driving circuit 18 connected to the light-emitting unit 17. The structure of the driving circuit 18 can be the same as or similar to that of the first circuit 13. Furthermore, when the structure of the driving circuit 18 is the same as that of the first circuit 13, the film layer in the driving circuit 18 can be the same layer structure as the film layer in the first circuit 13.

[0108] It should be noted that Figure 11 Only the first photoelectric sensing unit 11 is shown in FIG. 1 , and the second photoelectric sensing unit 12 is not shown. It is understood that the structure of the second photoelectric sensing unit 12 can be as follows: Figure 7 、 Figure 8 or Figure 9 shown.

[0109] In addition, the array substrate provided in the embodiment of the present application may also include other structures. For example, the array substrate may also include some insulating layers, interlayer dielectric layers, planar layers, pixel defining layers, thin-film encapsulation (TFE) layers and other film layers.

[0110] For example, the first circuit includes a TFT, and an insulating layer may be placed between the gate and active layer of the TFT; an ILD layer may be placed between the gate and source and drain electrodes (including the fifth electrode and the sixth electrode) of the TFT. A PLN layer may be placed between the source and drain electrodes of the TFT and the photoelectric sensing unit. A PDL may be provided on the PLN layer, and the PDL is used to define multiple sub-pixel regions. Each of the light-emitting unit and the photoelectric sensing unit may be located within a sub-pixel region. The light-emitting unit, the photoelectric sensing unit, and the PDL may be covered with a TFE layer on the side away from the substrate.

[0111] In summary, because the first circuit in the array substrate provided by the embodiments of the present application can receive electrical signals generated by multiple photoelectric sensing units, the amount of these electrical signals is relatively large, and the amount of electrical signals sent by the first circuit to the fingerprint recognition chip is also relatively large. Therefore, the fingerprint recognition chip can accurately identify the valleys and ridges of a fingerprint, and the fingerprint recognition chip has a higher success rate in fingerprint recognition.

[0112] In addition, experiments were conducted in the embodiments of the present application. In the same lighting scene, when the amount of electrical signal (current) generated by a photoelectric sensor unit is 8.82E-9 (the product of 10 to the power of -9 and 8.82), the amount of electrical signal generated by 100 photoelectric sensor units is 8.82E-7 (the product of 10 to the power of -7 and 8.82). When the amount of electrical signal generated by a photoelectric sensor unit is 1.12E-10 (the product of 10 to the power of -10 and 1.12), the amount of electrical signal generated by 10,000 photoelectric sensor units is 1.12E-6 (the product of 10 to the power of -6 and 1.12). It can be seen that the more photoelectric sensor units there are, the more electrical signals they generate.

[0113] In the embodiment of the present application, the first photoelectric sensor unit and the second photoelectric sensor unit are connected in parallel to the first circuit. In this way, the first circuit receives the electrical signals generated by the first and second photoelectric sensor units. The electrical signals generated by the first and second photoelectric sensor units are greater than the electrical signal generated by a single photoelectric sensor unit. Therefore, the amount of electrical signals received by the first circuit increases, and the amount of electrical signals sent by the first circuit to the fingerprint recognition chip also increases.

[0114] Based on the array substrate provided in the embodiment of the present application, the embodiment of the present application further provides a display panel, which includes any array substrate provided in the embodiment of the present application (such as Figures 4 to 11 Any array substrate shown in FIG. 1 ). The display panel may be any display panel, such as a liquid crystal panel, an OLED panel, a light-emitting diode (LED) panel, and the like.

[0115] Based on the display panel provided in the embodiments of the present application, the embodiments of the present application further provide a display device, which includes: any display panel provided in the embodiments of the present application, and the above-mentioned fingerprint recognition chip.

[0116] The fingerprint recognition chip is connected to the first circuit in the display panel, and is used to receive the electrical signal transmitted by the first circuit and perform fingerprint recognition based on the electrical signal. Optionally, the fingerprint recognition chip can also be connected to the light-emitting unit in the display panel (for example, when the light-emitting unit is a sub-pixel unit, the fingerprint recognition chip is connected to the light-emitting unit through a driving circuit), and the fingerprint recognition chip can also be used to control the light-emitting unit to emit light.

[0117] The display device provided in this application can be any product or component with a display function, such as electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, etc.

[0118] Furthermore, the display device provided in the embodiments of the present application further includes: at least one of a touch layer (e.g., a Flexible Multi-Layer On Cell (FMLOC) touch layer) and a color filter layer (e.g., a color filter on encapsulation (COE)). The black matrix (BM) in the color filter layer can be made of a black low-reflectivity material (e.g., molybdenum oxide) to provide light shielding and collimation.

[0119] When a display device includes a touch layer, the display device not only has a display function but also a touch function. In this case, the touch layer can be located on the display side of the array substrate. When the display device includes a color filter layer, the color filter layer can filter the light from the array substrate to enhance the display effect of the display device. In addition, when the display device includes a touch layer and a color filter layer, the color filter layer and the touch layer are arranged sequentially in a direction away from the array substrate.

[0120] In summary, because the first circuit in the array substrate of the display device provided by the embodiments of the present application can receive electrical signals generated by multiple photoelectric sensing units, the amount of these electrical signals is relatively large, and the amount of electrical signals sent by the first circuit to the fingerprint recognition chip is also relatively large. Therefore, the fingerprint recognition chip can accurately identify the valleys and ridges of the fingerprint, and the fingerprint recognition chip has a high success rate in fingerprint recognition.

[0121] Based on the array substrate provided in the embodiment of the present application, the embodiment of the present application further provides a method for manufacturing an array substrate, which is used to manufacture any array substrate provided in the embodiment of the present application (such as Figures 4 to 11 any of the array substrates shown).

[0122] For example, Figure 12As shown, the manufacturing method of the array substrate includes:

[0123] Step 1101: Provide a substrate.

[0124] Step 1102: forming a fingerprint recognition device on a base substrate, the fingerprint recognition device including: a light emitting unit, a first photoelectric sensing unit, a second photoelectric sensing unit and a first circuit.

[0125] Among them, the first photoelectric sensing unit and the second photoelectric sensing unit are connected in parallel to the first circuit; the light-emitting unit is used to emit light toward the side away from the substrate; the first photoelectric sensing unit and the second photoelectric sensing unit are both used to generate electrical signals based on light from the side away from the substrate, and transmit the electrical signals to the first circuit; the first circuit is used to connect to the fingerprint recognition chip, and transmit the received electrical signals to the fingerprint recognition chip.

[0126] In summary, in the array substrate manufactured using the method provided in the embodiments of the present application, the first circuit can receive electrical signals generated by multiple photoelectric sensing units. Therefore, the amount of these electrical signals is relatively large, and the amount of electrical signals sent by the first circuit to the fingerprint recognition chip is also relatively large. Therefore, the fingerprint recognition chip can accurately identify the valleys and ridges of a fingerprint, and the fingerprint recognition chip has a high success rate in fingerprint recognition.

[0127] Furthermore, there are multiple implementations of step 1102, and the embodiments of the present application will be explained using two optional implementations as examples.

[0128] (1) In a first optional implementation of step 1102, the method can be used to prepare Figure 7 At this time, the fingerprint recognition device further includes connecting electrodes. For example, Figure 13 As shown, step 1102 includes:

[0129] Step 11021a: forming a first circuit on the base substrate.

[0130] like Figure 14 As shown, in step 11021a, a first circuit 13 may be formed on a base substrate 14. In the embodiment of the present application, the first circuit 13 includes a TFT, and the TFT includes a gate 131, a fifth electrode 132, and a sixth electrode 133 as an example.

[0131] When forming the TFT on the base substrate 14, the active layer ( Figure 14 Not marked), gate insulating layer ( Figure 14 Not marked), gate 131, ILD layer ( Figure 14 not marked in the figure) and source and drain (including the fifth electrode 132 and the sixth electrode 133).

[0132] Step 11022a: forming a connection pattern on the base substrate on which the first circuit is formed, the connection pattern including: a first electrode of the first photoelectric sensing unit, a first electrode of the second photoelectric sensing unit, and a connection electrode, wherein the first electrode of the first photoelectric sensing unit is connected to the first circuit; and the first electrode of the second photoelectric sensing unit is connected to the first electrode of the first photoelectric sensing unit via the connection electrode.

[0133] After forming the first circuit 13, the connection pattern can be formed on the base substrate 14 having the first circuit 13 formed thereon. For example, an insulating layer can be first formed on the base substrate 14 having the first circuit 13 formed thereon, and then a conductive material layer (e.g., a metal material layer) can be formed on the insulating layer. The conductive material layer can then be processed using a single patterning process to obtain the connection pattern.

[0134] For example, a conductive material layer can be formed on the insulating layer by coating, physical vapor deposition (PVD), or chemical vapor deposition (CVD) to obtain a conductive material layer. PVD includes physical deposition methods such as magnetron sputtering or thermal evaporation, while CVD includes chemical deposition methods such as plasma-enhanced chemical vapor deposition (PECVD).

[0135] After obtaining the conductive material layer, a single patterning process can be used to process the conductive material layer to obtain a connection pattern. The single patterning process includes: photoresist coating, exposure, development, etching, and photoresist stripping. Processing the conductive material layer using the single patterning process includes: coating a layer of photoresist on the conductive material layer; then exposing the photoresist using a mask to form exposed and unexposed areas; then using a development process to remove the photoresist from one of the exposed and unexposed areas while retaining the photoresist in the other; then etching the areas of the conductive material layer not covered with photoresist; and after etching, stripping the photoresist from the conductive material layer to obtain a connection pattern.

[0136] It should be noted that the photoresist can be either positive or negative. If the photoresist is positive, then after the above-mentioned development process, the photoresist in the exposed areas is removed, while the photoresist in the unexposed areas remains. If the photoresist is negative, then after the above-mentioned development process, the photoresist in the unexposed areas is removed, while the photoresist in the exposed areas remains.

[0137] For example, please refer to Figure 15The connection pattern formed in step 11022a includes: the first electrode 21 of the first photoelectric sensing unit, the first electrode 21 of the second photoelectric sensing unit, and the connecting electrode 15. The first electrode 21 of the first photoelectric sensing unit is connected to the first circuit 13; the first electrode 21 of the second photoelectric sensing unit is connected to the first electrode 21 of the first photoelectric sensing unit through the connecting electrode 15.

[0138] It can be seen that the connection pattern formed in step 11022a includes not only the first electrode 21, but also the connection electrode 15. At this time, the shape of the hollow area in the above-mentioned mask plate can be adjusted so that the connection pattern can be obtained by processing the conductive material layer using a single composition process.

[0139] Step 11023a: forming other structures on the base substrate having the connection pattern formed thereon, the other structures including: structures other than the first electrode in the first photoelectric sensing unit, and structures other than the first electrode in the second photoelectric sensing unit; each of the first photoelectric sensing unit and the second photoelectric sensing unit includes: a first electrode, a photoelectric sensing layer, and a second electrode arranged in sequence in a direction away from the base substrate.

[0140] After step 11022a, you can Figure 15 The above-mentioned other structures are formed on the structure shown, such as forming Figure 7 The photoelectric sensing layer 22 and the second electrode 23 are included in the photoelectric sensing unit. Optionally, when the photoelectric sensing unit further includes a first injection layer, a first transmission layer, a second transmission layer and a second injection layer, the other structures also include these structures.

[0141] Step 11024a: forming a light-emitting unit on the base substrate.

[0142] The light emitting unit may be formed on the base substrate after step 11023a, or the light emitting unit may be formed during the process of forming the above-mentioned photoelectric sensing unit.

[0143] For example, Figure 11As shown, each photoelectric sensing unit in the array substrate includes: a first electrode 21, a first injection layer 24, a first transmission layer 25, a photoelectric sensing layer 22, a second transmission layer 26, a second injection layer 27, and a second electrode 23, arranged in sequence away from the base substrate 14. The light-emitting unit 17 includes: a third electrode 171, a third injection layer 172, a third transmission layer 173, an EL layer 174, a fourth transmission layer 175, a fourth injection layer 176, and a fourth electrode 177, arranged in sequence away from the base substrate. The first injection layer 24 and the third injection layer 172 are co-layered; the first transmission layer 25 and the third transmission layer 173 are co-layered; the second transmission layer 26 and the fourth transmission layer 175 are co-layered; and the second injection layer 27 and the fourth injection layer 176 are co-layered.

[0144] At this time, the third injection layer can be manufactured simultaneously with the first injection layer. For example, when manufacturing the first injection layer, an injection material layer can be formed, and the injection material layer includes the first injection layer and the third injection layer. The third transmission layer can be manufactured simultaneously with the first transmission layer. For example, when manufacturing the first transmission layer, a transmission material layer can be formed, and the transmission material layer includes the first transmission layer and the third transmission layer. The fourth injection layer can be manufactured simultaneously with the second injection layer. For example, when manufacturing the second injection layer, an injection material layer can be formed, and the injection material layer includes the second injection layer and the fourth injection layer. The third transmission layer can be manufactured simultaneously with the second transmission layer. For example, when manufacturing the second transmission layer, a transmission material layer can be formed, and the transmission material layer includes the second transmission layer and the fourth transmission layer.

[0145] In addition, when the light-emitting units are sub-pixel units, the array substrate further includes a driving circuit connected to the sub-pixel units. In this case, the driving circuit can be formed on the base substrate before forming the sub-pixel units. The film layer in the driving circuit can be the same layer structure as the film layer in the first circuit described above. In this case, the driving circuit can be formed in step 11021a.

[0146] (2) In a second alternative implementation of step 1102, the method can be used to prepare Figure 8 At this time, the fingerprint recognition device further includes a first connecting portion. For example, Figure 16 As shown, step 1102 includes:

[0147] Step 11021b: forming a first circuit and a first connecting portion on the base substrate, wherein the first circuit includes a second connecting portion, the first connecting portion and the second connecting portion are in the same layer structure, and the first connecting portion is connected to the second connecting portion.

[0148] like Figure 17As shown, in step 11021b, the first circuit 13 and the first connecting portion 161 can be formed on the base substrate 14. The first connecting portion 161 and the second connecting portion (such as Figure 17 The fifth electrode 132 in the embodiment is a same-layer structure, and the first connecting portion 161 is connected to the second connecting portion.

[0149] In the embodiment of the present application, the first circuit 13 includes a TFT, and the TFT includes a gate 131, a fifth electrode 132, and a sixth electrode 133. When forming the TFT on the base substrate 14, the TFT active layer 134, the gate insulating layer ( Figure 17 Not marked), gate 131, ILD layer ( Figure 17 The first connection portion 161 can be formed simultaneously with the formation of the source and drain electrodes. For example, a conductive material layer can be first formed on the substrate on which the ILD is formed, and then the conductive material layer can be processed using a single patterning process to obtain the source and drain electrodes and the first connection portion 161.

[0150] Optionally, when the embodiment of the present application is used to manufacture Figure 9 In the case of the array substrate shown, the second connecting portion is the active layer in the TFT, and the first connecting portion and the active layer are in the same layer structure. In this case, the first connecting portion can be formed when the active layer is formed.

[0151] Step 11022b: forming a first photoelectric sensing unit and a second photoelectric sensing unit on a base substrate having a first circuit and a first connecting portion; each of the first photoelectric sensing unit and the second photoelectric sensing unit includes: a first electrode, a photoelectric sensing layer, and a second electrode arranged in sequence in a direction away from the base substrate; the first electrode of the first photoelectric sensing unit is connected to the second connecting portion; and the first electrode of the second photoelectric sensing unit is connected to the first connecting portion.

[0152] like Figure 8 As shown, a flat layer ( Figure 8 (not shown), the planar layer has a via hole connected to the second connection portion (such as the fifth electrode 132) and a via hole connected to the first connection portion 161. Subsequently, the first photoelectric sensor unit 11 and the second photoelectric sensor unit 12 are formed on the planar layer. The first electrode 21 of the first photoelectric sensor unit 11 is connected to the second connection portion through the via hole connected to the second connection portion in the planar layer; the first electrode 21 of the second photoelectric sensor unit 12 is connected to the first connection portion through the via hole connected to the first connection portion 161 in the planar layer.

[0153] The manufacturing process of the first photoelectric sensor unit 11 and the second photoelectric sensor unit 12 can refer to Figure 13 The manufacturing process of the first photoelectric sensor unit 11 and the second photoelectric sensor unit 12 is not described in detail in this embodiment of the present application.

[0154] Step 11023b: forming a light-emitting unit on the base substrate.

[0155] The manufacturing process of the light-emitting unit can refer to Figure 13 The manufacturing process of the light-emitting unit is not described in detail in the embodiment of the present application.

[0156] In addition, when the light-emitting units are sub-pixel units, the array substrate further includes a driving circuit connected to the sub-pixel units. In this case, the driving circuit can be formed on the base substrate before forming the sub-pixel units. The film layer in this driving circuit can be the same layer structure as the film layer in the aforementioned first circuit. In this case, the driving circuit can be formed in step 11021b.

[0157] It should be noted that Figure 16 In the example where the second circuit is the first connection portion, optionally, when the second circuit is not the first connection portion, the second circuit needs to be formed before step 11022b. The film layer in the second circuit can be the same layer structure as the film layer in the first circuit, in which case the second circuit can be formed in step 11021b.

[0158] It should be noted that the method embodiments, array substrate embodiments, display panel embodiments, and display device embodiments provided in the embodiments of the present application can refer to each other, and the embodiments of the present application are not limited thereto. The order of the steps in the method embodiments provided in the embodiments of the present application can be appropriately adjusted, and the steps can be increased or decreased accordingly according to the circumstances. Any method that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application, and therefore will not be described in detail.

[0159] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. An array substrate, characterized in that: The array substrate includes: a base substrate, and a light-emitting unit, a first photoelectric sensing unit, a second photoelectric sensing unit, a first circuit, a second circuit, and a driving circuit located on the base substrate; the first photoelectric sensing unit and the second photoelectric sensing unit are connected in parallel to the first circuit, and the first photoelectric sensing unit and the second photoelectric sensing unit are organic photodiode (OPD) units; The light emitting unit is used to emit light toward a side away from the substrate; The first photoelectric sensing unit and the second photoelectric sensing unit are both used to generate an electrical signal according to light from a side away from the substrate, and transmit the electrical signal to the first circuit; The first circuit is used to connect to the fingerprint recognition chip and transmit the received electrical signal to the fingerprint recognition chip; the first circuit includes: a thin film transistor TFT, the TFT includes: a gate, an active layer, a fifth electrode and a sixth electrode; Each of the first photoelectric sensing unit and the second photoelectric sensing unit includes: a first electrode, a first injection layer, a first transmission layer, a photoelectric sensing layer, a second transmission layer, a second injection layer and a second electrode arranged in sequence in a direction away from the substrate; The light emitting unit comprises: a third electrode, a third injection layer, a third transmission layer, an electroluminescent layer, a fourth transmission layer, a fourth injection layer and a fourth electrode arranged in sequence in a direction away from the base substrate; The array substrate satisfies at least one of the following conditions: the electroluminescent layer and the photoelectric sensing layer are in the same layer structure; the first injection layer and the third injection layer are in the same layer structure; the first transmission layer and the third transmission layer are in the same layer structure; the second transmission layer and the fourth transmission layer are in the same layer structure; and the second injection layer and the fourth injection layer are in the same layer structure; The driving circuit is connected to the light-emitting unit, the structure of the driving circuit is the same as that of the first circuit, and the film layer in the driving circuit and the film layer in the first circuit are the same layer structure; The first electrode of the first photoelectric sensing unit is connected to the first circuit; The first electrode of the second photoelectric sensing unit is connected to the first circuit via the first electrode of the first photoelectric sensing unit; or the first electrode of the second photoelectric sensing unit is connected to the first circuit via the second circuit; The second circuit includes: a first connecting portion located on the base substrate; the first photoelectric sensing unit and the second photoelectric sensing unit are connected in parallel to the second connecting portion in the first circuit; the first connecting portion and the second connecting portion are in the same layer structure; and the second connecting portion is the fifth electrode or the active layer in the TFT; The array substrate also includes: multiple gate lines and multiple data lines, multiple light-emitting units are arranged in an array, and multiple photoelectric sensing units are arranged in an array; the light-emitting units are sub-pixel units; each row of sub-pixel units is connected to one gate line, each column of sub-pixel units is connected to one data line, each row of photoelectric sensing units is connected to one gate line, and each column of photoelectric sensing units is connected to one data line; the multiple sub-pixel units and the multiple photoelectric sensing units constitute a plurality of pixel units arranged in an array, and each pixel unit includes: n sub-pixel units and one photoelectric sensing unit, where n≥1; the gate of the TFT in the first circuit is connected to the gate line, and the sixth electrode of the TFT in the first circuit is connected to the fingerprint recognition chip through the data line.

2. The array substrate according to claim 1, wherein: The array substrate further comprises: a connecting electrode located on the base substrate; The first electrode of the second photoelectric sensing unit is connected to the first electrode of the first photoelectric sensing unit through the connecting electrode; the first electrode and the connecting electrode are in the same layer structure.

3. The array substrate according to claim 2, wherein: The second electrode and the fourth electrode are connected to form a common electrode; an orthographic projection of the connecting electrode on the base substrate and an orthographic projection of the common electrode on the base substrate have an overlapping area.

4. The array substrate according to any one of claims 1 to 3, wherein: The first photoelectric sensing unit and the second photoelectric sensing unit are connected in parallel to the fifth electrode or the active layer, and the sixth electrode is used to connect to a fingerprint recognition chip.

5. A display panel, characterized in that: The display panel comprises: the array substrate according to any one of claims 1 to 4.

6. A display device, characterized in that: The display device includes: the display panel according to claim 5, and a fingerprint recognition chip; the fingerprint recognition chip is connected to a first circuit in the display panel and is used to perform fingerprint recognition based on an electrical signal transmitted by the first circuit.

7. The display device according to claim 6, wherein: The display device further includes at least one of a touch layer and a color filter layer.

8. A method for manufacturing an array substrate, characterized in that: The method is used to manufacture the array substrate according to any one of claims 1 to 4, and the method comprises: providing a substrate; forming a fingerprint recognition device on the base substrate, the fingerprint recognition device comprising: a light emitting unit, a first photoelectric sensing unit, a second photoelectric sensing unit, a first circuit, a second circuit, and a driving circuit; Among them, the first photoelectric sensing unit and the second photoelectric sensing unit are connected in parallel to the first circuit; the light-emitting unit is used to emit light to the side away from the substrate; the first photoelectric sensing unit and the second photoelectric sensing unit are both used to generate an electrical signal according to the light from the side away from the substrate, and transmit the electrical signal to the first circuit; the first circuit is used to connect the fingerprint recognition chip and transmit the received electrical signal to the fingerprint recognition chip; the first circuit includes: a thin film transistor TFT, the TFT includes: a gate, an active layer, a fifth electrode and a sixth electrode; the first photoelectric sensing unit and the second photoelectric sensing unit are organic photodiode OPD units; each of the first photoelectric sensing unit and the second photoelectric sensing unit includes: a first electrode, a first injection layer, a first transmission layer, a photoelectric sensing layer, a second transmission layer, a second injection layer and a second electrode arranged in sequence along a direction away from the substrate; the light-emitting unit includes: a first electrode, a first injection layer, a first transmission layer, a photoelectric sensing layer, a second transmission layer, a second injection layer and a second electrode arranged in sequence along a direction away from the substrate The third electrode, the third injection layer, the third transmission layer, the electroluminescent layer, the fourth transmission layer, the fourth injection layer and the fourth electrode are arranged in sequence in the direction of the substrate; the array substrate satisfies at least one of the following conditions: the electroluminescent layer and the photoelectric sensing layer are in the same layer structure; the first injection layer and the third injection layer are in the same layer structure; the first transmission layer and the third transmission layer are in the same layer structure; the second transmission layer and the fourth transmission layer are in the same layer structure; and the second injection layer and the fourth injection layer are in the same layer structure; the driving circuit is connected to the light-emitting unit, the structure of the driving circuit is the same as that of the first circuit, and the film layer in the driving circuit is in the same layer structure as the film layer in the first circuit; the first electrode of the first photoelectric sensing unit is connected to the first circuit; the first electrode of the second photoelectric sensing unit is connected to the first circuit through the first electrode of the first photoelectric sensing unit; or the first electrode of the second photoelectric sensing unit is connected to the first circuit through the second circuit; The array substrate further includes: a plurality of gate lines and a plurality of data lines, a plurality of the light-emitting units arranged in an array, and a plurality of the photoelectric sensing units arranged in an array; the light-emitting units are sub-pixel units; each row of the sub-pixel units is connected to a gate line, each column of the sub-pixel units is connected to a data line, each row of the photoelectric sensing units is connected to a gate line, and each column of the photoelectric sensing units is connected to a data line; the plurality of sub-pixel units and the plurality of photoelectric sensing units constitute a plurality of pixel units arranged in an array, each pixel unit including: n sub-pixel units and one photoelectric sensing unit, where n ≥ 1; the gate electrode of the TFT in the first circuit is connected to the gate line, and the sixth electrode of the TFT in the first circuit is connected to the fingerprint recognition chip via the data line; The second circuit includes: a first connecting portion located on the base substrate, and a fingerprint recognition device is formed on the base substrate, including: The first circuit and the first connecting portion are formed on the base substrate, wherein the first circuit includes a second connecting portion, the first connecting portion and the second connecting portion are in the same layer structure, and the first connecting portion is connected to the second connecting portion; the second connecting portion is the fifth electrode or the active layer in the TFT; The first photoelectric sensing unit and the second photoelectric sensing unit are formed on the base substrate having the first circuit and the first connecting portion formed thereon; each of the first photoelectric sensing unit and the second photoelectric sensing unit comprises: a first electrode, a photoelectric sensing layer, and a second electrode sequentially arranged in a direction away from the base substrate; the first electrode of the first photoelectric sensing unit is connected to the second connecting portion; and the first electrode of the second photoelectric sensing unit is connected to the first connecting portion; The light emitting unit is formed on the base substrate.

9. The method according to claim 8, characterized in that The fingerprint recognition device further includes a connecting electrode, and the fingerprint recognition device is formed on the substrate, including: forming the first circuit on the base substrate; forming a connection pattern on the base substrate on which the first circuit is formed, the connection pattern including: a first electrode of the first photoelectric sensing unit, a first electrode of the second photoelectric sensing unit, and a connection electrode, wherein the first electrode of the first photoelectric sensing unit is connected to the first circuit; and the first electrode of the second photoelectric sensing unit is connected to the first electrode of the first photoelectric sensing unit via the connection electrode; forming other structures on the base substrate having the connection pattern formed thereon, the other structures including: structures other than the first electrode in the first photoelectric sensing unit, and structures other than the first electrode in the second photoelectric sensing unit; each of the first photoelectric sensing unit and the second photoelectric sensing unit including: a first electrode, a photoelectric sensing layer, and a second electrode sequentially arranged in a direction away from the base substrate; The light emitting unit is formed on the base substrate.

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