A film mold and a method of manufacturing and using the same

Abstract

The application discloses a film mold, comprising a transparent PC plate, a first ink layer, a cover bottom ink layer, a UV primer layer, a UV texture layer, a silicon dioxide layer and an AF film layer are sequentially arranged above the transparent PC plate, and the thickness of the transparent PC plate is 0.4-1.0 mm. The application also discloses a manufacturing method and a using method of the film mold. The structure design and the method steps are reasonable, the silicon dioxide layer and the AF film layer are arranged on the UV texture layer, the thickness of the transparent PC plate is adjusted from the existing 0.255 mm to 0.4-1.0 mm, so that the service life of the film mold is increased from the existing 100 times to about 200 times, and the single variable test shows that the bubble defect rate between the film mold and GDM glue can be reduced by 20%. The second UV glue is replaced by TSD-6081 glue or 8928-7 glue from ND-5204WJ glue, so that the matching between the second UV glue and the GDM glue is increased, and the test shows that the bubble defect rate between the film mold and the GDM glue can be reduced by about 20%.

Description

Technical Field

[0001] This invention relates to the field of surface energy technology for film molds, and in particular to a film mold and its manufacturing and usage methods. Background Technology

[0002] Currently, with the advent of the 5G era, people are paying more attention to the appearance design and product diversification of mobile phones and other electronic products, in addition to pursuing cost-effectiveness. Film molds are widely used in the GDM (Geometric Component Design) process for mobile phone camera lenses, playing a crucial role in the lens processing. GDM refers to directly creating textured effects on the glass cover plate. However, existing film molds in GDM, especially during the UV transfer process, exhibit the following two issues: First, without surface energy treatment, although the water droplet angle on the film mold surface is only 80±5°, the highly corrosive adhesive will damage the surface of the film mold, reducing its lifespan to only about 100 cycles. Second, when conventional surface energy treatment is applied to the film mold (this conventional surface energy treatment involves adding a SiO2+AF film layer structure to the UV texture layer of the film mold),... The thickness of the iO2 film is 5±1nm, and the thickness of the AF film is 200±20nm (the AF film is formed by the anti-fingerprint solution). Although this can improve the service life of the film mold, it will result in a water droplet angle of >110° on the surface of the film mold and a fluoride ion content of over 40%. Due to the excessively large water droplet angle on the surface of the film mold, the surface of the film mold will have poor compatibility with the adhesive, which will lead to a bubble defect rate of over 80% during the UV transfer process, resulting in a high rework rate and increased production costs. At the same time, due to the poor compatibility problem, it is necessary to cooperate with the adhesive supplier to redevelop the adhesive, which will increase the mold development cycle. Summary of the Invention

[0003] The purpose of this invention is to provide a film mold to solve the technical problem in the prior art that film molds cannot simultaneously achieve both high service life and low bubble defect rate in the UV transfer process.

[0004] To achieve the above objectives, the present invention provides a film mold comprising a transparent PC board, wherein a first ink layer, a cover ink layer, a UV undercoat layer, a UV texture layer, a silicon dioxide layer, and an AF film layer are sequentially disposed on the upper surface of the transparent PC board, and the thickness of the transparent PC board is 0.4 to 1.0 mm.

[0005] Furthermore, the thickness of the first ink layer is 3-5 μm, the thickness of the bottom ink layer is 5-7 μm, and the thickness of the silicon dioxide layer is 5 ± 1 nm.

[0006] Furthermore, the thickness of the AF film is 180±20nm, and the surface water droplet angle of the AF film is >110°.

[0007] The present invention also provides a method for manufacturing the above-mentioned film mold, comprising the following steps:

[0008] Step 1: Print the first ink on a transparent PC board with a thickness of 0.4 to 1.0 mm, and then bake the first ink to surface dry so that the first ink forms the first ink layer;

[0009] Step 2: Print the second ink on the first ink layer, and then bake the second ink to surface dry so that the second ink forms a cover ink layer;

[0010] Step 3: Solidify the film mold formed in Step 2;

[0011] Step 4: Apply the first UV adhesive to the base ink layer, cover the first UV adhesive with a PET film, use the first roller to roll and press the PET film, and then use the first UV light to irradiate and cure the first UV adhesive so that the first UV adhesive forms a UV underlayer. Finally, separate the PET film from the UV underlayer.

[0012] Step 5: Apply a second UV adhesive to the UV base layer, cover the film master mold on the second UV adhesive, use a second roller to roll and press the film master mold to transfer the texture on the film master mold to the second UV adhesive, use a second UV light to irradiate and cure the second UV adhesive to form a UV texture layer, and finally separate the film master mold from the UV texture layer.

[0013] Step Six: Use a fourth UV light to age the film mold formed in Step Five;

[0014] Step 7: Deposit a silicon dioxide layer onto the UV texture layer;

[0015] Step 8: Deposit an AF film onto the silicon dioxide layer.

[0016] Furthermore, the second UV adhesive is either TSD-6081 adhesive or 8928-7 adhesive to increase the compatibility between the second UV adhesive and the GDM adhesive.

[0017] Further, the first ink has a mass percentage composition of 70-75% main oil, 15-20% diluent, and 10% curing agent; the second ink has a mass percentage composition of 55-65% main oil, 25-35% diluent, and 10% curing agent; the main oil is polyvinyl chloride or phthalate.

[0018] Furthermore, the UV texture layer described in step six is ​​subjected to ultrasonic cleaning or plasma treatment to increase the adhesion of the UV texture layer to the silicon dioxide layer.

[0019] Furthermore, the required temperature for depositing the silicon dioxide layer on the UV textured layer is 23±2℃, the power is 3.0±0.5KW, the electroplating rate is 0.5±0.1Å / s, and the vacuum degree is 2.5±0.5 E ×10 -5 Torr, argon gas concentration 100±50 sccm, oxygen concentration 200±50 sccm, sputtering time 3–5 min; the required temperature for vacuum electroplating the AF film onto the silicon dioxide layer is 23±2℃, current 340±10 A, and electroplating vacuum 2.5±0.5 E ×10 -5 Torr; electroplating time is 20-25 minutes.

[0020] As one embodiment of the present invention, the present invention also provides a method for using the above-mentioned film mold, including:

[0021] Step 1: Fix the positioning sheet onto the UV transfer platform;

[0022] Step 2: Place the glass to be processed into the positioning frame of the positioning piece, and the positioning frame positions the glass to be processed.

[0023] Step 3: Apply GDM adhesive to the glass to be processed;

[0024] Step 4: Cover the film mold onto the GDM adhesive, roll and press the film mold with the third roller to transfer the texture on the film mold onto the GDM adhesive, and then cure the GDM adhesive by irradiating it with a third UV light.

[0025] The film mold includes a transparent PC board with a thickness of 0.4–1.0 mm; the roller pressure of the third roller is 0.3–0.4 MPa and the roller speed is 1–2 mm / s; the wavelength range of the third UV light is 365–425 nm, the curing time of the third UV light on the GDM adhesive is 0.7–1.1 s, and the energy of the third UV light is 50–100 mJ / cm².

[0026] Furthermore, the roller pressure of the third roller is 0.4 MPa, the roller speed of the third roller is 2.0 mm / s, and the curing time of the GDM adhesive by the third UV light is 0.8 s.

[0027] In summary, the technical solution of this invention has the following beneficial effects: By setting a silica layer and an AF film layer on the UV texture layer, and adjusting the thickness of the transparent PC board from the existing 0.255mm to 0.4-1.0mm, the service life of the film mold is increased from the existing 100 cycles to about 200 cycles. Furthermore, single-variable experiments show that the defect rate of bubbles generated between the film mold and GDM adhesive can be reduced by 20%, thus solving the technical problem that existing film fixtures cannot simultaneously achieve high service life and low bubble generation rate. Plasma treatment or ultrasonic cleaning of the UV texture layer improves the adhesion of the UV texture layer to the silica layer. Replacing the second UV adhesive with ND-5204WJ adhesive and TSD-6081 adhesive or 8928-7 adhesive increases the compatibility between the second UV adhesive and the GDM adhesive. Experimental tests show that the defect rate of bubbles generated between the film mold and GDM adhesive can be reduced by about 20%. By adjusting the roller pressure of the third roller on the GDM adhesive to 0.3-0.4 MPa and the roller speed to 1-2 mm / s, or by adjusting the UV irradiation time of the GDM adhesive to 0.7-1.1 s, the experimental results show that the defect rate of air bubbles generated between the film mold and the GDM adhesive can be reduced by about 30%. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the stacked structure of a film mold in the prior art.

[0029] Figure 2 This is a structural schematic diagram of a film mold in the prior art;

[0030] Figure 3 This is a structural schematic diagram of a GDM positioning fixture in the prior art;

[0031] Figure 4 This is a process flow diagram of the manufacturing method of the film fixture of the present invention;

[0032] Explanation of reference numerals in the attached drawings: 1-Film mold, 101-Transparent PC board, 102-First ink layer, 103-Cover ink layer, 104-UV undercoat, 105-UV texture layer, 106-Silica film layer, 107-AF film layer, 111-UV irradiation section; 2-UV transfer platform; 3-Positioning sheet, 301-Positioning frame; 4-Glass to be processed; 5-GDM adhesive; 6-Positioning post. Detailed Implementation

[0033] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention, but this does not constitute a limitation on the scope of protection of the present invention.

[0034] In this invention, for clarity, the following description is provided: The observer faces the attached... Figure 1 When making observations, the observer above is designated as "up" and the observer below is designated as "down." It should be noted that the terms "above" and "below" in the text indicate the orientation or positional relationship based on the accompanying drawings. They are only for the purpose of clearly describing the present invention and do not indicate or imply that the structure or component referred to must have a specific orientation or be constructed in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0035] See Figure 1 , Figure 2 This embodiment provides a film mold, including a transparent PC board 101. The transparent PC board 101 has a first ink layer 102, a cover ink layer 103, a UV undercoat layer 104, a UV texture layer 105, a silica layer 106, and an AF film layer 107 sequentially disposed on its top surface. The thickness of the transparent PC board 101 is 0.4–1.0 mm. By setting the silica layer 106 and the AF film layer 107 on the UV texture layer 105, and adjusting the thickness of the transparent PC board 101 from the existing 0.255 mm to 0.4–1.0 mm, the service life of the film mold 1 is increased from the existing 100 cycles to approximately 200 cycles. The actual test results are shown in the table below.

[0036]

[0037] Furthermore, single-variable experiments showed that the defect rate of air bubbles generated between the film mold 1 and UV adhesive 5 can be reduced by 20%, thus solving the technical problem that the existing film fixture 1 cannot simultaneously achieve high service life and low air bubble rate. The test results are shown in the table below:

[0038]

[0039] Specifically, the thickness of the first ink layer 102 is 3-5 μm, the thickness of the cover ink layer 103 is 5-7 μm, and the thickness of the silicon dioxide layer 106 is 5 ± 1 nm.

[0040] Specifically, the thickness of the AF film 107 is 180±20nm, and the surface water droplet angle of the AF film 107 is >110°. It should be noted that although a surface water droplet angle greater than 110° of the AF film 107 will result in poor hydrophilicity and wettability of the AF film 107, thereby increasing the bubble defect rate, this can be achieved by adjusting the thickness of the transparent PC board 101 from the existing 0.255mm to 0.4~1.0mm, which can improve the service life of the film fixture 1 while reducing the bubble defect rate.

[0041] See Figure 4 The present invention provides a method for manufacturing the above-mentioned film mold, comprising the following steps:

[0042] Step 1: Print the first ink on a transparent PC board 101 with a thickness of 0.4-1.0 mm, and then bake the first ink to surface dry so that the first ink forms the first ink layer 102; the first ink has the following composition by mass percentage: main oil 70-75%, thinner 15-20%, and curing agent 10%;

[0043] Step 2: Print the second ink on the first ink layer 102, and then bake the second ink to surface dry so that the second ink forms the cover ink layer 103. The second ink has the following composition by mass percentage: main oil 55-65%, thinner 25-35%, and curing agent 10%. It should be noted that both the first ink layer 102 and the cover ink layer 103 are for light blocking. Due to process requirements, the first ink layer 102 alone usually cannot achieve a good effect, and secondary or multiple ink layer treatments are necessary.

[0044] Step 3: Perform a curing process on the film mold 1 formed in Step 2. The film mold formed in Step 2 refers to the transparent PC board 101 and the first ink layer 102 and the cover ink layer 103 on the transparent PC board 101. They are placed in the oven together for curing, so each part will be subject to the curing effect. Moreover, the film mold formed in each step is different because each additional processing step will produce new technical features in the film mold 1.

[0045] Step 4: Apply the first UV adhesive to the base ink layer 103, cover the PET film on the first UV adhesive, use the first roller to roll and press the PET film, and then use the first UV light to irradiate and cure the first UV adhesive so that the first UV adhesive forms the UV underlay 104. Finally, separate the PET film from the UV underlay 104.

[0046] Step 5: Apply a second UV adhesive to the UV base layer 104, cover the film master mold on the second UV adhesive, use a second roller to roll and press the film master mold to transfer the texture on the film master mold to the second UV adhesive, use a second UV light to irradiate and cure the second UV adhesive to form a UV texture layer 105, and finally separate the film master mold from the UV texture layer 105.

[0047] Step 6: Use the fourth UV light to age the film mold 1 formed in step 5; the film mold 1 formed in step 5 refers to the transparent PC board and the first ink layer 102, the cover ink layer 103, the UV underlay layer 104, and the UV texture layer 105 on it; the UV underlay layer 104 serves as a base layer to facilitate the transition between the UV texture layer 105 and the cover ink layer 103.

[0048] Step 7: Deposit a silicon dioxide layer 106 onto the UV texture layer 105; the silicon dioxide layer 106 is used to reduce the corrosion of the film mold by the UV adhesive.

[0049] Step 8: Deposit an AF film 107 onto the silicon dioxide layer 106. The AF film 107 is an anti-fingerprint film, which is used to improve the hydrophilicity and wettability of the surface of the film mold 1 and the GDM adhesive 5 during the UV transfer process, thereby reducing air bubbles and facilitating mold separation. Therefore, AF treatment is essential.

[0050] Specifically, the second UV adhesive is either TSD-6081 or 8928-7 adhesive. This increases the compatibility between the second UV adhesive and GDM adhesive 5, thereby reducing the rate of air bubbles generated between the film mold 1 and GDM adhesive 5. Tests have shown that the rate of air bubbles generated between the film mold and GDM adhesive can be reduced by approximately 20%, as shown in the table below:

[0051]

[0052] It should be noted that the ND-5204WJ adhesive mentioned in the article is manufactured by NPC Co., Ltd. in South Korea and is available for purchase in the market. The TSD-6081 and 8928-7 adhesives mentioned are two types of adhesives manufactured by Quanshengde Co., Ltd. in China, and are also available for purchase in the market. The reason why TSD-6081 and 8928-7 adhesives have better compatibility with GDM adhesive 5 is that they contain UV monomers such as dipropylene glycol diacrylate or hexanediol diacrylate, which increases their compatibility with GDM adhesive 5. This allows for full contact between the mold and GDM adhesive 5 during UV transfer, preventing air bubbles. Additionally, the addition of zinc stearate increases their separation properties, which helps reduce film separation and pulling after UV curing. In summary, TSD-6081 and 8928-7 adhesives, by increasing their compatibility and film separation properties, enhance their compatibility with GDM adhesive 5, thereby reducing the rate of air bubbles between the film mold 1 and GDM adhesive 5. Based on this principle, other second UV adhesives with the same function can also be manufactured to replace the existing ND-5204WJ adhesive, further improving compatibility with GDM adhesive 5.

[0053] The UV texture layer 105 in step six is ​​subjected to ultrasonic cleaning or plasma treatment to increase the adhesion of the UV texture layer 105 to the silicon dioxide layer 106.

[0054] The required temperatures for depositing the silicon dioxide layer 106 on the UV textured layer 105 are 23±2℃, power is 3.0±0.5KW, electroplating rate is 0.5±0.1Å / s, and vacuum degree is 2.5±0.5. E ×10-5 Torr, argon 100±50 sccm, oxygen 200±50 sccm, sputtering time 3-5 min.

[0055] The required temperature for vacuum electroplating the AF film 107 onto the silicon dioxide layer 106 is 23±2℃, the current is 340±10A, and the electroplating vacuum is 2.5±0.5. E ×10 -5 Torr; electroplating time is 20-25 minutes.

[0056] See Figure 3 As an embodiment of the present invention, the present invention also provides a method for using the above-mentioned film mold, including:

[0057] Step 1: Fix the positioning piece 3 onto the UV transfer platform 2;

[0058] Step 2: Place the glass to be processed 4 into the positioning frame 301 of the positioning piece 3. The positioning frame 301 positions the glass to be processed 4.

[0059] Step 3: Apply GDM adhesive 5 to the glass to be processed 4;

[0060] Step 4: Cover the film mold 1 onto the GDM adhesive 5, and roll and press the film mold 1 with the third roller to transfer the texture on the film mold 1 onto the GDM adhesive 5, and then irradiate and cure the GDM adhesive 5 with the third UV light.

[0061] Specifically, the film mold 1 includes a transparent PC board 101 with a thickness of 0.4 to 1.0 mm; the roller pressure of the third roller is 0.3 to 0.4 MPa and the roller speed is 1 to 2 mm / s; the wavelength range of the third UV light is 365 to 425 nm, the curing time of the third UV light on the GDM adhesive 5 is 0.7 to 1.1 s, and the energy of the third UV light is 50 to 100 mj / cm2.

[0062] Specifically, the roller pressure of the third roller is 0.4 MPa, the roller speed of the third roller is 2.0 mm / s, and the curing time of the GDM adhesive 5 under the third UV light is 0.8 s. Specifically, by adjusting the roller pressure or roller speed of the third roller, or by adjusting the curing time of the GDM adhesive 5 under the third UV light, the rate of air bubbles between the film mold 1 and the GDM adhesive 5 can be reduced. Experimental tests show that the rate of air bubbles between the film mold and the GDM adhesive 5 can be reduced by approximately 30%, as described below:

[0063]

[0064] Specifically, after comprehensive testing, the bubble defect rate between the film mold and GDM adhesive 5 can be reduced to about 15%, as shown in the table below:

[0065]

[0066] In actual operation: see Figure 4 Step 1: Use a flat spray cleaning line to clean the incoming transparent PC board 101. The size of the transparent PC board 101 is 250*250*0.4~1.0mm. It is important to pay attention to whether the board thickness is 0.4~1.0mm. Set the cleaning line temperature to 40±5℃ and the speed to 2.0±0.2m / min.

[0067] Step 2: Print the first ink on the transparent PC board 101 using a glass screen printing machine and a first-pass film screen. The main ink of the first ink layer can be polyvinyl chloride or phthalate, or other main inks. The mass percentage composition of the first ink is: main ink 70-75%, thinner 15-20%, curing agent 10%, screen printing ink thickness 3-5µm, squeegee hardness 85°, squeegee speed 50-100mm / s, and then bake it in a tunnel oven at a low temperature to form the first ink layer 102. The temperature is set at 70±5℃ and the time is 2-3 minutes.

[0068] Step 3: Using a glass screen printing machine and a cover film screen, print the second ink onto the first ink layer 102. The main ink of the second ink can be polyvinyl chloride or phthalate, or other main inks. The second ink ratio is: main ink 55-65%, thinner 25-35%, curing agent 10%. The screen printing ink thickness is 5-7 μm, the squeegee hardness is 85°, and the squeegee speed is 50-100 mm / s. First, use a tunnel oven to bake it at a low temperature for surface drying, setting the temperature to 70±5℃ and the time to 2-3 minutes, to form the cover ink layer 103. Then, use an oven to bake the above transparent PC board 101 for curing, setting the curing temperature to 70℃ and the curing time to 60 minutes. It should be noted that the thinner mentioned above is an alcohol solvent, ketone solvent, ester solvent, etc., and the curing agent is an aliphatic amine, aromatic amine, amide amine, etc. Furthermore, the ink used to form the first ink layer 102 or the cover ink layer 103 is not limited to the above-described embodiments. Other inks with the same light-shielding function are also possible, such as the ink in Chinese invention patent with publication number CN103387764B entitled "A Surface Screen Printing Ink and Its Application", and Chinese invention patent application with publication number CN111138905A entitled "A Method for Preparing a High-Opacity Water-Based Lead-Free Environmentally Friendly High-Temperature Glass Ink".

[0069] Step 4: Perform visual inspection and dimensional measurement on the film mold 1 formed in Step 3. For OK products, apply the first UV adhesive to the entire surface of the cover ink layer 103. The thickness of the first UV adhesive is greater than or equal to the height of the ink layer, filling the height difference area between the non-ink area and the ink area. The first UV adhesive is a transfer adhesive for photocurable materials. Cover the first UV adhesive with a PET film. Set the transfer parameters of the first roller on the PET film as roller pressure 0.2~0.5MPa and roller speed 3~4mm / s. Then, irradiate and cure it with the first UV light to form the UV base layer 104. The wavelength range of the first UV light is 365~425nm, the curing time is 9~11s, and the energy is 350±50mJ / cm2. Manually separate the UV base layer 104 from the PET film.

[0070] Step 5: Import the required mold layout drawing into the laser cutting machine. The file format can usually be dxf, raw, bmp, or png. Align and drill holes in the texture film master mold and the film mold 1 formed in step 4. The power is 40-100W and the speed is 20±5mm / s.

[0071] Step Six: Place the perforated film mold 1 on the positioning post of the UV transfer platform 2 of the UV transfer machine for positioning and fixing. Manually apply the second UV adhesive to one end of the positioning post. The second UV adhesive is the master mold adhesive of the light-curing material. Cover the perforated texture film master mold from Step Five on the second UV adhesive and fix it. Set the transfer parameters of the second roller on the film master mold as follows: roller pressure 0.2-0.3 MPa, roller speed 1-2 mm / s. Then, irradiate and cure it with the second UV light. The wavelength range of the second UV lamp is 365-425 nm, the UV irradiation time is 14-16 s, and the energy is 900±100 mj / cm2. Transfer the texture on the texture film master mold to the second UV adhesive of the film mold to form a UV texture layer 105.

[0072] Step 7: Manually separate the UV texture layer 105 from the texture film master mold, and clean the excess adhesive on the edge of the film mold 1 from Step 6 using a mixture of alcohol and acetone.

[0073] Step 8: Perform visual inspection on film mold 1 from Step 7. OK products are aged using an ultraviolet curing machine. The ultraviolet curing machine emits a fourth UV light for aging treatment. The energy of the fourth UV light is set to 550±50 mJ / cm2, the speed is 2~2.5m / min, and the number of repetitions is 30~35 times.

[0074] Step 9: Perform visual inspection and precision measurement on the film mold 1 from Step 8. OK products will flow into the next process.

[0075] Step 10: Import the required mold layout drawing into the laser cutting machine. The file format is usually dxf, raw, bmp, or png. Perform laser cutting on the above film mold and process the positioning holes. The power is 40-100W and the speed is 20±5mm / s.

[0076] Step 11: Perform surface treatment on the UV texture layer 105 of the film mold 1 formed in step 10. The treatment method can be ultrasonic cleaning or plasma treatment to increase the adhesion to the silicon dioxide layer 106.

[0077] Step 12: Deposit a silicon dioxide layer 106 onto the UV texture layer 105 of the film mold 1 from Step 11. Set the temperature to 23±2℃, power to 3.0±0.5KW, electroplating rate to 0.5Å / s, and vacuum degree to 2.5. E ×10 -5 Torr, argon 100±50 sccm, oxygen 200±50 sccm, sputtering time 3~5 min, the thickness of the deposited silicon dioxide 106 layer is 5±1 nm;

[0078] Step 13: Deposit an AF film layer 107 onto the silica layer 106 of the film mold 1. Use conventional AF pellets with good hydrophobicity and poor wettability. AF pellets are anti-fingerprint pellets, which are existing technology and can be purchased as needed. For specific manufacturing methods, refer to Chinese invention patent CN105176342A, entitled "A Nano-Antibacterial Anti-fingerprint Liquid Material, Its Preparation Method and Its Application". The required temperature for depositing the AF film layer 107 is 23±2℃, the current is 340±10A, and the electroplating vacuum is 2.5±0.5. E ×10 -5 Torr, time 20-25 min, the thickness of the deposited AF film 107 is 180±20 nm, and the surface water droplet contact angle is >110°;

[0079] Step Fourteen: First, fix the positioning plate on the positioning post 6 of the UV transfer platform 2. Then, place the glass to be processed 4 into the positioning frame 301 of the positioning plate 3. Next, apply GDM adhesive 5. GDM adhesive 5 is named according to its function, but it is essentially a UV adhesive. Fix the positioning holes of the film mold 1 to the positioning post 6. Set the transfer parameters of the third roller to 0.3-0.4 MPa and 1-2 mm / s. Then, use the third UV light to irradiate and cure the UV adhesive on the glass lens 4 through the UV irradiation part 111 of the film mold 1. It should be noted that the UV irradiation part 111 can be a specially set transparent area on the film mold 1, or it can be a hole on the film mold 1 for UV light to pass through, or it can be other forms with the same function. The UV lamp wavelength range is 365-425 nm, the UV time is 0.7-1.1 s, and the energy is 50-100 mj / cm2. The texture on the film mold 1 is transferred to the glass to be processed 4.

[0080] Step 15: By increasing the compatibility between the second UV adhesive and the GDM adhesive 5, or by adjusting the roller pressure or speed of the third roller, or by adjusting the curing time of the GDM adhesive 5 under the third UV light, the rate of air bubbles generated between the film mold 1 and the GDM adhesive 5 can be reduced. Preferably, the second UV adhesive is TSD-6081 adhesive or 8928-7 adhesive.

[0081] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A film mold, comprising a transparent PC board (101), wherein a first ink layer (102), a cover ink layer (103), a UV undercoat layer (104), a UV texture layer (105), a silicon dioxide layer (106), and an AF film layer (107) are sequentially disposed on the upper surface of the transparent PC board (101), characterized in that: The thickness of the transparent PC board (101) is 0.4–1.0 mm; The thickness of the first ink layer (102) is 3-5 μm, the thickness of the cover ink layer (103) is 5-7 μm, and the thickness of the silicon dioxide layer (106) is 5 ± 1 nm. The thickness of the AF film (107) is 180±20nm, and the surface water droplet angle of the AF film (107) is >110°; The film mold is prepared by the following method, which includes: Step 1: Print the first ink on a transparent PC board (101) with a thickness of 0.4 to 1.0 mm, and then bake the first ink to surface dry so that the first ink forms the first ink layer (102). Step 2: Print a second ink on the first ink layer (102), and then bake the second ink to surface dry so that the second ink forms a cover ink layer (103). Step 3: Solidify the film mold (1) formed in Step 2; Step 4: Apply a first UV adhesive to the base ink layer (103), cover the first UV adhesive with a PET film, use a first roller to roll and press the PET film, and then use a first UV light to irradiate and cure the first UV adhesive so that the first UV adhesive forms a UV underlay (104). Finally, separate the PET film from the UV underlay (104). Step 5: Apply a second UV adhesive to the UV base layer (104), cover the film master mold on the second UV adhesive, use a second roller to roll and press the film master mold to transfer the texture on the film master mold to the second UV adhesive, use a second UV light to irradiate and cure the second UV adhesive to form a UV texture layer (105), and finally separate the film master mold from the UV texture layer (105). Step 6: Use the fourth UV light to age the film mold (1) formed in step 5; Step 7: Deposit a silicon dioxide layer (106) onto the UV texture layer (105). Step 8: Deposit an AF film (107) onto the silicon dioxide layer (106).

2. A method for manufacturing a film mold as described in claim 1, characterized in that: Step 1: Print the first ink on a transparent PC board (101) with a thickness of 0.4 to 1.0 mm, and then bake the first ink to surface dry so that the first ink forms the first ink layer (102). Step 2: Print a second ink on the first ink layer (102), and then bake the second ink to surface dry so that the second ink forms a cover ink layer (103). Step 3: Solidify the film mold (1) formed in Step 2; Step 4: Apply a first UV adhesive to the base ink layer (103), cover the first UV adhesive with a PET film, use a first roller to roll and press the PET film, and then use a first UV light to irradiate and cure the first UV adhesive so that the first UV adhesive forms a UV underlay (104). Finally, separate the PET film from the UV underlay (104). Step 5: Apply a second UV adhesive to the UV base layer (104), cover the film master mold on the second UV adhesive, use a second roller to roll and press the film master mold to transfer the texture on the film master mold to the second UV adhesive, use a second UV light to irradiate and cure the second UV adhesive to form a UV texture layer (105), and finally separate the film master mold from the UV texture layer (105). Step 6: Use the fourth UV light to age the film mold (1) formed in step 5; Step 7: Deposit a silicon dioxide layer (106) onto the UV texture layer (105). Step 8: Deposit an AF film (107) onto the silicon dioxide layer (106).

3. The manufacturing method according to claim 2, characterized in that: The first ink has a mass percentage composition of 70-75% main oil, 15-20% diluent, and 10% curing agent; the second ink has a mass percentage composition of 55-65% main oil, 25-35% diluent, and 10% curing agent; the main oil is polyvinyl chloride or phthalate.

4. The manufacturing method according to any one of claims 2 to 3, characterized in that: The UV texture layer (105) in step six is ​​subjected to ultrasonic cleaning or plasma treatment to increase the adhesion of the UV texture layer (105) to the silicon dioxide layer (106).

5. The manufacturing method according to claim 4, characterized in that: The required temperatures for depositing the silicon dioxide layer (106) on the UV textured layer (105) are 23±2℃, power is 3.0±0.5KW, electroplating rate is 0.5±0.1Å / s, and vacuum degree is 2.5±0.5×10⁻⁶. -5 Torr, argon 100±50 sccm, oxygen 200±50 sccm, sputtering time 3-5 min; the required temperature for vacuum electroplating the AF film (107) onto the silicon dioxide layer (106) is 23±2℃, current 340±10A, and electroplating vacuum 2.5±0.5×10 -5 Torr; electroplating time is 20-25 minutes.

6. A method of using the film mold as described in claim 1, comprising: Step 1: Fix the positioning piece (3) onto the UV transfer platform (2); Step 2: Place the glass to be processed (4) into the positioning frame (301) of the positioning piece (3), and the positioning frame (301) positions the glass to be processed (4); Step 3: Apply GDM adhesive (5) to the glass to be processed (4); Step 4: Cover the film mold (1) onto the GDM adhesive (5), and roll and press the film mold (1) with a third roller to transfer the texture on the film mold (1) onto the GDM adhesive (5). Then, irradiate and cure the GDM adhesive (5) with a third UV light. The film mold (1) comprises a transparent PC board (101) with a thickness of 0.4 to 1.0 mm; the roller pressure of the third roller is 0.3 to 0.4 MPa, and the roller speed is 1 to 2 mm / s; the wavelength range of the third UV light is 365 to 425 nm, the curing time of the third UV light on the GDM adhesive (5) is 0.7 to 1.1 s, and the energy of the third UV light is 50 to 100 mJ / cm. 2 .

7. The method of use according to claim 6, characterized in that: The roller pressure of the third roller is 0.4 MPa, the roller speed of the third roller is 2.0 mm / s, and the curing time of the third UV light on the GDM adhesive (5) is 0.8 s.

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