Scanning exposure device, scanning exposure method, and article manufacturing method

Abstract

The present disclosure relates to a scanning exposure device, a scanning exposure method, and an article manufacturing method. The scanning exposure device scans an original plate with respect to an illumination area illuminated by an illumination optical system, and scans the substrate while scanning and exposing the substrate in synchronization with the scanning of the original plate. The scanning exposure device comprises: a first adjustment mechanism for adjusting the illumination distribution of exposure light irradiated on an overlapping area of ​​the first and second areas in a mode of performing scanning exposure of a first area of ​​the substrate and scanning exposure of a second area that partially overlaps with the first area; a second adjustment mechanism for adjusting the shape of the illumination area; and a control unit for performing a first adjustment action for operating the first adjustment mechanism so that the exposure amount exceeds a target exposure amount in the entire overlapping area, and then performing a second adjustment action for operating the second adjustment mechanism so that the exposure amount in the overlapping area converges to an allowable range of the target exposure amount.

Description

Technical Field

[0001] The present invention relates to a scanning exposure device, a scanning exposure method and an article manufacturing method. Background Art

[0002] Patent document 1 describes a method for exposing a substrate via a projection optical system in a scanning exposure device that moves the substrate synchronously with an original plate while exposing the substrate. The method exposes the first shot area and the second shot area in such a manner that the first shot area and the second shot area partially overlap. Here, the first shot area and the second shot area are arranged in a non-scanning direction that is orthogonal to the scanning direction of the original plate and the substrate. In the exposure method of patent document 1, a first step of measuring the exposure amount of the overlapping connecting portion of the first shot area and the second shot area, and a second step of changing the position of a movable light-shielding member provided between the projection optical system and the substrate to change the exposure amount of the connecting portion are repeated. Thus, the relationship between the exposure amount of the connecting portion (overlapping area) and the position of the light-shielding member can be obtained, and based on this relationship, the uniformity of the exposure amount of the first shot area and the second shot area is adjusted according to the position of the light-shielding member.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-053888 Summary of the Invention

[0006] In an exposure device, the illumination distribution within the exposure area may be uneven. Possible causes include uneven thickness of the surface of optical components in the projection optical system, uneven reflectivity due to contamination, and insufficient calibration of optical components such as fly-eye lenses used to achieve uniform illumination distribution within the exposure area.

[0007] When the exposure amount in the connection part (overlapping area) is adjusted by adjusting the light-shielding component and then the exposure amount in the exposure area is uniformly adjusted by the variable slit mechanism that specifies the illumination area of ​​the original plate, the range that can be adjusted by the variable slit mechanism is insufficient and the target exposure amount may not be obtained.

[0008] An object of the present invention is to provide a technique that is effective in solving the problem of insufficient exposure when performing scanning exposure of a first region of a substrate and scanning exposure of a second region partially overlapping the first region.

[0009] The first aspect of the present invention relates to a scanning exposure device that scans an original plate with respect to an illumination area illuminated by an illumination optical system, and scans a substrate while performing scanning exposure on the substrate synchronously with the scanning of the original plate, the scanning exposure device comprising: a first adjustment mechanism that adjusts the illumination distribution of exposure light irradiated onto an overlapping area of ​​the first area and the second area in a mode of performing scanning exposure of a first area of ​​the substrate and scanning exposure of a second area that partially overlaps with the first area; a second adjustment mechanism that adjusts the shape of the illumination area; and a control unit that, after executing a first adjustment action of causing the first adjustment mechanism to operate in a manner that causes the exposure amount to exceed a target exposure amount in the entire overlapping area, executes a second adjustment action of causing the second adjustment mechanism to operate in a manner that causes the exposure amount to converge within an allowable range of the target exposure amount in the overlapping area.

[0010] The second aspect of the present invention relates to a method for manufacturing an article, which includes: an exposure process, using the scanning exposure device of the first aspect to expose a substrate; a development process, developing the substrate exposed in the exposure process; and a processing process, processing the substrate developed in the development process, and obtaining an article from the substrate processed in the processing process.

[0011] The third aspect of the present invention relates to a scanning exposure method performed by a scanning exposure device, wherein the scanning exposure device scans an original plate with respect to an illumination area illuminated by an illumination optical system, and scans the substrate while scanning and exposing the substrate synchronously with the scanning of the original plate, the scanning exposure device comprising: a first adjustment mechanism for adjusting the illumination distribution of exposure light irradiated on an overlapping area of ​​the first area and the second area in a mode of scanning and exposing the first area of ​​the substrate and then scanning and exposing the second area partially overlapping with the first area; and a second adjustment mechanism for adjusting the shape of the illumination area, the scanning exposure method comprising: an adjustment step for performing a first adjustment action for causing the first adjustment mechanism to operate in a manner that causes the exposure amount to exceed a target exposure amount in the entire overlapping area, and then performing a second adjustment action for causing the second adjustment mechanism to operate in a manner that causes the exposure amount to converge within an allowable range of the target exposure amount in the overlapping area; and an exposure step for performing a scanning exposure on the substrate by the scanning exposure device after the adjustment step.

[0012] According to the present invention, there is provided a technique which is advantageous for solving the problem of insufficient exposure when performing scanning exposure of a first region of a substrate and scanning exposure of a second region partially overlapping the first region. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a diagram schematically showing the structure of a scanning exposure device according to an embodiment.

[0014] Figure 2 It is a diagram schematically showing the structure of the second adjustment mechanism (variable slit mechanism).

[0015] Figure 3 It is a diagram schematically showing the structure of the first adjustment mechanism (light shielding member).

[0016] Figure 4 It is a diagram schematically showing adjustment of the illuminance distribution (exposure amount distribution) in the overlapping region by the first adjustment mechanism (light shielding member).

[0017] Figure 5 It is a diagram schematically showing adjustment of the illuminance distribution (exposure amount distribution) in the overlapping region by the first adjustment mechanism (light shielding member).

[0018] Figure 6 This is a diagram illustrating the operation of the scanning exposure device in the exposure area expansion mode.

[0019] Figure 7 It is a diagram schematically showing adjustment of the illuminance distribution (exposure amount distribution) in the overlapping area in the exposure area expansion mode.

[0020] (Explanation of Symbols)

[0021] EXP: scanning exposure device; 10: illumination optical system; AMA: first adjustment mechanism; AMB: second adjustment mechanism; 60L, 60R: light shielding members; 20: variable slit mechanism; 40: original plate; 80: substrate. DETAILED DESCRIPTION

[0022] The following embodiments are described in detail with reference to the accompanying drawings. The following embodiments do not limit the inventions described in the patent claims. While the embodiments describe multiple features, not all of these features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, identical or similar structures are denoted by the same reference numerals, and duplicate descriptions are omitted.

[0023] Figure 1The structure of a scanning exposure apparatus EXP according to one embodiment is schematically shown. The scanning exposure apparatus EXP may include an illumination optical system 10, a projection optical system 50, a plate holder 41, a plate drive mechanism 42, a substrate holder 81, a substrate drive mechanism 82, a first adjustment mechanism AMA, a second adjustment mechanism AMB, a sensor 70, and a control unit 90. The illumination optical system 10 illuminates an area within an illumination region of the plate 40 held by the plate holder 41. The projection optical system 50 projects a pattern within the illumination region of the plate 40 onto a substrate 80 held by the substrate holder 81. The projection optical system 50 may include, for example, a bending mirror 14, a concave mirror 12, and a convex mirror 15.

[0024] The original plate drive mechanism 42 scans the original plate 40 held by the original plate holder 41 in the scanning direction (a direction parallel to the Y direction). The substrate drive mechanism 82 drives the substrate 80 held by the substrate holder 81. The drive of the substrate 80 by the substrate drive mechanism 82 includes scanning the substrate 80 in the scanning direction in synchronization with the original plate 40. The scanning exposure device EXP scans the original plate 40 with respect to the illumination area illuminated by the illumination optical system 10, and performs scanning exposure on the substrate 80 while scanning the substrate 80 in synchronization with the scanning of the original plate 40.

[0025] The scanning exposure device EXP can have a mode for performing scanning exposure of a first area of ​​the substrate 80 and scanning exposure of a second area that partially overlaps with the first area (hereinafter referred to as the exposure area expansion mode). In the exposure area expansion mode, the pattern of the original plate 40 is transferred to an exposure area including the first area and the second area. Such an exposure area expansion mode is advantageous for transferring the pattern of the original plate 40 to an exposure area larger than the range that can be exposed by a single scanning exposure. The exposure area expansion mode can also be performed in a manner that transfers the pattern of the original plate to an exposure area consisting of a plurality of partial areas defined as having overlapping areas that overlap between adjacent partial areas. The first area and the second area described above are examples of a plurality of partial areas.

[0026] The first adjustment mechanism AMA can adjust the illumination distribution of the exposure light irradiated to the overlapping area of ​​the first area and the second area in the exposure area expansion mode. The second adjustment mechanism AMB can specify the shape of the illumination area of ​​the original plate 40 based on the illumination optical system 10. The sensor 70 detects the exposure light irradiated by the illumination optical system 10 via the projection optical system 50 to the surface of the configuration substrate 80. The sensor 70 can be mounted on the substrate holding portion 81, for example. The control unit 90 can be composed of, for example, FPGA (Field Programmable Gate Array), PLD (Programmable Logic Device), ASIC (Application Specific Integrated Circuit), or a general-purpose or dedicated computer programmed with a program, or a combination of all or part of them.

[0027] Figure 2 (a) and (b) show examples of the structure of the second adjustment mechanism AMB. The second adjustment mechanism AMB may include a variable slit mechanism 20. The variable slit mechanism 20 has a function of adjusting the shape of the slit (opening) 21. The light from the illumination optical system 10 that has passed through the slit 21 illuminates the original plate 40. Therefore, the second adjustment mechanism AMB or the variable slit mechanism 20 defines the illumination area illuminated by the illumination optical system 10 in the object plane (the plane on which the original plate 40 is arranged) of the projection optical system 50.

[0028] The variable slit mechanism 20 may include, for example, a plurality of drive mechanisms 22 arranged in a non-scanning direction (X direction) perpendicular to the scanning direction of the original plate 40 and substrate 80, and a plurality of aperture regulating members 23, each of which is controlled by the plurality of drive mechanisms 22 at a position in the scanning direction. Thus, the variable slit mechanism 20 can adjust the width of the illumination area in the scanning direction (Y direction) of the original plate 40 and substrate 80 at a plurality of positions in the direction perpendicular to the scanning direction (X direction). The variable slit mechanism 20 is configured so that light passing through the slit 21 is focused on an effective area 24 of the projection optical system 50 (an area guaranteed to be usable for exposing the substrate 80). The shape of the slit 21 is determined by the amount of drive of the aperture regulating members 23 by the plurality of drive mechanisms 22. The plurality of drive mechanisms 22 control the positions of the plurality of aperture regulating members 23 in accordance with commands from the control unit 90, thereby controlling the shape of the slit 21.

[0029] exist Figure 2In (c), the area of ​​the light incident on the concave mirror 12 of the projection optical system 50 after passing through the slit 21 is schematically shown. When the plurality of drive mechanisms 22 are moved in the scanning direction (Y direction), the size of the area of ​​the light incident on the concave mirror 12 is as follows: Figure 2 The variable slit mechanism 20 and the concave mirror 12 are designed so that the light passing through the slit 21 does not exceed the effective area of ​​the concave mirror 12 .

[0030] Figure 3 The schematic diagram shows an example of the structure and operation of the first adjustment mechanism AMA. The first adjustment mechanism AMA can include light shielding members 60L and 60R inserted into the optical path between the projection optical system 50 and the substrate 80. The light shielding members 60L and 60R can be made of metal, for example. The light shielding members 60L and 60R are configured to define the end portions in the non-scanning direction (X direction) of the irradiation area of ​​the exposure light EL directed to the substrate 80. The light shielding members 60L and 60R can have edges E extending in a direction intersecting the scanning direction (Y direction) of the original plate 40 and the substrate 80.

[0031] The first adjustment mechanism AMA includes a driving mechanism (not shown) for driving the light shielding members 60L and 60R in the Y direction. By driving the light shielding members 60L and 60R in the Y direction, the illuminance at the end portion in the non-scanning direction of the irradiation area of ​​the light EL on the substrate 80 can be changed. Figure 3 , regarding the positions of the light shielding members 60L and 60R, states S1 and S2 are shown.

[0032] exist Figure 4 In (a), it is shown that Figure 3 The illuminance distribution IL1(x) on the substrate formed by the light shielding member 60R on the right side in the state S1 and Figure 3 The illuminance distribution IL2(x) on the substrate is formed by the left shading member 60L in the state S1. Figure 4 (a) shows the cumulative illuminance distribution IL(x) achieved by exposure of the overlapping region based on the illuminance distribution IL1(x) and exposure of the overlapping region based on the illuminance distribution IL2(x).

[0033] Figure 4 (b) shows that Figure 3 The illuminance distribution IL1(x) on the substrate formed by the light shielding member 60R on the right side in the state S2 and Figure 3 The illuminance distribution IL2(x) on the substrate is formed by the light shielding member 60L on the left side in the state S3. Figure 4(b) shows the cumulative illuminance distribution IL(x) achieved by exposing the overlapping area based on illuminance distribution IL1(x) and the overlapping area based on illuminance distribution IL2(x). It can be seen that the cumulative illuminance in the overlapping area achieved in state S2 is greater than the cumulative illuminance in the overlapping area achieved in state S1.

[0034] exist Figure 5 , schematically illustrates a method for exposing the pattern of the original plate 40 to an exposure area 604 including the first area 601 and the second area 602 by scanning and exposing each of the first area 601 and the second area 602, which have an overlapping area 603 that is adjacent to each other in the non-scanning direction. Here, the second area 602 may be scanned and exposed after the first area 601 is scanned and exposed, or the first area 601 may be scanned and exposed after the second area 602 is scanned and exposed.

[0035] As shown in (a1), the first region 601 is scanned and exposed while the illumination distribution (exposure distribution) in the overlapping region 603 is controlled by the light shielding member 60R. As a result, the pattern of the original plate 40 is transferred to the first region 601 according to the exposure distribution that conforms to the illumination distribution IL1(x) shown in (b1). As shown in (a2), the second region 602 is scanned and exposed while the illumination distribution (exposure distribution) in the overlapping region 603 is controlled by the light shielding member 60L. As a result, the pattern of the original plate 40 is transferred to the second region 602 according to the exposure distribution that conforms to the illumination distribution IL2(x) shown in (b2). Through the exposure of the first and second regions 601, 602, the pattern of the original plate 40 is transferred to the exposure region 604 formed by the first and second regions 601, 602 according to the exposure distribution that conforms to the illumination distribution IL(x) shown in (d).

[0036] exist Figure 6 , the operation of the scanning exposure device EXP in the exposure area expansion mode is exemplified. This operation can be controlled by the control unit 90. Steps S601 to S605 are calibration operations, and step S605 is an exposure operation performed after the calibration operation.

[0037] In step S601, the control unit 90 performs a first measurement operation for obtaining a first exposure distribution along a non-scanning direction (X direction) orthogonal to the scanning direction (Y direction) of the original plate 40 and the substrate 80 with respect to the overlapping area 603 based on the detection result of the sensor 70. Specifically, the control unit 90 measures the exposure distribution E1(x) of the overlapping area 603 in the scanning exposure of the first area 601 and the exposure distribution E2(x) of the overlapping area 603 in the scanning exposure of the second area 602. Then, the control unit 90 calculates the exposure distribution E(x) of the overlapping area 603 that is repeatedly exposed by the scanning exposure of the first area 601 and the scanning exposure of the second area 602 based on the exposure distribution E1(x) and the exposure distribution E2(x). Here, E(x)=E1(x)+E2(x). In Figure 7 In (a), an example is shown in Figure 6 The exposure amount distribution E(x) of the overlapping area 603 obtained in step S601 can be performed in a state where the illumination area defined by the second adjustment mechanism AMB is at its maximum (a state where the width of the illumination area in the scanning direction is at its maximum).

[0038] To measure the exposure distribution E1(x), the control unit 90 positions the sensor 70 at an arbitrary position (x = xi) within the overlap region 603 and scans the substrate holding unit 81 in the scanning direction while controlling the illumination distribution within the overlap region 603 using the light shielding member 60R of the first adjustment mechanism AMA. This means that the sensor 70 is subjected to scanning exposure similar to the scanning exposure of the substrate 80. This results in the exposure distribution (xi) at x = xi within the overlap region 603. The control unit 90 repeats this operation multiple times while changing xi. This results in the exposure distribution E1(x) controlled by the light shielding member 60R.

[0039] Similarly, when measuring exposure distribution E2(x), the control unit 90 positions the sensor 70 at an arbitrary position (x = xi) within the overlap region 603 and scans the substrate holding unit 81 in the scanning direction while controlling the illumination distribution within the overlap region 603 using the light shielding member 60L of the first adjustment mechanism AMA. This means that the sensor 70 is subjected to scanning exposure similar to the scanning exposure of the substrate 80. This results in an exposure distribution E2(xi) at x = xi within the overlap region 603. The control unit 90 performs this operation multiple times while changing xi. This results in an exposure distribution E2(x) controlled by the light shielding member 60L.

[0040] In the above example, to obtain exposure distributions E1(x) and E2(x), sensors 70 are arranged at multiple locations, and scanning exposure is performed at each location. However, by using a line sensor having multiple pixels arranged in the non-scanning direction, exposure distributions E1(x) and E2(x) can each be obtained with a single scanning exposure.

[0041] In step S602, the control unit 90 determines whether the exposure amount in the exposure amount distribution E(x) obtained in step S601 exceeds the target exposure amount in the entire overlapping area 603. Then, the control unit 90 proceeds to step S604 when the exposure amount distribution E(x) obtained in step S601 exceeds the target exposure amount in the entire overlapping area 603. On the other hand, when the exposure amount in the exposure amount distribution E(x) obtained in step S601 does not exceed the target exposure amount in the entire overlapping area 603, the control unit 90 proceeds to step S603. For example, Figure 7 In (a), the exposure amount is lower than the target exposure amount at a portion of the overlapping region 603 .

[0042] In step S603, the control unit 90 Figure 7 As shown in (b) of FIG. 1 , the first adjustment operation is performed to operate the first adjustment mechanism AMA so that the exposure amount exceeds the target exposure amount in the entire overlapping area 603. This can be achieved by Figure 3 As shown as state S2 in FIG, the light shielding members 60L and 60R are driven in a direction in which the light shielding amount by the light shielding members 60L and 60R decreases. Step S603 can be performed in a state where the illumination area defined by the second adjustment mechanism AMB is at its maximum (a state where the width of the illumination area in the scanning direction is at its maximum).

[0043] In step S604, the control unit 90 performs a second measurement operation for acquiring a second exposure distribution along a non-scanning direction (X direction) perpendicular to the scanning direction (Y direction) of the original plate 40 and the substrate 80, with respect to the overlap region 603, based on the detection result of the sensor 70. The second measurement operation in step S604 can be performed in the same manner as the first measurement operation in step S601.

[0044] In step S605, the control unit 90 performs the following operations based on the second exposure distribution obtained in step S604: Figure 7As illustrated in (d) of FIG6 , the second adjustment mechanism AMB is controlled so that the exposure amount (exposure amount distribution) in the overlapping area 603 converges within the permissible range of the target exposure amount. The adjustment may include adjusting the positions of the multiple opening regulation members 23 in the variable slit mechanism 20 so that the exposure amount (exposure amount distribution) in the overlapping area 603 converges within the permissible range of the target exposure amount. Step S605 may also include a step of confirming whether the exposure amount in the overlapping area 603 converges within the permissible range of the target exposure amount after the second adjustment mechanism AMB is activated. In this case, the adjustment performed by the second adjustment mechanism AMB can be repeated before the exposure amount (exposure amount distribution) in the overlapping area 603 converges within the permissible range of the target exposure amount. In step S605, the second adjustment mechanism AMB can be adjusted in the direction of reducing the width in the scanning direction of the illumination area specified by the second adjustment mechanism AMB. That is, step S605 starts when the exposure amount of the entire area of ​​the overlapping area 603 is sufficient. Therefore, insufficient exposure will not occur due to the adjustment of the exposure amount (exposure amount distribution) by the second adjustment mechanism AMB.

[0045] In step S606, the control unit 90 performs exposure on the substrate 80 using the scanning exposure device EXP adjusted in steps S601 to S605. Figure 6 , although it is described that steps S601 to S605 are performed before step S606, steps S601 to S605 can be performed arbitrarily.

[0046] The following is an illustrative description of an article manufacturing method that can be implemented using the above-mentioned scanning exposure device. This article manufacturing method is suitable for manufacturing devices (semiconductor elements, magnetic storage media, liquid crystal display elements, etc.), color filters and other articles. The article manufacturing method may include: an exposure process, using the above-mentioned scanning exposure device to expose a substrate coated with a photosensitive agent; a development process, developing the substrate exposed in the exposure process; and a processing process, processing the substrate developed in the development process. In addition, the manufacturing method may include other well-known processes (oxidation, film formation, evaporation, doping, flattening, etching, resist stripping, cutting, bonding, packaging, etc.). Compared with the past, this article manufacturing method is advantageous in at least one of the performance, quality, productivity and production cost of the article.

[0047] The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, claims are appended to disclose the scope of the invention.

Claims

1. A scanning exposure device that scans an original plate with respect to an illumination area illuminated by an illumination optical system and scans a substrate synchronously with the scanning of the original plate while performing scanning exposure on the substrate, the scanning exposure device comprising: a first adjustment mechanism disposed between a projection optical system for projecting a pattern of the original onto the substrate and the substrate, and configured to adjust an illumination distribution of exposure light irradiated onto an overlapping region between the first region and the second region in a mode of performing scanning exposure of a first region of the substrate and scanning exposure of a second region partially overlapping the first region; a second adjustment mechanism, disposed between the illumination optical system and the original plate, for adjusting the shape of the illumination area; as well as The control unit performs a first adjustment action to cause the first adjustment mechanism to operate in such a manner that the exposure amount in the entire area of ​​the overlapping area exceeds the target exposure amount, and then performs a second adjustment action to cause the second adjustment mechanism to operate in such a manner that the exposure amount in the overlapping area converges to an allowable range of the target exposure amount.

2. The scanning exposure device according to claim 1, wherein The first adjustment mechanism includes a light shielding member inserted into an optical path between the projection optical system and the substrate.

3. The scanning exposure device according to claim 2, wherein: The light shielding member has an edge extending in a direction intersecting with a scanning direction of the original plate and the substrate.

4. The scanning exposure device according to claim 1, wherein The second adjustment mechanism includes a variable slit mechanism, and the variable slit mechanism is arranged between the illumination optical system and the original plate.

5. The scanning exposure device according to claim 4, wherein: The variable slit mechanism adjusts the width of the illumination area in the scanning direction at a plurality of positions in a direction perpendicular to the scanning direction of the original plate and the substrate.

6. The scanning exposure device according to claim 1, wherein The scanning exposure device further includes a sensor that detects light irradiated onto the surface on which the substrate is arranged. The control unit executes the first adjustment operation and the second adjustment operation based on the detection result of the sensor.

7. The scanning exposure device according to claim 6, wherein: The control unit performs a first measurement operation for acquiring a first exposure distribution along a non-scanning direction orthogonal to the scanning directions of the original plate and the substrate with respect to the overlapping region based on the detection result of the sensor, and performs the first adjustment operation based on the first exposure distribution. The control unit performs a second measurement operation to obtain a second exposure amount distribution along the non-scanning direction for the overlapping region based on a detection result of the sensor, and performs the second adjustment operation based on the second exposure amount distribution.

8. The scanning exposure device according to claim 7, wherein: The control unit performs the first adjustment operation when the first exposure amount distribution does not exceed the target exposure amount in the entire overlapping region.

9. A method for manufacturing an article, characterized in that: include: an exposure step of exposing the substrate using the scanning exposure device according to any one of claims 1 to 8; a developing step of developing the substrate exposed in the exposing step; as well as a processing step of processing the substrate developed in the developing step, An article is obtained from the substrate processed in the processing step.

10. A scanning exposure method, wherein the scanning exposure method is performed by a scanning exposure device, wherein the scanning exposure device scans an original plate with respect to an illumination area illuminated by an illumination optical system, and scans a substrate synchronously with the scanning of the original plate while performing scanning exposure on the substrate, wherein the scanning exposure method is characterized in that: The scanning exposure device includes: a first adjustment mechanism disposed between a projection optical system for projecting a pattern of the original onto the substrate and the substrate, and configured to adjust an illumination distribution of exposure light irradiated onto an overlapping region between the first and second regions in a mode in which scanning exposure is performed on a first region of the substrate and then scanning exposure is performed on a second region partially overlapping the first region; and a second adjustment mechanism, disposed between the illumination optical system and the original plate, for adjusting the shape of the illumination area. The scanning exposure method comprises: an adjustment step of performing a first adjustment operation of operating the first adjustment mechanism so that the exposure amount in the entire overlap region exceeds the target exposure amount, and then performing a second adjustment operation of operating the second adjustment mechanism so that the exposure amount in the overlap region converges to an allowable range of the target exposure amount; as well as The exposure step is to perform scanning exposure on the substrate by the scanning exposure device after the adjustment step.

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