Radiation detector and radiation image capturing apparatus

Abstract

The present invention provides a radiation detector and a radiation imaging apparatus. A sensor substrate forms a plurality of pixels in a pixel region on a first surface of a flexible substrate and has a terminal portion for electrically connecting a cable provided in a terminal region on the first surface. A conversion layer is provided outside the terminal region of the substrate and converts radiation into light. A reinforcing member is provided on a second surface of the substrate and reinforces the strength of the substrate. A stress neutral plane adjusting member is provided in the terminal region and corresponds to at least a part of the terminal region of the cable electrically connected to the terminal portion, and adjusts the position of the stress neutral plane in a region corresponding to the laminate, and can simply suppress disconnection of the electrical connection between the cable and the terminal portion. The laminate includes a reinforcing member, a terminal portion of the sensor substrate, and a cable electrically connected to the terminal portion.

Description

Technical Field

[0001] The present invention relates to a radiation detector and a radiation image photographing apparatus. Background Art

[0002] Conventionally, a radiation image photographing apparatus that performs radiation photography for medical diagnosis has been known. In such a radiation image photographing apparatus, a radiation detector that detects radiation that has passed through a subject and generates a radiation image is used.

[0003] As a radiation detector, there is a radiation detector that includes: a conversion layer such as a scintillator that converts radiation into light; and a substrate provided with a plurality of pixels that accumulate charges generated from the light converted by the conversion layer.

[0004] The following problems are known: Sometimes, a force acts in the direction in which the end of the radiation detector bends, and stress is applied to a cable electrically connected to the end of the radiation detector, and the electrical connection between the radiation detector and the cable is disconnected. As a technique for solving this problem, for example, in the technique described in Japanese Unexamined Patent Application Publication No. 2018-119891, the end of the radiation detector and the cable (flexible wiring board) are fixed to the side surface of a base, thereby suppressing warping of the end of the radiation detector. Summary of the Invention

[0005] Technical Problem to be Solved by the Invention

[0006] However, there is a radiation detector that uses a flexible substrate on a substrate as a radiation detector. By using a flexible substrate, for example, the radiation detector and the radiation image photographing apparatus can be made lighter, and it is sometimes easy to photograph a subject.

[0007] A substrate using a flexible substrate is easily bent. In particular, during the manufacturing process of a radiation image photographing apparatus or the like, the substrate is easily bent in a state where a cable is electrically connected to a terminal portion provided in the radiation detector. In the technique described in Japanese Unexamined Patent Application Publication No. 2018-119891, warping (bending) of a radiation detector having a substrate using a flexible substrate cannot sometimes be sufficiently suppressed.

[0008] The present invention provides a radiation detector and a radiation image photographing apparatus that can easily suppress disconnection of the electrical connection between a cable and a terminal portion.

[0009] Means for Solving the Technical Problem

[0010] The radiation detector according to the first aspect of the present invention includes: a substrate having a plurality of pixels formed in a pixel region on a first surface of a flexible substrate and configured to accumulate charges generated from light converted from radiation, and a terminal portion for electrically connecting a cable provided in a terminal region on the first surface; a conversion layer provided outside the terminal region in the first surface of the substrate and configured to convert radiation into light; a reinforcing member provided on a second surface of the substrate opposite to the first surface and configured to reinforce the strength of the substrate; and a stress neutral plane adjusting member provided in at least a part of the terminal region corresponding to the cable electrically connected to the terminal portion, and configured to adjust the position of the stress neutral plane in a region corresponding to the laminate in which the reinforcing member, the terminal portion of the substrate, and the cable electrically connected to the terminal portion are laminated.

[0011] Moreover, in the radiation detector according to the second aspect of the present invention, in the radiation detector according to the first aspect, the stress neutral plane adjusting member adjusts the position of the stress neutral plane in the stacking direction of the laminate within a predetermined range from the interface where the cable is electrically connected to the terminal portion.

[0012] Moreover, in the radiation detector according to the third aspect of the present invention, in the radiation detector according to the second aspect, the position within the predetermined range is a position within the laminate.

[0013] Moreover, in the radiation detector according to the fourth aspect of the present invention, in the radiation detector according to any one of the first to third aspects, the bending rigidity of the stress neutral plane adjusting member is 540 Pacm 4 or more and 140000 Pacm 4 or less.

[0014] Moreover, in the radiation detector according to the fifth aspect of the present invention, in the radiation detector according to any one of the first to fourth aspects, the bending elastic modulus of the stress neutral plane adjusting member is 150 MPa or more and 2500 MPa or less.

[0015] Moreover, in the radiation detector according to the sixth aspect of the present invention, in the radiation detector according to any one of the first to fifth aspects, a plurality of terminal portions are provided on the substrate, and the stress neutral plane adjusting member is provided on at least one or more of the terminal portions.

[0016] Moreover, in the radiation detector according to the seventh aspect of the present invention, in the radiation detector according to any one of the first to sixth aspects, a reinforcing member for strengthening the electrical connection between the cable and the terminal portion is further provided, and the stress neutral plane adjusting member is provided on at least a part of the cable covered by the reinforcing member.

[0017] Moreover, in the radiation detector according to the eighth aspect of the present invention, in the radiation detector according to the seventh aspect, the reinforcing member further has moisture resistance.

[0018] Moreover, in the radiation detector according to the ninth aspect of the present invention, in the radiation detector according to any one of the first to sixth aspects, the stress neutral plane adjusting member further strengthens the electrical connection between the cable and the terminal portion.

[0019] Moreover, in the radiation detector according to the tenth aspect of the present invention, in the radiation detector according to the ninth aspect, the stress neutral plane adjusting member further has moisture resistance.

[0020] Moreover, in the radiation detector according to the eleventh aspect of the present invention, in the radiation detector according to any one of the first to tenth aspects, the stress neutral plane adjusting member further contacts the end portion of the conversion layer.

[0021] Moreover, in the radiation detector according to the twelfth aspect of the present invention, in the radiation detector according to any one of the first to eleventh aspects, a reinforcing layer is further provided, the reinforcing layer is provided on the surface of the conversion layer opposite to the surface on the substrate side, and has a higher rigidity than the substrate.

[0022] Moreover, the radiation image photographing apparatus according to the thirteenth aspect of the present invention includes: a radiation detector according to any one of the first to twelfth aspects; a control unit that outputs a control signal for reading out charges accumulated in a plurality of pixels; a driving unit that is electrically connected to the terminal portion of the radiation detector via a cable, and outputs a driving signal for reading out charges from the plurality of pixels according to the control signal; and a signal processing unit that is electrically connected to the terminal portion of the radiation detector via a cable, inputs an electrical signal corresponding to the charges read out from the plurality of pixels, and generates and outputs image data corresponding to the input electrical signal.

[0023] Moreover, the radiation image photographing apparatus according to the fourteenth aspect of the present invention, in the radiation image photographing apparatus according to the thirteenth aspect, further includes a frame body that has an irradiation surface for irradiating radiation, and the radiation detector is housed in a state where the sensor substrate faces the irradiation surface in the sensor substrate and the conversion layer of the radiation detector.

[0024] Advantageous Effects of the Invention

[0025] According to the present invention, it is possible to simply prevent the electrical connection between the cable and the terminal portion from being disconnected. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a block diagram showing an example of the main part structure of the electrical system in the radiation image photographing apparatus according to the embodiment.

[0027] Figure 2 It is a top view showing an example of the radiation detector according to the embodiment as viewed from the first surface side of the substrate.

[0028] Figure 3A is Figure 2A-A cross-sectional view of the radiation detector shown

[0029] Figure 3B is Figure 2 B-B cross-sectional view of the radiation detector shown

[0030] Figure 4A is a schematic diagram for explaining the function of the stress neutral plane adjustment component

[0031] Figure 4B is a schematic diagram for explaining the function of the stress neutral plane adjustment component

[0032] Figure 5 is a schematic diagram for explaining the function of the stress neutral plane adjustment component

[0033] Figure 6A is a diagram for explaining an example of the manufacturing method of the radiation detector according to the embodiment

[0034] Figure 6B is a diagram for explaining an example of the manufacturing method of the radiation detector according to the embodiment

[0035] Figure 6C is a diagram for explaining an example of the manufacturing method of the radiation detector according to the embodiment

[0036] Figure 6D is a diagram for explaining an example of the manufacturing method of the radiation detector according to the embodiment

[0037] Figure 6E is a diagram for explaining an example of the manufacturing method of the radiation detector according to the embodiment

[0038] Figure 7 is a B-B cross-sectional view of the radiation detector of Modification 1

[0039] Figure 8A is a B-B cross-sectional view of an example of the radiation detector of Modification 2

[0040] Figure 8B is a B-B cross-sectional view of another example of the radiation detector of Modification 2

[0041] Figure 9 is a top view of an example of the radiation detector of Modification 3 as viewed from the first surface side of the substrate

[0042] Figure 10 is an A-A cross-sectional view of an example of the radiation detector of Modification 4

[0043] Figure 11 is an A-A cross-sectional view of an example of the radiation detector of Modification 5

[0044] Figure 12 It is a top view of another example of the radiation detector as viewed from the first surface side of the base material.

[0045] Figure 13 It is a sectional view taken along line A-A of another example of the radiation detector.

[0046] Figure 14 It is a sectional view of an example of a radiation image photographing apparatus according to an embodiment in a state of being housed in a housing.

[0047] Figure 15 It is a sectional view of another example of a radiation image photographing apparatus according to an embodiment in a state of being housed in a housing.

[0048] Figure 16 It is a sectional view of another example of a radiation image photographing apparatus according to an embodiment in a state of being housed in a housing. Detailed Embodiments

[0049] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, the present embodiments do not limit the present invention.

[0050] The radiation detector according to the present embodiment has a function of detecting radiation that has passed through a subject and outputting image information representing a radiation image of the subject. The radiation detector according to the present embodiment includes a sensor substrate and a conversion layer that converts radiation into light (refer to Figure 2 the sensor substrate 12 and the conversion layer 14 of the radiation detector 10 in

[0051] First, Figure 1 a summary of an example of the structure of the electrical system in the radiation image photographing apparatus according to the present embodiment will be described. Figure 1 It is a block diagram showing an example of the main part structure of the electrical system in the radiation image photographing apparatus according to the present embodiment.

[0052] As Figure 1 shown, the radiation image photographing apparatus 1 according to the present embodiment includes a radiation detector 10, a control unit 100, a drive unit 102, a signal processing unit 104, an image memory 106, and a power supply unit 108.

[0053] The radiation detector 10 includes a sensor substrate 12 and a conversion layer that converts radiation into light (refer to Figure 2 ). The sensor substrate 12 includes a flexible substrate 11 and a plurality of pixels 30 provided on the first surface 11A of the substrate 11. In addition, hereinafter, the plurality of pixels 30 may sometimes be simply referred to as "pixels 30".

[0054] AsFigure 1 As shown, each pixel 30 of the present embodiment includes a sensor unit 34 that generates and accumulates charges based on light converted by a conversion layer, and a switching element 32 that reads out the charges accumulated in the sensor unit 34. In the present embodiment, as an example, a thin film transistor (TFT: Thin Film Transistor) is used as the switching element 32. Therefore, hereinafter, the switching element 32 will be referred to as "TFT 32". In the present embodiment, the sensor unit 34 and the TFT 32 are formed, and further, a layer in which the pixels 30 are formed is provided as a planarized layer on the first surface 11A of the substrate 11.

[0055] The pixels 30 are two-dimensionally arranged in the pixel region 35 of the sensor substrate 12 along one direction (the scanning wiring direction corresponding to the lateral direction of Figure 1 , hereinafter also referred to as the "row direction") and the crossing direction crossing the row direction (the signal wiring direction corresponding to the longitudinal direction of Figure 1 , hereinafter also referred to as the "column direction"). Figure 1 In , the arrangement of the pixels 30 is simply shown. For example, 1024 × 1024 pixels 30 are arranged in the row direction and the column direction.

[0056] Moreover, in the radiation detector 10, a plurality of scanning wirings 38 and a plurality of signal wirings 36 are provided so as to cross each other. The plurality of scanning wirings 38 exist in each row of the pixels 30 and are used to control the switching state (on and off) of the TFT 32. The plurality of signal wirings 36 exist in each column of the pixels 30 and read out the charges accumulated in the sensor unit 34. Each of the plurality of scanning wirings 38 is connected to the driving unit 102 via a cable 112A (refer to Figure 2 ), whereby a driving signal for driving the TFT 32 to control the switching state output from the driving unit 102 flows through each of the plurality of scanning wirings 38. And each of the plurality of signal wirings 36 is connected to the signal processing unit 104 via a cable 112B (refer to Figure 2 ), whereby the charges read out from each pixel 30 are output to the signal processing unit 104 as an electric signal. The signal processing unit 104 generates and outputs image data corresponding to the input electric signal.

[0057] A control unit 100 described later is connected to the signal processing unit 104, and the image data output from the signal processing unit 104 is sequentially output to the control unit 100. An image memory 106 is connected to the control unit 100, and the image data sequentially output from the signal processing unit 104 is sequentially stored in the image memory 106 based on the control of the control unit 100. The image memory 106 has a storage capacity capable of storing a predetermined number of sheets of image data. Each time a radiation image is taken, the image data obtained by the shooting is sequentially stored in the image memory 106.

[0058] The control unit 100 includes a CPU (Central Processing Unit), a memory 100B including a ROM (ReadOnly Memory) and a RAM (Random Access Memory), and a non-volatile storage unit 100C such as a flash memory. As an example of the control unit 100, a microcomputer or the like can be cited. The control unit 100 controls the overall operation of the radiation image capturing apparatus 1.

[0059] In addition, in the radiation image capturing apparatus 1 of the present embodiment, the image memory 106, the control unit 100, etc. are formed on the control substrate 110.

[0060] Moreover, in the sensor unit 34 of each pixel 30, a common wiring 39 is provided in the wiring direction of the signal wiring 36 in order to apply a bias voltage to each pixel 30. The common wiring 39 is connected to a bias power supply (not shown) outside the sensor substrate 12, whereby a bias voltage is applied to each pixel 30 from the bias power supply.

[0061] The power supply unit 108 supplies power to various components or various circuits such as the control unit 100, the drive unit 102, the signal processing unit 104, the image memory 106, and the power supply unit 108. In addition, Figure 1 in order to avoid complication, the illustration of the wiring connecting the power supply unit 108 to various components or various circuits is omitted.

[0062] In addition, the radiation image capturing apparatus 1 will be described in detail. Figure 2 is an example of a top view of the radiation detector 10 of the present embodiment as viewed from the first surface 11A side of the base material 11. And, Figure 3A is Figure 2 an example of a cross-sectional view taken along line A-A of the radiation detector 10 in Figure 3B is Figure 2 an example of a cross-sectional view taken along line B-B of the radiation detector 10 in

[0063] The first surface 11A of the base material 11 is divided into a terminal region 60A where the terminal portion 60 is provided and an outside of the terminal region 60B where the terminal portion 60 is not provided. The pixel region 35 where the above-described pixel 30 is provided is provided on the outside of the terminal region 60B.

[0064] The base material 11 is flexible, for example, a resin sheet containing plastics such as PI (PolyImide). The thickness of the base material 11 only needs to be a thickness that can obtain the desired flexibility according to the hardness of the material and the size of the sensor substrate 12 (the area of the first surface 11A or the second surface 11B). As an example of having flexibility, in the case of a rectangular base material 11 monomer, when one side of the base material 11 is fixed, at a position 10 cm away from the fixed side, due to the gravity of the self-weight of the base material 11, the base material 11 sags by 2 mm or more (becomes lower than the height of the fixed side). As a specific example when the base material 11 is a resin sheet, a thickness of 5 μm to 125 μm is sufficient, and a thickness of 20 μm to 50 μm is more preferable.

[0065] In addition, the base material 11 has the characteristics capable of withstanding the manufacture of the pixel 30. In the present embodiment, it has the characteristics capable of withstanding the manufacture of an amorphous silicon TFT (a-Si TFT). As the characteristics of such a base material 11, the coefficient of thermal expansion (CTE: Coefficient of Thermal Expansion) at 300°C to 400°C is preferably the same level as that of an amorphous silicon (Si) wafer (for example, ±5 ppm / K), specifically, preferably 20 ppm / K or less. And, as the thermal shrinkage rate of the base material 11, in a state where the thickness is 25 μm, the thermal shrinkage rate at 400°C is preferably 0.5% or less. And, the elastic modulus of the base material 11 does not have a transition point that a normal PI has in the temperature range between 300°C and 400°C, and the elastic modulus at 500°C is preferably 1 GPa or more.

[0066] And, in order to suppress the backward scattered light based on itself, the base material 11 of the present embodiment preferably has a fine particle layer containing inorganic fine particles with an average particle diameter of 0.05 μm or more and 2.5 μm or less and absorbing the backward scattered light. In addition, as such inorganic fine particles, in the case of a resinous base material 11, it is preferable to use an inorganic substance with an atomic number greater than that of the organic substance constituting the base material 11 and 30 or less. As a specific example of such fine particles, oxides of Si with an atomic number of 14, i.e., SiO2, oxides of Mg with an atomic number of 12, i.e., MgO, oxides of Al with an atomic number of 13, i.e., Al2O3, and oxides of Ti with an atomic number of 22, i.e., TiO2, etc. can be cited. As a specific example of a resin sheet having such characteristics, XENOMAX (registered trademark) can be cited.

[0067] In addition, the above thickness in this embodiment was measured using a micrometer. The coefficient of thermal expansion was measured according to JIS K7197:1991. In addition, for the measurement, test pieces were cut by changing the angle by 15 degrees every time from the main surface of the base material 11, the coefficient of thermal expansion of each cut test piece was measured, and the highest value was set as the coefficient of thermal expansion of the base material 11. In the MD (Machine Direction: longitudinal) direction and the TD (Transverse Direction: transverse) direction respectively, the coefficient of thermal expansion was measured at intervals of 10 °C from -50 °C to 450 °C, and (ppm / °C) was converted to (ppm / K). For the measurement of the coefficient of thermal expansion, a TMA4000S device manufactured by MAC Science was used, the sample length was set to 10 mm, the sample width was set to 2 mm, and the initial load was set to 34.5 g / mm 2 , the heating rate was set to 5 °C / min, and the environment was set to argon.

[0068] As the base material 11 having the desired flexibility, it is not limited to a resin base material such as a resin sheet. For example, the base material 11 can be a relatively thin glass substrate or the like. As a specific example when the base material 11 is a glass substrate, if the thickness is 0.3 mm or less in a size of about 43 cm on one side, it has flexibility, so as long as the thickness is 0.3 mm or less, it can be the desired glass substrate.

[0069] As Figure 2 and Figure 3A shown, a plurality of pixels 30 are provided in a part of the region inside the outside 60B of the terminal region in the first surface 11A of the base material 11. And in the sensor substrate 12 of this embodiment, no pixel 30 is provided on the terminal region 60A in the first surface 11A of the base material 11. In this embodiment, the region where the pixel 30 is provided in the first surface 11A of the base material 11 is set as the pixel region 35.

[0070] And, as Figure 2 and Figure 3A shown, the conversion layer 14 of this embodiment covers the pixel region 35. In this embodiment, as an example of the conversion layer 14, a scintillator containing CsI (cesium iodide) is used. As such a scintillator, for example, CsI:Tl (cesium iodide added with thallium) or CsI:Na (cesium iodide added with sodium) whose emission spectrum when irradiating X-rays is 400 nm to 700 nm is preferably included. In addition, the emission peak wavelength in the visible light region of CsI:Tl is 565 nm.

[0071] As Figure 3A shown, an adhesive layer 40, a reflective layer 42, an adhesive layer 44, and a protective layer 46 are provided on the conversion layer 14 of this embodiment.

[0072] The adhesive layer 40 covers the entire surface of the conversion layer 14. The adhesive layer 40 has the function of fixing the reflective layer 42 to the conversion layer 14. The adhesive layer 40 preferably has light transmissivity. As the material of the adhesive layer 40, for example, acrylic adhesives, hot-melt adhesives, and silicone adhesives can be used. As acrylic adhesives, for example, polyurethane acrylate, acrylate resin acrylate, and epoxy acrylate can be cited. As hot-melt adhesives, for example, thermoplastics such as EVA (ethylene-vinyl acetate copolymer resin), EAA (ethylene-acrylic acid copolymer resin), EEA (ethylene-ethyl acrylate copolymer resin), and EMMA (ethylene-methyl methacrylate copolymer) can be cited. The thickness of the adhesive layer 40 is preferably 2 μm or more and 7 μm or less. By setting the thickness of the adhesive layer 40 to 2 μm or more, the effect of fixing the reflective layer 42 to the conversion layer 14 can be fully exerted. In addition, the risk of forming an air layer between the conversion layer 14 and the reflective layer 42 can be suppressed. If an air layer is formed between the conversion layer 14 and the reflective layer 42, multiple reflections may occur in which the light emitted from the conversion layer 14 is repeatedly reflected between the air layer and the conversion layer 14 and between the air layer and the reflective layer 42. And by setting the thickness of the adhesive layer 40 to 7 μm or less, a decrease in MTF (Modulation Transfer Function) and DQE (Detective Quantum Efficiency) can be suppressed.

[0073] The reflective layer 42 covers the entire surface of the adhesive layer 40. The reflective layer 42 has the function of reflecting the light converted by the conversion layer 14. The reflective layer 42 is preferably made of an organic material. As the material of the reflective layer 42, for example, white PET (Polyethylene Terephthalate), TiO2, Al2O3, foamed white PET, polyester high-reflection sheets, and specularly reflective aluminum can be used. White PET is white PET to which a white pigment such as TiO2 or barium sulfate is added, and foamed white PET refers to white PET with a porous surface. And the polyester high-reflection sheet refers to a sheet (film) having a multilayer structure in which a plurality of thin polyester sheets are laminated. The thickness of the reflective layer 42 is preferably 10 μm or more and 40 μm or less.

[0074] The adhesive layer 44 covers the entire surface of the reflective layer 42. The end of the adhesive layer 44 extends to the surface of the sensor substrate 12. That is, the adhesive layer 44 is adhered to the sensor substrate 12 at its end. The adhesive layer 44 has a function of fixing the reflective layer 42 and the protective layer 46 to the conversion layer 14. As the material of the adhesive layer 44, the same material as that of the adhesive layer 40 can be used, but it is preferable that the adhesive force of the adhesive layer 44 is greater than the adhesive force of the adhesive layer 40.

[0075] The protective layer 46 covers the entire conversion layer 14 and is provided such that its end covers a part of the sensor substrate 12. The protective layer 46 functions as a moisture-proof film for preventing moisture from entering the conversion layer 14. As the material of the protective layer 46, for example, an organic film containing an organic material such as PET, PPS (PolyPhenylene Sulfide), OPP (Oriented PolyPropylene), PEN (PolyEthylene Naphthalate), PI, or PARYLENE (registered trademark) can also be used. Also, as the protective layer 46, a laminated film of a resin film and a metal film can be used. As the laminated film of a resin film and a metal film, for example, a sheet of ALPET (registered trademark) can be cited.

[0076] And, as Figure 3A and Figure 3B shown, a reinforcing member 50 is provided via an antistatic layer 54 and an adhesive 52 on the second surface 11B side of the base material 11 in the sensor substrate 12 of the radiation detector 10 of the present embodiment.

[0077] The reinforcing member 50 has a function of strengthening the strength of the base material 11. The bending rigidity of the reinforcing member 50 in the present embodiment is higher than that of the base material 11, and the dimensional change (deformation) with respect to the force applied in the vertical direction along the surface facing the conversion layer 14 is smaller than the dimensional change with respect to the force applied in the vertical direction along the second surface 11B of the base material 11. Specifically, the bending rigidity of the reinforcing member 50 is preferably 100 times or more that of the base material 11. Also, the thickness of the reinforcing member 50 in the present embodiment is thicker than the thickness of the base material 11. For example, when XENOMAX (registered trademark) is used as the base material 11, the thickness of the reinforcing member 50 is preferably about 0.2 mm to 0.25 mm.

[0078] Specifically, the reinforcing member 50 of the present embodiment preferably uses a raw material having a flexural modulus of elasticity of 150 MPa or more and 2,500 MPa or less. From the viewpoint of suppressing the flexure of the base material 11, it is preferable that the flexural rigidity of the reinforcing member 50 is higher than that of the base material 11. In addition, if the flexural modulus of elasticity decreases, the flexural rigidity also decreases. In order to obtain the desired flexural rigidity, it is necessary to increase the thickness of the reinforcing member 50, resulting in an increase in the overall thickness of the radiation detector 10. Considering the material of the reinforcing member 50 as described above, when attempting to obtain a flexural rigidity exceeding 140,000 Pacm 4 the thickness of the reinforcing member 50 has a tendency to become relatively thick. Therefore, in order to obtain appropriate rigidity and consider the overall thickness of the radiation detector 10, the flexural modulus of elasticity of the material for the reinforcing member 50 is more preferably 150 MPa or more and 2,500 MPa or less. Further, the flexural rigidity of the reinforcing member 50 is preferably 540 Pacm 4 or more and 140,000 Pacm 4 or less.

[0079] Moreover, the coefficient of thermal expansion of the reinforcing member 50 of the present embodiment is preferably close to the coefficient of thermal expansion of the material of the conversion layer 14, and more preferably the ratio of the coefficient of thermal expansion of the reinforcing member 50 to the coefficient of thermal expansion of the conversion layer 14 (coefficient of thermal expansion of the reinforcing member 50 / coefficient of thermal expansion of the conversion layer 14) is preferably 0.5 or more and 2 or less. As the coefficient of thermal expansion of such a reinforcing member 50, it is preferably 30 ppm / K or more and 80 ppm / K or less. For example, when the conversion layer 14 uses CsI:Tl as the material, the coefficient of thermal expansion is 50 ppm / K. In this case, as materials relatively close to the conversion layer 14, PVC (Polyvinyl Chloride) having a coefficient of thermal expansion of 60 ppm / K to 80 ppm / K, acrylic having a coefficient of thermal expansion of 70 ppm / K to 80 ppm / K, PET having a coefficient of thermal expansion of 65 ppm / K to 70 ppm / K, PC (Polycarbonate) having a coefficient of thermal expansion of 65 ppm / K, and Teflon (registered trademark) having a coefficient of thermal expansion of 45 ppm / K to 70 ppm / K can be cited. Further, considering the above-mentioned flexural modulus of elasticity, as the material of the reinforcing member 50, a material containing at least one of PET and PC is more preferable.

[0080] From the viewpoint of elasticity, the reinforcing member 50 preferably includes a material having a yield point. In addition, in the present embodiment, the "yield point" refers to the phenomenon in which the stress temporarily drops sharply when the material is stretched, refers to the point on the curve showing the relationship between stress and strain where the strain increases but the stress does not increase, and refers to the top of the stress-strain curve during the tensile strength test of the material. As resins having a yield point, generally, hard and highly viscous resins and soft, highly viscous, and medium-strength resins can be cited. As hard and highly viscous resins, for example, PC etc. can be cited. And, as soft, highly viscous, and medium-strength resins, for example, polypropylene etc. can be cited.

[0081] The reinforcing member 50 of the present embodiment is a substrate made of plastic. For the reasons described above, the plastic that becomes the material of the reinforcing member 50 is preferably a thermoplastic resin, and at least one of PC, PET, styrene, acrylic, polyacetate, nylon, polypropylene, ABS (Acrylonitrile Butadiene Styrene), engineering plastic, and polyphenylene ether can be cited. In addition, among these, the reinforcing member 50 is preferably at least one of polypropylene, ABS, engineering plastic, PET, and polyphenylene ether, more preferably at least one of styrene, acrylic, polyacetate, and nylon, and further preferably at least one of PC and PET.

[0082] On the other hand, in the terminal region 60A of the radiation detector 10 of the present embodiment, a plurality of (a total of 16 in the present embodiment) terminal portions 60 are provided. As Figure 2 shown, the terminal region 60A is provided on each of two intersecting sides of the rectangular sensor substrate 12 (base material 11). In addition, the terminal region 60A refers to the region in the first surface 11A of the base material 11 where a plurality of terminal portions 60 are provided, and at least includes the region where the terminal portion 60 contacts the first surface 11A. As an example, in the present embodiment, the region that extends over the entire side of the sensor substrate 12 (base material 11) where the terminal portion 60 is provided and at least includes the region where the terminal portion 60 contacts the first surface 11A is called the terminal region 60A.

[0083] As Figure 2 shown, the cable 112 is electrically connected to each of the terminal portions 60 provided in the terminal region 60A of the base material 11. Specifically, as Figure 2 shown, the cable 112A is connected to a plurality of ( Figure 2Thermocompression bonding is performed on each of the eight terminal portions 60 in the middle. The cable 112A is a so-called COF (Chip on Film), and a driving IC (Integrated Circuit) 210 is mounted on the cable 112A. The driving IC 210 is connected to a plurality of signal lines (refer to FIG. 4, signal line 113) included in the cable 112A. In addition, in the present embodiment, when the cable 112A and the cable 112B described later are collectively referred to without distinction, they are simply referred to as "cable 112".

[0084] The other end of the cable 112A, which is opposite to the end electrically connected to the terminal portion 60 of the sensor substrate 12, is electrically connected to the connection area 202 of the driving substrate 200. As an example, in the present embodiment, a plurality of signal lines (refer to Figure 4A , signal line 113) are thermocompression bonded to the driving substrate 200, and thus are connected to the circuits and components (not shown) mounted on the driving substrate 200. In addition, the method of electrically connecting the driving substrate 200 and the cable 112A is not limited to the present embodiment. For example, it can be set to be electrically connected by a connector. As such a connector, a ZIF (Zero Insertion Force) structure connector or a Non-ZIF structure connector can be cited.

[0085] The driving substrate 200 of the present embodiment is a flexible PCB (Printed Circuit Board) substrate, which is a so-called flexible substrate. And the circuit components (not shown) mounted on the driving substrate 200 are mainly components for processing digital signals (hereinafter referred to as "digital components"). Digital components tend to have a relatively smaller area (size) than the analog components described later. As a specific example of digital components, digital buffers, bypass capacitors, pull-up / pull-down resistors, damping resistors, and EMC (Electro Magnetic Compatibility) countermeasure chip components and power ICs can be cited. In addition, the driving substrate 200 is not necessarily a flexible substrate, and can be a non-flexible rigid substrate or a rigid-flex substrate.

[0086] In the present embodiment, the driving unit 102 is implemented by the driving substrate 200 and the driving IC 210 mounted on the cable 112A. In addition, in the driving IC 210, various circuits and components for implementing the driving unit 102 include circuits different from the digital components mounted on the driving substrate 200.

[0087] On the other hand, the cable 112B is electrically connected to a plurality of ( Figure 2Each of the eight terminal portions 60 is provided on a side that intersects with one side of the base material 11 to which the cable 112A is electrically connected. Similar to the cable 112A, the cable 112B is a so-called COF (Chip on Film), and a signal processing IC 310 is mounted on the cable 112B. The signal processing IC 310 is connected to a plurality of signal lines (refer to FIG. 4, signal line 113) included in the cable 112B.

[0088] The other end of the cable 112B, which is opposite to the end electrically connected to the terminal portion 60 of the sensor substrate 12, is electrically connected to the connection region 302 of the signal processing substrate 300. As an example, in the present embodiment, a plurality of signal lines (refer to Figure 4A , signal line 113) included in the cable 112B are thermocompression bonded to the signal processing substrate 300, and thus are connected to circuits and components (not shown) mounted on the signal processing substrate 300. In addition, the method of electrically connecting the signal processing substrate 300 and the cable 112B is not limited to the present embodiment. For example, it can be set to a method of electrically connecting through a connector. As such a connector, a connector with a ZIF (Zero Insertion Force) structure or a non-ZIF structure connector can be cited. And, the method of electrically connecting the cable 112A and the drive substrate 200 and the method of electrically connecting the cable 112B and the signal processing substrate 300 can be the same or different. For example, it can be set to a method in which the cable 112A is electrically connected to the drive substrate 200 by thermocompression bonding and the cable 112B is electrically connected to the signal processing substrate 300 by a connector.

[0089] Similar to the above-described drive substrate 200, the signal processing substrate 300 of the present embodiment is a flexible PCB substrate, which is a so-called flexible substrate. The circuit components (not shown) mounted on the signal processing substrate 300 are mainly components for processing analog signals (hereinafter, referred to as "analog components"). As a specific example of the analog components, a charge amplifier, an analog-to-digital converter (ADC), a digital-to-analog converter (DAC), and a power supply IC can be cited. And, the circuit components of the present embodiment also include a coil around a power supply that is relatively large in component size and a large-capacity capacitor for smoothing. In addition, the signal processing substrate 300 is not necessarily a flexible substrate, and a non-flexible rigid substrate or a rigid-flex substrate can also be used.

[0090] In the present embodiment, the signal processing unit 104 is implemented by the signal processing substrate 300 and the signal processing IC 310 mounted on the cable 112B. In addition, in the signal processing IC 310, various circuits and components that implement the signal processing unit 104 include circuits different from the analog components mounted on the signal processing substrate 300.

[0091] In addition, in the present embodiment, a method in which a plurality of ( Figure 2 in this case, every two) driving substrates 200 and signal processing substrates 300 are separately provided has been described, but the numbers of the driving substrate 200 and the signal processing substrate 300 are not limited to the present embodiment. For example, it may be a method in which either the driving substrate 200 or the signal processing substrate 300 is used as one substrate.

[0092] On the other hand, as Figure 3A and Figure 3B shown, in the radiation detector 10 of the present embodiment, the cable 112 and the terminal portion 60 are thermocompression bonded via the connection layer 62, whereby the cable 112 and the terminal portion 60 are electrically connected. In addition, Figure 3A and Figure 3B is a diagram showing an example of the structure related to the electrical connection of the cable 112A and the radiation detector 10, but the structure related to the electrical connection of the cable 112B and the radiation detector 10 in the present embodiment is also the same as the example shown in Figure 3A and Figure 3B .

[0093] The connection layer 62 has a function of electrically connecting the terminal portion 60 and the cable 112. As the connection layer 62, for example, an anisotropic conductive film or the like can be cited, and an ACF (Anisotropic Conductive Film) in which conductive particles (refer to Figure 4A , conductive particles 62A) are dispersed in an adhesive cured by heat can be used.

[0094] As Figure 3A and Figure 3B shown, the first surface 11A side of the base material 11 in the laminate 63 in which the terminal portion 60, the connection layer 62, and the cable 112 are laminated is covered by the reinforcing member 64. Also, the side surfaces of the laminate in which the terminal portion 60, the connection layer 62, and the cable 112 are laminated and the side surfaces of the base material 11 are covered by the reinforcing member 65. The reinforcing member 64 and the reinforcing member 65 have a function of strengthening the electrical connection between the terminal portion 60 and the cable 112. Also, the reinforcing member 64 and the reinforcing member 65 in the present embodiment have moisture resistance. As the reinforcing member 64 and the reinforcing member 65, for example, a moisture-proof insulating film can be used, and TUFFY: Tuffy (registered trademark) of a moisture-proof insulating material for FPD (Flat Panel Display) or the like can be used. In addition, each of the reinforcing member 64 and the reinforcing member 65 may be a member based on the same material or a member based on different materials.

[0095] In addition, as Figure 3A and Figure 3BAs shown, a stress neutral plane adjustment member 70 is provided via an adhesive 66 on a laminate 63 covered by a reinforcing member 64. The stress neutral plane adjustment member 70 adjusts the position in the stacking direction P of the laminate 63 in the region of the laminate 63 where the radiation detector 10 is provided when the bending radiation detector 10 with respect to the stress neutral plane 71 (reference Figure 5 , details will be described later). In the present embodiment, PET is used as an example of the stress neutral plane adjustment member 70, and white PET, foamed white PET, etc. may also be used. And, as another example of the stress neutral plane adjustment member 70, organic films such as PC, LDPE (Low Density Polyethylene), PPS, 0PP, PEN, and PI can be cited.

[0096] Moreover, the stress neutral plane adjustment member 70 of the present embodiment preferably uses a raw material having a flexural modulus of 150 MPa or more and 2500 MPa or less. The method for measuring the flexural modulus is based on, for example, JIS K7171:2016 standard. From the viewpoint of suppressing the deflection of the substrate 11, it is preferable that the flexural rigidity of the stress neutral plane adjustment member 70 is higher than that of the substrate 11. In addition, the flexural rigidity described here refers to the difficulty of bending, indicating that the higher the flexural rigidity, the more difficult it is to bend. If the flexural modulus decreases, the flexural rigidity also decreases. In order to obtain the desired flexural rigidity, it is necessary to increase the thickness of the stress neutral plane adjustment member 70, resulting in an increase in the overall thickness of the radiation detector 10. Considering the material of the stress neutral plane adjustment member 70 as described above, when attempting to obtain a flexural rigidity exceeding 140000 Pacm 4 , the thickness of the stress neutral plane adjustment member 70 has a tendency to become relatively thick. Therefore, if an appropriate rigidity is obtained and the overall thickness of the radiation detector 10 is considered, the flexural modulus of the raw material for the stress neutral plane adjustment member 70 is more preferably 150 MPa or more and 2500 MPa or less. And, the flexural rigidity of the stress neutral plane adjustment member 70 is preferably 540 Pacm 4 or more and 140000 Pacm 4 or less.

[0097] Further, the coefficient of thermal expansion of the stress neutral plane adjustment member 70 of the present embodiment is preferably close to the coefficient of thermal expansion of the material of the conversion layer 14, and more preferably, the ratio of the coefficient of thermal expansion of the stress neutral plane adjustment member 70 to the coefficient of thermal expansion of the conversion layer 14 (coefficient of thermal expansion of the stress neutral plane adjustment member 70 / coefficient of thermal expansion of the conversion layer 14) is preferably 0.5 or more and 4 or less. As the coefficient of thermal expansion of such a stress neutral plane adjustment member 70, it is preferably 30 ppm / K or more and 200 ppm / K or less. For example, when the conversion layer 14 uses CsI:Tl as the material, the coefficient of thermal expansion is 50 ppm / K. In this case, as the material of the stress neutral plane adjustment member 70, LDPE with a coefficient of thermal expansion of 100 ppm / K to 200 ppm / K, PVC with a coefficient of thermal expansion of 60 ppm / K to 80 ppm / K, acrylic with a coefficient of thermal expansion of 70 ppm / K to 80 ppm / K, PET with a coefficient of thermal expansion of 65 ppm / K to 70 ppm / K, PC with a coefficient of thermal expansion of 65 ppm / K, and Teflon (registered trademark) with a coefficient of thermal expansion of 45 ppm / K to 70 ppm / K, etc. can be cited.

[0098] Furthermore, considering the above-mentioned flexural modulus of elasticity, as the material of the stress neutral plane adjustment member 70, a material containing at least one of PET, PC, and LDPE is more preferable.

[0099] In addition, in addition to the function of adjusting the position of the stress neutral plane, the stress neutral plane adjustment member 70 preferably has other functions such as an antistatic function or a moisture-proof function.

[0100] Reference Figure 4A Figure 4B and Figure 5 The operation of the stress neutral plane adjustment member 70 in the radiation detector 10 of the present embodiment will be described. In addition, Figure 4A 、 Figure 4B and Figure 5 For simplicity, only the structure in the radiation detector 10 that requires explanation of the operation of the stress neutral plane adjustment member 70 is schematically illustrated.

[0101] As Figure 4A shown, the connection layer 62 includes conductive particles 62A. The conductive particles 62A are disposed between the terminal portion 60 provided on the first surface 11A of the base material 11 and the signal line 113, thereby electrically connecting the terminal portion 60 and the signal line 113 of the cable 112.

[0102] Figure 4B shows the state where the stress neutral plane adjustment member 70 of the present embodiment is not provided. As Figure 4B ​As shown, when a load W is applied in the stacking direction of the laminate 63 or when film stress acts, with the reinforcing member 50 provided on the second surface 11B of the sensor substrate 12 (base material 11), the sensor substrate 12 and the reinforcing member 50 flex. In a state where the reinforcing member 50 is provided and the stress neutral plane adjusting member 70 is not provided, the position of the stress neutral plane 71 in the stacking direction P of the flexed sensor substrate 12 and the reinforcing member 50 becomes a position closer to the reinforcing member 50 side than the interface 67 where the terminal portion 60 contacts the conductive particles 62A of the connection layer 62. In Figure 4B the example shown, a state where the stress neutral plane 71 is located within the reinforcing member 50 is shown. In addition, the "stress neutral plane 71" refers to a plane that does not extend or contract even when the sensor substrate 12 and the reinforcing member 50 are flexed, in other words, a plane in a direction intersecting the stacking direction P. In the stress neutral plane 71, the stress becomes 0.

[0103] In Figure 4B the example shown, since the position of the stress neutral plane 71 is a position relatively far from the interface 67, the terminal portion 60 also flexes according to the flexure of the sensor substrate 12 and the reinforcing member 50. Specifically, the interface 67 flexes. Therefore, as Figure 4B shown, the terminal portion 60 and the conductive particles 62A become a non-contact state, and the electrical connection between the terminal portion 60 and the cable 112 is disconnected. When the electrical connection between the terminal portion 60 and the cable 112 is disconnected, the image quality of the radiation image obtained by the radiation detector 10 sometimes deteriorates, for example, so-called line defects sometimes occur.

[0104] On the other hand, in the radiation detector 10 of the present embodiment, since the stress neutral plane adjusting member 70 is provided on the laminate 63, the position of the stress neutral plane 71 moves closer to the laminate 63 side compared to the case where the stress neutral plane adjusting member 70 is not provided.

[0105] As Figure 5 shown, when the stress neutral plane adjusting member 70 is provided, the interval between the stress neutral plane 71 and the interface 67 can be made smaller than the case where the stress neutral plane adjusting member 70 is not provided ( Figure 4B the case). In other words, when the stress neutral plane adjusting member 70 is provided, the difference between the position of the stress neutral plane 71 and the position of the interface 67 can be made smaller than the case where the stress neutral plane adjusting member 70 is not provided ( Figure 4B the case). By making the position of the stress neutral plane 71 close to the position of the interface 67, the stress in the interface 67 when the sensor substrate 12 and the reinforcing member 50 are flexed can be reduced, so that the terminal portion 60 and the conductive particles 62A of the connection layer 62 are less likely to become a non-contact state. Therefore, the electrical connection between the terminal portion 60 and the cable 112 is less likely to be disconnected.

[0106] In addition, the position of the stress neutral plane 71 is preferably within the laminate 63. Regarding the position of the stress neutral plane 71, within the laminate 63 in the present embodiment is an example within the predetermined range of the present invention.

[0107] Moreover, as Figure 5 shown, it is more preferable that the position of the stress neutral plane 71 coincides with the position of the interface 67. In this case, even when the sensor substrate 12 and the reinforcing member 50 are flexed, the stress at the interface 67 can be set to 0. Therefore, the conductive particles 62A at the terminal portion 60 and the connection layer 62 are less likely to become non-contact states. As a result, the electrical connection between the terminal portion 60 and the cable is less likely to be disconnected.

[0108] As described above, in the radiation detector 10 of the present embodiment, by disposing the stress neutral plane adjusting member 70 on the laminate 63 formed by laminating the terminal portion 60, the connection layer 62, and the cable on the first surface 11A of the sensor substrate 12 (base material 11), the position of the stress neutral plane 71 in the lamination direction P can be adjusted to the vicinity of the interface 67. Thus, in the radiation detector 10 of the present embodiment, when the sensor substrate 12 and the reinforcing member 50 are flexed, the stress generated at the interface 67 can be made close to 0. Therefore, the electrical connection between the terminal portion 60 and the cable is less likely to be disconnected.

[0109] In addition, the thickness of the stress neutral plane adjusting member 70 is determined according to the allowable range as the position of the stress neutral plane 71 from the interface 67. As the allowable range, for example, within the laminate 63 as described above can be cited. The specific thickness of the stress neutral plane adjusting member 70 is determined according to the ease of the contact between the conductive particles 62A of the connection layer 62 and the terminal portion 60 becoming a non-contact state and the degree of predetermined flexure. For example, it is preferable that the thicker the thickness of the reinforcing member 50, the thicker the thickness of the stress neutral plane adjusting member 70.

[0110] Refer to Figures 6A - 6E A method for manufacturing the radiation detector 10 of the present embodiment will be described.

[0111] As Figure 6A shown, the base material 11 is formed on a support 400 such as a glass substrate having a thickness thicker than that of the base material 11 with a release layer 402 interposed therebetween. For example, when the base material 11 is formed by a lamination method, a sheet to be the base material 11 is adhered to the support 400. The second surface 11B of the base material 11 is in contact with the release layer 402. In addition, the method for forming the base material 11 is not limited to the present embodiment. For example, it may be a method of forming the base material 11 by a coating method.

[0112] Further, pixels 30 are formed outside the terminal region 60B on the first surface 11A of the base material 11. In addition, in the present embodiment, as an example, the pixels 30 are formed on the first surface 11A of the base material 11 via an undercoat layer (not shown) using SiN or the like.

[0113] Further, a conversion layer 14 is formed on the layer where the pixels 30 are formed (hereinafter, simply referred to as "pixels 30"). In the present embodiment, the conversion layer 14 of columnar crystals of CsI is directly formed on the sensor substrate 12 by a vapor deposition method such as a vacuum evaporation method, a sputtering method, or a CVD (Chemical Vapor Deposition) method. In this case, the side of the conversion layer 14 in contact with the pixels 30 becomes the base point side of the growth direction of the columnar crystals.

[0114] In addition, when a CsI scintillator is used as the conversion layer 14, the conversion layer 14 can also be formed on the sensor substrate 12 by a method different from that of the present embodiment. For example, a component obtained by vapor-depositing CsI on an aluminum plate or the like by a vapor deposition method is prepared, and the side of CsI not in contact with the aluminum plate is bonded to the pixels 30 of the sensor substrate 12 through an adhesive sheet or the like, whereby the conversion layer 14 can be formed on the sensor substrate 12. In this case, it is preferable to bond a component in a state where the entire conversion layer 14 including the aluminum plate covered by the protective layer 46 is bonded to the pixels 30 of the sensor substrate 12. In addition, in this case, the side of the conversion layer 14 in contact with the pixels 30 becomes the front end side of the growth direction of the columnar crystals.

[0115] And, different from the radiation detector 10 of the present embodiment, GOS (Gd202S:Tb) or the like can also be used as the conversion layer 14 instead of CsI. In this case, for example, a component in which a sheet obtained by dispersing GOS in an adhesive such as a resin is bonded to a support formed of white PET or the like through an adhesive layer or the like is prepared, and the side of GOS not bonded to the support is bonded to the pixels 30 of the sensor substrate 12 through an adhesive sheet or the like, whereby the conversion layer 14 can be formed on the sensor substrate 12. In addition, compared with the case of using GOS, when CsI is used in the conversion layer 14, the conversion efficiency from radiation to visible light becomes higher.

[0116] And, a reflective layer 42 is provided via an adhesive layer 40 on the conversion layer 14 formed on the sensor substrate 12, and further, a protective layer 46 is provided via an adhesive layer 44. And a terminal portion 60 is formed in the terminal region 60A on the first surface 11A of the base material 11.

[0117] Next, as Figure 6B shown, the cable 112 is thermocompression-bonded to the terminal portion 60 via a connection layer 62, and the terminal portion 60 and the connection layer 62 are electrically connected. Further, the laminate 63 is covered by a reinforcing member 64.

[0118] Next, as Figure 6C shown, the stress neutral plane adjustment member 70 is provided on the laminate 63 covered by the reinforced member 64 through the adhesive 66.

[0119] After the stress neutral plane adjustment member 70 is provided, the sensor substrate 12 in a state where the conversion layer 14 and the terminal portion 60 are electrically connected to the cable 112 is peeled off from the support 400, resulting in Figure 6D the state shown. For example, in the lamination method, any one of the four sides of the sensor substrate 12 (substrate 11) is used as the starting point for peeling, and the sensor substrate 12 is gradually peeled off from the support 400 from the starting side toward the opposite side, thereby performing mechanical peeling.

[0120] Furthermore, after the sensor substrate 12 is peeled off from the support 400, as Figure 6E shown, the reinforcing member 50 is formed on the second surface 11B of the substrate 11 via the antistatic layer 54 and the adhesive 52 and by pasting or the like. As described above, the radiation detector 10 of the present embodiment is manufactured.

[0121] In addition, the radiation detector 10 of the present embodiment can also be set to the modes shown in the following Modification 1 to Modification 5, for example. In addition, it can also be set to a mode in which each of Modification 1 to Modification 5 is appropriately combined.

[0122] (Modification 1)

[0123] Figure 7 shows an example of a cross-sectional view of the radiation detector 10 of this modification corresponding to the B-B line cross-sectional view of the radiation detector 10 shown above. In addition, Figure 3B the description of the adhesive 52, the antistatic layer 54, and the adhesive 66 is omitted. Figure 7 In the radiation detector 10 shown above, the reinforcing member 64 covers each laminate 63, in other words each terminal portion 60, but as

[0124] described above Figure 3B shown in the radiation detector 10, the reinforcing member 64 covers each laminate 63, that is, each terminal portion 60, but as Figure 7As shown, in the radiation detector 10 of this modification example, the reinforcing member 64 commonly covers the entirety of each of the plurality of laminates 63. Therefore, the reinforcing member 64 causes the state where the laminates 63 are filled between each other. Accordingly, in the radiation detector 10 of this modification example, the plurality of laminates 63 are in a state of being integrally fixed to the sensor substrate 12. Additionally, there is no particular limitation on the number of laminates 63 that the reinforcing member 64 commonly covers. For example, the drive substrate 200 or the signal processing substrate 300 electrically connected by the cable 112 may also be configured such that the reinforcing member 64 commonly covers the same laminates 63. Also, for example, it may be configured such that the reinforcing member 64 commonly covers the laminates 63 based on all the terminal portions 60 provided on one side of the sensor substrate 12 (base material 11).

[0125] (Modification Example 2)

[0126] Figure 8A and Figure 8B shows an example of a cross-sectional view of the radiation detector 10 of this modification example corresponding to the cross-sectional view taken along line B-B of the radiation detector 10 shown above. Additionally, Figure 3B the description of the adhesive 52, the antistatic layer 54, and the adhesive 66 is omitted. Figure 8A and Figure 8B In the radiation detector 10 of this modification example shown above, the stress neutral plane adjusting member 70 causes the state where the laminates 63 covered by the reinforcing member 64 are filled between each other, and the stress neutral plane adjusting member 70 reaches the first surface 11A of the sensor substrate 12 (base material 11).

[0127] Figure 8A By using the stress neutral plane adjusting member 70 that reaches the first surface 11A of the base material 11, the laminates 63 are filled between each other, and thereby the electrical connection between the terminal portion 60 and the cable 112 is strengthened by the stress neutral plane adjusting member 70.

[0128] Additionally, as

[0129] shown, it may be configured such that the reinforcing member 64 is not provided and the stress neutral plane adjusting member 70 commonly covers the entirety of each of the plurality of laminates 63. Figure 8B In the case of the configuration shown above, the stress neutral plane adjusting member 70 is not limited to the member based on the above-described material, and may be a member based on the same material as the reinforcing member 64. That is, Figure 8B in the case of the configuration shown above, the reinforcing member 64 can be used as the stress neutral plane adjusting member 70. Figure 8B

[0130] (Modification Example 3)

[0131] Figure 9 shows corresponding to the above​Figure 2 An example of a top view of the radiation detector 10 of this modification of the radiation detector 10 shown in the figure.

[0132] The above Figure 2 In the radiation detector 10 shown above, the stress neutral plane adjustment member 70 is provided on each side of the sensor substrate 12 (base material 11) corresponding to the terminal region 60A. In other words, Figure 2 In the radiation detector 10 shown above, the stress neutral plane adjustment member 70 is provided on each of the laminate 63 (refer to Figure 3B etc.) corresponding to the cable 112A and the laminate 63 (refer to Figure 3B etc.) corresponding to the cable 112B.

[0133] However, it is sufficient that the stress neutral plane adjustment member 70 is provided on at least one or more laminates 63 (terminal portions 60), and the number thereof is not limited. For example, Figure 9 In the radiation detector 10 of this modification shown above, a state in which two stress neutral plane adjustment members 70 are provided respectively on each of the cable 112A side and the cable 112B side is shown. In addition, it is not limited to this modification, and a state in which the stress neutral plane adjustment member 70 is provided on each laminate 63 (terminal portion 60) can also be adopted. By providing the stress neutral plane adjustment member 70 on a plurality of laminates 63 (terminal portions 60), it is possible to further suppress the electrical disconnection between the terminal portion 60 and the cable 112. On the other hand, by providing a plurality of stress neutral plane adjustment members 70, the stress neutral plane adjustment member 70 can be made lighter, and thus the entire radiation detector 10 can be made lighter.

[0134] As described above, the stress neutral plane adjustment member 70 may not be provided on the entire terminal region 60A. Also, the stress neutral plane adjustment member 70 may not be provided on the entire upper surface of each laminate 63.

[0135] (Modification 4)

[0136] Figure 10 Shown is equivalent to the above Figure 3A An example of a cross-sectional view of the radiation detector 10 of this modification of the radiation detector 10 corresponding to the A-A line cross-sectional view of the radiation detector 10 shown above.

[0137] As Figure 10 shown, in the radiation detector 10 of this modification, a reinforcing layer 48 is further provided on the conversion layer 14 covered by the protective layer 46.

[0138] The bending rigidity of the reinforcing layer 48 is higher than that of the base material 11, and the dimensional change (deformation) with respect to the force applied in the vertical direction to the surface facing the conversion layer 14 is smaller than the dimensional change with respect to the force applied in the vertical direction to the first surface 11A of the base material 11. Further, the thickness of the reinforcing layer 48 in this modification example is thicker than the thickness of the base material 11.

[0139] The preferred characteristics of the reinforcing layer 48 are the same as those of the above-described reinforcing layer 48. For the reinforcing layer 48 in this modification example, a raw material having a flexural modulus of elasticity of 150 MPa or more and 2500 MPa or less is preferably used. From the viewpoint of suppressing the deflection of the base material 11, it is preferred that the bending rigidity of the reinforcing layer 48 is higher than that of the base material 11. Further, if the flexural modulus of elasticity decreases, the bending rigidity also decreases, and in order to obtain the desired bending rigidity, it is necessary to increase the thickness of the reinforcing layer 48, which results in an increase in the overall thickness of the radiation detector 10. Considering the material of the reinforcing layer 48, when attempting to obtain a bending rigidity exceeding 140000 Pacm 4 the thickness of the reinforcing layer 48 has a tendency to become relatively thick. Therefore, in order to obtain appropriate rigidity and considering the overall thickness of the radiation detector 10, the flexural modulus of elasticity of the material for the reinforcing layer 48 is more preferably 150 MPa or more and 2500 MPa or less. Further, the bending rigidity of the reinforcing layer 48 is preferably 540 Pacm 4 or more and 140000 Pacm 4 or less.

[0140] Further, the coefficient of thermal expansion of the reinforcing layer 48 is preferably close to the coefficient of thermal expansion of the material of the conversion layer 14, and more preferably the ratio of the coefficient of thermal expansion of the reinforcing layer 48 to the coefficient of thermal expansion of the conversion layer 14 (coefficient of thermal expansion of the reinforcing layer 48 / coefficient of thermal expansion of the conversion layer 14) is preferably 0.5 or more and 2 or less. As the coefficient of thermal expansion of such a reinforcing layer 48, it is preferably 30 ppm / K or more and 80 ppm / K or less. For example, when the conversion layer 14 uses CsI:Tl as the material, the coefficient of thermal expansion is 50 ppm / K. In this case, as materials relatively close to the conversion layer 14, PVC, acrylic, PET, PC, and Teflon (registered trademark) etc. can be cited. Further, considering the above-described flexural modulus of elasticity, as the material of the reinforcing layer 48, a material containing at least one of PET and PC is more preferably used. Further, from the viewpoint of elasticity, the reinforcing layer 48 preferably contains a material having a yield point.

[0141] The reinforcing layer 48 of this modification example is a substrate made of plastic. Considering the above reasons, the plastic that becomes the material of the reinforcing layer 48 is preferably a thermoplastic resin, and at least one of PC, PET, styrene, acrylic acid, polyacetate, nylon, polypropylene, ABS, engineering plastic, and polyphenylene ether can be cited. In addition, among these, the reinforcing layer 48 is preferably at least one of polypropylene, ABS, engineering plastic, PET, and polyphenylene ether, more preferably at least one of styrene, acrylic acid, polyacetate, and nylon, and further preferably at least one of PC and PET.

[0142] In addition, the specific characteristics, materials, etc. of the reinforcing layer 48 and the reinforcing member 50 may be the same or different.

[0143] When the conversion layer 14 is formed by vapor deposition, as Figure 10 and as described above Figure 3A shown, the conversion layer 14 is formed with an inclination such that its thickness gradually thins towards its outer edge. Hereinafter, the central region of the conversion layer 14 where the thickness is regarded as being substantially constant when manufacturing errors and measurement errors are ignored is referred to as the central portion. And the outer peripheral region of the conversion layer 14 having a thickness of, for example, 90% or less with respect to the average thickness of the central portion of the conversion layer 14 is referred to as the peripheral portion. That is, the conversion layer 14 has an inclined surface that is inclined with respect to the sensor substrate 12 in the peripheral portion. As Figure 10 shown, the reinforcing layer 48 of this modification example covers the entire central portion and a part of the peripheral portion of the conversion layer 14. In other words, the outer edge of the reinforcing layer 48 is located on the inclined surface of the peripheral portion of the conversion layer 14.

[0144] In addition, the position where the reinforcing layer 48 is provided is not limited to this modification example. For example, the reinforcing layer 48 may be in a manner that covers the entire conversion layer 14. And, for example, as Figure 10 shown, in this modification example, the reinforcing layer 48 is provided in a state of being bent along the inclined portion of the conversion layer 14, but it may also be in a state where a space is provided between the inclined portion of the conversion layer 14 and the reinforcing layer 48 in a non-bent plate shape.

[0145] As described above, by providing the reinforcing layer 48 on the conversion layer 14, the strength of the base material 11 is further enhanced.

[0146] And in this modification example, compared with the case where, for example, the stress neutral plane adjustment member 70 is extended to the upper part of the conversion layer 14 and has the function of the reinforcing layer 48, by separately providing the reinforcing layer 48 and the stress neutral plane adjustment member 70, the radiation detector 10 is made lighter.

[0147] (Modification Example 5)

[0148] Figure 11shown corresponding to the above Figure 3A An example of a cross-sectional view of the radiation detector 10 of this modified example, which is a cross-sectional view taken along line A-A of the radiation detector 10 shown in Figure 3A .

[0149] As Figure 11 shown, in the radiation detector 10 of this modified example, the first surface 11A side of the sensor substrate 12 (base material 11) on which the conversion layer 14, the laminate 63, and the stress neutral plane adjustment member 70 are all provided is covered with the protective film 49. As Figure 11 shown, in the radiation detector 10 of this modified example, the protective film 49 is provided on the conversion layer 14 through the adhesive layer 57, and the protective film 49 is provided on the stress neutral plane adjustment member 70 through the adhesive layer 72.

[0150] The protective film 49 is a relatively thin film having a moisture-proof function. It is relatively thin compared to, for example, the reinforcing layer 48 in the radiation detector 10 of the above-described modified example 4. As the protective film 49, for example, insulating sheets such as PARYLENE (registered trademark), polyethylene terephthalate, and moisture-proof films such as ALPET (registered trademark) sheets can be used. In addition, the protective film 49 may have an antistatic function instead of or together with the moisture-proof function.

[0151] As described above, by covering the first surface 11A side of the sensor substrate 12 (base material 11) on which the conversion layer 14, the laminate 63, and the stress neutral plane adjustment member 70 are all provided with the protective film 49, the moisture-proof property of the entire radiation detector 10 is improved.

[0152] Moreover, according to the radiation detector 10 of this modified example, since the stress neutral plane adjustment member 70 is connected to the conversion layer 14 through the protective film 49, the adjustment function of the stress neutral plane 71 based on the stress neutral plane adjustment member 70 can be improved.

[0153] As described above, the radiation detector 10 of each of the above-described methods includes a sensor substrate 12, a conversion layer 14, a reinforcing member 50, and a stress neutral plane adjusting member 70. In the sensor substrate 12, a plurality of pixels 30 for accumulating charges generated by light converted from radiation are formed in a pixel region 35 on a first surface 11A of a flexible substrate 11, and a terminal portion 60 for electrically connecting a cable 112 is provided in a terminal region 60A on the first surface 11A. The conversion layer 14 is provided in an outer region 60B of the terminal region on the first surface 11A of the substrate 11 and converts radiation into light. The reinforcing member 50 is provided on a second surface 11B of the substrate 11 opposite to the first surface 11A to reinforce the strength of the substrate 11. The stress neutral plane adjusting member 70 is provided in the terminal region 60A and corresponds to at least a part of the terminal region 60A of the cable 112 electrically connected to the terminal portion 60, and adjusts the position of the stress neutral plane 71 in a region corresponding to a laminate 63 in which the reinforcing member 50, the terminal portion 60 of the sensor substrate 12, and the cable 112 electrically connected to the terminal portion 60 are laminated.

[0154] In the radiation detector 10 using the flexible substrate 11 for the sensor substrate 12, by providing the reinforcing member 50, the electrical connection between the terminal portion 60 and the cable 112 may be easily disconnected due to the flexure of the sensor substrate 12 and the reinforcing member 50.

[0155] In contrast, in the radiation detector 10 according to the present embodiment and each of the above-described modified examples, since the stress neutral plane adjusting member 70 is provided on the laminate 63, the position of the stress neutral plane 71 can be set near an interface 67 where the terminal portion 60 contacts the conductive particles 62A of the connection layer 62. Thus, in the radiation detector 10 according to the present embodiment and each of the above-described modified examples, the stress in the interface 67 can be reduced, and thus the terminal portion 60 and the conductive particles 62A of the connection layer 62 are less likely to be in a non-contact state.

[0156] Therefore, in the radiation detector 10 according to the present embodiment and each of the above-described modified examples, the electrical connection between the terminal portion 60 and the cable 112 can be simply suppressed from being disconnected. In particular, in the radiation detector 10 of the present embodiment and each of the above-described modified examples, even when the sensor substrate 12 and the reinforcing member 50 are flexed, the electrical connection between the terminal portion 60 and the cable 112 can be suppressed from being disconnected.

[0157] In addition, the radiation detector 10 is not limited to the forms described in the present embodiment and the above-described respective modified examples. For example, in the above-described radiation detector 10, each of the stress neutral plane adjustment members 70 provided on the laminate 63 based on the terminal portion 60 electrically connected to the cable 112A and the stress neutral plane adjustment member 70 provided on the laminate 63 based on the terminal portion 60 electrically connected to the cable 112B may be a member based on the same material or a member based on different materials.

[0158] Moreover, in the above-described radiation detector 10, the stress neutral plane adjustment members 70 are provided in both the laminate 63 based on the terminal portion 60 electrically connected to the cable 112A and the laminate 63 based on the terminal portion 60 electrically connected to the cable 112B, but the stress neutral plane adjustment member 70 may be provided in only either one of them. In this case, as Figure 12 shown, since the analog components tend to be heavier than the digital components, it is preferable to provide the stress neutral plane adjustment member 70 at the terminal portion 60 to which the cable 112B for electrically connecting to the signal processing substrate 300 and the signal processing IC 310, which are analog components, is electrically connected.

[0159] Furthermore, as in an example shown in Figure 13 , the stress neutral plane adjustment member 70 may also be provided in a state of being in contact with the end portion of the conversion layer 14. In Modified Example 2 (refer to Figure 8B ), as described above, when the stress neutral plane adjustment member 70 is coated like the above-described TUFFY (registered trademark) and has fluidity, it sometimes crosses over the laminate 63 and spreads over the entire surface of the terminal region 60A and then comes into contact with the end portion of the conversion layer 14 as Figure 13 shown. As described above, the stress neutral plane adjustment member 70 may be in contact with the end portion of the conversion layer 14. In addition, the "end portion of the conversion layer 14" includes at least the inclined portion of the above-described conversion layer 14, and may also include a region closer to the outer edge than the region corresponding to the pixel region 35 in the central portion of the conversion layer 14.

[0160] In addition, as in Figures 14 - 15 shown, the radiation image photographing apparatus 1 using the radiation detector 10 and the like of the present embodiment and the respective modified examples can be used in a state of being accommodated in the housing 120.

[0161] Figure 14 shows a cross-sectional view of an example of the radiation image photographing apparatus 1 of the ISS (Irradiation Side Sampling) method in which radiation is irradiated from the second surface 11B side of the base material 11. As in Figure 14As shown, within the housing 120, an X-ray detector 10, a power supply unit 108, and a control substrate 110 are arranged in a direction intersecting the incident direction of the X-rays. The X-ray detector 10 is disposed on the irradiation surface 120A side of the housing 120 that transmits the irradiated X-rays of the subject in a state facing the first surface 11A side of the base material 11 in the sensor substrate 12.

[0162] And, Figure 15 FIG. shows a cross-sectional view of an example of an X-ray image capturing apparatus 1 of the PSS (Penetration Side Sampling) method in which X-rays are irradiated from the conversion layer 14 side. As Figure 15 shown, within the housing 120, an X-ray detector 10, a power supply unit 108, and a control substrate 110 are arranged in a direction intersecting the incident direction of the X-rays. The X-ray detector 10 is disposed on the irradiation surface 120A side of the housing 120 that transmits the irradiated X-rays of the subject in a state facing the second surface 11B side of the base material 11 in the sensor substrate 12.

[0163] The control substrate 110 and the drive substrate 200 are electrically connected by a cable 220. And, Figure 14 and Figure 15 Although not described here, the control substrate 110 and the signal processing substrate 300 are electrically connected by a cable.

[0164] And, the control substrate 110 is connected to the image memory 106 formed on the control substrate 110 or the power supply unit 108 that supplies power to the control unit 100 etc. via a power line 115.

[0165] Figure 14 and Figure 15 Within the housing 120 of the X-ray image capturing apparatus 1 shown in FIG., a thin plate 116 is further provided on the side that emits the X-rays that have passed through the X-ray detector 10. As the thin plate 116, for example, a copper thin plate can be cited. The copper thin plate hardly generates secondary X-rays from the incident X-rays, and thus has a function of preventing scattering toward the rear side, i.e., the conversion layer 14 side. In addition, the thin plate 116 preferably covers at least the entire surface on the side that emits the X-rays of the conversion layer 14, and covers the entire conversion layer 14.

[0166] And, Figure 14 and Figure 15Inside the housing 120 of the radiation image photographing apparatus 1 shown, a protective layer 117 is also provided on the side where radiation enters (the irradiation surface 120A side). As the protective layer 117, moisture-proof films such as sheets of ALPET (registered trademark), PARYLENE (registered trademark) films, and polyethylene terephthalate, which are insulating sheets, can be applied to insulating sheets (thin films). The protective layer 117 has a moisture-proof function and an anti-static function with respect to the pixel region 35. Therefore, the protective layer 117 preferably covers at least the entire surface on the side where radiation enters the pixel region 35, and preferably covers the entire surface of the sensor substrate 12 on the side where radiation enters.

[0167] As Figure 14 and Figure 15 In the example shown, the thickness of each of the power supply unit 108 and the control substrate 110 is often thicker than that of the radiation detector 10. In this case, as Figure 16 In the example shown, the thickness of the portion of the housing 120 where the radiation detector 10 is provided can be thinner than the thicknesses of the portions of the housing 120 where the power supply unit 108 and the control substrate 110 are respectively provided. Further, in this way, when there is a difference in thickness between the portion of the housing 120 where the power supply unit 108 and the control substrate 110 are respectively provided and the portion of the housing 120 where the radiation detector 10 is provided, if a step difference occurs at the boundary portion between the two portions, it may cause discomfort to the subject in contact with the boundary portion 120B, etc. Therefore, it is preferable that the form of the boundary portion 120B be in a state with an inclination.

[0168] Thereby, an extremely thin and portable electronic cassette corresponding to the thickness of the radiation detector 10 can be configured.

[0169] And for example, in this case, the material of the housing 120 in the portion where the power supply unit 108 and the control substrate 110 are respectively provided and the portion where the radiation detector 10 is provided can be different. Further, for example, the portion of the housing 120 where the power supply unit 108 and the control substrate 110 are respectively provided and the portion of the housing 120 where the radiation detector 10 is provided can be separately arranged.

[0170] And, as described above, the housing 120 preferably has a low absorption rate of radiation, especially X-rays, and high rigidity, and is preferably made of a material with a sufficiently high elastic modulus. However, regarding the portion corresponding to the irradiation surface 120A of the housing 120, it has a low absorption rate of radiation and high rigidity and is made of a material with a sufficiently high elastic modulus. Regarding other portions, it can also be made of a material different from the portion corresponding to the irradiation surface 120A, for example, a material with an elastic modulus lower than that of the portion corresponding to the irradiation surface 120A.

[0171] And, in each of the above-described embodiments, as Figure 1Although the pixels 30 have been described as being two-dimensionally arranged in a matrix as shown, it is not limited thereto. For example, they may be arranged in one dimension or in a honeycomb pattern. Further, the shape of the pixels is not limited and may be rectangular, or a polygon such as a hexagon. Furthermore, the shape of the pixel region 35 is of course not limited.

[0172] In addition, the structures such as the radiation image capturing apparatus 1 and the radiation detector 10, and the manufacturing methods, etc. described in the above embodiments are examples, and it is of course possible to make changes according to the situation without departing from the gist of the present invention.

[0173] All the disclosures of Japanese Patent Application No. 2019-127738 filed on July 9, 2019 are incorporated herein by reference.

[0174] All the documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent as when each document, patent application, and technical standard incorporated by reference is specifically and individually described.

[0175] Reference Signs

[0176] 1 - Radiation image capturing apparatus, 10 - Radiation detector, 11 - Substrate, 11A - First surface, 11B - Second surface, 12 - Sensor substrate, 14 - Conversion layer, 30 - Pixel, 32 - TFT (switching element), 34 - Sensor section, 35 - Pixel region, 36 - Signal wiring, 38 - Scan wiring, 39 - Common wiring, 40, 57, 72 - Adhesive layer, 42 - Reflective layer, 44 - Adhesive layer, 46 - Protective layer, 48 - Reinforcing layer, 49 - Protective film, 50 - Reinforcing member, 52 - Adhesive, 54 - Antistatic layer, 60 - Terminal section, 60A - Terminal region, 60B - Outside the terminal region, 62 - Connection layer, 62A - Conductive particles, 63 - Laminate, 64, 65 - Reinforcing member, 66 - Adhesive, 67 - Interface, 70 - Stress neutral plane adjustment member, 71 - Stress neutral plane, 100 - Control section, 100A - CPU, 100B - Memory, 100C - Storage section, 102 - Driving section, 104 - Signal processing section, 106 - Image memory, 108 - Power supply section, 110 - Control substrate, 112, 112A, 112B, 220 - Cable, 113 - Signal line, 115 - Power line, 116 - Sheet, 117 - Protective layer, 120 - Housing, 120A - Irradiation surface, 120B - Boundary section, 200 - Driving substrate, 202, 302 - Connection region, 210 - Driving IC, 300 - Signal processing substrate, 310 - Signal processing IC, 400 - Support, 402 - Release layer, P - Laminating direction, W - Load.

Claims

1. A radiation detector, comprising: A substrate, on which a plurality of pixels for accumulating charges generated by light converted from radiation are formed in a pixel region on a first surface of a flexible substrate, and a terminal portion for electrically connecting a cable is provided in a terminal region on the first surface; A conversion layer, provided outside the terminal region in the first surface of the substrate, for converting the radiation into light; A reinforcing member, provided on a second surface of the substrate opposite to the first surface, for reinforcing the strength of the substrate; A stress neutral plane adjusting member, provided in at least a part of the terminal region corresponding to the cable electrically connected to the terminal portion, and adjusting the position of the stress neutral plane in a region corresponding to a laminate in which the reinforcing member, the terminal portion of the substrate, and the cable electrically connected to the terminal portion are laminated; and A strengthening member, strengthening the electrical connection between the cable and the terminal portion, The stress neutral plane adjusting member is provided in at least a part of the cable covered by the strengthening member.

2. The radiation detector according to claim 1, wherein The stress neutral plane adjusting member adjusts the position of the stress neutral plane in the stacking direction of the laminate within a predetermined range from the interface where the cable is electrically connected to the terminal portion.

3. The radiation detector according to claim 2, wherein The position within the predetermined range is a position within the laminate.

4. The radiation detector according to claim 1, wherein The bending rigidity of the stress neutral plane adjusting member is 540 Pacm 4 or more and 140000 Pacm 4 or less.

5. The radiation detector according to claim 1, wherein The bending elastic modulus of the stress neutral plane adjusting member is 150 MPa or more and 2500 MPa or less.

6. The radiation detector according to claim 1, wherein A plurality of the terminal portions are provided on the substrate, The stress neutral plane adjusting member is provided on at least one or more of the terminal portions.

7. The radiation detector according to claim 1, wherein The strengthening member also has moisture resistance.

8. The radiation detector according to claim 1, wherein The stress neutral plane adjusting member also strengthens the electrical connection between the cable and the terminal portion.

9. The radiation detector according to claim 8, wherein The stress neutral plane adjusting member also has moisture resistance.

10. The radiation detector according to claim 1, wherein The stress neutral plane adjusting member also contacts an end portion of the conversion layer.

11. The radiation detector according to claim 1, further comprising a reinforcing layer, which is provided on a surface of the conversion layer opposite to the surface on the substrate side and has a higher rigidity than the substrate.

12. A radiation image photographing apparatus, comprising: The radiation detector according to any one of claims 1 to 11; A control unit, outputting a control signal for reading out charges accumulated in the plurality of pixels; A driving unit, electrically connected to the terminal portion of the radiation detector via a cable, and outputting a driving signal for reading out charges from the plurality of pixels according to the control signal; and The signal processing unit is electrically connected to the terminal unit of the radiation detector via a cable, inputs an electrical signal corresponding to the charge read out from the plurality of pixels, and generates and outputs image data corresponding to the input electrical signal.

13. The radiation image photographing apparatus according to claim 12, further comprising a housing having an irradiation surface for irradiating radiation, wherein the radiation detector is housed in a state where the sensor substrate faces the irradiation surface in the sensor substrate and the conversion layer of the radiation detector.

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