Backing, ultrasonic transducer system and method for manufacturing backing

Abstract

The present application relates to a backing, an ultrasonic transducer system, and a method for manufacturing a backing. The backing includes a first substrate, and a plurality of first grooves are provided on the surface of the first substrate close to the piezoelectric layer, and each of the first grooves is used to fill a conductive member connected to the piezoelectric element of the piezoelectric layer. The first grooves are provided in the first substrate, which reduces the weight of the backing and thereby reduces the weight of the ultrasonic transducer system. Each of the first grooves of the backing is used to fill a conductive member connected to the piezoelectric element of the piezoelectric layer, avoiding the use of a flexible circuit board alone and reducing the height of the ultrasonic transducer system. Therefore, the structure in which the backing has grooves can reduce the weight and volume of the ultrasonic transducer system.

Description

Technical Field

[0001] The present application relates to the field of medical technology, and in particular to a backing, an ultrasonic transducer system, and a method for manufacturing the backing. Background Art

[0002] Ultrasonic transducers used in ultrasonic diagnostics typically consist of a piezoelectric layer, a matching layer, an acoustic lens, a backing, and an electrode lead-out assembly. The electrode lead-out assembly is a flexible printed circuit board (FPCB). The FPCB is positioned between the piezoelectric layer and the backing. Multiple conductive strips are arranged on the FPCB. These strips electrically connect the ultrasound diagnostic system to the piezoelectric layer, enabling signal transmission between the piezoelectric array elements within the transducer.

[0003] During ultrasonic testing, workers move a handheld ultrasonic transducer around the inspection area to obtain test data. This is labor-intensive and physically demanding. Reducing the weight and size of the ultrasonic transducer system is an urgent issue. Summary of the Invention

[0004] Based on this, it is necessary to provide a backing, an ultrasonic transducer system and a method for manufacturing the backing in order to solve the problem of how to reduce the weight and volume of the ultrasonic transducer system.

[0005] A backing includes a first substrate. A plurality of first grooves are formed on the surface of the first substrate. Each first groove is used to fill a conductive member connected to a piezoelectric element of a piezoelectric layer.

[0006] In one embodiment, the plurality of first grooves are arranged in a row array. The backing further includes a second substrate. The first substrate and the second substrate are arranged side by side. The second substrate defines a plurality of second grooves, and the plurality of second grooves are arranged in a row array. The plurality of first grooves and the plurality of second grooves are staggered one by one.

[0007] In one embodiment, the backing further includes a third substrate, and the third substrate is disposed between the first substrate and the second substrate.

[0008] In one embodiment, the first substrate includes a first surface and a second surface connected to the first surface. A plurality of first grooves are formed on the first surface, and the first grooves extend to the second surface.

[0009] In one embodiment, the first substrate further includes a third surface opposite to the second surface. A plurality of third grooves are formed on the first surface, and the plurality of third grooves are spaced apart from the plurality of first grooves. The third grooves extend to the third surface.

[0010] In one embodiment, the first base further includes a fourth surface opposite to the first surface, and the first groove extends to the fourth surface.

[0011] An ultrasonic transducer system includes a backing, a piezoelectric layer, a lens, and a housing. The backing includes a first substrate and / or a second substrate. A plurality of conductive members are arranged side by side and embedded in the first substrate and / or the second substrate. The piezoelectric layer is disposed on the backing. The piezoelectric layer includes a plurality of piezoelectric elements. The piezoelectric elements are electrically connected to the conductive members, respectively. The lens is disposed on the piezoelectric layer. The housing has an inner cavity surrounded by multiple surfaces. The backing, piezoelectric layer, and lens are at least partially accommodated in the inner cavity.

[0012] In one embodiment, the ultrasonic transducer system further comprises a matching layer and a control device. The matching layer is disposed on a surface of the piezoelectric layer away from the backing. The control device is connected to the piezoelectric layer via the conductive member.

[0013] In one embodiment, the first substrate and the second substrate are arranged side by side or overlapped, and the conductive members on the first substrate and the conductive members on the second substrate are arranged in a staggered or aligned manner.

[0014] In one embodiment, the thickness of the backing is greater than the thickness of the shell.

[0015] In one embodiment, the plurality of conductive elements extend from a first surface of the backing to a second surface of the backing, the first surface being opposite to or intersecting the second surface.

[0016] A method for making a backing, comprising:

[0017] The first substrate is manufactured.

[0018] A plurality of first grooves are opened on the surface of the first substrate, and each first groove is used to fill a conductive member connected to the piezoelectric element of the piezoelectric layer.

[0019] The backing provided in an embodiment of the present application includes a first substrate, and a plurality of first grooves are provided on the surface of the first substrate near the piezoelectric layer, each of which is used to fill a conductive member connected to the piezoelectric element of the piezoelectric layer. The first grooves are provided in the first substrate, thereby reducing the weight of the backing and, in turn, the weight of the ultrasonic transducer system. Each of the first grooves in the backing is used to fill a conductive member connected to the piezoelectric element of the piezoelectric layer, thereby avoiding the use of a separate flexible circuit board and reducing the height of the ultrasonic transducer system. Therefore, the structure in which the grooves are provided in the backing can reduce the weight and volume of the ultrasonic transducer system. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 This is a schematic structural diagram of the ultrasonic transducer system provided in one embodiment of the present application;

[0022] Figure 2 This is a schematic structural diagram of the piezoelectric layer and the backing provided in one embodiment of the present application;

[0023] Figure 3 This is a schematic cross-sectional structure diagram of the backing provided in one embodiment of the present application;

[0024] Figure 4 This is a schematic structural diagram of the backing provided in one embodiment of the present application;

[0025] Figure 5 This is a schematic top view of the backing provided in one embodiment of the present application;

[0026] Figure 6 This is a schematic structural diagram of the piezoelectric layer provided in one embodiment of the present application;

[0027] Figure 7 This is a perspective structural diagram of the piezoelectric layer and the backing provided in one embodiment of the present application;

[0028] Figure 8 A left side view of the piezoelectric layer and the backing provided in one embodiment of the present application;

[0029] Figure 9 A right side view of the piezoelectric layer and the backing provided in one embodiment of the present application;

[0030] Figure 10 This is a schematic structural diagram of the backing provided in one embodiment of the present application;

[0031] Figure 11 This is a schematic structural diagram of the backing provided in one embodiment of the present application;

[0032] Figure 12 This is a schematic structural diagram of the backing provided in one embodiment of the present application;

[0033] Figure 13 This is a schematic structural diagram of the backing provided in one embodiment of the present application;

[0034] Figure 14 This is a schematic structural diagram of the backing provided in one embodiment of the present application;

[0035] Figure 15 This is a flowchart of the production of the backing provided in one embodiment of the present application.

[0036] 10. Ultrasonic transducer system; 20. Piezoelectric layer; 30. Piezoelectric element; 301. Ground electrode; 302. Signal electrode; 40. Backing; 101. Shell; 401. First groove; 402. Second groove; 404. Third groove; 403. Fourth groove; 405. Fifth groove; 410. First substrate; 411. First surface; 412. Second surface; 413. Third surface; 414. Fourth surface; 420. Second substrate; 421. Auxiliary substrate; 430. Third substrate; 400. Conductor; 50. Electrical connector; 510. Terminal; 60. Matching layer; 70. Lens; First direction a; Second direction b. DETAILED DESCRIPTION

[0037] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar modifications without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0038] The serial numbers of the components herein, such as "first", "second", etc., are only used to separate the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application include direct and indirect connections (couplings) unless otherwise specified. In the description of this application, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0039] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0040] See Figure 1 and Figure 2 The embodiment of the present application provides a backing 40, comprising a first substrate 410. A plurality of first grooves 401 are formed on the surface of the first substrate 410. Each first groove 401 is filled with a conductive member 400 connected to the piezoelectric element 30 of the piezoelectric layer 20.

[0041] The backing 40 provided in this embodiment of the present application has first grooves 401, which reduces the weight of the backing 40 and, in turn, the weight of the ultrasonic transducer system 10. Each first groove 401 is used to house a conductive member 400 connected to the piezoelectric element 30 of the piezoelectric layer 20, eliminating the need for a separate flexible circuit board and reducing the height of the ultrasonic transducer system 10. Therefore, the grooved structure of the backing 40 reduces the weight and volume of the ultrasonic transducer system 10.

[0042] Furthermore, the conductive member 400 is positioned within the first groove 401, relative to the connection points on the flexible printed circuit board. This provides a larger connection area between the conductive member 400 and the piezoelectric element 30, and the connection surface is flat, facilitating connection between the conductive member 400 and the piezoelectric element 30 and reducing the assembly process complexity of the ultrasonic transducer system 10. The backing 40 is simple to manufacture, eliminating the need for specialized electrode coating designs for the piezoelectric array elements 30. Conventional ultrasonic transducer system 10 processing and assembly equipment can be used, reducing the cost of the ultrasonic transducer system 10 and improving production efficiency.

[0043] The piezoelectric layer 20 is disposed on the surface of the first substrate 410 . One piezoelectric element 30 is connected to at least one conductive member 400 , and one conductive member 400 is only connected to one piezoelectric element 30 .

[0044] The piezoelectric layer 20 includes one to several hundred piezoelectric elements 30. In some transducers, the number of piezoelectric elements 30 may reach tens of thousands. Each piezoelectric element 30 requires a separate lead wire to connect to a control device. The control device controls each piezoelectric element 30 individually.

[0045] When the ultrasonic wave encounters the tissue under examination, the reflected wave squeezes the piezoelectric element 30. The piezoelectric element 30 converts the pressure energy into an electrical signal and outputs it through the conductive member 400.

[0046] The backing 40 is used to support the piezoelectric layer 20. The shape of the backing 40 can be a regular three-dimensional structure such as a cuboid, a cube, a cylinder or a sphere, or an irregular three-dimensional structure such as a stepped or gourd-shaped one. In one embodiment, the shape of the backing 40 is a cuboid, and the piezoelectric layer 20 is laid on one surface of the cuboid. The shape of the edges of the cuboid three-dimensional structure is not limited. The shape of the edges of the cuboid can be a right angle, a chamfered angle or an arc. In the previous embodiment, the edges of the backing 40 are arc-shaped, and the arc-shaped edges can increase the contact area during collision and reduce the probability of scratching the human body.

[0047] The backing 40 is also used to provide a channel for the conductive member 400. In order to prevent the backing 40 from being electrically connected to the conductive member 400, the backing 40 has insulating properties. The backing 40 is not electrically connected to the piezoelectric layer 20. The material of the backing 40 includes inorganic insulating materials and / or organic insulating materials. Inorganic insulating materials may include, for example, SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, ZrO2, BST, and PZT. Organic insulating materials may include, for example, common polymers (PMMA, PS), phenolic polymer derivatives, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, paraxylene polymers, vinyl alcohol polymers, and mixtures thereof. In one embodiment, the backing 40 is PVC, which is lightweight, has good insulation properties, and is inexpensive.

[0048] In one embodiment, the backing material is epoxy resin adhesive added with tungsten powder to ensure the acoustic performance of the backing.

[0049] The conductive member 400 may be a finished conductive element such as a wire, a conductive sheet, or a conductive tube, or may be a conductive material filled in the first groove 401. The conductive material may be a solid metal such as copper, silver, or gold, metal powder, a mixture of metal powder and adhesive, or conductive graphite.

[0050] In one embodiment, the first groove 401 is filled with a mixture of metal powder and adhesive to ensure that the conductive material completely fills the first groove 401, thereby enhancing conductivity. Furthermore, the addition of adhesive to the conductive material maintains a fixed shape within the first groove 401, preventing powder from falling during handling and improving installation convenience.

[0051] The shape of the first groove 401 can be a regular shape such as a rectangle, square, or circle, or a combination of multiple shapes. It can also be an "L" shape, a "V" shape, a "U" shape, or a "concave" shape. The edges of the first groove 401 can be right-angled, chamfered, or arc-shaped. In the previous embodiment, the edges of the first groove 401 are right-angled to increase the distance between the edges of two adjacent first grooves 401, thereby preventing the adjacent first grooves 401 from being too close to each other, resulting in electrical connection between the conductive members 400 inside the two first grooves 401.

[0052] The cross-sectional shape of the first groove 401 can be a regular shape such as a rectangle, square, or circle, or a combination of multiple shapes, or can be an L-shaped, V-shaped, U-shaped, or concave-shaped shape. The cross-sectional shape of the first groove 401 can be constant along the length direction, or can vary along the length direction.

[0053] The first groove 401 may extend on the surface of the backing 40 , may extend inside the backing 40 , or may extend on both the surface and the inside of the backing 40 .

[0054] In one embodiment, the first groove 401 can be replaced by a through hole, that is, the two openings of the through hole are formed on different surfaces of the backing 40, and the through hole extends inside the backing 40. The cross-sectional shape of the through hole can be a regular shape such as a rectangle, square, or circle, or a shape composed of multiple shapes. It can also be an "L" shape, a "V" shape, a "U" shape, or a "concave" shape. The cross-sectional shape of the through hole can be constant along the length direction, or it can vary along the length direction.

[0055] Each first groove 401 may be provided with one conductive member 400, or multiple conductive members 400 may be provided. If multiple conductive members 400 are provided in each first groove 401, an insulating structure is provided between the multiple conductive members 400. The insulating structure includes an insulating layer, an insulating cable or an insulating sheath, etc. The material of the bonding structure may be an inorganic insulating material and / or an organic insulating material. The inorganic insulating material may include, for example, SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, ZrO2, BST and PZT. The organic insulating material may include, for example, common polymers (PMMA, PS), polymer derivatives having a phenol group, acrylic polymers, imide polymers, aryl ether-based polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers, vinyl alcohol-based polymers and mixtures thereof.

[0056] The shape of the conductive member 400 may be the same as or different from the shape of the first groove 401. The conductive member 400 may only extend to a portion of the length of the first groove 401. For example, the conductive member 400 may only extend to half the length of the first groove 401. The other half of the first groove 401 is used to reduce the weight of the backing 40.

[0057] Each piezoelectric element 30 may be connected to one conductive member 400 or to multiple conductive members 400 simultaneously. Multiple conductive members 400 connected to one piezoelectric element 30 transmit the same signal. A conductive member 400 is connected to only one piezoelectric element 30, meaning that it transmits only one signal.

[0058] In one embodiment, a conductive member 400 is disposed in each first groove 401. The piezoelectric elements 30 are connected to the conductive members 400 in the first grooves 401 in a one-to-one correspondence. This one-to-one correspondence between the piezoelectric elements 30 and the conductive members 400 avoids excessive conductive members 400, improves unit volume utilization, and reduces overall volume.

[0059] The cross-sectional width of the first groove 401 ranges from 5 um to 200 um.

[0060] The piezoelectric element 30 and the conductive member 400 are connected via a plate or a wire layer.

[0061] Please also see Figure 3 In one embodiment, the plurality of piezoelectric elements 30 are located in the same plane and are spaced apart. The piezoelectric layer 20 further includes a ground electrode 301 and a signal electrode 302. The signal electrode 302 is disposed between the piezoelectric element 30 and the backing 40. The ground electrode 301 is disposed on a surface of the piezoelectric element 30 away from the backing 40.

[0062] The ground electrode 301 is grounded. The signal electrode 302 is used to lead out the electrical signal generated by the piezoelectric element 30 .

[0063] There may be one or more ground electrodes 301. There may be multiple signal electrodes 302. The multiple signal electrodes 302 are arranged in the same plane. The multiple signal electrodes 302 are spaced apart, or insulating material is provided between adjacent signal electrodes 302. The multiple signal electrodes 302 may be provided separately or physically connected.

[0064] When there is only one ground electrode 301 , the piezoelectric elements 30 share a common negative electrode. Each piezoelectric element 30 is connected to at least one signal electrode 302 , and one signal electrode 302 is connected to only one piezoelectric element 30 .

[0065] In one embodiment, the plurality of signal electrodes 302 and the plurality of piezoelectric elements 30 are arranged opposite to each other, which can avoid excessive conductive members 400 being arranged between the signal electrodes 302 and the piezoelectric elements 30 , thereby improving the utilization rate of the unit volume and reducing the overall volume.

[0066] The signal electrode 302 and the conductive member 400 are connected by welding, bonding, or clamping.

[0067] In one embodiment, the signal electrode 302 and the conductive member 400 are connected by bonding to avoid the influence of high welding temperature on the acoustic performance of the pressure array element 30 .

[0068] In one embodiment, the arrangement form of the multiple piezoelectric elements 30 is the same as the arrangement form of the multiple first grooves 401, and the multiple first grooves 401 and the multiple piezoelectric elements 30 are arranged one by one relative to each other to reduce the distance between the piezoelectric elements 30 and the conductive parts 400 inside the first grooves 401 and simplify the wiring method.

[0069] The arrangement form of the plurality of piezoelectric elements 30, the arrangement form of the plurality of signal electrodes 302 or the arrangement form of the plurality of first grooves 401 includes a regular arrangement form such as a square matrix, a circular matrix, a triangular matrix, a row array or a column array, or can be a combination of several regular arrangement forms.

[0070] The arrangement of the plurality of piezoelectric elements 30 , the arrangement of the plurality of signal electrodes 302 , or the plurality of first grooves 401 may be the same or different.

[0071] The shape of the piezoelectric element 30 is a conventional shape such as a rectangle, a circle or a square, and can also be an unconventional shape such as a gourd, an arc or a semicircle.

[0072] In one embodiment, the plurality of piezoelectric elements 30 are arranged in a row array. The plurality of first grooves 401 are arranged in a row array. The number of rows in the row array of the piezoelectric elements 30 is the same as or different from the number of rows in the row array of the first grooves 401.

[0073] In one embodiment, the number of rows in the row array of the piezoelectric elements 30 is the same as the number of rows in the row array of the first grooves 401, and the piezoelectric elements 30 are arranged one-on-one with the first grooves 401. Only one conductive member 400 is provided in each first groove 401. This one-on-one correspondence between the piezoelectric elements 30 and the conductive members 400 avoids an excessive number of conductive members 400, improves unit volume utilization, and reduces overall volume. The surface of the piezoelectric element 30 adjacent to the first groove 401 is rectangular.

[0074] Please also see Figure 4 and Figure 5 In one embodiment, the backing 40 further includes a second substrate 420. The first substrate 410 and the second substrate 420 are arranged side by side. The second substrate 420 defines a plurality of second grooves 402 arranged in a row array. The plurality of first grooves 401 and the plurality of second grooves 402 are staggered one by one. This arrangement increases the distance between the grooves on the backing, facilitating the processing of grooves on the first and second substrates 410, 420.

[0075] In one embodiment, the first groove 410 or the second groove 420 is a "U"-shaped structure, and the first groove 410 extends on the surface of the first substrate 410 close to the piezoelectric layer 20, the surface of the first substrate 410 close to the second substrate 420, and the surface of the first substrate 410 away from the piezoelectric layer 20. The backing 40 also includes an auxiliary substrate 421. The auxiliary substrate 421 is disposed on the surface of the first substrate 410 and the second substrate 420 away from the piezoelectric layer 20 to prevent the conductive member 400 in the first groove 410 from being exposed. The auxiliary substrate 421 serves as an insulator.

[0076] In one embodiment, the spacing L1 between two adjacent first grooves 401 and the spacing L2 between two adjacent second grooves 402 are both equal to twice the spacing H1 between the centerlines of two adjacent piezoelectric elements 30. The plurality of piezoelectric elements 30 are arranged in an array along a first direction a, and the first substrate 410 and the second substrate 420 are arranged side by side along a second direction b, with the first direction a being perpendicular to the second direction b. The plurality of piezoelectric elements 30 are alternately connected to the conductive members 400 in the first grooves 401 and the conductive members 400 in the second grooves 402.

[0077] Because the piezoelectric elements 30 are densely arranged and alternately connected to the conductive members 400 of the first grooves 401 and the conductive members 400 of the second grooves 402, the required arrangement of the first grooves 401 and the second grooves 402 is less dense, and the spacing between adjacent first grooves 401 or adjacent second grooves 402 is larger, facilitating groove processing. Furthermore, the increased distance between adjacent grooves enhances the insulation between the conductive members 400 in the grooves.

[0078] The distance between adjacent grooves on the same substrate is related to the arrangement of the piezoelectric elements 30 and the number of substrates.

[0079] When the arrangement of the piezoelectric elements 30 remains unchanged, the greater the number of substrates, the smaller the spacing between adjacent grooves.

[0080] The distance L1 between two adjacent first grooves 401 refers to the distance between the centers of the openings of the two first grooves 401 along the first direction a.

[0081] The piezoelectric element 30 is a rectangular parallelepiped. The opening of the first groove 401 near the piezoelectric element 30 is rectangular. The length of the piezoelectric element 30 along the second direction b is twice the length of the opening of the first groove 401 near the piezoelectric element 30. Along the first direction a, multiple piezoelectric elements 30 are alternately connected to the conductive member 400 in the first groove 401 or the second groove 402. This arrangement can increase the distance between the grooves on the backing, making it easier to process the grooves on the first substrate 410 and the second substrate 420. In addition, the increased distance between two adjacent grooves increases the insulation between the conductive members 400 in the grooves.

[0082] The sum of the number of the first grooves 401 and the number of the second grooves 402 is not less than the number of the piezoelectric elements 30, that is, the sum of the number of the conductive parts 400 in the first grooves 401 and the number of the conductive parts 400 in the second grooves 402 is not less than the number of the piezoelectric elements 30, so as to ensure that each of the piezoelectric elements 30 is connected to at least one of the conductive parts 400.

[0083] Please also see Figure 6 、 Figure 7 、 Figure 8 and Figure 9In a specific embodiment, there are 8 piezoelectric elements 30, numbered A1-A8 respectively. There are 4 first grooves 401, numbered B1-B4 respectively. There are 4 second grooves 402, numbered C1-C4 respectively. The 4 first grooves 401 and the 4 second grooves 402 are arranged in a staggered manner along the first direction a. The piezoelectric element A1 is connected to the first groove B1, and the piezoelectric element A2 is connected to the second groove C1 of the second base 420. The piezoelectric element A3 is connected to the first groove B2, and the piezoelectric element A4 is connected to the second groove C2 of the second base 420. The piezoelectric element A5 is connected to the first groove B3, and the piezoelectric element A6 is connected to the second groove C3 of the second base 420. The piezoelectric element A7 is connected to the first groove B4, and the piezoelectric element A8 is connected to the second groove C4 of the second base 420.

[0084] The number of the first bases 410 may be one or more, and the plurality of first bases 410 are arranged along the second direction b, and the plurality of first grooves 401 on one first base 410 are arranged along the first direction a.

[0085] In one embodiment, there may be a plurality of second bases 420 , and the plurality of second bases 420 are arranged along the second direction b. The plurality of second grooves 402 in one second base 420 are arranged in an array along the first direction a.

[0086] The widths of the plurality of second base bodies 420 along the second direction b may be the same or different. The plurality of second base bodies 420 may be arranged adjacent to each other or arranged at intervals.

[0087] A plurality of second bases 420 may be simultaneously disposed on one side of the first base 410 , or may be respectively disposed on both sides of the first base 410 along the second direction b.

[0088] Please also see Figure 10In one embodiment, the lining plate 40 further includes a third base 430. The third base 430, the first base 410, and the second base 420 are arranged in an array along the second direction b. The third base 430 is provided with a plurality of fourth grooves 403 distributed along the first direction a. The plurality of fourth grooves 403 are arranged in an array. The spacing between two adjacent fourth grooves 403 is three times the centerline spacing H1 between two adjacent piezoelectric elements 30. The spacing between two adjacent second grooves 402 on the second base 420 is three times the centerline spacing H1 between two adjacent piezoelectric elements 30. The spacing between two adjacent first grooves 401 on the first base 410 is three times the centerline spacing H1 between two adjacent piezoelectric elements 30. The first groove 401, the second groove 402, and the fourth groove 403 are arranged in an staggered manner along the first direction a. In the above arrangement, along the first direction a, the plurality of piezoelectric elements 30 are alternately connected to the conductive members 400 in the first groove 401, the second groove 402, and the fourth groove 403. This increases the distance between the grooves on the backing, facilitating the processing of grooves on the first substrate 410, the second substrate 420, and the third substrate 430. Furthermore, the increased distance between adjacent grooves enhances the insulation between the conductive members 400 in the grooves.

[0089] In one embodiment, there may be a plurality of third bases 430 , and the plurality of third bases 430 are arranged along the second direction b, and the plurality of fourth grooves 403 in one third base 430 are arranged in an array along the first direction a.

[0090] The widths of the plurality of third bases 430 along the second direction b may be the same or different. The plurality of third bases 430 may be arranged adjacent to each other or arranged at intervals.

[0091] The plurality of third bases 430 may be simultaneously disposed on one side of the first base 410 , or may be respectively disposed on both sides of the first base 410 along the second direction b.

[0092] Please also see Figure 11 In one embodiment, the first base 410 further includes a third base 430. The third base 430 is disposed between the first base 410 and the second base 420. The third base 430 is made of an insulating material to increase the distance between the first groove 401 and the second groove 402, thereby increasing the insulation between the conductive member 400 in the first groove 401 and the second groove 402.

[0093] Please also see Figure 12In one embodiment, the first substrate 410 includes a first surface 411 and a second surface 412 connected to the first surface 411. A plurality of first grooves 401 are opened on the first surface 411, and the first grooves 401 extend to the second surface 412. The lead-out interface of the conductive member 400 in the first groove 401 is on the second surface 412. The control device can be connected to the plurality of conductive members 400 on the second surface 412 through a connector to control the plurality of piezoelectric elements 30 separately. The connection portion of the ultrasonic transducer system 10 is set on the side surface, and can also be set on the lower surface to facilitate the connection of the control device.

[0094] Please also see Figure 13 In one embodiment, the first substrate 410 further includes a third surface 413 opposite the second surface 412. A plurality of third grooves 404 are formed on the first surface 411, and the plurality of third grooves 404 are spaced apart from the plurality of first grooves 401. The third grooves 404 extend to the third surface 413.

[0095] The lead-out interfaces of the conductive members 400 in the plurality of first grooves 401 are respectively arranged on the second surface 412 and the third surface 413 , so as to avoid stacking the lead-out interfaces on the same side and increase the installation space.

[0096] In one embodiment, the first base 410 further includes a fourth surface 414 opposite to the first surface 411. The first groove 401 extends to the fourth surface 414, so that the lead-out interface of the conductive member 400 is exposed to the outside for easy maintenance.

[0097] The conductive member 400 in the first groove 401 , the second groove 402 or the fourth groove 403 may be connected to an external control device through a wire, or through an electrical connector 50 .

[0098] Please also see Figure 14 In one embodiment, the backing 10 further includes an electrical connector 50. The electrical connector 50 includes a terminal 510. The terminal 510 is arranged opposite to the first groove 401. The terminal 510 is connected to the conductive member 400. The electrical connector 50 is used to connect the conductive member 400 in the first groove 401 or the second groove 402 to an external control device to transmit the electrical signals of the plurality of piezoelectric elements 30 to the control device. The electrical connector 50 is detachably connected to the control device, which is convenient for replacement and maintenance. The electrical connector 50 is connected to the conductive member 400 by welding, bonding or clamping.

[0099] In one embodiment, the fourth surface 414 defines a fifth groove 405. The first groove 401 extends to the bottom of the fifth groove 405. The electrical connector 50 is disposed in the fifth groove 405. The electrical connector 50 is surrounded by the sidewalls of the fifth groove 405, preventing leakage of the connection point and improving safety.

[0100] An embodiment of the present application provides an ultrasonic transducer system 10, comprising a backing 40, a piezoelectric layer 20, a lens 70, and a housing 101. The backing 40 comprises a first substrate 410 and / or a second substrate 420. A plurality of conductive members 400 are arranged side by side and embedded in the first substrate 410 and / or the second substrate 420. The piezoelectric layer 20 is disposed on the backing 40. The piezoelectric layer 20 comprises a plurality of piezoelectric elements 30. The piezoelectric elements 30 are electrically connected to the conductive members 400, respectively. The lens 70 is disposed on the piezoelectric layer 20. The housing 101 has an inner cavity surrounded by a plurality of surfaces. The backing 40, the piezoelectric layer 20, and the lens 70 are at least partially accommodated in the inner cavity.

[0101] The ultrasonic transducer system 10 provided in the embodiment of the present application avoids the use of a separate flexible circuit board by arranging the conductive members 400 connected to the piezoelectric layer 20 side by side and embedding them into the first substrate 410 and / or the second substrate 420, thereby reducing the height of the ultrasonic transducer system 10. Therefore, the ultrasonic transducer system 10 adopts a structure in which the conductive members 400 are embedded in the backing 40, thereby reducing the weight and volume of the ultrasonic transducer system 10.

[0102] In one embodiment, the ultrasonic transducer system 10 further includes a matching layer 60 and a control device. The matching layer 60 is disposed on a surface of the piezoelectric layer 20 away from the backing 40. The control device is connected to the piezoelectric layer 20 via the conductive member 400.

[0103] In one embodiment, the first substrate 410 and the second substrate 420 are arranged side by side or overlapped. The conductive members 400 on the first substrate 410 and the conductive members 400 on the second substrate 420 are arranged in a staggered or aligned manner.

[0104] In one embodiment, the thickness of the backing 40 is greater than the thickness of the housing 101. The thickness of the housing 101 refers to the thickness of the panels surrounding the housing 101. The thickness of the backing 40 is between 1 mm and 20 mm.

[0105] The thickness of the larger ultrasonic transducer system 10 is about 30 mm, and the thickness of the smaller ultrasonic transducer system 10 is between 7 mm and 8 mm.

[0106] In a specific embodiment, the overall thickness of the ultrasonic transducer system 10 is 30 mm, and the thickness of the backing 40 is 20 mm.

[0107] In one embodiment, the plurality of conductive elements 400 extend from a first surface of the backing 40 to a second surface of the backing 40 , and the first surface is opposite to or intersects the second surface.

[0108] This embodiment provides an ultrasonic transducer system 10, comprising a backing 40 and a piezoelectric layer 20 as described in any of the above embodiments. The piezoelectric layer 20 is disposed on the surface of the backing 40 where the first groove 401 is located. The piezoelectric layer 20 includes a plurality of piezoelectric elements 30. Each piezoelectric element 30 is connected to at least one conductive member 400, and each conductive member 400 is connected to only one piezoelectric element 30.

[0109] The ultrasonic transducer system 10 provided in the embodiment of the present application has the first groove 401 defined in the backing 40, thereby reducing the weight of the backing 40 and, in turn, the weight of the ultrasonic transducer system 10. Furthermore, by disposing the conductive member 400 connected to the piezoelectric layer 20 in the first groove 401 of the backing 40, the ultrasonic transducer system 10 avoids the need for a separate flexible circuit board and reduces the height of the ultrasonic transducer system 10. Therefore, the ultrasonic transducer system 10 employs a structure in which the conductive member 400 is embedded in the backing 40, thereby reducing both the weight and volume of the ultrasonic transducer system 10.

[0110] The conductive member 400 is positioned within the first groove 401 relative to the connection points on the flexible printed circuit board. The connection area between the conductive member 400 and the piezoelectric element 30 is large and flat, facilitating connection between the conductive member 400 and the piezoelectric element 30 and reducing the difficulty of assembling the ultrasonic transducer system 10. The backing 40 is simple to manufacture, eliminating the need for specialized electrode coatings on the piezoelectric array elements 30. Conventional ultrasonic transducer system 10 processing and assembly equipment can be used, reducing the cost of the ultrasonic transducer system 10 and improving production efficiency.

[0111] In one embodiment, the ultrasonic transducer system 10 further includes a matching layer 60, a lens 70, and a control device. The matching layer 60 is disposed on a surface of the piezoelectric layer 20 away from the backing 40. The lens 70 is disposed on a surface of the matching layer 60 away from the piezoelectric layer 20. The control device is connected to the piezoelectric layer 20 via the conductive member 400.

[0112] The control device receives an external detection command and sends a detection signal. The detection signal is transmitted to the corresponding piezoelectric element 30 through the conductive member 400. The piezoelectric element 30 vibrates to generate ultrasonic waves. The matching layer 60 is used to match the impedance between the piezoelectric element 30 and the inspected tissue so that more ultrasonic energy can be transmitted to the inspected tissue and a higher signal response is obtained. The lens 70 is used to focus sound waves and enhance the response. When the ultrasonic wave encounters the inspected tissue, it is reflected back to the lens 70, the matching layer 60 and the piezoelectric layer 20. The reflected wave is received by the piezoelectric element 30 and an electrical signal is generated. The electrical signal is transmitted to the control device through the conductive member 400. The control device generates corresponding images, data, tables and other information based on the electrical signal to reflect the condition of the inspected tissue.

[0113] In one embodiment, the ultrasonic transducer system 10 further includes a housing 101. The housing 101 encloses a housing cavity. An opening is defined on a surface of the housing 101, and the lens 70 is disposed in the opening. The matching layer 60, the piezoelectric layer 20, and the backing 40 are housed in the housing cavity.

[0114] The shape of the shell 101 can be a regular three-dimensional structure such as a cuboid, a cube, a cylinder or a sphere, or an irregular three-dimensional structure such as a stepped or gourd-shaped structure. The material of the shell 101 is an insulating material. The material of the shell 101 can be an inorganic insulating material and / or an organic insulating material. The inorganic insulating material can include, for example, SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, ZrO2, BST, and PZT. Organic insulating materials may include, for example, common polymers (PMMA, PS), phenolic polymer derivatives, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, paraxylene polymers, vinyl alcohol polymers, and mixtures thereof. In one embodiment, the housing 101 is made of polybutylene terephthalate (PBT), which is lightweight, has good insulation properties, and is inexpensive.

[0115] Please also see Figure 15 , the embodiment of the present application provides a method for manufacturing a backing 40, comprising:

[0116] S100: manufacturing the first substrate 410.

[0117] The base material and filler are mixed uniformly in a certain proportion, degassed, and then placed in a certain temperature and humidity environment for hardening. The composition and ratio of the base material and filler depend on the impedance, thermal conductivity, hardness, and other requirements of the backing 40. The hardened backing 40 blank is processed into the desired shape to form the first substrate.

[0118] S200 , forming a plurality of first grooves 401 on the surface of the first base 410 .

[0119] A first groove 401 is formed on the top, joint, or bottom surface of the first substrate 410. The cross-sectional shape of the first groove 401 can be any shape, such as square, triangular, or semicircular. The cross-sectional width of the first groove 401 ranges from 5 μm to 200 μm, preferably to facilitate groove formation and minimize acoustic reflection caused by the first groove 401. The depth of the first groove 401 is minimized to ensure a secure connection between the conductive material and the substrate.

[0120] In one embodiment, the method for manufacturing the backing 40 further includes:

[0121] S300 , disposing a conductive member 400 inside the first groove 401 .

[0122] After a conductive material is embedded in the first groove 401 and the conductive material is firmly connected to the first groove 401 , the first substrate is finely ground to a designed size.

[0123] The step S100 further includes manufacturing the second base 420. The step S200 further includes forming a plurality of second grooves 402 on the surface of the second base 420. The step S300 further includes disposing a conductive member 400 inside the second groove 402.

[0124] In one embodiment, the method for manufacturing the backing 40 further includes:

[0125] S400, the first substrate 410 and the second substrate 420 are bonded together, and the surface of the first substrate 410 close to the piezoelectric layer 20 and the surface of the second substrate 420 close to the piezoelectric layer 20 are in the same plane, and the plurality of first grooves 401 and the plurality of second grooves 402 are staggered and spaced one by one along the first direction a.

[0126] The first substrate 410 and the second substrate 420 are combined together using an adhesive so that their upper surfaces are on the same plane, and the first groove 401 and the multiple second grooves 402 are separated by the width of a piezoelectric element 30, thereby ensuring that after the piezoelectric layer 20 is bonded to the backing 40 and divided into multiple piezoelectric elements 30, each piezoelectric element 30 is connected to a conductive member 400.

[0127] If the backing 40 includes multiple substrates, the backing 40 may be manufactured by referring to steps S100 to S400 .

[0128] In the manufacturing method of the backing 10 provided in the embodiment of the present application, the first groove 401 is provided on the surface of the first substrate 410, thereby reducing the weight of the backing 40 and, in turn, the weight of the ultrasonic transducer system 10. Furthermore, by disposing the conductive member 400 connected to the piezoelectric layer 20 within the first groove 401 of the backing 40, the ultrasonic transducer system 10 avoids the need for a separate flexible circuit board and reduces the height of the ultrasonic transducer system. Therefore, the structure of the backing 40 with the grooves reduced the weight and volume of the ultrasonic transducer system 10.

[0129] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0130] The above-described embodiments merely represent several implementation methods of the present application and should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the spirit of the present invention, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A backing, characterized in that: include: A first base body, wherein a plurality of first grooves are formed on a surface of the first base body; a second substrate, the second substrate being arranged side by side with the first substrate, the second substrate being provided with a plurality of second grooves, the plurality of first grooves being staggered with the plurality of second grooves, and the spacing between two adjacent first grooves and the spacing between two adjacent second grooves being equal to twice the spacing between the center lines of two adjacent piezoelectric elements; Each of the first grooves and each of the second grooves is used to fill a conductive member connected to the piezoelectric element of the piezoelectric layer.

2. The backing according to claim 1, wherein The first groove is filled with a mixture of metal powder and adhesive.

3. The backing according to claim 1, wherein The first grooves are arranged in a row array, and the second grooves are arranged in a row array.

4. The backing according to claim 3, wherein The invention further comprises a third substrate, wherein the third substrate is arranged between the first substrate and the second substrate.

5. The backing according to claim 1, wherein The first base includes a first surface and a second surface connected to the first surface. A plurality of first grooves are opened on the first surface, and the first grooves extend to the second surface.

6. The backing according to claim 5, wherein The first base also includes a third surface opposite to the second surface. A plurality of third grooves are opened on the first surface. The plurality of third grooves are spaced apart from the plurality of first grooves one by one. The third grooves extend to the third surface.

7. The backing according to claim 5, wherein The first base further includes a fourth surface opposite to the first surface, and the first groove extends to the fourth surface.

8. An ultrasonic transducer system, characterized in that: include: A backing, comprising: a first substrate and a second substrate, wherein a plurality of first grooves are defined on a surface of the first substrate, the second substrate is arranged side by side with the first substrate, and the second substrate is provided with a plurality of second grooves, wherein the plurality of first grooves and the plurality of second grooves are staggered one by one, and the spacing between two adjacent first grooves and the spacing between two adjacent second grooves are both equal to twice the spacing between the center lines of two adjacent piezoelectric elements, each first groove and each second groove is used to fill a conductive member connected to the piezoelectric element of the piezoelectric layer, and the plurality of conductive members are arranged side by side and embedded in the first substrate and the second substrate; a piezoelectric layer disposed on the backing, the piezoelectric layer comprising a plurality of piezoelectric elements, the piezoelectric elements being electrically connected to the conductive members respectively; a lens, disposed on the piezoelectric layer; The shell has an inner cavity surrounded by a plurality of surfaces, and the backing, the piezoelectric layer and the lens are at least partially accommodated in the inner cavity.

9. The ultrasonic transducer system according to claim 8, wherein: Also includes: a matching layer, disposed on a surface of the piezoelectric layer away from the backing; A control device is connected to the piezoelectric layer through the conductive member.

10. The ultrasonic transducer system according to claim 8 or 9, characterized in that: The first substrate and the second substrate are arranged side by side or overlapped, and the conductive members on the first substrate and the conductive members on the second substrate are arranged in a staggered or aligned manner.

11. The ultrasonic transducer system according to claim 10, wherein: The plurality of conductive members extend from a first surface of the backing to a second surface of the backing, the first surface being opposite to or intersecting the second surface.

12. A method for making a backing, characterized in that: include: A first substrate and a second substrate are manufactured; the second substrate and the first substrate are arranged side by side; A plurality of first grooves are opened on the surface of the first substrate, and a plurality of second grooves are opened on the surface of the second substrate. The plurality of first grooves and the plurality of second grooves are staggered one by one. The spacing between two adjacent first grooves and the spacing between two adjacent second grooves are both equal to twice the spacing between the center lines of two adjacent piezoelectric elements. Each first groove and each second groove is used to fill a conductive part, and the conductive part is connected to the piezoelectric element of the piezoelectric layer.

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