Method and device for constructing three-dimensional temperature cloud field of micro-module

Abstract

The present invention is applicable to the technical field of data centers, and provides a method and device for constructing a three-dimensional temperature cloud field of a micro-module. The method includes: obtaining temperature information corresponding to at least three temperature monitoring points on the micro-module; constructing a three-dimensional micro-module model of the micro-module; determining the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system where the model is located; for any interpolation point: selecting a plurality of known data points as the first data points corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point; calculating the temperature value of the interpolation point based on the temperature values of the first data points and the distances between each first data point and the interpolation point; rendering the three-dimensional micro-module model according to the temperature values corresponding to each position coordinate to obtain the three-dimensional temperature cloud field of the micro-module. Through the above solution, the present application can improve the reliability of the three-dimensional temperature cloud field on the premise of ensuring data accuracy.

Description

Technical Field

[0001] The present invention belongs to the technical field of data centers, and particularly relates to a method and device for constructing a three-dimensional temperature cloud field of a micro-module. Background Art

[0002] Micro-modules are usually used to store IT devices such as servers. The core components of IT devices such as servers are semiconductor devices, which generate a large amount of heat. In addition to the CPU, other processing chips of a computer, such as buses, memories, I / O, etc., are all high-heat-generating devices. With the continuous development of the refrigeration method, it is increasingly difficult to master the temperature data in the computer room.

[0003] The existing method for obtaining temperature data is to arrange a sufficient number of temperature sensors outside the cabinet, collect the temperature data of each point of the cabinet through the temperature sensors, and then draw the corresponding temperature cloud map according to the temperature data, so that the operation and maintenance personnel of the data center can quickly locate the hot spots and cold spots according to the temperature cloud map. This temperature cloud map usually can only accurately display the temperature data of the monitoring points outside the cabinet. However, when the temperature outside the cabinet is high, it indicates that there is a higher heat source inside the cabinet, resulting in an unreliable generated temperature cloud field. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a method and device for constructing a three-dimensional temperature cloud field of a micro-module to solve the problem that the temperature cloud field in the prior art cannot accurately and effectively reflect the temperature of the cabinet.

[0005] The first aspect of the embodiments of the present invention provides a method for constructing a three-dimensional temperature cloud field of a micro-module, including:

[0006] Obtaining temperature information corresponding to at least three temperature monitoring points on the micro-module; the temperature information includes a temperature value and position data; each temperature monitoring point is located in a different orientation of the micro-module;

[0007] Constructing a three-dimensional micro-module model of the micro-module; and converting the position data corresponding to each temperature monitoring point to the three-dimensional coordinate system where the three-dimensional micro-module model is located;

[0008] Determining the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system;

[0009] For any interpolation point: based on the position coordinates of the interpolation point and the position coordinates of each known data point, selecting a plurality of known data points as the first data points corresponding to the interpolation point; calculating the temperature value of the interpolation point based on the temperature values of each first data point corresponding to the interpolation point and the distances between each first data point and the interpolation point; the known data points include temperature monitoring points and / or interpolation points for which the temperature values have been calculated;

[0010] Render the three-dimensional micro-module model according to the temperature values corresponding to the position coordinates at various positions on the three-dimensional micro-module model to obtain the three-dimensional temperature cloud field of the micro-module.

[0011] The second aspect of the embodiments of the present invention provides a device for constructing a three-dimensional temperature cloud field of a micro-module, including:

[0012] A temperature information acquisition module, configured to acquire temperature information corresponding to at least three temperature monitoring points on the micro-module; the temperature information includes temperature values and position data; each temperature monitoring point is located in a different orientation of the micro-module;

[0013] A model construction module, configured to construct a three-dimensional micro-module model of the micro-module; and convert the position data corresponding to each temperature monitoring point to the three-dimensional coordinate system where the three-dimensional micro-module model is located;

[0014] An interpolation point coordinate determination module, configured to determine the position coordinates of multiple interpolation points in the three-dimensional coordinate system;

[0015] A temperature value calculation module, for any interpolation point: based on the position coordinates of the interpolation point and the position coordinates of each known data point, select multiple known data points as the first data points corresponding to the interpolation point; calculate the temperature value of the interpolation point based on the temperature values of each first data point corresponding to the interpolation point and the distances between each first data point and the interpolation point; the known data points include temperature monitoring points and / or interpolation points for which temperature values have been calculated;

[0016] A temperature cloud field construction module, configured to render the three-dimensional micro-module model according to the temperature values corresponding to the position coordinates at various positions on the three-dimensional micro-module model to obtain the three-dimensional temperature cloud field of the micro-module.

[0017] The third aspect of the embodiments of the present invention provides a terminal device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the method for constructing a three-dimensional temperature cloud field of the micro-module as described above are implemented.

[0018] The fourth aspect of the embodiments of the present invention provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps of the method for constructing a three-dimensional temperature cloud field of the micro-module as described above are implemented.

[0019] The beneficial effects of the embodiments of the present invention compared with the prior art are as follows: In this embodiment, first, temperature information corresponding to at least three temperature monitoring points on the micro-module is obtained; a three-dimensional micro-module model of the micro-module is constructed; and the position data corresponding to each temperature monitoring point is converted into the three-dimensional coordinate system where the three-dimensional micro-module model is located; then, the position coordinates of multiple interpolation points in the three-dimensional coordinate system are determined; for any interpolation point: based on the position coordinates of this interpolation point and the position coordinates of each known data point, multiple known data points are selected as the first data points corresponding to this interpolation point; based on the temperature values of each first data point corresponding to this interpolation point and the distances between each first data point and this interpolation point, the temperature value of this interpolation point is calculated; finally, according to the temperature values corresponding to each position coordinate on the three-dimensional micro-module model, the three-dimensional micro-module model is rendered to obtain the three-dimensional temperature cloud field of the micro-module. Through the above solution, this embodiment can accurately obtain the values of each interpolation point based on the temperature data and distances of multiple known data points around the interpolation point, thereby improving the reliability of the three-dimensional temperature cloud field on the premise of ensuring the accuracy of the three-dimensional temperature cloud field data. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 is a flowchart showing a method for constructing a three-dimensional temperature cloud field of a micro-module provided by an embodiment of the present invention;

[0022] Figure 2 is a schematic diagram showing the selection of interpolation points provided by an embodiment of the present invention;

[0023] Figure 3 is a schematic diagram of a temperature cloud field provided by an embodiment of the present invention;

[0024] Figure 4 is a schematic diagram of a device for constructing a three-dimensional temperature cloud field of a micro-module provided by an embodiment of the present invention;

[0025] Figure 5 is a schematic diagram of a terminal device provided by an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] In the following description, specific details such as specific system architectures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present invention. However, those skilled in the art should clearly understand that the present invention can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present invention.

[0027] In order to illustrate the technical solutions described in the present invention, the following will be described through specific embodiments.

[0028] In one embodiment, as Figure 1 shown, Figure 1 The implementation process of a method for constructing a three-dimensional temperature cloud field of a micro-module provided in this embodiment is shown. The execution subject of this method is a terminal device, and the process is described in detail as follows:

[0029] S101: Obtain the temperature information corresponding to at least three temperature monitoring points on the micro-module; the temperature information includes temperature values and position data; each temperature monitoring point is located at a different orientation of the micro-module.

[0030] In this embodiment, a plurality of temperature sensors are evenly arranged on the micro-module, and the temperature information of each part of the micro-module is obtained through the temperature sensors. The temperature information includes temperature values and position data.

[0031] Specifically, the staff can vertically and evenly set N temperature sensors in the cold channel and the hot channel corresponding to each cabinet, and set at least one temperature sensor on the top and side of the cabinet. Temperature sensors can also be set at the parts with the highest temperature and the lowest temperature of each cabinet respectively. Exemplarily, N = 5.

[0032] In a possible embodiment, the actual power of the selected positions of each temperature monitoring point is greater than a preset power threshold.

[0033] Specifically, temperature monitoring points can be arranged at positions with higher power on the micro-module, or at least one temperature monitoring point can be arranged in areas with intensive work. The actual power of each part of the micro-module can be obtained through the monitoring system.

[0034] S102: Construct a three-dimensional micro-module model of the micro-module; and convert the position data corresponding to each temperature monitoring point to the three-dimensional coordinate system where the three-dimensional micro-module model is located.

[0035] Specifically, the browser in the terminal device needs to support the Threejs environment. Create a corresponding 3D rendering environment in the Threejs environment and inject the mouse operation controller OrbitControls. The user inputs the number and type of cabinets in the micro-module. Based on Threejs, load the basic 3D model of a single row of cabinets of the corresponding type, calculate the corresponding positions of each cabinet model, and finally splice the basic 3D models of the corresponding number of cabinets into an overall 3D micro-module model.

[0036] The process of modeling the cabinet is as follows:

[0037] First, model the basic module of a single row of cabinets. After the model is loaded, the terminal device parses the cabinet data configured by the current user returned by the background. The micro-module cabinets are divided into two rows of front and rear cabinets. The terminal device only needs to calculate the specific position of any one row (for example, the rear row), and the position of the other row can be determined; because the current cabinet model is a unified model of two columns, the subscript of the cabinet number data starts from 0, and the cabinets with even subscript numbers are in the rear row, and the cabinets with odd subscript numbers are in the front row. Then create a new object model group, loop through the background data, store the data configured by the user returned by the background (such as cabinet name, cabinet type, etc.) in the corresponding basic cube model of a single row of cabinets, and distinguish the type of cabinet according to the fixed width of the cube model (the width of the full cabinet of the ordinary cabinet is 64, and the width of the half cabinet of the air-conditioning cabinet is 34). Multiply the width of the cube model by the subscript number of the current loop as the X-axis position of the cabinet model in the scene (the Y-axis and Z-axis are both defaulted to 0), and add it to the previously created object model group for use as a basis for data change when the data changes. Finally, add the object model group to the scene to complete the rendering of the basic model of the 3D micro-module.

[0038] S103: Determine the position coordinates of multiple interpolation points in the three-dimensional coordinate system.

[0039] In one embodiment, the specific implementation process of S103 includes:

[0040] According to the preset unit step size and the coordinate range of the three-dimensional micro-module model in the three-dimensional coordinate system, determine the position coordinates of multiple interpolation points in the three-dimensional coordinate system.

[0041] As a way to select interpolation points, after establishing a three-dimensional micro-module model, the terminal device can obtain the preset unit step determined by the user according to the coordinate range of the three-dimensional micro-module model in the coordinate system, and save the preset unit step, where the preset unit step is the unit in the three-dimensional coordinate system; then divide multiple data points on the three-dimensional micro-module model according to the preset unit step. For example, the data points of the three-dimensional micro-module model can be determined with 1 as the unit step on the x, y, and z axes respectively, and the data points corresponding to the temperature monitoring points are used as known data points, and other points are used as interpolation points to determine the position coordinates of each interpolation point.

[0042] In one embodiment, as an alternative to S103 above, S103 can also be implemented through the following steps:

[0043] S201: Obtain the size information of the micro-module;

[0044] S202: Obtain the actual distance between the first interpolation point and the landmark point of the micro-module; the first interpolation point is any interpolation point;

[0045] S203: Based on the position coordinates of the landmark point of the micro-module, the actual distance between the first interpolation point and the landmark point of the micro-module, and the proportional relationship between the micro-module and the three-dimensional micro-module model, determine the position coordinates of the first interpolation point.

[0046] As another implementation of interpolation point selection, in this embodiment, the position coordinates of each interpolation point can be automatically calculated according to the size information of the actual micro-module. Specifically, when the user establishes a three-dimensional micro-module model, the actual positions of each interpolation point can be determined first. The terminal device determines the actual distance and relative angle between each interpolation point and the landmark point according to the actual positions of each interpolation point and the landmark point of the micro-module. In this way, the simulated distance and relative angle between each interpolation point and the landmark point in the three-dimensional coordinate system can be determined according to the proportional relationship between the micro-module and the three-dimensional micro-module model, the actual distance and relative angle between each interpolation point and the landmark point, and then the position coordinates of each interpolation point in the three-dimensional coordinate system can be determined according to the position coordinates of the landmark point in the three-dimensional coordinate system, the simulated distance and relative angle between each interpolation point and the landmark point in the three-dimensional coordinate system.

[0047] Specifically, the landmark point can be any corner point of the micro-module.

[0048] In practical applications, the terminal device can determine the position coordinates of the interpolation points by using any of the above methods. It can also determine the position coordinates of the interpolation points in a mixed manner of two methods. For example, the position coordinates of ordinary interpolation points are determined by using a preset unit step length to ensure the comprehensiveness of the three-dimensional temperature cloud field; the position coordinates of some specific points on the micro-module that are not convenient to install temperature sensors but are very important are determined by using the method of S201 - S203 to ensure the accuracy and traceability of special points.

[0049] S104: For any interpolation point: Based on the position coordinates of the interpolation point and the position coordinates of each known data point, select multiple known data points as the first data points corresponding to the interpolation point; Calculate the temperature value of the interpolation point based on the temperature values of each first data point corresponding to the interpolation point and the distances between each first data point and the interpolation point; The known data points include temperature monitoring points and / or interpolation points for which the temperature values have been calculated.

[0050] In one embodiment, the process of obtaining the first data points in S104 specifically includes:

[0051] Sort all the known data points in ascending order of the distance from the interpolation point to obtain the distance sequence corresponding to the interpolation point;

[0052] Select the first N known data points in the distance sequence as the first data points corresponding to the interpolation point.

[0053] In one embodiment, another implementation manner of the process of obtaining the first data points in S104 includes:

[0054] Step 1: Based on the position coordinates of the interpolation point and the position coordinates of each known data point, calculate the distances between the interpolation point and each known data point; Use the known data points whose distances from the interpolation point are greater than the preset distance threshold as the second data points corresponding to the interpolation point;

[0055] Step 2: Use the second data point closest to the interpolation point as the first data point corresponding to the interpolation point;

[0056] Step 3: Output the current first data point corresponding to the interpolation point;

[0057] Step 4: Calculate the target angle ∠A between the current first data point corresponding to the interpolation point and the second data point o XA k , where X represents the interpolation point; A o represents the current first data point of the interpolation point X; A k represents the second data point corresponding to the interpolation point X other than the current first data point;

[0058] Step Five: Starting from the current first data point, select the first second data point corresponding to the interpolation point that satisfies the preset angle condition in the preset rotation direction to replace the current first data point, and repeat Steps Three to Five until M first data points of the interpolation point are obtained; the preset angle condition is that the target angle is greater than the preset angle threshold.

[0059] Specifically, the preset rotation angles include clockwise rotation angles and counterclockwise rotation angles.

[0060] In this embodiment, as Figure 3 shown, the interpolation point is the white dot X in Figure 2 , the black dots are known data points. First, the second data points of the interpolation point X can be determined as A1 to A5 according to the distance from each known data point to the interpolation point. Then, through the above selection rule, when A4 is used as the current first data point and the next first data point is selected by clockwise rotation, the angle difference between A5 and A4 is relatively small, so the selection of point A5 is abandoned. Therefore, the first data points of the interpolation point X are A1 to A4.

[0061] In this embodiment, if the number of first data points obtained by rotating one circle (starting from the second data point closest to the interpolation point X and rotating back to this second data point) is less than M, the temperature value of the interpolation point X is calculated using the temperature values of the first data points obtained by rotating one circle.

[0062] In this embodiment, through the above method, the selected first data points can be evenly dispersed in different directions of the interpolation point, thereby improving the calculation accuracy of the interpolation point.

[0063] In one embodiment, the temperature value calculation process of the above S104 specifically includes:

[0064] Based on the formula obtain the temperature value of the interpolation point j;

[0065] where, t i represents the temperature value of the known data point i, d ij represents the distance between the known data point i and the interpolation point j, and T j represents the temperature value of the interpolation point j.

[0066] S105: According to the temperature values corresponding to the position coordinates at each position on the three-dimensional micro-module model, render the three-dimensional micro-module model to obtain the three-dimensional temperature cloud field of the micro-module.

[0067] In this embodiment, after obtaining the temperature values of each data point, the three-dimensional micro-module model is rendered according to the temperature values of each position coordinate and the corresponding colors to obtain a three-dimensional temperature cloud field, as Figure 3 shown.

[0068] As can be seen from the above embodiments, in this embodiment, the temperature information corresponding to at least three temperature monitoring points on the micro-module is first obtained; a three-dimensional micro-module model of the micro-module is constructed; and the position data corresponding to each temperature monitoring point is converted into the three-dimensional coordinate system where the three-dimensional micro-module model is located; then, the position coordinates of multiple interpolation points in the three-dimensional coordinate system are determined; for any interpolation point: based on the position coordinates of this interpolation point and the position coordinates of each known data point, multiple known data points are selected as the first data points corresponding to this interpolation point; based on the temperature values of each first data point corresponding to this interpolation point and the distances between each first data point and this interpolation point, the temperature value of this interpolation point is calculated; finally, according to the temperature values corresponding to each position coordinate on the three-dimensional micro-module model, the three-dimensional micro-module model is rendered to obtain the three-dimensional temperature cloud field of the micro-module. Through the above solution, this embodiment can accurately obtain the values of each interpolation point based on the temperature data and distances of multiple known data points around the interpolation point, so as to obtain the temperature data of all parts on the micro-module, improve the comprehensive accuracy of the three-dimensional temperature cloud field, ensure that the three-dimensional temperature cloud field can reliably and effectively reflect the temperature situation inside the micro-module, and at the same time, since this embodiment can accurately obtain the temperature value of the interpolation point, fewer temperature sensors can be arranged to achieve the establishment of a comprehensive and accurate three-dimensional temperature cloud field, achieving the effect of reducing the cost of constructing the temperature cloud field.

[0069] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not mean the order of execution. The order of execution of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0070] In one embodiment, as Figure 4 shown, Figure 4 FIG. 10 shows the structure of a device 100 for constructing a three-dimensional temperature cloud field of a micro-module provided in this embodiment, which includes:

[0071] A temperature information acquisition module 110, configured to acquire temperature information corresponding to at least three temperature monitoring points on the micro-module; the temperature information includes temperature values and position data; each temperature monitoring point is located at a different orientation of the micro-module;

[0072] A model construction module 120, configured to construct a three-dimensional micro-module model of the micro-module; and convert the position data corresponding to each temperature monitoring point into the three-dimensional coordinate system where the three-dimensional micro-module model is located;

[0073] An interpolation point coordinate determination module 130, configured to determine the position coordinates of multiple interpolation points in the three-dimensional coordinate system;

[0074] The temperature value calculation module 140 is configured to, for any interpolation point: based on the position coordinates of the interpolation point and the position coordinates of each known data point, select multiple known data points as the first data points corresponding to the interpolation point; calculate the temperature value of the interpolation point based on the temperature values of each first data point corresponding to the interpolation point and the distances between each first data point and the interpolation point; the known data points include temperature monitoring points and / or interpolation points for which the temperature values have been calculated;

[0075] The temperature cloud field construction module 150 is configured to render the three-dimensional micro-module model according to the temperature values corresponding to the position coordinates on the three-dimensional micro-module model, so as to obtain the three-dimensional temperature cloud field of the micro-module.

[0076] In one embodiment, the temperature value calculation module 140 includes:

[0077] Based on the formula Obtain the temperature value of interpolation point j;

[0078] where, t i represents the temperature value of known data point i, d ij represents the distance between known data point i and interpolation point j, and T j represents the temperature value of interpolation point j.

[0079] In one embodiment, the temperature value calculation module 140 includes:

[0080] The distance sequence acquisition unit is configured to sort each known data point in ascending order of the distance from the interpolation point, so as to obtain the distance sequence corresponding to the interpolation point;

[0081] The first data point selection unit is configured to select the first N known data points in the distance sequence as the first data points corresponding to the interpolation point.

[0082] In one embodiment, the temperature value calculation module 140 is specifically configured to:

[0083] Step 1: Based on the position coordinates of the interpolation point and the position coordinates of each known data point, calculate the distances between the interpolation point and each known data point; use the known data points whose distances from the interpolation point are greater than the preset distance threshold as the second data points corresponding to the interpolation point;

[0084] Step 2: Use the second data point closest to the interpolation point as the first data point corresponding to the interpolation point;

[0085] Step 3: Output the current first data point corresponding to the interpolation point;

[0086] Step 4: Calculate the target angle ∠A between the current first data point corresponding to the interpolation point and the second data point o XAk , where X represents the interpolation point; A o represents the current first data point of the interpolation point X; A k represents the second data point corresponding to the interpolation point X other than the current first data point;

[0087] Step Five: Starting from the current first data point, select the first second data point corresponding to the interpolation point that satisfies the preset angle condition in the preset rotation direction to replace the current first data point, and repeat Step Three to Step Five until M first data points of the interpolation point are obtained; the preset angle condition is that the target angle is greater than the preset angle threshold.

[0088] In one embodiment, the interpolation point coordinate determination module 130 includes:

[0089] Determine the position coordinates of multiple interpolation points in the three-dimensional coordinate system according to the preset unit step size and the coordinate range of the three-dimensional micro-module model in the three-dimensional coordinate system.

[0090] In one embodiment, the interpolation point coordinate determination module 130 includes:

[0091] Obtain the size information of the micro-module;

[0092] Obtain the actual distance between the first interpolation point and the landmark point of the micro-module; the first interpolation point is any interpolation point;

[0093] Based on the position coordinates of the landmark point of the micro-module, the actual distance between the first interpolation point and the landmark point of the micro-module, and the proportional relationship between the micro-module and the three-dimensional micro-module model, determine the position coordinates of the first interpolation point.

[0094] In one embodiment, the actual power at the selected position of each temperature monitoring point is greater than the preset power threshold.

[0095] As can be seen from the above embodiments, this embodiment can accurately obtain the values of each interpolation point based on the temperature data and distances of multiple known data points around the interpolation point, so as to obtain the temperature data of all parts on the micro-module, improving the overall accuracy of the three-dimensional temperature cloud field.

[0096] Figure 5 is a schematic diagram of a terminal device provided by an embodiment of the present invention. As Figure 5 shown, the terminal device 5 in this embodiment includes: a processor 50, a memory 51, and a computer program 52 stored in the memory 51 and executable on the processor 50. When the processor 50 executes the computer program 52, it implements the steps in the embodiments of the method for constructing the three-dimensional temperature cloud field of each micro-module, such as Figure 1Steps 101 to 105 shown. Alternatively, when the processor 50 executes the computer program 52, it implements the functions of each module / unit in the above-described device embodiments, such as Figure 4 the functions of the modules 110 to 150 shown.

[0097] The computer program 52 can be divided into one or more modules / units, and the one or more modules / units are stored in the memory 51 and executed by the processor 50 to complete the present invention. The one or more modules / units can be a series of computer program instruction segments capable of performing specific functions, and these instruction segments are used to describe the execution process of the computer program 52 in the terminal device 5.

[0098] The terminal device 5 can be a computing device such as a desktop computer, a notebook, a palm computer, and a cloud server. The terminal device may include, but is not limited to, a processor 50 and a memory 51. Those skilled in the art can understand that Figure 5 merely examples of the terminal device 5, which do not constitute a limitation on the terminal device 5, and may include more or fewer components than shown in the figure, or combine certain components, or different components. For example, the terminal device may further include input / output devices, network access devices, a bus, etc.

[0099] The so-called processor 50 may be a central processing unit (CPU), or may also be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0100] The memory 51 may be an internal storage unit of the terminal device 5, such as a hard disk or memory of the terminal device 5. The memory 51 may also be an external storage device of the terminal device 5, such as a plug-in hard disk equipped on the terminal device 5, a Smart Media Card (SMC), a Secure Digital (SD) card, a Flash Card, etc. Further, the memory 51 may also include both the internal storage unit and the external storage device of the terminal device 5. The memory 51 is used to store the computer program and other programs and data required by the terminal device. The memory 51 may also be used to temporarily store the data that has been output or will be output.

[0101] Those skilled in the art can clearly understand that, for the convenience and conciseness of description, only the above-mentioned division of each functional unit and module is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated into a processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above integrated unit can be implemented in the form of hardware or in the form of a software functional unit. In addition, the specific names of each functional unit and module are only for the convenience of mutual distinction and do not limit the protection scope of this application. The specific working process of the units and modules in the above system can refer to the corresponding process in the foregoing method embodiment and will not be elaborated herein.

[0102] In the above embodiments, the descriptions of the various embodiments have their own emphases. For the parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0103] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or by a combination of computer software and electronic hardware. Whether these functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

[0104] In the embodiments provided by the present invention, it should be understood that the disclosed device / terminal device and method can be implemented in other ways. For example, the device / terminal device embodiments described above are merely illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of the devices or units can be in electrical, mechanical or other forms.

[0105] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0106] In addition, each functional unit in the various embodiments of the present invention can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

[0107] If the integrated module / unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, to implement all or part of the processes in the above-mentioned method embodiments of the present invention, it can also be completed by a computer program instructing relevant hardware. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps of the above-mentioned various method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in the form of source code, object code, executable file or some intermediate form, etc. The computer-readable medium can include: any entity or device that can carry the computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disc, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal, and software distribution medium, etc. It should be noted that the content included in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable medium does not include electrical carrier signals and telecommunication signals.

[0108] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for constructing a three-dimensional temperature cloud field of a micro-module, characterized in that, Including: Obtaining temperature information corresponding to at least three temperature monitoring points on the micro-module; the temperature information includes temperature values and position data; each temperature monitoring point is located in a different orientation of the micro-module; Constructing a three-dimensional micro-module model of the micro-module; and converting the position data corresponding to each temperature monitoring point to the three-dimensional coordinate system where the three-dimensional micro-module model is located; Determining the position coordinates of multiple interpolation points in the three-dimensional coordinate system; For any interpolation point: Based on the position coordinates of this interpolation point and the position coordinates of each known data point, select multiple known data points as the first data points corresponding to this interpolation point; Calculate the temperature value of this interpolation point based on the temperature values of each first data point corresponding to this interpolation point and the distances between each first data point and this interpolation point; The known data points include temperature monitoring points and / or interpolation points for which the temperature values have been calculated; Render the three-dimensional micro-module model according to the temperature values corresponding to each position coordinate on the three-dimensional micro-module model to obtain the three-dimensional temperature cloud field of the micro-module; The selecting multiple known data points as the first data points corresponding to this interpolation point based on the position coordinates of this interpolation point and the position coordinates of each known data point includes: Step 1: Based on the position coordinates of this interpolation point and the position coordinates of each known data point, calculate the distances between this interpolation point and each known data point; Use the known data points whose distances from this interpolation point are greater than a preset distance threshold as the second data points corresponding to this interpolation point; Step 2: Use the second data point closest to this interpolation point as the first data point corresponding to this interpolation point; Step 3: Output the current first data point corresponding to this interpolation point; Step 4: Calculate the target angle ∠A between the current first data point and the second data point corresponding to the interpolation point o XA k , where X represents the interpolation point; A o represents the current first data point of the interpolation point X; A k represents the second data point corresponding to the interpolation point X other than the current first data point; Step 5: Starting from the current first data point, select the first second data point that satisfies the preset angle condition corresponding to this interpolation point in the preset rotation direction to replace the current first data point, and repeat Step 3 to Step 5 until M first data points corresponding to this interpolation point are obtained; The preset angle condition is that the target angle is greater than the preset angle threshold.

2. The method for constructing the three-dimensional temperature cloud field of the micro-module according to claim 1, wherein The calculating the temperature value of this interpolation point based on the temperature values of each first data point corresponding to this interpolation point and the distances between each first data point and this interpolation point includes: Based on the formula Obtain the temperature value of the interpolation point j; where, t i represents the temperature value of the known data point i, d ij represents the distance between the known data point i and the interpolation point j, T j represents the temperature value of the interpolation point j.

3. The method for constructing the three-dimensional temperature cloud field of the micro-module according to claim 1, wherein, The determining the position coordinates of multiple interpolation points in the three-dimensional coordinate system includes: According to a preset unit step size and the coordinate range of the three-dimensional micro-module model in the three-dimensional coordinate system, determine the position coordinates of multiple interpolation points in the three-dimensional coordinate system.

4. The method for constructing the three-dimensional temperature cloud field of the micro-module according to claim 1, wherein The determining the position coordinates of multiple interpolation points in the three-dimensional coordinate system includes: Obtaining the size information of the micro-module; Obtaining the actual distance between a first interpolation point and the landmark point of the micro-module; the first interpolation point is any interpolation point; Based on the position coordinates of the landmark point of the micro-module, the actual distance between the first interpolation point and the landmark point of the micro-module, and the scale relationship between the micro-module and the three-dimensional micro-module model, determine the position coordinates of the first interpolation point.

5. The method for constructing a three-dimensional temperature cloud field of the micro-module according to claim 1, characterized in that The actual power at the selected positions of each temperature monitoring point is greater than the preset power threshold.

6. A device for constructing a three-dimensional temperature cloud field of a micro-module, characterized in that, Including: A temperature information acquisition module, configured to acquire temperature information corresponding to at least three temperature monitoring points on the micro-module; the temperature information includes a temperature value and position data; each temperature monitoring point is located at a different azimuth of the micro-module; A model construction module, configured to construct a three-dimensional micro-module model of the micro-module; and convert the position data corresponding to each temperature monitoring point to the three-dimensional coordinate system where the three-dimensional micro-module model is located; An interpolation point coordinate determination module, configured to determine the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system; A temperature value calculation module, for any interpolation point: based on the position coordinates of the interpolation point and the position coordinates of each known data point, select a plurality of known data points as the first data points corresponding to the interpolation point; based on the temperature values of each first data point corresponding to the interpolation point and the distances between each first data point and the interpolation point, calculate the temperature value of the interpolation point; the known data points include temperature monitoring points and / or interpolation points for which the temperature values have been calculated; A temperature cloud field construction module, configured to render the three-dimensional micro-module model according to the temperature values corresponding to each position coordinate on the three-dimensional micro-module model to obtain a three-dimensional temperature cloud field of the micro-module; The temperature value calculation module includes: Step 1: Based on the position coordinates of the interpolation point and the position coordinates of each known data point, calculate the distances between the interpolation point and each known data point; use the known data points whose distances from the interpolation point are greater than a preset distance threshold as the second data points corresponding to the interpolation point; Step 2: Use the second data point closest to the interpolation point as the first data point corresponding to the interpolation point; Step 3: Output the current first data point corresponding to the interpolation point; Step 4: Calculate the target angle ∠A between the current first data point and the second data point corresponding to the interpolation point o XA k , where X represents the interpolation point; A o represents the current first data point of the interpolation point X; A k represents the second data point corresponding to the interpolation point X other than the current first data point; Step 5: Starting from the current first data point, select the first second data point that satisfies the preset angle condition corresponding to the interpolation point in the preset rotation direction to replace the current first data point, and repeat steps 3 to 5 until M first data points of the interpolation point are obtained; the preset angle condition is that the target angle is greater than the preset angle threshold.

7. A terminal device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 5.

8. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it implements the steps of the method according to any one of claims 1 to 5.

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