Method for manufacturing display panel and method for manufacturing spliced ​​display screen

Abstract

The present application relates to a method for manufacturing a spliced ​​display screen and a display panel, comprising: providing a first substrate, the first substrate comprising a first surface, a second surface and a side surface, the first surface and the second surface being opposite to each other, and the side surface connecting the first surface and the second surface; setting a first circuit on the first surface, setting a second circuit on the second surface, and opening a groove penetrating the first surface and the second surface on the side surface; providing a second substrate and a third substrate, the second substrate being arranged on one side of the first surface, the third substrate being arranged on one side of the second surface, the first substrate, the second substrate and the third substrate enclosing a concave hole including the groove; and making a connecting circuit connecting the first circuit and the second circuit in the concave hole. Through the above arrangement, the adhesion of the connecting circuit to the first substrate can be increased, and at the same time, the groove has a protective effect on the connecting circuit, which can reduce the probability of disconnection of the connecting circuit and increase the reliability of the display panel.

Description

Technical Field

[0001] The present application relates to the technical field of display panel manufacturing, and in particular to a method for manufacturing a display panel and a method for manufacturing a spliced ​​display screen. Background Art

[0002] One of the major application prospects of Micro-LED (Micro-light-emitting diode) display technology is unlimited splicing without size restrictions. In order to achieve seamless splicing between display units, it is necessary to consider how to connect the wiring on the front and back surfaces of the substrate. The commonly used solutions in the industry are punching holes in the substrate for connection, connecting the sides of the substrate, and bending the front back panel binding area. Among them, the punching solution does not conform to the high-resolution development trend because it will occupy the line area, and the bending process of the back panel binding area is difficult to implement. The side of the substrate is the mainstream direction.

[0003] There are currently the following difficulties in connecting the side of the substrate. First, the connection material has poor adhesion to the side. Second, the side connection is broken, resulting in failure of the connection between the front and back sides of the substrate.

[0004] Therefore, how to avoid failure of circuit connections on the front and back sides of the substrate is an urgent problem to be solved. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a method for manufacturing a display panel and a method for manufacturing a spliced ​​display screen, aiming to solve the problem of how to avoid failure of circuit connections on the front and back sides of a substrate.

[0006] A method for manufacturing a display panel, comprising:

[0007] A first substrate is provided, wherein the first substrate comprises a first surface, a second surface and a side surface, wherein the first surface and the second surface are opposite to each other, and the side surface connects the first surface and the second surface; a first circuit is arranged on the first surface, a second circuit is arranged on the second surface, and a groove penetrating the first surface and the second surface is arranged on the side surface;

[0008] Providing a second substrate and a third substrate, wherein the second substrate is disposed on one side of the first surface, and the third substrate is disposed on one side of the second surface, and the first substrate, the second substrate and the third substrate enclose a concave hole including the groove;

[0009] A connection circuit connecting the first circuit and the second circuit is formed in the cavity.

[0010] A recess is formed by opening a groove in the first substrate, and a second substrate and a third substrate are arranged on both sides of the first substrate to form a recess. The recess is blocked by the second substrate and the third substrate near the opening of the first surface and the second surface of the first substrate. When a connecting line is made in the recess, the second substrate and the third substrate have a limiting and blocking effect on the connecting line, so that the connecting line is confined in the recess and is not formed on the side of the first substrate. Since the connecting line is formed in the recess, it has a larger molding area than forming the connecting line on the side of the first substrate, which can increase the adhesion of the connecting line to the first substrate. At the same time, the groove has a protective effect on the connecting line, which can reduce the probability of disconnection of the connecting line and increase the reliability of the display panel.

[0011] Optionally, when the groove is provided, the first circuit and the second circuit are both connected to the inner wall of the groove. With such a configuration, the connection circuit can be connected to the first circuit and the second circuit at the opening of the groove on the first surface and the second surface, and the connection between the connection circuit and the first circuit and the second circuit can be realized without the need to set up complex connection circuits or routing of the first circuit and the second circuit on the first surface or the second surface. The structure is simple and easy to implement.

[0012] Optionally, when the groove is formed, the width of the groove is made greater than the width of the first circuit and the second circuit. This arrangement can reduce the accuracy requirements for the position correspondence between the groove and the first circuit and the second circuit, and a slight deviation of the position of any one of the groove, the first circuit or the second circuit will not affect the final product quality, thereby reducing the process difficulty.

[0013] Optionally, the first circuit and the second circuit are both provided in multiple numbers and are arranged at equal intervals, and the grooves are provided in multiple numbers and are arranged at equal intervals. In this way, multiple first circuits and second circuits can be provided on a first substrate, which facilitates the subsequent electrical connection of a large number of pixels, increases the number and density of pixels of the display panel, and improves the resolution.

[0014] Optionally, making a connection line connecting the first line and the second line in the concave hole includes: filling the concave hole with a conductive material, the conductive material filling the groove and extending to connect with the first line and the second line. By filling the concave hole with a conductive material, and making the conductive material fill the groove and extend to connect with the first line and the second line, due to the limitation of the inner wall of the groove and the blocking of the conductive material by the second substrate and the third substrate, the conductive material can eventually fill the concave hole, thereby realizing the production of the connection line, and the process is simple.

[0015] Optionally, it also includes: an overflow hole is opened in the second substrate or the third substrate, and the overflow hole is connected to the cavity, so that the conductive material filled in the cavity can overflow from the overflow hole, which is convenient for detecting and judging whether the cavity is filled with the conductive material.

[0016] Optionally, the method further includes: removing excess conductive material so that the conductive material forms a connection line with a preset thickness attached to the inner wall of the concave hole. By removing excess conductive material to form a thinner connection line, the impedance of the connection line can be reduced and the efficiency of signal transmission can be improved.

[0017] Optionally, the method further includes: forming a protective layer on the connecting line, which can provide good protection for the connecting line and prevent the connecting line from being exposed and oxidized.

[0018] Optionally, the method further includes: peeling off the second substrate and the third substrate.

[0019] Based on the same inventive concept, the present application also provides a method for manufacturing a spliced ​​display screen, including: providing a first display panel and a second display panel, wherein the first display panel and the second display panel are both manufactured using the display panel manufacturing method described in any one of the aforementioned embodiments; splicing the first substrate of the first display panel and the first substrate of the second display panel.

[0020] Since the connecting circuit is arranged in the groove instead of being located on the side of the first substrate, the connecting circuit will not be bumped during splicing, which can ensure that the connecting circuit is not affected by external forces during splicing. Combined with the technical effects of the aforementioned display panel manufacturing method, the adhesion of the connecting circuit to the first substrate can be increased. At the same time, the groove has a protective effect on the connecting circuit, which can reduce the probability of disconnection of the connecting circuit, increase the reliability of the display panel, and further increase the reliability of the spliced ​​display screen.

[0021] Optionally, splicing the first display panel and the second display panel comprises: arranging the side of the first display panel with the groove and the side of the second display panel with the groove opposite to each other, and staggering the grooves of the first display panel and the second display panel, and inserting the first display panel and the second display panel into the corresponding grooves of each other for splicing. Inserting the first display panel and the second display panel into each other's grooves can further reduce the gap between the two display panels and reduce the size of the splicing seam, so that the spliced ​​display screen has a better overall display effect.

[0022] Optionally, it further includes: arranging a plurality of pixels on the first display panel and the second display panel, each of the pixels includes a plurality of sub-pixels, wherein the grooves of the first display panel and the second display panel each occupy at least one sub-pixel; splicing the first display panel and the second display panel, wherein the sub-pixels at the edge of the first display panel and the sub-pixels at the edge of the second display panel together form one pixel. Such an arrangement can further reduce the sense of pixel fragmentation at the splicing seam and optimize the visual effect at the splicing seam. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The present invention is a flow chart of a method for manufacturing a display panel according to an embodiment.

[0024] Figure 2a The present invention is a structural front view of a step of a method for manufacturing a display panel according to an embodiment.

[0025] Figure 2b for Figure 2a Cross-sectional view along the AA direction.

[0026] Figure 3a The present invention is a structural front view of a step of a method for manufacturing a display panel according to an embodiment.

[0027] Figure 3b for Figure 3a Cross-sectional view along direction BB.

[0028] Figure 4a The present invention is a structural front view of a step of a method for manufacturing a display panel according to an embodiment.

[0029] Figure 4b for Figure 4a Cross-sectional view along CC direction.

[0030] Figure 5a The present invention is a structural front view of a step of a method for manufacturing a display panel according to an embodiment.

[0031] Figure 5b for Figure 5a Cross-sectional view along DD direction.

[0032] Figure 6a The present invention is a structural front view of a step of a method for manufacturing a display panel according to an embodiment.

[0033] Figure 6b for Figure 6a Cross-sectional view along EE direction.

[0034] Figure 7a The present invention is a structural front view of a step of a method for manufacturing a display panel according to an embodiment.

[0035] Figure 7b for Figure 7a Cross-sectional view along the FF direction.

[0036] Figure 8a The present invention is a structural front view of a step of a method for manufacturing a display panel according to an embodiment.

[0037] Figure 8b for Figure 8a Cross-sectional view along the GG direction.

[0038] Fig. 9 The present invention is a structural schematic diagram of a step of a method for manufacturing a spliced ​​display screen according to an embodiment.

[0039] Fig.10 A schematic diagram of a step of a method for manufacturing a spliced ​​display screen according to an embodiment.

[0040] Description of reference numerals:

[0041] 10-first substrate, 101-first surface, 102-second surface, 103-side surface, 11-first circuit, 12-second circuit, 13-groove, 14-hole;

[0042] 20-second substrate, 21-overflow hole;

[0043] 30- a third substrate;

[0044] 40-Connection line;

[0045] 50-protective layer;

[0046] 100 - a first display panel, 100 ′ - a second display panel. DETAILED DESCRIPTION

[0047] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0049] One of the major application prospects of Micro-LED (Micro-light-emitting diode) display technology is unlimited splicing without size restrictions. In order to achieve seamless splicing between display units, it is necessary to consider how to connect the wiring on the front and back surfaces of the substrate. The commonly used solutions in the industry are punching holes in the substrate for connection, connecting the sides of the substrate, and bending the front back panel binding area. Among them, the punching solution does not conform to the high-resolution development trend because it will occupy the line area, and the bending process of the back panel binding area is difficult to implement. The side of the substrate is the mainstream direction.

[0050] There are currently the following difficulties in connecting the side of the substrate. First, the connection material has poor adhesion to the side. Second, the side connection is broken, resulting in failure of the connection between the front and back sides of the substrate.

[0051] Therefore, how to avoid failure of circuit connections on the front and back sides of the substrate is an urgent problem to be solved.

[0052] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0053] Please refer to Figure 1 , the embodiment of the present application provides a method for manufacturing a display panel, comprising steps S10-S30:

[0054] Combination Figure 1 , Figures 2a to 3b Step S10: Provide a first substrate 10, the first substrate 10 includes a first surface 101, a second surface 102 and a side surface 103, the first surface 101 and the second surface 102 are opposite to each other, and the side surface 103 connects the first surface 101 and the second surface 102; set a first circuit 11 on the first surface 101, set a second circuit 12 on the second surface 102, and open a groove 13 on the side surface 103 that runs through the first surface 101 and the second surface 102.

[0055] Specifically, the first substrate 10 may be a glass substrate, a silicon substrate, etc., and the first surface 101, the second surface 102 and the side surface 103 may all be planes, or any of the surfaces may be curved surfaces instead of planes. The first surface 101 and the second surface 102 may be rectangular. There is no limitation on the first circuit 11 and the second circuit 12. For example, the first circuit 11 may be a data line, and the second circuit 12 may be a scan line, etc. The orthographic projections of the first circuit 11 and the second circuit 12 on the first surface 101 may overlap or may be staggered. The shape of the groove 13 is also not limited. For example, the orthographic projection of the groove 13 on the surface where the first surface 101 is located may be a rectangle, or other shapes such as a rounded rectangle. The process for forming the groove 13 is also not limited, for example, etching, laser cutting, etc. may be used.

[0056] The groove 13 penetrates the first surface 101 and the second surface 102, so that the groove 13 has openings in three directions, namely, openings at the first surface 101, the second surface 102 and the side surface 103. The groove 13 is used to set the connection line 40 connecting the first line 11 and the second line 12, and the openings at the first surface 101 and the second surface 102 are used to allow the connection line 40 to be connected to the first line 11 and the second line 12.

[0057] Optional, such as Figures 2a to 3b As shown, when the groove 13 is opened, the first circuit 11 and the second circuit 12 are both connected to the inner wall of the groove 13 .

[0058] Specifically, Figure 3a As shown, the first circuit 11 extends to the inner wall of the groove 13, which is the inner wall opposite to the opening of the groove 13 on the side 103 of the first substrate 10. In this way, the connection circuit 40 can be connected to the first circuit 11 and the second circuit 12 at the opening of the groove 13 on the first surface 101 and the second surface 102, and there is no need to set up a complicated connection circuit 40 or the routing of the first circuit 11 and the second circuit 12 on the first surface 101 or the second surface 102, and the connection between the connection circuit 40 and the first circuit 11 and the second circuit 12 can be achieved, which has a simple structure and is easy to implement.

[0059] Alternatively, the first circuit 11 and the second circuit 12 may also be spaced a little apart from the inner wall of the groove 13 .

[0060] Optional, such as Figures 2a to 3b As shown, when the groove 13 is formed, the width W2 of the groove 13 is greater than the width W1 of the first circuit 11 and the second circuit 12 .

[0061] Specifically, the first circuit 11 and the second circuit 12 extend in substantially the same direction and may be substantially straight lines, with their ends close to the groove 13. The width here refers to the dimension in a direction perpendicular to the first circuit 11 or the second circuit 12. For the groove 13, the width is the spacing between two opposite side walls of the groove 13 on the first substrate 10. The widths of the first circuit 11 and the second circuit 12 may be the same or different, and the width of the groove 13 may be greater than the wider width of the first circuit 11 or the second circuit 12.

[0062] Such an arrangement can reduce the accuracy requirements for the position correspondence of the groove 13 relative to the first circuit 11 and the second circuit 12. A slight deviation of the position of any one of the groove 13, the first circuit 11 or the second circuit 12 will not affect the final product quality, thereby reducing the process difficulty.

[0063] Optional, such as Figures 2a to 3bAs shown, a plurality of first lines 11 and a plurality of second lines 12 are provided and are arranged at equal intervals, a plurality of grooves 13 are provided and the plurality of grooves 13 are arranged at equal intervals.

[0064] With such an arrangement, a plurality of first circuits 11 and second circuits 12 can be arranged on a first substrate 10, which facilitates the subsequent electrical connection of a large number of pixels, increases the number and density of pixels of the display panel, and improves the resolution.

[0065] It is understandable that the first substrate 10 may be a display backplane provided with a driving array, and the driving array may be connected to the first circuit 11 and / or the second circuit 12. The driving array may include a plurality of crisscrossing circuits, which are not specifically shown.

[0066] It can be understood that the first substrate 10 can also be a display backplane provided with a driving array and a plurality of pixel units. The driving array is connected to the first circuit 11 and / or the second circuit 12 on one hand, and is also connected to the plurality of pixel units on the other hand.

[0067] Combination Figure 1 , Figure 4a to Figure 4b Step S20: providing a second substrate 20 and a third substrate 30 , wherein the second substrate 20 is disposed on one side of the first surface 101 , and the third substrate 30 is disposed on one side of the second surface 102 . The first substrate 10 , the second substrate 20 , and the third substrate 30 enclose a cavity 14 including a groove 13 .

[0068] Specifically, the second substrate 20 and the third substrate 30 may also be glass substrates or silicon substrates, and the second substrate 20 and the third substrate 30 may be the same as the first substrate 10 in shape, structure, size, etc. The second substrate 20 and the third substrate 30 are complete plates without the groove 13 of the first substrate 10. Each side of the second substrate 20 and the third substrate 30 may be flush with the first substrate 10. The second substrate 20 and the third substrate 30 may be bonded to the first substrate 10 by glue (not shown in the figure), and the glue may be photolytic glue, thermal glue, etc. The second substrate 20 may be connected to the first circuit 11, and the third substrate 30 may be connected to the second circuit 12. The dimension of the first circuit 11 and the second circuit 12 in a direction perpendicular to the first surface 101 is their thickness. The thickness of the first circuit 11 and the second circuit 12 is relatively thin. After the second substrate 20 and the third substrate 30 are arranged, the structure is that the second substrate 20 covers the first circuit 11, and the third substrate 30 covers the second circuit 12. From the appearance, it is roughly equivalent to the second substrate 20 being arranged on the first surface 101 and the third substrate 30 being arranged on the second surface 102. As mentioned above, the groove 13 has three openings. By setting the second substrate 20 and the third substrate 30, a barrier can be formed near the opening of the groove 13 on the first surface 101 and the opening of the second surface 102. The formed cavity 14 includes the space of the groove 13, that is, the thickness of the first substrate 10, and the space between the first substrate 10 and the second substrate 20, that is, the thickness of the first circuit 11, and the space between the first substrate 10 and the third substrate 30, that is, the thickness of the second circuit 12. When the connecting circuit 40 is subsequently manufactured, the second substrate 20 and the third substrate 30 will limit and block the connecting circuit 40, so as to facilitate the molding of the connecting circuit 40.

[0069] Combination Figure 1 , Figures 5a to 6b , step S30 : making a connecting line 40 connecting the first line 11 and the second line 12 in the cavity 14 .

[0070] Specifically, the process for making the connecting line 40 is not limited, and some embodiments will be provided later in this application.

[0071] In the present application, a groove 13 is opened on a first substrate 10, and a second substrate 20 and a third substrate 30 are arranged on both sides of the first substrate 10 to form a concave hole 14. The second substrate 20 and the third substrate 30 form a barrier for the groove 13 near the opening of the first surface 101 and the second surface 102 of the first substrate 10. When the connecting line 40 is made in the concave hole 14, the second substrate 20 and the third substrate 30 have a limiting and blocking effect on the connecting line 40, so that the connecting line 40 is confined in the concave hole 14 and is not formed on the side 103 of the first substrate 10. Since the connecting line 40 is formed in the concave hole 14, compared with forming the connecting line 40 on the side 103 of the first substrate 10, the connecting line 40 has a larger molding area, which can increase the adhesion of the connecting line 40 to the first substrate 10. At the same time, the groove 13 has a protective effect on the connecting line 40, which can reduce the probability of disconnection of the connecting line 40 and increase the reliability of the display panel.

[0072] In one embodiment, please refer to Figures 4a to 5b , making a connecting line 40 connecting the first line 11 and the second line 12 in the cavity 14 , including: filling the cavity 14 with a conductive material, the conductive material fills the groove 13 and extends to connect with the first line 11 and the second line 12 .

[0073] Specifically, the conductive material may be silver paste. Silver paste has fluidity. When the silver paste is filled in the cavity 14, the silver paste may first fill the groove 13, and continue to flow to the opening of the groove 13 on the first surface 101, that is, between the first substrate 10 and the second substrate 20 and connected to the first circuit 11, and flow to the opening of the groove 13 on the second surface 102, and between the first substrate 10 and the third substrate 30 and connected to the second circuit 12. Due to the obstruction of the second substrate 20 and the third substrate 30, the silver paste may eventually fill the cavity 14. Afterwards, the silver paste is solidified to form a connecting circuit 40. The connecting circuit 40 is located in the cavity 14. As shown in FIG. Figure 5a and Figure 5b As shown, due to the thin thickness of the first electrode and the second electrode, when the silver paste flows to between the first substrate 10 and the second substrate 20 and is offset from the opening of the groove 13 on the first surface 101, it is difficult for the silver paste to continue to flow to the narrow space between the first substrate 10 and the second substrate 20. The same is true for the silver paste between the first substrate 10 and the third substrate 30, so that the connecting circuit 40 only connects the first circuit 11 and the second circuit 12 on the two side surfaces of the first substrate 10, and does not connect the two first circuits 11 or second circuits 12 on the same surface.

[0074] In this embodiment, the conductive material is filled in the cavity 14, and the conductive material fills the groove 13 and extends to connect with the first circuit 11 and the second circuit 12. Due to the limitation of the inner wall of the groove 13 and the blocking of the conductive material by the second substrate 20 and the third substrate 30, the conductive material can eventually fill the cavity 14, thereby realizing the production of the connecting circuit 40, and the process is simple.

[0075] It should be understood that two adjacent first lines 11 on the first surface 101 and two adjacent second lines 12 on the second surface should be spaced apart. If the silver paste connects two adjacent first lines 11 or second lines 12, the silver paste connecting the two first lines 11 or second lines 12 can be cut off and separated by subsequent etching and other processes.

[0076] In one embodiment, please refer to Figures 4a to 5b The manufacturing method of the display panel further includes: opening an overflow hole 21 on the second substrate 20 or the third substrate 30 , and the overflow hole 21 is connected to the concave hole 14 .

[0077] like Figure 4a The embodiment of the invention shows that an overflow hole 21 is provided in the second substrate 20, and the overflow hole 21 passes through two opposite surfaces of the second substrate 20. The overflow hole 21 is connected with the cavity 14, so that the conductive material filled in the cavity 14 can overflow from the overflow hole 21, which is convenient for detecting and judging whether the cavity 14 is filled with the conductive material.

[0078] In one embodiment, please refer to Figures 5a to 6b The method for manufacturing the display panel further includes: removing excess conductive material so that the conductive material forms a connection line 40 with a preset thickness attached to the inner wall of the cavity 14 .

[0079] Specifically, the excess conductive material can be removed by methods such as plasma etching, and the removal operation can be started from the opening of the groove 13 on the side 103 of the first substrate 10, and the remaining conductive material is attached to the inner wall of the groove 13 and at least partially connected to the first circuit 11 and the second circuit 12 to form the connecting circuit 40. Optionally, the conductive material can be removed at the opposite side walls of the groove 13, and the conductive material is retained at the side wall opposite to the opening of the groove 13 on the side 103 of the first substrate 10. The preset thickness of the connecting circuit 40 can be 2μm-10μm, further can be 4μm-6μm, preferably 5μm. Optionally, the thickness of the connecting circuit 40 can be roughly the same as the thickness of the first circuit 11 and the second circuit 12.

[0080] By removing excess conductive material to form a thinner connection line 40 , the impedance of the connection line 40 can be reduced and the efficiency of signal transmission can be improved.

[0081] In one embodiment, please refer to Figures 6a to 7b The method for manufacturing the display panel further includes: forming a protective layer 50 on the connecting line 40 .

[0082] Specifically, the protective layer 50 may be ink, which may be formed on the connection line 40 by spraying, and may be formed on the inner wall of the groove 13, and the area between the first substrate 10 and the second substrate 20 and the third substrate 30, so as to completely cover the connection line 40. The protective layer 50 may completely fill the concave hole 14, or may be sprayed with a thinner layer without filling the concave hole 14, and the thickness of the thinner protective layer 50 may be about 10 μm, for example. The protective layer 50 may be formed on the three side walls of the groove 13, and one of the side walls may completely cover the connection line 40 in the groove 13 because it has the connection line 40, so as to prevent the connection line 40 from being exposed through the opening of the groove 13. The protective layer 50 in the area between the first substrate 10 and the second substrate 20 and the third substrate 30 may also have a good protective effect on the connection line 40, so as to prevent the connection line 40 from being exposed and oxidized.

[0083] In one embodiment, please refer to Figures 7a to 8b The method for manufacturing the display panel further includes: peeling off the second substrate 20 and the third substrate 30 .

[0084] Specifically, after forming the connection circuit 40, the second substrate 20 and the third substrate 30 are peeled off to form a display panel, which includes: a first substrate 10, a first circuit 11 formed on a first surface 101 of the first substrate 10, a second circuit 12 formed on a second surface 102 of the first substrate 10, and a structure of a connection circuit 40 located in a groove 13 of the first substrate 10 and connecting the first circuit 11 and the second circuit 12, forming an intermediate product that can be used in subsequent processes. The method of peeling off the second substrate 20 and the third substrate 30 can be by irradiation with special light or heating, etc., the photodissolved glue is irradiated with special light to release the viscosity, and the thermal dissolved glue is heated to release the viscosity, so as to realize the peeling of the substrate.

[0085] In one embodiment, please refer to Fig. 9 , and combined with Figures 1 to 8b The present application also provides a method for manufacturing a spliced ​​display screen, including:

[0086] A first display panel 100 and a second display panel 100' are provided. The first display panel 100 and the second display panel 100' are both manufactured by the display panel manufacturing method of any of the aforementioned embodiments. Then, the first substrate 10 of the first display panel 100 and the first substrate 10 of the second display panel 100' are spliced.

[0087] In this embodiment, when the first display panel 100 and the second display panel 100' are spliced, the connection lines 40 of the two display panels are opposite, that is, the side of the first substrate 10 of the first display panel 100 having the groove 13 is spliced ​​opposite to the side of the first substrate 10 of the second display panel 100' having the groove 13. In this embodiment, the first display panel 100 and the second display panel 100' can be liquid crystal display panels, OLED display panels, Micro-LED display panels, etc.

[0088] Since the connecting circuit 40 is arranged in the groove 13 instead of being located on the side 103 of the first substrate 10, the connecting circuit 40 will not be bumped during splicing, which can ensure that the connecting circuit 40 is not affected by external forces during splicing. Combined with the technical effect of the aforementioned display panel manufacturing method, the adhesion between the connecting circuit 40 and the first substrate 10 can be increased. At the same time, the groove 13 has a protective effect on the connecting circuit 40, which can reduce the probability of disconnection of the connecting circuit 40, increase the reliability of the display panel, and further increase the reliability of the spliced ​​display screen.

[0089] In one embodiment, please refer to Fig. 9 , and combined with Figures 2a to 8b , splicing the first display panel 100 and the second display panel 100', including: arranging the side 103 of the first display panel 100 with the groove 13 and the side 103 of the second display panel 100' with the groove 13 opposite to each other, and making the grooves 13 of the first display panel 100 and the second display panel 100' alternately arranged, and extending the first display panel 100 and the second display panel 100' into the corresponding grooves 13 of each other for splicing.

[0090] By extending the first display panel 100 and the second display panel 100 ′ into each other's groove 13 , the gap between the two display panels can be further reduced, and the size of the joint seam can be reduced, so that the jointed display screen has a better overall display effect.

[0091] In one embodiment, please refer to Fig.10 The method for manufacturing a spliced ​​display screen also includes: setting a plurality of pixels on the first display panel 100 and the second display panel 100', each pixel including a plurality of sub-pixels, wherein the grooves 13 of the first display panel 100 and the second display panel 100' each occupy at least one sub-pixel; splicing the first display panel 100 and the second display panel 100', wherein the sub-pixels at the edge of the first display panel 100 and the sub-pixels at the edge of the second display panel 100' together constitute one pixel.

[0092] Specifically, Fig.10As shown, the first display panel 100 and the second display panel 100' each have a plurality of red sub-pixels R, green sub-pixels G and blue sub-pixels B, and are arranged in multiple rows and columns. The red sub-pixels R, green sub-pixels G and blue sub-pixels B arranged in columns constitute a pixel, and a space for a sub-pixel is vacated at the groove 13 of one of the display panels, and the vacated sub-pixels of the first display panel 100 and the second display panel 100' are complementary. After the first display panel 100 and the second display panel 100' are spliced ​​together, the first display panel 100 and the second display panel 100' extend into each other's groove 13, so that at the position of the column where the groove 13 is opened, the two display panels are spliced ​​into a complete pixel. Such a setting can further reduce the sense of pixel segmentation at the splicing seam and optimize the visual effect at the splicing seam.

[0093] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A method for manufacturing a display panel, characterized in that: include: A first substrate is provided, wherein the first substrate comprises a first surface, a second surface and a side surface, wherein the first surface and the second surface are opposite to each other, and the side surface connects the first surface and the second surface; a first circuit is arranged on the first surface, a second circuit is arranged on the second surface, and a groove penetrating the first surface and the second surface is arranged on the side surface; Providing a second substrate and a third substrate, wherein the second substrate is disposed on one side of the first surface, and the third substrate is disposed on one side of the second surface, and the first substrate, the second substrate and the third substrate enclose a concave hole including the groove; A connection circuit connecting the first circuit and the second circuit is formed in the cavity.

2. The method for manufacturing a display panel according to claim 1, wherein: When the groove is opened, the first circuit and the second circuit are both connected to the inner wall of the groove.

3. The method for manufacturing a display panel according to claim 2, wherein: When the groove is formed, the width of the groove is made greater than the widths of the first circuit and the second circuit.

4. The method for manufacturing a display panel according to claim 1, wherein: The first circuit and the second circuit are both arranged in plurality and are arranged at equal intervals, and the grooves are provided in plurality and are arranged at equal intervals.

5. The method for manufacturing a display panel according to any one of claims 1 to 4, characterized in that: Producing a connection line connecting the first line and the second line in the concave hole, comprising: The cavity is filled with a conductive material, the conductive material fills up the groove and extends to connect with the first circuit and the second circuit.

6. The method for manufacturing a display panel according to claim 5, wherein: Also includes: An overflow hole is opened on the second substrate or the third substrate, and the overflow hole is communicated with the concave hole.

7. The method for manufacturing a display panel according to claim 5, wherein: Also includes: The excess conductive material is removed so that the conductive material forms a connection line with a preset thickness attached to the inner wall of the cavity.

8. The method for manufacturing a display panel according to claim 7, wherein: Also includes: A protection layer is formed on the connecting line.

9. The method for manufacturing a display panel according to any one of claims 1 to 4, characterized in that: Also includes: The second substrate and the third substrate are peeled off.

10. A method for manufacturing a spliced ​​display screen, characterized in that: include: Providing a first display panel and a second display panel, wherein the first display panel and the second display panel are both manufactured by the method for manufacturing a display panel according to any one of claims 1 to 9; The first substrate of the first display panel and the first substrate of the second display panel are spliced ​​together.

11. The method for manufacturing a spliced ​​display screen according to claim 10, characterized in that: Splicing the first display panel and the second display panel, comprising: The side of the first display panel with the groove is opposite to the side of the second display panel with the groove, and the grooves of the first display panel and the second display panel are arranged alternately, and the first display panel and the second display panel are inserted into the corresponding grooves of each other for splicing.

12. The method for manufacturing a spliced ​​display screen according to claim 11, characterized in that: Also includes: Arranging a plurality of pixels on the first display panel and the second display panel, each of the pixels comprising a plurality of sub-pixels, wherein the grooves of the first display panel and the second display panel each occupy a position of at least one sub-pixel; The first display panel and the second display panel are spliced ​​together, and the sub-pixels at the edge of the first display panel and the sub-pixels at the edge of the second display panel together form one pixel.

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