Display panel, manufacturing method thereof, and display device

Abstract

The present invention relates to a display panel, a method for manufacturing the same, and a display device. The display panel includes a substrate, a plurality of bonding areas arranged in an array on one side of the substrate, with each bonding area spaced apart from adjacent areas by a predetermined distance; grooves disposed in the spacing between each bonding area and adjacent areas; and a light absorbing layer disposed in the spacing between each bonding area and adjacent areas. In some implementations, the display panel facilitates simultaneously maintaining high contrast and high transmittance, and the light absorbing layer is formed with high precision and high quality.

Description

Technical Field

[0001] The present invention relates to the field of display devices, and in particular to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] Display technology is rapidly developing, with backlighting and direct display being the two main development directions. Numerous packaging solutions exist for direct-display LEDs (light-emitting diodes), but these technologies often struggle to achieve both high contrast and high transmittance. A packaging solution that achieves high transmittance results in a loss of transmittance and brightness, while a solution that achieves high transmittance results in low contrast.

[0003] Therefore, how to make direct display devices have both high contrast and high transmittance is an urgent problem to be solved. Summary of the Invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present application is to provide a display panel and a manufacturing method thereof and a display device, aiming to solve the problem that direct display devices cannot have high contrast and high transmittance at the same time.

[0005] A display panel, comprising:

[0006] substrate;

[0007] A plurality of crystal-bonding regions, wherein the crystal-bonding regions are arranged in an array on one side of the substrate, and each of the crystal-bonding regions is spaced apart from an adjacent one by a preset distance;

[0008] A groove is provided in a spaced area between each of the crystal-fixing regions and an adjacent crystal-fixing region;

[0009] The light absorbing layer is arranged in the interval area between each of the crystal-fixing regions and the adjacent crystal-fixing regions.

[0010] The above-mentioned display panel sets the structure for improving the contrast on the substrate, which will not directly block the light of the light-emitting chip. Therefore, the light absorption effect of the light-absorbing layer can be as good as possible, that is, the degree of blackening can be as high as possible, or even pure black, without worrying about a significant impact on the luminous effect of the final display panel. The grooves set on the substrate make the contact area between the light-absorbing layer and the substrate larger, and in some implementation processes, it can improve the bonding force between the light-absorbing layer and the substrate, and reduce the situation of the light-absorbing layer falling off. The subsequent encapsulation glue layer can be implemented as an encapsulation glue layer with higher transmittance, and the transmittance of the light-emitting chip can also be guaranteed. Therefore, it is beneficial to simultaneously ensure high contrast and high transmittance of the display panel, and good quality.

[0011] Optionally, the substrate further includes a roughened surface, the roughened surface is provided at least on the inner wall surface of the groove, and a portion of the light absorbing layer in the groove contacts the roughened surface.

[0012] It can be understood that the roughened surface has the effect of roughening the surface, increasing the friction between the light-absorbing layer and the substrate, making the light-absorbing layer made of fluid raw materials more concentrated during molding, further improving the precision of the light-absorbing layer during molding, and improving the bonding force between the light-absorbing layer and the substrate. The two have better adhesion and are less likely to peel off. In some implementation processes, the reliability of the final product is also improved.

[0013] Optionally, a preset interval between each of the crystal-bonding regions and an adjacent crystal-bonding region is not less than a width of the crystal-bonding region itself.

[0014] It is understandable that a larger width of the light absorbing layer is beneficial to the precision control of manufacturing the light absorbing layer, and thus helps to avoid the light absorbing layer covering the die-bonding area due to precision issues during manufacturing.

[0015] Optionally, the substrate further includes a plurality of light-emitting chips, and the light-emitting chips are die-bonded in the die-bonding area in groups, with each die-bonding area having a group of the light-emitting chips die-bonded therein;

[0016] The display panel further includes an encapsulation adhesive layer, and the encapsulation adhesive layer covers the light emitting chip and the light absorbing layer.

[0017] Optionally, the packaging adhesive layer includes an atomized layer, and the atomized layer is at least provided on a side of the packaging adhesive layer away from the substrate.

[0018] It is understandable that the atomized layer provided on the encapsulation adhesive layer can reduce ambient light radiation and improve the visual effect of the product in some implementation processes.

[0019] Optionally, the light absorbing layer satisfies at least one of the following conditions in its thickness direction:

[0020] The surface of the light absorbing layer is not lower than the first end of the electrode of the light emitting chip, where the first end is the end of the electrode away from the substrate;

[0021] The surface of the light absorbing layer is no higher than a surface of the light emitting layer of the light emitting chip close to the substrate.

[0022] The light-absorbing layer's surface is higher than the light-emitting chip's electrodes, providing some shielding from the side of the electrodes. This effectively reduces or eliminates light reflection from the electrodes. Positioned below the light-emitting chip's light-emitting layer, the light-absorbing layer doesn't directly block the light emitted by the chip, minimizing brightness loss and ensuring the display panel's brightness.

[0023] Based on the same inventive concept, the present application also provides a method for manufacturing a substrate, comprising:

[0024] Providing a substrate, the substrate comprising a plurality of crystal-bonding regions, wherein the crystal-bonding regions are arranged in an array on one side of the substrate, and each of the crystal-bonding regions is spaced apart from an adjacent one by a predetermined distance;

[0025] forming grooves in the interval areas between each of the crystal-fixing regions and adjacent crystal-fixing regions on the substrate;

[0026] A light absorbing layer is formed in the spaced region.

[0027] The display panel manufactured by the above-mentioned substrate manufacturing method forms a light-absorbing layer structure on the substrate that can improve the display contrast. The light-absorbing layer on the substrate is difficult to block the solid-crystal light-emitting chip, which is conducive to forming a high-contrast and high-transmittance display panel and display device. The light-absorbing layer has high molding precision, which reduces the impact on the solid-crystal area or the light-emitting chip, and also ensures the contrast improvement effect.

[0028] Optionally, forming a light absorbing layer in the spacer region includes:

[0029] A fluid material is arranged in the spacing area, and the fluid material is solidified to form the light absorbing layer; before the fluid material is solidified, a portion of the fluid material enters the groove.

[0030] It can be understood that when a fluid raw material is used to form the light absorbing layer, the space in the groove allows the fluid raw material to flow into the light absorbing layer before solidification, thereby making the distribution of the fluid raw material of the light absorbing layer more concentrated and improving the molding accuracy of the light absorbing layer.

[0031] Optionally, a plurality of light-emitting chips are provided on the substrate, and the light-emitting chips are die-bonded in the die-bonding area in groups, with one group of the light-emitting chips being die-bonded in each die-bonding area;

[0032] After the fluid raw material is solidified to form the light absorbing layer, the method further comprises:

[0033] A packaging adhesive layer is provided on the substrate, and the packaging adhesive layer covers the light-emitting chip and the light-absorbing layer.

[0034] The display panel manufactured by the above-mentioned method for manufacturing a display panel can achieve both high contrast and high brightness in some implementation processes.

[0035] Based on the same inventive concept, the present application also provides a display device comprising a frame, a driver module, and the display panel described above; the display panel is fixed to the frame; and the display panel is connected to the driver module. The display device employs the display panel described above and, in some implementations, can achieve both high contrast and high brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of a substrate structure of a display panel provided by an embodiment of the present invention Figure 1 ;

[0037] Figure 2 A schematic diagram of a substrate structure of a display panel provided by an embodiment of the present invention Figure 2 ;

[0038] Figure 3 A schematic diagram of the packaging structure of the related technology provided by the embodiment of the present invention;

[0039] Figure 4 A schematic diagram of a substrate having a roughened surface in a display panel provided by an embodiment of the present invention Figure 1 ;

[0040] Figure 5 A schematic diagram of a substrate having a roughened surface in a display panel provided by an embodiment of the present invention Figure 2 ;

[0041] Figure 6 Schematic diagram of the structure of the display panel provided by the embodiment of the present invention Figure 1 ;

[0042] Figure 7 Schematic diagram of the structure of the display panel provided by the embodiment of the present invention Figure 2 ;

[0043] Figure 8 A schematic flow chart of a method for manufacturing a display panel according to another optional embodiment of the present invention;

[0044] Figure 9 A schematic structural diagram of a substrate for manufacturing a display panel provided by another optional embodiment of the present invention;

[0045] Figure 10 A schematic diagram of a structure for forming a groove on a substrate provided in another optional embodiment of the present invention Figure 1 ;

[0046] Figure 11 A schematic diagram of a structure for forming a groove on a substrate provided in another optional embodiment of the present invention Figure 2 ;

[0047] Description of reference numerals:

[0048] 1-crystal-solidifying area; 2-groove; 3-light-absorbing layer; 4-light-emitting chip; 5-encapsulation adhesive layer; 6-passivation layer; 10-substrate. DETAILED DESCRIPTION

[0049] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0051] The packaging solutions for direct display devices in related technologies cannot achieve both high contrast and high transmittance.

[0052] Based on this, the present application hopes to provide a solution that can solve the above technical problems, the details of which will be explained in the subsequent embodiments.

[0053] Example:

[0054] This embodiment provides a display panel, which includes a substrate. Figure 1 The substrate comprises: a plurality of solid crystal regions 1, the solid crystal regions 1 are arranged in an array on one side of the substrate, and each solid crystal region 1 is spaced apart from the adjacent solid crystal regions 1 by a preset interval;

[0055] The groove 2 is provided in the interval area between each crystal-bonding area 1 and the adjacent crystal-bonding area 1;

[0056] The light absorbing layer 3 is provided in the spaced area between each crystal-bonding region 1 and the adjacent crystal-bonding region 1 .

[0057] The substrate may include, but is not limited to, a glass substrate, a flexible PI (Polyimide) substrate, or any other substrate. The substrate of this embodiment can serve as a substrate for a light-emitting backplane or light-emitting panel. The array of die-bonding regions thereon can be used to bond light-emitting chips to the substrate. For example, the die-bonding regions may include a conductive layer. When the light-emitting chip is bonded to the die-bonding regions, the conductive layer is electrically connected to the electrodes of the light-emitting chip.

[0058] The groove can be of any shape. Figure 1 The example groove has a rectangular cross section, see Figure 2As shown, a groove 2 with a triangular cross-section is also exemplified, and other shapes such as arcs and trapezoids are not exemplified here. In practical applications, the groove can be formed on the substrate by methods including but not limited to etching, mechanical cutting, etc., and the specifications such as the groove depth, groove width, and the number of grooves between the two solid crystal areas can be set according to actual needs. The setting of the groove makes the contact area between the light absorbing layer and the substrate larger, and the contact between the light absorbing layer and the substrate is not limited to one plane, but forms contacts of multiple different planes. Therefore, in some implementation processes, the bonding force between the light absorbing layer and the substrate can be improved, and the light absorbing layer can be reduced from falling off.

[0059] In order to facilitate understanding of the effects that can be produced by the display panel of this embodiment, the following describes a packaging solution for the display panel in a direct display device in the related art. Figure 3 The display panel in this example includes a substrate 10, a light-emitting chip 4, and an encapsulation layer 5. The substrate 10 is a common substrate, on which a die-bonding area for arranging the light-emitting chip 4 is provided. The light-emitting chip 4 is die-bonded in the die-bonding area, and the encapsulation layer 5 covers all the light-emitting chips 4 on the display panel. In the related art, in order to improve the contrast of the display, some black substances are added to the encapsulation layer 5, so that the encapsulation layer 5 is blackened to a certain extent. It is understandable that this will inevitably lead to a loss in the transmittance of the light-emitting chip 4. If the transmittance is to be improved, the degree of blackening of the encapsulation layer 5 needs to be reduced, but this will also lead to a decrease in contrast.

[0060] The display panel of this embodiment has a light-absorbing layer disposed between the die-bonding regions of the substrate. After the light-emitting chips are disposed within the die-bonding regions, the light-absorbing layer between adjacent die-bonding regions can achieve the contrast-enhancing effect of the blackened encapsulation adhesive layer used in related art. Furthermore, the display panel of this embodiment has the contrast-enhancing structure (i.e., including the light-absorbing layer) disposed on the substrate, without directly blocking the light from the light-emitting chips. Therefore, the light-absorbing layer can achieve the best possible light-absorbing effect, achieving the highest possible degree of blackening, even achieving pure black, without significantly impacting the display panel's luminous effect.

[0061] The light-absorbing layer can be any black material capable of absorbing light. For example, materials for the light-absorbing layer include, but are not limited to, black ink, a colloid mixed with black ink, a colloid mixed with a black solid material (e.g., carbon black powder), and a black solid material. In some embodiments, the light-absorbing layer can include a black ink layer, that is, the light-absorbing layer can be formed by curing black ink. For example, the black ink can be applied to the substrate by inkjet printing, coating, or the like.

[0062] Because the substrate has already achieved a structure that improves contrast without affecting or minimally affecting the light from the light-emitting chip, the subsequent encapsulation adhesive layer can be implemented as an encapsulation adhesive layer with high transmittance, and the transmittance of the light-emitting chip can also be guaranteed. Therefore, the display panel of this embodiment is conducive to achieving both high contrast and high transmittance, and the light-absorbing layer is tightly bonded to the substrate and is not easily detached.

[0063] It should be noted that, in some examples, the grooves provided in this embodiment can not only increase the bonding force between the light absorbing layer and the substrate. For example, when the light absorbing layer is made of a fluid raw material, the setting of the grooves makes the surface of the substrate not a complete plane. The space in the grooves allows the fluid raw material of the light absorbing layer to flow in before solidification. In the process of making the light absorbing layer, the distribution of the fluid raw material of the light absorbing layer can be made more concentrated, thereby improving the molding accuracy of the light absorbing layer. That is to say, in the example where the light absorbing layer is made of a fluid raw material, the display panel can also form a light absorbing layer with higher precision. The light absorbing layer formed with high precision avoids covering the solid crystal area or the light emitting chip solidified on the solid crystal area, thereby ensuring the quality of the final product and also ensuring the contrast improvement effect. It should be understood that the fluid raw material referred to in this embodiment refers to a raw material with a certain fluidity. Before the light absorbing layer is solidified, it can be a liquid fluid raw material or a solid-liquid mixed fluid raw material.

[0064] In some embodiments, the substrate further includes a roughened surface, the roughened surface is provided at least on the inner wall surface of the groove, and a portion of the light absorbing layer in the groove contacts the roughened surface.

[0065] This roughened surface roughens the surface, increasing the friction between the light-absorbing layer and the substrate. This allows the light-absorbing layer, made from a fluid material, to be more concentrated during molding, thereby improving the precision of the light-absorbing layer during molding. Furthermore, the rougher surface enhances the bonding strength between the light-absorbing layer and the substrate, improving adhesion and preventing detachment. In some implementations, this also improves the reliability of the final product. It is understood that the roughened surface in this embodiment is at least rougher than the original, flat substrate material.

[0066] As an example of roughening a surface, see Figure 4A passivation layer 6 is formed on the surface outside the solid crystal area 1 on the substrate, especially the inner wall surface of the groove. The passivation layer 6 can be selected from at least one material including but not limited to SiNx (silicon nitride) or SiOx (silicon oxide), and is made by methods including but not limited to CVD (Chemical Vapor Deposition) film formation. The surface of the passivation layer 6 is rough, and a roughened surface is formed on the surface of the substrate. The chemical and physical properties of the passivation layer 6 are very stable, and setting another passivation layer 6 on the surface of the substrate as a roughened surface will not have a significant impact on the stability of the final product. It can be understood that in actual applications, the roughened surface with an independent layer structure (that is, similar to the passivation layer 6, an independent layer of structure for roughening is formed on the substrate) can also be made of non-passivated materials, as long as the surface roughness after molding is guaranteed.

[0067] As another example, the surface of the substrate outside the solid crystal area can be directly roughened by physical or chemical means to make it rough, thereby forming a roughened surface. It is understandable that the grooves are mainly used to increase the bonding strength between the light-absorbing layer and the substrate, or to make the fluid raw material more concentrated when the light-absorbing layer is made of a fluid raw material. Therefore, the accuracy of the grooves themselves does not need to be set too high. Therefore, as another example, the grooves on the substrate can be formed by mechanical cutting. According to actual needs, a cutting process that results in an uneven cutting surface is selected to cut the substrate. While the grooves are formed, the inner wall surface of the grooves naturally forms a roughened surface.

[0068] Of course, in some implementations, such as Figure 5 In the manner shown, the roughened surface may not be provided on the inner wall surface of the groove, but may be formed only in the area outside the groove, which can also achieve the above-mentioned effect to a certain extent.

[0069] In some embodiments, the preset interval between the solid crystal area and the adjacent solid crystal area is not less than the width of the solid crystal area itself. For example, the preset interval can be selected to be 1-2 times the width of the solid crystal area. It should be noted that the width of the solid crystal area referred to in this embodiment refers to the length of the shorter side of the solid crystal area. In actual applications, if the solid crystal area is not a standard rectangular area, the preset interval can be set to be not less than the width of a single light-emitting chip; or when more than one light-emitting chip is provided in the solid crystal area, the preset interval can be set to be not less than the sum of the widths of a group of light-emitting chips in the solid crystal area. Since the solid crystal area cannot be covered, the maximum width of the light-absorbing layer is the preset interval between the solid crystal area and the adjacent solid crystal area. A reasonable preset gap is set between the solid crystal areas to ensure that the light-absorbing layer has enough space for setting. Reasonably increasing the setting width of the light-absorbing layer is beneficial to the precision control of the light-absorbing layer, and is also beneficial to avoid the light-absorbing layer covering the solid crystal area due to precision problems during production.

[0070] See Figure 6 The substrate further includes a plurality of light-emitting chips 4, which are solidified in the solidification area in groups, and each solidification area has a group of light-emitting chips 4 solidified;

[0071] The display panel further includes an encapsulation layer 5 , which covers the light-emitting chip 4 and the light-absorbing layer 3 .

[0072] It should be noted that the number of each group of light emitting chips 4 on the substrate is determined according to actual conditions. In some embodiments, for example Figure 6 As shown, each group includes only one light-emitting chip 4, that is, one light-emitting chip 4 is bonded to one die bonding area. In some embodiments, each group includes multiple light-emitting chips 4. For example, in some examples, each group of light-emitting chips 4 includes three light-emitting chips, and the colors of the three light-emitting chips 4 are red, green, and blue, respectively. These three light-emitting chips 4 together form an RGB group, and one RGB group can constitute a pixel, for example Figure 7 As shown, the light-emitting chips 4 in the same group are arranged closely in sequence, that is, each die-bonding area includes a light-emitting chip 4 of one pixel, and the area between each pixel is provided with a light-absorbing layer 3 to improve contrast. In some other embodiments, a die-bonding area may include more than three light-emitting chips 4, and the arrangement of the light-emitting chips 4 is not limited to a sequential arrangement, and can be combined into a more complex arrangement.

[0073] The encapsulation adhesive layer includes, but is not limited to, thermosetting adhesive or other encapsulation adhesives. Specifically, thermosetting adhesives include, but are not limited to, epoxy resins or silicone resins. In some specific embodiments, to minimize the overall thickness of the display panel while protecting the chip, the total thickness of the encapsulation adhesive layer can be 2-2.5 times the thickness of the chip. That is, after the encapsulation adhesive layer covers the chip, it is 1-1.5 times thicker than the chip. To minimize brightness loss on the display panel and ensure display brightness, in some embodiments, the transmittance of the encapsulation adhesive layer is selected to be no less than 70%. It is understood that the transmittance of the encapsulation layer is selected based on actual needs. A transmittance of 70% is merely an example. In actual applications, the transmittance can also be 75%, 80%, 85%, 90%, or 95%, etc. In some implementations, if the brightness of the display panel exceeds the preset standard, an encapsulation layer with a transmittance lower than 70% can be selected. While ensuring that the brightness of the display panel still meets the required standards, the encapsulation layer can be appropriately blackened to further improve the contrast. In fact, this can also achieve both high contrast and brightness standards, and is also a solution for achieving both contrast and brightness. In the related art, when selecting an encapsulation layer, the choice of encapsulation layer is greatly limited because both brightness and contrast need to be considered. It can be seen that this embodiment improves the display contrast without affecting the brightness of the light-emitting chip through the above-mentioned light-absorbing layer formed on the substrate. It also makes the range of parameters such as the transmittance of the encapsulation layer wider and more flexible when the display panel is subsequently formed, which broadens the selection range of encapsulation layers.

[0074] The surface of the encapsulation adhesive layer (including but not limited to the side of the encapsulation adhesive layer away from the substrate) can be optically treated, such as forming an optical structure or setting other optical film layers, so as to achieve the desired optical visual effect. For example, in some embodiments, the encapsulation adhesive layer includes an atomizing layer, and the atomizing layer is at least provided on the side of the encapsulation adhesive layer away from the substrate. It can be understood that the atomizing layer can make the light present an atomizing effect, reduce the reflection of ambient light, and thus enhance the visual effect of the product. For example, AG (anti-glare) / AR (anti-reflection) atomizing treatment can be performed on the surface of the encapsulation adhesive layer by methods including but not limited to release film transfer or hot pressing mold transfer, and the entire surface of the encapsulation adhesive layer is atomized to reduce ambient light reflection and further enhance the visual effect. In some examples, the encapsulation adhesive layer can adopt an atomized colloid mixed with an atomizing material.

[0075] In order to further ensure the display effect of the display panel, in some embodiments, the light absorbing layer satisfies at least one of the following conditions in the thickness direction:

[0076] The surface of the light absorbing layer is not lower than the first end of the electrode of the light emitting chip, where the first end is the end of the electrode away from the substrate;

[0077] The surface of the light absorbing layer is no higher than the side of the light emitting layer of the light emitting chip close to the substrate.

[0078] like Figure 7 In the figure, the dotted line indicates the position of the light-emitting layer of the light-emitting chip close to the side of the substrate. The light-absorbing layer satisfies both of the above conditions. The surface of the light-absorbing layer is higher than the electrode of the light-emitting chip. The light-absorbing layer can block the electrode of the light-emitting chip from the side to a certain extent. The reflection of the electrode of the light-emitting chip can be effectively weakened or eliminated. The light-absorbing layer is located below the light-emitting layer of the light-emitting chip (with Figure 7 The display panel posture shown in the figure is for reference only) does not directly block the light emitted by the light-emitting chip, minimizing brightness loss and ensuring the brightness of the display panel. The light-emitting layer of the light-emitting chip generally includes an active layer of the light-emitting chip, including but not limited to a multi-quantum well active layer and other active layer structures capable of emitting light.

[0079] Light-emitting chips include, but are not limited to, Micro-LED (Micro light-emitting diode) chips and Mini-LED (Mini light-emitting diode) chips. For example, if the thickness of a Micro-LED is 100 μm, the thickness of the light-absorbing layer can be 20 μm to 40 μm. If the thickness of a Micro-LED is 10 μm, the thickness of the light-absorbing layer can be 3 μm to 5 μm. Of course, due to differences in manufacturing processes, the light-emitting locations of the same type of light-emitting chip may vary even if the total thickness is the same. In practical applications, the thickness of the light-absorbing layer should take into account the actual structure of the light-emitting chip.

[0080] The substrate used in the display panel of the above example of this embodiment has a black light-absorbing layer set with high precision. The contrast of the display panel is guaranteed by the contrast enhancement structure (including the light-absorbing layer) set on the substrate. Therefore, according to the requirements of brightness and other aspects, a packaging glue layer with a higher transmittance can be used in this embodiment. In some implementation processes, the display panel of this embodiment can achieve both contrast and brightness.

[0081] This embodiment also provides a display device, comprising a frame and the display panel described above, the display panel being fixed to the frame. The display device can be any electronic device that utilizes the display panel described above and can provide a display, including but not limited to various smart mobile terminals, vehicle-mounted terminals, personal computers (PCs), monitors, electronic billboards, and the like.

[0082] Another optional embodiment of the present invention:

[0083] This embodiment provides a method for manufacturing a display panel. By using this method, display panels including but not limited to the above-mentioned embodiment examples can be manufactured. Figure 8 , a method for manufacturing a display panel includes:

[0084] S101, providing a substrate;

[0085] like Figure 9 The substrate includes a plurality of crystal-bonding regions 1 , which are arranged in an array on one side of the substrate, and each crystal-bonding region 1 is spaced a preset distance from an adjacent crystal-bonding region 1 .

[0086] S102, forming a groove in the interval area between each crystal-bonding area and the adjacent crystal-bonding area on the substrate;

[0087] As an example, Figure 10 as well as Figure 11 Each spacing area between the crystal-solidifying areas 1 is formed with multiple strip-shaped grooves 2 by methods including but not limited to etching, mechanical cutting, etc.

[0088] S103, forming a light absorbing layer in the spacer area;

[0089] The light absorbing layer may be formed in the spaced regions by methods including but not limited to deposition, spraying, printing, and the like.

[0090] In some embodiments, step S103 may specifically include:

[0091] S1031, placing a fluid material in the spaced area, and solidifying the fluid material to form a light absorbing layer;

[0092] The fluid material can be applied by methods including, but not limited to, inkjet printing and coating. Before the fluid material solidifies, a portion of the fluid material flows and fills the grooves, while the remainder remains on the surface of the substrate. As a specific example, in some embodiments, the light-absorbing layer is black ink. The black ink can be applied to the substrate by inkjet printing and solidifies to form a black ink layer.

[0093] It can be understood that when a fluid raw material is used to form the light absorbing layer, the space in the groove allows the fluid raw material to flow into the light absorbing layer before solidification, thereby making the distribution of the fluid raw material of the light absorbing layer more concentrated and improving the molding accuracy of the light absorbing layer.

[0094] In some embodiments, after forming the grooves in step S102 and before forming the light absorbing layer in step S103, the method further includes:

[0095] S104, forming a roughened surface on the substrate;

[0096] The roughened surface is specifically provided on the side of the substrate having the crystal-bonding region. The roughened surface can be formed on all surfaces of the intervening regions between each crystal-bonding region (including both grooves and non-grooved areas), or it can be provided only on the inner wall surfaces of the grooves, or on areas outside the grooves.

[0097] As mentioned above in this embodiment, the roughened surface can be a surface formed by roughening the surface of the substrate itself, or it can be achieved by forming an additional roughened layer on the surface of the substrate.

[0098] Therefore, illustratively, S104 may specifically include at least one of the following steps:

[0099] S1041: performing a roughening treatment on the surface of the substrate to increase the surface roughness of the substrate;

[0100] S1042: forming a roughening layer on all surfaces of the interval area between each crystal-bonding area and the adjacent crystal-bonding area;

[0101] The roughening layer includes but is not limited to the passivation layer made of materials such as SiNx (silicon nitride) or SiOx (silicon oxide) mentioned above in this embodiment, or other materials.

[0102] It can be understood that if in the above step S102, the surface of the groove is made relatively rough while the groove is being made (for example, a relatively rough cutting surface is formed by mechanical cutting), then the above step S104 may not be performed separately, or the step S104 can be understood as being implemented simultaneously with the step S102.

[0103] In some embodiments, the method for manufacturing a display panel further includes:

[0104] S105, arranging a plurality of light-emitting chips on the substrate;

[0105] The light-emitting chips are solidified in the solidification area in groups, and each solidification area has a group of light-emitting chips solidified. In some examples, when executing step S101, the light-emitting chips are not set to the solidification area of the substrate, and the light-emitting chips can be solidified after the light-absorbing layer is formed (that is, after the above-mentioned step S103 is executed); while in other examples, the light-emitting chips have been solidified to the solidification area on the substrate provided by step S101, that is, before step S102, the light-emitting chips are solidified to the solidification area. In other words, the substrate provided by step S101 in this embodiment can be a substrate on which the light-emitting chips have not been set, or it can be a substrate on which the light-emitting chips are set. It can be seen that in the absence of conflict, the order of step S105 and other steps can be adjusted according to the actual process, and this embodiment does not limit the execution order of step S105.

[0106] After the fluid raw material is solidified to form the light absorbing layer, the following step S106 is also included;

[0107] S106, providing a packaging adhesive layer on the substrate, wherein the packaging adhesive layer covers the light-emitting chip and the light-absorbing layer;

[0108] Depending on the actual material of the encapsulation layer, the encapsulation layer can be applied by methods including, but not limited to, hot pressing. After application, the encapsulation layer is allowed to cure. After curing, the encapsulation layer can also be subjected to optical processing steps, including, but not limited to, AG / AR atomization processing, on the surface of the encapsulation layer.

[0109] The display panel manufactured by the display panel manufacturing method of this embodiment has a light-absorbing layer structure on the substrate of the display panel that can improve the display contrast. The light-absorbing layer on the substrate is difficult to block the solid-crystal light-emitting chip, which is beneficial to simultaneously ensure high contrast and high transmittance of the display panel and display device. The light-absorbing layer has high molding accuracy, which reduces the impact on the solid-crystal area or the light-emitting chip, and also ensures the contrast improvement effect.

[0110] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A display panel, characterized in that: include: a substrate, wherein the substrate includes a plurality of light-emitting chips; a plurality of die-bonding regions, the light-emitting chips being die-bonded in the die-bonding regions, the die-bonding regions being arranged in an array on one side of the substrate, with each die-bonding region being spaced apart from an adjacent die-bonding region by a preset interval; A groove is provided in a spaced area between each of the crystal-fixing regions and an adjacent crystal-fixing region, wherein the groove is provided on the substrate; The light absorbing layer is arranged in the interval area between each of the solid crystal areas and the adjacent solid crystal areas. The light absorbing layer is arranged on the substrate and fills and covers the groove. The surface of the light absorbing layer is not higher than the side of the light emitting chip away from the substrate.

2. The display panel according to claim 1, wherein The substrate further includes a roughened surface, which is provided at least on the inner wall surface of the groove, and a portion of the light absorbing layer in the groove contacts the roughened surface.

3. The display panel according to claim 1, wherein The preset interval between each of the crystal-bonding regions and the adjacent crystal-bonding regions is not less than the width of the crystal-bonding region itself.

4. The display panel according to any one of claims 1 to 3, wherein: The substrate further includes a plurality of light-emitting chips, which are bonded to the bonding area in groups, with each bonding area bonding a group of the light-emitting chips; The display panel further includes an encapsulation adhesive layer, and the encapsulation adhesive layer covers the light emitting chip and the light absorbing layer.

5. The display panel according to claim 4, wherein: The packaging adhesive layer includes an atomized layer, and the atomized layer is at least arranged on a side of the packaging adhesive layer away from the substrate.

6. The display panel according to claim 4, wherein: The light absorbing layer satisfies at least one of the following conditions in its thickness direction: The surface of the light absorbing layer is not lower than the first end of the electrode of the light emitting chip, where the first end is the end of the electrode away from the substrate; The surface of the light absorbing layer is no higher than a surface of the light emitting layer of the light emitting chip close to the substrate.

7. A method for manufacturing a display panel, characterized in that: include: A substrate is provided, comprising a plurality of die-bonding regions, a plurality of light-emitting chips die-bonded to the die-bonding regions, the die-bonding regions being arranged in an array on one side of the substrate, and each die-bonding region being spaced apart from an adjacent die-bonding region by a predetermined distance; forming a groove in the interval area between each of the crystal-fixing regions and the adjacent crystal-fixing regions on the substrate, wherein the groove is provided on the substrate; A light absorbing layer is formed in the spacing area. The light absorbing layer is arranged on the substrate and fills and covers the groove. The surface of the light absorbing layer is not higher than the side of the light emitting chip away from the substrate.

8. The method for manufacturing a display panel according to claim 7, wherein: The forming of the light absorbing layer in the spacer region includes: A fluid material is arranged in the spacing area, and the fluid material is solidified to form the light absorbing layer; before the fluid material is solidified, a portion of the fluid material enters the groove.

9. The method for manufacturing a display panel according to claim 8, wherein: Also includes: A plurality of light-emitting chips are arranged on the substrate, and the light-emitting chips are bonded to the bonding area in groups, with each bonding area bonding a group of the light-emitting chips; After the fluid raw material is solidified to form the light absorbing layer, the method further comprises: A packaging adhesive layer is provided on the substrate, and the packaging adhesive layer covers the light-emitting chip and the light-absorbing layer.

10. A display device, characterized in that: The display device comprises a frame, a driving module and a display panel according to any one of claims 1 to 6; The display panel is fixed on the frame; The display panel is connected to the driving module.

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