Display device

Abstract

Disclosed is a display device capable of reducing its thickness and weight. In an organic light emitting diode display device having a touch sensor, a plurality of wirings connected to a plurality of touch sensors disposed on a package unit are disposed on different planes so as to overlap each other and are electrically connected to each other through a plurality of wiring contact holes. Thus, connection failure between the wirings is prevented. In addition, by providing the touch sensor over the package unit without a separate attachment process, a simplified manufacturing process and reduced cost are produced.

Description

[0001] This application is a divisional application of the Chinese patent application entitled “Display Device” and application number 201810430831.0. Patent application 201810430831.0 is an invention patent application submitted to the China Patent Office on May 8, 2018 in accordance with the Paris Treaty.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims the benefit of Korean Patent Application No. 10-2017-0057291, filed on May 8, 2017, which is hereby incorporated by reference in its entirety as if fully set forth herein. Technical Field

[0004] The present disclosure relates to a display device, and more particularly, to a display device and a method of manufacturing the same for achieving a simplified manufacturing process and reduced cost. Background Art

[0005] A touchscreen is an input device that allows a user to input commands by selecting content appearing on a screen of a display device, etc., using a human hand or an object. Specifically, a touchscreen converts a contact point directly touched by a human hand or object into an electrical signal and receives the content selected at the contact point as an input signal. Touchscreens can eliminate the need for a separate input device, such as a keyboard or mouse, that is connected to and operated by the display device, and as a result, their use is expanding.

[0006] Such a touch screen is usually attached to the front surface of a display panel, such as a liquid crystal display panel or an organic light-emitting diode display panel, by an adhesive. In this case, since the touch screen is separately manufactured and attached to the front surface of the display panel, the manufacturing process becomes complicated, and the addition of such an attachment process increases the cost. Summary of the Invention

[0007] Accordingly, the present disclosure is directed to a display device that substantially obviates one or more problems due to the drawbacks and disadvantages of the related art.

[0008] The present disclosure is provided to solve the above-mentioned problems, and the present disclosure will provide a display device and a method of manufacturing the same for achieving a simplified manufacturing process and reduced cost.

[0009] Additional advantages and features of the present disclosure will be partially set forth in the following description and will partially become apparent to those skilled in the art upon studying the following or may be learned from practice of the present disclosure. Other advantages of the present disclosure may be realized and obtained through the structures specifically pointed out in its written description and claims and the accompanying drawings.

[0010] To achieve these and other advantages and in accordance with the purposes of the present disclosure, an organic light-emitting diode display device with a touch sensor, as embodied and broadly described herein, is configured such that a plurality of wirings, respectively connected to a plurality of touch sensors above a packaging unit, are arranged on different planes so as to overlap with each other and are electrically connected to each other through a plurality of wiring contact holes, thereby preventing connection failures between the wirings. Furthermore, by providing the touch sensor above the packaging unit, a separate attachment process is not required, resulting in a simplified manufacturing process and reduced costs.

[0011] In another aspect of the present disclosure, a display device includes: a light-emitting element arranged on a substrate; a packaging unit arranged on the light-emitting element; a plurality of touch sensors arranged above the packaging unit; a touch insulation layer arranged on the packaging unit; a lower wiring, which is arranged on the touch insulation layer having a plurality of wiring contact holes and covers the side surface of the packaging unit; and an upper wiring, which is arranged on the touch insulation layer along the lower wiring and connected to the lower wiring through a plurality of wiring contact holes, wherein the lower wiring and the upper wiring are arranged on different planes and overlap each other.

[0012] In another aspect of the present disclosure, a method for manufacturing a display device is provided, the method comprising: forming a light-emitting element on a substrate; forming a packaging unit on the light-emitting element; forming a plurality of touch sensors above the packaging unit; and forming a plurality of wirings connected to the plurality of touch sensors and covering a side surface of the packaging unit, wherein the plurality of wirings are arranged on different planes to overlap each other and are electrically connected to each other through a plurality of wiring contact holes.

[0013] It is to be understood that both the foregoing general description and the following detailed description of the present disclosure are exemplary and explanatory and are intended to provide further explanation of the disclosure as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings illustrate various aspects of the disclosure and together with the description serve to explain the principles of the disclosure. The accompanying drawings are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this application.

[0015] In the attached figure:

[0016] Figure 1 is a perspective view showing an organic light emitting diode display device with a touch sensor according to the present disclosure;

[0017] Figure 2 It shows Figure 1 A plan view of an organic light emitting diode display device with a touch sensor is shown;

[0018] Figure 3 It shows that along Figure 2 A cross-sectional view of an organic light emitting diode display device with a touch sensor taken along lines “I-I′” and “II-II′”;

[0019] Figure 4A and Figure 4B are used to illustrate the manufacturing Figure 2 and Figure 3 A plan view and a cross-sectional view of the second bridge, the lower wiring and the lower pad electrode shown;

[0020] Figure 5A and Figure 5B Is used to illustrate the manufacturing Figure 2 and Figure 3 A plan view and a cross-sectional view of the touch contact hole, the wiring contact hole and the pad contact hole are shown;

[0021] Figure 6A and Figure 6B Is used to illustrate the manufacturing Figure 2 and Figure 3 A plan view and a cross-sectional view of the method of illustrating the first touch electrode, the second touch electrode, the first bridge, the upper wiring and the upper pad electrode;

[0022] 7A to 7D It is used to describe the manufacturing Figure 6B A cross-sectional view of the method of the first touch electrode, the second touch electrode, the first bridge, the upper wiring and the upper pad electrode shown;

[0023] Figure 8A and Figure 8B Is used to illustrate the manufacturing Figure 2 and Figure 3 Plan and cross-sectional views of the touch protection layer shown;

[0024] Figure 9 is a cross-sectional view illustrating an organic light emitting diode display device having a touch sensor according to another aspect of the present disclosure; and

[0025] Figure 10 are a plan view and a cross-sectional view illustrating another form of a bridge in an organic light emitting diode display device with a touch sensor according to the present disclosure. DETAILED DESCRIPTION

[0026] Hereinafter, various aspects according to the present disclosure will be described in detail with reference to the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or similar parts.

[0027] Figure 1 is a perspective view illustrating an organic light emitting diode display device having a touch sensor according to the present disclosure.

[0028] Figure 1 The organic light emitting diode display device with a touch sensor is shown by Figure 2 The touch electrodes 152e and 154e shown sense the mutual capacitance Cm (touch sensor) in response to changes in the user's touch to sense the presence or absence of touch and the touch position. Figure 1 The organic light emitting diode display device with a touch sensor shown displays an image through unit pixels each including a light emitting element 120. Each unit pixel may include red (R), green (G), and blue (B) sub-pixels PXL, or may include red (R), green (G), blue (B), and white (W) sub-pixels PXL.

[0029] to this end, Figure 1 The organic light emitting diode display device shown includes a plurality of sub-pixels PXL arranged in a matrix on a substrate 111 , an encapsulation unit 140 arranged on the sub-pixels PXL, and a mutual capacitance array Cm arranged on the encapsulation unit 140 .

[0030] Each sub-pixel PXL includes a pixel driving circuit and a light emitting element 120 connected to the pixel driving circuit.

[0031] The pixel driving circuit includes a switching transistor T1 , a driving transistor T2 , and a storage capacitor Cst.

[0032] When a scan pulse is supplied to the scan line SL, the switching transistor T1 is turned on and supplies the data signal supplied to the data line DL to the storage capacitor Cst and the gate electrode of the driving transistor T2.

[0033] The driving transistor T2 controls the current supplied to the light emitting element 120 from the high voltage (VDD) power supply line in response to the data signal supplied to the gate electrode of the driving transistor T2, thereby adjusting the amount of light emission from the light emitting element 120. Then, even if the switching transistor T1 is turned off, the driving transistor T2 supplies a constant amount of current to the light emitting element 120 by the voltage charged in the storage capacitor Cst to maintain the light emission of the light emitting element 120 until the data signal of the next frame is supplied.

[0034] like Figure 3 As shown, the driving transistor T2 or 130 includes a gate electrode 132, a semiconductor layer 134 overlapping the gate electrode 132, and a source electrode 136 and a drain electrode 138 formed on the interlayer insulating layer 114 to contact the semiconductor layer 134, with the gate insulating layer 102 between the gate electrode 132 and the semiconductor layer 134. Here, the semiconductor layer 134 is formed on the buffer layer 104 using at least one of an amorphous semiconductor material, a polycrystalline semiconductor material, and an oxide semiconductor material.

[0035] The light emitting element 120 includes an anode electrode 122 , at least one light emitting stack 124 formed on the anode electrode 122 , and a cathode electrode 126 formed on the light emitting stack 124 .

[0036] The anode electrode 122 is electrically connected to the drain electrode 138 of the driving transistor T2 or 130 , and the drain electrode 138 is exposed through a pixel contact hole formed in the protection layer 116 .

[0037] Light-emitting stack 124 is formed on anode electrode 122 in the light-emitting region defined by bank 128. Light-emitting stack 124 is formed by stacking a hole-related layer, an organic light-emitting layer, and an electron-related layer on anode electrode 122 in this order or in reverse order. Alternatively, at least one light-emitting stack 124 may include a first light-emitting stack and a second light-emitting stack facing each other, with a charge generation layer between them. In this case, the organic light-emitting layer of one of the first and second light-emitting stacks generates blue light, and the organic light-emitting layer of the other generates yellow-green light, thereby generating white light from the first and second light-emitting stacks. Since the white light generated in light-emitting stack 124 is incident on a color filter located above or below light-emitting stack 124, a color image can be achieved. Furthermore, each light-emitting stack 124 can generate colored light corresponding to each sub-pixel to achieve a color image without the need for separate color filters. That is, the light emitting stack 124 of the red (R) sub-pixel may generate red light, the light emitting stack 124 of the green (G) sub-pixel may generate green light, and the light emitting stack 124 of the blue (B) sub-pixel may generate blue light.

[0038] The cathode electrode 126 may be formed to face the anode electrode 122 with the light emitting stack 124 therebetween and connected to a low voltage (VSS) power supply line.

[0039] The encapsulation unit 140 prevents external moisture or oxygen from entering the light-emitting element 120, which is susceptible to external moisture or oxygen. To this end, the encapsulation unit 140 includes a plurality of inorganic encapsulation layers 142 and 146 and an organic encapsulation layer 144 arranged between the inorganic encapsulation layers 142 and 146. The inorganic encapsulation layer 146 is the uppermost layer. Here, the encapsulation unit 140 includes at least two inorganic encapsulation layers 142 and 146 and at least one organic encapsulation layer 144. In the present disclosure, the structure of the encapsulation unit 140 in which the organic encapsulation layer 144 is arranged between the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146 will be described with the help of embodiments.

[0040] The first inorganic encapsulation layer 142 is formed on the substrate 111 on which the cathode electrode 126 is formed, so as to be closest to the light-emitting element 120. The first inorganic encapsulation layer 142 is formed of an inorganic insulating material that can be deposited at low temperatures, such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), and aluminum oxide (Al2O3). Therefore, since the first inorganic encapsulation layer 142 is deposited in a low-temperature atmosphere, it is possible to prevent damage to the light-emitting stack 124, which is susceptible to high-temperature atmospheres, during the deposition process of the first inorganic encapsulation layer 142.

[0041] The organic encapsulation layer 144 is used to suppress stress between layers caused by bending the organic light emitting diode display device and improve planarization performance. The organic encapsulation layer 144 is formed using an organic insulating material such as acrylic resin, epoxy resin, polyimide, polyethylene, and silicon oxycarbide (SiOC).

[0042] The second inorganic encapsulating layer 146 is formed to cover the upper and side surfaces of the organic encapsulating layer 144 and the upper surface of the first inorganic encapsulating layer 142 exposed by the organic encapsulating layer 144. Therefore, since the upper and lower surfaces of the organic encapsulating layer 144 are sealed by the first and second inorganic encapsulating layers 142 and 146, it is possible to minimize or prevent external moisture or oxygen from entering the organic encapsulating layer 144, or minimize or prevent moisture or oxygen in the organic encapsulating layer 144 from entering the light-emitting element 120. The second inorganic encapsulating layer 146 is formed of an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), and aluminum oxide (Al2O3).

[0043] On the packaging unit 140, touch sensing lines 154 and touch driving lines 152 are arranged so as to cross each other, with a touch insulating layer 156 therebetween. A mutual capacitance array Cm is formed at the intersections of the touch sensing lines 154 and the touch driving lines 152. Therefore, the mutual capacitance array Cm functions as a touch sensor by storing charges in response to touch driving pulses supplied to the touch driving lines 152 and releasing the stored charges to the touch sensing lines 154.

[0044] The touch driving line 152 includes a plurality of first touch electrodes 152e and a first bridge 152b electrically interconnecting the first touch electrodes 152e.

[0045] The first touch electrodes 152e are equidistantly spaced apart from each other along the Y direction, which is the first direction, on the touch insulating layer 156. Each first touch electrode 152e is electrically connected to an adjacent first touch electrode 152e via a first bridge 152b.

[0046] The first bridge 152b is disposed on the same plane as the first touch electrode 152e on the touch insulating layer 156 and is electrically connected to the first touch electrode 152e without a separate contact hole.

[0047] The touch sensing line 154 includes a plurality of second touch electrodes 154 e and a second bridge 154 b electrically interconnecting the second touch electrodes 154 e.

[0048] The second touch electrodes 154e are equidistantly spaced apart from each other along the X direction, which is the second direction, on the touch insulating layer 156. Each second touch electrode 154e is electrically connected to an adjacent second touch electrode 154e via a second bridge 154b.

[0049] The second bridge 154b is formed on the second inorganic encapsulation layer 146 and is exposed through the touch contact hole 150 formed in the touch insulating layer 156, thereby being electrically connected to the second touch electrode 154e. The second bridge 154b is arranged in the same manner as the first bridge 152b so as to overlap with the bank 128, which can prevent the first bridge 152b and the second bridge 154b from causing a loss in aperture ratio.

[0050] In this manner, the touch drive lines 152 and the touch sense lines 154 of the present disclosure are respectively connected to a touch drive unit (not shown) through wiring 160 and touch pads 170 , which are arranged in the non-active (border) area.

[0051] In this way, the wiring 160 transmits a touch driving pulse generated in the touch driving unit to the touch driving line 152 via the touch pad 170 , and also transmits a touch signal from the touch sensing line 154 to the touch pad 170 .

[0052] The wiring 160 is arranged between each of the first touch electrode 152e and the second touch electrode 154e and the touch pad 170 to electrically interconnect these touch electrodes 152e, 154e and the touch pad 170. Figure 2 As shown, the wiring 160 is connected to the first touch electrode 152e, extends to at least one of the upper side and the lower side of the active area so as to be connected to the touch pad 170. The wiring 160 connected to the second touch electrode 154e extends to at least one of the right side and the left side of the active area so as to be connected to the touch pad 170. The arrangement of the wiring 160 is not limited to Figure 2 structure, and can be changed in various ways according to the design requirements of the display device.

[0053] The plurality of wirings 160 are arranged on different planes so as to overlap each other. In the present disclosure, a structure in which the wiring 160 includes a lower wiring 162 and an upper wiring 164 arranged on different planes will be described with the aid of embodiments.

[0054] The lower wiring 162 is formed using the same material as the second bridge 154 b through the same mask process as the second bridge 154 b. The lower wiring 162 is formed on the second inorganic encapsulation layer 146, which is the uppermost layer of the encapsulation unit 140, to cover the side surface of the encapsulation unit 140. Since the lower wiring 162 is protected by the touch insulation layer 156, it can be prevented from being damaged when the upper wiring 164 is patterned, which improves reliability.

[0055] Upper wiring 164 is formed using the same material as touch electrodes 152e and 154e through the same masking process as touch electrodes 152e and 154e. Upper wiring 164 is arranged on touch insulation layer 156 and is also formed to cover the side surfaces of touch insulation layer 156, which is formed to cover lower wiring 162. Furthermore, upper wiring 164 is formed on touch insulation layer 156 so as to extend along lower wiring 162 and has the same shape as lower wiring 162. Upper wiring 164 extends from each of the first touch electrode 152e and the second touch electrode 154e and overlaps with lower wiring 162, with touch insulation layer 156 between them.

[0056] Upper wiring 164 is electrically connected to lower wiring 162, which is exposed through a plurality of wiring contact holes 166 formed in touch insulation layer 156. Wiring contact holes 166 can be used to increase the connection area between upper wiring 164 and lower wiring 162, thereby preventing connection failures between the upper wiring 164 and lower wiring 162. In addition, since wiring 160, including upper wiring 164 and lower wiring 162, is formed into a multilayer structure, the resistance of wiring 160 can be reduced. Furthermore, since wiring 160 has a multilayer structure, even if either upper wiring 162 or lower wiring 164 is disconnected, the other wiring can still transmit touch drive pulses and touch signals.

[0057] The touch pad 170 is formed to be exposed to the outside through the touch protection layer 190 and is thus connected to a signal transmission film on which a touch driving unit (not shown) is installed. The touch pad 170 can be arranged in at least one of the one side area and the other side area of ​​the substrate 111 together with a display pad (not shown) connected to at least one of the data line DL, the scan line SL, the low voltage (VSS) power line, and the high voltage (VDD) power line. Alternatively, the touch pad 170 and the display pad can be arranged in different non-active areas. At the same time, the arrangement of the touch pad 170 is not limited to Figure 2 structure and can be changed in various ways according to the necessary design requirements of the display device.

[0058] The touch pad 170 is disposed on at least one layer 116 of the plurality of insulating layers 102, 104, 114, 116, and 118, which are disposed below the light emitting element 120. The touch pad 170 includes a lower pad electrode 172 extending from the lower wiring 162 and an upper pad electrode 174 extending from the upper wiring 164.

[0059] The lower pad electrode 172 is formed using the same material as the second bridge 154b through the same mask process as the second bridge 154b. The lower pad electrode 172 extends from the lower wiring 162 on the protective layer 116 and is thus directly connected to the lower wiring 162.

[0060] The upper pad electrode 174 is formed using the same material and mask process as the touch electrodes 152e and 154e. The upper pad electrode 174 is electrically connected to the lower pad electrode 172 exposed through the pad contact hole 176 formed in the touch insulation layer 156.

[0061] In this manner, in the present disclosure, each of the first and second touch electrodes 152e and 154e, the first bridge 152b, the upper wiring 164, and the upper pad electrode 174 is formed of a transparent conductive layer 161 and an opaque conductive layer 163 disposed above or below the transparent conductive layer 161. The transparent conductive layer 161 is formed in a single layer or multiple layers using at least one of ITO, IZO, ZnO, IGZO, and ITO / Ag / ITO. The opaque conductive layer 163 is formed in a single layer or multiple layers using a highly conductive material having strong corrosion resistance and acid resistance, such as Al, Ti, Cu, and Mo. For example, the opaque conductive layer 163 is formed in a three-layer structure that is a stack of Ti / Al / Ti or Mo / Al / Mo.

[0062] The transparent conductive layer 161 and the opaque conductive layer 163 of each of the upper wiring 164 and the upper pad electrode 174 are formed to have the same shape. That is, the opaque conductive layer 163 of each of the upper wiring 164 and the upper pad electrode 174 is formed on the transparent conductive layer 161 of each of the upper wiring 164 and the upper pad electrode 174 so as to have the same shape and the same line width as those of the transparent conductive layer 161.

[0063] The opaque conductive layer 163 of each of the first and second touch electrodes 152e, 154e, and the first bridge 152b is formed to have a smaller line width than the line width of the transparent conductive layer 161 of each of the first and second touch electrodes 152e, 154e, and the first bridge 152b. In other words, the opaque conductive layer 163 of each of the first and second touch electrodes 152e, 154e, and the first bridge 152b is formed on the transparent conductive layer 161 in a grid pattern. The opaque conductive layer 163 has a higher conductivity than the transparent conductive layer 161, allowing the first and second touch electrodes 152e, 154e to be formed as low-resistance electrodes. This reduces the resistance and capacitance of the first and second touch electrodes 152e, 154e, which can reduce the RC time constant and increase touch sensitivity. Furthermore, since the grid-like opaque conductive layer 163 has a very small line width, it can prevent degradation in aperture ratio and transmittance caused by the grid-like opaque conductive layer 163.

[0064] Figures 4A to 8B Is used to illustrate the manufacturing of Figure 2 and Figure 3 The method of showing a touch sensor of an organic light emitting diode display device is shown in plan view and cross-sectional view.

[0065] Reference Figure 4A and Figure 4B The second bridge 154 b , the lower wiring 162 , and the lower pad electrode 172 are formed on the substrate 111 on which the switching transistor T1 , the driving transistor T2 or 130 , the light emitting element 120 , and the package unit 140 are formed.

[0066] Specifically, a conductive layer is deposited on the entire surface of the substrate 111 on which the switching transistor T1, the driving transistor T2 or 130, the light-emitting element 120, and the packaging unit 140 are formed through a deposition process. Subsequently, the conductive layer is patterned through a photolithography process and an etching process using a first mask, thereby forming the second bridge 154b, the lower wiring 162, and the lower pad electrode 172. Here, each of the second bridge 154b, the lower wiring 162, and the lower pad electrode 172 is formed in a single layer or multiple layers using a material having good electrical conductivity and strong corrosion resistance and acid resistance, such as Al, Ag, Ti, Cu, Mo, and MoTi. For example, each of the second bridge 154b, the lower wiring 162, and the lower pad electrode 172 is formed in a three-layer structure that is a stack of Ti / Al / Ti or Mo / Al / Mo.

[0067] Reference Figure 5A and Figure 5BA touch insulating layer 156 including the touch contact hole 150 , the wiring contact hole 166 , and the pad contact hole 176 is formed on the substrate 111 on which the second bridge 154 b , the lower wiring 162 , and the lower pad electrode 172 are formed.

[0068] Specifically, the touch insulating layer 156 is formed by depositing an inorganic or organic insulating material on the substrate 111 on which the second bridge 154b, the lower wiring 162, and the lower pad electrode 172 are formed. Here, the touch insulating layer 156 may be a material such as SiN x , SiON, and SiO2, or may be an acrylic, epoxy, parylene-C, parylene-N, parylene-F, or siloxane-based organic layer. Subsequently, the touch insulation layer 156 is patterned using a second mask through a photolithography process and an etching process, thereby forming the touch contact hole 150, the wiring contact hole 166, and the pad contact hole 176.

[0069] Reference Figure 6A and Figure 6B , the first touch electrode 152e, the second touch electrode 154e, the first bridge 152b, the upper wiring 164 and the upper pad electrode 174 are formed on the substrate 111 on which the touch contact hole 150, the wiring contact hole 166 and the pad contact hole 176 are formed. This will be referred to below 7A to 7D Provide a description.

[0070] like Figure 7A As shown, a transparent conductive layer 161 and an opaque conductive layer 163 are sequentially stacked on a touch insulating layer 156 on which touch contact holes 150, wiring contact holes 166, and pad contact holes 176 are formed. Transparent conductive layer 161 is formed of a transparent conductive layer such as ITO, IZO, ZnO, IGZO, and ITO / Ag / ITO, while opaque conductive layer 163 is formed in a single layer or multiple layers using materials having good electrical conductivity and strong corrosion and acid resistance, such as Al, Ag, Ti, Cu, Mo, and MoTi. For example, opaque conductive layer 163 is formed in a three-layer structure of a stack of Ti / Al / Ti or Mo / Al / Mo.

[0071] Subsequently, after the photosensitive layer is stacked on the opaque conductive layer 163, the photosensitive layer is patterned using a third mask (e.g., a halftone mask or a slit mask) through a photolithography process, thereby forming a multilayered photosensitive layer 180. The multilayered photosensitive layer 180 is formed to have a second thickness d2 in the region of the mesh-shaped opaque conductive layer 163 where each of the first touch electrode 152e, the second touch electrode 154e, the first bridge 152b, the upper wiring 164, and the upper pad electrode 174 is formed, and is also formed to have a first thickness d1 in the region where the transparent conductive layer 161 is formed so as to be exposed through the mesh-shaped opaque conductive layer 163 of each of the first touch electrode 152e, the second touch electrode 154e, and the first bridge 152b. The photosensitive layer 180 is not formed in the remaining regions.

[0072] The opaque conductive layer 163 and the transparent conductive layer 161 are etched by an etching process using the multi-layer photosensitive layer 180 as a mask. Figure 7B As shown, each of the first touch electrode 152e, the second touch electrode 154e, the first bridge 152b, the upper wiring 164, and the upper pad electrode 174 is formed to have a multi-layer structure including a transparent conductive layer 161 and an opaque conductive layer 163 having the same line width.

[0073] Then, the multi-layer photosensitive layer 180 is ashed. Figure 7C , the total thickness of the photosensitive layer 180 is reduced, so that a portion of the photosensitive layer 180 having the first thickness is removed, thereby exposing the opaque conductive layer 163 of each of the first touch electrode 152e, the second touch electrode 154e, and the first bridge 152b. Subsequently, when the exposed opaque conductive layer 163 is removed by an etching process using the multi-layer photosensitive layer 180 subjected to ashing as a mask, as shown in FIG. Figure 7D As shown, the transparent conductive layer 161 of each of the first touch electrode 152e, the second touch electrode 154e, and the first bridge 152b is exposed. Subsequently, the photosensitive layer 180 remaining on the substrate is removed by a lift-off process.

[0074] Reference Figure 8A and Figure 8B The touch protection layer 190 is formed on the substrate 111 on which the first touch electrode 152e, the second touch electrode 154e, the first bridge 152b, the upper wiring 164, and the upper pad electrode 174 are formed.

[0075] Specifically, an organic insulating material, such as a photosensitive acrylic resin, is applied to the entire surface of the substrate 111 on which the first touch electrode 152e, the second touch electrode 154e, the first bridge 152b, the upper wiring 164, and the upper pad electrode 174 are formed. Subsequently, the organic insulating material is patterned by a photolithography process and an etching process using a fourth mask. Figure 8B As shown, a touch protection layer 190 is formed to expose the touch pads 170 .

[0076] In this manner, in the display panel according to the present disclosure, the transparent conductive layer 161 and the grid-shaped opaque conductive layer 163 included in each of the touch electrodes 152e and 154e are formed by the same mask process. Thus, since the number of mask processes is reduced, the present disclosure can achieve a simplified process and reduced costs.

[0077] Figure 9 is a cross-sectional view illustrating an organic light emitting diode display device according to another aspect of the present disclosure.

[0078] In addition to including a color filter 192 disposed between the encapsulation unit 140 and the touch electrodes 152e and 154e, Figure 9 The organic light emitting diode display device shown includes Figure 3 The components of the organic light emitting diode display device shown in FIG. 1 are the same as those of the organic light emitting diode display device shown in FIG. Therefore, detailed descriptions of the same components will be omitted below.

[0079] The color filter 192 is formed between each of the touch sensing line 154 and the touch driving line 152 and the light emitting element 120. The distance between each of the touch sensing line 154 and the touch driving line 152 and the light emitting element 120 is increased by the color filter 192. Therefore, the capacitance of the parasitic capacitor formed between each of the touch sensing line 154 and the touch driving line 152 and the light emitting element 120 can be minimized, and the interaction caused by the coupling between each of the touch sensing line 154 and the touch driving line 152 and the light emitting element 120 can be prevented. In addition, the color filter 192 can prevent the chemical solution (for example, the developer or the etching solution) used in the process of manufacturing the touch sensing line 154 and the touch driving line 152, external moisture, etc. from entering the light emitting stack 124. Thus, the color filter 192 can prevent damage to the light emitting stack 124 that is susceptible to the chemical solution or moisture. At the same time, as Figure 9 As shown, the configuration in which the touch electrodes 152e and 154e are arranged above the color filter 192 has been described with the aid of the embodiment, but the color filter 192 may be arranged above the touch electrodes 152e and 154e. In this case, the touch electrodes 152e and 154e are arranged between the color filter 192 and the encapsulation unit 140.

[0080] A black matrix 194 is arranged between the color filters 192. The black matrix 194 is used to separate the sub-pixel areas from each other and prevent optical interference and light leakage between adjacent sub-pixel areas. The black matrix 194 can be formed of a high-impedance black insulating material, or can be formed by stacking color filters of at least two colors among the red (R), green (G), and blue (B) color filters 192. In addition, a touch planarization layer 196 is formed on the substrate 111 on which the color filters 192 and the black matrix 194 are formed. The touch planarization layer 196 flattens the substrate 111 on which the color filters 192 and the black matrix 194 are formed.

[0081] Meanwhile, in this disclosure, Figure 10 As shown, the first bridge 152b and the second bridge 154b may include a plurality of slits 153. Figure 3 Compared to the second bridge 154b shown without the slot 153, Figure 10 The second bridge 154b shown with the slit 153 can have a reduced surface area. This can reduce reflection of external light by the second bridge 154b, which can prevent degradation of visibility. Furthermore, while the present disclosure describes a mutual capacitance touch sensor formed between the intersecting touch sensing lines 154 and touch drive lines 152, the present disclosure can also be applied to a self-capacitance touch sensor Cs.

[0082] It is obvious from the above description that in the display device according to the present disclosure, a plurality of wirings respectively connected to a plurality of touch sensors are arranged on different planes so as to overlap with each other and are electrically connected to each other through a plurality of wiring contact holes. Thus, according to the present disclosure, connection failures between wirings can be prevented. In addition, in the present disclosure, the transparent conductive layer and the grid-shaped opaque conductive layer included in each touch electrode are formed by the same mask process. Thus, by reducing the number of mask processes, the manufacturing process can be simplified and the cost can be reduced. In addition, the conventional organic light emitting diode display device includes a touch screen attached thereto using an adhesive, while the organic light emitting diode display device of the present disclosure includes touch electrodes arranged on the packaging unit, which can make a separate attachment process unnecessary, resulting in a simplified manufacturing process and reduced costs.

[0083] Although various aspects of the present disclosure have been described in detail above with reference to the accompanying drawings, it will be apparent to those skilled in the art that the present disclosure described above is not limited to the above aspects, and various alternatives, modifications, and variations may be designed within the spirit and scope of the present disclosure.

[0084] The present invention provides the following technical solutions:

[0085] Solution 1. A display device comprising:

[0086] a light emitting element disposed on a substrate;

[0087] a packaging unit arranged on the light-emitting element;

[0088] a plurality of touch sensors disposed above the packaging unit; and

[0089] a plurality of wirings connected to the plurality of touch sensors and covering a side surface of the packaging unit,

[0090] The plurality of wirings are arranged on different planes to overlap each other and are electrically connected to each other through a plurality of wiring contact holes.

[0091] Solution 2. The display device according to Solution 1, wherein the plurality of wirings include:

[0092] a lower wiring arranged on the package unit; and

[0093] an upper wiring connected to the lower wiring through the plurality of wiring contact holes formed in a touch insulating layer covering the lower wiring; and

[0094] The upper wiring is arranged on the touch insulation layer and disposed along the lower wiring.

[0095] Solution 3. The display device according to Solution 2, wherein the plurality of touch sensors include touch sensing lines and touch driving lines arranged on the packaging unit to cross each other,

[0096] The touch drive line includes:

[0097] a plurality of first touch electrodes arranged on the package unit along a first direction; and a first bridge interconnecting the plurality of first touch electrodes,

[0098] The touch sensing line comprises:

[0099] a plurality of second touch electrodes arranged along a second direction crossing the first direction; and

[0100] a second bridge interconnecting the second touch electrodes,

[0101] wherein the lower wiring is formed of the same material as one of the first bridge and the second bridge,

[0102] The upper wiring extends from each of the first touch electrode and the second touch electrode.

[0103] Solution 4. The display device according to Solution 3 further includes a touch pad, the touch pad being arranged on at least one of a plurality of insulating layers and extending from the plurality of wirings, the plurality of insulating layers being arranged below the light emitting element.

[0104] The touch pad includes:

[0105] a lower pad electrode extending from the lower wiring; and

[0106] An upper pad electrode extends from the upper wiring.

[0107] Solution 5. The display device according to Solution 4, wherein at least one of the upper wiring, the upper pad electrode, the first bridge, the first touch electrode, and the second touch electrode includes a transparent conductive layer and an opaque conductive layer arranged on the transparent conductive layer.

[0108] wherein the transparent conductive layer has a structure including at least one layer formed of at least one of ITO, IZO, ZnO, and IGZO, and

[0109] The opaque conductive layer has a structure including at least one layer formed of at least one of Ti, Al, Mo, MoTi, Cu, and Ta.

[0110] Solution 6. The display device according to Solution 4, wherein the opaque conductive layer of the upper wiring and the upper pad electrode is arranged on or below a transparent conductive layer and has the same shape as that of the transparent conductive layer.

[0111] Solution 7. The display device according to Solution 4, wherein the first touch electrode, the second touch electrode, and the opaque conductive layer of the first bridge are provided on a transparent conductive layer and have a line width smaller than a line width of the transparent conductive layer.

[0112] Solution 8. The display device according to Solution 7, wherein the opaque conductive layer of at least one of the first touch electrode, the second touch electrode, and the first bridge has a mesh shape.

[0113] Solution 9. The display device according to Solution 3, wherein at least one of the first bridge and the second bridge includes at least one slit.

[0114] Solution 10. The display device according to Solution 1, further comprising a color filter arranged between the encapsulation unit and the touch sensor.

[0115] Solution 11. A display device comprising:

[0116] a light emitting element disposed on a substrate;

[0117] a packaging unit arranged on the light-emitting element;

[0118] a plurality of touch sensors arranged on the packaging unit;

[0119] a touch insulating layer arranged on the packaging unit;

[0120] a lower wiring arranged under the touch insulating layer having a plurality of wiring contact holes and covering a side surface of the package unit; and

[0121] an upper wiring arranged on the touch insulation layer along the lower wiring and connected to the lower wiring through the plurality of wiring contact holes;

[0122] The lower wiring and the upper wiring are arranged on different planes and overlap each other.

[0123] Solution 12. The display device according to Solution 11, wherein the plurality of touch sensors include:

[0124] a touch driving line having a plurality of first touch electrodes arranged on the package unit along a first direction and a first bridge interconnecting the plurality of first touch electrodes arranged on the package unit;

[0125] a touch sensing line having a plurality of second touch electrodes arranged in a second direction crossing the first direction and a second bridge interconnecting the second touch electrodes,

[0126] One of the first bridge and the second bridge is formed of the same material as the lower wiring, and the upper wiring extends from each of the first touch electrode and the second touch electrode.

[0127] Solution 13. The display device according to Solution 12 further includes a touch pad arranged on at least one of a plurality of insulating layers and extending from the upper wiring and the lower wiring, the plurality of insulating layers being arranged below the light emitting element.

[0128] The touch pad includes a lower pad electrode extending from the lower wiring and an upper pad electrode extending from the upper wiring.

[0129] Solution 14. The display device according to Solution 13, wherein at least one of the upper wiring, the upper pad electrode, the first bridge, the first touch electrode, and the second touch electrode includes a transparent conductive layer and an opaque conductive layer arranged on the transparent conductive layer.

[0130] wherein the transparent conductive layer has a structure including at least one layer formed of at least one of ITO, IZO, ZnO and IGZO, and the opaque conductive layer has a structure including at least one layer formed of at least one of Ti, Al, Mo, MoTi, Cu and Ta.

[0131] Solution 15. The display device according to Solution 14, wherein the opaque conductive layer of the upper wiring and the upper pad electrode is arranged on or below the transparent conductive layer and has the same shape as the transparent conductive layer.

[0132] Solution 16. The display device according to Solution 14, wherein the first touch electrode, the second touch electrode, and the opaque conductive layer of the first bridge are arranged on the transparent conductive layer and have a line width smaller than a line width of the transparent conductive layer.

[0133] Solution 17. The display device according to Solution 16, wherein the opaque conductive layer of at least one of the first touch electrode, the second touch electrode, and the first bridge has a grid shape.

[0134] Option 18. The display device according to Option 12, wherein at least one of the first bridge and the second bridge includes at least one slit.

[0135] Solution 19. The display device according to Solution 11, further comprising a color filter arranged between the encapsulation unit and the touch sensor.

[0136] Solution 20. A method for manufacturing a display device, comprising:

[0137] forming a light-emitting element on a substrate;

[0138] forming a packaging unit on the light-emitting element;

[0139] forming a plurality of touch sensors above the packaging unit; and

[0140] A plurality of wirings are formed, the plurality of wirings being connected to the plurality of touch sensors and covering a side surface of the package unit, wherein the plurality of wirings are arranged on different planes to overlap each other and are electrically connected to each other through a plurality of wiring contact holes.

Claims

1. A display device, comprising: a light emitting element disposed on a substrate, the substrate having an active region and an inactive region; an encapsulation unit disposed on the light-emitting element, wherein the encapsulation unit includes a plurality of inorganic encapsulation layers and at least one organic encapsulation layer; first and second touch electrodes and first and second bridges arranged above the packaging unit; as well as first wirings electrically connected to the first touch electrodes respectively; second wirings electrically connected to the second touch electrodes, respectively, wherein the first wiring and the second wiring are arranged along the side surface of the organic encapsulation layer, The first wiring and the second wiring include: a lower wiring arranged on the package unit; and an upper wiring connected to the lower wiring through a wiring contact hole passing through a touch insulating film arranged to cover the lower wiring, and wherein the upper wiring and the lower wiring overlap each other, wherein the touch insulating film is interposed between the upper wiring and the lower wiring, and The first touch electrode is arranged on the packaging unit along a first direction, the second touch electrode is arranged along a second direction different from the first direction, and the first touch electrode, the second touch electrode and the upper wiring are located on the same plane in a longitudinal cross-sectional view of the display device, and the first touch electrode and the second touch electrode are both located on the touch insulating film and on the same side of the touch insulating film. 2 . The display device of claim 1 , wherein the non-active region comprises a pad region and at least one dam, the at least one dam being disposed between the active region and the pad region.

3. The display device according to claim 1, The first bridge interconnects a plurality of first touch electrodes. as well as The second bridge interconnects the plurality of second touch electrodes. wherein the lower wiring is made of the same material as any one of the first bridge and the second bridge, and wherein the upper wiring extends from each of the first touch electrode and the second touch electrode.

4. The display device according to claim 3, comprising: a touch pad arranged on at least one of a plurality of insulating films in the pad region and extending from the first wiring and the second wiring, the plurality of insulating films being arranged below the light emitting element, The touch pad includes: a lower pad electrode extending from the lower wiring; and An upper pad electrode extends from the upper wiring.

5. The display device according to claim 4, wherein At least one of the upper wiring, the upper pad electrode, the first bridge, the first touch electrode, and the second touch electrode includes a transparent conductive layer and an opaque conductive layer disposed on the transparent conductive layer, wherein the transparent conductive layer is formed into a structure including at least one layer of at least one of ITO, IZO, ZnO and IGZO, and The opaque conductive layer is formed into a structure including at least one layer of at least one of Ti, Al, Mo, MoTi, Cu, and Ta. 6 . The display device according to claim 5 , wherein the opaque conductive layer of each of the upper wiring and the upper pad electrode is arranged on or below the transparent conductive layer and has the same shape as the transparent conductive layer. 7 . The display device according to claim 6 , wherein the first touch electrode, the second touch electrode, and the opaque conductive layer of the first bridge are formed on the transparent conductive layer and have a line width smaller than a line width of the transparent conductive layer. 8 . The display device of claim 7 , wherein the first touch electrode, the second touch electrode, and at least one opaque conductive layer in the first bridge and the second bridge have a mesh shape. 9 . The display device of claim 1 , wherein at least one of the first bridge and the second bridge includes at least one slit. 10 . The display device of claim 1 , further comprising a color filter disposed between the encapsulation unit and at least one of the first touch electrode, the second touch electrode, the first bridge, and the second bridge.

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