Substrate processing apparatus

Abstract

A substrate processing apparatus is provided. The substrate processing apparatus (1) includes a first conveyance section (6a) and a second conveyance section (6b). The second conveyance section (6b) is provided below the first conveyance section (6a). The first conveyance section (6a) includes a first conveyance space (61a), a first conveyance FFU (11, 12), and a first floor section (71). The first conveyance FFU (11, 12) is provided above the first conveyance space (61a). The first floor section (71) includes a plurality of first through holes. The first floor section (71) is provided below the first conveyance space (61a). The second conveyance section (6b) includes a second conveyance space (61b), a second conveyance FFU (13, 14), a second floor section (72), and an exhaust fan (73). The second conveyance FFU (13, 14) is provided below the first floor section (71). The second floor section (72) includes a plurality of second through holes. The second floor section (72) is provided below the second conveyance space (61b). The exhaust fan (73) is provided below the second floor section (72).

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate processing apparatus. BACKGROUND

[0002] A substrate processing apparatus is known that has an upper-stage processing block and a lower-stage processing block (see, for example, Patent Literature 1). The upper-stage processing block and the lower-stage processing block each have a processing unit that processes a substrate, and the substrate processing apparatus has a conveyance device that conveys a substrate to the processing unit on the upper-stage side and a conveyance device that conveys a substrate to the processing unit on the lower-stage side. The conveyance device on the upper-stage side travels within a conveyance space that adjoins the upper-stage processing block, and the conveyance device on the lower-stage side travels within a conveyance space that adjoins the lower-stage processing block. The conveyance space on the upper-stage side and the conveyance space on the lower-stage side are partitioned by a partition wall or the like.

[0003] [BACKGROUND ART LITERATURE]

[0004] [Patent Literature]

[0005] [Patent Literature 1] Japanese Patent Laid-Open No. 2016-201526 SUMMARY

[0006] [PROBLEMS TO BE SOLVED BY THE INVENTION]

[0007] However, the conveyance device traveling within the conveyance space on the upper-stage side sometimes causes turbulence in the airflow within the conveyance space on the upper-stage side. Likewise, the conveyance device traveling within the conveyance space on the lower-stage side sometimes causes turbulence in the airflow within the conveyance space on the lower-stage side. Therefore, it is necessary to suppress turbulence in the airflow within the conveyance space on the upper-stage side. Likewise, it is necessary to suppress turbulence in the airflow within the conveyance space on the lower-stage side.

[0008] The present application was made in view of the above-described problems, and aims to provide a substrate processing apparatus that can suppress turbulence in the airflow within the conveyance space on the upper-stage side and within the conveyance space on the lower-stage side.

[0009] [MEANS OF SOLVING THE PROBLEMS]

[0010] According to an aspect of the present application, a substrate processing apparatus processes a substrate. The substrate processing apparatus includes a processing section, a first conveyance section, and a second conveyance section. The processing section processes the substrate. The first conveyance section is adjacent to the processing section. The second conveyance section is adjacent to the processing section and is disposed below the first conveyance section. The first conveyance section includes a first substrate conveyance section, a first conveyance space, a first conveyance fan filter unit, and a first floor section. The first substrate conveyance section conveys the substrate. The first substrate conveyance section is housed in the first conveyance space. The first conveyance fan filter unit is disposed above the first conveyance space and supplies gas from above the first conveyance space toward below. The first floor section has a plurality of first through holes. The first floor section is disposed below the first conveyance space. The second conveyance section includes a second substrate conveyance section, a second conveyance space, a second conveyance fan filter unit, a second floor section, and an exhaust fan. The second substrate conveyance section conveys the substrate. The second substrate conveyance section is housed in the second conveyance space. The second conveyance fan filter unit is disposed below the first floor section and supplies gas from above the second conveyance space toward below. The second floor section has a plurality of second through holes. The second floor section is disposed below the second conveyance space. The exhaust fan is disposed below the second floor section. The exhaust fan exhausts gas that has passed through the plurality of second through holes.

[0011] In one embodiment, the first conveyance section further includes a first sidewall section adjacent to the processing section. The second conveyance section further includes a second sidewall section adjacent to the processing section. The second sidewall section is disposed below the first sidewall section. At least one of the first sidewall section and the second sidewall section further includes a gap forming section. The gap forming section forms a gap between the first sidewall section and the second sidewall section.

[0012] In one embodiment, at least one of the first conveyance section and the second conveyance section further includes an opening ratio adjusting member. The opening ratio adjusting member adjusts an opening ratio of the gap.

[0013] In one embodiment, the first conveyance section includes a plurality of the first conveyance fan filter units.

[0014] In one embodiment, the first substrate conveyance section includes a first conveyance robot that moves in the first conveyance space. The plurality of first conveyance fan filter units are arranged so as to cover a movement range of the first conveyance robot.

[0015] In one embodiment, the second conveyance section includes a plurality of the second conveyance fan filter units.

[0016] In one embodiment, the second substrate transfer unit includes a second transfer robot that moves within the second transfer space. The plurality of second transfer fan filter units are arranged so as to cover a movement range of the second transfer robot.

[0017] In one embodiment, the first transfer unit further includes a first rectifying portion provided in the first floor portion. The first rectifying portion rectifies gas that passes through the plurality of first through holes.

[0018] In one embodiment, the second transfer fan filter unit includes a fan, a box-shaped member, and a second rectifying portion. The box-shaped member supports the fan. The second rectifying portion is provided in the box-shaped member. The second rectifying portion rectifies gas that passes through the plurality of first through holes.

[0019] In one embodiment, the second transfer unit further includes a ceiling wall and a third rectifying portion. The second transfer fan filter unit is provided in the ceiling wall. The third rectifying portion is provided in the ceiling wall. The third rectifying portion rectifies gas that passes through the plurality of first through holes.

[0020] In one embodiment, the substrate processing apparatus further includes a transfer unit, a first path portion, and a second path portion. The transfer unit performs transfer-in and transfer-out of the substrate. The first path portion is provided between the transfer unit and the first transfer unit. The first path portion temporarily holds the substrate. The second path portion is provided between the transfer unit and the second transfer unit. The second path portion temporarily holds the substrate. The transfer unit includes a transfer transfer unit, a transfer space, and a transfer fan filter unit portion. The transfer transfer unit performs transfer-in and transfer-out of the substrate. The transfer space accommodates the transfer transfer unit. The transfer fan filter unit portion is provided above the transfer space and supplies gas from above the transfer space toward below.

[0021] In one embodiment, the transfer fan filter unit portion includes a first transfer fan filter unit and a second transfer fan filter unit. The first transfer fan filter unit is arranged on a side opposite to the first path portion and the second path portion. The second transfer fan filter unit is arranged on the side of the first path portion and the second path portion.

[0022] In one embodiment, the transfer unit further includes a first opening and a second opening. The first opening communicates with the first path portion. The second opening communicates with the second path portion. The second opening is provided below the first opening. The transfer fan filter unit portion further includes a third transfer fan filter unit. The third transfer fan filter unit is arranged on a side of the first transfer fan filter unit and the second transfer fan filter unit when the first opening and the second opening are viewed from the front.

[0023] In one embodiment, the carrier transfer space includes a first carrier transfer space and a second carrier transfer space. The second carrier transfer space is located on a side of the first carrier transfer space when the first opening and the second opening are viewed from the front. The uppermost portion of the first carrier transfer space is located higher than the uppermost portion of the second carrier transfer space. The first carrier transfer fan filter unit and the second carrier transfer fan filter unit supply gas from above the first carrier transfer space toward below. The third carrier transfer fan filter unit supplies gas from above the second carrier transfer space toward below.

[0024] In one embodiment, the carrier transfer conveyance section includes a carrier transfer robot and a guide rail. The carrier transfer robot conveys the substrate. The guide rail guides the carrier transfer robot in the vertical direction. The third carrier transfer fan filter unit is disposed on the side opposite the guide rail when the first opening and the second opening are viewed from the front.

[0025] In one embodiment, the exhaust fan generates an airflow from the carrier transfer space to the second conveyance space via the second passage section.

[0026] [Effects of the Invention]

[0027] According to the substrate processing apparatus of the present application, it is possible to suppress airflow turbulence in the upper conveyance space and airflow turbulence in the lower conveyance space. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 FIG. 1 is a perspective view showing the overall configuration of a substrate processing apparatus according to Embodiment 1 of the present application.

[0029] Figure 2 FIG. 2 is an exploded perspective view of the substrate processing apparatus according to Embodiment 1 of the present application.

[0030] Figure 3 FIG. 3 is a side view showing the internal configuration of the substrate processing apparatus according to Embodiment 1 of the present application.

[0031] Figure 4 FIG. 4 is a plan view showing the internal configuration of the substrate processing apparatus according to Embodiment 1 of the present application.

[0032] Figure 5 FIG. 5 is a side view showing the internal configuration of a conveyance block of the substrate processing apparatus.

[0033] Figure 6 FIG. 6 is a perspective view showing a carrier transfer block and a passage block of the substrate processing apparatus.

[0034] Figure 7 FIG. 7 is another side view showing the internal configuration of the substrate processing apparatus according to Embodiment 1 of the present application.

[0035] Figure 8 is a front view showing the internal configuration of a transfer block of a substrate processing apparatus.

[0036] Figure 9 is a perspective view showing a transfer block of a substrate processing apparatus.

[0037] Figure 10 In (a), a cross section of an upper-stage side wall portion and a lower-stage side wall portion is shown. In (b), a perspective view of the opening ratio adjustment member is shown.

[0038] Figure 11 In (a), another cross section of an upper-stage side wall portion and a lower-stage side wall portion is shown. In (b), a perspective view of the opening ratio adjustment member in another state is shown.

[0039] Figure 12 is a view showing a part of the transfer block of the substrate processing apparatus of Embodiment 2 of the present application, which is enlarged.

[0040] Figure 13 is another view showing a part of the transfer block of the substrate processing apparatus of Embodiment 2 of the present application, which is enlarged. DETAILED DESCRIPTION

[0041] Hereinafter, with reference to the drawings ( Figures 1-13 ), an embodiment of a substrate processing apparatus of the present application will be described. However, the present application is not limited to the following embodiment. Further, for parts where the explanation is repeated, the explanation will be appropriately omitted. In addition, in the drawings, the same reference numerals are attached to the same or equivalent parts, and the explanation will not be repeated.

[0042] In the present specification, for the convenience of understanding, the X direction, the Y direction, and the Z direction orthogonal to each other are sometimes described. Typically, the X direction and the Y direction are parallel to the horizontal direction, and the Z direction is parallel to the vertical direction. However, it is not intended that the orientation of the substrate processing apparatus of the present application in use is limited by the definition of these directions.

[0043] The "substrate" in the present embodiment can be applied to various substrates such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a substrate for a FED (Field Emission Display), a substrate for an optical disc, a substrate for a magnetic disc, and a substrate for a magneto-optical disc. Hereinafter, the present embodiment will be described mainly using a substrate processing apparatus used in the processing of a circular disc-shaped semiconductor wafer as an example, but can be equally applied to the processing of the various substrates exemplified above. In addition, the shape of the substrate can be applied to various shapes.

[0044] [Embodiment 1]

[0045] Hereinafter, the description will be given with reference to the drawings. Figures 1-11 Embodiment 1 of the present application will be described. First, the description will be given with reference to Figure 1 The substrate processing apparatus 1 of the present embodiment will be described. Figure 1 is a perspective view showing the overall configuration of the substrate processing apparatus 1 of the present embodiment. The substrate processing apparatus 1 processes a substrate W. As shown in Figure 1 The substrate processing apparatus 1 has a transfer block 3, a path block 4, a processing block 5, a conveyance block 6, and a multifunction block 7.

[0046] The transfer block 3 has a carrier placement portion 31. In the present embodiment, the transfer block 3 has four carrier placement portions 31. The carrier C is placed on the carrier placement portion 31. The carrier C accommodates a plurality of (for example, 25) substrates W in a stacked manner. The carrier C is, for example, a FOUP (Front Opening Unified Pod). Hereinafter, the carrier C placed on the carrier placement portion 31 will be described as "carrier C".

[0047] The transfer block 3 conveys the substrate W before processing, which is accommodated in the carrier C, to the inside space of the transfer block 3. In addition, the transfer block 3 conveys the substrate W after processing from the inside space of the transfer block 3 to the outside. Specifically, the transfer block 3 accommodates the substrate W after processing in the carrier C. The transfer block 3 is an example of a transfer portion.

[0048] The path block 4 is provided between the transfer block 3 and the conveyance block 6. The transfer block 3, the path block 4, and the conveyance block 6 are arranged in the X direction. Specifically, the path block 4 is arranged on the -X side of the transfer block 3, and the conveyance block 6 is arranged on the -X side of the path block 4.

[0049] In the path block 4, the substrate W before processing and the substrate W after processing are temporarily placed. The transfer block 3 conveys the substrate W before processing from the carrier C to the path block 4. In addition, the transfer block 3 conveys the substrate W after processing from the path block 4 to the carrier C. Further, the path block 4 can also have a mechanism that flips the front surface and the back surface of the substrate W.

[0050] The conveyance block 6 is adjacent to the processing block 5. The conveyance block 6 conveys the substrate W before processing from the path block 4 to the processing block 5. In addition, the conveyance block 6 conveys the substrate W after processing from the processing block 5 to the path block 4.

[0051] The processing block 5 processes the substrate W. The processing block 5, for example, cleans the substrate W. The processing block 5 is an example of a processing portion. The multifunction block 7 supplies a processing liquid to the processing block 5. The processing liquid contains a chemical liquid. The processing liquid can also contain DIW (deionized water). The multifunction block 7 can further supply a gas such as nitrogen or air to the processing block 5.

[0052] The substrate processing apparatus 1 of the present embodiment has two processing blocks 5. The two processing blocks 5 are adjacent to the conveyance block 6. Specifically, one of the two processing blocks 5 is disposed on the -Y side with respect to the conveyance block 6, and the other of the two processing blocks 5 is disposed on the +Y side with respect to the conveyance block 6. Hereinafter, the processing block 5 disposed on the -Y side with respect to the conveyance block 6 will be referred to as the "-Y side processing block 5", and the processing block 5 disposed on the +Y side with respect to the conveyance block 6 will be referred to as the "+Y side processing block 5".

[0053] Next, the substrate processing apparatus 1 of the present embodiment will be further described with reference to Figure 2 . Figure 2 is an exploded perspective view of the substrate processing apparatus 1 of the present embodiment.

[0054] As shown in Figure 2 , the two processing blocks 5 each include a tower unit TW including a plurality of processing units 2 stacked in the vertical direction (Z direction). In the present embodiment, the -Y side processing block 5 includes two tower units TW1, TW3, and the +Y side processing block 5 includes two tower units TW2, TW4. The two tower units TW1, TW3 are disposed in the X direction. Specifically, the tower unit TW3 is disposed on the -X side of the tower unit TW1. Similarly, the two tower units TW2, TW4 are disposed in the X direction. Specifically, the tower unit TW4 is disposed on the -X side of the tower unit TW2.

[0055] In the present embodiment, each of the tower units TW1 to TW4 has four processing units 2. Hereinafter, the four tower units TW1 to TW4 will be sometimes referred to as "1st tower unit TW1 to 4th tower unit TW4", respectively.

[0056] Next, the substrate processing apparatus 1 of the present embodiment will be further described with reference to Figure 3 . Figure 3 is a side view showing the internal configuration of the substrate processing apparatus 1 of the present embodiment. Specifically, Figure 3 shows the internal configuration of the substrate processing apparatus 1 as viewed from the +Y side. First, the conveyance block 3 and the path block 4 will be described with reference to Figure 3 .

[0057] As shown in Figure 3 , the conveyance block 3 has a conveyance space 3a and a conveyance conveyance unit 32. The path block 4 has an upper path unit 41 and a lower path unit 42. The upper path unit 41 is disposed above (on the +Z side of) the lower path unit 42.

[0058] In the upper-stage path portion 41, the substrate W before processing and the substrate W after processing are temporarily placed. Similarly, in the lower-stage path portion 42, the substrate W before processing and the substrate W after processing are temporarily placed. Further, the upper-stage path portion 41 can also have a mechanism that flips the front surface and the back surface of the substrate W. Similarly, the lower-stage path portion 42 can also have a mechanism that flips the front surface and the back surface of the substrate W. The upper-stage path portion 41 is an example of the first path portion, and the lower-stage path portion 42 is an example of the second path portion.

[0059] The transfer conveyance portion 32 is housed in the transfer space 3a. The transfer conveyance portion 32 conveys the substrate W before processing housed in the carrier C into the transfer space 3a. In addition, the transfer conveyance portion 32 conveys the substrate W after processing from the transfer space 3a to the outside. Specifically, the transfer conveyance portion 32 houses the substrate W after processing in the carrier C.

[0060] In addition, the transfer conveyance portion 32 conveys the substrate W before processing to the upper-stage path portion 41 and the lower-stage path portion 42. The transfer conveyance portion 32 conveys the substrate W after processing from the upper-stage path portion 41 and the lower-stage path portion 42 to the carrier C.

[0061] More specifically, the transfer conveyance portion 32 has a transfer conveyance robot 33 that conveys the substrate W, and a guide rail 34. The guide rail 34 guides the transfer conveyance robot 33 in the vertical direction (Z direction).

[0062] The transfer conveyance robot 33 ascends and descends along the guide rail 34. Specifically, the transfer conveyance robot 33 ascends and descends between a position that can access the carrier C, a position that can access the upper-stage path portion 41, and a position that can access the lower-stage path portion 42.

[0063] The transfer conveyance robot 33 moves to the position that can access the carrier C, and takes out the substrate W before processing from the carrier C. In addition, the transfer conveyance robot 33 moves to the position that can access the carrier C, and houses the substrate W after processing in the carrier C.

[0064] The transfer conveyance robot 33 moves to the position that can access the upper-stage path portion 41, and places the substrate W before processing on the upper-stage path portion 41. In addition, the transfer conveyance robot 33 moves to the position that can access the upper-stage path portion 41, and takes out the substrate W after processing from the upper-stage path portion 41.

[0065] The transfer conveyance robot 33 moves to the position that can access the lower-stage path portion 42, and places the substrate W before processing on the lower-stage path portion 42. In addition, the transfer conveyance robot 33 moves to the position that can access the lower-stage path portion 42, and takes out the substrate W after processing from the lower-stage path portion 42.

[0066] Next, the path block 4 and the conveyance block 6 will be further described with reference to Figure 3 , as shown in FIG. 1. The path block 4 has a first path portion 41 and a second path portion 42.Figure 3 As shown, the conveying block 6 includes an upper conveying section 6a and a lower conveying section 6b. The lower conveying section 6b is located below the upper conveying section 6a (on the -Z side). The upper path section 41 is located between the transfer block 3 and the upper conveying section 6a. The lower path section 42 is located between the transfer block 3 and the lower conveying section 6b.

[0067] For reference Figure 1 As explained, the transport block 6 is adjacent to the processing block 5. Therefore, the upper transport section 6a and the lower transport section 6b are adjacent to the processing block 5. The upper transport section 6a is an example of the first transport section, and the lower transport section 6b is an example of the second transport section.

[0068] In detail, the upper conveyor section 6a is adjacent to the two upper processing units 2 of the first tower unit TW1 and the two upper processing units 2 of the third tower unit TW3. The upper conveyor section 6a is also adjacent to the two upper processing units 2 of the second tower unit TW2 (see reference). Figure 2 ), and the two processing units 2 above tower unit TW4 (refer to Figure 2 (Adjacent). Hereinafter, the two processing units 2 contained in the first tower unit TW1 to the fourth tower unit TW4 are sometimes referred to as "the processing unit 2 of the upper section".

[0069] The lower conveyor section 6b is adjacent to the next two processing units 2 of tower unit TW1 and the next two processing units 2 of tower unit TW3. The lower conveyor section 6b is also adjacent to the next two processing units 2 of tower unit TW2 (see reference). Figure 2 ), and the next two processing units 2 of tower unit TW4 (refer to Figure 2 (Adjacent). Hereinafter, the next two processing units 2 contained in the first tower unit TW1 to the fourth tower unit TW4 are sometimes referred to as "the processing unit 2 of the next segment".

[0070] The upper transport section 6a includes an upper substrate transport section 50a for transporting substrate W and an upper transport space 61a. The upper substrate transport section 50a is housed within the upper transport space 61a. The upper substrate transport section 50a transports substrate W between each of the upper processing units 2 and the upper path section 41. The upper substrate transport section 50a is an example of a first substrate transport section, and the upper transport space 61a is an example of a first transport space.

[0071] The upper-stage substrate transfer unit 50a has an upper-stage transfer robot 51a, a fixed frame 52a, and a movable frame 53a. The upper-stage transfer robot 51a moves within the upper-stage transfer space 61a. In detail, the upper-stage transfer robot 51a is supported by the fixed frame 52a and the movable frame 53a so as to be movable in and out of all the upper-stage processing units 2 and the upper-stage path unit 41. Specifically, the fixed frame 52a supports the movable frame 53a so as to be movable in the X direction, and the movable frame 53a supports the upper-stage transfer robot 51a so as to be movable in the vertical direction (Z direction). Thus, the upper-stage transfer robot 51a moves in the X direction and the Z direction (vertical direction). The upper-stage transfer robot 51a is an example of the first transfer robot.

[0072] The lower-stage substrate transfer unit 6b has a lower-stage substrate transfer unit 50b that transfers the substrate W, and a lower-stage transfer space 61b. The lower-stage substrate transfer unit 50b is housed in the lower-stage transfer space 61b. The lower-stage substrate transfer unit 50b transfers the substrate W between each of the lower-stage processing units 2 and the lower-stage path unit 42. The lower-stage substrate transfer unit 50b is an example of the second substrate transfer unit, and the lower-stage transfer space 61b is an example of the second transfer space.

[0073] The lower-stage substrate transfer unit 50b has a lower-stage transfer robot 51b, a fixed frame 52b, and a movable frame 53b. The lower-stage transfer robot 51b moves within the lower-stage transfer space 61b. In detail, the lower-stage transfer robot 51b is supported by the fixed frame 52b and the movable frame 53b so as to be movable in and out of all the lower-stage processing units 2 and the lower-stage path unit 42. Specifically, the fixed frame 52b supports the movable frame 53b so as to be movable in the X direction, and the movable frame 53b supports the lower-stage transfer robot 51b so as to be movable in the vertical direction (Z direction). Thus, the lower-stage transfer robot 51b moves in the X direction and the Z direction (vertical direction). The lower-stage transfer robot 51b is an example of the second transfer robot.

[0074] Next, the upper-stage transfer robot 51a and the lower-stage transfer robot 51b will be described with reference to FIG. 6. Figure 3 The upper-stage transfer robot 51a has a base portion 54, a swivel base 55, and an arm 56. The base portion 54 is supported by the movable frame 53a. The swivel base 55 is supported by the base portion 54 so as to be swivelable in the horizontal plane with respect to the base portion 54. The arm 56 is supported by the swivel base 55 so as to be movable in and out in the horizontal plane with respect to the swivel base 55. The lower-stage transfer robot 51b also has the base portion 54, the swivel base 55, and the arm 56 like the upper-stage transfer robot 51a. The lower-stage transfer robot 51b has the same configuration as the upper-stage transfer robot 51a, and thus the description thereof will be omitted.

[0075] Next, the upper-stage transfer robot 51a and the lower-stage transfer robot 51b will be described with reference to FIG. 6. Figure 4Further explanation will be given of the substrate processing apparatus 1 of the present embodiment. Figure 4 is a plan view showing the internal configuration of the substrate processing apparatus 1 of the present embodiment. In detail, Figure 4 shows the internal configuration of the substrate processing apparatus 1 as viewed from the +Z side. First, reference will be made to Figure 4 for explanation of the transport carrying section 32.

[0076] As shown in Figure 4 , the guide rail 34 is disposed in the vicinity of the path block 4. In detail, the guide rail 34 is disposed laterally of the center of the path block 4 in the Y direction. In the present embodiment, the guide rail 34 is disposed on the +Y side with respect to the center of the path block 4 in the Y direction. More specifically, the guide rail 34 is disposed at a position in the path block 4 that does not overlap the placement position of the substrate W as viewed from the carrier placement section 31 (+X side).

[0077] The transport carrying robot 33 has a base section 35, a multi-joint arm 36, and a hand 37. The base section 35 is supported by the guide rail 34 so as to be freely raised and lowered in the vertical direction (Z direction). The base section 35 is raised and lowered in the vertical direction (Z direction) along the guide rail 34. The multi-joint arm 36 is supported by the base section 35. The hand 37 is supported by the front end of the multi-joint arm 36. The multi-joint arm 36 moves the hand 37 in the X direction and the Y direction.

[0078] Next, reference will be made to Figure 4 for explanation of the processing unit 2. As shown in Figure 4 , the processing unit 2 is provided with, for example, a suction chuck 21, a baffle 23, and a processing nozzle 25. The suction chuck 21 adsorbs the substrate W by vacuum suction. The suction chuck 21 is rotationally driven by a not-shown electric motor. Thereby, the substrate W is rotated in the horizontal plane. The processing nozzle 25 processes the substrate W by supplying a processing liquid to the substrate W. The baffle 23 is disposed around the suction chuck 21 in a manner of surrounding the suction chuck 21. The baffle 23 prevents the processing liquid supplied to the substrate W from the processing nozzle 25 from flying around.

[0079] Next, reference will be made to Figure 5 for further explanation of the substrate processing apparatus 1 of the present embodiment. Figure 5 is a side view showing the internal configuration of the carrying block 6 of the substrate processing apparatus 1. In detail, Figure 5 shows the internal configuration of the carrying block 6 as viewed from the +Y side. Further, Figure 5 , the upper-stage substrate carrying section 50a and the lower-stage substrate carrying section 50b are not shown for ease of understanding.

[0080] As shown in Figure 5As shown, the upper-stage conveyance section 6a also has two upper-stage FFUs (fan filter units) 11, 12 and a plurality of upper-stage punched plates 71. In addition, the lower-stage conveyance section 6b also has two lower-stage FFUs 13, 14, a plurality of lower-stage punched plates 72, and a plurality of exhaust fans 73.

[0081] The two upper-stage FFUs 11, 12 are disposed above the upper-stage conveyance space 61a. The two upper-stage FFUs 11, 12 are arranged in the X direction. Specifically, the two upper-stage FFUs 11, 12 are arranged in such a manner as to cover the range of movement of the upper-stage conveyance robot 51a in the X direction. Figure 3 The two upper-stage FFUs 11, 12 are arranged in such a manner as to cover the range of movement of the upper-stage conveyance robot 51a in the X direction.

[0082] The two upper-stage FFUs 11, 12 supply gas from above toward below of the upper-stage conveyance space 61a, and a downflow is generated in the upper-stage conveyance space 61a. Specifically, the two upper-stage FFUs 11, 12 suck air in the clean room of the substrate processing apparatus 1 and supply the air to the upper-stage conveyance space 61a. The uniformity of the wind speed in the upper-stage conveyance space 61a is improved due to the downflow generated in the upper-stage conveyance space 61a. As a result, the cleanliness of the upper-stage conveyance space 61a is improved. The two upper-stage FFUs 11, 12 are an example of the first conveyance fan filter unit. More specifically, the two upper-stage FFUs 11, 12 each have a fan 112, a box-shaped member 111, and a filter. The fan 112 is supported on the upper portion of the box-shaped member 111. The fan 112 sucks air in the clean room. The air sucked by the fan 112 is diffused in the internal space of the box-shaped member 111 and flows out of the box-shaped member 111 through the filter.

[0083] The plurality of upper-stage punched plates 71 are disposed below the upper-stage conveyance space 61a. The upper-stage punched plate 71 has a plurality of through-holes that pass through the upper-stage punched plate 71 in the up-down direction. The gas supplied to the upper-stage conveyance space 61a from the two upper-stage FFUs 11, 12 flows in the upper-stage conveyance space 61a from above toward below and then passes through the through-holes of the upper-stage punched plate 71. The plurality of upper-stage punched plates 71 are an example of the first floor portion, and the through-holes of the upper-stage punched plate 71 are an example of the first through-holes.

[0084] The two lower-stage FFUs 13, 14 are disposed above the lower-stage conveyance space 61b. The two lower-stage FFUs 13, 14 are arranged in the X direction. Specifically, the two lower-stage FFUs 13, 14 are arranged in such a manner as to cover the range of movement of the lower-stage conveyance robot 51b in the X direction. Figure 3 The two lower-stage FFUs 13, 14 are arranged in such a manner as to cover the range of movement of the lower-stage conveyance robot 51b in the X direction.

[0085] The two lower-stage FFUs 13 and 14 supply gas from above toward below of the lower-stage conveyance space 61b, and a downflow is generated in the lower-stage conveyance space 61b. Specifically, the two lower-stage FFUs 13 and 14 suck gas that has passed through the through-holes of the plurality of upper-stage punched plates 71 and supply the gas to the lower-stage conveyance space 61b. The uniformity of the wind speed in the lower-stage conveyance space 61b is improved because of the downflow generated in the lower-stage conveyance space 61b. As a result, the cleanliness of the lower-stage conveyance space 61b is improved. In addition, the lower-stage FFUs 13 and 14 exhaust gas from the upper-stage conveyance space 61a to the lower-stage conveyance space 61b. Therefore, it is possible to exhaust gas from the upper-stage conveyance space 61a without using the exhaust resources of the factory in which the substrate processing apparatus 1 is installed. The two lower-stage FFUs 13 and 14 are examples of the second conveyance fan filter units. Furthermore, the two lower-stage FFUs 13 and 14 each have a fan, a box-shaped member, and a filter, like the upper-stage FFUs 11 and 12. The configurations of the lower-stage FFUs 13 and 14 are the same as those of the upper-stage FFUs 11 and 12, and thus the description thereof is omitted.

[0086] A plurality of lower-stage punched plates 72 is provided below the lower-stage conveyance space 61b. The lower-stage punched plate 72 has a plurality of through-holes that pass through the lower-stage punched plate 72 in the vertical direction. The gas supplied to the lower-stage conveyance space 61b from the two lower-stage FFUs 13 and 14 flows from above to below in the lower-stage conveyance space 61b and then passes through the through-holes of the lower-stage punched plate 72. The plurality of lower-stage punched plates 72 is an example of the second floor portion, and the through-holes of the lower-stage punched plate 72 are an example of the second through-holes.

[0087] A plurality of exhaust fans 73 is provided below the plurality of lower-stage punched plates 72 and exhausts the gas that has passed through the through-holes of the plurality of lower-stage punched plates 72 to the outside of the conveyance block 6. More specifically, the plurality of exhaust fans 73 exhausts the gas to the outside of the substrate processing apparatus 1. Therefore, it is possible to exhaust gas from the lower-stage conveyance space 61b without using the exhaust resources of the factory in which the substrate processing apparatus 1 is installed.

[0088] According to the present embodiment, the downflow (airflow) generated in the upper-stage conveyance space 61a by the upper-stage FFUs 11 and 12 is sucked by the lower-stage FFUs 13 and 14 via the upper-stage punched plates 71, and thus even if the upper-stage conveyance robot 51a moves in the upper-stage conveyance space 61a, it is possible to suppress the downflow (airflow) generated in the upper-stage conveyance space 61a from being disturbed by the movement of the upper-stage conveyance robot 51a. Similarly, the downflow (airflow) generated in the lower-stage conveyance space 61b by the lower-stage FFUs 13 and 14 is sucked by the exhaust fans 73 via the lower-stage punched plates 72, and thus even if the lower-stage conveyance robot 51b moves in the lower-stage conveyance space 61b, it is possible to suppress the downflow (airflow) generated in the lower-stage conveyance space 61b from being disturbed by the movement of the lower-stage conveyance robot 51b.

[0089] Further, according to the present embodiment, the upper stage conveyance section 6a is provided with two upper stage FFUs 11, 12, and thus can stably generate the downflow in a wide range of the upper stage conveyance space 61a. Similarly, the lower stage conveyance section 6b is provided with two lower stage FFUs 13, 14, and thus can stably generate the downflow in a wide range of the lower stage conveyance space 61b.

[0090] Further, according to the present embodiment, the two upper stage FFUs 11, 12 are arranged so as to cover the movement range of the upper stage conveyance robot 51a, and thus the downflow (airflow) generated in the upper stage conveyance space 61a can be further suppressed from being disturbed. Similarly, the two lower stage FFUs 13, 14 are arranged so as to cover the movement range of the lower stage conveyance robot 51b, and thus the downflow (airflow) generated in the lower stage conveyance space 61b can be further suppressed from being disturbed.

[0091] Next, the substrate processing apparatus 1 according to the present embodiment will be further described with reference to Figures 6-8 . Figure 6 is a perspective view showing the transfer block 3 and the path block 4 of the substrate processing apparatus 1.

[0092] As shown in Figure 6 , the transfer block 3 is further provided with a transfer FFU section 15. The transfer FFU section 15 is arranged above the transfer space 3a described with reference to Figure 3 . The transfer FFU section 15 supplies gas from above toward below of the transfer space 3a, and generates a downflow in the transfer space 3a.

[0093] More specifically, the transfer FFU section 15 has a first transfer FFU 16, a second transfer FFU 17, and a third transfer FFU 18. The first transfer FFU 16 and the second transfer FFU 17 suck air in a clean room of the substrate processing apparatus 1 and supply it to the transfer space 3a. Further, the first transfer FFU 16, the second transfer FFU 17, and the third transfer FFU 18 each have a fan 112, a box-shaped member 111, and a filter, like the upper stage FFUs 11, 12. The first transfer FFU 16, the second transfer FFU 17, and the third transfer FFU 18 have the same configuration as the upper stage FFUs 11, 12, and thus the description thereof will be omitted.

[0094] The first transfer FFU 16 is arranged on the side opposite to the path block 4, and the second transfer FFU 17 is arranged on the side of the path block 4. In other words, the first transfer FFU 16 is arranged on the side opposite to the upper stage path section 41 and the lower stage path section 42 described with reference to Figure 3 . The second transfer FFU 17 is arranged on the side of the upper stage path section 41 and the lower stage path section 42 described with reference to Figure 3 . As for the third transfer FFU 18, the description will be made later. Figure 8 ​

[0095] Figure 7 is another side view showing the internal configuration of the substrate processing apparatus 1 of the present embodiment. Specifically, Figure 7 shows the internal configuration of the substrate processing apparatus 1 as viewed from the +Y side. Further, in Figure 7 , the transport carrying section 32, the upper-stage substrate carrying section 50a, and the lower-stage substrate carrying section 50b are not shown for the sake of understanding.

[0096] As shown in Figure 6 and Figure 7 , the upper-stage path section 41 has an upper-stage opening 41a and an upper-stage path space 41b, and the lower-stage path section 42 has a lower-stage opening 42a and a lower-stage path space 42b. The upper-stage path space 41b communicates with the upper-stage carrying space 61a via the upper-stage opening 41a. The lower-stage path space 42b communicates with the lower-stage carrying space 61b via the lower-stage opening 42a.

[0097] Further, as shown in Figure 7 , the transport block 3 has a first opening 3b and a second opening 3c. The first opening 3b communicates with the upper-stage path space 41b of the upper-stage path section 41. Thus, the transport space 3a communicates with the upper-stage path space 41b via the first opening 3b. The second opening 3c is provided below the first opening 3b and communicates with the lower-stage path space 42b of the lower-stage path section 42. Thus, the transport space 3a communicates with the lower-stage path space 42b via the second opening 3c.

[0098] According to the present embodiment, the transport block 3 is provided with the first transport FFU 16 and the second transport FFU 17, and thus a downflow can be generated on the side of the carrier placement section 31 and on the side of the path block 4 in the transport space 3a. Further, by generating a downflow on the side of the path block 4 with the second transport FFU 17, an air current flowing from the transport space 3a to the upper-stage carrying space 61a and the lower-stage carrying space 61b via the upper-stage path space 41b and the lower-stage path space 42b can be generated.

[0099] Next, the exhaust fan 73 will be further described with reference to Figure 7 . In the present embodiment, the exhaust fan 73 is driven at an exhaust amount that sucks the gas in the lower-stage path space 42b of the lower-stage path section 42. Thus, by the driving of the exhaust fan 73, the gas in the lower-stage path space 42b of the lower-stage path section 42 flows to the lower-stage carrying space 61b. As a result, the gas flows from the transport space 3a to the lower-stage carrying space 61b via the lower-stage path space 42b. That is, the exhaust fan 73 generates an air current flowing from the transport space 3a to the lower-stage carrying space 61b via the lower-stage path space 42b. According to the present embodiment, the air current flowing from the transport space 3a to the lower-stage carrying space 61b via the lower-stage path space 42b can be more reliably generated.

[0100] Next, referring to Figure 6 and Figure 8 , the conveyance FFU section 15 will be further described. Figure 8 is a front view showing the internal configuration of the conveyance block 3 of the substrate processing apparatus 1. In detail, Figure 8 shows the internal configuration of the conveyance block 3 when viewed from the +X side. Further, Figure 8 In the drawings, the conveyance transfer robot 33 is not shown for the sake of convenience of understanding.

[0101] As shown in Figure 6 and Figure 8 , the third conveyance FFU 18 is provided inside the conveyance block 3. In detail, the third conveyance FFU 18 is disposed on the side (-Y side) of the first conveyance FFU 16 and the second conveyance FFU 17 when the first opening 3b and the second opening 3c are viewed from the front. Thus, according to the present embodiment, the downflow can be generated in a wider range of the conveyance space 3a by the conveyance FFU section 15.

[0102] In detail, the conveyance block 3 further has an electrical component group 38. In addition, the conveyance space 3a includes a first conveyance space 3al and a second conveyance space 3a2.

[0103] The electrical component group 38 includes a plurality of electrical components. The electrical component group 38 is disposed on the side (-Y side) of the first opening 3b and the second opening 3c when the first opening 3b and the second opening 3c are viewed from the front.

[0104] The second conveyance space 3a2 is a space below the electrical component group 38, and the first conveyance space 3al is the remaining space. Thus, the second conveyance space 3a2 is located on the side (-Y side) of the first conveyance space 3al when the first opening 3b and the second opening 3c are viewed from the front, and the uppermost portion of the first conveyance space 3al is located higher than the uppermost portion of the second conveyance space 3a2.

[0105] The first conveyance FFU 16 and the second conveyance FFU 17 are disposed above the first conveyance space 3al. The first conveyance FFU 16 and the second conveyance FFU 17 supply gas from above the first conveyance space 3al toward the lower side, and generate downflow in the first conveyance space 3al.

[0106] The gas flow (downflow) generated by the first conveyance FFU 16 and the second conveyance FFU 17 is difficult to reach the space below the electrical component group 38 (the second conveyance space 3a2). The third conveyance FFU 18 is disposed below the electrical component group 38. The third conveyance FFU 18 supplies gas from above the second conveyance space 3a2 toward the lower side, and generates downflow in the second conveyance space 3a2.

[0107] According to the present embodiment, the transport block 3 is provided with the third transport FFU 18, and thus can more surely generate a downdraft in a space (second transport space 3a2) that is difficult for the airflow (downdraft) generated by the first transport FFU 16 and the second transport FFU 17 to reach in the transport space 3a.

[0108] In addition, in the present embodiment, the third transport FFU 18 is disposed on the side opposite the guide rail 34 when the first opening 3b and the second opening 3c are viewed from the front. Specifically, as shown in Figure 8 , the guide rail 34 is disposed so as to overlap with the end of the first opening 3b and the second opening 3c on the (+Y side) when the first opening 3b and the second opening 3c are viewed from the front. The guide rail 34 extends in the up-down direction (Z direction), and thus the airflow generated by the first transport FFU 16 and the second transport FFU 17 easily flows along the guide rail 34 in the up-down direction (Z direction). On the other hand, in the second transport space 3a2 (the space on the side opposite the guide rail 34), even if the airflow generated by the first transport FFU 16 and the second transport FFU 17 flows in, the airflow spreads out, and it is difficult to generate a downdraft.

[0109] According to the present embodiment, since the third transport FFU 18 generates a downdraft in the second transport space 3a2, in the transport space 3a, the space in which it is difficult to generate a downdraft can be reduced.

[0110] Next, the substrate processing apparatus 1 of the present embodiment will be further described with reference to Figure 5 , Figure 7 , and Figures 9-11 . Figure 9 is a perspective view showing the transport block 6 of the substrate processing apparatus 1. As shown in Figure 9 , the upper-stage transport section 6a has an upper-stage side wall section 611, and the lower-stage transport section 6b has a lower-stage side wall section 612. The lower-stage side wall section 612 is disposed below the upper-stage side wall section 611, and the upper-stage side wall section 611 and the lower-stage side wall section 612 are contiguous with the processing block 5 described with reference to Figure 1 and Figure 2 . The upper-stage side wall section 611 is an example of a first side wall section, and the lower-stage side wall section 612 is an example of a second side wall section. More specifically, the upper-stage side wall section 611 includes an upper-stage side wall section 611 on the +Y side and an upper-stage side wall section 611 on the -Y side. The upper-stage side wall section 611 on the +Y side constitutes a side wall on the +Y side of the upper-stage transport section 6a, and the upper-stage side wall section 611 on the -Y side constitutes a side wall on the -Y side of the upper-stage transport section 6a. Similarly, the lower-stage side wall section 612 includes a lower-stage side wall section 612 on the +Y side and a lower-stage side wall section 612 on the -Y side. The lower-stage side wall section 612 on the +Y side constitutes a side wall on the +Y side of the lower-stage transport section 6b, and the lower-stage side wall section 612 on the -Y side constitutes a side wall on the -Y side of the lower-stage transport section 6b.

[0111] Figure 10 (a) is a view showing the cross section of the upper-stage side wall portion 611 and the lower-stage side wall portion 612. In detail, Figure 10 (a) shows the cross section of the upper-stage side wall portion 611 on the +Y side and the cross section of the lower-stage side wall portion 612 on the +Y side.

[0112] As Figure 10 (a) shows, the upper-stage side wall portion 611 has an upper-stage gap forming portion 611a, and the lower-stage side wall portion 612 has a lower-stage gap forming portion 612a. The upper-stage gap forming portion 611a and the lower-stage gap forming portion 612a face each other in the up-and-down direction (Z direction), and a gap 63 is formed between the upper-stage gap forming portion 611a and the lower-stage gap forming portion 612a. The gap 63 communicates with the space of the lower-stage FFU 13, 14 described with reference Figure 5 to FIG. 6. In addition, the gap 63 communicates with the outside of the transfer block 6. In detail, the gap 63 communicates with the outside of the substrate processing apparatus 1 via the gap of the transfer block 6 and the processing block 5.

[0113] More specifically, the upper-stage side wall portion 611 on the +Y side has a plurality of upper-stage gap forming portions 611a, and the lower-stage side wall portion 612 on the +Y side has a plurality of lower-stage gap forming portions 612a. Similarly, the upper-stage side wall portion 611 on the -Y side has a plurality of upper-stage gap forming portions 611a, and the lower-stage side wall portion 612 on the -Y side has a plurality of lower-stage gap forming portions 612a. The plurality of upper-stage gap forming portions 611a on the +Y side and the plurality of lower-stage gap forming portions 612a on the +Y side are arranged along the X direction. Similarly, the plurality of upper-stage gap forming portions 611a on the -Y side and the plurality of lower-stage gap forming portions 612a on the -Y side are arranged along the X direction.

[0114] According to the present embodiment, it is possible to cause a part of the gas flowing into the space where the lower-stage FFU 13, 14 is arranged from the upper-stage transfer space 61a to escape to the outside of the transfer block 6 via the plurality of gaps 63. As a result, the gas is less likely to stay in the upper-stage path space 41b described with reference Figure 7 to FIG. 6, and the gas is more likely to flow from the upper-stage path space 41b to the upper-stage transfer space 61a. Thus, it is possible to more reliably generate the gas flow from the transfer space 3a to the upper-stage transfer space 61a via the upper-stage path space 41b.

[0115] Further, in the present embodiment, as Figure 9 shown in FIG. 6, the upper-stage transfer portion 6a has a plurality of opening ratio adjustment members 62. The plurality of opening ratio adjustment members 62 correspond to the plurality of gaps 63 one-to-one. The opening ratio adjustment member 62 adjusts the opening ratio of the corresponding gap 63.

[0116] Specifically, the opening rate adjustment members 62 are each supported on the upper-stage side wall portion 611 so as to be slidable in the up-and-down direction (Z direction) with respect to the upper-stage side wall portion 611 in a manner that the overlapping state with the corresponding gap 63 as viewed from the Y direction changes. By sliding the opening rate adjustment member 62, the opening rate of the corresponding gap 63 can be adjusted. For example, the worker slides the opening rate adjustment member 62 in the up-and-down direction (Z direction) to adjust the opening rate of the corresponding gap 63.

[0117] Figure 10 (b) is a perspective view showing the opening rate adjustment member 62. In detail, Figure 10 (b) shows the opening rate adjustment member 62 with the gap 63 opened halfway. Further, Figure 10 (a) also shows the opening rate adjustment member 62 with the gap 63 opened halfway.

[0118] As Figure 10 (b) shows, the opening rate adjustment member 62 has a plate portion 62a and a shield portion 62b. The plate portion 62a extends in the Z direction. The shield portion 62b extends in the X direction. The shield portion 62b is connected to the lower end of the plate portion 62a.

[0119] The opening rate adjustment member 62 is fixed to the upper-stage side wall portion 611 above the gap 63 by a fixing portion not shown. In the fixing portion, a through-hole is provided that penetrates in the Z direction, and the plate portion 62a of the opening rate adjustment member 62 is inserted in the through-hole of the fixing portion so as to be slidable.

[0120] In the fixing portion, for example, a screw mechanism for fixing the plate portion 62a to the through-hole can also be provided. Alternatively, a spur gear can also be provided in the plate portion 62a, and a gear is provided in the fixing portion, and a so-called rack-and-pinion mechanism is constituted by the plate portion 62a and the fixing portion. In this case, the gear provided in the fixing portion can be rotated by hand or by a motor to slide the opening rate adjustment member 62 in the Z direction.

[0121] The fixing portion is desirably provided at a position where, by sliding the plate portion 62a with respect to the fixing portion, the overlapping state of the shield portion 62b with the gap 63 as viewed from the Y direction can be changed more drastically. For example, the fixing portion is desirably arranged in such a manner that, in the case where the opening rate adjustment member 62 is in one state, the shield portion 62b completely shields the gap 63 as viewed from the Y direction, and in the case where the opening rate adjustment member 62 is in another state, the shield portion 62b completely opens the gap 63.

[0122] Figure 11 (a) is another view showing the cross section of the upper-stage side wall portion 611 and the lower-stage side wall portion 612. Figure 11 (b) is a perspective view showing another state of the opening rate adjustment member 62. In detail,Figure 11 (a) indicates the opening rate adjusting member 62 that closes the gap 63. Figure 11 (b) also indicates the opening rate adjusting member 62 that closes the gap 63.

[0123] As shown in Figure 10 (a) and Figure 10 (b), the opening rate adjusting member 62 opens the gap 63, whereby gas flows out from the space in which the lower-stage FFUs 13, 14 are arranged (refer to Figure 5 ) to the outside of the transport block 6 via the gap 63. On the other hand, as shown in Figure 11 (a) and Figure 11 (b), the opening rate adjusting member 62 blocks the gap 63, whereby the gas flow via the gap 63 is stopped.

[0124] According to the present embodiment, the transport block 6 is provided with the opening rate adjusting member 62, whereby the opening rate of the gap 63 can be adjusted, and the easiness of the gas flow from the space in which the lower-stage FFUs 13, 14 are arranged to the outside of the transport block 6 can be adjusted. Therefore, the amount of the gas flow per unit time from the space in which the lower-stage FFUs 13, 14 are arranged to the outside of the transport block 6 can be adjusted. Thus, the opening rate of the gap 63 can be adjusted, and the gas flow from the transport space 3a to the upper-stage transport space 61a via the upper-stage path space 41b can be more surely generated.

[0125] Hereinafter, the present embodiment will be described with reference to Figures 1-13 The present embodiment of the present application will be described. According to the present embodiment, the downflow (gas flow) disorder generated in the upper-stage transport space 61a and the downflow (gas flow) disorder generated in the lower-stage transport space 61b can be suppressed.

[0126] Further, in the present embodiment, the upper-stage side wall portion 611 has the upper-stage gap forming portion 611a, and the lower-stage side wall portion 612 has the lower-stage gap forming portion 612a, but the upper-stage side wall portion 611 can have a structure or a shape that forms the gap 63 alone, or the lower-stage side wall portion 612 can have a structure or a shape that forms the gap 63 alone.

[0127] Further, in the present embodiment, the transport block 6 has a plurality of gaps 63, but the transport block 6 can have one gap 63.

[0128] Further, in the present embodiment, the transport block 6 has the gaps 63 on both the +Y side and the -Y side, but the transport block 6 can have the gaps 63 on only one side of the +Y side and the -Y side.

[0129] Further, in the present embodiment, the opening ratio adjustment member 62 slides in the up-down direction, but the direction in which the opening ratio adjustment member 62 slides is not limited to the up-down direction. The opening ratio adjustment member 62 can slide in a direction in which the opening ratio of the corresponding gap 63 can be adjusted. For example, the opening ratio adjustment member 62 can be supported by the upper-stage side wall portion 611 and can slide freely in the X direction.

[0130] Further, in the present embodiment, the upper-stage conveyance portion 6a has the opening ratio adjustment member 62, but the lower-stage conveyance portion 6b can also have the opening ratio adjustment member 62, and both the upper-stage conveyance portion 6a and the lower-stage conveyance portion 6b can have the opening ratio adjustment member 62.

[0131] [Embodiment 2]

[0132] Next, the configuration of the substrate processing apparatus 1 according to Embodiment 2 will be described with reference to FIG. 9. Figure 12 Figure 13 Embodiment 2 will be described. However, matters different from Embodiment 1 will be described, and the description of matters common to Embodiment 1 will be omitted. Embodiment 2 is different from Embodiment 1 in that the first to third rectifying portions 81 to 83 are provided in the conveyance block 6.

[0133] Figure 12 is an enlarged view of a portion of the conveyance block 6 provided in the substrate processing apparatus 1 according to the present embodiment. Specifically, Figure 12 is an enlarged view of a portion of the conveyance block 6 viewed from the +Y side. As shown in Figure 12 , in the present embodiment, the upper-stage conveyance portion 6a further has the first rectifying portion 81 provided in the upper-stage punch plate 71. The first rectifying portion 81 protrudes downward from the upper-stage punch plate 71. The first rectifying portion 81 can also be constituted by a bent portion of a frame of the upper-stage punch plate 71.

[0134] The first rectifying portion 81 rectifies the gas passing through the through hole of the upper-stage punch plate 71. Specifically, the first rectifying portion 81 rectifies the gas passing through the through hole of the upper-stage punch plate 71 in such a manner that the gas passing through the through hole of the upper-stage punch plate 71 flows toward the lower-stage FFU 13 or the lower-stage FFU 14. Thus, according to the present embodiment, the lower-stage FFU 13 and the lower-stage FFU 14 can efficiently suck the gas passing through the through hole of the upper-stage punch plate 71.

[0135] In the present embodiment, the lower-stage FFUs 13 and 14 further have the second rectifying portion 82. Specifically, the lower-stage FFUs 13 and 14 each have a fan 112, a box-shaped member 111, the second rectifying portion 82, and a filter. The second rectifying portion 82 is provided in the box-shaped member 111. The second rectifying portion 82 protrudes upward from the box-shaped member 111.

[0136] ​The second rectifying portion 82 rectifies the gas passing through the through holes of the upper perforated panel 71. Specifically, the second rectifying portion 82 rectifies the gas passing through the through holes of the upper perforated panel 71 in such a manner that the gas passing through the through holes of the upper perforated panel 71 flows toward the fan 112. Thus, according to the present embodiment, the lower FFUs 13 and 14 can efficiently suck the gas passing through the through holes of the upper perforated panel 71.

[0137] Further, the box-shaped member 111 supports the fan 112. Specifically, the fan 112 is supported at the upper portion of the box-shaped member 111. The filter is housed in the interior of the box-shaped member 111. The air sucked by the fan 112 is diffused in the interior space of the box-shaped member 111 and flows out of the box-shaped member 111 via the filter.

[0138] Figure 13 is another view that enlarges a portion of the conveyance block 6 of the present embodiment. Specifically, Figure 13 is an enlarged view of a portion of the conveyance block 6 as viewed from the -X side. As Figure 13 indicated, the lower conveyance portion 6b further has a top wall 613 and a third rectifying portion 83. The lower FFUs 13 and 14 and the third rectifying portion 83 are provided on the top wall 613.

[0139] The third rectifying portion 83 rectifies the gas passing through the through holes of the upper perforated panel 71. Specifically, the third rectifying portion 83 rectifies the gas passing through the through holes of the upper perforated panel 71 in such a manner that the gas passing through the through holes of the upper perforated panel 71 flows toward the lower FFUs 13 and 14. Thus, according to the present embodiment, the lower FFUs 13 and 14 can efficiently suck the gas passing through the through holes of the upper perforated panel 71.

[0140] Hereinbefore, with reference to Figure 12 and Figures 1-13 Embodiment 2 of the present application is described. According to the present embodiment, the lower FFUs 13 and 14 can efficiently suck the gas passing through the through holes of the upper perforated panel 71.

[0141] Further, in the present embodiment, the first to third rectifying portions 81 to 83 are provided in the conveyance block 6, but one or two of the first to third rectifying portions 81 to 83 can be provided in the conveyance block 6.

[0142] Hereinbefore, with reference to the drawings Figures 1-13Embodiments of the present application will be described. However, the present application is not limited to the described embodiments, and can be implemented in various forms without departing from the gist thereof. In addition, a plurality of components disclosed in the described embodiments can be appropriately changed. For example, a certain component among all components shown in a certain embodiment can be added as a component of another embodiment, or a certain number of components among all components shown in a certain embodiment can be deleted from the embodiment.

[0143] The drawings are schematically shown with each component as a main body for the purpose of facilitating understanding of the application, and the thickness, length, number, interval, and the like of each component shown in the drawings are sometimes different from those of the actual product for the purpose of facilitating production of the drawings. In addition, the configuration of each component shown in the described embodiments is an example, and is not particularly limited, and various changes can be made without substantially departing from the effects of the present application.

[0144] For example, in the embodiment described with reference to Figures 1-13 , the upper stage conveyance section 6a has two upper stage FFUs 11 and 12, but the upper stage conveyance section 6a can have one upper stage FFU, and can have three or more upper stage FFUs. Similarly, the lower stage conveyance section 6b has two lower stage FFUs 13 and 14, but the lower stage conveyance section 6b can have one lower stage FFU, and can have three or more lower stage FFUs.

[0145] In addition, in the embodiment described with reference to Figures 1-13 , the upper stage conveyance section 6a has a plurality of upper stage punched sheets 71, but the upper stage conveyance section 6a can have one upper stage punched sheet. Similarly, the lower stage conveyance section 6b has a plurality of lower stage punched sheets 72, but the lower stage conveyance section 6b can have one lower stage punched sheet.

[0146] In addition, in the embodiment described with reference to ​ , the lower stage conveyance section 6b has two exhaust fans 73, but the lower stage conveyance section 6b can have one exhaust fan 73, and can have three or more exhaust fans 73.

[0147] [Industrial Applicability]

[0148] The present application can be used for a substrate processing apparatus.

[0149] [Explanation of Symbols]

[0150] 1 Substrate processing apparatus

[0151] 3 Carrier block

[0152] 3a Carrier space

[0153] 3a1 First carrier space

[0154] 3a2 2nd carrier space

[0155] 3b 1st opening

[0156] 3c 2nd opening

[0157] 5 processing block

[0158] 6a upper stage conveyance section

[0159] 6b lower stage conveyance section

[0160] 11 upper stage FFU

[0161] 12 upper stage FFU

[0162] 13 lower stage FFU

[0163] 14 lower stage FFU

[0164] 15 carrier FFU section

[0165] 16 1st carrier FFU

[0166] 17 2nd carrier FFU

[0167] 18 3rd carrier FFU

[0168] 32 carrier conveyance section

[0169] 33 carrier conveyance robot

[0170] 34 guide rail

[0171] 41 upper stage path section

[0172] 42 lower stage path section

[0173] 50a upper stage substrate conveyance section

[0174] 50b lower stage substrate conveyance section

[0175] 51a upper stage conveyance robot

[0176] 51b lower stage conveyance robot

[0177] 61a upper stage conveyance space

[0178] 61b lower stage conveyance space

[0179] 62 opening ratio adjustment member

[0180] 63 gap

[0181] 71 upper stage punched plate

[0182] 72 lower stage punched plate

[0183] 73 exhaust fan

[0184] 81 first flow regulating portion

[0185] 82 second flow regulating portion

[0186] 83 third flow regulating portion

[0187] 111 box-like member

[0188] 112 fan

[0189] 611 upper-stage side wall portion

[0190] 611a upper-stage gap forming portion

[0191] 612 lower-stage side wall portion

[0192] 612a lower-stage gap forming portion

[0193] 613 top wall

[0194] W substrate

Claims

1. A substrate processing apparatus that processes a substrate, comprising: a processing section that processes the substrate; a first conveyance section that is adjacent to the processing section; and a second conveyance section that is adjacent to the processing section and is disposed below the first conveyance section, wherein the first conveyance section includes: a first substrate conveyance section that conveys the substrate; a first conveyance space that accommodates the first substrate conveyance section; and a first floor section that has a plurality of first through-holes and is disposed below the first conveyance space, wherein the second conveyance section includes: a second substrate conveyance section that conveys the substrate; a second conveyance space that accommodates the second substrate conveyance section; a second conveyance fan filter unit that is disposed below the first floor section and supplies gas from above to below of the second conveyance space; a second floor section that has a plurality of second through-holes and is disposed below the second conveyance space; and an exhaust fan that is disposed below the second floor section and exhausts gas that passes through the plurality of second through-holes, wherein at least one of the first conveyance section and the second conveyance section further includes a first side wall section that is adjacent to the processing section, wherein at least one of the first conveyance section and the second conveyance section further includes a second side wall section that is adjacent to the processing section and is disposed below the first side wall section, wherein at least one of the first side wall section and the second side wall section further includes a gap forming section that forms a gap in which the first side wall section and the second side wall section face each other in a vertical direction, and wherein the gap communicates between the first conveyance section, the second conveyance section, and an outside.

2. The substrate processing apparatus according to claim 1, wherein at least one of the first conveyance section and the second conveyance section further includes an opening rate adjusting member that adjusts an opening rate of the gap.

3. The substrate processing apparatus according to claim 1 or 2, wherein the first conveyance section includes a plurality of the first conveyance fan filter units.

4. The substrate processing apparatus according to claim 3, wherein the first substrate conveyance section includes a first conveyance robot that moves within the first conveyance space, and wherein the plurality of first conveyance fan filter units are arranged so as to cover a movement range of the first conveyance robot.

5. The substrate processing apparatus according to claim 1 or 2, wherein the second conveyance section includes a plurality of the second conveyance fan filter units.

6. The substrate processing apparatus according to claim 5, wherein the second substrate conveyance section includes a second conveyance robot that moves within the second conveyance space, and wherein the plurality of second conveyance fan filter units are arranged so as to cover a movement range of the second conveyance robot.

7. The substrate processing apparatus according to claim 1 or 2, wherein the first conveyance section further includes a first rectifying section that is disposed in the first floor section, and wherein the first rectifying section rectifies gas that passes through the plurality of first through-holes. A first conveyance fan filter unit is provided above the first conveyance space and supplies gas from above the first conveyance space toward below.

8. The substrate processing apparatus according to claim 1 or 2, wherein the second conveyance fan filter unit includes a fan, a box-shaped member that supports the fan, and a second rectifying section that is disposed in the box-shaped member, and wherein the second rectifying section rectifies gas that passes through the plurality of first through-holes. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 9. The substrate processing apparatus according to claim 1 or 2, wherein the second conveyance section further has: a top wall provided with the second conveyance fan filter unit; and a third rectification section provided at the top wall; and the third rectification section rectifies the gas passing through the plurality of first through holes.

10. The substrate processing apparatus according to claim 1 or 2, further comprising: a transfer section that performs conveyance in and conveyance out of the substrate; a first path section that is provided between the transfer section and the first conveyance section, and temporarily holds the substrate; and a second path section that is provided between the transfer section and the second conveyance section, and temporarily holds the substrate; and the transfer section has: a transfer conveyance section that performs conveyance in and conveyance out of the substrate; a transfer space that accommodates the transfer conveyance section; and a transfer fan filter unit section that is provided above the transfer space, and supplies gas from above toward below of the transfer space.

11. The substrate processing apparatus according to claim 10, wherein the transfer fan filter unit section has: a first transfer fan filter unit that is arranged on a side opposite to the first path section and the second path section; and a second transfer fan filter unit that is arranged on the side of the first path section and the second path section.

12. The substrate processing apparatus according to claim 11, wherein the transfer section further has: a first opening that communicates with the first path section; and a second opening that is provided below the first opening, and communicates with the second path section; and the transfer fan filter unit section further has a third transfer fan filter unit that is arranged on a side of the first transfer fan filter unit and the second transfer fan filter unit when the first opening and the second opening are viewed from the front.

13. The substrate processing apparatus according to claim 12, wherein the transfer space includes: a first transfer space; and a second transfer space that is located on a side of the first transfer space when the first opening and the second opening are viewed from the front; and an uppermost portion of the first transfer space is located more upward than an uppermost portion of the second transfer space, the first transfer fan filter unit and the second transfer fan filter unit supply gas from above toward below of the first transfer space, the third transfer fan filter unit supplies gas from above toward below of the second transfer space.

14. The substrate processing apparatus according to claim 12, wherein the transfer conveyance section includes: a transfer conveyance robot that conveys the substrate; and a guide rail that guides the transfer conveyance robot in the vertical direction; and the third transfer fan filter unit is arranged on a side opposite to the guide rail when the first opening and the second opening are viewed from the front.

15. The substrate processing apparatus according to claim 10, wherein the exhaust fan generates an air flow from the transfer space to the second conveyance space via the second path section.

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