A carrying device, a carrying system and a working method

Abstract

The present invention discloses a carrying device, a carrying system and a working method. The carrying device includes a vacuum chuck and a plurality of support components; the vacuum chuck includes an opposite adsorption surface and a back surface, and the adsorption surface is used for adsorbing the first surface of a to-be-tested object; the support components are configured to move in a direction perpendicular to the adsorption surface; the plurality of support components have a supporting surface for supporting the edge of the to-be-tested object; in the direction perpendicular to the adsorption surface, the distance between the adsorption surface and the back surface of the vacuum chuck is less than the distance between the carrying surface and the back surface of the vacuum chuck. Applying this solution can complete the detection of two surfaces of a to-be-tested object in one detection chamber, effectively reducing the detection cost without affecting the integrity and cleanliness of the front surface of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor testing equipment, and particularly relates to a carrying device, a carrying system and a working method. Background Art

[0002] In a typical existing manufacturing process, it is necessary to perform defect detection on both the front and back surfaces of a wafer. Usually, two detection chambers are adopted. One detection chamber is used for front surface detection of the wafer, and the other detection chamber is used for back surface detection of the wafer. Specifically, different carrying devices are respectively arranged in the front surface detection chamber and the back surface detection chamber to carry the back surface and the front surface of the wafer, and a manipulator is used to realize the transportation and flipping of the wafer. Limited by its own structural principle, there are defects of relatively high detection cost and relatively long detection cycle.

[0003] In view of this, it is urgent to optimize the structure of the existing carrying device to effectively reduce the detection cost and detection time. Summary of the Invention

[0004] To solve the above technical problems, the present invention provides a carrying device, a carrying system and a working method. Through the carrying device with optimized functional structure, the detection of two surfaces of the object to be measured can be completed in one detection chamber, and on the basis of effectively reducing the detection cost, the detection time can be greatly reduced.

[0005] A carrying device provided by the present invention includes a vacuum chuck and a plurality of support components; the vacuum chuck includes an adsorption surface and a back surface opposite to each other, and the adsorption surface is used for adsorbing the first surface of the object to be measured; the support components are configured to move in a direction perpendicular to the adsorption surface; the plurality of support components form a support surface, and the support surface is used for supporting the edge of the object to be measured; in the direction perpendicular to the adsorption surface, the distance between the adsorption surface and the back surface of the vacuum chuck is less than the distance between the support surface and the back surface of the vacuum chuck.

[0006] Preferably, the plurality of support components include positioning blocks, and the positioning blocks include positioning parts and first supporting surfaces. The first supporting surfaces are used for supporting the edge area of the object to be measured, and the positioning parts are radially abutted against the edge of the object to be measured.

[0007] Preferably, the plurality of support components include carrying blocks, and the carrying blocks have second supporting surfaces, and the second supporting surfaces do not extend beyond the adsorption surface or the second supporting surfaces are flush with the support surface.

[0008] Preferably, the carrying device also includes a clamping component, which includes a clamping portion and a clamping drive portion, and the clamping portion is configured to radially abut against the edge of the object to be measured; the clamping drive portion is used to drive the clamping portion to move radially along the vacuum suction cup, provide a clamping drive force for the clamping portion, and is configured such that: under the action of the clamping drive force, the clamping force formed by the clamping portion and the positioning block is applied to the object to be measured.

[0009] Preferably, the clamping drive part includes a clamping cylinder, the output end of the clamping cylinder is transmission-connected to the body of the clamping component; the clamping part is pivotally connected to the body of the clamping component, and can switch between a clamping working position and a loosening working position around the pivot center, and is configured as follows: the clamping part located in the clamping working position and the clamping force formed by the positioning block are applied to the object to be measured.

[0010] Preferably, the clamping parts are provided in two, and the two clamping parts are mirror-imaged relative to a symmetrical center line perpendicular to the connecting line of the pivotal centers of the two. Each of the clamping parts has a clamping end formed by bending outward from the main body, and the end adapted to the outer periphery of the device to be connected is an outward convex arc surface. The clamping component also includes: an elastic member provided between the two clamping parts, and is configured as follows: during the process of the two clamping parts switching to the clamping working position, the elastic member deforms and stores elastic deformation energy.

[0011] Preferably, it also includes a lifting component, which includes: a lifting platform, on which the multiple supporting components are arranged and moved by the lifting platform in a direction perpendicular to the adsorption surface; and a lifting drive unit that can provide a lifting drive force for the lifting platform.

[0012] Preferably, it also includes: at least two limit blocks, which are evenly distributed circumferentially on the lifting platform and are configured as follows: the lifting platform drives the multiple support components to move in a direction perpendicular to the adsorption surface, and at least two of the limit blocks are pressed against the back side of the vacuum suction cup to limit the position.

[0013] Preferably, the supporting block and the positioning block are both located radially outside the vacuum suction cup, wherein the positioning blocks are provided in at least two numbers and are symmetrically arranged on the lifting platform away from the clamping portion, and the supporting block is arranged on the lifting platform close to the clamping portion.

[0014] Preferably, the first surface of the object to be measured is a non-machined surface of the object to be measured.

[0015] The present invention also provides a carrying system, comprising the carrying device as described above, a manipulator and a transfer device, wherein the carrying device is used to carry the object to be tested, the manipulator is used to transfer the object to be tested, and the transfer device is used to flip the object to be tested.

[0016] The present invention also provides a working method of a carrying device. The carrying device includes any one of the carrying devices described above. The method includes: moving a plurality of support components in a direction perpendicular to the surface of the vacuum chuck; causing the adsorption surface of the vacuum chuck to adsorb the first surface of the object to be measured; or moving the plurality of support components in a direction perpendicular to the surface of the vacuum chuck, and causing the support components and the clamping member to hold the edge of the object to be measured.

[0017] Preferably, the carrying device includes a manipulator. The method further includes: moving the plurality of support components to drive the object to be measured in a direction perpendicular to the surface of the vacuum chuck, and causing the manipulator to take the object to be measured away from the carrying device.

[0018] In view of the prior art, the present invention takes a new approach and optimizes the design of the carrying device for the object to be measured. The carrying device has a fixed implementation method for two detection states of the object to be measured. Taking the object to be measured as a wafer for example, the carrying device adsorbs and fixes the back surface of the wafer with a vacuum chuck. At this time, the front surface of the wafer can be detected, that is, the first detection state; its plurality of support components are configured to move in a direction perpendicular to the adsorption surface, and the support surface formed by the support components can be used to support the edge of the object to be measured, so as to detect the back surface of the wafer, that is, the second detection state; in the direction perpendicular to the adsorption surface, the distance between the adsorption surface and the back surface of the vacuum chuck is less than the distance between the support surface and the back surface of the vacuum chuck; that is to say, when detecting the front surface of the wafer, the support surface of the support components does not extend beyond the adsorption surface of the vacuum chuck. Compared with the prior art, the present solution has the following beneficial technical effects:

[0019] First of all, by providing a vacuum chuck and a plurality of support components, the present solution can selectively achieve the adsorption of the back surface of the wafer or the clamping of the edge of the wafer, so that the functions of detecting the front and back surfaces of the wafer can be satisfied by one carrying device, thereby providing good technical guarantee for detecting two surfaces of the object to be measured in one detection chamber. Thus, the defect of too high detection cost caused by using corresponding carrying devices in two detection chambers can be avoided; at the same time, applying the present solution can also reduce the auxiliary working hours for transferring the object to be measured between detection chambers, greatly reduce the detection time, and further reduce the detection cost.

[0020] Secondly, in a preferred embodiment of the present invention, a positioning block adapted to the clamping portion is added. The positioning block can be switched synchronously with the supporting block between the working position and the non-working position. When switched to the working position, the positioning portion can form a restriction on the position of the object to be measured in the horizontal plane, so as to form a reliable clamping and positioning for the second detection state. At the same time, the body below the positioning portion has a first supporting surface, and the first supporting surface is configured to jointly support the second surface of the wafer with the supporting portion when switched to the working position, and has the function of supporting the wafer, and can more smoothly push the wafer to move to the second detection state, ensuring the detection accuracy.

[0021] Thirdly, in another preferred embodiment of the present invention, the clamping portions are mirror-image arranged in two, and can be respectively switched between the clamping working position and the releasing working position around the pivoting center. Each clamping portion has a clamping end formed by bending outward from the body, and the end adapted to the outer periphery of the device to be measured is a convex arc surface. Thus, in the process of the clamping portion pressing against and clamping the edge of the wafer, they respectively rotate around their pivoting centers and the arcs of the two clamping ends are tangent to the wafer. During the process, the elastic member absorbs energy to maintain a flexible clamping force on the wafer.

[0022] Finally, in yet another preferred embodiment of the present invention, at least two limiting blocks are added, which are circumferentially and uniformly arranged on the lifting platform that drives the carrying block and the positioning block to switch to the working position. When reaching the working position, the limiting blocks can press against and limit the lower surface of the vacuum chuck. With such a setting, the lifting platform can be in a horizontal posture through the uniformly arranged limiting blocks, thereby ensuring that the wafer to be measured supported is maintained in an ideal second detection state, providing good technical guarantee for obtaining good detection accuracy. Description of the Drawings

[0023] Figure 1 Schematic diagram of the carrying device in the first detection state in the specific embodiment;

[0024] Figure 2 Schematic diagram of the carrying device in the second detection state in the specific embodiment;

[0025] Figure 3 Top view of the carrying device in the specific embodiment;

[0026] Figure 4 Top view of the carrying device in the specific embodiment without showing the vacuum chuck;

[0027] Figure 5 For Figure 3 Enlarged view of the positional relationship between the carrying block and the wafer shown in part B of

[0028] Figure 6 For Figure 3 Enlarged view of the positional relationship between the positioning block and the wafer shown in part C of

[0029] Figure 7 Schematic diagram of the clamping component in the released working position;

[0030] Figure 8 Schematic diagram of the clamping component in the clamped working position;

[0031] Figure 9 Top view of the assembly relationship in the application state of the bearing system described in the specific implementation manner.

[0032] In the figure:

[0033] Bearing device 10, vacuum chuck 1, clamping component 2, clamping part 21, clamping end 211, clamping cylinder 22, elastic member 23, bearing block 3, second supporting surface 31, positioning block 4, positioning part 41, first supporting surface 42, lifting component 5, lifting platform 51, lifting cylinder 52, limiting block 6, rotary drive mechanism 7, manipulator 20, detection chamber 30, detection device 40, moving platform 50. Specific implementation manner

[0034] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] Without loss of generality, in this embodiment, the bearing device shown in the figure is used as the description subject, which is placed in a detection chamber of the object to be detected. It should be understood that the specific structural form and actual specific application of this detection chamber do not constitute a substantial limitation to the technical solution claimed in this application.

[0036] Please refer to Figure 1 and Figure 2 , where Figure 1 is a schematic diagram of the bearing device in the first detection state, Figure 2 is a schematic diagram of the bearing device in the second detection state. In order to clearly describe the working principle of this bearing device, this solution takes wafer A as the object to be detected for detailed description. It can be understood that the object to be detected can be different product forms with two surfaces to be detected, such as, but not limited to, wafers. Among them, the first surface of the object to be detected is the non-processed surface of the object to be detected, and the second surface of the object to be detected is the processed surface to be detected.

[0037] The carrying device includes: The vacuum chuck 1 includes an opposite adsorption surface and a back surface, and its adsorption surface is used to adsorb the first surface of the object to be measured; A plurality of support components are configured to move in a direction perpendicular to the surface of the vacuum chuck, and a plurality of support components can form a support surface, which is a plane formed by the corresponding supporting surfaces of the plurality of support components, for supporting the edge of the object to be measured; In the direction perpendicular to the surface of the vacuum chuck, the distance between the adsorption surface and the back surface of the vacuum chuck is less than the distance between the support surface and the back surface of the vacuum chuck. That is, when detecting the front side of the wafer, the supporting surface of the support component does not exceed the adsorption surface of the vacuum chuck.

[0038] In this solution, by setting the vacuum chuck 1 and a plurality of support components, the adsorption and fixation of the back surface of the wafer or the clamping and fixation of the edge of the wafer can be selectively achieved. The wafer A is at two fixed positions to be detected at different heights in a detection chamber. Using one carrying device can meet the functional requirements of detecting the front and back surfaces of the wafer respectively, and thus provides good technical guarantee for detecting the two surfaces of the object to be measured.

[0039] As shown in the figure, the carrying device includes a vacuum chuck 1 and a plurality of support components. Among them, the support components can be realized in different ways, such as but not limited to the preferred examples shown in the figure. In this solution, the support component includes a carrying block 3 having a second supporting surface 31 and a positioning block 4 having a positioning portion 41 and a first supporting surface 42.

[0040] Specifically, the vacuum chuck 1 is used to fix the wafer A in Figure 1 the first detection state shown. Specifically, the back surface (the first surface) of the wafer A is placed on the vacuum chuck 1. Under the vacuum pumping state, the adsorption surface on the upper surface of the vacuum chuck 1 can adsorb the first surface of the wafer A, that is, the wafer A is fixed in the first detection state by the vacuum chuck 1. The vacuum part can be a vacuum groove or a vacuum part. At this time, the front surface (the second surface) of the wafer A can be detected.

[0041] In the first detection state, both the clamping component 2 and the carrying block 3 are in a non-working state.

[0042] Specifically, the clamping member 2 fixedly arranged relative to the vacuum chuck 1, the clamping portion 21 is located above the outside of the vacuum chuck 1, and a predetermined distance is arranged in the vertical direction between the clamping portion 21 and the upper surface of the vacuum chuck 1; meanwhile, the second supporting surface 31 of the bearing block 3 can be flush with the adsorption surface, or the second supporting surface is lower than the adsorption surface, and the bearing block 3 can be switched between the working position and the non-working position in the vertical direction. Here, the "working position" and the "non-working position" are defined based on whether the bearing block 3 participates in fixing the object to be measured. The bearing block 3 in the "working position" participates in fixing the object to be measured, while it does not participate in fixing the object to be measured in the "non-working position". And it is configured that when in the non-working position, the second supporting surface 31 of the bearing block 3 is not higher than the upper surface of the vacuum chuck 1, as Figure 1 shown. In this state, the vacuum chuck 1 can provide the adsorption and fixing function in the first detection state; when the second supporting surface 31 supports the front surface (the second surface) of the wafer A and switches to the working position, as Figure 2 shown, the clamping portion 21 of the side clamping member 2 applies a clamping force to the wafer to fix the object to be measured in the second detection state. At this time, the back surface (the first surface) of the wafer A can be detected.

[0043] Similarly, in the second detection state, the vacuum chuck 1 and the components related to building the vacuum are all in the non-working state.

[0044] Please refer to Figure 1 and Figure 2 together. The positioning block 4 with the positioning portion 41 can also be switched between the working position and the non-working position in the vertical direction, and is configured that when in the non-working position, the positioning portion 41 of the positioning block 4 is not higher than the upper surface of the vacuum chuck 1; when in the working position, the positioning portion 41 of the positioning block 4 radially abuts against the edge of the object to be measured, and can form a restriction on the position of the wafer A in the horizontal plane, so as to form a reliable clamping and positioning for the wafer A switched to the second detection state. Based on the design of the positioning portion 41, it provides a good technical guarantee for simplifying the force application structure of the clamping member 2.

[0045] In addition, the body of the positioning block 4 below the positioning portion 41 has a first supporting surface 42, and the first supporting surface 42 is configured to jointly support the front surface (the second surface) of the wafer A with the second supporting surface 31 and switch to Figure 2 the shown working position. That is to say, in the height direction, the first supporting surface 42 of the positioning block 4 is flush with the second supporting surface 31 of the supporting block 30. In this way, the positioning block 4 also has the function of supporting the wafer A, and can more stably push the wafer to move to the second detection state, ensuring the detection accuracy.

[0046] Of course, in the second detection state, in order to minimize the possible influence of the support on the surface of the wafer A, as a preference, the bearing block 3 can be arranged below the edge of the wafer A. Please refer toFigure 3 and Figure 4 , both figures are top views of the carrying device, where Figure 4 The shown top view is formed after removing the vacuum suction cup.

[0047] As shown in the figure, both the carrying block 3 and the positioning block 4 are located radially outside the vacuum suction cup 1. The carrying block 3 is configured to move in a direction perpendicular to the adsorption surface of the vacuum suction cup 1. The carrying block 3 has a second supporting surface, and the second supporting surface is flush with the adsorption surface or the second supporting surface is flush with the carrying surface. A partial surface on the radially inner side of the first supporting surface 42 is used to support the edge of the wafer A without directly contacting the central region of the front surface of the wafer A. Please also refer to 5, which is the enlarged view of the positional relationship between the carrying block and the wafer shown in part B of Figure 3 . It can be understood that based on the actual size of the wafer to be measured and the size matching of the supporting block 30, the entire first supporting surface 42 can also be used to support the edge of the wafer A, rather than being limited to the partial participation in support shown in the figure. As long as it can meet the functional requirements of supporting the edge of the wafer A and not directly contacting the central region of the front surface, it is within the scope of protection claimed in this application.

[0048] Similarly, the positioning block 4 with a supporting function can also be arranged below the edge of the wafer A. Please also refer to Figure 6 , Figure 6 which is Figure 3 the enlarged view of the positional relationship between the positioning block and the wafer shown in part C of

[0049] As shown in the figure, the clamping component 2 is located on one side of the vacuum suction cup 1, and the positioning portion 41 adapted to be clamped and positioned is located on the radially opposite side of the clamping component 2. Thus, when the clamping portion 21 applies a clamping force to the wafer approximately along the radial direction, the positioning portion 41 of the positioning block 4 abuts against the edge of the wafer A to construct the above positioning. In this solution, the specific number and corresponding positions of the positioning blocks 4 can be set as needed, for example, but not limited to two in the preferred example of this solution. Combining Figure 3 shown, relative to the radial force application direction of the clamping portion 21, the two positioning blocks 4 are symmetrically arranged on both sides, forming a stable clamping and positioning relationship, with a simple and reliable structure. Among them, the carrying block 3 of this solution is also set to two. As Figure 3 shown, relative to the positioning block 4, the carrying block 3 is located on the side close to the clamping component 2, and the supporting portions are arranged approximately evenly along the circumferential direction of the wafer A to ensure that the wafer to be measured maintains a horizontal posture. Of course, the carrying block 3 can also be configured as other plural numbers.

[0050] Theoretically, the clamping force provided by the clamping member 2 can be applied in the radial direction or in the vertical direction, for example but not limited to the preferred example shown in the figure, where the clamping force is applied to the wafer substantially in the radial direction.

[0051] The clamping component 2 may also include a clamping drive unit (22) that can provide a clamping drive force for the clamping portion 21. Specifically, the clamping drive unit 22 and the positioning portion 41 can apply a clamping force to the object to be measured, the wafer A, under the action of the clamping drive force. Here, the clamping drive unit for providing the above-mentioned clamping drive force preferably includes a clamping cylinder 22, the output end of which is transmission-connected to the body of the clamping component 21 to drive its linear displacement; preferably, the clamping cylinder 22 is provided with a guide double-acting cylinder. In addition, the clamping drive unit can also be configured as a hydraulic cylinder or a linear motor as needed.

[0052] In order to obtain a flexible clamping method and meet the clamping force requirements of different test objects such as ordinary wafers, thin wafers and TAIKO wafers, the clamping component 2 can be further optimized. Figure 7 and Figure 8 ,in, Figure 7 This is a schematic diagram of the clamping component in the loose working position. Figure 8 Schematic diagram of the clamping component in the clamping working position.

[0053] Preferably, the clamping portion 21 is pivotally connected to the body of the clamping component 2 and can be switched between a clamping position and a loosening position around the pivot center, and is configured as follows: Figure 8 The clamping force formed by the clamping portion 21 of the clamping work position and the positioning portion 41 of the positioning block 4 is applied to the wafer A to be tested; Figure 7 As shown, the clamping portion 21 of the working position is released and separated from the wafer A to be tested. Therefore, through this switching stroke, technical guarantee is provided for adapting to different objects to be tested.

[0054] As shown in the figure, there are two clamping parts 21. The two clamping parts 21 are mirror-imaged relative to a symmetry center line perpendicular to the connecting line of the pivot centers of the two, that is, symmetrically arranged relative to the radial clamping force direction. Each clamping part 21 has a clamping end 211 formed by bending outward from the main body, and the end adapted to the outer periphery of the wafer A to be clamped is an outward convex arc surface. In the process of pressing against the edge of the wafer to be clamped, the clamping parts 21 rotate around their respective pivot centers and are tangent to the wafer through the two clamping end arcs. At the same time, an elastic member 23 is provided between the two clamping parts 21 and is configured so that: in the process of switching the two clamping parts 21 from the loosening working position to the clamping working position, the elastic member deforms and stores elastic deformation energy. During the process, the elastic member 23 absorbs energy to maintain a flexible clamping force on the wafer A, thereby achieving safe and stable bearing and fixation of various types of wafers.

[0055] In addition, the elastic member 23 is preferably in the form of a tension spring. By replacing springs with different wire diameters, it is possible to adjust the clamping force exerted by the clamping portion 21 on the outer edge of the wafer A while keeping the force of the clamping cylinder 22 unchanged.

[0056] In this solution, both the carrier block 3 and the positioning block 4 are switched between the working position and the non-working position in the vertical direction. In particular, the positioning block 4 also has the function of supporting the wafer to be measured, and the synchronization of the displacements of the two can be further optimized. Combining Figure 1 and Figure 2 As shown, a plurality of support components such as the carrier block 3 and the positioning block 4 are arranged on the lifting platform 51 of the lifting member 5, and are driven by the lifting platform 51 to move in a direction perpendicular to the adsorption surface, that is, to be synchronously switched between the working position and the non-working position in the vertical direction. Among them, the lifting driving force of the lifting platform 51 is provided by the lifting driving portion (52). Similarly, the lifting driving portion can be a lifting cylinder 52, or a hydraulic cylinder or a motor can be used for driving.

[0057] Furthermore, a limiting block 6 is provided on the lifting platform 51. Please refer to Figure 1 and Figure 2 together, and it is configured that when the lifting platform 51 moves in a direction perpendicular to the adsorption surface and drives the carrier block 3 and the positioning block 4 to switch to the Figure 2 working position shown, at least two of the limiting blocks 6 move in a direction perpendicular to the adsorption surface and press against the lower surface of the vacuum chuck 1 for limiting. Due to the uniformly arranged limiting blocks 6, the lifting platform 51 in the second detection state is in a horizontal posture, thereby ensuring that the wafer to be measured supported is in an ideal state to be measured, providing a good technical guarantee for obtaining good detection accuracy. Combining Figure 4 As shown, four limiting blocks 6 are circumferentially and uniformly distributed on the lifting platform 51. It can be understood that at least two limiting blocks 6 can achieve the function requirements of balanced load sharing, rather than being limited to the preferred exemplary illustration shown in the figure.

[0058] In addition to the foregoing carrying device, this embodiment also provides a carrying system including the above-mentioned carrying device 10, as well as a manipulator and a transfer device. The carrying device is used to carry the object to be measured, the manipulator is used to transfer the object to be measured, and the transfer device is used to flip the object to be measured. The carrying system further includes a rotation driving mechanism 7, which is drivingly connected to associated components such as the vacuum chuck 1, the clamping component 20, and the lifting component 5 to achieve driving rotation. Please refer to Figure 9 This figure is a top view of the assembly relationship in the application state of the carrying system described in the specific embodiment. The carrying system is placed on the moving table 50 in the detection chamber 30, and a detection device 40 is arranged above it.

[0059] It should be understood that other functions of the carrying system do not constitute the core inventive points of this application and can be achieved by those of ordinary skill in the art based on the prior art. For example, but not limited to, the rotary drive mechanism is installed on the rotary direct drive motor of the high-speed moving platform, so it will not be elaborated herein.

[0060] In addition to the aforementioned carrying device, this embodiment also provides a working method for the carrying device, including: moving multiple support components in a direction perpendicular to the surface of the vacuum chuck; making the adsorption surface of the vacuum chuck adsorb the first surface of the object to be measured; or moving the multiple support components in a direction perpendicular to the surface of the vacuum chuck, and making the support components and clamping components act on the edge of the object to be measured.

[0061] Furthermore, the carrying device includes a manipulator, and the method further includes: making the multiple support components move the object to be measured in a direction perpendicular to the surface of the vacuum chuck, and making the manipulator take the object to be measured away from the carrying device.

[0062] Specifically, before the optical detection starts, the high-speed moving platform rotates through the rotary drive mechanism 7, and places the back surface of the wafer A to be measured downward on the carrying device. In the first detection state, it is adsorbed and fixed by the vacuum chuck 1, and the front surface of the wafer A can be detected. Next, the vacuum pump is disconnected, and the wafer A to be measured is flipped 180 degrees by the manipulator 60, and the front surface of the wafer A to be measured is placed downward on the carrying device. In the second detection state, the front edge of the wafer A is jointly supported by the carrying block 3 and the positioning block 4, moved up to the working position, and the outer edge of the wafer A is jointly positioned and clamped by the clamping component 20 and the positioning block 4, and the back surface of the wafer A can be detected.

[0063] After the optical detection is completed, the manipulator lifts up and takes away the wafer, and the rotary drive mechanism rotates the corresponding associated components to the zero position, so as to complete high-speed and fully automatic optical detection in one detection chamber.

[0064] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "radial", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the protection scope of the present invention.

[0065] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and retouches can be made, and these improvements and retouches should also be regarded as the protection scope of the present invention.

Claims

1. A carrying device, characterized in that: include: A vacuum suction cup, comprising an adsorption surface and a back surface opposite to each other, wherein the adsorption surface is used to adsorb a first surface of an object to be measured; A plurality of support assemblies, each of which is configured to move in a direction perpendicular to the adsorption surface to switch between a working position and a non-working position; The plurality of support components form a support surface, and the support surface is used to support the edge of the object to be measured; In a direction perpendicular to the adsorption surface, the distance between the adsorption surface and the back surface of the vacuum suction cup is smaller than the distance between the support surface in the working position and the back surface of the vacuum suction cup; the distance between the adsorption surface and the back surface of the vacuum suction cup is larger than the distance between the support surface in the non-working position and the back surface of the vacuum suction cup; The plurality of support components include a positioning block, the positioning block including a positioning portion and a first supporting surface, the first supporting surface is used to support an edge area of the object to be measured, and the positioning portion is radially opposed to the edge of the object to be measured; The carrying device further comprises a clamping component, the clamping component comprising a clamping portion and a clamping drive portion, the clamping portion being configured to radially abut against an edge of the object to be measured; The clamping drive part is used to drive the clamping part to move radially along the vacuum suction cup to provide a clamping drive force for the clamping part, and is configured such that: under the action of the clamping drive force, the clamping drive force formed by the clamping part and the positioning block is applied to the object to be measured.

2. The carrying device according to claim 1, characterized in that: The plurality of supporting components include a bearing block having a second supporting surface, wherein the second supporting surface does not exceed the adsorption surface or the second supporting surface is flush with the supporting surface.

3. The carrying device according to claim 1, characterized in that: The clamping drive part includes a clamping cylinder, the output end of which is transmission-connected to the body of the clamping component; the clamping part is pivotally connected to the body of the clamping component and can switch between a clamping working position and a loosening working position around the pivot center, and is configured as follows: the clamping part located in the clamping working position and the positioning block construct the clamping driving force to the object to be measured.

4. The carrying device according to claim 3, characterized in that: The two clamping parts are provided, and the two clamping parts are mirror-imaged relative to a symmetrical center line perpendicular to the connecting center line of the two pivotal connection parts; each clamping part has a clamping end formed by bending outward from the main body, and the end adapted to the outer periphery of the device to be mounted is an outward convex arc surface; the clamping part further includes: The elastic member is arranged between the two clamping parts and is configured so that when the two clamping parts are switched to the clamping working position, the elastic member is deformed and stores elastic deformation energy.

5. The carrying device according to claim 2, characterized in that: It also includes a lifting component, the lifting component including: A lifting platform, wherein the plurality of supporting components are arranged on the lifting platform and are moved by the lifting platform in a direction perpendicular to the adsorption surface; The lifting drive unit can provide the lifting driving force of the lifting platform.

6. The carrying device according to claim 5, characterized in that: Also includes: At least two limit blocks are evenly distributed circumferentially on the lifting platform and are configured as follows: the lifting platform drives the multiple support components to move in a direction perpendicular to the adsorption surface, and at least two of the limit blocks are pressed against the back of the vacuum suction cup to limit the position.

7. The carrying device according to claim 5, characterized in that: The supporting block and the positioning block are both located radially outside the vacuum suction cup, wherein the positioning blocks are provided in at least two numbers and are symmetrically arranged on the lifting platform away from the clamping portion, and the supporting block is arranged on the lifting platform close to the clamping portion.

8. The carrying device according to claim 1, characterized in that: The first surface of the object to be measured is a non-machined surface of the object to be measured.

9. A bearing system, characterized in that: It comprises the carrying device according to any one of claims 1 to 8, a manipulator and a transfer device, wherein the carrying device is used to carry the object to be tested, the manipulator is used to transfer the object to be tested, and the transfer device is used to flip the object to be tested.

10. A method for operating a carrying device, wherein the carrying device comprises the carrying device according to any one of claims 1 to 9, characterized in that: The method comprises: Move the plurality of support components in a direction perpendicular to the surface of the vacuum suction cup; Allowing the adsorption surface of the vacuum suction cup to adsorb the first surface of the object to be measured; Alternatively, the plurality of support components are moved in a direction perpendicular to the surface of the vacuum suction cup, so that the support components and the clamping parts face the edge of the object to be measured.

11. The working method according to claim 10, characterized in that: The carrying device includes a robot arm, and the method further includes: The multiple supporting components drive the object to be measured to move in a direction perpendicular to the surface of the vacuum suction cup, so that the robot arm takes the object to be measured away from the carrying device.

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