Coupler and base station antenna

Abstract

The present disclosure relates to a coupler and a base station antenna. The coupler includes: a first coupling component, which includes a first substrate and a first sub-path of a first signal path and a second signal path located on the first substrate. The first sub-path is configured to be at least partially coupled with the first signal path to couple a part of the signal in the first signal path into the second signal path; a second coupling component, which is vertically stacked with the first coupling component. The second coupling component includes a second substrate and a second sub-path of the second signal path located on the second substrate; a shielding component, which is disposed between the first substrate and the second substrate to shield the first coupling component and the second coupling component from each other, and the shielding component is provided with a first connection through hole; and a first connection component, which passes through the first connection through hole, and the first connection component is electrically connected between the first sub-path and the second sub-path.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technologies, and more particularly, to a coupler and a base station antenna. Background Art

[0002] To meet the increasing capacity requirements, more antenna arrays are being integrated into base station antennas. Since the overall size of the base station antenna generally remains unchanged, as the number of antenna arrays integrated therein increases, the interaction between adjacent antenna arrays may increase, resulting in the deterioration of the "antenna beam" or radiation parameters generated by the antenna arrays. Specifically, the azimuth beam width (AZBW) of the antenna beam becomes wider, leading to a decrease in the gain of the antenna array and a deterioration in sector coverage, etc. Summary of the Invention

[0003] One object of the present disclosure is to provide a coupler and a base station antenna.

[0004] According to a first aspect of the present disclosure, there is provided a coupler, the coupler including: a first coupling component, the first coupling component including a first substrate and a first sub-path of a first signal path and a second signal path located on the first substrate, the first sub-path being configured to be at least partially coupled with the first signal path to couple a part of the signal in the first signal path into the second signal path; a second coupling component, the second coupling component being vertically stacked with the first coupling component, the second coupling component including a second substrate and a second sub-path of the second signal path located on the second substrate; a shielding component, the shielding component being provided between the first substrate and the second substrate so as to shield the first coupling component and the second coupling component from each other, the shielding component being provided with a first connection through-hole; and a first connection component, the first connection component passing through the first connection through-hole and being electrically connected between the first sub-path and the second sub-path.

[0005] According to a second aspect of the present disclosure, there is provided a base station antenna, the base station antenna including: a first radiation element array, the first radiation element array including a plurality of first radiation elements; a second radiation element array, the second radiation element array including a plurality of second radiation elements, and the operating frequency band of the second radiation elements being the same as that of the first radiation elements; the coupler as described above, the coupler being configured to couple at least one first radiation element to the second radiation element array, and / or couple at least one second radiation element to the first radiation element array.

[0006] Other features and advantages of the present disclosure will become clearer through the following detailed description of the exemplary embodiments of the present disclosure with reference to the accompanying drawings. Brief Description of the Drawings

[0007] The drawings forming a part of the specification depict embodiments of the present disclosure and, together with the specification, are used to explain the principles of the present disclosure.

[0008] Referring to the drawings, the present disclosure can be more clearly understood from the following detailed description, wherein:

[0009] Figure 1 is a schematic block diagram of a base station antenna;

[0010] Figure 2 is a schematic perspective view of a coupler;

[0011] Figure 3 is Figure 2 an exploded schematic perspective view of the coupler of;

[0012] Figure 4 is a schematic perspective view of a coupler according to an exemplary embodiment of the present disclosure;

[0013] Figure 5 is Figure 4 an exploded schematic perspective view of the coupler of;

[0014] Figure 6 is a schematic perspective view of a coupler according to another exemplary embodiment of the present disclosure;

[0015] Figure 7 is Figure 6 an exploded schematic perspective view of the coupler of.

[0016] In the embodiments described below, in some cases, the same reference numerals are used commonly between different drawings to denote the same parts or parts having similar functions, and their repeated description is omitted. In some cases, similar reference numerals and letters are used to denote similar items, and thus once an item is defined in one drawing, no further discussion thereof is required for subsequent drawings.

[0017] For ease of understanding, in some cases, the positions, sizes, ranges, etc. of the various structures shown in the drawings and the like do not represent the actual positions, sizes, ranges, etc. Therefore, the present disclosure is not necessarily limited to the positions, sizes, ranges, etc. disclosed in the drawings and the like. Detailed Description of the Embodiments

[0018] The various exemplary embodiments of the present disclosure will be described in detail below with reference to the drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present disclosure.

[0019] The following description of at least one exemplary embodiment is merely illustrative and in no way limiting of the disclosure, its application, or uses. That is, the structures and methods discussed herein are shown by way of example to explain various embodiments in accordance with the disclosure. Those skilled in the art will understand that these examples are presented only by way of illustration of the embodiments of the disclosure and not in an exhaustive manner. Additionally, the drawings are not necessarily to scale, and some features may be enlarged to show details of some specific components.

[0020] Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and devices are intended to be part of the specification.

[0021] In all examples shown and discussed herein, any specific values should be construed as merely illustrative and not restrictive. Thus, other examples of the exemplary embodiments may have different values.

[0022] Figure 1 is a schematic block diagram of a base station antenna. The base station antenna may include a first radiation element array 210, a second radiation element array 220, and a coupler 100. The first radiation element array 210 may include a plurality of first radiation elements 211, the second radiation element array 220 may include a plurality of second radiation elements 221, and the operating frequency bands of the first radiation elements 211 and the second radiation elements 221 are the same. As the distance between the first radiation element array 210 and the second radiation element array 220 decreases, the interaction between the first radiation elements 211 and the second radiation elements 221 increases correspondingly, which causes the azimuth beamwidth (AZBW) of the antenna beam generated by the corresponding first radiation element array 210 and second radiation element array 220 to become wider.

[0023] For example, in a specific example, if the first radiation element array 210 is sufficiently isolated from other radiation element arrays (e.g., by spacing the arrays far enough apart), then the first radiation element array 210 can generate an antenna beam with an azimuth beamwidth that provides a coverage range of a 120-degree sector. Similarly, if sufficiently isolated, the second radiation element array 220 can also generate an antenna beam with an azimuth beamwidth that provides a coverage range of a 120-degree sector, and a full 360-degree coverage range can be achieved in the azimuth plane with three sets of such first radiation element arrays 210 or second radiation element arrays 220. However, in practice, since the first radiation element array 210 is affected by the second radiation element array 220, the azimuth beamwidth of the antenna beam generated by the first radiation element array 210 may increase, such that the first radiation element array 210 provides a coverage range that exceeds a 120-degree sector. Similarly, the azimuth beamwidth of the antenna beam generated by the second radiation element array 220 may increase, such that the second radiation element array 220 also provides a coverage range that exceeds a 120-degree sector. As a result, the coverage areas of the first radiation element array 210 and the second radiation element array 220 may overlap with the coverage areas of the first radiation element array 210 and the second radiation element array 220 of other antennas of the base station, resulting in a reduction in the gain of all antennas and a deterioration of the sector coverage range.

[0024] To solve the above problems, a coupler 100 can be provided in the base station antenna. As Figure 1 shown, the coupler 100 can couple a portion of the signal of the first radiation element array 210 into the second radiation element array 220, and according to the principle of interference and superposition of electromagnetic waves, narrow the AZBW of the second radiation element array 220 to improve the performance of the base station antenna. Specifically, the coupler 100 can include a first port 121, a second port 122, a third port 123, and a fourth port 124. Among them, the first port 121 can be used as an input port to receive an input signal, the second port 122 can be used as a coupling port to output a coupling signal of a portion of the input signal, the third port 123 can be used as an isolation port, and the fourth port 124 can be used as an output port to output the remaining portion of the input signal. For the sake of simplicity, Figure 1Only one coupler 100 is shown. It will be understood that more couplers 100 (and coupled to other radiating elements 211, 221) can be provided as needed to couple an additional portion of the signal of the first radiating element array 210 to the second radiating element array 220, so as to narrow the AZBW of the antenna beam generated by the first radiating element array 210 to improve the performance of the antenna. Similarly, one or more additional couplers can be provided to couple a portion of the signal of the second radiating element array 220 to the first radiating element array 210, so as to narrow the AZBW of the antenna beam generated by the second radiating element array 220.

[0025] The base station antenna may further include power dividers 310 and 320. The power divider 310 can distribute corresponding portions of the signal received from the port 311 to the corresponding first radiating elements 211 in the first radiating element array 210 through the corresponding ports 312, and to the coupler 100 through the port 313. Similarly, the power divider 320 can distribute corresponding portions of the signal received from the port 321 to the corresponding second radiating elements 221 in the second radiating element array 220 through the corresponding ports 322, and to the coupler 100 through the port 323.

[0026] It will be understood that in Figure 1 the base station antenna shown, additional radiating element arrays can be included, and these radiating element arrays can be arranged to overlap with the first radiating element array 210 and the second radiating element array 220, or arranged adjacent to the first radiating element array 210 and the second radiating element array 220. In addition, other radiating element arrays can operate in the same or different frequency bands as the first radiating element array 210 and the second radiating element array 220. For radiating element arrays operating in the same frequency band, couplers can be used to improve the AZBW of each radiating element array, while for radiating element arrays operating in different frequency bands, their radiation performances generally do not interfere with each other, and can effectively expand the operating frequency band of the antenna. In some embodiments, the antenna can include radiating element arrays operating using multiple-input multiple-output (MIMO) transmission technology.

[0027] As Figure 2 and Figure 3 shown, a coupler used in a base station antenna can be a parallel-line coupler, which can include a first signal path 111' between the first port 121' and the fourth port 124', a second signal path 112' between the first port 121' and the second port 122', a third signal path 113' between the third port 123' and the second port 122', and a fourth signal path 114' between the third port 123' and the fourth port 124'.

[0028] In one configuration, the first port 121’ serves as an input port, the second port 122’ serves as a coupling port, the third port 123’ serves as an isolation port, and the fourth port 124’ serves as an output port. As Figure 2 indicated by the solid arrows in, an initial signal can be input from the first port 121’ and travel directly to the fourth port 124’ via the first signal path 111’ for output. Additionally, since the first signal path 111’ and the second signal path 112’ are partially parallel, and the second signal path 112’ and the third signal path 113’ are partially parallel, signal coupling can occur, and as Figure 2 indicated by the dashed arrows in, a portion of the initial signal can be coupled into the second signal path 112’, travel along the second signal path 112’, and then be coupled into the third signal path 113’ to be output from the second port 122’.

[0029] Similarly, in another configuration, the first port 121’ serves as an isolation port, the second port 122’ serves as an output port, the third port 123’ serves as an input port, and the fourth port 124’ serves as a coupling port. The initial signal can be input from the third port 123’ and travel directly to the second port 122’ via the third signal path 113’ for output. Additionally, a portion of the initial signal can be coupled into the fourth signal path 114’, travel along the fourth signal path 114’, and then be coupled into the first signal path 111’ to be output at the fourth port 124’.

[0030] An appropriate configuration can be selected according to requirements such as wiring to connect the coupler in the antenna to improve the performance of the antenna.

[0031] However, Figure 2 and Figure 3 the couplers shown generally have a large area and thus sufficient space needs to be reserved for them in the antenna. However, in an antenna including a large array of radiating elements, the layout space for each component tends to be limited, and especially in the case where multiple couplers are required, the configuration of the antenna will become more difficult.

[0032] To reduce the amount of space occupied by the coupler, according to an exemplary embodiment of the present disclosure, as Figures 4 to 7As shown, the coupler may include a first coupling component, a second coupling component, a shielding component 180, and a first connection component 191, where the first coupling component, the shielding component 180, and the second coupling component may be vertically stacked in sequence. In some embodiments, the first coupling component may be a printed circuit board, including a single-layer printed circuit board. Similarly, the second coupling component may also be a printed circuit board, including a single-layer printed circuit board. The shielding component 180 may be formed of a metal plate, which may shield the first coupling component and the second coupling component from each other to prevent the signal paths on the first coupling component and the signal paths on the second coupling component from interfering with each other as described below, thereby improving signal transmission.

[0033] As Figures 4 to 7 shown, the first coupling component may include a first substrate 151 and a first sub-path 1121 of a first signal path 111 and a second signal path 112 located on the first substrate 151, where the first sub-path 1121 may be configured to be at least partially coupled with the first signal path 111 to couple a part of the signal in the first signal path 111 into the second signal path 112. The second coupling component may include a second substrate 152 and a second sub-path 1122 of the second signal path 112 located on the second substrate 152. The first sub-path 1121 located on the first substrate 151 and the second sub-path 1122 located on the second substrate 152 may be connected together through the first connection component 191 to jointly form the second signal path 112, and the second signal path 112 may participate in the transmission of the coupled signal, which may be a part of the initial signal in the first signal path 111.

[0034] To provide the first connection component 191, the shielding component 180 may be provided with a first connection through-hole 181, and the first connection component 191 may pass through the first connection through-hole 181 to connect the first sub-path 1121 and the second sub-path 1122.

[0035] In an exemplary embodiment of the present disclosure, by forming the signal paths originally on the same plane on two vertically stacked planes, the area required for the signal paths can be effectively reduced, and thus the size of the coupler is reduced. Moreover, the shielding component 180 provided between the different planes where the signal paths are located can prevent interference between the signal paths on different planes, thereby improving the performance of the coupler.

[0036] In some cases, the coupled signal in the second sub-path 1122 may be directly output. In other cases, as Figures 4 to 7As shown, the second coupling component may further include a third signal path 113 located on the second substrate 152, and the third signal path 113 may be configured to be at least partially coupled to the second sub-path 1122 to couple a portion of the signal in the second signal path 112 into the third signal path 113.

[0037] Due to the coupling between the second sub-path 1122 and the third signal path 113, the magnitude of the resulting coupled signal can be further reduced, thereby helping to more accurately adjust the AzBW of the corresponding radiation element array in the antenna.

[0038] In addition, in some embodiments, the third signal path 113 may be arranged in a manner similar to the first signal path 111. Thus, the initial signal may also be first input into the third signal path 113, and then a portion of it is coupled into the second sub-path 1122, travels along the second signal path 112 to the first sub-path 1121, and is then coupled into the first signal path 111 for output. In actual operation, the appropriate paths for the initial signal and the coupled signal can be selected according to the connection mode of the coupler in the antenna and the wiring requirements, etc.

[0039] Similar to the arrangement of the second signal path 112, a fourth signal path 114 may also be arranged in the coupler to provide a redundant path, so as to facilitate the selection of the appropriate paths for the initial signal and the coupled signal according to the connection mode of the coupler in the antenna and the wiring requirements, etc. As Figures 4 to 7 shown, the second coupling component may include a third sub-path 1143 of the fourth signal path 114 located on the second substrate 152, and the third sub-path 1143 may be configured to be at least partially coupled to the third signal path 113 to couple a portion of the signal in the third signal path 113 into the fourth signal path 114. The first coupling component may further include a fourth sub-path 1144 of the fourth signal path 114 located on the first substrate 151. The third sub-path 1143 located on the second substrate 152 and the fourth sub-path 1144 located on the first substrate 151 may be connected together by a second connection component 192 to jointly form the fourth signal path 114, and the fourth signal path 114 may participate in the transmission of the coupled signal, which may be a portion of the initial signal in the third signal path 113.

[0040] To provide the second connection component 192, a second connection through-hole 182 may also be provided on the shielding component 180, and the second connection component 192 may pass through the second connection through-hole 182 to connect the third sub-path 1143 and the fourth sub-path 1144.

[0041] In some cases, the coupled signal in the fourth sub-path 1144 can be directly output. In other cases, as Figures 4 to 7 shown, the first signal path 111 can also be configured to be at least partially coupled with the fourth sub-path 1144 to couple a part of the signal in the fourth signal path 114 into the first signal path 111. Due to the coupling between the fourth sub-path 1144 and the first signal path 111, the magnitude of the resulting coupled signal can be further reduced, thereby helping to more accurately adjust the AZBW of the corresponding radiation element array in the antenna.

[0042] In the present exemplary embodiment, at least four different signal paths can be provided on different planes of the coupler to achieve different coupling requirements and effectively reduce the size of the coupler, thereby helping to efficiently utilize the space in the antenna.

[0043] Furthermore, in order to make the coupled signal in-phase with a part of the initial signal directly output via the first signal path 111 or the third signal path 113, so as to reduce the AZBW of the corresponding radiation element array by the interference superposition of electromagnetic waves, there are certain limitations on the lengths of the respective signal paths. That is, the first length of the first signal path 111 and the second length of the second signal path 112 are configured such that a part of the signal obtained by passing through the first signal path 111 is in-phase with another part of the signal obtained by passing through the second signal path 112; and the third length of the third signal path 113 and the fourth length of the fourth signal path 114 are configured such that a part of the signal obtained by passing through the third signal path 113 is in-phase with another part of the signal obtained by passing through the fourth signal path 114. By adjusting the bending shape of at least one of the first signal path 111, the second signal path 112, the third signal path 113, and the fourth signal path 114, the lengths of the respective signal paths can be adjusted while keeping the total area occupied by the signal paths unchanged as much as possible.

[0044] In some embodiments, the first length of the first signal path 111 can be equal to the third length of the third signal path 113, and / or, the second length of the second signal path 112 can be equal to the fourth length of the fourth signal path 114.

[0045] In some embodiments, as Figures 4 to 7 shown, the second length of the second signal path 112 can be greater than the first length of the first signal path 111, and / or, the fourth length of the fourth signal path 114 can be greater than the third length of the third signal path 113.

[0046] As Figures 4 to 7As shown, the coupler can be a parallel-line coupler. The first coupling segment 111a of the first signal path 111 can be parallel to the first sub-segment 1121a of the first sub-path 1121, such that the first signal path 111 is coupled to the first sub-path 1121. Similarly, the fourth coupling segment 111d of the first signal path 111 can be parallel to the fourth sub-segment 1144d of the fourth sub-path 1144, such that the first signal path 111 is coupled to the fourth sub-path 1144. In the same manner, the second coupling segment 113b of the third signal path 113 can be parallel to the second sub-segment 1122b of the second sub-path 1122, such that the third signal path 113 can be coupled to the second sub-path 1122, and the third coupling segment 113c of the third signal path 113 can be parallel to the third sub-segment 1143c of the third sub-path 1143, such that the third signal path 113 is coupled to the third sub-path 1143.

[0047] It should be noted that in a parallel-line coupler, the traveling direction of the initial signal in a certain path is opposite to the traveling direction of the coupled signal coupled from the initial signal into another path. That is, the signal traveling direction in the first coupling segment 111a is opposite to the signal traveling direction in the first sub-segment 1121a, the signal traveling direction in the fourth coupling segment 111d is opposite to the signal traveling direction in the fourth sub-segment 1144d, the signal traveling direction in the second coupling segment 113b is opposite to the signal traveling direction in the second sub-segment 1122b, and the signal traveling direction in the third coupling segment 113c is opposite to the signal traveling direction in the third sub-segment 1143c.

[0048] As Figure 5 and Figure 7 shown, in an exemplary embodiment of the present disclosure, the first sub-path 1121 and the fourth sub-path 1144 can be arranged side by side on the same side of the first substrate 151; and the second sub-path 1122 and the third sub-path 1143 can be arranged side by side on the same side of the second substrate 152, so as to make full use of the space on the first substrate 151 and the second substrate 152 to arrange the corresponding paths. In addition, as Figure 5 shown, the first sub-path 1121 and the third sub-path 1143 can be vertically stacked; and the fourth sub-path 1144 and the second sub-path 1122 can be vertically stacked, so as to reduce the area of the first substrate 151 and the second substrate 152 required.

[0049] To facilitate signal input and output from the coupler, as Figures 4 to 7As shown, the first coupling component may further include a first port 121 and a fourth port 124 located on the first substrate 151, where the first port 121 may be connected to one end of the first signal path 111 close to the first sub-path 1121, and the fourth port 124 may be connected to the other end of the first signal path 111 close to the fourth sub-path 1144. Similarly, the second coupling component may further include a second port 122 and a third port 123 located on the second substrate 152, where the second port 122 may be connected to one end of the third signal path 113 close to the second sub-path 1122, and the third port 123 may be connected to the other end of the third signal path 113 close to the third sub-path 1143.

[0050] In the coupler, any one of the first port 121, the second port 122, the third port 123, and the fourth port 124 can be used as an input port, and correspondingly, the output port, the coupling port, and the isolation port will also change to facilitate connecting the coupler to other components in different antennas. For example, when the first port 121 is used as the input port, the fourth port 124 can be used as the output port, the second port 122 can be used as the coupling port, and the third port 123 can be used as the isolation port. Or, when the third port 123 is used as the input port, the second port 122 can be used as the output port, the fourth port 124 can be used as the coupling port, and the first port 121 can be used as the isolation port.

[0051] As Figures 5 to 7 shown, to facilitate connecting the coupler to other components in the antenna, the projections of the first port 121, the second port 122, the third port 123, and the fourth port 124 in the vertical direction may be spaced apart from each other.

[0052] In addition, in the configuration where the first sub-path 1121 and the third sub-path 1143 are vertically stacked, and the fourth sub-path 1144 and the second sub-path 1122 are vertically stacked, the output port and the coupling port may be located at one end of the coupler, while the input port and the isolation port may be located at the other end of the coupler to facilitate connecting the coupler to other components.

[0053] To improve the isolation performance of the coupler, as Figures 4 to 7As shown, the first coupling component may further include a first absorption path 131 and a first absorption component 141 located on the first substrate 151, as well as a fourth absorption path 134 and a fourth absorption component 144. The first absorption path 131 may connect a first sub-segment 1121a of the first sub-path 1121 to the first absorption component 141, and the fourth absorption path 134 may connect a fourth sub-segment 1144d of the fourth sub-path 1144 to the fourth absorption component 144. Similarly, the second coupling component may further include a second absorption path 132 and a second absorption component 142 located on the second substrate 152, as well as a third absorption path 133 and a third absorption component 143. The second absorption path 132 may connect a second sub-segment 1122b of the second sub-path 1122 to the second absorption component 142, and the third absorption path 133 may connect a third sub-segment 1143c of the third sub-path 1143 to the third absorption component 143.

[0054] In some embodiments, at least one of the first absorption component 141, the second absorption component 142, the third absorption component 143, and the fourth absorption component 144 may include a resistor. To improve the tuning performance of the coupler, at least one of the first absorption component 141, the second absorption component 142, the third absorption component 143, and the fourth absorption component 144 may further include two resistors arranged in parallel. The resistance of each of these two resistors may be 50 ohms. It will be understood that in other embodiments, other absorption components may be provided to achieve the desired performance.

[0055] As Figure 5 and Figure 7 As shown, the first coupling component may further include a first grounding component 161, and the first grounding component 161 may be located on different sides of the first substrate 151 with respect to the first absorption component 141 and the fourth absorption component 144. In some embodiments, the first grounding component 161 may be formed of a metal layer and vertically stacked with the first substrate 151. Moreover, the first absorption component 141 may be electrically connected to the first grounding component 161 via a first conductive via 1513 on the first substrate 151, and the fourth absorption component 144 may be electrically connected to the first grounding component 161 via a fourth conductive via 1514 on the first substrate 151. In the same manner, the second coupling component may further include a second grounding component 162, and the second grounding component 162 may be located on different sides of the second substrate 152 with respect to the second absorption component 142 and the third absorption component 143. In some embodiments, the second grounding component 162 may also be formed of a metal layer and vertically stacked with the second substrate 152. Moreover, the second absorption component 142 may be electrically connected to the second grounding component 162 via a second conductive via 1523 on the second substrate 152, and the third absorption component 143 may be electrically connected to the second grounding component 162 via a third conductive via 1524 on the second substrate 152.

[0056] In some embodiments, the shielding component 180 may be electrically connected to the first grounding component 161 and the second grounding component 162, so that the first coupling component and the second coupling component share the same ground.

[0057] In an exemplary embodiment of the present disclosure, as Figure 5 shown, the first signal path 111, the first sub-path 1121, the fourth sub-path 1144, the first absorption path 131, the fourth absorption path 134, the first absorption component 141, and the fourth absorption component 144 are located on the first side ( Figure 5 the upper side as shown in) of the first substrate 151, and the first grounding component 161 is located on the opposite second side ( Figure 5 the lower side as shown in) of the first substrate 151. Moreover, the first substrate 151 is provided with a first non-conductive through-hole 1511 and a second non-conductive through-hole 1512, and the first grounding component is provided with a third connection through-hole 1611 and a fourth connection through-hole 1612. Moreover, the second grounding component 162 is located on the first side ( Figure 5 the upper side as shown in) of the second substrate 152, and the third signal path 113, the second sub-path 1122, the third sub-path 1143, the second absorption path 132, the third absorption path 133, the second absorption component 142, and the third absorption component 143 are located on the opposite second side ( Figure 5 the lower side as shown in) of the second substrate 152. The second substrate 152 is provided with a third non-conductive through-hole 1521 and a fourth non-conductive through-hole 1522, and the second grounding component 162 is provided with a fifth connection through-hole 1621 and a sixth connection through-hole 1622. Based on the above configuration, the first connection component 191 can connect the first sub-path 1121 to the second sub-path 1122 by sequentially passing through the first non-conductive through-hole 1511, the third connection through-hole 1611, the first connection through-hole 181, the fifth connection through-hole 1621, and the third non-conductive through-hole 1521, and the second connection component 192 can connect the third sub-path 1143 to the fourth sub-path 1144 by sequentially passing through the fourth non-conductive through-hole 1522, the sixth connection through-hole 1622, the second connection through-hole 182, the fourth connection through-hole 1612, and the second non-conductive through-hole 1512.

[0058] For the convenience of connection, the first non-conductive through-hole 1511, the third connection through-hole 1611, the first connection through-hole 181, the fifth connection through-hole 1621, and the third non-conductive through-hole 1521 may overlap in the vertical direction, so that the first connection component 191 can directly pass through these holes. In the same way, the fourth non-conductive through-hole 1522, the sixth connection through-hole 1622, the second connection through-hole 182, the fourth connection through-hole 1612, and the second non-conductive through-hole 1512 may overlap in the vertical direction, so that the second connection component 192 can directly pass through these holes.

[0059] In some embodiments, the first connection component 191 may include a first inner conductor and a first dielectric layer surrounding the first inner conductor, wherein the first inner conductor may be connected between the first sub-path 1121 and the second sub-path 1122, and the first dielectric layer may electrically insulate the first inner conductor from the first substrate 151, the first ground component 161, the shielding component 180, the second ground component 162, and the second substrate 152. Similarly, the second connection component 192 may include a second inner conductor and a second dielectric layer surrounding the second inner conductor, wherein the second inner conductor may be connected between the third sub-path 1143 and the fourth sub-path 1144, and the second dielectric layer may electrically insulate the second inner conductor from the second substrate 152, the second ground component 162, the shielding component 180, the first ground component 161, and the first substrate 151. Such a first connection component 191 may form a structure similar to a coaxial cable with the shielding component 180, wherein the shielding component 180 is equivalent to the outer conductor of the coaxial cable. Similarly, the second connection component 192 may also form a structure similar to a coaxial cable with the shielding component 180.

[0060] As Figure 4 and Figure 5 shown, in an exemplary embodiment, the first port 121 and the fourth port 124 may be located on the first side of the first substrate 151, and the second port 122 and the third port 123 may be located on the second side of the second substrate 152. Thus, the first coupling component and the second coupling component can be fabricated in a similar manner, thereby reducing the process cost.

[0061] However, in Figure 4 and Figure 5 the arrangement shown, when connecting the second port 122 and the third port 123 to another component in the base station antenna, connection operations such as welding need to be performed from the back of the coupler, resulting in inconvenience. Therefore, according to another exemplary embodiment of the present disclosure, as Figure 6 and Figure 7As shown, the second port 122 and the third port 123 may be located on the first side of the second substrate 152. To achieve connection, the second substrate 152 may also be provided with a fifth conductive via 1525 and a sixth conductive via 1526. In this way, the second port 122 may be electrically connected to the second sub-path 1122 via the fifth conductive via 1525, and the third port 123 may be electrically connected to the third sub-path 1143 via the sixth conductive via 1526. In addition, the second coupling component may further include a third grounding component 163 and a fourth grounding component 164 located on the second side of the second substrate 152. The third grounding component 163 may be configured to serve as the grounding end of the second port 122, and the fourth grounding component 164 may be configured to serve as the grounding end of the third port 123. By disposing the third grounding component 163 and the fourth grounding component 164 on the second side opposite to the first side where the second port 122 and the third port 123 are located, the consistency of grounding in the entire coupler can be achieved because the thicknesses of the first substrate 151 and the second substrate 152 may be substantially the same.

[0062] In addition, embodiments of the present disclosure may further include the following examples:

[0063] 1. A coupler, the coupler comprising:

[0064] A first coupling component, the first coupling component including a first substrate and a first sub-path of a first signal path and a second signal path located on the first substrate, the first sub-path being configured to be at least partially coupled with the first signal path to couple a part of the signal in the first signal path into the second signal path;

[0065] A second coupling component, the second coupling component being vertically stacked with the first coupling component, the second coupling component including a second substrate and a second sub-path of the second signal path located on the second substrate;

[0066] A shielding component, the shielding component being disposed between the first substrate and the second substrate so as to shield the first coupling component and the second coupling component from each other, the shielding component being provided with a first connection via; and

[0067] A first connection component, the first connection component passing through the first connection via, and the first connection component being electrically connected between the first sub-path and the second sub-path.

[0068] 2. The coupler according to 1, wherein the second coupling component further includes a third signal path located on the second substrate, the third signal path being configured to be at least partially coupled with the second sub-path to couple a part of the signal in the second signal path into the third signal path.

[0069] 3. The coupler according to 2, wherein the second coupling component further includes a third sub-path of the fourth signal path located on the second substrate, and the third sub-path is configured to be at least partially coupled to the third signal path to couple a part of the signal in the third signal path into the fourth signal path;

[0070] The first coupling component further includes a fourth sub-path of the fourth signal path located on the first substrate;

[0071] The shielding component further has a second connection through-hole; and

[0072] The coupler further includes a second connection component that passes through the second connection through-hole, and the second connection component is electrically connected between the third sub-path and the fourth sub-path.

[0073] 4. The coupler according to 3, wherein the first signal path is further configured to be at least partially coupled to the fourth sub-path to couple a part of the signal in the fourth signal path into the first signal path.

[0074] 5. The coupler according to 4, wherein the first length of the first signal path and the second length of the second signal path are configured such that a part of the signal obtained through the first signal path is in phase with another part of the signal obtained through the second signal path; and

[0075] The third length of the third signal path and the fourth length of the fourth signal path are configured such that a part of the signal obtained through the third signal path is in phase with another part of the signal obtained through the fourth signal path.

[0076] 6. The coupler according to 5, wherein the first length is equal to the third length; and / or

[0077] The second length is equal to the fourth length.

[0078] 7. The coupler according to 5, wherein the second length is greater than the first length; and / or

[0079] The fourth length is greater than the third length.

[0080] 8. The coupler according to 4, wherein the first coupling segment of the first signal path is parallel to the first sub-segment of the first sub-path, such that the first signal path is coupled to the first sub-path, and the fourth coupling segment of the first signal path is parallel to the fourth sub-segment of the fourth sub-path, such that the first signal path is coupled to the fourth sub-path; and

[0081] The second coupling segment of the third signal path is parallel to the second sub-segment of the second sub-path, such that the third signal path is coupled to the second sub-path, and the third coupling segment of the third signal path is parallel to the third sub-segment of the third sub-path, such that the third signal path is coupled to the third sub-path.

[0082] 9. The coupler according to 8, wherein the direction of signal travel in the first coupling segment is opposite to the direction of signal travel in the first sub-segment;

[0083] The direction of signal travel in the fourth coupling segment is opposite to the direction of signal travel in the fourth sub-segment;

[0084] The direction of signal travel in the second coupling segment is opposite to the direction of signal travel in the second sub-segment; and

[0085] The direction of signal travel in the third coupling segment is opposite to the direction of signal travel in the third sub-segment.

[0086] 10. The coupler according to 4, wherein the first sub-path and the fourth sub-path are arranged side by side on the same side of the first substrate; and

[0087] The second sub-path and the third sub-path are arranged side by side on the same side of the second substrate.

[0088] 11. The coupler according to 4, wherein the first sub-path and the third sub-path are vertically stacked; and

[0089] The second sub-path and the fourth sub-path are vertically stacked.

[0090] 12. The coupler according to 12, wherein the first coupling component further includes a first port and a fourth port located on the first substrate, the first port is connected to one end of the first signal path close to the first sub-path, and the fourth port is connected to the other end of the first signal path close to the fourth sub-path; and

[0091] The second coupling component further includes a second port and a third port located on the second substrate, the second port is connected to one end of the third signal path close to the second sub-path, and the third port is connected to the other end of the third signal path close to the third sub-path.

[0092] 13. The coupler according to 12, wherein the projections of the first port, the second port, the third port, and the fourth port in the vertical direction are spaced apart from each other.

[0093] 14. The coupler according to 12, wherein the first coupling component further comprises:

[0094] A first absorption path and a first absorption component located on the first substrate, the first absorption path connecting a first sub - segment of the first sub - path that is coupled to the first signal path and the first absorption component;

[0095] A fourth absorption path and a fourth absorption component located on the first substrate, the fourth absorption path connecting a fourth sub - segment of the fourth sub - path that is coupled to the first signal path and the fourth absorption component; and

[0096] The second coupling component further comprises:

[0097] A second absorption path and a second absorption component located on the second substrate, the second absorption path connecting a second sub - segment of the second sub - path that is coupled to the third signal path and the second absorption component;

[0098] A third absorption path and a third absorption component located on the second substrate, the third absorption path connecting a third sub - segment of the third sub - path that is coupled to the third signal path and the third absorption component.

[0099] 15. The coupler according to 14, wherein at least one of the first absorption component, the second absorption component, the third absorption component, and the fourth absorption component comprises a resistor.

[0100] 16. The coupler according to 15, wherein at least one of the first absorption component, the second absorption component, the third absorption component, and the fourth absorption component comprises two resistors arranged in parallel.

[0101] 17. The coupler according to 14,

[0102] The first coupling component further comprises a first grounding component, the first grounding component being located on the opposite side of the first substrate with respect to the first absorption component and the fourth absorption component, the first absorption component being electrically connected to the first grounding component via a first conductive via on the first substrate, and the fourth absorption component being electrically connected to the first grounding component via a fourth conductive via on the first substrate; and

[0103] The second coupling component further comprises a second grounding component, the second grounding component being located on the opposite side of the second substrate with respect to the second absorption component and the third absorption component, the second absorption component being electrically connected to the second grounding component via a second conductive via on the second substrate, and the third absorption component being electrically connected to the second grounding component via a third conductive via on the second substrate.

[0104] 18. The coupler according to claim 17, wherein the shielding member is electrically connected between the first grounding member and the second grounding member.

[0105] 19. The coupler according to claim 17, wherein the first signal path, the first sub-path, the fourth sub-path, the first absorption path, the fourth absorption path, the first absorption member and the fourth absorption member are located on a first side of the first substrate, the first grounding member is located on a second side opposite to the first substrate, the first substrate is provided with a first non-conductive through hole and a second non-conductive through hole, and the first grounding member is provided with a third connection through hole and a fourth connection through hole;

[0106] The second grounding member is located on a first side of the second substrate, the third signal path, the second sub-path, the third sub-path, the second absorption path, the third absorption path, the second absorption member and the third absorption member are located on a second side opposite to the second substrate, the second substrate is provided with a third non-conductive through hole and a fourth non-conductive through hole, and the second grounding member is provided with a fifth connection through hole and a sixth connection through hole;

[0107] The first connection member sequentially passes through the first non-conductive through hole, the third connection through hole, the first connection through hole, the fifth connection through hole and the third non-conductive through hole to connect the first sub-path to the second sub-path;

[0108] The second connection member sequentially passes through the fourth non-conductive through hole, the sixth connection through hole, the second connection through hole, the fourth connection through hole and the second non-conductive through hole to connect the third sub-path to the fourth sub-path.

[0109] 20. The coupler according to claim 19, wherein the first non-conductive through hole, the third connection through hole, the first connection through hole, the fifth connection through hole and the third non-conductive through hole overlap in a vertical direction; and

[0110] The fourth non-conductive through hole, the sixth connection through hole, the second connection through hole, the fourth connection through hole and the second non-conductive through hole overlap in a vertical direction.

[0111] 21. The coupler according to claim 19, wherein the first connection member includes a first inner conductor and a first dielectric layer surrounding the first inner conductor, the first inner conductor is connected between the first sub-path and the second sub-path, and the first dielectric layer electrically insulates the first inner conductor from the first substrate, the first grounding member, the shielding member, the second grounding member and the second substrate; and / or

[0112] The second connection component includes a second inner conductor and a second dielectric layer surrounding the second inner conductor. The second inner conductor is connected between the third sub-path and the fourth sub-path, and the second dielectric layer electrically insulates the second inner conductor from the second substrate, the second grounding component, the shielding component, the first grounding component, and the first substrate.

[0113] 22. The coupler according to 19, wherein the first port and the fourth port are located on a first side of the first substrate.

[0114] 23. The coupler according to 19, wherein the second port and the third port are located on a second side of the second substrate.

[0115] 24. The coupler according to 19, wherein the second port and the third port are located on a first side of the second substrate;

[0116] The second coupling component further includes a third grounding component and a fourth grounding component located on a second side of the second substrate. The second substrate is further provided with a fifth conductive via and a sixth conductive via;

[0117] Wherein, the second port is electrically connected to the second sub-path via the fifth conductive via, the third grounding component is configured to serve as the grounding end of the second port, and the third port is electrically connected to the third sub-path via the sixth conductive via, and the fourth grounding component is configured to serve as the grounding end of the third port.

[0118] 25. The coupler according to 17, wherein the first grounding component includes a first metal layer vertically stacked with the first substrate; and / or

[0119] The second grounding component includes a second metal layer vertically stacked with the second substrate.

[0120] 26. The coupler according to 1, wherein the first coupling component includes a first printed circuit board; and / or

[0121] The second coupling component includes a second printed circuit board.

[0122] 27. A base station antenna, the base station antenna comprising:

[0123] A first radiation element array, the first radiation element array including a plurality of first radiation elements;

[0124] A second radiation element array, the second radiation element array including a plurality of second radiation elements, and the operating frequency band of the second radiation element is the same as that of the first radiation element;

[0125] The coupler according to any one of 1 to 26, the coupler being configured to couple at least one first radiating element to the second radiating element array, and / or to couple at least one second radiating element to the first radiating element array.

[0126] 28. The base station antenna according to 27, the base station antenna comprising a multiple-input multiple-output antenna.

[0127] As used herein, the words "front", "rear", "top", "bottom", "above", "below", etc., if present, are used for descriptive purposes and do not necessarily describe invariant relative positions. It should be understood that such words are interchangeable under appropriate circumstances, such that the embodiments of the present disclosure described herein, for example, can operate in other orientations different from those shown or otherwise described herein.

[0128] As used herein, the word "exemplary" means "serving as an example, instance, or illustration", rather than as a "model" to be precisely replicated. Any implementation described exemplarily herein is not necessarily to be construed as preferred or advantageous over other implementations. Moreover, the present disclosure is not limited by any theory expressed or implied in the above technical field, background art, summary of the invention, or detailed description.

[0129] As used herein, the word "substantially" means including any minor variations caused by design or manufacturing defects, tolerances of devices or components, environmental effects, and / or other factors. The word "substantially" also allows for differences from a perfect or ideal situation due to parasitic effects, noise, and other practical considerations that may exist in an actual implementation.

[0130] Additionally, the previous description may have referred to elements or nodes or features that are "connected" or "coupled" together. As used herein, unless otherwise explicitly stated, "connected" means that one element / node / feature is connected (or communicates) with another element / node / feature electrically, mechanically, logically, or otherwise. Similarly, unless otherwise explicitly stated, "coupled" means that one element / node / feature can be connected to another element / node / feature either directly or indirectly mechanically, electrically, logically, or otherwise to allow interaction, even if the two features may not be directly connected. That is, "coupled" is intended to encompass both direct and indirect connections of elements or other features, including connections using one or more intermediate elements.

[0131] Additionally, for reference purposes only, terms such as "first", "second", and the like may also be used in this document, and thus are not intended to be limiting. For example, unless the context clearly indicates otherwise, the words "first", "second", and other such numerical words referring to structures or elements do not imply an order or sequence.

[0132] It should also be noted that, as used herein, the words "comprising", "including", "having", and any other variants specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0133] In this disclosure, the term "provide" is broadly intended to cover all ways of obtaining an object, so the expression "provide an object" includes, but is not limited to, "purchase", "prepare / manufacture", "arrange / set up", "install / assemble", and / or "order" the object, etc.

[0134] Those skilled in the art should also recognize that the boundaries between the above operations are merely illustrative. Multiple operations can be combined into a single operation, a single operation can be distributed among additional operations, and operations can be performed at least partially overlapping in time. Moreover, alternative embodiments can include multiple instances of a particular operation, and the order of operations can be changed in various other embodiments. However, other modifications, variations, and substitutions are also possible. Therefore, this specification and the drawings should be regarded as illustrative rather than restrictive.

[0135] Although some specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the above examples are only intended to be illustrative and not to limit the scope of this disclosure. The embodiments disclosed herein can be combined with each other arbitrarily without departing from the spirit and scope of this disclosure. Those skilled in the art should understand that the above embodiments can be modified without departing from the spirit and scope of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. A coupler, characterized in that: The coupler comprises: a first coupling component, the first coupling component comprising a first substrate, a first signal path and a first subpath of a second signal path located on the first substrate, a fourth subpath of a fourth signal path located on the first substrate, and a first port and a fourth port located on the first substrate, the first subpath being configured to at least partially couple with the first signal path to couple a portion of a signal in the first signal path to the second signal path, the first port being connected to one end of the first signal path close to the first subpath, and the fourth port being connected to the other end of the first signal path close to the fourth subpath; a second coupling component stacked vertically with the first coupling component, the second coupling component comprising a second substrate, a second subpath of the second signal path located on the second substrate, a third signal path located on the second substrate, a third subpath of the fourth signal path located on the second substrate, and a second port and a third port located on the second substrate, the third signal path being configured to at least partially couple with the second subpath to couple a portion of the signal in the second signal path to the third signal path, the third subpath being configured to at least partially couple with the third signal path to couple a portion of the signal in the third signal path to the fourth signal path, the second port being connected to one end of the third signal path proximate to the second subpath, and the third port being connected to the other end of the third signal path proximate to the third subpath; a shielding component, the shielding component being provided between the first substrate and the second substrate so as to shield the first coupling component and the second coupling component from each other, the shielding component being provided with a first connecting through hole and a second connecting through hole; a first connecting member passing through the first connecting through-hole and electrically connecting the first sub-path and the second sub-path; and A second connecting component passes through the second connecting through-hole and is electrically connected between the third sub-path and the fourth sub-path.

2. The coupler according to claim 1, wherein: The first signal path is further configured to be at least partially coupled to the fourth sub-path to couple a portion of the signal in the fourth signal path into the first signal path.

3. The coupler according to claim 2, wherein: The first length of the first signal path and the second length of the second signal path are configured such that a portion of the signal passing through the first signal path is in phase with another portion of the signal passing through the second signal path; and The third length of the third signal path and the fourth length of the fourth signal path are configured such that a portion of the signal obtained through the third signal path is in phase with another portion of the signal obtained through the fourth signal path.

4. The coupler according to claim 3, wherein: The first length is equal to the third length; and / or The second length is equal to the fourth length.

5. The coupler according to claim 3, wherein: The second length is greater than the first length; and / or The fourth length is greater than the third length.

6. The coupler according to claim 2, wherein: The first coupling segment of the first signal path is parallel to the first subsegment of the first subpath, so that the first signal path is coupled to the first subpath, and the fourth coupling segment of the first signal path is parallel to the fourth subsegment of the fourth subpath, so that the first signal path is coupled to the fourth subpath; and The second coupling segment of the third signal path is parallel to the second sub-segment of the second sub-path, so that the third signal path is coupled to the second sub-path, and the third coupling segment of the third signal path is parallel to the third sub-segment of the third sub-path, so that the third signal path is coupled to the third sub-path.

7. The coupler according to claim 6, wherein: The direction of signal travel in the first coupling section is opposite to the direction of signal travel in the first subsection; The direction of signal travel in the fourth coupling segment is opposite to the direction of signal travel in the fourth sub-segment; The direction of signal travel in the second coupling section is opposite to the direction of signal travel in the second sub-section; and A signal traveling direction in the third coupling section is opposite to a signal traveling direction in the third sub-section.

8. The coupler according to claim 2, wherein: The first sub-path and the fourth sub-path are arranged side by side on the same side of the first substrate; and The second sub-path and the third sub-path are arranged side by side on the same side of the second substrate.

9. The coupler according to claim 2, wherein: The first sub-path is vertically stacked with the third sub-path; and The second sub-path is vertically stacked with the fourth sub-path.

10. The coupler according to claim 2, wherein: Projections of the first port, the second port, the third port, and the fourth port in a vertical direction are spaced apart from each other.

11. The coupler according to claim 2, wherein: The first coupling component further includes: a first absorption path and a first absorption component located on the first substrate, the first absorption path connecting a first subsegment of the first subpath coupled to the first signal path and the first absorption component; a fourth absorption path and a fourth absorption component located on the first substrate, the fourth absorption path connecting a fourth subsegment of the fourth subpath coupled to the first signal path and the fourth absorption component; and The second coupling component further includes: a second absorption path and a second absorption component located on the second substrate, the second absorption path connecting a second subsegment of the second subpath coupled to the third signal path and the second absorption component; A third absorption path and a third absorption component are located on the second substrate, wherein the third absorption path connects a third subsegment of the third sub-path coupled with the third signal path and the third absorption component.

12. The coupler according to claim 11, wherein: At least one of the first absorption member, the second absorption member, the third absorption member, and the fourth absorption member includes a resistor.

13. The coupler according to claim 12, wherein: At least one of the first absorbing member, the second absorbing member, the third absorbing member, and the fourth absorbing member includes two resistors arranged in parallel.

14. The coupler according to claim 11, wherein: The first coupling component further includes a first grounding component, the first grounding component being located on an opposite side of the first substrate relative to the first absorbing component and the fourth absorbing component, the first absorbing component being electrically connected to the first grounding component via a first conductive via on the first substrate, and the fourth absorbing component being electrically connected to the first grounding component via a fourth conductive via on the first substrate; and The second coupling component further includes a second grounding component, which is located on an opposite side of the second substrate relative to the second absorbing component and the third absorbing component. The second absorbing component is electrically connected to the second grounding component via a second conductive via on the second substrate, and the third absorbing component is electrically connected to the second grounding component via a third conductive via on the second substrate.

15. The coupler according to claim 14, wherein: The shielding member is electrically connected between the first ground member and the second ground member.

16. The coupler according to claim 14, wherein: The first signal path, the first sub-path, the fourth sub-path, the first absorption path, the fourth absorption path, the first absorption component, and the fourth absorption component are located on a first side of the first substrate, the first ground component is located on an opposite second side of the first substrate, the first substrate is provided with a first non-conductive through-hole and a second non-conductive through-hole, and the first ground component is provided with a third connecting through-hole and a fourth connecting through-hole; The second grounding component is located on a first side of the second substrate, the third signal path, the second sub-path, the third sub-path, the second absorption path, the third absorption path, the second absorption component, and the third absorption component are located on an opposite second side of the second substrate, the second substrate is provided with a third non-conductive through-hole and a fourth non-conductive through-hole, and the second grounding component is provided with a fifth connecting through-hole and a sixth connecting through-hole; The first connecting component sequentially passes through the first non-conductive through-hole, the third connecting through-hole, the first connecting through-hole, the fifth connecting through-hole, and the third non-conductive through-hole to connect the first sub-path to the second sub-path; The second connecting member sequentially passes through the fourth non-conductive through-hole, the sixth connecting through-hole, the second connecting through-hole, the fourth connecting through-hole, and the second non-conductive through-hole to connect the third sub-path to the fourth sub-path.

17. The coupler according to claim 16, wherein: The first non-conductive via, the third connecting via, the first connecting via, the fifth connecting via, and the third non-conductive via overlap in a vertical direction; and The fourth non-conductive via, the sixth connection via, the second connection via, the fourth connection via, and the second non-conductive via overlap in a vertical direction.

18. The coupler according to claim 16, wherein: The first connecting component includes a first inner conductor and a first dielectric layer surrounding the first inner conductor, the first inner conductor is connected between the first sub-path and the second sub-path, and the first dielectric layer electrically insulates the first inner conductor from the first substrate, the first ground component, the shielding component, the second ground component, and the second substrate; and / or The second connecting component includes a second inner conductor and a second dielectric layer surrounding the second inner conductor, the second inner conductor is connected between the third sub-path and the fourth sub-path, and the second dielectric layer electrically insulates the second inner conductor from the second substrate, the second ground component, the shielding component, the first ground component and the first substrate.

19. The coupler according to claim 16, wherein: The first port and the fourth port are located on a first side of the first substrate.

20. The coupler according to claim 16, wherein The second port and the third port are located on the second side of the second substrate.

21. The coupler according to claim 16, wherein The second port and the third port are located on the first side of the second substrate; The second coupling component further includes a third grounding component and a fourth grounding component located on the second side of the second substrate, and the second substrate is further provided with a fifth conductive through hole and a sixth conductive through hole; The second port is electrically connected to the second sub-path via the fifth conductive via, the third grounding component is configured to serve as a grounding terminal of the second port, and the third port is electrically connected to the third sub-path via the sixth conductive via, and the fourth grounding component is configured to serve as a grounding terminal of the third port.

22. The coupler according to claim 14, wherein The first grounding component includes a first metal layer vertically stacked on the first substrate; and / or The second grounding member includes a second metal layer vertically stacked on the second substrate.

23. The coupler according to claim 1, wherein The first coupling component comprises a first printed circuit board; and / or The second coupling component includes a second printed circuit board.

24. A base station antenna, characterized in that: The base station antenna comprises: a first radiating element array, the first radiating element array comprising a plurality of first radiating elements; a second radiating element array, wherein the second radiating element array includes a plurality of second radiating elements, and an operating frequency band of the second radiating elements is the same as an operating frequency band of the first radiating elements; The coupler according to any one of claims 1 to 23, the coupler being configured to couple at least one first radiating element to the second radiating element array, and / or to couple at least one second radiating element to the first radiating element array.

25. The base station antenna according to claim 24, characterized in that The base station antenna includes a multiple-input multiple-output antenna.

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