Component mounting device and component warpage detection method

Abstract

The present invention can improve the robustness of ball height measurement and component warpage measurement of ball components, thereby more accurately determining whether a ball component is a defective component. The component mounting device includes: an imaging unit that captures images of a plurality of balls on the lower surface of a component held by a mounting head from multiple different directions; a defective ball determination unit that determines whether each of the plurality of balls is a defective ball based on each of the multiple images captured by the imaging unit from the multiple different directions; a ball height measuring unit that measures the height of each ball not determined as a defective ball by the defective ball determination unit; and a component warpage detection unit that detects component warpage based on the height of each ball measured by the ball height measuring unit.

Description

Technical Field

[0001] The invention relates to a component mounting device and a component warpage detection method. Background Art

[0002] Patent Document 1 discloses a component recognition method that captures images of a hemispherical terminal attached to an electronic component mounted on a printed wiring board from multiple directions and detects the height of the hemispherical terminal based on multiple images obtained from different shooting directions. This method captures the hemispherical terminal from an oblique angle, then rotates the electronic component by a predetermined angle about an axis perpendicular to the mounting surface. The hemispherical terminal is then captured again from an oblique angle, and the height of the hemispherical terminal is detected using both the pre-rotation and post-rotation images.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2005-340648

[0006] However, Patent Document 1 uses pre-rotation and post-rotation images to detect the height of the electronic component based on the height of all hemispherical terminals, including the defective one. This may result in inaccurate measurement of the warpage of the electronic component. Furthermore, in Patent Document 1, if a hemispherical terminal is defective, the shape of the hemispherical terminal shown in the pre-rotation and post-rotation images will differ, making it impossible to accurately measure the height of the terminal. This may result in the misidentification of a non-warped electronic component as a defective warped component. Summary of the Invention

[0007] Problems to be solved by the invention

[0008] The present invention has been made in view of the above-mentioned conventional situation, and its object is to provide a component mounting device and a component warpage detection method that can improve the robustness of ball height measurement and component warpage measurement of a ball component and thereby more accurately determine whether a ball component is a defective component.

[0009] Solutions to Problems

[0010] The present invention provides a component mounting device, comprising: a photographing unit, which photographs a plurality of balls provided on the lower surface of a component held by a mounting head from a plurality of different directions; a defective ball determination unit, which determines whether the plurality of balls are defective balls based on each of a plurality of photographed images taken by the photographing unit from the plurality of different directions; a ball height measuring unit, which measures the height of each ball that is not determined to be a defective ball by the defective ball determination unit; and a component warping detection unit, which detects the warping of the component based on the height of each of the balls measured by the ball height measuring unit.

[0011] In addition, the present invention provides a component warpage measurement method, wherein a plurality of balls provided on the lower surface of a component held by a mounting head are photographed separately from a plurality of different directions, and based on each of a plurality of photographed images taken from the plurality of different directions, it is determined whether the plurality of balls are defective balls, the height of each ball that is not determined to be the defective ball is measured, and the warpage of the component is detected based on the measured height of each of the balls.

[0012] Effects of the Invention

[0013] According to the present invention, the robustness of ball height measurement and component warpage measurement of a ball component can be improved, thereby more accurately determining whether the ball component is a defective component. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a diagram showing the component mounting device according to the embodiment as viewed from above.

[0015] Figure 2 It shows Figure 1 A side view of an example of the mechanical structure of a component mounting device shown.

[0016] Figure 3 This is a perspective view showing a component mounting step from suction to mounting of components by a mounting head.

[0017] Figure 4 This is a perspective view showing an example of the internal structure of a component recognition camera.

[0018] Figure 5 This is a diagram illustrating the positional relationship between the component recognition camera and the ball component.

[0019] Figure 6 This is a block diagram illustrating the functional configuration of a control unit of a component mounting apparatus.

[0020] Figure 7 This is a diagram showing an example of the bottom surface of a ball member.

[0021] Figure 8This is a flowchart for explaining an example of a component warpage detection procedure of the component mounting device according to the embodiment.

[0022] Figure 9 These are diagrams for explaining an example of a component warpage detection procedure of the component mounting device according to the embodiment.

[0023] Description of Reference Numerals

[0024] 1 Component mounting device

[0025] 26 Mounting head

[0026] 28 Parts Recognition Camera

[0027] 28A right camera

[0028] 28B Left Camera

[0029] 40 Control Unit

[0030] 41 Storage

[0031] 42 Mechanism drive unit

[0032] 43 Shooting Processing Department

[0033] 43B Defective Ball Determination Unit

[0034] 43C Ball height measurement unit

[0035] 43D Parts Warpage Detection Unit

[0036] 43E Defective Parts Judgment Department

[0037] BP, BP1, BP2 ball parts

[0038] B1, B2, B3, B4, B5, B6 solder balls

[0039] F1, F2 capture images

[0040] P parts

[0041] UP, UP1, UP2 lower surface

[0042] W substrate. DETAILED DESCRIPTION

[0043] Hereinafter, the embodiments of the component mounting device and the component warpage detection method that specifically disclose the present invention will be described in detail with appropriate reference to the accompanying drawings. However, sometimes overly detailed descriptions are omitted. For example, sometimes detailed descriptions of matters that are already well known and repeated descriptions of substantially the same structures are omitted. This is to avoid the following description from becoming too lengthy and to make it easy for those skilled in the art to understand. It should be noted that the drawings and the following description are provided to enable those skilled in the art to fully understand the present invention, and they are not used to limit the subject matter described in the technical solution.

[0044] For example, the "unit" or "device" mentioned in the embodiments is not limited to physical structures mechanically implemented by hardware, but also includes structures that implement the functions of the structure through software such as programs. In addition, the functions of a structure can be implemented by two or more physical structures, and the functions of two or more structures can be implemented by one physical structure.

[0045] Reference Figure 1 , the structure of the component mounting device 1 is described. Figure 1 This is a diagram showing the component mounting device 1 according to the embodiment as viewed from above. Figure 2 It shows Figure 1 The side view of the mechanical structure example of the component mounting device 1 shown in FIG. Figure 1 as well as Figure 2 In the embodiment, the front side of the component mounting device 1 (in Figure 1 The lower side is in the paper. Figure 2 The left side in the paper) is called the front side, and the back side of the component mounting device 1 (the Figure 1 The upper side is in the paper. Figure 2 The right side in the paper is called the back side.

[0046] The component mounting apparatus 1 is located in a component mounting production line (not shown) for manufacturing mounting substrates, and is used to mount one or more components P (e.g., electronic components such as ICs (Integrated Circuits), transistors, capacitors, or BGA components) on a loaded substrate W. The component mounting apparatus 1 is housed within a base 12 (described below) and includes a control unit 40 for controlling various components of the component mounting apparatus 1.

[0047] It should be noted that, while the present embodiment shows an example in which a pair of component feeding mechanisms 15 are provided on both sides (in the Y direction and the -Y direction) of a pair of substrate conveying mechanisms 13 that convey substrates W, a configuration in which component feeding mechanisms 15 are provided on only one side is also possible. Furthermore, while the present embodiment shows an example in which the component mounting apparatus 1 has a single lane configuration capable of conveying one substrate, a dual lane configuration capable of simultaneously conveying two substrates is also possible.

[0048] And, for Figure 1 as well as Figure 2 The component mounting apparatus 1 of the illustrated embodiment uses an example of a method for supplying substrate mounting components P to be mounted on a substrate W using a tape feeder 18 containing components P. However, the method for supplying components is not limited to the tape feeder 18. For example, a tray containing components may be used, or a tape feeder 18 and a tray may be used in combination. It should be noted that, in the case of using the tape feeder 18, the component supply mechanism 15 includes a tape feeder, and in the case of using a tray, the component supply mechanism 15 includes a tray feeder.

[0049] In the center of the base 12 of the mounting machine body 11, along Figure 1 A substrate conveying mechanism 13 is provided in the X direction (the conveying direction of the substrate W) shown. The substrate conveying mechanism 13 includes a pair of conveyor sections 14 extending in the X direction, and conveys the substrate W placed on the pair of conveyor sections 14 and positions and holds the substrate W at a predetermined mounting position.

[0050] A pair of front and rear component feeding mechanisms 15 are respectively disposed on the front and rear sides of the substrate conveying mechanism 13 (at the Figure 1 The paper is the upper and lower sides, Figure 2 The pair of component supply mechanisms 15 each includes a feeder base 16 having a slot 17 , and a plurality of tape feeders 18 accommodating components P as part feeders are mounted in parallel in the slots 17 .

[0051] In addition, the component mounting device 1 also includes a feeder cart 19. The feeder cart 19 is configured to include a trolley portion 20 having a plurality of wheels provided on its lower side, and a plurality of reel storage portions (not shown) provided on the upper side of the trolley portion 20. Reels 21 are respectively stored in the plurality of reel storage portions. A carrier tape 22 containing components P is pulled out from each reel 21 and fed to the tape feeder 18 of the component supply mechanism 15, thereby supplying the components P to a removal position where removal (pickup) is performed. Thus, the tape feeder 18 of the component supply mechanism 15 feeds the carrier tape 22 by a pitch in the tape feed direction, thereby supplying it to a component removal position where the components P are removed (pickup) by the mounting head 26 of the component mounting mechanism 23 described below.

[0052] The component mounting mechanism 23 is disposed above the base 12 and is configured to be movable within a range between a component removal position where the component supply mechanism 15 is provided and a substrate transfer position for transferring the substrate W. Specifically, the component mounting mechanism 23 is capable of linear movement in the X and Y directions on a plane substantially parallel to the surface of the substrate W by means of an X-axis table mechanism 25 and a Y-axis table mechanism 24 that are arranged orthogonally to each other.

[0053] The Y-axis worktable mechanism 24 is arranged on the upper surface of the base 12 along the Y direction. In addition, a pair of front and rear X-axis worktable mechanisms 25 are arranged along the X direction and are respectively mounted on the Y-axis worktable mechanism 24 in a manner that allows them to slide along the Y direction. In addition, the mounting head 26 is mounted on the front and rear pair of X-axis worktable mechanisms 25 in a manner that allows them to slide along the X direction. That is, in the embodiment, the component mounting mechanism 23 is equipped with a mounting head 26, and the mounting head 26 is configured to be able to move independently of each other through the X-axis worktable mechanism 25 and the Y-axis worktable mechanism 24. Thus, the mounting head 26 can be arbitrarily positioned on a plane that is roughly parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). It should be noted that the X-axis worktable mechanism 25 and the Y-axis worktable mechanism 24 are both composed of linear guide drive mechanisms.

[0054] A component recognition camera 28 (an example of an imaging unit) is provided between the front and rear component supply mechanisms 15 and the substrate conveyor mechanism 13. While the component P is being taken out and held by the component supply mechanism 15, the component holding nozzle 27 (see below) attached to the mounting head 26 moves and passes over the component recognition camera 28. At this time, the component recognition camera 28 captures an image of the component P held by the component holding nozzle 27 at a predetermined timing.

[0055] The component recognition camera 28 is composed of cameras (specifically, a right camera 28A, a left camera 28B, and a lower camera 28C) positioned at multiple different angles. It should be noted that if the component P is a ball component (e.g., a BGA (Ball Grid Array), a CSP (Chip Size Package), an interposer, etc.) having solder balls (an example of balls) on its lower surface, the component recognition camera 28 uses the right camera 28A and the left camera 28B to capture images of the ball component from different angles based on control signals input from the control unit 40.

[0056] In addition, a nozzle holder 38 and a waste box 37 are provided between the front and rear pair of component supply mechanisms 15 and the substrate conveying mechanism 13. The nozzle holder 38 stores the various component holding nozzles 27 of the mounting head 26 in a manner corresponding to the component P to be held. By bringing the mounting head 26 into contact with the nozzle holder 38 and performing a prescribed nozzle replacement action, a component holding nozzle 27 (described below) suitable for the holding object is assembled to the mounting head 26. The waste box 37 is formed in a box shape and has an internal space, into which components P, etc. that are identified and photographed by the component recognition camera 28 and are judged to be defective, are discarded.

[0057] Next, refer to Figure 3 The structure and operation of the mounting head 26 will be described. Figure 3 2 is a perspective view showing the component mounting step of the component P from being adsorbed to being mounted by the mounting head 26. Figure 3 For simplicity of explanation, the mounting head 26 shown in the figure is equipped with a single component holding nozzle 27. However, a multi-head (not shown) equipped with multiple component holding nozzles may also be used. In addition, a reflector (not shown) is fixed to the mounting head 26 for reflecting the illumination light emitted from the transmissive illumination unit (not shown). The reflector is arranged above the held component P.

[0058] The component holding nozzle 27 vacuum-adsorbs and holds the component P from the tape feeder 18 fed to the component removal position of the component supply mechanism 15, for example, using air pressure, and then raises and lowers it. In addition, the mounting head 26 also has a Z-axis lifting mechanism (not shown) that raises and lowers the component holding nozzle 27, and a θ-axis rotation mechanism (not shown) that rotates the component holding nozzle 27 independently around the nozzle axis. Driven by the Y-axis worktable mechanism 24 and the X-axis worktable mechanism 25, the mounting head 26 is arbitrarily positioned on the horizontal plane (XY plane). Through this movement, the mounting head 26 uses the component holding nozzle 27 to adsorb and remove the component P from the removal position of the tape feeder 18 of the component supply mechanism 15.

[0059] A substrate recognition camera 36 (see FIG. 1 ) is fixed to the mounting head 26 and is disposed on the lower surface side of the X-axis table mechanism 25 and moves integrally with the mounting head 26. Figure 1 As the mounting head 26 moves, the substrate recognition camera 36 passes over the substrate W that has been transported to the substrate transport position and positioned by the substrate transport mechanism 13, and images the substrate W. This image capture result (image capture information) is also recognized and processed by the control unit 40, thereby detecting the transport position and posture of the substrate W.

[0060] As a result of detecting the conveying position and posture of the substrate W, the mounting head 26 mounts the component P in a predetermined posture at a predetermined component mounting position using the component holding nozzle 27 based on control instructions from the control unit 40. In this way, the component P is held and moved by the component holding nozzle 27 of the mounting head 26 between the component removal position and the component mounting position, and is then mounted on the substrate W.

[0061] The component mounting apparatus 1 repeatedly performs a series of operations, including the removal, installation, and return of multiple components P by the component holding nozzle 27 of the mounting head 26 to the component removal position, until all components are mounted at the multiple mounting positions on the substrate W. This repetition of operations allows multiple components P to be sequentially mounted on each of the substrates W being transported, and a substrate W with all the components P to be mounted by the component mounting apparatus 1 is transported to the next process (downstream process). In this manner, the mounting machine main body 11 and the component mounting mechanism 23 operate in coordination, with this coordinated operation being executed under the direction of the control unit 40.

[0062] Next, refer to Figure 4 The structure of the component recognition camera 28 will be described. Figure 4 It is a perspective view showing an example of the internal structure of the component recognition camera 28 .

[0063] like Figure 4 As shown, the component recognition camera 28 includes multiple right cameras 28A, multiple left cameras 28B, and a lower camera 28C. One right camera 28A and one left camera 28B, facing each other with a mirror 281C of the lower camera 28C interposed therebetween, function as a stereo camera set. It should be noted that while the component recognition camera 28 of this embodiment includes two right cameras 28A and two left cameras 28B to achieve a wider viewing angle, a configuration with one right camera 28A and one left camera 28B each is also possible, or a configuration with three right cameras 28A and three left cameras 28B each is also possible.

[0064] The right camera 28A is configured to include a lens 281A respectively incorporated in a mirror body 283A, and an image sensor 282A for the right camera.

[0065] The left camera 28B is configured to include a lens (not shown) respectively built into a mirror body 283B, and an image sensor 282B for the left camera.

[0066] The lower camera 28C is configured to include lenses (not shown) each incorporated in a mirror body 281C, image sensors 282C and 283C for the lower camera, and a prism 281P.

[0067] The image sensors 282A, 282B, 282C, and 283C are formed of, for example, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor).

[0068] The right camera 28A, the left camera 28B, and the lower camera 28C are arranged with their optical axes oriented in the vertical direction (Z direction) and are capable of capturing images of parts P moving above the part recognition camera 28. Furthermore, the right camera 28A, the left camera 28B, and the lower camera 28C have shutter functions and are configured to capture images at predetermined timings in response to control commands from an image processing unit 43 (described below) of the control unit 40. The right camera 28A, the left camera 28B, and the lower camera 28C transmit the captured images (captured images) to the control unit 40.

[0069] Next, refer to Figure 5 The positional relationship when the component recognition camera 28 captures an image of the ball component BP will be described. Figure 5 This is a diagram for explaining the positional relationship between the component recognition camera 28 and the ball component BP.

[0070] The right camera 28A and the left camera 28B, which are stereo cameras included in the component recognition camera 28, capture images from different angles of the lower surface of the ball component BP being conveyed over the component recognition camera 28 while being held by the component holding nozzle 27 attached to the mounting head 26. The two right cameras 28A and the two left cameras 28B each transmit the captured images to the image processing unit 43.

[0071] The imaging processing unit 43 determines whether each solder ball included in the ball component BP is a defective ball based on the multiple captured images sent from the two right cameras 28A and the two left cameras 28B. In addition, the imaging processing unit 43 sets a plane passing through points on the optical axes of the lenses included in the right camera and the left camera and at an equal distance H1 from the surface of each lens as a reference plane H0. Here, the distance H1 used to set the reference plane H0 is set to a value such as 4 mm. Based on each of the multiple captured images captured by the two right cameras 28A and the two left cameras 28B, the imaging processing unit 43 measures the distance H2 from the surface to the reference plane H0 of the solder balls (hereinafter referred to as "normal balls") among the multiple solder balls included in the ball component BP that are determined not to be defective balls as the ball height.

[0072] Next, refer to Figure 6 The functions of the control unit 40 of the component mounting device 1 according to the embodiment will be described. Figure 6 1 is a block diagram illustrating the functional configuration of the control unit 40 of the component mounting apparatus 1 .

[0073] The control unit 40 of the component mounting device 1 is constructed using, for example, a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array), and cooperates with the storage unit 41 to perform various processing and control. Specifically, the control unit 40 refers to the program and data stored in the storage unit 41, and realizes the functions of each unit by executing the program. The units mentioned here are, for example, the mechanism driving unit 42 and the imaging processing unit 43. The control unit 40 uses the above-mentioned units to perform the functions of determining whether each solder ball possessed by the ball component BP is a defective ball, detecting the warping of the ball component BP based on the ball height of each normal ball of the ball component BP, and determining whether the ball component BP is a defective component based on the warping of the ball component BP.

[0074] If the component removed by the mounting head 26 is a ball component BP having a solder ball, the control unit 40 uses the right camera 28A and the left camera 28B of the component recognition camera 28 to image the ball component BP. On the other hand, if the component removed by the mounting head 26 is a component without a solder ball (i.e., not a ball component BP), the control unit 40 uses the lower camera 28C, or a combination of the lower camera 28C and the right camera 28A or the left camera 28B, to image the component.

[0075] The storage unit 41 includes, for example, a RAM (Random Access Memory) serving as work memory used when executing various processes of the control unit 40, and a ROM (Read Only Memory) storing programs and data that define the operations of the control unit 40. The RAM temporarily stores data or information generated or acquired by the control unit 40. The ROM is written with programs that define the operations of the control unit 40. The storage unit 41 stores mounting data 41A, component data 41B, ball height information 41C, and component warpage data 41D.

[0076] The installation data 41A is information related to the substrate W and multiple components installed on the substrate W, and includes height information (i.e., thickness information) of the substrate W, information about the components supplied by each carrier 22 respectively arranged in multiple slots 17, information about the component installation position of each component, etc.

[0077] The component data 41B is information related to the component and includes, for example, the component name, component size, component thickness (height in the Z direction), the number and position of electrodes provided on the component, etc. Furthermore, if the component is a ball component BP, the component data 41B stores information indicating that the component is a ball component, the number of solder balls included in the component, and position information of each solder ball.

[0078] The ball height information 41C is stored in association with the component data 41B of each ball component BP, and includes information such as the height (height in the Z direction) of the solder ball included in the ball component BP.

[0079] The component warpage data 41D is stored in association with the component data 41B of each of a plurality of components, and includes information on a component warpage threshold for determining whether a component is a defective component based on the component warpage detected by the component warpage detector 43D.

[0080] The mechanism driving unit 42 drives the substrate conveying mechanism 13, the component mounting mechanism 23, and the tape feeding mechanism 29 based on the control command output from the control unit 40. It should be noted that the tape feeding mechanism 29 is a mechanism for feeding the carrier tape 22 containing the components to be mounted on the substrate W and delivering the components to the component removal position.

[0081] The mechanism drive unit 42 drives the substrate transport mechanism 13 to transport the substrate W to the substrate transport position. Furthermore, upon receiving information about the corrected substrate transport position and the component mounting positions of the components P from the control unit 40, the mechanism drive unit 42 drives the tape feed mechanism 29 to deliver the components mounted on the substrate W to the respective component removal positions. The mechanism drive unit 42 drives the component mounting mechanism 23 to suction-hold the components at the respective component removal positions, remove the components, and transport the components so that they pass over the component recognition camera 28.

[0082] The imaging processing unit 43 performs image processing on the images captured by the component recognition camera 28 and measures the ball height of each solder ball included in the ball component BP to determine whether the ball component BP is a defective component. Furthermore, the imaging processing unit 43 detects the position and posture of the substrate W conveyed to the substrate conveyance position based on the images captured by the substrate recognition camera 36. The imaging processing unit 43 is configured to include a camera control unit 43A, a defective ball determination unit 43B, a ball height measurement unit 43C, a component warpage detection unit 43D, and a defective component determination unit 43E.

[0083] The camera control unit 43A controls the component recognition camera 28 based on control commands output from the control unit 40. Specifically, if the component being suctioned and held by the mounting head 26 is a ball component BP, the camera control unit 43A causes the multiple right cameras 28A and the multiple left cameras 28B to capture an image of the ball component BP when the ball component BP passes above the component recognition camera 28. On the other hand, if the component being suctioned and held by the mounting head 26 is not a ball component BP, the image processing unit 43 causes the lower camera 28C to capture an image of the component when the component passes above the component recognition camera 28. The multiple right cameras 28A, the multiple left cameras 28B, or the lower camera 28C transmit the captured images to the image processing unit 43.

[0084] The defective ball determination unit 43B determines the roundness of the shape of any of the plurality of solder balls included in the ball component BP based on each of the plurality of images captured by the plurality of right cameras 28A and the plurality of left cameras 28B. The defective ball determination unit 43B determines a solder ball with a roundness equal to or less than a predetermined value (i.e., an elliptical solder ball) as a defective ball, and determines a solder ball with a roundness greater than the predetermined value as a normal ball.

[0085] The ball height measuring unit 43C measures the ball height of a normal ball determined by the defective ball determining unit 43B to be a non-defective ball. The ball height measuring unit 43C associates information identifying the normal ball (e.g., position information) with the measured ball height, stores the information, and outputs it to the storage unit 41. The storage unit 41 stores the normal ball information (e.g., position information) output from the ball height measuring unit 43C and the measured ball height as ball height information 41C for each ball part BP.

[0086] The imaging processing unit 43 repeatedly executes the determination process by the defective ball determination unit 43B and the measurement process by the ball height measurement unit 43C for all solder balls included in the ball part BP.

[0087] After the ball height measuring unit 43C measures the ball heights of all normal balls included in the ball component BP, the component warpage detecting unit 43D measures (detects) the warpage of the ball component BP based on the measured ball heights. The component warpage detecting unit 43D stores the measured (detected) component warpage and outputs it to the storage unit 41. The storage unit 41 stores the component warpage information output from the component warpage detecting unit 43D for each ball component BP as component warpage data 41D.

[0088] The defective component determination unit 43E determines whether the ball component BP is a defective component based on the warpage of the ball component BP measured (detected) by the component warpage detection unit 43D. When the defective component determination unit 43E determines that the ball component BP is a defective component, it generates a signal notifying that the ball component BP is defective and outputs it to the control unit 40. Based on the signal output from the defective component determination unit 43E, the control unit 40 generates a control instruction to discard the component P and outputs it to the mechanism driving unit 42. It should be noted that, in the case where there is less than one normal ball among the multiple solder balls included in the ball component BP, the component warpage detection unit 43D may generate a signal notifying that the ball component BP is a defective component and output it to the defective component determination unit 43E or the control unit 40.

[0089] Here, refer to Figure 7 The lower surfaces UP1 and UP2 of the ball parts BP1 and BP2 will be described. Figure 7 1 is a diagram showing an example of the lower surfaces UP1 and UP2 of the ball parts BP1 and BP2. Figure 7 It goes without saying that the shape and size of each of the ball parts BP1 and BP2 as components and the number and arrangement of the solder balls are merely examples and are not limited thereto.

[0090] The ball component BP1, as a component, has a plurality of solder balls BA on its lower surface UP1. When the ball component BP1 is mounted (placed) at a predetermined position on the substrate W by the mounting head 26, the solder balls BA each contact the substrate W. Similarly, the rectangular ball component BP2 has a plurality of solder balls BB on its lower surface UP2. When the ball component BP2 is mounted (placed) at a predetermined position on the substrate W by the mounting head 26, the solder balls BB each contact the substrate W.

[0091] Next, refer to Figure 8 as well as Figure 9 The component warpage detection process executed by the component mounting apparatus 1 will be described. Figure 8 This is a flowchart for explaining an example of a component warpage detection procedure in the component mounting device 1 according to the embodiment. Figure 9 This is a diagram for explaining an example of a component warpage detection step of the component mounting device 1 according to the embodiment. Figure 8 as well as Figure 9 In the following, an example in which the mounting head 26 suctions and mounts a ball component BP including six solder balls B1 , B2 , B3 , B4 , B5 , and B6 on the substrate W will be described.

[0092] The component mounting device 1 sucks and holds the ball component BP conveyed to the component removal position with the component holding nozzle 27 attached to the mounting head 26 ( St1 ), and moves the mounting head 26 above the component recognition camera 28 ( St2 ).

[0093] When the ball component BP held by the mounting head 26 moves to the position above the component recognition camera 28, that is, the position where the lower surface of the ball component BP can be photographed by the component recognition camera 28, the component mounting device 1 uses the right camera 28A and the left camera 28B to photograph the lower surface of the ball component BP (i.e., the ball part) (St3). Figure 9 The following describes captured images F1 and F2. Image F1 is an image of the lower surface UP of ball component BP captured by right camera 28A. Image F2 is an image of the lower surface UP of ball component BP captured by left camera 28B. Images F1 and F2 each show six solder balls B1 to B6 captured from different angles.

[0094] The component mounting device 1 determines whether any one of the solder balls B1 to B6 (for example, the solder ball B1 ) is a defective ball based on the captured image F1 captured by the right camera 28A and the captured image F2 captured by the left camera 28B ( St4 ).

[0095] Specifically, the component mounting device 1 detects the six solder balls B1 to B6 that appear in the plurality of captured images F1 and F2, respectively, by comparing the brightness difference with other parts. If the roundness of one or both of the solder balls that appear in the plurality of captured images F1 and F2 is less than a specified value, the component mounting device 1 determines that the solder ball is a defective ball. In addition, if the roundness of both of the solder balls that appear in the plurality of captured images F1 and F2 is greater than a specified value, the component mounting device 1 determines that the solder ball is a normal ball. For example, in Figure 9 In the partial side view of ball component BP shown, solder ball B3 has a defect defect DF1 and a contamination defect DF2. When inspecting the shape of a solder ball to determine its roundness, the solder ball may be detected as a non-circular shape, such as an ellipse or a semicircle.

[0096] As described above, the component mounting apparatus 1 determines whether a solder ball is a defective ball. Figure 9 In the illustrated example, the component mounting apparatus 1 determines the solder balls B1 , B3 , and B6 as defective balls, and determines the solder balls B2 , B4 , and B5 as normal balls.

[0097] When the component mounting apparatus 1 determines that the solder ball B1 is not a defective ball through the process of step St4 (St4, No), the ball height ( Figure 5 The ball height H2 shown is measured and stored (which is the distance from the reference plane H0 to the solder ball) (St5).

[0098] When the component mounting apparatus 1 determines that the solder ball B1 is a defective ball by the process of step St4 (St4, Yes) or after executing the process of step St5, it determines whether there is a solder ball whose ball height is not measured (St6).

[0099] When the component mounting apparatus 1 determines in the process of step St6 that there is a solder ball whose ball height has not been measured (St6, Yes), it moves to the process of step St4.

[0100] On the other hand, after repeatedly executing the processing of steps St4 to St6, if the component mounting device 1 determines that there are no solder balls whose ball heights have not been measured, that is, if the processing of steps St4 to St5 has been executed for all solder balls of the ball component BP (St6, No), the component warping of the ball component BP is detected based on the measured ball heights of all normal balls (St7). It should be noted that, in Figure 9 In the illustrated example, the component mounting apparatus 1 detects (measures) component warpage of the ball component BP based on the ball heights of the plurality of solder balls B2 , B4 , and B5 .

[0101] The component mounting device 1 determines whether the ball component BP is a defective component based on the detected (measured) component warpage ( St8 ). For example, the component mounting device 1 determines whether the value of the detected (measured) component warpage is greater than or equal to a predetermined value.

[0102] When the component mounting apparatus 1 determines that the ball component BP is not a defective component through the process of step St8 ( St8 , No), it mounts the ball component BP held by the mounting head 26 at a predetermined position on the substrate W ( St9 ).

[0103] On the other hand, when the component mounting device 1 determines that the ball component BP is a defective component through the processing of step St8 (St8, yes), it omits the installation processing of the ball component BP adsorbed and held by the mounting head 26 on the substrate W, and discards the ball component BP into the waste box 37, for example.

[0104] According to the above content, the component mounting device 1 of the embodiment includes: a right camera 28A and a left camera 28B, which respectively photograph the multiple solder balls provided on the lower surface UP of the ball component BP held by the mounting head 26 from multiple different directions; a defective ball determination unit 43B, which respectively determines whether the multiple solder balls are defective balls based on each of the multiple captured images F1 and F2 captured by the right camera 28A and the left camera 28B from multiple different directions; a ball height measuring unit 43C, which measures the height of each solder ball that is not determined as a defective ball by the defective ball determination unit 43B; and a component warping detection unit 43D, which detects the warping of the ball component based on the ball height of each solder ball measured by the ball height measuring unit 43C.

[0105] Thus, the component mounting apparatus 1 of the embodiment performs ball height measurement and component warpage measurement of the ball component BP based on the solder ball determined to be a normal ball, thereby improving the robustness of the ball height measurement and component warpage measurement, thereby more accurately determining whether the ball component BP is a defective component.

[0106] Furthermore, the defective ball determination unit 43B of the component mounting apparatus 1 of the embodiment calculates the roundness of each solder ball shown in each of the multiple captured images F1 and F2, and determines solder balls whose calculated roundness is below a predetermined value as defective balls. Thus, the component mounting apparatus 1 of the embodiment can use the calculated roundness to detect solder balls with contaminants or defects such as surface scratches or defects as defective balls. Consequently, the component mounting apparatus 1 uses the ball heights of normal balls other than these defective balls to measure the ball height and component warpage of the ball component BP, thereby improving the robustness of the ball height and component warpage measurements and more accurately determining whether the ball component BP is a defective component.

[0107] The component mounting apparatus 1 of the embodiment further includes a defective component determination unit 43E that determines whether the ball component BP is defective based on the warpage of the ball component BP detected by the component warpage detection unit 43D. Thus, the component mounting apparatus 1 of the embodiment can effectively determine whether the ball component BP has a predetermined component warpage that is a major cause of poor contact with the substrate W.

[0108] While various embodiments have been described above with reference to the accompanying drawings, the present invention is not limited to the aforementioned examples. It goes without saying that those skilled in the art will be able to devise various variations, modifications, substitutions, additions, deletions, and equivalents within the scope of the technical solutions described, and it should be understood that these variations also fall within the technical scope of the present invention. Furthermore, the various structural elements in the various embodiments described above may be arbitrarily combined without departing from the spirit of the invention.

[0109] Industrial Applicability

[0110] The present invention is useful as a component mounting device and a component warpage measurement method that can improve the robustness of ball height measurement and component warpage measurement of a ball component and more accurately determine whether a ball component is a defective component.

Claims

1. A component mounting device, wherein: The component mounting device comprises: an imaging unit that captures images of the plurality of balls on the lower surface of the component held by the mounting head from a plurality of different directions; a defective ball determination unit that calculates, based on each of the plurality of images captured by the imaging unit from the plurality of different directions, a roundness of each of the balls respectively shown in the plurality of images, and determines as a defective ball a ball whose calculated roundness is equal to or less than a predetermined value; a ball height measuring unit that measures the height of each ball that has not been determined as the defective ball by the defective ball determining unit as the distance from the surface to a reference plane based on each of the plurality of captured images; as well as A component warpage detection unit detects warpage of the component based on the height of each of the balls measured by the ball height measurement unit.

2. The component mounting device according to claim 1, wherein The component mounting device further includes a defective component determination unit configured to determine whether the component is defective based on the warpage of the component detected by the component warpage detection unit.

3. A method for measuring component warpage, wherein: The multiple balls on the lower surface of the component held by the mounting head are photographed from multiple different directions. Based on each of the plurality of images captured from the plurality of different directions, the roundness of each of the balls respectively shown in the plurality of images is calculated, and a ball having a roundness less than a predetermined value is determined as a defective ball. Based on each of the plurality of captured images, the height of each ball that is not determined to be the defective ball is measured as the distance from the surface to the reference plane. Warpage of the component is detected based on the measured heights of the respective balls.

Images