Display panel and electronic equipment

Abstract

The present invention relates to a display panel and an electronic device, comprising a driving backplane and a plurality of pixel units arranged on the driving backplane and electrically connected to the driving backplane; the pixel units include a plurality of LED chips of different colors, and the LED chips in the pixel units are arranged rotationally symmetrically. In the display panel, the positional relationship of the LED chips in the pixel units is changed from a linear "one-dimensional" relationship to a planar "two-dimensional" relationship, so that the LED chips can not only be adjacent in the rotation direction, but also the distances from all LED chips to the rotational symmetry center are basically the same, and the relative distance and arrangement relationship of any two adjacent chips in the rotation direction are basically the same, thereby improving the consistency of the light mixing effect and enhancing the display performance of the display panel.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and an electronic device. Background Art

[0002] At present, using self-luminous LED chips to form pixel units to realize image display has become the main development direction of display technology. In a display panel, a pixel unit usually includes LED chips of the three primary colors of red, green and blue. The light emitted by the three primary color LED chips is mixed to realize the color presentation of a pixel point in the display image. However, in the pixel units of current display panels, the light mixing effect of each LED chip is poor, which affects the display effect.

[0003] Therefore, how to improve the display effect of the display panel is a technical problem that needs to be solved urgently. Summary of the invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present application is to provide a display panel and an electronic device, aiming to solve the problem that the LED chip in the pixel unit of the existing display panel has a poor light mixing effect, which affects the display effect.

[0005] The present application provides a display panel, including: a driving backplane and a plurality of pixel units arranged on the driving backplane and electrically connected to the driving backplane; the pixel unit includes a plurality of LED chips with different colors, and the LED chips in the pixel unit are arranged rotationally symmetrically around a rotationally symmetric center.

[0006] In the above-mentioned display panel, the practice of arranging the LED chips in the pixel unit in rows or columns in the related art is abandoned, and the multiple LED chips in the pixel unit are arranged rotationally symmetrically, so that the position relationship of each LED chip in the pixel unit is changed from a linear "one-dimensional" relationship to a planar "two-dimensional" relationship. In the pixel unit where the LED chips are arranged "one-dimensionally", one LED chip has at most two adjacent chips, and more LED chips are not adjacent. Because the LED chips are arranged "one-dimensionally", the distance between adjacent LED chips is much smaller than the distance between non-adjacent LED chips. The uneven distance between LED chips will inevitably lead to unbalanced light mixing between non-adjacent LED chips and light mixing between adjacent LED chips. The present application changes the arrangement method so that the LED chips can not only be adjacent in the rotation direction, but also the distance from all LED chips to the center of rotational symmetry is basically the same, and the relative distance and arrangement relationship between any two adjacent chips in the rotation direction are basically the same, thereby improving the consistency of the light mixing effect and enhancing the display performance of the display panel.

[0007] Optionally, the polarities of the near-center electrodes of each LED chip in the pixel unit are the same, and the near-center electrode is an electrode in the LED chip that is closer to the rotational symmetry center.

[0008] In the above display panel, when deploying each LED chip in the pixel unit, the near-center electrode of each LED chip close to the rotational symmetry center is set to be the same, which facilitates the wiring of the driving circuit on the driving backplane, helps save the wiring space of the driving circuit on the driving backplane, and reduces the wiring difficulty.

[0009] Optionally, the proximal center electrodes of the LED chips in the pixel unit are electrically connected.

[0010] In the above display panel, the electrodes proximal to the center of each LED chip in the pixel unit are electrically connected together, so that the common-pole driving of each LED chip in the same pixel unit can be achieved.

[0011] Optionally, the conductive via is arranged at the rotational symmetry center.

[0012] In the above display panel, the conductive via used to connect the near-center electrode of each LED chip in a pixel unit is arranged at the rotationally symmetric center, so as to ensure that the distance between the near-center electrode of each LED chip and the conductive via is equal, which is convenient for the deployment of the pads and lines on the driving backplane.

[0013] Optionally, a plurality of pixel units are arranged in an array on the driving backplane, and the LED chips of the same color in each pixel unit are oriented in the same direction.

[0014] In the above-mentioned display panel, each pixel unit is arranged in an array on the driving backplane, and the LED chips of the same color in different pixel units have the same orientation. This can ensure that the LED chips of the same color are transferred and bonded to the driving backplane in the same orientation, which facilitates the mass transfer of LED chips, reduces the transfer difficulty and transfer cost of LED chips, and is conducive to improving the transfer efficiency and the production efficiency of the display panel.

[0015] Optionally, a vertical projection of the LED chip in a direction parallel to the driving backplane has two mutually perpendicular symmetry axes, and the symmetry axis of each LED chip in the pixel unit is not parallel to the side of the driving backplane.

[0016] In the above-mentioned display panel, because the two mutually perpendicular symmetry axes of the LED chip are not parallel to the side edges of the driving backplane, this can avoid the color cast phenomenon in the pixel units near the seams when the LED light panels are spliced ​​(or the display modules are spliced), further improving the light mixing effect of the pixel units and enhancing the display performance of the display panel.

[0017] Optionally, a vertical projection of the LED chip in a direction parallel to the driving backplane has two mutually perpendicular symmetry axes, and a line between the rotational symmetry center and the center of the LED chip is not parallel to the two symmetry axes.

[0018] In the above display panel, the two symmetry axes of the vertical projection of the LED chip are not parallel to the center line, which reduces the deployment space required for the pixel unit, is conducive to deploying more pixel units in the same area of ​​the driving backplane, and improves the resolution of the display panel. At the same time, the spacing between the pixel units can also be made smaller to further reduce the mixing distance between the LED chips, enhance the mixing effect of a single pixel unit, and improve the sharpness of the image displayed by the display panel.

[0019] Optionally, a vertical projection of the LED chip in a direction parallel to the driving backplane has two mutually perpendicular symmetry axes, and the distances between the rotational symmetry center and the two symmetry axes are both less than 2000 um.

[0020] In the above display panel, because the vertical projection of the LED chip in the direction parallel to the driving backplane has two mutually perpendicular symmetry axes, the vertical projection of the LED chip in the direction parallel to the driving backplane is a central symmetric figure. In a right triangle formed by the line between the rotational symmetry center and the center of the LED chip as the hypotenuse, one of the right-angled sides is parallel to one of the symmetry axes, the other right-angled side is parallel to the other symmetry axis, and the lengths of the two right-angled sides are both less than 2000um, so that the LED chips in the pixel unit can be deployed more closely together, the area occupied by the pixel unit as a whole is reduced, and the display resolution of the display panel is improved.

[0021] Optionally, the LED chip is a flip chip, and the line between the rotational symmetry center and the center of the LED chip coincides with or is perpendicular to the line between the centers of two electrodes of the LED chip.

[0022] In the above display panel, the die bonding process of the LED chip on the driving backplane is simpler, and the number of LED chips in the same area of ​​the driving backplane is smaller, which can facilitate the heat dissipation of the LED chip and maintain the reliability of the LED chip.

[0023] Optionally, the LED chip is a flip chip, and the angle between the line between the rotational symmetry center and the center of the LED chip and the line between the centers of two electrodes of the LED chip is 30° to 60°.

[0024] In the above display panel, because the angle between the line connecting the center of the LED chip and the rotational symmetry center and the line connecting the centers of the two electrodes of the LED chip is between 30° and 60°, this angle range is beneficial to the heat dissipation between the LED chips and can ensure the mixing light effect of the LED chips.

[0025] Optionally, the display panel further includes a sealing layer, which is arranged on a side of the driving backplane where the LED chip is arranged, and the sealing layer covers the LED chip.

[0026] In the above display panel, each LED chip is covered by a sealing layer, which can be used to physically protect the LED chip to prevent the LED chip from falling off due to stress when the display panel is hit by external force; at the same time, it can also prevent the influence of external water and oxygen on the LED chip, thereby improving the reliability of the display panel.

[0027] Based on the same inventive concept, the present application also provides an electronic device, including a processor and any one of the display panels described above, wherein the display panel is communicatively connected to the processor.

[0028] In the display panel of the above-mentioned electronic device, the practice of arranging the LED chips in the pixel unit in rows or columns in the related art is abandoned, and the multiple LED chips in the pixel unit are arranged rotationally symmetrically, so that the position relationship of each LED chip in the pixel unit is changed from a linear "one-dimensional" relationship to a planar "two-dimensional" relationship. In the pixel unit where the LED chips are arranged "one-dimensionally", one LED chip has at most two adjacent chips, and more LED chips are not adjacent. Because the LED chips are arranged "one-dimensionally", the distance between adjacent LED chips is much smaller than the distance between non-adjacent LED chips. The uneven distance between LED chips will inevitably lead to unbalanced light mixing between non-adjacent LED chips and light mixing between adjacent LED chips. By changing the arrangement method, the present application allows the LED chips to be adjacent not only in the rotation direction, but also all LED chips are adjacent near the center of rotational symmetry, which greatly reduces the difference in distance between each LED chip, improves the light mixing effect of the LED chips in the pixel unit, and improves the display performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of an arrangement of LED chips in a pixel unit in the related art;

[0030] Figure 2 A schematic diagram of a top view structure of a display panel provided in an optional embodiment of the present application;

[0031] Figure 3a A schematic diagram of an arrangement of a pixel unit including four rectangular LED chips provided in an optional embodiment of the present application;

[0032] Figure 3b A schematic diagram of an arrangement of LED chips in a spliced ​​LED light board provided in an optional embodiment of the present application;

[0033] Figure 3cThis is another schematic diagram of the arrangement of LED chips in a spliced ​​LED light board provided in an optional embodiment of the present application;

[0034] Figure 4 A schematic diagram of an arrangement of a pixel unit including three elliptical LED chips provided in an optional embodiment of the present application;

[0035] Figure 5a A schematic diagram showing that a near-center electrode of an LED chip in a pixel unit is electrically connected through a conductive via hole in an optional embodiment of the present application;

[0036] Figure 5b This is a schematic diagram of another orientation of LED chip electrodes in a pixel unit shown in an optional embodiment of the present application;

[0037] Figure 5c This is a schematic diagram of the orientation of electrodes of an LED chip in another pixel unit shown in an optional embodiment of the present application;

[0038] Figure 6 A schematic cross-sectional structure diagram of a display panel provided in an optional embodiment of the present application;

[0039] Figure 7 A schematic diagram of a hardware structure of an electronic device provided in an optional embodiment of the present application;

[0040] Figure 8 A schematic diagram of an adjustable distance and an adjustable angle of an LED chip relative to a rotational symmetry center shown in another optional embodiment of the present application;

[0041] Figure 9a This is a schematic diagram of a first type of pixel unit including three LED chips provided in another optional embodiment of the present application;

[0042] Figure 9b This is a schematic diagram of a second pixel unit including three LED chips provided in another optional embodiment of the present application;

[0043] Fig.9c This is a schematic diagram of a third type of pixel unit including three LED chips provided in another optional embodiment of the present application;

[0044] Figure 9d This is a schematic diagram of a fourth type of pixel unit including three LED chips provided in another optional embodiment of the present application;

[0045] Fig.9e This is a schematic diagram of a fifth pixel unit including three LED chips provided in another optional embodiment of the present application;

[0046] Fig.10aThis is a schematic diagram of a first type of pixel unit including four LED chips provided in another optional embodiment of the present application;

[0047] Fig.10b This is a schematic diagram of a second pixel unit including four LED chips provided in another optional embodiment of the present application;

[0048] Fig.10c This is a schematic diagram of a third type of pixel unit including four LED chips provided in another optional embodiment of the present application;

[0049] Fig.10d This is a schematic diagram of a fourth type of pixel unit including four LED chips provided in another optional embodiment of the present application.

[0050] Description of reference numerals:

[0051] 10-pixel unit; 11-red LED chip; 12-green LED chip; 13-blue LED chip; 20-display panel; 21-driving backplane; 22-multiple pixel units; 221-red LED chip; 222-green LED chip; 223-blue LED chip; 31-driving backplane; 32a-pixel unit; 32b-pixel unit; 32c-pixel unit; 320-LED chip; 42-pixel unit; 420-LED chip; 50a-pixel unit; 500a-LED chip; 501-conductive via; 50b pixel Unit; 500b-LED chip; 50c-pixel unit; 500c-LED chip; 60-display panel; 600-LED chip; 61-driving backplane; 63-sealing layer; 70-electronic device; 71-processor; 72-display panel; 800-LED chip; 801-first symmetry axis; 802-second symmetry axis; 90a-pixel unit; 90b-pixel unit; 90c-pixel unit; 90d-pixel unit; 90e-pixel unit; 10a-pixel unit; 10b-pixel unit; 10c-pixel unit; 10d-pixel unit. DETAILED DESCRIPTION

[0052] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0054] In current display panels, a pixel unit usually includes a red LED chip, a green LED chip, and a blue LED chip. Figure 1 A schematic diagram of the arrangement of LED chips in a pixel unit is shown: the red LED chip 11, the green LED chip 12, and the blue LED chip 13 in the pixel unit 10 are arranged in a row. It is obvious that in some other examples, the arrangement order of the red LED chip 11, the green LED chip 12, and the blue LED chip 13 can also be changed, for example, the red LED chip 11, the blue LED chip 13, and the green LED chip 12 in sequence. It is understandable that the rows and columns can be switched due to different observation directions, so in some other examples, the red LED chip 11, the green LED chip 12, and the blue LED chip 13 can also be arranged in a row. It should also be noted that the red LED chip 11, the green LED chip 12, and the blue LED core 13 can be quantum wells of LED chips that emit red light, green light, and blue light respectively, but in some other examples, the red LED chip 11, the green LED chip 12, and the blue LED core 13 can also be obtained by converting a certain color of light emitted by the LED chip through a light conversion layer such as a quantum dot film layer or a fluorescent layer. For example, the pixel unit 10 can all contain blue LED chips, wherein at least one blue LED chip is provided with a red quantum dot film layer to convert blue light into red light; in addition, at least one blue LED chip is provided with a green quantum dot film layer to convert blue light into green light; and there is at least one blue LED chip without a light conversion layer.

[0055] In the pixel unit 10, the green LED chip 12 is adjacent to the red LED chip 11 and the blue LED chip 13, but the green LED chip 12 is spaced between the red LED chip 11 and the blue LED chip 13. Therefore, the mixing effect of green light and red light, as well as the mixing effect of green light and blue light are relatively good, while the mixing effect of red light and blue light is poor, which will cause the overall light emitted from the pixel unit 10 to have color cast, affecting the overall display effect of the display panel.

[0056] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0057] An optional embodiment of the present application:

[0058] This embodiment first provides a display panel. Figure 2 A structural schematic diagram of a display panel 20 is shown: the display panel 20 includes a driving backplane 21 and a plurality of pixel units 22, a driving circuit is disposed on the driving backplane 21, and the pixel units 22 are electrically connected to the driving circuit. It should be understood that the "on" in "a driving circuit is disposed on the driving backplane 21" does not mean that the driving circuit is located on the upper surface of the driving backplane 21, nor does it mean that the driving circuit must be located on the surface of the driving backplane 21, it only means that there is a connection relationship between the driving circuit and the driving backplane 21, for example, the driving circuit can also be disposed in the driving backplane 21. Optionally, the driving backplane 21 can include but is not limited to any one of a PCB (Printed Circuit Board), a glass substrate and an FPC (Flexible Printed Circuit).

[0059] The pixel unit 22 includes N LED chips, N is greater than or equal to 3, and the colors of the LED chips are not completely the same, that is, they can be completely different or partially the same. In other words, the pixel unit 22 includes multiple LED chips with different colors. In some examples of this embodiment, the pixel unit 22 includes a red LED chip 221, a green LED chip 222, and a blue LED chip 223, and these LED chips can be chips that emit light of corresponding colors through quantum wells, or chips that obtain light of corresponding colors through conversion by a light conversion layer. In some other examples of this embodiment, the color of the LED chip in the pixel unit 22 may not be limited to red, green, and blue. For example, it may also include at least one of white LED chips or yellow LED chips. In some examples, the pixel unit 22 may include four LED chips of red, green, blue, and white. In some examples, a pixel unit 22 is composed of three LED chips, namely a red LED chip 221, a green LED chip 222 and a blue LED chip 223. In some other examples, although a pixel unit 22 only includes LED chips of three colors, red, green and blue, at least some of the colors have two or more LED chips.

[0060] It can be understood that when a pixel unit includes three LED chips, the angle between two adjacent center lines is 120°, that is, the angle between the line between the center of one LED chip and the center of rotational symmetry and the line between the center of an adjacent LED chip and the center of rotational symmetry is 120°; when a pixel unit includes four LED chips, the angle between two adjacent center lines is 90°, and the number of LED chips in the pixel unit is expanded to N, N is greater than or equal to 3, then the angle between the center of the adjacent LED chip and the center of rotational symmetry is 360° / N.

[0061] In this embodiment, the LED chip can be a flip-chip structure or a face-up structure, a vertical structure or a horizontal structure. In some examples of this embodiment, the LED chips on the driving backplane 21 are all flip-chip chips, and the display panel 20 is a COB (Chip On Board Light) display panel, or it can also be a COG (Chip On Glass) display panel.

[0062] In this embodiment, the LED chips in the pixel unit 22 are arranged rotationally symmetrically. The so-called rotationally symmetrical arrangement means that the pattern formed by the arrangement of the LED chips in the pixel unit 22 is a rotationally symmetrical pattern. The definition of a rotationally symmetrical pattern is: after a plane pattern is rotated around a fixed point on the plane by α (radians), it coincides with the initial pattern. This pattern is called a rotationally symmetrical pattern, the fixed point is called the rotational symmetry center, and the angle of rotation is called the rotation angle. Typical rotationally symmetrical patterns include the pattern of fan blades, the bauhinia pattern in the emblem of the Hong Kong Special Administrative Region, etc. In the pattern corresponding to the pixel unit 22 of this embodiment, any LED chip can coincide with another LED chip after rotating around the rotational symmetry center by a certain angle.

[0063] from Figure 2 It can be seen that in the pixel unit 22, for one of the LED chips, in addition to being adjacent to the other two LED chips in the rotation direction, the LED chips in the pixel unit 22 on the side close to the rotational symmetry center O are adjacent to each other. This can solve the problem in the prior art that when the LED chips are arranged in rows or columns, some LED chips are adjacent and close to each other, while some LED chips are spaced apart and far away, resulting in poor light mixing effect due to uneven distance between LED chips. Especially when the pixel unit 22 is composed of three LED chips, for example, Figure 2 In the embodiment, the red LED chip 221, the green LED chip 222 and the blue LED chip 223 are adjacent to each other in the rotation direction and are also adjacent to each other on the side close to the rotational symmetry center. In this case, the spatial position relationship between the LED chips is Figure 1 There is a significant difference in the spatial position relationship of the LED chips in the pixel unit 10 shown in the figure, which can significantly improve the light mixing effect of the LED chips in the pixel unit 22 and enhance the display performance of the display panel.

[0064] In this embodiment, the vertical projection of the LED chip in the direction parallel to the driving backplane 21 (hereinafter referred to as "vertical projection") has two mutually perpendicular axes of symmetry. Generally, the vertical projection of the LED chip is the same as the cross-sectional profile of the LED chip in the direction parallel to the driving backplane. However, in this embodiment, it is not excluded that the cross-sectional profile of the LED chip in the direction parallel to the driving backplane is different from the vertical projection of the LED chip in the direction parallel to the driving backplane. The vertical projection of the LED chip includes, but is not limited to, a rectangle, a rhombus, an ellipse, a regular polygon, etc.

[0065] For the convenience of introduction, the line connecting the center of the LED chip and the center of rotational symmetry is hereinafter referred to as the "center line". When the vertical projection of the LED chip has a certain aspect ratio (i.e., when the aspect ratio is greater than 1), the axis of symmetry corresponding to the direction with a larger dimension of the vertical projection of the LED chip is called the "long axis of symmetry", and the axis of symmetry corresponding to the direction with a smaller dimension of the vertical projection of the LED chip is called the "short axis of symmetry". In some examples of this embodiment, the center line can be parallel to one of the axes of symmetry of the vertical projection of the LED chip. For example, please refer to Figure 3a the schematic layout diagram of the LED chips in a pixel unit 32a shown in. In the pixel unit 32a, there are four LED chips 320. The vertical projections of these four LED chips 320 are rectangles. The center line is parallel to the long axis of symmetry of the vertical projection, that is, parallel to the long side of the rectangle, and perpendicular to the short axis of symmetry, that is, perpendicular to the short side of the rectangle. It can be understood that the two electrodes in the LED chip are usually arranged along the axis of symmetry of the vertical projection (for example, usually along the long axis of symmetry. Of course, in this embodiment, it is not excluded that they are arranged along the short axis of symmetry). Therefore, when the center line is parallel to the axis of symmetry of the vertical projection, the center line coincides with or is perpendicular to the center line of the two electrodes of the LED chip (hereinafter referred to as the "electrode center line"). In this way, the die bonding process of the LED chip on the driving backplane is simpler, and the number of LED chips in the same area on the driving backplane is smaller, which is convenient for the heat dissipation of the LED chip and maintains the reliability of the LED chip.

[0066] In some other examples, neither of the two axes of symmetry of the vertical projection of the LED chip is parallel to the center line. This can make the deployment area of the pixel unit 32a on the driving backplane smaller, which is beneficial to deploying more pixel units 32a in the limited active display area (AA) on the driving backplane. At the same time, the pitch of the pixel units 32a can be made smaller, further reducing the light mixing distance between the LED chips 320, enhancing the light mixing effect of a single pixel unit, and improving the sharpness of the image displayed on the display panel. Please continue to refer to Figure 2 In Figure 2 each LED chip is in an "I" shape. Another example is, please refer to Figure 4As shown, the pixel unit 42 includes three LED chips 420, and the vertical projections of the three LED chips are elliptical, and the center line is not parallel to the major axis and the minor axis of the ellipse. In some examples of this embodiment, the angle between the center line and the center line of the electrode is between 25° and 65°. For example, in some examples, the angle between the center line and the center line of the electrode is guaranteed to be between 30° and 60°, for example, it may not be limited to 30°, 45°, 50° or 55°, 60°, etc. By limiting the angle range, the contradiction between the heat dissipation of the LED chip in the pixel unit and the light mixing of the pixel unit can be balanced, and the light mixing effect of the LED chip can be maintained while ensuring the heat dissipation requirements of the LED chip.

[0067] In some examples of this embodiment, there is at least one LED chip in a pixel unit whose symmetry axis is parallel to the side of the driving backplane, for example, see Figure 3b As shown, in Figure 3b In the example, the pixel unit 32b includes three LED chips A, B, and C, wherein the long symmetry axis of A is parallel to the side of the driving backplane 31. It is understandable that because the vertical projection of A has a certain aspect ratio, the long symmetry axis is parallel to the side of the driving backplane 31, which means that the side of the LED chip A with a larger size is parallel to the side of the driving backplane. This will result in a larger amount of light emitted from the side of the LED chip A in the pixel unit 32b near the seam when the LED light board is spliced, thereby causing color cast in the pixel unit 32b, affecting the display effect of the display panel. Therefore, in some examples of this embodiment, such as Figure 3c As shown, the vertical projection of the LED chip in the direction parallel to the driving backplane has two mutually perpendicular symmetry axes, but the symmetry axis of each LED chip in the pixel unit 32c is not parallel to the side of the driving backplane 31, thereby improving the light mixing effect of the pixel unit 32c near the seam and enhancing the display performance of the display panel.

[0068] It is understandable that when the LED chips are arranged rotationally symmetrically in the pixel unit, the LED chips should not interfere with each other, that is, there should be a certain gap between adjacent LED chips. In some examples of this embodiment, the LED chip is of micron size. For example, in some examples, the size of the vertical projection of the LED chip can be as small as 10μm×10μm, and in other examples, the size of the vertical projection of the LED chip can reach 400μm×300μm. In some examples of this embodiment, the distance between the rotational symmetry center O and the two symmetry axes of the LED chip is less than 2mm. In this way, the problem of too dispersed arrangement of LED chips in the surface pixel unit can be solved while ensuring that there is no touching interference between the LED chips. It can not only reduce the deployment area of ​​the pixel unit, but also improve the light output effect of the pixel unit.

[0069] In some cases, when the LED chips in the pixel unit 22 are arranged rotationally symmetrically, the distances between the two electrodes in each LED chip and the rotationally symmetrical center O are different. For example, see Figure 5a As shown, in the pixel unit 50a, each of the four LED chips 500a has an electrode relatively close to the rotational symmetry center O, and the other electrode is relatively far from the rotational symmetry center O. In this embodiment, the one of the LED chips 500a that is closer to the rotational symmetry center O is recorded as the "near-center electrode", that is, the electrode that is closer to the rotational symmetry center. In some examples of this embodiment, when the LED chips in the pixel unit are arranged in a rotationally symmetrical manner, the polarity of the near-center electrode of each LED chip can be set to be the same. For example, Figure 5a Among them, the near-center electrodes of each LED chip 500a are all anodes. Optionally, in some examples, not only are the polarities of the near-center electrodes of each LED chip in the pixel unit set to be the same, but these near-center electrodes are also connected together to achieve common-pole driving. Figure 5a In the embodiment, a conductive via 501 may be provided at the rotational symmetry center O, and the conductive via 501 is used to connect the near-center electrodes of the LED chips with the same polarity.

[0070] Of course, it should be understood that the present embodiment does not limit the conductive via 501 to be located at the rotational symmetry center O. For example, it may also be located near the rotational symmetry center O. However, relatively speaking, if the conductive via 501 is set at the rotational symmetry center O, the distance between the conductive via 501 and the near-center electrode of each LED chip in the pixel unit 50a is the same, which facilitates circuit design. In addition, in some other examples of the present embodiment, two or more conductive vias may be set corresponding to one pixel unit 50a, and these conductive vias may be electrically connected together in other ways, or they may be independent. In other examples, the near-center electrodes of each LED chip in the pixel unit 50a may also be electrically connected by means other than conductive vias, and in some examples, these near-center electrodes are not even electrically connected together, but are driven independently. In some other examples, the polarity of the near-center electrodes of each LED chip is not the same, such as Figure 5b As shown, in Figure 5b The pixel unit 50b shown also includes four LED chips 500b, but the electrodes near the center of some of the LED chips 500b are anodes, and the electrodes near the center of some of the LED chips 500b are cathodes. Figure 5c In the pixel unit 50c shown, the distances between the two electrodes of the LED chip 500c and the rotational symmetry center O are the same, and there is no concept of near-center electrodes. In this case, the orientation of the LED chips 500c can be arranged arbitrarily, and the polarities of the adjacent electrodes of two adjacent LED chips 500c can also be set to be the same. See Figure 5c As shown, for example, in Figure 5c In the figure, the anode of the upper LED chip 500c is close to the anode of the left LED chip 500c, the cathode of the upper LED chip 500c is close to the cathode of the right LED chip 500c, the anode of the right LED chip 500c is close to the anode of the lower LED chip 500c, and the cathode of the lower LED chip 500c is close to the cathode of the left LED chip 500c.

[0071] In this embodiment, the plurality of pixel units 22 in the display panel 20 may be arranged in an array, that is, arranged in rows and columns on the driving backplane 21. Figure 2 In some examples, the orientations of the LED chips in different pixel units are not related, so the orientations of the pixel units are random. However, in some other examples, the orientations of the LED chips of the same color in each pixel unit are the same, such as Figure 2 As shown, this makes it easy for LED chips of the same color to be arranged in the same direction on the transfer substrate, and then transferred and bonded to the driving backplane 21 from the transfer substrate in large quantities, thereby improving the production efficiency of the display panel and reducing the production cost.

[0072] In some examples of this embodiment, the display panel 60 includes a sealing layer 63, such as Figure 6 As shown, the sealing layer 63 covers the LED chip 600. Figure 6 The LED chips 600 in the pixel units are simply explained in different directions, but those skilled in the art can understand that: Figure 6 The orientation of the LED chip 600 in the display panel 60 is not a limitation of the orientation of the LED chip 600 in the display panel 60. The sealant layer 63 can not only fix the LED chip 600 more firmly on the driving backplane 61 to prevent the LED chip 600 from falling off the driving backplane 61, but also block the invasion of external water vapor on the LED chip 600, especially when the LED chip 600 includes quantum dot materials, the sealant layer 63 can protect the quantum dot materials, improve the reliability of the LED chip 600, and extend the life of the display panel 60. The sealant layer 63 can be transparent glue or black glue. When the sealant layer 63 is black glue, the package of the display panel 60 can be blackened to prevent users from seeing the details of the LED chip 600 and the driving backplane 61 inside the display panel 60 from the outside, thereby improving the display performance of the display panel 60.

[0073] This embodiment also provides an electronic device, see Figure 7The electronic device 7 includes a processor 71 and at least one display panel 72 in communication with the processor 71. The display panel 72 may be a display panel provided in any of the aforementioned examples. In the display panel 72, the LED chips in the pixel units are arranged rotationally symmetrically. It is understood that the communication connection between the display panel 72 and the processor 71 may be achieved through a wired connection, such as a data bus connection, or through a wireless connection. In addition, in addition to the processor 71 and the display panel 72, the electronic device 70 may also include other devices, such as at least one of an audio input and output unit, an image acquisition unit, a memory, a Bluetooth module, a WiFi module, and the like.

[0074] The display panel and electronic device provided in this embodiment change the arrangement of the LED chips in the pixel units of the display panel in a rotationally symmetrical manner, so that the original arrangement of the LED chips becomes a two-dimensional arrangement, reducing the difference in distance between the LED chips, improving the balance of the light mixing effect between LED chips of different colors, and enhancing the display effect of the display panel.

[0075] Another optional embodiment of the present application:

[0076] In order to make the structure and advantages of the display panel and the electronic device provided in the above embodiments more clear to those skilled in the art, this embodiment will continue to explain the arrangement scheme of the LED chips in the pixel unit in the above embodiments in combination with examples:

[0077] It is understandable that the arrangement of the LED chips in the pixel unit is related to the number of LED chips in the pixel unit, the shape of the LED chip itself, the distance of the LED chip relative to the rotational symmetry center, and the tilt angle of the LED chip relative to the reference direction on the driving backplane (for example, the direction parallel to the long side or short side of the driving backplane). In this embodiment, it is assumed that there are three LED chips in the pixel unit, and the vertical projection of the LED chip is an "I" shape. In this case, the specific arrangement of the LED chips in the pixel unit is determined by the distance between the LED chip and the rotational symmetry center and the tilt angle of the LED chip relative to the reference direction.

[0078] First, please refer to Figure 8 : The size of the vertical projection of the LED chip 800 in the direction of one symmetry axis is larger than the size of the vertical projection in the direction of the other symmetry axis, and the size of the vertical projection in the direction of the first symmetry axis 801 is larger than the size in the direction of the second symmetry axis 802. For the sake of convenience, in this embodiment, the symmetry axis corresponding to the direction with the larger vertical projection size of the LED chip is called the "long symmetry axis", and the symmetry axis corresponding to the direction with the smaller vertical projection size of the LED chip is called the "short symmetry axis". Therefore, in Figure 8Among them, the first symmetry axis 801 is the long symmetry axis, and the second symmetry axis 802 is the short symmetry axis. Of course, in some other examples, if the vertical projection of the LED chip is a rectangle, the long symmetry axis is parallel to the long side of the LED chip, and the short symmetry axis is parallel to the short side of the LED chip; if the vertical projection of the LED chip is a rhombus, the long symmetry axis is the long diagonal of the rhombus, and the short symmetry axis is the short diagonal of the rhombus; if the vertical projection of the LED chip is an ellipse, the long symmetry axis is the long axis of the ellipse, and the short symmetry axis is the short axis of the ellipse.

[0079] In this embodiment, the distance between the rotational symmetry center O and the short symmetry axis 802 of the LED chip 800 is recorded as the adjustable distance d, and the angle between the line between the center of the LED chip 800 and the rotational symmetry center O, that is, the center line, and the long symmetry axis 801 is recorded as the adjustable angle β. It can be understood that by adjusting the adjustable distance d (micrometer level, but the size of the LED chip 800 and the size between the LED chips 800 in the accompanying drawings are proportionally enlarged) and the value of the adjustable angle β, different pixel units of the three LED chips 800 can be obtained. Figure 9a The pixel unit 90a obtained when the adjustable distance d is 85.75 and the adjustable angle β is 29.76° is shown; Figure 9b The pixel unit 90b is shown when the adjustable distance d is 35.74 and the adjustable angle β is 60.66°; Fig.9c The pixel unit 90c is shown when the adjustable distance d is 126.79 and the adjustable angle β is 0; Figure 9d The pixel unit 90d obtained when the adjustable distance d is 99.96 and the adjustable angle β is 0 is shown; Fig.9e The pixel unit 90e is obtained when the adjustable distance d is 0 and the adjustable angle β is 90°. In each pixel unit including three LED chips 800 shown in this embodiment, the adjustable distance d is less than 2 mm.

[0080] The following describes the case where the pixel unit includes four LED chips 800. Fig.10a The pixel unit 10a shown has a corresponding adjustable distance d of 85.75 and an adjustable angle β of 30°; Fig.10b The pixel unit 10b is shown when the adjustable distance d is 47.56 and the adjustable angle β is 60°; Fig.10c The pixel unit 10c is shown when the adjustable distance d is 166.77 and the adjustable angle β is 0; Fig.10d The pixel unit 10d is shown when the adjustable distance d is 0 and the adjustable angle β is 0.

[0081] It is obvious that if the distance between the rotational symmetry center O and the long symmetry axis 801 of the LED chip 800 is changed as an adjustable distance, pixel units with different arrangements can also be obtained. Alternatively, it is also feasible to use the angle between the center line and the short symmetry axis 802 as an adjustable angle.

[0082] In the display panel or electronic device obtained based on the LED chip arrangement scheme in this embodiment, each LED chip is adjacent to each other within a single pixel unit, thereby optimizing the color mixing effect of various colors and improving the display effect of the display panel and the electronic device.

[0083] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A display panel, characterized in that: include: A driving backplane and a plurality of pixel units disposed on the driving backplane and electrically connected to the driving backplane; The pixel unit includes a plurality of LED chips with different colors, and the LED chips in the pixel unit are arranged rotationally symmetrically around a rotationally symmetrical center; the vertical projection of the LED chip in a direction parallel to the driving backplane has two mutually perpendicular symmetry axes, wherein the distance between the rotationally symmetrical center and one of the symmetry axes of the LED chip is an adjustable distance, and / or the angle between the line between the LED chip and the rotationally symmetrical center and the other symmetry axis is an adjustable angle.

2. The display panel according to claim 1, wherein: The pixel unit includes three LED chips. A seam is formed when two adjacent display panels are spliced ​​together. The three LED chips in the pixel unit close to the seam are arranged obliquely relative to the seam.

3. The display panel according to claim 1, wherein: The polarity of the near-center electrode of each LED chip in the pixel unit is the same, and the near-center electrode is an electrode in the LED chip that is closer to the rotational symmetry center.

4. The display panel according to claim 3, wherein: The proximal center electrodes of the LED chips in the pixel unit are electrically connected.

5. The display panel according to claim 1, wherein: The plurality of pixel units are arranged in an array on the driving backplane, and the LED chips of the same color in each of the pixel units have the same orientation.

6. The display panel according to any one of claims 1 or 3 to 5, characterized in that: The vertical projection of the LED chip in a direction parallel to the driving backplane has two mutually perpendicular symmetry axes, and the symmetry axis of each LED chip in the pixel unit is not parallel to the side of the driving backplane.

7. The display panel according to any one of claims 1 or 3 to 5, characterized in that: The vertical projection of the LED chip in a direction parallel to the driving backplane has two mutually perpendicular symmetry axes, and the line between the rotational symmetry center and the center of the LED chip is not parallel to the two symmetry axes.

8. The display panel according to any one of claims 1 or 3 to 5, characterized in that: The vertical projection of the LED chip in a direction parallel to the driving backplane has two mutually perpendicular symmetry axes, and the distances between the rotational symmetry center and the two symmetry axes are both less than 2 mm.

9. The display panel according to any one of claims 1 or 3 to 5, characterized in that: The LED chip is a flip chip, and the line between the rotational symmetry center and the center of the LED chip coincides with or is perpendicular to the line between the electrode centers of two electrodes of the LED chip.

10. The display panel according to any one of claims 1 or 3 to 5, characterized in that: The LED chip is a flip chip, and the angle between the line between the rotational symmetry center and the center of the LED chip and the line between the centers of two electrodes of the LED chip is 30° to 60°.

11. An electronic device, characterized in that: The device comprises a processor and a display panel as described in any one of claims 1 to 10, wherein the display panel is communicatively connected to the processor.

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