A soldering device for an engine oil cooler

Abstract

The application provides a solder spraying device for an engine oil cooler, which mainly comprises a conveying device, a feeding device, a gas control device, a solder recovery device and a negative pressure suction device; the feeding device comprises a spraying box, a barrel and a spraying gun; the gas control device comprises a gas pump, a first gas conveying pipe and a second gas conveying pipe; the first gas conveying pipe is branched into a first branch pipe and a second branch pipe; the solder recovery device comprises a scraping plate and a collecting box; and the negative pressure suction device comprises a suction pump, a threaded pipe, a suction main pipe and two suction branch pipes. The application can effectively collect the solder for secondary use, realizes the automation of the solder spraying on the surface of a chip assembly and solves the problem of uneven solder coating in the prior art.

Description

Technical Field

[0001] The present invention mainly relates to the technical field of spraying processing, and in particular to a solder spraying device for an oil cooler. Background Art

[0002] An oil cooler is a device that accelerates the heat dissipation of lubricating oil to keep it at a lower temperature. High-performance, high-power reinforced engines require an oil cooler due to the high heat load. The oil cooler is an integrated structure consisting of several chip components stacked on top of each other. To ensure stable connections between the chip components, the surface of the chip components usually needs to be coated with solder for welding. However, the aluminum plate-fin oil cooler has a complex structure and many solder joints, and the existing technology uses brazing. However, uneven solder coating can lead to various defects such as incomplete brazing, poor brazing seam formation, pores, slag inclusions, weld blockage, and overburning, which greatly affect the service life of the oil cooler. In addition, during the solder coating process, the solder easily falls everywhere, resulting in a huge waste of resources. Moreover, on the conveying device, the solder that has solidified into a paste easily adheres to the surface of the chip components, affecting subsequent welding processes. Summary of the Invention

[0003] In the prior art, uneven solder coating can lead to problems such as incomplete brazing and poor brazing seam formation. At the same time, the coating process can easily cause extreme waste of solder resources. In order to solve the above technical problems, the present invention provides a solder spraying device for an oil cooler.

[0004] The technical solution provided by the present invention is:

[0005] The present invention provides a solder spraying device for an oil cooler, comprising a conveying device, a feeding device, an air control device, a solder recovery device and a negative pressure suction device; the conveying device carries the chip assembly for translation; the feeding device comprises a spray box, a barrel and a spray gun; the spray box is mounted directly above the conveying device; the barrel is fixedly mounted on the top surface of the spray box; the bottom of the spray box is externally connected to a feeding pipe to the barrel; the spray gun is mounted inside the spray box; the air control device comprises an air pump, a first air supply pipe and a second air supply pipe; the first air supply pipe branches into a first branch pipe and a second branch pipe; the first branch pipe and the second branch pipe are connected to each other; The pipes are respectively connected to the spray guns; the first branch pipe and the second branch pipe are respectively provided with a precision pressure regulating valve and an air-controlled angle seat valve; the second air supply pipe is connected to the barrel; the solder recovery device includes a scraper and a collection box; the scraper is arranged at the bottom of the conveying device and is in contact with the conveying device; the collection box is arranged directly below the scraper; the negative pressure suction device includes a suction pump, a threaded pipe, a suction main pipe and two suction branches; the two suction branches pass through the wall of the spray box and are respectively arranged on both sides of the spray box; the two suction branches are connected to the two ends of the suction main pipe; the threaded pipe is connected to the middle part of the suction main pipe.

[0006] Preferably, a fixing ring is provided around the bottom of the barrel; a limiting groove is provided through the side wall of the fixing ring; the feeding pipe is provided through the limiting groove; a limiting hole is provided through the wall of the spray box; the feeding pipe is connected to the spray gun through the limiting hole; the first branch pipe, the second branch pipe and the feeding pipe are connected to the spray gun through the limiting hole.

[0007] Preferably, a crossbeam is fixed in the spray box; the spray gun is detachably mounted on the crossbeam; an opening is provided through the top surface of the spray box; a closed door for covering the opening is provided on the top surface of the spray box; one side of the closed door is hinged to the top surface of the spray box.

[0008] Preferably, a funnel for feeding is provided on the top of the barrel; the funnel is an integrated structure consisting of a conical bucket and a vertical tube; the vertical tube is arranged to pass through the top surface of the barrel; and a ball valve is installed on the vertical tube.

[0009] Preferably, the second gas supply pipe, the first branch pipe and the second branch pipe are respectively provided with a first solenoid valve, a second solenoid valve and a third solenoid valve; the feeding pipe is provided with a check valve.

[0010] Preferably, one end of the suction main pipe is connected to the outside world; a pull-out material storage pipe is provided in the suction main pipe; the material storage pipe is in communication with the suction branch pipe and the threaded pipe; a first filter is provided at the junction of the material storage pipe and the threaded pipe; an internal thread structure is provided at the end of the material storage pipe, and the internal thread structure is detachably connected to a mounting ring provided with an external thread structure; a second filter is provided on the inner ring of the mounting ring; the second filter is provided on the outside of the whole formed by the two suction branch pipes.

[0011] Preferably, a mud storage tank is provided between the scraper plate and the collecting box; the acute angle between the tank surface of the mud storage tank and the reference horizontal plane is 10-20°; at the end of the slope of the mud storage tank, a collecting pipe is provided through the bottom tank surface; the collecting pipe is connected to the interior of the collecting box.

[0012] Preferably, the acute angle between the scraper plate and the bottom surface of the conveying device is 45-60°.

[0013] Beneficial effects of the present invention:

[0014] The solder spraying device for the oil cooler provided by the present invention has the following beneficial effects:

[0015] 1. The solder spraying on the surface of chip components is automated. Under the action of the suction branches on both sides, the solder is evenly distributed and adheres to the surface of the chip components, solving the problem of uneven solder coating in the prior art.

[0016] 2. Through the coordinated use of the negative pressure suction device and the solder recovery device, most of the unused solder can be collected for secondary use, greatly saving the cost of solder usage;

[0017] 3. During the solder spraying process, the paste solder that solidifies and adheres to the surface of the conveyor will be scraped off by the solder recovery device, so it will not adhere to the surface of the chip component and will not affect the subsequent soldering between chip components.

[0018] 4. The negative pressure suction device can inhale the toxic solder flowing and suspended in the air and temporarily store it, effectively preventing the suspended solder from being inhaled into the operator's body during the production process, reducing production risks and avoiding personal injury. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention and its features, configurations, and advantages will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference numerals indicate like parts throughout the drawings. The drawings are not drawn to scale, emphasis instead being placed on illustrating the subject matter of the present invention.

[0020] Figure 1 It is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 A three-dimensional structural diagram of the present invention from another angle;

[0022] Figure 3 It is a three-dimensional structural diagram of the gas control device in the present invention; DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other. It should be noted that the terms used in the present invention are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to this application.

[0024] It should be understood that when the terms “include” and / or “comprising” are used in this specification, they specify the presence of features, steps, operations, devices, components and / or their combinations.

[0025] If the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0026] The terms "first", "second", "third", and the like, as used in the description and the claims, do not imply any relative importance of the referred objects.

[0027] Unless otherwise defined, the terms "mounting", "connected", "connecting" are to be construed as broadly as possible, for example, can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through intermediate medium, can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Therefore, the detailed description of the embodiments of the present application provided in the following drawings is not intended to limit the scope of the claimed application, but only to represent selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0029] Example 1

[0030] The uneven solder coating in the prior art can cause problems such as incomplete brazing and poor brazing seam formation, and meanwhile, the solder resource is easily wasted during the coating process, in order to solve the above technical problems, the embodiment of the present application provides a solder spraying device for an oil cooler, which comprises a conveying device 1, a feeding device 2, a gas control device 3, a solder recovery device 4 and a negative pressure suction device 5; the conveying device 1 carries a chip assembly 6 to translate; the feeding device 2 comprises a spraying box 201, a barrel 202 and a spray gun 203; the spraying box 201 is erected directly above the conveying device 1; the barrel 202 is fixedly arranged on the top surface of the spraying box 201; the bottom of the spraying box 201 is connected with a feeding pipe to the barrel 202; the spray gun 203 is erected in the interior of the spraying box 201; the gas control device 3 comprises a gas pump 301, a first gas conveying pipe 302 and a second gas conveying pipe 303; the first gas conveying pipe 302 is branched into a first branch pipe 3021 and a second branch pipe 3022; the first branch pipe 3021 and the second branch pipe 3022 are respectively connected with the spray gun 203; the first branch pipe 3021 and the second branch pipe 3022 are respectively provided with a precision pressure regulating valve 7 and a gas control angle seat valve 8; the second gas conveying pipe 303 is communicated with the barrel 202; the solder recovery device 4 comprises a scraping plate 401 and a collecting box 402; the scraping plate 401 is arranged at the bottom of the conveying device 1 and is in contact with the conveying device 1; the collecting box 402 is arranged directly below the scraping plate 401; the negative pressure suction device 5 comprises a suction pump 501, a threaded pipe 502, a suction main pipe 503 and two suction branch pipes 504; the two suction branch pipes 504 penetrate through the wall surface of the spraying box 201 and are arranged on the two sides of the spraying box 201; the two suction branch pipes 504 are connected with the two ends of the suction main pipe 503; the threaded pipe 502 is communicated with the middle part of the suction main pipe 503.

[0031] When using the solder spraying device for the oil cooler involved in this embodiment, the solder required for the chip assembly processing of the oil cooler is injected into the barrel 202, the barrel 202 is closed to seal the inside, the conveyor 1 is activated, and the chip assemblies 6 are placed on the conveyor 1 in sequence, and moved horizontally with the conveyor 1; the air pump 301 is activated, and the air pump 301 conveys gas into the inside of the barrel 202. In the closed space, under the action of air pressure, the solder is transferred from the barrel 202 to the welding gun through the feeding pipe. At the same time, the air pressure value of the precision pressure regulating valve 7 is set according to the amount of solder required to be sprayed on the surface of each chip assembly 6, and the air pump 301 pumps the gas into the first branch pipe 3021. The gas is input into the spray gun 203 of the welding gun at a limited flow rate through the precision pressure regulating valve 7. Under the combined action of the air pressure and the spray gun 203, the solder in the welding gun is converted from paste to mist and sprayed downward. The mist solder is sprayed on the surface of the chip component 6 below each spray gun 203. During this process, the second branch pipe 3022 continuously supplies air to the air-controlled angle seat valve 8 to keep it in an open state. The suction pump 501 continues to operate, and the suction branches 504 on both sides of the spray box 201 act on both sides of the spray gun 203 to diffuse and evenly distribute the mist solder to both sides. The surface of the wall on both sides of the chip component 6 is solder-coated, and the excess solder is discharged by the suction branch pipe 504. The solder is sucked into the suction main pipe 503 and the suction branch pipe 504 in sequence for temporary storage; since the solder sprayed by the spray gun 203 is in a diffused state, a large amount of solder will adhere to the surface of the conveyor 1. When this part of the solder moves to the bottom of the conveyor 1, the scraper plate 401 in contact with the conveyor 1 will block it. At this time, the solder that has become a paste will slide along the scraper plate 401 to the collection box 402 and be temporarily stored in the collection box 402. When all chip components 6 have completed solder spraying, turn off the air pump 301, remove the suction pump 501, use a simple device to scrape out the solder in the threaded tube 502 and the suction main pipe 503, and take out the solder temporarily stored in the collection box 402. Solder, and reuse the solder; the present invention realizes the automation of solder spraying on the surface of the chip component 6. Under the action of the suction branch pipes 504 on both sides, the solder is evenly distributed and adheres to the surface of the chip component 6, solving the problem of uneven solder coating in the prior art; through the coordinated use of the negative pressure suction device 5 and the solder recovery device 4, most of the unused solder can be collected for secondary utilization, which greatly saves the cost of solder usage; the negative pressure suction device 5 can inhale the toxic solder flowing and suspended in the air and temporarily store it, effectively preventing the suspended solder from being inhaled into the operator's body during the production process, reducing production risks and avoiding personal injury.

[0032] In this embodiment, preferably, a fixing ring is provided at the bottom of the barrel 202; in order to ensure that the solder in the barrel is injected into the spray gun 203 as much as possible and to improve the utilization rate of the solder, the feeding pipe needs to be connected to the bottom of the barrel 202, which will conflict with the position of the above-mentioned fixing ring 9. Therefore, a limiting groove 10 is provided on the side wall passing through the fixing ring 9; the feeding pipe is provided through the limiting groove 10; the spray box 201 is relatively closed as a whole. In order not to cause obstacles to the transportation of the chip component 6, a limiting hole 11 is provided on the wall of the spray box 201; the feeding pipe is connected to the spray gun 203 through the limiting hole 11; the first branch pipe 3021, the second branch pipe 3022 and the feeding pipe are connected to the spray gun 203 through the limiting hole 11; on the one hand, the positions of the first branch pipe 3021, the second branch pipe 3022 and the feeding pipe can be fixed, and the relative airtightness of the spray box 201 as a whole can also be ensured.

[0033] The spray box 201 needs to maintain a relatively closed internal environment, and the height of the spray gun 203 needs to be changed at any time according to the process requirements. If a number of process holes are set on its top surface, not only can the spray box 201 not be guaranteed to be closed, but the height of the spray gun 203 cannot be adjusted at any time; therefore, in this embodiment, it is preferred that a crossbeam 12 is fixed in the spray box 201; the spray gun 203 is detachably mounted on the crossbeam 12, and the position of the spray gun 203 on the crossbeam 12 is adjusted according to the working conditions; an opening is provided through the top surface of the spray box 201; the top surface of the spray box 201 is provided with a closed door 14 for covering the opening 13; one side of the closed door 14 is hinged to the top surface of the spray box 201, and the staff can adjust the position of the spray gun 203 at any time through the opening 13, and repair and replace the spray gun 203 when it is damaged.

[0034] Before the solder is fed into the welding gun to complete the spraying, it should be avoided as much as possible from contact with the air to avoid drying. In order to ensure its moisture content, the barrel 202 as a whole needs to have good airtightness. In this embodiment, preferably, a funnel 15 for replenishing material is provided on the top of the barrel 202; the funnel 15 is an integrated structure composed of a conical bucket and a vertical pipe; the vertical pipe is set through the top surface of the barrel 202; a ball valve 16 is installed on the vertical pipe; the funnel 15 is used to load the inside of the barrel 202. During the operation, the operator pours the paste solder into the conical bucket, opens the ball valve 16, and the solder is injected into the barrel 202 through the vertical pipe. When enough solder is injected, the ball valve 16 is closed to keep the barrel 202 sealed.

[0035] In this embodiment, preferably, the second gas pipe 303, the first branch pipe 3021 and the second branch pipe 3022 are respectively provided with a first solenoid valve 17, a second solenoid valve 18 and a third solenoid valve 19, and the second gas pipe 303 and the first and second branches (3021, 3022) are respectively controlled to be opened or closed by the first, second and third solenoid valves (17, 18, 19); a check valve 20 is provided on the feeding pipe, and the check valve 20 is used to prevent the solder from flowing back into the barrel 202 during the feeding process.

[0036] In order to facilitate the removal of the solder in the suction main pipe 503, it is preferred in this embodiment that one end of the suction main pipe 503 is connected to the outside world; a pull-out storage pipe 21 is provided in the suction main pipe 503. When the solder spraying on the surface of all chip components 6 is completed, most of the solder sucked by the negative pressure suction device 5 remains on the inner wall of the discharge pipe. The storage pipe 21 in the suction main pipe 503 is pulled out from the end connected to the outside world, and the solder in the storage pipe 21 is poked out and stored using a simple device; the storage pipe 21 is connected to the suction branch pipe 504 and the threaded pipe 502; a first filter screen (not shown in the figure) is provided at the junction of the storage pipe 21 and the threaded pipe 502, and the inner wall is bent The threaded tube 502 is inconvenient to take out the solder, so the solder is isolated in the storage tube 21 by the above-mentioned first filter to prevent the solder from entering the threaded tube 502; the end of the storage tube 21 is provided with an internal thread structure, and the internal thread structure is detachably connected to the mounting ring with an external thread structure; the inner ring of the mounting ring is provided with a second filter 22, and the second filter 22 is provided on the outside of the whole formed by the two suction branches 504. The second filter 22 can effectively prevent the solder from floating into the external environment with the air and causing damage to the operator. When in use, the mounting ring and the second filter 22 are disassembled, and a simple device is used to bucket the solder into the storage tube 21 from one end, and the solder is discharged and collected from the other end.

[0037] In this embodiment, preferably, a mud storage tank 23 is provided between the scraper plate 401 and the collecting box 402; the acute angle between the tank surface of the mud storage tank 23 and the reference horizontal plane is 10-20°; at the end of the slope of the mud storage tank 23, a collecting pipe 24 is provided through the bottom tank surface thereof; the collecting pipe 24 is connected to the interior of the collecting box 402; the inclined tank surface enables the solder to move more easily from one end of the mud storage tank 23 to the other end, and fall into the collecting box 402 through the collecting pipe 24. The use of the mud storage tank 23 can increase the temporary storage space for the recycled solder, and the cooperation with the collecting pipe 24 can improve the orderliness of the solder in the collecting box 402.

[0038] In order to ensure the smoothness of the scraper plate 401 in scraping the mud, and at the same time ensure that the solder can slide along the scraper plate 401 into the mud storage tank 23, in order to ensure the preferred embodiment in this embodiment, the acute angle between the scraper plate 401 and the bottom surface of the conveying device 1 is 45-60°. If the angle is too large, the scraping effect is not good, and if the angle is too small, the solder will stay on the surface of the scraper plate 401 and will not slide into the mud storage tank 23.

[0039] The above embodiments are merely illustrative of the principles and effects of this patent application and are not intended to limit this patent application. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this patent application. Therefore, any equivalent modifications or alterations made by a person skilled in the art without departing from the spirit and technical concepts disclosed in this patent application shall be covered by the claims of this patent application.

Claims

1. A solder spraying device for an oil cooler, characterized in that: It includes a conveying device, a feeding device, a gas control device, a solder recovery device and a negative pressure suction device; The oil cooler is composed of a plurality of chip assemblies; the conveying device carries the chip assemblies for translation; The feeding device includes a spray box, a barrel and a spray gun; the spray box is mounted directly above the conveying device; the barrel is fixed to the top surface of the spray box; the bottom of the spray box is externally connected to a feeding pipe to the barrel; the spray gun is mounted inside the spray box; The air control device includes an air pump, a first air pipe and a second air pipe; the first air pipe is divided into a first branch pipe and a second branch pipe; the first branch pipe and the second branch pipe are respectively connected to the spray gun; the first branch pipe and the second branch pipe are respectively provided with a precision pressure regulating valve and an air-controlled angle seat valve; the second air pipe is connected to the barrel; The solder recovery device includes a scraper and a collection box; the scraper is arranged at the bottom of the conveying device and contacts the conveying device; the collection box is arranged directly below the scraper; The negative pressure suction device includes a suction pump, a threaded pipe, a suction main pipe and two suction branch pipes; the two suction branch pipes pass through the wall of the spray box and are arranged on both sides of the spray box; the two suction branch pipes are connected to the two ends of the suction main pipe; the threaded pipe is connected to the middle part of the suction main pipe; A fixing ring is provided at the bottom of the barrel; a limiting groove is provided on the side wall of the fixing ring; and the feeding pipe is provided through the limiting groove; A limiting hole is provided through the wall of the spray box; the feeding pipe is connected to the spray gun through the limiting hole; the first branch pipe, the second branch pipe and the feeding pipe are connected to the spray gun through the limiting hole; One end of the suction main pipe is connected to the outside world; A pull-out material storage pipe is provided in the suction main pipe; the material storage pipe is in communication with the suction branch pipe and the threaded pipe; a first filter is provided at the junction of the material storage pipe and the threaded pipe; The end of the material storage pipe is provided with an internal thread structure, which is detachably connected to a mounting ring provided with an external thread structure; the inner ring of the mounting ring is provided with a second filter screen; the second filter screen is provided on the outside of the whole formed by the two suction branch pipes.

2. The solder spraying device for an oil cooler according to claim 1, characterized in that: A crossbeam is fixed in the spray box; the spray gun is detachably mounted on the crossbeam; An opening is provided through the top surface of the spray box; a sealed door for covering the opening is provided on the top surface of the spray box; one side of the sealed door is hinged to the top surface of the spray box.

3. The solder spraying device for an oil cooler according to claim 1, characterized in that: A funnel for feeding is provided on the top of the barrel; the funnel is an integrated structure consisting of a conical bucket and a vertical pipe; the vertical pipe is arranged to pass through the top surface of the barrel; and a ball valve is installed on the vertical pipe.

4. The solder spraying device for an oil cooler according to claim 1, characterized in that: The second gas delivery pipe, the first branch pipe and the second branch pipe are respectively provided with a first solenoid valve, a second solenoid valve and a third solenoid valve; the feeding pipe is provided with a check valve.

5. The solder spraying device for an oil cooler according to claim 1, characterized in that: A mud storage tank is provided between the scraper plate and the collecting box; the acute angle between the tank surface of the mud storage tank and the reference horizontal plane is 10-20 degrees; At the end of the slope of the mud storage tank, a collecting pipe is provided through the bottom tank surface; the collecting pipe is connected to the interior of the collecting box.

6. The solder spraying device for an oil cooler according to claim 1, characterized in that: The acute angle between the scraper plate and the bottom surface of the conveying device is 45-60 degrees.

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