electronic devices

Abstract

The present disclosure relates to an electronic device, belonging to the field of hardware product technology. The electronic device overcomes the defect of the fingerprint recognition component pressing the screen upward to produce black spots. The electronic device includes: a fingerprint recognition sensor, a connecting circuit and a buffer component. The connecting circuit is overlapped on the fingerprint recognition sensor. The buffer component is located above the connecting circuit, and a recessed area is provided on the side of the buffer component facing the connecting circuit, and the recessed area is provided corresponding to the portion of the connecting circuit overlapped on the sensor.

Description

Technical Field

[0001] The present disclosure relates to the technical field of hardware products, and in particular to an electronic device. Background Art

[0002] Thinness and lightweighting are the development trend of electronic devices such as mobile phones. To achieve this, the thickness of various components within these devices needs to be reduced. Fingerprint recognition components are widely used in mobile phones and other electronic devices. Related technologies provide a relatively thin fingerprint recognition component for installation below the display screen.

[0003] However, when using an electronic device with the above-mentioned fingerprint recognition component, the fingerprint recognition component may press the screen upward, thereby generating black spots on the screen and affecting the normal use of the electronic device. Summary of the Invention

[0004] The present disclosure provides an electronic device to solve the technical deficiencies in the related art.

[0005] According to an embodiment of the present disclosure, an electronic device is provided, comprising:

[0006] Fingerprint recognition sensor;

[0007] A connecting line is connected to the fingerprint recognition sensor; and

[0008] The buffer component is located above the connecting line, and a recessed area is provided on a side of the buffer component facing the connecting line. The recessed area is provided corresponding to a portion of the connecting line that is overlapped on the sensor.

[0009] In one embodiment, the buffer assembly includes a first surface facing the connection line, and a second surface opposite to the first surface;

[0010] The recessed area forms a first opening on the first surface and is recessed toward the second surface;

[0011] The portion of the connecting line overlapping the sensor enters the recessed area through the first opening, and has a gap with a portion of the recessed area close to the second surface.

[0012] In one embodiment, the recessed area further forms a second opening on the second surface.

[0013] In one embodiment, the recessed area has a bottom wall close to the second surface.

[0014] In one embodiment, the buffer assembly includes: a light shielding layer, a buffer layer, and an isolation layer that are stacked, and the light shielding layer is arranged toward the connecting line;

[0015] The recessed area forms the first opening on the light shielding layer and is recessed at least to the buffer layer.

[0016] In one embodiment, the connection circuit includes: a wire connected to the fingerprint recognition sensor, and a circuit board connected to the wire.

[0017] In one embodiment, the electronic device further comprises a middle frame, wherein a mounting hole for mounting a fingerprint recognition sensor is provided on the middle frame;

[0018] A sealing member is provided between the mounting hole and the fingerprint recognition sensor.

[0019] In one embodiment, the sealing member is in contact with the sidewall of the mounting hole and the side edge of the fingerprint recognition sensor.

[0020] In one embodiment, the fingerprint recognition sensor includes a photosensitive portion, and the buffer component is further provided with a light-transmitting area, and the light-transmitting area is provided corresponding to the photosensitive portion.

[0021] The electronic device provided by the present disclosure has at least the following beneficial effects:

[0022] If external forces cause the portion of the connecting wire that overlaps the fingerprint sensor to bulge toward the display screen and the buffer assembly, the recessed area in the buffer assembly provides space for the connecting wire to move toward the display screen. This reduces stress on the buffer assembly at the junction of the connecting wire and the fingerprint sensor, and prevents the connecting wire and / or buffer assembly from protruding and squeezing the display screen, thus preventing the "black spot" that occurs on the top of the screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0024] Figure 1 is a partial cross-sectional view of an electronic device according to an exemplary embodiment;

[0025] Figure 2 is a partial cross-sectional view of an electronic device according to another exemplary embodiment;

[0026] Figure 3 is a schematic structural diagram of a buffer assembly according to an exemplary embodiment;

[0027] Figure 4 is a schematic structural diagram of a buffer assembly according to another exemplary embodiment;

[0028] Figure 5is a schematic structural diagram of a buffer assembly according to another exemplary embodiment;

[0029] Figure 6 is a schematic structural diagram of a buffer assembly according to another exemplary embodiment;

[0030] Figure 7 It is a schematic diagram of a partial structure of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0031] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, like numbers in different figures represent like or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0032] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meaning understood by a person of ordinary skill in the art to which this disclosure belongs. The use of "a" or "an," and similar terms in this disclosure and the claims does not indicate a limitation of quantity, but rather indicates the presence of at least one. Unless otherwise indicated, the use of "include" or "comprises," and similar terms means that the elements or objects preceding "include" or "comprises" include the elements or objects listed after "include" or "comprises," and their equivalents, and does not exclude other elements or objects. The use of "connected" or "connected" and similar terms is not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. As used in this disclosure and the claims, the singular forms "a," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein is intended to encompass any and all possible combinations of one or more of the associated listed items.

[0033] In some embodiments, the fingerprint recognition assembly includes a fingerprint recognition sensor and connecting circuitry. To reduce the thickness of the fingerprint recognition assembly, the connecting circuitry is overlapped with the fingerprint recognition sensor. In this manner, the fingerprint recognition sensor is no longer directly mounted on the flexible printed circuit board, thereby reducing the overall thickness of the fingerprint recognition assembly. Furthermore, in the electronic device, a buffer assembly is disposed above the fingerprint recognition assembly, and a display screen is disposed above the buffer assembly.

[0034] However, in this fingerprint recognition component, the portion of the connection line connected to the fingerprint sensor is higher than the upper surface of the fingerprint recognition sensor. During the use of the electronic device, the connection line and the fingerprint recognition sensor may be deformed by external forces (for example, the electronic device falls), and the portion of the connection line overlapping the fingerprint recognition sensor may press the buffer component upward. At this time, the stress of the portion of the connection line overlapping the fingerprint recognition sensor is concentrated, squeezing the buffer component and the display screen, causing black spots on the screen. In particular, when the display screen is a flexible display, the problem of "black spots on the top screen" is more serious.

[0035] To address the above-mentioned issues, embodiments of the present disclosure provide an electronic device that is less susceptible to "black spots on the top screen" when subjected to external forces, thereby ensuring normal use of the electronic device. In embodiments of the present disclosure, the electronic device is a device including a display screen, including but not limited to smartphones, tablet computers, desktop / laptop / handheld computers, notebook computers, ultra-mobile personal computers (UMPCs), personal digital assistants (PDAs), and augmented reality (AR) / virtual reality (VR) devices.

[0036] Figure 1 、 Figure 2 FIG is a partial cross-sectional view of an electronic device according to different exemplary embodiments. Figure 1 、 Figure 2 As shown, the electronic device provided by the embodiment of the present disclosure includes: a fingerprint recognition sensor 100, a connecting circuit 200, and a buffer component 300. The fingerprint recognition sensor 100 and the connecting circuit 200 form a fingerprint recognition component.

[0037] The fingerprint recognition sensor 100 includes but is not limited to: an ultrasonic fingerprint recognition sensor, an optical fingerprint recognition sensor, and a capacitive fingerprint recognition sensor.

[0038] When the fingerprint recognition sensor 100 is an optical fingerprint recognition sensor, the fingerprint recognition sensor 100 includes a photosensitive portion 110. The photosensitive portion 110 receives light reflected from the user's finger and determines the distance from different positions of the user's finger to the sensor based on the energy of the received light, thereby obtaining fingerprint information of the user's finger.

[0039] The connection circuit 200 includes a wire 210 and a circuit board 220. The wire 210 can be a gold wire and connected to the fingerprint recognition sensor 100. Figure 1 、 Figure 2In the example shown, wire 210 is attached to the upper surface of fingerprint sensor 100. Furthermore, wire 210 is electrically connected to circuit board 220. Circuit board 220, which can be a flexible circuit board, is connected to a processor in an electronic device. Thus, data transmission between fingerprint sensor 100 and the processor is achieved via connection line 200.

[0040] The buffer component 300 is disposed above the connection line 200. In the electronic device, the buffer component 300 is located between the fingerprint recognition sensor 100 and the display screen (not shown in the figure), and plays a supporting and buffering role for the fingerprint recognition sensor 100 and the display screen.

[0041] The buffer component 300 includes a first surface 300a facing the connection line 200 and a second surface 300b opposite the first surface 300a. In the electronic device, the second surface 300b faces the display screen. The buffer component 300 includes a multi-layer structure. Figure 3 FIG is a schematic diagram showing the structure of a buffer assembly according to an exemplary embodiment. Figure 3 As shown, the buffer assembly 300 includes: a light shielding layer 320, a buffer layer 330, and an isolation layer 340 stacked in sequence. Optionally, the light shielding layer 320 and the buffer layer 330 are made of Mylar, and the buffer layer 330 is made of foam.

[0042] Optionally, the light shielding layer 320 is disposed toward the connection line. Figure 3 In the illustrated orientation, the lower surface of the light shielding layer 320 is the first surface 300 a of the buffer component 300 , and the upper surface of the isolation layer 340 is the second surface 300 b of the buffer component 300 .

[0043] Continue to see Figure 1 and Figure 2 A recessed area 310 is provided on one side of the buffer assembly 300 facing the connection line 200. The recessed area 310 corresponds to the portion of the connection line 200 that is overlapped on the sensor 100. For example, the recessed area 310 corresponds to the portion of the wire 210 that is overlapped on the sensor 100.

[0044] In this way, when the electronic device is subjected to external force causing the junction of the wire 210 in the connecting circuit 200 and the fingerprint recognition sensor 100 to bulge toward the display screen, the recessed area 310 on the buffer component 300 provides displacement space for the connecting circuit 200, thereby reducing the stress on the buffer component 300 at the junction of the wire 210 and the fingerprint recognition sensor 100, avoiding the buffer component 300 and / or the wire 210 from squeezing the display screen, and thereby avoiding the occurrence of "black spots on the top screen".

[0045] Optionally, the recessed area 310 forms a first opening 311 on the first surface 300a of the buffer assembly 300, and the recessed area 310 is recessed toward the second surface 300b. The portion of the connection line 200 that overlaps the fingerprint sensor 100 enters the recessed area 310 through the first opening 311, and a gap is left between the portion of the recessed area 310 that is closer to the second surface 300b.

[0046] In this way, the recessed area 310 creates sufficient upward displacement space for the connecting line 200. As long as the deformation of the connecting line 200 where it overlaps the fingerprint sensor 300 does not exceed the depth of the recessed area 310, the buffer assembly 300 and / or the connecting line 200 will not press the display screen upward.

[0047] Figures 4 to 6 It is a schematic structural diagram of a buffer assembly according to different exemplary embodiments.

[0048] In one example, if Figure 4 As shown, the recessed area 310 forms a first opening 311 on the first surface 300 a and a second opening 312 on the second surface 300 b . At this point, the recessed area 310 penetrates the buffer assembly 300 .

[0049] In this way, the portion of the wire 220 that is connected to the sensor 100 can completely extend into the recessed area 310 , thereby maximizing the upward displacement space of the wire 200 and preventing the wire 220 from pressing the display screen upward.

[0050] In one example, if Figure 5 、 Figure 6 As shown, the recessed area 310 forms a first opening 311 on the first surface 300a. In addition, the recessed area 310 has a bottom wall 313 close to the second surface 300b. In this case, the recessed area 310 does not penetrate the buffer assembly 300 and is a blind hole on the buffer assembly 300.

[0051] For example, Figure 5 As shown, the recessed area 310 is recessed into the buffer layer 330. That is, the recessed area 310 penetrates the light shielding layer 320 and the buffer layer 330. At this time, the portion of the isolation layer 340 exposed within the recessed area 310 forms the bottom wall 313 of the recessed area 310. In this way, the buffer assembly 300 is ensured to have a uniform isolation effect.

[0052] For example, Figure 6As shown, recessed area 310 penetrates light shielding layer 320 but does not penetrate buffer layer 330. The portion of buffer layer 330 exposed within recessed area 310 forms bottom wall 313 of recessed area 310. This ensures that the buffer assembly 300 retains its cushioning properties at the portion corresponding to recessed area 310 while also ensuring uniform isolation.

[0053] It should be noted that when the isolation layer 330 is disposed toward the connection line 200, the isolation layer 300 is located below the light shielding layer 320. Figure 4 In the embodiment of the recessed area 310 shown, the recessed area 310 does not penetrate the light shielding layer 320 , thereby ensuring that the buffer assembly 300 has a uniform light shielding effect.

[0054] also, Figure 7 FIG. 1 is a schematic diagram of a partial structure of an electronic device according to an exemplary embodiment. Figure 7 As shown, a light-transmitting area 350 is also provided on the buffer component 300. For example, a through hole is provided on the buffer component 300 to form the light-transmitting area 350. The light-transmitting area 350 is used to cooperate with the signal receiving surface of the fingerprint recognition sensor 100. For example, if the fingerprint recognition sensor 100 is an optical fingerprint recognition sensor having a photosensitive surface, the light-transmitting area 350 cooperates with the photosensitive surface of the fingerprint recognition sensor 100. In addition, the edge of the light-transmitting area 350 is located outside the field of view of the photosensitive portion 110 of the fingerprint recognition sensor 100. In this way, the fingerprint recognition sensor 100 is guaranteed to receive sufficient incident light to the greatest extent possible, thereby optimizing the fingerprint recognition effect.

[0055] In one embodiment, referring to Figure 7 The electronic device further includes a middle frame 400. The middle frame 400 is provided with a mounting hole 410 for mounting the fingerprint recognition sensor 200.

[0056] In the disclosed embodiment, the recessed area 310 is provided on the buffer assembly 300, thereby reducing the contact area between the buffer assembly 300 and the fingerprint recognition module 100. To ensure that the fingerprint recognition sensor 100 is stably installed in the electronic device, a seal 500 is provided between the mounting hole 410 and the fingerprint recognition sensor 200.

[0057] For example, the seal 500 has a frame-like structure with at least four sides. The inner wall of each side of the seal 500 fits against the side of the fingerprint sensor 100, and the side is also connected to the middle frame 400 at the mounting hole 410. The seal 500 compensates for the weakened sealing performance caused by the recessed area 310, ensuring the stable installation of the fingerprint sensor 100 within the electronic device.

[0058] In the electronic device provided by the embodiment of the present disclosure, when an external force causes the junction between the wire 210 and the fingerprint recognition sensor 100 to bulge toward the buffer component 300, the recessed area 310 on the buffer component 300 provides displacement space for the connecting wire 200 toward the display screen, thereby reducing the stress on the buffer component 300 at the junction between the wire 210 and the fingerprint recognition sensor 100, thereby avoiding the occurrence of "black spots on the top screen".

[0059] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow from the general principles of the disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

Claims

1. An electronic device, characterized in that: The electronic device comprises: Fingerprint recognition sensor; A connecting circuit, comprising: a wire connected to the upper surface of the fingerprint recognition sensor, and a circuit board connected to the wire, wherein the fingerprint recognition sensor is not provided on the circuit board; and A buffer component is located between the fingerprint recognition sensor and the display screen, supporting and buffering the fingerprint recognition sensor and the display screen, and the buffer component is located above the connecting line, and a recessed area is provided on the side of the buffer component facing the connecting line, and the recessed area is provided corresponding to the portion of the connecting line overlapping the sensor.

2. The electronic device according to claim 1, wherein The buffer assembly includes a first surface facing the connection line, and a second surface opposite to the first surface; The recessed area forms a first opening on the first surface and is recessed toward the second surface; The portion of the connecting line overlapping the sensor enters the recessed area through the first opening, and has a gap with a portion of the recessed area close to the second surface.

3. The electronic device according to claim 2, wherein: The recessed area further forms a second opening on the second surface.

4. The electronic device according to claim 2, wherein: The recessed area has a bottom wall close to the second surface.

5. The electronic device according to claim 3, wherein: The buffer assembly comprises: a light shielding layer, a buffer layer and an isolation layer stacked in sequence, wherein the light shielding layer is arranged toward the connecting circuit; The recessed area forms the first opening on the light shielding layer and is recessed at least to the buffer layer.

6. The electronic device according to claim 1, wherein: The electronic device further includes a middle frame, wherein a mounting hole for mounting a fingerprint recognition sensor is provided on the middle frame; A sealing member is provided between the mounting hole and the fingerprint recognition sensor.

7. The electronic device according to claim 6, wherein: The sealing member is in contact with the side wall of the mounting hole and the side edge of the fingerprint recognition sensor.

8. The electronic device according to claim 1, wherein: The fingerprint recognition sensor includes a photosensitive portion, and the buffer component is further provided with a light-transmitting area, which is provided corresponding to the photosensitive portion.

Images