Electronic device

Abstract

The present application discloses an electronic device, relating to the technical field of electronic devices. The electronic device includes: a housing assembly, an inner wall of the housing assembly is provided with a sound absorption cavity; a sounding device, disposed in the housing assembly, the sounding device includes a first sound cavity, and the first sound cavity is communicated with the sound absorption cavity; a powder filling medium, disposed in the sound absorption cavity, and the powder filling medium is used for absorbing at least part of the sound waves emitted by the sounding device.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and more particularly, to an electronic device. Background Art

[0002] With the rapid development of mobile communication technology, electronic devices have become essential communication and entertainment tools for humans. With the stacking requirements of electronic devices, electronic devices are becoming thinner and thinner, and the internal volume of electronic devices is gradually being compressed more and more severely. In related technologies, the volume of the rear cavity of the sound-emitting device in the electronic device is also getting smaller and smaller, greatly reducing the audio performance. Summary of the Invention

[0003] This application aims to provide an electronic device, which at least solves the technical problem that the internal volume of the electronic device in related technologies is small, resulting in a small rear sound cavity volume of the sound-emitting device and poor low-frequency performance.

[0004] An embodiment of this application provides an electronic device, including: a housing assembly, an inner wall of the housing assembly is provided with a sound-absorbing cavity; a sound-emitting device, disposed in the housing assembly, the sound-emitting device includes a first sound cavity, and the first sound cavity is communicated with the sound-absorbing cavity; a powder-filling medium, disposed in the sound-absorbing cavity, and the powder-filling medium is used to absorb at least part of the sound waves emitted by the sound-emitting device.

[0005] In the embodiment of this application, from the structural design, the low-frequency performance of the electronic device is made more sufficient, the low-frequency strength is improved, and the sound quality effect is improved. Moreover, this application also effectively improves the problem of large vibration feeling of the housing assembly to a certain extent. And, on the basis of improving the low-frequency effect of the sound-emitting device, this application does not need to additionally add relevant structures inside the housing assembly, ensuring the simple structure of the electronic device and realizing the thin and light design of the electronic device.

[0006] The additional aspects and advantages of this application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of this application. Brief Description of the Drawings

[0007] The above and / or additional aspects and advantages of this application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0008] Figure 1 is a schematic diagram of an electronic device according to an embodiment of this application;

[0009] Figure 2 is Figure 1 a top view of the electronic device shown;

[0010] Figure 3 is Figure 1 a bottom view of the electronic device shown;

[0011] Figure 4 is Figure 1 One of the partial schematic diagrams of the electronic device shown;

[0012] Figure 5 is Figure 1 Another partial schematic diagram of the electronic device shown;

[0013] Figure 6 Is the exploded view of the electronic device of an embodiment of the present application;

[0014] Figure 7 is Figure 6 One of the partial schematic diagrams of the electronic device shown;

[0015] Figure 8 is Figure 6 Another partial schematic diagram of the electronic device shown;

[0016] Figure 9 is Figure 6 The third partial schematic diagram of the electronic device shown;

[0017] Figure 10 is Figure 6 One of the installation schematic diagrams of the electronic device shown;

[0018] Figure 11 is Figure 6 Another installation schematic diagram of the electronic device shown;

[0019] Figure 12 is Figure 6 The third installation schematic diagram of the electronic device shown;

[0020] Figure 13 Is one of the structural schematic diagrams of the speaker in the electronic device of an embodiment of the present application;

[0021] Figure 14 Is another structural schematic diagram of the speaker in the electronic device of an embodiment of the present application;

[0022] Figure 15 is

[0023] Figure 16 is

[0024] Figure 17 is Figure 15 One of the partial schematic diagrams of the electronic device shown;

[0025] Figure 18 is Figure 15 Another partial schematic diagram of the electronic device shown;

[0026] Figure 19 is Figure 15 the third partial schematic diagram of the electronic device shown;

[0027] Figure 20 is the low-frequency effect diagram of the electronic device of the embodiment of the present application and the electronic device in the related art.

[0028] Figures 1 to 19 The reference numerals in

[0029] 102 housing assembly, 104 sound absorption cavity, 106 sound generating device, 108 first sound cavity, 110 powder filling medium, 112 frame, 114 cover plate, 116 sound outlet cavity, 118 partition, 120 first seal, 122 first opening, 124 second opening, 126 second seal, 128 third opening, 130 earpiece, 132 sound guiding channel, 134 speaker, 136 circuit board, 138 appearance sound outlet hole, 140 mounting structure, 142 screen, 144 circuit board, 146 speaker, 148 battery, 150 third seal, 152 second sound cavity, 154 first sound hole, 156 second sound hole, 158 connection port, 160 third sound hole, 162 sound transmission space, 164 sound outlet. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0031] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. generally belong to the same category, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0032] Next, the electronic device provided in the embodiments of the present application will be described in detail in conjunction with the accompanying drawings through specific embodiments and their application scenarios. Among them, Figure 20 the line L1 in Figure 7 represents the low-frequency effect of the electronic device in the related art, and the line L2 represents the low-frequency effect of the electronic device in the embodiment of the present application. Figure 7 andFigure 18 The dashed arrow in the figure indicates the propagation direction of the sound wave.

[0033] As Figure 1 and Figure 6 shown, an embodiment of the present application provides an electronic device, including: a housing assembly 102, an inner wall of the housing assembly 102 is provided with a sound absorption cavity 104; a sound generating device 106, disposed in the housing assembly 102, the sound generating device 106 includes a first sound cavity 108, and the first sound cavity 108 is communicated with the sound absorption cavity 104; a powder filling medium 110, disposed in the sound absorption cavity 104, and the powder filling medium 110 is used to absorb at least part of the sound waves emitted by the sound generating device 106.

[0034] It can be understood that the electronic device includes a housing assembly 102, a sound generating device 106, and a powder filling medium 110. Among them, the inner wall of the housing assembly 102 is hollowed out to form a sound absorption cavity 104, the sound generating device 106 is disposed in the housing assembly 102, and it is ensured that the first sound cavity 108 of the sound generating device 106 is communicated with the sound absorption cavity 104, so that part of the sound waves of the sound generating device 106 can enter the sound absorption cavity 104. In addition, the powder filling medium 110 is disposed in the sound absorption cavity 104, and the powder filling medium 110 is used to absorb part of the sound waves entering the sound absorption cavity 104.

[0035] Particularly, as Figure 6 shown, in the electronic device proposed by the present application, the sound absorption cavity 104 disposed on the inner wall of the housing assembly 102 is communicated with the first sound cavity 108 of the sound generating device 106, and the sound absorption cavity 104 can play a role in expanding the first sound cavity 108, so that at least part of the sound waves of the sound generating device 106 can be effectively conducted into the sound absorption cavity 104. In addition, a powder filling medium 110 is disposed in the sound absorption cavity 104 by means of powder filling, so that part of the sound waves entering the sound absorption cavity 104 can be absorbed by the powder filling medium 110, thereby effectively improving the low-frequency effect of the sound generating device 106 of the electronic device (the use of the powder filling medium 110 can double the effective working space volume of the first sound cavity 108).

[0036] Comparing Figure 20 the line L1 and the line L2 in Figure 20 it can be clearly seen that ( in Figure 20 the line L1 represents the low-frequency effect of the electronic device in the related art, and the line L2 represents the low-frequency effect of the electronic device in the embodiment of the present application), the present application makes the low-frequency performance of the electronic device more sufficient from the structural design, improves the low-frequency strength, and improves the sound quality effect. In addition, the present application also effectively improves the problem of large vibration feeling of the housing assembly 102. And, on the basis of improving the low-frequency effect of the sound generating device 106, the present application does not need to additionally add relevant structures inside the housing assembly 102, ensuring the simple structure of the electronic device and realizing the thin and light design of the electronic device.

[0037] In some possible embodiments, such as Figure 2 and Figure 5 shown, the housing assembly 102 includes a frame 112, and the sound absorption cavity 104 is disposed in at least a partial area of the frame 112.

[0038] It can be understood that the housing assembly 102 includes a frame 112, and the above-mentioned sound absorption cavity 104 is disposed on the frame 112 in the embodiments of the present application. Specifically, the frame 112 can be understood as the middle frame of the electronic device and is located at the edge position of the electronic device. As Figure 9 , Figure 10 , Figure 11 , Figure 12 shown, in the embodiments of the present application, a local hollowing-out design is directly performed on the frame 112, and then the above-mentioned sound absorption cavity 104 is formed on the frame 112, and the position of the sound absorption cavity 104 is opposite to that of the sound-emitting device 106, ensuring that the first sound cavity 108 of the sound-emitting device 106 is communicated with the sound absorption cavity 104. Moreover, in the embodiments of the present application, the above-mentioned sound absorption cavity 104 is formed by a hollowing-out method, which also ensures that the structure of the electronic device is simple and conforms to the current design trend of electronic devices.

[0039] In some possible embodiments, the sound absorption cavity 104 is disposed at the top of the frame 112; and / or the sound absorption cavity 104 is disposed at the bottom of the frame 112; and / or the sound absorption cavity 104 is disposed at the side of the frame 112.

[0040] It can be understood that the position of the sound absorption cavity 104 can be designed according to actual needs; specifically, it can be designed according to the position of the sound-emitting device 106 in the housing assembly 102, as long as it can ensure that the first sound cavity 108 is communicated with the sound absorption cavity 104, which can be achieved. Specifically, the sound absorption cavity 104 can be disposed at the top of the frame 112, or at the bottom of the frame 112, or on the side wall of the frame 112.

[0041] Specifically, the sound absorption cavity 104 can be disposed at the top of the frame 112 so that the position of the sound absorption cavity 104 is opposite to the position of the sound-emitting device 106 of most electronic devices.

[0042] In some possible embodiments, such as Figure 11 and Figure 15 shown, the sound absorption cavity 104 penetrates through the frame 112; the housing assembly 102 further includes a cover plate 114, the cover plate 114 is connected to the frame 112, and at least a part of the cover plate 114 covers the sound absorption cavity 104.

[0043] It can be understood that the sound absorption cavity 104 runs through the frame 112. In addition, the housing assembly 102 further includes a cover plate 114. Among them, the cover plate 114 is connected to the frame 112, and the cover plate 114 can at least cover the sound absorption cavity 104. In this way, on the one hand, the cover plate 114 can further ensure the absorption effect of the powder filling medium 110 on the sound waves entering the sound absorption cavity 104, thereby improving the low-frequency effect of the sound-emitting device 106; on the other hand, the cover plate 114 can prevent external dust from entering the sound absorption cavity 104, thereby ensuring the cleanliness of the sound absorption cavity 104 and the interior of the housing assembly 102. Specifically, the cover plate 114 is hermetically connected to the frame 112.

[0044] In some possible implementation manners, such as Figure 10 、 Figure 11 、 Figure 12 、 Figure 15 and Figure 16 shown, the housing assembly 102 further includes a sound outlet cavity 116. There is a partition 118 between the sound absorption cavity 104 and the sound outlet cavity 116, and the second sound cavity 152 of the sound-emitting device 106 is communicated with the sound outlet cavity 116.

[0045] It can be understood that the housing assembly 102 further includes a sound outlet cavity 116. Among them, there is a partition 118 between the sound absorption cavity 104 and the sound outlet cavity 116, and it is ensured that the sound outlet cavity 116 is isolated from the sound absorption cavity 104. In addition, the second sound cavity 152 of the sound-emitting device 106 is communicated with the sound outlet cavity 116; among them, the second sound cavity 152 of the sound-emitting device 106 is the front sound cavity.

[0046] Furthermore, the sound outlet cavity 116 is isolated from the sound absorption cavity 104 by the partition 118, so that part of the sound waves entering the sound absorption cavity will not enter the sound outlet cavity 116, thereby ensuring that this part of the sound waves is absorbed by the powder filling medium 110 in the sound absorption cavity, and thus improving the sound quality of the electronic device.

[0047] In some possible implementation manners, such as Figure 5 、 Figure 11 、 Figure 15 and Figure 16 shown, the electronic device further includes a first seal 120. The first seal 120 is arranged at the connection between the cover plate 114 and the frame 112. Among them, the first seal 120 is provided with a first opening 122 and a second opening 124. The first opening 122 is opposite to the position of the sound absorption cavity 104, and the second opening 124 is opposite to the position of the second sound cavity 152. The sound absorption cavity 104 and the sound outlet cavity 116 are isolated by the first seal 120.

[0048] Understandably, the electronic device further includes a first seal 120. The first seal 120 is disposed at the connection between the cover plate 114 and the frame 112. The first seal 120 can ensure the connection strength between the frame 112 and the cover plate 114, and at the same time can ensure the sealing performance at the connection between the frame 112 and the cover plate 114, thereby isolating the sound absorption cavity 104 from the sound output cavity 116.

[0049] Further, as Figure 5 , Figure 11 , Figure 15 and Figure 16 shown, the first seal 120 is provided with a first opening 122 and a second opening 124. The first opening 122 is opposite to the position of the sound absorption cavity 104, ensuring that at least part of the sound waves in the first sound cavity 108 can enter the sound absorption cavity 104; the second opening 124 is opposite to the position of the sound output cavity 116, ensuring that at least part of the sound waves in the second sound cavity 152 can enter the sound output cavity 116 and finally be transmitted through the sound output hole. In addition, the first seal 120 is disposed at the connection between the cover plate 114 and the frame 112, thereby ensuring the sealing performance at the connection between the cover plate 114 and the frame 112, so that the sound absorption cavity 104 and the sound output cavity 116 are isolated, and further preventing part of the sound waves entering the sound absorption cavity 104 from entering the sound output cavity 116, ensuring the sound output effect of the electronic device.

[0050] Specifically, as Figure 5 , Figure 11 , Figure 15 and Figure 16 shown, the first seal 120 can be a sealing double-sided tape, and the above-mentioned first opening 122 and second opening 124 are formed on the sealing double-sided tape. The sealing double-sided tape can ensure the connection between the cover plate 114 and the frame 112, and can also ensure the sealing performance at the connection between the cover plate 114 and the frame 112, thereby ensuring the isolation between the sound absorption cavity 104 and the sound output cavity 116.

[0051] In some possible implementation manners, as Figure 5 , Figure 11 , Figure 15 and Figure 16 shown, the electronic device further includes a second seal 126. The second seal 126 is disposed at the inlet end of the sound absorption cavity 104. The second seal 126 is provided with a third opening 128, and the third opening 128 is opposite to the position of the inlet end of the sound absorption cavity 104.

[0052] It can be understood that the electronic device further includes a second seal 126. The second seal 126 is disposed at the inlet end of the sound absorption cavity 104 to ensure that the powder filling medium 110 does not leak out of the sound absorption cavity 104 again. In addition, a third opening 128 is provided on the seal, and the third opening 128 is opposite to the inlet end of the sound absorption cavity 104, so as to ensure that at least part of the sound waves in the first sound cavity 108 can enter the sound absorption cavity 104.

[0053] In some possible implementation manners, such as Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 shown, the sound generating device 106 includes a receiver 130, and the electronic device further includes a sound guiding channel 132; the first sound cavity 108 of the receiver 130 is respectively communicated with the sound guiding channel 132 and the sound absorption cavity 104.

[0054] It can be understood that the sound generating device 106 includes a receiver 130 (non-two-in-one receiver), and the electronic device further includes a sound guiding channel 132. Among them, the first sound cavity 108 of the receiver 130 is respectively communicated with the sound guiding channel 132 and the sound absorption cavity 104.

[0055] Specifically, as Figure 7 shown, the first sound cavity 108 of the receiver 130 is open (i.e., an open rear cavity). And there is a sound transmission space 162 between the first sound cavity 108 of the receiver 130 and the sound absorption cavity 104, and part of the sound waves in the first sound cavity 108 can enter the sound absorption cavity 104 through the sound transmission space 162. In addition, the second seal 126 is disposed at the inlet end of the sound absorption cavity 104 and is located in the sound transmission space 162.

[0056] Particularly, when the receiver 130 is adopted in the sound generating device 106, a part of the first sound cavity 108 of the receiver 130 is communicated with the sound absorption cavity 104; as Figure 4 shown, the second sound cavity 152 of the receiver 130 emits sound through the appearance sound outlet hole 138 of the electronic device. In addition, the receiver 130 is connected to the circuit board 136 of the electronic device through a third seal 150 (the third seal 150 can be a double-sided adhesive).

[0057] In some possible implementation manners, the first sound cavity 108 of the receiver 130 is open, there is a sound transmission space 162 between the sound absorption cavity 104 and the first sound cavity 108 of the receiver 130, and the second seal 126 is located in the sound transmission space 162.

[0058] It can be understood that the first sound cavity 108 of the earpiece 130 is open (i.e., an open rear cavity). Therefore, when the rear cavity of the earpiece 130 is blocked, in the embodiment of the present application, the middle sound absorption cavity 104 is used to expand the first sound cavity 108 to a certain extent, and the powder filling medium 110 is arranged in the sound absorption cavity 104, so that the volume of the first sound cavity 108 can be doubled, effectively increasing the low-frequency components, making the sound more full and the low-frequency effect stronger.

[0059] Specifically, as Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 and Figure 12 shown, the earpiece 130 uses the first seal 120 to seal and isolate the first sound cavity 108 and the second sound cavity 152, effectively preventing acoustic short-circuit between the first sound cavity 108 and the second sound cavity 152. In addition, the air in the second sound cavity 152 will reach the sound absorption cavity 104, and the powder filling medium 110 is used to expand the volume of the first sound cavity 108 and the second sound cavity 152.

[0060] Specifically, as Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 and Figure 12 shown, the second seal 126 is used to seal the powder filling medium 110 into the sound absorption cavity 104, and the second seal 126 can also be used for ventilation; part of the sound waves in the second sound cavity 152 can extend into the sound absorption cavity 104 through the third opening 128 of the second seal 126. Specifically, the second seal 126 seals the connection between the sound outlet 164 and the sound absorption cavity 104. In addition, the cover plate 114 can effectively seal the powder filling medium 110 into the sound absorption cavity 104 of the frame 112 through the first seal 120.

[0061] Specifically, as Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 and Figure 12 shown, the frame 112 is partially grooved to form the sound absorption cavity 104, the powder filling medium 110 is filled in the sound absorption cavity 104, and the powder filling medium 110 is effectively sealed through the cover plate 114 (cooperating with the first seal 120) and the internal second seal 126, so that the powder filling medium 110 is stored in the sound absorption cavity 104; and the second seal 126 can achieve the ventilation function.

[0062] In some possible implementation manners, such as Figure 13 、 Figure 14 、 Figure 15 、Figure 16 , Figure 17 , Figure 18 and Figure 19 As shown in Figure 19 , the sound generating device 106 includes a speaker 134. An outlet 164 is provided at a partial position of the first sound cavity 108 of the speaker 134, and the outlet 164 is in communication with the sound absorbing cavity 104.

[0063] It can be understood that the sound generating device 106 includes a speaker 134 (an integrated BOX speaker). Among them, an outlet 164 is provided at a partial position of the first sound cavity 108 of the speaker 134, and the outlet 164 is directly in communication with the sound absorbing cavity 104. In particular, when the speaker 134 is adopted in the sound generating device 106, the entire first sound cavity 108 of the speaker 134 is in communication with the sound absorbing cavity 104.

[0064] In some possible implementation manners, as Figure 13 , Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 and Figure 19 As shown in Figure 19 , the electronic device further includes a mounting structure 140, and the speaker 134 is mounted in the housing assembly 102 through the mounting structure 140.

[0065] It can be understood that a mounting structure 140 is provided in the housing assembly 102 for mounting the speaker 134. Among them, a mounting groove is provided on the body of the electronic device, and the shape of the mounting groove matches the structure of the mounting structure 140. Therefore, during the process of mounting the speaker 134, the speaker 134 can be mounted on the mounting structure 140, and the mounting structure 140 can be mounted in the mounting groove, so as to ensure the stable connection of the speaker 134 on the body of the electronic device.

[0066] Specifically, as Figure 13 and Figure 14 As shown in Figure 14 , an outlet 164 is provided at a partial position of the first sound cavity 108 of the speaker 134. Therefore, in the embodiment of the present application, the volume of the first sound cavity 108 is directly expanded to the housing assembly 102. In addition, with the powder filling medium 110 in the sound absorbing cavity 104, the volume of the first sound cavity 108 can be effectively increased.

[0067] Specifically, in the embodiment of the present application, a partial groove is formed on the frame 112 to form the sound absorbing cavity 104, and a powder filling medium 110 is provided in the sound absorbing cavity 104. The outlet 164 of the first sound cavity 108 of the speaker 134 is aligned with the sound absorbing cavity 104 through the second sealing member 126. The powder filling medium 110 is designed inside the sound absorbing cavity 104 (the use of the powder filling medium 110 can double the spatial volume of the first sound cavity 108).

[0068] Specifically, as Figure 16, Figure 17 and Figure 18 As shown in Figure 17 and Figure 18 , after the sound absorption cavity 104 is filled with powder, it can be sealed by the first seal 120. The first seal 120 forms an effective seal between the frame 112 and the cover plate 114, preventing leakage and ensuring a good sealing effect. As Figure 19 shown in Figure 19 , the speaker 134 is effectively fixed inside the housing assembly 102 by screws and the mounting structure 140 to prevent movement.

[0069] In some possible implementation manners, as Figure 17 and Figure 18 shown in Figure 17 and Figure 18 , the second seal 126 seals the connection between the sound outlet 164 and the sound absorption cavity 104.

[0070] It can be understood that the sound outlet 164 of the first sound cavity 108 of the speaker 134 is directly aligned with the sound absorption cavity 104 of the frame 112 through the second seal 126; the second sound cavity 152 of the speaker 134 is aligned with the external sound outlet 138 of the electronic device to emit sound. The first sound cavity 108 and the second sound cavity 152 are completely sealed and separated, effectively preventing sound short - circuit. In addition, the sound outlet 164 of the first sound cavity 108 of the speaker 134 and the outlet of the second sound cavity 152 are located on different end faces.

[0071] In some possible implementation manners, as Figure 6 shown in Figure 6 , the electronic device further includes a circuit board 136. Among them, the circuit board 136 is disposed inside the housing assembly 102, and the sound - generating device 106 is connected to the circuit board 136. In this way, the circuit board 136 can provide an electrical signal to the sound - generating device 106 for the sound - generating effect.

[0072] In some possible implementation manners, as Figure 6 shown in Figure 6 , the electronic device further includes a circuit board 144 and a battery 148. Among them, both the circuit board 144 and the battery 148 are disposed inside the housing assembly 102, and the battery 148 is used to supply power to the circuit board 136, the circuit board 144, the sound - generating device 106, etc.

[0073] In some possible implementation manners, the electronic device proposed in the embodiments of the present application includes, but is not limited to, products such as mobile phones, tablet computers, e - books, game consoles, etc.

[0074] In some possible implementation manners, the powder - filling medium 110 can be D - BASS powder. In addition, those skilled in the art can understand the powder - filling process, and it will not be elaborated in detail here.

[0075] Specifically, in the embodiments of the present application, the sound absorption cavity 104 is disposed at the top of the frame 112. In addition, as Figure 2 and Figure 3As shown, a first sound hole 154 (top MIC hole) is also provided at the top of the frame 112, and a second sound hole 156 (bottom MIC hole), a connection port 158 (USB interface), and a third sound hole 160 (bottom speaker opening) are also provided at the bottom of the frame 112. In addition, as Figure 6 shown, the electronic device further includes a screen 142 and a speaker 146.

[0076] Therefore, in the embodiment of the present application, a sound absorption cavity 104 is hollowed out on the frame 112 of the electronic device, and a powder filling medium 110 is filled by a powder filling process. The first sound cavity 108 of the sound generating device 106 (earpiece 130 or speaker 134) of the electronic device can communicate with the sound absorption cavity 104, which can effectively improve the low-frequency performance of calls or playing songs, effectively improve the sound quality, increase the low-frequency components, and structurally improve the problem of insufficient ventilation of the first sound cavity 108 of the sound generating device 106, enhance the low-frequency performance, and enhance the low-frequency listening experience.

[0077] Moreover, the first sound cavity 108 of the sound generating device 106 is conducted to the sound absorption cavity 104 at the top, which can, to some extent, alleviate the vibration problem of the back cover of the electronic device. And it can effectively relieve the problem of insufficient ventilation of the first sound cavity 108 of the sound generating device 106 caused by the overall thinning of the electronic device.

[0078] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0079] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirits of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, Comprising: A housing assembly, an inner wall of the housing assembly being provided with a sound absorption cavity; A sound generating device, disposed within the housing assembly, the sound generating device including a first sound cavity, the first sound cavity being in communication with the sound absorption cavity; A powder filling medium, disposed within the sound absorption cavity, the powder filling medium being configured to absorb at least a portion of the sound waves emitted by the sound generating device; The housing assembly includes a frame, the sound absorption cavity being disposed in at least a portion of the frame; The sound absorption cavity runs through the frame; the housing assembly further includes a cover plate, the cover plate being connected to the frame, at least a portion of the cover plate covering the sound absorption cavity; The first sound cavity is open, i.e., an open rear cavity, and the first sound cavity is expanded by the sound absorption cavity; The frame is the middle frame of the electronic device; The housing assembly further includes a sound output cavity, there being a partition between the sound absorption cavity and the sound output cavity, a second sound cavity of the sound generating device being in communication with the sound output cavity; The electronic device further includes a first sealing member, the first sealing member being disposed at a connection between the cover plate and the frame, wherein, a first opening and a second opening are provided on the first sealing member, the first opening being opposite to the position of the sound absorption cavity, the second opening being opposite to the position of the second sound cavity, the sound absorption cavity and the sound output cavity being isolated by the first sealing member to prevent at least some of the sound waves entering the sound absorption cavity from entering the sound output cavity; The electronic device further includes a second sealing member, the second sealing member being disposed at an inlet end of the sound absorption cavity, wherein, a third opening is provided on the second sealing member, the third opening being opposite to the position of the inlet end of the sound absorption cavity.

2. The electronic device according to claim 1, wherein the sound absorption cavity is disposed at the top of the frame; and / or the sound absorption cavity is disposed at the bottom of the frame; and / or the sound absorption cavity is disposed at the side of the frame.

3. The electronic device according to claim 1 or 2, wherein the sound generating device includes a receiver, the electronic device further includes a sound guiding channel; the first sound cavity of the receiver is in communication with the sound guiding channel and the sound absorption cavity respectively.

4. The electronic device according to claim 3, wherein there is a sound transmission space between the sound absorption cavity and the first sound cavity of the receiver, and the second sealing member is located within the sound transmission space.

5. The electronic device according to claim 1 or 2, wherein the sound generating device includes a speaker, an outlet is provided at a partial position of the first sound cavity of the speaker, the outlet being in communication with the sound absorption cavity.

6. The electronic device according to claim 5, wherein the electronic device further includes a mounting structure, the speaker being mounted within the housing assembly through the mounting structure; and / or the second sealing member seals a communication portion between the outlet and the sound absorption cavity.

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