Automatic cleaning apparatus, semiconductor process equipment and cleaning method

Abstract

The application discloses an automatic cleaning device, a semiconductor process equipment and a cleaning method. The automatic cleaning device is used for cleaning a positioning pin of a rotary chuck in the semiconductor process equipment, and comprises a brush head, a brush body arranged in the brush head, a hollow chamber for accommodating the positioning pin is formed in the brush body, and the positioning pin is in contact with a wall of the hollow chamber when the positioning pin is accommodated in the hollow chamber; a driving mechanism connected with the brush head, used for driving the brush head to rotate, driving the brush body to relatively rotate with respect to the positioning pin, and driving the brush head to move up and down, so that the positioning pin is in butt joint or separation with the hollow chamber; and a first fluid channel in communication with the hollow chamber, used for spraying cleaning solvent to the positioning pin accommodated in the hollow chamber. The application solves the technical problem that the effect is poor in the prior art, in which a nozzle is used to spray deionized water to the surface of the positioning pin to clean the contaminants on the surface of the positioning pin.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor processing equipment, and in particular to an automatic cleaning device, semiconductor process equipment, and cleaning method. Background Technology

[0002] When cleaning wafers, single-wafer cleaning equipment, such as Figure 1 As shown, its rotating chuck uses positioning pins to physically grip the wafer and rotates it at speeds of over 2000 rpm. Long-term high-speed rotation will cause relative movement between the chuck and the wafer, resulting in wear of the chuck's positioning pins. The worn positioning pins will contaminate the wafer surface, thus causing wafer quality problems.

[0003] In traditional technologies, such as Figure 2 As shown, deionized water is usually sprayed onto the surface of the locating pin using a deionized water nozzle in an attempt to clean the contaminants on the surface of the locating pin. However, this cleaning method is not very effective. Summary of the Invention

[0004] This application provides an automatic cleaning device, semiconductor process equipment, and cleaning method, which solves the technical problem that the existing method of using nozzles to spray deionized water onto the surface of the positioning pin to clean contaminants is not very effective.

[0005] Firstly, this application provides the following technical solution through an embodiment of the application:

[0006] An automatic cleaning device is provided for cleaning the positioning pins of a rotating chuck in semiconductor process equipment. The automatic cleaning device includes: a brush head, wherein a brush body is disposed within the brush head, and a hollow cavity is formed on the brush body to accommodate the positioning pin. When the positioning pin is accommodated in the hollow cavity, the positioning pin contacts the wall of the hollow cavity; a driving mechanism is connected to the brush head for driving the brush head to rotate, thereby causing the brush body to rotate relative to the positioning pin, and also for driving the brush head to move up and down, so that the positioning pin engages or disengages from the hollow cavity; and a first fluid channel communicating with the hollow cavity for spraying cleaning solvent onto the positioning pin accommodated in the hollow cavity.

[0007] In one embodiment, the automatic cleaning device further includes: a second fluid channel; the second fluid channel, communicating with the hollow cavity, is used to spray cleaning gas onto the positioning pin housed within the hollow cavity, the cleaning gas being used to dry the positioning pin.

[0008] In one embodiment, the driving mechanism includes: a first driving mechanism for driving the brush head to move upward or downward; and a second driving structure including: a power unit and a rotating shaft, wherein one end of the rotating shaft is connected to the output shaft of the power unit via a synchronous conveyor belt, and the other end of the rotating shaft is connected to the brush head for driving the brush head to rotate.

[0009] In one embodiment, the rotating shaft includes a hollow channel; one end of the hollow channel is connected to one end of the hollow chamber, and the other end of the hollow channel is connected to a cleaning solvent branch pipe and a cleaning gas branch pipe respectively through a fluid main pipe, wherein the cleaning solvent branch pipe, the fluid main pipe, and the hollow channel are connected in sequence to form the first fluid channel; the cleaning gas branch pipe, the fluid main pipe, and the hollow channel are connected in sequence to form the second fluid channel.

[0010] In one embodiment, the wall surface of the hollow chamber is non-flat.

[0011] Secondly, through one embodiment of this application, the following technical solution is provided:

[0012] A semiconductor process apparatus includes the automatic cleaning device described in any of the above embodiments. The semiconductor process apparatus further includes: a rotary chuck, on which a plurality of positioning pins are evenly distributed in a circumferential direction. The positioning pins are used to hold the wafer. The rotary chuck can drive the positioning pins to rotate and cause each positioning pin to move sequentially to the cleaning position.

[0013] In one embodiment, the semiconductor process equipment further includes a positioning device for moving the brush head to or away from the cleaning position.

[0014] Thirdly, through one embodiment of this application, the following technical solution is provided:

[0015] A cleaning method is applied to the semiconductor process equipment described in any of the above embodiments. The cleaning method includes: moving a first positioning pin to the cleaning position via a rotary chuck, wherein the first positioning pin is any one of a plurality of positioning pins; moving a brush head downward via a driving mechanism to accommodate the positioning pin in the hollow cavity; rotating the brush head at a preset speed via the driving mechanism and spraying the cleaning solvent onto the positioning pin at a preset flow rate through a first fluid channel to clean the positioning pin for a first preset time until cleaning is completed; moving the next positioning pin to the cleaning position via the rotary chuck, and repeating the cleaning steps until cleaning of the plurality of positioning pins is completed.

[0016] In one embodiment, the automatic cleaning device further includes: a second fluid channel, which communicates with the hollow chamber and is used to spray cleaning gas onto the positioning pin housed in the hollow chamber, the cleaning gas being used to dry the positioning pin; before the next positioning pin is moved to the cleaning position by the rotating chuck, the device further includes: after the brush head is moved upward above the positioning pin by the driving mechanism, the cleaning gas is sprayed onto the positioning pin through the second fluid channel to dry the positioning pin for a second preset time until drying is complete; the next positioning pin is moved to the cleaning position by the rotating chuck, and the cleaning and drying steps are repeated until the cleaning and drying of the plurality of positioning pins are completed.

[0017] In one embodiment, the preset speed is 500-1000 rpm, the preset flow rate is 0.5 lpm, the first preset time is 5-10 seconds, and the second preset time is 5-10 seconds.

[0018] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0019] In the automatic cleaning device provided in this application, the brush head can be moved up and down by the drive mechanism to mate or separate the positioning pin from the hollow cavity. After mate, the brush head can be rotated by the drive mechanism, thereby causing the brush body to rotate relative to the positioning pin. This allows the positioning pin, which is housed in the hollow cavity and in contact with the wall of the hollow cavity, to generate friction with the hollow cavity. Combined with the spraying of cleaning solvent onto the positioning pin through the first fluid channel, the contaminants on the positioning pin can be washed away. Compared with the prior art, which simply uses deionized water spraying for cleaning, the cleaning method of this application is obviously more effective. Therefore, this application solves the technical problem of the poor effectiveness of the prior art method of using a nozzle to spray deionized water onto the surface of the positioning pin to clean the contaminants on the surface of the positioning pin. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram illustrating contamination of the locating pins of a rotary chuck in the prior art;

[0022] Figure 2 This is a schematic diagram of a structure utilizing a cleaning positioning pin in the prior art;

[0023] Figure 3 This is a schematic diagram of the automatic cleaning device provided in Embodiment 1 of this application;

[0024] Figure 4 This is a cross-sectional view of the brush body provided in Embodiment 1 of this application;

[0025] Figure 5 This is a schematic diagram of the structure of the semiconductor process equipment provided in Embodiment 2 of this application;

[0026] Figure 6 A flowchart of the cleaning method provided in Embodiment 3 of this application;

[0027] Figures 6a-6e This is a flowchart illustrating the working process of the cleaning method provided in Embodiment 3 of this application. Detailed Implementation

[0028] This application provides an automatic cleaning device, semiconductor process equipment, and cleaning method, which solves the technical problem that the existing method of using nozzles to spray deionized water onto the surface of the positioning pin to clean contaminants is not very effective.

[0029] The technical solution of this application embodiment is to solve the above-mentioned technical problems, and the general idea is as follows:

[0030] In the automatic cleaning device provided in this application, the brush head can be moved up and down by the drive mechanism to make the positioning pin dock or disconnect from the hollow cavity. When docked, the brush head can be rotated by the drive mechanism, thereby causing the brush body to rotate relative to the positioning pin. This allows the positioning pin, which is housed in the hollow cavity and in contact with the wall of the hollow cavity, to form friction with the hollow cavity. Combined with the spraying of cleaning solvent onto the positioning pin through the first fluid channel, the contaminants on the positioning pin can be washed away. Compared with the prior art, which simply uses deionized water to spray and clean, the cleaning method of this application is obviously more effective. Therefore, this application solves the technical problem of the poor effectiveness of the prior art method of using a nozzle to spray deionized water onto the surface of the positioning pin to clean the contaminants on the surface of the positioning pin.

[0031] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0032] Example 1

[0033] like Figure 3 , 5 As shown, this embodiment provides an automatic cleaning device 1, which is installed in a vacuum reaction chamber and is used to clean the positioning pins 22 of the rotating chuck 21 in semiconductor process equipment.

[0034] The automatic cleaning device 1 includes: a brush head 11, wherein,

[0035] The brush head 11 includes a brush head housing 111, and a brush body 112 is disposed inside the brush head housing 111. The brush body 112 has a hollow cavity 113 for accommodating the positioning pin 22. The opening of the hollow cavity 113 faces downward. When the positioning pin 22 is accommodated in the hollow cavity 113, the positioning pin 22 contacts the wall of the hollow cavity 113.

[0036] In practice, the brush body 112 is made of a corrosion-resistant soft material. As an example, the brush body 112 is made of PVA material. Of course, it can also be made of other corrosion-resistant soft materials, and there are no restrictions here.

[0037] Meanwhile, to ensure the cleaning ability of the brush body 112 on the positioning pin 22 and to increase the friction between the positioning pin 22 and the wall of the hollow chamber 113 during relative rotation, the surface of the wall of the hollow chamber 113 is a non-flat surface, such as... Figure 4 The uneven surface shown can also be a non-flat surface with small protruding particles, or a "W"-shaped uneven surface in practical applications; there are no restrictions here.

[0038] In addition, to ensure that the positioning pin 22 can easily enter the hollow cavity 113, the width of the end of the hollow cavity 113 near the positioning pin 22 can be greater than the width of the end away from the positioning pin 22. It should be noted that the end of the hollow cavity 113 near the positioning pin 22 refers to the end of the hollow cavity 113 near the positioning pin 22 before the positioning pin 22 enters the hollow cavity 113, while the end away from the positioning pin 22 is the other end of the hollow cavity 113 in this state.

[0039] The automatic cleaning device 1 further includes: a drive mechanism, wherein,

[0040] The drive mechanism is connected to the brush head 11 and is used to drive the brush head 11 to rotate so that the brush body 112 rotates relative to the positioning pin 22. It is also used to drive the brush head 11 to move up and down so that the positioning pin 22 can be docked or separated from the hollow cavity 113.

[0041] As an optional embodiment, the drive mechanism specifically includes:

[0042] The first drive mechanism (not shown in the figure) is used to drive the brush head 11 to move up or down.

[0043] The second drive structure includes a power unit 121 and a rotating shaft 122. One end of the rotating shaft 122 is connected to the output shaft of the power unit 121 via a synchronous conveyor belt 123, and the other end of the rotating shaft 122 is connected to the brush head 11 to drive the brush head to rotate.

[0044] In specific implementation, the first drive mechanism can be a mechanism consisting of a motor and a ball screw pair. The lead screw of the ball screw pair is connected to the automatic cleaning device 1. The motor is used to drive the nut of the ball screw pair to rotate, thereby driving the lead screw of the ball screw pair to move up or down in the vertical direction, thereby driving the brush head 11 on the automatic cleaning device 1 to move up or down. The first drive mechanism can also be an electric telescopic rod. One end of the electric telescopic rod is connected to the automatic cleaning device 1. While the electric telescopic rod is extending and retracting, it drives the brush head 11 to move up or down.

[0045] A first gear is fitted on the output shaft of the power unit 121, and a second gear is fitted on one end of the rotating shaft 122. The first gear is connected to the second gear through a synchronous toothed belt. The other end of the rotating shaft 122 is connected to the brush head housing 111 through the brush head fixing block 13. The rotating shaft 122 is connected to the support object 15 through the bearing 14. Optionally, the brush head fixing block 13 and the brush head housing 111 are connected in a detachable manner, such as a threaded connection, to facilitate the periodic replacement of the brush head housing 111.

[0046] Of course, the scope of protection covered by this embodiment should cover equivalent substitutions made by those skilled in the art based on their ordinary technical knowledge for the drive mechanism used to drive the brush head 11 to rotate and move up and down, and no limitation is imposed here.

[0047] The automatic cleaning device 1 further includes: a first fluid channel, wherein,

[0048] The first fluid channel is connected to the hollow chamber 113, and a cleaning solvent is sprayed onto the positioning pin 22 contained in the hollow chamber 113. Optionally, the cleaning solvent can be deionized water, hydrogen peroxide, or citric acid.

[0049] Further optionally, the automatic cleaning device 1 further includes: a second fluid channel, wherein,

[0050] The second fluid channel is connected to the hollow chamber 113 and is used to spray cleaning gas onto the positioning pin 22 contained in the hollow chamber 113. The cleaning gas is used to dry the positioning pin 22. Optionally, the cleaning gas is nitrogen, inert gas or other cleaning gas.

[0051] In specific implementation, the first fluid channel and the second fluid channel can be connected to the hollow cavity 113 on the wall of the hollow cavity 113 or on the end face of the hollow cavity 113, and a nozzle 16 is provided at the connection point. It should be noted that the connection points between the first fluid channel and the hollow cavity 113 and the connection points between the second fluid channel and the hollow cavity 113 can be different or the same.

[0052] It should be noted that since the second fluid channel and the first fluid channel have a sequential relationship in use—one is for rinsing and the other is for drying—in practical applications, they can be the same fluid channel. When a cleaning solvent is needed for rinsing, this fluid channel is selected to connect to the cleaning solvent source; when a cleaning solvent is needed for rinsing, this fluid channel is selected to connect to the cleaning gas source.

[0053] Based on the above-described embodiments of the drive mechanism, this embodiment further provides an optional embodiment, as follows:

[0054] The rotating shaft 122 includes a hollow channel (not shown in the figure);

[0055] One end of the hollow channel is connected to one end of the hollow chamber 113, and the other end of the hollow channel is connected to a clean solvent branch pipe and a clean gas branch pipe respectively through a fluid main pipe.

[0056] The cleaning solvent branch pipe 171, the fluid main pipe 172, and the hollow channel are connected in sequence to form the first fluid channel;

[0057] The clean gas branch pipe 173, the fluid main pipe 172, and the hollow channel are connected in sequence to form a second fluid channel.

[0058] In actual implementation, the hollow channel can communicate with the hollow chamber 113 via the wall of the hollow chamber 113, and a nozzle 16 is formed at the communication point. Preferably, the nozzle 16 is formed at the communication point between the hollow channel and the hollow chamber 113 on the upper end face of the hollow chamber 113 (located at the end of the hollow chamber 113 closest to the hollow channel). This preferred method reduces the design difficulty of the fluid channel and improves the reliability of the entire brush head.

[0059] In this embodiment, the hollow channel of the rotating shaft 122 is used as part of the first and second fluid channels to spray cleaning solvent and cleaning gas onto the positioning pin 22, which is beneficial to the compactness of the cleaning device. In addition, in this embodiment, the first and second fluid channels share the same fluid main pipe 172 and hollow channel, and are only distinguished in the part where the cleaning solvent and cleaning gas are connected. On the one hand, this saves the material cost of the pipes to the greatest extent and is beneficial to the compactness of the entire cleaning device. On the other hand, compared with embodiments that use the same pipe to connect the cleaning solvent and cleaning gas, there is no need to switch back and forth on the hardware pipes between the cleaning solvent and cleaning gas.

[0060] Furthermore, in actual implementation, the automatic cleaning device 1 also includes an adjustment unit for adjusting the flow rates of the cleaning solvent and the cleaning gas.

[0061] The technical solutions described in the embodiments of this application have at least the following technical effects or advantages:

[0062] In the automatic cleaning device provided in this application, the brush head can be moved up and down by the drive mechanism to mate or separate the positioning pin from the hollow cavity. After mate, the brush head can be rotated by the drive mechanism, thereby causing the brush body to rotate relative to the positioning pin. This allows the positioning pin, which is housed in the hollow cavity and in contact with the wall of the hollow cavity, to generate friction with the hollow cavity. Combined with the spraying of cleaning solvent onto the positioning pin through the first fluid channel, the contaminants on the positioning pin can be washed away. Compared with the prior art, which simply uses deionized water spraying for cleaning, the cleaning method of this application is obviously more effective. Therefore, this application solves the technical problem of the poor effectiveness of the prior art method of using a nozzle to spray deionized water onto the surface of the positioning pin to clean the contaminants on the surface of the positioning pin.

[0063] Example 2

[0064] like Figure 3 , 5 As shown, this embodiment provides a semiconductor process apparatus, which is set inside a vacuum reaction chamber and includes the automatic cleaning device 1 of any of the embodiments in Example 1.

[0065] The semiconductor process equipment further includes a rotary chuck 21.

[0066] The rotating chuck 21 has multiple positioning pins 22 evenly distributed around its upper edge. The positioning pins 22 are used to hold the wafer. The rotating chuck 21 can drive the positioning pins 22 to rotate and move each positioning pin 22 to the cleaning position in sequence.

[0067] It should be noted that the cleaning position includes a first cleaning position and a second cleaning position. In this embodiment, the cleaning position to which each positioning pin 22 is moved by the rotating chuck 21 is specifically the first cleaning position. The first cleaning position can be selected at any position of the positioning pin 22 of the rotating chuck 21 during the rotation process. When cleaning is required, the brush head of the automatic cleaning device 1 is in the second cleaning position. The first cleaning position and the second cleaning position are aligned in the vertical direction, and the second cleaning position is located above the first cleaning position.

[0068] In the specific implementation process, the rotary chuck 21 is rotatably fixed to the base by bearings, and can be driven to rotate by a power mechanism (not shown in the figure) to move each positioning pin 22 on the rotary chuck 21 to the cleaning position in sequence. This embodiment utilizes the rotation function of the rotary chuck 21 in the semiconductor process equipment to rotate the positioning pin 22 to the bottom of the hollow cavity 113.

[0069] As an optional embodiment, the semiconductor process equipment further includes: a positioning device;

[0070] The positioning device is used to move the brush head 11 to or from the cleaning position. Specifically, the positioning device moves the brush head 11 to or from the second cleaning position.

[0071] It should be noted that, in order to avoid the automatic cleaning device 1 from affecting the daily operation of the rotary chuck 21 in the semiconductor process equipment, the automatic cleaning device 1 can be in a position other than the second cleaning position when it is not in use. When it is necessary to use the automatic cleaning device 1 to clean the positioning pin 22 on the rotary chuck 21, the positioning device is used to drive the brush head 11 to move to the second cleaning position.

[0072] The positioning device can be set on the vacuum reaction chamber and connected to the automatic cleaning device 1 to drive the entire automatic cleaning device 1 to move, thereby moving the brush head 11 to the second cleaning position. Alternatively, it can be set on the automatic cleaning device 1 to drive the automatic cleaning device 1 to rotate around a certain fulcrum, thereby moving the brush head 11 to the second cleaning position. It can also be used to drive the brush head 11 to rotate around a certain fulcrum, thereby moving the brush head 11 to the second cleaning position.

[0073] The technical solutions described in the embodiments of this application have at least the following technical effects or advantages:

[0074] In the semiconductor process equipment provided in this application, a drive mechanism can move the brush head up and down to align or separate the positioning pin from the hollow cavity. Once aligned, the drive mechanism can rotate the brush head, causing the brush body to rotate relative to the positioning pin. This allows the positioning pin, which is housed within the hollow cavity and in contact with its wall, to generate friction with the cavity. Combined with the spraying of cleaning solvent onto the positioning pin through the first fluid channel, contaminants on the positioning pin can be thoroughly cleaned. Compared to the prior art, which simply uses deionized water for cleaning, the cleaning method of this application is significantly more effective. Therefore, this application solves the technical problem of the prior art, which uses a nozzle to spray deionized water onto the surface of the positioning pin to remove contaminants, resulting in poor cleaning performance.

[0075] Example 3

[0076] like Figure 6 As shown, corresponding to the semiconductor process equipment provided in Embodiment 2, this embodiment provides a cleaning method, which is applied in the semiconductor process equipment.

[0077] The cleaning method includes:

[0078] Step S101: The first positioning pin 22 is moved to the cleaning position by rotating the chuck 21. The first positioning pin 22 can be any one of a plurality of positioning pins 22, such as... Figure 6a As shown.

[0079] During the implementation process, before step S101, it is necessary to stop the daily operation mode of the rotating chuck in the vacuum reaction chamber.

[0080] Step S102: The brush head 11 is moved downward by a fixed drive so that the positioning pin 22 is accommodated in the hollow cavity 113, as shown. Figure 6b As shown.

[0081] Step S103: The drive mechanism rotates the brush head 11 at a preset speed, and sprays cleaning solvent A onto the positioning pin 22 through the first fluid channel at a preset flow rate to clean the positioning pin 22. The cleaning time is a first preset time, until cleaning is complete. Figure 6c As shown.

[0082] Optionally, the preset speed is 100-1000 rpm, preferably 500-1000 rpm, for example: 500 rpm, 625 rpm, 700 rpm, 789 rpm, 1000 rpm, the preset flow rate is 0.5 lpm, and the first preset time is 5-10 seconds, for example: 5 seconds, 5.9 seconds, 7.8 seconds, 8.6 seconds, 9.9 seconds.

[0083] Step S104: Move the next positioning pin 22 to the cleaning position by rotating the chuck 21, and repeat the cleaning steps until all positioning pins 22 are cleaned.

[0084] As an optional embodiment, when the automatic cleaning device further includes a second fluid channel, the cleaning method further includes, prior to step S104:

[0085] After cleaning, the drive mechanism moves the brush head 11 upwards above the positioning pin 22. Cleaning gas B is then sprayed onto the positioning pin 22 through the second fluid channel to dry it. The drying time is a second preset time, continuing until drying is complete. Figure 6d As shown.

[0086] Optionally, the second preset time is 5 to 10 seconds, for example: 5.3 seconds, 5.8 seconds, 6.8 seconds, 8.4 seconds, or 9.6 seconds.

[0087] After drying, the next positioning pin 22 is moved to the cleaning position by rotating the chuck 21, and the cleaning and drying steps are repeated until all positioning pins 22 are cleaned and dried.

[0088] During implementation, to facilitate the rotation of the chuck 21 to move the next positioning pin 22 to the cleaning position, before the chuck 21 moves the next positioning pin 22 to the cleaning position, the process also includes: driving the brush head 11 to continue moving upward via a drive mechanism, such as... Figure 6e As shown.

[0089] The technical solutions described in the embodiments of this application have at least the following technical effects or advantages:

[0090] In the cleaning method provided in this application, the brush head can be moved up and down by a drive mechanism to align or separate the positioning pin from the hollow cavity. After alignment, the brush head can be rotated by the drive mechanism, thereby causing the brush body to rotate relative to the positioning pin. This allows the positioning pin, which is housed in the hollow cavity and in contact with the wall of the hollow cavity, to generate friction with the hollow cavity. Combined with the spraying of cleaning solvent onto the positioning pin through the first fluid channel, the contaminants on the positioning pin can be washed away. Compared with the prior art, which simply uses deionized water spraying for cleaning, the cleaning method of this application is obviously more effective. Therefore, this application solves the technical problem of the poor effectiveness of the prior art method of using a nozzle to spray deionized water onto the surface of the positioning pin to clean the contaminants on the surface of the positioning pin.

[0091] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0092] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0093] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0094] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0095] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0096] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A semiconductor process apparatus, characterized by, The automatic cleaning device, the rotary chuck and the positioning device, wherein the automatic cleaning device is used for cleaning the positioning pin of the rotary chuck; The automatic cleaning device comprises a brush head, a driving mechanism, a first fluid channel and a second fluid channel, the brush head is provided with a brush body, a hollow chamber accommodating the positioning pin is formed on the brush body, when the positioning pin is accommodated in the hollow chamber, the positioning pin is in contact with the wall of the hollow chamber, the wall of the hollow chamber is a W-shaped concave-convex plane, the width of one end of the hollow chamber close to the positioning pin is greater than the width of the other end away from the positioning pin; the driving mechanism is connected with the brush head and is used for driving the brush head to rotate, driving the brush body to rotate relative to the positioning pin, and driving the brush head to move up and down to make the positioning pin butt joint with the hollow chamber or separate from the hollow chamber; the first fluid channel is communicated with the hollow chamber and is used for spraying cleaning solvent to the positioning pin accommodated in the hollow chamber; the second fluid channel is communicated with the hollow chamber and is used for spraying cleaning gas to the positioning pin accommodated in the hollow chamber, and the cleaning gas is used for air drying the positioning pin; A plurality of positioning pins are uniformly distributed on the rotary chuck along the circumferential direction, the positioning pins are used for clamping wafers, the rotary chuck can drive the positioning pins to rotate and make each positioning pin move to a cleaning position in turn; The positioning device is used for driving the brush head to move to the cleaning position or move away from the cleaning position.

2. The semiconductor process apparatus according to claim 1, wherein The driving mechanism comprises: A first driving mechanism is used for driving the brush head to move upward or downward; A second driving mechanism comprises a power device and a rotating shaft, wherein One end of the rotating shaft is in transmission connection with the output shaft of the power device through a synchronous transmission belt, and the other end of the rotating shaft is connected with the brush head and is used for driving the brush head to rotate.

3. The semiconductor process apparatus according to claim 2, wherein The rotating shaft comprises a hollow channel; One end of the hollow channel is communicated with one end of the hollow chamber, and the other end of the hollow channel is communicated with a cleaning solvent branch pipe and a cleaning gas branch pipe through a fluid main pipe, wherein The cleaning solvent branch pipe, the fluid main pipe and the hollow channel are sequentially communicated to form the first fluid channel; The cleaning gas branch pipe, the fluid main pipe and the hollow channel are sequentially communicated to form the second fluid channel.

4. A cleaning method characterized by, The cleaning method is applied to the semiconductor process equipment in any one of claims 1 to 3, and the cleaning method comprises: The first positioning pin is moved to the cleaning position by the rotary chuck, and the first positioning pin is any one of the plurality of positioning pins; The brush head is moved downward by the driving mechanism to make the positioning pin accommodated in the hollow chamber; The brush head is driven to rotate at a preset speed by the driving mechanism, and the cleaning solvent is sprayed to the positioning pin at a preset flow rate by the first fluid channel to clean the positioning pin, and the cleaning time is a first preset time until the cleaning is completed. The rotation chuck drives the next positioning pin to move to the cleaning position, and the cleaning step is repeatedly executed until the cleaning of the multiple positioning pins is completed.

5. The cleaning method according to claim 4, wherein Before the rotation chuck drives the next positioning pin to move to the cleaning position, the method further comprises: After the driving mechanism drives the brush head to move upward above the positioning pin, the second fluid channel sprays the cleaning gas to the positioning pin to dry the positioning pin, and the drying time is a second preset time until the drying is completed. The rotation chuck drives the next positioning pin to move to the cleaning position, and the cleaning and drying steps are repeatedly executed until the cleaning and drying of the multiple positioning pins are completed.

6. The cleaning method according to claim 5, wherein The preset speed is 500-1000 rpm, the preset flow rate is 0.5 lpm, the first preset time is 5-10 seconds, and the second preset time is 5-10 seconds.

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