Terminal equipment, display device, display panel and manufacturing method thereof

Abstract

The present disclosure provides a terminal device, a display apparatus, a display panel and a manufacturing method thereof, which relate to the field of display technology. The display panel includes a substrate, a driving layer, a light-emitting layer, an encapsulation layer and a transparent filling layer. The driving layer is arranged on one side of the substrate, and includes a driving area and a peripheral area outside the driving area, and the driving area includes a first sub-area and a second sub-area; the driving layer has a plurality of pixel circuits, and the density of the pixel circuits in the first sub-area is less than the density of the pixel circuits in the second sub-area; the first sub-area is at least partially recessed toward the substrate to form a first pit; the light-emitting layer is arranged on the side of the driving layer away from the substrate, and includes a plurality of light-emitting devices, and the light-emitting devices include a plurality of first light-emitting devices corresponding to the first sub-area and a plurality of second light-emitting devices corresponding to the second sub-area; the encapsulation layer covers the light-emitting layer and is recessed in the area corresponding to the first pit to form a second pit; the transparent filling layer is arranged on the surface of the encapsulation layer away from the substrate, and at least partially fills the second pit.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a terminal device, a display apparatus, a display panel, and a method for manufacturing the display panel. Background Art

[0002] For mobile phones, tablets and other terminal devices with front cameras, the area of ​​the screen corresponding to the front camera usually needs to be opened for shooting, and the area with the hole cannot emit light, which is not conducive to increasing the screen-to-body ratio. At present, although there is under-screen camera technology, which allows the area where the front camera is located to display images, avoids opening holes, and can shoot normally, the images taken by the front camera are prone to glare and blur, and the image quality still needs to be improved.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0004] The purpose of the present disclosure is to overcome the deficiencies of the above-mentioned prior art and to provide a terminal device, a display apparatus, a display panel and a method for manufacturing a display panel, which can improve the imaging quality of under-screen camera.

[0005] According to one aspect of the present disclosure, there is provided a display panel, comprising:

[0006] substrate;

[0007] A driving layer is provided on one side of the substrate and includes a driving area and a peripheral area outside the driving area, wherein the driving area includes a first sub-area and a second sub-area; the driving layer has a plurality of pixel circuits, and the density of the pixel circuits in the first sub-area is less than the density of the pixel circuits in the second sub-area; the first sub-area is at least partially recessed toward the substrate to form a first pit;

[0008] a light-emitting layer, disposed on a side of the driving layer away from the substrate, and comprising a plurality of light-emitting devices connected to the pixel circuit, wherein the light-emitting devices include a plurality of first light-emitting devices corresponding to the first sub-area and a plurality of second light-emitting devices corresponding to the second sub-area;

[0009] an encapsulation layer, covering the light-emitting layer and being recessed in a region corresponding to the first pit to form a second pit;

[0010] The transparent filling layer is disposed on a surface of the packaging layer facing away from the substrate, and at least a portion of the transparent filling layer is filled in the second pit.

[0011] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0012] A transfer layer is provided on a surface of the driving layer away from the substrate and is recessed in a region corresponding to the first pit, and the transfer layer has a lead extending from the first sub-region to the second sub-region; the light-emitting layer is provided on a surface of the transfer layer away from the substrate;

[0013] The pixel circuit includes multiple first pixel circuits and multiple second pixel circuits, the second pixel circuits and at least part of the first pixel circuits are located in the second sub-area; at least part of the first light-emitting devices are connected to the first pixel circuits through the leads; and the second light-emitting devices are connected to the second pixel circuits.

[0014] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0015] A blocking dam is arranged in the same layer as the light-emitting layer and is spaced apart from the light-emitting layer, is located in the peripheral area, and is arranged around the light-emitting layer;

[0016] The encapsulation layer comprises:

[0017] a first inorganic layer covering the light emitting layer and the barrier dam and being recessed at a position corresponding to the first pit;

[0018] an organic layer, disposed on a surface of the first inorganic layer facing away from the substrate, located within a range surrounded by the blocking dam, and recessed at a position of the first inorganic layer corresponding to the first pit;

[0019] The second inorganic layer covers the organic layer and the area of ​​the first inorganic layer not covered by the organic layer, and is recessed at a position of the organic layer corresponding to the first pit to form a second pit.

[0020] In an exemplary embodiment of the present disclosure, the encapsulation layer includes a flat portion and an edge portion surrounding the flat portion, the thickness of different regions of the flat portion is substantially the same, and the thickness of the edge portion gradually decreases toward the blocking dam;

[0021] The orthographic projection of the edge portion on the driving layer at least partially overlaps with the first pit, and the second pit is at least partially located at the edge portion.

[0022] In an exemplary embodiment of the present disclosure, the transparent filling layer covers the edge portion and a region of the encapsulation layer corresponding to the blocking dam, and a surface of the transparent filling layer facing away from the substrate is flush with a surface of the flat portion facing away from the substrate.

[0023] In an exemplary embodiment of the present disclosure, the transparent filling layer covers the edge portion and the area of ​​the encapsulation layer corresponding to the blocking dam, and the surface of the transparent filling layer facing away from the substrate is located on the side of the surface of the flat portion facing away from the substrate.

[0024] In an exemplary embodiment of the present disclosure, the transparent filling layer extends to a surface of the flat portion facing away from the substrate, and covers a partial area of ​​the flat portion.

[0025] In an exemplary embodiment of the present disclosure, a boundary of the first pit surrounds an outside of an orthographic projection of the second pit on the driving layer.

[0026] In an exemplary embodiment of the present disclosure, the light transmittance of the transparent filling layer is greater than 99%.

[0027] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0028] The touch layer covers the encapsulation layer and the transparent filling layer.

[0029] According to one aspect of the present disclosure, there is provided a method for manufacturing a display panel, comprising:

[0030] A driving layer including a driving area and a peripheral area outside the driving area is formed on a substrate, wherein the driving area includes a first sub-area and a second sub-area; the driving layer has a plurality of pixel circuits, and the density of the pixel circuits in the first sub-area is less than the density of the pixel circuits in the second sub-area; the first sub-area is at least partially recessed toward the substrate to form a first pit;

[0031] forming a light-emitting layer including a plurality of light-emitting devices on a side of the driving layer away from the substrate, the light-emitting devices including a plurality of first light-emitting devices corresponding to the first sub-area and a plurality of second light-emitting devices corresponding to the second sub-area;

[0032] forming an encapsulation layer covering the light-emitting layer, wherein the encapsulation layer is recessed in a region corresponding to the first pit to form a second pit;

[0033] A transparent filling layer is formed on a surface of the packaging layer facing away from the substrate, and at least a portion of the transparent filling layer is filled in the second pit.

[0034] In an exemplary embodiment of the present disclosure, the pixel circuit includes a plurality of first pixel circuits and a plurality of second pixel circuits, and the second pixel circuits and at least part of the first pixel circuits are located in the second sub-area;

[0035] Before forming the light-emitting layer and after forming the driving layer, the manufacturing method further includes:

[0036] A transfer layer is formed on a surface of the driving layer facing away from the substrate, the transfer layer is recessed in a region corresponding to the first pit, and the transfer layer has a lead extending from the first sub-region to the second sub-region;

[0037] The light-emitting layer is arranged on the surface of the transfer layer away from the substrate, at least part of the first light-emitting devices are connected to the first pixel circuit through the lead wires; and the second light-emitting devices are connected to the second pixel circuit.

[0038] In an exemplary embodiment of the present disclosure, the manufacturing method further includes:

[0039] A touch control layer covering the encapsulation layer and the transparent filling layer is formed.

[0040] According to one aspect of the present disclosure, a display device is provided, comprising any one of the display panels described above.

[0041] According to one aspect of the present disclosure, a terminal device is provided, including:

[0042] The display device according to any one of the above;

[0043] The camera device is disposed on a side of the substrate away from the driving layer and is directly opposite to the first sub-area, and is used for capturing images through the first sub-area.

[0044] The terminal device, display device, display panel and manufacturing method thereof provided by the present disclosure can make the density of the pixel circuit of the first sub-area lower than the pixel density of the second sub-area, improve the light transmittance of the first sub-area, reduce the shielding of the camera device by the first sub-area, ensure that the light-emitting device of the first sub-area can display images normally, and the camera device can shoot images through the first sub-area. The transparent filling layer can fill the second pit to avoid the interference of the second pit as a concave lens on the light path, thereby improving the imaging quality of the camera device.

[0045] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0047] Figure 1It is a schematic diagram of an embodiment of a display panel disclosed in the present invention.

[0048] Figure 2 This is a schematic diagram before a transparent filling layer is formed in an embodiment of a display panel disclosed herein.

[0049] Figure 3 Schematic diagram of a substrate and a driving layer in an embodiment of a display panel disclosed herein.

[0050] Figure 4 FIG. 1 is a top view of a driving layer in an embodiment of a display panel disclosed herein.

[0051] Figure 5 FIG. 4 is a schematic diagram of another embodiment of the display panel disclosed in the present invention.

[0052] Figure 6 FIG. 4 is a schematic diagram of another embodiment of the display panel disclosed in the present invention.

[0053] Figure 7 FIG. 4 is a schematic diagram of another embodiment of the display panel disclosed in the present invention.

[0054] Figure 8 It is a schematic diagram of an implementation of a terminal device disclosed herein. DETAILED DESCRIPTION

[0055] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0056] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used merely as labels and are not intended to limit the quantity of their objects.

[0057] Herein, the "correspondence" between feature A and region B means that in the direction perpendicular to the substrate, feature A corresponds to region B, that is, the orthographic projection of feature A on the driving layer is at least partially located in region B. Feature A may be a light-emitting device, an encapsulation layer, a second pit, etc., and region B may be a driving region, a first sub-region, a second sub-region, etc.

[0058] In the related art, a terminal device with an under-screen camera function may include a display panel and a camera device, wherein:

[0059] The display panel includes a driving backplane, a light-emitting device and an encapsulation layer, wherein: the driving backplane can be divided into at least a driving area and a peripheral area, and the driving area can have a first sub-area and a second sub-area; at the same time, the driving backplane can include a driving circuit, and the driving circuit includes a peripheral circuit located in the peripheral area and a pixel circuit located in the driving area, and the number of pixel circuits is multiple, and all are connected to the peripheral circuit. The number of light-emitting devices is multiple and the array is distributed on one side of the driving backplane, and the first sub-area and the second sub-area are both provided with pixel circuits, and the areas corresponding to the first sub-area and the second sub-area are both provided with light-emitting devices. At the same time, each light-emitting device is connected to each pixel circuit, for example, a light-emitting device is connected to one pixel circuit, so that each light-emitting device can be driven to emit light independently. Thus, the light-emitting device can be driven to emit light through the peripheral circuit and each pixel circuit, so as to display an image. The encapsulation layer covers the light-emitting device to block external corrosion and protect the light-emitting device. The encapsulation layer may include an organic layer for achieving flatness and flexibility.

[0060] The camera device may be arranged on a side of the driving back plate away from the light emitting device and corresponding to the first sub-area, and is used to capture images through the first sub-area.

[0061] In order to improve the transmittance of the first sub-area, the density of the pixel circuits in the first sub-area can be made smaller than the density of the pixel circuits in the second sub-area, thereby reducing the shielding of the pixel circuits in the first sub-area to light, which is beneficial for the camera device to capture images. To this end, the number of pixel circuits in the first sub-area and the number of corresponding light-emitting devices can be directly reduced, so that the resolution of the first sub-area is correspondingly reduced, and the transmittance is improved. Alternatively, at least a part of the pixel circuits in the first sub-area can be transferred to the second sub-area, so that the density of the pixel circuits in the first sub-area is reduced, but the total number of pixel circuits can not be reduced or reduced as little as possible, and connected to the light-emitting device corresponding to the first sub-area through a special lead, so as to reduce the shielding of the pixel circuits to the first sub-area, but the total number of pixel circuits is reduced as little as possible, or even not reduced, which is beneficial to improve the transmittance while ensuring the resolution.

[0062] However, the inventors found that the images captured by the above-mentioned camera device have problems such as glare that blur the picture, and the image resolution is low. After a large number of experiments and analyses, the inventors found that the cause of this problem is that after the density of the pixel circuit in the first sub-area is reduced, the supporting effect of the pixel circuit on the first sub-area is weakened, causing the driving backplane to collapse to a certain extent in the first sub-area, forming a pit. Correspondingly, the encapsulation layer inherits the morphology of the driving backplane and the light-emitting device, and thus is concave at the position corresponding to the pit, especially the organic layer of the encapsulation layer, which is prone to forming a depression. When the camera device captures an image, the depression of the encapsulation layer is equivalent to a concave lens, which directly affects the light path, thereby affecting the quality of the image captured by the camera device.

[0063] Based on the above analysis, the present disclosure provides a display panel such as Figure 1-Figure 4 As shown, the display panel may include a substrate SU, a driving layer PN, a switching layer LI, a light-emitting layer PL, an encapsulation layer FE and a transparent filling layer OC, wherein:

[0064] The driving layer PN is arranged on one side of the substrate SU, and includes a driving area AA and a peripheral area PEA outside the driving area AA, the driving area AA includes a first sub-area TRA and a second sub-area CIA; the second sub-area CIA has a plurality of pixel circuits, the density of the pixel circuits in the first sub-area TRA is less than the density of the pixel circuits in the second sub-area CIA, and the first sub-area TRA is at least partially recessed toward the substrate SU to form a first pit Pit1;

[0065] The light emitting layer PL is arranged on the side of the driving layer PN away from the substrate SU, and includes a plurality of light emitting devices LED connected to the pixel circuit, the light emitting devices LED include a plurality of first light emitting devices LED1 corresponding to the first sub-area TRA and a plurality of second light emitting devices LED2 corresponding to the second sub-area CIA;

[0066] The encapsulation layer FE covers the light emitting layer PL and is recessed in a region corresponding to the first pit Pit1 to form a second pit Pit2;

[0067] The transparent filling layer OC is disposed on the surface of the encapsulation layer FE facing away from the substrate SU, and at least a portion of the transparent filling layer OC is filled in the second pit Pit2.

[0068] The display panel of the embodiment of the present disclosure can reduce the density of the pixel circuit of the first sub-area TRA, and while reducing the shielding of the camera device by the first sub-area TRA, ensure that the light-emitting device LED of the first sub-area TRA can display images normally, and the camera device can shoot images through the first sub-area TRA. Among them, the transparent filling layer OC can fill the second pit Pit2 to prevent the second pit Pit2 from acting as a concave lens to interfere with the light path entering the camera device, thereby improving the imaging quality of the camera device.

[0069] The following is a detailed description of the disclosed display panel:

[0070] like Figure 1-Figure 4 As shown, the substrate SU can be a flat plate that supports the substrate, and its shape can be rectangular or other shapes. The material of the substrate SU can include transparent hard materials such as glass, or flexible materials such as polyimide (PI). The substrate SU can be a single-layer or multi-layer structure, which is not specifically limited here.

[0071] like Figure 3 and Figure 4 As shown, the driving layer PN can be directly stacked on one side of the substrate SU; or, in order to prevent the impurities in the substrate SU from affecting the driving layer PN, a buffer layer can be provided between the substrate SU and the driving layer PN, and the driving layer PN can be provided on the surface of the buffer layer away from the substrate SU. The driving layer PN and the substrate SU and the film layer therebetween can form a driving backplane.

[0072] The driving layer PN at least includes a driving area AA and a peripheral area PEA, and the peripheral area PEA may be an annular area surrounding the driving area AA, or may be two discontinuous areas separated on both sides of the driving area AA, as long as it is located outside the driving area AA. The driving area AA may include a second sub-area CIA and a first sub-area TRA, and the second sub-area CIA may be arranged around the first sub-area TRA, but the first sub-area TRA may not be at the center of the second sub-area CIA, but may be arranged close to the edge of the second sub-area CIA; or, a part of the boundary of the first sub-area TRA may overlap with a part of the second sub-area CIA.

[0073] The driving layer PN has a driving circuit for driving the light emitting device LED to emit light. The driving circuit may include a pixel circuit and a peripheral circuit. The pixel circuit is arranged in the driving area AA. Of course, a part of the pixel circuit may be located in the peripheral area PEA. The pixel circuit may be a 7T1C, 7T2C, 6T1C or 6T2C structure. As long as it can drive the light emitting device LED to emit light, its structure is not specifically limited here. The number of pixel circuits is the same as the number of light emitting devices LED, and they are connected to each light emitting device LED in a one-to-one correspondence so as to control each light emitting device LED to emit light independently. Among them, nTmC means that a pixel circuit includes n transistors (represented by the letter "T") and m capacitors (represented by the letter "C"). Of course, a pixel circuit can also be connected to multiple light emitting devices LED at the same time, and can drive multiple light emitting devices LED to emit light simultaneously or in a time-sharing manner.

[0074] The density of the pixel circuits in the first sub-area TRA is less than the density of the pixel circuits in the second sub-area CIA, wherein the density of the pixel circuits in the first sub-area TRA refers to the ratio of the number of pixel circuits in the first sub-area TRA to the area of ​​the first sub-area TRA. The density of the pixel circuits in the second sub-area CIA refers to the ratio of the number of pixel circuits in the second sub-area CIA to the area of ​​the second sub-area CIA.

[0075] The pixel circuit may include a first pixel circuit and a second pixel circuit. The first pixel circuit is used to drive the first light emitting device LED1 , and the second pixel circuit is used to drive the second light emitting device LED2 .

[0076] In some embodiments of the present disclosure, in order to minimize the reduction of resolution, at least a portion of the pixel circuits in the first sub-area TRA may be transferred to the second sub-area CIA. Specifically, the second pixel circuit and at least a portion of the first pixel circuit are located in the second sub-area CIA, and at most a portion of the first pixel circuit may be set in the first sub-area TRA, or the first pixel circuit may not be set, that is, the density of the pixel circuits in the first sub-area TRA may be equal to or greater than 0.

[0077] For example, all the first pixel circuits are located in the second sub-area CIA, there is no first pixel circuit in the first sub-area TRA, and the first pixel circuits and the second pixel circuits in the second sub-area CIA are arranged in an array along the row and column directions, each column of first pixel circuits is located between each column of second pixel circuits, and a column of first pixel circuits is provided between two adjacent columns of second pixel circuits; multiple columns of second pixel circuits may be provided between two adjacent columns of first pixel circuits.

[0078] Alternatively, all of the second pixel circuits and a portion of the first pixel circuits may be located in the second sub-area CIA, and another portion of the first pixel circuits may be located in the first sub-area TRA.

[0079] In some embodiments of the present disclosure, one or more columns of pixel circuits closest to the first sub-area TRA in the row direction may not be connected to the light-emitting device LED, and these pixel circuits may be used as dummy pixel circuits to increase the distance between the first pixel circuit closest to the first sub-area TRA and the first sub-area TRA, which is connected to the light-emitting device LED corresponding to the first sub-area TRA, and the first sub-area TRA, thereby increasing the minimum length of the corresponding lead wire, avoiding excessive differences in the lighting time of the light-emitting devices LED in different columns corresponding to the first sub-area TRA due to excessive differences in the length of the lead wire, and improving the picture quality.

[0080] In order to ensure that there is enough space in the driving area AA to accommodate the first pixel circuit and the second pixel circuit without reducing the number of pixel circuits, at least part of the pixel circuits can be compressed along the row direction to reduce the width of the pixel circuit in the row direction. Under the premise that the size of the driving layer PN is the same, more areas can be provided in the driving area AA, and the first pixel circuit can be arranged in the more areas. The width of the pixel circuit refers to the length of the positive projection of the pixel circuit on the driving layer PN along the row direction.

[0081] It should be noted that the row direction and column direction in this article refer to two perpendicular directions, and are not limited to the horizontal and vertical directions in the figure. Those skilled in the art may imagine that if the display panel is rotated, the actual directions of the row direction and column direction may change.

[0082] In addition, if Figure 6 As shown, in other embodiments of the present disclosure, all first pixel circuits are located in the first sub-area TRA, and all second pixel circuits are located in the second sub-area CIA. The purpose of making the density of the first pixel circuit lower than that of the second pixel circuit can be achieved by reducing the number of first pixels, thereby improving the transmittance of the first sub-area TRA.

[0083] The peripheral circuit is located in the peripheral area PEA and connected to the pixel circuit for inputting a driving signal to the pixel circuit so as to control the light emitting device LED to emit light. The peripheral circuit may include a gate driving circuit and a light emitting control circuit, and the specific structure of the peripheral circuit is not specifically limited here.

[0084] like Figure 1-Figure 4 As shown, the driving layer PN may be formed by a plurality of film layers. Taking the transistor in the driving circuit as a top-gate thin film transistor as an example, the driving layer PN may include an active layer ACT, a first gate insulating layer GI1, a gate Gate, a second gate insulating layer GI2, an interlayer dielectric layer ILD, a first source and drain layer SD1, a passivation layer PVX, a first planar layer PLN1, a second source and drain layer SD2, and a second planar layer PLN2, wherein:

[0085] The active layer ACT is arranged on the substrate SU; the first gate insulating layer GI1 covers the active layer ACT; the gate Gate is arranged on the surface of the first gate insulating layer GI1 away from the substrate SU, and is arranged opposite to the active layer ACT; the second gate insulating layer GI2 covers the gate Gate and the first gate insulating layer GI1; the interlayer dielectric layer ILD covers the second gate insulating layer GI2; the first source and drain layer SD1 is arranged on the surface of the interlayer dielectric layer ILD away from the substrate SU, and includes a source and a drain, and the source and the drain are connected to the active layer ACT; the passivation layer PVX covers the first source and drain layer SD1; the first flat layer PLN1 covers the passivation layer PVX; the second source and drain layer SD2 is arranged on the surface of the first flat layer PLN1 away from the substrate SU, and is connected to the first source and drain layer SD1; the second flat layer PLN2 covers the second source and drain layer SD2 and the first flat layer PLN1.

[0086] The pixel circuit in the first sub-area TRA mentioned above is transferred to the second sub-area CIA, which means that the circuit formed by the transistor, capacitor and wiring is transferred to the second sub-area CIA. For example, there is no light-blocking film layer such as the source layer ACT, the gate Gate, the first source drain layer SD1 and the second source drain layer SD2 in the first sub-area TRA, while the transparent first gate insulating layer GI1, the second gate insulating layer GI2, the interlayer dielectric layer ILD, the passivation layer PVX, the first flat layer PLN1 and the second flat layer PLN2 can still be retained in the first sub-area TRA and stacked. Due to the transfer of the pixel circuit, the film layer of the first sub-area TRA is reduced compared with the film layer of the second sub-area CIA, thereby collapsing relative to the second sub-area CIA, forming the first pit Pit1. In other words, the depression of the first pit Pit1 is relative to the second sub-area CIA, and there is a height difference between the two. The bottom surface of the first pit Pit1 may not be a plane, but a curved surface or an uneven surface, and its side surface may smoothly transition with the second sub-area CIA.

[0087] Of course, in other embodiments of the present disclosure, the second source / drain layer SD2 and the second planar layer PLN2 may be absent, and the first pit Pit1 may be formed on the first planar layer PLN1.

[0088] It should be noted that the drawings disclosed herein only show the second flat layer PLN2 being recessed, but this is only a schematic illustration of the first pit Pit1 and does not mean that only the second flat layer PLN2 is recessed. The first flat layer PLN1 of the first sub-area TRA, the passivation layer PVX, the interlayer dielectric layer ILD, etc. can all be recessed, as long as the driving layer PN is made to face away from the surface of the substrate SU to form the first pit Pit1.

[0089] like Figure 1-Figure 4As shown, the light-emitting layer PL is arranged on the side of the driving layer PN away from the substrate SU, and includes a plurality of light-emitting devices LED, the light-emitting devices LED include a plurality of first light-emitting devices LED1 corresponding to the first sub-area TRA and a plurality of second light-emitting devices LED2 corresponding to the second sub-area CIA, that is, the orthographic projection of any first light-emitting device LED1 on the driving layer PN is at least partially located in the first sub-area TRA, and the orthographic projection of the second light-emitting device LED2 on the driving layer PN is located in the second sub-area CIA. A first light-emitting device LED1 can be connected to a first pixel circuit, and a second light-emitting device LED2 can be connected to a second pixel circuit.

[0090] In some embodiments of the present disclosure, the first pixel circuit is entirely located in the second sub-area CIA, and the first pixel circuit can be connected to the first light-emitting device LED1 corresponding to the first sub-area TRA through the transfer layer LI. For example:

[0091] A transfer layer LI may be provided on the surface of the driving layer PN facing away from the substrate SU, for example, the transfer layer LI is provided on the surface of the second flat layer PLN2 facing away from the substrate SU. The transfer layer LI is recessed in the area corresponding to the first pit Pit1, and the transfer layer LI has a lead; the transfer layer LI may cover the first sub-area TRA and the driving area AA. The light-emitting layer PL is provided on the surface of the transfer layer LI facing away from the substrate SU. The transfer layer LI includes a plurality of mutually insulated lead layers, each of which includes a plurality of mutually insulated leads, and the orthographic projection of each lead on the driving layer PN extends from the first sub-area TRA to the second sub-area CIA, and is connected to a first pixel circuit. At the same time, a transfer hole connected to each lead in a one-to-one correspondence is provided in the transfer layer LI, and the first light-emitting device LED1 may be connected to the corresponding first pixel circuit through a transfer hole and a lead. The transfer hole may be a via structure in the transfer layer LI, but since the leads connected to the transfer hole may be located in different lead layers, the depths of different transfer holes may be different.

[0092] The material of the leads of each lead layer may be a transparent material such as indium tin oxide (ITO) or indium gallium zinc oxide (IGZO).

[0093] In some embodiments of the present disclosure, the number of lead layers may be three layers, including a first lead layer, a second lead layer, and a third lead layer sequentially distributed from the driving layer PN to the light-emitting layer PL. In order to insulate the lead layers, the transfer layer LI further includes a first insulating layer, a second insulating layer, and a third insulating layer, wherein: the first lead layer may be disposed on the surface of the driving layer PN close to the light-emitting layer PL. The first insulating layer covers the surface of the first lead layer and the driving layer PN close to the light-emitting layer PL. The second lead layer is disposed on the surface of the first insulating layer away from the driving layer PN. The second insulating layer covers the surface of the second lead layer and the first insulating layer close to the light-emitting layer PL. The third lead layer is disposed on the surface of the second insulating layer away from the driving layer PN. The third insulating layer covers the surface of the third lead layer and the second insulating layer close to the light-emitting layer PL; the light-emitting layer PL is disposed on the surface of the third insulating layer away from the driving layer PN.

[0094] Of course, the number of lead layers can be one layer, two layers, or more than three layers, and is not specifically limited here.

[0095] like Figure 6 As shown, in other embodiments of the present disclosure, if the first pixel circuit is located in the first sub-area TRA, the first pixel circuit in the first sub-area TRA can be directly connected to the first light-emitting device OLED1 through the via hole penetrating the transfer layer, without passing through the above-mentioned lead wire. Further, in order to reduce the shielding of light by the first pixel circuit, the first pixel circuit can be corresponded to the first electrode AN of the first light-emitting device LED1, so that the orthographic projection of the first pixel circuit on the substrate SU is located within the orthographic projection of the first electrode AN on the substrate SU, or at least partially overlaps, in addition to the shielding effect of the first electrode AN on the light, the shielding of light by the first pixel circuit is minimized.

[0096] The light emitting device LED may be an organic light emitting diode (OLED), which may include a first electrode AN, a light emitting material layer EL and a second electrode CA, wherein:

[0097] The first electrode AN may be disposed on the surface of the transfer layer LI away from the driving layer PN. The first electrode AN serves as the anode of the light-emitting device LED and is connected to the pixel circuit. For example, the first electrode AN connected to the first pixel circuit may be connected to a lead through a transfer hole in the transfer layer LI, thereby connecting the first pixel circuit to the first electrode AN of the corresponding light-emitting device LED. The first electrode AN connected to the second pixel circuit may be connected to the second pixel circuit through a via hole that passes through the transfer layer LI and penetrates into the driving layer PN. The first electrode AN may be a single-layer or multi-layer structure, and its material may include one or more of conductive metals, metal oxides, and alloys.

[0098] The light-emitting material layer EL can be arranged on the surface of the first electrode AN away from the driving layer PN. It may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer and an electron injection layer stacked in sequence on the first electrode AN. Holes and electrons can be recombined into excitons in the organic light-emitting layer, and the excitons can radiate photons to generate visible light. The specific light-emitting principle will not be described in detail here.

[0099] The second electrode CA, as the cathode of the light emitting device LED, may be disposed on the surface of the light emitting material layer EL away from the driving layer PN. The light emitting material layer EL may be driven to emit light by applying an electrical signal to the first electrode AN and the second electrode CA. The second electrode CA may be a single-layer or multi-layer structure, and its material may include one or more of a conductive metal, a metal oxide, and an alloy.

[0100] The above is the structure of a light-emitting device LED. In the entire display panel, the first electrodes AN of each light-emitting device LED can be made of the same material and formed simultaneously through a single patterning process. Each light-emitting material layer EL can also be made of the same material and formed simultaneously through a single patterning process. At the same time, each light-emitting device LED can share the same second electrode CA, that is, the second electrode CA can cover each light-emitting material layer EL at the same time. The light-emitting material layers EL of each light-emitting device LED can be independent of each other, and the array is distributed in each opening, that is, the light-emitting material layers EL of different light-emitting device LEDs are independent of each other. Of course, the light-emitting material layers EL of each light-emitting device LED can also share at least a portion of the film layer of the light-emitting material layer EL, thereby reducing the difficulty of the process.

[0101] The color of the light emitting device LED can be the same color. In this case, the color filter layer needs to be used to achieve color display. Of course, since the light emitting material layers EL of each light emitting device LED are independent of each other, different light emitting devices LED can also directly emit light of different colors.

[0102] like Figure 1-Figure 4 As shown, in order to facilitate the limitation of the light-emitting range of each light-emitting device LED, the light-emitting layer PL may further include a pixel definition layer PDL, which may be provided on the surface of the transfer layer LI away from the driving layer PN, and the pixel definition layer PDL is used to separate each light-emitting device LED. Specifically, the pixel definition layer PDL may be provided with a plurality of openings, and the range defined by each opening is the range of a light-emitting device LED. The shape of the opening, that is, the shape of the contour of the positive projection of the opening on the driving layer PN may be a polygon, a smooth closed curve or other shapes, and the smooth closed curve may be a circle, an ellipse or an oval, etc., which is not specifically limited here. The light-emitting material layer EL may cover the first electrode AN in each opening.

[0103] In order to make the brightness of the light emitting layer PL in the area corresponding to the first sub-area TRA and the area corresponding to the second sub-area CIA consistent, the density of the first light emitting device LED1 in the area corresponding to the first sub-area TRA and the density of the second light emitting device LED2 in the area corresponding to the second sub-area CIA can be made the same.

[0104] like Figure 1 and Figure 2 As shown, the display panel may further include an encapsulation layer FE, which may cover the light-emitting layer PL, and may be used to protect the light-emitting layer PL and prevent external water and oxygen from corroding the light-emitting device LED. Since the transfer layer LI is recessed due to the first pit Pit1 of the driving layer PN, the encapsulation layer FE is recessed in the area corresponding to the first pit Pit1 to form a second pit Pit2. At the same time, the range of the second pit Pit2 is limited by the first pit Pit1, so that the boundary of the first pit Pit1 surrounds the outside of the positive projection of the second pit Pit2 on the driving layer PN.

[0105] In some embodiments of the present disclosure, Figure 1 and Figure 2 As shown, the encapsulation layer FE may include a first inorganic layer IL1, an organic layer OL and a second inorganic layer IL2, wherein:

[0106] The first inorganic layer IL1 covers the surface of the light emitting layer PL away from the driving layer PN. For example, the first inorganic layer IL1 covers the second electrode CA. The material of the first inorganic layer IL1 may include insulating materials such as silicon nitride and silicon oxide that can block water and oxygen. The first inorganic layer IL1 is recessed in the area corresponding to the first pit Pit1.

[0107] The organic layer OL may be disposed on the surface of the first inorganic layer IL1 away from the driving layer PN, and the boundary of the organic layer OL is limited to the inner side of the boundary of the first inorganic layer IL1, that is, the area of ​​the organic layer OL is smaller than that of the second inorganic layer IL2, thereby exposing the edge of the first inorganic layer IL1. The organic layer OL is recessed in the area of ​​the first inorganic layer IL1 corresponding to the first pit Pit1.

[0108] like Figure 2 As shown, the second inorganic layer IL2 covers the organic layer OL and the first inorganic layer IL1 not covered by the organic layer OL, and the second inorganic layer IL2 can block the intrusion of water and oxygen, and the planarization is achieved through the flexible organic layer OL. The material of the second inorganic layer IL2 may include insulating materials such as silicon nitride and silicon oxide that can block water and oxygen. The second inorganic layer IL2 is recessed in the region of the organic layer OL corresponding to the first pit Pit1 to form a second pit Pit2.

[0109] Further, such as Figure 2As shown, the organic layer OL can be formed by inkjet printing or the like, and it has fluidity, so in the process of forming the organic layer OL, it can gradually flow toward the periphery. In order to limit the range of its flow, the display panel further includes a barrier dam Dam, which can be arranged in the same layer as the light-emitting layer PL and is located in the peripheral area PEA and is arranged around the light-emitting layer PL to define the boundary of the organic layer OL. The first inorganic layer IL1 can cover the light-emitting layer PL and the barrier dam Dam, and the organic layer OL is located within the range surrounded by the barrier dam Dam. The second inorganic layer IL2 covers the organic layer OL and the area of ​​the first inorganic layer IL1 not covered by the organic layer OL.

[0110] For example, Figure 2 As shown, at least a portion of the barrier dam Dam can be formed with the pixel definition layer PDL through a single patterning process to simplify the structure. There can be multiple barrier dams Dam, which are spaced outward layer by layer around the driving area AA, and the heights of different barrier dams Dam can be different.

[0111] In some embodiments of the present disclosure, Figure 2 As shown, the encapsulation layer FE may include a flat portion FEm and an edge portion FEf surrounding the flat portion FEm, and the thickness of different areas of the flat portion FFm is basically the same. The basic consistency here takes into account that the inevitable process error will cause the flat portion FEm to be impossible to be absolutely flat and have an absolutely uniform thickness. The thickness of the edge portion FEf gradually decreases toward the barrier dam Dam, that is, the thickness of the edge portion FEf of the encapsulation layer FE gradually decreases outward. At the same time, the inventors found that if the first sub-area TRA is close to the boundary of the driving area AA, or partially overlaps with the boundary of the driving area AA, the position of the first pit Pit1 may correspond to the edge portion FEf, so that the orthographic projection of the edge portion FEf on the driving layer PN can at least partially overlap with the first pit Pit1, and at least part of the second pit Pit2 is located at the edge portion FEf. Further, in some embodiments of the present disclosure, the second pit Pit2 may be located at the edge portion FEf.

[0112] Of course, in other embodiments of the present disclosure, Figure 6 As shown, the first pit Pit1 may also correspond to the flat portion FEm, so that the second pit Pit2 is located in the flat portion FEm. However, since the thickness of the edge portion FEf gradually decreases toward the barrier dam Dam, the edge portion FEf is more likely to collapse due to the existence of the first pit Pit1. Therefore, if the second pit Pit2 is located in the edge portion FEf, its depth may be greater than the depth of the second pit Pit2 when it is located in the flat portion FEm.

[0113] like Figure 1As shown, the transparent filling layer OC can be arranged on the surface of the encapsulation layer FE away from the substrate SU, and at least a part of the area is filled in the second pit Pit2 to compensate for the collapse caused by the second pit Pit2 and prevent the optical path of the light in the first sub-area TRA from being affected by the second pit Pit2, thereby improving the imaging effect of the camera device.

[0114] Furthermore, the material of the transparent filling layer OC may be optical glue, the light transmittance of which may be greater than 99%, thereby minimizing the blocking of light and facilitating improving the imaging effect of the camera device.

[0115] In some embodiments of the present disclosure, Figure 5 As shown, the transparent filling layer OC can cover the edge portion FEf and the area of ​​the encapsulation layer FE corresponding to the blocking dam Dam, and the surface of the transparent filling layer OC facing away from the substrate SU is flush with the surface of the flat portion FEm facing away from the substrate SU. That is to say, the transparent filling layer OC fills the depression formed by thinning the edge portion FEf of the encapsulation layer FE, and does not protrude from the flat portion FEm, thereby avoiding the need to climb a slope when forming other film layers above.

[0116] In other embodiments of the present disclosure, Figure 6 As shown, the transparent filling layer OC can cover the edge portion FEf and the area of ​​the encapsulation layer FE corresponding to the barrier dam Dam, and the surface of the transparent filling layer OC facing away from the substrate SU is located on the side of the surface of the flat portion FEm facing away from the substrate SU facing away from the substrate SU, that is, the maximum depth of the transparent filling layer OC can be greater than the thickness of the edge portion FEf of the encapsulation layer FE that is thinned relative to the flat portion FEm. In addition, the transparent filling layer OC extends to the surface of the flat portion FEm facing away from the substrate SU and covers a partial area of ​​the flat portion FEm, and the thickness of the transparent filling layer OC on the flat portion FEm is less than the thickness of the flat portion FEm. As a result, it is possible to avoid accurately controlling the thickness of the transparent filling layer OC and reduce the difficulty of the process.

[0117] In some embodiments of the present disclosure, Figure 1 As shown, the display panel may further include a touch layer TSP, covering the encapsulation layer FE and the transparent filling layer OC. If the surface of the transparent filling layer OC facing away from the substrate SU is flush with the surface of the flat portion FEm facing away from the substrate SU, the encapsulation layer FE is directly on the surface. If the transparent filling layer OC extends to the surface of the flat portion FEm facing away from the substrate SU, the touch layer TSP needs to climb at the boundary of the area where the transparent filling layer OC is located on the flat portion FEm to cover the transparent filling layer OC.

[0118] The touch layer TSP can adopt a self-capacitive or mutual-capacitive touch structure. For example, the touch layer TSP can be an external type, or it can also be an On-CEL1 method such as FMLOC (Flexible Multi-Layer On CEL1). There is no special limitation on its specific structure here, as long as the touch function can be realized.

[0119] In addition, the display panel may further include a circular polarizing layer and a transparent cover plate which are sequentially arranged on a side of the touch layer TSP away from the substrate SU, as well as other structures, which will not be described in detail herein.

[0120] The present disclosure provides a method for manufacturing a display panel. The structure of the display panel can refer to the above embodiment of the display panel and will not be described in detail here. The manufacturing method may include steps S110 to S140, wherein:

[0121] Step S110, forming a driving layer including a driving area and a peripheral area outside the driving area on a substrate, wherein the driving area includes a first sub-area and a second sub-area; the driving layer has a plurality of pixel circuits, and the density of the pixel circuits in the first sub-area is less than the density of the pixel circuits in the second sub-area; the first sub-area is at least partially recessed toward the substrate to form a first pit;

[0122] Step S120, forming a light-emitting layer including a plurality of light-emitting devices on a side of the driving layer away from the substrate, wherein the light-emitting devices include a plurality of first light-emitting devices corresponding to the first sub-area and a plurality of second light-emitting devices corresponding to the second sub-area;

[0123] Step S130, forming an encapsulation layer covering the light-emitting layer, wherein the encapsulation layer is recessed in a region corresponding to the first pit to form a second pit;

[0124] Step S140 , forming a transparent filling layer on a surface of the encapsulation layer facing away from the substrate, and at least a portion of the transparent filling layer is filled in the second pit.

[0125] In some embodiments of the present disclosure, the pixel circuit includes a plurality of first pixel circuits and a plurality of second pixel circuits, and the second pixel circuits and at least part of the first pixel circuits are located in the second sub-area;

[0126] After step S110 and before step S120, the manufacturing method of the present disclosure further includes step S150, which may include:

[0127] A transfer layer is formed on a surface of the driving layer facing away from the substrate, the transfer layer is recessed in a region corresponding to the first pit, and the transfer layer has a lead extending from the first sub-region to the second sub-region;

[0128] The light-emitting layer is arranged on the surface of the transfer layer away from the substrate, at least part of the first light-emitting devices are connected to the first pixel circuit through the lead wires; and the second light-emitting devices are connected to the second pixel circuit.

[0129] In some embodiments of the present disclosure, the manufacturing method of the present disclosure further includes step S160, which may include:

[0130] A touch control layer covering the encapsulation layer and the transparent filling layer is formed.

[0131] The structural details involved in each step of the manufacturing method disclosed in the present invention have been described in detail in the above embodiment of the display panel and will not be described in detail here.

[0132] It should be noted that, although the steps of the manufacturing method in the present disclosure are described in a specific order in the drawings, this does not require or imply that the steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or one step may be decomposed into multiple steps, etc.

[0133] The present disclosure also provides a display device, which may include the display panel of any of the above embodiments. The structure and beneficial effects of the display panel can refer to the above embodiments of the display panel and will not be described in detail here.

[0134] The present disclosure also provides a terminal device, such as Figure 8 As shown, the terminal device may include a display device Dis and a camera device Cam, wherein:

[0135] The display device Dis may be a display device of any of the above embodiments. Its structure and beneficial effects may refer to the embodiments of the display panel and the display device above, which will not be described in detail here.

[0136] The camera device Cam may be arranged on the backlight side of the display device Dis, that is, the back side in the light-emitting direction. For example, if the light-emitting device LED of the display device Dis is a top-emitting structure, that is, it emits light in the direction of the light-emitting layer PL away from the substrate SU, then the camera device may be arranged on the side of the substrate SU away from the light-emitting layer PL, and the camera device Cam may be directly opposite to the first sub-area TRA, and is used to capture images through the first sub-area TRA. If the light-emitting device LED of the display device Dis is a bottom-emitting structure, then the camera device Cam may be arranged on the side of the transparent filling layer OC away from the substrate SU.

[0137] The camera device Cam may include a lens, a photoelectric sensor, etc. The specific structure of the camera device Cam is not particularly limited herein, as long as it can capture images.

[0138] The terminal device disclosed in the present invention may be a mobile phone, a tablet computer, a television, or other electronic device with display and shooting functions, which are not listed here one by one.

[0139] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A display panel, characterized in that: include: substrate; A driving layer is provided on one side of the substrate and includes a driving area and a peripheral area outside the driving area, wherein the driving area includes a first sub-area and a second sub-area; the driving layer has a plurality of pixel circuits, and the density of the pixel circuits in the first sub-area is less than the density of the pixel circuits in the second sub-area; The first sub-region is at least partially recessed toward the substrate to form a first pit; a light-emitting layer, disposed on a side of the driving layer away from the substrate, and comprising a plurality of light-emitting devices connected to the pixel circuit, wherein the light-emitting devices include a plurality of first light-emitting devices corresponding to the first sub-area and a plurality of second light-emitting devices corresponding to the second sub-area; an encapsulation layer, covering the light-emitting layer and being recessed in a region corresponding to the first pit to form a second pit; The transparent filling layer is disposed on a surface of the packaging layer facing away from the substrate, and at least a portion of the transparent filling layer is filled in the second pit.

2. The display panel according to claim 1, characterized in that: The display panel further includes: A transfer layer is provided on a surface of the driving layer away from the substrate and is recessed in a region corresponding to the first pit, and the transfer layer has a lead extending from the first sub-region to the second sub-region; the light-emitting layer is provided on a surface of the transfer layer away from the substrate; The pixel circuit includes multiple first pixel circuits and multiple second pixel circuits, the second pixel circuits and at least part of the first pixel circuits are located in the second sub-area; at least part of the first light-emitting devices are connected to the first pixel circuits through the leads; and the second light-emitting devices are connected to the second pixel circuits.

3. The display panel according to claim 1, characterized in that: The display panel further includes: A blocking dam is arranged in the same layer as the light-emitting layer and is spaced apart from the light-emitting layer, is located in the peripheral area, and is arranged around the light-emitting layer; The encapsulation layer comprises: a first inorganic layer covering the light emitting layer and the barrier dam and being recessed at a position corresponding to the first pit; an organic layer, disposed on a surface of the first inorganic layer facing away from the substrate, located within a range surrounded by the blocking dam, and recessed at a position of the first inorganic layer corresponding to the first pit; The second inorganic layer covers the organic layer and the area of ​​the first inorganic layer not covered by the organic layer, and is recessed at a position of the organic layer corresponding to the first pit to form a second pit.

4. The display panel according to claim 3, characterized in that: The encapsulation layer comprises a flat portion and an edge portion surrounding the flat portion, the thickness of different regions of the flat portion is substantially the same, and the thickness of the edge portion gradually decreases toward the blocking dam; The orthographic projection of the edge portion on the driving layer at least partially overlaps with the first pit, and the second pit is at least partially located at the edge portion.

5. The display panel according to claim 4, characterized in that: The transparent filling layer covers the edge portion and a region of the encapsulation layer corresponding to the blocking dam, and a surface of the transparent filling layer facing away from the substrate is flush with a surface of the flat portion facing away from the substrate.

6. The display panel according to claim 4, characterized in that: The transparent filling layer covers the edge portion and a region of the encapsulation layer corresponding to the blocking dam, and a surface of the transparent filling layer facing away from the substrate is located on a side of a surface of the flat portion facing away from the substrate facing away from the substrate.

7. The display panel according to claim 6, characterized in that: The transparent filling layer extends to the surface of the flat portion facing away from the substrate and covers a partial area of ​​the flat portion.

8. The display panel according to claim 1, characterized in that: The boundary of the first pit is outside the orthographic projection of the second pit on the driving layer.

9. The display panel according to claim 1, characterized in that: The light transmittance of the transparent filling layer is greater than 99%.

10. The display panel according to claim 1, characterized in that: The display panel further includes: The touch layer covers the encapsulation layer and the transparent filling layer.

11. A method for manufacturing a display panel, characterized in that: include: A driving layer including a driving area and a peripheral area outside the driving area is formed on a substrate, wherein the driving area includes a first sub-area and a second sub-area; the driving layer has a plurality of pixel circuits, and the density of the pixel circuits in the first sub-area is less than the density of the pixel circuits in the second sub-area; The first sub-region is at least partially recessed toward the substrate to form a first pit; forming a light-emitting layer including a plurality of light-emitting devices on a side of the driving layer away from the substrate, the light-emitting devices including a plurality of first light-emitting devices corresponding to the first sub-area and a plurality of second light-emitting devices corresponding to the second sub-area; forming an encapsulation layer covering the light-emitting layer, wherein the encapsulation layer is recessed in a region corresponding to the first pit to form a second pit; A transparent filling layer is formed on a surface of the packaging layer facing away from the substrate, and at least a portion of the transparent filling layer is filled in the second pit.

12. The manufacturing method according to claim 11, characterized in that: The pixel circuit includes a plurality of first pixel circuits and a plurality of second pixel circuits, wherein the second pixel circuits and at least part of the first pixel circuits are located in the second sub-area; Before forming the light-emitting layer and after forming the driving layer, the manufacturing method further includes: A transfer layer is formed on a surface of the driving layer facing away from the substrate, the transfer layer is recessed in a region corresponding to the first pit, and the transfer layer has a lead extending from the first sub-region to the second sub-region; The light-emitting layer is arranged on the surface of the transfer layer away from the substrate, at least part of the first light-emitting devices are connected to the first pixel circuit through the lead wires; and the second light-emitting devices are connected to the second pixel circuit.

13. The manufacturing method according to claim 11 or 12, characterized in that: The manufacturing method further comprises: A touch control layer covering the encapsulation layer and the transparent filling layer is formed.

14. A display device, characterized in that: A display panel comprising any one of claims 1 to 10.

15. A terminal device, characterized in that: include: The display device according to claim 14; The camera device is disposed on a side of the substrate away from the driving layer and is directly opposite to the first sub-area, and is used for capturing images through the first sub-area.

Images