Liquid ejecting head and liquid ejecting apparatus

Abstract

A liquid ejecting head and a liquid ejecting apparatus are provided. In the liquid ejecting head, the attachment of moisture to a connection terminal portion can be suppressed. The liquid ejecting head includes a plurality of head chips that eject liquid in a first direction, a holder on which the plurality of head chips are fixed, a circuit substrate that is disposed in a direction opposite to the first direction with respect to the holder, and a cover member that is disposed in the direction opposite to the first direction with respect to the circuit substrate. The plurality of head chips have a flexible wiring substrate that has a connection terminal portion connected to the circuit substrate, the cover member has a plurality of first ribs that protrude toward the circuit substrate, the first ribs are disposed at positions overlapping the connection terminal portion when viewed in the first direction, and a first adhesive is disposed between the first ribs and the connection terminal portion.

Description

Technical Field

[0001] This disclosure relates to a liquid jet head and a liquid jetting device. Background Technology

[0002] Patent Document 1 discloses a liquid injection head comprising: a lower housing member for housing a plurality of head chips; a circuit board laminated on the lower housing member; and an upper housing member laminated on the lower housing member to cover the circuit board. In this liquid injection head, piezoelectric actuator elements disposed on each head chip and the circuit board are connected via a flexible substrate.

[0003] In the liquid jet head described in the aforementioned literature, since the connection terminal of the flexible substrate connected to the circuit board is exposed inside the liquid jet head, there is a possibility that moisture in the atmosphere that has entered the liquid jet head may adhere to the connection terminal and cause electrical malfunction.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2014-188887 Summary of the Invention

[0005] According to a first aspect of this disclosure, a liquid injection head is provided. The liquid injection head includes: a plurality of head chips that inject liquid in a first direction; a holder on which the plurality of head chips are fixed; a circuit board disposed relative to the holder in a direction opposite to the first direction; and a cover member disposed relative to the circuit board in a direction opposite to the first direction. Each of the plurality of head chips has a flexible wiring substrate, the flexible wiring substrate having a connection terminal portion connected to the circuit board. The circuit board has a first surface mounted on the holder and a second surface opposite to the first surface and connected to the connection terminal portion. The cover member has a plurality of first ribs protruding toward the second surface of the circuit board. When viewed in the first direction, the plurality of first ribs are disposed at positions overlapping with each of the connection terminal portions of the plurality of head chips. A first adhesive is disposed between the plurality of first ribs and the connection terminal portions of the plurality of head chips.

[0006] According to a second aspect of this disclosure, a liquid injection device is provided. This liquid injection device includes a liquid injection head and a cap as described in the first aspect. The liquid injection head has a spray surface for spraying the liquid, and the cap seals the spray surface by moving relative to the spray surface in a direction opposite to the first direction and abutting against the spray surface. Attached Figure Description

[0007] Figure 1This is an explanatory diagram showing the general structure of the liquid injection device according to the first embodiment.

[0008] Figure 2 This is a first exploded perspective view showing the outline structure of the head unit in the first embodiment.

[0009] Figure 3 This is a second exploded perspective view showing the outline structure of the head unit in the first embodiment.

[0010] Figure 4 This is a bottom view showing the outline structure of the head unit in the first embodiment.

[0011] Figure 5 This is a cross-sectional view showing the structure of the first liquid outlet in the first embodiment.

[0012] Figure 6 An exploded perspective view showing the structure of the liquid injection head according to the first embodiment.

[0013] Figure 7 This is a side view showing the structure of the liquid injection head according to the first embodiment.

[0014] Figure 8 This is a top view showing the structure of the liquid injection head according to the first embodiment.

[0015] Figure 9 for Figure 8 Sectional view along line IX-IX.

[0016] Figure 10 for Figure 8 Sectional view along line X-X.

[0017] Figure 11 This is a cross-sectional view showing the outline structure of the head chip in the first embodiment.

[0018] Figure 12 This is a top view showing the structure of the cage according to the first embodiment.

[0019] Figure 13 This is a top view showing the structure of the circuit board according to the first embodiment.

[0020] Figure 14 This is a top view showing the structure of the cover component according to the first embodiment.

[0021] Figure 15 for Figure 7 Sectional view along line XXV-XXV.

[0022] Figure 16 for Figure 9 A magnified view of part A in the image.

[0023] Figure 17 for Figure 10 A magnified view of part B in the image.

[0024] Figure 18 This is a top view showing the structure of the filter unit according to the first embodiment.

[0025] Figure 19 This is a bottom view showing the contact area provided on the fixed plate in the first embodiment.

[0026] Figure 20 This is a bottom view showing the contact area provided on the fixed plate in another embodiment.

[0027] Figure 21 This is a first cross-sectional view showing the structure of the first liquid outlet in another embodiment.

[0028] Figure 22 This is a second cross-sectional view showing the structure of the first liquid outlet in another embodiment. Detailed Implementation

[0029] A. First implementation method:

[0030] Figure 1 This is an explanatory diagram showing the general structure of the liquid injection device 10 in the first embodiment. Figure 1 The diagram shows arrows indicating the X, Y, and Z directions, which are mutually orthogonal. The X and Y directions are parallel to the horizontal plane, and the Z direction is the direction of gravity. The arrows indicating the X, Y, and Z directions are also shown in other figures, with the arrows pointing in the same direction as the horizontal plane. Figure 1 The corresponding methods are illustrated appropriately. In the following explanation, when a specific orientation is specified, the direction indicated by the arrow mark, i.e., the positive direction, is marked as "+", and the direction opposite to the direction indicated by the arrow mark, i.e., the negative direction, is marked as "-", and both positive and negative signs are used in the direction markings. In addition, the +Z direction is sometimes referred to as "first direction D1", the +X direction as "third direction D3", and the +Y direction as "fourth direction D4".

[0031] In this embodiment, the liquid jetting device 10 is configured as an inkjet printer that prints images on a medium M by jetting ink as a liquid. The liquid jetting device 10 includes: a control unit 15, a liquid container 20, a head unit 30, a conveying mechanism 40, a capping mechanism 50, a suction mechanism 60, and a wiping mechanism 70.

[0032] The control unit 15 is configured as a computer equipped with one or more processors, main storage devices, and input / output interfaces for implementing signals to and from the outside. By executing programs or commands read from the main storage devices through the processor, the control unit 15 performs various functions. For example, the control unit 15 receives image data from a computer connected via wired or wireless communication and converts the received image data into printing data indicating the presence or absence of dots formed on the medium M. According to the printing data, the control unit 15 ejects ink from the head unit 30 while simultaneously conveying the medium M in the +Y direction using the transport mechanism 40, forming dots of ink at predetermined positions on the medium M, thereby printing an image on the medium M.

[0033] Liquid container 20 stores ink to be sprayed onto medium M. In this embodiment, liquid container 20 consists of four containers, each storing ink of four colors: blue-green, magenta, yellow, and black. Each container of liquid container 20 is connected to head unit 30 via supply channel 21. Supply channel 21 is, for example, a flexible tube. The ink stored in liquid container 20 is supplied to head unit 30, for example, by means of a water level difference. Alternatively, a pressure pump for pressurizing ink toward head unit 30 may be provided between liquid container 20 and head unit 30.

[0034] The head unit 30 has six liquid ejection heads 100 arranged side by side along the X direction. The head unit 30 distributes ink of various colors supplied from the liquid container 20 via the supply channel 21 to each liquid ejection head 100, and ejects ink from each liquid ejection head 100 toward the medium M under the control of the control unit 15. In addition, the number of liquid ejection heads 100 provided in the head unit 30 is not limited to six; it can be one, two to five, or even seven or more.

[0035] Under the control of the control unit 15, the conveying mechanism 40 conveys the medium M. In this embodiment, the conveying mechanism 40 conveys the medium M in the +Y direction. The conveying mechanism 40 is, for example, a roller conveying method that uses rollers to clamp the medium M from both sides and rotates the rollers by a motor to convey the medium M. The conveying mechanism 40 may also not be a roller conveying method, but a belt conveying method that uses electrostatic or air pressure to adsorb the medium M onto a belt and conveys the medium M through the belt, or a roller conveying method that rotates a drum wound with the medium M to deliver the medium M.

[0036] The capping mechanism 50 includes a cap unit 51 and a cap moving part 52. In this embodiment, the cap unit 51 consists of six caps 53 arranged side by side along the X direction and a support member 54 supporting the six caps 53. Each cap 53 has a base 55 and a rib 56 protruding from the base 55 toward the -Z direction. When viewed in the +Z direction, the rib 56 is configured as annular. A through hole 57 is provided in the base 55 on the inner side of the rib 56. Under the control of the control unit 15, the cap moving part 52 moves the cap unit 51 relative to the head unit 30. The cap moving part 52 is configured, for example, by a guide rail or a motor. The cap moving part 52 moves the cap unit 51 relative to the head unit 30 in the -Z direction during periods when ink is not being ejected from each liquid ejection head 100 to the medium M, thereby causing the top ends of each rib 56 to abut against the ejection surface of each liquid ejection head 100, and thus covering at least a portion of the ejection surface of each liquid ejection head 100 by the cap 53. The ejection surface refers to the surface of the liquid ejection head 100 that ejects ink. In this embodiment, the ejection surface is the surface of the liquid ejection head 100 in the +Z direction, and is constituted by the nozzle plate 210 and the fixing plate 150 described later. The situation where at least a portion of the ejection surface of each liquid ejection head 100 is covered by the cap 53 is called capping. Alternatively, the cap moving part 52 can move the head unit 30 without moving the cap unit 51, and cover at least a portion of the ejection surface of each liquid ejection head 100 by the cap 53.

[0037] The suction mechanism 60 includes a discharge channel 61, a suction pump 62, and a waste liquid tank 63. The discharge channel 61 communicates with each through hole 57 provided on the cap 53. The discharge channel 61 is, for example, made of a flexible tube. The suction pump 62 is driven under the control of the control unit 15, and when capping, it creates a negative pressure in the space surrounded by each liquid nozzle 100 and the cap 53, thereby suctioning air bubbles or foreign matter from each liquid nozzle 100 along with the ink. The suction pump 62 is, for example, made of a tubular pump. The waste liquid tank 63 stores the ink discharged from each liquid nozzle 100 by the suction pump 62. The process of creating a negative pressure in the space surrounded by each liquid nozzle 100 and the cap 53 when capping, thereby suctioning air bubbles or foreign matter from each liquid nozzle 100 along with the ink, is called suction cleaning.

[0038] The wiping mechanism 70 includes a wiping component 71 and a wiping component moving part 72. The wiping component 71 is, for example, made of a rubber sheet. The wiping component 71 may also be made of cloth or the like. The wiping component moving part 72 is, for example, a guide rail or a motor. Under the control of the control unit 15, the wiping component moving part 72 moves the wiping component 71 relative to the head unit 30 in the +X direction, thereby wiping away ink or foreign matter adhering to the head unit 30. Wiping away ink or foreign matter adhering to the head unit 30 using the wiping component 71 is called wiping. Alternatively, the wiping component moving part 72 can also move the wiping component 71 relative to the head unit 30 in the -X direction to wipe away ink or foreign matter adhering to the head unit 30.

[0039] Figure 2 This is a first exploded perspective view showing the outline structure of the head unit 30. Figure 3 This is a second exploded perspective view showing the outline structure of the head unit 30. Figure 4 This is a bottom view showing the outline structure of the head unit 30. Figure 5 This is a cross-sectional view showing the structure of the first liquid outlet Di1 of the head unit 30. (See attached image.) Figure 2 as well as Figure 3 As shown, the head unit 30 includes a flow distribution component 31, a support component 32, and six liquid injection heads 100.

[0040] The distribution channel component 31 is provided with a number of first liquid inlets Si1 corresponding to the number of ink colors, and a number of first liquid outlets Di1 corresponding to the number of ink colors and the number of liquid injection heads 100. In this embodiment, as... Figure 2 As shown, four first liquid inlets Si1 are provided on the -Z direction side surface of the distribution channel component 31. A supply channel 21 is connected to each first liquid inlet Si1. Figure 3 As shown, twenty-four first liquid outlets Di1 are provided on the surface of the distribution channel component 31 in the +Z direction.

[0041] Within the distribution channel component 31, ink channels for four systems are provided. Each system's ink channel consists of a common channel communicating with a first liquid inlet Si1 and six independent channels branching from the common channel. The common channel is connected to a first liquid outlet Di1 via an independent channel. Ink introduced into the distribution channel component 31 from a first liquid inlet Si1 is distributed to the six first liquid outlets Di1 via the common channel and the independent channels. A [missing information - likely a typo, should be inserted here] is provided between each independent channel and the first liquid outlet Di1. Figure 5The pressure regulating valve 500 shown regulates the pressure of the ink distributed to each of the first liquid outlets Di1. The structure of the pressure regulating valve 500 will be described below.

[0042] like Figure 2 As shown, the support member 32 is disposed on the +Z direction side of the distribution channel member 31 and is fixed to the distribution channel member 31 by screws or adhesives. Each liquid injection head 100 is disposed on the +Z direction side of the support member 32. Each liquid injection head 100 is fixed to the support member 32 by screws or adhesives. Each liquid injection head 100 has four second liquid inlets Si2. An opening is provided on the -Z direction side surface of the support member 32 to expose the second liquid inlets Si2. Each second liquid inlet Si2 is connected to a first liquid outlet Di1. Alternatively, the distribution channel member 31 and the support member 32 can be integrated and constituted as a single component.

[0043] like Figure 4 As shown, each liquid injection head 100 has multiple nozzle rows arranged side-by-side along the X direction. Each nozzle row consists of multiple nozzles N arranged side-by-side along a second direction D2, wherein the third direction D3 is orthogonal to the Z direction and intersects both the X and Y directions. Each liquid injection head 100 ejects ink from each nozzle N. The multiple nozzles N are divided into groups that eject blue-green ink, groups that eject magenta ink, groups that eject yellow ink, and groups that eject black ink.

[0044] like Figure 5 As shown, the pressure regulating valve 500 includes a housing 510, a valve body 520, a valve seat 530, a cover member 540, a diaphragm member 550, and a spring 560. A primary chamber 511 and a secondary chamber 512 are provided inside the housing 510. The primary chamber 511 and the secondary chamber 512 are separated by a partition wall 513. A communication channel 514 is provided on the partition wall 513 to connect the primary chamber 511 and the secondary chamber 512.

[0045] The primary chamber 511 is formed by sealing the opening of the recess provided on the outer casing 510 using a cover member 540. The secondary chamber 512 is formed by sealing the opening of the recess provided on the outer casing 510 using a flexible film member 550. For example, high-density polyethylene terephthalate or polyethylene terephthalate can be used as the material for the film member 550. A pressure plate 555 is adhered to the surface of the film member 550 on the secondary chamber 512 side. The rigidity of the pressure plate 555 is higher than that of the film member 550. The space opposite to the secondary chamber 512, separated by the film member 550, is in communication with the atmosphere.

[0046] The primary chamber 511 is connected to the independent flow channel FP via an inflow channel 541 provided on the cover member 540. The independent flow channel FP is connected to the first liquid inlet Si1. The secondary chamber 512 is connected to the first liquid outlet Di1 via an outflow channel 518 provided on the outer casing 510. A sealing member 519 is provided in the first liquid outlet Di1. At the top end of the second liquid inlet Si2 of the liquid injection head 100, a supply needle 105 for introducing ink into the liquid injection head 100 is provided. Inside the supply needle 105, an ink flow channel and a filter F for capturing air bubbles or foreign matter contained in the ink are provided. The supply needle 105 passes through the sealing member 519, thereby connecting the ink flow channel within the supply needle 105 to the outflow channel 518.

[0047] The valve body 520 is movably disposed within the housing 510. The valve body 520 includes a valve body main body 521 and an abutment member 522. The valve body main body 521 has a cylindrical shaft portion 525 and a disc-shaped flange portion 526 connected to one end of the shaft portion 525. The shaft portion 525 is inserted into a communication channel 514. A gap for ink flow is formed between the shaft portion 525 and the communication channel 514. The top end of the shaft portion 525, opposite to the flange portion 526, abuts against a pressure plate 555. The flange portion 526 is disposed within a primary chamber 511. The abutment member 522 is fixed to the surface of the partition wall 513 side of the flange portion 526. The abutment member 522 is annularly arranged to surround the shaft portion 525. The abutment member 522 is formed of rubber or an elastomer. The valve seat 530 is fixed to the partition wall 513 in a manner opposite to the abutment member 522. The valve seat 530 is configured in an annular shape to surround the communication channel 514.

[0048] A spring 560 is disposed between the flange 526 of the valve body 520 and the cover member 540. One end of the spring 560 abuts against the flange 526, and the other end of the spring 560 abuts against the cover member 540. The spring 560 applies force to the valve body 520 toward the secondary chamber 512. The abutting member 522 of the valve body 520 abuts against the valve seat 530 by the force applied by the spring 560, thereby closing the communication passage 514; in other words, the pressure regulating valve 500 is closed.

[0049] When the ink stored in the secondary chamber 512 flows out from the outflow channel 518, causing a decrease in pressure within the secondary chamber 512, the pressure difference between the secondary chamber 512 and atmospheric pressure causes the diaphragm component 550 to flex, thereby moving the pressure plate 555, which is bonded to the diaphragm component 550, toward the primary chamber 511. The pressure plate 555 overcomes the force applied by the spring 560 and presses against the shaft 525, causing the valve body 520 to move. This creates a gap between the abutment component 522 and the valve seat 530, opening the communication channel 514; in other words, the pressure regulating valve 500 opens.

[0050] When ink flows from the primary chamber 511 into the secondary chamber 512 through the opening of the pressure regulating valve 500, the pressure difference between the secondary chamber 512 and atmospheric pressure decreases. The valve body 520 and the pressure plate 555 return to their original positions due to the force applied by the spring 560, thereby eliminating the gap between the abutment component 522 and the valve seat 530. This closes the communication channel 514; in other words, the pressure regulating valve 500 closes. Thus, since the pressure regulating valve 500 can regulate the pressure of the ink supplied from the distribution channel component 31 to the liquid injection head 100, the supply of ink from the distribution channel component 31 to each liquid injection head 100 can be stabilized.

[0051] Figure 6 An exploded perspective view showing the structure of the liquid injection head 100. Figure 7 This is a side view showing the structure of the liquid injection head 100. Figure 8 This is a top view showing the structure of the liquid injection head 100. Figure 9 for Figure 8 Sectional view along line IX-IX. Figure 10 for Figure 8 The cross-sectional view along line X-X. (See example...) Figure 6 As shown, the liquid injection head 100 includes six head chips 200, a filter unit 110, a cover component 120, a circuit board 130, a retainer 140, and a fixing plate 150.

[0052] like Figure 6 As shown, a fixing plate 150, a retainer 140, a circuit board 130, a cover component 120, and a filter unit 110 are arranged in a stacked manner from the +Z direction side. Figure 9 As shown, six head chips 200 are housed within the space enclosed by the fixing plate 150 and the retainer 140. Furthermore, the number of head chips 200 disposed in a liquid injection head 100 is only required to be two or more, and is not limited to six.

[0053] like Figure 6As shown, the filter unit 110 includes a flow channel component 111 and a filter 112. The flow channel component 111 is configured as a plate. The flow channel component 111 has four upper flow channel pipes 115 and four lower flow channel pipes 116. Each upper flow channel pipe 115 protrudes from the upper surface of the flow channel component 111 in the -Z direction. The aforementioned second liquid inlet Si2 is provided at the top end of each upper flow channel pipe 115. Although in Figure 6 It is not shown in the figure, but it is fixed in the second liquid inlet Si2. Figure 5 The supply needle 105 is shown. Each lower flow channel tube 116 protrudes from the bottom surface of the flow channel component 111 toward the +Z direction.

[0054] Each upper flow channel 115 and each lower flow channel 116 is configured as a tube and has an ink flow channel inside. Within the flow channel component 111, four ink flow channels are provided, communicating with one upper flow channel 115 and one lower flow channel 116. A filter 112 is disposed on each flow channel within the flow channel component 111. The filter 112 captures foreign matter contained in the ink. Furthermore, the flow channels provided inside the upper flow channel 115, the flow channels provided inside the lower flow channel 116, and the flow channels provided within the flow channel component 111 are sometimes referred to as "first flow channel sections." The lower flow channel 116 is sometimes referred to as the "first flow channel tube."

[0055] In this embodiment, the flow channel component 111 is formed of a resin material such as Zylon (registered trademark) or liquid crystal polymer. The filter unit 110 is fixed to the cover component 120 by screws 101. The screws 101 are inserted into the filter unit 110 and the cover component 120 along the Z direction. Alternatively, the filter unit 110 may be fixed to the cover component 120 by adhesive instead of screws 101.

[0056] The cover component 120 has a main body 121 and four resilient sealing portions 122. Each resilient sealing portion 122 is configured as a cylinder centered on a central axis along the Z direction. In each resilient sealing portion 122, the top end of the lower flow channel tube 116 of the filter unit 110 is inserted from the -Z direction side, and the top end of the upper flow channel tube 147 of the retainer 140 (described later) is inserted from the +Z direction side. Each resilient sealing portion 122 suppresses ink leakage from between the lower flow channel tube 116 and the upper flow channel tube 147.

[0057] In this embodiment, the cover component 120 is constructed by co-injection molding of a main body 121 made of a relatively difficult-to-deform resin material such as cyclohexane (registered trademark) or liquid crystal polymer, and an elastic sealing portion 122 made of an elastomer such as nitrile rubber, silicone rubber, or fluororubber. The main body 121 is fixed to the retainer 140 by an adhesive. Alternatively, the main body 121 may also be made of a metal material such as stainless steel. In this case, the metal material forming the main body 121 and the elastomer forming the elastic sealing portion 122 may be integrated by inlay molding or outlay molding. The main body 121 and the elastic sealing portion 122 may also not be integrated. A more specific structure of the cover component 120 will be described below.

[0058] The circuit board 130 supplies drive signals or power supply voltages to each of the head chips 200. The circuit board 130 is configured as a plate. The circuit board 130 has a first surface 131 as the +Z direction side and a second surface 132 as the side opposite to the first surface 131. At the corners of the circuit board 130, cutouts are provided in a manner that do not interfere with the upper flow channel 147 of the holder 140. In this embodiment, the circuit board 130 is fixed to the cover member 120 and the holder 140 by adhesive. Furthermore, a more specific structure of the circuit board 130 will be described later.

[0059] The cage 140 is composed of a first cage component 141, a second cage component 142, and a third cage component 143. The third cage component 143, the second cage component 142, and the first cage component 141 are arranged in a stacked manner from the +Z direction side.

[0060] The first retainer component 141 has four upper flow channel tubes 147. Each upper flow channel tube 147 protrudes from the upper surface portion 145 of the first retainer component 141 in the -Z direction. Each upper flow channel tube 147 is configured as a tube and has an ink flow channel inside. The top end of each upper flow channel tube 147 is inserted into the resilient sealing portion 122 of the cover component 120.

[0061] Each retainer component 141-143 is provided with a flow channel for distributing ink introduced from each upper flow channel 147 to the ink of the six head chips 200. In this embodiment, each retainer component 141-143 is formed of a resin material such as cyclohexane (registered trademark) or liquid crystal polymer. Each retainer component 141-143 is fixed to each other by an adhesive. The first retainer component 141 is fixed to the main body 121 of the cover component 120 and the circuit board 130 by an adhesive. The third retainer component 143 is fixed to the fixing plate 150 by an adhesive.

[0062] The fixing plate 150 has a number of openings 155 corresponding to the number of head chips 200. In this embodiment, the fixing plate 150 has six openings 155 arranged side by side along the X direction. Each opening 155 is configured to penetrate the fixing plate 150 and expose the nozzle array provided on the nozzle plate 210 of each head chip 200. The fixing plate 150 is formed of a metal material such as stainless steel.

[0063] Each chip head 200 is arranged side-by-side along the X-direction on each opening 155 of the fixing plate 150. Each chip head 200 is fixed to the -Z-direction side surface of the fixing plate 150 by adhesive. Each chip head 200 is provided with four liquid inlet ports 251 for introducing ink. Ink, which is dispensed through flow channels provided in each retainer member 141-143, is supplied to each liquid inlet port 251. Each chip head 200 has a flexible wiring substrate 246. A connection terminal portion 247 for connection to the circuit board 130 is provided at one end of the flexible wiring substrate 246.

[0064] Figure 11 This is a cross-sectional view showing the outline structure of the head chip 200. Figure 11 The image shows a cross-section of a head chip 200 and a fixing plate 150. The head chip 200 includes a nozzle plate 210 with a plurality of nozzles N for ink jetting, a flow channel forming substrate 221, a pressure chamber substrate 222, a protective substrate 223, a plastic part 230, a vibrating plate 240, a piezoelectric element 245, a flexible wiring substrate 246, and a housing 224.

[0065] In the head chip 200, the ink flow channel 250, which communicates with the nozzle N, includes a liquid inlet 251 for introducing ink, a reservoir R, an independent flow channel 253, a pressure chamber C, and a connecting flow channel 255. The ink flow channel 250 is constructed by laminating a flow channel forming substrate 221, a pressure chamber substrate 222, and a housing 224. The lower portions of the connecting flow channel 255, the independent flow channel 253, and the reservoir R are disposed on the flow channel forming substrate 221. The pressure chamber C is disposed on the pressure chamber substrate 222. The upper portions of the liquid inlet 251 and the reservoir R are disposed in the housing 224.

[0066] Ink introduced into the housing 224 from the liquid inlet 251 is stored in the liquid reservoir R. The liquid reservoir R is a common flow channel communicating with multiple independent flow channels 253 corresponding to the multiple nozzles N constituting the nozzle array. The ink stored in the liquid reservoir R is supplied to the pressure chamber C via the independent flow channels 253. The ink pressurized in the pressure chamber C is ejected from the nozzle N in the +Z direction via the connecting flow channel 255. In the head chip 200, an independent flow channel 253, a pressure chamber C, and a connecting flow channel 255 are provided for each nozzle N.

[0067] The nozzle plate 210, the flow channel forming substrate 221, and the pressure chamber substrate 222 are formed of monocrystalline silicon. The housing 224 is formed of a resin material such as cyclohexane (registered trademark) or liquid crystal polymer. The nozzle plate 210, the flow channel forming substrate 221, the pressure chamber substrate 222, and the housing 224 are fixed together by an adhesive.

[0068] A nozzle plate 210 and a malleable portion 230 are fixed to the bottom surface of the flow channel forming substrate 221. The nozzle plate 210 is fixed to the lower side of the connecting flow channel 255. The malleable portion 230 is fixed to the lower side of the reservoir R and the independent flow channel 253. The malleable portion 230 is composed of a sealing film 231 and a support body 232. The sealing film 231 is a flexible film-shaped component. The lower side of the reservoir R and the independent flow channel 253 is sealed by the sealing film 231. The outer periphery of the sealing film 231 is supported by the frame-shaped support body 232. The bottom surface of the support body 232 is fixed to the fixing plate 150. The malleable portion 230 suppresses pressure fluctuations of the ink in the reservoir R or the independent flow channel 253.

[0069] The upper side of the pressure chamber C is sealed by the vibrating plate 240. In this embodiment, the vibrating plate 240 is constructed by stacking elastic film-like components such as silicon oxide and insulating film-like components such as zirconium oxide. Alternatively, the elastic film-like components such as silicon oxide of the vibrating plate 240 and the pressure chamber substrate 222 can be integrated and formed from the same components.

[0070] A piezoelectric element 245, serving as a driving device, is provided on the upper surface of the vibrating plate 240. The piezoelectric element 245 consists of a piezoelectric body and electrodes formed on both sides of the piezoelectric body. Each electrode of the piezoelectric element 245 is electrically connected to a flexible wiring board 246 disposed within the housing 224. The flexible wiring board 246 is electrically connected to the circuit board 130. The piezoelectric element 245 receives a driving signal from the control unit 15 via the flexible wiring board 246, thereby vibrating together with the vibrating plate 240 and causing a change in the volume of the pressure chamber C. By reducing the volume of the pressure chamber C, the ink within the pressure chamber C is pressurized, and the ink is ejected from the nozzle N. Alternatively, a heating element may be used instead of the piezoelectric element 245 as the driving device.

[0071] In addition, such as Figure 11 As shown, an adhesive 180 is provided to seal the gap between the edge of the opening 155 of the fixing plate 150 and the edge of the malleable portion 230 and the edge of the nozzle plate 210. Epoxy adhesives or silicone adhesives can be used as the adhesive 180. By providing the adhesive 180, ink can be prevented from entering the gap, and by smoothly connecting the +Z direction side of the nozzle plate 210 to the stepped portion of the first surface 151 of the fixing plate 150, the wiping performance achieved by the wiping action can be improved.

[0072] Figure 12 This is a top view showing the structure of the cage 140. (Example:) Figure 12 As shown, the first retainer component 141 has an upper surface portion 145, an outer peripheral wall 146, and the aforementioned upper flow channel tube 147. The upper surface portion 145 is provided along a plane parallel to the X and Y directions. The outer peripheral wall 146 protrudes from the outer periphery of the upper surface portion 145 in the -Z direction. The outer peripheral wall 146 is annular at the outer periphery of the upper surface portion 145. The upper flow channel tube 147 is disposed inside the outer peripheral wall 146. The upper flow channel tube 147 protrudes from the upper surface portion 145 in the -Z direction. The upper flow channel tube 147 is configured as a tube and has ink flow channels inside. A slit hole 148 is provided in the upper surface portion 145 for the flexible wiring substrate 246 of each head chip 200 to be inserted. In addition, the outer peripheral wall 146 of the retainer 140 is sometimes referred to as the "second outer peripheral wall". The flow channel provided inside the retainer 140 and the flow channel provided inside the upper flow channel tube 147 are sometimes referred to as the "second flow channel section". The upper flow channel tube 147 is sometimes referred to as the "second flow channel tube".

[0073] Figure 13 This is a top view showing the structure of the circuit board 130. Figure 13The diagram shows a circuit board 130 fixed to a holder 140, and a portion of the holder 140 is shown together with the circuit board 130. As described above, the circuit board 130 has a first surface 131 as the +Z direction side and a second surface 132 as the side opposite to the first surface 131. Figure 13 The second face 132 is shown in the image. The first face 131 and... Figure 12 The upper surface portion 145 of the first retainer component 141 shown is in contact. That is, the first surface 131 is the surface of the circuit board 130 that is placed on the retainer 140.

[0074] The circuit board 130 has six openings 133 arranged along the second direction D2. The openings 133 are arranged side-by-side along the X direction. Two of the six openings 133 located at both ends in the X direction are provided as cutouts at the ends of the circuit board 130, and the other four openings 133 (excluding the two located at both ends in the X direction) are provided as slits. A flexible wiring board 246 for inserting a head chip 200 is passed through each opening 133.

[0075] On the second surface 132 of the circuit board 130, there are a plurality of circuit elements 134, six first connection portions 135 electrically connected to the connection terminal portions 247 of each flexible wiring board 246, two connectors 137 into which a signal cable KB is inserted, and two second connection portions 136 electrically connected to each connector 137. The first connection portions 135 are configured as a collection of a plurality of connection terminals arranged side by side along the opening 133 through which the flexible wiring board 246 is inserted. The second connection portions 136 are configured as a collection of a plurality of connection terminals arranged side by side along the connectors 137. The signal cable KB electrically connects the control unit 15 and the circuit board 130. In this embodiment, the signal cable KB is a flexible flat cable. In addition, the signal cable KB is not limited to a flexible flat cable, and can be any type of signal cable such as a flat cable. Furthermore, the plurality of circuit elements 134 in this embodiment are discrete components such as resistors, capacitors, transistors, and coils, and are electronic components that protrude more than 0.4 mm from the second surface 132 of the circuit board 130.

[0076] Each first connecting portion 135 is arranged adjacent to each opening 133 and extends in the second direction D2. Each first connecting portion 135 is arranged side-by-side in the X direction. Each connecting terminal portion 247 extends in the second direction D2 when connected to the first connecting portion 135.

[0077] One of the two connectors 137 is configured on the +Y direction side relative to each of the first connecting portions 135, and the other of the two connectors 137 is configured on the -Y direction side relative to each of the first connecting portions 135. Each of the second connecting portions 136 is provided along each of the connectors 137. Furthermore, the configuration of the connectors 137 is not limited to the above-described configuration. For example, one of the two connectors 137 may be configured on the +X direction side relative to each of the first connecting portions 135, and the other of the two connectors 137 may be configured on the -X direction side relative to each of the first connecting portions 135.

[0078] Figure 14 A top view showing the structure of the cover component 120. Figure 15 for Figure 7 Sectional view along line XXV-XXV. Figure 16 for Figure 9 A magnified view of part A in the image. Figure 17 for Figure 10 A magnified view of part B in the image. Figure 14 The image shows the cover component 120 fixed to the retainer 140, and a portion of the retainer 140 is shown together with the cover component 120. Figure 15 In the diagram, the second surface 132 of the circuit board 130 is shown together with the cross-section of the cover component 120.

[0079] like Figure 14 as well as Figure 15 As shown, the main body 121 of the cover member 120 has a base 125, an outer peripheral wall 126, six first ribs 128, and two second ribs 129. Openings 123 for inserting signal cables KB are provided at the +Y direction side and the -Y direction side ends of the main body 121. The outer peripheral wall 126 of the cover member 120 is sometimes referred to as the "first outer peripheral wall".

[0080] like Figure 14 As shown, the base 125 is provided along a plane parallel to both the X and Y directions. Figure 15 As shown, when viewed in the +Z direction, the outer peripheral wall 126 is configured as a ring surrounding the outer periphery of the circuit board 130. Figure 9As shown, the outer peripheral wall 126 protrudes from the outer periphery of the base 125 in both the +Z and -Z directions. In this embodiment, the lower end of the outer peripheral wall 126 of the cover member 120 and the upper end of the outer peripheral wall 146 of the first retainer member 141 are fixed together by an epoxy adhesive. Alternatively, the adhesive used to bond the lower end of the outer peripheral wall 126 of the cover member 120 and the upper end of the outer peripheral wall 146 of the first retainer member 141 is sometimes referred to as a "second adhesive." The outer peripheral wall 126 of the cover member 120 and the outer peripheral wall 146 of the first retainer member 141 may also be fixed without adhesive, for example, by screws.

[0081] like Figure 9 As shown, each of the first ribs 128 protrudes from the base 125 toward the second surface 132 of the circuit board 130; in other words, it protrudes from the base 125 toward the +Z direction. Figure 10 As shown, each of the second ribs 129 protrudes from the base 125 toward the second surface 132 of the circuit board 130, in other words, from the base 125 toward the +Z direction.

[0082] like Figure 15 As shown, each first rib 128 is disposed on the inner side of the outer peripheral wall 126. Each first rib 128 is disposed along the second direction D2. Each first rib 128 is arranged side by side along the X direction. Each first rib 128 is configured as an elongated strip in the second direction D2. When viewed in the +Z direction, each first rib 128 is disposed at a position overlapping with each connecting terminal portion 247. Each first rib 128 is longer than each connecting terminal portion 247 in the second direction D2 and overlaps from one end of each connecting terminal portion 247 to the other end. When viewed in the +Z direction, each first rib 128 is disposed at a position that does not overlap with the plurality of circuit elements 134. In addition, although it is preferable that each first rib 128 is longer than each connecting terminal portion 247 in the second direction D2, it is also possible that it is shorter than each connecting terminal portion 247. While it is preferred that each of the first ribs 128 is positioned in a location that does not overlap with the circuit element 134 when viewed in the +Z direction, it may also be positioned in a location that overlaps with the circuit element 134.

[0083] like Figure 16As shown, with the outer peripheral wall 126 of the cover member 120 fixed to the outer peripheral wall 146 of the first retainer member 141, each of the first ribs 128 is arranged such that it is spaced apart by a first interval W1 relative to each of the connecting terminal portions 247. The first interval W1 is less than the distance Hmax, which is the distance from the tip of the circuit element 134 that protrudes most from the second surface 132 in the -Z direction (i.e., the largest protruding circuit element) to the second surface 132. The second interval W2, from the tip of the largest protruding circuit element to the surface of the cover member 120 opposite to the largest protruding circuit element, is greater than the first interval W1. In this embodiment, the first interval W1 is 0.49 mm or less. The distance Hmax from the tip of the largest protruding circuit element to the second surface 132 is 0.90 mm or more. The second interval W2 is 0.16 to 0.64 mm. Furthermore, with the outer peripheral wall 126 of the cover member 120 fixed to the outer peripheral wall 146 of the first retainer member 141, a portion of each of the first ribs 128 may also contact each of the connecting terminal portions 247. The first interval W1 may also be less than the distance Hmax from the top of the largest protruding circuit element to the second surface 132. The second interval W2 may also be less than or equal to the first interval W1.

[0084] An adhesive 161 is disposed between each of the first ribs 128 and each of the connecting terminal portions 247, and the first ribs 128 and the connecting terminal portions 247 are connected together by the adhesive 161. Preferably, the adhesive 161 is an insulating adhesive. Preferably, the hardness of the adhesive 161 is 70 degrees or more under type D of hardness tester hardness (JIS K 6253). More preferably, the hardness of the adhesive 161 is 80 degrees or more at 25 degrees Celsius. In this embodiment, the adhesive 161 is an epoxy adhesive. The adhesive 161 contains epoxy resin as the main agent and aliphatic amine, polyamide, or polythiol as the curing agent. In addition, the adhesive 161 is sometimes referred to as the "first adhesive". Although the adhesive 161 is preferably insulating, it may not be insulating. While the hardness of adhesive 161 is preferably 70 degrees or higher on the hardness tester under type D, it can also be less than 70 degrees under type D. Adhesive 161 can also be an adhesive other than an epoxy adhesive.

[0085] like Figure 15As shown, each of the second ribs 129 is disposed on the inner side of the outer peripheral wall 126. One of the two second ribs 129 is disposed on the +Y direction side relative to each of the first ribs 128, and the other of the two second ribs 129 is disposed on the -Y direction side relative to each of the first ribs 128. Each of the second ribs 129 is disposed along the X direction. Each of the second ribs 129 is configured as a strip in the X direction.

[0086] like Figure 17 As shown, with the outer peripheral wall 126 of the cover member 120 fixed to the outer peripheral wall 146 of the first retainer member 141, the second ribs 129 are arranged at intervals relative to the second surface 132 of the circuit board 130. Alternatively, with the outer peripheral wall 126 of the cover member 120 fixed to the outer peripheral wall 146 of the first retainer member 141, a portion of each of the second ribs 129 may be in contact with the second surface 132.

[0087] The connector 137 has a housing portion 138 for inserting the terminals of the signal cable KB, and a substrate connection portion 139 electrically connected to the second connection portion 136. The substrate connection portion 139 is disposed between the housing portion 138 and the second rib 129 in the Y direction. In addition, the substrate connection portion 139 may also overlap with the second rib 129 when viewed in the +Z direction.

[0088] An adhesive 162 is disposed between the second rib 129 and the second surface 132. The adhesive 162 covers at least a portion of the substrate connection portion 139. In this embodiment, the adhesive 162 covers the entire substrate connection portion 139. In this embodiment, the adhesive 162 is the same epoxy adhesive as the adhesive 161 disposed between the first rib 128 and the connection terminal portion 247. Alternatively, the adhesive 162 is sometimes referred to as a "third adhesive." The adhesive 162 may also be a different adhesive than the adhesive 161 disposed between the first rib 128 and the connection terminal portion 247.

[0089] Figure 18 This is a top view showing the structure of the filter unit 110. Figure 18 The filter unit 110 and the cover component 120 are shown together. In this embodiment, the filter unit 110 and the cover component 120 are joined and fixed together by the screw 101 at the position where they overlap with the circuit board 130 when viewed in the +Z direction. Alternatively, the filter unit 110 and the cover component 120 can also be joined and fixed together by the screw 101 at a position where they do not overlap with the circuit board 130 when viewed in the +Z direction.

[0090] Figure 19The image shows a bottom view of the abutment area Rc provided on the fixing plate 150. An abutment area Rc is provided on the +Z direction side of the fixing plate 150, where the ribs 56 of the cap 53 abut during pressing. In this embodiment, the abutment area Rc is provided to surround six openings 155. Each first rib 128 is disposed inside the abutment area Rc.

[0091] According to the liquid injection device 10 of this embodiment described above, since adhesive 161 is disposed between each of the first ribs 128 and the connection terminal portions 247 of each flexible wiring board 246, it is possible to suppress the adhesion of moisture in the atmosphere that intrudes into the space housing the circuit board 130 disposed between the cover member 120 and the first retainer member 141 to each connection terminal portion 247. Therefore, it is possible to suppress the occurrence of electrical defects at each connection terminal portion 247. Furthermore, the rigidity of the liquid injection head 100 can be improved by the six first ribs 128 provided on the cover member 120. Furthermore, since the first ribs 128 and the connecting terminals 247 are bonded together by adhesive 161, for example, when an external force along the Z direction is applied to the liquid injection head 100 during capping, the stress acting on the outer peripheral wall 126 of the cover member 120 and the outer peripheral wall 146 of the first retainer member 141 can be reduced compared to when the first ribs 128 and the connecting terminals 247 are not bonded, thus effectively suppressing deformation of the liquid injection head 100. Furthermore, compared to filling the space between the base 125 and the connecting terminals 247 with adhesive 161 without the first ribs 128, the amount of adhesive 161 can be reduced. Furthermore, since the first ribs 128 can be marked as positions for applying adhesive 161, the application of adhesive 161 can be facilitated.

[0092] Furthermore, in this embodiment, since the outer peripheral wall 126 of the cover member 120 and the outer peripheral wall 146 of the first retainer member 141 are bonded together with an adhesive, the intrusion of moisture into the space provided between the cover member 120 and the first retainer member 141 can be suppressed. Further, with the outer peripheral wall 126 of the cover member 120 and the outer peripheral wall 146 of the first retainer member 141 fixed, each of the first ribs 128 is arranged at intervals relative to each of the connecting terminal portions 247. Therefore, by contacting each of the first ribs 128 with each of the connecting terminal portions 247 when the outer peripheral wall 126 of the cover member 120 and the outer peripheral wall 146 of the first retainer member 141 are fixed, the generation of gaps between the outer peripheral wall 126 of the cover member 120 and the outer peripheral wall 146 of the first retainer member 141 can be suppressed.

[0093] Furthermore, in this embodiment, each of the first ribs 128 is elongated compared to each of the connecting terminal portions 247 in the second direction D2. Therefore, each of the connecting terminal portions 247 can be covered by adhesive 161 applied to the top of the first ribs 128 along the second direction D2. Furthermore, since each of the first ribs 128 is elongated compared to each of the connecting terminal portions 247, it is easy to ensure the rigidity of the cover member 120.

[0094] Furthermore, in this embodiment, the rigidity of the liquid injection head 100 can be improved by the second ribs 129 provided in the cover member 120. Further, since each second rib 129 extends along an X direction intersecting the second direction D2 extending from each first rib 128, the rigidity of the liquid injection head 100 can be improved in both the X direction and the second direction D2. In particular, in this embodiment, when viewed in the +Z direction, the second ribs 129 are disposed between each connection terminal portion 247 and the connector 137, and an adhesive 162 is disposed between the second ribs 129 and the second surface 132 of the circuit board 130. Therefore, it is possible to suppress the movement of moisture that enters from the opening 123 through which the signal cable KB passes to each connection terminal portion 247.

[0095] Furthermore, in this embodiment, with the outer peripheral wall 126 of the cover member 120 and the outer peripheral wall 146 of the holder 140 fixed, each of the second ribs 129 is arranged at a distance from the second surface 132 of the circuit board 130. Therefore, it is possible to suppress the situation where, when the outer peripheral wall 126 of the cover member 120 and the outer peripheral wall 146 of the first holder member 141 are fixed, a gap is created between the second ribs 129 and the second surface 132.

[0096] Furthermore, in this embodiment, at least a portion of the substrate connection portion 139 is covered by an adhesive 162 disposed between each of the second ribs 129 and the second surface 132. Therefore, it is possible to suppress electrical defects in the substrate connection portion 139 caused by moisture adhering to it.

[0097] Furthermore, in this embodiment, the cover member 120 includes a main body 121 having a plurality of first ribs 128, and the main body 121 is made of a thermoplastic resin or a thermosetting resin with the elastomer removed. Therefore, compared to the case where the first ribs 128 are made of flexible components, the deformation of the liquid injection head 100 caused when a force is applied to the liquid injection head 100 in the +Z or -Z direction can be suppressed by having rigid first ribs 128.

[0098] Furthermore, in this embodiment, the cover member 120 has a main body 121 formed of a thermoplastic resin or a thermosetting resin other than an elastomer, and an elastic sealing portion 122 formed of an elastomer. Therefore, while ensuring the rigidity of the cover member 120 through the main body 121, the elastic sealing portion 122 ensures a tight seal between the lower flow channel 116 of the filter unit 110 and the upper flow channel 147 of the holder 140. In particular, in this embodiment, since the cover member 120 is constructed with the main body 121 and the elastic sealing portion 122 integrated, the number of components in the liquid injection head 100 can be reduced.

[0099] Furthermore, in this embodiment, each liquid injection head 100 is equipped with a filter unit 110. Therefore, since foreign matter mixed into the ink can be captured by the filter 112, the mixing of foreign matter into the ink supplied to each head chip 200 can be suppressed.

[0100] Furthermore, in this embodiment, the filter unit 110 and the cover member 120 are joined and fixed by screws 101. Therefore, by providing each first rib 128 in the cover member 120, deformation of the cover member 120 due to the fixing force when the filter unit 110 is joined and fixed in the cover member 120 by screws 101 can be suppressed. In particular, in this embodiment, when viewed in the +Z direction, the filter unit 110 and the cover member 120 are joined and fixed by screws 101 at the position where they overlap with the circuit board 130. Therefore, since the filter unit 110 is joined and fixed to the cover member 120 near each first rib 128, the fixing force can be easily distributed on each first rib 128.

[0101] Furthermore, in this embodiment, each of the first ribs 128 does not overlap with each of the circuit elements 134 when viewed in the +Z direction. Therefore, it is possible to suppress the possibility of the first ribs 128 coming into contact with the circuit elements 134 and causing damage to the circuit elements 134.

[0102] Furthermore, in this embodiment, the first interval W1 between the first rib 128 and the connecting terminal portion 247 is less than the distance Hmax from the top of the largest protruding circuit element to the second surface 132. Therefore, since the first interval W1 can be reduced, the amount of adhesive 161 disposed between the first rib 128 and the connecting terminal portion 247 can be reduced.

[0103] Furthermore, in this embodiment, the second interval W2 from the top of the largest protruding circuit element to the surface of the cover member 120 opposite to the largest protruding circuit element is greater than the first interval W1. Therefore, even if the adhesive 161 is crushed due to deformation of the liquid injection head 100, causing the first rib 128 to approach the connecting terminal portion 247, contact between the largest protruding circuit element and the cover member 120 can be suppressed. Thus, damage to the largest protruding circuit element caused by contact with the cover member 120 can be suppressed.

[0104] Furthermore, in this embodiment, the adhesive 161 is an insulating adhesive. Therefore, since the insulation of the connection terminal portion 247 can be ensured, electrical defects in the connection terminal portion 247 can be suppressed.

[0105] Furthermore, in this embodiment, adhesive 161 is an epoxy adhesive. Therefore, the adhesive is less prone to crushing. In particular, in this embodiment, since the hardness of adhesive 161 is 70 degrees or higher under type D of hardness tester, the adhesive 161 can be reliably prevented from crushing.

[0106] Furthermore, although in this embodiment, the cap 53 moves relative to the spray surface in the Z direction and comes into contact with the spray surface to seal the spray surface, the rigidity of the liquid spray head 100 can be improved by providing the first rib 128 in the cover member 120, so the deformation of the liquid spray head 100 when the cap 53 comes into contact with the spray surface can be suppressed.

[0107] B. Other implementation methods:

[0108] (B1) Figure 20This is an explanatory diagram showing the contact area in another embodiment. In the liquid injection device 10 of the above embodiment, a cap 53 is provided relative to a liquid injection head 100, and a contact area Rc is provided on a fixing plate 150. Alternatively, multiple caps 53 may be provided relative to a liquid injection head 100, and multiple contact areas may be provided on a fixing plate 150. For example, as... Figure 20 As shown, the fixing plate 150 may also have abutment regions Rc1 arranged to surround three of the six openings 155 disposed on the -X direction side, and abutment regions Rc2 arranged to surround three of the six openings 155 disposed on the +X direction side. Each abutment region Rc1, Rc2 may also be configured to surround at least one of a plurality of projection images obtained by projecting each of the first ribs 128 perpendicularly onto the surface provided with each abutment region Rc1, Rc2. In other words, the region Ri, which is formed by connecting the ends of the projection images of each first rib 128 in the +Y direction direction, the second imaginary line LN2 connecting the ends of the projection images of each first rib in the -Y direction direction, the long side of the projection image of the first rib positioned closest to the -X direction direction among the six first ribs, and the long side of the projection image of the first rib positioned closest to the +X direction direction among the six first ribs in the +X direction direction, may also have a portion overlapping with the abutment regions Rc1 and Rc2. In this case, although by providing multiple abutment regions Rc1 and Rc2, it is easier to apply a force in the -Z direction to the liquid injection head 100 during capping, the force applied during capping can be dispersed by the individual first ribs 128, thus suppressing deformation of the liquid injection head 100.

[0109] (B2) In the liquid injection device 10 of the above embodiment, two second ribs 129 are provided in the cover member 120 of the liquid injection head 100. In contrast, the number of second ribs 129 provided in the cover member 120 may also be one. Alternatively, no second ribs 129 may be provided in the cover member 120.

[0110] (B3) In the liquid injection device 10 of the above embodiment, at least a portion of the substrate connection portion 139 of the connector 137 of the liquid injection head 100 is covered by adhesive 162. Alternatively, the substrate connection portion 139 may not be covered by adhesive 162.

[0111] (B4) In the liquid jetting device 10 of the above-described embodiment, the head chip 200 of the liquid jetting head 100, the connection terminal portion 247 of the flexible wiring board 246, the first connection portion 135 of the circuit board 130, and the first rib 128 of the cover member 120 extend in the second direction D2. Alternatively, the head chip 200 of the liquid jetting head 100, the connection terminal portion 247 of the flexible wiring board 246, the first connection portion 135 of the circuit board 130, and the first rib 128 of the cover member 120 may also extend in the Y direction.

[0112] (B5) In the liquid injection device 10 of the above embodiment, the filter unit 110 may not be provided in the liquid injection head 100.

[0113] (B6) The liquid injection device 10 of the above embodiment includes a capping mechanism 50. In contrast, the liquid injection device 10 may also not include a capping mechanism 50.

[0114] (B7) The liquid jetting device 10 of the above embodiment includes a suction mechanism 60. In contrast, the liquid jetting device 10 may also not include a suction mechanism 60.

[0115] (B8) The liquid jetting device 10 of the above embodiment includes a wiping mechanism 70. In contrast, the liquid jetting device 10 may also not include a wiping mechanism 70.

[0116] (B9) The liquid jetting device 10 of the above embodiment includes a conveying mechanism 40 for conveying the medium M. In contrast, in the liquid jetting device 10, the conveying mechanism 40 may not convey the medium M, but rather move the medium M relative to the head unit 30 by moving the head unit 30 along the Y direction.

[0117] (B10) The liquid jetting device 10 of the above embodiment is configured as a line printer. In contrast, the liquid jetting device 10 can also be configured as a serial printer. In this case, the liquid jetting device 10 may also include a carriage for holding the liquid jetting head 100 and reciprocating it along the X direction, which is orthogonal to the transport direction of the medium M, i.e., the +Y direction.

[0118] (B11) Figure 21 This is a first cross-sectional view showing the structure of the first liquid outlet Di1 of the head unit 30 in other embodiments. In the liquid injection device 10 of the various embodiments described above, it is also possible to replace... Figure 5 The pressure regulating valve 500 shown is installed within the distribution channel component 31 of the head unit 30. Figure 21The pressure regulating unit 600 is shown. The pressure regulating unit 600 includes a housing 610 and a flexible diaphragm member 620. Inside the housing 610, a buffer chamber 611, an inflow channel 612, and an outflow channel 613 are provided. The buffer chamber 611 is formed by sealing the opening of a recess provided on the housing 610 using the diaphragm member 620. The buffer chamber 611 communicates with an independent flow channel FP via the inflow channel 612 and with a first liquid outlet Di1 via the outflow channel 613. A supply needle 105 provided on the liquid injection head 100 is inserted into the first liquid outlet Di1. The inner diameter of the first liquid outlet Di1 and the outer diameter of the supply needle 105 are approximately the same. Ink flowing into the buffer chamber 611 from the inflow channel 612 is supplied to the liquid injection head 100 via the outflow channel 613. Since a portion of the inner wall of the buffer chamber 611 is made of a flexible thin film component 620, flexing occurs through the thin film component 620, thereby suppressing pressure fluctuations of the ink supplied to the liquid jet head 100.

[0119] (B12) Figure 22 This is a second cross-sectional view showing the structure of the first liquid outlet Di1 of the head unit 30 in another embodiment. In the liquid injection device 10 of the various embodiments described above, it is also possible that this is not provided. Figure 5 The pressure regulating valve 500 is shown. In this case... Figure 22 As shown, a supply needle 105, which is provided on the liquid injection head 100, is inserted into the first liquid outlet Di1, which is located at the end of the independent flow channel FP. The inner diameter of the first liquid outlet Di1 is approximately equal to the outer diameter of the supply needle 105.

[0120] (B13) Although in the various embodiments described above, the X and Y directions are parallel to the horizontal plane, and the +Z direction is the direction of gravity, this is not a limitation. For example, the direction in which liquid is ejected from nozzle N, i.e., the +Z direction, can also be a direction different from the direction of gravity, and the X and Y directions can also be directions that are not parallel to the horizontal plane.

[0121] C. Another approach:

[0122] This disclosure is not limited to the embodiments described above, and can be implemented in various ways without departing from its spirit. For example, this disclosure can also be implemented in the following ways. For the technical features in the above embodiments corresponding to the technical features in the various embodiments described below, appropriate substitutions or combinations can be implemented to solve part or all of the problems of this disclosure, or to achieve part or all of the effects of this disclosure. Furthermore, if a technical feature is not described as an essential feature in this specification, it can be appropriately deleted.

[0123] (1) According to a first aspect of this disclosure, a liquid injection head is provided. The liquid injection head comprises: a plurality of head chips that inject liquid in a first direction; a holder on which the plurality of head chips are fixed; a circuit board disposed relative to the holder in a direction opposite to the first direction; and a cover member disposed relative to the circuit board in a direction opposite to the first direction. Each of the plurality of head chips has a flexible wiring board having a connection terminal portion connected to the circuit board. The circuit board has a first surface mounted on the holder and a second surface opposite to the first surface and connected to the connection terminal portion. The cover member has a plurality of first ribs protruding toward the second surface of the circuit board. When viewed in the first direction, the plurality of first ribs are disposed at positions overlapping with each of the connection terminal portions of the plurality of head chips. A first adhesive is disposed between the plurality of first ribs and the connection terminal portions of the plurality of head chips.

[0124] According to this method of liquid injection head, since a first adhesive is disposed between the connection terminal portion of the flexible substrate connected to the circuit board disposed between the retainer and the cover member and the first rib of the cover member, it is possible to suppress the adhesion of moisture in the atmosphere that intrudes between the retainer and the cover member to the connection terminal portion. Therefore, it is possible to suppress the occurrence of electrical defects in the connection terminal portion. Furthermore, by providing the first rib in the cover member, the rigidity of the liquid injection head can be improved.

[0125] (2) In the liquid injection head of the above-described manner, the following manner may also be adopted, namely, the cover member has an annular first outer peripheral wall that surrounds the circuit board when viewed in the first direction, the retainer has a second outer peripheral wall that surrounds the circuit board when viewed in the first direction, the cover member and the retainer are fixed by bonding the first outer peripheral wall and the second outer peripheral wall with a second adhesive, and each of the plurality of first ribs is arranged in a spaced manner relative to the connecting terminal portion when the first outer peripheral wall and the second outer peripheral wall are fixed.

[0126] According to this liquid injection head, since the first and second outer peripheral walls are bonded together by a second adhesive, the intrusion of moisture between the retainer and the cover component can be suppressed. Furthermore, since the first rib is arranged at a distance from the connecting terminal portion when the first and second outer peripheral walls are fixed, gaps between the first and second outer peripheral walls due to contact between the first rib and the connecting terminal portion during fixing can be suppressed.

[0127] (3) In the liquid injection head of the above method, the following method can also be adopted, that is, the connecting terminal portion and the first rib extend in a second direction orthogonal to the first direction, and the first rib is longer than the connecting terminal portion in the second direction.

[0128] According to this method of liquid injection head, since the first rib is longer than the connecting terminal portion, the entire connecting terminal portion can be covered by a first adhesive disposed between the first rib and the connecting terminal portion. Furthermore, since the first rib is longer than the connecting terminal portion, the strength of the first rib is easily ensured.

[0129] (4) In the liquid injection head of the above method, the following method can also be adopted, that is, the connecting terminal portion and the first rib extend in a second direction orthogonal to the first direction, the plurality of head chips are arranged side by side in a third direction orthogonal to the first direction and intersecting the second direction, the connecting terminal portion of the plurality of head chips is arranged side by side in the third direction, and the plurality of first ribs are arranged side by side in the third direction.

[0130] According to this method, the rigidity of the liquid injection head can be increased in both the second and third directions.

[0131] (5) In the liquid injection head of the above-described manner, the following manner may also be adopted, namely, a connector for connecting a signal cable is disposed on the second surface of the circuit board, the cover member has an opening through which the signal cable is inserted and a second rib protruding toward the second surface of the circuit board, the second rib being disposed between the connection terminal portion of the plurality of head chips and the connector when viewed in the first direction, and a third adhesive being disposed between the second rib and the second surface of the circuit board.

[0132] According to this method of liquid injection head, the rigidity of the liquid injection head can be further improved by providing a second rib in the cover component. Furthermore, since a second rib is provided between the connector and the connection terminal of the signal cable, and a third adhesive is disposed between the second rib and the circuit board, it is possible to suppress the movement of moisture that enters from the opening through which the signal cable is inserted into the space where the connection terminal is disposed.

[0133] (6) In the liquid injection head of the above manner, the connector is also configured in a fourth direction orthogonal to the first direction and the third direction relative to the connection terminal portion of the plurality of head chips, and the second rib is a strip in the third direction.

[0134] According to this method, the rigidity of the liquid injection head can be effectively improved because the second rib extends along the arrangement direction of the plurality of first ribs.

[0135] (7) In the liquid injection head of the above-described manner, the following manner may also be adopted, namely, the cover member has an annular first outer peripheral wall surrounding the circuit board when viewed in the first direction, the retainer has an annular second outer peripheral wall surrounding the circuit board when viewed in the first direction, the cover member and the retainer are fixed by bonding the first outer peripheral wall and the second outer peripheral wall with a second adhesive, and the second rib is provided in a spaced manner relative to the second surface of the circuit board when the cover member is fixed on the retainer.

[0136] According to this liquid injection head, since the first and second outer peripheral walls are bonded together by a second adhesive, the intrusion of moisture into the holder and cover component can be suppressed. Furthermore, since the second rib is arranged spaced apart from the second surface of the circuit board while the first and second outer peripheral walls are fixed, gaps between the first and second outer peripheral walls due to contact between the second rib and the second surface during fixing can be suppressed.

[0137] (8) In the liquid injection head of the above manner, the connector may also have the following structure, namely, the connector has a housing portion into which the terminal of the signal cable is inserted and a substrate connection portion electrically connected to the circuit board, the substrate connection portion being disposed between the housing portion and the second rib when viewed in the first direction, and the third adhesive covering at least a portion of the substrate connection portion.

[0138] According to this liquid jet head, since at least a portion of the substrate connection portion of the connector is covered by a third adhesive, it is possible to suppress the electrical defects that occur in the connector due to moisture adhering to the substrate connection portion.

[0139] (9) In the liquid injection head of the above-mentioned manner, the following manner may also be adopted, namely, the cover part has a main body part, the main body part has the plurality of first ribs, and the main body part is made of thermoplastic resin or thermosetting resin other than an elastomer.

[0140] According to this method, compared to the case where the first rib is made of a flexible component, the deformation of the liquid jet head caused by the application of force to the liquid jet head in the first direction or the opposite direction to the first direction can be suppressed by the rigid first rib.

[0141] (10) In the liquid injection head of the above-described manner, the liquid injection head may also be provided in the following manner: the liquid injection head further includes a flow channel component disposed in the opposite direction to the first direction relative to the cover component; the flow channel component has a first flow channel portion and a first flow channel tube that forms part of the first flow channel portion and protrudes toward the retainer; the retainer has a second flow channel portion that communicates with the first flow channel portion and supplies the liquid to the plurality of head chips, and a second flow channel tube that forms part of the second flow channel portion and protrudes toward the flow channel component; the cover component includes an elastic sealing portion into which the first flow channel tube and the second flow channel tube are inserted; the main body portion and the elastic sealing portion are provided as an integral part.

[0142] According to this method, the liquid injection head can ensure the rigidity of the cover component through the main body, while ensuring the sealing between the first flow channel tube and the second flow channel tube through the elastic sealing component. Furthermore, since the main body and the elastic sealing component are provided as a single unit, the number of components of the liquid injection head can be reduced.

[0143] (11) In the liquid injection head of the above manner, the liquid injection head may also be provided with a flow channel component disposed in a direction opposite to the first direction relative to the cover component, and the flow channel component and the cover component are joined and fixed by screws.

[0144] According to this method of liquid injection head, since a first rib is provided in the cover component, it is possible to suppress the deformation of the cover component caused by the fixing force when the flow channel component is fixed relative to the cover component by using screws.

[0145] (12) In the liquid injection head of the above method, the flow channel component and the cover component are also connected and fixed by the screw at the position where they overlap with the circuit board when viewed in the first direction.

[0146] According to this liquid injection head, since the flow channel component and the cover component are joined and fixed by screws at a position close to the first rib, i.e., at the position overlapping with the circuit board, the deformation of the cover component caused by the joining and fixing force when the flow channel component is joined and fixed relative to the cover component by screws can be effectively suppressed.

[0147] (13) In the liquid injection head of the above manner, the flow channel component may also be provided with a filter through which the liquid passes.

[0148] (14) In the liquid jet head of the above method, the following method can also be adopted, that is, a plurality of circuit elements are provided on the second surface of the circuit board, and the plurality of first ribs do not overlap with the plurality of circuit elements when viewed in the first direction.

[0149] The liquid injection head according to this method can suppress damage to the circuit elements caused by the first rib coming into contact with the circuit elements.

[0150] (15) In the liquid injection head of the above manner, the first rib is also configured such that, with the cover member fixed on the retainer, the first rib is spaced apart from the connecting terminal portion by a first interval, the first interval being less than the distance from the top of the largest protruding circuit element that protrudes most from the second surface of the circuit board to the second surface among the plurality of circuit elements.

[0151] According to this liquid injection head, since the first gap between the first rib and the connecting terminal portion can be reduced, the amount of the first adhesive disposed between the first rib and the connecting terminal portion can be reduced.

[0152] (16) In the liquid injection head of the above manner, the second interval from the top of the maximum protruding circuit element to the surface of the cover member opposite the maximum protruding circuit element is greater than the first interval.

[0153] According to this liquid injection head, it is possible to suppress the contact between the most protruding circuit element and the cover member when the first adhesive is crushed due to deformation of the liquid injection head, thereby reducing the distance between the first rib and the connecting terminal. Therefore, damage to the most protruding circuit element caused by contact with the cover member can be suppressed.

[0154] (17) In the liquid spray head of the above method, the following method may also be adopted, that is, the first adhesive is an adhesive with insulating properties.

[0155] According to this method of liquid injection head, since the insulation of the connection terminal portion can be ensured, electrical defects in the connection terminal portion can be suppressed.

[0156] (18) In the liquid injection head of the above method, the first adhesive can also be an epoxy adhesive.

[0157] The liquid jet nozzle of this method makes it difficult for the first adhesive to be crushed.

[0158] (19) In the liquid injection head of the above method, the following method may also be adopted, that is, the hardness of the first adhesive is 70 degrees or more under the type D of the hardness of the hardness tester.

[0159] The liquid jet nozzle of this method makes it difficult for the first adhesive to be crushed.

[0160] (20) According to a second aspect of this disclosure, a liquid injection device is provided. The liquid injection device includes a liquid injection head and a cap as described in the first aspect. The liquid injection head has a spray surface for spraying the liquid, and the cap seals the spray surface by moving relative to the spray surface in a direction opposite to the first direction and abutting against the spray surface.

[0161] According to this liquid injection device, since a first adhesive is disposed between the connection terminal portion of the flexible substrate connected to the circuit board disposed between the retainer and the cover member and the first rib of the cover member, it is possible to suppress the adhesion of moisture in the atmosphere that intrudes between the retainer and the cover member to the connection terminal portion. Therefore, it is possible to suppress the occurrence of electrical defects in the connection terminal portion. Furthermore, since the rigidity of the liquid injection head can be increased by providing the first rib in the cover member, it is possible to suppress the deformation of the liquid injection head when the cap abuts against the injection surface.

[0162] (21) In the liquid injection device of the above manner, the following manner may also be adopted, namely, having a liquid injection head of the first manner described above and a plurality of caps, wherein the liquid injection head has a spray surface for spraying the liquid, and the plurality of caps are relatively moved relative to the spray surface in a direction opposite to the first direction and abut against the spray surface to seal the spray surface, wherein a plurality of abutment areas are provided on the spray surface for the plurality of caps to abut against, and each of the plurality of abutment areas is configured to surround at least one of a plurality of projection images formed by vertically projecting each of the plurality of first ribs onto the spray surface.

[0163] According to this liquid injection device, it is possible to suppress the adhesion of moisture from the atmosphere that intrudes between the retainer and the cover component to the connecting terminal portion. Furthermore, it is possible to effectively suppress the deformation of the liquid injection head when each cap comes into contact with the injection surface.

[0164] (22) In the liquid injection device of the above manner, it is also possible to adopt the following manner, that is, to have the liquid injection head of the first manner described above and the signal cable connected to the connector.

[0165] According to this method of liquid injection device, when a signal cable is provided, it is possible to suppress the adhesion of moisture in the atmosphere that has entered between the retainer and the cover component to the connection terminal, and to improve the rigidity of the liquid injection head.

[0166] (23) In the liquid injection device of the above manner, it may also be adopted in the following manner, that is, it has a liquid injection head of the first manner described above and a conveying mechanism for conveying the medium.

[0167] According to this method of liquid injection device, in the case of having a conveying mechanism, it is possible to suppress the adhesion of moisture in the atmosphere that intrudes between the holder and the cover component to the connecting terminal portion, and to improve the rigidity of the liquid injection head.

[0168] This disclosure can also be implemented in various ways other than by a liquid injection head. For example, it can be implemented by a liquid injection device, a head unit, etc.

[0169] Symbol Explanation

[0170] 10…Liquid injection device; 15…Control unit; 20…Liquid container; 30…Head unit; 40…Conveying mechanism; 50…Capping mechanism; 60…Suction mechanism; 70…Wiping mechanism; 100…Liquid injection head; 101…Screw; 110…Filter unit; 111…Flow channel component; 112…Filter; 120…Cover component; 121…Main body; 122…Elastic sealing part; 123…Opening; 128…First rib; 129…Second rib 130…Circuit board; 134…Circuit element; 135…First connection part; 136…Second connection part; 137…Connector; 138…Carrier part; 139…Board connection part; 140…Retainer; 141…First retainer component; 142…Second retainer component; 143…Third retainer component; 150…Fixing plate; 161-162…Adhesive; 200…Head chip; 246…Flexible wiring board; 247…Connecting terminal part.

Claims

1. A liquid injection head, comprising: Multiple head chips that spray liquid in a first direction; A retainer on which the plurality of head chips are fixed; A circuit board, which is configured relative to the holder in a direction opposite to the first direction; A cover component, which is configured relative to the circuit board in a direction opposite to the first direction. Each of the multiple head chips has a flexible wiring substrate. The flexible wiring substrate has a connection terminal portion that connects to the circuit board. The circuit board has a first side that is mounted on the holder, and a second side that is opposite to the first side and connected to the connection terminal portion. The cover component has a plurality of first ribs protruding toward the second surface of the circuit board. When viewed in the first direction, the plurality of first ribs are positioned at each overlapping location with the connection terminal portion of the plurality of head chips. In the first direction, a first adhesive is disposed between each of the plurality of first ribs and each of the connection terminal portions of the plurality of head chips.

2. The liquid injection head as claimed in claim 1, wherein, The cover component has an annular first outer peripheral wall that surrounds the circuit board when viewed in the first direction. The retainer has a second outer peripheral wall that surrounds the circuit board when viewed in the first direction. The cover component and the retainer are fixed by bonding the first outer peripheral wall and the second outer peripheral wall together using a second adhesive. Each of the plurality of first ribs is configured to be spaced apart relative to the connecting terminal portion while the first outer peripheral wall and the second outer peripheral wall are fixed.

3. The liquid injection head as described in claim 1 or 2, wherein, The connecting terminal portion and the first rib extend in a second direction orthogonal to the first direction. The first rib is longer than the connecting terminal portion in the second direction.

4. The liquid injection head as claimed in claim 1, wherein, The connecting terminal portion and the first rib extend in a second direction orthogonal to the first direction. The plurality of head chips are arranged side by side in a third direction, orthogonal to the first direction and intersecting the second direction. The connection terminals of the plurality of head chips are arranged side by side facing upwards on the third side. The plurality of first ribs are arranged side by side in the direction of the third party.

5. The liquid injection head as described in claim 4, wherein, A connector for connecting a signal cable is disposed on the second surface of the circuit board. The cover component has an opening through which the signal cable is inserted, and a second rib protruding toward the second surface of the circuit board. When viewed in the first direction, the second rib is positioned between the connection terminal portion of the plurality of head chips and the connector. A third adhesive is disposed between the second rib and the second surface of the circuit board.

6. The liquid injection head as claimed in claim 5, wherein, The connector is configured relative to the connection terminals of the plurality of head chips in a fourth direction orthogonal to both the first direction and the third direction. The second rib is a long strip in the direction of the third party.

7. The liquid injection head as claimed in claim 5 or claim 6, wherein, The cover component has an annular first outer peripheral wall that surrounds the circuit board when viewed in the first direction. The retainer has an annular second outer peripheral wall that surrounds the circuit board when viewed in the first direction. The cover component and the retainer are fixed by bonding the first outer peripheral wall and the second outer peripheral wall together using a second adhesive. The second rib is provided at a distance from the second surface of the circuit board while the cover component is fixed to the retainer.

8. The liquid injection head as claimed in claim 5, wherein, The connector has a housing portion into which the terminals of the signal cable are inserted, and a substrate connection portion electrically connected to the circuit board. When viewed in the first direction, the substrate connecting portion is positioned between the housing portion and the second rib. The third adhesive covers at least a portion of the substrate connection portion.

9. The liquid injection head as claimed in claim 1, wherein, The cover component includes a main body portion, and the main body portion has the plurality of first ribs. The main body is made of a thermoplastic resin or a thermosetting resin other than an elastomer.

10. The liquid injection head as claimed in claim 9, wherein, The liquid injection head also includes a flow channel component that is configured in a direction opposite to the first direction relative to the cover component. The flow channel component has a first flow channel portion and a first flow channel tube that forms part of the first flow channel portion and protrudes toward the cage. The retainer has a second flow channel portion that communicates with the first flow channel portion and supplies the liquid to the plurality of head chips, and a second flow channel tube that forms part of the second flow channel portion and protrudes toward the flow channel component. The cover component includes a resilient sealing portion into which the first flow channel tube and the second flow channel tube are inserted. The main body and the elastic sealing part are configured as a single unit.

11. The liquid injection head as claimed in claim 1, wherein, The liquid injection head also includes a flow channel component that is configured in a direction opposite to the first direction relative to the cover component. The flow channel component and the cover component are joined and fixed together by screws.

12. The liquid injection head as claimed in claim 11, wherein, When viewed in the first direction, the flow channel component and the cover component are joined and fixed by the screws at the position where they overlap with the circuit board.

13. The liquid injection head according to any one of claims 10 to 12, wherein, The flow channel component has a filter through which the liquid passes.

14. The liquid injection head as claimed in claim 1, wherein, On the second surface of the circuit board, a plurality of circuit elements are disposed. When viewed in the first direction, the plurality of first ribs do not overlap with the plurality of circuit elements.

15. The liquid injection head as claimed in claim 14, wherein, With the cover component fixed to the retainer, the first rib is configured to be spaced apart by a first interval relative to the connecting terminal portion. The first interval is less than the distance from the top of the largest protruding circuit element that protrudes most from the second surface of the circuit substrate to the second surface among the plurality of circuit elements.

16. The liquid injection head as claimed in claim 15, wherein, The second interval from the top of the largest protruding circuit element to the surface of the cover member opposite the largest protruding circuit element is greater than the first interval.

17. The liquid injection head as claimed in claim 1, wherein, The first adhesive is an insulating adhesive.

18. The liquid injection head as claimed in claim 1, wherein, The first adhesive is an epoxy adhesive.

19. The liquid injection head as claimed in claim 1, wherein, The hardness of the first adhesive is 70 degrees or higher under the type D of the hardness tester.

20. A liquid injection device, comprising: The liquid injection head according to any one of claims 1 to 19; Cap, The liquid injection head has a spray surface for spraying the liquid. The cap seals the spray surface by moving relative to the spray surface in a direction opposite to the first direction and abutting against the spray surface.

21. A liquid injection device, comprising: The liquid injection head according to any one of claims 1 to 19; Multiple caps, The liquid injection head has a spray surface for spraying the liquid. The plurality of caps seal the spray surface by moving relative to the spray surface in a direction opposite to the first direction and abutting against the spray surface. The spray surface is provided with multiple contact areas for the multiple caps to contact. Each of the plurality of contact areas is configured to surround at least one of a plurality of projected images formed by vertically projecting each of the plurality of first ribs onto the jet surface.

22. A liquid injection device, comprising: The liquid injection head according to any one of claims 5 to 8; The signal cable connected to the connector.

23. A liquid injection device, comprising: The liquid injection head according to any one of claims 1 to 19; A conveying mechanism that transports media.

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