Electronic components and electronic component modules

Abstract

An electronic component and an electronic component module are provided that enable an aesthetically pleasing appearance. The electronic component comprises: a glass body containing a photosensitizer; a conductor disposed in the glass body and serving as at least part of an electrical element; terminal electrodes disposed above the outer surface of the glass body, electrically connected to the conductor, and serving as terminals of the electrical element; and an insulating film disposed above the outer surface of the glass body, reflecting or absorbing light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body.

Description

Technical Field

[0001] This invention relates to electronic components and electronic component modules. Background Technology

[0002] Conventionally, as an electronic component, there is the component described in US2011 / 0195360 (Patent Document 1). This electronic component has photosensitive glass. It is assumed that at least a portion of the electronic component is covered with a resin different from the photosensitive glass. The optical properties of the resin are not specified.

[0003] Patent Document 1: US2011 / 0195360

[0004] However, in the aforementioned conventional electronic components, because they contain photosensitive glass, for example, when the electronic component is exposed to ultraviolet light, Ce in the photosensitive glass will... 3+ Photosensitive glass can become discolored (yellown) due to photo-oxidation. This discoloration is considered a defect during the visual inspection of electronic components. Summary of the Invention

[0005] Therefore, this disclosure provides electronic components and electronic component modules that can improve appearance.

[0006] To solve the above-mentioned problems, an electronic component as one aspect of this disclosure includes:

[0007] Vitreous humor, containing photosensitizer;

[0008] A conductor is disposed in the aforementioned glass body and serves as at least a part of an electrical component;

[0009] Terminal electrodes, disposed above the outer surface of the aforementioned glass body, are electrically connected to the aforementioned conductor and serve as terminals of the aforementioned electrical components; and

[0010] An insulating film is disposed above the outer surface of the glass body and reflects or absorbs light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body.

[0011] Here, "outer surface of the vitreous body" refers not only to the surface of the vitreous body facing the outer periphery, but also to the surface that forms the boundary between the outer and inner sides of the vitreous body. In addition, "above the outer surface" is not an absolute direction such as vertically above as defined by the direction of gravity, but refers to the direction towards the outer side of the outer and inner sides that the outer surface is used as a reference.

[0012] In addition, "above" relative to a certain element includes not only the position above that element that is separate from it, that is, the position above that element via other objects or the position above that element that is separated by a gap, but also the position directly above that element that is in contact with it.

[0013] According to the above method, even if light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass irradiates the electronic component, the amount of light irradiating the glass can be reduced because the insulating film reflects or absorbs the light. Therefore, the photooxidation of the photosensitizer contained in the glass due to the light can be reduced, and discoloration caused by photooxidation of the glass can be minimized. Thus, the electronic component can have a good appearance.

[0014] In one preferred embodiment of the electronic component,

[0015] The aforementioned outer surface includes a bottom surface, which is one of the main surfaces of the aforementioned glass body, and a top surface located on the back side of the aforementioned bottom surface.

[0016] The terminal electrodes are disposed at least above the bottom surface, and the insulating film is disposed at least above the top surface.

[0017] According to the above embodiment, after the bottom surface of the glass body of the electronic component is mounted on the mounting substrate, the electronic component receives light from the top surface of the glass body. However, since the insulating film is disposed on at least the top surface of the glass body, discoloration of the glass body can be reduced.

[0018] In one preferred embodiment of the electronic component,

[0019] The aforementioned outer surface includes multiple side surfaces connecting the aforementioned bottom surface and the aforementioned top surface.

[0020] The insulating film is also disposed above at least a portion of the bottom surface and the side surface.

[0021] According to the above embodiments, discoloration of the glass can be reduced even before the electronic components are mounted on the mounting substrate.

[0022] In one preferred embodiment of the electronic component,

[0023] The insulating film described above has at least one of the following characteristics: (i), (ii), and (iii).

[0024] (i) The insulating material that serves as the substrate contains microparticles with a refractive index different from that of the substrate.

[0025] (ii) Layering low-refractive-index insulating materials and high-refractive-index insulating materials

[0026] (iii) Materials containing a band gap or HOMO-LUMO band gap that has a smaller energy required for photosensitization than that of a photosensitizer in a vitreous body.

[0027] According to the above embodiments, it is possible to reduce the discoloration of the vitreous body caused by light irradiation.

[0028] In one preferred embodiment of the electronic component,

[0029] The insulating film described above has at least one of the following characteristics: (iv), (v), and (vi).

[0030] (iv) The insulating material serving as the substrate contains microparticles with a refractive index different from that of the substrate.

[0031] (v) Layering low-refractive-index insulating materials and high-refractive-index insulating materials

[0032] (vi) A material containing a photosensitizer after photosensitization with an absorption wavelength of λ [nm] and having a band gap of 1240 / λ [eV] or a HOMO-LUMO band gap.

[0033] According to the above embodiments, it is possible to reduce discoloration of the glass caused by light irradiation. In addition, even if discoloration is assumed to occur in the glass, it is possible to reduce the appearance of discoloration when observing the glass through an insulating film.

[0034] Preferably, in one embodiment of the electronic component, the photosensitizer comprises one or more lanthanide elements.

[0035] According to the above embodiments, compared with organic photosensitizers, it can be easily mixed with glass.

[0036] In one embodiment of the electronic component, the photosensitizer contains cerium.

[0037] According to the above embodiments, it is the cheapest among lanthanide photosensitizers.

[0038] In one preferred embodiment of the electronic component,

[0039] The conductor described above has an outer surface conductor disposed above the outer surface.

[0040] The aforementioned insulating film includes a portion directly above the conductor that is in contact with and directly above the outer surface conductor, and a portion directly above the glass that is in contact with and directly above the glass body.

[0041] The thickness of the portion directly above the conductor is thinner than the thickness of the portion directly above the glass.

[0042] According to the above embodiment, the insulating film is disposed not only above the glass body but also above the outer surface conductor, so the formation of the insulating film is easy. In addition, since the thickness of the portion directly above the conductor is thinner than the thickness of the portion directly above the glass, the size of the electronic component can be miniaturized.

[0043] Preferably, in one embodiment of the electronic component, the thickness of the portion directly above the glass is greater than the thickness of the outer surface conductor.

[0044] According to the above embodiments, discoloration of the vitreous body can be further reduced.

[0045] In one preferred embodiment of the electronic component,

[0046] The conductor described above has an outer surface conductor disposed above the outer surface.

[0047] The aforementioned insulating film includes a portion directly above the conductor that is in contact with and located directly above the outer surface conductor.

[0048] The portion directly above the conductor has a hole that opens onto the outer surface conductor, and the entire inner periphery of the hole on the outer surface conductor side is located directly above the outer surface conductor.

[0049] According to the above embodiment, when forming holes in the insulating film, only the holes formed in the insulating film on the outer surface conductor can be removed. Therefore, it is possible to reliably suppress the exposure of the glass near the outer surface conductor due to deviations during hole formation, further reducing discoloration of the glass. Furthermore, especially when the insulating film is formed using photolithography, even if the photosensitive wavelength of the insulating film is the same as the photosensitive wavelength of the photosensitizer, the irradiated light will not reach the glass because it is blocked by the outer surface conductor. Therefore, discoloration of the glass can be reduced.

[0050] In one preferred embodiment of the electronic component,

[0051] The insulating film includes a portion directly above the terminal electrode that is in contact with the terminal electrode.

[0052] The portion directly above the terminal has a hole that opens onto the terminal electrode, and the entire inner periphery of the hole on the terminal electrode side is located directly above the terminal electrode.

[0053] According to the above embodiment, when forming holes in the insulating film, only the holes formed in the insulating film on the terminal electrode can be removed. Therefore, it is possible to reliably suppress the exposure of the glass near the terminal electrode due to deviations during hole formation, and further reduce discoloration of the glass. In addition, especially when the insulating film is formed using photolithography, even if the photosensitive wavelength of the insulating film is the same as the photosensitive wavelength of the photosensitizer, the irradiated light will not reach the glass because it is blocked by the terminal electrode. Therefore, discoloration of the glass can be reduced.

[0054] In one preferred embodiment of the electronic component,

[0055] The conductor described above has an outer surface conductor disposed above the outer surface.

[0056] The surface roughness of the interface between the insulating film and the glass body is greater than the surface roughness of the interface between the outer surface conductor and the glass body.

[0057] According to the above embodiments, the effect of reducing discoloration of the glass can be maintained without deteriorating the high-frequency characteristics of the electronic components.

[0058] Preferably, in one embodiment of the electronic component, the surface roughness of the interface between the insulating film and the glass body is greater than the surface roughness of the interface between the terminal electrode and the glass body.

[0059] According to the above embodiments, the effect of reducing discoloration of the glass can be maintained without deteriorating the high-frequency characteristics of the electronic components.

[0060] In one preferred embodiment of the electronic component,

[0061] It also includes an anchoring portion protruding from the terminal electrode into the interior of the glass body.

[0062] On a cross section orthogonal to the extension direction of the anchoring portion, at least a portion of the outer periphery of the anchoring portion includes a curved surface.

[0063] According to the above implementation method, it is not easy to cause local stress concentration in the anchoring part.

[0064] In addition, the electronic component module, as one aspect of this disclosure, includes:

[0065] Mounting substrate; and

[0066] The aforementioned electronic components are mounted on the aforementioned mounting substrate.

[0067] According to the above method, it is possible to realize an electronic component module with an attractive appearance.

[0068] In one preferred embodiment of the electronic component module, a sealing resin is further provided to seal the electronic component and to reflect or absorb light in the photosensitive wavelength region corresponding to the photosensitizer contained in the glass body of the electronic component.

[0069] According to the above embodiments, the discoloration of electronic components when mounting electronic components on a mounting substrate can be reduced more reliably.

[0070] In addition, the electronic component module, as one aspect of this disclosure, includes:

[0071] Mounting substrate;

[0072] Electronic components, mounted on the aforementioned mounting substrate; and

[0073] Sealing resin is used to seal the aforementioned electronic components.

[0074] The above-mentioned electronic components include:

[0075] Vitreous humor, containing photosensitizer;

[0076] A conductor, disposed within the aforementioned glass body, and serving as at least a portion of an electrical component; and

[0077] Terminal electrodes are disposed above the outer surface of the glass body, electrically connected to the conductor, and serve as terminals of the electrical components.

[0078] The aforementioned sealing resin reflects or absorbs light in the photosensitive wavelength range of the photosensitizer contained in the aforementioned glass body, which corresponds to the aforementioned electronic component.

[0079] According to the above method, it is possible to realize an electronic component module with an attractive appearance.

[0080] According to the electronic components and electronic component modules that are one aspect of this disclosure, a good appearance can be achieved. Attached Figure Description

[0081] Figure 1 This is a schematic perspective view of the inductor component of the first embodiment as viewed from the bottom side.

[0082] Figure 2 This is a schematic perspective view of the inductor component of the first embodiment as viewed from the top side.

[0083] Figure 3 This is a schematic cross-sectional view of a part of an inductor component.

[0084] Figure 4 This is a schematic cross-sectional view showing a modified example of the outer surface conductor and insulating film.

[0085] Figure 5 This is a schematic cross-sectional view showing a modified example of the terminal electrode and the insulating film.

[0086] Figure 6 This is a schematic cross-sectional view showing a modified example of a terminal electrode.

[0087] Figure 7A This is a schematic sectional view showing a modified example of the anchoring part.

[0088] Figure 7B This is a schematic sectional view showing a modified example of the anchoring part.

[0089] Figure 8 This is a schematic cross-sectional view showing a modified example of the insulating film.

[0090] Figure 9 This is a magnified view of the area near the outer surface conductor.

[0091] Figure 10 This is a schematic cross-sectional view showing a modified example of the insulating film.

[0092] Figure 11A This is a schematic cross-sectional view illustrating the manufacturing method of the holes in the insulating film.

[0093] Figure 11B This is a schematic cross-sectional view illustrating the manufacturing method of the holes in the insulating film.

[0094] Figure 11C This is a schematic cross-sectional view illustrating the manufacturing method of the holes in the insulating film.

[0095] Figure 12 This is a schematic cross-sectional view showing a modified example of the perforation in the insulating film.

[0096] Figure 13 This is a schematic cross-sectional view showing a modified example of the terminal electrode and the insulating film.

[0097] Figure 14A This is a schematic cross-sectional view illustrating the manufacturing method of the holes in the insulating film.

[0098] Figure 14B This is a schematic cross-sectional view illustrating the manufacturing method of the holes in the insulating film.

[0099] Figure 14C This is a schematic cross-sectional view illustrating the manufacturing method of the holes in the insulating film.

[0100] Figure 14D This is a schematic cross-sectional view illustrating the manufacturing method of the holes in the insulating film.

[0101] Figure 14E This is a schematic cross-sectional view illustrating the manufacturing method of the holes in the insulating film.

[0102] Figure 15 This is a schematic cross-sectional view showing a modified example of the perforation in the insulating film.

[0103] Figure 16 This is a schematic cross-sectional view showing a deformation example near the outer surface conductor.

[0104] Figure 17 This is a schematic cross-sectional view of the capacitor component according to the second embodiment.

[0105] Figure 18 This is a schematic cross-sectional view of the electronic component module according to the third embodiment.

[0106] Figure 19 This is a schematic cross-sectional view of the electronic component module according to the fourth embodiment.

[0107] Explanation of reference numerals in the attached figures

[0108] 1, 1A…Inductor component (electronic component), 2…Capacitor component (electronic component), 5, 5A…Electronic component module, 6…Sealing resin, 7…Mounting substrate, 10…Glass body, 11, 21…Outer surface conductor, 11b…Bottom surface conductor, 11t…Top surface conductor, 12, 22…Terminal electrodes, 13, 23…Through wiring, 14, 24…Insulating film, 21b…Bottom surface plate electrode, 21t…Top surface plate electrode, 100…Outer surface, 100b…Bottom surface, 100t…Top surface, 100s…Side surface, 110…Wound wiring (conductor), 121, 221…First terminal electrode, 122… 222…Second terminal electrode, 123…Anchoring part, 131…Through-hole conductor, 141…Above part of conductor, 141a…Hole, 141b…Inner periphery, 142…Above part of glass, 143…Above part of terminal, 143a…Hole, 143b…Inner periphery, AX…Wrapping shaft, Cap…Capacitor element, L…Inductor element, V…Through hole, t…(Thickness of outer surface conductor), t1…(Thickness of the portion above conductor), t2…(Thickness of the portion above glass), S1…(Interface between insulating film and glass), S2…(Interface between outer surface conductor and glass). Detailed Implementation

[0109] Hereinafter, an electronic component and an electronic component module, as one embodiment of the present disclosure, will be described in detail with reference to the illustrated embodiments. Furthermore, some of the accompanying drawings are schematic and do not reflect actual dimensions or proportions.

[0110] <First Implementation>

[0111] The inductor component 1 of the first embodiment will be described below. Figure 1 This is a schematic perspective view of inductor component 1 as seen from the bottom side. Figure 2 This is a schematic perspective view of the inductor component 1 as viewed from the top side.

[0112] 1. Overview

[0113] The general structure of inductor component 1 will be described. Inductor component 1 is, for example, a surface-mount type electronic component that includes an inductor element L for a high-frequency signal transmission circuit as an electrical element. Inductor component 1 includes a glass body 10 containing a photosensitizer, a wound wiring 110 disposed on the glass body 10 and serving as at least a part of the inductor element L, i.e., a conductor, a terminal electrode 12 disposed above the outer surface 100 of the glass body 10 and electrically connected to the wound wiring 110 as a terminal of the inductor element L, and an insulating film 14 disposed above the outer surface 100 of the glass body 10 and reflecting or absorbing light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body 10.

[0114] With the above configuration, even if light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body 10 irradiates the inductor component 1, the amount of light irradiating the glass body 10 can be reduced because the insulating film 14 reflects or absorbs the light. Therefore, the photooxidation of the photosensitizer contained in the glass body 10 due to the light can be reduced, and discoloration caused by photooxidation of the glass body 10 can be decreased. Thus, the inductor component 1 can have a good appearance.

[0115] Additionally, the outer surface 100 of the glass body 10 includes a bottom surface 100b, which is one of the main surfaces of the glass body 10, and a top surface 100t located on the back side of the bottom surface 100b. The terminal electrode 12 is disposed at least above the bottom surface 100b, and the insulating film 14 is disposed at least above the top surface 100t.

[0116] With the above configuration, after the bottom surface 100b side of the glass body 10 of the inductor component 1 is mounted on the mounting substrate, the inductor component 1 is irradiated by light from the top surface 100t side of the glass body 10. However, since the insulating film 14 is disposed on at least the top surface 100t of the glass body 10, the discoloration of the glass body 10 can be reduced.

[0117] Furthermore, as shown in the attached figures, for ease of explanation, the direction along the long side of the glass body 10, specifically the direction from one terminal electrode 12 (first terminal electrode 121) towards the other terminal electrode 12 (second terminal electrode 122), is designated as the X direction. Additionally, the direction orthogonal to the X direction, from the bottom surface 100b towards the top surface 100t, is designated as the Z direction, and the direction orthogonal to both the X and Z directions, forming a right-handed system when arranged in the order X, Y, Z, is designated as the Y direction. Furthermore, without considering direction, directions parallel to the X, Y, and Z directions are sometimes referred to as the L direction, W direction, and T direction, respectively.

[0118] 2. Composition of each part

[0119] (Vitreous body 10)

[0120] like Figure 1 and Figure 2 As shown, the glass body 10 functions as an insulator and structural element of the inductor component 1. The glass body 10 contains a photosensitizer, preferably a photosensitive glass body represented by Foturan II (a registered trademark of Schott AG).

[0121] When using Foturan II as the glass body 10, the glass body 10 is selectively irradiated with ultraviolet light at wavelengths below 320 nm, followed by firing, causing the irradiated portion to crystallize. Subsequently, by wet etching with an aqueous hydrofluoric acid solution, the crystallized portion is selectively etched, forming a through-hole V inside the glass body 10. Ultraviolet irradiation can be performed using a mask aligner, but a stepper or a UV laser can also be used. Using a mask aligner is preferred, as it allows processing of the entire surface of the glass body 10 in a single exposure, improving productivity. By using a photosensitive glass body 10, the aspect ratio of the through-hole V can be increased (e.g., 5 or more), and the cone angle of the inner surface of the through-hole V can be increased (e.g., 87° or more).

[0122] The main components of the glass body 10 are SiO2 and Al2O3, but it may also contain various metal oxides such as Li2O3. The photosensitizer contains one or more lanthanide elements. Therefore, compared to organic photosensitizers, it can be easily mixed with glass. Preferably, the photosensitizer contains cerium. Therefore, it is the cheapest among lanthanide photosensitizers.

[0123] Here, if we consider the Ce contained in the vitreous body 10 3+ When exposed to ultraviolet light, Ce 3+ It is photo-oxidized to become Ce 4+ Because of this Ce 4+ The glass body 10 has an absorption edge in the visible light region, so unless the ultraviolet light irradiation part is removed by firing or etching, it will become the cause of discoloration (yellowing). In this embodiment, by providing an insulating film 14 that reflects or absorbs light in the photosensitive wavelength region corresponding to the photosensitizer contained in the glass body 10, the discoloration of the glass body 10 can be suppressed.

[0124] (Wrapped wiring 110)

[0125] like Figure 1 and Figure 2 As shown, the wound wiring 110 includes an outer surface conductor 11 disposed above the outer surface 100 of the glass body 10, and a through hole V penetrating the glass body 10 and electrically connected to the outer surface conductor 11.

[0126] The outer surface conductor 11 includes a bottom surface conductor 11b disposed on the bottom surface 100b of the glass body 10, and a top surface conductor 11t disposed on the top surface 100t of the glass body 10. The bottom surface conductor 11b has a shape extending in the Y direction. A plurality of bottom surface conductors 11b are arranged parallel to each other along the X direction. The top surface conductor 11t extends in the Y direction at a slight inclination towards the X direction. A plurality of top surface conductors 11t are arranged parallel to each other along the X direction.

[0127] The through-wire 13 extends in a direction orthogonal to the bottom surface 100b and the top surface 100t. The through-wire 13 is arranged on both sides in the Y direction inside the glass body 10. Multiple through-wires 13 are arranged parallel to each other along the X direction on both sides in the Y direction.

[0128] Furthermore, the bottom conductor 11b, the through wire 13 on one side of the Y direction, the top conductor 11t, and the through wire 13 on the other side of the Y direction are connected in sequence to form a spiral shape. In other words, the winding wire 110 is wound around the winding axis AX parallel to the bottom surface 100b.

[0129] According to the above configuration, since the winding shaft AX is parallel to the mounting surface of the inductor component 1, the main component of the magnetic flux generated by the inductor element L, that is, the magnetic flux through the inner diameter of the winding wiring 110, does not cross the mounting substrate. This can reduce the decrease in the Q value of the inductor element L caused by eddy current loss and also reduce noise radiation to the mounting substrate.

[0130] The outer surface conductor 11 is made of a good conductor material such as copper, silver, gold, or their alloys. The outer surface conductor 11 can also be a metal film formed by electroplating, vapor deposition, sputtering, etc., or a sintered metal body coated with a conductor paste and then sintered. Alternatively, the outer surface conductor 11 can be a multilayer structure with multiple metal layers stacked. Preferably, the thickness of the outer surface conductor 11 is 5 μm or more and 50 μm or less.

[0131] Furthermore, it is preferable to form the outer surface conductor 11 using a semi-additive method, thereby enabling the formation of an outer surface conductor 11 with low resistance, high precision, and high aspect ratio. For example, the outer surface conductor 11 can be formed as follows: First, a titanium layer and a copper layer are sequentially formed as a seed layer on the entire outer surface 100 of the monolithically formed glass body 10 by sputtering or electroless plating, and a patterned photoresist is formed on the seed layer. Next, a copper layer is formed on the seed layer at the opening of the photoresist using electrolytic plating. Subsequently, the photoresist and the seed layer are removed by wet etching or dry etching. Thus, an outer surface conductor 11 patterned into an arbitrary shape can be formed on the outer surface 100 of the glass body 10.

[0132] Through-wire 13 can be formed in the through-hole V pre-formed in the glass body 10 using the material and manufacturing method exemplified by the outer surface conductor 11.

[0133] Figure 3 This is a schematic cross-sectional view of a portion of inductor component 1. Specifically, Figure 3 The cross-section shown is an enlarged view of a portion of the first terminal electrode 121 side, which includes the winding shaft AX and is orthogonal to the bottom surface 100b. (See figure) Figure 3 As shown, the outer surface conductor 11 is in contact with the glass body 10. Specifically, the bottom surface conductor 11b is in contact with the bottom surface 100b, and the top surface conductor 11t is in contact with the top surface 100t. This allows for a reduction in the Z-direction dimension of the inductor component 1.

[0134] Figure 4 It means Figure 3 A schematic cross-sectional view of a modified example of the outer surface conductor 11 and the insulating film 14. (See attached image.) Figure 4 As shown, the outer surface conductor 11 may not be in direct contact with the glass body 10. In other words, the outer surface conductor 11 may also be adjacent to the glass body 10 via the insulating film 14. In this case, the outer surface conductor 11 is connected to the glass body 10 via a through-hole conductor penetrating the insulating film 14. Figure 4 The through-wire connection 13 is not shown.

[0135] (Terminal electrode 12)

[0136] like Figure 1 and Figure 2 As shown, the terminal electrode 12 includes a first terminal electrode 121 and a second terminal electrode 122, which serve as input / output terminals of the inductor element L. Furthermore, in the inductor component 1, the first terminal electrode 121 and the second terminal electrode 122 are located above the bottom surface 100b and have a main surface shape parallel to the bottom surface 100b. Figure 3 As shown, the terminal electrode 12 is exposed outside the inductor component 1.

[0137] According to the above configuration, the inductor component 1 has input and output terminals of an inductor element L on the bottom surface 100b side, which has a surface that can attach solder in a direction parallel to the bottom surface 100b. Therefore, it becomes a surface-mount type electronic component that can be surface-mounted with the bottom surface 100b as the mounting surface and can reduce the mounting area.

[0138] like Figure 3 As shown, terminal electrode 12 is in contact with glass body 10. Specifically, first terminal electrode 121 and second terminal electrode 122 are in contact with bottom surface 100b. This allows for a reduction in the Z-direction dimension of inductor component 1.

[0139] Figure 5 It means Figure 3A schematic cross-sectional view of a modified example of the terminal electrode 12 and the insulating film 14. (See attached image.) Figure 5 As shown, the terminal electrode 12 may not be in direct contact with the glass body 10. In other words, the terminal electrode 12 may also be adjacent to the glass body 10 via the insulating film 14. In this case, the terminal electrode 12 is connected to the through wiring 13 via a through-hole conductor penetrating the insulating film 14.

[0140] Figure 6 It means Figure 3 A schematic cross-sectional view of a modified example of terminal electrode 12. For example... Figure 6 As shown, the inductor component 1 may also include an anchoring portion 123 protruding from the terminal electrode 12 into the interior of the glass body 10. This improves the fixation of the terminal electrode 12 relative to the glass body 10.

[0141] like Figure 7A and Figure 7B As shown, preferably, at least a portion of the outer periphery of the anchoring portion 123 includes a curved surface on a cross section orthogonal to the extension direction of the anchoring portion 123. Figure 7A The anchoring part 123 is shown in a circular cross-sectional shape. Figure 7B The diagram shows the anchoring portion 123 with a cross-sectional shape that is a quadrilateral including a convex curved corner. If the outer periphery of the anchoring portion 123 is curved in a cross-section orthogonal to the extending direction, stress will concentrate at the curved portion. On the other hand, in this embodiment, at least a portion of the outer periphery of the anchoring portion 123 includes a curved surface, which can reduce the curved portions where stress is easily concentrated. As a result, localized stress concentration in the anchoring portion 123 is less likely to occur.

[0142] The manufacturing method of the anchoring portion 123 will be described. For example, before forming the terminal electrode 12, a non-through hole or a through hole is formed in the glass body 10, and a conductor is formed in the non-through hole or through hole using the material and manufacturing method exemplified by the outer surface conductor 11. For example, a seed layer is formed in the terminal electrode forming area inside and around the non-through hole or through hole, and the conductor is formed to fill the non-through hole or through hole by electrolytic plating. The terminal electrode 12 and the anchoring portion 123 can be formed independently, or they can be formed using the same seed layer, so that the terminal electrode 12 and the anchoring portion 123 are integrally formed, resulting in a terminal electrode 12 with a higher anchoring effect. In addition, since the glass body 10 is photosensitive, the shape of the non-through hole or through hole formed in the glass body 10 can be freely controlled, thereby allowing free control of the cross-sectional shape of the anchoring portion 123. Therefore, at least a portion of the outer periphery of the anchoring portion 123 can include a curved surface.

[0143] Furthermore, the terminal electrodes 12 are not limited to the above configuration, and there may be three or more, and they may also be formed on the side surface and top surface 100t of the outer surface 100 of the glass body 10, connecting the bottom surface 100b and the top surface 100t. The terminal electrodes 12 can be made of the materials and manufacturing methods exemplified by the outer surface conductor 11.

[0144] (Insulating film 14)

[0145] like Figure 1 and Figure 2 As shown, the insulating film 14 has the function of reflecting or absorbing light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body 10. For example, when the photosensitizer is Ce... 3+ In such cases, the insulating film 14 needs to reflect or absorb light with wavelengths below 320 nm, which corresponds to the photosensitive wavelength region.

[0146] To impart the function of reflecting or absorbing light to the insulating film 14, it is preferable that the thickness of the insulating film 14 is at least 100 nm or more, and more preferably at least 1 μm. The method of forming the insulating film 14 is not particularly limited. If the insulating film 14 is an inorganic compound, sputtering or sol-gel methods can be used, and if the insulating film 14 is an organic compound, coating methods can be used.

[0147] The insulating film 14 has at least one of the following features (i), (ii), and (iii).

[0148] (i) The insulating material that serves as the substrate contains microparticles with a refractive index different from that of the substrate.

[0149] (ii) Layering low-refractive-index insulating materials and high-refractive-index insulating materials

[0150] (iii) Materials containing a band gap or HOMO-LUMO band gap that has a smaller energy required for photosensitization than that of a photosensitizer in a vitreous body.

[0151] Accordingly, it is possible to reduce the discoloration of the vitreous body 10 caused by light exposure.

[0152] In (i) and (ii) above, by making the insulating film 14 a composite of a low-refractive-index material and a high-refractive-index material, the insulating film 14 can be endowed with the function of reflecting light. Specifically, in (i) above, microparticles with a refractive index different from that of the substrate are mixed into the insulating material that serves as the substrate. In addition, in (ii) above, two or more layers of insulating materials with different refractive indices are stacked.

[0153] Various resins, or inorganic compounds including SiO2 and other metal oxides, can be considered as materials for both low-refractive-index and high-refractive-index materials. However, when microparticles with a refractive index different from the substrate are mixed into an insulating material that serves as the substrate, coating onto a glass body is easily achieved by making the substrate a resin. In this case, the material of the microparticles mixed with the resin can be different types of resin materials, or it can be SiO2 or various metal oxides.

[0154] In (iii) above, materials capable of absorbing light in the photosensitive wavelength region corresponding to the photosensitizer have a smaller band gap, or a HOMO-LUMO band gap, compared to the energy required for the photooxidation of the photosensitizer. For example, when using Ce... 3+ In the case of photosensitizers, by forming a surface on the vitreous body with a higher concentration of Ce... 3+ Materials with a small band gap of 3.9 eV or a HOMO-LUMO band gap, required for photo-oxidation, can suppress Ce. 3+ Photo-oxidation, and the discoloration of the vitreous body that accompanies photo-oxidation.

[0155] Alternatively, the insulating film 14 may also have at least one of the following features (iv), (v), and (vi).

[0156] (iv) The insulating material serving as the substrate contains microparticles with a refractive index different from that of the substrate.

[0157] (v) Layering low-refractive-index insulating materials and high-refractive-index insulating materials

[0158] (vi) A material containing a photosensitizer after photosensitization with an absorption wavelength of λ [nm] and having a band gap of 1240 / λ [eV] or a HOMO-LUMO band gap.

[0159] Accordingly, it is possible to reduce the discoloration of the glass body 10 caused by light exposure. In addition, even if discoloration is assumed to occur in the glass body 10, the discoloration of the appearance when observing the glass body 10 through the insulating film can be reduced.

[0160] In (iv) and (v) above, the same applies as in (i) and (ii) above, so their descriptions are omitted.

[0161] In (vi) above, unlike (iii) above, a material is included that can also absorb light of a wavelength equivalent to the absorption wavelength of the photosensitizer after photosensitization. Therefore, even assuming discoloration of the glass, the appearance of the inductor component is not easily altered. Specifically, this is usually due to the trace amounts of Ce contained in the glass. 4+The absorption edge exists around 400nm, so by forming a material with a band gap or a HOMO-LUMO band gap lower than 3.1eV (=1240 / 400) on the surface of the glass, it is not easy to cause changes in the appearance of the inductor component that is prone to discoloration.

[0162] Examples of such materials include inorganic compounds or resin materials with band gaps or HOMO-LUMO band gaps smaller than 3.1 eV, such as rutile TiO2 and various aromatic polyimides. Additionally, materials colored with pigments that have narrow HOMO-LUMO band gaps, such as phthalocyanine green and carbon black, can also be used.

[0163] Depending on the application and purpose of the insulating film 14, it can be used in either a reflective or absorptive manner. In terms of suppressing electrical losses in the inductor component 1, a reflective insulating film, which is not affected by the dielectric losses of the light-absorbing material, is advantageous. On the other hand, in terms of visual inspection, if the surface reflectivity of the inductor component 1 is too high, there is a possibility that visual defects cannot be detected; therefore, an absorptive insulating film may also be advantageous.

[0164] like Figure 3 As shown, the insulating film 14 is disposed above the bottom surface 100b and the top surface 100t of the glass body 10. After the inductor component 1 is mounted on the mounting substrate from the bottom surface 100b side, the inductor component 1 is exposed to light from the top surface 100t side of the glass body 10. However, since the insulating film 14 is disposed on the top surface 100t, discoloration of the glass body 10 can be reduced. In addition, since the insulating film 14 is disposed on the bottom surface 100b, discoloration of the glass body 10 can be reduced even before the inductor component 1 is mounted on the mounting substrate.

[0165] Figure 8 It means Figure 3 A schematic cross-sectional view of a modified example of the insulating film 14. (See attached image.) Figure 8 As shown, the insulating film 14 can also be further disposed above the side surface 100s connecting the bottom surface 100b and the top surface 100t in the outer surface 100 of the glass body 10. This reduces discoloration of the glass body 10 even before the inductor component 1 is mounted onto the mounting substrate. In other words, the insulating film 14 can be disposed not only above the top surface 100t, but also above at least a portion of the bottom surface 100b and the side surface 100s. Alternatively, the insulating film 14 can be disposed only on the top surface 100t, without being disposed on the bottom surface 100b and the side surface 100s.

[0166] Figure 9 yes Figure 3 A magnified view of the area near the outer surface conductor 11. (See image below.) Figure 9As shown, the insulating film 14 covers the outer surface conductor 11 on its top surface 100t. The insulating film 14 includes a conductor-top portion 141 that contacts and is located directly above the outer surface conductor 11, and a glass-top portion 142 that contacts and is located directly above the glass body 10. The thickness t1 of the conductor-top portion 141 is thinner than the thickness t2 of the glass-top portion 142.

[0167] Here, the thickness of the insulating film 14 refers to the thickness in a direction orthogonal to the outer surface 100 located below the insulating film 14, for example, in Figure 9 In this process, the thickness of the insulating film 14 (thickness t1 of the portion 141 directly above the conductor and thickness t2 of the portion 142 directly above the glass) is the thickness in a direction orthogonal to the top surface 100t. Furthermore, when measuring these thicknesses, in order to eliminate the influence of the R-shape, chamfer shape, etc. of the ends of the glass and the conductor, the thickness of the portion 141 directly above the conductor on the relatively flat conductor portion and the portion 142 directly above the glass on the glass are measured.

[0168] Based on the above configuration, the insulating film 14 is disposed not only above the glass body 10, but also above the outer surface conductor 11, so the formation of the insulating film 14 is easy. In addition, the thickness t1 of the portion 141 directly above the conductor is thinner than the thickness t2 of the portion 142 directly above the glass, so the size of the inductor component 1 can be miniaturized.

[0169] Generally, if reducing the discoloration effect of the glass body 10 is considered, the portion 141 directly above the conductor in the insulating film 14 may not be provided. However, by providing the portion 141 directly above the conductor, the insulating film 14 can be integrally formed, and the insulation of the adjacent outer surface conductor 11 can also be improved. However, since the outer surface conductor 11 blocks external light, the discoloration reduction effect is not required in the portion 141 directly above the conductor, and the thickness of the portion 141 directly above the conductor can be reduced. Furthermore, since the portion 141 directly above the conductor is already located higher than the portion 142 directly above the glass due to the outer surface conductor 11, from the viewpoint of the size of the inductor component 1, it is preferable that the portion 141 directly above the conductor is thinner than the portion 142 directly above the glass.

[0170] Preferably, the thickness t2 of the portion 142 directly above the glass is thicker than the thickness t of the outer surface conductor 11. This further reduces discoloration of the glass body 10. Generally, considering the effect of reducing discoloration of the glass body 10, the thickness t2 of the portion 142 directly above the glass in the insulating film 14 is preferably the thickest.

[0171] Preferably, the upper surface of the conductor-above portion 141 opposite to the top surface 100t and the upper surface of the glass-above portion 142 opposite to the top surface 100t are located on the same plane. This reduces surface roughness of the inductor component 1 and minimizes damage to its surface. Furthermore, the upper surface of the conductor-above portion 141 may be positioned higher than the upper surface of the glass-above portion 142. In other words, the upper surface of the conductor-above portion 141 may have a shape that follows the shape of the upper surface of the outer conductor 11.

[0172] like Figure 3 As shown, the insulating film 14 on the bottom surface 100b does not completely cover the terminal electrode 12. In other words, the lower surface of the terminal electrode 12, opposite to the bottom surface 100b, is exposed from the insulating film 14. This allows the terminal electrode 12 to be externally connected to the inductor component 1.

[0173] Figure 10 It means Figure 3 A schematic cross-sectional view of a modified example of the insulating film 14. (See attached image.) Figure 10 As shown, the insulating film 14 may also include a terminal-top portion 143 that contacts the terminal electrode 12 and is located directly above the terminal electrode 12. The terminal-top portion 143 has a hole 143a that opens onto the terminal electrode 12. The entire inner periphery 143b of the hole 143a on the terminal electrode 12 side is located directly above the terminal electrode 12.

[0174] Here, the hole 143a includes not only the case of a completely empty hole, but also the case of a hole filled with a conductor. In other words, the hole 143a can be an empty hole from which the terminal electrode 12 itself is exposed, or the hole 143a can be filled with a conductor.

[0175] According to the above configuration, when the insulating film 14 forms the aperture 143a, the aperture 143a can be formed by removing only the insulating film 14 on the terminal electrode 12. Therefore, it is possible to reliably suppress the exposure of the glass body 10 near the terminal electrode 12 due to deviations during the formation of the aperture 143a, and further reduce the discoloration of the glass body 10. In particular, when the insulating film 14 forms the aperture 143a using photolithography, even if the photosensitive wavelength of the insulating film 14 is the same as the photosensitive wavelength of the photosensitizer, the irradiated light will not reach the glass body 10 because it is blocked by the terminal electrode 12. Therefore, the discoloration of the glass body 10 can be reduced.

[0176] If the manufacturing method of the photolithography-based hole 143a is explained in detail, then as follows Figure 11A As shown, the insulating film 14 is configured to cover the entire surface of the terminal electrode 12. Subsequently, as... Figure 11BAs shown, a mask (not shown) or similar device is used to avoid directly above the glass body 10 and only illuminate the insulating film 14 directly above the terminal electrode 12. At this time, although there is a possibility that the illumination range of light towards the insulating film 14 may be expanded compared to the opening portion of the mask due to misalignment, if this expansion is further addressed by removing only the insulating film 14 on the terminal electrode 12, the irradiated light will not reach the glass body 10 because it is blocked by the terminal electrode 12. Then, as... Figure 11C As shown, after removing the insulating film 14 from the area irradiated by light, a hole 143a is formed in the portion 143 directly above the terminal. Furthermore, the method for forming the hole 143a is not limited to photolithography; it can also be a physical method such as laser.

[0177] Figure 12 It means Figure 10 A schematic cross-sectional view of a modified example of the hole 143a. Figure 10 In this case, the inner surface of the hole 143a is a straight line along the Z direction, so that the width of the hole 143a on the side opposite to the terminal electrode 12 is the same as the width of the hole 143a on the side opposite to the terminal electrode 12. On the other hand, as... Figure 12 As shown, the inner surface of the hole 143a can also be a tapered shape inclined relative to the Z direction, so that the width of the hole 143a on the terminal electrode 12 side is smaller than the width of the hole 143a on the side opposite to the terminal electrode 12. In this case, the entire inner periphery 143b of the hole 143a on the terminal electrode 12 side is located directly above the terminal electrode 12, but when viewed from the Z direction, the entire inner periphery 143c of the hole 143a on the side opposite to the terminal electrode 12 does not coincide with the terminal electrode 12.

[0178] Figure 13 It means Figure 3 A schematic cross-sectional view of a modified example of the terminal electrode 12 and the insulating film 14. (See attached image.) Figure 13 As shown, the portion 141 directly above the conductor may also have a hole 141a that opens onto the outer surface conductor 11. The entire inner periphery 141b of the hole 141a on the outer surface conductor 11 side is located directly above the outer surface conductor 11. The hole 141a of the portion 141 directly above the conductor is the same as the hole 143a of the portion 143 directly above the terminal described above, including not only cases where it is a completely empty hole, but also cases where the interior of the empty hole is filled with a conductor.

[0179] According to the above configuration, when the insulating film 14 forms the aperture 141a, the aperture 141a can be formed by removing only the insulating film 14 on the outer surface conductor 11. Therefore, it is possible to reliably suppress the exposure of the glass body 10 near the outer surface conductor 11 due to deviations during the formation of the aperture 141a, and further reduce the discoloration of the glass body 10. In addition, especially when the insulating film 14 forms the aperture 141a by photolithography, even if the photosensitive wavelength of the insulating film 14 is the same as the photosensitive wavelength of the photosensitizer, the irradiated light will not reach the glass body 10 because it is blocked by the outer surface conductor 11. Therefore, the discoloration of the glass body 10 can be reduced.

[0180] Furthermore, by filling the hole portion 141a with the through-hole conductor 131, the outer surface conductor 11 can be connected to the terminal electrode 12 exposed from the insulating film 14 via the through-hole conductor 131. This is preferable in terms of reducing discoloration of the glass body 10 and exposing the terminal electrode 12. Typically, when viewed from the bottom surface 100b side, the through-hole conductor 131 is formed on the inner side compared to the outer surface conductor 11. Therefore, when the insulating film 14 containing the through-hole conductor 131 is removed using laser irradiation or photolithography, the irradiation light is blocked by the outer surface conductor 11 and does not reach the glass body 10.

[0181] The manufacturing method of the photolithography-based hole 141a is described in detail, such as... Figure 14A As shown, the insulating film 14 is configured to cover the entire surface of the outer surface conductor 11. Subsequently, as... Figure 14B As shown, a mask (not shown) or similar device is used to avoid irradiating the area directly above the glass body 10, and only irradiating the insulating film 14 directly above the outer surface conductor 11. At this time, although there is a possibility that the irradiation range of the insulating film 14 may be increased compared to the opening portion of the mask due to misalignment of the mask, if the insulating film 14 on the outer surface conductor 11 is removed based on this increase, the irradiated light will not reach the glass body 10 because it is blocked by the outer surface conductor 11. Furthermore, as... Figure 14C As shown, after removing the insulating film 14 from the area illuminated by light, a hole 141a is formed in the portion 141 directly above the conductor. Thereafter, as... Figure 14D As shown, the through-hole conductor 131 is filled in the hole portion 141a, as... Figure 14E As shown, the terminal electrode 12 is configured on the insulating film 14 to connect with the through-hole conductor 131. Furthermore, the method for forming the hole 141a is not limited to photolithography; it can also be a physical method such as laser processing.

[0182] Figure 15 It means Figure 13 A schematic cross-sectional view of a modified example of the hole 141a. Figure 13In this case, the inner surface of the hole 141a is a straight line along the Z direction, so that the width of the outer surface of the hole 141a on the conductor 11 side is the same as the width of the terminal electrode 12 side of the hole 141a. On the other hand, as... Figure 15 As shown, the inner surface of the hole 141a can also be a tapered shape inclined relative to the Z direction, so that the width of the outer surface conductor 11 side of the hole 141a is smaller than the width of the terminal electrode 12 side of the hole 141a. In this case, the entire inner periphery 141b of the outer surface conductor 11 side of the hole 141a is located directly above the outer surface conductor 11, but when viewed from the Z direction, the entire inner periphery 141c of the terminal electrode 12 side of the hole 141a does not coincide with the outer surface conductor 11.

[0183] Figure 16 It means Figure 3 A schematic cross-sectional view of a deformed example near the outer surface conductor 11. (See attached image.) Figure 16 As shown, the surface roughness of the interface S1 between the insulating film 14 and the glass body 10 is preferably greater than the surface roughness of the interface S2 between the outer surface conductor 11 and the glass body 10. Accordingly, the effect of reducing discoloration of the glass body 10 can be maintained without deteriorating the high-frequency characteristics of the inductor component 1.

[0184] Specifically, because the surface roughness of the interface S1 between the insulating film 14 and the glass body 10 is relatively large, the light scattering reaching the outer surface of the glass body 10 is reduced, which in particular can further suppress discoloration in the deeper parts of the glass body 10. In addition, the improved adhesion between the insulating film 14 and the glass body 10 makes it easier to maintain the effect of the insulating film 14 in reducing the discoloration of the glass body 10.

[0185] On the other hand, if the surface roughness of the interface S2 between the outer surface conductor 11 and the glass body 10 is large, the above-mentioned effect cannot be expected. Instead, because the surface shape of the outer surface conductor 11 becomes rougher, when a high-frequency signal passes through the outer surface conductor 11, the current is concentrated on the rougher surface portion of the outer surface conductor 11, resulting in deteriorated losses. Consequently, the high-frequency characteristics of the inductor component 1 deteriorate. Therefore, it is preferable to have a smaller surface roughness at the interface S2 between the outer surface conductor 11 and the glass body 10.

[0186] As a method to increase the surface roughness of the interface S1 between the insulating film 14 and the glass body 10, for example, after forming the outer surface conductor 11 and terminal electrode 12 on the top surface 100t or bottom surface 100b of the glass body 10, the outer surface of the glass body 10 can be roughened by dry etching, wet etching, sandblasting, etc., and then the insulating film 14 can be formed, thereby selectively increasing the surface roughness of the interface S1 between the insulating film 14 and the glass body 10.

[0187] Similarly, it is preferable that the surface roughness of the interface between the insulating film 14 and the glass body 10 is greater than the surface roughness of the interface between the terminal electrode 12 and the glass body 10. Accordingly, the effect of reducing discoloration of the glass body 10 can be maintained without deteriorating the high-frequency characteristics of the inductor component 1.

[0188] <Second Implementation>

[0189] In the first embodiment, the outer surface conductor is part of the inductor element, but the outer surface conductor is not limited to this and may also be part of an electrical element other than the inductor element L. Figure 17 This is a schematic cross-sectional view of the capacitor component 2 according to the second embodiment. Figure 17 As shown, capacitor component 2 is a surface-mount type electronic component that includes a capacitor element Cap, which is widely used in electronic circuits, as an electrical component.

[0190] The capacitor component 2 includes the aforementioned glass body 10 containing a photosensitizer, an outer surface conductor 21 disposed above the outer surface 100 of the glass body 10 and serving as part of an electrical element, namely a capacitor element Cap, a terminal electrode 22 disposed above the outer surface 100 and electrically connected to the outer surface conductor 21 and serving as a terminal of the capacitor element Cap, and an insulating film 24 disposed above the outer surface 100 of the glass body 10 and reflecting or absorbing light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body 10.

[0191] With the above configuration, even if light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body 10 irradiates the capacitor component 2, the amount of light irradiating the glass body 10 can be reduced because the insulating film 24 reflects or absorbs the light. Therefore, the photooxidation of the photosensitizer contained in the glass body 10 due to the light can be reduced, and discoloration caused by photooxidation of the glass body 10 can be minimized. Thus, the capacitor component 2 can have a good appearance.

[0192] Additionally, in capacitor component 2, the outer surface 100 of glass body 10 includes a bottom surface 100b, which is one of the main surfaces of glass body 10, and a top surface 100t located on the back side of bottom surface 100b. The outer surface conductor 21 is disposed above bottom surface 100b. Figure 17 A flat bottom plate electrode 21b (in the negative Z direction) and a plate disposed above the top surface 100t. Figure 17 A flat plate electrode 21t with a flat top surface (in the Z direction).

[0193] According to the above configuration, in the capacitor component 2, the bottom plate electrode 21b and the top plate electrode 21t are opposed to each other via the glass body 10, which serves as a dielectric layer, thereby forming a capacitor element Cap.

[0194] In addition, the capacitor component 2 also has a through hole V formed in the glass body 10 and a through wiring 23 that is at least a part of the capacitor element Cap and is electrically connected to the outer surface conductor 21.

[0195] According to the above configuration, in capacitor component 2, wiring can be formed in the vertical direction for the outer surface conductor 21 and terminal electrode 22 disposed above the outer surface 100, thereby increasing the degree of freedom in forming the capacitor element Cap. In capacitor component 2, the through wiring 23 serves as the wiring connecting the top surface plate electrode 21t and the terminal electrode 22.

[0196] Additionally, in capacitor component 2, terminal electrode 22 includes a first terminal electrode 221 and a second terminal electrode 222, which serve as input / output terminals of capacitor element Cap. The first terminal electrode 221 and the second terminal electrode 222 are located above the bottom surface 100b (in the negative Z direction) and have the shape of a main surface parallel to the bottom surface 100b.

[0197] According to the above configuration, the capacitor component 2 has input and output terminals of a capacitor element Cap on the bottom surface 100b side, which has a surface on which solder can be attached in a direction parallel to the bottom surface 100b. Therefore, it becomes a surface-mount type electronic component that can be surface-mounted with the bottom surface 100b as the mounting surface and can reduce the mounting area.

[0198] An insulating film 24 covers the portion of the bottom surface 100b of the glass body 10 that is exposed from the bottom plate electrode 21b. The characteristics of the insulating film 24 are the same as those of the insulating film 14 in the first embodiment. Therefore, even if light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body 10 irradiates the exposed portion of the bottom surface 100b of the glass body 10, the insulating film 24 reflects or absorbs the light, thus reducing the amount of light irradiating the glass body 10 and reducing discoloration caused by photo-oxidation of the glass body 10.

[0199] Furthermore, the insulating film 24 covers a portion of the bottom plate electrode 21b. In other words, the insulating film 24 can make that portion of the bottom plate electrode 21b serve as the terminal electrode 22 (first terminal electrode 221) by exposing that portion.

[0200] <Third Implementation Method>

[0201] Figure 18 This is a schematic cross-sectional view of electronic component module 5. (Example) Figure 18 As shown, the electronic component module 5 includes a mounting substrate 7 and an inductor component 1 of the first embodiment mounted on the mounting substrate 7. Accordingly, the electronic component module 5 with an inductor component 1 having a good appearance can be realized.

[0202] The mounting substrate 7 can be a substrate equivalent to a printed wiring substrate, or it can be an auxiliary substrate mounted on a printed wiring substrate such as a motherboard substrate, or it can be an internal substrate used in semiconductors or electronic modules, such as an interposer or substrate. Alternatively, it can replace the inductor component 1 and be the capacitor component 2 of the second embodiment, or it can be both the inductor component 1 and the capacitor component 2.

[0203] Preferably, the electronic component module 5 may also include a sealing resin 6 for sealing the inductor component 1. The sealing resin 6 reflects or absorbs light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body 10 of the inductor component 1. The characteristics of the sealing resin 6 are the same as those of the insulating film 14 in the first embodiment, and detailed description is omitted. Accordingly, discoloration of the inductor component 1 when it is mounted on the mounting substrate 7 can be reduced more reliably.

[0204] <Fourth Implementation>

[0205] Figure 19 This is a schematic cross-sectional view of electronic component module 5A. (Example) Figure 19 As shown, the electronic component module 5A includes a mounting substrate 7, an inductor component 1A mounted on the mounting substrate 7 as an electronic component, and a sealing resin 6 for sealing the inductor component 1A.

[0206] Inductor component 1A includes a glass body containing a photosensitizer, a conductor disposed in the glass body and serving as at least part of an electrical element, and terminal electrodes disposed above the outer surface of the glass body and electrically connected to the conductor, serving as terminals of the electrical element. In other words, inductor component 1A differs from inductor component 1 of the first embodiment in that it lacks the insulating film 14, but its other configuration is the same as that of inductor component 1 of the first embodiment. Therefore, a detailed description of inductor component 1A is omitted.

[0207] The sealing resin 6 reflects or absorbs light within the photosensitive wavelength range corresponding to the photosensitive agent contained in the glass body of the inductor component 1A. The characteristics of the sealing resin 6 are the same as those of the insulating film 14 in the first embodiment, and detailed description is omitted. Accordingly, an electronic component module 5A with an aesthetically pleasing inductor component 1A can be realized.

[0208] Furthermore, this disclosure is not limited to the embodiments described above, and design changes can be made without departing from the spirit of this disclosure. For example, the feature points of the first to fourth embodiments can be combined separately.

[0209] In the first to third embodiments described above, an inductor or capacitor was used as the electronic component. However, any electronic component can be any electronic component that includes a glass body containing a photosensitizer, a conductor disposed in the glass body and serving as at least part of an electrical element, a terminal electrode disposed above the outer surface of the glass body and electrically connected to the conductor as a terminal of the electrical element, and an insulating film disposed above the outer surface of the glass body that reflects or absorbs light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body.

[0210] In the fourth embodiment described above, an inductor component was used as an electronic component, but a capacitor component may also be used. Alternatively, any electronic component may be used as long as it comprises a glass body containing a photosensitizer, a conductor disposed in the glass body and serving as at least part of an electrical element, and a terminal electrode disposed above the outer surface of the glass body and electrically connected to the conductor as a terminal of the electrical element.

Claims

1. An electronic component, comprising: Vitreous humor, containing photosensitizer; A conductor is disposed in the aforementioned glass body and serves as at least a part of an electrical component; Terminal electrodes, disposed above the outer surface of the aforementioned glass body, are electrically connected to the aforementioned conductor and serve as terminals of the aforementioned electrical components; and An insulating film is disposed above the outer surface of the glass body and reflects or absorbs light corresponding to the photosensitive wavelength region of the photosensitizer contained in the glass body.

2. The electronic component according to claim 1, wherein, The aforementioned outer surface includes a bottom surface, which is one of the main surfaces of the aforementioned glass body, and a top surface located on the back side of the aforementioned bottom surface. The terminal electrodes are disposed at least above the bottom surface, and the insulating film is disposed at least above the top surface.

3. The electronic component according to claim 2, wherein, The aforementioned outer surface includes multiple side surfaces connecting the aforementioned bottom surface and the aforementioned top surface. The insulating film is also disposed above at least a portion of the bottom surface and the side surface.

4. The electronic component according to any one of claims 1 to 3, wherein, The insulating film described above has at least one of the following characteristics: (i), (ii), and (iii). (i) The insulating material that serves as the substrate contains microparticles with a refractive index different from that of the substrate. (ii) Layering low-refractive-index insulating materials and high-refractive-index insulating materials (iii) Materials containing a band gap or HOMO-LUMO band gap that has a smaller energy required for photosensitization than that of a photosensitizer in a vitreous body.

5. The electronic component according to any one of claims 1 to 3, wherein, The aforementioned insulating film comprises a material having a band gap of less than 1240 / λ [eV] or a HOMO-LUMO band gap when the absorption wavelength of the photosensitizer after photosensitization is λ [nm].

6. The electronic component according to any one of claims 1 to 3, wherein, The aforementioned photosensitizer contains one or more lanthanide elements.

7. The electronic component according to any one of claims 1 to 3, wherein, The aforementioned photosensitizer contains cerium.

8. The electronic component according to any one of claims 1 to 3, wherein, The conductor described above has an outer surface conductor disposed above the outer surface. The aforementioned insulating film includes a portion directly above the conductor that is in contact with and directly above the outer surface conductor, and a portion directly above the glass that is in contact with and directly above the glass body. The thickness of the portion directly above the conductor is thinner than the thickness of the portion directly above the glass.

9. The electronic component according to claim 8, wherein, The thickness of the portion directly above the glass is greater than the thickness of the outer surface conductor.

10. The electronic component according to any one of claims 1 to 3, wherein, The conductor described above has an outer surface conductor disposed above the outer surface. The aforementioned insulating film includes a portion directly above the conductor that is in contact with and located directly above the outer surface conductor. The portion directly above the conductor has a hole that opens onto the outer surface conductor, and the entire inner periphery of the hole on the outer surface conductor side is located directly above the outer surface conductor.

11. The electronic component according to any one of claims 1 to 3, wherein, The insulating film includes a portion directly above the terminal electrode that is in contact with the terminal electrode. The portion directly above the terminal has a hole that opens onto the terminal electrode, and the entire inner periphery of the hole on the terminal electrode side is located directly above the terminal electrode.

12. The electronic component according to any one of claims 1 to 3, wherein, The conductor described above has an outer surface conductor disposed above the outer surface. The surface roughness of the interface between the insulating film and the glass body is greater than the surface roughness of the interface between the outer surface conductor and the glass body.

13. The electronic component according to any one of claims 1 to 3, wherein, The surface roughness of the interface between the insulating film and the glass body is greater than the surface roughness of the interface between the terminal electrode and the glass body.

14. The electronic component according to any one of claims 1 to 3, wherein, It also includes an anchoring portion protruding from the terminal electrode into the interior of the glass body. On a cross section orthogonal to the extension direction of the anchoring portion, at least a portion of the outer periphery of the anchoring portion includes a curved surface.

15. An electronic component module, comprising: Mounting substrate; and The electronic component according to any one of claims 1 to 14 is mounted on the aforementioned mounting substrate.

16. The electronic component module according to claim 15, wherein, It also includes a sealing resin that seals the electronic component and reflects or absorbs light in the photosensitive wavelength range of the photosensitizer contained in the glass body of the electronic component.

17. An electronic component module, comprising: Mounting substrate; Electronic components, mounted on the aforementioned mounting substrate; and Sealing resin is used to seal the aforementioned electronic components. The above-mentioned electronic components include: Vitreous humor, containing photosensitizer; A conductor, disposed within the aforementioned glass body, and serving as at least a part of an electrical component; and Terminal electrodes are disposed above the outer surface of the glass body, electrically connected to the conductor, and serve as terminals of the electrical components. The aforementioned sealing resin reflects or absorbs light in the photosensitive wavelength range of the photosensitizer contained in the aforementioned glass body, which corresponds to the aforementioned electronic component.

Images