Metallized film and metallized film capacitors

Abstract

The present invention provides a metallized film and a metallized film capacitor. The metallized film comprises: a dielectric film, an evaporation electrode disposed on the dielectric film, and a metal-free margin. The evaporation electrode has a plurality of first metal-free strips arranged along the length of the metallized film, and a plurality of second metal-free strips arranged along the width of the metallized film, so as to divide the evaporation electrode into a plurality of segmented electrode blocks, with adjacent segments connected by 0 to 1 fuses. Along the width of the metallized film, the first metal-free strips of at least two adjacent segments of three adjacent columns are staggered. The segmented electrode blocks in the column farthest from the metal-free margin are provided with two to three fuses, while the segmented electrode blocks in the remaining columns are provided with three to four fuses. Thus, the metallized film ensures low capacity loss and high safety while ensuring electrode layer utilization.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitors, and in particular to a metallized film and a metallized film capacitor. Background Art

[0002] Metallized film capacitors use Figure 1 As shown, the vapor deposition is performed by thickening the vapor deposition electrode 2 near the sprayed metal of the polypropylene film 1 and thinning the vapor deposition electrode 3 near the non-sprayed metal, and a metallized film without a metal margin 4 is formed at the end opposite to the sprayed metal.

[0003] The related art uses two metallized films with a half-grid design to pair, which can ensure the utilization of the electrode layer, but cannot simultaneously ensure a low capacity loss rate and high safety. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems in the above-mentioned technologies to a certain extent. To this end, one object of the present invention is to provide a metallized film that can ensure low capacity loss rate and high safety while ensuring the utilization rate of the electrode layer.

[0005] Another object of the present invention is to provide a metallized film capacitor.

[0006] To achieve the above-mentioned object, an embodiment of the present invention provides a metallized film, which includes: a dielectric film, an evaporation electrode provided on the dielectric film, and a metal-free margin;

[0007] The vapor-deposited electrode is provided with a plurality of first non-metallic strips arranged along the length direction of the metallized film and a plurality of second non-metallic strips arranged along the width direction of the metallized film, so as to divide the vapor-deposited electrode into a plurality of divided electrode blocks, and two adjacent divided electrode blocks are connected by 0-1 fuses;

[0008] Along the width direction of the metallized film, the vapor-deposited electrodes are separated by the second metal-free strips to form N columns of split electrode portions, where N is greater than or equal to 2, wherein the first column of split electrode portions is adjacent to the metal-free margin, and the Nth column of split electrode portions is farthest from the metal-free margin; when N is equal to 2, the first metal-free strips of two adjacent columns are staggered; when N is greater than 2, the first metal-free strips of at least two adjacent columns of three adjacent columns are staggered;

[0009] Two to three of the fuses are arranged on the divided electrode blocks of the Nth column of divided electrode parts, and three to four of the fuses are arranged on the divided electrode blocks of the remaining columns of divided electrode parts.

[0010] According to the metallized film of an embodiment of the present invention, 2 to 3 fuses are arranged on the split electrode blocks in the Nth column, and 3 to 4 fuses are arranged on the split electrode blocks in the remaining columns. When breakdown occurs inside two adjacent split electrode blocks, the islands formed due to the blowing of the fuses of the adjacent split electrode blocks can be reduced, thereby ensuring a lower capacity loss rate and higher safety.

[0011] In addition, the metallized film according to the above embodiment of the present invention may also have the following additional technical features:

[0012] Optionally, 0-1 fuses are arranged at the first metal-free strips of the first column of divided electrode parts, and no fuses are arranged at the first metal-free strips of the remaining columns of divided electrode parts.

[0013] Optionally, when N≥2, 1 to 2 fuses are arranged at the second metal-free strip corresponding to each of the split electrode blocks at the second metal-free strip between the split electrode portion in the Nth column and the split electrode portion in the (N-1)th column.

[0014] Optionally, the plurality of first metal-free strips are equally spaced apart.

[0015] According to a metallized film capacitor of an embodiment of the present invention, a metallized film is wound or stacked to form a capacitor element, and a sprayed metal for electrode extraction is connected to both end surfaces of the capacitor element. The metallized film is the metallized film described above.

[0016] According to the metallized film capacitor of the embodiment of the present invention, the metallized film is provided to ensure the utilization rate of the electrode layer while ensuring a low capacity loss rate and high safety.

[0017] Optionally, the metallized film capacitor includes a first metallized film and a second metallized film, the first metallized film is provided with the evaporated electrode on the first surface of the dielectric film, the second metallized film is provided with the evaporated electrode on the first surface of the dielectric film, the first metallized film and the second metallized film are partially overlapped and the metal-free edge of the first metallized film and the metal-free edge of the second metallized film are arranged one-to-one on both sides of the width direction of the metallized film.

[0018] Optionally, the metallized film is provided with a first evaporated electrode on the first surface of the dielectric film and a second evaporated electrode on the second surface, and the metal-free margins of the first evaporated electrode and the metal-free margins of the second evaporated electrode are arranged one-to-one on both sides of the width direction of the metallized film.

[0019] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a layer structure diagram of the metallized film in the prior art;

[0021] Figure 2 is a top view of a metallized film according to one embodiment of the present invention;

[0022] Figure 3 is a top view of a comparative design of a metallized film according to one embodiment of the present invention;

[0023] Figure 4 is a top view of a metallized film capacitor according to one embodiment of the present invention;

[0024] Figure 5 yes Figure 4 AA cross-sectional view;

[0025] Figure 6 is a top view of a metallized film capacitor according to another embodiment of the present invention;

[0026] Figure 7 yes Figure 6 AA cross-sectional view. DETAILED DESCRIPTION

[0027] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0028] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Instead, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0029] The following is combined with Figure 1-Figure 7 The metallized film and the implementation of the metallized film capacitor provided by the present invention are described in detail.

[0030] Example 1

[0031] A metallized film according to an embodiment of the present invention includes a dielectric film 100, an evaporated electrode 200 disposed on the dielectric film 100, and a metal-free margin 300. The evaporated electrode 200 may include a high-resistance coating region, a transition coating region, and a thickened coating region. The metal-free margin 300 is the margin on the dielectric film 100 where the evaporated electrode 200 is not evaporated.

[0032] Specifically, the vapor-deposited electrode 200 is arranged with a plurality of first metal-free strips a along the length direction of the metallized film and a plurality of second metal-free strips b along the width direction of the metallized film, so as to divide the vapor-deposited electrode 200 into a plurality of divided electrode blocks 201. Along the width direction of the metallized film, two adjacent divided electrode blocks 201 are connected by 0 to 1 fuses 400, that is, two adjacent divided electrode blocks 201 can only be connected by one fuse 400 at most. The vapor-deposited electrode 200 is separated by the second metal-free strips b to form N columns of divided electrode parts, N ≥ 2, wherein the first column of divided electrode parts is adjacent to the metal-free margin 300, and the Nth column of divided electrode parts is farthest from the metal-free margin 300. 00; Along the width direction of the metallized film, the vapor-deposited electrodes are separated by the second metal-free tape to form N columns of split electrode parts, N≥2, wherein the first column of split electrode parts is adjacent to the metal-free margin, and the Nth column of split electrode parts is farthest from the metal-free margin 300; when N=2, the first metal-free tapes a of two adjacent columns are staggered; when N>2, the first metal-free tapes a of at least two adjacent columns of the three adjacent columns are staggered; Along the length direction of the metallized film, 2 to 3 fuses 400 are arranged on the split electrode blocks 201 of the Nth column of split electrode parts, and 3 to 4 fuses 400 are arranged on the split electrode blocks 201 of the remaining columns of split electrode parts.

[0033] The width of the metallized film is defined as the horizontal direction, and the length as the vertical direction. The first metal-free strip a can be understood as a horizontal metal-free strip, and the second metal-free strip b can be understood as a vertical metal-free strip. The horizontal and vertical metal-free strips divide the vapor-deposited electrode into multiple segmented electrode blocks (blocks). The metal-free strips can be free of metal gaps.

[0034] Two to three fuses 400 are arranged on the split electrode blocks 201 of the Nth column of split electrode parts, and three to four fuses 400 are arranged on the split electrode blocks 201 of the remaining columns. That is, each square of the grid column farthest from the non-metal margin 300 is electrically connected to the surrounding squares through two to three fuses 400, and each square of the remaining columns is electrically connected to the surrounding squares through three to four fuses 400, and no two squares are electrically connected through only one fuse 400; in this way, refer to Figure 2 When self-healing occurs inside adjacent blocks, the block islands formed when the fuses of adjacent blocks blow can be reduced, thus reducing capacity loss. Figure 2 When self-healing occurs inside blocks 4, 5, and 6, the fuses between block 4 and block 1 blow, the fuses between block 5 and block 1 blow, and the fuses between block 6 and block 2 blow. At this time, the fuses between block 1 and block 3, and between block 2 and block 3 are still connected, so that blocks 1, 2, and 3 will not be isolated into islands, ensuring a low capacity loss rate. Figure 3 , when each block in the other columns is connected by 2 fuses, when Figure 3 When self-healing occurs inside blocks 4, 5, and 6, the fuses between block 4 and blocks 1 and 3 blow, the fuse between block 5 and block 1 blows, and the fuse between block 6 and block 2 blows, isolating blocks 1, 2, and 3 into islands and increasing the capacity loss rate.

[0035] Therefore, according to the metallized film of an embodiment of the present invention, 2 to 3 fuses 400 are arranged on the split electrode blocks 201 in the Nth column, and 3 to 4 fuses 400 are arranged on the split electrode blocks 201 in the remaining columns. When a breakdown occurs inside two adjacent split electrode blocks 201, the island formed due to the melting of the fuses 400 of the adjacent split electrode blocks 201 can be reduced, thereby ensuring a lower capacity loss rate and higher safety.

[0036] In some examples, a fuse is arranged adjacent to the first metal-free band a on the divided electrode block of the metal-free margin 300. Figure 2 That is, fuses 400 can be placed at the first metal-free strip a in the first grid column of the three grids, but not at the other two grid columns. This reduces the ESR of the capacitor core. For a core with the same 55mm film width, the ESR of the core with fuses 400 placed at all first metal-free strips a is 0.340mΩ. The ESR of the core with fuses 400 placed at all first metal-free strips a except in the first grid column, and no fuses at all other first metal-free strips a, is 0.325mΩ.

[0037] In some examples, the evaporated electrode 200 is arranged into three columns of split electrode segments separated by a second metal-free strip b. The first column of split electrode segments 200c3 is adjacent to the metal-free margin 300, the third column of split electrode segments 200c1 is located on the opposite side of the metal-free margin 300 in the width direction, and the second column of split electrode segments 200c2 is located between the first column of split electrode segments 200c3 and the third column of split electrode segments 200c1. A fuse 400 is arranged at the first metal-free strip a3 on the first split electrode segment 200c3 to connect two adjacent split electrode segments 201. In other words, except for the first metal-free strip a3 of the first column of meshes, which can be equipped with a fuse 400, the first metal-free strip a of the other columns of meshes cannot be equipped with a fuse 400, thereby further reducing ESR.

[0038] Furthermore, along the length of the metallized film, the first metal-free strips a3 on the first column of split electrode segments 200c3 are alternately staggered with the first metal-free strips a2 on the second split electrode segments 200c2. The first metal-free strips a2 on the second split electrode segments 200c2 are alternately staggered with the first metal-free strips a1 on the third split electrode segments 200c1. Consequently, along the width of the metallized film, at least two adjacent columns of the first metal-free strips a are staggered. This facilitates the placement of the fuses 400.

[0039] Furthermore, two fuses 400 are arranged at the second metal-free zone b between the second divided electrode portion 200 c 2 and the first divided electrode portion 200 c 3 corresponding to each divided electrode block 201 .

[0040] In some examples, the plurality of first metal-free strips a are spaced evenly apart, wherein the spacing can be set according to actual needs, for example, the spacing is set to 2.5 mm to 6 mm.

[0041] According to the metallized film capacitor of the embodiment of the present invention, a metallized film is wound or stacked to form a capacitor element, and a sprayed metal for electrode extraction is connected to both end surfaces of the capacitor element.

[0042] Among them, reference Figure 4 and Figure 5 The metallized film capacitor includes a first metallized film 1 and a second metallized film 2. The first metallized film 1 has an evaporated electrode 200 disposed on the first surface of a dielectric film 100, and the second metallized film 2 has an evaporated electrode 200 disposed on the first surface of the dielectric film 100. The first metallized film 1 and the second metallized film 2 partially overlap, and the metal-free margin 300 of the first metallized film 1 and the metal-free margin 300 of the second metallized film 2 are arranged one-to-one on both sides of the width direction of the metallized films. The layout of the evaporated electrodes 200 of the first metallized film 1 and the second metallized film 2 is as described above.

[0043] Therefore, by providing the metallized film, it is possible to ensure the utilization rate of the electrode layer while ensuring a lower capacity loss rate and higher safety.

[0044] Example 2

[0045] According to the metallized film capacitor of the embodiment of the present invention, a metallized film is wound or stacked to form a capacitor element, and a sprayed metal for electrode extraction is connected to both end surfaces of the capacitor element.

[0046] Among them, reference Figure 6 and Figure 7 The metallized film has a first evaporated electrode 200 on the first surface of the dielectric film 100 and a second evaporated electrode 200' on the second surface. The metal-free margins 300 of the first evaporated electrode 200 and the metal-free margins 300' of the second evaporated electrode 200' are arranged one-to-one on either side of the width of the metallized film. The layout of the first evaporated electrode 200 and the second evaporated electrode 200' is as described above.

[0047] Therefore, by providing the metallized film, it is possible to ensure the utilization rate of the electrode layer while ensuring a lower capacity loss rate and higher safety.

[0048] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0050] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0051] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0052] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0053] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A metallized film, characterized in that: include: A dielectric film, an evaporated electrode disposed on the dielectric film, and a metal-free margin; The vapor-deposited electrode is provided with a plurality of first non-metallic strips arranged along the length direction of the metallized film and a plurality of second non-metallic strips arranged along the width direction of the metallized film, so as to divide the vapor-deposited electrode into a plurality of divided electrode blocks, and two adjacent divided electrode blocks are connected by 0-1 fuses; Along the width direction of the metallized film, the vapor-deposited electrodes are separated by the second metal-free strips to form N columns of split electrode portions, where N is greater than or equal to 2, wherein the first column of split electrode portions is adjacent to the metal-free margin, and the Nth column of split electrode portions is farthest from the metal-free margin; when N is equal to 2, the first metal-free strips of two adjacent columns are staggered; when N is greater than 2, the first metal-free strips of at least two adjacent columns of three adjacent columns are staggered; Two to three of the fuses are arranged on the divided electrode blocks of the Nth column of divided electrode parts, and three to four of the fuses are arranged on the divided electrode blocks of the remaining columns of divided electrode parts; 0-1 fuses are arranged on the first metal-free strips of the first column of divided electrode parts, and no fuses are arranged on the first metal-free strips of the remaining columns of divided electrode parts.

2. The metallized film according to claim 1, wherein When N≥2, 1 to 2 fuses are arranged in the second metal-free zone corresponding to each of the split electrode blocks at the second metal-free zone between the split electrode portion in the Nth column and the split electrode portion in the (N-1)th column.

3. The metallized film according to claim 1, wherein The plurality of first metal-free strips are equally spaced apart.

4. A metallized film capacitor, characterized in that: A capacitor element is formed by winding or laminating a metallized film, and a sprayed metal for electrode extraction is connected to both end surfaces of the capacitor element. The metallized film is the metallized film according to any one of claims 1 to 3.

5. The metallized film capacitor according to claim 4, wherein: The invention comprises a first metallized film and a second metallized film, wherein the first metallized film is provided with the evaporated electrode on the first surface of the dielectric film, and the second metallized film is provided with the evaporated electrode on the first surface of the dielectric film, the first metallized film and the second metallized film are partially overlapped, and the metal-free margin of the first metallized film and the metal-free margin of the second metallized film are arranged on both sides of the width direction of the metallized film in a one-to-one correspondence.

6. The metallized film capacitor according to claim 4, wherein: The metallized film is provided with a first evaporated electrode on the first surface of the dielectric film and a second evaporated electrode on the second surface. The metal-free margins of the first evaporated electrode and the metal-free margins of the second evaporated electrode are arranged one-to-one on both sides of the width direction of the metallized film.

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