Substrate processing apparatus, substrate processing method, and storage medium

Abstract

A substrate processing apparatus, a substrate processing method, and a storage medium for forming a coating film on the periphery of the front surface and the side surface of a substrate. A substrate processing apparatus for forming a coating film on the periphery of a substrate including the periphery of the front surface and the side surface, includes: a substrate holding section configured to be capable of holding a substrate in a manner that the substrate is rotatable; a first chemical liquid supply section configured to be capable of supplying a first chemical liquid to the periphery of the substrate including the back surface of the substrate; a partial removal section that removes at least a portion of the first chemical liquid adhering to the front surface and the side surface of the substrate from the first chemical liquid supplied to the substrate; a second chemical liquid supply section configured to be capable of supplying a second chemical liquid for forming a coating film to the front surface and the side surface of the substrate; a first chemical liquid removal section that removes the first chemical liquid remaining on the substrate to which the second chemical liquid is adhered; and a control section that controls the substrate holding section, the first chemical liquid supply section, the partial removal section, the second chemical liquid supply section, and the first chemical liquid removal section.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus, a substrate processing method, and a storage medium. Background Technology

[0002] Patent document 1 discloses a technique for forming a ring-shaped coating film by applying a coating liquid to the periphery of a substrate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-62436 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] This invention provides a technique for forming a coating film on the periphery and sides of the front side of a substrate.

[0008] Technical solutions for solving technical problems

[0009] One aspect of the substrate processing apparatus of the present invention is a substrate processing apparatus for forming a coating film on a peripheral portion of a substrate, including the periphery and side surfaces of the front surface, comprising: a substrate holding section configured to hold the substrate in a rotatable manner; a first liquid supply section configured to supply a first liquid to the periphery of the substrate, including the back surface of the substrate; a partial removal section for removing at least a portion of the first liquid supplied to the substrate that is adhered to the front surface and side surfaces of the substrate; a second liquid supply section configured to supply a second liquid to the front surface and side surfaces of the substrate; a first liquid removal section for removing the first liquid retained on the substrate with the second liquid adhered to it; and a control section for controlling the substrate holding section, the first liquid supply section, the partial removal section, the second liquid supply section, and the first liquid removal section.

[0010] Invention Effects

[0011] According to the present invention, a technique is provided that enables the formation of a coating film on the periphery and sides of the front side of a substrate. Attached Figure Description

[0012] Figure 1 This is a three-dimensional diagram illustrating an example of a substrate processing system.

[0013] Figure 2 This is a side view that schematically represents an example of the interior of a substrate processing system.

[0014] Figure 3 This is a schematic diagram illustrating an example of a coating unit.

[0015] Figure 4 This is a block diagram illustrating an example of the hardware structure of a control device.

[0016] Figure 5 This is a schematic diagram illustrating an example of the shape of a coating film formed on a workpiece.

[0017] Figure 6 This is a flowchart illustrating an example of a substrate processing method.

[0018] Figure 7 (a)~ Figure 7 (f) is a schematic diagram illustrating an example of a substrate processing method.

[0019] Figure 8 (a)~ Figure 8 (f) is a schematic diagram used to illustrate a variation of the substrate processing method.

[0020] Figure 9 (a) and Figure 9 (b) is a schematic diagram illustrating a variation of the substrate processing method.

[0021] Explanation of reference numerals in the attached figures

[0022] 1...Substrate processing system

[0023] 2... Coating and developing apparatus

[0024] 11-14... Processing modules

[0025] 21... Rotary chuck

[0026] 22……Rotary drive unit

[0027] 31……First Processing Fluid Supply Department

[0028] 32……Second Processing Fluid Supply Department

[0029] 33……Third Processing Fluid Supply Department

[0030] 34……4th Processing Fluid Supply Department

[0031] 90...brush

[0032] 91...Raw Material

[0033] 100……Control device

[0034] F1... Solvent No. 1

[0035] F2……Second solvent

[0036] R……Coating film

[0037] R1...First Liquid

[0038] R2...Second potion

[0039] W……workpiece. Detailed Implementation

[0040] The following describes various illustrative implementation methods.

[0041] In one exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus is for forming a coating film on the peripheral portion of a substrate, including its front side and side surface. It includes: a substrate holding section configured to hold the substrate in a rotatable manner; a first solution supply section configured to supply a first solution to the peripheral portion of the substrate, including its back side; a partial removal section removing at least a portion of the first solution supplied to the substrate that adheres to the front and side surfaces of the substrate; a second solution supply section configured to supply a second solution for forming the coating film to the front and side surfaces of the substrate; a first solution removal section removing the first solution retained on the substrate with the second solution adhering to it; and a control section controlling the substrate holding section, the first solution supply section, the partial removal section, the second solution supply section, and the first solution removal section.

[0042] According to the substrate processing apparatus described above, after supplying a first solution to the periphery of the substrate, including the back side of the substrate, at least a portion of the first solution adhering to the front and side surfaces of the substrate is removed. Then, after supplying a second solution to the front and side surfaces of the substrate, the first solution remaining on the substrate is removed. Therefore, when the second solution for forming the coating film is supplied, the back side of the substrate is in a state where the first solution is adhered, thus preventing the second solution from adhering to the back side of the substrate, and allowing the coating film to be formed on the front and side surfaces of the substrate. Therefore, it is possible to prevent the formation of a coating film on the back side of the substrate, and to form a coating film on the periphery of the substrate, including the front and side surfaces.

[0043] Alternatively, the following method can be used: the first liquid supply unit includes a first nozzle disposed on the back side of the substrate for releasing the first liquid to the periphery of the substrate, and the second liquid supply unit includes a second nozzle disposed on the front side of the substrate for releasing the second liquid to the front and side sides of the substrate.

[0044] By positioning the first nozzle for releasing the first liquid agent on the back side of the substrate, the first liquid agent can be properly adhered to the periphery of the substrate, including the back side. Therefore, the first liquid agent can be used to prevent the second liquid agent from adhering to the back side of the substrate, and a coating film can be formed on the periphery of the substrate, including the front side and the sides.

[0045] Alternatively, the following method can be adopted: the first liquid supply unit includes a first nozzle disposed on the front side of the substrate and for releasing the first liquid to the periphery of the substrate, and the second liquid supply unit includes a second nozzle disposed on the front side of the substrate and for releasing the second liquid to the front and side sides of the substrate.

[0046] By placing the first nozzle for releasing the first liquid medicine on the front side of the substrate, it is possible to prevent the configuration of the mechanism for supplying the first liquid medicine to the back side of the substrate from becoming complicated.

[0047] Alternatively, the following method can be used: the partial removal section includes a third nozzle disposed on the front side of the substrate, which releases a solvent capable of removing the first drug solution onto the substrate; the control section controls the substrate holding section and the partial removal section so that the solvent is released onto the substrate while the substrate is rotated.

[0048] By employing a configuration in which a portion of the first solution is removed by supplying solvent from a third nozzle while rotating the substrate, at least a portion of the first solution adhering to the front and side surfaces of the substrate can be appropriately removed using the solvent. Therefore, a second solution used to form a coating film can be appropriately adhered to the front and side surfaces of the substrate.

[0049] Alternatively, the control unit can control the substrate holding unit and the second liquid supply unit so that when the substrate is rotated, the second liquid is supplied, and the rotational speed of the substrate when the second liquid is supplied by the second liquid supply unit is smaller than the rotational speed of the substrate when the solvent is supplied by the partial removal unit.

[0050] As described above, by making the rotational speed of the substrate when the second drug solution is supplied by the second drug solution supply unit less than the rotational speed of the substrate when the solvent is supplied by the partial removal unit, it is possible to prevent the solvent from moving to the back side of the substrate. Furthermore, by reducing the rotational speed of the substrate when the second drug solution is supplied, the second drug solution can be supplied evenly to the substrate, and it is possible to prevent the second drug solution from scattering due to liquid splashing or the like.

[0051] Alternatively, the third nozzle can spray the solvent in a mist onto the substrate. By spraying the solvent in a mist, the solvent can be supplied to the desired location on the substrate, and the first solution can be appropriately removed using the solvent.

[0052] Alternatively, the partial removal section may include a removal component capable of removing the first liquid by contacting the front and side surfaces of the substrate while the substrate is rotated using the substrate holding section. In this way, by removing the first liquid by contacting the removal component with the front and side surfaces of the substrate, the first liquid at a desired location can be appropriately removed.

[0053] In one exemplary embodiment, a substrate processing method is provided. The substrate processing method is a method for forming a coating film on the peripheral portion of a substrate, including its front side and side surface. The method includes: supplying a first solution to the peripheral portion of the substrate, including its back side; removing at least a portion of the first solution supplied to the substrate that adheres to the front and side surfaces of the substrate; supplying a second solution for forming the coating film to the front and side surfaces of the substrate; and removing the first solution remaining on the substrate to which the second solution adheres.

[0054] According to the substrate processing method described above, after supplying the first solution to the periphery of the substrate, including the back side of the substrate, at least a portion of the first solution adhering to the front and side surfaces of the substrate is removed. Then, after supplying the second solution to the front and side surfaces of the substrate, the first solution remaining on the substrate is removed. Therefore, when the second solution for forming the coating film is supplied, the back side of the substrate is in a state where the first solution is adhered, thus preventing the second solution from adhering to the back side of the substrate, and allowing the coating film to be formed on the front and side surfaces of the substrate. Therefore, it is possible to prevent the formation of a coating film on the back side of the substrate, and to form a coating film on the periphery of the substrate, including the front and side surfaces.

[0055] In one exemplary embodiment, a computer-readable storage medium is provided. The computer-readable storage medium can also store a program for causing a device to perform the methods described above. The storage medium achieves the same effect as the substrate processing method described above.

[0056] Hereinafter, one embodiment will be described with reference to the accompanying drawings. In the description, the same reference numerals are used to label components that have the same elements or functions, and repeated descriptions are omitted.

[0057] [Substrate Processing System]

[0058] Figure 1The substrate processing system 1 shown is a system for forming a photosensitive coating on a workpiece W, exposing the photosensitive coating, and developing the photosensitive coating. The workpiece W, the object of processing, is, for example, a substrate or a substrate that has been formed into films and circuits through a prescribed process. As an example, the substrate included in the workpiece W is a silicon-containing wafer. The workpiece W (substrate) may also be formed in a circular shape. The workpiece W, the object of processing, may be a glass substrate, a mask substrate, an FPD (Flat Panel Display), or an intermediate obtained by performing a prescribed process on these substrates. The photosensitive coating is, for example, a resist film.

[0059] The substrate processing system 1 includes a coating and developing apparatus 2, an exposure apparatus 3, and a control device 100 (control unit). The exposure apparatus 3 is used to expose the resist film (photosensitive coating) formed on the workpiece W (substrate). Specifically, the exposure apparatus 3 irradiates the exposed portion of the resist film with energy lines using methods such as immersion exposure. Before the exposure process performed by the exposure apparatus 3, the coating and developing apparatus 2 coats the surface of the workpiece W with a resist (solution) to form a resist film, and after the exposure process, it performs a developing process on the resist film.

[0060] (Substrate processing device)

[0061] The structure of the coating and developing apparatus 2 will be described below as an example of a substrate processing apparatus. Figure 1 and Figure 2 As shown, the coating and developing apparatus 2 includes a carrier block 4, a processing block 5, and an interface block 6.

[0062] The carrier block 4 handles the introduction of workpiece W into and removal of workpiece W from the coating and developing apparatus 2. For example, the carrier block 4 can support multiple carriers C for workpiece W and includes a built-in conveyor A1 containing a transfer arm. The carriers C hold multiple workpieces W, for example, circular shapes. The conveyor A1 removes workpiece W from the carriers C and delivers it to the processing block 5, receives workpiece W from the processing block 5, and returns it to the carriers C. The processing block 5 has multiple processing modules 11, 12, 13, and 14.

[0063] Processing module 11 includes a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying workpiece W to these units. Processing module 11 uses the coating unit U1 and the heat treatment unit U2 to form a lower film on the surface of workpiece W. The coating unit U1 applies a processing liquid for lower film formation to the workpiece W. The heat treatment unit U2 performs various heat treatments accompanying the formation of the lower film.

[0064] Processing module 12 (liquid treatment unit) includes a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying workpiece W to these units. Processing module 12 performs liquid treatment, including forming a resist film on a lower film using the coating unit U1 and the heat treatment unit U2. The coating unit U1 applies a processing liquid (resist) for resist film formation onto the lower film. The heat treatment unit U2 performs various heat treatments accompanying the film formation. Furthermore, the coating unit U1 has the function of forming a resist liquid coating film around the periphery of the workpiece W.

[0065] Processing module 13 includes a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying workpiece W to these units. Processing module 13 uses the coating unit U1 and the heat treatment unit U2 to form an upper film on the resist film. The coating unit U1 coats the resist film with a liquid for upper film formation. The heat treatment unit U2 performs various heat treatments accompanying the formation of the upper film.

[0066] Processing module 14 includes a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying workpiece W to these units. Processing module 14 utilizes the coating unit U1 and the heat treatment unit U2 to perform development treatment of the photoresist film after exposure treatment and accompanying heat treatment. The coating unit U1 applies a developer to the surface of the exposed workpiece W and then cleans it with a rinsing solution, thereby performing the development treatment of the photoresist film. The heat treatment unit U2 performs various heat treatments accompanying the development treatment. Specific examples of heat treatment include pre-development heat treatment (PEB: Post-Exposure Bake) and post-development heat treatment (PB: Post-Bake).

[0067] A shelf unit U10 is provided on the side of the carrier block 4 within the processing block 5. The shelf unit U10 is divided into multiple small chambers arranged in the vertical direction. A conveying device A7, including a lifting arm, is provided near the shelf unit U10. The conveying device A7 causes the workpiece W to move up and down between the small chambers of the shelf unit U10.

[0068] A shelf unit U11 is provided on the interface block 6 side within processing block 5. The shelf unit U11 is divided into multiple small compartments arranged in the vertical direction.

[0069] Interface block 6 facilitates the transfer of workpiece W between itself and exposure device 3. For example, interface block 6 includes a built-in conveyor A8 with a transfer arm, which is connected to exposure device 3. Conveyor A8 delivers workpiece W, which is positioned in shelf unit U11, to exposure device 3. Conveyor A8 receives workpiece W from exposure device 3 and returns it to shelf unit U11.

[0070] [Coating Unit]

[0071] The coating unit U1 of the processing module 12 will now be described in detail. For example... Figure 3 As shown, the coating unit U1 of the processing module 12 includes a rotary chuck 21 (substrate holding part), a rotary drive part 22, a support pin 23, a guide ring 25, a cup-shaped body 26, an exhaust pipe 28, and a drain port 29. Furthermore, the coating unit U1 includes a first processing liquid supply part 31, a second processing liquid supply part 32, a third processing liquid supply part 33, and a fourth processing liquid supply part 34.

[0072] In addition, the first processing liquid supply unit 31 to the fourth processing liquid supply unit 34 mentioned above are processing liquids used when forming a coating film on the periphery of the workpiece W.

[0073] The rotary chuck 21 holds the workpiece W horizontally. The rotary chuck 21 is connected to the rotary drive unit 22 via a shaft extending in the vertical direction. The rotary drive unit 22 rotates the rotary chuck 21 at a predetermined speed based on a control signal output from the control device 100.

[0074] Support pins 23 are pins that support the back of workpiece W. For example, three support pins 23 are provided around the shaft of the rotary chuck 21. Support pins 23 can be raised and lowered via a lifting mechanism (not shown). Workpiece W is transferred between the workpiece W conveying mechanism (not shown) and the rotary chuck 21 using support pins 23.

[0075] A guide ring 25 is positioned below the workpiece W held by the rotary chuck 21 and functions to guide the processing fluid supplied to the surface of the workpiece W to a drain port. Furthermore, a cup-shaped body 26 is provided around the outer periphery of the guide ring 25 to suppress the spread of the processing fluid. The upper part of the cup-shaped body 26 is open to allow the workpiece W to be transferred to the rotary chuck 21. A space 27, serving as a discharge path for the liquid, is formed between the side peripheral surface of the cup-shaped body 26 and the outer peripheral edge of the guide ring 25. Additionally, an exhaust pipe 28 with an exhaust port 28a and a drain port 29 for discharging liquid moving within the space 27 are provided below the cup-shaped body 26.

[0076] In addition, the coating unit U1 is provided with four processing liquid supply units for supplying four types of processing liquids. The first processing liquid supply unit 31 (partial removal unit) and the second processing liquid supply unit 32 (second chemical liquid supply unit) release processing liquid from the upper part of the workpiece W supported by the rotary chuck 21 towards the periphery of the front side of the workpiece W. The third processing liquid supply unit 33 (first chemical liquid supply unit) and the fourth processing liquid supply unit 34 (first chemical liquid removal unit) release processing liquid from the lower part of the workpiece W supported by the rotary chuck 21 towards the periphery of the back side of the workpiece W.

[0077] The first processing fluid supply unit 31 is configured to include a nozzle 31a (the third nozzle), a processing fluid supply source 31b, and a pipe 31c. Similarly, the second processing fluid supply unit 32 is configured to include a nozzle 32a (the second nozzle), a processing fluid supply source 32b, and a pipe 32c. The third processing fluid supply unit 33 is configured to include a nozzle 33a (the first nozzle), a processing fluid supply source 33b, and a pipe 33c. The fourth processing fluid supply unit 34 is configured to include a nozzle 34a, a processing fluid supply source 34b, and a pipe 34c. An on / off valve controlled by the control device 100 may also be provided on the pipes of each of the first to fourth processing fluid supply units 31 to 34. Alternatively, the supply / stop of processing fluid may be switched by switching the open and closed states of the on / off valves based on a control signal from the control device 100.

[0078] Furthermore, the processing liquid supplied from the first processing liquid supply unit 31 can be, for example, a solvent. Examples of solvents supplied from the first processing liquid supply unit 31 include those capable of dissolving the processing liquid supplied from the third processing liquid supply unit 33 (e.g., a diluent). Additionally, the processing liquid supplied from the second processing liquid supply unit 32 can be, for example, a processing liquid used when forming a coating film on the periphery of the workpiece W (e.g., a photoresist liquid). Examples of processing liquids supplied from the third processing liquid supply unit 33 include liquids capable of adhering to the end face of the workpiece W and capable of dissolving the solvent supplied from the first processing liquid supply unit 31. Furthermore, the processing liquid supplied from the fourth processing liquid supply unit 34 can be a solvent capable of removing the processing liquid supplied from the third processing liquid supply unit 33 and incapable of dissolving the processing liquid supplied from the second processing liquid supply unit 32. In the following description, the processing liquid supplied from the third processing liquid supply unit 33 is sometimes referred to as the first processing liquid R1, and the processing liquid (processing liquid for coating film formation) supplied from the second processing liquid supply unit 32 is sometimes referred to as the second processing liquid R2. Furthermore, the solvent supplied from the first processing liquid supply unit 31 is sometimes referred to as the first solvent F1, and the solvent supplied from the fourth processing liquid supply unit 34 is sometimes referred to as the second solvent F2. Based on the above relationships, the first processing liquid R1 and the second processing liquid R2 can be the same agent. Furthermore, the first solvent F1 and the second solvent F2 can be different agents. However, for example, the same agent can be selected as the first solvent F1 and the second solvent F2.

[0079] Furthermore, in this embodiment, the term "dissolving" of a specific liquid in a specific solvent means that when a specific solvent is mixed with a specific liquid, the components constituting the liquid do not dissolve in the solvent, but are able to move. Specifically, a specific liquid adhering to a workpiece W without moving means that the components constituting the liquid (e.g., resin particles in the case of a resist liquid) are close to each other. When a specific solvent is mixed with a liquid in this state, the solvent enters between the components constituting the liquid. As a result, the components in the liquid are able to move (flow), resulting in a state where the liquid is removed from the area where it is adhered. In this embodiment, "dissolving" means that the liquid can move as described above, resulting in the removal of the liquid.

[0080] The nozzles 31a of the first processing fluid supply unit 31 and 32a of the second processing fluid supply unit 32 are mounted, for example, on an arm extending in the horizontal direction, and are movable in the horizontal direction. Furthermore, the nozzles 31a and 32a are also movable in the vertical direction. A moving mechanism is provided for moving the nozzles 31a and 32a in both the horizontal and vertical directions. Through the operation of the moving mechanism, the nozzles 31a and 32a can move between a standby position outside the cup-shaped body 26 and above the workpiece W.

[0081] The nozzles 33a of the third processing fluid supply unit 33 and 34a of the fourth processing fluid supply unit 34, like the nozzles 31a and 32a, can be moved in the vertical and horizontal directions by a moving mechanism. Furthermore, the standby positions of the nozzles 33a and 34a can be separate from the standby positions of the nozzles 31a and 32a.

[0082] Nozzles 31a to 34a can all be nozzles with a small (narrow diameter) discharge port diameter (e.g., 0.2 mm to 1.2 mm). When using such a narrow-diameter nozzle, by moving the nozzle position vertically and horizontally, the treatment fluid can be appropriately supplied to a specific location on the workpiece W. However, the diameter and shape of nozzles 31a to 34a are not limited to the examples described above.

[0083] The control device 100 controls the coating and developing apparatus 2. The control device 100 executes the liquid treatment of the workpiece W by the processing module 12 according to predetermined conditions. For example, the control device 100 supplies each processing liquid to the workpiece W using the first processing liquid supply unit 31 to the fourth processing liquid supply unit 34 based on predetermined conditions, and controls the rotation of the workpiece W at the same time. The control device 100 may also be composed of multiple functional modules for performing the above-described liquid treatment. Each functional module is not limited to being implemented by executing a program, but may also be implemented by dedicated circuits (e.g., logic circuits) or integrated circuits (ASICs).

[0084] The hardware of the control device 100 can be, for example, composed of one or more control computers. Figure 4 As shown, the control device 100 includes a circuit 201 as a hardware structure. The circuit 201 can be composed of circuit elements. The circuit 201 may also include a processor 202, a memory 203, a storage device 204, a driver 205, and an input / output port 206.

[0085] The processor 202, in conjunction with at least one of the memory 203 and storage 204, executes the program and performs input / output of signals via the input / output port 206, thereby constituting the aforementioned functional modules. The memory 203 and storage 204 store various information, programs, etc., used in the control device 100. The driver 205 is a circuit that drives various devices of the coating and developing apparatus 2. The input / output port 206 enables signal input / output between the driver 205 and the various components constituting the coating and developing apparatus 2.

[0086] The substrate processing system 1 may include a control device 100 or a controller group (control unit) consisting of multiple control devices 100. When the substrate processing system 1 includes a controller group, for example, each of the multiple functional modules may be implemented by a different control device, or by a combination of two or more control devices 100. When the control device 100 is composed of multiple computers (circuit 201), each of the multiple functional modules may be implemented by one computer (circuit 201). Furthermore, the control device 100 may also be implemented by a combination of two or more computers (circuit 201). The control device 100 may also have multiple processors 202. In this case, each of the multiple functional modules may be implemented by one processor 202, or by a combination of two or more processors 202. Alternatively, a portion of the functionality of the control device 100 of the substrate processing system 1 may be located in a device different from the substrate processing system 1 and connected to the substrate processing system 1 via a network to perform various operations as described in this embodiment. For example, when the functions of the processors 202, memory 203, and storage 204 of multiple substrate processing systems 1 are implemented together using one or more different devices, the information and actions of multiple substrate processing systems 1 can also be managed and controlled remotely.

[0087] The processing of workpiece W performed in substrate processing system 1 will now be described. Control device 100 controls coating and developing device 2 to perform processing of workpiece W, for example, in the following process. First, control device 100 controls conveying device A7 to convey workpiece W in carrier C to shelf unit U10, and controls conveying device A1 to place workpiece W in the chamber for processing module 11.

[0088] Next, the control device 100 controls the conveying device A3 to transport the workpiece W from the shelf unit U10 to the coating unit U1 and heat treatment unit U2 within the processing module 11. Furthermore, the control device 100 controls the coating unit U1 and heat treatment unit U2 to form a lower film on the surface of the workpiece W. Afterward, the control device 100 controls the conveying device A3 to return the workpiece W with the lower film formed to the shelf unit U10, and controls the conveying device A7 to place the workpiece W into the processing module 12.

[0089] Next, the control device 100 controls the conveying device A3 to transport the workpiece W from the shelf unit U10 to the coating unit U1 and heat treatment unit U2 within the processing module 12. The control device 100 controls the coating unit U1 and heat treatment unit U2 to form a resist film on the lower layer of the workpiece W. An example of the liquid treatment method performed in the processing module 12 will be described later. Afterward, the control device 100 controls the conveying device A3 to transport the workpiece W to the shelf unit U10 and controls the conveying device A7 to position the workpiece W into the chamber for the processing module 13.

[0090] Next, the control device 100 controls the conveying device A3 to transport the workpiece W from the shelf unit U10 to the coating unit U1 and heat treatment unit U2 within the processing module 13. Furthermore, the control device 100 controls the coating unit U1 and heat treatment unit U2 to form an upper film on the resist film of the workpiece W. Afterward, the control device 100 controls the conveying device A3 to transport the workpiece W to the shelf unit U11.

[0091] Next, the control device 100 controls the conveying device A8 to deliver the workpiece W housed in the shelf unit U11 to the exposure device 3. Then, in the exposure device 3, the resist film formed on the workpiece W is exposed. Afterward, the control device 100 controls the conveying device A8 to receive the exposed workpiece W from the exposure device 3 and place the workpiece W into the chamber of the processing module 14 in the shelf unit U11.

[0092] Next, the control device 100 controls the conveying device A3 to transport the workpiece W from the shelf unit U11 to the heat treatment unit U2 of the processing module 14. Then, the control device 100 controls the coating unit U1 and the heat treatment unit U2 to perform heat treatment and development processes accompanied by development processes. As described above, the control device 100 concludes the substrate processing of one workpiece W.

[0093] [Substrate Processing Methods]

[0094] The following describes an example of the substrate processing method performed in processing module 12. Here, as a liquid processing method, a method for forming a resist film on the periphery of workpiece W will be described. Figure 5 This illustrates an example of a workpiece W with a coating film R formed on its periphery. In processing module 12, a coating film (resist film) is also formed on the front surface W1 of workpiece W, excluding the periphery; however, the description of the coating film outside the periphery is omitted. The coating film R applied to the periphery of workpiece W is provided to protect an area on the front surface W1 of workpiece W that is different from the central portion where the resist pattern is formed.

[0095] like Figure 5As shown, the workpiece W has a front surface W1 and a back surface W2 forming a pair of main surfaces, and a strip-shaped side surface W3 extending in a direction orthogonal to the front surface W1 and the back surface W2. Furthermore, an inclined surface W4 is formed between the front surface W1 and the side surface W3 of the workpiece W, and an inclined surface W5 is also formed between the back surface W2 and the side surface W3. A coating film R is formed, for example, in a region extending radially several millimeters from the side surface W3 of the workpiece W, with a thickness of 10 nm to 100 μm. The coating film R is also formed on the inclined surface W4 and the side surface W3. Specifically, the coating film R is formed in the upper part of the side surface W3, in a region that is approximately 30% to 100% of the height (length) of the side surface W3 along the thickness direction of the workpiece W (orthogonal to the front surface W1 and the back surface W2). Furthermore, the thickness of the coating film R on the side surface W3 is, for example, 10 nm to 100 μm.

[0096] In this way, the coating film R is formed to cover the periphery of the front surface W1 of the workpiece W, as well as a portion of the inclined surface W4 and the side surface W3 that are continuous from the periphery of the front surface W1. Thus, the front surface W1 of the workpiece W can also be protected, including the inclined surface W4 and a portion of the side surface W3. That is, the periphery of the workpiece W to which the coating film R is formed refers to the periphery of the front surface W1 and a portion of the inclined surface W4 and the side surface W3 that are continuous from the periphery of the front surface W1. However, when considering conveying the workpiece W after the coating film R is formed, it is required that the coating film R not be formed on the inclined surface W5 and the back surface W2 of the workpiece W.

[0097] Figure 6 It means as Figure 5 The diagram illustrates an example of a process for forming a coating film R on the periphery of the front surface W1 of the workpiece W, as well as on a portion of the inclined surface W4 and the side surface W3 that are continuous from the periphery of the front surface W1. Furthermore, Figure 7 (a)~ Figure 7 (f) is an explanation Figure 6 A diagram showing the periphery of workpiece W in each process step. Furthermore, in Figure 7 and the following Figure 8 The diagram shows only a portion of the cross-section of the workpiece W (the periphery). As described later, while rotating the workpiece W, each processing liquid is supplied to the workpiece W, so that each processing liquid is applied (adhered) to the workpiece W in a ring shape.

[0098] like Figure 6 As shown, the control device 100 executes step S01. In step S01, the control device 100 controls the support pin 23 of the conveying device A3 and the coating unit U1 to support the workpiece W on the rotating chuck 21 of the coating unit U1.

[0099] Next, the control device 100 executes step S02. In step S02, while the workpiece W is rotated by driving the rotary drive unit 22, the control device 100 controls the third processing liquid supply unit 33 to release the first processing liquid from the nozzle 33a to the back surface W2 of the workpiece W. Thus, as... Figure 7 As shown in (a), the first liquid medicine R1 is attached to the back surface W2, the inclined surface W5 and the side surface W3 of the workpiece W.

[0100] Next, the control device 100 executes step S03. In step S03, while the workpiece W is rotated by driving the rotary drive unit 22, the control device 100 controls the first processing liquid supply unit 31 to release the first solvent F1 from the nozzle 31a onto the front surface W1 of the workpiece W. Thus, as... Figure 7 As shown in (b), the first solvent F1 adheres to the top of the front surface W1, the inclined surface W4, and the side surface W3 of the workpiece W. By controlling the rotational speed of the workpiece W using the rotary drive unit 22, the first solvent F1 supplied to the front surface W1 of the workpiece W diffuses outward from the workpiece W while also diffusing upward from the front surface W1, the inclined surface W4, and the side surface W3. By adjusting the rotational speed, the diffusion of the first solvent F1 on the workpiece W can be controlled. Although it also depends on the type and characteristics of the solvent, the size of the workpiece W, etc., increasing the rotational speed of the workpiece W to a certain extent can make the first solvent F1 reach the side surface W3 of the workpiece W and prevent the first solvent F1 from reaching the inclined surface W5 and the back surface W2 of the workpiece W. That is, the rotational speed of the workpiece W in step S02 is controlled such that the first solvent F1 can move outward from the workpiece W and is difficult to spread to the inclined surface W5 and the back surface W2. As an example, the rotational speed of the workpiece W at this time is around 1000 rpm to 4000 rpm.

[0101] The first chemical solution R1 is a reagent that can be removed by the first solvent F1. Therefore, when the first chemical solution R1 is applied and then the solvent is supplied, the first chemical solution R1 applied to the workpiece W is removed. As a result, as... Figure 7 As shown in (c), the first drug solution R1 in the region supplied with the first solvent F1 is removed, becoming a state in which a portion of the first drug solution R1' is retained after removal.

[0102] Next, the control device 100 executes step S04. In step S04, while the workpiece W is rotated by driving the rotary drive unit 22, the control device 100 controls the second processing liquid supply unit 32 to release the second processing liquid from the nozzle 32a. Thus, as... Figure 7As shown in (d), the second liquid R2 adheres to the top of the front surface W1, the inclined surface W4, and the side surface W3 of the workpiece W. By controlling the rotational speed of the workpiece W using the rotary drive unit 22, the second liquid R2 supplied to the front surface W1 of the workpiece W diffuses outwards from the outer periphery of the workpiece W while also diffusing upwards from the front surface W1, the inclined surface W4, and the side surface W3. By adjusting the rotational speed, the diffusion of the second liquid R2 on the workpiece W can be controlled. The second liquid R2 diffuses along each surface of the workpiece W, thus diffusing along the areas where the first liquid R1 was removed by the first solvent F1 and the areas where the first liquid R1 was not originally attached. Furthermore, the second liquid R2 does not have the characteristic of being able to remove the first liquid R1, therefore... Figure 7 As shown in (d), even if the second drug solution R2 diffuses onto part of the removed first drug solution R1', it cannot remove the first drug solution R1' and becomes attached to the top of the first drug solution R1'.

[0103] While it also depends on the type and properties of the second solvent R2, the size of the workpiece W, etc., in order to control the diffusion of the second solvent R2 so that it reaches the side W3 of the workpiece W, the rotation speed of the workpiece W is reduced to a certain extent. That is, the rotation speed of the workpiece W in step S04 is lower than the rotation speed when the first solvent F1 diffuses from the center to the outside on the front W1 of the workpiece W (the rotation speed in step S02). As an example, the rotation speed of the workpiece W at this time is less than 1000 rpm.

[0104] Next, the control device 100 executes step S05. In step S05, while the workpiece W is rotated by driving the rotation drive unit 22, the control device 100 controls the fourth processing liquid supply unit 34 to release the second solvent F2 from the nozzle 34a to the back surface W2 of the workpiece W. Thus, as... Figure 7 As shown in (e), the first chemical solution R1', remaining below the back surface W2, inclined surface W5, and side surface W3 of the workpiece W, comes into contact with the second solvent F2. The first chemical solution R1' is a chemical agent that can be removed by the second solvent F2. Therefore, when the solvent is supplied after the first chemical solution R1' has adhered, the first chemical solution R1' adhering to the workpiece W is removed. The second solvent F2 is released to the extent that the first chemical solution R1' adhering to the workpiece W is completely removed. On the other hand, the chemical agent and solvent are selected so that the second chemical solution R2 is not removed from the workpiece W by the second solvent F2. As a result, as Figure 7 As shown in (f), the first solution R1' is removed, while the second solution R2 is retained. The second solution R2 becomes a coating film R formed on the workpiece W.

[0105] Through the above processing, the periphery of workpiece W becomes... Figure 5 The state shown is characterized by the formation of a coated film R. Furthermore, in... Figure 6The text only describes the application of a treatment liquid (medicinal solution or solvent) to the workpiece W, but it also suggests that heat treatment, drying treatment, etc., may be performed between steps for purposes such as fixing the medicinal solution or promoting the removal of the solvent. In the case of heat treatment, for example, the workpiece W may be moved to the heat treatment unit U2 for heat treatment.

[0106] (Example of Substrate Processing Method Modification - 1)

[0107] Reference Figure 8 ,right Figure 6 and Figure 7 A modified example of the substrate processing method shown will be explained. The modified example of substrate processing method is also similar to... Figure 6 The process follows the same sequence as the flowchart shown, but the specific processing methods in some steps differ from the substrate processing method described above. The following explanation focuses on the areas of change.

[0108] The control device 100 executes step S01. In step S01, the control device 100 controls the support pin 23 of the conveying device A3 and the coating unit U1 to support the workpiece W on the rotating chuck 21 of the coating unit U1.

[0109] Next, the control device 100 executes step S02. In step S02, the control device 100 supplies the first chemical solution while the workpiece W is rotated by driving the rotation drive unit 22. Here, in the modified substrate processing method, the first chemical solution is supplied from the front side of the workpiece W. Therefore, instead of the nozzle 33a of the third processing liquid supply unit 33, the first chemical solution is released from the nozzle 35a provided on the front side of the workpiece W to the front side W1 of the workpiece W. At this time, the control device 100 controls the rotational speed of the workpiece W, etc. Figure 8 As shown in (a), the first liquid medicine is brought from the front W1 of the workpiece W through the side W3 to the back W2. Thus, the first liquid medicine R1 is attached to the front W1, the inclined surface W4, the back W2, the inclined surface W5 and the side W3 of the workpiece W.

[0110] Next, the control device 100 executes step S03. In step S03, while the workpiece W is rotated by driving the rotary drive unit 22, the control device 100 controls the first processing liquid supply unit 31 to release the first solvent F1 from the nozzle 31a onto the front surface W1 of the workpiece W. Thus, as... Figure 8 As shown in (b), the first solvent F1 adheres to the top of the front surface W1, the inclined surface W4, and the side surface W3 of the workpiece W. By controlling the rotational speed of the workpiece W using the rotary drive unit 22, the first solvent F1 supplied to the front surface W1 of the workpiece W diffuses outwards from the outer periphery of the workpiece W while also diffusing to the top of the front surface W1, the inclined surface W4, and the side surface W3. By adjusting the rotational speed, the diffusion of the first solvent F1 on the workpiece W can be controlled.

[0111] The first chemical solution R1 is a chemical agent that can be removed by the first solvent F1. Therefore, when the first chemical solution R1 is applied and then the solvent is supplied, the first chemical solution R1 applied to the workpiece W is removed. As a result, as... Figure 8 As shown in (c), the first drug solution R1 in the region supplied with the first solvent F1 is removed, leaving a portion of the removed first drug solution R1' retained. This state is similar to... Figure 7 The state shown in (c) is roughly the same. However, when the first liquid medicine R1 is supplied from the front W1 side of the workpiece W, although it depends on the viscosity and other characteristics of the first liquid medicine R1, it is similar to that shown in (c). Figure 7 Compared to the case shown in (c) where the medicine is supplied from the back W2 side, sometimes less of the first medicine R1' is retained on the back W2 side.

[0112] Next, the control device 100 executes step S04. In step S04, the control device 100, by driving the rotation drive unit 22, controls the second processing liquid supply unit 32 to discharge the second processing liquid from the nozzle 32a while the workpiece W is rotating. Thus, as... Figure 8 As shown in (d), the second liquid R2 adheres to the top of the front surface W1, the inclined surface W4, and the side surface W3 of the workpiece W.

[0113] Next, the control device 100 executes step S05. In step S05, while the workpiece W is rotated by driving the rotation drive unit 22, the control device 100 controls the fourth processing liquid supply unit 34 to release the second solvent F2 from the nozzle 34a to the back surface W2 of the workpiece W. Thus, as... Figure 8 As shown in (e), the first solution R1', which remains below the back surface W2, inclined surface W5, and side surface W3 of the workpiece W, comes into contact with the second solvent F2, and the first solution R1' adhering to the workpiece W is removed. As a result, as... Figure 8 As shown in (f), the first chemical solution R1' is removed, leaving a state where the second chemical solution R2 remains. This second chemical solution R2 becomes a coating film R formed on the workpiece W.

[0114] Through the above processing, a layer is formed on the periphery of workpiece W. Figure 5 The coating film R shown. Furthermore, in Figure 6 The text only describes the application of a treatment solution (medicinal solution or solvent) to the workpiece W, but it also suggests that heat treatment, drying treatment, etc., can be performed between steps for purposes such as fixing the medicinal solution or promoting the removal of the solvent. In the case of heat treatment, for example, the workpiece W can be moved to the heat treatment unit U2 for heat treatment. This is... Figure 8 The same applies to the process shown.

[0115] For reference Figure 8The substrate processing method of the modified example described can also supply the first solution R1 to the workpiece W from the front side W1 side. However, the first solution R1 is used to prevent the formation of a coating film R formed by the second solution R2 on the back side W2 and the inclined surface W5 of the workpiece W. By selecting and supplying the first solution R1 so that the first solution R1 can fully adhere to the areas of the back side W2 and the inclined surface W5 of the workpiece W where the second solution R2 may adhere in step S04, the above-mentioned objective can be achieved.

[0116] (Example 2 of a change in substrate processing method)

[0117] Below, refer to Figure 9 A modified example of step S03 in the substrate processing method will be described. In step S03, a portion of the first solvent R1 adhering to the workpiece W is removed, but the removal method is not limited to the release method described above, which uses nozzle 31a to release the first solvent F1.

[0118] exist Figure 9 In (a), an example is shown where a portion of the first liquid medicine R1 is removed using a brush 90 having bristles 91 (removal component) capable of abutting against the front surface W1, inclined surface W4, and side surface W3 of a workpiece W to which the first liquid medicine R1 is attached. By bringing the brush 90 against the workpiece W, the first liquid medicine R1 attached to the front surface W1, inclined surface W4, and side surface W3 of the workpiece W can be removed, while the first liquid medicine R1 below remains. It is also possible to prevent the workpiece W from being damaged by the bristles 91 by making the shape of the bristles 91 correspond to the shape of the periphery of the workpiece W. Furthermore, it is also possible to configure the brush 90 to be movable in the horizontal and vertical directions, for example, using a moving mechanism (not shown), thereby allowing it to remain idle outside the cup-shaped body 26 when the brush 90 is not in use. Furthermore, in Figure 9 In (a), a brush 90 with bristles 91 is shown, but the removal part for removing the first liquid medicine R1 is not limited to bristles 91, and a sponge or the like may also be used.

[0119] exist Figure 9 In (b), it is shown that when the first solvent F1 is released from the nozzle 31a of the first processing liquid supply unit 31, the first solvent F1 is sprayed out in a mist from the nozzle 31a. The method of releasing the first solvent F1 can be changed in this way. When the first solvent F1 is sprayed in a mist, the first drug solution R1 comes into easy contact with the first solvent F1, thus promoting the movement (removal) of the first drug solution R1 based on the first solvent F1. Therefore, when controlling the range of removal of the first drug solution R1 by utilizing the movement of the first solvent F1, high-precision control can be performed.

[0120] [effect]

[0121] According to the substrate processing apparatus (coating and developing apparatus 2) and substrate processing method described above, after the first chemical solution R1 is supplied to the periphery of the workpiece W, including the back surface W2, the first chemical solution R1 adhering to at least a portion of the front surface W1 and side surface W3 of the workpiece W is removed. Then, after the second chemical solution R2 is supplied to the front surface W1 and side surface of the workpiece W, the first chemical solution R1 (first chemical solution R1') remaining on the workpiece W is removed using the second solvent F2. In this way, when the second chemical solution R2 for forming the coating film R is supplied, the back surface of the workpiece W is in a state where the first chemical solution R1 is adhered, thus preventing the second chemical solution R2 from adhering to the back surface of the workpiece W, and thus enabling the formation of the coating film R on the front surface W1 and side surface of the workpiece W. Therefore, it is possible to prevent the formation of a coating film on the back surface of the workpiece W, and to form a coating film on the periphery, including the periphery and side surface of the front surface W1 of the workpiece W.

[0122] In the prior art, techniques have been studied to prevent damage to the periphery of workpiece W during various processing processes such as etching by forming a coating film of resist liquid or the like on the periphery of the front surface W1 of workpiece W. In contrast, there are cases where the side surface W3 of workpiece W and the inclined surface W4 between the front surface W1 and the side surface W3 are also damaged during subsequent processing. Therefore, techniques have been studied to protect workpiece W by forming a coating film on the inclined surface W4 and the side surface W3 as well. However, when using the method of forming a coating film on the periphery of the front surface W1 of workpiece W, the processing liquid for coating film formation may also spread to the back surface W2 of workpiece W when supplied to the side surface W3, etc. When the processing liquid spreads to the back surface W2, it may affect the subsequent transport of workpiece W. Therefore, it is necessary to control the supply of processing liquid so that a coating film does not form on the inclined surface W5, which is lower than the side surface W3 of workpiece W, and on the back surface W2.

[0123] In this regard, according to the method described above, since the first liquid R1 is supplied to the back surface W2 of the workpiece W before the second liquid R2 is applied, the back surface W2 of the workpiece W is protected by the first liquid R1 when the second liquid R2 is supplied. Therefore, the second liquid R2 can be prevented from adhering to the back surface W2 of the workpiece W, and the formation of the coating film R can also be prevented. Furthermore, the first liquid R1 adhering to the side surface W3, etc., is removed, for example, by the supply of the first solvent F1 by the first processing liquid supply unit 31 before the supply of the second liquid R2. Therefore, since the first liquid R1 is removed from the side surface W3 of the workpiece W and the second liquid R2 is supplied, the second liquid R2 can be appropriately used to form a coating film. Therefore, the formation of the coating film R on the back surface W2 of the workpiece W can be prevented, and the coating film R can be appropriately formed on the periphery of the front surface W1 and the side surface W3.

[0124] Furthermore, in the aforementioned apparatus, the third processing liquid supply unit 33 (first processing liquid supply unit) for supplying the first liquid R1 includes a nozzle 33a (first nozzle) disposed on the back side W2 of the workpiece W, which releases the first liquid R1 to the periphery of the workpiece W. Additionally, the second processing liquid supply unit 32 (second processing liquid supply unit) for supplying the second liquid R2 includes a nozzle 32a (second nozzle) disposed on the front side W1 of the workpiece W, which releases the second liquid R2 to the front side W1 and the side side of the workpiece W. By employing this structure, the first liquid R1 can be appropriately adhered to the periphery of the workpiece W, including the back side W2. Therefore, the first liquid R1 can be used to prevent the second liquid R2 from adhering to the back side W2 of the workpiece W, and a coating film R can be formed on the periphery, including the periphery of the front side W1 and the side side W3 of the workpiece W.

[0125] In addition, such as Figure 8 As illustrated in the modified example, the first drug supply unit for supplying the first drug solution R1 may also include a nozzle 35a (first nozzle) provided on the front side W1 of the workpiece W for releasing the first drug solution R1 to the periphery of the workpiece W. When the nozzle 35a is provided on the front side W1 of the workpiece W, it is possible to prevent the configuration of the mechanism for supplying the first drug solution to the back side of the workpiece W from becoming complicated.

[0126] Furthermore, in the coating and developing apparatus 2 described above, the first processing liquid supply unit 31, which serves as a partial removal unit, includes a nozzle 31a (third nozzle) disposed on the front side W1 of the workpiece W, which releases a first solvent F1 capable of removing the first chemical solution R1. Moreover, the control device 100 controls each unit to release the solvent onto the workpiece W while it is rotating. By employing the above structure, the first solvent F1 can be used to appropriately remove at least a portion of the first chemical solution R1 adhering to the front side W1 and the side surface of the workpiece W. Therefore, the second chemical solution R2 used to form the coating film R can be appropriately adhered to the front side W1 and the side surface of the workpiece W.

[0127] Furthermore, the control device 100 controls each part to supply the second chemical solution R2 while the workpiece W is rotating. At this time, the rotational speed of the workpiece W when the second chemical solution R2 is supplied from the second processing liquid supply unit 32 (which serves as the second chemical solution supply unit) can be lower than the rotational speed of the workpiece W when the first solvent F1 is supplied from the first processing liquid supply unit 31 (which serves as the partial removal unit). In this way, by increasing the rotational speed of the workpiece W when the first solvent F1 is supplied, it is possible to prevent the first solvent F1 from moving to the back side W2 of the workpiece W. Furthermore, by decreasing the rotational speed of the workpiece W when the second chemical solution R2 is supplied, the second chemical solution R2 can be supplied evenly to the workpiece W. In addition, it is possible to prevent liquid splashing on the workpiece W when the second chemical solution R2 is supplied, and to prevent the second chemical solution R2 from scattering.

[0128] Alternatively, as described above, the nozzle 31a supplying the first solvent F1 can also spray the first solvent F1 onto the workpiece W in a mist form. In this case, solvent can be supplied to the desired location on the workpiece W, and the first chemical solution R1 can be appropriately removed using the first solvent F1.

[0129] Alternatively, as a partial removal unit replacing the first processing liquid supply unit 31 that supplies the first solvent F1, a configuration can be adopted in which the first chemical solution R1 is removed using the bristles 91 of the brush 90. That is, while holding the workpiece W using the rotating chuck 21, which serves as a substrate holding unit, the workpiece W is rotated, and the bristles 91 of the brush 90, which functions as a removal component, come into contact with the front side W1 and the side side W3 of the workpiece W, thereby removing the first chemical solution R1. In this way, by employing a configuration in which the first chemical solution R1 is removed by contacting the removal component with the front side W1 and the side side W3 of the workpiece W, the first chemical solution R1 at the desired location can be appropriately removed.

[0130] The above descriptions illustrate various illustrative embodiments, but the implementation is not limited to these illustrative embodiments, and various omissions, substitutions, and changes are possible. Furthermore, elements from different embodiments can be combined to form other embodiments.

[0131] For example, the configuration of each part in the substrate processing apparatus (coating and developing apparatus 2) is only one example and can be appropriately modified. For example, the structure for supplying the processing liquid (chemical solution, solvent) to the workpiece W can be appropriately modified. In addition, the configuration of the nozzles (31a to 35a) for supplying the processing liquid, the configuration of the processing liquid supply source (31b to 34b), the configuration of the piping (31c to 34c), etc., can also be appropriately modified. Furthermore, the structure of each part of the coating unit U1, including the rotary chuck 21 (substrate holding part), the rotary drive part 22, the guide ring 25, the cup-shaped body 26, etc., can also be appropriately modified.

[0132] Furthermore, in the above-described embodiment, the coating unit U1 of the processing module 12 for substrate processing was described as the unit that forms the coating film R on the periphery of the workpiece W, but the same function can also be provided in other units of other modules.

[0133] Based on the above description, various embodiments of the present invention have been described in this specification for illustrative purposes. It should be understood that various changes can be made without departing from the scope and spirit of the invention. Therefore, the various embodiments disclosed in this specification are not limiting, and the true scope and spirit are given by the appended claims.

Claims

1. A substrate processing apparatus, characterized in that: The substrate processing apparatus forms a coating film on the peripheral portion of the substrate, including the periphery of the front side and the side side, comprising: A substrate holding portion is configured to hold the substrate in a rotatable manner; The first liquid supply unit is configured to supply a first liquid to the periphery of the substrate, including the back side of the substrate. A partial removal section removes at least a portion of the first liquid adhering to the front and side surfaces of the substrate, thereby removing a portion of the first liquid supplied to the substrate. The second liquid supply unit is configured to supply the second liquid for forming the coating film to the front and side surfaces of the substrate. The first liquid removal section removes the first liquid retained on the substrate to which the second liquid is attached; and The control unit controls the substrate holding unit, the first drug supply unit, the partial removal unit, the second drug supply unit, and the first drug removal unit to sequentially perform the supply of the first drug, the removal of a portion of the first drug, the supply of the second drug, and the removal of the first drug retained on the substrate to which the second drug is attached.

2. The substrate processing apparatus as described in claim 1, characterized in that: The first drug supply unit includes a first nozzle disposed on the back side of the substrate, which releases the first drug to the periphery of the substrate. The second liquid supply unit includes a second nozzle disposed on the front side of the substrate, which releases the second liquid to the front and side sides of the substrate.

3. The substrate processing apparatus as described in claim 1, characterized in that: The first drug supply unit includes a first nozzle disposed on the front side of the substrate, which releases the first drug to the periphery of the substrate. The second liquid supply unit includes a second nozzle disposed on the front side of the substrate, which releases the second liquid to the front and side sides of the substrate.

4. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that: The partial removal section includes a third nozzle disposed on the front side of the substrate, which releases solvent capable of removing the first pharmaceutical solution onto the substrate. The control unit controls the substrate holding unit and the partial removal unit so that the solvent is released onto the substrate while the substrate is rotated.

5. The substrate processing apparatus as described in claim 4, characterized in that: The control unit controls the substrate holding unit and the second drug supply unit so that the second drug is supplied while the substrate is rotated. The rotational speed of the substrate when the second drug solution is supplied by the second drug solution supply unit is lower than the rotational speed of the substrate when the solvent is supplied by the partial removal unit.

6. The substrate processing apparatus as described in claim 4, characterized in that: The third nozzle sprays the solvent into the substrate in a mist.

7. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that: The partial removal section includes a removal component that can remove the first liquid by contacting the front and side surfaces of the substrate while the substrate is rotated using the substrate holding section.

8. A substrate processing method, characterized in that: The substrate processing method forms a coating film on the peripheral portion of the substrate, including the periphery of the front side and the side surface, comprising: The step of supplying a first solution to the periphery of the substrate, including the back side of the substrate; After supplying the first drug solution, at least a portion of the first drug solution adhering to the front and side surfaces of the substrate is removed, in order to remove a portion of the first drug solution supplied to the substrate. The step of supplying a second solution for forming the coating film to the front and sides of the substrate after removing a portion of the first solution; and The step of removing the first drug solution that remains on the substrate with the second drug solution attached after the second drug solution has been supplied.

9. A computer-readable storage medium, characterized in that: The device contains a program for performing the method of claim 8.

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