A semiconductor heating plate with built-in thermal insulation structure for semiconductor processing

Abstract

The present invention discloses a semiconductor heating plate with a built-in heat insulation structure for semiconductor processing, including a heating plate seat, a support block fixedly connected to the bottom of the heating plate seat, a heating tube arranged on the top of the heating tube, a heat conducting plate arranged on the top of the heat conducting plate, a ceramic plate fixedly connected to the top, and a rock wool layer fixedly connected to the inside of the heating plate seat. The present invention insulates the ceramic plate by arranging a rock wool layer, a vacuum insulation board and an aerogel pad, and a water pump cools the heating plate seat through a connecting pipe, a water inlet pipe 1, a water inlet pipe 2 and a cooling pipe. The ceramic plate can be disassembled by pulling the pull block outward and pulling the handle upward, thereby solving the problem that the existing semiconductor conductor heating plate does not have a heat insulation structure, the overall temperature of the heating plate will rise when heating the semiconductor, which is inconvenient for maintenance, and is easy to scald the user, posing a threat to the user and safety.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing, in particular to a semiconductor heating disk with a built-in heat insulation structure for semiconductor processing. Background Art

[0002] In semiconductor processing, a heating plate is required to heat the semiconductor. However, the existing semiconductor conductor heating plate does not have a heat insulation structure. When heating the semiconductor, the overall temperature of the heating plate will rise, which is inconvenient for maintenance and can easily burn the user, posing a threat to the user's safety. Summary of the invention

[0003] In order to solve the problems raised in the above-mentioned background technology, the purpose of the present invention is to provide a semiconductor heating plate with a built-in thermal insulation structure for semiconductor processing, which has the advantage of thermal insulation and solves the problem that the existing semiconductor conductor heating plate does not have a thermal insulation structure, the overall temperature of the heating plate will increase when heating the semiconductor, it is not convenient for maintenance, and it is easy to burn the user, posing a threat to the user's safety.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: A semiconductor heating plate with a built-in thermal insulation structure for semiconductor processing, comprising a heating plate seat, a support block is fixedly connected to the bottom of the heating plate seat, a heating tube is arranged on the top of the heating plate seat, a heat conducting plate is arranged on the top of the heating tube, a ceramic plate is fixedly connected to the top of the heat conducting plate, a rock wool layer is fixedly connected to the inside of the heating plate seat, a vacuum insulation board is fixedly connected to the inside of the rock wool layer, an aerogel pad is fixedly connected to the inside of the vacuum insulation board, and a structure for cooling the heating plate seat and the ceramic plate is arranged inside the heating plate seat.

[0005] As a preferred embodiment of the present invention, the structure for cooling the heating plate seat and the ceramic plate includes a cooling pipe fixedly connected to the inside of the heating plate seat, the bottom of the cooling pipe is connected to a water inlet pipe 1, the end of the water inlet pipe 1 away from the cooling pipe is connected to a water inlet pipe 2 through a joint, the right end of the water inlet pipe 2 is connected to a water pump, the bottom of the water pump is fixedly connected to a water tank, the input end of the water pump is connected to a connecting pipe, the bottom of the left side of the water tank is connected to a drain pipe 1, the left side of the drain pipe 1 is connected to a drain pipe 2 through a joint, the top of the drain pipe 2 is connected to the surface of the cooling pipe, and the interior of the heating plate seat is provided with a structure for fixing the ceramic plate.

[0006] As a preferred embodiment of the present invention, the structure for fixing the ceramic disk includes a movable groove opened inside the heating disk seat, a fixing rod is arranged inside the movable groove, the inner side of the fixing rod penetrates into the interior of the ceramic disk, a baffle is fixedly connected to the surface of the fixing rod, a spring is fixedly connected to the outer side of the baffle, and the outer side of the spring is fixedly connected to the outer side of the inner wall of the movable groove.

[0007] As a preferred embodiment of the present invention, the outer side of the fixing rod penetrates through the outer side of the heating plate seat and is fixedly connected with a pull block, and the surface of the pull block is provided with anti-slip grooves.

[0008] As a preferred embodiment of the present invention, a heat conducting plate is fixedly connected to the surface of the cooling tube, and the material of the heat conducting plate is copper.

[0009] As a preferred embodiment of the present invention, the bottom of the right side of the water tank is connected to a drain pipe, and a control valve is provided on the surface of the drain pipe.

[0010] As a preferred embodiment of the present invention, the bottom of the heating plate seat is fixedly connected with a supporting leg, and the bottom of the supporting leg is fixedly connected with an anti-slip pad.

[0011] As a preferred embodiment of the present invention, handles are fixedly connected to the front and rear sides of the top of the ceramic plate, and the number of the supporting legs is four and they are evenly distributed.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. The present invention insulates the ceramic disk by arranging a rock wool layer, a vacuum insulation board and an aerogel pad. The water pump cools down the heating disk seat through the connecting pipe, the water inlet pipe 1, the water inlet pipe 2 and the cooling pipe. The ceramic disk can be disassembled by pulling the pull block outward and pulling the handle upward, which solves the problem that the existing semiconductor conductor heating disk does not have a heat insulation structure. When heating the semiconductor, the overall temperature of the heating disk will rise, which is inconvenient for maintenance and is easy to scald the user, posing a threat to the user and safety.

[0014] 2. The present invention can cool the heating plate seat and the ceramic plate by arranging a cooling pipe, a water inlet pipe, a water pump, a water tank and a drainage pipe, thereby accelerating the cooling speed of the heating plate seat and the ceramic plate.

[0015] 3. The present invention can fix the ceramic disk by arranging the movable groove, the fixing rod, the baffle and the spring, thereby improving the stability of the ceramic disk.

[0016] 4. The present invention provides a pulling block, which makes it easier for the user to pull the fixing rod, thereby improving the mobility of the fixing rod.

[0017] 5. The present invention can make the cooling pipe cool the heating plate seat more evenly by arranging the heat conduction plate, thereby improving the cooling effect of the cooling pipe.

[0018] 6. The present invention can discharge the water with too high temperature inside the water tank by arranging the discharge pipe and the control valve, thereby improving the cooling effect of the cooling pipe.

[0019] 7. The present invention can support the heating plate seat by providing supporting legs, thereby improving the stability of the heating plate seat.

[0020] 8. The present invention provides a handle, which makes it convenient for the user to pull the ceramic plate through the handle, thereby improving the mobility of the ceramic plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the present invention;

[0022] Figure 2 It is a schematic diagram of the front and cross-sectional view of the heating plate seat of the present invention;

[0023] Figure 3 It is a schematic diagram of a front cross-sectional view of a cooling tube of the present invention;

[0024] Figure 4 For the present invention Figure 3 The enlarged schematic diagram at A in the middle;

[0025] Figure 5 For the present invention Figure 3 The enlarged schematic diagram of point B in the middle;

[0026] Figure 6 It is a schematic diagram of the three-dimensional structure of the heating plate seat of the present invention.

[0027] In the figure: 1. heating plate seat; 2. support block; 3. heating tube; 4. heat conducting plate; 5. ceramic plate; 6. rock wool layer; 7. vacuum insulation board; 8. aerogel pad; 9. cooling pipe; 10. water inlet pipe 1; 11. water inlet pipe 2; 12. water pump; 13. water tank; 14. connecting pipe; 15. drain pipe 1; 16. drain pipe 2; 17. moving groove; 18. fixing rod; 19. baffle; 20. spring; 21. pull block; 22. heat conducting plate; 23. drain pipe; 24. control valve; 25. supporting leg; 26. anti-skid pad; 27. handle. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] like Figures 1 to 6As shown, the present invention provides a semiconductor heating plate with a built-in thermal insulation structure for semiconductor processing, including a heating plate seat 1, a supporting block 2 is fixedly connected to the bottom of the heating plate seat 1, a heating tube 3 is arranged on the top of the heating tube 3, a heat conducting plate 4 is arranged on the top of the heat conducting plate 4, a ceramic plate 5 is fixedly connected to the top of the heat conducting plate 4, a rock wool layer 6 is fixedly connected to the inside of the heating plate seat 1, a vacuum insulation board 7 is fixedly connected to the inside of the rock wool layer 6, an aerogel pad 8 is fixedly connected to the inside of the vacuum insulation board 7, and a structure for cooling the heating plate seat 1 and the ceramic plate 5 is arranged inside the heating plate seat 1.

[0030] refer to Figure 2 The structure for cooling the heating plate seat 1 and the ceramic plate 5 includes a cooling pipe 9 fixedly connected to the inside of the heating plate seat 1, the bottom of the cooling pipe 9 is connected with a water inlet pipe 10, the end of the water inlet pipe 10 away from the cooling pipe 9 is connected with a water inlet pipe 2 via a joint, the right end of the water inlet pipe 2 11 is connected with a water pump 12, the bottom of the water pump 12 is fixedly connected with a water tank 13, the input end of the water pump 12 is connected with a connecting pipe 14, the bottom of the left side of the water tank 13 is connected with a drain pipe 15, the left side of the drain pipe 15 is connected with a drain pipe 2 16 via a joint, the top of the drain pipe 2 16 is connected to the surface of the cooling pipe 9, and a structure for fixing the ceramic plate 5 is provided inside the heating plate seat 1.

[0031] As a technical optimization solution of the present invention, by setting a cooling pipe 9, a water inlet pipe 10, a water pump 12, a water tank 13 and a drain pipe 15, the heating plate seat 1 and the ceramic plate 5 can be cooled, thereby accelerating the cooling speed of the heating plate seat 1 and the ceramic plate 5.

[0032] refer to Figure 4 The structure for fixing the ceramic plate 5 includes a movable groove 17 opened inside the heating plate seat 1, a fixing rod 18 is arranged inside the movable groove 17, the inner side of the fixing rod 18 penetrates into the interior of the ceramic plate 5, a baffle 19 is fixedly connected to the surface of the fixing rod 18, a spring 20 is fixedly connected to the outer side of the baffle 19, and the outer side of the spring 20 is fixedly connected to the outer side of the inner wall of the movable groove 17.

[0033] As a technical optimization solution of the present invention, the ceramic disk 5 can be fixed by providing the moving groove 17, the fixing rod 18, the baffle 19 and the spring 20, thereby improving the stability of the ceramic disk 5.

[0034] refer to Figure 4 The outer side of the fixing rod 18 penetrates through the outer side of the heating plate seat 1 and is fixedly connected with a pull block 21, and the surface of the pull block 21 is provided with anti-slip grooves.

[0035] As a technical optimization solution of the present invention, by providing the pulling block 21 , it is convenient for the user to pull the fixing rod 18 , thereby improving the mobility of the fixing rod 18 .

[0036] refer to Figure 3 A heat conducting plate 22 is fixedly connected to the surface of the cooling tube 9 , and the heat conducting plate 22 is made of copper.

[0037] As a technical optimization solution of the present invention, by providing the heat conducting plate 22 , the cooling tube 9 can cool the heating plate seat 1 more evenly, thereby improving the cooling effect of the cooling tube 9 .

[0038] refer to Figure 1 The bottom of the right side of the water tank 13 is connected to a drain pipe 23 , and a control valve 24 is provided on the surface of the drain pipe 23 .

[0039] As a technical optimization solution of the present invention, by providing a drain pipe 23 and a control valve 24 , water with excessively high temperature inside the water tank 13 can be drained, thereby improving the cooling effect of the cooling pipe 9 .

[0040] refer to Figure 2 A support leg 25 is fixedly connected to the bottom of the heating plate seat 1 , and an anti-slip pad 26 is fixedly connected to the bottom of the support leg 25 .

[0041] As a technical optimization solution of the present invention, by providing support legs 25 , the heating plate seat 1 can be supported, thereby improving the stability of the heating plate seat 1 .

[0042] refer to Figure 1 The front and rear sides of the top of the ceramic plate 5 are fixedly connected with handles 27, and the number of the supporting legs 25 is four and evenly distributed.

[0043] As a technical optimization solution of the present invention, by providing a handle 27 , it is convenient for the user to pull the ceramic plate 5 through the handle 27 , thereby improving the mobility of the ceramic plate 5 .

[0044] The working principle and use process of the present invention: during use, when the heating plate seat 1 needs to be repaired, the rock wool layer 6, the vacuum insulation board 7 and the aerogel pad 8 insulate the ceramic plate 5 to prevent the ceramic plate 5 from scalding the user, thereby achieving the effect of heat insulation. The water pump 12 is started, and the water pump 12 transports the water inside the water tank 13 to the cooling pipe 9 through the connecting pipe 14, the water inlet pipe 10 and the water inlet pipe 2 11. The cooling pipe 9 cools the heating plate seat 1 through the heat conduction plate 22 to achieve the effect of heat dissipation, and then the pull block 21 is pulled outward, and the pull block 21 drives the fixing rod 18 to move outward. When the fixing rod 18 is separated from the ceramic plate 5, the ceramic plate 5 can be disassembled through the handle 27, which is convenient for the user to repair.

[0045] To sum up: the semiconductor heating plate with built-in insulation structure for semiconductor processing insulates the ceramic plate 5 through the rock wool layer 6, the vacuum insulation board 7 and the aerogel pad 8, and the water pump 12 cools the heating plate seat 1 through the connecting pipe 14, the water inlet pipe 10, the water inlet pipe 2 11 and the cooling pipe 9. The ceramic plate 5 can be disassembled by pulling the pull block 21 outward and pulling the handle 27 upward, which solves the problem that the existing semiconductor conductor heating plate does not have a thermal insulation structure, the overall temperature of the heating plate will rise when heating the semiconductor, which is inconvenient for maintenance and easily burns the user, posing a threat to the user and safety.

[0046] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0047] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor heating plate with a built-in heat insulation structure for semiconductor processing, comprising a heating plate seat (1), Features: The bottom of the heating plate seat (1) is fixedly connected to a support block (2); the top of the heating plate seat (1) is provided with a heating tube (3); the top of the heating tube (3) is provided with a heat conducting sheet (4); the top of the heat conducting sheet (4) is fixedly connected to a ceramic plate (5); the interior of the heating plate seat (1) is fixedly connected to a rock wool layer (6); the interior of the rock wool layer (6) is fixedly connected to a vacuum insulation board (7); the interior of the vacuum insulation board (7) is fixedly connected to an aerogel pad (8); and the interior of the heating plate seat (1) is provided with a structure for cooling the heating plate seat (1) and the ceramic plate (5); The structure for cooling the heating plate seat (1) and the ceramic plate (5) comprises a cooling pipe (9) fixedly connected to the interior of the heating plate seat (1), the bottom of the cooling pipe (9) being connected to a water inlet pipe (10), the end of the water inlet pipe (10) away from the cooling pipe (9) being connected to a water inlet pipe (11) via a joint, the right end of the water inlet pipe (11) being connected to a water pump (12), the bottom of the water pump (12) being fixedly connected to a water tank (13), the water pump (12) outputting The inlet end is connected to a connecting pipe (14); the bottom of the left side of the water tank (13) is connected to a drain pipe 1 (15); the left side of the drain pipe 1 (15) is connected to a drain pipe 2 (16) through a joint; the top of the drain pipe 2 (16) is connected to the surface of the cooling pipe (9); the interior of the heating plate seat (1) is provided with a structure for fixing the ceramic plate (5); the surface of the cooling pipe (9) is fixedly connected to a heat conducting plate (22), and the material of the heat conducting plate (22) is copper.

2. A semiconductor heating plate with a built-in heat insulation structure for semiconductor processing according to claim 1, characterized in that: The structure for fixing the ceramic disk (5) comprises a movable groove (17) provided inside the heating disk seat (1), a fixing rod (18) being arranged inside the movable groove (17), the inner side of the fixing rod (18) penetrating into the interior of the ceramic disk (5), a baffle (19) being fixedly connected to the surface of the fixing rod (18), a spring (20) being fixedly connected to the outer side of the baffle (19), and the outer side of the spring (20) being fixedly connected to the outer side of the inner wall of the movable groove (17).

3. A semiconductor heating plate with a built-in heat insulation structure for semiconductor processing according to claim 2, characterized in that: The outer side of the fixing rod (18) penetrates through the outer side of the heating plate seat (1) and is fixedly connected to a pull block (21), and the surface of the pull block (21) is provided with anti-slip grooves.

4. A semiconductor heating plate with a built-in heat insulation structure for semiconductor processing according to claim 1, characterized in that: The bottom of the right side of the water tank (13) is connected to a drain pipe (23), and a control valve (24) is arranged on the surface of the drain pipe (23).

5. The semiconductor heating plate with built-in thermal insulation structure for semiconductor processing according to claim 1, characterized in that: The bottom of the heating plate seat (1) is fixedly connected to a support leg (25), and the bottom of the support leg (25) is fixedly connected to an anti-slip pad (26).

6. A semiconductor heating plate with a built-in heat insulation structure for semiconductor processing according to claim 5, characterized in that: The front and rear sides of the top of the ceramic plate (5) are both fixedly connected with handles (27), and the number of the supporting legs (25) is four and they are evenly distributed.

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