A simulation heating system, a cooling method, and a temperature calibration method

Abstract

The present invention discloses an analog heating system, in which a host computer is communicatively connected to a main control device; the host computer is used to determine a control instruction and send the control instruction to the main control device; a heating device is connected to the main control device through a communication channel; the main control device is used to control the heating process of the heating device according to the control instruction; a temperature monitoring device includes a first temperature detection unit; the heating device includes a control unit and a heating component, the control unit is connected to the heating component and the first temperature detection unit, and the heating component is used to heat an aerosol-forming substrate; the control unit collects the heating temperature of the heating component and receives the temperature signal of the first temperature detection unit. This analog heating system can be used for systematic research on the heating method, heating temperature of the aerosol-forming substrate, and the influence of temperature changes during the heating process on the heating effect of the aerosol-forming substrate, and can also analyze the temperature changes at different positions of the heating device in real time. The present invention also discloses a cooling method and a temperature calibration method.

Description

Technical Field

[0001] The present invention relates to the technical field of simulated heating, and in particular to a simulated heating system, a cooling method and a temperature calibration method. Background Art

[0002] As a new type of aerosol-forming matrix, heated cigarettes have significantly reduced tar content and the release of other harmful substances in smoke compared to traditional cigarettes.

[0003] At present, the domestic aerosol-forming substrate and its supporting electric heating device are still in the development stage. The existing similar aerosol-forming substrate and its supporting electric heating device abroad work on the principle of heating the aerosol-forming substrate through the electric heating device and controlling the heating temperature within a specific temperature range. There are two heating methods: central heating and circumferential heating. However, there is almost no systematic research on the heating method, heating temperature and the influence of temperature changes during the heating process on the heating effect of the aerosol-forming substrate. The existing aerosol-forming substrate is mainly for consumers, and there is still a lack of equipment development and systematic research. Summary of the invention

[0004] The purpose of the present invention is to solve the above-mentioned technical problems. The present invention provides a simulated heating system, a cooling method and a temperature calibration method, which can be used to systematically study the heating method and heating temperature of the aerosol-forming substrate and the influence of temperature changes during the heating process on the heating effect of the aerosol-forming substrate. The temperature changes at different positions of the heating device can also be analyzed in real time, and the temperature program control has high precision and integrated structure.

[0005] To solve the above technical problems, an embodiment of the present invention discloses a simulated heating system, comprising: a host computer, a main control device, a temperature monitoring device and at least one heating device, wherein the host computer is communicatively connected to the main control device; wherein the host computer is used to determine a control instruction and send the control instruction to the main control device; wherein the at least one heating device is connected to the main control device through a communication channel; the main control device is used to control the heating process of the heating device according to the control instruction; the temperature monitoring device comprises a first temperature detection unit; the heating device comprises a control unit and a heating component, the control unit is connected to the heating component and the first temperature detection unit, and the heating component is used to heat an aerosol-forming substrate; the control unit collects the heating temperature of the heating component and receives the temperature signal of the first temperature detection unit.

[0006] The above technical solution can be used to systematically study the influence of heating temperature and temperature change during heating on the heating effect of aerosol-forming substrate, and the structure is integrated.

[0007] According to another specific embodiment of the present invention, an embodiment of the present invention discloses an analog heating system. The first temperature detection unit includes a plurality of temperature sensors, and the plurality of temperature sensors are installed at different positions of the heating device to detect the temperatures at different positions in real time.

[0008] By adopting the above technical solution, the change situation of the temperatures at different positions of the heating device can be analyzed in real time.

[0009] According to another specific embodiment of the present invention, an embodiment of the present invention discloses an analog heating system. The heating component can be an internal heating type component, an external heating type component or an internal and external heating type component.

[0010] By adopting the above technical solution, it is possible to simulate internal core heating, peripheral heating or simultaneous internal core and peripheral heating of the aerosol forming substrate.

[0011] According to another specific embodiment of the present invention, an embodiment of the present invention discloses an analog heating system. The external heating type component includes a positioning rod, an adjusting rod and a receiving part for receiving the aerosol forming substrate. The receiving part is located at the upper end of the positioning rod, the positioning rod is fixed to the upper end of the adjusting rod, and the adjusting rod is used to rotate along its own circumference to drive the positioning rod to move up and down along the axial direction of the external heating type component so as to adjust the insertion length of the aerosol forming substrate in the receiving part.

[0012] By adopting the above technical solution, the heating component can be adapted to aerosol forming substrates of different lengths.

[0013] According to another specific embodiment of the present invention, an embodiment of the present invention discloses an analog heating system. The internal and external heating type component includes an upper cover, a heating component body, an electromagnetic heating tube and an electromagnetic heating coil. The upper cover is detachably connected to the heating component body. The electromagnetic heating tube is installed in the upper cover, and the electromagnetic heating coil is sleeved on the circumference of the heating component body.

[0014] By adopting the above technical solution, the heating component can be adapted to aerosol forming substrates of different circumferences.

[0015] According to another specific embodiment of the present invention, an embodiment of the present invention discloses an analog heating system, which further includes a suction cooling unit. The suction cooling unit is connected to the main control device. The suction joint of the suction cooling unit extends into the receiving part of the heating component for receiving the aerosol forming substrate. The main control device controls the suction cooling unit to suck gas from the receiving part according to the control instruction of the upper computer.

[0016] By adopting the above technical solution, the heating temperature of the heating component can be actively reduced.

[0017] According to another specific embodiment of the present invention, an embodiment of the present invention discloses an analog heating system, and the suction cooling unit is a vacuum pump.

[0018] According to another specific embodiment of the present invention, an embodiment of the present invention discloses an analog heating system. The temperature monitoring device further includes: a temperature calibration control unit connected to the main control device; a second temperature detection unit respectively connected to the temperature calibration control unit and the heating component to detect the actual heating temperature of the heating component. The temperature calibration control unit obtains the actual heating temperature from the second temperature detection unit and sends the actual heating temperature to the main control device. The main control device further sends the actual heating temperature to the host computer, and the host computer calibrates the heating temperature of the heating component to the actual heating temperature.

[0019] By adopting the above technical solution, the heating temperature of the heating component can be calibrated.

[0020] An embodiment of the present invention also discloses a method for actively reducing the heating temperature of a heating component. This method requires providing the above-mentioned analog heating system, and includes the following steps:

[0021] S1: The host computer issues a temperature reduction instruction to the main control device;

[0022] S2: The main control device receives the temperature reduction instruction;

[0023] S3: The main control device starts the suction cooling unit to perform gas suction on the accommodating part of the heating component for accommodating the aerosol-forming matrix, actively reducing the heating temperature of the heating component;

[0024] S4: When the heating temperature of the heating component reaches the preset temperature, the host computer issues a stop temperature reduction instruction to the main control device;

[0025] S5: The main control device receives the stop temperature reduction instruction;

[0026] S6: The main control device stops the suction cooling unit from performing gas suction on the accommodating part of the heating component for accommodating the aerosol-forming matrix.

[0027] By adopting the above technical solution, the heating temperature of the heating component can be actively reduced.

[0028] An embodiment of the present invention also discloses a method for calibrating the heating temperature of a heating component. This method requires providing the above-mentioned analog heating system, and includes the following steps:

[0029] S1: Connect the second temperature detection unit to the heating component;

[0030] S2: According to the control instruction of the host computer, control the heating temperature of the heating component at the first temperature T1;

[0031] S3: The temperature calibration control unit is connected to the second temperature detection unit, collects and processes the output signal of the second temperature detection unit, and obtains the first actual heating temperature T1R;

[0032] S4: The temperature calibration control unit sends the first actual heating temperature T1R to the main control device, and the main control device further sends the first actual heating temperature T1R to the host computer;

[0033] S5: The host computer calibrates the first temperature T1 of the heating component to the first actual heating temperature T1R;

[0034] S6: According to the control instruction of the host computer, the heating temperature of the heating component is controlled at the second temperature T2;

[0035] S7: The temperature calibration control unit obtains the second actual heating temperature T2R;

[0036] S8: The temperature calibration control unit sends the second actual heating temperature T2R to the main control device, and the main control device further sends the second actual heating temperature T2R to the host computer;

[0037] S9: The host computer calibrates the second temperature T2 of the heating component to the second actual heating temperature T2R.

[0038] By adopting the above technical solution, the heating temperature of the heating component can be calibrated, so that the accuracy of the heating temperature is high. Description of the Drawings

[0039] Figure 1 Shows the block diagram of the analog heating system under an embodiment of the present invention Figure One .

[0040] Figure 2 Shows the block diagram of the analog heating system under an embodiment of the present invention Figure Two .

[0041] Figure 3 Shows the block diagram of the analog heating system under an embodiment of the present invention Figure Three .

[0042] Figure 4 Shows the block diagram of the analog heating system under an embodiment of the present invention Figure Four .

[0043] Figure 5 Shows the block diagram of the analog heating system under an embodiment of the present invention Figure Five .

[0044] Figure 6 Shows the block diagram of the analog heating system under an embodiment of the present invention Figure Six .

[0045] Figure 7A cross-sectional view of the externally heated component provided by the present invention is shown.

[0046] Figure 8 A cross-sectional view of the upper cover of the internally and externally heated component provided by the present invention is shown.

[0047] Figure 9 A cross-sectional view of the heating component body of the internally and externally heated component provided by the present invention is shown.

[0048] Figure 10 Shown Figure 8 in the upper cover and Figure 9 a cross-sectional view of the internally and externally heated component after the upper cover and the heating component body are assembled.

[0049] Figure 11 A simulated heating system frame according to an embodiment of the present invention is shown Figure Seven .

[0050] Figure 12 A flowchart showing the active cooling of the heating component according to the present invention is shown.

[0051] Figure 13 A simulated heating system frame according to an embodiment of the present invention is shown Figure Eight .

[0052] Figure 14 A flowchart showing the calibration of the heating temperature of the heating component according to the present invention is shown. Detailed implementation manners

[0053] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiments, this does not mean that the features of this invention are limited to this implementation manner. On the contrary, the purpose of introducing the invention in conjunction with the implementation manner is to cover other alternatives or modifications that may be extended based on the claims of the present invention. To provide a deep understanding of the present invention, many specific details will be included in the following description. The present invention can also be implemented without using these details. In addition, to avoid confusing or obscuring the key points of the present invention, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0054] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0055] In the description of this embodiment, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "bottom", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0056] The terms "first", "second", etc. are only used for distinguishing descriptions and should not be construed as indicating or implying relative importance.

[0057] In the description of this embodiment, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances.

[0058] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the drawings.

[0059] Existing aerosol-forming substrate devices are mainly targeted at consumers, and there is a lack of devices for the development and systematic research of the devices. The present invention proposes a simulation heating system for systematically studying aspects such as the heating method, heating temperature, and the influence of temperature changes during the heating process on the heating effect of the aerosol-forming substrate, and can also analyze the temperature changes at each key point in real time.

[0060] Referring to Figure 1 , a simulation heating system 1 includes: a host computer 11, a main control device 13, a temperature monitoring device (not shown in the figure), and heating devices 15, 16, 17, 18.

[0061] Among them, the host computer 11 is connected to the main control device 13 through a USB interface to exchange data; the main control device 13 receives the control instructions from the host computer 11. The connection method between the main control device 13 and the host computer 11 includes but is not limited to being connected through USB, and can also be connected through other methods such as WiFi. The control instructions issued by the host computer 11 can be one or more heating temperatures during the heating process of the heating devices 15, 16, 17, 18, and the control instructions can also be the temperature change rate during the heating process of the heating devices 15, 16, 17, 18. The control instructions issued by the host computer 11 include but are not limited to the above two.

[0062] The heating devices 15, 16, 17, and 18 are respectively connected to the main control device 13 through data communication channels. Among them, the heating device 15 is connected to the main control device 13 through the data communication channel 21, the heating device 16 is connected to the main control device 13 through the data communication channel 22, the heating device 17 is connected to the main control device 13 through the data communication channel 23, and the heating device 18 is connected to the main control device 13 through the data communication channel 24. The data communication channels 21, 22, 23, and 24 include but are not limited to being constructed by serial ports or Bluetooth.

[0063] In this embodiment, the number of heating devices is set to 4. In other possible embodiments, there may include but are not limited to 4 heating devices.

[0064] See Figure 2 , the heating device 15 includes a control unit 153 and a heating component 151. The control unit 153 is connected to the heating component 151. The control unit 153 collects the heating temperature of the heating component 151, and the heating component 151 is used to heat the aerosol-forming matrix.

[0065] See Figure 3 , the heating device 16 includes a control unit 163 and a heating component 161. The control unit 163 is connected to the heating component 161. The control unit 163 collects the heating temperature of the heating component 161, and the heating component 161 is used to heat the aerosol-forming matrix.

[0066] See Figure 4 , the heating device 17 includes a control unit 173 and a heating component 171. The control unit 173 is connected to the heating component 171. The control unit 173 collects the heating temperature of the heating component 171, and the heating component 171 is used to heat the aerosol-forming matrix.

[0067] See Figure 5 , the heating device 18 includes a control unit 183 and a heating component 181. The control unit 183 is connected to the heating component 181. The control unit 183 collects the heating temperature of the heating component 181, and the heating component 181 is used to heat the aerosol-forming matrix.

[0068] In one embodiment, the control instructions issued by the host computer 11 are as follows: the heating device 15 is heated to the temperature T1 within the time t1, the heating device 16 is heated to the temperature T2 within the time t1, the heating device 17 is heated to the temperature T3 within the time t1, and the heating device 18 is heated to the temperature T4 within the time t1;

[0069] After receiving the above control instruction, the main control device 13 parses the control instruction and sends, through channel 21, the control instruction for heating to temperature T1 within time t1 to the heating device 15. Specifically, the above control instruction is sent to the control unit 153 of the heating device 15. The control unit 153 causes the heating component 151 of the heating device 15 to heat up to temperature T1 within time t1 according to the corresponding control instruction, and the control unit 153 collects in real time the heating temperature of the heating component 151;

[0070] The main control device 13 sends, through channel 22, heating to temperature T2 within time t1 to the heating device 16. Specifically, the above control instruction is sent to the control unit 163 of the heating device 16. The control unit 163 causes the heating component 161 of the heating device 16 to heat to temperature T2 within time t1 according to the corresponding control instruction, and the control unit 163 collects in real time the heating temperature of the heating component 161;

[0071] The main control device 13 sends, through channel 23, heating to temperature T3 within time t1 to the heating device 17. Specifically, the above control instruction is sent to the control unit 173 of the heating device 17. The control unit 173 causes the heating component 171 of the heating device 17 to heat to temperature T3 within time t1 according to the corresponding control instruction, and the control unit 173 collects in real time the heating temperature of the heating component 171;

[0072] The main control device 13 sends, through channel 24, heating to temperature T4 within time t1 to the heating device 18. Specifically, the above control instruction is sent to the control unit 183 of the heating device 18. The control unit 183 causes the heating component 181 of the heating device 18 to heat to temperature T4 within time t1 according to the corresponding control instruction, and the control unit 183 collects in real time the heating temperature of the heating component 181.

[0073] In one implementation, referring to Figure 6 , the temperature monitoring device may include 4 groups of first temperature detection units 165. Each group of first temperature detection units 165 may include 4 temperature sensors, and each group of first temperature detection units 165 may be respectively connected to each heating device.

[0074] Taking the heating device 16 as an example, the first temperature detection unit 165 connected to the control unit 163 of the heating device 16 includes a temperature sensor 1651, a temperature sensor 1652, a temperature sensor 1653, and a temperature sensor 1654. The temperature sensor 1651 is used to detect the temperature of the surface of the battery that supplies energy to the heating device 16; the temperature sensor 1652 is used to detect the surface temperature of the PCB panel in the heating device 16; the temperature sensor 1653 is used to detect the surface temperature of the accommodating part in the heating component 161 for accommodating the aerosol-forming substrate; the temperature sensor 1654 is used to detect the surface temperature of the inner wall of the housing of the heating device 16.

[0075] Specifically, the control unit 163 is connected to the heating component 161, and the control unit is also respectively connected to the temperature sensor 1651, the temperature sensor 1652, the temperature sensor 1653, and the temperature sensor 1654. The control unit 163 collects in real time the temperatures detected by the temperature sensor 1651, the temperature sensor 1652, the temperature sensor 1653, the temperature sensor 1654, and the heating temperature of the heating component 161.

[0076] Furthermore, the control unit 163 of the heating device 16 collects in real time the heating temperature of the heating component 161 and the temperatures detected by the temperature sensor 1651, the temperature sensor 1652, the temperature sensor 1653, and the temperature sensor 1654 in a periodic and autonomous manner. When the heating device 16 is connected to the main control device 13, the control unit 163 will package and send the collected heating temperature of the heating component 161 and the temperatures detected by the temperature sensor 1651, the temperature sensor 1652, the temperature sensor 1653, and the temperature sensor 1654 to the main control device 13, and the main control device 13 will further send them to the host computer 11.

[0077] The temperature sensors can be installed at different positions of the heating device 16 to detect the temperatures at different positions of the heating device 16 in real time. The positions include but are not limited to the surface of the battery, the surface of the PCB panel, the surface of the accommodating part of the heating component 161, and the inner wall surface of the housing of the heating device 16 as described above. The number of temperature sensors can be set to include but is not limited to the above-mentioned 4.

[0078] The setting of the temperature sensors is beneficial to understanding the temperatures at different positions of the heating device 16 in real time, and plays a key role in the subsequent design of the aerosol-forming substrate heating non-combustion device.

[0079] At this point, the main control device 13 can collect in real time the heating temperatures of the heating components of each heating device and the temperatures at different positions of the heating device detected by the temperature sensors. Using this simulated heating system is conducive to systematically studying the heating temperature of the aerosol-forming substrate and the influence of temperature changes during the heating process on the heating effect of the aerosol-forming substrate, and can also analyze in real time the changes in the temperatures of each key point.

[0080] Furthermore, the heating component 151, the heating component 161, the heating component 171, and the heating component 181 can be an internal heating type component (not shown in the figure), an external heating type component 3, or an internal and external heating type component 4.

[0081] In one embodiment, the internal heating type component includes a needle-shaped ceramic heating element, and the needle-shaped ceramic heating element is inserted into the aerosol-forming substrate to heat the aerosol-forming substrate.

[0082] In one embodiment, referring to Figure 7 , the external heating type component 3 includes an electromagnetic heating tube 31, an electromagnetic heating coil (not shown in the figure), and a receiving portion 33 for receiving the aerosol-forming substrate. The electromagnetic heating coil is wound around the electromagnetic heating tube 31, the aerosol-forming substrate is inserted into the receiving portion 33, and the electromagnetic heating tube 31 circumferentially surrounds the receiving portion 33. Through the energy conversion of electricity-magnetism-heat, the aerosol-forming substrate is heated to release smoke. Further, the external heating type component 3 can also be a resistance heating component.

[0083] In one embodiment, referring to Figure 7 , the external heating type component 3 further includes a positioning rod 35 and an adjusting rod 37. The receiving portion 33 is located at the upper end of the positioning rod 35; at the same time, the positioning rod 35 is fixedly connected to the upper end of the adjusting rod 37 by a threaded connection. The adjusting rod 37 can drive the positioning rod 35 to move up and down in the axial direction of the external heating type component 3 by rotating along its own circumference, so as to adjust the insertion length of the aerosol-forming substrate in the receiving portion 33.

[0084] Specifically, when the external heating type component 3 is adapted to a longer aerosol-forming substrate, the adjusting rod 37 can be set to rotate clockwise along its own circumference to drive the positioning rod 35 to move downward in the axial direction of the external heating type component 3, so that the receiving portion 33 can accommodate a longer aerosol-forming substrate. When the external heating type component 3 is adapted to a shorter aerosol-forming substrate, the adjusting rod 37 can be set to rotate counterclockwise along its own circumference to drive the positioning rod 35 to move upward in the axial direction of the external heating type component 3, so that the receiving portion 33 can accommodate a shorter aerosol-forming substrate. It should be noted that it can also be that the adjusting rod 37 is set to rotate counterclockwise along the circumference to drive the positioning rod 35 to move downward in the axial direction of the external heating type component 3, and the adjusting rod 37 is set to rotate clockwise along the circumference to drive the positioning rod 35 to move upward in the axial direction of the external heating type component 3.

[0085] In one embodiment, the heating component may include either a pin-type ceramic heating element or an electromagnetic heating tube and an electromagnetic heating coil. The pin-type ceramic heating element is inserted into the aerosol-forming substrate, and the accommodating portion that houses the aerosol-forming substrate is circumferentially surrounded by the electromagnetic heating tube to achieve simultaneous heating of the inside and outside of the aerosol-forming substrate.

[0086] In one embodiment, referring to Figure 8 、 Figure 9 and Figure 10 , the internal and external heating component 4 further includes an upper cover 41 and a heating component body 43. The electromagnetic heating tube 45 is installed inside the upper cover 41, and the electromagnetic heating coil 47 is sleeved around the circumference of the heating component body 43. The upper cover 41 and the heating component body 43 are detachably connected, and the connection structure can be a structure commonly recognized in the industry for detachable connection between components. For example, a clamping mechanism can be provided between the upper cover 41 and the heating component body 43 to facilitate the disassembly between the upper cover 41 and the heating component body 43. With the internal and external heating component 4 designed in this way, as long as the upper cover 41 with a different diameter is replaced, the accommodating portion 33 of the internal and external heating component 4 can be adapted to aerosol-forming substrates with different diameters.

[0087] In one embodiment, here the heating component 161 is taken as an example for illustration. Referring to Figure 11 , the simulation heating system 1 further includes a vacuum pump 51. The main control device 13 is connected to the vacuum pump 51. The vacuum pump 51 has a suction joint (not shown in the figure), and the suction joint of the vacuum pump 51 extends into the accommodating portion for accommodating the aerosol-forming substrate in the heating component 161. The main control device 13 starts the vacuum pump 51 to actively suck the hot air in the accommodating portion according to the control instruction received from the host computer 11 to take away the heat, achieving the effect of cooling the heating component 161; the main control device 13 can also close the operation of the vacuum pump 51 according to the control instruction received from the host computer 11.

[0088] As Figure 12 shown in the flowchart of the present invention for actively cooling the heating component.

[0089] Combined with Figure 11 , the following is an explanation of actively cooling the heating component 161. By clicking the cooling button on the interface of the host computer 11, the host computer 11 sends a cooling instruction to the main control device 13. After receiving the cooling instruction, the main control device 13 starts the vacuum pump 51 to suck the hot air in the accommodating portion to take away the heat and reduce the heating temperature of the heating component 161.

[0090] When the heating temperature of the heating component 161 collected by the host computer in real time reaches the preset temperature, by clicking the cooling button on the interface of the host computer 11 again, the host computer 11 sends a stop cooling instruction to the main control device 13. After receiving the stop cooling instruction, the main control device 13 stops the vacuum pump 51 from sucking the hot air in the accommodating part of the heating component 161.

[0091] In an implementation manner, when the heating temperature of the heating component 161 collected by the host computer 11 in real time reaches the preset temperature, the host computer 11 can actively send a stop cooling instruction to the main control device 13. After receiving the stop cooling instruction, the main control device 13 stops the vacuum pump 51 from sucking the hot air in the accommodating part of the heating component 161.

[0092] In an implementation manner, see Figure 13 , the temperature monitoring device further includes a second temperature detection unit and a temperature calibration control unit connected to the main control device 13. The temperature calibration control unit can be a multi-channel thermocouple temperature measurement component 61; the second temperature detection unit can include a thermocouple sensor 611, a thermocouple sensor 612, a thermocouple sensor 613, and a thermocouple sensor 614. The thermocouple sensor 611 is assembled on the heating component 151 and connected to the multi-channel thermocouple temperature measurement component 61 through an interface 71; the thermocouple sensor 612 is assembled on the heating component 161 and connected to the multi-channel thermocouple temperature measurement component 61 through an interface 72; the thermocouple sensor 613 is assembled on the heating component 171 and connected to the multi-channel thermocouple temperature measurement component 61 through an interface 73; the thermocouple sensor 614 is assembled on the heating component 181 and connected to the multi-channel thermocouple temperature measurement component 61 through an interface 74.

[0093] Here, taking the calibration of the heating temperature of the heating component 161 as an example, the thermocouple sensor 612 is used to detect the actual heating temperature of the heating component 161. The multi-channel thermocouple temperature measurement component 61 connected to the thermocouple sensor 612 obtains the actual heating temperature detected by the thermocouple sensor 612. The multi-channel thermocouple temperature measurement component 61 sends the actual heating temperature to the main control device 13, and the main control device 13 further sends the actual heating temperature to the host computer 11. The host computer 11 calibrates the heating temperature of the heating component 61 to the actual heating temperature.

[0094] Figure 14 The flowchart showing the calibration of the heating temperature of the heating component by the present invention is shown.

[0095] Combined with Figure 13, the following describes how to calibrate the heating temperature of the heating component 161. Attach the thermocouple sensor 612 to the heating component 161; according to the control instruction of the host computer 11, control the heating temperature of the heating component 161 at T1. When the heating temperature of the heating component 161 stabilizes at T1, the actual heating temperature of the heating component 161 detected by the thermocouple sensor 612 is T1R. The multi-channel thermocouple temperature measurement component 61 connected to the thermocouple sensor 612 obtains the actual heating temperature T1R detected by the thermocouple sensor 612, and the multi-channel thermocouple temperature measurement component 61 sends the actual heating temperature T1R to the main control device 13. The main control device 13 further sends the actual heating temperature T1R to the host computer 11, and the host computer 11 calibrates the first temperature T1 of the heating component 161 to T1R;

[0096] Again, according to the control instruction of the host computer 11, control the heating temperature of the heating component 161 at T2. When the heating temperature of the heating component 161 stabilizes at T2, the host computer 11 obtains the actual heating temperature of the heating component 161 detected by the thermocouple sensor 612 as T2R, and the host computer 11 calibrates the second temperature T2 of the heating component 161 to T2R.

[0097] Although the present invention has been illustrated and described by referring to some preferred embodiments of the present invention, those of ordinary skill in the art should understand that the above content is a further detailed description of the present invention in combination with specific embodiments, and it cannot be determined that the specific implementation of the present invention is only limited to these descriptions. Those skilled in the art can make various changes in form and detail, including making several simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. A simulated heating system, characterized in that, it includes: a host computer, a main control device, a temperature monitoring device and at least one heating device, and the host computer is communicatively connected to the main control device; wherein, the host computer is configured to determine a control instruction and send the control instruction to the main control device; at least one of the heating devices, and the heating device is connected to the main control device through a communication channel; the main control device is configured to control the heating process of the heating device according to the control instruction; the temperature monitoring device includes a first temperature detection unit; the heating device includes a control unit and a heating component, the control unit is connected to the heating component and the first temperature detection unit, and the heating component is used to heat the aerosol-forming substrate; the control unit collects the heating temperature of the heating component and receives the temperature signal of the first temperature detection unit, wherein, the temperature monitoring device further includes: a temperature calibration control unit, which is connected to the main control device; a second temperature detection unit, the second temperature detection unit is respectively connected to the temperature calibration control unit and the heating component to detect the actual heating temperature of the heating component; the temperature calibration control unit obtains the actual heating temperature from the second temperature detection unit and sends the actual heating temperature to the main control device, and the main control device further sends the actual heating temperature to the host computer, and the host computer calibrates the heating temperature of the heating component to the actual heating temperature.

2. The simulated heating system according to claim 1, characterized in that, the first temperature detection unit includes a plurality of temperature sensors, and the plurality of temperature sensors are installed at different positions of the heating device to detect the temperatures of the different positions in real time.

3. The simulated heating system according to claim 1, characterized in that, the heating component can be an internal heating type component, an external heating type component or an internal and external heating type component.

4. The simulated heating system according to claim 3, characterized in that, the external heating type component includes a positioning rod, an adjusting rod and a receiving portion for accommodating the aerosol-forming substrate, the receiving portion is located at the upper end of the positioning rod, the positioning rod is fixed to the upper end of the adjusting rod, and the adjusting rod is used to rotate along its own circumference to drive the positioning rod to move up and down along the axial direction of the external heating type component to adjust the insertion length of the aerosol-forming substrate in the receiving portion.

5. The simulated heating system according to claim 3, characterized in that, the internal and external heating type component includes an upper cover, a heating component body, an electromagnetic heating tube and an electromagnetic heating coil, the upper cover is detachably connected to the heating component body, the electromagnetic heating tube is installed in the upper cover, and the electromagnetic heating coil is sleeved on the circumference of the heating component body.

6. The simulated heating system according to claim 1, characterized in that, It further includes a suction cooling unit, which is connected to the main control device. The suction joint of the suction cooling unit extends into the accommodating part of the heating component for accommodating the aerosol-forming substrate, and the main control device controls the suction cooling unit to perform gas suction on the accommodating part according to the control instruction of the host computer.

7. An analog heating system according to claim 6, wherein, the suction cooling unit is a vacuum pump.

8. A method for actively cooling the heating temperature of a heating component, characterized in that: the method requires providing an analog heating system according to claim 6, and includes the following steps: S1: The host computer issues a cooling instruction to the main control device; S2: The main control device receives the cooling instruction; S3: The main control device starts the suction cooling unit to perform gas suction on the accommodating part of the heating component for accommodating the aerosol-forming substrate, and actively reduces the heating temperature of the heating component; S4: When the heating temperature of the heating component reaches the preset temperature, the host computer issues a stop cooling instruction to the main control device; S5: The main control device receives the stop cooling instruction; S6: The main control device stops the suction cooling unit from performing gas suction on the accommodating part of the heating component for accommodating the aerosol-forming substrate.

9. A method for calibrating the heating temperature of a heating component, characterized in that, the method requires providing an analog heating system according to claim 1, and includes the following steps: S1: Connect the second temperature detection unit to the heating component; S2: Control the heating temperature of the heating component at the first temperature T1 according to the control instruction of the host computer; S3: The temperature calibration control unit is connected to the second temperature detection unit, collects and processes the output signal of the second temperature detection unit, and obtains the first actual heating temperature T1R; S4: The temperature calibration control unit sends the first actual heating temperature T1R to the main control device, and the main control device further sends the first actual heating temperature T1R to the host computer; S5: The host computer calibrates the first temperature T1 of the heating component to the first actual heating temperature T1R; S6: Control the heating temperature of the heating component at the second temperature T2 according to the control instruction of the host computer; S7: The temperature calibration control unit obtains the second actual heating temperature T2R; S8: The temperature calibration control unit sends the second actual heating temperature T2R to the main control device, and the main control device further sends the second actual heating temperature T2R to the host computer; S9: The host computer calibrates the second temperature T2 of the heating component to the second actual heating temperature T2R.

Images