Display substrate, display device, and method for preparing display substrate

Abstract

A display substrate, a display device, and a method for manufacturing a display substrate, relating to the field of display technology, includes multiple display units, each comprising a transparent region and a light-emitting region. The light-emitting region includes multiple sub-pixels, each of which includes a pixel driver circuit and a light-emitting device. The light-emitting region includes a first area and a second area. The pixel driver circuits for the multiple sub-pixels in the light-emitting region are located in the first area, while the second area is configured to emit light and be transparent when not emitting light. The display substrate of the disclosed embodiments can improve the brightness and transparency of the display substrate.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of display technology, and particularly to a display substrate, a display device, and a method for manufacturing the display substrate. Background Art

[0002] Organic light-emitting diodes (OLEDs) are active light-emitting devices with the advantages of self-luminescence, ultra-thinness, wide viewing angle, high brightness, high contrast, low power consumption, and extremely high response speed. With the continuous development of display technology, OLED display technology is increasingly used in transparent displays. Transparent display is an important personalized display field of display technology. It refers to the display of images in a transparent state. Viewers can not only see the image in the display device, but also the scene behind the display device. Figure 1 As shown, Figure 1 The structure diagram of two display units of a transparent display device of some technologies is shown. Each display unit (or pixel) includes a transparent area and a light-emitting area. The transparent area allows light to pass through, and the light-emitting area includes multiple sub-pixels ( Figure 1 The diagram shows three sub-pixels (P1, P2, and P3) and sets pixel drive circuits and light-emitting devices for these sub-pixels to achieve image display. The light-emitting area is opaque. Maximizing the transparent area to ensure high transparency of the display device reduces the area of ​​the light-emitting area, resulting in reduced brightness and lifespan of the display device. Summary of the Invention

[0003] The embodiments of the present disclosure provide a display substrate, a display device, and a method for manufacturing the display substrate, which can improve the brightness and transparency of the display substrate.

[0004] An embodiment of the present disclosure provides a display substrate, comprising a plurality of display units, wherein the display units include a transparent area and a light-emitting area, the light-emitting area includes a plurality of sub-pixels, and the sub-pixels include a pixel driving circuit and a light-emitting device; the light-emitting area includes a first region and a second region, the pixel driving circuit of the plurality of sub-pixels in the light-emitting area is arranged in the first region, and the second region is arranged to be able to emit light and have transparency when not emitting light.

[0005] An embodiment of the present disclosure further provides a display device, comprising the display substrate.

[0006] The present disclosure also provides a method for preparing the display substrate, including:

[0007] forming a driving structure layer in the light-emitting area, and an inorganic composite insulating layer and a planar layer in the transparent area on a substrate, wherein the driving structure layer includes a pixel driving circuit arranged in the first area, and the planar layer is arranged on a side of the inorganic composite insulating layer away from the substrate;

[0008] forming a plurality of first electrodes on the driving structure layer in the light-emitting area, wherein the first electrodes located in the second area are formed of a transparent material;

[0009] forming a pixel defining layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, wherein the pixel defining layer is provided with a plurality of pixel openings, each of the pixel openings exposing a surface of a corresponding first electrode away from the substrate;

[0010] forming an organic functional layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, wherein the organic functional layer located in the second region is formed of a transparent material;

[0011] A second electrode layer is formed on the side of the organic functional layer away from the substrate and located in the light emitting area and the transparent area. The second electrode layer is formed of a transparent material. Each of the first electrode, the organic functional layer and the second electrode layer forms a light emitting device.

[0012] The present disclosure also provides another method for preparing the display substrate, including:

[0013] A thin film transistor in the first region of the light emitting area and an inorganic composite insulating layer in the transparent area are formed on the substrate, wherein the pixel driving circuit includes the thin film transistor;

[0014] forming a flat layer located in the light-emitting area and the transparent area on a side of the thin film transistor away from the substrate, wherein the flat layer at the boundary between the light-emitting area and the transparent area is provided with a partition groove;

[0015] forming a transparent conductive film located in the light-emitting area and the transparent area on a side of the planar layer away from the substrate, and patterning the transparent conductive film to form a plurality of first electrodes located in the light-emitting area and a transparent conductive layer located in the transparent area, wherein the first electrodes cover the walls of the partitioning grooves facing the transparent area, and the transparent conductive layer exposes the walls of the partitioning grooves facing the light-emitting area;

[0016] Performing an ashing process on the groove wall of the partition groove facing the light-emitting area so that the transparent conductive layer protrudes from the groove wall of the partition groove facing the light-emitting area;

[0017] forming a pixel defining layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, the pixel defining layer being provided with a plurality of pixel openings, each of the pixel openings exposing a surface of a corresponding first electrode away from the substrate, the pixel defining layer being partially disposed within the partition groove;

[0018] forming an organic functional layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, wherein the organic functional layer located in the second region is formed of a transparent material;

[0019] A second electrode layer is formed on a side of the organic functional layer away from the substrate and located in the light-emitting area and the transparent area, the second electrode layer being disconnected at the partition groove and being formed of a transparent material, and each of the first electrode, the organic functional layer and the second electrode layer forms a light-emitting device;

[0020] forming a first encapsulation layer located in the light-emitting area and the transparent area on a side of the second electrode layer away from the substrate, wherein the first encapsulation layer is disconnected at the partition groove and is formed of a transparent material;

[0021] removing the planar layer in the transparent area, and the transparent conductive layer, the second electrode layer, and the first encapsulation layer stacked on the planar layer;

[0022] A second encapsulation layer is formed on a side of the first encapsulation layer away from the substrate and located in the light emitting area and the transparent area. The second encapsulation layer is formed of a transparent material.

[0023] In the display substrate of the embodiment of the present disclosure, the light-emitting area includes a first area and a second area, and the pixel driving circuits of the multiple sub-pixels in the light-emitting area are set in the first area, and the second area is set to be able to emit light and have transparency when not emitting light. In this way, the second area can achieve light transmission when not emitting light, thereby improving the transparency of the display substrate. The second area can increase the brightness of the display substrate when emitting light. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are intended to provide a further understanding of the technical solutions of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solutions of the present disclosure and do not constitute a limitation of the technical solutions of the present disclosure. The shapes and sizes of the components in the accompanying drawings do not reflect the actual scale and are intended only to illustrate the contents of the present disclosure.

[0025] Figure 1 A schematic structural diagram of two display units of a transparent display device according to some technologies;

[0026] Figure 2 is a schematic structural diagram of two display units of a display substrate of some exemplary embodiments;

[0027] Figure 3 In some exemplary embodiments Figure 2 AA cross-sectional structural diagram of a display substrate;

[0028] Figure 4 In some other exemplary embodiments Figure 2 AA cross-sectional structural diagram of a display substrate;

[0029] Figure 5 In some further exemplary embodiments Figure 2 AA cross-sectional structural diagram of a display substrate;

[0030] Figure 6a is a schematic diagram of a partial cross-sectional structure of a display substrate after forming a first electrode according to some exemplary embodiments;

[0031] Figure 6b Schematic diagram of a partial cross-sectional structure of a display substrate after forming a pixel defining layer and an organic functional layer according to some exemplary embodiments;

[0032] Figure 6c Schematic diagram of a partial cross-sectional structure of a display substrate after forming an encapsulation structure layer or a first encapsulation layer according to some exemplary embodiments;

[0033] Figure 6d is a schematic diagram of a partial cross-sectional structure of a display substrate after the first encapsulation layer and the second electrode layer in the transparent area are removed according to some exemplary embodiments;

[0034] Figure 7a Schematic diagrams of partial cross-sectional structures of display substrates after a planar layer is formed according to other exemplary embodiments;

[0035] Figure 7b Schematic diagrams of partial cross-sectional structures of display substrates after forming first electrodes according to other exemplary embodiments;

[0036] Figure 7c Schematic diagrams of partial cross-sectional structures of display substrates according to other exemplary embodiments after the groove walls of the isolation grooves facing the light-emitting areas are ashed;

[0037] Figure 7d Schematic diagrams of partial cross-sectional structures of display substrates according to other exemplary embodiments after forming pixel defining layers and organic functional layers;

[0038] Figure 7e Schematic diagrams of partial cross-sectional structures of display substrates according to other exemplary embodiments after forming a second electrode layer and a first encapsulation layer;

[0039] Figure 7f Schematic diagrams of partial cross-sectional structures of display substrates of other exemplary embodiments after the planar layer in the transparent area, and the transparent conductive layer, the second electrode layer, and the first encapsulation layer stacked on the planar layer are removed.

[0040] The figures are marked as follows: 10, substrate, 11, first insulating layer, 12, second insulating layer, 13, third insulating layer, 14, fourth insulating layer, 15, flat layer, 21, first electrode, 22, pixel defining layer, 23, organic functional layer, 24, second electrode layer, 30, encapsulation structure layer, 31, first encapsulation layer, 32, second encapsulation layer, 100, light-emitting area, 101, first region, 102, second region, 110, thin film transistor, 120, storage capacitor, 130, light-emitting device, 151, partition groove, 152, via, 200, transparent area, 211, reflective layer, 212, transparent conductive layer. DETAILED DESCRIPTION

[0041] Those skilled in the art should understand that the technical solutions of the embodiments of the present disclosure may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the embodiments of the present disclosure, and all should be included in the scope of the claims of the present disclosure.

[0042] The present disclosure provides a display substrate, such as Figure 2 As shown, Figure 2 Schematic diagram of the structure of two display units of a display substrate of some exemplary embodiments, wherein the display substrate includes a plurality of display units, wherein the display unit includes a transparent area 200 and a light-emitting area 100, wherein the light-emitting area 100 includes a plurality of sub-pixels ( Figure 2 Three sub-pixels P1, P2 and P3 are shown as an example), and the sub-pixels include a pixel driving circuit and a light-emitting device; the light-emitting area 100 includes a first area 101 and a second area 102, and the pixel driving circuits of the multiple sub-pixels of the light-emitting area 100 are set in the first area 101, and the second area 102 is set to be able to emit light and have transparency when not emitting light.

[0043] In the display substrate of the embodiment of the present disclosure, the light-emitting area 100 includes a first area 101 and a second area 102. The pixel driving circuits of the multiple sub-pixels of the light-emitting area 100 are set in the first area 101, and the second area 102 is configured to be able to emit light and have transparency when not emitting light. In this way, the second area 102 can allow light to pass through when not emitting light, thereby improving the transparency of the display substrate. When emitting light, the second area 102 can increase the brightness of the display substrate.

[0044] In some exemplary embodiments, Figure 2 As shown, the transparent area 200 can be provided on one side of the light emitting area 100 , and the second area 102 can be located on at least one side of the first area 101 .

[0045] In an example of this embodiment, Figure 2As shown, the transparent area 200 is located on one side of the light-emitting area 100 in the first direction X, and the second area 102 can be located on one side or both sides of the first area 101 in the first direction X. Figure 2 In the example shown in FIG. 1 , the second region 102 is located on both sides of the first region 101 in the first direction. The transparent region 200 and the luminous region 100 can both be rectangular in shape. In other embodiments, the second region 102 can be located on one or both sides of the first region 101 in the second direction Y, where the first direction X intersects the second direction Y.

[0046] In an example of this embodiment, Figure 2 As shown, the plurality of sub-pixels ( Figure 2 The light-emitting devices 130 of three sub-pixels (P1, P2, and P3) can be arranged side by side in a second direction Y, where the first direction X intersects the second direction Y. The first electrode 21 of each light-emitting device 130 in the light-emitting area 100 is partially located (in the middle portion of the first electrode 21) in the first region 101 and partially located (at both ends of the first electrode 21) in the second region 102.

[0047] In other embodiments, the light-emitting devices of the multiple sub-pixels of the light-emitting area 100 can be arranged side by side in the first direction X. The present disclosure does not limit the number of sub-pixels in the light-emitting area 100, and can be three or four, etc. The present disclosure does not limit the arrangement of the multiple sub-pixels in the light-emitting area 100, and can be arranged side by side in the first direction X or the second direction Y, or three sub-pixels can be arranged in a "pin" shape, four sub-pixels can be arranged in two rows and two columns, etc. In other embodiments, the first electrode 21 of at least one light-emitting device in the light-emitting area 100 can be completely located in the first region 101 or the second region 102.

[0048] In some exemplary embodiments, Figure 3 As shown, Figure 3 In some exemplary embodiments Figure 2The AA cross-sectional structure diagram of the display substrate is shown. The light-emitting region 100 includes a driving structure layer, a light-emitting structure layer, and an encapsulation structure layer 30, which are sequentially stacked on the substrate 10. The driving structure layer includes the pixel driving circuit, and the light-emitting structure layer includes multiple light-emitting devices disposed on the driving structure layer. The light-emitting devices include a first electrode 21, an organic functional layer 23, and a second electrode layer 24, which are stacked in sequence. The first electrode 21 and the organic functional layer 23, as well as the second electrode layer 24 and the encapsulation structure layer 30 in the second region 102 are all formed of transparent materials. This ensures that the second region 102 is transparent when not emitting light, allowing light to pass through.

[0049] like Figure 3 As shown, the light-emitting structure layer further includes a pixel defining layer 22, which is disposed on a side of the plurality of first electrodes 21 away from the substrate 10 and is provided with a plurality of pixel openings, each of which exposes the surface of a corresponding first electrode 21 away from the substrate 10. Exemplarily, the organic functional layer 23 includes a light-emitting layer and may further include any one or more of the following film layers stacked between the first electrode and the light-emitting layer: a hole injection layer, a hole transport layer, and an electron blocking layer; the organic functional layer 23 may further include any one or more of the following film layers stacked between the light-emitting layer and the second electrode layer: a hole blocking layer, an electron transport layer, and an electron injection layer.

[0050] Exemplarily, the light-emitting layer includes multiple sub-light-emitting layers, each of which can be disposed within a corresponding pixel opening. Exemplarily, the light-emitting area can include three sub-pixels: red, green, and blue. The light-emitting layer can include a red sub-light-emitting layer, a green sub-light-emitting layer, and a blue sub-light-emitting layer. The sub-light-emitting layers of the light-emitting device of each sub-pixel emit light of the corresponding color under the action of the voltage of the first electrode and the second electrode layer. The light-emitting device can be an OLED device. The red sub-light-emitting layer, the green sub-light-emitting layer, and the blue sub-light-emitting layer can be formed separately using a vapor deposition process or an inkjet printing process multiple times. During the vapor deposition process, a fine metal mask (FMM) can be used to form the sub-light-emitting layer of each color sub-pixel within the pixel opening of the corresponding color sub-pixel. Any of the hole injection layer, the hole transport layer, the electron blocking layer, the hole blocking layer, the electron transport layer, and the electron injection layer can be disposed as a common layer within the multiple sub-pixels of the light-emitting area. It can be formed using a vapor deposition process or an inkjet printing process and formed in the first and second regions of the light-emitting area. Each layer of the organic functional layer can be formed of a transparent material.

[0051] In an example of this embodiment, Figure 3As shown, the first electrode 21 located in the first region 101 may include a reflective layer 211 and a transparent conductive layer 212 provided on a side of the reflective layer 211 away from the substrate 10; the first electrode 21 located in the second region 102 includes the transparent conductive layer 212. The reflective layer 211 can reflect light emitted by the light-emitting device to improve the luminous efficiency of the display substrate.

[0052] For example, the first electrode 21 of at least one of the light-emitting devices in the light-emitting area 100 may be partially located in the first region 101 and partially located in the second region 102. For example, Figure 2 In the example of , the first electrode 21 of each light emitting device in the light emitting area 100 is partially located in the first region 101 (the middle portion of the first electrode 21 ) and partially located in the second region 102 (the two end portions of the first electrode 21 ). Figure 3 As shown, the first electrode 21 of each light-emitting device may include a reflective layer 211 and a transparent conductive layer 212 provided on a side of the reflective layer 211 away from the substrate 10. The reflective layer 211 is located in the first region 101 and not in the second region 102. The middle portion of the transparent conductive layer 212 covers the reflective layer 211 and is located in the first region 101, and the end portions of the transparent conductive layer 212 are located in the second region 102. Since the pixel driving circuits of the multiple sub-pixels in the light-emitting area 100 are all located in the first region 101, the first electrode 21 of each light-emitting device can be connected to a corresponding pixel driving circuit through the reflective layer 211.

[0053] In some exemplary embodiments, Figure 3 As shown, the material of the reflective layer 211 may include any one or more of silver (Ag), aluminum (Al), and copper (Cu), and may be a single material or an alloy material. The material of the transparent conductive layer 212 may include any one or more of indium tin oxide (ITO) and indium zinc oxide (IZO), and the transparent conductive layer 212 may be provided as one or more layers. The material of the second electrode layer 24 may be a material with high transparency and low resistance, such as ITO, IZO, silver nanowires (AgNW), or carbon nanotubes (CNT).

[0054] In some exemplary embodiments, Figure 3 As shown, the driving structure layer may include a thin film transistor 110 provided on the substrate 10 and a planar layer 15 provided on a side of the thin film transistor 110 away from the substrate 10. The pixel driving circuit includes the thin film transistor 110. The transparent area 200 may include an inorganic composite insulating layer, the planar layer 15, the second electrode layer 24, and the encapsulation structure layer 30 stacked in sequence on the substrate 10. The encapsulation structure layer 30 may be a single-layer structure or a multi-layer composite structure.

[0055] In other exemplary embodiments, Figure 4 As shown, Figure 4 In some other exemplary embodiments Figure 2 AA cross-sectional structural diagram of the display substrate, in the light-emitting area 100, the driving structure layer may include a thin film transistor 110 provided on the substrate 10 and a flat layer 15 provided on the side of the thin film transistor 110 away from the substrate 10, and the pixel driving circuit includes the thin film transistor 110; the encapsulation structure layer 30 may include a first encapsulation layer 31 and a second encapsulation layer 32 stacked in sequence in a direction away from the substrate 10.

[0056] In an example of this embodiment, Figure 4 As shown, the transparent area 200 may include an inorganic composite insulating layer, the planar layer 15 and the second encapsulation layer 32 sequentially stacked on the substrate 10 , and does not include the second electrode layer 24 and the first encapsulation layer 31 .

[0057] The transmittance of the transparent area of ​​transparent display substrates in some technologies decreases by approximately 10% in the transparent cathode (IZO or ITO) and by approximately 2% to 10% in the thin-film encapsulation layer, resulting in reduced transparency of the transparent display substrate. It is difficult to ensure a transmittance of more than 80% in the transparent area of ​​a typical transparent OLED display substrate. In this example, the transparent area 200 does not include the second electrode layer 24 and the first encapsulation layer 31. This can increase the transmittance of the transparent area 200 by 12% to 16%, allowing the transmittance of the transparent area 200 to exceed 95%.

[0058] In another example of this embodiment, Figure 5 As shown, Figure 5 In some further exemplary embodiments Figure 2 AA cross-sectional structural diagram of a display substrate, the transparent region 200 may include an inorganic composite insulating layer and the second encapsulation layer 32 sequentially stacked on the substrate 10, and does not include the planar layer 15, the second electrode layer 24, and the first encapsulation layer 31. In this example, the transparent region 200 does not include the planar layer 15, the second electrode layer 24, and the first encapsulation layer 31, thereby improving the transmittance of the transparent region 200 and the transparency of the display substrate.

[0059] The following is an exemplary description of the method for preparing the display substrate disclosed herein. The "patterning process" referred to herein includes processes such as film deposition, photoresist coating, mask exposure, development, etching, and photoresist stripping. Deposition can be performed by any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed by any one or more of spray coating and spin coating; and etching can be performed by any one or more of dry etching and wet etching. A "thin film" refers to a thin layer of a material deposited on a substrate using a deposition or coating process. If the thin film does not require a patterning process during the entire production process, it can also be referred to as a "layer." If the thin film requires a patterning process during the entire production process, it is referred to as a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern." As used herein, "A and B are arranged in the same layer" means that A and B are formed simultaneously through the same patterning process. "The orthographic projection of A includes the orthographic projection of B" means that the orthographic projection of B falls within the orthographic projection of A, or that the orthographic projection of A covers the orthographic projection of B.

[0060] In some exemplary embodiments, the method for preparing a display substrate according to an embodiment of the present disclosure may include the following steps:

[0061] 1) Forming a driving structure layer of the light-emitting area 100, and an inorganic composite insulating layer and a flat layer 15 of the transparent area 200 on the substrate 10 may include:

[0062] A first insulating film and an active layer film are sequentially deposited on a substrate 10 , and the active layer film is patterned through a patterning process to form a first insulating layer 11 covering the substrate 10 , and an active layer pattern arranged on the first insulating layer 11 , wherein the active layer pattern includes at least the active layer of each sub-pixel in the light-emitting area 100 .

[0063] Subsequently, a second insulating film and a first metal film are deposited in sequence, and the first metal film is patterned through a patterning process to form a second insulating layer 12 covering the active layer pattern, and a first gate metal layer pattern arranged on the second insulating layer 12. The first gate metal layer pattern may include a gate electrode and a first capacitor electrode for each sub-pixel in the light-emitting area 100.

[0064] Subsequently, a third insulating film and a second metal film are sequentially deposited, and the second metal film is patterned through a patterning process to form a third insulating layer 13 covering the first gate metal layer, and a second gate metal layer pattern disposed on the third insulating layer 13. The second gate metal layer pattern may include a second capacitor electrode for each sub-pixel in the light-emitting area 100, and the position of the second capacitor electrode corresponds to the position of the first capacitor electrode. The first capacitor electrode and the second capacitor electrode constitute the storage capacitor 120.

[0065] Subsequently, a fourth insulating film is deposited and patterned through a patterning process to form a fourth insulating layer 14 pattern covering the second gate metal layer. At least two via holes are opened on the fourth insulating layer 14 of each sub-pixel. The fourth insulating layer 14, the third insulating layer 13 and the second insulating layer 12 in the two via holes are etched away to expose the surface of the active layer of each sub-pixel.

[0066] Subsequently, a third metal film is deposited and patterned through a patterning process to form a source-drain metal layer pattern on the fourth insulating layer 14. The source-drain metal layer may include a source electrode and a drain electrode for each sub-pixel. The source electrode and the drain electrode are connected to the active layer through two vias passing through the fourth insulating layer 14, the third insulating layer 13 and the second insulating layer 12.

[0067] Subsequently, a flat film of organic material is coated on the substrate 10 forming the aforementioned pattern, and a via is formed on the flat film of each sub-pixel through processes such as masking, exposure, and development. The flat film in the via is developed away to expose the surface of the drain electrode, thereby forming a flat layer 15 (PLN) covering the aforementioned pattern.

[0068] In this example, Figure 6a As shown, Figure 6a This is a schematic diagram of a partial cross-sectional structure of a display substrate after forming the first electrode 21 in some exemplary embodiments. In the driving structure layer, the active layer, gate electrode, source electrode, and drain electrode can form the driving thin film transistor 110 of the pixel driving circuit, and the first capacitor electrode and the second capacitor electrode can form the storage capacitor 120 of the pixel driving circuit. The pixel driving circuit can use an active matrix driving method to drive the light-emitting device of each sub-pixel. The pixel driving circuit includes multiple thin film transistors and storage capacitor 120. The pixel driving circuit can have a 3T1C, 5T1C, or 7T1C structure. The pixel driving circuit is formed in the first area 101 of the light-emitting area 100.

[0069] The first insulating layer 11, the second insulating layer 12, the third insulating layer 13 and the fourth insulating layer 14 can be made of inorganic materials, such as any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and can be a single layer, a multilayer or a composite layer. The first insulating layer 11 can be called a buffer layer, which is used to improve the water and oxygen resistance of the substrate 10. The second insulating layer 12 and the third insulating layer 13 can be called a gate insulating (GI) layer, and the fourth insulating layer 14 can be called an interlayer insulating (ILD) layer. The first metal film, the second metal film and the third metal film can be made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and can be a single layer structure or a multilayer composite structure, such as Ti / Al / Ti. The active layer thin film can be made of amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), sexithiophene, polythiophene, and other materials. Specifically, the disclosed embodiments are applicable to thin-film transistors manufactured using oxide, silicon, and organic technologies. The substrate 10 can be made of glass or a transparent plastic material, such as polyimide (PI), polyethylene terephthalate (PET), or polyethylene (PE).

[0070] At this point, the driving structure layer of the light-emitting region 100, as well as the inorganic composite insulating layer and the planar layer 15 of the transparent region 200, are formed on the substrate 10. In this example, the inorganic composite insulating layer of the transparent region 200 includes a first insulating layer 11, a second insulating layer 12, a third insulating layer 13, and a fourth insulating layer 14, which are sequentially stacked on the substrate 10.

[0071] 2) Forming a plurality of first electrodes 21 on the driving structure layer of the light-emitting area 100 may include:

[0072] A reflective film is deposited on the planar layer 15, and the reflective film is patterned by a patterning process to form a plurality of reflective layers 211 located in the first region 101. Each reflective layer 211 is connected to the drain electrode through a corresponding via hole provided in the planar layer 15. Figure 6a shown.

[0073] A transparent conductive film is deposited on the side of the multiple reflective layers 211 away from the substrate 10, and the transparent conductive film is patterned through a patterning process to form a plurality of transparent conductive layers 212 located in the first area 101 and the second area 102 of the light-emitting area 100. Each transparent conductive layer 212 is arranged on the side of a corresponding reflective layer 211 away from the substrate 10, the middle part of each transparent conductive layer 212 is located in the first area 101 and covers the corresponding reflective layer 211, and the two end parts of each transparent conductive layer 212 are located in the second area 102. Each first electrode 21 includes a reflective layer 211 and a transparent conductive layer 212 arranged on the side of the reflective layer 211 away from the substrate 10. Since the reflective layer 211 is located in the first area 101 and not in the second area 102, the part of each first electrode 21 located in the second area 102 can only have a transparent conductive layer 212 and be formed of a transparent material. Figure 6a shown.

[0074] 3) Forming a pixel defining layer 22 and an organic functional layer 23 on a side of the plurality of first electrodes 21 of the light emitting area 100 away from the substrate 10 may include:

[0075] A pixel definition film is coated on the patterned substrate 10. Masking, exposure, and development processes are performed to form a pixel definition layer 22 located in the light-emitting area 100. The pixel definition layer 22 is provided with a plurality of pixel openings, each of which exposes the surface of a corresponding first electrode 21 away from the substrate 10. The pixel definition layer can be made of polyimide, acrylic, or polyethylene terephthalate, among other materials.

[0076] A hole injection layer, a hole transport layer, an electron blocking layer, a light emitting layer, a hole blocking layer, an electron transport layer and an electron injection layer are sequentially formed on the side of the plurality of first electrodes 21 of the light emitting area 100 away from the substrate 10 by using an evaporation process, thereby forming the organic functional layer 23. Each film layer of the organic functional layer 23 is formed of a transparent material. Figure 6b As shown, Figure 6b Schematic diagram of a partial cross-sectional structure of a display substrate after forming a pixel defining layer 22 and an organic functional layer 23 according to some exemplary embodiments.

[0077] 4) Forming the second electrode layer 24 and the encapsulation structure layer 30 may include:

[0078] In some examples, a second electrode film can be deposited on the substrate 10 formed with the aforementioned pattern by evaporation or sputtering process to form a second electrode layer 24 located in the light-emitting area 100 and the transparent area 200. The second electrode layer 24 is formed of a transparent material, and each of the first electrode 21, the organic functional layer 23 and the second electrode layer 24 forms a light-emitting device. Subsequently, an encapsulation structure layer 30 is formed on the side of the second electrode layer 24 away from the substrate 10, and is located in the light-emitting area 100 and the transparent area 200. The encapsulation structure layer 30 is formed of a transparent material and can be a single-layer structure or a multi-layer structure. Figure 3 Subsequently, a cover plate may be attached to the side of the packaging structure layer 30 facing away from the substrate 10 .

[0079] In other examples, a second electrode film can be deposited on the substrate 10 formed with the aforementioned pattern by evaporation or sputtering to form a second electrode layer 24 located in the light-emitting area 100 and the transparent area 200. The second electrode layer 24 is formed of a transparent material. Subsequently, a first encapsulation layer 31 is formed on the side of the second electrode layer 24 away from the substrate 10 and located in the light-emitting area 100 and the transparent area 200. The first encapsulation layer 31 is formed of a transparent material, such as Figure 6c As shown, Figure 6c Schematic diagram of a partial cross-sectional structure of a display substrate after forming the encapsulation structure layer 30 or the first encapsulation layer 31 of some exemplary embodiments. Subsequently, the first encapsulation layer 31 and the second electrode layer 24 of the transparent area 200 can be etched away by using masking, exposure, development, etching and other processes, as shown in FIG. Figure 6d As shown, Figure 6d Schematic diagram of a partial cross-sectional structure of a display substrate of some exemplary embodiments after the first encapsulation layer 31 and the second electrode layer 24 in the transparent area 200 are removed. Subsequently, a second encapsulation layer 32 located in the light-emitting area 100 and the transparent area 200 is formed on the side of the first encapsulation layer 31 away from the substrate 10. The second encapsulation layer 32 is formed of a transparent material, such as Figure 4 In the display substrate of this example, the transparent region 200 does not include the second electrode layer 24 and the first encapsulation layer 31 , which can improve the light transmittance of the transparent region 200 .

[0080] The present disclosure also provides another method for preparing a display substrate, wherein the display substrate includes a plurality of display units, such as Figure 5As shown, the display unit includes a transparent area 200 and a light-emitting area 100. The light-emitting area 100 includes multiple sub-pixels, each of which includes a pixel driving circuit and a light-emitting device. The light-emitting area 100 includes a first region 101 and a second region 102. The pixel driving circuit of the multiple sub-pixels in the light-emitting area 100 is set in the first region 101, and the second region 102 is configured to be able to emit light and have transparency when not emitting light. The pixel driving circuit includes a thin film transistor 110. The preparation method may include the following steps:

[0081] 1) Forming the thin film transistor 110 in the first region 101 of the light emitting region 100 and the inorganic composite insulating layer in the transparent region 200 on the substrate 10. The preparation process of this step can refer to the above content.

[0082] 2) Forming a planar layer 15 located in the light emitting area 100 and the transparent area 200 on a side of the thin film transistor 110 away from the substrate 10 may include:

[0083] A flat film of organic material is coated on the substrate 10 on which the aforementioned pattern is formed, and a flat layer 15 (PLN) covering the aforementioned pattern is formed through processes such as masking, exposure, and development. The flat layer 15 is provided with a via 152 in each sub-pixel to expose the surface of the drain electrode, and a partition groove 151 is formed at the boundary between the light-emitting area 100 and the transparent area 200. The partition groove 151 can separate the flat layer 15 of the transparent area 200 from the flat layer 15 of the light-emitting area 100. Exemplarily, the cross-section of the partition groove 151 can be formed as an inverted trapezoid, that is, the orthographic projection of the end of the partition groove 151 away from the substrate 10 on the substrate 10 includes the orthographic projection of the end of the partition groove 151 close to the substrate 10 on the substrate 10, and the sidewall of the partition groove 151 is a slope. As Figure 7a As shown, Figure 7a Schematic diagrams of partial cross-sectional structures of display substrates according to other exemplary embodiments after the flat layer 15 is formed.

[0084] 3) Forming a plurality of first electrodes 21 located in the light-emitting region 100 and a transparent conductive layer 212 located in the transparent region 200 may include:

[0085] A reflective film is deposited on the substrate 10 with the aforementioned pattern, and patterned to form a plurality of reflective layers 211 located in the first region 101. Each reflective layer 211 is connected to the drain electrode through a corresponding via 152 provided in the planar layer 15.

[0086] A transparent conductive film is deposited on the substrate 10 having the aforementioned pattern formed thereon. The transparent conductive film is then patterned through a patterning process to form a plurality of transparent conductive layers 212 located in the first region 101 and the second region 102 of the light-emitting region 100, as well as a transparent conductive layer 212 located in the transparent region 200. Within the light-emitting region 100, each transparent conductive layer 212 is disposed on the side of a corresponding reflective layer 211 away from the substrate 10. The middle portion of each transparent conductive layer 212 is located in the first region 101 and covers the corresponding reflective layer 211, while both ends of each transparent conductive layer 212 are located in the second region 102. Each first electrode 21 includes a reflective layer 211 and a transparent conductive layer 212 disposed on the side of the reflective layer 211 away from the substrate 10. Since the reflective layer 211 is located in the first region 101 and not in the second region 102, the portion of each first electrode 21 located in the second region 102 can consist solely of the transparent conductive layer 212, which is formed of a transparent material. In addition, the two end portions of each transparent conductive layer 212 located in the second region 102 cover the groove wall of the partition groove 151 facing the transparent region 200, and the transparent conductive layer 212 of the transparent region 200 exposes the groove wall of the partition groove 151 facing the light-emitting region 100, as shown in FIG. Figure 7b As shown, Figure 7b Schematic diagrams of partial cross-sectional structures of display substrates according to other exemplary embodiments after the first electrodes 21 are formed.

[0087] 4) Performing an ashing process on the groove wall of the partition groove 151 facing the light-emitting area 100 so that the transparent conductive layer 212 protrudes from the groove wall of the partition groove 151 facing the light-emitting area 100. This may include:

[0088] By using the transparent conductive layer 212 as a mask, an etching process can be used to etch the groove wall of the partition groove 151 facing the light-emitting area 100, so that the transparent conductive layer 212 of the transparent area 200 protrudes from the groove wall of the partition groove 151 facing the light-emitting area 100, so that the subsequently formed second electrode layer 24 and the first encapsulation layer 31 can be disconnected at the partition groove 151. Figure 7c As shown, Figure 7c 1 is a schematic diagram of a partial cross-sectional structure of a display substrate according to some other exemplary embodiments after the groove wall of the isolation groove facing the light-emitting area 100 is ashed.

[0089] 5) Forming a pixel defining layer 22 and an organic functional layer 23 on a side of the plurality of first electrodes 21 of the light emitting area 100 away from the substrate 10 may include:

[0090] A pixel-defining film is applied to the patterned substrate 10. Masking, exposure, and development processes are performed to form a pixel-defining layer 22 located in the light-emitting area 100. The pixel-defining layer 22 is provided with a plurality of pixel openings, each of which exposes the surface of a corresponding first electrode 21 facing away from the substrate 10. The pixel-defining layer 22 can be partially disposed within the partitioning trench 151. The orthographic projection of the pixel-defining layer 22 on the substrate 10 can include the orthographic projection of the partitioning trench 151 wall facing the transparent area 200 on the substrate 10. The pixel-defining layer can be made of polyimide, acrylic, or polyethylene terephthalate, among others.

[0091] A hole injection layer, a hole transport layer, an electron blocking layer, a light emitting layer, a hole blocking layer, an electron transport layer and an electron injection layer are sequentially formed on the side of the plurality of first electrodes 21 of the light emitting area 100 away from the substrate 10 by using an evaporation process, thereby forming the organic functional layer 23. Each film layer of the organic functional layer 23 is formed of a transparent material. Figure 7d As shown, Figure 7d Schematic diagrams of partial cross-sectional structures of display substrates according to other exemplary embodiments after the pixel defining layer 22 and the organic functional layer 23 are formed.

[0092] 6) Sequentially forming a second electrode layer 24 and a first encapsulation layer 31 located in the light-emitting area 100 and the transparent area 200 on the substrate 10 having the aforementioned pattern, which may include:

[0093] A second electrode thin film can be deposited on the patterned substrate 10 using an evaporation or sputtering process to form a second electrode layer 24 located in the light-emitting region 100 and the transparent region 200. The second electrode layer 24 is disconnected at the partition groove 151 and is formed of a transparent material. Each of the first electrode 21, the organic functional layer 23, and the second electrode layer 24 forms a light-emitting device.

[0094] A first encapsulation layer 31 is formed on the side of the second electrode layer 24 away from the substrate 10 and located in the light emitting area 100 and the transparent area 200. The first encapsulation layer 31 is disconnected at the partition groove 151 and is formed of a transparent material. Figure 7e As shown, Figure 7e Schematic diagrams of partial cross-sectional structures of display substrates according to other exemplary embodiments after the second electrode layer 24 and the first encapsulation layer 31 are formed.

[0095] 7) The flat layer 15 of the transparent area 200, as well as the transparent conductive layer 212, the second electrode layer 24 and the first encapsulation layer 31 stacked on the flat layer 15 are removed. Figure 7f As shown, Figure 7fSchematic diagrams of partial cross-sectional structures of display substrates of other exemplary embodiments after the planar layer 15 of the transparent area 200 and the transparent conductive layer 212 , the second electrode layer 24 and the first encapsulation layer 31 stacked on the planar layer 15 are removed.

[0096] 8) A second encapsulation layer 32 is formed on the side of the first encapsulation layer 31 away from the substrate 10 and located in the light emitting area 100 and the transparent area 200. The second encapsulation layer 32 is formed of a transparent material. Figure 5 In the display substrate of this example, the transparent area 200 does not include the flat layer 15 , the second electrode layer 24 and the first encapsulation layer 31 , which can improve the light transmittance of the transparent area 200 .

[0097] Based on the above content, an embodiment of the present disclosure provides a method for preparing a display substrate, comprising:

[0098] forming a driving structure layer in the light-emitting area, and an inorganic composite insulating layer and a planar layer in the transparent area on a substrate, wherein the driving structure layer includes a pixel driving circuit arranged in the first area, and the planar layer is arranged on a side of the inorganic composite insulating layer away from the substrate;

[0099] forming a plurality of first electrodes on the driving structure layer in the light-emitting area, wherein the first electrodes located in the second area are formed of a transparent material;

[0100] forming a pixel defining layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, wherein the pixel defining layer is provided with a plurality of pixel openings, each of the pixel openings exposing a surface of a corresponding first electrode away from the substrate;

[0101] forming an organic functional layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, wherein the organic functional layer located in the second region is formed of a transparent material;

[0102] A second electrode layer is formed on the side of the organic functional layer away from the substrate and located in the light emitting area and the transparent area. The second electrode layer is formed of a transparent material. Each of the first electrode, the organic functional layer and the second electrode layer forms a light emitting device.

[0103] In some examples of this embodiment, the preparation method may further include:

[0104] forming a first encapsulation layer located in the light-emitting area and the transparent area on a side of the second electrode layer away from the substrate, wherein the first encapsulation layer is formed of a transparent material;

[0105] removing the first encapsulation layer and the second electrode layer from the transparent area;

[0106] A second encapsulation layer is formed on a side of the first encapsulation layer away from the substrate and located in the light emitting area and the transparent area. The second encapsulation layer is formed of a transparent material.

[0107] Based on the above content, the embodiment of the present disclosure further provides another method for preparing the display substrate, including:

[0108] A thin film transistor in the first region of the light emitting area and an inorganic composite insulating layer in the transparent area are formed on the substrate, wherein the pixel driving circuit includes the thin film transistor;

[0109] forming a flat layer located in the light-emitting area and the transparent area on a side of the thin film transistor away from the substrate, wherein the flat layer at the boundary between the light-emitting area and the transparent area is provided with a partition groove;

[0110] forming a transparent conductive film located in the light-emitting area and the transparent area on a side of the planar layer away from the substrate, and patterning the transparent conductive film to form a plurality of first electrodes located in the light-emitting area and a transparent conductive layer located in the transparent area, wherein the first electrodes cover the walls of the partitioning grooves facing the transparent area, and the transparent conductive layer exposes the walls of the partitioning grooves facing the light-emitting area;

[0111] Performing an ashing process on the groove wall of the partition groove facing the light-emitting area so that the transparent conductive layer protrudes from the groove wall of the partition groove facing the light-emitting area;

[0112] forming a pixel defining layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, the pixel defining layer being provided with a plurality of pixel openings, each of the pixel openings exposing a surface of a corresponding first electrode away from the substrate, the pixel defining layer being partially disposed within the partition groove;

[0113] forming an organic functional layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, wherein the organic functional layer located in the second region is formed of a transparent material;

[0114] A second electrode layer is formed on a side of the organic functional layer away from the substrate and located in the light-emitting area and the transparent area, the second electrode layer being disconnected at the partition groove and being formed of a transparent material, and each of the first electrode, the organic functional layer and the second electrode layer forms a light-emitting device;

[0115] forming a first encapsulation layer located in the light-emitting area and the transparent area on a side of the second electrode layer away from the substrate, wherein the first encapsulation layer is disconnected at the partition groove and is formed of a transparent material;

[0116] removing the planar layer in the transparent area, and the transparent conductive layer, the second electrode layer, and the first encapsulation layer stacked on the planar layer;

[0117] A second encapsulation layer is formed on a side of the first encapsulation layer away from the substrate and located in the light emitting area and the transparent area. The second encapsulation layer is formed of a transparent material.

[0118] The present disclosure also provides a display device comprising the display substrate described in any of the above embodiments. The display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system.

[0119] In the drawings, the sizes of components, layer thicknesses, or regions are sometimes exaggerated for clarity. Therefore, the embodiments of the present disclosure are not necessarily limited to these dimensions, and the shapes and sizes of each component in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate some examples, and the embodiments of the present disclosure are not limited to the shapes or values ​​shown in the drawings.

[0120] In this description, "parallel" refers to a state where the angle formed by two straight lines is greater than -10° and less than 10°, and thus includes a state where the angle is greater than -5° and less than 5°. Furthermore, "perpendicular" refers to a state where the angle formed by two straight lines is greater than 80° and less than 100°, and thus includes a state where the angle is greater than 85° and less than 95°.

[0121] In the description herein, the terms "upper", "lower", "left", "right", "top", "inner", "outer", "axial", "four corners", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the embodiments of the present disclosure, and do not indicate or imply that the structure referred to has a specific orientation, is constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present disclosure.

[0122] In the description herein, unless otherwise expressly specified or limited, the terms "connect," "fixed connection," "installation," and "assembly" should be understood in a broad sense, for example, to mean a fixed connection, a detachable connection, or an integral connection; the terms "installation," "connection," and "fixed connection" can mean a direct connection, an indirect connection through an intermediate medium, or internal communication between two components. A person of ordinary skill in the art can understand the meaning of the above terms in the embodiments of the present disclosure according to the circumstances.

Claims

1. A display substrate, characterized in that: The device comprises a plurality of display units, each comprising a transparent area and a light-emitting area, wherein the light-emitting area comprises a plurality of sub-pixels, each of which comprises a pixel driving circuit and a light-emitting device; the light-emitting area comprises a first region and a second region, wherein the pixel driving circuit of the plurality of sub-pixels in the light-emitting area is arranged in the first region, and the second region is arranged to be luminous and transparent when not luminous; The light-emitting area includes a driving structure layer, a light-emitting structure layer and an encapsulation structure layer stacked in sequence on the substrate; the driving structure layer includes the pixel driving circuit, the light-emitting structure layer includes a plurality of light-emitting devices arranged on the driving structure layer, and the light-emitting devices include a first electrode, an organic functional layer and a second electrode layer stacked in sequence; the first electrode and the organic functional layer located in the second area, as well as the second electrode layer and the encapsulation structure layer are all formed of transparent materials.

2. The display substrate according to claim 1, wherein: The first electrode located in the first area includes a reflective layer and a transparent conductive layer provided on a side of the reflective layer away from the substrate; the first electrode located in the second area includes the transparent conductive layer.

3. The display substrate according to claim 1, wherein: The driving structure layer includes a thin film transistor arranged on the substrate and a flat layer arranged on the side of the thin film transistor away from the substrate, and the pixel driving circuit includes the thin film transistor; the transparent area includes an inorganic composite insulating layer, the flat layer, the second electrode layer and the packaging structure layer stacked in sequence on the substrate.

4. The display substrate according to claim 1, wherein: The driving structure layer includes a thin film transistor provided on the substrate and a planar layer provided on a side of the thin film transistor away from the substrate, and the pixel driving circuit includes the thin film transistor; the encapsulation structure layer includes a first encapsulation layer and a second encapsulation layer stacked in sequence in a direction away from the substrate; The transparent area includes an inorganic composite insulating layer, the flat layer and the second encapsulation layer stacked in sequence on the substrate, and does not include the second electrode layer and the first encapsulation layer; or, the transparent area includes an inorganic composite insulating layer and the second encapsulation layer stacked in sequence on the substrate, and does not include the flat layer, the second electrode layer and the first encapsulation layer.

5. The display substrate according to claim 1, wherein: The transparent area is provided on one side of the light emitting area, and the second area is located on at least one side of the first area.

6. The display substrate according to claim 5, wherein: The transparent area is located on one side of the light-emitting area in a first direction, and the second area is located on one side or both sides of the first area in the first direction.

7. The display substrate according to claim 6, wherein: The light-emitting devices of the plurality of sub-pixels in the light-emitting area are arranged in parallel in a second direction, and the first direction intersects the second direction.

8. The display substrate according to claim 2, wherein: The material of the reflective layer includes any one or more of silver, aluminum, and copper; or / and the material of the transparent conductive layer includes any one or more of indium tin oxide and indium zinc oxide.

9. A display device, characterized in that: The display substrate comprises the display substrate according to any one of claims 1 to 8.

10. A method for preparing the display substrate according to claim 1, characterized in that: include: forming a driving structure layer in the light-emitting area, and an inorganic composite insulating layer and a planar layer in the transparent area on a substrate, wherein the driving structure layer includes a pixel driving circuit arranged in the first area, and the planar layer is arranged on a side of the inorganic composite insulating layer away from the substrate; forming a plurality of first electrodes on the driving structure layer in the light-emitting area, wherein the first electrodes located in the second area are formed of a transparent material; forming a pixel defining layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, wherein the pixel defining layer is provided with a plurality of pixel openings, each of the pixel openings exposing a surface of a corresponding first electrode away from the substrate; forming an organic functional layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, wherein the organic functional layer located in the second region is formed of a transparent material; A second electrode layer is formed on a side of the organic functional layer away from the substrate and located in the light-emitting area and the transparent area, wherein the second electrode layer is formed of a transparent material, and each of the first electrode, the organic functional layer and the second electrode layer forms a light-emitting device; An encapsulation structure layer is formed on a side of the second electrode layer away from the substrate.

11. The method according to claim 10, wherein The step of forming a packaging structure layer on a side of the second electrode layer away from the substrate includes: forming a first encapsulation layer located in the light-emitting area and the transparent area on a side of the second electrode layer away from the substrate, wherein the first encapsulation layer is formed of a transparent material; removing the first encapsulation layer and the second electrode layer from the transparent area; A second encapsulation layer is formed on a side of the first encapsulation layer away from the substrate and located in the light emitting area and the transparent area. The second encapsulation layer is formed of a transparent material.

12. A method for preparing the display substrate according to claim 1, characterized in that: include: A thin film transistor in the first region of the light emitting area and an inorganic composite insulating layer in the transparent area are formed on the substrate, wherein the pixel driving circuit includes the thin film transistor; forming a flat layer located in the light-emitting area and the transparent area on a side of the thin film transistor away from the substrate, wherein the flat layer at the boundary between the light-emitting area and the transparent area is provided with a partition groove; forming a transparent conductive film located in the light-emitting area and the transparent area on a side of the planar layer away from the substrate, and patterning the transparent conductive film to form a plurality of first electrodes located in the light-emitting area and a transparent conductive layer located in the transparent area, wherein the first electrodes cover the walls of the partitioning grooves facing the transparent area, and the transparent conductive layer exposes the walls of the partitioning grooves facing the light-emitting area; Performing an ashing process on the groove wall of the partition groove facing the light-emitting area so that the transparent conductive layer protrudes from the groove wall of the partition groove facing the light-emitting area; forming a pixel defining layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, the pixel defining layer being provided with a plurality of pixel openings, each of the pixel openings exposing a surface of a corresponding first electrode away from the substrate, the pixel defining layer being partially disposed within the partition groove; forming an organic functional layer on a side of the plurality of first electrodes in the light-emitting region away from the substrate, wherein the organic functional layer located in the second region is formed of a transparent material; A second electrode layer is formed on a side of the organic functional layer away from the substrate and located in the light-emitting area and the transparent area, the second electrode layer being disconnected at the partition groove and being formed of a transparent material, and each of the first electrode, the organic functional layer and the second electrode layer forms a light-emitting device; forming a first encapsulation layer located in the light-emitting area and the transparent area on a side of the second electrode layer away from the substrate, wherein the first encapsulation layer is disconnected at the partition groove and is formed of a transparent material; removing the planar layer in the transparent area, and the transparent conductive layer, the second electrode layer, and the first encapsulation layer stacked on the planar layer; A second encapsulation layer is formed on a side of the first encapsulation layer away from the substrate and located in the light emitting area and the transparent area. The second encapsulation layer is formed of a transparent material.

Images