Cleaning jig, substrate processing equipment including the cleaning jig, and cleaning method for substrate processing equipment

Abstract

This invention relates to a substrate processing apparatus, and may include such an apparatus. The substrate processing apparatus includes: a rotatable rotating head; a cup surrounding the rotating head; a cleaning clamp located on the rotating head and discharging cleaning liquid toward the cup by rotation of the rotating head; and a nozzle unit located at the upper portion of the cleaning clamp and supplying the cleaning liquid to the center of the upper surface of the cleaning clamp, wherein the cleaning clamp includes a splash guide groove formed recessed to allow the cleaning liquid supplied from the nozzle unit to splash toward the cup using centrifugal force caused by the rotation of the rotating head.

Description

Technical Field

[0001] The embodiments described herein relate to a substrate processing apparatus, and more specifically to a substrate processing apparatus capable of cleaning a cup disposed in a liquid processing unit. Background Technology

[0002] Semiconductor devices are manufactured by performing various processes such as cleaning, deposition, imaging, etching, and ion implantation. Among these processes, the imaging process involves sequentially performing coating, exposure, and development steps. The coating process is the process of applying a photosensitive liquid, such as a photoresist, to the surface of a substrate. The exposure process is the process of exposing a circuit pattern onto the substrate in which a photosensitive film is formed. The development process is the process of selectively developing the exposed areas of the substrate.

[0003] Typically, coating and developing processes are used for liquid processing, and the process of supplying processing liquid to the substrate is performed. The liquid processing of the substrate is carried out in a processing container, and the used processing liquid is recovered through the processing container.

[0004] Because various processing liquids are recycled through the processing container according to the process, these liquids adhere to the container. The processing liquids adhering to the container subsequently generate waste gas or become a major cause of substrate contamination.

[0005] Figure 1 The liquid handling unit is shown.

[0006] refer to Figure 1 The liquid processing unit 1 includes: a cup 2 that provides a substrate processing procedure; a support plate 4 inside the cup 2 on which the substrate is placed; and a nozzle unit 5 located above the support plate 4 to discharge processing liquid toward the substrate 3.

[0007] The processing liquid supplied to the substrate is recycled through cup 2. Because various processing liquids are recycled through cup 2 according to the process, the processing liquid adheres to cup 2. The processing liquid 6 adhering to cup 2 then generates waste gas, or may splash back onto the substrate.

[0008] Therefore, it is preferable to clean cup 2 regularly, or to clean cup 2 before processing the substrate with another liquid.

[0009] Traditionally, disc-shaped cleaning clamps are used. With the relative height between the cup 2 and the cleaning clamp fixed, it is difficult to clean the objects to be cleaned evenly distributed at different heights inside the cup 2. Summary of the Invention

[0010] The present invention provides a cleaning clamp that can effectively clean cups, a substrate processing device having the cleaning clamp, and a method for cleaning the substrate processing device.

[0011] This invention also provides a cleaning clamp that can clean cups at different heights, a substrate processing device having the cleaning clamp, and a method for cleaning the substrate processing device.

[0012] This invention also provides a cleaning fixture that can easily utilize space and a substrate processing apparatus having the cleaning fixture.

[0013] The inventive concept is not limited thereto, and other unmentioned aspects of the invention will be readily apparent to those skilled in the art from the following description.

[0014] According to an aspect of the present invention, a substrate processing apparatus includes: a rotatable rotating head; a cup surrounding the rotating head; a cleaning clamp located on the rotating head and discharging cleaning liquid toward the cup by rotation of the rotating head; and a nozzle unit located at the upper portion of the cleaning clamp and supplying cleaning liquid to the center of the upper surface of the cleaning clamp, wherein the cleaning clamp includes a splash guide groove formed in a recessed manner such that the cleaning liquid supplied from the nozzle unit splashes toward the cup by centrifugal force caused by rotation of the rotating head.

[0015] In addition, the splash guide groove can be formed to bend from the center of the cleaning fixture along the circumferential direction of the cleaning fixture.

[0016] In addition, the curved portion of the splash guide groove can be bent in the cleaning fixture in a direction corresponding to the flow direction of the cleaning fluid.

[0017] In addition, the curved portion of the splash guide groove can be bent in the cleaning fixture in the opposite direction to the flow direction of the cleaning fluid.

[0018] In addition, splash guide grooves can be formed on concentric circles, which are spaced at equal intervals and at a specific distance from the center of the cleaning fixture.

[0019] Furthermore, each splash guide groove in the splash guide groove can be configured such that the inclination of the first bottom surface of each splash guide groove facing the outside of the cleaning fixture relative to the bottom point of the bottom surface of each splash guide groove is gentler than the inclination of the second bottom surface of each splash guide groove facing the inside of the cleaning fixture, and the height of the bottom point is the lowest.

[0020] Furthermore, each splash guide channel in the splash guide channel can be configured such that: the first bottom surface of each splash guide channel in the direction in which the cleaning liquid splashes has a gentler slope relative to the bottom point of the bottom surface of each splash guide channel than the second bottom surface in the opposite direction, and the height of the bottom point is the lowest.

[0021] In addition, the inclination of the first bottom surface of the splash guide groove can be different.

[0022] In addition, the substrate processing equipment may also include: a supply unit that supplies cleaning fluid to a nozzle unit, and a controller that controls the supply unit to increase and decrease the amount of cleaning fluid supplied to the cleaning fixture in a specific cycle.

[0023] In addition, the controller can control the rotating head, causing the rotation speed of the rotating head to repeatedly increase and decrease, while supplying cleaning fluid to the cleaning fixture.

[0024] In addition, the substrate processing apparatus may also include a rear nozzle that sprays cleaning fluid onto the bottom surface of a cleaning fixture, and the cleaning fixture may also include a splash guide boss that protrudes downward from the bottom surface of its edge.

[0025] According to another aspect of the invention, the cleaning fixture includes a fixture body in the shape of a circular plate with a specific thickness, the fixture body including a central region and an edge region surrounding the central region, the cleaning fluid being supplied from a nozzle unit to the central region, and a splash guide groove being formed as a recess in the edge region, such that the cleaning fluid splashes due to centrifugal force caused by the rotation of the rotating head.

[0026] In addition, the splash guide groove may include a first set of splash guide grooves arranged along a first concentric circle of the fixture body, and a second set of splash guide grooves arranged along a second concentric circle larger than the first concentric circle.

[0027] In addition, the length of the first set of splash guide grooves can be different from the length of the second set of splash guide grooves.

[0028] In addition, the splash guide groove can be formed to bend from the center of the cleaning fixture along the circumferential direction of the cleaning fixture.

[0029] In addition, splash guide grooves can be formed on concentric circles, which are located at a specific distance from the center of the fixture body.

[0030] Furthermore, each of the splash guide slots can be configured such that the inclination of its first bottom surface facing the outside of the cleaning fixture relative to the bottom point of its bottom surface is gentler than the inclination of its second bottom surface facing the inside of the cleaning fixture, the bottom point being the lowest.

[0031] Furthermore, each of the splash guide channels can be configured such that its first bottom surface in the direction in which the cleaning fluid splashes has a gentler slope relative to its bottom point than the second bottom surface in the opposite direction, and that the bottom point is the lowest.

[0032] In addition, the cleaning fixture may include a splash guide boss that protrudes downward from the bottom surface of its edge.

[0033] According to another aspect of the present invention, a method for cleaning a cup using a substrate processing apparatus includes: placing a cleaning fixture on a rotating head; rotating the rotating head; and supplying cleaning fluid to the upper surface of the cleaning fixture, the cleaning fixture rotating such that the cleaning fluid splashes along a splash guide groove formed on the upper surface of the cleaning fixture, the amount of cleaning fluid supplied to the cleaning fixture increasing and decreasing in a specific cycle, and the rotational speed of the rotating head repeatedly increasing and decreasing while the cleaning fluid is supplied to the cleaning fixture.

[0034] In addition, the rotational speed of the rotating head is repeatedly increased and decreased while cleaning fluid is supplied to the cleaning fixture. Attached Figure Description

[0035] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals in the various drawings refer to the same parts, and wherein:

[0036] Figure 1 This is a cross-sectional view showing a typical liquid handling unit;

[0037] Figure 2 This is a plan view of a substrate processing system according to an embodiment of the present invention;

[0038] Figure 3 It is along Figure 2 The line AA is intercepted Figure 2 A cross-sectional view of the system;

[0039] Figure 4 It is along Figure 1 The line BB cut Figure 2 A cross-sectional view of the system;

[0040] Figure 5 It is along Figure 2 The line CC cut Figure 2 A cross-sectional view of the system;

[0041] Figure 6 It is shown Figure 2 A cross-sectional view of the substrate processing equipment;

[0042] Figure 7 It is used for cleaning Figure 6A perspective view of the cleaning fixture of the substrate processing equipment shown;

[0043] Figure 8 yes Figure 7 A plan view of the cleaning fixture shown;

[0044] Figure 9 It is along Figure 8 A cross-sectional view taken by line AA;

[0045] Figure 10 This is a view showing the process of cleaning a container using a cleaning fixture;

[0046] Figure 11 This is a perspective view showing a first variation of the cleaning fixture;

[0047] Figure 12 It is along Figure 11 A cross-sectional view taken by line BB;

[0048] Figure 13 This is a perspective view showing a second variation of the cleaning fixture;

[0049] Figure 14 This is a bottom perspective view showing a third variation of the cleaning clamp;

[0050] Figure 15 yes Figure 14 A cross-sectional view of the cleaning fixture shown; and

[0051] Figure 16 It shows the use Figure 14 The image shows a view of the cleaning fixture cleaning the container. Detailed Implementation

[0052] In the following description, exemplary embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. Embodiments of the invention may be modified in various forms, and the scope of the inventive concept should not be construed as limited to the following embodiments. Embodiments of the inventive concept are provided to describe the invention more fully to those skilled in the art. Therefore, the shapes of components in the drawings are enlarged or reduced to emphasize their clearer description.

[0053] The system of this embodiment of the invention can be used to perform imaging processing on a substrate such as a semiconductor substrate or a flat panel display panel. Specifically, the system of this embodiment can be connected to an exposure device to perform coating and development processing on the substrate. Hereinafter, examples of using a substrate as the substrate will be described.

[0054] In the following text, reference will be made to Figures 2 to 16 Describes the substrate processing system of the present invention.

[0055] Figure 2 This is a view of the substrate processing system as seen from top. Figure 3 It is along Figure 2 The line AA is intercepted Figure 2 A cross-sectional view of the system. Figure 4 It is along Figure 1 The line BB cut Figure 2 A cross-sectional view of the system. Figure 5 It is along Figure 1 The line CC cut Figure 2 A cross-sectional view of the system.

[0056] refer to Figures 2 to 5 The substrate processing system 1 includes a loading port 100, an indexing module 200, a first buffer module 300, a coating / developing module 400, a second buffer module 500, a pre-exposure / post-exposure processing module 600, and an interface module 700. The loading port 100, indexing module 200, first buffer module 300, coating / developing module 400, second buffer module 500, pre-exposure / post-exposure processing module 600, and interface module 700 are arranged sequentially in one direction.

[0057] In the following text, the direction in which the loading port 100, index module 200, first buffer module 300, coating / developing module 400, second buffer module 500, pre-exposure / post-exposure processing module 600 and interface module 700 are arranged is referred to as the first direction 12, and the direction perpendicular to the first direction 12 when viewed from the top is referred to as the second direction 14, and the direction perpendicular to the first direction 12 and the second direction 14 is referred to as the third direction 16.

[0058] The substrate "W" is moved while being received in the housing 20. The housing 20 then has a structure that is sealed from the outside. For example, a front-opening wafer transfer box (FOUP) can be used as the housing 20, which has a door on the front side.

[0059] The following sections will describe in detail the loading port 100, the index module 200, the first buffer module 300, the coating / developing module 400, the second buffer module 500, the pre-exposure / post-exposure processing module 600, and the interface module 700.

[0060] The loading port 100 has a carrier 120 on which a box 20 is positioned, the box containing a substrate "W". Multiple carriers 120 are provided and arranged in a row in a second direction 14. Figure 2 In the middle, four carriers 120 are provided.

[0061] The indexing module 200 feeds the substrate "W" between the box 20, which is placed on the carrier 120 of the loading port 100, and the first buffer module 300. The indexing module 200 has a frame 210, an indexing robot 220, and a guide rail 230. The frame 210 has a substantially rectangular parallelepiped shape with an empty interior, and the frame is disposed between the loading port 100 and the first buffer module 300. The height of the frame 210 of the indexing module 200 may be lower than the height of the frame 310 of the first buffer module 300, as will be described below. The indexing robot 220 and the guide rail 230 are disposed in the frame 210. The indexing robot 220 has a 4-axis drive structure, allowing the hand 221, which directly handles the substrate "W," to move and rotate in a first direction 12, a second direction 14, and a third direction 16. The indexing robot 220 has a hand 221, an arm 222, a support 223, and a support column 224. The hand 221 is fixedly mounted on the arm 222. Arm 222 has a flexible and rotatable structure. Support 223 is configured such that its length is oriented along a third direction 16. Arm 222 is coupled to support 223 so that it can move along support 223. Support 223 is fixedly coupled to support 224. Guide rail 230 is configured such that its length is oriented along a second direction 14. Support 224 is coupled to guide rail 230 so that it can move linearly along guide rail 230. Although not shown, frame 210 is also provided with a door opener that opens and closes the door of box 20.

[0062] The first buffer module 300 includes a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 has a rectangular parallelepiped shape with an empty interior and is positioned between the index module 200 and the coating / developing module 400. The first buffer 320, second buffer 330, cooling chamber 350, and first buffer robot 360 are located within the frame 310. The cooling chamber 350, second buffer 330, and first buffer 320 are arranged sequentially from the bottom along a third direction 16. The first buffer 320 is located at the height of the coating module 401, corresponding to the coating / developing module 400 described below, and the second buffer 330 and cooling chamber 350 are located at the height of the developing module 402, corresponding to the coating / developing module 400 described below. The first buffer robot 360 is spaced a predetermined distance from the second buffer 330, cooling chamber 350, and first buffer 320 in a second direction 14.

[0063] First buffer 320 and second buffer 330 temporarily hold multiple substrates "W". Second buffer 330 has a housing 331 and multiple supports 332. Supports 332 are disposed within housing 331 and spaced apart from each other along a third direction 16. A substrate "W" is positioned on each of the supports 332. Housing 331 has openings (not shown) on one side where an indexing robot 220 is disposed, on one side where a first buffer robot 360 is disposed, and on one side where a developing robot 482 is disposed, such that the indexing robot 220, the first buffer robot 360, and the developing robot 482 of the developing module 402 described below place the substrate "W" into or remove the substrate from the supports 332 in housing 331. The structure of first buffer 320 is substantially similar to that of second buffer 330. Meanwhile, housing 321 of first buffer 320 has openings on one side where the first buffer robot 360 is disposed and on one side where the coating robot 432 located in coating module 401 described below is disposed. The number of supports 322 provided for the first buffer 320 and the number of supports 332 provided for the second buffer 330 may be the same or different. According to an embodiment, the number of supports 332 provided for the second buffer 330 may be greater than the number of supports 322 provided for the first buffer 320.

[0064] A first buffer manipulator 360 feeds a substrate “W” between a first buffer 320 and a second buffer 330. The first buffer manipulator 360 has a hand 361, an arm 362, and a support 363. The hand 361 is fixedly mounted on the arm 362. The arm 362 has a flexible structure, allowing the hand 361 to move along a second direction 14. The arm 362 is coupled to the support 363 to move linearly along the support 363 in a third direction 16. The support 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support 363 can be configured to extend further upwards or downwards. The first buffer manipulator 360 can be configured such that the hand 361 simply performs two-axis drive along only the second direction 14 and the third direction 16.

[0065] Cooling chamber 350 cools substrate "W". Cooling chamber 350 has a housing 351 and a cooling plate 352. Cooling plate 352 has a cooling unit 353 that cools the upper surface of substrate "W" on which it is placed and substrate "W". Various types, such as cooling types using cooling water and cooling types using thermoelectric elements, can be used as cooling unit 353. A lifting pin assembly (not shown) for positioning substrate "W" on cooling plate 352 can be provided in cooling chamber 350. Housing 351 has openings (not shown) on one side where indexing robot 220 is provided and on the other side where developing robot 482 is provided, such that indexing robot 220 and developing robot 482, which will be provided as developing robot 402 as described below, can place substrate "W" into or remove it from cooling plate 352. A door (not shown) for opening and closing the aforementioned openings can be provided in cooling chamber 350.

[0066] The coating / developing module 400 performs the processes of coating a photoresist onto a substrate "W" before exposure and developing the substrate "W" after exposure. The coating / developing module 400 has a rectangular parallelepiped shape on the substrate. The coating / developing module 400 has a coating module 401 and a developing module 402. The coating module 401 and the developing module 402 can be arranged to be separated from each other in different layers. According to an example, the coating module 401 is located on the developing module 402.

[0067] The coating module 401 performs the process of coating a photosensitive liquid, such as a photoresist, onto a substrate "W," and, for example, heat treatment processes such as heating and cooling the substrate "W" before and after the resist coating process. The coating module 401 has a resist coating chamber 410, a baking chamber 420, and a transfer chamber 430. The resist coating chamber 410, baking chamber 420, and transfer chamber 430 are arranged sequentially along a second direction 14. Thus, the resist coating chamber 410 and baking chamber 420 are spaced apart from each other in the second direction 14, with the transfer chamber 430 inserted between them. Multiple resist coating chambers 410 can be provided, and multiple resist coating chambers 410 can be provided in each of the first direction 12 and the third direction 16. In the figures, six resist coating chambers 410 are shown as an example. Multiple baking chambers 420 can be provided in each of the first direction 12 and the third direction 16. In the figures, six baking chambers 420 are shown as an example. However, unlike this, a greater number of baking chambers 420 can be provided.

[0068] The transfer chamber 430 is positioned parallel to the first buffer 320 of the first buffer module 300 in the first direction 12. A coating robot 432 and a guide rail 433 may be located within the transfer chamber 430. The transfer chamber 430 has a generally rectangular shape. The coating robot 432 feeds the substrate “W” between the baking chamber 420, the resist coating chamber 410, the first buffer 320 of the first buffer module 300, and the first cooling chamber 520 of the second buffer module 500. The guide rail 433 is arranged such that its length direction is parallel to the first direction 12. The guide rail 433 guides the coating robot 432, causing it to move linearly. The coating robot 432 has a hand 434, an arm 435, a support 436, and a pillar 437. The hand 434 is fixedly mounted on the arm 435. The arm 435 has a flexible structure that allows the hand 434 to move horizontally. The support 436 is arranged such that its length direction is oriented along a third direction 16. Arm 435 is coupled to support 436 to move linearly along support 436 in a third direction 16. Support 436 is fixedly coupled to pillar 437, and pillar 437 is coupled to guide rail 433 to be movable along guide rail 433.

[0069] The photoresist coating chamber 410 has the same structure. However, the type of photoresist used in the photoresist coating chamber 410 can be different. For example, the photoresist can be a chemically amplified photoresist. The photoresist coating chamber 410 is configured for a substrate processing apparatus that coats a photoresist onto a substrate "W". The substrate processing apparatus 800 performs a liquid coating process, and will refer to the following... Figures 6 to 7 Describe its details.

[0070] Return to reference Figures 2 to 5 The baking chamber 420 performs heat treatment on the substrate "W". For example, the baking chamber 420 performs a pre-baking process to remove organic matter and moisture from the surface of the substrate "W" by heating the substrate "W" at a predetermined temperature before applying photoresist, or performs a soft baking process after applying photoresist to the substrate "W", and performs a cooling process to cool the substrate "W" after the heating process. The baking chamber 420 has a cooling plate 421 and a heating plate 422. The cooling plate 421 is provided with a cooling unit 423, such as cooling water or a thermoelectric element. The heating plate 422 is provided with a heating unit 424, such as a heating wire or a thermoelectric element. The cooling plate 421 and the heating plate 422 can be arranged in one baking chamber 420. Optionally, some baking chambers in the baking chamber 420 may include only the cooling plate 421, and some baking chambers in the baking chamber 420 may include only the heating plate 422.

[0071] The developing module 402 includes a process of removing photoresist by providing a developing liquid to obtain a pattern on a substrate "W", and heat treatment processes such as heating and cooling performed on the substrate "W" before and after the developing process. The developing module 402 has a developing chamber 460, a baking chamber 470, and a transfer chamber 480. The developing chamber 460, baking chamber 470, and transfer chamber 480 are arranged sequentially along a second direction 14. Thus, the developing chamber 460 and baking chamber 470 are spaced apart from each other in the second direction 14, with the transfer chamber 480 inserted between them. Multiple developing chambers 460 can be provided, and multiple developing chambers 460 can be provided in each of the first direction 12 and the third direction 16. Six developing chambers 460 are shown as an example in the figures. Multiple baking chambers 470 can be provided in each of the first direction 12 and the third direction 16. Six baking chambers 470 are shown as an example in the figures. However, instead of this, a greater number of baking chambers 470 can be provided.

[0072] The transfer chamber 480 is positioned parallel to the second buffer 330 of the first buffer module 300 in the first direction 12. The developing robot 482 and guide rail 483 may be located within the transfer chamber 480. The transfer chamber 480 has a generally rectangular shape. The developing robot 482 transfers substrate W between the baking chamber 470, the developing chamber 460, the second buffer 330 and cooling chamber 350 of the first buffer module 300, and the second cooling chamber 540 of the second buffer module 500. The guide rail 483 is arranged such that its length direction is parallel to the first direction 12. The guide rail 483 guides the developing robot 482, allowing it to move linearly in the first direction 12. The developing robot 482 has a hand 484, an arm 485, a support 486, and a pillar 487. The hand 484 is fixedly mounted on the arm 485. The arm 485 has a flexible structure that allows the hand 484 to move horizontally. The support 486 is arranged such that its length direction is oriented along a third direction 16. Arm 485 is coupled to support 486 for linear movement along support 486 in a third direction 16. Support 486 is fixedly coupled to support 487. Support 487 is coupled to guide rail 483 for linear movement along guide rail 483.

[0073] The developing chamber 460 has the same structure. However, the type of developing liquid used in the developing chamber 460 can be different. The developing chamber 460 removes the photoresist areas on the substrate "W" that are exposed to light. Then, the areas of the protective film that are exposed to light are also removed. Alternatively, depending on the type of photoresist used, only the areas of the photoresist and protective film that are not exposed to light can be removed.

[0074] The developing chamber 460 has a container 461, a support plate 462, and a nozzle 463. The container 461 has a cup shape with an open top. The support plate 462 is located in the container 461 and supports the substrate W. The support plate 462 may be rotatable. The nozzle 463 supplies developing liquid to the substrate W located on the support plate 462. The nozzle 463 may have a cylindrical shape and can supply developing liquid to the center of the substrate W. Optionally, the nozzle 463 may have a length corresponding to the diameter of the substrate W, and the discharge orifice of the nozzle 463 may be a slit. The developing chamber 460 may also be provided with a nozzle 464 that supplies a cleaning solution, such as deionized water, to clean the surface of the substrate W on which developing liquid is additionally supplied.

[0075] Baking chamber 470 heats the substrate "W". For example, baking chamber 470 may perform a post-baking process of heating the substrate "W" before the developing process, a hard baking process of heating the substrate "W" after the developing process, and a cooling process of cooling the heated wafer after the baking process. Baking chamber 470 has a cooling plate 471 and a heating plate 472. Cooling plate 471 is provided with a cooling unit 473, such as cooling water or a thermoelectric element. Heating plate 472 is provided with a heating unit 474, such as a heating wire or a thermoelectric element. Cooling plate 471 and heating plate 472 may be arranged in one baking chamber 470. Optionally, some baking chambers in baking chamber 470 may include only cooling plate 471, and some baking chambers in baking chamber 470 may include only heating plate 472.

[0076] As described above, the coating / developing module 400 is provided such that the coating module 401 and the developing module 402 are separate. When viewed from above, the coating module 401 and the developing module 402 can have the same chamber arrangement.

[0077] The second buffer module 500 is configured as a channel through which the substrate W is transferred between the coating / developing module 400 and the pre- / post-exposure module 600. Furthermore, the second buffer module 500 performs processes on the substrate "W", such as cooling processes or edge exposure processes. The second buffer module 500 has a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560. The frame 510 has a rectangular parallelepiped shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located within the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are positioned at a height corresponding to the coating module 401. The second cooling chamber 540 is positioned at a height corresponding to the developing module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are arranged in a row along a third direction 16. When viewed from above, the buffer 520 is positioned along the transfer chamber 430 of the coating module 401 in the first direction 12. The edge exposure chamber 550 is spaced a predetermined distance from the buffer 520 or the first cooling chamber 530 in the second direction 14.

[0078] A second buffer robot 560 transports the substrate W between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. The second buffer robot 560 is located between the edge exposure chamber 550 and the buffer 520. The structure of the second buffer robot 560 can be similar to that of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform subsequent processes on the wafer “W”, on which the coating module 401 has already performed processes. The first cooling chamber 530 cools the substrate “W” on which the coating module 401 has already performed processes. The structure of the first cooling chamber 530 is similar to that of the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes the periphery of the wafer “W”, on which the first cooling chamber 530 has already performed a cooling process. The buffer 520 temporarily holds the substrate “W” before transferring it to the preprocessing module 601, which will be described below. Before transferring the wafer "W", on which the post-processing module 602 (described below) has performed its process, to the developing module 402, the second cooling chamber 540 cools the wafer "W". The second buffer module 500 may also have a buffer at a height corresponding to that of the developing module 402. In this case, the wafer "W", on which the post-processing module 602 has performed its process, can be transferred to the developing module 402 after being temporarily stored in the added buffer.

[0079] During the immersion / exposure process performed by the exposure equipment 1000, the pre-exposure / post-exposure module 600 can perform a process of coating a protective film to protect the photoresist film coated on the substrate "W" during the immersion / exposure process. The pre-exposure / post-exposure module 600 can also perform a process of cleaning the substrate "W" after the exposure process. Furthermore, when the coating process is performed using a chemically amplified photoresist, the pre-exposure / post-exposure module 600 can perform a baking process after the exposure process.

[0080] The pre- and post-exposure module 600 includes a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs a process to process the substrate "W" before the exposure process, and the post-processing module 602 performs the same process after the exposure process. The pre-processing module 601 and the post-processing module 602 can be arranged to be separated from each other in different layers. According to an example, the pre-processing module 601 is located on top of the post-processing module 602. The height of the pre-processing module 601 is the same as the height of the coating module 401. The height of the post-processing module 602 is the same as the height of the developing module 402. The pre-processing module 601 includes a protective film coating chamber 610, a baking chamber 620, and a transfer chamber 630. The protective film coating chamber 610, the transfer chamber 630, and the baking chamber 620 are arranged sequentially along a second direction 14. Therefore, the protective film coating chamber 610 and the baking chamber 620 are spaced apart from each other in the second direction 14, while the transfer chamber 630 is inserted between them. A plurality of protective film coating chambers 610 are provided, and the plurality of protective film coating chambers 610 are arranged along a third direction 16 to form different layers. Optionally, a plurality of protective film coating chambers 610 may be provided in each of the first direction 12 and the third direction 16. A plurality of baking chambers 620 are provided, and the plurality of baking chambers 620 are arranged along a third direction 16 to form different layers. Optionally, a plurality of baking chambers 620 may be provided in each of the first direction 12 and the third direction 16.

[0081] The transfer chamber 630 is positioned parallel to the first cooling chamber 530 of the second buffer module 500 in a first direction 12. A pre-processing robot 632 is located within the transfer chamber 630. The transfer chamber 630 has a substantially square or rectangular shape. The pre-processing robot 632 feeds the substrate W between the protective film coating chamber 610, the baking chamber 620, the buffer 520 of the second buffer module 500, and the first buffer 720 of the interface module 700 (described below). The pre-processing robot 632 has a hand 633, an arm 634, and a support 635. The hand 633 is fixedly mounted on the arm 634. The arm 634 has a flexible and rotatable structure. The arm 634 is coupled to the support 635 to move linearly along the support 635 in a third direction 16.

[0082] A protective film coating chamber 610 coats a protective film onto a substrate "W" that protects the photoresist film during immersion / exposure. The protective film coating chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with an open top. The support plate 612 is located within the housing 611 and supports the substrate "W". The support plate 612 may be rotatable. The nozzle 613 supplies a protective liquid for forming the protective film onto the substrate W placed on the support plate 612. The nozzle 613 has a cylindrical shape and can supply the protective liquid to the center of the substrate "W". Optionally, the nozzle 613 may have a length corresponding to the diameter of the substrate "W", and the discharge orifice of the nozzle 613 may be a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid comprises an expandable material. The protective liquid may be a material with low affinity for photoresist and water. For example, the protective liquid may include a fluorinated solvent. The protective film coating chamber 610 supplies protective liquid to the central area of ​​the substrate "W" while rotating the substrate "W" located on the support plate 612.

[0083] Baking chamber 620 heat-treats a substrate "W" coated with a protective film. Baking chamber 620 has a cooling plate 621 and a heating plate 622. Cooling plate 621 is provided with a cooling unit 623, such as cooling water or a thermoelectric element. Heating plate 622 is provided with a heating unit 624, such as a heating wire or a thermoelectric element. Heating plate 622 and cooling plate 621 can be disposed in one baking chamber 620. Optionally, some baking chambers in baking chamber 620 may consist only of heating plate 622, and some baking chambers in baking chamber 620 may consist only of cooling plate 621.

[0084] The post-processing module 602 includes a cleaning chamber 660, a post-exposure baking chamber 670, and a transfer chamber 680. The cleaning chamber 660, transfer chamber 680, and post-exposure baking chamber 670 are arranged sequentially along a second direction 14. Therefore, the cleaning chamber 660 and the post-exposure baking chamber 670 are spaced apart from each other in the second direction 14, with the transfer chamber 680 inserted between them. A plurality of cleaning chambers 660 are provided, and the plurality of cleaning chambers 660 are arranged along a third direction 16 to form different layers. Optionally, a plurality of cleaning chambers 660 may be provided in each of the first direction 12 and the third direction 16. A plurality of post-exposure baking chambers 670 are provided, and the plurality of post-exposure baking chambers 670 are arranged along a third direction 16 to form different layers. Optionally, a plurality of post-exposure baking chambers 670 may be provided in each of the first direction 12 and the third direction 16.

[0085] When viewed from above, the transfer chamber 680 is positioned parallel to the second cooling chamber 540 of the second buffer module 500 in the first direction 12. The transfer chamber 680 has a substantially square or rectangular shape. The post-processing robot 682 is located in the transfer chamber 680. The post-processing robot 682 transfers the substrate W between the cleaning chamber 660, the post-exposure baking chamber 670, the second cooling chamber 540 of the second buffer module 500, and the second buffer 730 of the interface module 700 (described below). The structure of the post-processing robot 682 provided in the post-processing module 602 can be the same as the structure of the pre-processing robot 632 provided in the pre-processing module 601.

[0086] Cleaning chamber 660 cleans substrate "W" after the exposure process. Cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. Housing 661 has a cup shape with an open top. Support plate 662 is located in housing 661 and supports substrate "W". Support plate 662 may be configured to be rotatable. Nozzle 663 supplies cleaning fluid to substrate "W" located on support plate 662. Cleaning fluid may be water, such as deionized water. Cleaning chamber 660 supplies cleaning fluid to the central region of substrate "W" while rotating substrate "W" located on support plate 662. Optionally, nozzle 663 may move linearly or rotate from the central region of substrate "W" to the edge region while substrate "W" rotates.

[0087] After the exposure process, the baking chamber 670 heats the substrate "W" on which the exposure process has been performed using far-infrared radiation. During the baking process, the substrate "W" is heated to complete the change in the properties of the photoresist by amplifying the acid generated by the photoresist during exposure. The baking chamber 670 has a heating plate 672 after the exposure process. The heating plate 672 is provided with a heating unit 674, such as a heating wire or a thermoelectric element. The baking chamber 670 may also have a cooling plate 671 inside it after the exposure process. The cooling plate 671 is provided with a cooling unit 673, such as cooling water or a thermoelectric element. Optionally, a baking chamber with only a cooling plate 671 may also be provided.

[0088] As described above, a pre-exposure / post-exposure module 600 is provided such that the pre-processing module 601 and the post-processing module 602 are completely separated from each other. The transfer chamber 630 of the pre-processing module 601 and the transfer chamber 680 of the post-processing module 602 may have the same dimensions and may completely overlap each other when viewed from above. The protective film coating chamber 610 and the cleaning chamber 660 may have the same dimensions and may completely overlap each other when viewed from above. The baking chamber 620 and the post-exposure baking chamber 670 may have the same dimensions and may completely overlap each other when viewed from above.

[0089] Interface module 700 feeds substrate "W" between pre- / post-exposure module 600 and exposure equipment 1000. Interface module 700 has frame 710, first buffer 720, second buffer 730, and interface robot 740. First buffer 720, second buffer 730, and interface robot 740 are located within frame 710. First buffer 720 and second buffer 730 are spaced apart by a predetermined distance and can be stacked. First buffer 720 is positioned at a higher position than second buffer 730. First buffer 720 is located at a height corresponding to pre-processing module 601, and second buffer 730 is located at a height corresponding to post-processing module 602. When viewed from above, first buffer 720 is arranged along a first direction 12 and aligned with transfer chamber 630 of pre-processing module 601, and second buffer 730 is arranged along the first direction 12 and aligned with transfer chamber 630 of post-processing module 602.

[0090] Interface robot 740 is positioned spaced apart from first buffer 720 and second buffer 730 in a second direction 14. Interface robot 740 transfers substrate "W" between first buffer 720, second buffer 730 and exposure equipment 1000. The structure of interface robot 740 is substantially similar to that of second buffer robot 560.

[0091] The first buffer 720 temporarily holds the substrate "W" before moving it from the preprocessing module 601 to the exposure device 1000. The second buffer 730 temporarily holds the substrate "W" before moving it from the exposure device 1000 to the postprocessing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed within the housing 721 and spaced apart from each other along a third direction 16. A substrate "W" is positioned on each of the supports 722. The housing 721 has openings (not shown) on one side where an interface robot 740 is disposed and on the other side where a preprocessing robot 721 is disposed, allowing the interface robot 740 and the preprocessing robot 732 to place the substrate "W" into or remove it from the support plate 722. The structure of the second buffer 730 is substantially similar to that of the first buffer 720. Meanwhile, the housing 4531 of the second buffer 730 has openings on one side where the interface robot 740 is mounted and on the other side where the post-processing robot 682 is mounted. As described above, the interface module may only have a buffer and a robot, without having a chamber on the wafer where specific processes are performed.

[0092] The resist coating chamber 410 may be provided for a substrate processing apparatus that coats a photoresist onto a substrate “W”, which will be described below.

[0093] Figure 6 It is shown Figure 2 A cross-sectional view of the substrate processing equipment.

[0094] refer to Figure 6 The substrate processing apparatus 800 is an apparatus for coating a photoresist onto a substrate "W". The substrate processing apparatus 800 includes a housing 810, a substrate support unit 830, a processing container 850, a lifting unit 840, a liquid supply unit 890, and a controller 880.

[0095] The housing 810 has a rectangular barrel shape, with a processing space 812 inside. An opening (not shown) is formed on one side of the housing 810. The opening acts as a port through which a substrate "W" is inserted and removed. A door is installed in the opening, and the door opens and closes the opening. If a substrate processing procedure is performed, the door interrupts the opening and closes the processing space 812 of the housing 810. An inner outlet 814 and an outer outlet 816 are formed on the lower surface of the housing 810. Air in the housing 810 is discharged to the outside through the inner outlet 814 and the outer outlet 816. According to an example, air supplied to the processing container 850 can be discharged through the inner outlet 814, and air supplied to the outside of the processing container 850 can be discharged through the outer outlet 816.

[0096] The substrate support unit 830 supports the substrate "W" within the processing space 812 of the housing 810. The substrate support unit 830 rotates the substrate "W". The substrate support unit 830 includes a rotary chuck 832, a rotation shaft 834, and a driver 836. The rotary chuck 832 provides a substrate support member 832 for supporting the substrate. The rotary chuck 832 has a disk shape. The substrate "W" contacts the upper surface of the rotary chuck 832. The diameter of the rotary chuck 832 is smaller than the diameter of the substrate "W". According to an example, the rotary chuck 832 can vacuum-pump the substrate "W" and clamp it. Optionally, the rotary chuck 832 can be configured for an electrostatic chuck, which clamps the substrate "W" using electrostatic force. The rotary chuck 832 can also clamp the substrate "W" using physical force.

[0097] Meanwhile, during the cleaning process of container 850, the cleaning fixture 900 can be positioned on the rotary chuck 832.

[0098] A rotating shaft 834 and a driver 836 provide rotary drive components 834 and 836 for rotating a rotary chuck 832. The rotating shaft 834 supports the rotary chuck 832 below it. The rotating shaft 834 is configured such that its length direction faces upward and downward. The rotating shaft 834 is configured to rotate about its central axis. The driver 836 provides a driving force to rotate the rotating shaft 834. For example, the driver 836 may be a motor that changes the rotational speed of the rotating shaft. The rotary drive components 834 and 836 can rotate the rotary chuck 832 at different rotational speeds depending on the substrate processing steps.

[0099] The processing container 850 has a processing space 812 inside, in which the developing process is performed. The processing container 850 can be configured to surround the substrate support unit 830. The processing container 850 has a cup shape with a top opening. The processing container 850 includes an inner cup 852 and an outer cup 862.

[0100] The inner cup 852 has a circular cup shape around a rotation axis 834. When viewed from above, the inner cup 852 is positioned to overlap with the inner outlet 814. The upper surface of the inner cup 852 is configured such that its outer and inner regions have different angles when viewed from above. According to an example, the outer region of the inner cup 852 slopes downward as it moves away from the substrate support unit 830, and the inner region of the inner cup 852 slopes upward as it moves away from the substrate support unit 830. The point where the outer and inner regions of the inner cup 852 meet is configured to vertically correspond to the side end of the substrate “W”. The outer region of the upper surface of the inner cup 852 is circular. The outer region of the upper surface of the inner cup 852 is concave. The outer region of the upper surface of the inner cup 852 can be configured as the area through which liquid flows.

[0101] The outer cup 862 has a cup shape surrounding the substrate support unit 830 and the inner cup 852. The outer cup 862 has a bottom wall 864, a side wall 866, a top wall, and an inclined wall 870. The bottom wall 864 has a hollow disk shape. A recovery line 865 is formed in the bottom wall 864. The recovery line 865 recovers the processing liquid supplied to the substrate "W". The processing liquid recovered by the recovery line 865 can be reused by an external liquid recycling system. The side wall 866 has a circular barrel shape surrounding the substrate support unit 830. The side wall 866 extends from the side end of the bottom wall 864 in a direction perpendicular to the bottom wall 864. The side wall 866 extends upward from the bottom wall 864.

[0102] An inclined wall 870 extends from the upper end of the side wall 866 toward the interior of the outer cup 862. The inclined wall 870 is configured to become closer as it moves upward. The inclined wall 870 has an annular shape. The upper end of the inclined wall 870 is higher than the substrate "W" supported by the substrate support unit 830.

[0103] The lifting unit 840 lifts the inner cup 852 and the outer cup 862. The lifting unit 840 includes an internal movable member 842 and an external movable member 844. The internal movable member 842 lifts the inner cup 852, and the external movable member 844 lifts the outer cup 862.

[0104] The liquid supply unit 890 can selectively supply various processing fluids to the substrate "W".

[0105] For example, the liquid supply unit 890 may include a nozzle 892 and a nozzle moving member 893, the nozzle supplying processing liquid to the substrate "W". Multiple nozzles 892 may be provided. When multiple nozzles 892 are provided, processing liquid supply lines are connected to each nozzle 892. Of the multiple nozzles 892, except for the nozzle held by the nozzle moving member 893 to discharge processing liquid onto the substrate, the nozzles 892 wait in their original ports (not shown). One of the multiple nozzles 892 can be moved by the nozzle moving member 893 to a processing position and a standby position. Here, the processing position is the position where the nozzle 892 faces the substrate "W" located on the rotary chuck 832. The standby position is the position where the nozzle 892 waits in its original port 900. For example, the processing liquid may be a photosensitive liquid such as a photoresist, or a cleaning liquid used to clean the processing container.

[0106] Simultaneously, controller 880 controls supply unit 896, which supplies cleaning fluid to liquid supply unit 890. Controller 880 can change the supply to cleaning fixture 900 (see [link to product]) during the cleaning process of processing container 850. Figure 10 The amount of cleaning fluid can be adjusted to improve cleaning efficiency. For example, controller 880 can increase or decrease the amount of cleaning fluid supplied during a specific cycle.

[0107] The controller 880 can control the driver 836 to repeatedly accelerate and decelerate the rotation speed of the rotating head 832, while supplying cleaning fluid to the cleaning fixture 900.

[0108] Figure 7 It is used for cleaning Figure 6 A perspective view of the cleaning fixture of the substrate processing equipment shown. Figure 8 yes Figure 7 The diagram shows a plan view of the cleaning fixture. Figure 9 It is along Figure 8 The cross-sectional view taken by line AA.

[0109] refer to Figures 7 to 9 The cleaning fixture 900 can be in the shape of a circular plate with a specific thickness. The diameter of the cleaning fixture 900 can be substantially the same as the diameter of the substrate.

[0110] The clamp body 910 of the cleaning clamp 900 can be divided into a central region 902 and an edge region 904. The central region 902 can be the area where cleaning fluid discharged from the nozzle 892 is supplied, and the edge region 904 can be the area where cleaning fluid splashes.

[0111] The splash guide groove 920 is formed as a recess in the edge region 904 so that the cleaning fluid splashes due to the centrifugal force caused by the rotation of the rotating head 832.

[0112] The splash guide groove 920 may include a first set of first splash guide grooves 920-1 and a second set of second splash guide grooves 920-2. The second set of splash guide grooves 920-2 may be arranged at equal intervals along a first concentric circle of the fixture body, and the first set of splash guide grooves 920-1 may be arranged at equal intervals along a second concentric circle larger than the first concentric circle. However, the arrangement of the splash guide grooves 920-1 and 920-2 is not limited thereto. For example, it is evident that the splash guide grooves may be arranged on one, two, or more concentric circles.

[0113] Meanwhile, the lengths of the first set of splash guide grooves 920-1 and the second set of splash guide grooves 920-2 can be different.

[0114] The splash guide groove 920 can be formed to be curved from the center of the cleaning fixture 900 along the circumferential direction (the direction of the flow of the cleaning fluid).

[0115] The first set of splash guide grooves 920-1 and the second set of splash guide grooves 920-2 may have different lengths, but may have the same construction. Preferably, each splash guide groove in the first set of splash guide grooves 920-1 (or the second set of splash guide grooves 920-2) is configured such that the inclination of the first bottom surface 922 facing the exterior of the cleaning fixture 900 relative to the bottom point "P" of the bottom surface of each splash guide groove is gentler than the inclination of the second bottom surface 924 facing the interior of the cleaning fixture 900, and the height of the bottom point is the lowest.

[0116] In other words, the lowest point “P” of the first bottom surface 922 of the first set of splash guide grooves 920-1 relative to the bottom surface of the splash guide groove in the direction of cleaning liquid splashing is more gently inclined than the second bottom surface 924 of the splash guide groove in the opposite direction, and the height of this bottom point is the lowest.

[0117] The cleaning fluid supplied to the center of the cleaning fixture 900 with the above structure flows from the center to the outside, while simultaneously drawing a long arc using centrifugal force. Figure 8(The arrow direction is shown). Furthermore, the cleaning fluid passing through splash guide channels 920-1 and 920-2 splashes upwards along the inclination of the first bottom surface 922. The cleaning areas of the cleaning fluid L2 splashed in the first set of splash guide channels 920-1 and the cleaning areas of the cleaning fluid L3 splashed in the second set of splash guide channels 920-2 may be different.

[0118] In other words, the cleaning fixture 900 can adjust the angle of the cleaning fluid splashing according to the inclination of the first bottom surface 922. For example, when the first bottom surface 922 of the first set of splash guide grooves 920-1 is machined to different inclinations, the cleaning area of ​​the treatment container can be widened, and cleaning can be effectively performed while the cleaning fluid splashes at various angles (that is, over a wider range).

[0119] As mentioned above, the inclination of the bottom surface of the splash guide channel can be determined according to the cleaning range.

[0120] Although not shown, the transverse cross-section of the splash guide groove 920 can have various forms, such as a semi-circular cross-section shape, a true circular cross-section shape in which the upper part is partially open, a U-shaped cross-section shape in which the upper part is open, a quadrilateral cross-section shape in which the upper part is open, a V-shaped cross-section shape in which the upper part is open, and an inclined quadrilateral cross-section shape.

[0121] Figure 10 This is a view showing the process of cleaning a treatment container using a cleaning fixture.

[0122] like Figure 10 As shown, a cleaning clamp 900 is positioned on a rotating head 832. The rotating head 832, on which the cleaning clamp 900 is positioned, rotates at a preset speed. A nozzle 892 supplies cleaning fluid to the upper surface of the cleaning clamp 900. The cleaning fluid supplied to the upper surface of the cleaning clamp 900 flows while simultaneously drawing an arc from the center of the cleaning clamp 900 toward the edge using centrifugal force, and a portion of the cleaning fluid splashes upward along the splash guide grooves 920-1 and 920-2 formed on the upper surface of the cleaning clamp 900, while the remainder of the cleaning fluid splashes in a substantially horizontal direction along the flat upper surface of the cleaning clamp 900.

[0123] Figures 8 to 10 The reference numeral L1 in the figure indicates the splash direction of the cleaning fluid splashing from the flat upper surface of the cleaning fixture 900, the reference numeral L2 indicates the splash direction of the cleaning fluid splashing in the first set of splash guide grooves 920-1, and the reference numeral L3 indicates the splash direction of the cleaning fluid splashing in the second set of splash guide grooves 920-2.

[0124] Therefore, in the cleaning clamp 900, the cleaning fluid splashes over a wide area, making it possible to effectively clean the cup.

[0125] Preferably, during the cleaning process of the treatment container using the cleaning fixture 900, the cleaning fluid is supplied at a variable flow rate rather than a fixed flow rate. For example, when the cleaning fluid is over-supplied to the cleaning fixture 900, the amount of cleaning fluid splashed from the cleaning fixture 900 becomes greater than the amount of cleaning fluid remaining on the upper surface of the cleaning fixture, and the cleaning fluid fills the splash guide channels 920-1 and 920-2. Subsequently, when the amount of cleaning fluid supplied decreases (or the supply of cleaning fluid is temporarily stopped), the cleaning fluid completely filled in the splash guide channels 920-1 and 920-2 can be splashed into the treatment container 850 by centrifugal force. In this way, the cleaning fluid supplied to the cleaning fixture 900 can be supplied to the cleaning fixture in this mode, wherein the amount of cleaning fluid supplied increases and decreases (or over-supplied and under-supplied / stopped supply) in a specific cycle.

[0126] During the cleaning process of the cleaning fixture 900 and the cleaning container 850, the rotation speed of the rotating head 832 can be changed while the cleaning fluid is being supplied. For example, the rotation speed may be reduced when there is an oversupply of cleaning fluid, and increased when there is an undersupply of cleaning fluid.

[0127] Figure 11 This is a perspective view showing the first variation of the cleaning fixture. Figure 12 It is along Figure 11 The cross-sectional view taken by line BB.

[0128] like Figure 11 and Figure 12 As shown, the cleaning fixture 900a may include a fixture body 910a having splash grooves 920a-1 and 920a-2, and these grooves have... Figure 7 The cleaning fixture 900 shown has a basically the same construction and function as the splash groove, therefore, the main description will focus on the differences from the variant and this embodiment.

[0129] The first variation is characterized in that splash guide grooves 920a-1 and 920a-2 are formed along concentric circles that are equally spaced and located at a specific distance from the center of the fixture body 910. Each splash guide groove can be configured such that the inclination of the first bottom surface 922a facing the exterior of the cleaning fixture 900a relative to the bottom point "P" of the lowest bottom surface is gentler than the inclination of the second bottom surface 924a facing the interior of the cleaning fixture 900a.

[0130] Figure 13 This is a perspective view showing a second variation of the cleaning fixture.

[0131] like Figure 13As shown, the cleaning fixture 900b may include a fixture body 910b, which has splash grooves 920b-1 and 920b-2, and these grooves have... Figure 7 The cleaning fixture 900 shown has a basically the same construction and function as the splash groove, therefore, the main description will focus on the differences from the variant and this embodiment.

[0132] In the second variant, splash guide grooves 920b-1 and 920b-2 are formed to bend circumferentially from the center of the cleaning fixture 900b, but the bending direction of splash guide grooves 920b-1 and 920b-2 is in the opposite direction to the flow direction (rotation direction, indicated by the arrow) of the cleaning fluid.

[0133] Figure 14 This is a bottom perspective view showing the third variation of the cleaning fixture. Figure 15 yes Figure 14 A cross-sectional view of the cleaning fixture shown. Figure 16 It shows the use Figure 14 The image shows a view of the cleaning fixture cleaning the container.

[0134] like Figures 14 to 16 As shown, the cleaning fixture 900c has a fixing boss and a splash guide boss 932 on its bottom surface 930. The splash guide boss 932 protrudes downward from the edge portion of the bottom surface 930 of the fixture body 910c. The fixing boss 934 protrudes downward from the bottom surface 930 and is positioned around the outside of the rotating head to prevent the flow of cleaning fluid when the cleaning fixture 900c is positioned on the rotating head 832.

[0135] During the cleaning process of the substrate processing equipment, the cleaning fluid sprayed from the rear nozzle 820 located below the rotating head 832 flows to the outside along the bottom surface of the cleaning fixture 900c. In addition, the cleaning fluid cleans the upper surface of the inner cup 852 while colliding with the splash guide boss 932.

[0136] According to embodiments of the present invention, the cleaning efficiency of a cup can be improved by allowing cleaning water to splash through the cleaning clamp to different heights inside the cup.

[0137] According to embodiments of the present invention, cleaning efficiency can be improved by adjusting the amount of cleaning fluid supplied, even if the support plate does not move up and down.

[0138] According to embodiments of the present invention, the cleaning liquid can splash at various angles through the recess, and the space can be well utilized (to hold the cleaning fixture).

[0139] The effects of this invention are not limited to those described above, and any effects not mentioned will be clearly understood by those skilled in the art from the specification and drawings.

[0140] The above detailed description illustrates the inventive concept. Furthermore, the foregoing descriptions depict exemplary embodiments of the inventive concept, and the inventive concept can be applied to various other combinations, modifications, and environments. That is, the inventive concept can be modified and corrected without departing from the scope of the inventive concept disclosed in the specification, the equivalent scope of the written disclosure, and / or the technical or knowledge scope of those skilled in the art. The written embodiments describe the best state for carrying out the technical spirit of the inventive concept, and various changes can be made as needed for the application fields and purposes of the detailed description of the inventive concept. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed embodiments. Furthermore, it should be understood that the appended claims include other embodiments.

Claims

1. A substrate processing apparatus, comprising: A rotatable rotating head; A cup, configured to revolve around the rotating head; A cleaning clamp, located on the rotating head, is configured to discharge cleaning liquid toward the cup by rotation of the rotating head; as well as A nozzle unit, located in the upper portion of the cleaning fixture, is configured to supply the cleaning fluid to the center of the upper surface of the cleaning fixture. The cleaning clamps mentioned above include: A splash guide groove is formed in a recessed manner so that the cleaning fluid supplied from the nozzle unit splashes towards the cup due to the centrifugal force caused by the rotation of the rotating head. Each of the splash guide grooves is configured such that the inclination of the bottom point of the first bottom surface of the splash guide groove facing the outside of the cleaning fixture is gentler than the inclination of the splash guide groove facing the second bottom surface of the cleaning fixture, and the height of the bottom point is the lowest.

2. The substrate processing apparatus according to claim 1, wherein the splash guide groove is formed to bend from the center of the cleaning fixture along the circumferential direction of the cleaning fixture.

3. The substrate processing apparatus according to claim 2, wherein the curved portion of the splash guide groove is curved in a direction corresponding to the flow direction of the cleaning fluid in the cleaning fixture.

4. The substrate processing apparatus according to claim 2, wherein the curved portion of the splash guide groove is curved in a direction opposite to the flow direction of the cleaning fluid in the cleaning fixture.

5. The substrate processing apparatus of claim 1, wherein the splash guide grooves are formed on concentric circles, the concentric circles being spaced at equal intervals and at a specific distance from the center of the cleaning fixture.

6. The substrate processing apparatus according to claim 1, wherein the inclination of the first bottom surface of the splash guide groove is different.

7. The substrate processing apparatus according to claim 1, further comprising: A supply unit configured to supply the cleaning fluid to the nozzle unit; as well as A controller configured to control the supply unit such that the amount of cleaning fluid supplied to the cleaning fixture increases and decreases at specific intervals.

8. The substrate processing apparatus of claim 7, wherein the controller controls the rotating head to repeatedly increase and decrease the rotation speed of the rotating head while supplying the cleaning fluid to the cleaning fixture.

9. The substrate processing apparatus according to claim 1, further comprising: The rear nozzle is configured to spray the cleaning fluid onto the bottom surface of the cleaning fixture. The cleaning clamp also includes: A splash guide boss that protrudes downward from the bottom surface of its edge.

10. A cleaning clamp, comprising: The fixture body is a circular plate with a specific thickness. The fixture body includes: In the central area, cleaning fluid is supplied from the nozzle unit to the central area; and The edge region, which surrounds the central region, The splash guide grooves formed in the edge region are recessed, so that the cleaning fluid splashes due to the centrifugal force caused by the rotation of the rotating head. The splash guide groove is formed on the upper surface of the cleaning fixture. When the cleaning fixture is placed on the rotating head, the splash guide groove is directly exposed to the processing space, and Each of the splash guide grooves is configured such that the inclination of the first bottom surface of the splash guide groove facing the outside of the cleaning fixture relative to the bottom point of the bottom surface of the splash guide groove is gentler than the inclination of the splash guide groove facing the second bottom surface of the cleaning fixture, and the height of the bottom point is the lowest.

11. The cleaning fixture of claim 10, wherein the splash guide groove comprises: A first set of splash guide grooves is arranged along a first concentric circle of the fixture body; and The second set of splash guide grooves is arranged along a second concentric circle that is larger than the first concentric circle.

12. The cleaning fixture according to claim 11, wherein the length of the first set of splash guide grooves is different from the length of the second set of splash guide grooves.

13. The cleaning fixture according to claim 10 or 11, wherein the splash guide groove is formed to bend from the center of the cleaning fixture along the circumferential direction of the cleaning fixture.

14. The cleaning fixture according to claim 10 or 11, wherein the splash guide groove is formed on concentric circles, the concentric circles being spaced apart from the center of the fixture body at specific distances.

15. The cleaning fixture of claim 10, wherein the cleaning fixture further comprises: A splash guide boss that protrudes downward from the bottom surface of its edge.

16. A method for cleaning a cup using a substrate processing apparatus, the method comprising: Place the cleaning clamp on the rotating head; Rotate the rotating head; as well as Cleaning fluid is supplied to the upper surface of the rotating cleaning fixture, causing the cleaning fluid to splash along splash guide grooves formed on the upper surface of the cleaning fixture. The amount of cleaning fluid supplied to the cleaning fixture increases and decreases periodically, and The rotational speed of the rotating head is repeatedly increased and decreased, while the cleaning fluid is supplied to the cleaning fixture. Each of the splash guide grooves is configured such that the inclination of the bottom point of the first bottom surface of the splash guide groove facing the outside of the cleaning fixture is gentler than the inclination of the splash guide groove facing the second bottom surface of the cleaning fixture, and the height of the bottom point is the lowest.

Images