Heat exchanger with a header

Abstract

The outdoor heat exchanger (13) has a liquid-side header (52) and heat transfer tubes (53). The liquid-side header (52) guides the refrigerant. The heat transfer tubes (53) are connected to the liquid-side header (52) to effect heat exchange between the refrigerant and the medium. The liquid-side header (52) has an inner plate (62), an inner plate (63), and an outer plate (61). The inner plate (62) has a surface (622). The inner plate (63) has a surface (631) opposed to the surface (622). The outer plate (61) has a surface (614). The surface (614) intersects the surface (622) and the surface (631) and joins the inner plate (62) and the inner plate (63). The surface (622) and the surface (631) are joined by solder having a first thickness. The surface (614) and the inner plate (62) are joined by solder having a second thickness. The surface (614) and the inner plate (63) are joined by solder having a third thickness. The first thickness is smaller than the second thickness. The first thickness is smaller than the third thickness. The first thickness is 0.2 mm or less.

Description

Technical Field

[0001] A heat exchanger with a header mounted on an air conditioner. Background Art

[0002] In Patent Document 1 (International Publication Gazette WO2015 / 004719), a heat exchanger with a stacked header is disclosed. The stacked header has a plurality of plate-like bodies. The plurality of plate-like bodies are composed of bare materials and coating materials arranged alternately. Solder is not applied to the bare materials. On the other hand, solder is applied to the coating materials. The stacked header is manufactured by heating the plurality of plate-like bodies to melt the solder. Summary of the Invention

[0003] Problems to be Solved by the Invention

[0004] The solder melts, and as a result, the thickness of the coating material decreases. Therefore, the interval between the stacked plurality of plate-like bodies becomes narrow. As a result, the plate-like bodies move from the positions expected by the manufacturer, and thus, it becomes a cause of refrigerant leakage.

[0005] Means for Solving the Problems

[0006] The heat exchanger according to the first aspect has a header and a heat transfer component. The header guides the refrigerant. The heat transfer component is connected to the header and exchanges heat between the refrigerant and the medium. The header has a first component, a second component, and a third component. The first component has a first surface. The second component has a second surface facing the first surface. The third component has a third surface. The third surface intersects the first surface and the second surface and joins the first component and the second component. The first surface and the second surface are joined by solder having a first thickness. The third surface and the first component are joined by solder having a second thickness. The third surface and the second component are joined by solder having a third thickness. The first thickness is smaller than the second thickness. The first thickness is smaller than the third thickness. The first thickness is 0.2 mm or less.

[0007] According to this structure, the thickness of the solder between the first surface and the second surface is 0.2 mm or less. Therefore, the first surface and the second surface can be joined without pre-arranging solder between the first surface and the second surface. Thus, the first component and the second component are not likely to move relative to each other, and refrigerant leakage is not likely to occur in the header.

[0008] The heat exchanger according to the second aspect has a header and a heat transfer component. The header guides the refrigerant. The heat transfer component is connected to the header and exchanges heat between the refrigerant and the medium. The header has a first component, a second component, and a third component. The first component has a first surface to which solder is not applied. The second component has a second surface. The second surface faces the first surface and solder is not applied thereto. The third component has a third surface. The third surface intersects both the first surface and the second surface and is coated with solder. The solder coated on the third surface penetrates between the first surface and the second surface, thereby joining the first surface and the second surface.

[0009] According to this structure, the solder provided on the third surface penetrates between the first surface and the second surface. Therefore, the first surface and the second surface can be joined without pre-arranging solder between the first surface and the second surface. As a result, the first component and the second component are not likely to move relative to each other, and refrigerant leakage is not likely to occur in the header.

[0010] In the heat exchanger of the third aspect, in the heat exchanger of the second aspect, the thickness of the solder joining the first surface and the second surface is 0.2 mm or less.

[0011] According to this structure, the thickness of the solder between the first surface and the second surface is 0.2 mm or less. Therefore, the first component and the second component are not likely to move relative to each other.

[0012] In the heat exchanger of the fourth aspect, in the heat exchanger of the second or third aspect, the first component has a fourth surface. The fourth surface is located on the back side of the first surface and is not coated with solder. The second component has a fifth surface. The fifth surface is located on the back side of the second surface and is not coated with solder.

[0013] According to this structure, no solder is provided between the first component and the second component. Therefore, the solder coating process is not required, and thus the cost of the heat exchanger is reduced.

[0014] In the heat exchanger of the fifth aspect, in the heat exchanger of any one of the second to fourth aspects, the header has a plurality of header component parts including the first component, the second component, and the third component. More than half of the plurality of header component parts are not coated with solder.

[0015] According to this structure, more than half of the header component parts do not have solder provided thereon. Therefore, in the furnace welding process, the header component parts are not likely to move.

[0016] In the heat exchanger of the sixth aspect, in the heat exchanger of the fifth aspect, the plurality of header component parts have at least two parts coated with solder. The at least two parts coated with solder are located on both sides in a direction intersecting the first surface and the second surface with respect to the first component and the second component.

[0017] According to this structure, the parts without solder provided thereon are sandwiched by the plurality of parts with solder provided thereon.

[0018] In the heat exchanger of the seventh aspect, in the heat exchanger of any one of the second to sixth aspects, a soldering agent is coated on the first surface and the second surface.

[0019] According to this structure, a soldering agent is coated on the surface where no solder is provided. Thus, the oxide film formed on the surface where no solder is provided is removed, and therefore, it is easy to guide solder from other components.

[0020] In the heat exchanger according to the eighth aspect, among the heat exchangers according to any one of the first to seventh aspects, the third component has a C-shaped cross section and surrounds the first component and the second component.

[0021] According to this structure, the first component and the second component are surrounded by the third component having a C-shaped cross section. Therefore, refrigerant leakage is not likely to occur in the header.

[0022] In the method for manufacturing a header according to the ninth aspect, a first component having a first surface on which solder is not applied, a second component having a second surface on which solder is not applied, and a third component having a third surface on which solder is applied are prepared. The first surface and the second surface are opposed to each other. The third surface is brought into contact with both the first component and the second component. The first component, the second component, and the third component are heated in a furnace, whereby the solder applied to the third surface intrudes between the first surface and the second surface.

[0023] According to this method, solder can be guided between the first surface and the second surface where solder is not provided. Therefore, it is not necessary to provide excess solder on the first surface and the second surface, and thus the components constituting the header are not likely to move, and refrigerant leakage is not likely to occur in the header. Description of the Drawings

[0024] Figure 1 is a circuit diagram of the air conditioner 100.

[0025] Figure 2 is a schematic diagram showing the structure of the outdoor heat exchanger 13.

[0026] Figure 3 is an external view of the liquid-side header 52.

[0027] Figure 4 is an exploded perspective view of the liquid-side header 52.

[0028] Figure 5 is an exploded cross-sectional view of the liquid-side header 52.

[0029] Figure 6 is a cross-sectional view of the liquid-side header 52 after welding.

[0030] Figure 7 is an exploded cross-sectional view of the gas-side header 51. Detailed Description of the Invention

[0031] <First Embodiment>

[0032] (1) Overall Structure

[0033] Figure 1This is the circuit diagram of the air conditioner 100. The air conditioner 100 includes an outdoor unit 10, an indoor unit 20, and a connecting pipe 30. As will be described later, the outdoor unit 10 has an outdoor heat exchanger 13 of the first embodiment.

[0034] (2) Detailed Structure

[0035] (2-1) Outdoor Unit 10

[0036] The outdoor unit 10 functions as a heat source. The outdoor unit 10 includes a compressor 11, a four-way switching valve 12, an outdoor heat exchanger 13, an outdoor fan 14, an expansion valve 15, a liquid shut-off valve 17, a gas shut-off valve 18, and an outdoor control unit 19. Furthermore, the outdoor unit has a plurality of internal pipes.

[0037] (2-1-1) Compressor 11

[0038] The compressor 11 compresses the inhaled low-pressure gaseous refrigerant to generate a high-pressure gaseous refrigerant. The compressor 11 has a compressor motor 11a. The compressor motor 11a generates the power required for compression.

[0039] (2-1-2) Four-way Switching Valve 12

[0040] The four-way switching valve 12 switches the connection of the internal pipes. When the air conditioner 100 is in the cooling operation, the four-way switching valve 12 realizes the connection shown by the solid line in Figure 1 . When the air conditioner 100 is in the heating operation, the four-way switching valve 12 realizes the connection shown by the dotted line in Figure 1 .

[0041] (2-1-3) Outdoor Heat Exchanger 13

[0042] The outdoor heat exchanger 13 exchanges heat between the refrigerant and the medium. Typically, the medium is air, but it can also be water or brine. In the cooling operation, the outdoor heat exchanger 13 functions as a radiator (or condenser). In the heating operation, the outdoor heat exchanger 13 functions as a heat absorber (or evaporator).

[0043] (2-1-4) Outdoor Fan 14

[0044] The outdoor fan 14 promotes the heat exchange of the outdoor heat exchanger 13. The outdoor fan 14 has an outdoor fan motor 14a. The outdoor fan motor 14a generates the power required to move the medium such as air.

[0045] (2-1-5) Expansion Valve 15

[0046] The expansion valve 15 is a valve capable of adjusting the opening degree. The expansion valve 15 reduces the pressure of the refrigerant. Further, the expansion valve 15 controls the flow rate of the refrigerant.

[0047] (2-1-6) Liquid shut-off valve 17

[0048] The liquid shut-off valve 17 can cut off the refrigerant flow path. The liquid shut-off valve 17 is closed by the installer during the installation of the air conditioner 100, for example.

[0049] (2-1-7) Gas shut-off valve 18

[0050] The gas shut-off valve 18 can cut off the refrigerant flow path. The gas shut-off valve 18 is closed by the installer during the installation of the air conditioner 100, for example.

[0051] (2-1-8) Internal piping

[0052] The internal piping includes a discharge pipe 16a, a gas side pipe 16b, a liquid side pipe 16c, a liquid side pipe 16d, a gas side pipe 16e, and a suction pipe 16f.

[0053] The discharge pipe 16a connects the discharge port of the compressor 11 and the four-way switching valve 12. The gas side pipe 16b connects the four-way switching valve 12 and the outdoor heat exchanger 13. The liquid side pipe 16c connects the outdoor heat exchanger 13 and the expansion valve 15. The liquid side pipe 16d connects the expansion valve 15 and the liquid shut-off valve 17. The gas side pipe 16e connects the gas shut-off valve 18 and the four-way switching valve 12. The suction pipe 16f connects the four-way switching valve 12 and the suction port of the compressor 11.

[0054] (2-1-9) Outdoor control unit 19

[0055] The outdoor control unit 19 has a microcomputer and a memory. The outdoor control unit 19 controls the compressor motor 11a, the four-way switching valve 12, the outdoor fan motor 14a, the expansion valve 15, etc. The memory stores software for controlling these components.

[0056] (2-2) Indoor unit 20

[0057] The indoor unit 20 conditions the air in the room where the user is located. The indoor unit 20 has an indoor heat exchanger 22, an indoor fan 23, and an indoor control unit 29. Further, the indoor unit 20 has a plurality of internal pipings.

[0058] (2-2-1) Indoor heat exchanger 22

[0059] The indoor heat exchanger 22 exchanges heat between the refrigerant and the air. In the case of cooling operation, the indoor heat exchanger 22 functions as a heat absorber (or evaporator). In the case of heating operation, the indoor heat exchanger 22 functions as a radiator (or condenser).

[0060] (2-2-2) Indoor fan 23

[0061] The indoor fan 23 promotes the heat exchange of the indoor heat exchanger 22. The indoor fan 23 has an indoor fan motor 23a. The indoor fan motor 23a generates the power required to move the air.

[0062] (2-2-3) Internal piping

[0063] The internal piping includes a liquid side pipe 26a and a gas side pipe 26b. The liquid side pipe 26a connects the liquid connection pipe 31, which will be described later, and the indoor heat exchanger 22. The gas side pipe 26b connects the indoor heat exchanger 22 and the gas connection pipe 32, which will be described later.

[0064] (2-2-4) Indoor control unit 29

[0065] The indoor control unit 29 has a microcomputer and a memory. The indoor control unit 29 controls the indoor fan motor 23a and the like. The memory stores the software for controlling these components.

[0066] The indoor control unit 29 exchanges data and commands with the outdoor control unit 19 via the communication line L.

[0067] (2-3) Connection pipe 30

[0068] The connection pipe 30 guides the refrigerant moving between the outdoor unit 10 and the indoor unit 20. The connection pipe 30 has a liquid connection pipe 31 and a gas connection pipe 32.

[0069] (2-3-1) Liquid connection pipe 31

[0070] The liquid connection pipe 31 mainly guides the liquid refrigerant or the gas-liquid two-phase refrigerant. The liquid connection pipe 31 connects the liquid stop valve 17 and the liquid side pipe 26a.

[0071] (2-3-2) Gas connection pipe 32

[0072] The gas connection pipe 32 mainly guides the gas refrigerant. The gas connection pipe 32 connects the gas stop valve 18 and the gas side pipe 26b.

[0073] (3) Overall operation

[0074] In the following description, it is assumed that the refrigerant undergoes changes associated with phase changes such as condensation or evaporation in the outdoor heat exchanger 13 and the indoor heat exchanger 22. However, alternatively, the refrigerant may not undergo a phase change in the outdoor heat exchanger 13 and the indoor heat exchanger 22.

[0075] (3-1) Refrigeration operation

[0076] In the case of refrigeration operation, the refrigerant circulates in the direction of arrow C of Figure 1 . The compressor 11 discharges high-pressure gaseous refrigerant in the direction of arrow D of Figure 1 . Then, the high-pressure gaseous refrigerant reaches the outdoor heat exchanger 13 via the discharge pipe 16a, the four-way switching valve 12, and the gas-side pipe 16b. In the outdoor heat exchanger 13, the high-pressure gaseous refrigerant condenses and changes into high-pressure liquid refrigerant. Then, the high-pressure liquid refrigerant reaches the expansion valve 15 via the liquid-side pipe 16c. In the expansion valve 15, the high-pressure liquid refrigerant is depressurized and changes into low-pressure gas-liquid two-phase refrigerant. Then, the low-pressure gas-liquid two-phase refrigerant reaches the indoor heat exchanger 22 via the liquid-side pipe 16d, the liquid stop valve 17, the liquid connection pipe 31, and the liquid-side pipe 26a. In the indoor heat exchanger 22, the low-pressure gas-liquid two-phase refrigerant evaporates and changes into low-pressure gaseous refrigerant. During this process, the temperature of the air in the user's room decreases. Then, the low-pressure gaseous refrigerant reaches the compressor 11 via the gas-side pipe 26b, the gas connection pipe 32, the gas stop valve 18, the gas-side pipe 16e, the four-way switching valve 12, and the suction pipe 16f. Then, the compressor 11 sucks in the low-pressure gaseous refrigerant.

[0077] (3-2) Heating operation

[0078] In the case of heating operation, the refrigerant circulates in the direction of arrow H of Figure 1 . The compressor 11 discharges high-pressure gaseous refrigerant in the direction of arrow D of Figure 1The high-pressure gaseous refrigerant is discharged in the direction of arrow D. Then, the high-pressure gaseous refrigerant reaches the indoor heat exchanger 22 via the discharge pipe 16a, the four-way switching valve 12, the gas-side pipe 16e, the gas stop valve 18, the gas connection pipe 32, and the gas-side pipe 26b. In the indoor heat exchanger 22, the high-pressure gaseous refrigerant condenses and changes into a high-pressure liquid refrigerant. During this process, the temperature of the air in the user's room rises. Then, the high-pressure liquid refrigerant reaches the expansion valve 15 via the liquid-side pipe 26a, the liquid connection pipe 31, the liquid stop valve 17, and the liquid-side pipe 16d. In the expansion valve 15, the high-pressure liquid refrigerant is decompressed and changes into a low-pressure gas-liquid two-phase refrigerant. Then, the low-pressure gas-liquid two-phase refrigerant reaches the outdoor heat exchanger 13 via the liquid-side pipe 16c. In the outdoor heat exchanger 13, the low-pressure gas-liquid two-phase refrigerant evaporates and changes into a low-pressure gaseous refrigerant. Then, the low-pressure gaseous refrigerant reaches the compressor 11 via the gas-side pipe 16b, the four-way switching valve 12, and the suction pipe 16f. Then, the compressor sucks in the low-pressure gaseous refrigerant.

[0079] (4) Detailed structure of the outdoor heat exchanger 13

[0080] (4-1) Overall structure of the outdoor heat exchanger 13

[0081] Figure 2 The structure of the outdoor heat exchanger 13 is shown. The outdoor heat exchanger 13 has a gas-side header 51, a liquid-side header 52, a plurality of heat transfer tubes 53, and a plurality of fins 54.

[0082] The gas-side header 51 is connected to the gas-side pipe 16b. The liquid-side header 52 is connected to the liquid-side pipe 16c. Each heat transfer tube 53 connects the gas-side header 51 and the liquid-side header 52. A plurality of fins 54 are provided on the heat transfer tubes 53 to improve the heat exchange efficiency.

[0083] In the case of refrigeration operation, the gas-side header 51 distributes the high-pressure gaseous refrigerant to the plurality of heat transfer tubes 53. The high-pressure gaseous refrigerant condenses when passing through the heat transfer tubes 53, and during this process, heat energy is released to a medium such as air. The liquid-side header 52 collects the high-pressure liquid refrigerant from the plurality of heat transfer tubes 53.

[0084] In the case of heating operation, the liquid-side header 52 distributes the low-pressure gas-liquid two-phase refrigerant to the plurality of heat transfer tubes 53. The low-pressure gas-liquid two-phase refrigerant evaporates when passing through the heat transfer tubes 53, and during this process, heat energy is absorbed from a medium such as air. The gas-side header 51 collects the low-pressure gaseous refrigerant from the plurality of heat transfer tubes 53.

[0085] (4-2) Structure of the liquid-side header 52

[0086] Figure 3The external appearance of the liquid-side header 52 is shown. A plurality of holes 61a are provided in the liquid-side header 52 to connect the heat transfer tubes 53.

[0087] Figure 4 is an exploded view of the liquid-side header 52. The liquid-side header 52 is a laminated header and has a plurality of plate-like bodies laminated thereon. The plurality of plate-like bodies include an outer plate 61, an inner plate 62, an inner plate 63, an inner plate 64, an inner plate 65, and an outer plate 66.

[0088] The outer plate 61 has a C-shaped cross section and surrounds the inner plate 62, the inner plate 63, the inner plate 64, the inner plate 65, and the outer plate 66. The outer plate 61 has a plurality of holes 61a for receiving the heat transfer tubes 53. Further, the outer plate 61 has a plurality of pressing claws 61b for holding the inner plate 62, the inner plate 63, the inner plate 64, the inner plate 65, and the outer plate 66. The pressing claws 61b are bent inward in the manufacturing process of the liquid-side header 52.

[0089] The inner plate 62 has a plurality of holes 62a. Each hole 62a communicates with any one of the holes 61a.

[0090] The inner plate 63 has a plurality of holes 63a. Each hole 63a communicates with any one of the holes 62a.

[0091] The inner plate 64 has a plurality of holes 64a and a plurality of holes 64b. Each hole 64a communicates with any one of the holes 63a. However, the holes 64b do not communicate with the holes 63a.

[0092] The inner plate 65 has a C-shaped refrigerant flow path 65a and an I-shaped refrigerant flow path 65b. The refrigerant flow path 65a communicates with all of the holes 64a. Both the refrigerant flow path 65a and the refrigerant flow path 65b communicate with the holes 64b.

[0093] A hole 66a for connecting the liquid-side pipe 16c is provided in the outer plate 66. The hole 66a communicates with the refrigerant flow path 65a.

[0094] (4-3) Manufacture of the liquid-side header 52

[0095] (4-3-1) Preparation of the plate-like bodies

[0096] Figure 5 is a cross-sectional view showing the manufacturing process of the liquid-side header 52.

[0097] The prepared external plate 61 has a first wall portion W1, a second wall portion W2, and a third wall portion W3. The external plate 61 is a double-sided clad material. Specifically, solders 61x are provided on the inner surfaces 612 of the first wall portion, 614 of the second wall portion, and 616 of the third wall portion, and solders 61y are provided on the outer surfaces 611 of the first wall portion, 613 of the second wall portion, and 615 of the third wall portion. No anticorrosive material is mixed into the solder 61x. Anticorrosive materials such as zinc are mixed into the solder 61y.

[0098] The prepared internal plate 62 is a bare material. Specifically, no solder is provided on either surface 621 or surface 622.

[0099] The prepared internal plate 63 is a bare material. Specifically, no solder is provided on either surface 631 or surface 632.

[0100] The prepared internal plate 64 is a single-sided clad material. Specifically, no solder is provided on surface 641, and on the other hand, a solder 64x is provided on surface 642. No anticorrosive material is mixed into the solder 64x.

[0101] The prepared internal plate 65 is a bare material. Specifically, no solder is provided on either surface 651 or surface 652.

[0102] The prepared external plate 66 is a double-sided clad material. Specifically, a solder 66x is provided on surface 661, and a solder 66y is provided on surface 662. No anticorrosive material is mixed into the solder 66x. Anticorrosive materials such as zinc are mixed into the solder 66y.

[0103] More than half of the plurality of plate-like bodies (external plate 61, internal plates 62, 63, 64, 65, and external plate 66) (internal plates 62, 63, and 65) are not provided with solder.

[0104] (4-3-2) Coating of Flux

[0105] Flux is coated on the surfaces (surfaces 621, 622, 631, 632, 641, 651, and 652) that are not provided with solder.

[0106] (4-3-3) Arrangement of Plate-like Bodies

[0107] Internal plates 62, 63, 64, 65, and external plate 66 are housed in external plate 61. At this time, no solder is provided on the opposing surfaces 622 and 631. Further, no solder is provided on the opposing surfaces 632 and 641.

[0108] Both the inner surface 614 of the second wall portion and the inner surface 616 of the third wall portion, which are provided with solder 61x, are in contact with the internal plates 62, internal plates 63, internal plates 64, etc.

[0109] Next, a plurality of pressing claws 61b are bent inward.

[0110] (4-3-4) In-furnace soldering

[0111] The stacked plate-like bodies are heated in the furnace. As a result, the solders 61x, 64x, and 66x melt, and thus, the adjacent plate-like bodies are joined.

[0112] Figure 6 It is a cross-sectional view of the liquid-side header 52 after soldering. The solders 61x, 64x, and 66x melt and partially move. Therefore, the thickness of the solder changes compared to the preparation stage of the plate-like body. Specifically, the thickness of the solder 61x changes to become the solder 61z. The thickness of the solder 64x changes to become the solder 64y. The thickness of the solder 66x changes to become the solder 66z.

[0113] Solder 60z is interposed between the internal plate 62 and the internal plate 63. Further, solder 60z is interposed between the internal plate 63 and the internal plate 64. After the molten solder 61x invades the gap, the solder 60z existing in these portions solidifies.

[0114] Let the thickness of the solder 60z be the first thickness T1, and let the thickness of the solder 61z be the second thickness T2. At this time, the first thickness T1 is smaller than the second thickness T2. The first thickness is, for example, 0.2 mm or less.

[0115] (5) Features

[0116] (5-1)

[0117] Before in-furnace soldering, a plurality of pressing claws 61b of the external plate 61 are bent inward, whereby a plurality of plate-like bodies are fixed. However, in the case where solder is provided on most of the plate-like bodies in advance, the solder melts, and thus, a gap appears between the plurality of plate-like bodies. Therefore, although the plate-like bodies are fixed by the pressing claws 61b before in-furnace soldering, refrigerant may leak from the liquid-side header 52 after in-furnace soldering.

[0118] In contrast, in the present embodiment, the solder 61x provided on the inner surface 614 of the second wall portion and the inner surface 616 of the third wall portion invades between the surface 622 and the surface 631. Therefore, the surface 622 and the surface 631 can be joined without previously arranging solder between the surface 622 and the surface 631. Thus, the internal plate 62 and the internal plate 63 are not easily displaced relative to each other, and refrigerant leakage is not easily caused in the liquid-side header 52.

[0119] (5-2)

[0120] The thickness of the solder 60z between the surface 622 and the surface 631 is 0.2 mm or less. Therefore, the internal plates 62 and 63 are not likely to move relative to each other.

[0121] (5-3)

[0122] No solder is provided between the internal plates 62 and 63. Therefore, the solder coating process is not required, and thus the cost of the outdoor heat exchanger 13 is reduced.

[0123] (5-4)

[0124] More than half of the plurality of plate-like bodies (the outer plate 61, the internal plates 62, 63, 64, 65, and the outer plate 66) (the internal plates 62, 63, and 65) are not provided with solder. Therefore, in the furnace welding process, the plate-like bodies are not likely to move.

[0125] (5-5)

[0126] A flux is coated on the surfaces 622 and 631 where no solder is provided. Thus, the oxide film formed on the surfaces 622 and 631 where no solder is provided is removed, and therefore, it is easy to guide solder from other components.

[0127] (5-6)

[0128] The internal plates 62 and 63 are surrounded by the outer plate 61 having a C shape. Therefore, refrigerant leakage is not likely to occur in the liquid side header 52.

[0129] (6) Modification

[0130] (6-1) Modification 1A

[0131] The heat exchanger of the above-described embodiment is the outdoor heat exchanger 13. Instead, the above-described structure and manufacturing method may be applied to the indoor heat exchanger 22.

[0132] (6-2) Modification 1B

[0133] In the liquid side header 52 of the above-described embodiment, three of the four internal plates (the internal plates 62, 63, 64, and 65) (the internal plates 62, 63, and 65) are bare materials without solder. Instead, all four internal plates (the internal plates 62, 63, 64, and 65) may be bare materials.

[0134] (6-3) Modification 1C

[0135] In the liquid-side header 52 of the above-described embodiment, the number of internal plates is four. Instead, the number of internal plates may be other than four. For example, the number of internal plates may be two, three, or five.

[0136] <Second Embodiment>

[0137] (1) Structure

[0138] Figure 7 is a cross-sectional view showing Figure 2 the manufacturing process of the gas-side header 51 in the outdoor heat exchanger 13. The gas-side header 51 is also a laminated header and has a plurality of plate-like bodies laminated thereon. The plurality of plate-like bodies include an outer plate 71, an inner plate 72, and an outer plate 73.

[0139] The prepared outer plate 71 has a first wall portion V1, a second wall portion V2, and a third wall portion V3. Pressing claws 71b are provided on the second wall portion V2 and the third wall portion V3. The outer plate 71 is a double-sided clad material. Specifically, solders 71x are provided on the inner surface 712 of the first wall portion, the inner surface 714 of the second wall portion, and the inner surface 716 of the third wall portion, and solders 71y are provided on the outer surface 711 of the first wall portion, the outer surface 713 of the second wall portion, and the outer surface 715 of the third wall portion. No anticorrosive material is mixed into the solder 71x. Anticorrosive materials such as zinc are mixed into the solder 71y.

[0140] The prepared inner plate 62 is a bare material. Specifically, no solder is provided on both the surface 721 and the surface 722.

[0141] The prepared outer plate 73 has a first wall portion U1, a second wall portion U2, and a third wall portion U3. The outer plate 73 is a single-sided clad material. Specifically, no solder is provided on the surfaces 731a, 731b, 731c, 733, 734, 735, and 736, and on the other hand, a solder 73y is provided on the surface 732. Anticorrosive materials such as zinc are mixed into the solder 73y.

[0142] The laminated plate-like bodies are heated in a furnace. As a result, the solder 71x melts, and thus, the adjacent plate-like bodies are joined.

[0143] No solder is provided on the surface 722 of the inner plate 72. No solder is also provided on the surfaces 731a and 731b of the outer plate 73 opposed to the surface 722. Similar to the first embodiment, a part of the melted solder 71x invades the gaps between the surface 722 and the surface 731a and between the surface 722 and the surface 731b and solidifies.

[0144] (2) Features

[0145] By pre - arranging solder in the gaps between surface 722 and surface 731a and between surface 722 and surface 731b, these surfaces can be joined. Therefore, the internal plate 72 and the external plate 73 are not likely to move relative to each other, and refrigerant leakage is not likely to occur in the gas - side header 51.

[0146] (3) Variant

[0147] The heat exchanger of the above - described embodiment is the outdoor heat exchanger 13. Instead, the above - described structure and manufacturing method can also be applied to the indoor heat exchanger 22.

[0148] <Summary>

[0149] The embodiments of the present invention have been described above. However, it can be understood that various changes in the mode and details can be made without departing from the gist and scope of the present invention described in the claims.

[0150] Reference Signs Explanation

[0151] 10: Outdoor unit

[0152] 13: Outdoor heat exchanger (heat exchanger) 20: Indoor unit

[0153] 22: Indoor heat exchanger

[0154] 51: Gas - side header

[0155] 52: Liquid - side header (header)

[0156] 53: Heat - transfer tube (heat - transfer component)

[0157] 54: Fin (heat - transfer component)

[0158] 60z: Solder 61: External plate (third component)

[0159] 61x: Solder

[0160] 61y: Solder

[0161] 61z: Solder 62: Internal plate (first component)

[0162] 63: Internal plate (second component)

[0163] 64: Internal plate

[0164] 64x: Solder

[0165] 64y: Solder

[0166] 65: Internal plate 66: External plate (component)

[0167] 66x: Solder

[0168] 66y: Solder

[0169] 66z: Solder

[0170] 71: External plate

[0171] 71x: Solder

[0172] 71y: Solder

[0173] 72: Internal plate

[0174] 73: External plate

[0175] 73y: Solder

[0176] 100: Air conditioner

[0177] 611: Outer surface of the first wall portion

[0178] 612: Inner surface of the first wall portion

[0179] 613: Outer surface of the second wall portion 614: Inner surface of the second wall portion (the third surface)

[0180] 615: Outer surface of the third wall portion 616: Inner surface of the third wall portion (the third surface)

[0181] 621: Surface (the fourth surface)

[0182] 622: Surface (the first surface)

[0183] 631: Surface (the second surface)

[0184] 632: Surface (the fifth surface)

[0185] 711: Outer surface of the first wall portion

[0186] 712: Inner surface of the first wall portion

[0187] 713: Outer surface of the second wall portion

[0188] 714: Inner surface of the second wall portion

[0189] 715: Outer surface of the third wall portion

[0190] 716: Inner surface of the third wall portion

[0191] T1: The first thickness (the first thickness)

[0192] T2: The second thickness (the second thickness, the third thickness) Prior art documents

[0193] Patent documents

[0194] Patent document 1: International Publication Gazette WO2015 / 004719

Claims

1. A heat exchanger (13) having: a header (52) for guiding a refrigerant; and heat transfer members (53, 54) connected to the header for effecting heat exchange between the refrigerant and a medium, wherein the header has: a first member (62) having a first surface (622); a second member (63) having a second surface (631) opposed to the first surface; and a third member (61) having a third surface (614, 616) intersecting the first surface and the second surface and joined to the first member and the second member, the first surface and the second surface being joined by solder (60z) having a first thickness (T1), the third surface and the first member being joined by solder (61x) having a second thickness (T2), the third surface and the second member being joined by solder (61x) having a third thickness (T2), the first thickness being smaller than the second thickness, the first thickness being smaller than the third thickness, the first thickness being 0.2 mm or less.

2. The heat exchanger according to claim 1, wherein the third member has a C-shaped cross section and surrounds the first member and the second member.

3. A heat exchanger (13) having: a header (52) for guiding a refrigerant; and heat transfer members (53, 54) connected to the header for effecting heat exchange between the refrigerant and a medium, wherein the header has: a first member (62) having a first surface (622) not coated with solder; a second member (63) having a second surface (631) opposed to the first surface and not coated with solder; and a third member (61) having a third surface (614, 616) intersecting both the first surface and the second surface and coated with solder (61x), the solder coated on the third surface invading between the first surface and the second surface to thereby join the first surface and the second surface.

4. The heat exchanger according to claim 3, wherein the thickness of the solder joining the first surface and the second surface is 0.2 mm or less.

5. The heat exchanger according to claim 3 or 4, wherein the first member has a fourth surface (621) not coated with solder on the back side of the first surface, the second member has a fifth surface (632) not coated with solder on the back side of the second surface.

6. The heat exchanger according to claim 3 or 4, wherein the header has a plurality of header constituent members including the first member, the second member, and the third member, more than half of the plurality of header constituent members not being coated with solder.

7. The heat exchanger according to claim 6, wherein the plurality of header constituent members have a third member (61) coated with solder, the third member (61) being located on both sides of the first member and the second member in a direction intersecting the first surface and the second surface.

8. The heat exchanger according to claim 3 or 4, wherein The first surface and the second surface are coated with a soldering flux.

9. The heat exchanger according to claim 3 or 4, wherein, the third component has a C-shaped cross-section and surrounds the first component and the second component.

10. A method for manufacturing a header (52), wherein, a first component (62) having a first surface (622) not coated with solder, a second component (63) having a second surface (631) not coated with solder, and a third component (61) having a third surface (614, 616) coated with solder (61x) are prepared, the first surface and the second surface are opposed to each other, the third surface is brought into contact with both the first component and the second component, the first component, the second component, and the third component are heated in a furnace, whereby the solder coated on the third surface penetrates between the first surface and the second surface.

11. The manufacturing method according to claim 10, wherein, in the step of performing the penetration, the thickness of the penetrated solder is 0.2 mm or less.

12. The manufacturing method according to claim 10 or 11, wherein, the first component has a fourth surface (621) not coated with solder on the back side of the first surface, the second component has a fifth surface (632) not coated with solder on the back side of the second surface.

13. The manufacturing method according to claim 10 or 11, wherein, in the step of performing the preparation, a plurality of header constituent components including the first component, the second component, and the third component are prepared, in the step of performing the contact, the plurality of header constituent components are brought into contact with at least one other header constituent component respectively, more than half of the plurality of header constituent components are not coated with solder.

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