Display device and method for manufacturing the same

Abstract

A display device and a method for manufacturing the same are provided. The display device includes a display panel including a plurality of display pads, at least some of the plurality of display pads extending in a first direction and being arranged in a second direction intersecting the first direction, and a flexible circuit board including circuit pads and circuit lines connected to the circuit pads, at least some of the circuit pads being electrically connected to the display pads. The circuit pads include at least one dummy pad, and the circuit lines include a dummy circuit line, at least a portion of the dummy circuit line being connected to the at least one dummy pad. The dummy circuit line includes a first portion connected to the at least one dummy pad and a second portion spaced apart from the first portion by a gap.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2020-0117625, filed on September 14, 2020, which is incorporated herein by reference for all purposes, as if fully set forth herein. Technical Field

[0002] The embodiments of the invention generally relate to a display device and a method for manufacturing the display device, and more specifically, to a display device in which the elongation of the flexible circuit board produced in the process of bonding the display panel to the flexible circuit board is measured to improve reliability. Background Technology

[0003] Display devices that provide images to users (such as televisions, monitors, smartphones, and tablets) include display panels that display images. Various display panels are currently under development (such as liquid crystal display panels, organic light-emitting display panels, electrowetting display panels, and electrophoretic display panels).

[0004] Recently, display devices incorporating flexible display panels have been developed. The display panel includes multiple pixels for displaying images and driving circuitry for driving the pixels. To achieve a thin display device, pixels can be positioned in the display area of ​​the display panel, and a flexible circuit board with driving circuitry mounted on it can be connected to the non-display area of ​​the display panel.

[0005] The information disclosed above in this background section is only for understanding the background art of the inventive features that will be described below, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0006] The applicant recognizes that controlling the elongation of the flexible circuit board during the process of incorporating it into the display panel can affect the reliability of the display device.

[0007] A display device constructed according to the principles and illustrative embodiments of the invention, having a flexible circuit board bonded to a display panel, can provide improved reliability by being able to accurately measure the degree of elongation (i.e., elongation rate) of the flexible circuit board during bonding to the display device. For example, the elongation rate can be easily and accurately measured by at least one reference mark set relative to at least one dummy circuit line on the flexible circuit board, thereby improving the reliability of the display device.

[0008] The method for manufacturing a display device according to the principles of the invention and exemplary embodiments enables accurate measurement of the elongation of the flexible circuit board during the process of bonding the display panel to the flexible circuit board.

[0009] Additional features of the inventive concept will be set forth in the description which follows, and will be apparent in part from the description or may be learned by practice of the inventive concept.

[0010] More specifically, according to one embodiment, a display device includes: a display panel including a plurality of display pads, at least some of the display pads extending in a first direction and arranged in a second direction intersecting the first direction; and a flexible circuit board including a plurality of circuit pads and a plurality of circuit lines, at least some of the circuit pads being electrically connected to the plurality of display pads, and the plurality of circuit lines being connected to the plurality of circuit pads, wherein the plurality of circuit pads includes at least one dummy pad, and the plurality of circuit lines includes at least one dummy circuit line, at least a portion of the at least one dummy circuit line being connected to the dummy pad, wherein the dummy circuit line includes: a first portion connected to the dummy pad; and a second portion spaced apart from the first portion by a certain gap.

[0011] The display panel may also include a first mark, which is configured to overlap with a plurality of display pads in a second direction.

[0012] The flexible circuit board may also include a second mark, at least a portion of which is configured to be stacked with a plurality of circuit pads in a second direction.

[0013] The plurality of circuit pads may also include a base pad configured to overlap with the dummy pads in a second direction, wherein the plurality of display pads may include: a window pad or panel dummy pad electrically connected to the dummy pads; and an input pad electrically connected to the base pads.

[0014] The first part can have a length smaller than the distance between the first part and the second part.

[0015] The flexible circuit board may also include a circuit substrate layer on which multiple circuit pads and multiple circuit lines are disposed, and the circuit substrate layer may include a flexible material.

[0016] The dummy pad may include: a left dummy pad disposed on the left side of the flexible circuit board with respect to a center line symmetrically arranged through the flexible circuit board in a first direction; and a right dummy pad disposed on the right side of the flexible circuit board with respect to the center line. The dummy circuit line may include: a left dummy circuit line including a first left portion connected to the left dummy pad and a second left portion spaced apart from the first left portion by a first gap; and a right dummy circuit line including a first right portion connected to the right dummy pad and a second right portion spaced apart from the first right portion by a second gap.

[0017] The ends of the first left portion and the first right portion may not overlap each other in the second direction.

[0018] The flexible circuit board may also include data driving circuitry connected to at least a portion of the circuit lines.

[0019] The display device may also include a conductive adhesive film disposed between the display panel and the flexible circuit board to electrically connect the display pad to the base pad.

[0020] According to another embodiment, a display device includes: a display panel including a plurality of display pads, at least some of the display pads extending in a first direction and arranged in a second direction intersecting the first direction; and a flexible circuit board electrically connected to the display panel, wherein the flexible circuit board includes: a plurality of circuit pads, including a base pad electrically connected to the plurality of display pads and at least one dummy pad disposed adjacent to the base pad; a plurality of circuit lines, including dummy circuit lines connected to the dummy pads; a first mark disposed adjacent to the plurality of circuit lines; and a reference point disposed on the dummy circuit line or disposed between the dummy circuit line and the first mark.

[0021] The dummy circuit may include: a first part connected to the dummy pad; and a second part spaced apart from the first part, wherein a reference point may be defined at the end of the first part.

[0022] The reference point can be roughly rectangular, roughly circular, or roughly triangular in shape.

[0023] The reference point may include: a left reference mark, which is located on the left side of the flexible circuit board relative to the center line that runs through the flexible circuit board in the first direction; and a right reference mark, which is located on the right side of the flexible circuit board relative to the center line that runs through it.

[0024] According to another embodiment, a method for manufacturing a display device includes: preparing a display panel having a display area configured to display an image and a non-display area adjacent to the display area, and including a plurality of display pads and a first mark disposed in the non-display area; preparing a flexible circuit board including a plurality of circuit pads, a plurality of circuit lines connected to the plurality of circuit pads, a second mark disposed adjacent to the plurality of circuit lines, and a plurality of reference points disposed on at least one of the plurality of circuit lines or between two of the plurality of circuit lines and the second mark; pressing the display panel and the flexible circuit board together such that at least a portion of the plurality of circuit pads is electrically connected to the plurality of display pads; and measuring the elongation rate of the flexible circuit board during pressing by measuring the distance between the plurality of reference points.

[0025] The step of pressing the display panel and the flexible circuit board together may include: a first pressing process of pressing the display panel and the flexible circuit board with a first pressure; and a second pressing process of pressing the display panel and the flexible circuit board with a second pressure greater than the first pressure.

[0026] The steps for measuring elongation may include: measuring a first distance between multiple reference points before the second pressing process; measuring a second distance between multiple reference points after the second pressing process; and comparing the first distance with the second distance.

[0027] The reference points may include: a left reference mark, positioned on the left side of the flexible circuit board relative to the center line of symmetry; and a right reference mark, positioned on the right side of the flexible circuit board relative to the center line of symmetry, wherein measuring elongation includes measuring the distance between the left and right reference marks.

[0028] Multiple circuit pads may include at least one dummy pad, and multiple circuit lines may include dummy circuit lines connected to at least one dummy pad, and the dummy circuit lines may include: a first portion connected to at least one dummy pad; and a second portion spaced apart from the first portion by a certain gap.

[0029] Multiple circuit pads may include at least one dummy pad, multiple circuit lines may include dummy circuit lines connected to at least one dummy pad, a reference point may be set between the dummy circuit line and the second mark, and the reference point may have a generally rectangular shape, a generally circular shape, or a generally triangular shape.

[0030] It will be understood that the foregoing general description and the following detailed description are exemplary and explanatory, and are intended to provide further explanation of the invention as claimed. Attached Figure Description

[0031] The accompanying drawings illustrate illustrative embodiments of the invention and, together with the description, serve to explain the inventive concept. The drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification.

[0032] Figure 1 This is a front perspective view of an embodiment of a display device constructed according to the principles of the invention.

[0033] Figure 2 yes Figure 1 An exploded perspective view of the display device.

[0034] Figure 3A yes Figure 1 A cross-sectional view of an embodiment of the display module.

[0035] Figure 3B yes Figure 1 A cross-sectional view of another embodiment of the display module.

[0036] Figure 4 yes Figure 1 A plan view of the display device.

[0037] Figure 5AIt is along Figure 4 A cross-sectional view of the display device taken by line I-I'.

[0038] Figure 5B It is along Figure 5A A magnified sectional view of the display device taken by line V-V'.

[0039] Figure 5C It is along Figure 4 The cross-sectional view of the display panel is taken by line O-O'.

[0040] Figure 6 yes Figure 4 A magnified and decomposed planar diagram of region AA.

[0041] Figure 7A and Figure 7B It is shown Figure 6 A magnified plan view of a portion of the flexible circuit board.

[0042] Figure 8 It is shown Figure 6 A magnified plan view of a portion of the display panel.

[0043] Figure 9 It is along Figure 6 A cross-sectional view of the flexible circuit board and display panel taken from line II-II'.

[0044] Figure 10A and Figure 10B It is shown in Figure 6 A plan view of the display panel and flexible circuit board that are integrated together in area AA.

[0045] Figure 11 It is shown in Figure 6 A plan view of another embodiment of the display panel and flexible circuit board combined with each other in region AA.

[0046] Figure 12 This is a flowchart illustrating an embodiment of a method for manufacturing a display device according to the principles of the invention.

[0047] Figure 13 This is a flowchart illustrating an embodiment of a method for manufacturing a display device.

[0048] Figure 14A and Figure 14B This is a plan view illustrating an embodiment of a portion of the measurement process used in a method for manufacturing a display device. Detailed Implementation

[0049] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of various embodiments or implementations of the invention. As used herein, “embodiment” and “implementation” are interchangeable terms and are non-limiting examples of apparatus or methods employing one or more inventive concepts disclosed herein. However, it will be apparent that various embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, the various embodiments may be different, but are not necessarily exclusive. For example, a particular shape, construction, and characteristic of an embodiment may be used or implemented in another embodiment without departing from the inventive concept.

[0050] Unless otherwise stated, the embodiments shown are to be understood as illustrative features providing details of variations in how the inventive features can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as “elements”) can be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0051] The use of crosshairs and / or shading in the accompanying drawings is generally provided to clarify the boundaries between adjacent elements. Thus, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for the specific material, material properties, size, scale, commonalities between the elements shown, or any other characteristics, properties, etc. Furthermore, in the drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. When embodiments can be implemented differently, a particular process sequence may be performed differently than the described sequence. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Additionally, the same reference numerals denote the same elements.

[0052] When a component or layer is referred to as being "on," "connected to," or "bonded to" another component or layer, the component or layer may be directly on, directly connected to, or directly bonded to the other component or layer, or there may be intermediate components or layers present. However, when a component or layer is referred to as being "directly on," "directly connected to," or "directly bonded to" another component or layer, there are no intermediate components or layers present. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection with or without intermediate components. Furthermore, the DR1, DR2, and DR3 axes are not limited to the three axes of a Cartesian coordinate system (such as the x, y, and z axes) and can be interpreted in a broader sense. For example, the DR1, DR2, and DR3 axes can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z (species / man)” and “selected from at least one of the group consisting of X, Y, and Z (species / man)” can be interpreted as X only, Y only, Z only, or any combination of two or more of X, Y, and Z (such as XYZ, XYY, YZ, and ZZ). As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0053] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the publicly stated teachings, the first element discussed below may be referred to as the second element.

[0054] Spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein for descriptive purposes and thus to describe the relationship of one element to another (or other) elements as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are intended to cover different orientations of the device during use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will subsequently be positioned “above” other elements or features. Thus, the term “below” can cover both above and below orientations. Furthermore, the device may be otherwise positioned (e.g., rotated 90 degrees or in other orientations), and thus, the spatial relative descriptive terms used herein are interpreted accordingly.

[0055] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well. Furthermore, when the terms “comprising” and variations thereof and / or “including” and variations thereof are used in this specification, the presence of the stated features, integrals, steps, operations, elements, components, and / or groups thereof is indicated, but the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof is not excluded. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than terms of degree, and are thus used to interpret the inherent biases in measured, calculated, and / or provided values ​​that will be recognized by those skilled in the art.

[0056] Various embodiments are described herein with reference to cross-sectional and / or exploded views as schematic illustrations of idealized embodiments and / or intermediate structures. Thus, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances will be expected. Therefore, the embodiments disclosed herein should not necessarily be interpreted as limited to the shapes of the specifically shown areas, but rather include deviations in shape due to, for example, manufacturing processes. In this way, the areas shown in the figures can be schematic in nature, and the shapes of these areas may not reflect the actual shapes of the areas of the device, and are thus not intended to be limiting.

[0057] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense unless expressly defined herein.

[0058] Figure 1 This is a front perspective view of an embodiment of a display device constructed according to the principles of the invention. Figure 2 This is an exploded perspective view of a display device according to an embodiment.

[0059] Reference Figure 1 and Figure 2The display device EA can be a device activated by an electrical signal. The display device EA can be implemented in various embodiments. For example, the display device EA can be used in large electronic devices such as televisions, monitors, or billboards, as well as small and medium-sized electronic devices such as personal computers, laptops, personal digital terminals, vehicle navigation units, game consoles, portable electronic devices, and cameras. Furthermore, the devices described above are only examples; therefore, the display device EA can be used in other electronic devices unless departing from the scope of the invention. In this embodiment, the display device EA as part of a smartphone will be described as an example.

[0060] The display device EA can display an image IM on a third direction DR3 on a display surface FS that is substantially parallel to each of the first direction DR1 and the second direction DR2. The image IM can include still images as well as moving images (such as video images that change over time). Figure 1 In the example, the image IM is shown as a time display window and icon. The display surface FS on which the image IM is displayed can correspond to the front surface of the display device EA, and can also correspond to the front surface of the window panel WP.

[0061] In this embodiment, the front (or top) or rear (or bottom) surface of each component can be defined based on the image IM along its display direction. The front and rear surfaces may face each other on a third direction DR3. The normal direction of each of the front and rear surfaces may be substantially parallel to the third direction DR3. The directions indicated as the first direction DR1, the second direction DR2, and the third direction DR3 may be relative concepts and thus vary into different directions. In this specification, the term "in a plane" may mean when viewed on the third direction DR3.

[0062] The display device EA may include a window panel WP, an anti-reflective panel RPP, a display module DM, and a housing HU. In this embodiment, the window panel WP and the housing HU are combined together to define the appearance of the display device EA.

[0063] Window panels (WP) may include optically transparent insulating materials. For example, window panels (WP) may include glass or plastic. Window panels (WP) may have a single-layer or multi-layer structure. For example, window panels (WP) may include multiple plastic films bonded together using adhesives, or a glass substrate and plastic films bonded together using adhesives.

[0064] The display surface FS of the window panel WP can define the front surface of the display device EA as described above. The transmissive region TA can be an optically transparent region. For example, the transmissive region TA can be an area with a visible light transmittance of about 90% or more.

[0065] The border region BZA can be a region with a relatively lower transmittance than the transmission region TA. The border region BZA defines the shape of the transmission region TA. The border region BZA can be configured to be adjacent to the transmission region TA to surround the transmission region TA.

[0066] The border area BZA can have a predetermined color. The border area BZA can cover the outer perimeter area NAA of the display module DM to prevent the outer perimeter area NAA from being visible from the outside. However, this is only an example. For instance, the border area BZA is optional and can be omitted.

[0067] An anti-reflective panel (RPP) can be installed below the window panel (WP). The RPP reduces the reflectivity of external light incident from the upper side of the window panel (WP). The RPP is optional and can be omitted, or it can be included as a component in the display module (DM).

[0068] The display module DM can display an image IM and sense external input TC. External input TC can include various types of input provided externally to the display module DM (e.g., input provided via an operator's finger). External input TC can be provided in various forms.

[0069] For example, the external input TC may include external inputs such as hovering (approaching or being at a predetermined distance from the display module DM) or contact (a part of the human body, such as the user's hand) . Additionally, the input may be provided in various other forms (such as force, pressure, light, etc.) and is not limited to any one embodiment. Figure 1 An example is shown where the user's hand is used as an external input TC.

[0070] The display module DM includes a front surface IS, which comprises an active area AA and a peripheral area NAA. The active area AA can be an area that is activated based on an electrical signal.

[0071] In this embodiment, the effective area AA can be the area on which the image IM is displayed and on which the external input TC is sensed. The transmission area TA is at least superimposed on the effective area AA. For example, the transmission area TA is superimposed on the entire surface or at least a portion of the effective area AA. Therefore, the user can see the image IM or receive the external input TC through the transmission area TA. However, this is only an example. For example, the area of ​​the effective area AA on which the image IM is displayed and the area of ​​the effective area AA on which the external input TC is sensed can be separated from each other, but are not limited to this particular embodiment.

[0072] The peripheral region NAA can be the area covered by the border region BZA. The peripheral region NAA is adjacent to the active region AA. The peripheral region NAA can surround the active region AA. The drive circuit or drive line used to drive the active region AA can be set in the peripheral region NAA.

[0073] The display module DM includes the display panel DP, the input sensing unit ISL, and the circuit board CS.

[0074] The display panel (DP) can be a component that essentially generates the image (IM). The image (IM) generated by the display panel (DP) can be seen from the outside by the user through the transmissive area (TA).

[0075] The input sensing unit ISL senses external input TC applied from the outside. As described above, the input sensing unit ISL can sense external input TC provided to the window panel WP.

[0076] The circuit board CS is electrically connected to the display panel DP. The circuit board CS includes the main circuit board MB and the flexible circuit board CF. The flexible circuit board CF may include the panel circuit board CF1 and the input circuit board CF2.

[0077] Panel circuit board CF1 is electrically connected to display panel DP. Panel circuit board CF1 can connect display panel DP to main circuit board MB. In this embodiment, panel circuit board CF1 is shown as a flexible circuit film, to which main circuit board MB is connected at its end. However, this is only an example, and panel circuit board CF1 may not be connected to main circuit board MB.

[0078] The panel circuit board CF1 can be connected to a pad (also known as a solder pad or solder joint) located in the peripheral area NAA of the display panel DP. The panel circuit board CF1 provides electrical signals to the display panel DP for driving the display panel DP. These electrical signals can be generated in the panel circuit board CF1 or in the main circuit board MB.

[0079] The flexible circuit board CF included in the circuit board CS may further include an input circuit board CF2 electrically connected to the input sensing unit ISL. The input circuit board CF2 can connect the input sensing unit ISL to the main circuit board MB. In this embodiment, the input circuit board CF2 may be configured as a flexible circuit film to connect the input sensing unit ISL to the main circuit board MB. However, this embodiment is not limited to this, and the input circuit board CF2 may not be connected to the main circuit board MB.

[0080] The input circuit board CF2 can be connected to the pad (sensing pad) located in the peripheral area NAA of the input sensing unit ISL. The input circuit board CF2 provides electrical signals to the input sensing unit ISL for driving the input sensing unit ISL. The electrical signals can be generated in the input circuit board CF2 or in the main circuit board MB.

[0081] The main circuit board MB may include various drive circuits for driving the display module DM and connectors for supplying power. Each of the panel circuit board CF1 and the input circuit board CF2 may be connected to the main circuit board MB. According to one feature, the display module DM can be easily controlled via a single main circuit board MB. However, this is merely an example. In the display module DM, the display panel DP and the input sensing unit ISL may be connected to different main circuit boards, or one of the panel circuit board CF1 and the input circuit board CF2 may not be connected to a single main circuit board MB; however, the embodiment is not limited to this specific construction.

[0082] The housing HU is integrated into the window panel WP. The housing HU is integrated into the window panel WP to provide a predetermined internal space. The display module DM can be accommodated within the internal space.

[0083] The housing HU may comprise a material with relatively high rigidity. For example, the housing HU may comprise glass, plastic, or metal, or may comprise multiple frames and / or panels made of a combination of glass, plastic, and metal. The housing HU can stably protect the components of the display device EA housed within its internal space from external impacts.

[0084] Figure 3A and Figure 3B This is a cross-sectional view of a display device according to an embodiment.

[0085] Reference Figure 3A The display module DM may include a display panel DP, an input sensing unit ISL, and a bonding component SLM.

[0086] The display panel DP can be an emissive display panel, but the embodiments are not limited to this. For example, the display panel DP can be an organic light-emitting display panel or a quantum dot light-emitting display panel.

[0087] The display panel (DP) may include a substrate (BL), a display circuit layer (ML-D), and an emissive layer (EML). The input sensing unit (ISL) may include an upper substrate (BS) and a sensing circuit layer (ML-T).

[0088] Each of the substrate BL and the upper substrate BS can be a silicon substrate, a plastic substrate, a glass substrate, an insulating film, or a stacked structure including multiple insulating layers. The substrate BL can be a display substrate on which circuit layers, display layers, etc. are disposed.

[0089] The display circuit layer ML-D can be disposed on the substrate BL. The display circuit layer ML-D may include multiple insulating layers, multiple conductive layers, and semiconductor layers. The multiple conductive layers of the display circuit layer ML-D can form the signal lines or control circuits of the pixels.

[0090] The emissive layer (EML) can be disposed on the display circuit layer (ML-D). The EML can be a layer that generates light or controls the transmittance of light. For example, the EML of an organic light-emitting display panel may include organic light-emitting materials. The EML of a quantum dot light-emitting display panel may include at least one of quantum dots and quantum rods. The EML of a liquid crystal display panel may include a liquid crystal layer.

[0091] The upper substrate BS can be disposed on the light-emitting layer EML. The upper substrate BS can be an encapsulation substrate for encapsulating the display panel DP. A predetermined space can be defined between the upper substrate BS and the light-emitting layer EML. The space defined between the upper substrate BS and the light-emitting layer EML can be filled with air or an inert gas. Furthermore, the space defined between the upper substrate BS and the light-emitting layer EML can be filled with a filler such as a silicone polymer, epoxy resin, or acrylic resin. However, embodiments of the invention are not limited to this. For example, no space may be provided between the light-emitting layer EML and the upper substrate BS, so that the light-emitting layer EML and the upper substrate BS can be in contact with each other.

[0092] The sensing circuit layer ML-T can be disposed on the upper substrate BS. The sensing circuit layer ML-T may include multiple insulating layers and multiple conductive layers. The multiple conductive layers constitute sensing electrodes for sensing external input TC, sensing lines connected to the sensing electrodes, and sensing pads connected to the sensing lines.

[0093] The bonding member SLM can be disposed between the substrate BL and the upper substrate BS. The bonding member SLM bonds the substrate BL to the upper substrate BS. The bonding member SLM may include organic materials such as light-curable resins or photoplastic resins, or inorganic materials such as glass sealants, but is not limited to specific embodiments.

[0094] Figure 3B This is a cross-sectional view of a display device according to an embodiment.

[0095] Reference Figure 3B The display module DM-1 may include a display panel DP-1 and an input sensing unit ISL-1. The input sensing unit ISL-1 may be referred to as the input sensing layer.

[0096] The display panel DP-1 may include a substrate BL, a display circuit layer ML-D, a light-emitting layer EML, and a thin-film encapsulation layer TFL. The input sensing unit ISL-1 may include a substrate layer TFL and a sensing circuit layer ML-T. The thin-film encapsulation layer (hereinafter also referred to as the "encapsulation layer") TFL and the substrate layer TFL may have the same structure.

[0097] The display panel DP-1 and the input sensing unit ISL-1 can be formed through a continuous process. That is, the sensing circuit layer ML-T can be directly disposed on the thin-film encapsulation layer TFL.

[0098] Figure 4 This is a plan view of a display device according to an embodiment. Figure 5A This is a cross-sectional view of a display device according to an embodiment. Figure 5A It is along Figure 4 A sectional view taken from line I-I'.

[0099] Reference Figure 4 and Figure 5A The display module DM may include a display panel DP, a flexible circuit board CF, and a conductive adhesive film ACF. The display module DM may include a main circuit board MB electrically connected to the flexible circuit board CF via the conductive adhesive film ACF. In this embodiment, the flexible circuit board CF may include a flexible circuit board portion FPC and a data driving circuit DC.

[0100] The non-display area NDA adjacent to the display area DA in which pixels PX are disposed can be defined on the display panel DP. A pad area PA, which will be described later, is disposed thereon. Figure 6 The mounting area (MA) can be defined within the non-display area (NDA). In an embodiment, the mounting area (MA) can be defined on the display panel (DP). The flexible circuit board (CF) can be bonded to the mounting area (MA) via a conductive adhesive film (ACF). The non-display area (NDA) and the mounting area (MA) can be indistinguishable from each other. The mounting area (MA) can be a part of the non-display area (NDA). The pad area (PA) can be defined within a part of the mounting area (MA). A detailed description of the pad area (PA) is provided below.

[0101] like Figure 4 As shown, the display panel DP can display a desired image by applying drive signals to a plurality of pixels PX. The plurality of pixels PX can be arranged in a matrix along a first direction DR1 and a second direction DR2 that are perpendicular to each other. Pixel PX may include first to third pixels displaying red, green, and blue, respectively. In an embodiment, pixel PX may further include a subset of pixels displaying white, cyan, and magenta, respectively.

[0102] Each pixel PX includes an organic light-emitting diode (OLED) and a driving circuit GDC connected to the OLED. The driving circuit GDC and the signal line SGL can be set... Figure 5A The circuit element layer DP-CL shown is shown.

[0103] The driving circuit GDC may include scan driving circuitry. The scan driving circuitry generates multiple scan signals (hereinafter referred to as scan signals) to sequentially output the scan signals to multiple scan lines GL (hereinafter referred to as scan lines), which will be described below. The scan driving circuitry may also output other control signals to the driving circuitry of each of the pixels PX.

[0104] The scan driving circuit may include multiple thin-film transistors manufactured using the same process as the driving circuit of the pixel PX (e.g., low-temperature polycrystalline silicon (LTPS) process or low-temperature polycrystalline oxide (LTPO) process).

[0105] The signal line SGL includes scan lines GL, data lines DL, power lines PL, and control signal lines CSL. Scan lines GL are connected to corresponding pixels PX within pixels PX, and data lines DL are also connected to corresponding pixels PX within pixels PX. Power lines PL are connected to pixels PX. Control signal lines CSL provide control signals to the scan drive circuit.

[0106] The signal line SGL is stacked with the display area DA and the non-display area NDA. The signal line SGL may include a pad portion and a line portion. The line portion is stacked with the display area DA and the non-display area NDA. The pad portion is connected to the end of the line portion. The pad portion is disposed in the non-display area NDA to stack with a corresponding signal pad in the signal pad. The area in the non-display area NDA in which the signal pad is disposed can be defined as the pad area PA. Figure 6 This will be described in more detail below.

[0107] Display panels (DPs) can be classified into liquid crystal display panels, organic electroluminescent display panels, electrowetting display panels, quantum dot emission display panels, etc., based on the type of multiple pixel PXs. In this embodiment, the display panel DP can be an organic electroluminescent display panel.

[0108] like Figure 5A As shown, the display panel DP includes a substrate BL, a circuit element layer DP-CL disposed on the substrate BL, a display element layer DP-OLED, and an encapsulation layer TFL. In this specification, unless otherwise stated, the phrase "region / part and area / part correspond to each other" means "overlapping with each other" on a third-party DR3, but is not limited to having the same area and / or the same shape.

[0109] The substrate BL may include at least one synthetic resin film. The substrate BL may include a glass substrate, a metal substrate, and an organic / inorganic composite substrate.

[0110] The circuit element layer DP-CL includes at least one insulating layer and circuit elements. The insulating layer includes at least one inorganic layer and at least one organic layer. The circuit elements include signal lines and pixel driving circuitry.

[0111] The display element layer of a DP-OLED can include at least organic light-emitting diodes as light-emitting elements. The display element layer of a DP-OLED can also include an organic layer (such as a pixel-defining layer).

[0112] The encapsulation layer TFL can include multiple thin films. Some films can improve optical efficiency, while others can protect the organic light-emitting diode.

[0113] A black matrix blocking light can be located in the non-display area NDA. A drive circuit GDC for supplying gate signals to multiple pixels PX can be located in the non-display area NDA. A data drive circuit can be further located in the non-display area NDA. A pad area PA (for receiving signals supplied from the flexible circuit board CF) Figure 6 It can be limited to the installation area MA.

[0114] like Figure 4 and Figure 5A As shown, the flexible circuit board CF includes a flexible circuit board portion FPC and a data drive circuit DC. The data drive circuit DC may include at least one driver chip. The data drive circuit DC is electrically connected to a line of the flexible circuit board portion FPC.

[0115] When the flexible circuit board CF includes a data driving circuit DC, the pad portion of the display panel DP may include a data pad electrically connected to the data line DL and a control signal pad electrically connected to the control signal line CSL. The data line DL may be connected to the pixel PX, and the control signal line CSL may be connected to the driving circuit GDC. Although the flexible circuit board CF has a chip-on-film structure, the embodiments are not limited thereto.

[0116] The main circuit board (MB) provides image data, control signals, and power voltage to the display panel (DP) or data drive circuit (DC). The main circuit board (MB) can be a board with an area larger than the flexible circuit board portion (FPC) and can include both active and passive components. The main circuit board (MB) can be a flexible or rigid board and may include pad portions connected to the flexible circuit board portion (FPC).

[0117] Figure 5B This is a partial cross-sectional view of a display device according to an embodiment. Figure 5B It is along Figure 5A The anatomical view is taken by the line V-V'.

[0118] Reference Figure 5A and Figure 5B The flexible circuit board CF may include multiple circuit pads LD. The flexible circuit board portion FPC may include a circuit substrate layer BL-F and multiple circuit pads LD disposed on the circuit substrate layer BL-F. Each of the multiple circuit pads LD may be spaced apart from each other by a predetermined distance. The circuit substrate layer BL-F provides the substrate surface of the flexible circuit board CF disposed on the display panel DP. The circuit substrate layer BL-F may include a flexible material. For example, the circuit substrate layer BL-F may be a polyimide film with flexible properties.

[0119] Multiple circuit pads LD can be connected to the pad area PA of the display panel DP. Figure 6 Direct contact. Specifically, multiple circuit pads LD can contact display pads SD disposed in the circuit element layer DP-CL of the display panel DP. When multiple circuit pads LD and display pads SD are connected to each other, the flexible circuit board CF and the display panel DP can be electrically connected to each other.

[0120] A conductive adhesive film (ACF) can be disposed between a flexible circuit board (CF) and a display panel (DP). The conductive adhesive film (ACF) can also be disposed between the flexible circuit board (CF) and the circuit element layer (DP-CL) in the pad region (PA). The conductive adhesive film (ACF) may include a plurality of conductive balls (CB) electrically connecting the flexible circuit board (CF) to the display panel (DP). The conductive adhesive film (ACF) may further include an adhesive resin (BR) in which the plurality of conductive balls (CB) are dispersed. When the display panel (DP) and the flexible circuit board (CF) are electrically connected to each other, the plurality of conductive balls (CB) can be aligned in a second direction (DR2).

[0121] Figure 5C This is a cross-sectional view of the display panel according to an embodiment. Figure 5C It is along Figure 4 A sectional view taken by line O-O'.

[0122] Figure 5C This is a cross-sectional view of the display area DA of the display panel DP. (Refer to...) Figure 5C The display panel DP includes a buffer layer BFL, a first gate insulating layer GI1, a second gate insulating layer GI2, an interlayer insulating layer ILD, an upper insulating layer VIA1, a semiconductor pattern ACP including multiple patterns, a first conductive layer CLP1 including multiple patterns, a second conductive layer CLP2 including multiple patterns, and a third conductive layer CLP3 including multiple patterns. Here, the first conductive layer CLP1 may include a first gate metal pattern, the second conductive layer CLP2 may include a second gate metal pattern, and the third conductive layer CLP3 may include a first data metal pattern.

[0123] Each of the first gate insulating layer GI1, the second gate insulating layer GI2, and the interlayer insulating layer ILD may include an organic layer and / or an inorganic layer. Each of the first gate insulating layer GI1, the second gate insulating layer GI2, and the interlayer insulating layer ILD may include multiple inorganic thin films. The multiple inorganic thin films may include a silicon nitride layer and a silicon oxide layer. Each of the first conductive layer CLP1 and the second conductive layer CLP2 may include, but is not limited to, molybdenum (Mo).

[0124] The third conductive layer CLP3 may include, but is not limited to, at least one of aluminum (Al) and titanium (Ti). The third conductive layer CLP3 may have a structure in which titanium, aluminum and titanium are sequentially stacked.

[0125] A buffer layer BFL can be disposed on a substrate BL. The buffer layer BFL may include a first buffer layer and a second buffer layer. The second buffer layer may be disposed on the first buffer layer. The buffer layer BFL prevents impurities present on the substrate BL from being introduced into the pixel PX during the manufacturing process. Specifically, the buffer layer BFL prevents impurities from diffusing into the semiconductor patterns ACP of the transistors T1 and T2 constituting the pixel PX.

[0126] Impurities may be introduced from the outside or generated during the pyrolysis of the substrate BL. Impurities may include gases or sodium emanating from the substrate BL. Additionally, the buffer layer BFL can block moisture introduced into the pixel PX from the outside.

[0127] Semiconductor pattern ACP can be set on buffer layer BFL.

[0128] The semiconductor pattern ACP may include each of transistors T1 and T2. The semiconductor pattern ACP may include polycrystalline silicon, amorphous silicon, or metal-oxide-semiconductor. Figure 5C Semiconductor patterns for the source S1, active C1, and drain D1 constituting the first transistor T1 and semiconductor patterns for the source S2, active C2, and drain D2 constituting the second transistor T2 are shown.

[0129] A first gate insulating layer GI1 may be disposed on a buffer layer BFL to cover the semiconductor pattern ACP. A first conductive layer CLP1 may be disposed on the first gate insulating layer GI1. The gate G1 of the first transistor T1 and the gate G2 of the second transistor T2 are shown in the first conductive layer CLP1. The first conductive layer CLP1 may include one of the two electrodes of the capacitor constituting the pixel PX.

[0130] A second gate insulating layer GI2 may be disposed on the first gate insulating layer GI1 to cover the first conductive layer CLP1. A second conductive layer CLP2 may be disposed on the second gate insulating layer GI2. The second conductive layer CLP2 may be the other of the two electrodes of the capacitor constituting the pixel PX. The upper electrode UE is shown as the second conductive layer CLP2. An opening may be defined in the upper electrode UE.

[0131] An interlayer insulating layer (ILD) can be disposed on the second gate insulating layer (GI2) to cover the second conductive layer (CLP2). The first connection electrode (CNE-D1) of the third conductive layer (CLP3) can be correspondingly connected to the gate (G1) of the first transistor (T1) and the source (S2) of the second transistor (T2). An upper insulating layer (VIA1) can be disposed on the interlayer insulating layer (ILD) to cover the third conductive layer (CLP3).

[0132] exist Figure 5C In the display area DA, the light-emitting element layer ELL may include a light-emitting element ED and a pixel-defining layer PDL. The light-emitting element ED may include an anode electrode AE, a light-emitting layer EML, and a cathode electrode CE. The pixel-defining layer PDL may correspond to a pixel-defining film. The anode electrode AE ​​may be disposed on the anode layer.

[0133] An anode electrode AE ​​can be disposed on the upper insulating layer VIA1. The anode electrode AE ​​can be electrically connected to the third conductive layer CLP3 through contact holes. A pixel defining layer PDL can be disposed on the upper insulating layer VIA1 to expose at least a portion of the anode electrode AE. A light-emitting layer EML can be disposed on the anode electrode AE. A cathode electrode CE can be disposed on the light-emitting layer EML.

[0134] When the light-emitting element (ED) is an organic light-emitting diode (OLED), the light-emitting layer (EML) may include organic materials. The encapsulation layer (TFL) can seal the light-emitting element layer (ELL) to protect it from external oxygen or moisture. The encapsulation layer (TFL) may be a layer in which organic and inorganic layers are mixed.

[0135] Figure 6 This is a plan view showing a portion of the display device according to an embodiment. Figure 6 yes Figure 4 A magnified and decomposed planar diagram of region AA.

[0136] Reference Figures 4 to 6 The pad area PA can be defined within the display panel DP. The pad area PA can be defined within a portion of the mounting area MA, and can be an area on which the display pad SD is mounted.

[0137] The base pad region PA-CF of the flexible circuit board portion FPC of the flexible circuit board CF and the pad region PA of the display panel DP can be electrically connected to each other via a conductive adhesive film ACF. The pad region of the main circuit board MB can include pads electrically connected to the circuit pads LD of the flexible circuit board portion FPC. The input pad region of the flexible circuit board portion FPC and the pad region of the main circuit board MB can also be electrically connected to each other via the conductive adhesive film ACF. The conductive adhesive film ACF can be an anisotropic conductive film (ACF). A shoulder bump can replace the conductive adhesive film ACF. The circuit pads LD disposed in the base pad region PA-CF of the flexible circuit board portion FPC can be electrically connected to the display pads SD disposed in the pad region PA of the display panel DP via the conductive adhesive film ACF. The conductive adhesive film ACF can include a plurality of conductive balls CB. When the conductive adhesive film ACF is pressed between the flexible circuit board portion FPC and the display panel DP, the plurality of conductive balls CB aligned in the first direction DR1 can electrically connect the circuit pads LD of the flexible circuit board portion FPC to the display pads SD of the display panel DP.

[0138] The flexible circuit board portion FPC disposed in the flexible circuit board CF includes multiple circuit pads LD and circuit lines CL connected to the circuit pads LD. The multiple circuit pads LD can be disposed in the substrate pad region PA-CF. The multiple circuit pads LD can be disposed on the circuit substrate layer BL-F of the flexible circuit board portion FPC. Although for ease of description, Figure 6 Components such as multiple circuit pads LDs disposed in the flexible circuit board CF are shown in solid lines, but the embodiments are not limited thereto. For example, the components disposed in the flexible circuit board CF may be disposed on the rear surface of the circuit substrate layer BL-F.

[0139] At least a portion of the multiple circuit pads LD can be electrically connected to the data drive circuit DC disposed in the flexible circuit board CF via the circuit line CL.

[0140] The flexible printed circuit board (FPC) portion may also include a mark that can be in the form of a circuit alignment mark ALM-C. The circuit alignment mark ALM-C may have a shape in which at least a portion of the circuit alignment mark ALM-C is superimposed on the substrate pad region PA-CF. The circuit alignment mark ALM-C may also have a shape in which at least a portion of the circuit alignment mark ALM-C is superimposed on a plurality of circuit pads LD in a second direction DR2. The circuit alignment mark ALM-C can be used as a mark for determining the position of the flexible printed circuit board CF, or as an identification mark for aligning the flexible printed circuit board CF and the display panel DP during the process of bonding the flexible printed circuit board CF to the display panel DP.

[0141] The display panel DP includes multiple display pads SD. The multiple display pads SD can be disposed on the substrate BL of the display panel DP. The multiple display pads SD can be disposed in the pad area PA of the display panel DP.

[0142] Each of the multiple display pads SD can have a shape corresponding to each of the circuit pads LD disposed in the flexible circuit board CF. That is, the multiple display pads SD can have a longitudinal axis aligned with the longitudinal axis of the circuit pad LD. Signal lines SGL can be connected to the multiple display pads SD. For example, data lines DL or control signal lines CSL can be connected to the multiple display pads SD.

[0143] The display panel DP may also include a mark that can be in the form of a panel alignment mark ALM-P. The panel alignment mark ALM-P may be disposed in the pad area PA of the display panel DP. At least a portion of the panel alignment mark ALM-P may extend along a first direction DR1 or a second direction DR2. Figure 6 As shown, when viewed in a plane, the panel alignment mark ALM-P can have a "T" shape. The panel alignment mark ALM-P can have a shape corresponding to the circuit alignment mark ALM-C, and can be used as a mark for determining the position of the display panel DP, or as an identification mark for aligning the display panel DP and the flexible circuit board CF in the process of bonding the flexible circuit board CF to the display panel DP.

[0144] Figure 7A and Figure 7B This is an enlarged plan view showing a portion of a flexible circuit board according to an embodiment. Figure 8 This is an enlarged plan view showing a portion of the display panel according to an embodiment. Figure 9 This is a cross-sectional view showing a portion of the display device according to an embodiment. Figure 10A and Figure 10B This is a plan view showing a portion of the display device according to an embodiment. Figure 11 This is a plan view showing a portion of a display device according to another embodiment. Figure 7A and Figure 7B It shows Figure 6 The circuit pads and peripheral components of the flexible circuit board. Figure 8 It shows Figure 6 The display panel, display pad, and peripheral components. Figure 9 A cross-sectional view of the flexible circuit board and display panel combined is shown, corresponding to the view along... Figure 6 The cutting line intercepted by line II-II'. Figure 10A , Figure 10B and Figure 11 It is shown that Figure 6A plan view of the display panel and flexible circuit board bonded together in area AA.

[0145] Reference Figure 4 , Figure 6 and Figure 7A The flexible circuit board CF includes multiple circuit pads LD and circuit lines CL connected to the circuit pads LD. The multiple circuit pads LD can be disposed in the substrate pad region PA-CF. The multiple circuit pads LD can be disposed on the circuit substrate layer BL-F of the flexible circuit board portion FPC. Although for ease of description... Figure 7A and Figure 7B Components such as multiple circuit pads LDs disposed in the flexible circuit board CF are shown in solid lines, but the embodiments are not limited thereto. For example, the components disposed in the flexible circuit board CF may be disposed on the rear surface of the circuit substrate layer BL-F.

[0146] Multiple circuit pads LD can have a shape corresponding to multiple display pads SD disposed in the display panel DP. Multiple circuit pads LD can have a longitudinal axis extending diagonally between a first direction DR1 and a second direction DR2. Multiple circuit lines CL connected to the multiple circuit pads LD can also have a longitudinal axis extending diagonally.

[0147] Multiple circuit pads LD may include a left circuit pad LD-1 and a right circuit pad LD-2. The left circuit pad LD-1 is positioned at the center of the flexible circuit board portion FPC in the second direction DR2 and is arranged on the left side of the flexible circuit board portion FPC, symmetrically positioned relative to the center line CTL that penetrates the flexible circuit board CF in the first direction DR1. The right circuit pad LD-2 is arranged on the right side of the flexible circuit board portion FPC, relative to the center line CTL. The left circuit pad LD-1 and the right circuit pad LD-2 may be symmetrical relative to the center line CTL.

[0148] Multiple circuit pads LD include base pads LD-PD1 and LD-PD2 arranged on the second direction DR2, and additional pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22. Base pads LD-PD1 and LD-PD2 can be input pads SD-PD1 and SD-PD2 electrically connected to the display panel DP (see...). Figure 8 The pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22 are used to provide electrical signals to the display panel DP for driving the display panel DP. Additional pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22 can be window pads SD-WM1 and SD-WM2 (see [link to product details]) electrically connected to the display panel DP. Figure 8 ) and panel dummy pads SD-DM1 and SD-DM2 (see Figure 8The pads are designed to provide essentially no signal. However, embodiments of the invention are not limited thereto. For example, additional pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22 of the plurality of circuit pads LD can also provide predetermined signals for driving and testing the display module DM.

[0149] The base pads LD-PD1 and LD-PD2 of the multiple circuit pads LD may include a left base pad LD-PD1 disposed on the left side of the flexible circuit board portion FPC relative to the center line CTL, and a right base pad LD-PD2 disposed on the right side of the flexible circuit board portion FPC relative to the center line CTL. Although for convenience, Figure 7A Only one left base pad LD-PD1 and one right base pad LD-PD2 are shown, but each of the left base pads LD-PD1 and right base pads LD-PD2 can be configured as multiple. Additional pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22 of the multiple circuit pads LD may include left additional pads LD-DM11 and LD-DM12 positioned relative to the center line CTL on the left side of the flexible circuit board portion FPC, and right additional pads LD-DM21 and LD-DM22 positioned relative to the center line CTL on the right side of the flexible circuit board portion FPC. Left additional pads LD-DM11 and LD-DM12 may include a first left additional pad LD-DM11 and a second left additional pad LD-DM12, and right additional pads LD-DM21 and LD-DM22 may include a first right additional pad LD-DM21 and a second right additional pad LD-DM22.

[0150] The circuit lines CL connected to the circuit pads LD include output lines CL11 and CL21 connected to the base pads LD-PD1 and LD-PD2, and additional circuit lines CL12, CL13, CL22, and CL23 connected to the additional pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22. Output lines CL11 and CL21 may include a left output line CL11 and a right output line CL21. The left output line CL11 is positioned relative to the center line CTL on the left side of the flexible circuit board portion FPC and connected to the left base pad LD-PD1. The right output line CL21 is positioned relative to the center line CTL on the right side of the flexible circuit board portion FPC and connected to the right base pad LD-PD2. Additional circuit lines CL12, CL13, CL22, and CL23 may include left additional circuit lines CL12 and CL13 and right additional circuit lines CL22 and CL23. Left additional circuit lines CL12 and CL13 are positioned on the left side of the flexible circuit board portion FPC relative to the center line CTL and are connected to left additional pads LD-DM11 and LD-DM12. Right additional circuit lines CL22 and CL23 are positioned on the right side of the flexible circuit board portion FPC relative to the center line CTL and are connected to right additional pads LD-DM21 and LD-DM22.

[0151] At least one of the additional circuit lines CL12, CL13, CL22, and CL23 includes a first portion connected to the additional pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22, and a second portion spaced apart from the first portion in the longitudinal direction of the additional circuit lines CL12, CL13, CL22, and CL23. In an embodiment, the first left additional circuit line CL12 connected to the first left additional pad LD-DM11 and the first right additional circuit line CL22 connected to the first right additional pad LD-DM21 may include the first portion and the second portion. The first left additional circuit line CL12 may include a first left portion CL12-1 connected to the first left additional pad LD-DM11 and a second left portion CL12-2 spaced apart from the first left portion CL12-1 in the longitudinal direction of the circuit line. The first right additional circuit line CL22 may include a first right portion CL22-1 connected to the first right additional pad LD-DM21 and a second right portion CL22-2 spaced apart from the first right portion CL22-1 in the longitudinal direction of the circuit line. The additional pad to which the additional circuitry of the first and second parts is connected can be referred to as a "dummy pad". Furthermore, the additional circuitry connected to the "dummy pad" can be referred to as a "dummy circuitry".

[0152] and Figure 7AAs shown, among the additional circuit lines CL12, CL13, CL22, and CL23, the second left additional circuit line CL13 connected to the second left additional pad LD-DM12 may include a first portion and a second portion spaced apart from the first portion. Similarly, among the additional circuit lines CL12, CL13, CL22, and CL23, the second right additional circuit line CL23 connected to the second right additional pad LD-DM22 may include a first portion and a second portion spaced apart from the first portion. Alternatively, each of all additional circuit lines CL12, CL13, CL22, and CL23 connected to the first left additional pad LD-DM11, the second left additional pad LD-DM12, the first right additional pad LD-DM21, and the second right additional pad LD-DM22 may include a first portion and a second portion spaced apart from the first portion.

[0153] Since at least one of the additional circuit lines CL12, CL13, CL22, and CL23 includes a first portion and a second portion, a predetermined line gap (or “gap”) CL-G can be defined between the first portion and the second portion. For example... Figure 7A As shown, the first left additional circuit line CL12 may include a first left portion CL12-1 connected to the first left additional pad LD-DM11 and a second left portion CL12-2 spaced apart from the first left portion CL12-1 in the longitudinal direction of the circuit line, and a predetermined line gap CL-G may be defined between the first left portion CL12-1 and the second left portion CL12-2. The first right additional circuit line CL22 may include a first right portion CL22-1 connected to the first right additional pad LD-DM21 and a second right portion CL22-2 spaced apart from the first right portion CL22-1 in the longitudinal direction of the circuit line, and a predetermined line gap CL-G may be defined between the first right portion CL22-1 and the second right portion CL22-2. The distance d2 between the first and second portions defined by the predetermined line gap CL-G may be greater than the length d1 of the first portion of each additional circuit line. In a particular embodiment, the length d1 of the first portion of the additional circuit line may be about 0.2 micrometers, and the distance d2 between the first and second portions may be about 0.3 micrometers.

[0154] Since at least one of the additional circuit lines CL12, CL13, CL22, and CL23 includes a first part and a second part, a reference point, which may be in the form of reference marks FM1 and FM2, can be defined at the end of the first part or the end of the second part. Figure 7AAs shown, a left reference mark FM1 can be defined at the end of the first left portion CL12-1 of the first left auxiliary circuit line CL12, and a right reference mark FM2 can be defined at the end of the first right portion CL22-1 of the first right auxiliary circuit line CL22. In the state where the flexible circuit board CF is not attached to the display panel DP, the left reference mark FM1 and the right reference mark FM2 can be defined at substantially symmetrical positions relative to the center line CTL.

[0155] Since at least one of the additional circuit lines CL12, CL13, CL22, and CL23 connected to the additional pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22 includes a first portion and a second portion, the end of the first portion or the end of the second portion can be used as a reference mark. Specifically, one of the left additional circuit lines CL12 and CL13 located on the left side and one of the right additional circuit lines CL22 and CL23 located on the right side can include the first portion and the second portion, and therefore can include the left reference mark FM1 and the right reference mark FM2. Therefore, in the process of bonding the flexible circuit board to the display panel, the degree of elongation of the flexible circuit board (i.e., the elongation rate of the flexible circuit board) can be easily and accurately measured by using the left reference mark FM1 and the right reference mark FM2, thereby improving the reliability of the display device.

[0156] exist Figure 7AAlthough at least one of the additional circuit lines CL12, CL13, CL22, and CL23 includes a first portion and a second portion to define a line gap CL-G between the first portion and the second portion, embodiments of the invention are not limited thereto. For example, multiple line gaps may be defined in at least one of the additional circuit lines CL12, CL13, CL22, and CL23. For example, at least one of the additional circuit lines CL12, CL13, CL22, and CL23 may include a first portion, a second portion, and a third portion, and a line gap may be defined between the first portion and the second portion, and a line gap may be defined between the second portion and the third portion. The first left additional circuit line CL12 may include a first left portion connected to the first left additional pad LD-DM11, a second left portion spaced apart from the first left portion in the longitudinal direction of the circuit line, and a third left portion spaced apart from the second left portion in the longitudinal direction of the circuit line. Here, predetermined line gaps may be defined between the first left portion and the second left portion, and between the second left portion and the third left portion, respectively. The first right auxiliary circuit line CL22 may include a first right portion connected to the first right auxiliary pad LD-DM21, a second right portion spaced apart from the first right portion in the longitudinal direction of the circuit line, and a third right portion spaced apart from the second right portion in the longitudinal portion of the circuit line. Here, predetermined line gaps may be defined between the first and second right portions and between the second and third right portions, respectively. Since multiple line gaps are defined in at least one of the auxiliary circuit lines CL12, CL13, CL22, and CL23, multiple reference marks may be provided in the lines in which multiple line gaps are defined. For example, in the first left auxiliary circuit line CL12 including the first left portion, the second left portion, and the third left portion, two or more reference marks may be defined at each end of the first left portion, the second left portion, and the third left portion. Similarly, in the first right auxiliary circuit line CL22 including the first right portion, the second right portion, and the third right portion, two or more reference marks may be defined at each end of the first right portion, the second right portion, and the third right portion.

[0157] The flexible circuit board portion (FPC) may also include markings in the form of circuit alignment marks (ALM-C). The circuit alignment marks (ALM-C) may include a left circuit alignment mark (ALM-C1) and a right circuit alignment mark (ALM-C2), with the left circuit alignment mark (ALM-C1) positioned on the left side of the flexible circuit board portion (FPC) relative to the center line (CTL), and the right circuit alignment mark (ALM-C2) positioned on the right side of the flexible circuit board portion (FPC) relative to the center line (CTL).

[0158] Figure 7B It shows Figure 7A A modified example of a flexible circuit board. In the following text, referencing... Figure 7BIn describing flexible circuit boards, the same reference numerals will be assigned to those already in use. Figure 7A The construction described in the description will be omitted to avoid redundancy.

[0159] Reference Figure 7B The flexible circuit board portion (FPC) may also include markings in the form of reference marks FM-PP. Reference marks FM-PP1 and FM-PP2 disposed in the flexible circuit board portion (FPC) may not be defined by cut-off portions on the circuit lines, but may be configured as at least one pattern disposed between the additional circuit lines CL12, CL13, CL22, and CL23 and the circuit alignment mark ALM-C. Reference marks FM-PP1 and FM-PP2 may include a left reference mark FM-PP1 disposed between the left additional circuit lines CL12 and CL13 and the left circuit alignment mark ALM-C1, and a right reference mark FM-PP2 disposed between the right additional circuit lines CL22 and CL23 and the right circuit alignment mark ALM-C2. Figure 7B In the diagram, when viewed in a plane, each of the left reference marker FM-PP1 and the right reference marker FM-PP2 has a generally rectangular shape, but is not limited to this. For example, each of the left reference marker FM-PP1 and the right reference marker FM-PP2 can have an unrestricted shape, as long as the reference markers are used as markers for measuring the elongation of the flexible circuit board. For example, each of the left reference marker FM-PP1 and the right reference marker FM-PP2 can have a generally circular shape or a generally triangular shape.

[0160] Reference Figure 4 and Figures 6 to 8 The display panel DP includes multiple display pads SD. The multiple display pads SD can be disposed on the substrate BL of the display panel DP. The multiple display pads SD can be disposed in the pad area PA of the display panel DP.

[0161] Each of the multiple display pads SD can have a shape corresponding to one of the circuit pads LD disposed in the flexible circuit board CF. The multiple display pads SD can extend in a diagonal direction between a first direction DR1 and a second direction DR2. That is, the longitudinal direction of the multiple display pads SD can be substantially the same as the longitudinal direction of the circuit pad LD. Signal lines SGL, such as data lines DL and control signal lines CSL, can be connected to the multiple display pads SD, and the longitudinal direction of the signal lines SGL can also be in a diagonal direction.

[0162] A panel centerline CTL' can be defined on the display panel DP, corresponding to the centerline CTL defined on the flexible circuit board portion FPC. Multiple display pads SD can include a left display pad SD-1 located to the left of the display panel DP relative to the panel centerline CTL', and a right display pad SD-2 located to the right of the display panel DP relative to the panel centerline CTL'. The left display pad SD-1 and the right display pad SD-2 can be substantially symmetrical to each other with respect to the panel centerline CTL'.

[0163] Multiple display pads SD may include input pads SD-PD1 and SD-PD2, window pads SD-WM1 and SD-WM2, and panel dummy pads SD-DM1 and SD-DM2 arranged on the second direction DR2. Input pads SD-PD1 and SD-PD2 may be electrically connected to the base pads LD-PD1 and LD-PD2 of the flexible circuit board portion FPC, and window pads SD-WM1 and SD-WM2 and panel dummy pads SD-DM1 and SD-DM2 may be electrically connected to the dummy pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22 of the flexible circuit board portion FPC.

[0164] The input pads SD-PD1 and SD-PD2 of the multiple display pads SD may include a left input pad SD-PD1 positioned on the left side of the display panel DP relative to the panel center line CTL' and a right input pad SD-PD2 positioned on the right side of the display panel DP relative to the panel center line CTL'. Although for convenience, Figure 8 Only one left input pad SD-PD1 and one right input pad SD-PD2 are shown, but each of the left input pad SD-PD1 and right input pad SD-PD2 can be configured as multiple. The multiple display pads SD's window pads SD-WM1 and SD-WM2 may include a left window pad SD-WM1 positioned on the left side of the display panel DP relative to the panel center line CTL' and a right window pad SD-WM2 positioned on the right side of the display panel DP relative to the panel center line CTL'. The multiple display pads SD's panel dummy pads SD-DM1 and SD-DM2 may include a left panel dummy pad SD-DM1 positioned on the left side of the display panel DP relative to the panel center line CTL' and a right panel dummy pad SD-DM2 positioned on the right side of the display panel DP relative to the panel center line CTL'.

[0165] The signal lines SGL include data lines SGL11 and SGL21 connected to input pads SD-PD1 and SD-PD2, and dummy lines SGL12, SGL13, SGL22, and SGL23 connected to window pads SD-WM1 and SD-WM2 and panel dummy pads SD-DM1 and SD-DM2. Data lines SGL11 and SGL21 may include a left data line SGL11 positioned to the left of the display panel DP relative to the panel center line CTL', and a right data line SGL21 positioned to the right of the display panel DP relative to the panel center line CTL'. Dummy lines SGL12, SGL13, SGL22, and SGL23 may include left dummy lines SGL12 and SGL13 positioned to the left of the display panel DP relative to the panel center line CTL', and right dummy lines SGL22 and SGL23 positioned to the right of the display panel DP relative to the panel center line CTL'.

[0166] The display panel DP may also include panel alignment marks ALM-P. Panel alignment marks ALM-P may include a left panel alignment mark ALM-P1 located on the left side of the display panel DP relative to the panel center line CTL' and a right panel alignment mark ALM-P2 located on the right side of the display panel DP relative to the panel center line CTL'.

[0167] Reference points SM1 and SM2 can be defined on the panel alignment mark ALM-P. The panel alignment mark ALM-P may have a "T" shape in which a portion extending in the second direction DR2 protrudes from the middle of said portion along the first direction DR1, and reference points SM1 and SM2 may be defined at the recessed points of the "T" shape. The display panel DP may include a first reference point SM1 defined at the left panel alignment mark ALM-P1 and a second reference point SM2 defined at the right panel alignment mark ALM-P2. When measuring the elongation of the flexible circuit board during the process of bonding the flexible circuit board to the display panel, the reference points SM1 and SM2 defined at the panel alignment mark ALM-P can provide reference points for the positional coordinates of the reference marks.

[0168] Reference Figure 4 , Figures 6 to 9 In the cross-section where the display panel DP and the flexible circuit board CF are bonded together by a conductive adhesive film ACF, multiple display pads SD disposed in the display panel DP and multiple circuit pads LD disposed in the flexible circuit board CF can be positioned at corresponding locations. Multiple conductive balls CB can be placed between the multiple display pads SD and the multiple circuit pads LD to electrically connect the multiple display pads SD to the multiple circuit pads LD.

[0169] The base pads LD-PD1 and LD-PD2 can be electrically connected to the input pads SD-PD1 and SD-PD2 via multiple conductive balls CB, and the dummy pads LD-DM11, LD-DM12, LD-DM21 and LD-DM22 can be electrically connected to the window pads SD-WM1 and SD-WM2 and the panel dummy pads SD-DM1 and SD-DM2 via multiple conductive balls CB.

[0170] exist Figure 9 Although the panel alignment mark ALM-P disposed in the display panel DP and the circuit alignment mark ALM-C disposed in the flexible circuit board portion FPC are shown as not corresponding to each other in a cross-section where the display panel DP and the flexible circuit board CF are joined together, embodiments of the invention are not limited thereto. For example, since the panel alignment mark ALM-P and the circuit alignment mark ALM-C correspond to each other in cross-section, at least a portion of the panel alignment mark ALM-P and the circuit alignment mark ALM-C can be superimposed on each other. The panel alignment mark ALM-P and the circuit alignment mark ALM-C can have corresponding shapes to align the display panel DP with the flexible circuit board CF when the flexible circuit board CF and the display panel DP are joined together.

[0171] Multiple display pads (SDs) disposed within the display panel (DP) can have substantially the same thickness. That is, the input pads SD-PD1 and SD-PD2, the window pads SD-WM1 and SD-WM2, and the panel dummy pads SD-DM1 and SD-DM2 disposed within the multiple display pads SD can have substantially the same thickness and can be formed using the same process. The input pads SD-PD1 and SD-PD2, the window pads SD-WM1 and SD-WM2, and the panel dummy pads SD-DM1 and SD-DM2 can contain the same metal and can be patterned together using the same process.

[0172] Multiple circuit pads (LDs) disposed within the flexible printed circuit board (FPC) portion can have substantially the same thickness. That is, the base pads LD-PD1 and LD-PD2, as well as the dummy pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22 disposed within the FPC portion can have substantially the same thickness and can be formed using the same process. The base pads LD-PD1 and LD-PD2, as well as the dummy pads LD-DM11, LD-DM12, LD-DM21, and LD-DM22, can contain the same metal and can be patterned together using the same process.

[0173] Each of the panel alignment mark ALM-P and circuit alignment mark ALM-C can have a thickness smaller than that of each of the pads disposed in the display panel DP and the flexible circuit board CF. When the display panel DP and the flexible circuit board CF are bonded together, each of the panel alignment mark ALM-P and circuit alignment mark ALM-C can have only the minimum thickness required for alignment and can be substantially non-protruding. However, embodiments of the invention are not limited thereto. For example, each of the panel alignment mark ALM-P and circuit alignment mark ALM-C can have a thickness substantially the same as that of each of the pads disposed in the display panel DP and the flexible circuit board CF.

[0174] Reference Figure 4 , Figures 6 to 9 and Figure 10A In the state where the display panel DP and the flexible circuit board CF are bonded together, the multiple reference marks FM1' and FM2' defined in the dummy circuit lines CL12 and CL22 may not be parallel to each other in the second direction DR2. That is, the left reference mark FM1' defined in the first left dummy circuit line CL12 and the right reference mark FM2' defined in the first right dummy circuit line CL22 may not be parallel to each other in the second direction DR2. The left reference mark FM1' and the right reference mark FM2' may not be superimposed on each other in the second direction DR2. When the flexible circuit board CF and the display panel DP are bonded together, in the process of bonding the circuit substrate layer BL-F, which is disposed in the flexible circuit board CF and contains flexible material, the left reference mark FM1' and the right reference mark FM2' may be elongated by heat and pressure, and therefore may not be parallel to each other in the second direction DR2.

[0175] However, embodiments of the invention are not limited thereto. For example, refer to... Figure 10B In the state where the display panel DP and the flexible circuit board CF are bonded together, multiple reference marks FM1 and FM2 defined in dummy circuit lines CL12 and CL22 can be parallel to each other in the second direction DR2. That is, the left reference mark FM1 defined in the first left dummy circuit line CL12 and the right reference mark FM2 defined in the first right dummy circuit line CL22 can be parallel to each other in the second direction DR2. The left reference mark FM1 and the right reference mark FM2 can be stacked on top of each other in the second direction DR2. When the flexible circuit board CF and the display panel DP are bonded together, in the process of bonding the circuit substrate layer BL-F, which is disposed in the flexible circuit board CF and contains flexible material, the left reference mark FM1 and the right reference mark FM2 can be elongated by the heat and pressure applied in the bonding process. However, the elongation rate of the circuit substrate layer BL-F can be calculated to compensate for and design so that the left reference mark FM1 and the right reference mark FM2 can be parallel to each other in the second direction DR2.

[0176] Reference Figure 4 , Figure 6 and Figure 11 The multiple display pads SD set in the display panel DP, the circuit pads LD set in the flexible circuit board section FPC, and the multiple lines connected to the pads can not extend in a diagonal direction, but extend substantially parallel to the first direction DR1.

[0177] Panel alignment marks ALM-P1' and ALM-P2' disposed on the substrate BL of the display panel DP may have a structure in which a portion of one portion has a "T" shape in a plane. Panel alignment marks ALM-P1' and ALM-P2' may include a left panel alignment mark ALM-P1' disposed on the left side of the display panel DP and a right panel alignment mark ALM-P2' disposed on the right side of the display panel DP. Reference points SM1' and SM2' may be defined on panel alignment marks ALM-P1' and ALM-P2'. When measuring the elongation of the flexible circuit board during the process of bonding the flexible circuit board to the display panel, reference points SM1' and SM2' defined at panel alignment marks ALM-P1' and ALM-P2' can provide points for use as positional coordinates of the reference marks. Circuit alignment marks superimposed on at least a portion of panel alignment marks ALM-P1' and ALM-P2' may be disposed on the circuit substrate layer BL-F of the flexible circuit board portion FPC.

[0178] Similar to the description above, in the dummy pads connected to the window pads SD-WM1' and SD-WM2' of the flexible circuit board portion FPC, each of the dummy circuit lines connected to the dummy pads may include a first portion and a second portion spaced apart from the first portion. Therefore, reference marks FM1-1 and FM2-1 can be defined at the ends of the first portions of each of the dummy circuit lines CL12' and CL22'. More specifically, the left reference mark FM1-1 can be defined at the end of the first portion of the left dummy circuit line CL12', and the right reference mark FM2-1 can be defined at the end of the first portion of the right dummy circuit line CL22'. Therefore, in the process of integrating the flexible circuit board into the display panel, the degree of elongation of the flexible circuit board (i.e., the elongation rate of the flexible circuit board) can be easily and accurately measured using reference marks FM1-1 and FM2-1 to improve the reliability of the display device. The dummy circuit lines CL12' and CL22', defined by reference numerals FM1-1 and FM2-1, may extend in a direction substantially parallel to the first direction DR1. An example method for manufacturing the display device will be described below with reference to the accompanying drawings.

[0179] Figure 12 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment. Figure 13This is a flowchart illustrating a portion of the process of a method for manufacturing a display device according to an embodiment. Figure 13 This is a flowchart illustrating the process of pressing a display panel and a flexible circuit board, and the process of measuring the elongation of the flexible circuit board in a method for manufacturing a display device according to an embodiment.

[0180] Reference Figure 12 The method for manufacturing a display device includes a process for preparing a display panel (S100), a process for preparing a flexible circuit board (S200), a process for pressing the display panel and the flexible circuit board (S300), and a process for measuring the elongation of the flexible circuit board (S400). In the process for measuring the elongation of the flexible circuit board (S400), the distance between a plurality of reference marks set in the flexible circuit board is measured.

[0181] Reference Figure 4 , Figures 6 to 9 , Figure 10A , Figure 10B and Figure 12 The flexible circuit board CF includes multiple circuit pads LD. The flexible circuit board CF includes at least one reference mark. For example, as... Figure 7A As shown, in the flexible circuit board CF, the first left dummy circuit line CL12 may include a first left portion CL12-1 connected to the first left dummy pad LD-DM11 and a second left portion CL12-2 spaced apart from the first left portion CL12-1 in the longitudinal direction of the circuit line, and the first right dummy circuit line CL22 may include a first right portion CL22-1 connected to the first right dummy pad LD-DM21 and a second right portion CL22-2 spaced apart from the first right portion CL22-1 in the longitudinal direction of the circuit line. A left reference mark FM1 may be defined on the end of the first left portion CL12-1 of the first left dummy circuit line CL12, and a right reference mark FM2 may be defined on the end of the first right portion CL22-1 of the first right dummy circuit line CL22. Alternatively, as Figure 7B As shown, the flexible circuit board CF may include a left reference mark FM-PP1 disposed between the left dummy circuit lines CL12 and CL13 and the left circuit alignment mark ALM-C1, and a right reference mark FM-PP2 disposed between the right dummy circuit lines CL22 and CL23 and the right circuit alignment mark ALM-C2.

[0182] The display panel DP may include multiple display pads SD and panel alignment marks ALM-P, and may define reference points SM1 and SM2 on the panel alignment marks ALM-P. The display panel DP may include a first reference point SM1 defined at the left panel alignment mark ALM-P1 and a second reference point SM2 defined at the right panel alignment mark ALM-P2.

[0183] In the process of pressing the display panel and the flexible circuit board (S300), multiple circuit pads LD disposed in the flexible circuit board CF and multiple display pads SD disposed in the display panel DP can be bonded to each other through the conductive adhesive film ACF and then electrically connected to each other.

[0184] Reference Figure 13 The process of pressing the display panel and the flexible circuit board (S300) can include a first pressing process (S310) of pressing the display panel and the flexible circuit board together with a first pressure and a second pressing process (S320) of pressing the display panel and the flexible circuit board together with a second pressure. The second pressure can be higher than the first pressure. Heat with a first temperature can be applied in the first pressing process (S310), and heat with a second temperature can be applied in the second pressing process (S320). The second temperature can be higher than the first temperature. That is, the process of pressing the display panel and the flexible circuit board (S300) can include a process of pressing the display panel and the flexible circuit board primarily at a higher temperature after a process of pre-pressing the display panel and the flexible circuit board at a lower temperature. After the second pressing process (S320), the display panel and the flexible circuit board can be fully bonded together.

[0185] The process for measuring the elongation of a flexible circuit board (S400) may include a primary distance measurement process (S410) measuring the distance between multiple reference marks, a secondary distance measurement process (S420) measuring the distance between multiple reference marks, and a process for comparing the primary and secondary measured distances (S430). The primary distance measurement process (S410) may be performed after the first pressing process (S310) and before the second pressing process (S320). The secondary distance measurement process (S420) may be performed after the second pressing process (S320).

[0186] Figure 14A and Figure 14B This is a plan view illustrating a portion of the process of a method for manufacturing a display device according to an embodiment. Figure 14A The process status is shown when a distance is measured once after the first pressing process. Figure 14B The state of the process of measuring the secondary distance after the second pressing process is shown.

[0187] Reference Figure 13 and Figure 14AAfter the first pressing process (S310), in a distance measurement process (S410), the distance between reference marks FM1 and FM2 set in the flexible circuit board can be measured. When measuring the distance, a first distance L1 between the left reference mark FM1 defined in the first left dummy circuit line CL12 and the right reference mark FM2 defined in the first right dummy circuit line CL22 can be measured.

[0188] Reference Figure 13 and Figure 14B Following the second pressing process (S320), in the secondary distance measurement process (S420), the distance between reference marks FM1' and FM2' set in the flexible circuit board can be measured. When measuring the secondary distance, a second distance L2 can be measured between the left reference mark FM1' defined in the first left dummy circuit line CL12 and the right reference mark FM2' defined in the first right dummy circuit line CL22.

[0189] When measuring the second distance L2, it can be easily determined based on reference points SM1 and SM2 defined in panel alignment marks ALM-P1 and ALM-P2. After the second pressing process (S320), the positions of reference marks FM1' and FM2' may change relatively significantly due to the elongation of the flexible circuit board, but the positions of panel alignment marks ALM-P1 and ALM-P2 set in the display panel may change only slightly. Therefore, by using reference points SM1 and SM2 defined in panel alignment marks ALM-P1 and ALM-P2 as starting points and by coordinateizing the positions of reference marks FM1' and FM2', the second distance L2 between reference marks FM1' and FM2' can be easily measured by coordinate calculation.

[0190] The first distance L1 and the second distance L2 are different from each other. Because low pressure and low temperature heat are applied in the first pressing process (S310), the deformation of the flexible circuit board can be relatively small. Therefore, the positions of the reference marks FM1 and FM2 set in the flexible circuit board can remain largely unchanged with respect to their initially aligned positions. However, after the second pressing process (S320) in which high temperature and high pressure are applied, the positions of the reference marks FM1' and FM2' may change relatively significantly; therefore, the second distance L2 may differ from the first distance L1.

[0191] In an example method for manufacturing a display device, a cut portion can be formed in the dummy circuit lines of the flexible circuit board, and one end of the cut dummy circuit line can be used as a reference mark. Alternatively, a reference mark formed in a predetermined pattern between the dummy line and the circuit alignment mark can be provided to easily and accurately measure the elongation of the flexible circuit board. More specifically, in the example method for manufacturing a display device, a reference mark located on the flexible circuit board that can calculate coordinates based on a reference point of the panel alignment mark can be provided to easily and accurately measure the elongation compared to the elongation based on the circuit pad. Therefore, when manufacturing a display device, the elongation of the flexible circuit board can be accurately measured to improve the reliability of the display device manufactured by the manufacturing method according to the principles and embodiments of the invention.

[0192] The elongation of the flexible circuit board, which includes a flexible circuit substrate layer, can be accurately measured during the process of bonding the flexible circuit board to the display panel. This allows for the design of the display device taking into account the elongation of the flexible circuit board, thereby improving the reliability of the display device manufactured by the method described above.

[0193] Although certain embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those skilled in the art.

Claims

1. A display device, the display device comprising: A display panel includes a plurality of display pads, at least some of which extend in a first direction and are arranged in a second direction intersecting the first direction; as well as A flexible circuit board includes multiple circuit pads and multiple circuit lines, wherein at least some of the multiple circuit pads are electrically connected to the multiple display pads, and the multiple circuit lines are connected to the multiple circuit pads. The plurality of circuit pads includes at least one dummy pad, and The plurality of circuit lines includes dummy circuit lines, at least a portion of which is connected to the at least one dummy pad. The dummy circuit line includes: a first portion connected to the at least one dummy pad; and a second portion spaced apart from the first portion by a certain gap. The flexible circuit board further includes reference marks defined at the end of the first portion, and the elongation of the flexible circuit board is measured by measuring the distance between the reference marks.

2. The display device according to claim 1, wherein The display panel also includes a first mark configured to overlap the plurality of display pads in the second direction.

3. The display device according to claim 1, wherein The flexible circuit board also includes a second mark, at least a portion of which is configured to overlap with the plurality of circuit pads in the second direction.

4. The display device according to claim 1, wherein The plurality of circuit pads also include a plurality of base pads configured to overlap with the at least one dummy pad in the second direction. The plurality of display pads include: a window pad or panel dummy pad electrically connected to the at least one dummy pad; and an input pad electrically connected to the plurality of base pads.

5. The display device according to claim 1, wherein The first part has a length smaller than the distance between the first part and the second part.

6. The display device according to claim 1, wherein The flexible circuit board further includes a circuit substrate layer, and the plurality of circuit pads and the plurality of circuit lines are disposed on the circuit substrate layer. The circuit substrate layer includes a flexible material.

7. The display device according to claim 1, wherein The at least one dummy pad includes: A left dummy pad is disposed on the left side of the flexible circuit board, symmetrically positioned relative to a center line that runs through the flexible circuit board in the first direction; and A right-side dummy pad is positioned on the right side of the flexible circuit board relative to the center line. The dummy circuit line includes: a left dummy circuit line, comprising a first left portion connected to the left dummy pad and a second left portion spaced apart from the first left portion by a first gap; and a right dummy circuit line, comprising a first right portion connected to the right dummy pad and a second right portion spaced apart from the first right portion by a second gap.

8. The display device of claim 7, wherein, The ends of the first left portion and the first right portion do not overlap each other in the second direction.

9. A display device, the display device comprising: A display panel includes a plurality of display pads, at least some of which extend in a first direction and are arranged in a second direction intersecting the first direction; as well as The flexible circuit board is electrically connected to the display panel. The flexible circuit board includes: Multiple circuit pads, including a base pad electrically connected to the multiple display pads and at least one dummy pad disposed adjacent to the base pad; Multiple circuit lines, including dummy circuit lines connected to the at least one dummy pad; The first mark is disposed adjacent to the plurality of circuit lines; and A reference point is set on the dummy circuit line or between the dummy circuit line and the first mark, and The elongation of the flexible circuit board is measured by measuring the distance between the reference points.

10. A method for manufacturing a display device, the method comprising the following steps: Prepare a display panel having a display area configured to display an image and a non-display area adjacent to the display area, and including a plurality of display pads and a first mark disposed in the non-display area; Prepare a flexible circuit board, the flexible circuit board including a plurality of circuit pads, a plurality of circuit lines connected to the plurality of circuit pads, a second mark disposed adjacent to the plurality of circuit lines, and a plurality of reference points disposed on at least one of the plurality of circuit lines or between two of the plurality of circuit lines and the second mark; The display panel and the flexible circuit board are pressed together, such that at least a portion of the plurality of circuit pads are electrically connected to the plurality of display pads; as well as The ratio of the stretch of the flexible circuit board during pressing is measured by measuring the distance between the plurality of reference points.

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