Display panel and display device

Abstract

The present application discloses a display panel and a display device. The display panel disclosed in the present application includes a substrate, a first flexible layer, a thin film transistor structure layer, a light-emitting functional layer, an opening and a first inorganic layer. The first flexible layer is arranged on the substrate, the thin film transistor structure layer is arranged on the side of the first flexible layer away from the substrate, and the thin film transistor structure layer is located in the display area, the light-emitting functional layer is located on the side of the thin film transistor structure layer away from the first flexible layer, the opening is located in the non-display area, and the opening runs through the first flexible layer, the thin film transistor structure layer and the light-emitting functional layer, the first inorganic layer is arranged on the side of the light-emitting functional layer away from the thin film transistor structure layer, and the first inorganic layer at least covers the side wall of the opening. The display panel disclosed in the present application is used to improve the problem of forming hole black spots at the camera opening of the display panel due to water and oxygen intrusion.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Flexible organic light-emitting diode display panels (OLED panels) have unique advantages in energy saving, color performance and portability, and are increasingly used in mobile phones, laptops, TVs and other fields.

[0003] At present, there are two solutions for installing cameras on the screen of OLED display panels, one is the under-screen camera, and the other is the screen hole. Among them, the screen hole is the mainstream technology. Since OLED display panels are very sensitive to water and oxygen, packaging technology is particularly important. Generally, flexible OLED display panels use inorganic / organic / inorganic flexible packaging technology. At the camera hole, the packaging structure is different from other positions, which makes it easy for water and oxygen to invade, forming a hole black spot at the camera hole.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above technical problems. Summary of the invention

[0005] Embodiments of the present application provide a display panel and a display device, which are used to improve the problem of black spots formed at the camera opening of the display panel due to water and oxygen intrusion.

[0006] An embodiment of the present application provides a display panel, the display panel having a display area and a non-display area, the non-display area including a through hole, and the display panel including:

[0007] substrate;

[0008] a first flexible layer, the first flexible layer being disposed on the substrate;

[0009] A thin film transistor structure layer, wherein the thin film transistor structure layer is arranged on a side of the first flexible layer away from the substrate, and the thin film transistor structure layer is located in the display area;

[0010] a light-emitting functional layer, wherein the light-emitting functional layer is located on a side of the thin-film transistor structure layer away from the first flexible layer;

[0011] An opening, wherein the opening is located in the non-display area, and the opening passes through the first flexible layer, the thin film transistor structure layer and the light-emitting functional layer;

[0012] A first inorganic layer, wherein the first inorganic layer is arranged on a side of the light-emitting functional layer away from the thin film transistor structure layer, the first inorganic layer at least covers the sidewalls of the opening, and the first inorganic layer covers the bottom of the opening.

[0013] In the display panel provided in the embodiment of the present application, the display panel further includes:

[0014] The second inorganic layer is arranged on a side of the first inorganic layer away from the light-emitting functional layer, and the second inorganic layer covers the first inorganic layer.

[0015] In the display panel provided in the embodiment of the present application, the display panel further includes:

[0016] The undercut structure is located in the non-display area and is disposed on the substrate. The undercut structure has an undercut space.

[0017] In the display panel provided in the embodiment of the present application, the first flexible layer corresponding to the non-display area includes at least two grooves, and a portion between two adjacent grooves is defined as a convex portion;

[0018] The thin film transistor structure layer comprises a buffer layer, the buffer layer is arranged on a side of the first flexible layer away from the substrate, the buffer layer comprises a partition portion located in the non-display area; the convex portion and the partition portion located above the convex portion form the undercut structure;

[0019] The partition portion includes a suspended portion protruding from the raised portion, and the suspended portion and the side surface of the raised portion define the undercut space;

[0020] The groove is in communication with the undercut space.

[0021] In the display panel provided in the embodiment of the present application, the light-emitting functional layer includes an anode, a pixel definition layer, a light-emitting layer and a cathode arranged in sequence, the anode is electrically connected to the thin film transistor structure layer, and at least a portion of the light-emitting layer is confined within an opening of the pixel definition layer;

[0022] The light-emitting layer corresponding to the non-display area includes a first portion and a second portion, the first portion of the light-emitting layer and the second portion of the light-emitting layer are disconnected by the undercut space, the first portion of the light-emitting layer is located in the groove, and the second portion of the light-emitting layer is located on the partition portion;

[0023] The cathode corresponding to the non-display area includes a first part and a second part, the first part of the cathode and the second part of the cathode are disconnected by the undercut space, the first part of the cathode is located on the first part of the light-emitting layer, and the second part of the cathode is located on the second part of the light-emitting layer.

[0024] In the display panel provided by the embodiment of the present application, the first inorganic layer covers the groove and the undercut structure.

[0025] In the display panel provided in the embodiment of the present application, the groove includes a first groove and a second groove, the first groove is arranged on a side of the second groove away from the through hole, and the second groove is arranged on a side close to the through hole, and the display panel further includes:

[0026] an organic filling layer, wherein the organic filling layer fills the second groove;

[0027] An organic encapsulation layer is located between the first inorganic layer and the second inorganic layer, and the organic encapsulation layer fills the first groove.

[0028] In the display panel provided in the embodiment of the present application, the substrate includes:

[0029] Back panel;

[0030] a second flexible layer, the second flexible layer being disposed on the back plate;

[0031] The barrier layer is arranged on a side of the second flexible layer away from the back plate, and the through hole passes through the back plate, the second flexible layer and the barrier layer.

[0032] In the display panel provided in the embodiment of the present application, the opening width is greater than or equal to 30 micrometers.

[0033] An embodiment of the present application further provides a display device, which includes a touch unit and the above-mentioned display panel, wherein the touch unit is disposed on the display panel or integrated in the display panel.

[0034] The embodiment of the present application provides a display panel and a display device. The display panel provided by the embodiment of the present application includes a substrate, a first flexible layer, a thin film transistor structure layer, a light-emitting functional layer, an opening and a first inorganic layer. The first flexible layer is arranged on the substrate. The thin film transistor structure layer is arranged on the side of the first flexible layer away from the substrate, and the thin film transistor structure layer is located in the display area. The light-emitting functional layer is located on the side of the thin film transistor structure layer away from the first flexible layer. The opening is located in the non-display area, and the opening passes through the first flexible layer, the thin film transistor structure layer and the light-emitting functional layer. The first inorganic layer is arranged on the side of the light-emitting functional layer away from the thin film transistor structure layer, and the first inorganic layer at least covers the side wall of the opening. In the display panel provided by the embodiment of the present application, an opening is arranged on the side close to the through hole, and the opening passes through the first flexible layer, the thin film transistor structure layer and the light-emitting functional layer, and the first inorganic layer covers the side wall of the opening, which improves the problem of forming hole black spots at the through hole of the display panel due to the invasion of water and oxygen.

[0035] In order to make the above contents of the present application more clearly understood, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of the planar structure of a display panel provided in an embodiment of the present application;

[0037] Figure 2 For along Figure 1 A schematic diagram of a cross-sectional structure taken along line A-A';

[0038] Figure 3 for Figure 2 Enlarged view of area B;

[0039] Figure 4 A structural schematic diagram of a display device is provided for an embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. Please refer to the drawings in the accompanying drawings, in which the same component symbols represent the same components. The following description is based on the specific embodiments of the present application shown, which should not be construed as limiting other specific embodiments of the present application that are not described in detail herein. The word "embodiment" used in this specification means an example, an example or an illustration.

[0041] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0042] The embodiments of the present application provide a display panel and a display device. The following are detailed descriptions of each. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0043] Please combine Figure 1 , Figure 2 and Figure 3 ,in, Figure 1 A schematic diagram of the planar structure of a display panel provided in an embodiment of the present application. Figure 2 For along Figure 1 A schematic diagram of a cross-sectional structure taken along line A-A'. Figure 3 for Figure 2 An enlarged view of the B area in the middle. The embodiment of the present application provides a display panel, wherein the display panel 100 has a display area AA and a non-display area NA, wherein the non-display area NA is located on at least one side of the display area AA. The non-display area NA is provided with a through hole TH, and the through hole TH is used to set components such as a camera, an earpiece or a microphone.

[0044] It should be noted that, in some embodiments, the display area AA may be any one of one side, two sides, three sides or four sides of the non-display area NA. The embodiment of the present application is described by taking the display area AA surrounding the non-display area NA as an example, but is not limited to this.

[0045] The display panel 100 includes a substrate 101 , a first flexible layer 102 , a thin film transistor structure layer 103 , a light emitting functional layer 104 , an opening H, a first inorganic layer 105 , a second inorganic layer 106 , an undercut structure 108 , an organic filling layer 107 and an organic encapsulation layer 109 .

[0046] Specifically, the first flexible layer 102 is disposed on the substrate 101. The thin film transistor structure layer 103 is disposed on a side of the first flexible layer 102 away from the substrate 101, and the thin film transistor structure layer 103 is located in the display area AA. The light-emitting functional layer 104 is located on a side of the thin film transistor structure layer 103 away from the first flexible layer 102. The opening H is located in the non-display area NA, and the opening H penetrates the first flexible layer 102, the thin film transistor structure layer 103 and the light-emitting functional layer 104. The first inorganic layer 105 is disposed on a side of the light-emitting functional layer 104 away from the thin film transistor structure layer 103, and the first inorganic layer 105 at least covers the sidewall of the opening H. The second inorganic layer 106 is disposed on a side of the first inorganic layer 105 away from the light-emitting functional layer 104, and the second inorganic layer 106 covers the first inorganic layer 105. The undercut structure 108 is located in the non-display area NA, and the undercut structure 108 is disposed on the substrate 101, and the undercut structure 108 has an undercut space.

[0047] In the display panel 100 provided in the embodiment of the present application, an opening H is arranged on a side close to the through hole TH, and the opening H penetrates the first flexible layer 102, the thin film transistor structure layer 103 and the light-emitting functional layer 104, and the first inorganic layer 105 covers the side wall of the opening H, thereby improving the problem of black spots formed at the through hole TH of the display panel 100 due to water and oxygen intrusion.

[0048] It should be noted that the region where the through hole TH is located has a shape of, but not limited to, a circle. For example, the region also includes a shape of a quadrilateral, a triangle, an ellipse, or the like.

[0049] Furthermore, the first inorganic layer 105 covers the bottom of the opening H. In the embodiment of the present application, the first inorganic layer 105 is extended to the bottom of the opening H, so that the opening H is completely covered by the first inorganic layer 105, further blocking the invasion of water and oxygen from the side of the first flexible layer 102, thereby further improving the problem of forming hole black spots at the through hole TH of the display panel 100 due to the invasion of water and oxygen, and increasing the packaging life.

[0050] In some embodiments, the material of the first inorganic layer 105 may be SiO x 、SiN x or SiO x N y The material of the second inorganic layer 106 may be SiO x 、SiN x or SiO x N y At least one of .

[0051] The substrate 101 includes a back plate 101a, a second flexible layer 101b and a barrier layer 101c. The second flexible layer 101b is disposed on the back plate 101a. The barrier layer 101c is disposed on a side of the second flexible layer 101b away from the back plate 101a. The through hole TH penetrates the back plate 101a, the second flexible layer 101b and the barrier layer 101c.

[0052] The barrier layer 101c is used to prevent water and oxygen from penetrating through one side of the back plate 101a to the structure above the barrier layer 101c, thereby preventing damage to the display panel 100. The material of the barrier layer 101c includes but is not limited to silicon-containing oxides, nitrides or oxynitrides. For example, the material of the barrier layer 101c is SiO x 、SiN x or SiO x N y The material of the second flexible layer 101b may be the same as that of the first flexible layer 102, and may include at least one of PI (polyimide), PET (polyethylene phthalate), PEN (polyethylene naphthalate), PC (polycarbonate), PES (polyether sulfone), PAR (aromatic fluorotoluene containing polyarylate), or PCO (polycyclic olefin).

[0053] The first flexible layer 102 corresponding to the non-display area NA includes at least two grooves h, and the portion between two adjacent grooves h is defined as a convex portion 102a. The thin film transistor structure layer 103 includes a buffer layer 103a, which is arranged on a side of the first flexible layer 102 away from the substrate 101, and the buffer layer 103a includes a partition portion 103a1 located in the non-display area NA, and the convex portion 102a and the partition portion 103a1 located above the convex portion 102a form an undercut structure 108. The partition portion 103a1 includes a suspended portion 103a11 protruding from the convex portion 102a, and the side of the suspended portion 103a11 and the convex portion 102a define an undercut space 108a. Any groove h is connected to the undercut space 108a. The first inorganic layer 105 covers the groove h and the undercut structure 108.

[0054] The groove h includes a first groove h1 and a second groove h2, the first groove h1 is arranged on a side of the second groove h2 away from the through hole TH, the second groove h2 is arranged on a side close to the through hole TH, and the organic filling layer 107 fills the second groove h2. The organic encapsulation layer 109 is located between the first inorganic layer 105 and the second inorganic layer 106, and the organic encapsulation layer 109 fills the first groove h1.

[0055] It should be noted that, in some embodiments, the materials of the organic filling layer 107 and the organic encapsulation layer 109 can be selected from organic materials such as epoxy resin, polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyethylene (PE), polyacrylate, etc. The materials of the organic filling layer 107 and the organic encapsulation layer 109 can be the same or different.

[0056] The thin film transistor structure layer 103 may include a buffer layer 103a, an active layer 103b, a gate insulating layer 103c, a gate electrode 103d, an interlayer dielectric layer 103e, a source electrode 103f, a drain electrode 103g and a planarization layer 103h. The active layer 103b is disposed on the buffer layer 103a. The gate insulating layer 103c covers the active layer 103b and the buffer layer 103a. The gate electrode 103d is disposed on the gate insulating layer 103c. The source electrode 103f and the drain electrode 103g are electrically connected to the active layer 103b through vias, respectively. The planarization layer 103h covers the source electrode 103f and the drain electrode 103g.

[0057] The active layer 103b may be an oxide active layer of indium gallium zinc oxide (IGZO), zinc tin oxide (ZTO) or indium tin zinc oxide (ITZO), or a low temperature polycrystalline silicon (LTPS) active layer. The materials of the gate 103c, the source 103f, and the drain 103g include one or any combination of metals such as silver (Ag), magnesium (Mg), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum (Pt), tantalum (Ta), neodymium (Nd) or scandium (Sc), their alloys, their nitrides, etc. The materials of the gate insulating layer 103c and the interlayer dielectric layer 103e include one or any combination of silicon oxide, silicon nitride or silicon oxynitride. The material of the planarization layer 103h may be selected from silicon dioxide, nitrogen dioxide, silicon oxynitride and their stacks or organic materials, such as acrylic resin.

[0058] It should be noted that the thin film transistor structure layer 103 can be a bottom gate thin film transistor or a top gate thin film transistor, a single gate thin film transistor or a double gate thin film transistor. The present application embodiment is described by taking a top gate thin film transistor as an example, but is not limited thereto.

[0059] The light-emitting functional layer 104 includes an anode 104a, a pixel definition layer 104b, a light-emitting layer 104c and a cathode 104d arranged in sequence, and the anode 104a is electrically connected to the thin film transistor structure layer 103. At least a portion of the light-emitting layer 104c is confined in the opening of the pixel definition layer 104b. The light-emitting layer 104c corresponding to the non-display area NA includes a first portion 104c1 and a second portion 104c2, and the first portion 104c1 of the light-emitting layer 104c and the second portion 104c2 of the light-emitting layer 104c are disconnected by the undercut space 108a. The first portion 104c1 of the light-emitting layer 104c is located in the groove h, and the second portion 104c2 of the light-emitting layer 104c is located on the partition portion 103a. The cathode 104d corresponding to the non-display area NA includes a first portion 104d1 and a second portion 104d2, the first portion 104d1 of the cathode 104d and the second portion 104d2 of the cathode 104d are disconnected by the bottom cut space 108a, the first portion 104d1 of the cathode 104d is located on the first portion 104c1 of the light-emitting layer 104c, and the second portion 104d2 of the cathode 104d is located on the second portion 104c2 of the light-emitting layer 104c.

[0060] The material of the anode 104a may be indium tin oxide (ITO). The light-emitting layer 104c is formed by inkjet printing. The material of the light-emitting layer 104c may be an organic electroluminescent material commonly used in the art, such as a high molecular weight or low molecular weight organic photoluminescent or electroluminescent material, and a fluorescent and phosphorescent compound. The material of the cathode 104d may be at least one of silver or magnesium. The light-emitting functional layer 104 may also include other elements of the organic light-emitting device, such as a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0061] In the embodiment of the present application, an undercut structure 108 is provided at a portion corresponding to the non-display area NA. Since the cross section of the first flexible layer 102 cut out by the through hole TH is exposed, water vapor easily invades from the exposed cross section of the first flexible layer 102, causing the first inorganic layer 105 of the display panel 100 to fall off at the corner of the undercut structure 108. The further invasion of water vapor causes the display panel 100 to deteriorate and shrink. In the embodiment of the present application, an undercut structure 108 is provided at a portion corresponding to the non-display area, so that the light-emitting layer 104c is disconnected here, cutting off the invasion channel of water vapor from the light-emitting layer 104c.

[0062] It should be noted that the number of the undercut structures 108 in the embodiment of the present application is between 2 and 12. In some embodiments, the number of the undercut structures 108 may be any one of 2, 3, 6, 9, 11 or 12. In the embodiment of the present application, the number of the undercut structures 108 is set to between 2 and 12, so as to avoid the situation where the light-emitting layer 104c is not disconnected at the undercut space 108a when there is only one undercut structure 108, thereby causing the display panel 100 to fail.

[0063] In some embodiments, the width of the opening H is greater than or equal to 30 microns. For example, the width of the opening H can be any one of 30 microns, 35 microns, 40 microns, 45 microns, 50 microns, 55 microns, 60 microns, or 65 microns. In the embodiment of the present application, the width of the opening H is set to be greater than or equal to 30 microns to ensure the accuracy of cutting the opening H.

[0064] Please refer to Figure 2 , the display panel 100 provided in the embodiment of the present application may further include a retaining wall, which is located between the first groove h1 and the second groove h2. The retaining wall includes a protruding portion 102a, a partition portion 103a located on the protruding portion 102a, a planarization layer 103h located above the partition portion 103a, a pixel definition layer 104b located above the planarization layer 103h, a light-emitting layer 104c located above the pixel definition layer 104b, and a cathode 104d located above the light-emitting layer 104c. It should be understood that the retaining wall described in the embodiment of the present application can also be understood as an undercut structure. Moreover, the retaining wall has a higher height than the undercut structure 108. This design method can further extend the channel for water and oxygen invasion, thereby further improving the stability of the display panel 100.

[0065] In some embodiments, the undercut structure 108 may be an annular undercut structure, which includes at least a first undercut structure and a second undercut structure. The first undercut structure includes at least one first opening, and the first undercut structure is arranged around the through hole TH, and the second undercut structure includes at least one second opening, and the second undercut structure is arranged around the first undercut structure. Among them, at least a part of the second opening corresponds to the first opening, and this arrangement can reduce the gas discharge path and shorten the subsequent coating time. Alternatively, the second opening and the first opening are staggered, and this arrangement can extend the gas invasion path and effectively block the invasion of water and oxygen.

[0066] It should be noted that the display panel 100 can be an active light-emitting display panel, such as an organic light-emitting diode (OLED) display panel, an active matrix organic light-emitting diode (AMOLED) display panel, a passive matrix organic light-emitting diode (PMOLED) display panel, a quantum dot organic light-emitting diode (QLED) display panel, a micro light-emitting diode (Micro-LED) display panel, and a sub-millimeter light-emitting diode (Mini-LED) display panel.

[0067] Please refer to Figure 4 , Figure 4 The structure diagram of the display device provided in the embodiment of the present application. The display device 1000 includes a display panel and a touch unit 200, and the touch unit 200 is arranged on the display panel or integrated in the display panel. The display panel can be the display panel 100 described in the above embodiment, and the specific structure of the display panel 100 can refer to the description of the above embodiment, which will not be repeated here.

[0068] The touch control unit 200 may include an inorganic silicon layer 201, a touch control unit 202 and an organic flat layer 203. The touch control unit 202 is embedded in the inorganic silicon layer 201, which may be a double-layer structure, and the material of the touch control unit 202 may be a stacked structure of titanium, aluminum, and titanium. The touch control unit 200 is used to implement capacitive touch.

[0069] It should be noted that the display device 1000 provided in the embodiment of the present application may be a display device such as a mobile phone, a tablet, a laptop computer, and a television.

[0070] The embodiment of the present application provides a display panel and a display device. The display panel provided by the embodiment of the present application includes a substrate, a first flexible layer, a thin film transistor structure layer, a light-emitting functional layer, an opening and a first inorganic layer. The first flexible layer is arranged on the substrate. The thin film transistor structure layer is arranged on the side of the first flexible layer away from the substrate, and the thin film transistor structure layer is located in the display area. The light-emitting functional layer is located on the side of the thin film transistor structure layer away from the first flexible layer. The opening is located in the non-display area, and the opening penetrates the first flexible layer, the thin film transistor structure layer and the light-emitting functional layer. The first inorganic layer is arranged on the side of the light-emitting functional layer away from the thin film transistor structure layer, and the first inorganic layer at least covers the side wall of the opening. In the display panel provided by the embodiment of the present application, an opening is arranged on the side close to the through hole, and the first flexible layer, the thin film transistor structure layer and the light-emitting functional layer are penetrated by the opening, and the first inorganic layer covers the side wall of the opening, which improves the problem of forming hole black spots at the through hole of the display panel due to the invasion of water and oxygen.

[0071] In summary, although the present application has been disclosed as above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined in the claims.

Claims

1. A display panel, characterized in that: The display panel has a display area and a non-display area, the non-display area includes a through hole, and the display panel includes: substrate; a first flexible layer, wherein the first flexible layer is disposed on the substrate, and the first flexible layer corresponding to the non-display area comprises at least two grooves, and a portion between two adjacent grooves is defined as a convex portion; A thin film transistor structure layer, wherein the thin film transistor structure layer is arranged on a side of the first flexible layer away from the substrate, and the thin film transistor structure layer is located in the display area; a light-emitting functional layer, wherein the light-emitting functional layer is located on a side of the thin-film transistor structure layer away from the first flexible layer; An opening, wherein the opening is located in the non-display area and passes through the first flexible layer, the thin film transistor structure layer and the light-emitting functional layer; an undercut structure, located in the non-display area, and the undercut structure is disposed on the substrate, and the undercut structure has an undercut space; A first inorganic layer, wherein the first inorganic layer is disposed on a side of the light-emitting functional layer away from the thin film transistor structure layer, the first inorganic layer at least covers the sidewall of the opening, the first inorganic layer covers the bottom of the opening, and the first inorganic layer covers the undercut structure; The thin film transistor structure layer comprises a buffer layer, the buffer layer is arranged on a side of the first flexible layer away from the substrate, the buffer layer comprises a partition portion located in the non-display area; the convex portion and the partition portion located above the convex portion form the undercut structure; The partition portion includes a suspended portion protruding from the raised portion, and the suspended portion and the side surface of the raised portion define the undercut space; The groove is in communication with the undercut space; The light-emitting layer corresponding to the non-display area includes a first part and a second part, the first part of the light-emitting layer and the second part of the light-emitting layer are disconnected by the bottom cut space, the first part of the light-emitting layer is located in the groove, and the second part of the light-emitting layer is located on the partition part.

2. The display panel according to claim 1, characterized in that: The display panel further includes: The second inorganic layer is arranged on a side of the first inorganic layer away from the light-emitting functional layer, and the second inorganic layer covers the first inorganic layer.

3. The display panel according to claim 2, characterized in that: The light-emitting functional layer comprises an anode, a pixel definition layer, a light-emitting layer and a cathode which are arranged in sequence, the anode is electrically connected to the thin film transistor structure layer, and at least a part of the light-emitting layer is defined in an opening of the pixel definition layer; The cathode corresponding to the non-display area includes a first part and a second part, the first part of the cathode and the second part of the cathode are disconnected by the undercut space, the first part of the cathode is located on the first part of the light-emitting layer, and the second part of the cathode is located on the second part of the light-emitting layer.

4. The display panel according to claim 3, characterized in that: The first inorganic layer covers the groove.

5. The display panel according to claim 2, characterized in that: The groove includes a first groove and a second groove, the first groove is arranged on a side of the second groove away from the through hole, and the second groove is arranged on a side close to the through hole, and the display panel further includes: an organic filling layer, wherein the organic filling layer fills the second groove; An organic encapsulation layer is located between the first inorganic layer and the second inorganic layer, and the organic encapsulation layer fills the first groove.

6. The display panel according to claim 1, characterized in that: The substrate comprises: Back panel; a second flexible layer, the second flexible layer being disposed on the back plate; The barrier layer is arranged on a side of the second flexible layer away from the back plate, and the through hole passes through the back plate, the second flexible layer and the barrier layer.

7. The display panel according to claim 1, characterized in that: The opening width is greater than or equal to 30 microns.

8. A display device, characterized in that: The display device comprises a touch control unit and the display panel according to any one of claims 1 to 7, wherein the touch control unit is arranged on the display panel or integrated in the display panel.

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