Chip Coplanarity Detection Equipment

Abstract

The present invention discloses a chip coplanarity detection device, which includes at least one carrier module and a detector. The carrier module includes a carrier table and an optical glass mounted on the carrier table. The optical glass has a carrier plane and a light incident surface located on opposite sides, and a pair of alignment patterns formed on the carrier plane. The carrier plane can be used for arranging a plurality of pads of at least one chip, so that some of the pads of at least one chip can abut against the carrier plane by gravity. The detector is arranged corresponding to the optical glass and can know the position of the carrier plane by detecting the alignment patterns, so as to detect each pad to know the distance between it and the carrier plane. Accordingly, through the carrier plane of the optical glass in combination with gravity, a judgment reference plane required in the coplanarity test is stably provided, thereby effectively reducing the error caused by the reference plane.

Description

Technical Field

[0001] The present invention relates to a coplanarity detection device, and more particularly to a chip coplanarity detection device. Background Art

[0002] Although existing coplanarity detection devices can be used to detect the coplanarity of multiple objects to be measured (such as solder balls), the existing coplanarity detection devices calculate or select a judgment reference plane (base plane) of the coplanarity based on the information provided by the multiple objects to be measured. Therefore, the coplanarity results detected by the existing coplanarity detection devices will have relatively large errors.

[0003] Therefore, the inventor believes that the above-mentioned defects can be improved, and thus specifically devotes himself to research and combines the application of scientific principles, and finally proposes the present invention with reasonable design and effective improvement of the above-mentioned defects. Summary of the Invention

[0004] An embodiment of the present invention provides a chip coplanarity detection device, which can effectively improve the defects that may occur in existing coplanarity detection devices.

[0005] An embodiment of the present invention discloses a chip coplanarity detection device, which includes at least one carrier module and a detector. The carrier module includes a carrier table and an optical glass. The optical glass is installed on the carrier table, and the optical glass has a carrying plane and a light incident surface on opposite sides. The optical glass includes a pair of alignment patterns formed on the carrying plane; wherein, the carrying plane can be used for arranging a plurality of pads of at least one chip, so that some pads of at least one chip can abut against the carrying plane by gravity; a detector is arranged corresponding to the optical glass. The detector can know the position of the carrying plane by detecting the alignment patterns, and the detector can be used to detect each pad to know the distance between it and the carrying plane.

[0006] Preferably, the carrier table includes a first surface and a second surface on opposite sides, and the carrier table is formed with a through hole penetrating from the first surface to the second surface. The optical glass is arranged on the first surface with the light incident surface, and the positions of the carrying plane and the alignment patterns correspond to the through hole, so that the detector can detect the alignment patterns and a plurality of pads arranged on the carrying plane through the through hole.

[0007] Preferably, the through hole of the carrier table is rectangular and defines a length direction. The carrying plane can be used for arranging a plurality of chips along the length direction; the chip coplanarity detection device further includes a transverse transfer mechanism. The detector is installed on the transverse transfer mechanism, and the transverse transfer mechanism can make the detector face the through hole and move along the length direction.

[0008] Preferably, at least one carrier module includes a longitudinal transfer mechanism, and the carrier platform is mounted on the longitudinal transfer mechanism so that the longitudinal transfer mechanism can move the carrier platform in a direction along the vertical length direction.

[0009] Preferably, the chip coplanarity detection device further includes a U-shaped bracket, the transverse transfer mechanism and the detector are located inside the U-shaped bracket, the number of at least one carrier module is further limited to two, and the two carrier modules are respectively mounted on two end portions of the U-shaped bracket.

[0010] Preferably, at least one carrier module includes a positioning fixture detachably disposed on the carrier platform, and the positioning fixture is formed with at least one holding groove for receiving at least one chip.

[0011] Preferably, the optical glass is clamped between the positioning fixture and the carrier platform.

[0012] Preferably, the positioning fixture is formed with a receiving groove communicating with at least one holding groove, and the optical glass is disposed in the receiving groove.

[0013] Preferably, the optical glass has a light transmittance of more than 90% for visible light with a wavelength between 400 nanometers and 700 nanometers.

[0014] Preferably, the bearing plane of the optical glass is perpendicular to a plumb direction.

[0015] In summary, the chip coplanarity detection device disclosed in the embodiments of the present invention uses the bearing plane of the optical glass to cooperate with gravity to stably provide a judgment reference plane required in its coplanarity test, thereby effectively reducing the error caused by the reference plane.

[0016] Furthermore, the detector can know the position of the bearing plane by detecting the alignment pattern, and the detector can be used to detect each of the pads to know the distance between it and the bearing plane, thereby accurately measuring the coplanarity of the multiple pads of any one of the chips.

[0017] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not impose any limitation on the protection scope of the present invention. Brief Description of the Drawings

[0018] Figure 1 It is a three-dimensional schematic diagram of the chip coplanarity detection device according to the embodiment of the present invention.

[0019] Figure 2 is Figure 1 A cross-sectional schematic view taken along section line II-II.

[0020] Figure 3 It is Figure 2 an enlarged schematic view of part III of

[0021] Figure 4 It is Figure 3 an enlarged schematic view of part IV of

[0022] Figure 5 It is Figure 1 a three - dimensional schematic view of another form.

[0023] Figure 6 It is an enlarged schematic view of the bearing module of the chip coplanarity detection device according to the embodiment of the present invention.

[0024] Figure 7 It is Figure 6 an enlarged schematic view from another perspective.

[0025] Figure 8 It is Figure 6 a partial exploded schematic view of

[0026] Figure 9 It is Figure 8 an enlarged schematic view from another perspective.

[0027] Figure 10 It is Figure 8 an exploded schematic view of

[0028] Figure 11 It is Figure 10 an enlarged schematic view from another perspective. Specific Embodiments

[0029] The following are specific embodiments to illustrate the embodiments of the present invention regarding the "chip coplanarity detection device". Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Additionally, the drawings of the present invention are only simple schematic illustrations and are not drawn according to actual dimensions, hereby stated in advance. The following embodiments will further detail the related technical content of the present invention, but the disclosed content is not used to limit the protection scope of the present invention.

[0030] It should be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another, or one signal from another. Additionally, the term "or" used herein should, depending on the actual situation, possibly include any one or a combination of more of the associated listed items.

[0031] Please refer to Figures 1 to 11 as shown, which is an embodiment of the present invention. As Figures 1 to 4 shown, this embodiment discloses a chip coplanarity detection device 100, which uses gravity to detect the coplanarity of a plurality of pads 201 of at least one chip 200. Among them, the chip coplanarity detection device 100 includes a U-shaped bracket 1, two carrier modules 2 respectively installed at two end portions 11 of the U-shaped bracket 1, a transverse transfer mechanism 3 located inside the U-shaped bracket 1, and a detector 4 installed on the transverse transfer mechanism 3 and located inside the U-shaped bracket 1.

[0032] It should be noted that although the chip coplanarity detection device 100 is described in this embodiment as including the above components, the present invention is not limited thereto. For example, as Figure 5 shown, the number of the carrier modules 2 included in the chip coplanarity detection device 100 may be one, and the U-shaped bracket 1 is correspondingly adjusted to an L-shaped bracket 1a. In addition, in other embodiments not shown in the present invention, the chip coplanarity detection device 100 may omit the transverse transfer mechanism 3 so that the detector 4 does not move; or, the chip coplanarity detection device 100 may also omit the U-shaped bracket 1 and the transverse transfer mechanism 3, and at least one of the carrier modules 2 and the detector 4 is installed on other components.

[0033] Since Figures 1 to 4 the two carrier modules 2 shown are of substantially the same structure and the two carrier modules 2 are installed in a substantially symmetric manner, for the convenience of describing this embodiment, the structure of a single carrier module 2 will be described first below, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the chip coplanarity detection device 100 may also include a plurality of carrier modules 2 with slightly different structures.

[0034] Please refer to Figure 4 and Figures 6 to 11 as shown, the carrier module 2 in this embodiment includes a plate-shaped carrier table 21 (which can also be regarded as an additional circuit board), a longitudinal transfer mechanism 22 connected to the carrier table 21, an optical glass 23 installed on the carrier table 21, and a positioning jig 24 detachably arranged on the carrier table 21, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the carrier module 2 may omit or replace the longitudinal transfer mechanism 22 and / or the positioning jig 24 with other components; or, the carrier module 2 may also adopt a carrier table 21 that is not plate-shaped.

[0035] In this embodiment, the carrier table 21 includes a first surface 211 and a second surface 212 located on opposite sides, and the carrier table 21 is formed with a through hole 213 penetrating from the first surface 211 to the second surface 212. Among them, the through hole 213 of the carrier table 21 is elongated in this embodiment and defines a length direction L, and the through hole 213 is preferably recessed from one end of the carrier table 21 away from the longitudinal transfer mechanism 22 (such as: Figure 7 the right end of the carrier table 21 in

[0036] It should be additionally noted that since the carrier table 21 of this embodiment is non-translucent, the carrier table 21 is formed with the through hole 213 to facilitate cooperation with other components to jointly realize the detection of the chip coplanarity, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the carrier table 21 may also be translucent and not formed with the through hole 213.

[0037] Furthermore, the carrier table 21 is installed on the longitudinal transfer mechanism 22 so that the longitudinal transfer mechanism 22 can move the carrier table 21 along a direction perpendicular to the length direction L. Among them, the carrier table 21 is installed on the longitudinal transfer mechanism 22 at a portion without the through hole 213, so that the portion of the carrier table 21 formed with the through hole 213 is in a suspended state.

[0038] The optical glass 23 is a transparent flat structure in this embodiment, and the optical glass 23 has a light transmittance of more than 90% for visible light with a wavelength between 400 nanometers and 700 nanometers, but the present invention is not limited thereto. That is to say, glass without specific optical conditions is different from the optical glass 23 referred to in this embodiment. Among them, the optical glass 23 has a bearing plane 231 and a light incident surface 232 located on opposite sides. The light incident surface 232 is also planar in this embodiment, and the outer shape of the light incident surface 232 is the same as the outer shape of the bearing plane 231, but the present invention is not limited thereto.

[0039] Among them, the optical glass 23 is disposed on the first surface 211 of the carrier table 21 with the light incident surface 232, and the optical glass 23 preferably completely covers one side of the through hole 213 (such as: Figure 8 the top side of the through hole 213 in

[0040] Furthermore, the bearing plane 231 can be used for arranging a plurality of pads 201 of at least one chip 200, so that a part of the pads 201 of at least one chip 200 can abut against the bearing plane 231 by gravity. That is to say, the chip coplanarity detection device 100 uses the bearing plane 231 of the optical glass 23 in combination with gravity to stably provide a judgment reference plane (base plane) required in its coplanarity test, thereby effectively reducing the error caused by the reference plane.

[0041] In this embodiment, the bearing plane 231 of the optical glass 23 is perpendicular to a plumb direction V, and the optical glass 23 has a long strip-shaped structure parallel to the length direction L, so that the bearing plane 231 can be used for arranging a plurality of chips 200 along the length direction L.

[0042] More specifically, the optical glass 23 includes a pair of alignment patterns 233 formed on the bearing plane 231, and the positions of the bearing plane 231 and the alignment patterns 233 (along the plumb direction V) correspond to the through holes 213. In this embodiment, the alignment patterns 233 are illustrated by opaque films located on the bearing plane 231, so as to facilitate accurately providing the position of the bearing plane 231 through the alignment patterns 233, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the alignment patterns 233 can also be films with a light transmittance different from (or less than) that of the optical glass 23, which can also effectively provide the position of the bearing plane 231.

[0043] It should be additionally noted that although the optical glass 23 is illustrated as a flat glass in this embodiment, in other embodiments not shown in the present invention, the bearing plane 231 may only occupy a partial plate surface of the optical glass 23, and the area of the optical glass 23 outside the bearing plane 231 may be non-planar, but the alignment patterns 233 cannot be formed in the area outside the bearing plane 231, so as to accurately provide the position of the bearing plane 231.

[0044] The positioning fixture 24 is arranged on the first surface 211 of the bearing table 21, and the optical glass 23 is clamped between the positioning fixture 24 and the bearing table 21. In this embodiment, the positioning fixture 24 is formed with a plurality of through-shaped holding grooves 241 along the length direction L from the top surface, so as to respectively accommodate at least a plurality of chips 200.

[0045] Furthermore, a receiving groove 242 communicating with a plurality of the holding grooves 241 is formed on the bottom surface of the positioning jig 24 along the length direction L, and the shape of the receiving groove 242 corresponds to that of the optical glass 23, so that the optical glass 23 can be disposed in the receiving groove 242, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the positioning jig 24 may be formed with at least one holding groove 241 for receiving at least one of the chips 200 and a receiving groove 242 communicating with at least one of the holding grooves 241, and the optical glass 23 is disposed in the receiving groove 242.

[0046] More specifically, in this embodiment, the receiving groove 242 penetrates the positioning jig 24 along the length direction L, and the width of the receiving groove 242 is slightly larger than the width of the through hole 213, so as to facilitate clamping the optical glass 23 between the positioning jig 24 and the carrier 21. In other words, a projection area formed by the front projection of the through hole 213 of the carrier 21 towards the positioning jig 24 is located within the receiving groove 242 and covers a plurality of the holding grooves 241.

[0047] In addition, the positioning jig 24 is non-light-transmissive in this embodiment, and the alignment pattern 233 of the optical glass 23 corresponds to the area of the positioning jig 24 where no holding groove 241 is formed along the vertical direction V. Furthermore, the thickness of the positioning jig 24 is preferably slightly smaller than the thickness of any one of the chips 200, so as to facilitate taking out the chip 200 from the holding groove 241 of the positioning jig 24.

[0048] The detector 4 is disposed corresponding to the optical glass 23, so that the detector 4 can know the position of the bearing plane 231 by detecting the alignment pattern 233, and the detector 4 can be used to detect each of the pads 201 to know the distance between each of the pads 201 and the bearing plane 231, and further accurately measure the coplanarity of a plurality of the pads 201 of any one of the chips 200.

[0049] More specifically, in this embodiment, the detector 4 is mounted on the lateral transfer mechanism 3, and the lateral transfer mechanism 3 can make the detector 4 face the through hole 213 and move along the length direction L, but the present invention is not limited thereto. Furthermore, since the positions of the bearing plane 231 and the alignment pattern 233 of the optical glass 23 (both along the vertical direction V) correspond to the through hole 213, the detector 4 can detect the alignment pattern 233 and a plurality of the pads 201 disposed on the bearing plane 231 through the through hole 213.

[0050] [Technical effects of the embodiments of the present invention]

[0051] In summary, for the chip coplanarity detection device disclosed in the embodiments of the present invention, through the bearing plane 231 of the optical glass 23 and gravity, a judgment reference plane required in the coplanarity test is stably provided (that is, with the bearing plane 231 as the reference plane), thereby effectively reducing the error caused by the reference plane.

[0052] Furthermore, the detector 4 can know the position of the bearing plane 231 by detecting the alignment pattern 233, and the detector 4 can be used to detect each pad 201 to know the distance between it and the bearing plane 231, thereby accurately measuring the coplanarity of multiple pads 201 of any one chip 200.

[0053] The content disclosed above is only the preferred feasible embodiments of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the patent scope of the present invention.

Claims

1. A chip coplanarity detection device, characterized in that, the chip coplanarity detection device includes: at least one carrier module, including: a longitudinal transfer mechanism; a carrier table mounted on the longitudinal transfer mechanism; an optical glass mounted on the carrier table, and the optical glass has a carrier plane and a light incident surface on opposite sides, and the optical glass includes a pair of alignment patterns formed on the carrier plane; wherein, the carrier plane can be used for arranging a plurality of pads of at least one chip, so that some of the pads of at least one chip can abut against the carrier plane by gravity; and a positioning fixture detachably arranged on the carrier table, the optical glass is clamped between the positioning fixture and the carrier table, and the positioning fixture is formed with at least one holding groove for receiving at least one chip; and a detector arranged corresponding to the optical glass, the detector can know the position of the carrier plane by detecting the alignment pattern, and the detector can be used to detect each pad to know the distance between it and the carrier plane.

2. The chip coplanarity detection device according to claim 1, characterized in that, the carrier table includes a first surface and a second surface on opposite sides, and the carrier table is formed with a through hole penetrating from the first surface to the second surface, the optical glass is arranged on the first surface with the light incident surface, and the positions of the carrier plane and the alignment pattern correspond to the through hole, so that the detector can detect the alignment pattern and a plurality of pads arranged on the carrier plane through the through hole.

3. The chip coplanarity detection device according to claim 2, characterized in that, the through hole of the carrier table is elongated and defines a length direction, and the carrier plane can be used for arranging a plurality of chips along the length direction; the chip coplanarity detection device further includes a transverse transfer mechanism, the detector is mounted on the transverse transfer mechanism, and the transverse transfer mechanism can make the detector face the through hole and move along the length direction.

4. The chip coplanarity detection device according to claim 3, characterized in that, the longitudinal transfer mechanism can make the carrier table move along a direction perpendicular to the length direction.

5. The chip coplanarity detection device according to claim 3, characterized in that, the chip coplanarity detection device further includes a U-shaped bracket, the transverse transfer mechanism and the detector are located inside the U-shaped bracket, the number of at least one carrier module is further limited to two, and the two carrier modules are respectively mounted on two end portions of the U-shaped bracket.

6. The chip coplanarity detection device according to claim 1, characterized in that, the positioning fixture is formed with a receiving groove communicating with at least one holding groove, and the optical glass is arranged in the receiving groove.

7. The chip coplanarity detection device according to claim 1, characterized in that, The optical glass has a light transmittance of more than 90% for visible light with a wavelength between 400 nm and 700 nm.

8. The chip coplanarity detection device according to claim 1, characterized in that the bearing plane of the optical glass is perpendicular to a plumb direction.

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