Chip mounting device and chip mounting method

Abstract

The present invention provides a chip placement device and method. The chip placement device includes an optical projection unit, a chip carrier assembly, an optical sensing assembly, and a chip placement unit. The optical projection unit projects a preset chip layout onto the chip carrier assembly. The optical sensing assembly is disposed below the chip carrier assembly and is configured to generate a light intensity signal based on the received projected light, thereby positioning the chip layout according to the light intensity signal so that the chip layout falls completely within the chip carrier assembly. The chip placement unit then performs chip placement on the chip carrier assembly based on the positioned chip layout. The chip placement device eliminates the need for positioning marks on a glass carrier, significantly reducing costs. Since the chip layout is created by the optical projection unit, the chip layout can be quickly adjusted for different designs, significantly reducing the development cycle. The chip placement method is simple to operate, saves costs, and reduces the development cycle.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a chip mounting device and a chip mounting method. Background Art

[0002] With the advancement of semiconductor technology, packaging technology is moving towards higher density and higher integration. Currently, fan-out technology has become a key development direction for high-density interconnects. By using redistribution layers to connect single and multiple chips, it significantly increases the flexibility of packaging integration. Fan-out technology has been applied in fields such as high-performance computing (HPC) and mobile phone processors.

[0003] At present, temporary chip placement equipment is used in fan-out packaging to rearrange the chips on the temporary carrier, and then the temporary carrier is removed after the temporary placement. There are several temporary carrier removal processes, including heating removal, laser removal, and ultraviolet light removal. When using optical removal methods, the transmittance of the temporary carrier needs to be guaranteed, so the temporary material is generally glass. In order to achieve chip positioning, such as Figure 1 As shown, it is necessary to make positioning marks 12 on a temporary carrier 11. The production of positioning marks on a glass carrier generally requires the use of photolithography and etching processes. Therefore, the cost of carrier production is relatively high.

[0004] In view of the above problems, it is necessary to propose a patch device and a patch method that are reasonably designed and can effectively solve the above problems. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art and provides a patch device and a patch method.

[0006] One aspect of the present invention provides a patch device, comprising an optical projection unit, a chip carrier assembly, an optical sensing assembly, and a patch unit;

[0007] The optical projection unit is arranged above the slide assembly and is used to project a preset chip layout onto the slide assembly;

[0008] The optical sensing component is disposed below the wafer carrier assembly and is configured to generate a light intensity signal according to the received projection light, and to position the chip layout diagram according to the light intensity signal, so that the chip layout diagram completely falls within the wafer carrier assembly;

[0009] The patch unit is used to perform patching on the wafer carrier assembly according to the positioned chip layout diagram.

[0010] Optionally, the wafer carrier assembly is light-transmissive, and the optical sensing assembly includes a substrate and an optical sensor;

[0011] The optical sensor cover is disposed on the substrate, and an orthographic projection of the optical sensor on the wafer carrier assembly falls outside the wafer carrier assembly.

[0012] Optionally, the patch device further includes a control unit, configured to compare the light intensity signal at each area of ​​the optical sensor with a preset light intensity signal threshold value;

[0013] If the light intensity signal of at least one of the regions is inconsistent with the light intensity signal threshold, the relative distance between the optical projection unit and the slide assembly is adjusted.

[0014] Optionally, if the light intensity signal is greater than the light intensity signal threshold, reducing the relative distance between the optical projection unit and the slide assembly;

[0015] If the light intensity signal is less than the light intensity signal threshold, the relative distance between the optical projection unit and the slide assembly is increased.

[0016] Optionally, the patch device further includes a control unit, configured to compare the light intensity signal at each area of ​​the optical sensor with the light intensity signals at other areas;

[0017] If the light intensity signal of at least one of the regions is inconsistent with the light intensity signals of other regions, the relative distance between the optical projection unit and the slide assembly is adjusted.

[0018] Optionally, the optical sensing component includes a substrate and an optical sensor;

[0019] The optical sensors are distributed along an edge region of the substrate, and an orthographic projection of the optical sensors on the wafer carrier assembly falls outside the wafer carrier assembly.

[0020] Optionally, if the optical sensor just generates the light intensity signal, the chip layout map falls completely within the carrier assembly.

[0021] Optionally, the wafer carrier assembly includes a wafer carrier, a temporary carrier plate and a patch film.

[0022] The temporary carrier is arranged on the wafer carrier; the patch film is arranged on a side of the temporary carrier away from the wafer carrier.

[0023] Another aspect of the present invention provides a patch method, using a patch device, the patch device including an optical projection unit, a wafer carrier assembly, an optical sensing assembly, and a patch unit, the optical projection unit being disposed above the wafer carrier assembly, and the optical sensing assembly being disposed below the wafer carrier assembly; wherein the method comprises:

[0024] The optical projection unit projects a preset chip layout onto the slide assembly;

[0025] The optical sensing component generates a light intensity signal according to the received projection light, and positions the chip layout according to the light intensity signal so that the chip layout falls completely within the wafer carrier component;

[0026] The patch unit performs patching on the chip carrier assembly according to the positioned chip layout diagram.

[0027] Optionally, the wafer carrier assembly is light-transmissive, and the optical sensing assembly includes a substrate and an optical sensor; the optical sensor cover is disposed on the substrate, and the orthographic projection of the optical sensor on the wafer carrier assembly falls outside the wafer carrier assembly;

[0028] Generating a light intensity signal according to the received projection light, and positioning the chip layout according to the light intensity signal, includes:

[0029] Comparing the light intensity signal at each area of ​​the optical sensor with a preset light intensity signal threshold value;

[0030] If the light intensity signal of at least one of the regions is inconsistent with the light intensity signal threshold, the relative distance between the optical projection unit and the slide assembly is adjusted.

[0031] Optionally, if the light intensity signal of at least one of the regions is inconsistent with the light intensity signal threshold, adjusting the relative distance between the optical projection unit and the slide assembly includes:

[0032] If the light intensity signal is greater than the light intensity signal threshold, reducing the relative distance between the optical projection unit and the slide assembly;

[0033] If the light intensity signal is less than the light intensity signal threshold, the relative distance between the optical projection unit and the slide assembly is increased.

[0034] Optionally, the generating of a light intensity signal according to the received projection light, and positioning the chip layout according to the light intensity signal, further includes:

[0035] Comparing the light intensity signal at each area of ​​the optical sensor with the light intensity signals at other areas respectively;

[0036] If the light intensity signal of at least one of the regions is inconsistent with the light intensity signals of other regions, the relative distance between the optical projection unit and the slide assembly is adjusted.

[0037] Optionally, the optical sensing assembly includes a substrate and an optical sensor; the optical sensor is distributed along an edge region of the substrate, and an orthographic projection of the optical sensor on the wafer carrier assembly falls outside the wafer carrier assembly;

[0038] Generating a light intensity signal according to the received projection light, and positioning the chip layout according to the light intensity signal, includes:

[0039] If the optical sensor just generates the light intensity signal, then the chip layout falls completely within the slide assembly.

[0040] The present invention provides a patch device and patch method, the patch device including an optical projection unit, a chip carrier assembly, an optical sensing assembly, and a patch unit; a preset chip layout diagram is projected onto the chip carrier assembly by the optical projection unit; the optical sensing assembly generates a light intensity signal based on the received projection light to position the chip layout diagram based on the light intensity signal, so that the chip layout diagram completely falls within the chip carrier assembly; the patch unit performs patching on the chip carrier assembly according to the chip layout diagram. Compared to the current traditional glass carrier with positioning marks, the patch device does not require the production of positioning marks on the glass carrier, which greatly reduces costs; because the chip layout diagram is completed by the optical projection unit, the chip layout diagram can be quickly adjusted for different designs, without the need to re-produce the layout and produce a new glass carrier as in the traditional method, which greatly reduces the development cycle. The patch method is simple to operate, saves costs, and reduces the development cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 This is a schematic diagram of the structure of a glass carrier plate with positioning marks in the prior art;

[0042] Figure 2 1 is a schematic structural diagram of a patch device in a patch device and a patch method according to an embodiment of the present invention;

[0043] Figure 3 It is a structural schematic diagram of a chip placement device when a chip carrier assembly is offset in a chip placement device and a chip placement method according to another embodiment of the present invention;

[0044] Figure 4 1 is a structural schematic diagram of a chip placement device in a chip placement device and a chip placement method according to another embodiment of the present invention;

[0045] Figure 5 A schematic diagram of a chip layout diagram in a chip placement device and a chip placement method according to another embodiment of the present invention;

[0046] Figure 6 A schematic diagram of a patch device and a patch method according to another embodiment of the present invention;

[0047] Figure 7 The present invention is another embodiment of a chip placement device and a chip placement method in a flowchart of the method. DETAILED DESCRIPTION

[0048] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0049] like Figure 2 、 Figure 3 and Figure 4 As shown, one aspect of the present invention provides a chip placement device 100, which includes an optical projection unit 110, a chip carrier assembly 120, an optical sensing assembly 130, and a chip placement unit 140. The optical projection unit 110 is arranged above the chip carrier assembly 120 and is used to project a preset chip layout onto the chip carrier assembly 120. The optical sensing assembly 130 is arranged below the chip carrier assembly 120 and is used to generate a light intensity signal based on the received projection light, so as to position the chip layout 150 based on the light intensity signal, so that the chip layout 150 is positioned as shown in FIG. Figure 5 The chip is shown as being completely within the wafer carrier assembly 120. The wafer mounting unit 140 is used to mount the chips on the wafer carrier assembly 120 according to the positioned chip layout diagram 150.

[0050] It should be noted that in this embodiment, the optical projection unit 110 may be a laser projector that projects the preset chip layout onto the wafer carrier assembly 120. Because the chip layout 150 is projected by laser, the preset chip layout can be quickly adjusted for different chip designs, significantly reducing the development cycle. The optical projection unit 110 may also be other optical devices capable of projection, which is not specifically limited in this embodiment and can be selected based on specific needs.

[0051] It needs to be further explained that, Figure 6 As shown, the patch unit 140 may include multiple patch heads, and the robot controls the patch head to grab the chip to be patched, and then Figure 5 The positioned chip layout 150 is shown to be mounted on the wafer carrier assembly 120 .

[0052] The chip placement device of the present invention uses an optical projection unit to project a preset chip layout onto a wafer carrier. An optical sensing component generates a light intensity signal based on the received projected light, which is used to position the chip layout according to the light intensity signal, ensuring that the chip layout falls completely within the wafer carrier. This eliminates the need for photolithographic positioning marks on the glass substrate, reducing costs. Because the chip layout is generated by the optical projection unit, the chip layout can be quickly adjusted for different designs, eliminating the need to recreate the layout and produce a new glass carrier as in traditional methods, significantly reducing the development cycle.

[0053] For example, Figure 2 、 Figure 3 and Figure 4 As shown, the wafer carrier assembly 120 includes a wafer carrier 121, a temporary carrier plate 122, and a die bonding film 123. The temporary carrier plate 122 is placed on the wafer carrier 121 to secure the temporary carrier plate 122. The die bonding film 123 is placed on the side of the temporary carrier plate 122 facing away from the wafer carrier 121. The chips to be bonded are attached to the die bonding film 123 by the bonding unit 140. In other words, the wafer carrier assembly 120 comprises, from bottom to top, the wafer carrier 121, the temporary carrier plate 122, and the die bonding film 123.

[0054] It should be noted that in this embodiment, both the temporary carrier 122 and the die-attachment film 123 are circular, and there is no requirement for the shape of the wafer carrier 121, as long as it can fix the temporary carrier 122. Of course, the temporary carrier 122 and the die-attachment film 123 can also have other shapes, which can be selected according to actual needs and are not specifically limited in this embodiment.

[0055] For example, Figure 2 and Figure 3 As shown, the carrier assembly 120 is light-transmitting, that is, the temporary carrier 122 is made of a light-transmitting material. In this embodiment, the temporary carrier 122 adopts a temporary glass carrier, and a temporary carrier 122 made of other light-transmitting materials can also be used, which is not specifically limited in this embodiment. The optical sensing assembly 130 includes a substrate 131 and an optical sensor 132; the optical sensor 132 is covered on the substrate 131, that is, the entire substrate 131 is covered with the optical sensor 132. And the positive projection of the optical sensor 132 on the carrier assembly 120 falls on the outside of the carrier assembly 120, that is, the cross-sectional size of the optical sensor 132 is larger than the cross-sectional size of the temporary carrier 122, so that when the position of the temporary carrier 122 is offset, the optical sensor 132 can receive the original projection light emitted by the optical projection unit 110. The substrate 131 can be circular or rectangular, which is not specifically limited in this embodiment.

[0056] Illustratively, the patch device 100 further includes a control unit (not shown) that compares the light intensity signal at each region of the optical sensor 132 with a preset light intensity signal threshold. If the light intensity signal at at least one region is inconsistent with the light intensity signal threshold, the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 is adjusted.

[0057] Specifically, if Figure 3As shown, the optical projection unit 110 projects a preset chip layout onto the surface of the patch film 123, and the projection light passes through the temporary carrier 122, that is, the temporary glass plate, and reaches the surface of the optical sensor 132. Each area of ​​the optical sensor 132 generates a light intensity signal according to the projection light emitted by the optical projection unit 110, and transmits the received light intensity signal to the control unit. The control unit compares the light intensity signal received at each area of ​​the optical sensor 132 with a preset light intensity signal threshold. If the light intensity signal of at least one area is inconsistent with the light intensity signal threshold, the relative distance between the optical projection unit 110 and the carrier assembly 120 is adjusted.

[0058] It should be noted that the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 can be adjusted by adjusting the position of the optical projection unit 110 alone, the position of the wafer carrier assembly 120 alone, or both. However, in this embodiment, the height of the optical projection unit 110 is substantially constant for wafers of the same size, so only the position of the wafer carrier assembly 120 needs to be adjusted.

[0059] Exemplarily, the patch device 100 includes a control unit, and when the wafer carrier assembly 120 is light-transmissive and the optical sensor 132 is covered on the substrate 131, a specific method for adjusting the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 is as follows:

[0060] If the light intensity signal is greater than the preset light intensity signal threshold, the relative distance between the optical projection unit 110 and the slide assembly 120 is reduced. Specifically, if the light intensity signal received by at least one area of ​​the optical sensor 132 is greater than the preset light intensity signal threshold, it indicates that the slide assembly 120 has shifted. In this embodiment, Figure 3 As shown, the light intensity signal received by the edge area of ​​the optical sensor 132 should be greater than the preset light intensity signal threshold. At this time, the control unit will issue an alarm signal. At this time, we need to reduce the relative distance between the optical projection unit 110 and the carrier assembly 120, that is, move the carrier assembly 120 upward until the light intensity signal received by the edge area of ​​the optical sensor 132 is equal to the preset light intensity signal threshold, that is, the chip layout diagram 150 completely falls within the carrier assembly 120.

[0061] It should be noted that since the thickness of the die-mounting film 123 and the temporary carrier 122 is essentially fixed, in this embodiment, the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 is adjusted primarily by adjusting the position of the wafer carrier 121. A linear motor can be provided on the wafer carrier 121 to adjust the position of the wafer carrier 121. Alternatively, a stepper motor can be provided on the wafer carrier 121 to adjust the position of the wafer carrier 121 by controlling a gear rack, a crank slider, or a worm gear provided on the wafer carrier 121. Of course, other methods can also be used to adjust the position of the wafer carrier 121, and this embodiment does not specifically limit such methods.

[0062] If the light intensity signal is less than a preset light intensity signal threshold, the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 is increased. In other words, the position of the wafer carrier 121 is adjusted to move the wafer carrier 121 downward, increasing the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 so that the chip layout 150 falls completely within the wafer carrier assembly 120. It should be noted that the position of the wafer carrier 121 can be adjusted manually or automatically.

[0063] Illustratively, the patch device 100 includes a control unit. When the wafer carrier assembly 120 is light-transmissive and the optical sensor 132 is positioned on the substrate, the control unit is configured to compare the light intensity signal received at each region of the optical sensor 132 with the light intensity signals received at other regions. If the light intensity signal at at least one region is inconsistent with the light intensity signals at other regions, the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 is adjusted.

[0064] Specifically, if the light intensity signal of at least one area is inconsistent with the light intensity signals of other areas, adjusting the relative distance between the optical projection unit 110 and the slide assembly 120 includes:

[0065] like Figure 3 As shown, if the light intensity signal received at the edge of the optical sensor 132 is greater than the light intensity signal received at the central area of ​​the optical sensor 132, it is necessary to reduce the relative distance between the optical projection unit 110 and the wafer carrier assembly 120, that is, to move the wafer carrier assembly 120 upward, which is actually to move the wafer carrier 121 upward. Specifically, a linear motor can be set on the wafer carrier 121 to adjust the position of the wafer carrier 121 by the linear motor, or a stepper motor can be set on the wafer carrier 121 to adjust the position of the wafer carrier 121 by controlling a gear rack, a crank slider or a worm gear. Of course, other methods can also be used to adjust the position of the wafer carrier 121, and this embodiment does not specifically limit it.

[0066] If the light intensity signal received at the edge of the optical sensor 132 is less than the light intensity signal received at the center of the optical sensor 132, the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 needs to be increased, that is, the wafer carrier assembly 120 needs to be moved downward, which is actually to move the wafer carrier 121 downward so that the chip layout 150 falls completely within the wafer carrier assembly 120. It should be noted that the position of the wafer carrier 121 can be adjusted manually or automatically.

[0067] For example, Figure 4 As shown, the optical sensing assembly 130 includes a substrate 131 and optical sensors 132. The optical sensors 132 are distributed along the edge of the substrate 131. Specifically, if the substrate 131 is circular, the optical sensors 132 are distributed along the edges of the circular substrate; if the substrate 131 is rectangular, the optical sensors 132 are distributed along the four sides of the rectangular substrate. The orthographic projection of the optical sensors 132 onto the wafer assembly 120 falls outside the wafer assembly 120. This allows the optical sensors 132 to receive the original projection light emitted by the optical projection unit 110 even when the wafer assembly 120 is shifted.

[0068] For example, Figure 4 As shown, when the optical sensors 132 are distributed along the edge area of ​​the substrate 131, the optical sensors 132 are used to generate light intensity signals based on the received projection light. If the optical sensors 132 generate light intensity signals, it means that the chip layout 150 is completely within the wafer carrier assembly 120. In this embodiment, the wafer carrier assembly 120 can be light-transmissive or non-light-transmissive.

[0069] like Figure 7 As shown, another aspect of the present invention provides a patch method S100, which uses a patch device 100, which includes an optical projection unit 110, a wafer carrier assembly 120, an optical sensing assembly 130, and a patch unit 140. The optical projection unit 110 is arranged above the wafer carrier assembly 120, and the optical sensing assembly 130 is arranged below the wafer carrier assembly 120. The patch method S100 includes:

[0070] S110. The optical projection unit projects a preset chip layout onto a wafer carrier assembly.

[0071] Specifically, if Figure 2 、 Figure 3 and Figure 4 As shown, in this embodiment, the optical projection unit 110 is used to project the preset chip layout onto the carrier assembly 120 to form the following Figure 5 The optical projection unit 110 may further preferably be a laser projector.

[0072] like Figure 2 、 Figure 3 and Figure 4 As shown, the wafer carrier assembly 120 includes a wafer carrier 121, a temporary carrier plate 122, and a die bonding film 123. The temporary carrier plate 122 is disposed on the wafer carrier 121 and serves to secure the temporary carrier plate 122. The die bonding film 123 is disposed on the side of the temporary carrier plate 122 facing away from the wafer carrier 121. The die to be bonded is bonded to the die bonding film 123 by the bonding unit 140.

[0073] S120. The optical sensing component generates a light intensity signal according to the received projection light, and positions the chip layout diagram according to the light intensity signal, so that the chip layout diagram completely falls within the carrier component.

[0074] Specifically, if Figure 2 、 Figure 3 and Figure 4 As shown, the optical sensing component 130 generates a light intensity signal according to the received projection light, and positions the chip layout 150 according to the light intensity signal, so that Figure 5 The chip layout 150 is shown as being completely contained within the wafer carrier assembly 120 .

[0075] S130. The patch unit performs patching on the wafer carrier assembly according to the positioned chip layout diagram.

[0076] Specifically, if Figure 6 As shown, the chip placement unit 140 performs chip placement on the carrier assembly 120 according to the positioned chip layout diagram 150. The chip placement unit 140 may include multiple chip placement heads, and the robot controls the chip placement head to grab the chip to be placed, and then places the chip according to the following example: Figure 5 The positioned chip layout 150 is shown to be mounted on the wafer carrier assembly 120 .

[0077] For example, Figure 2 and Figure 3 As shown, the wafer carrier assembly 120 is light-transmissive, and the optical sensing assembly 130 includes a substrate 131 and an optical sensor 132. The optical sensor 132 is covered on the substrate 131, and the orthographic projection of the optical sensor 132 on the wafer carrier assembly 120 falls outside the wafer carrier assembly 120.

[0078] Specifically, if Figure 2 and Figure 3As shown, the carrier assembly 120 is light-transmitting, that is, the temporary carrier 122 is made of a light-transmitting material. In this embodiment, the temporary carrier 122 adopts a temporary glass carrier, and a temporary carrier 122 made of other light-transmitting materials can also be used, which is not specifically limited in this embodiment. The optical sensing assembly 130 includes a substrate 131 and an optical sensor 132. The optical sensor 132 is covered on the substrate 131, that is, the entire substrate 131 is covered with the optical sensor 132, and the positive projection of the optical sensor 132 on the carrier assembly 120 falls on the outside of the carrier assembly 120, so that when the position of the temporary carrier 122 is offset, the optical sensor 132 can receive the original projection light emitted by the optical projection unit 110. The substrate 131 can be circular or rectangular, which is not specifically limited in this embodiment.

[0079] Generating a light intensity signal according to the received projection light, and positioning the chip layout according to the light intensity signal, includes:

[0080] The light intensity signal at each area of ​​the optical sensor 131 is compared with a preset light intensity signal threshold. If the light intensity signal of at least one area is inconsistent with the light intensity signal threshold, the relative distance between the optical projection unit 110 and the slide assembly 120 is adjusted.

[0081] Specifically, if Figure 3 As shown, the optical projection unit 110 projects the preset chip layout onto the surface of the patch film 123, and the projection light passes through the temporary carrier 122, that is, the temporary glass plate, to the surface of the optical sensor 132. Each area of ​​the optical sensor 132 generates a light intensity signal according to the received projection light, and transmits the received light intensity signal to the control unit. The control unit compares the light intensity signal received at each area of ​​the optical sensor 132 with a preset light intensity signal threshold. If the light intensity signal of at least one area is inconsistent with the light intensity signal threshold, the relative distance between the optical projection unit 110 and the carrier assembly 120 is adjusted.

[0082] It should be noted that the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 can be adjusted by adjusting the position of the optical projection unit 110 alone, the position of the wafer carrier assembly 120 alone, or the positions of the optical projection unit 110 and the wafer carrier assembly 120 simultaneously. However, in this embodiment, the height of the optical projection unit 110 is substantially fixed for wafers of the same size, so only the position of the wafer carrier assembly 120 needs to be adjusted.

[0083] Exemplarily, if the light intensity signal of at least one of the regions is inconsistent with the light intensity signal threshold, adjusting the relative distance between the optical projection unit and the slide assembly includes:

[0084] like Figure 3 As shown, if the light intensity signal is greater than the preset light intensity signal threshold, the relative distance between the optical projection unit 110 and the slide assembly 120 is reduced. Specifically, if the light intensity signal received by at least one area of ​​the optical sensor 132 is greater than the preset light intensity signal threshold, it means that the slide assembly 120 has shifted. In this embodiment, Figure 3 As shown, the light intensity signal received by the edge area of ​​the optical sensor 132 should be greater than the preset light intensity signal threshold. At this time, the control unit will issue an alarm signal. At this time, we need to reduce the relative distance between the optical projection unit 110 and the carrier assembly 120, that is, move the carrier assembly 120 upward until the light intensity signal received by the edge area of ​​the optical sensor 132 is equal to the preset light intensity signal threshold, that is, the chip layout diagram 150 completely falls within the carrier assembly 120.

[0085] It should be noted that if Figure 2 and Figure 3 As shown, since the thickness of the die attach film 123 and the temporary carrier 122 is essentially fixed, in this embodiment, the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 is adjusted primarily by adjusting the position of the wafer carrier 121. A linear motor can be provided on the wafer carrier 121 to adjust the height of the wafer carrier 121. Alternatively, a stepper motor can be provided on the wafer carrier 121 to adjust the height of the wafer carrier 121 by controlling a gear rack, a crank slider, or a worm gear. Of course, other methods can also be used to adjust the height of the wafer carrier 121, and this embodiment does not specifically limit these methods.

[0086] like Figure 3 As shown, if the light intensity signal is less than a preset light intensity signal threshold, the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 is increased. In other words, the position of the wafer carrier 121 is adjusted to move the wafer carrier 121 downward, increasing the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 so that the chip layout 150 falls completely within the wafer carrier assembly 120. It should be noted that the position of the wafer carrier 121 can be adjusted manually or automatically.

[0087] Exemplarily, the generating of a light intensity signal according to the received projection light, and positioning the chip layout according to the light intensity signal, further includes:

[0088] like Figure 3As shown, the control unit compares the light intensity signal at each area of ​​the optical sensor 132 with the light intensity signals at other areas. If the light intensity signal at at least one area is inconsistent with the light intensity signals at other areas, the relative distance between the optical projection unit 110 and the slide assembly 120 is adjusted.

[0089] Specifically, if Figure 3 As shown, the optical projection unit 110, that is, the laser projector, projects the chip layout diagram 150 onto the surface of the patch film 123. The projection light passes through the patch film 123 and the temporary carrier 122 to reach the surface of the optical sensor 132. Due to optical absorption, the light intensity will decrease, and the optical sensor 132 can measure the light intensity change. If the laser projection area is offset, the projected wafer boundary exceeds the actual temporary carrier 122 boundary, the optical sensor 132 generates a light intensity signal based on the received projection light, and the optical sensor 132 transmits the generated light intensity signal to the control unit. The control unit compares the light intensity signal received at each area of ​​the optical sensor 132 with the light intensity signals at other areas. If the light intensity signal of at least one area is inconsistent with the light intensity signals at other areas, the relative distance between the optical projection unit 110 and the carrier assembly 120 is adjusted.

[0090] If the light intensity signal of at least one area is inconsistent with the light intensity signals of other areas, adjusting the relative distance between the optical projection unit 110 and the slide assembly 120 includes:

[0091] like Figure 3 As shown, if the light intensity signal received at the edge of the optical sensor 132 is greater than the light intensity signal received in the central area of ​​the optical sensor 132, it is necessary to reduce the relative distance between the optical projection unit 110 and the wafer carrier assembly 120, that is, to move the wafer carrier assembly 120 upward, which is actually to move the wafer carrier 121 upward. Specifically, a linear motor can be set on the wafer carrier 121 to adjust the height of the wafer carrier 121 by the linear motor. Alternatively, a stepper motor can be set on the wafer carrier 121 to adjust the height of the wafer carrier 121 by controlling a gear rack, a crank slider, or a worm gear. Of course, other methods can also be used to adjust the height of the wafer carrier 121, and this embodiment does not specifically limit this.

[0092] like Figure 3As shown, if the light intensity signal received at the edge of the optical sensor 132 is less than the light intensity signal received at the center of the optical sensor 132, the relative distance between the optical projection unit 110 and the wafer carrier assembly 120 needs to be increased, that is, the wafer carrier assembly 120 needs to be moved downward, which is actually to move the wafer carrier 121 downward so that the chip layout 150 falls completely within the wafer carrier assembly 120. It should be noted that the position of the wafer carrier 121 can be adjusted manually or automatically.

[0093] For example, Figure 4 As shown, the optical sensing assembly 130 includes a substrate 131 and an optical sensor 132. The optical sensor 132 is distributed along the edge of the substrate 131, and the orthographic projection of the optical sensor 132 on the wafer carrier assembly 120 falls outside the wafer carrier assembly 120.

[0094] Specifically, if Figure 4 As shown, optical sensing assembly 130 includes substrate 131 and optical sensors 132. Optical sensors 132 are distributed along the edge of the substrate. If substrate 131 is circular, they are distributed along the edges of the circular substrate. If substrate 131 is rectangular, they are distributed along the four sides of the rectangular substrate. Furthermore, the orthographic projection of optical sensors 132 onto wafer assembly 120 falls outside wafer assembly 120. This allows optical sensors 132 to receive the original projection light emitted by optical projection assembly 110 even when wafer assembly 120 shifts.

[0095] Generating a light intensity signal according to the received projection light, and positioning the chip layout according to the light intensity signal, includes:

[0096] like Figure 4 As shown, when the optical sensors 132 are distributed along the edge area of ​​the substrate 131, the optical sensors 132 are used to generate light intensity signals according to the received projection light. If the optical sensors 132 generate light intensity signals, the chip layout 150 is completely within the wafer carrier assembly 120. In this embodiment, the wafer carrier assembly 120 can be light-transmissive or non-light-transmissive.

[0097] The chip mounting method provided by the present invention is simple to operate and cost-effective. The chip layout can be quickly adjusted for different designs without the need to re-make the layout and produce a new glass carrier as in the traditional method, thereby greatly reducing the development cycle.

[0098] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A patch device, characterized in that: The patch device includes an optical projection unit, a wafer carrier assembly, an optical sensing assembly, and a patch unit; the wafer carrier assembly is light-transmissive, and the optical sensing assembly includes a substrate and an optical sensor; the optical sensor cover is disposed on the substrate, and the orthographic projection of the optical sensor on the wafer carrier assembly falls outside the wafer carrier assembly; The optical projection unit is arranged above the slide assembly and is used to project a preset chip layout onto the slide assembly; The optical sensing component is disposed below the wafer carrier assembly and is configured to generate a light intensity signal according to the received projection light, and to position the chip layout diagram according to the light intensity signal, so that the chip layout diagram completely falls within the wafer carrier assembly; The patch unit is used to perform patching on the chip carrier assembly according to the positioned chip layout diagram; The patch device further includes a control unit, which is used to compare the light intensity signal at each area of ​​the optical sensor with a preset light intensity signal threshold; If the light intensity signal of at least one of the regions is inconsistent with the light intensity signal threshold, the relative distance between the optical projection unit and the slide assembly is adjusted.

2. The patch device according to claim 1, characterized in that: If the light intensity signal is greater than the light intensity signal threshold, reducing the relative distance between the optical projection unit and the slide assembly; If the light intensity signal is less than the light intensity signal threshold, the relative distance between the optical projection unit and the slide assembly is increased.

3. The patch device according to claim 1, characterized in that: The control unit is further configured to compare the light intensity signal at each area of ​​the optical sensor with the light intensity signals at other areas respectively; If the light intensity signal of at least one of the regions is inconsistent with the light intensity signals of other regions, the relative distance between the optical projection unit and the slide assembly is adjusted.

4. The patch device according to claim 1, characterized in that The optical sensing component includes a substrate and an optical sensor; The optical sensors are distributed along an edge region of the substrate, and an orthographic projection of the optical sensors on the wafer carrier assembly falls outside the wafer carrier assembly.

5. The patch device according to claim 4, characterized in that: If the optical sensor just generates the light intensity signal, then the chip layout falls completely within the slide assembly.

6. The patch device according to any one of claims 1 to 5, characterized in that: The wafer carrier assembly includes a wafer carrier, a temporary carrier plate and a patch film. The temporary carrier is arranged on the wafer carrier; The die-attachment film is arranged on a side of the temporary carrier away from the wafer carrier.

7. A patch method, characterized in that: A chip placement device is used, which includes an optical projection unit, a chip carrier assembly, an optical sensing assembly, and a chip placement unit. The optical projection unit is arranged above the chip carrier assembly, and the optical sensing assembly is arranged below the chip carrier assembly. The chip carrier assembly is light-transmissive, and the optical sensing assembly includes a substrate and an optical sensor. The optical sensor cover is disposed on the substrate, and the orthographic projection of the optical sensor on the wafer carrier assembly falls outside the wafer carrier assembly; wherein the method comprises: The optical projection unit projects a preset chip layout onto the slide assembly; The optical sensing component generates a light intensity signal according to the received projection light, and positions the chip layout according to the light intensity signal so that the chip layout falls completely within the wafer carrier component; The patch unit performs patching on the chip carrier assembly according to the positioned chip layout diagram; The optical sensing component generates a light intensity signal according to the received projection light, so as to locate the chip layout according to the light intensity signal, including: Comparing the light intensity signal at each area of ​​the optical sensor with a preset light intensity signal threshold value; If the light intensity signal of at least one of the regions is inconsistent with the light intensity signal threshold, the relative distance between the optical projection unit and the slide assembly is adjusted.

8. The method according to claim 7, characterized in that If the light intensity signal of at least one of the regions is inconsistent with the light intensity signal threshold, adjusting the relative distance between the optical projection unit and the slide assembly comprises: If the light intensity signal is greater than the light intensity signal threshold, reducing the relative distance between the optical projection unit and the slide assembly; If the light intensity signal is less than the light intensity signal threshold, the relative distance between the optical projection unit and the slide assembly is increased.

9. The method according to claim 7, characterized in that The step of generating a light intensity signal according to the received projection light, and positioning the chip layout according to the light intensity signal, further comprises: Comparing the light intensity signal at each area of ​​the optical sensor with the light intensity signals at other areas respectively; If the light intensity signal of at least one of the regions is inconsistent with the light intensity signals of other regions, the relative distance between the optical projection unit and the slide assembly is adjusted.

10. The method according to claim 7, characterized in that The optical sensing assembly includes a substrate and an optical sensor; the optical sensor is distributed along the edge area of ​​the substrate, and the orthographic projection of the optical sensor on the wafer carrier assembly falls outside the wafer carrier assembly; Generating a light intensity signal according to the received projection light, and positioning the chip layout according to the light intensity signal, includes: If the optical sensor just generates the light intensity signal, then the chip layout falls completely within the slide assembly.

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