Gas dryer and solvent removal apparatus provided with the same

Abstract

The present application provides a gas dryer and a solvent removal device provided with the gas dryer. The gas dryer includes: a base plate provided with a hole array and a plurality of through grooves, the hole array having a plurality of through holes, the plurality of through holes having a plurality of hole rows and a plurality of hole columns extending along a first direction and a second direction and arranged in a matrix shape, and the plurality of through grooves being alternately arranged with the hole columns and extending in a linear shape along the second direction; a plurality of spray nozzles respectively combined with the through holes in a manner of protruding to a lower surface of the base plate and used for spraying drying gas to a drying object located at a lower portion of the spray nozzle; and a flow control plate fixed to an upper surface of the base plate in a manner of communicating with the spray nozzle, used for supplying drying gas to the spray nozzle, and provided with a dam-shaped supply line surrounding a peripheral portion of the through groove and defining an exhaust hole of the drying gas together with the through groove.

Description

Technical Field

[0001] The present invention relates to a gas dryer and a solvent removal apparatus having the gas dryer, and more specifically, to a gas dryer for removing solvent from an organic layer formed by a printing process and a solvent removal apparatus having the gas dryer. Background Technology

[0002] Vacuum deposition using fine metal masks (FMMs) is widely used as a pixel formation process for organic light-emitting display devices, but due to limitations in achieving large-area, high-resolution results, various alternative processes are being developed.

[0003] In particular, in the case of organic light-emitting display devices that use organic materials as the light-emitting layer, a printing process has been proposed that utilizes the property that organic materials are easily soluble in organic solvents and uses ink to spray organic materials.

[0004] By mixing organic materials and organic solvents used to form the light-emitting layer to form ink, and using a printing press with information related to the pixel map, the organic ink is precisely sprayed only onto the designated pixel areas, thereby forming an organic printed film of the desired thickness at precise locations. As a result, the printing process has replaced the deposition process and is attracting considerable attention as a pixel technology for large-area display devices.

[0005] However, since organic light-emitting layers are susceptible to moisture and humidity, drying and baking processes are required to remove solvents from organic printed films formed through printing processes.

[0006] The drying process removes solvent by rapidly vaporizing it under vacuum, while the baking process removes solvent molecules trapped inside the organic printed film by diffusing them through a high-temperature process.

[0007] Typically, a high-vacuum, low-temperature drying process and a low-vacuum, high-temperature baking process are performed in separate chambers. This is because if both processes are performed in the same chamber, the solvent evaporated during the drying process and deposited on the inner wall of the chamber can be re-vaporized at the high temperature of the subsequent baking process and resupplyed to the organic printing film, potentially reducing the quality of the printed film. Therefore, the time and expense required for moving the chambers used for the drying and baking processes and for establishing a vacuum in the chamber used for the baking process lead to a decrease in the efficiency of the organic film printing process.

[0008] However, since the drying and baking processes share the same goal of removing solvent from the organic printed film, it is best to perform both processes consecutively in the same chamber. Therefore, various efforts have been made to prevent solvents evaporated during the drying process from depositing within the chamber in order to perform both processes on the organic printed film in the same chamber. Summary of the Invention

[0009] One object of the present invention is to provide a gas dryer that causes the drying gas injected onto an organic printed film to be discharged upward along the reflective direction of the organic printed film, thereby preventing the drying gas from depositing in the chamber.

[0010] Another object of the present invention is to provide a solvent removal apparatus, which includes a gas dryer as described above and substrate heaters provided at the upper and lower parts of the substrate, thereby simultaneously performing drying and baking on the organic printed film.

[0011] A gas dryer according to an embodiment of the present invention for achieving the above-mentioned objectives includes: a base plate having a hole array and a plurality of through slots, the hole array having a plurality of through holes, the plurality of through holes having a plurality of rows and columns of holes extending along a first direction and a second direction and arranged in a matrix shape, the plurality of through slots being alternately arranged with the rows of holes and extending linearly along the second direction; a plurality of injection nozzles respectively coupled to the plurality of through holes and protruding toward the lower surface of the base plate for injecting a drying gas to remove solvent from a drying object located below the injection nozzles for drying; a flow control plate fixed to the upper surface of the base plate in communication with the injection nozzles for supplying the drying gas to the injection nozzles, the flow control plate having a dam-shaped supply line surrounding the periphery of the through slots and defining, together with the through slots, an outlet for discharging the drying gas and the solvent; and a fixing member extending from the upper surface of the base plate and fixed to the outside.

[0012] A solvent removal apparatus according to another embodiment of the present invention for achieving the objectives described above includes: a chamber having a sealed internal space; a substrate fixing part disposed at the lower part of the chamber and for fixing a substrate having an organic printed film, the substrate fixing part having a lower heating element for performing a baking process on the organic printed film; a gas dryer fixed at the upper part of the chamber opposite to the substrate and providing a gas flow area between the gas dryer and the organic printed film, wherein the drying process of evaporating the solvent from the organic printed film is performed by performing the injection of drying gas for removing solvent from the organic printed film and the discharge of the solvent and the drying gas in the gas flow area, thereby avoiding the deposition of the solvent on the inner surface of the chamber; and a gas blower disposed between the gas dryer and the top plate of the chamber for generating a forced flow to discharge the solvent and the drying gas discharged through the gas dryer to the outside of the chamber.

[0013] According to an embodiment of the present invention, a gas dryer and a solvent removal apparatus equipped with the gas dryer are provided with a plurality of injection nozzles arranged at an angle relative to an organic printed film, and a through groove extending through a substrate plate, wherein the injection nozzles are disposed on the substrate plate. Drying gas is supplied at an angle relative to the organic printed film, and the drying gas reflected from the organic printed film and the solvent evaporated from the organic printed film are discharged to the outside through the through groove. Thus, during the drying process, the diffusion of the drying gas and the solvent evaporated from the organic printed film into the interior space of the chamber is suppressed by a curtain gas, and the drying gas and solvent are rapidly discharged to the outside through the through groove.

[0014] During the drying process of the organic printed film (OPL), solvent deposition on the inner wall of the chamber can be prevented, and the temperature and flow rate uniformity of the OPL can be improved. In particular, by reducing solvent deposition on the inner wall of the chamber, defects in the OPL that may result from the re-evaporation of deposited solvent film during subsequent high-temperature baking processes can be significantly reduced.

[0015] By stably performing drying and baking processes within the same chamber, the efficiency and stability of pixel formation processes in organic thin-film display devices can be improved.

[0016] However, the effects of the present invention are not limited to those described above, and can be extended in various ways without departing from the spirit and scope of the present invention. Attached Figure Description

[0017] Figure 1 This is a top view showing a gas dryer according to an embodiment of the present invention.

[0018] Figure 2a It is a section cut along the I-I' direction. Figure 1 The diagram shows a cross-sectional view of the gas dryer.

[0019] Figure 2b It is a section cut along the II-II' direction. Figure 1 The diagram shows a cross-sectional view of the gas dryer.

[0020] Figure 3a It means Figure 1 A top view of the base plate in the gas dryer shown.

[0021] Figure 3b It means Figure 1 A top view of the flow control plate in the gas dryer shown.

[0022] Figure 4a and Figure 4b This indicates that it is set in Figure 1 The diagram shows the configuration of the injection nozzles of the gas dryer.

[0023] Figure 5a This is a top view showing a gas dryer according to another embodiment of the present invention.

[0024] Figure 5b This indicates that it is set in Figure 5a The diagram shows a top view of the flow control plate and the dummy supply line of the gas dryer.

[0025] Figure 6a This is a top view showing a gas dryer according to another embodiment of the present invention.

[0026] Figure 6b It is a section cut along the II-II' direction. Figure 6a The diagram shows a cross-sectional view of the gas dryer.

[0027] Figure 7 This is a structural diagram showing a solvent removal apparatus equipped with a gas dryer according to an embodiment of the present invention.

[0028] Figure 8 It means possessing Figure 7 The diagram shows the structure of a multi-chamber system for pixel generation in the solvent removal apparatus shown. Detailed Implementation

[0029] The preferred embodiments of the gas dryer and the solvent removal apparatus equipped with the gas dryer of the present invention will now be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments. Those skilled in the art can implement the present invention in many different ways without departing from the technical concept of the present invention.

[0030] In the accompanying drawings, for clarity of the invention, the dimensions of the substrate, layer (film), region, pattern, or structure are shown at a larger scale than actual dimensions. In this specification, terms such as “parallel,” “orthogonal,” “same,” “equal,” etc., used to define shape, geometry, physical properties, and their degree, as well as lengths, angles, and physical property values, should not be limited to their precise meaning but should be interpreted to include a range of degrees to which the same function can be expected.

[0031] The terminology used in this application is for illustrative purposes only and is not intended to limit the invention. Regarding singular expressions, unless the context clearly distinguishes them, the singular expression also includes the meaning of the plural form. It should be understood that the terms "comprising" or "having" in this application are used to specify the presence of features, numbers, steps, operations, structural elements, components, or combinations thereof described in the specification, and are not intended to preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, structural elements, components, or combinations thereof.

[0032] Furthermore, when referring to the formation of layers (films), regions, electrodes, patterns, or structures on a substrate, or when referring to them as "on," "upper," or "lower," it indicates that the layers (films), regions, electrodes, patterns, or structures are directly formed above or below the substrate, or that other layers (films), regions, electrodes, patterns, or structures may be further formed on the substrate. Additionally, when referring to a substance, layer (film), region, electrode, pattern, or structure using "first," "second," "third," and / or "preparation," this is not intended to limit the component but rather to distinguish each substance, layer (film), region, electrode, pattern, or structure. Therefore, "first," "second," "third," and / or "preparation" may be used selectively or alternatively for each layer (film), region, electrode, pattern, or structure.

[0033] Figure 1 This is a top view showing a gas dryer according to an embodiment of the present invention. Figure 2a It is a section cut along the I-I' direction. Figure 1 The diagram shows a cross-sectional view of the gas dryer. Figure 2b It is a section cut along the II-II' direction. Figure 1 The diagram shows a cross-sectional view of the gas dryer. Figure 3a It means Figure 1 The diagram shows a top view of the base plate in the gas dryer. Figure 3b It means Figure 1 A top view of the flow control plate in the gas dryer shown.

[0034] Reference Figures 1 to 3bAccording to an embodiment of the present invention, a gas dryer 300 includes: a base plate 310, which forms the base of the dryer; a plurality of injection nozzles 320 protruding downward from the base plate 310 and used for injecting drying gas; a flow control plate 330, which is attached to the upper surface of the base plate 310; and a fixing member 340 extending from the base plate 310 and fixed to the outside.

[0035] As one embodiment, the base plate 310 can be provided in various shapes and components, provided it has the strength and rigidity to support the flow control plate 330 disposed above and the injection nozzle 320 combined below, and to deliver high-temperature dry gas (DG) under vacuum. For example, the base plate 310 can be provided as a metal plate with sufficient strength and rigidity.

[0036] A plurality of through holes PH and through grooves PS are provided on the substrate plate 310. The through holes PH are arranged in a matrix shape to provide a hole array HA, wherein the matrix shape has a plurality of hole rows HR and a plurality of hole columns HC extending along a first direction x and a second direction y that is substantially perpendicular to the first direction x.

[0037] The through-hole PH can be provided in various ways as long as its shape and structure are suitable for engagement with the injection nozzle 320 described later. Thus, various engagement mechanisms for detachably engaging the injection nozzle 320 can be further provided or formed at the end of the through-hole PH. For example, the end of the through-hole PH can be provided with an internal thread compared to the external thread provided at the end of the injection nozzle 320.

[0038] The through-groove PS is alternately arranged with the orifice HC and is configured to extend linearly along the second direction y. Since the through-groove PS is provided as the discharge path for the drying gas DG reflected by the object being dried, the through-groove PS can be formed to have a width larger than the width of the through-hole PH, thereby ensuring sufficient discharge space.

[0039] In particular, the through groove PS can extend along the second direction y and be alternately arranged with the orifice array HC along the first direction x, thereby sufficiently shortening the discharge path of the dry gas DG ejected from the injection nozzle 320 provided in the orifice array HC.

[0040] That is, after the drying process of removing solvent from the object to be dried is performed by the drying gas DG ejected from the nozzle 320 provided in the adjacent orifice array HC and coming into contact with the object to be dried, the gas is reflected and discharged through the through groove PS adjacent to the orifice array HC, thereby enabling the rapid discharge of the drying gas reflected from the object to be dried and the solvent removed from the object to be dried.

[0041] Therefore, the organic solvent evaporated from the object being dried by the drying gas DG is rapidly discharged as a mixture with the drying gas DG through the through-channel PS to the outside of the gas dryer 300. Thus, the deposition of the solvent inside the gas dryer 300 can be minimized.

[0042] The base plate 310 has a built-in heating element 315 that can independently heat the object to be dried relative to the drying process. Therefore, it can be configured such that a baking process can be performed within the same chamber after the drying process is completed, without changing the chamber.

[0043] The heating element 315 can be constructed from various heating elements, provided it is disposed inside the base plate 310 and is sufficient to heat the object to be dried located below. For example, the heating element 315 can be constructed from an electric heater that generates Joule heat, or it can be equipped with heating wires inside to allow the flow of high-temperature heat. In contrast, the base plate 310 itself can also be constructed from a planar heating element.

[0044] The injection nozzles 320 are respectively attached to the through holes PH in such a way that they protrude toward the lower surface of the base plate 310, and are used to inject drying gas DG onto the object to be dried located below.

[0045] In this embodiment, the object to be dried includes an organic printed film used to form pixels of an organic light-emitting display device. Therefore, the drying gas DG can be composed of a substance suitable for vaporizing organic solvents from the organic printed film.

[0046] For example, the drying gas DG may be composed of any one of nitrogen, oxygen, argon and clean dry air (CDA), and is supplied to the object to be dried through the injection nozzle 320.

[0047] At this point, the shape of the injection nozzle 320 can be appropriately changed so that the drying gas DG is reflected after being supplied to the object to be dried and directed toward the through groove PS.

[0048] For example, the reflection direction of the drying gas DG ejected through the nozzle 320 can be adjusted to be towards the through-channel PS by configuring the nozzle 320 to be tilted relative to the object being dried at a predetermined spray angle. That is, by adjusting the spray angle, the drying gas DG is set to perform the drying process after being injected into the object being dried, and to flow in a direction perpendicular to the object being dried when it leaves the object being dried, thereby being configured to be discharged through the through-channel PS.

[0049] In particular, when the object to be dried is an organic printed film, the organic solvent evaporated from the organic printed film through the drying process can also be quickly discharged to the outside along with the drying gas DG through the through-channel PS.

[0050] Figure 4a and Figure 4b This indicates that it is set in Figure 1 The diagram shows the configuration of the injection nozzles of the gas dryer.

[0051] like Figure 4a As shown, the plurality of injection nozzles 320 arranged along the orifice array HC can be alternately tilted toward the left and right through grooves PS. Thus, the injection nozzles 320 arranged along the second direction y can uniformly discharge dry gas DG and solvent toward the right through groove PS and the left through groove PS with the orifice array HC as a reference.

[0052] In contrast, such as Figure 4b As shown, two rows of injection nozzles 320 can also be arranged on a single orifice row HC, such that the injection nozzles 320 are inclined towards the left and right through grooves PS of the orifice row HC. In this way, the number of injection nozzles 320 that can be installed on the base plate 310 can be maximized, and the discharge capacity of the through groove PS can be utilized to the maximum extent.

[0053] The spray angle of the spray nozzle 320 can be set to a range of approximately 45° to 60° relative to a vertical plane perpendicular to the base plate 310. The spray angle is set to guide the drying gas DG sprayed from the spray nozzle 320 and reflected by the object being dried to the base plate 310 located above the object being dried. Therefore, it is evident that the spray angle can be set in various ways depending on the arrangement between the base plate 310 and the object being dried.

[0054] Therefore, by discharging the drying gas DG at an angle relative to the supply direction, the drying gas DG flows only in the gas flow area between the base plate 310 and the object to be dried, thus minimizing the phenomenon of the drying gas DG diffusing away from the gas flow area.

[0055] That is, the drying gas DG is supplied to the object to be dried through the substrate plate 310, and is discharged to the outside through the substrate plate 310 after the drying process is performed. Thus, the substrate plate 310 acts as a flow circulation component that determines the start and end points of the flow of the drying gas DG, and inhibits the flow of the drying gas DG to the outside of the gas flow area.

[0056] Furthermore, the spray nozzle 320 can simultaneously spray drying gas DG into each spray area, thereby uniformly setting the drying process characteristics of the object to be dried. For example, the flow rate and temperature of the drying gas DG can be controlled separately for each spray area, thus significantly improving the uniformity of flow rate and temperature compared to existing drying gas supply methods that supply a single flow to the entire surface of the substrate.

[0057] In particular, the solvent evaporating from the object being dried also flows along with the drying gas DG. Therefore, the solvent only flows in the gas flow area between the substrate plate 310 and the object being dried, and is discharged to the outside through the through-groove PS. This prevents the drying gas DG and solvent from diffusing out of the gas flow area into the interior space of the gas dryer.

[0058] Furthermore, spray nozzles 320 can be installed in each spray zone of the object to be dried, thereby controlling the flow rate and temperature of the sprayed drying gas DG according to each spray zone. This allows for uniform drying of the entire surface of the object, improving drying quality.

[0059] When the object to be dried is an organic printed film, the drying gas DG can be supplied at a temperature of approximately 100°C to 150°C. Since the temperature of the drying gas DG is set to be equal in each spray zone, the temperature uniformity of the entire surface of the object to be dried can be significantly improved.

[0060] Furthermore, the drying process is also affected by the average flow velocity of the drying gas (DG) on the object being dried. Therefore, ensuring a uniform flow velocity across the entire surface of the object being dried will affect the drying quality.

[0061] In this embodiment, since the drying gas DG can be sprayed at an equal speed across multiple spray zones, the drying quality can be significantly improved. In this embodiment, when the object to be dried is an organic printed film, the spray nozzle 320 can spray the drying gas DG at a uniform speed of approximately 0.02 m / s to 0.1 m / s.

[0062] The flow control plate 330 is attached to the upper surface of the base plate 310, and supplies dry gas DG to the through hole PH, forming a discharge flow DF of dry gas DG and solvent through the through groove PS.

[0063] For example, the flow control plate 330 is provided as a three-dimensional structure with a storage space HS, in which dry gas DG is stored and can flow to the through hole PH. The flow control plate 330 is connected to an externally located dry gas supply device (not shown) via a supply line SL.

[0064] In this embodiment, the flow control plate 330 includes: a body 332 connected to the supply line SL to receive dry gas DG from the outside; and a dam-shaped supply line 334 branching from the body 332, covering a plurality of perforated rows HC and opening the through slot PS.

[0065] The main body 332 extends along the first direction x to provide the baseline of a plurality of supply lines 334, and the plurality of supply lines 334 are alternately arranged along the first direction x and the through groove PS in such a manner as to cover the hole array HC and open the through groove PS.

[0066] The dry gas DG supplied to the main body 332 via the supply line SL flows along each supply line 334 to each orifice row HC branch and into multiple through holes PH arranged on a single orifice row HC.

[0067] Therefore, although not shown, it is evident that an additional pressure regulating mechanism for uniformly maintaining the partial pressure of the dry gas DG flowing from the main body 332 to each branch of the supply line 334 can be further provided on the main body 332. In particular, a pair of main bodies 332 can be provided at both ends of the branch supply line 334 and dry gas DG can be supplied from both ends of the supply line 334 to the center, thereby uniformly setting the physical properties of the supplied dry gas DG.

[0068] This allows for uniform drying of the object being dried. In particular, when the object being dried is an organic printed film, the organic solvent can be uniformly evaporated from the organic printed film. At this time, the drying gas DG and the organic solvent are uniformly mixed to form a uniform discharge flow DF.

[0069] Furthermore, since the flow control plate 330 has a thickness sufficient to accommodate the storage space HS, the supply line 334 surrounding the through groove PS forms a recess at the periphery of the through groove PS to provide discharge holes DH for the discharged dry gas DG. Therefore, through the supply line 334, linear discharge holes DH, alternating with the supply line 334, are provided along the second direction y at the upper part of the through groove PS.

[0070] The solvent evaporated from the object being dried by the drying process and the drying gas DG reflected from the object being dried form a discharge flow DF that exits linearly from the flow control plate 330 along the discharge hole DH defined along the supply line 334.

[0071] Therefore, the drying gas DG is supplied along the supply line 334 and simultaneously injected into multiple injection areas through the injection nozzles 320 distributed along the orifice array HA. Then, the drying gas DG is mixed with the solvent, which is a by-product of the drying process, along the linear discharge orifice DH defined by the same supply line 334 and discharged as a discharge flow DF.

[0072] The supply flow of drying gas (DG) and the discharge flow of the mixture of drying gas (DG) and solvent complete the flow cycle in each injection zone. That is, by supplying drying gas (DG) and discharging drying gas (DG) and solvent separately according to multiple local areas of the object to be dried, the flow cycle is completed, and multiple flow cycles are achieved on the entire surface of the object to be dried to perform the drying process.

[0073] The fixing member 340 extends upward from the base plate 310 and is fixed to the outside. This allows the gas dryer 300 to be fixed in a specific position. For example, when the gas dryer 300 is disposed inside a drying chamber, the fixing member 340 can be fixed to the top plate of the drying chamber.

[0074] The gas dryer 300 may further include a dummy supply line 336, which is used to form the side groove ES, which is the outermost through groove PS, into the edge discharge hole EH, which is the outermost discharge hole DH.

[0075] Figure 5a This is a top view showing a gas dryer according to another embodiment of the present invention. Figure 5b This indicates that it is set in Figure 5a The diagram shows a top view of the flow control plate and the dummy supply line of the gas dryer.

[0076] Reference Figure 5a and Figure 5b In another embodiment of the present invention, the gas dryer 301 includes a detachable dummy supply line 336, which forms an edge discharge hole EH by surrounding a side groove ES enclosed by the end of the outermost supply line 334a and the body 332.

[0077] Although the dummy supply line 336 is provided to have the same size and shape as the supply line 334, it is separated from the body 332 and fixed to the upper surface of the base plate 310, so it does not supply dry gas DG, but is only provided for the purpose of constructing the edge discharge hole EH.

[0078] In this embodiment, according to the arrangement of the supply line 334 and the through groove PS, the outer side of the side groove ES is exposed to the upper surface of the base plate 310. Therefore, the dry gas DG and solvent discharged through the side groove ES may diffuse to the outer periphery of the base plate 310.

[0079] Since the drying gas DG diffuses outward from the periphery of the substrate plate 310 in a mixture with the evaporated solvent, the solvent may deposit on the inner surface of the chamber where the gas dryer 300 is located. The solvent deposited on the inner surface of the chamber can vaporize during subsequent baking processes, thus acting as a source of contamination; therefore, it is preferable to minimize solvent deposition.

[0080] The dummy supply line 336, together with the end of the main body 332 and the outermost supply line 334a, forms a recess surrounding the side groove ES, and forms an edge discharge hole EH for discharging a mixture of dry gas DG and solvent.

[0081] Therefore, even if the mixture of dry gas DG and solvent is discharged through the side groove ES, it can be confined to the edge discharge hole EH and can be inserted into the forced flow for discharging dry gas DG and solvent to be discharged to the outside. This prevents residual gas and evaporated solvent from flowing to the outside of the substrate plate 310.

[0082] When the side groove ES is open around the periphery of the base plate 310 without forming a discharge hole, the dummy supply line 336 can be selectively provided. Therefore, it is obvious that if the side groove ES is also provided with a discharge hole through the combination of the through groove PS and the supply line 334, the dummy supply line 336 may not be provided.

[0083] The gas dryer 300 may further include a curtain structure 350 for defining the gas flow area to prevent the mixture of drying gas (DG) and evaporated solvent from the gas flow area to the outside.

[0084] Figure 6a This is a top view showing a gas dryer according to another embodiment of the present invention. Figure 6b It is a section cut along the II-II' direction. Figure 6a The diagram shows a cross-sectional view of the gas dryer.

[0085] Reference Figure 6a and Figure 6b In another embodiment of the present invention, the gas dryer 302 may further include a curtain structure 350, which extends downward on the side of the base plate 310 in a manner spaced apart from the base plate 310, for blocking the gas flow area between the base plate 310 and the object to be dried to prevent the mixture of the drying gas DG and the solvent from diffusing outward from the gas flow area.

[0086] For example, the curtain structure 350 includes: a curtain body 352, which is fixed to the base plate 310, flow control plate 330 or the outside by the fixing member 340 or other fixing member, and extends along a third direction z perpendicular to the first direction x and the second direction y with a size corresponding to the width of the base plate 310; and a curtain nozzle 354, which protrudes from the curtain body 352 into a gas flow area FS that serves as a space between the base plate 310 and the object to be dried.

[0087] The curtain body 352 has an internal space for storing curtain air CG supplied from the outside and provides support for the fixing components. The curtain nozzle 354 protrudes from the curtain body 352 into the gas flow area FS and sprays curtain air CG into the gas flow area FS.

[0088] At this time, the curtain gas CG can be the same as or different from the drying gas DG. As long as the diffusion of the evaporated solvent and the drying gas DG from the gas flow area FS to the outside is blocked and the solvent does not deposit inside the chamber and act as a source of contamination, the curtain gas CG can be composed of various substances. In this embodiment, the curtain gas CG can be composed of clean, dry air or an inert gas.

[0089] Furthermore, if impurities generated from the dummy supply line 336 flow into the gas flow region FS, they may become a source of particulate matter for the object to be dried. Therefore, the curtain structure 350 can reduce particulate defects by blocking the supply of defective sources generated outside the gas flow region FS, such as the dummy supply line 336, to the gas flow region FS.

[0090] According to the gas dryers 300, 301, and 302 described above, multiple injection nozzles are arranged at an angle relative to the object being dried, and a through-groove is provided on the same base plate on which the injection nozzles are arranged. Drying gas is supplied to the object being dried at an angle through the injection nozzles, and the drying gas reflected from the object being dried, along with the solvent evaporated from the object being dried during the drying process, is discharged to the outside through the through-groove. Therefore, by performing the supply and discharge of drying gas through the same base plate 310, the path in the gas flow area can be shortened to the minimum, allowing the drying gas and solvent to be rapidly discharged to the outside. This prevents the solvent evaporated from the object being dried from depositing inside the drying apparatus equipped with the gas dryer. In particular, by confining the mixture of solvent and drying gas within the gas flow area by a curtain structure to prevent diffusion to the outside, solvent deposition inside the chamber can be minimized.

[0091] Furthermore, by simultaneously supplying drying gas to multiple injection zones, temperature uniformity across the entire surface of the object being dried can be improved, preventing a decline in drying quality due to temperature differences in localized areas. This allows for the sufficient and uniform maintenance of the drying gas temperature and flow rate, enhancing the uniformity of process state factors during the drying process.

[0092] Figure 7 This is a structural diagram showing a solvent removal apparatus equipped with a gas dryer according to an embodiment of the present invention. Figure 7 The solvent removal device shown can continuously perform drying and baking processes on an organic printed film disposed on a substrate, thereby thoroughly removing the solvent contained in the organic printed film. Figure 7 The gas dryer installed in the solvent removal device has the same characteristics as the reference. Figure 1 The gas dryer illustrated in Figure 6 has essentially the same structure. Therefore, in Figure 7 In the middle, to and Figure 1 The same structural elements as those in Figure 6 use the same reference numerals and further detailed descriptions are omitted.

[0093] Reference Figure 7 A solvent removal apparatus 500 according to an embodiment of the present invention may include a chamber 100, a substrate fixing part 200, a gas dryer 300 and a gas flower 400.

[0094] The chamber 100 is provided as a three-dimensional structure with a sealed internal space in which the drying and baking processes of organic printed film (OPL) are continuously performed.

[0095] Since the drying and baking processes are performed under vacuum, the chamber 100 can be provided by a variety of structures, provided that the chamber 100 is a three-dimensional structure with sufficient strength and rigidity to withstand the vacuum pressure used in the drying and baking processes.

[0096] In this embodiment, the chamber 100 includes: a wall 110 for sealing the internal space to separate it from the outside; a gate 120 for selectively opening the wall 110 and loading or unloading a substrate P on which an organic printed film OPL is formed into the internal space; and a vacuum pump structure 130 for applying vacuum pressure to the internal space of the chamber 100.

[0097] When performing the drying process, the vacuum pump structure 130 creates a relatively high vacuum in the internal space, and when performing the baking process, it creates a relatively low vacuum in the internal space, thus allowing the vacuum level to be adjusted according to the process mode.

[0098] The substrate P, which is loaded into the interior of the wall 110 through the gate 120, is fixed to the substrate fixing part 200.

[0099] The substrate fixing part 200 is disposed in the lower part of the chamber 100 for fixing the substrate P having an organic printed film OPL. The substrate fixing part 200 has a lower heating element 211 for performing a baking process on the organic printed film OPL.

[0100] For example, the substrate fixing part 200 includes: a fixing clamp 210, in which the lower heating element 211 is disposed and used to fix the substrate P; a lifter 220 for selectively raising and lowering the fixing clamp 210; and a pedestal 230 for fixing the lifter 220 to the bottom surface of the chamber 100 to provide a reference for the raising and lowering movement.

[0101] The fixed clamp 210 can be provided in various shapes depending on the shape of the substrate P, and can be constructed by an electromagnetic fixing mechanism, such as a mechanical clamp or an electrostatic clamp.

[0102] In particular, a lower heating element 211 is disposed inside the fixed clamp 210. This lower heating element 211 is linked with the heating component 315 disposed in the gas dryer 300 to heat the substrate P, and can be used as a heat source for the baking process. Hereinafter, the heating component 315 will be referred to as the upper heating element, corresponding to the lower heating element 211.

[0103] The elevator 220 raises the fixed clamp 210 toward the gas dryer 300 to form a gas flow region FS of a size suitable for the solvent removal process. Thus, a gas flow region FS with a predetermined spacing is established between the organic printed film OPL and the substrate plate 310. In this embodiment, the gas flow region FS may be set to have a spacing of approximately 1 mm to 20 mm.

[0104] The gas flow zone FS is adjusted to a size suitable for preventing solvent evaporating from the organic printed film OPL from diffusing into the interior space of chamber 100 and depositing on the inner wall of wall 110 during the drying process. Therefore, various settings can be made according to the characteristics of the organic printed film OPL and the drying and baking processes.

[0105] If the solvent removal process from the organic printed film (OPL) is completed, the elevator 220 descends again to the support platform 230 so that the upper surface of the fixed clamp 210 is aligned with the lower surface of the gate 120. This allows the substrate P, from which the solvent removal process has been completed, to be removed from the chamber 100.

[0106] If the fixed clamp 210 is raised and lowered and the substrate P and the base plate 310 form a gas flow area FS at an appropriate distance, then the gas dryer 300 is driven to perform a drying process on the organic printed film OPL.

[0107] If the dry gas DG is sprayed obliquely onto the upper surface of the organic printed film OPL through the spray nozzle 320, the solvent contained in the organic printed film OPL evaporates and is removed from the organic printed film OPL. The dry gas DG and organic solvent reflected from the organic printed film OPL form a mixture and are discharged to the upper part through the through groove PS, which is provided on the base plate 310 on which the spray nozzle 320 is fixed.

[0108] Furthermore, by supplying curtain gas CG to the gas flow region FS, the internal space of chamber 100 and the gas flow region FS can be effectively separated. This prevents the exchange of substances between the internal space and the gas flow region FS, and blocks the diffusion of evaporated solvent to the outside of the gas flow region FS. Consequently, solvent deposition on the inner wall of chamber 100 is prevented.

[0109] That is, by rapidly removing the solvent from the organic printed film OPL and blocking its diffusion into the chamber 100, the formation of a solvent deposit film on the inner surface of the chamber 100 can be prevented. Therefore, in subsequent baking processes, the risk of the solvent deposit film re-vaporizing and falling onto the organic printed film OPL, causing contamination, can be significantly reduced.

[0110] In addition, drying gas (DG) can be supplied to multiple spraying areas simultaneously to improve temperature uniformity across the entire surface of the organic printed film (OPL) and prevent poor drying caused by temperature differences in local areas.

[0111] Furthermore, by using the same substrate plate 310 for both supplying and discharging the drying gas, the path within the gas flow region FS can be minimized, thus shortening the service life of the drying gas DG. This allows for the uniform maintenance of the drying gas temperature and flow rate, improving the uniformity of process state factors during the drying process.

[0112] The gas dryer 300 has a reference Figure 1 The gas dryer 300 described up to Figure 6 has a basically the same structure, so further detailed description is omitted.

[0113] The gas flow device 400 is disposed between the gas dryer 300 and the top plate C of the chamber 100, and is used to form a discharge flow DF of the mixture of the dried gas DG discharged through the gas dryer 300 and the evaporated solvent, which is then discharged to the outside by a forced flow generator such as a blower. Thus, a forced flow is generated in the space between the upper part of the gas dryer 300 and the gas flow device 400 to guide the discharge flow DF to the outside of the chamber 100, thereby effectively preventing the evaporated solvent contained in the discharge flow DF from diffusing to the outside of the gas dryer 300 and depositing on the inner wall of the chamber 100.

[0114] Therefore, during the drying process of the organic printed film OPL, contamination of the inner wall of the chamber 100 can be effectively prevented, and the temperature uniformity and flow rate uniformity of the organic printed film OPL can be improved, thereby significantly reducing drying process defects.

[0115] If the drying process of the organic printed film OPL is completed, the internal pressure of the chamber 100 is increased to set a relatively low level of vacuum, and the upper heating element 315 and the lower heating element 211 are activated to perform the baking process.

[0116] The baking process described above allows residual solvents that remain inside the organic printed film (OPL) even after the drying process to diffuse outwards and be removed, resulting in a sufficiently low solvent density in the OPL.

[0117] In particular, since the baking process removes residual solvent by diffusion rather than by evaporation, it requires heating the substrate at a process temperature higher than the boiling point of the solvent.

[0118] At this time, since sufficient vacuum pressure has been applied inside the chamber during the drying process, the boiling point of the solvent can be significantly reduced by heating the substrate after a low level of vacuum is created by relieving the vacuum pressure of the drying process. This significantly improves the process efficiency of the baking process. In this embodiment, the baking process can be performed at a uniform process temperature of approximately 250°C to 300°C.

[0119] In particular, the evaporating solvent generated during the drying process can be fully discharged to the outside of the chamber, thus suppressing its deposition on the inner wall of the chamber. Therefore, even when performing a high-temperature baking process within the same chamber, the evaporating solvent on the inner wall of the chamber can be effectively suppressed from acting as a particulate source for the organic printed circuit board (OPL). Consequently, the drying and baking processes can be performed within the same chamber while keeping the particulate defect rate within acceptable limits.

[0120] Figure 8 It means possessing Figure 7 The diagram shows the structure of a solvent removal apparatus and a multi-chamber system used to generate pixels for an organic light-emitting display device. Figure 8 In this context, the solvent removal device included in the multi-chamber system has the same characteristics as... Figure 7 The solvent removal devices shown have essentially the same structure. Therefore, in Figure 8 China and Figure 7 The same structural elements use the same reference numerals and further detailed descriptions are omitted.

[0121] Reference Figure 8A multi-chamber system 1000 according to an embodiment of the present invention can utilize Figure 7 The solvent removal device 500 shown forms a multilayer organic printed film OPL on a substrate P.

[0122] As one embodiment, the multi-chamber system 1000 includes a loading port 1100, a substrate extraction module 1200, and a substrate processing module 1300.

[0123] For example, the loading port 1100 can accommodate a transfer pod 1110, such as a wafer cassette or FOUP, which holds multiple substrates. After the deposition of the lower electrode of the organic light-emitting display device is completed, the flexible substrate P with the lower electrode is loaded onto the inkjet printing apparatus IJP and a hole injection layer (HIL) is formed to form the light-emitting layer through a printing process.

[0124] Multiple flexible substrates P with HIL film formed are housed in transfer chamber 1110 and standby for the process of removing solvent from HIL film. After the solvent removal process is completed, the substrates P are housed in transfer chamber 1110 and then transferred to inkjet printing device IJP for the formation of hole transfer layer (HTL).

[0125] The transfer chamber 1110 is configured to be connected to the gate G of the substrate extraction module 1200 via the gate 1111. If a start signal for the solvent removal process is applied, the gate G opens, and the substrate P stored in the transfer chamber 1110 is extracted by the substrate extraction module 1200 and supplied to the substrate processing module 1300.

[0126] For example, the substrate extraction module 1200 includes: a transfer chamber 1210 connected to the transfer compartment 1110 via the gate G; and a transfer robot 1220 disposed inside the transfer chamber 1210 for extracting the substrate P from the transfer compartment 1110 or storing the processed substrate P in the transfer compartment 1110.

[0127] The transfer chamber 1210 provides a sealed transfer space isolated from the outside. A transfer robot 1220 is mounted on the bottom or side wall of the transfer chamber 1210 and extracts the substrate P to be desolventized according to the compartment number of the transfer chamber 1110. Furthermore, the processed substrate P is stored in a designated slot within the transfer chamber 1110. A purge gas supply unit (not shown) for purging the interior of the transfer space may be further provided in the upper part of the transfer chamber 1210.

[0128] In the substrate processing module 1300, a solvent removal process is performed on the substrate P transferred from the transfer chamber 1210. For example, the substrate processing module 1300 includes: a vacuum chamber dryer (VCD) 1310 for exchanging substrate P with the transfer chamber 1210; a substrate transfer chamber 1320 for extracting substrate P from the VCD 1310 and loading it into a solvent removal device 500; and a plurality of solvent removal devices 500 for performing solvent removal processes according to the type of organic printed film (OPL) printed on the substrate P.

[0129] During the movement of the substrate P with the organic film formed between the inkjet printing apparatus IJP and the multi-chamber system 1000, the VCD 1310 can minimize defects in the organic printed film OPL by removing oxygen and moisture.

[0130] The substrate transfer chamber 1320 includes a substrate loader 1330 for extracting the substrate P stored in the VCD 1310 and loading it into the solvent removal device 500 located in the periphery. Multiple solvent removal devices 510, 520, and 530 are arranged in the periphery of the substrate transfer chamber 1320, and the substrate processing module 1300 can simultaneously perform processing on multiple substrates P.

[0131] In particular, the solvent removal device 500 can select an appropriate removal device according to the type of organic printed film OPL formed on the substrate P.

[0132] For example, when the organic printed film OPL is a hole injection layer (HIL), the substrate P can be loaded into the first solvent removal device 510 and continuously perform a drying process and a baking process for removing solvent from the hole injection layer (HIL).

[0133] Furthermore, when the organic printed film OPL is a hole transfer layer (HTL), the substrate P can be loaded into the second solvent removal device 520 and continuously perform drying and baking processes for removing solvent from the hole transfer layer (HTL).

[0134] Similarly, when the organic printed film OPL is an emitting material layer (EML), the substrate P can be loaded into a third solvent removal device 530 and continuously perform a drying process and a baking process for removing solvent from the emitting material layer (EML).

[0135] The first to third solvent removal devices 510, 520, and 530 have the same Figure 7The solvent removal apparatus shown has essentially the same structure.

[0136] Therefore, drying gas can be supplied to multiple spray zones simultaneously, improving temperature uniformity across the entire surface of the object being dried and preventing a decrease in drying quality caused by temperature differences in localized areas.

[0137] In particular, by supplying and venting the drying gas through the same substrate plate 310, the path in the gas flow area FS can be minimized to rapidly remove the evaporated solvent. This prevents the formation of a solvent deposition film inside the chamber of the substrate processing module 1300, and effectively prevents the solvent deposition film from falling onto the organic printed film OPL and acting as a source of contamination during subsequent baking processes performed in the same substrate processing module 1300.

[0138] Furthermore, by supplying and discharging the drying gas through the same substrate plate 310, the path in the gas flow area can be shortened to the minimum, thereby uniformly maintaining the temperature and flow rate of the drying gas and improving the uniformity of process state factors during the drying process.

[0139] The printing process of organic light-emitting display devices constructs a three-layer film consisting of a HIL layer, an HTL layer, and an EML layer on the lower electrode. It is necessary to suppress interfacial defects such as inter-mixing and inter-dissolution between the organic film materials according to their characteristics.

[0140] Therefore, each time an organic printed film is formed, the solvent inside the organic printed film is sufficiently removed by transferring it to the multi-chamber system 1000 before printing subsequent organic films. At this time, the drying and baking processes are performed in a single chamber while sufficiently reducing the possibility of contamination caused by evaporating solvents, thereby significantly improving the efficiency of the pixel formation process consisting of multiple organic films.

[0141] According to the gas dryer and solvent removal device and multi-chamber system described above, multiple injection nozzles are arranged at an angle relative to the organic printing film, and a through-groove is provided that penetrates the substrate plate on which the injection nozzles are arranged. Thus, drying gas is supplied to the organic printing film at an angle, and the drying gas reflected from the organic printing film and the solvent evaporated from the organic printing film are discharged to the outside through the through-groove. Therefore, during the drying process, the diffusion of the drying gas and the solvent evaporated from the organic printing film into the interior space of the chamber is suppressed by a curtain gas, and the drying gas and solvent are rapidly discharged to the outside through the through-groove.

[0142] Therefore, during the drying process of the organic printed film OPL, the solvent can be prevented from depositing on the inner wall of the chamber, and the temperature uniformity and flow rate uniformity of the organic printed film OPL can be improved.

[0143] In particular, by reducing solvent deposition on the inner sidewall of the chamber, the potential defects in the organic printed film (OPL) caused by the re-evaporation of the deposited solvent film during subsequent high-temperature baking processes can be significantly reduced.

[0144] Therefore, by stably performing the drying and baking processes within the same chamber, the efficiency and stability of the pixel formation process in organic thin-film display devices can be improved.

[0145] The above description refers to preferred embodiments of the present invention. However, it should be understood that those skilled in the art can modify and alter the present invention in various ways without departing from the spirit and scope of the present invention as set forth in the appended claims.

Claims

1. A gas dryer, comprising: A base plate has a hole array and multiple through slots. The hole array has multiple through holes. The multiple through holes have multiple rows and columns of holes extending along a first direction and a second direction and are arranged in a matrix shape. The multiple through slots are alternately arranged with the rows of holes and are linearly connected along the second direction. Multiple injection nozzles are respectively attached to the through hole in such a way that they protrude toward the lower surface of the base plate and are used to inject drying gas to remove solvent from the object to be dried located below the injection nozzles for drying. A flow control plate, directly fixed to the upper surface of the base plate in communication with the injection nozzle, is used to supply the drying gas to the injection nozzle. The flow control plate has a dam-shaped supply line surrounding the periphery of the through-groove, and the dam-shaped supply line, together with the through-groove, defines a linear discharge hole for discharging the drying gas and the solvent; and A fixing component extends from the upper surface of the base plate and is fixed to the outside.

2. The gas dryer according to claim 1, wherein, The base plate includes a built-in heating element that can heat the object to be dried.

3. The gas dryer according to claim 1, wherein, The injection nozzle is configured to be tilted toward the adjacent through slot at a predetermined injection angle, and the dry gas is injected downward at the injection angle.

4. The gas dryer according to claim 1, wherein, The flow control plate further includes a detachable dummy supply line that is coupled to the upper surface of the base plate in a manner that defines a side groove, thereby defining the side groove together with the dam-shaped supply line located at the outermost periphery of the flow control plate to provide an edge discharge port for discharging a mixture of the dry gas and the solvent, wherein the side groove is a through groove extending along the second direction and located at the outermost periphery of the flow control plate along the first direction.

5. The gas dryer according to claim 1, The device further includes a curtain structure that extends downward from the side of the substrate plate at a distance from the substrate plate, for blocking the gas flow area between the substrate plate and the object to be dried, so as to prevent the drying gas and the solvent from diffusing from the gas flow area.

6. A solvent removal apparatus, comprising: A chamber is a sealed internal space; A substrate fixing part is disposed in the lower part of the chamber and is used to fix a substrate having an organic printed film. The substrate fixing part has a lower heating element for performing a baking process on the organic printed film. A gas dryer is fixed to the upper part of the chamber opposite to the substrate, thereby providing a gas flow area between the gas dryer and the organic printed film. By performing the injection of drying gas for removing solvent from the organic printed film and the discharge of the solvent and the drying gas within this gas flow area, a drying process that evaporates the solvent from the organic printed film is performed while avoiding solvent deposition on the inner surface of the chamber; and A gas flow device, disposed between the gas dryer and the top plate of the chamber, is used to generate forced flow to discharge the mixture of solvent and drying gas discharged through the gas dryer to the outside of the chamber. The solvent removal device is configured to continuously perform the drying process and the baking process within the same chamber. The chamber includes a vacuum pump structure for applying vacuum pressure to the internal space of the chamber. The vacuum pump structure is configured to create a relatively high vacuum state in the internal space during the drying process and a relatively low vacuum state in the internal space during the baking process.

7. The solvent removal apparatus according to claim 6, wherein, The gas dryer includes: A base plate has a hole array and multiple through slots. The hole array has multiple through holes. The multiple through holes have multiple rows and columns of holes extending along a first direction and a second direction and are arranged in a matrix shape. The multiple through slots are alternately arranged with the rows of holes and are linearly connected along the second direction. Multiple injection nozzles are respectively connected to the multiple through holes for injecting the drying gas into the organic printed film; A flow control plate, directly fixed to the upper surface of the base plate in communication with the injection nozzle, and used to supply the drying gas to the injection nozzle, the flow control plate having a dam-shaped supply line surrounding the periphery of the through-channel, and providing linear discharge holes for discharging the solvent and the drying gas through the dam-shaped supply line and the through-channel; and A fixing component extends from the upper surface of the base plate and is fixed to the top plate of the chamber.

8. The solvent removal apparatus according to claim 7, wherein, The substrate plate has an upper heating element built into it, and the baking process is performed on the organic printed film by heating the upper heating element and the lower heating element.

9. The solvent removal apparatus according to claim 7, wherein, The spray nozzle is configured to be tilted at a predetermined spray angle toward the adjacent through-groove, such that the dry gas reflected from the organic printed film flows in a direction perpendicular to the organic printed film and is discharged through the discharge hole.

10. The solvent removal apparatus according to claim 7, The device further includes a curtain structure that extends downward from the side of the base plate at a distance from the base plate, for spraying curtain gas to block the gas flow area from the outside, so as to prevent the solvent and the drying gas from diffusing from the gas flow area.

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