Electronic component and board assembly on which the electronic component is mounted

Abstract

The present invention provides an electronic component and a board assembly on which the electronic component is mounted. The board assembly includes: a capacitor body; a pair of external electrodes, respectively disposed at both ends of the capacitor body; a pair of metal frames, including a pair of connecting portions and a pair of mounting portions, the pair of connecting portions being respectively connected to the pair of external electrodes, the lower sides of the pair of connecting portions each having a protrusion; a board; and a pair of electrode pads, disposed on the upper surface of the board and respectively connected to the pair of metal frames, the upper surfaces of the pair of electrode pads each having a groove portion corresponding to the protrusion.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0121564 filed on September 21, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to an electronic component and a board assembly on which the electronic component is mounted. Background Art

[0003] Since multilayer capacitors can be miniaturized and can achieve high capacitance, they have been used in various electronic devices.

[0004] Recently, with the rapid development of environmentally friendly vehicles and electric vehicles, the importance of power drive systems in vehicles has increased, and the demand for multilayer capacitors required for the power drive systems has also increased.

[0005] In order for multilayer capacitors to be used as automotive components, high levels of thermal, electrical, and mechanical reliability may be required.

[0006] In particular, as component mounting density in vehicles increases, there is a demand for a multilayer capacitor that can be easily mounted in a limited space, achieves high capacity, and has excellent durability against vibration and deformation.

[0007] Furthermore, a method of mounting the multilayer capacitor using a metal frame to be spaced apart from the board may be used as a method for improving the durability of the multilayer capacitor against vibration and deformation.

[0008] However, in the case of an electronic component using such a metal frame, since the surface of the metal frame is smooth, the metal frame may be easily degraded along with the electrode pads of the board when the component is mounted on the board. Summary of the Invention

[0009] An aspect of the present disclosure is to provide a board assembly on which an electronic component is mounted, which can improve durability of a multilayer capacitor against vibration and deformation and improve bonding strength between a metal frame and a board of the electronic component.

[0010] According to one aspect of the present disclosure, a board assembly on which electronic components are mounted includes: a capacitor body; a pair of external electrodes, respectively arranged on both ends of the capacitor body; a pair of metal frames, including a pair of connecting parts and a pair of mounting parts, the pair of connecting parts are respectively connected to the pair of external electrodes, and the lower sides of the pair of connecting parts each have a protrusion; a board; and a pair of electrode pads, arranged on the upper surface of the board and respectively connected to the pair of metal frames, and the upper surfaces of the pair of electrode pads each have a groove portion corresponding to the protrusion.

[0011] The height of the protrusion may be defined as g, the diameter of the protrusion may be defined as c, and g and c may satisfy 1 / 6≤g / c, or 1 / 6≤g / c≤1 / 2.

[0012] The width of the mounting portion may be defined as a, the diameter of the protrusion may be defined as c, and a and c may satisfy 1 / 6≤c / a, or 1 / 6≤c / a≤1 / 3.

[0013] A width of the electrode pad may be defined as e, a diameter of the groove portion may be defined as d, and e and d may satisfy 1 / 6≤d / e, or 1 / 6≤d / e≤1 / 3.

[0014] A depth of the groove portion may be defined as h, a diameter of the groove portion may be defined as d, and h and d may satisfy 1 / 6≤h / d, or 1 / 6≤h / d≤1 / 2.

[0015] According to another aspect of the present disclosure, a board assembly on which electronic components are mounted, the board assembly including: a capacitor body; a pair of external electrodes, respectively arranged on both ends of the capacitor body; a pair of metal frames, including a pair of connecting parts and a pair of mounting parts, the pair of connecting parts are respectively connected to the pair of external electrodes, and the lower sides of the pair of mounting parts each have a groove part; a board; and a pair of electrode pads, arranged on the upper surface of the board and respectively connected to the pair of metal frames, and the upper sides of the pair of electrode pads each have a protrusion to correspond to the groove part.

[0016] The capacitor body may include a dielectric layer and a plurality of inner electrodes alternately disposed with the dielectric layer interposed between the plurality of inner electrodes.

[0017] The external electrode may include a head portion provided on an end surface of the capacitor body, and a band portion extending from the head portion to a portion of an upper surface, a portion of a lower surface, and portions of both side surfaces of the capacitor body.

[0018] In the metal frame, the connection portion may be connected to the head portion, and the mounting portion may be bent at a lower end of the connection portion and extend from the lower end of the connection portion.

[0019] The protrusion may be provided in the groove portion.

[0020] According to another aspect of the present disclosure, an electronic component may include: a capacitor body; first and second external electrodes, respectively disposed at opposite ends of the capacitor body; and a first metal frame and a second metal frame, the first metal frame including a first connecting portion and a first mounting portion, the second metal frame including a second connecting portion and a second mounting portion, the first connecting portion and the second connecting portion being connected to the first and second external electrodes, respectively, the lower sides of the first mounting portion and the lower sides of the second mounting portion each having a groove portion or a protrusion. The first mounting portion and the second mounting portion may be bent at the lower ends of the first connecting portion and the lower ends of the second connecting portion, respectively, and may extend toward each other from the lower ends of the first connecting portion and the lower ends of the second connecting portion, respectively.

[0021] The groove portion or the protrusion is provided only on a lower side of the first mounting portion and a lower side of the second mounting portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0023] Figure 1 is a perspective view illustrating a multilayer capacitor according to an example embodiment of the present disclosure;

[0024] Figure 2 It is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0025] Figure 3 is an exploded perspective view illustrating a coupling structure between an electronic component and a board according to an example embodiment of the present disclosure;

[0026] Figure 4 It shows Figure 3 A cross-sectional view showing a state in which an electronic component and a board are combined with each other;

[0027] Figure 5 is an exploded perspective view illustrating a coupling structure between an electronic component and a board according to another exemplary embodiment of the present disclosure;

[0028] Figure 6 It shows Figure 5 A cross-sectional view showing a state in which an electronic component and a board are combined with each other;

[0029] Figure 7 is a graph showing changes in the bonding strength of an electronic component as the ratio of the height of a protrusion of a mounting portion to its diameter changes; and

[0030] Figure 8 is a graph showing changes in the bonding strength of an electronic component as the ratio of the diameter of a protrusion to the width of a mounting portion changes. DETAILED DESCRIPTION

[0031] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0032] This disclosure may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein.

[0033] Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0034] Therefore, the shapes and sizes of elements in the drawings may be exaggerated for clarity of description, and in the drawings, elements designated by the same reference numerals are the same elements.

[0035] In addition, throughout the specification, unless otherwise stated, when a part “includes” an element, the part may further include other elements, rather than excluding other elements.

[0036] As for the directions of the hexahedron, in the drawings, X, Y, and Z indicated in the drawings represent the length direction, width direction, and thickness direction of the capacitor body, respectively.

[0037] The Z direction may be the same as the stacking direction along which the dielectric layers are stacked.

[0038] Figure 1 is a perspective view illustrating a multilayer capacitor according to example embodiments. Figure 2 It is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0039] Will refer to Figure 1 and Figure 2 The structure of the multilayer capacitor 100 applied to the electronic component of the example embodiment is described.

[0040] The multilayer capacitor 100 in example embodiments may include a capacitor body 110 and first and second external electrodes 131 and 132 , respectively disposed on both ends of the capacitor body 110 in the X direction.

[0041] The capacitor body 110 may be obtained by stacking a plurality of dielectric layers 111 in the Z direction and sintering the dielectric layers, and boundaries between adjacent dielectric layers 111 of the capacitor body 110 may be integrated so that the boundaries may be difficult to identify without using a scanning electron microscope (SEM).

[0042] The capacitor body 110 may include a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122, which are alternately arranged in the Z direction with the dielectric layers 111 interposed therebetween. In this case, the first and second internal electrodes 121 and 122 may have different polarities.

[0043] The capacitor body 110 may include an active area and cover areas 112 and 113 .

[0044] The active area may contribute to the capacitance of the multilayer capacitor.

[0045] Cover regions 112 and 113 may be provided as edge portions in upper and lower portions of the active region in the Z direction, respectively.

[0046] The cover regions 112 and 113 may be provided by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the active region, respectively.

[0047] The cover regions 112 and 113 may prevent the first and second internal electrodes 121 and 122 from being damaged due to physical stress or chemical stress.

[0048] The capacitor body 110 may have a substantially hexahedral shape, but example embodiments thereof are not limited thereto.

[0049] In example embodiments, the capacitor body 110 may include a first surface 1 and a second surface 2 facing each other in the Z direction, a third surface 3 and a fourth surface 4 facing each other in the X direction and connected to the first surface 1 and the second surface 2, and a fifth surface 5 and a sixth surface 6 facing each other in the Y direction and connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4. The first surface 1 may be a mounting surface.

[0050] The shape and size of the capacitor body 110 and the number of laminated dielectric layers 111 are not limited to the examples shown in the drawings.

[0051] The dielectric layer 111 may include ceramic powder, such as BaTiO 3 ceramic powder.

[0052] BaTiO3 ceramic powder may include calcium (Ca) or zirconium (Zr) partially dissolved in BaTiO3 (Ba 1-x Ca x )TiO3、Ba(Ti 1-y Ca y )O3、(Ba 1-x Ca x )(Ti1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3, etc., and the ceramic powder in the exemplary embodiment is not limited thereto.

[0053] In addition to the ceramic powder, the dielectric layer 111 may further include ceramic additives, an organic solvent, a plasticizer, a binder, and a dispersant.

[0054] The ceramic additive may include transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), or aluminum (Al).

[0055] The first and second internal electrodes 121 and 122 may be applied with different polarities.

[0056] The first and second internal electrodes 121 and 122 may be respectively formed on the dielectric layer 111 and may be stacked in the Z direction.

[0057] The first and second internal electrodes 121 and 122 may be alternately disposed opposite to each other in the Z direction in the capacitor body 110 with the dielectric layer 111 interposed therebetween.

[0058] In this case, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 interposed therebetween.

[0059] In example embodiments, a plurality of internal electrodes may be stacked in the Z direction, but example embodiments are not limited thereto and may be applied to a structure in which internal electrodes are stacked in the Y direction, if necessary.

[0060] One end of the first internal electrode 121 may be exposed through the third surface 3 of the capacitor body 110 .

[0061] An end portion of the first internal electrode 121 exposed through the third surface 3 of the capacitor body 110 may be electrically connected to a first external electrode 131 disposed on one end of the capacitor body 110 in the X direction.

[0062] One end of the second inner electrode 122 may be exposed through the fourth surface 4 of the capacitor body 110 .

[0063] An end portion of the second internal electrode 122 exposed through the fourth surface 4 of the capacitor body 110 may be electrically connected to a second external electrode 132 disposed on the other end of the capacitor body 110 in the X direction.

[0064] Therefore, when a predetermined voltage is applied to the first and second external electrodes 131 and 132 , charges may be accumulated between the first and second internal electrodes 121 and 122 .

[0065] In this case, the capacitance of the multilayer capacitor 100 may be proportional to an overlapping area between the first and second internal electrodes 121 and 122 overlapping each other in the Z direction in the active region.

[0066] The material for forming the first and second internal electrodes 121 and 122 is not limited to any specific material.

[0067] For example, the first and second internal electrodes 121 and 122 may be formed using a conductive paste formed using at least one of a noble metal material, nickel (Ni), and copper (Cu).

[0068] The noble metal material may be platinum (Pt), palladium (Pd), and palladium-silver (Pd-Ag) alloy.

[0069] A screen printing method or a gravure printing method may be used as a method of printing the conductive paste, but example embodiments thereof are not limited thereto.

[0070] The first and second external electrodes 131 and 132 may be supplied with voltages having different polarities, may be respectively disposed on both ends of the body 110 in the X direction, and may be respectively electrically connected to the exposed ends of the first and second internal electrodes 121 and 122.

[0071] The first external electrode 131 may include a first head portion 131 a and a first band portion 131 b .

[0072] The first head portion 131 a may be disposed on the third surface 3 of the capacitor body 110 .

[0073] The first head portion 131 a may make contact with an end portion of the first internal electrode 121 exposed through the third surface 3 of the capacitor body 110 and may electrically connect the first internal electrode 121 to the first external electrode 131 .

[0074] The first strip portion 131 b may extend from the first head portion 131 a to a portion of the first surface 1 , a portion of the second surface 2 , a portion of the fifth surface 5 , and a portion of the sixth surface 6 of the capacitor body 110 .

[0075] The first band portion 131 b may improve the bonding strength of the first external electrode 131 .

[0076] The second external electrode 132 may include a second head portion 132 a and a second band portion 132 b

[0077] The second head portion 132 a may be disposed on the fourth surface 4 of the capacitor body 110 .

[0078] The second head portion 132 a may make contact with an end portion of the second inner electrode 122 exposed through the fourth surface 4 of the body 110 and may electrically connect the second inner electrode 122 to the second outer electrode 132 .

[0079] The second strip portion 132 b may extend from the second head portion 132 a to a portion of the first surface 1 , a portion of the second surface 2 , a portion of the fifth surface 5 , and a portion of the sixth surface 6 of the capacitor body 110 .

[0080] The second strip portion 132 b may improve the bonding strength of the second external electrode 132 .

[0081] The first and second external electrodes 131 and 132 may further include a plating layer.

[0082] The plating layer of the first external electrode 131 may include a first nickel (Ni) plating layer set on the capacitor body 110 and a first tin (Sn) plating layer covering the first nickel plating layer, and the plating layer of the second external electrode 132 may include a second nickel (Ni) plating layer set on the capacitor body 110 and a second tin (Sn) plating layer covering the second nickel plating layer.

[0083] Figure 3 is an exploded perspective view illustrating a coupling structure between an electronic component and a board according to example embodiments. Figure 4 It shows Figure 3 sectional view showing a state in which an electronic component and a board are combined with each other.

[0084] Reference Figure 3 and Figure 4 , the board assembly on which the electronic component 101 is mounted in the example embodiment may include: a multilayer capacitor 100, including a capacitor body 110 and first and second external electrodes 131 and 132; a first metal frame 140 and a second metal frame 150, respectively connected to the first and second external electrodes 131 and 132; a board 210; and a first electrode pad 221 and a second electrode pad 222.

[0085] The first metal frame 140 may include a first connection portion 141 and a first mounting portion 142 .

[0086] The first connection portion 141 may be physically connected to the first head portion 131 a of the first external electrode 131 , and may be electrically connected to the first head portion 131 a of the first external electrode 131 .

[0087] In this case, the first conductive bonding layer 160 may be disposed between the first connection part 141 and the first head part 131 a of the first external electrode 131 .

[0088] The first conductive bonding layer 160 may be formed using a high temperature solder or a conductive bonding material, and example embodiments thereof are not limited thereto.

[0089] The first mounting portion 142 may be bent inwardly along the X-direction at a lower end of the first connection portion 141 and may extend to be horizontally formed with respect to the mounting surface.

[0090] When the electronic component 101 is mounted on the board 210 , the first mounting portion 142 may function as a connection terminal.

[0091] In this case, the first mounting portion 142 may be disposed to be spaced apart from the lower end of the multilayer capacitor 100 .

[0092] In addition, the first mounting portion 142 may include a first protrusion 143 protruding downward in the Z direction on a lower surface of the first mounting portion 142 .

[0093] In this case, if Figure 3 As shown in , two first protrusions 143 may be arranged side by side with each other in the Y direction, but example embodiments are not limited thereto. For example, only a single first protrusion may be provided on the lower surface of the first mounting portion, or three or more first protrusions may be provided on the lower surface of the first mounting portion in various layouts.

[0094] The first protrusion 143 may have various shapes. Figure 3 As shown in FIG, the first protrusion 143 may have a conical shape, and as another example, the first protrusion 143 may have a pyramidal shape or a hemispherical shape.

[0095] The second metal frame 150 may include a second connection portion 151 and a second mounting portion 152 .

[0096] The second connection part 151 may be physically connected to the second head portion 132 a of the second external electrode 132 , and may be electrically connected to the second head portion 132 a of the second external electrode 132 .

[0097] In this case, the second conductive bonding layer 170 may be disposed between the second connection part 151 and the second head part 132 a of the second external electrode 132 .

[0098] The second conductive bonding layer 170 may be formed using a high temperature solder or a conductive bonding material, and example embodiments thereof are not limited thereto.

[0099] The second mounting portion 152 may be bent inwardly along the X-direction at a lower end of the second connection portion 151 and may extend to be horizontally formed with respect to the mounting surface.

[0100] When the electronic component 101 is mounted on the board 210 , the second mounting portion 152 may function as a connection terminal.

[0101] In this case, the second mounting portion 152 may be disposed to be spaced apart from the lower end of the multilayer capacitor 100 .

[0102] In addition, the second mounting portion 152 may include a second protrusion 153 protruding downward in the Z direction on a lower surface of the second mounting portion 152 .

[0103] In this case, if Figure 3 As shown in , the two second protrusions 153 may be arranged side by side with each other in the Y direction, but the exemplary embodiment is not limited thereto. For example, only a single second protrusion may be provided on the lower surface of the second mounting portion, or three or more second protrusions may be arranged in various layouts on the lower surface of the second mounting portion.

[0104] In addition, the second protrusion 153 may have various shapes. Figure 3 As shown in FIG, the second protrusion 153 may have a conical shape, and as another example, the second protrusion 153 may have a pyramidal shape or a hemispherical shape.

[0105] The first and second electrode pads 221 and 222 may be disposed on the upper surface of the board 210 such that the first and second metal frames 140 and 150 may be connected to the first and second electrode pads 221 and 222 , respectively.

[0106] The first electrode pad 221 and the second electrode pad 222 may be disposed on the upper surface of the board 210, may be spaced apart from each other in the X direction, and may respectively contact and be electrically connected to the lower surface of the first mounting portion 142 of the first metal frame 140 and the lower surface of the second mounting portion 152 of the second metal frame 150.

[0107] In this case, the first mounting portion 142 may be coupled and physically connected to the first electrode pad 221 through the solder 241 , and the second mounting portion 152 may be coupled and physically connected to the second electrode pad 222 through the solder 242 .

[0108] The first electrode pad 221 may include a first groove portion 231 formed on an upper surface of the first electrode pad 221 and configured to be recessed downward in the Z direction to correspond to the first protrusion 143 of the first mounting portion 142 .

[0109] In this case, the first groove portion 231 may be formed in a shape substantially similar to that of the first protrusion 143, so that the first protrusion 143 may be inserted into and coupled to the first groove portion 231, and the upper surface of the first electrode pad 221 may be in close contact with the lower surface of the first mounting portion 142. Therefore, the first metal frame 140 may be stably supported and mounted on the board 210.

[0110] In addition, the number and size of the first groove parts 231 may be configured to be substantially the same as the number and size of the first protrusions 143 .

[0111] Positions of the first groove portion 231 and the first protrusion 143 may correspond to each other, and when a plurality of first groove portions and a plurality of first protrusions are provided, a distance between centers of the first groove portions may be equal to a distance between centers of the first protrusions.

[0112] The second electrode pad 222 may include a second groove portion 232 formed on an upper surface of the second electrode pad 222 and configured to be recessed downward in the Z direction to correspond to the second protrusion 153 .

[0113] In this case, the second groove portion 232 may have a shape substantially similar to that of the second protrusion 153, so that the second protrusion 153 may be inserted into and coupled to the second groove portion 232, and the upper surface of the second electrode pad 222 may be in close contact with the lower surface of the second mounting portion 152. Therefore, the second metal frame 150 may be stably supported and mounted on the board 210.

[0114] The number and size of the second groove parts 232 may be configured to be substantially the same as the number and size of the second protrusions 153 .

[0115] Positions of the second groove portion 232 and the second protrusion 153 may correspond to each other, and when a plurality of second groove portions and a plurality of second protrusions are provided, a distance between centers of the second groove portions may be equal to a distance between centers of the second protrusions.

[0116] When the height of the first protrusion or the second protrusion is defined as g and the diameter of the first protrusion or the second protrusion is defined as c, g and c may satisfy 1 / 6≤g / c≤1 / 2.

[0117] When a width of the first or second mounting portion in the X direction is defined as a and a diameter of the first or second protrusion is defined as c, a and c may satisfy 1 / 6≤c / a≤1 / 3.

[0118] When the width of the first or second electrode pad in the X direction is defined as e and the diameter of the first or second groove portion is defined as d, e and d may satisfy 1 / 6≤d / e≤1 / 3.

[0119] When a depth of the first groove portion or the second groove portion is defined as h and a diameter of the first groove portion or the second groove portion is defined as d, h and d may satisfy 1 / 6≤h / d≤1 / 2.

[0120] Figure 5 is an exploded perspective view illustrating a coupling structure between an electronic component and a board according to another example embodiment. Figure 6 It shows Figure 5 sectional view showing a state in which an electronic component and a board are combined with each other.

[0121] exist Figure 5 and Figure 6 In the illustrated example embodiment, the structure of the multilayer capacitor 100 of the electronic component 101', the structure in which the metal frame may include the connection portion and the mounting portion, and the structure in which the first and second electrode pads are formed on the upper surface of the board may be similar to that of the reference Figure 3 and Figure 4 The structure of the above-described exemplary embodiment is described, and a repeated description will not be provided. By exchanging the parameters of the mounting portion with the parameters of the electrode pad or by exchanging the parameters of the groove portion with the parameters of the protrusion, it is possible to Figure 5 and Figure 6 The above-described geometrical relationship among the protrusion, the recess portion, the mounting portion, and the electrode pad is applied in the illustrated example embodiment.

[0122] Reference Figure 5 and Figure 6 In the electronic assembly 101 ′ in the example embodiment, the first mounting portion 142 of the first metal frame 140 ′ may include a third groove portion 143 ′ formed on a lower surface of the first mounting portion 142 and configured to be concave upward.

[0123] like Figure 5 As shown in FIG, two third groove portions 143' may be arranged side by side with each other in the Y direction, but example embodiments are not limited thereto. For example, only a single third groove portion may be formed on the lower surface of the first mounting portion, or three or more third groove portions may be provided on the lower surface of the first mounting portion in various layouts to improve the bonding strength between the first mounting portion and the first electrode pad.

[0124] In addition, the second mounting portion 152 of the second metal frame 150 ′ may include a fourth groove portion 153 ′ formed in a lower surface of the second mounting portion 152 and configured to be recessed upward in the Z direction.

[0125] In this case, if Figure 5 As shown in , two fourth groove portions 153' may be arranged side by side with each other in the Y direction, but example embodiments are not limited thereto. For example, only one fourth groove portion may be formed in the lower surface of the second mounting portion, or three or more fourth groove portions may be arranged in various layouts in the lower surface of the second mounting portion to improve the bonding force between the second mounting portion and the second electrode pad.

[0126] In addition, the first electrode pad 221 ′ may include a third protrusion 231 ′ formed on an upper surface thereof and configured to protrude upward in the Z direction to correspond to the third groove portion 143 ′ of the first mounting portion 142 .

[0127] In this case, the third protrusion 231 ′ may have a shape substantially similar to that of the third groove part 143 ′.

[0128] Therefore, since the third protrusion 231 ′ is inserted into and coupled to the third groove portion 143 ′, the upper surface of the first electrode pad 221 ′ may be in close contact with the lower surface of the first mounting portion 142 .

[0129] Therefore, the first metal frame 140 ′ may be stably supported and mounted on the board 210 .

[0130] In addition, the second electrode pad 222 ′ may include a fourth protrusion 232 ′ formed on an upper surface thereof and configured to protrude upward in the Z direction to correspond to the fourth groove portion 153 ′ of the second mounting portion 152 .

[0131] In this case, the fourth protrusion 232 ′ may have a shape substantially similar to that of the fourth groove part 153 ′.

[0132] Since the fourth protrusion 232 ′ is inserted into and coupled to the fourth groove portion 153 ′, the upper surface of the second electrode pad 222 ′ may be in close contact with the lower surface of the second mounting portion 152 .

[0133] Therefore, the second metal frame 150 ′ may be stably supported by the board 210 and mounted on the board 210 .

[0134] A conventional multilayer capacitor may have a structure in which external electrodes of the multilayer capacitor may directly contact the board through solder when mounted on the board.

[0135] Therefore, heat or mechanical strain generated by the board may be directly transmitted to the multilayer capacitor, making it difficult for the multilayer capacitor to ensure a high level of reliability.

[0136] The electronic assembly in example embodiments may secure a gap between the multilayer capacitor 100 and the board 210 by bonding the first and second metal frames 140 and 150 to both ends of the multilayer capacitor 100 , respectively.

[0137] Therefore, when the electronic component 101 is mounted on the board 210 , stress from the board 210 may not be directly transmitted to the multilayer capacitor 100 , so that thermal reliability, electrical reliability, and mechanical stability of the electronic component 101 may be improved.

[0138] However, in the case of an electronic component using such a metal frame, since the surface of the metal frame is smooth, the metal frame may be easily degraded in a portion in contact with an electrode pad of the board when mounted on the board.

[0139] In example embodiments, a protrusion may be formed in the mounting portion of the metal frame, and a groove portion having a shape similar to that of the protrusion may be formed in the electrode pad of the board, or alternatively, a protrusion may be formed in the electrode pad of the board, and a groove portion having a shape similar to that of the protrusion may be formed in the mounting portion of the metal frame.

[0140] Therefore, since the metal frame is mounted on the board in a state in which the protrusions are combined with and inserted into the groove portions, the electronic components may not wobble in the horizontal direction (X direction or Y direction) of the board.

[0141] Therefore, the electronic components can have strong durability against deformation occurring in the horizontal direction of the board, and the bonding strength between the board and the electronic components mounted on the board can be improved, so that the electronic components can be prevented from being separated from the board due to environmental changes (such as mechanical shock or vibration during movement) after the components are mounted on the board.

[0142] The bonding strength between the electronic component and the board can be obtained as follows: after 40 electronic components are mounted on the board, a mechanical force is applied to the middle part of one surface of the electronic component in the Z direction using a bonding force measuring instrument, each force (N) is measured at the time point when the metal frame of the electronic component is separated from the electrode pad of the board, and the average value is calculated.

[0143] Figure 7 The graph shows that the bonding strength of the electronic component changes with the change of the ratio of the height of the protrusion of the mounting portion to its diameter. Here, c / a is determined to be 1 / 3, which is Figure 8 was determined to be the best binding condition. Figure 7 As shown at the leftmost point on the middle curve, a comparative example in which no protrusions and recesses are formed is provided as a reference.

[0144] The bonding force between electronic components and boards is usually required to be 20N or greater.

[0145] Reference Figure 7 , showing that: when the diameter of the protrusion is defined as c and the height of the protrusion is defined as g, when g / c is 1 / 6, the binding force is slightly higher than 20 N, and when g / c is less than 1 / 6, the binding force decreases below 20 N. When g / c is 1 / 2, the binding force is maximum, and when g / c exceeds 1 / 2, the binding force decreases again compared to the maximum value.

[0146] Therefore, a preferred numerical range of g / c that can optimize the bonding strength between the electronic component and the board may satisfy 1 / 6≤g / c.

[0147] A more preferred numerical range of g / c, which can optimize the bonding strength between the electronic component and the board, may satisfy 1 / 6≤g / c≤1 / 2.

[0148] In this case, when the depth of the groove portion is defined as h and the diameter of the groove portion is d, h may need to be the same as g of the protrusion and d may need to be the same as c of the protrusion so that the protrusion and the groove portion can be accurately engaged with each other. Therefore, h / d may satisfy 1 / 6≤h / d.

[0149] A more preferred numerical range of h / d may satisfy 1 / 6≤h / d≤1 / 2.

[0150] Figure 8 The graph shows the change of the electronic component bonding strength with the change of the ratio of the protrusion diameter to the mounting portion width. Here, g / c is determined to be 1 / 2, which is Figure 7 was determined to be the best binding condition. Figure 8 As shown at the leftmost point on the middle curve, a comparative example in which no protrusions and recesses are formed is provided as a reference.

[0151] Reference Figure 8 , showing that: when the length of the mounting portion in the X direction is defined as a and the diameter of the protrusion is defined as c, when c / a is 1 / 6, the binding force is slightly higher than 20 N, and when c / a is less than 1 / 6, the binding force decreases to below 20 N. When c / a is 1 / 3, the binding force is highest, and when c / a exceeds 1 / 3, the binding force decreases again compared to the maximum value.

[0152] Therefore, a preferred numerical range of c / a, which can optimize the bonding force between the electronic component and the board, may satisfy 1 / 6≤c / a.

[0153] A more preferred numerical range of c / a, which can optimize the bonding strength between the electronic component and the board, may satisfy 1 / 6≤c / a≤1 / 3.

[0154] In this case, when the length of the electrode pad in the X direction is defined as e and the diameter of the groove portion is defined as d, e may need to be the same as a of the mounting portion and d may need to be the same as c of the protrusion so that the protrusion and the groove portion can be precisely engaged with each other, and therefore, d / e can satisfy 1 / 6≤d / e.

[0155] A more preferred numerical range of d / e may satisfy 1 / 6≤d / e≤1 / 3.

[0156] According to the above-described example embodiments, the durability of the multilayer capacitor against vibration and deformation may be improved, and the reliability of electronic components mounted on the board may be improved by improving the bonding strength between the metal frame and the board.

[0157] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. A board assembly having an electronic component mounted thereon, the board assembly comprising: capacitor body; a pair of external electrodes, respectively disposed on both ends of the capacitor body; a pair of metal frames, comprising a pair of connecting portions and a pair of mounting portions, wherein the pair of connecting portions are respectively connected to the pair of external electrodes, and the lower sides of the pair of mounting portions each have a protrusion; board; and a pair of electrode pads provided on the upper surface of the plate and connected to the pair of metal frames, respectively, each of the pair of electrode pads having a groove portion corresponding to the protrusion on its upper surface; The protrusion is arranged in the groove portion, the height of the protrusion is defined as g, the diameter of the protrusion is defined as c, g and c satisfy 1 / 6≤g / c, and the width of the mounting portion is defined as a, a and c satisfy 1 / 6≤c / a.

2. The plate assembly according to claim 1, wherein g and c satisfy 1 / 6≤g / c≤1 / 2.

3. The plate assembly according to claim 1, wherein The width of the mounting portion is defined as a, and a and c satisfy c / a≤2 / 3.

4. The plate assembly according to claim 1, wherein A width of the electrode pad is defined as e, a diameter of the groove portion is defined as d, and e and d satisfy 1 / 6≤d / e.

5. The plate assembly according to claim 1, wherein The depth of the groove portion is defined as h, the diameter of the groove portion is defined as d, and h and d satisfy 1 / 6≤h / d.

6. The plate assembly according to claim 1, wherein The capacitor body includes a dielectric layer and a plurality of inner electrodes that are alternately arranged with the dielectric layer interposed between the plurality of inner electrodes.

7. The plate assembly according to claim 1, wherein The outer electrode comprises: a head portion provided on an end surface of the capacitor body; and A band portion extends from the head portion to a portion of the upper surface, a portion of the lower surface, and a portion of both side surfaces of the capacitor body.

8. The plate assembly according to claim 7, wherein In the metal frame, the connection portion is connected to the head portion, and the mounting portion is bent at a lower end of the connection portion and extends from the lower end of the connection portion.

9. The plate assembly according to claim 3, wherein a and c satisfy 1 / 6≤c / a≤1 / 3.

10. The plate assembly according to claim 4, wherein e and d satisfy 1 / 6≤d / e≤1 / 3.

11. The plate assembly according to claim 5, wherein h and d satisfy 1 / 6≤h / d≤1 / 2.

12. The plate assembly of claim 1, wherein The protrusion has a conical shape or a hemispherical shape.

13. A board assembly having an electronic component mounted thereon, the board assembly comprising: capacitor body; a pair of external electrodes, respectively disposed on both ends of the capacitor body; a pair of metal frames, comprising a pair of connecting portions and a pair of mounting portions, wherein the pair of connecting portions are respectively connected to the pair of external electrodes, and the lower sides of the pair of mounting portions each have a groove portion; board; and a pair of electrode pads provided on the upper surface of the board and connected to the pair of metal frames, respectively, each of the pair of electrode pads having a protrusion on its upper side to correspond to the groove portion, The protrusion is arranged in the groove portion, the width of the mounting portion is defined as a, the diameter of the protrusion is defined as c, and a and c satisfy 1 / 6≤c / a, and the height of the protrusion is defined as g, and g and c satisfy 1 / 6≤g / c.

14. The plate assembly according to claim 13, wherein The capacitor body includes a dielectric layer and a plurality of inner electrodes that are alternately arranged with the dielectric layer interposed between the plurality of inner electrodes.

15. The plate assembly of claim 13, wherein: The outer electrode comprises: a head portion provided on an end surface of the capacitor body; and A band portion extends from the head portion to a portion of the upper surface, a portion of the lower surface, and a portion of both side surfaces of the capacitor body.

16. The plate assembly according to claim 15, wherein In the metal frame, the connection portion is connected to the head portion, and the mounting portion is bent at a lower end of the connection portion and extends from the lower end of the connection portion.

17. The plate assembly of claim 13, wherein: a and c satisfy 1 / 6≤c / a≤1 / 3.

18. An electronic assembly comprising: capacitor body; A first external electrode and a second external electrode are respectively provided on both ends of the capacitor body; as well as a first metal frame and a second metal frame, wherein the first metal frame includes a first connecting portion and a first mounting portion, and the second metal frame includes a second connecting portion and a second mounting portion, wherein the first connecting portion and the second connecting portion are connected to the first external electrode and the second external electrode respectively, and the lower side of the first mounting portion and the lower side of the second mounting portion both have a groove portion or a protrusion, wherein the first mounting portion and the second mounting portion are bent at the lower ends of the first connecting portion and the second connecting portion, respectively, and extend toward each other from the lower ends of the first connecting portion and the second connecting portion, respectively; In which, the height of the protrusion is defined as g, the diameter of the protrusion is defined as c, g and c satisfy 1 / 6≤g / c, the depth of the groove portion is defined as h, the diameter of the groove portion is defined as d, and h and d satisfy 1 / 6≤h / d, and the width of the mounting portion is defined as a, a and c satisfy 1 / 6≤c / a.

19. The electronic component according to claim 18, wherein The groove portion or the protrusion is provided only on a lower side of the first mounting portion and a lower side of the second mounting portion.

20. The electronic assembly according to claim 18, wherein The capacitor body includes a dielectric layer and a plurality of inner electrodes that are alternately arranged with the dielectric layer interposed between the plurality of inner electrodes.

21. The electronic assembly according to claim 18, wherein The outer electrode comprises: a head portion provided on an end surface of the capacitor body; and A band portion extends from the head portion to a portion of the upper surface, a portion of the lower surface, and a portion of both side surfaces of the capacitor body.

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